WO2021256688A1 - Procédé et système de fabrication de filtre à cavité haute fréquence - Google Patents

Procédé et système de fabrication de filtre à cavité haute fréquence Download PDF

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Publication number
WO2021256688A1
WO2021256688A1 PCT/KR2021/004972 KR2021004972W WO2021256688A1 WO 2021256688 A1 WO2021256688 A1 WO 2021256688A1 KR 2021004972 W KR2021004972 W KR 2021004972W WO 2021256688 A1 WO2021256688 A1 WO 2021256688A1
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WIPO (PCT)
Prior art keywords
filter body
resonator
filter
coupling
unit
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PCT/KR2021/004972
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English (en)
Korean (ko)
Inventor
여선구
신명철
Original Assignee
주식회사 엘트로닉스
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Publication of WO2021256688A1 publication Critical patent/WO2021256688A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/007—Manufacturing frequency-selective devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2056—Comb filters or interdigital filters with metallised resonator holes in a dielectric block
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters

Definitions

  • An embodiment of the present invention relates to a manufacturing technique for a high frequency cavity filter.
  • a high-frequency filter is used in most transmission/reception communication equipment such as a mobile communication base station or a repeater.
  • a cavity filter having a cavity structure is mainly used for devices requiring high power, such as a mobile communication base station.
  • a cavity filter is a filter in which a plurality of cavities are formed inside the filter, a resonator is installed in the cavity, and filtering is performed through resonance in each cavity.
  • Conventional high-frequency cavity filters have problems in that assembly is difficult because there are many parts, manufacturing cost and manufacturing time are consumed, and they are not suitable for mass production because there are many tuning points.
  • An embodiment of the present invention is to provide a method and system for manufacturing a high-frequency cavity filter that can be mass-produced with a simple manufacturing process.
  • a manufacturing system includes a filter body made of a conductive material and a plurality of resonators provided to protrude from a resonator hole provided in a base plate of the filter body to the inside of the filter body.
  • a manufacturing system comprising: a first assembling device for coupling a frequency control unit to each resonator of the filter body, the first assembling device comprising: a first input unit into which the filter body is fed; a second input unit to which the frequency control unit is input; and a coupling part for coupling the frequency adjusting part input from the second input part to each resonator of the filter body input through the first input part.
  • the frequency control unit includes an insertion hole into which an end of the resonator is inserted, a frequency control body having a diameter wider than the outer diameter of the resonator, and a fitting coupling unit protruding from the edge of the insertion hole, the second input
  • the part may be aligning the direction of the frequency adjusting unit so that the interposed coupling portion of the frequency adjusting unit faces the resonator, and the coupling unit may be press-fitted to the end of the resonator by press-fitting the interposed coupling unit to the resonator.
  • the second input unit may be provided to provide the same number of frequency adjusting units as the number of resonators of the filter body as the coupling unit, and to arrange the arrangement order according to the type of the frequency adjusting unit.
  • the second input unit may be disposed in the first and last of the first type of frequency control unit, and the second type of frequency adjusting unit may be disposed between the first and last to provide the coupling unit.
  • the high frequency cavity filter manufacturing system may further include a second assembly device for receiving the filter body coupled to the resonator by the frequency control unit and coupling the notch filter unit to one inner side of the filter body.
  • the high frequency cavity filter manufacturing system may further include a third assembly device for receiving the filter body to which the notch filter unit is coupled, and coupling the cover unit to the filter body.
  • the third assembly device performs a press-fit process by disposing the first coupling hole of the cover to correspond to the press protrusion of the filter body, and the second coupling hole of the cover to correspond to the coupling protrusion of the filter body,
  • a plurality of the press protrusions may be provided to be spaced apart from each other along the edge of the filter body, and the coupling protrusions may extend from the end of the partition wall provided between the resonator and the resonator in the filter body to protrude.
  • the high frequency cavity filter manufacturing system may further include a printer device that receives a substrate tray including a plurality of substrates and applies solder cream to a predetermined portion of each substrate.
  • the high frequency cavity filter manufacturing system may further include a fourth assembling device for mounting the filter body in which the cover part is coupled to each substrate on the substrate tray.
  • the high-frequency cavity filter manufacturing system may further include a reflow device for bonding each substrate to the filter body by performing a reflow process on a solder cream-coated portion of each substrate in the substrate tray.
  • the high frequency cavity filter manufacturing system may further include a cutting device for cutting and separating the high frequency cavity filter to which the substrate and the filter body are bonded from the substrate tray, respectively.
  • a tuning part is provided at an end of the resonator, which is spaced apart from the inner wall of the resonator and connected to the resonator through a tuning connection part, and the high frequency cavity filter manufacturing system inserts a tuning screw through the resonator hole of the high frequency cavity filter and performs the tuning It may further include a tuning device for pressing the portion to stretch downward.
  • the manufacturing method includes a filter body made of a conductive material and a plurality of resonators provided to protrude from a resonator hole provided in a base plate of the filter body to the inside of the filter body.
  • a manufacturing method comprising: coupling a frequency adjusting unit to each resonator of the filter body in a first assembling device; coupling a notch filter unit to an inner side of the filter body in a second assembly device; coupling the cover part to the filter body in a third assembling device; applying a solder cream to a predetermined portion of each substrate in a substrate tray having a plurality of substrates in the printer apparatus; mounting the filter body to each substrate on the substrate tray in a fourth assembly apparatus; bonding each substrate to the filter body by performing a reflow process on a solder cream-coated portion of each substrate of the substrate tray in a reflow apparatus; cutting and separating the high frequency cavity filter to which the substrate of the substrate tray and the filter body are bonded in a cutting device;
  • the filter body and the cover part are combined through a pressing process, assembly between parts of the high-frequency cavity filter is simple, and the number of parts is reduced, thereby reducing manufacturing cost and manufacturing effort.
  • the tuning unit is provided at the end of each resonator, the number of resonators and the number of tuning units are the same, thereby reducing the time required for tuning.
  • the inside of the resonator is empty and the tuning is performed by pressing the tuning part through the tuning screw, the appearance of the resonator, such as scratches, is not affected.
  • FIG. 1 is an exploded perspective view of a high-frequency cavity filter according to an embodiment of the present invention
  • FIG. 2 is a combined perspective view of a high-frequency cavity filter according to an embodiment of the present invention.
  • FIG. 3 is a view showing the inside of the filter body in the high-frequency cavity filter according to an embodiment of the present invention.
  • FIG. 4 is a view showing a state in which the filter body and the cover part are combined in the high-frequency cavity filter according to an embodiment of the present invention
  • FIG. 5 is a view illustrating a state in which a frequency adjuster is coupled to a resonator in a high-frequency cavity filter according to an embodiment of the present invention
  • FIG. 6 is a perspective view illustrating a resonator of a high-frequency cavity filter according to an embodiment of the present invention
  • FIG. 7 is a diagram illustrating a method of tuning a resonator through a tuning unit in a high-frequency cavity filter according to an embodiment of the present invention
  • FIG. 8 is a graph showing an S parameter of a high-frequency cavity filter according to an embodiment of the present invention.
  • FIG. 9 is a graph showing an spurious wave of a high-frequency cavity filter according to an embodiment of the present invention.
  • FIG. 10 is a schematic diagram showing a manufacturing system and manufacturing sequence of a high-frequency cavity filter according to an embodiment of the present invention
  • FIG. 11 is a photograph showing a state in which a set of frequency control units are fitted to each resonator of the filter body in an disclosed embodiment
  • FIG. 12 is a photograph showing a state in which the notch filter unit is coupled to one side of the inner side of the filter body in the disclosed embodiment
  • FIG. 13 is a photograph showing a state in which the cover part is coupled to the filter body in an embodiment to be disclosed;
  • FIG. 14 is a photograph showing a substrate tray according to an embodiment disclosed.
  • 15 is a photograph showing a state in which solder cream is applied to each substrate of the substrate tray in an embodiment to be disclosed;
  • 16 is a photograph showing a state in which the filter body is mounted on each substrate on the substrate tray according to the disclosed embodiment
  • 17 is a photograph showing a high-frequency cavity filter cut by a cutting device in an embodiment of the present disclosure
  • first and second may be used to describe various components, but the components should not be limited by the terms. The above terms may be used for the purpose of distinguishing one component from another component.
  • a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component.
  • FIG. 1 is an exploded perspective view of a high-frequency cavity filter according to an embodiment of the present invention
  • FIG. 2 is a combined perspective view of a high-frequency cavity filter according to an embodiment of the present invention
  • FIG. 3 is a high-frequency cavity filter according to an embodiment of the present invention. It is a view showing the inside of the filter body in the cavity filter
  • FIG. 4 is a view showing a state in which the filter body and the cover part are combined in the high frequency cavity filter according to an embodiment of the present invention.
  • the high frequency cavity filter 100 may include a filter body 102 , a resonator 104 , a cover part 106 , and a substrate 108 .
  • the filter body 102 may be formed to form a cavity space therein.
  • the filter body 102 may have a rectangular parallelepiped shape with an open lower surface, but the shape is not limited thereto.
  • the filter body 102 may be made of a conductive material.
  • the filter body 102 may include a base plate 102a, a first side plate 102b, a second side plate 102c, a front plate 102d, and a back plate 102e.
  • the base plate 102a may be a portion forming the upper surface of the high frequency cavity filter 100 .
  • the base plate 102a may be formed in a rectangular plane having a predetermined length and width, but the shape is not limited thereto.
  • the first side plate 102b may be provided downward from one side of the base plate 102a.
  • the first side plate 102b may be provided along one edge of the base plate 102a.
  • the second side plate 102c may be provided downward from the other side of the base plate 102a.
  • the second side plate 102c may be provided along the other edge of the base plate 102a.
  • the second side plate 102c may be provided to face the first side plate 102b.
  • the front plate 102d may be provided downward from the front end of the base plate 102a.
  • the front plate 102d may be provided along the front edge of the base plate 102a.
  • the front plate 102d may be connected to one end of the first side plate 102b and the second side plate 102c, respectively.
  • the rear plate 102e may be provided downward from the rear end of the base plate 102a.
  • the rear plate 102e may be provided along the rear edge of the base plate 102a.
  • the rear plate 102e may be connected to the other ends of the first side plate 102b and the second side plate 102c, respectively.
  • the rear plate 102e may be provided to face the front plate 102d.
  • an edge portion 111 may be provided at the lower end of the filter body 102 along the edge of the filter body 102 . That is, the edge portion 111 may be provided along the lower ends of the first side plate 102b, the second side plate 102c, the front plate 102d, and the rear plate 102e. The edge portion 111 may be provided to be thicker than the thickness of the filter body 102 .
  • a plurality of press protrusions 111a may be provided on one surface of the edge portion 111 (ie, the surface facing the cover portion 106 ).
  • a plurality of press protrusions 111a may be provided to be spaced apart from each other along the edge portion 111 .
  • one or more partition walls 113 may be provided inside the filter body 102 .
  • the partition wall 113 may be provided between the resonator 104 and the resonator 104 inside the filter body 102 .
  • One end of the partition wall 113 may be connected to the first side plate 102b, and the other end of the partition wall 113 may be connected to the second side plate 102c. That is, the partition wall 113 may be provided in the filter body 102 along the width direction of the filter body 102 .
  • the partition wall 113 may be provided integrally with the filter body 102 .
  • the barrier rib 113 may control electrical coupling between the resonator 104 and the resonator 104 .
  • a window 113a may be provided in the partition wall 113 to adjust the electrical coupling between the resonator 104 and the resonator 104 .
  • the window 113a may be provided by partially cutting the partition wall 113 .
  • the frequency bandwidth of the resonator 104 can be adjusted by adjusting the electrical coupling between the resonator 104 and the resonator 104 according to the size of the window 113a. For example, as the size of the window 113a increases, the frequency bandwidth of the resonator 104 becomes wider, and as the size of the window 113a decreases, the frequency bandwidth of the resonator 104 becomes narrower.
  • the partition wall 113 may be provided with a coupling protrusion 115 that protrudes from an end of the partition wall 113 .
  • the coupling protrusion 115 may serve to couple the filter body 102 and the cover part 106 .
  • an input terminal part 131 and an output terminal part 133 may be provided inside the filter body 102 , respectively.
  • the input terminal unit 131 may be provided on one side of the inside of the filter body 102 .
  • the input terminal part 131 may be provided to protrude downward from the base plate 102a.
  • the input terminal part 131 may be provided to protrude lower than the lower end of the filter body 102 .
  • a signal received by an antenna of a communication system may be input to the input terminal unit 131 .
  • the output terminal part 133 may be provided on the other side of the inside of the filter body 102 .
  • the output terminal part 133 may be provided to protrude downward from the base plate 102a.
  • the output terminal part 133 may be provided to protrude lower than the lower end of the filter body 102 .
  • a signal filtered through the high-frequency cavity filter 100 may be output to the output terminal unit 133 .
  • a plurality of resonators 104 may be provided in the filter body 102 to be spaced apart from each other. When a plurality of resonators 104 are formed, each resonator 104 may be provided to be spaced apart from each other at regular intervals. The number of resonators 104 may be set to an appropriate number according to the performance of a communication system using the high frequency cavity filter 100 and frequency selectivity required in the communication system.
  • the resonator 104 may be provided integrally with the filter body 102 .
  • a resonator hole 117 may be provided in the base plate 102a at a position corresponding to the resonator 104 .
  • the resonator 104 may be provided to protrude downward from the edge of the resonator hole 117 of the base plate 102a. That is, the resonator 104 may be provided downward from the filter body 102 .
  • the resonator 104 may have a cylindrical shape, but the shape is not limited thereto.
  • the inside of the resonator 104 may be provided in an empty form. Accordingly, the inside of the resonator 104 may be provided in communication with the outside through the resonator hole 117 .
  • a tuning part 119 may be provided at an end of the resonator 104 .
  • the tuning unit 119 may be provided to tune the resonant frequency of the resonator 104 .
  • a frequency adjusting unit 121 may be coupled to the resonator 104 .
  • 5 is a view showing a state in which the frequency adjusting unit 121 is coupled to the resonator 104 in the high frequency cavity filter according to an embodiment of the present invention.
  • a frequency control coupling unit 104a into which the frequency control unit 121 is inserted and coupled may be provided at an end of the resonator 104 .
  • the frequency control coupling portion 104a may have an outer diameter smaller than the outer diameter of the resonator 104 body.
  • the inner diameter of the frequency control coupling portion 104a may be provided to be the same as the inner diameter of the main body of the resonator 104 . Accordingly, a step may be formed at the boundary between the resonator 104 body and the frequency control coupling portion 104a.
  • the frequency adjusting unit 121 may be coupled to an end of the resonator 104 .
  • the frequency control unit 121 may be provided to face the cover unit 106 in a state coupled to the end of the resonator 104 .
  • the frequency adjusting unit 121 may serve to adjust the resonant frequency of the resonator 104 to decrease as the capacitance value is increased by increasing the area facing the cover unit 106 . Therefore, the overall size (height) of the high-frequency cavity filter 100 can be reduced.
  • the capacitance value is greater than the inductance value of the resonator 104 due to the frequency adjusting unit 121 , so that the spurious wave characteristic is improved.
  • the frequency control unit 121 may include a frequency control body 121a and a fitting coupling unit 121b.
  • the frequency control body 121a may be provided to face the cover part 106 .
  • the frequency control body 121a may be formed of a circular plate, but the shape is not limited thereto and may be formed in various other shapes (eg, a square, etc.).
  • An insertion hole 121a-1 may be provided in the frequency control body 121a.
  • the insertion hole 121a-1 may be provided in the center of the frequency control body 121a.
  • the frequency control body 121a may have a larger diameter than the outer diameter of the resonator 104 .
  • the frequency control body 121a may be provided in parallel with the cover part 106 . Accordingly, the resonator 104 can increase the area facing the cover part 106 through the frequency control part 121 .
  • the engaging portion 121b may be provided to protrude from the edge of the insertion hole 121a-1 toward the resonator 104.
  • the pinched coupling portion (121b) may be coupled to the outside of the frequency control coupling portion (104a).
  • the inner diameter of the fitting coupling portion 121b may be provided to be smaller than the outer diameter of the frequency control coupling portion 104a. Accordingly, by pressing the frequency control unit 121, the fitting coupling portion 121b may be coupled to the outside of the frequency control coupling portion 104a.
  • the frequency control body 121a of the frequency control unit 121 coupled to the resonator 104 (ie, the first resonator and the last resonator) adjacent to the input terminal unit 131 and the output terminal unit 133 is different from the other.
  • the diameter of the frequency control body 121a of the frequency control unit 121 coupled to the resonator 104 (ie, the resonator positioned between the first resonator and the last resonator) may be larger than that of the frequency control body 121a.
  • the frequency control unit 121 coupled to the resonator 104 adjacent to the input terminal unit 131 and the output terminal unit 133 may be referred to as a first type of frequency control unit.
  • the frequency adjusting unit 121 coupled to the other resonator 104 may be referred to as a second type of frequency adjusting unit.
  • the cover part 106 may be provided under the filter body 102 .
  • the cover part 106 may be coupled to the filter body 102 at the lower part of the filter body 102 .
  • As the cover part 106 is coupled to the filter body 102 a cavity is formed inside the filter body 102 and the cover part 106 .
  • the cover part 106 may be made of a conductive material.
  • the cover part 106 may be provided to cover the open lower surface of the filter body 102 .
  • the cover part 106 may be formed in the form of a plate.
  • a plurality of first coupling holes 106a may be provided on the edge of the cover part 106 .
  • a plurality of first coupling holes 106a may be provided to be spaced apart from each other along the edge of the cover part 106 .
  • the first coupling hole 106a may be provided to correspond to the press protrusion 111a.
  • the cover part 106 may be coupled to the filter body 102 through a press. Specifically, in a state in which the cover part 106 is positioned under the filter body 102 so that the first coupling holes 106a of the cover part 106 correspond to the press protrusions 111a of the filter body 102, respectively. When the cover part 106 is pushed up toward the filter body 102 , the press protrusion 111a is inserted into the first coupling hole 106a to protrude from the opposite surface of the cover part 106 . At this time, when the pressing process is performed, the protruding press protrusion 111a is pressed against the opposite surface of the cover part 106 , so that a firm coupling is made between the cover part 106 and the filter body 102 .
  • a second coupling hole 106b may be provided in the cover part 106 .
  • the second coupling hole 106b may be provided to correspond to the coupling protrusion 115 of the partition wall 113 .
  • the coupling protrusion 115 is fitted into the second coupling hole 106b, coupling between the cover part 106 and the filter body 102 is made.
  • a first terminal insertion hole 106c and a second terminal insertion hole 106d may be provided in the cover part 106 , respectively.
  • the input terminal part 131 may be inserted into the first terminal insertion hole 106c and exposed downward.
  • the output terminal part 133 may be inserted into the second terminal insertion hole 106d and exposed downward.
  • the diameters of the first terminal insertion hole 106c and the second terminal insertion hole 106d may be larger than the diameters of the input terminal part 131 and the output terminal part 133 , respectively. Therefore, the input terminal part 131 and the output terminal part 133 are respectively inserted into the first terminal insertion hole 106c and the second terminal insertion hole 106d into the first terminal insertion hole 106c and the second terminal insertion hole 106d. It may be spaced apart from the insertion hole 106d, respectively.
  • the substrate 108 may be provided under the cover part 106 .
  • a first connection part 108a electrically connected to the input terminal part 131 and a second connection part 108b electrically connected to the output terminal part 133 may be provided on the board 108 , respectively.
  • the high-frequency cavity filter 100 may further include a notch filter unit 123 .
  • the notch filter unit 123 may be provided to remove a frequency band adjacent to the used frequency band of the high frequency cavity filter 100 . That is, in order to prevent the signal of the high frequency cavity filter 100 from interfering with the signal of the adjacent frequency band, the notch filter unit 123 uses the frequency band of the high frequency cavity filter 100 in the signal of the high frequency cavity filter 100 . It can serve to remove the frequency band adjacent to .
  • the notch filter unit 123 may be mounted inside the filter body 102 .
  • FIG. 6 is a perspective view illustrating a resonator of a high-frequency cavity filter according to an embodiment of the present invention
  • FIG. 7 is a view showing a method of tuning the resonator through a tuning unit in the high-frequency cavity filter according to an embodiment of the present invention.
  • FIG. 7A is a view showing a state before tuning
  • FIG. 7B is a view showing a state after tuning.
  • a tuning unit 119 may be provided at an end of the resonator 104 .
  • the tuning part 119 may be provided at an end of the resonator 104 to be spaced apart from the inner wall of the resonator 104 . That is, the tuning unit 119 may have a smaller diameter than the inner diameter of the resonator 104 .
  • the tuning unit 119 may be connected to the resonator 104 through the tuning connection unit 141 .
  • a plurality of tuning connection units 141 may be provided to be spaced apart from each other.
  • the tuning connection units 141 may be provided at intervals of 120 degrees to connect the tuning units 119 with the inner wall of the resonator 104 , but is not limited thereto.
  • the tuning unit 119 is connected to the inner wall of the resonator 104 through the tuning connection unit 141 at three points, and a gap is formed between the inner wall and the inner wall of the resonator 104 in other portions.
  • the tuning part 119 when the tuning part 119 is pressed after the tuning screw 50 is inserted through the resonator hole 117, the tuning part 119 is stretched downward due to the toughness of the metal. Accordingly, the distance between the tuning part 119 and the cover part 106 is narrowed, so that the capacitance value of the resonator 104 can be adjusted.
  • the tuning unit 119 is provided at the end of each resonator 104, the number of resonators 104 and the number of tuning units 119 are the same, thereby reducing the time required for tuning.
  • the tuning part corresponding to about twice the number of resonators there is a tuning part corresponding to about twice the number of resonators, and it takes a lot of time for tuning. time can be reduced
  • the inside of the resonator 104 is empty and the tuning is performed by pressing the tuning part 119 through the tuning screw 50, the appearance of the resonator 104, such as scratches, is not affected.
  • FIG. 8 is a graph illustrating an S parameter of a high-frequency cavity filter according to an embodiment of the present invention. .
  • the frequency band used for the high-frequency cavity filter 100 is 3.6 to 3.7 GHz.
  • the high frequency cavity filter 100 exhibits a notch characteristic in bands adjacent to the 3.6 GHz and 3.7 GHz bands, which are used frequency bands. This is a result of making the notch characteristic appear near the frequency band used by the high frequency cavity filter 100 by the notch filter unit 123 . Through this, the high frequency cavity filter 100 can prevent interference with signals of adjacent frequency bands from occurring.
  • FIG 9 is a graph illustrating an spurious wave of a high-frequency cavity filter according to an embodiment of the present invention.
  • the high frequency cavity filter 100 exhibits spurious waves at 4.8 times or more of the center frequency (ie, 3.6 GHz). That is, in general, the spurious wave is generated at twice the center frequency, but in the disclosed embodiment, the capacitance is greater than the inductance of the resonator 104 due to the frequency adjusting unit 121, so that the center frequency (ie, 3.6 GHz) is 4.8 times or more. spurious wave appears, and thus the spurious wave characteristic is improved.
  • the center frequency ie, 3.6 GHz
  • FIG. 10 is a schematic diagram illustrating a manufacturing system and manufacturing sequence of a high-frequency cavity filter according to an embodiment of the present invention.
  • the high frequency cavity filter manufacturing system 200 includes a first assembling device 202 , a second assembling device 204 , a third assembling device 206 , a printer device 208 , and a fourth assembling device 210 , a reflow device 212 , a cutting device 214 , and a tuning device 216 .
  • movement between devices may be performed through a conveyor or the like.
  • the first assembly device 202 may couple the frequency control unit 121 to the resonator 104 of the filter body 102 (1).
  • the filter body 102 and the frequency control unit 121 may be respectively input to the first assembly device 202 .
  • a case in which six resonators 104 are formed in the filter body 102 will be described as an example.
  • the first assembly device 202 includes a first input part (not shown) into which the filter body 102 is input, a second input part (not shown) into which the frequency adjusting part 121 is input, and the filter body 102 and It may include a coupling unit (not shown) for fitting the frequency adjusting unit 121 .
  • the second input unit (not shown) may align the direction of the input frequency adjusting unit 121 .
  • the second input unit aligns the direction of the frequency control unit 121 input so that the interposed coupling unit 121b of the frequency control unit 121 faces the resonator 104 to form a coupling unit (not shown). ) can be provided.
  • the interposed coupling unit 121b of the frequency control unit 121 is interposed in the direction of the frequency control unit 121 as the interposed coupling unit 121b. It can be changed to face the resonator 104 .
  • the second input unit (not shown) may provide one set (ie, six) of the frequency control units 121 as a coupling unit (not shown).
  • the second input unit (not shown) may provide a coupling unit (not shown) by arranging the frequency adjusting unit 121 in a line according to the type of the frequency adjusting unit 121 .
  • the second input unit (not shown) provides one set (ie, six) of the frequency control unit 121 as a coupling unit (not shown)
  • the first type of frequency control unit ( 121) is arranged in the first and last (ie, sixth)
  • the second type of frequency control unit 121 is arranged in the second, third, fourth, and fifth to form a coupling unit (not shown).
  • a coupling unit may be coupled to each resonator 104 of the filter body 102 by fitting one set of the frequency control unit 121 .
  • the coupling unit (not shown) may be press-fitted to the end of the resonator 104 by press-fitting the coupling unit 121b of the frequency control unit 121 of one set.
  • 11 is a photograph showing a state in which a set of frequency adjusting units 121 are fitted to each resonator 104 of the filter body 102 in an disclosed embodiment.
  • the second assembly device 204 may couple the notch filter unit 123 to the inside of the filter body 102 (2). Specifically, the second assembling device 204 may receive the filter body 102 to which the frequency adjusting unit 121 is coupled from the first assembling device 202 . The second assembly device 204 may include a third input part (not shown) into which the notch filter part 123 is input.
  • the second assembling device 204 places the notch filter unit 123 on the inner one side of the filter body 102 and press-fits the notch filter unit 123 and the filter body 102 .
  • 12 is a photograph showing a state in which the notch filter unit 123 is coupled to one side of the inner side of the filter body 102 in the disclosed embodiment.
  • the third assembly device 206 may couple the cover part 106 to the filter body 102 (3). Specifically, the third assembling device 206 may receive the filter body 102 to which the notch filter unit 123 is coupled from the second assembling device 204 . The third assembling device 206 may include a fourth input unit (not shown) into which the cover unit 106 is inserted.
  • the third assembling device 206 press-fits the cover portion 106 in a state in which the cover portion 106 is disposed on the upper portion of the filter body 102 to include the filter body 102 and the cover portion ( 106) can be combined.
  • the third assembly device 206 has the first coupling hole 106a of the cover part 106 to correspond to the press protrusion 111a of the filter body 102 , and the second coupling hole 106b of the cover part 106 . ) may be disposed to correspond to the coupling protrusion 115 of the filter body 102 and then the press-fitting process may be performed.
  • 13 is a photograph showing a state in which the cover part 106 is coupled to the filter body 102 in one disclosed embodiment.
  • the printer device 208 may apply (print) solder cream to the substrate 108 (4).
  • the printer device 208 may apply solder cream to a predetermined portion of each substrate 108 .
  • 14 is a photograph showing the substrate tray 152 according to the disclosed embodiment
  • FIG. 15 is a photograph showing a state in which solder cream is applied to each substrate 108 of the substrate tray 152 in the disclosed embodiment. to be.
  • the substrate tray 152 may include eight substrates 108 .
  • Eight substrates 108 in the substrate tray 152 may be arranged in two rows.
  • the substrate tray 152 may include various other numbers of substrates 108 .
  • One or more markers 154 may be provided on the substrate tray 152 .
  • the marker 154 may be provided at each corner of the substrate tray 152 .
  • the marker 154 may be for the printer device 208 to recognize the position and orientation of the substrate tray 152 .
  • the fourth assembly device 210 may mount the substrate 108 to the filter body 102 to which the cover part 106 is coupled (5).
  • the fourth assembling device 210 may receive the filter body 102 on which the cover part 106 is mounted from the third assembling device 206 .
  • the fourth assembling apparatus 210 may receive the substrate tray 152 (ie, the substrate tray 152 including the plurality of substrates 108 to which the solder cream is applied) from the printer apparatus 208 .
  • the fourth assembly apparatus 210 may dispose the filter body 102 corresponding to each substrate 108 of the substrate tray 152 . That is, the fourth assembling device 210 may arrange the eight filter bodies 102 to correspond to the respective substrates 108 of the substrate tray 152 . The fourth assembly apparatus 210 may mount the filter body 102 on each substrate 108 of the substrate tray 152 . In this case, the cover portion 106 of the filter body 102 may be opposite to the substrate 108 . 16 is a photograph showing a state in which the filter body 102 is mounted on each substrate 108 on the substrate tray 152 according to the disclosed embodiment.
  • the reflow device 212 may reflow the solder cream-coated portion of each substrate 108 (6).
  • the reflow device 212 may receive the substrate tray 152 in which the filter body 102 is mounted on each substrate 108 from the fourth assembling device 210 .
  • the reflow device 212 may bond each substrate 108 and the filter body 102 by performing a reflow process on the solder cream-coated portion of each substrate 108 in the substrate tray 152 .
  • the high-frequency cavity filter 100 is formed as the substrate 108 and the filter body 102 are bonded.
  • a plurality of high-frequency cavity filters 100 are formed on the substrate tray 152 .
  • the cutting device 214 may cut each high frequency cavity filter 100 from the substrate tray 152 (7).
  • the cutting device 214 may receive the substrate tray 152 to which each substrate 108 and the filter body 102 are bonded from the reflow device 212 .
  • the cutting device 214 may cut each high frequency cavity filter 100 from the substrate tray 152 and separate the high frequency cavity filters 100 into individual high frequency cavity filters 100 .
  • 17 is a photograph showing the high-frequency cavity filter 100 cut by the cutting device 214 in the disclosed embodiment.
  • the tuning device 216 may tune the tuning unit 119 of the high-frequency cavity filter 100 (8).
  • a plurality of tuning devices 216 may be provided. Each tuning device 216 may receive a separate high-frequency cavity filter 100 from the cutting device 214 .
  • the tuning device 216 may perform a tuning operation by pressing the tuning part 119 after inserting the tuning screw 50 through the resonator hole 117 .

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

Un système et un procédé de fabrication d'un filtre à cavité haute fréquence sont divulgués. Un système de fabrication d'un filtre à cavité haute fréquence selon un mode de réalisation de la présente divulgation est un système de fabrication d'un filtre à cavité haute fréquence comprenant un corps de filtre formé à partir d'un matériau conducteur et une pluralité de résonateurs faisant saillie vers l'intérieur du corps de filtre à partir de trous de résonateur disposés dans une plaque de base du corps de filtre. Le système comprend un premier dispositif d'assemblage permettant d'accoupler une partie de commande de fréquence à chaque résonateur du corps de filtre, le premier dispositif d'assemblage comprenant : une première partie d'entrée dans laquelle le corps de filtre est entré ; une seconde partie d'entrée dans laquelle la partie de commande de fréquence est entrée ; et une partie d'accouplement permettant d'accoupler l'entrée de partie de commande de fréquence à travers la seconde partie d'entrée au résonateur respectif du corps de filtre entré à travers la première partie d'entrée.
PCT/KR2021/004972 2020-06-18 2021-04-21 Procédé et système de fabrication de filtre à cavité haute fréquence WO2021256688A1 (fr)

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KR1020200074455A KR102194401B1 (ko) 2020-06-18 2020-06-18 고주파 캐비티 필터의 제조 방법 및 시스템
KR10-2020-0074455 2020-06-18

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KR102194401B1 (ko) * 2020-06-18 2020-12-23 주식회사 엘트로닉스 고주파 캐비티 필터의 제조 방법 및 시스템

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KR102194401B1 (ko) * 2020-06-18 2020-12-23 주식회사 엘트로닉스 고주파 캐비티 필터의 제조 방법 및 시스템

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CN101924262A (zh) * 2009-06-11 2010-12-22 深圳市大富科技股份有限公司 一种腔体滤波器
KR101274031B1 (ko) * 2012-07-20 2013-06-12 주식회사 이너트론 통과 대역의 반사 손실을 제어하기 위한 대역 저지 필터
KR101386941B1 (ko) * 2012-10-10 2014-04-18 주식회사 이너트론 조립식 대역 저지 필터
KR101420044B1 (ko) * 2013-01-28 2014-07-17 주식회사 에이스테크놀로지 트랜스미션-제로 튜닝이 가능한 다중 모드 필터
KR102194401B1 (ko) * 2020-06-18 2020-12-23 주식회사 엘트로닉스 고주파 캐비티 필터의 제조 방법 및 시스템

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