WO2022045602A1 - Method for manufacturing busbar assembly for battery module, through which high stepped portion is easily filled - Google Patents

Method for manufacturing busbar assembly for battery module, through which high stepped portion is easily filled Download PDF

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Publication number
WO2022045602A1
WO2022045602A1 PCT/KR2021/009845 KR2021009845W WO2022045602A1 WO 2022045602 A1 WO2022045602 A1 WO 2022045602A1 KR 2021009845 W KR2021009845 W KR 2021009845W WO 2022045602 A1 WO2022045602 A1 WO 2022045602A1
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WIPO (PCT)
Prior art keywords
bus bar
jig
manufacturing
battery module
cover film
Prior art date
Application number
PCT/KR2021/009845
Other languages
French (fr)
Korean (ko)
Inventor
우상엽
조원선
이광희
김준호
한승호
Original Assignee
한화솔루션 주식회사
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Publication of WO2022045602A1 publication Critical patent/WO2022045602A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
    • H01M2220/20—Batteries in motive systems, e.g. vehicle, ship, plane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a method of manufacturing a busbar assembly for a battery module that can easily be filled with a high level difference, and more particularly, the shapes of the surfaces of the lower jig and the upper jig are complementary to the shapes of the lower and upper surfaces of the busbar assembly. Formed to be coupled, it is possible to improve the filling properties of the film of the stepped portion.
  • a battery In order to drive an electric car, a battery is required, and a plurality of battery cells are connected to provide a high-output, large-capacity battery in the electric car. In addition, a plurality of battery cells are connected in series and in parallel.
  • a plurality of connected batteries is commonly referred to as a battery module.
  • a battery module A plurality of connected batteries is commonly referred to as a battery module.
  • a device for sensing the voltage and temperature of a battery cell is called various types, and is generally referred to as a battery sensing module.
  • the battery sensing module is provided with a flexible printed circuit board (FPCB), a busbar, a connector, a frame, and the like. These parts are electrically connected to each other.
  • the flexible printed circuit board (FPCB) serves to sense the voltage and temperature of the cell and transmit a signal to the BMS (Battery Management System).
  • the battery sensing module is provided with a plurality of films (Film) for insulation, circuit protection, and the like.
  • the film is generally positioned to cover both sides of a flexible printed circuit board (FPCB), a busbar, or the like.
  • the film is laminated and attached together with a flexible printed circuit board (FPCB), a busbar, etc., and is pressurized through a jig to produce a battery sensing module.
  • the part 1 is an enlarged actual photograph of the vicinity of a component in a conventional battery sensing module.
  • a film 2 is attached to the component 1 .
  • the part 1 has a protruding portion as shown in FIG. 1 , and in some cases, a non-protruding portion and a step 3 are formed.
  • the present invention relates to a method of manufacturing a busbar assembly for a battery module that can easily be filled with a high level difference, and more particularly, the shapes of the surfaces of the lower jig and the upper jig are complementary to the shapes of the lower and upper surfaces of the busbar assembly. Formed to be coupled, it is possible to improve the filling properties of the film of the stepped portion.
  • a method of manufacturing a bus bar assembly for a battery module comprising: disposing a lower jig; disposing a bus bar assembly on the upper surface of the lower jig: pressing the upper jig toward the bus bar assembly, wherein the shapes of the surfaces of the lower jig and the upper jig are respectively the lower surfaces of the bus bar assembly And characterized in that it is formed to be complementary to the shape of the upper surface.
  • the busbar assembly of the method for manufacturing a busbar assembly for a battery module that can easily be filled with a high level difference according to the present invention is characterized in that it includes a cover film, a busbar, a substrate and a sheet.
  • the cover film of the method for manufacturing a bus bar assembly for a battery module that is easily filled with a high step according to the present invention comprises a lower cover film and an upper cover film respectively coupled to the lower surface and upper surface of the sheet. do.
  • the bus bar of the method for manufacturing a bus bar assembly for a battery module that can easily be filled with a high step according to the present invention includes: a lower bus bar disposed between a lower surface of the sheet and the lower cover film; and an upper bus bar disposed between the upper surface of the sheet and the upper cover film.
  • the substrate of the method for manufacturing a bus bar assembly for a battery module that is easily filled with a high step according to the present invention is disposed between the upper surface of the sheet and the upper cover film and is electrically connected to the bus bar. .
  • the substrate of the method for manufacturing a busbar assembly for a battery module that is easily filled with a high step according to the present invention is characterized in that it is a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the sheet of the method for manufacturing a bus bar assembly for a battery module that is easily filled with a high step difference is characterized in that it includes an insulating film.
  • the method of manufacturing a bus bar assembly for a battery module that is easily filled with a high step difference further includes the step of laminating a rubber between the bus bar assembly and the upper jig or the lower jig.
  • the method for manufacturing a busbar assembly for a battery module that is easily filled with a high level difference further includes laminating a release film between the busbar assembly and the upper jig or the lower jig.
  • the present invention it is possible to improve the filling properties of the film in the high-step difference portion between the protruding part and the film formed in the battery sensing module.
  • 1 is an enlarged actual photograph of the vicinity of a component in a conventional battery sensing module.
  • 15 is an exploded perspective view of a bus bar assembly according to the present invention.
  • a method of manufacturing a battery sensing module that can be easily filled with a high level difference will be described.
  • an assembly excluding the frame in the battery sensing module is referred to as a 'bus bar assembly (A)', and a method of manufacturing the 'bus bar assembly (A)' will be described below.
  • FIG. 14 is an assembled busbar assembly
  • FIG. 15 is a busbar assembly according to the present invention. It is an exploded perspective view.
  • FIG. 2 Please refer to FIG. 2 .
  • the lower jig 100 is disposed.
  • the lower jig 100 has a plate shape, and protruding and recessed portions are formed so that a cover film, a sheet, a flexible printed circuit board, rubber, a release film, etc. to be described later are disposed in the shape of the designed bus bar assembly (A).
  • A designed bus bar assembly
  • the surfaces of the lower jig 100 and the upper jig 1400 to be described later are formed to be complementary to the shapes of the lower and upper surfaces of the bus bar assembly A.
  • the surface of the pressing jig has a flat shape, there is a problem in that when the bus bar assembly A is pressed, the filling property is inevitably reduced in the portion where the step is formed due to the bus bar or the like.
  • the lower jig 100 and the upper jig 1400 can coincide with the surface of the bus bar assembly A to be manufactured, there is an advantage that the cover film can be filled even in the portion where the step is formed.
  • both the rubber and the release film laminated on the lower jig 100 are formed to correspond to the shape of the lower jig 100 , and similarly to the effect of the lower jig 100 , the filling property of the cover film is improved.
  • the lower jig 100 may include, for example, a lower jig frame 110 , a bus bar seating groove 120 , and a plurality of guide pins 130 .
  • a bus bar to be described later may be disposed in the bus bar seating groove 120 , and the guide pin 130 may penetrate the entire bus bar assembly A.
  • the lower rubber 200 is laminated on the upper surface of the lower jig 100 .
  • the lower rubber 200 preferably has a shape corresponding to the surface shape of the lower jig 100 .
  • the rubber Rubber, rubber
  • the rubber has an elastic material.
  • the lower rubber 200 comes into contact with the portion where the step is formed, the lower rubber 200 is bent due to pressure. For this reason, the rubber 200 can press the stepped portion, so that the fillability of the cover film is improved.
  • the lower release film 300 is laminated on the upper surface of the lower rubber 200 .
  • the lower release film 300 preferably has a shape corresponding to the surface shape of the lower jig 100 . For this reason, there is an advantage in that the fillability of the cover film is improved.
  • a release film is a kind of film used for the purpose of product protection. Since the release film is a known technology in the art, a detailed description thereof will be omitted.
  • the lower cover film 400 is laminated on the upper surface of the lower release film 300 .
  • the lower cover film 400 preferably has a shape corresponding to the surface shape of the lower jig 100 . For this reason, there is an advantage in that the fillability of the cover film is improved.
  • a cover film (Cover Film) is also referred to as a coverlay (Coverlay), and performs a protection function and an insulating function of the circuit.
  • the cover film has an adhesive layer, it is possible to adhere and fix components (bus bars, flexible printed circuit boards, etc.) laminated on the upper surface of the cover film.
  • an adhesive layer is formed on the upper surface of the lower cover film 400 , and the worker peels off the protective film protecting the adhesive layer and then laminates the lower cover film 400 on the upper surface of the lower release film 300 .
  • a plurality of lower bus bars 700 are stacked at a previously designed position on the upper surface of the lower cover film 400 .
  • a busbar is a rod-shaped conductor and serves to perform electrical connection. It is connected to a flexible printed circuit board to be described later, and the bus bar is a well-known technology in the relevant field, so a detailed description thereof will be omitted.
  • the sheet 800 is laminated on the upper surface of the lower cover film 400 and the lower bus bar 700 .
  • the sheet 800 serves as a bonding sheet, and is composed of an insulating film 810, an upper sheet 820 and a lower sheet 830 laminated on the upper and lower surfaces of the insulating film 810. It is preferable
  • the top sheet 820 and the bottom sheet 830 have adhesive layers. For this reason, the lower cover film 400 , the upper cover film 1100 , the flexible printed circuit board 1000 , the lower bus bar 700 , and the upper bus bar 900 can be combined.
  • FIG. 8 Reference is made to FIG. 8 .
  • a plurality of upper bus bars 900 are stacked at a previously designed position on the upper surface of the sheet 800 .
  • the lower bus bar 700 and the lower bus bar 700 are generally disposed so as not to be positioned at the same position in the vertical direction, and the description of the bus bar has been described above, and thus a detailed description thereof will be omitted to avoid overlapping description.
  • the substrate 1000 is laminated at a pre-designed position on the upper surface of the sheet 800 .
  • the substrate 1000 may be, for example, a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • a flexible printed circuit board is a circuit board that can be bent, and is a well-known technology in the art, and detailed description thereof will be omitted.
  • the flexible printed circuit board 1000 may be electrically connected to the bus bars 700 and 900 and the bus bar plate 1001 .
  • the bus bars 700 and 900 and the bus bar plate 1001 may be coupled, for example, by laser welding, and the bus bar plate 1001 and the flexible printed circuit board 1001 may be coupled, for example, by soldering. there is.
  • Reference numeral '1002' denotes a soldered paste.
  • an upper cover film 1100 is laminated on the sheet 800 , the upper bus bar 900 , and the upper surface of the substrate 1000 .
  • the upper cover film 1100 preferably has a shape corresponding to the surface shape of the upper jig 1400 . For this reason, there is an advantage in that the fillability of the cover film is improved.
  • the upper cover film 1100 has an adhesive layer to adhere and fix parts (bus bars, flexible printed circuit boards, etc.) stacked on the lower surface of the upper cover film 1100 .
  • an adhesive layer is formed on the lower surface of the upper cover film 1100, and the worker peels off the protective film protecting the adhesive layer and then laminates it.
  • FIG. 11 Reference is made to FIG. 11 .
  • the upper release film 1200 is laminated on the upper surface of the upper cover film 1100 .
  • the upper release film 1200 preferably has a shape corresponding to the surface shape of the upper jig 1400 .
  • FIG. 12 Reference is made to FIG. 12 .
  • the upper rubber 1300 is laminated on the upper surface of the upper release film 1200 .
  • the upper rubber 1300 preferably has a shape corresponding to the surface shape of the upper jig 1400 .
  • the upper rubber 1300 is preferably made of the same material as the lower rubber 200 .
  • the lower rubber 200 may fill the lower cover film 400 near the step portion generated due to the height difference between the seat 800 and the lower bus bar 700 in the vertical direction
  • the upper rubber 1300 fills the upper cover film 1100 near the step portion generated due to the height difference in the vertical direction of the sheet 800, the upper bus bar 900, the substrate 1000, the bus bar plate 1001, etc. be able to As such, there is an advantage that the filling properties can be improved on both surfaces.
  • FIG. 13 Reference is made to FIG. 13 .
  • the upper jig 1400 is pressed toward the upper rubber 1300 .
  • the surface of the upper jig 1400 is preferably formed to be complementary to the shape of the upper surface of the bus bar assembly (A) stacked.
  • the cover film can be filled even in the portion where the step is formed.
  • the upper jig 1400 may include, for example, an upper jig frame 1410 and a plurality of guide grooves 1420 .
  • the upper jig frame 1410 may coincide with the lower jig frame 110 as shown in FIG. 13 , and the guide pin 130 partially penetrates the guide groove 1420 to improve the fixability of the bus bar assembly A.
  • FIG. 1 Compared with FIG. 1 , it can be seen that the film is not floating in the vicinity of the step unlike in the prior art. That is, it can be confirmed that the filling properties are improved.
  • the present invention relates to a method of manufacturing a busbar assembly for a battery module that can easily be filled with a high level difference, and more particularly, the shapes of the surfaces of the lower jig and the upper jig are complementary to the shapes of the lower and upper surfaces of the busbar assembly. Formed to be coupled, it is possible to improve the filling properties of the film of the stepped portion.

Abstract

The present invention relates to a method for manufacturing a busbar assembly for a battery module, through which a high stepped portion is easily filled. More specifically, since the shapes of the surfaces of a bottom jig and a top jig are formed so as to be complementarily coupled to the shapes of the bottom surface and the top surface of the busbar assembly, it is possible to improve the filling properties of a film on a stepped portion.

Description

고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법Manufacturing method of busbar assembly for battery module that is easy to fill with high level difference
본 발명은 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법에 관한 발명으로, 보다 상세하게는 하부 지그 및 상부 지그의 표면의 형상이 버스바 조립체의 하면 및 상면의 형상에 상보적으로 결합되도록 형성되어, 단차 부분의 필름의 충진성을 향상시킬 수 있게 된다.The present invention relates to a method of manufacturing a busbar assembly for a battery module that can easily be filled with a high level difference, and more particularly, the shapes of the surfaces of the lower jig and the upper jig are complementary to the shapes of the lower and upper surfaces of the busbar assembly. Formed to be coupled, it is possible to improve the filling properties of the film of the stepped portion.
전기차(electric car)가 구동되기 위해서는 배터리(battery)가 필요하며, 고출력 대용량의 배터리를 전기차 내에 구비하기 위해 복수 개의 배터리 셀(battery cell)을 연결하게 된다. 또한, 복수 개의 배터리 셀을 직렬, 병렬로 연결하게 된다.In order to drive an electric car, a battery is required, and a plurality of battery cells are connected to provide a high-output, large-capacity battery in the electric car. In addition, a plurality of battery cells are connected in series and in parallel.
연결된 복수 개의 배터리를 통상적으로 배터리 모듈(battery module)이라 지칭한다. 이때, 배터리 모듈의 일부 배터리 셀에서는 과전압, 과전류, 과발열 등의 현상이 발생되므로 배터리 셀의 전압 및 온도를 센싱하는 것이 매우 중요하다.A plurality of connected batteries is commonly referred to as a battery module. At this time, since phenomena such as overvoltage, overcurrent, and overheating occur in some battery cells of the battery module, it is very important to sense the voltage and temperature of the battery cells.
배터리 셀의 전압 및 온도를 센싱하는 장치는 다양한 형태로 불리우는데, 일반적으로 배터리 센싱 모듈이라고 지칭한다. 배터리 센싱 모듈은 연성인쇄회로기판(FPCB, Flexible Printed Circuit Board), 버스바(Busbar), 커넥터(Connector), 프레임(Frame) 등으로 구비된다. 이러한 부품들은 상호 전기적으로 연결된다. 연성인쇄회로기판(FPCB)은 셀의 전압 및 온도를 센싱하여 BMS(Battery Management System)으로 신호를 전송하는 역할을 한다.A device for sensing the voltage and temperature of a battery cell is called various types, and is generally referred to as a battery sensing module. The battery sensing module is provided with a flexible printed circuit board (FPCB), a busbar, a connector, a frame, and the like. These parts are electrically connected to each other. The flexible printed circuit board (FPCB) serves to sense the voltage and temperature of the cell and transmit a signal to the BMS (Battery Management System).
또한, 배터리 센싱 모듈은 절연, 회로 보호 등을 위한 필름(Film)이 다수 구비된다. 필름은 연성인쇄회로기판(FPCB), 버스바(Busbar) 등의 양면을 감싸도록 위치되는 것이 일반적이다. 필름은 연성인쇄회로기판(FPCB), 버스바(Busbar) 등과 함께 적층 및 부착되고, 지그를 통해 가압 되어 배터리 센싱 모듈로 제작된다.In addition, the battery sensing module is provided with a plurality of films (Film) for insulation, circuit protection, and the like. The film is generally positioned to cover both sides of a flexible printed circuit board (FPCB), a busbar, or the like. The film is laminated and attached together with a flexible printed circuit board (FPCB), a busbar, etc., and is pressurized through a jig to produce a battery sensing module.
도 1은 종래의 배터리 센싱 모듈에서 부품 부근을 확대한 실제 사진이다. 부품(1)에는 필름(2)이 부착되어 있다. 부품(1)에는 도 1과 같이 돌출된 부분이 있어, 돌출되지 않은 부분과 단차(3)가 형성되는 경우가 있다.1 is an enlarged actual photograph of the vicinity of a component in a conventional battery sensing module. A film 2 is attached to the component 1 . The part 1 has a protruding portion as shown in FIG. 1 , and in some cases, a non-protruding portion and a step 3 are formed.
이때, 단차(3) 부근에 필름(2)이 부착될 때, 도 1과 같이 단차(3) 구조 특성으로 인해 필름(2)이 들떠 충진이 되지 않는 문제가 있다. 특히, 고(高)단차 부근에서는 이러한 들뜸 현상이 극대화된다. 또한, 굴곡진(Curve) 부분에도 이러한 현상이 발생된다.At this time, when the film 2 is attached to the vicinity of the step 3, there is a problem in that the film 2 is not filled due to the structure characteristic of the step 3 as shown in FIG. 1 . In particular, in the vicinity of a high step, this lifting phenomenon is maximized. Also, this phenomenon occurs in curved portions.
위와 같이 배터리 센싱 모듈에 있어서 필름의 미충진의 문제점을 극복하기 위한 발명의 개발이 필요한 실정이다.As described above, it is necessary to develop an invention to overcome the problem of not filling the film in the battery sensing module.
본 발명은 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법에 관한 발명으로, 보다 상세하게는 하부 지그 및 상부 지그의 표면의 형상이 버스바 조립체의 하면 및 상면의 형상에 상보적으로 결합되도록 형성되어, 단차 부분의 필름의 충진성을 향상시킬 수 있게 된다.The present invention relates to a method of manufacturing a busbar assembly for a battery module that can easily be filled with a high level difference, and more particularly, the shapes of the surfaces of the lower jig and the upper jig are complementary to the shapes of the lower and upper surfaces of the busbar assembly. Formed to be coupled, it is possible to improve the filling properties of the film of the stepped portion.
상기 목적을 달성하기 위하여, 본 발명에 따른 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법은 하부 지그를 배치하는 단계; 상기 하부 지그의 상면에 버스바 조립체를 배치하는 단계: 상부 지그를 상기 버스바 조립체를 향하여 가압하는 단계;를 포함하고, 상기 하부 지그 및 상기 상부 지그의 표면의 형상은 각각 상기 버스바 조립체의 하면 및 상면의 형상에 상보적으로 결합되도록 형성되는 것을 특징으로 한다.In order to achieve the above object, according to the present invention, there is provided a method of manufacturing a bus bar assembly for a battery module that is easily filled with a high level difference, comprising: disposing a lower jig; disposing a bus bar assembly on the upper surface of the lower jig: pressing the upper jig toward the bus bar assembly, wherein the shapes of the surfaces of the lower jig and the upper jig are respectively the lower surfaces of the bus bar assembly And characterized in that it is formed to be complementary to the shape of the upper surface.
또한, 본 발명에 따른 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법의 상기 버스바 조립체는, 커버필름, 버스바, 기판 및 시트를 포함하는 것을 특징으로 한다.In addition, the busbar assembly of the method for manufacturing a busbar assembly for a battery module that can easily be filled with a high level difference according to the present invention is characterized in that it includes a cover film, a busbar, a substrate and a sheet.
또한, 본 발명에 따른 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법의 상기 커버필름은, 상기 시트의 하면 및 상면에 각각 결합되는 하부 커버필름 및 상부 커버필름을 포함하는 것을 특징으로 한다.In addition, the cover film of the method for manufacturing a bus bar assembly for a battery module that is easily filled with a high step according to the present invention comprises a lower cover film and an upper cover film respectively coupled to the lower surface and upper surface of the sheet. do.
또한, 본 발명에 따른 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법의 상기 버스바는, 상기 시트의 하면과 상기 하부 커버필름 사이에 배치되는 하부 버스바; 및 상기 시트의 상면과 상기 상부 커버필름 사이에 배치되는 상부 버스바;를 포함하는 것을 특징으로 한다.In addition, the bus bar of the method for manufacturing a bus bar assembly for a battery module that can easily be filled with a high step according to the present invention includes: a lower bus bar disposed between a lower surface of the sheet and the lower cover film; and an upper bus bar disposed between the upper surface of the sheet and the upper cover film.
또한, 본 발명에 따른 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법의 상기 기판은, 상기 시트의 상면과 상기 상부 커버필름 사이에 배치되어 상기 버스바와 전기적으로 연결되는 것을 특징으로 한다.In addition, the substrate of the method for manufacturing a bus bar assembly for a battery module that is easily filled with a high step according to the present invention is disposed between the upper surface of the sheet and the upper cover film and is electrically connected to the bus bar. .
또한, 본 발명에 따른 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법의 상기 기판은, 연성인쇄회로기판(FPCB)인 것을 특징으로 한다.In addition, the substrate of the method for manufacturing a busbar assembly for a battery module that is easily filled with a high step according to the present invention is characterized in that it is a flexible printed circuit board (FPCB).
또한, 본 발명에 따른 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법의 상기 시트는, 절연필름을 포함하는 것을 특징으로 한다.In addition, according to the present invention, the sheet of the method for manufacturing a bus bar assembly for a battery module that is easily filled with a high step difference is characterized in that it includes an insulating film.
또한, 본 발명에 따른 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법은 상기 버스바 조립체와 상기 상부 지그 또는 상기 하부 지그 사이에 러버를 적층하는 단계;를 더 포함한다.In addition, the method of manufacturing a bus bar assembly for a battery module that is easily filled with a high step difference according to the present invention further includes the step of laminating a rubber between the bus bar assembly and the upper jig or the lower jig.
또한, 본 발명에 따른 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법은 상기 버스바 조립체와 상기 상부 지그 또는 상기 하부 지그 사이에 이형 필름을 적층하는 단계;를 더 포함한다.In addition, the method for manufacturing a busbar assembly for a battery module that is easily filled with a high level difference according to the present invention further includes laminating a release film between the busbar assembly and the upper jig or the lower jig.
본 발명에 따르면, 배터리 센싱 모듈에 형성되는 돌출된 부품과 필름 사이의 고단차부 부분에 필름의 충진성을 향상시킬 수 있다.According to the present invention, it is possible to improve the filling properties of the film in the high-step difference portion between the protruding part and the film formed in the battery sensing module.
도 1은 종래의 배터리 센싱 모듈에서 부품 부근을 확대한 실제 사진이다.1 is an enlarged actual photograph of the vicinity of a component in a conventional battery sensing module.
도 2 내지 도 13은 본 발명에 따른 버스바 조립체의 제조를 위한 적층 과정을 순차적으로 도시한 것이다.2 to 13 sequentially illustrate a lamination process for manufacturing a busbar assembly according to the present invention.
도 14는 조립된 버스바 조립체를 도시한 것이다.14 shows an assembled busbar assembly.
도 15는 본 발명에 따른 버스바 조립체의 분해 사시도이다.15 is an exploded perspective view of a bus bar assembly according to the present invention.
도 16은 본 발명에 따른 제조 방법을 통해 제조된 배터리 센싱 모듈의 부품 부근을 확대한 실제 사진이다.16 is an enlarged actual photograph of the vicinity of the parts of the battery sensing module manufactured through the manufacturing method according to the present invention.
이하, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명의 실시예에 대하여 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다.Hereinafter, embodiments of the present invention will be described in detail so that those of ordinary skill in the art can easily carry out the present invention. However, the present invention may be embodied in several different forms and is not limited to the embodiments described herein.
이하에서는, 고단차부 충진이 용이한 배터리 센싱 모듈의 제조 방법을 설명하도록 한다. 특히, 배터리 센싱 모듈 내에서 프레임을 제외한 조립체를 '버스바 조립체(A)'라고 지칭하며, 이하에서는 '버스바 조립체(A)'의 제조방법을 설명하도록 한다.Hereinafter, a method of manufacturing a battery sensing module that can be easily filled with a high level difference will be described. In particular, an assembly excluding the frame in the battery sensing module is referred to as a 'bus bar assembly (A)', and a method of manufacturing the 'bus bar assembly (A)' will be described below.
또한, 도면에 도시된 필름, 연성인쇄회로기판, 버스바 등의 형상은 일 예시이며, 반드시 이러한 형상에 국한되지 않는다.In addition, the shapes of the films, flexible printed circuit boards, bus bars, etc. shown in the drawings are examples, and are not necessarily limited to these shapes.
도 2 내지 도 13은 본 발명에 따른 버스바 조립체의 제조를 위한 적층 과정을 순차적으로 도시한 것이며, 도 14는 조립된 버스바 조립체를 도시한 것이며, 도 15는 본 발명에 따른 버스바 조립체의 분해 사시도이다.2 to 13 sequentially illustrate a lamination process for manufacturing a busbar assembly according to the present invention, FIG. 14 is an assembled busbar assembly, and FIG. 15 is a busbar assembly according to the present invention. It is an exploded perspective view.
도 2를 참조하도록 한다.Please refer to FIG. 2 .
먼저, 하부 지그(100)를 배치한다. 하부 지그(100)는 플레이트(plate) 형상으로, 후술할 커버필름, 시트, 연성인쇄회로기판, 러버, 이형필름 등이 설계된 버스바 조립체(A)의 형상에 배치되도록 돌출, 함몰된 부분이 형성될 수 있다.First, the lower jig 100 is disposed. The lower jig 100 has a plate shape, and protruding and recessed portions are formed so that a cover film, a sheet, a flexible printed circuit board, rubber, a release film, etc. to be described later are disposed in the shape of the designed bus bar assembly (A). can be
이때, 하부 지그(100) 및 후술할 상부 지그(1400)의 표면은 버스바 조립체(A)의 하면 및 상면의 형상에 상보적(相補的)으로 결합되도록 형성되는 것이 바람직하다. 종래에는 가압 지그의 표면이 플랫(Plat)한 형상이기 때문에, 버스바 조립체(A)를 가압하는 경우 버스바 등으로 인해 단차가 형성된 부분에 충진성이 떨어질 수밖에 없는 문제점이 있다. 그러나, 본 발명에 따르면, 하부 지그(100) 및 상부 지그(1400)가 제조될 버스바 조립체(A)의 표면과 합치될 수 있어 단차가 형성된 부분에도 커버필름이 충진될 수 있는 장점이 있다.At this time, it is preferable that the surfaces of the lower jig 100 and the upper jig 1400 to be described later are formed to be complementary to the shapes of the lower and upper surfaces of the bus bar assembly A. Conventionally, since the surface of the pressing jig has a flat shape, there is a problem in that when the bus bar assembly A is pressed, the filling property is inevitably reduced in the portion where the step is formed due to the bus bar or the like. However, according to the present invention, since the lower jig 100 and the upper jig 1400 can coincide with the surface of the bus bar assembly A to be manufactured, there is an advantage that the cover film can be filled even in the portion where the step is formed.
이때, 하부 지그(100)에 적층되는 러버, 이형필름 모두 하부 지그(100)의 형상에 대응되도록 형성되며, 하부 지그(100)의 효과와 마찬가지로 커버필름이 충진성이 향상된다.At this time, both the rubber and the release film laminated on the lower jig 100 are formed to correspond to the shape of the lower jig 100 , and similarly to the effect of the lower jig 100 , the filling property of the cover film is improved.
하부 지그(100)는 일 예로 하부 지그 프레임(110), 버스바 안착홈(120), 가이드 핀(130) 등이 복수 개 형성될 수 있다. 버스바 안착홈(120)에는 후술할 버스바가 배치될 수 있으며, 가이드 핀(130)은 버스바 조립체(A) 전체를 관통할 수 있다.The lower jig 100 may include, for example, a lower jig frame 110 , a bus bar seating groove 120 , and a plurality of guide pins 130 . A bus bar to be described later may be disposed in the bus bar seating groove 120 , and the guide pin 130 may penetrate the entire bus bar assembly A.
도 3을 참조하도록 한다.Please refer to FIG. 3 .
다음으로, 하부 지그(100)의 상면에 하부 러버(200)를 적층한다. 하부 러버(200)는 하부 지그(100)의 표면 형상에 대응되는 형상을 지니는 것이 바람직하다.Next, the lower rubber 200 is laminated on the upper surface of the lower jig 100 . The lower rubber 200 preferably has a shape corresponding to the surface shape of the lower jig 100 .
이때, 러버(Rubber, 고무)는 탄성 재질을 지니게 된다. 단차가 형성된 부분에 하부 러버(200)가 맞닿는 경우, 가압으로 인해 하부 러버(200)는 벤딩(Bending)된다. 이로 인해, 러버(200)가 단차 부분을 가압할 수 있어 커버필름의 충진성이 향상되는 장점이 있다.At this time, the rubber (Rubber, rubber) has an elastic material. When the lower rubber 200 comes into contact with the portion where the step is formed, the lower rubber 200 is bent due to pressure. For this reason, the rubber 200 can press the stepped portion, so that the fillability of the cover film is improved.
도 4를 참조하도록 한다.Reference is made to FIG. 4 .
다음으로, 하부 러버(200)의 상면에 하부 이형필름(300)을 적층한다. 하부 이형필름(300)은 하부 지그(100)의 표면 형상에 대응되는 형상을 지니는 것이 바람직하다. 이로 인해, 커버필름의 충진성이 향상되는 장점이 있다.Next, the lower release film 300 is laminated on the upper surface of the lower rubber 200 . The lower release film 300 preferably has a shape corresponding to the surface shape of the lower jig 100 . For this reason, there is an advantage in that the fillability of the cover film is improved.
이형필름(Release Film)이란, 제품 보호를 목적으로 사용되는 필름의 일종이다. 이형필름은 해당 분야에서 공지된 기술인 바, 상세한 설명은 생략하도록 한다.A release film is a kind of film used for the purpose of product protection. Since the release film is a known technology in the art, a detailed description thereof will be omitted.
도 5를 참조하도록 한다.Reference is made to FIG. 5 .
다음으로, 하부 이형필름(300)의 상면에 하부 커버필름(400)을 적층한다. 하부 커버필름(400)은 하부 지그(100)의 표면 형상에 대응되는 형상을 지니는 것이 바람직하다. 이로 인해, 커버필름의 충진성이 향상되는 장점이 있다.Next, a lower cover film 400 is laminated on the upper surface of the lower release film 300 . The lower cover film 400 preferably has a shape corresponding to the surface shape of the lower jig 100 . For this reason, there is an advantage in that the fillability of the cover film is improved.
커버필름(Cover Film)은 커버레이(Coverlay)라 지칭되기도 하며, 회로의 보호 기능 및 절연 기능을 수행한다. 이때, 커버필름에는 접착층이 있어 커버필름의 상면에 적층되는 부품(버스바, 연성인쇄회로기판 등)을 접착 및 고정할 수 있게 된다. 본 발명에서는 하부 커버필름(400)의 상면에 접착층이 형성되고, 작업자는 접착층을 보호하고 있는 보호필름을 벗겨낸 뒤 하부 이형필름(300)의 상면에 하부 커버필름(400)을 적층하게 된다.A cover film (Cover Film) is also referred to as a coverlay (Coverlay), and performs a protection function and an insulating function of the circuit. At this time, since the cover film has an adhesive layer, it is possible to adhere and fix components (bus bars, flexible printed circuit boards, etc.) laminated on the upper surface of the cover film. In the present invention, an adhesive layer is formed on the upper surface of the lower cover film 400 , and the worker peels off the protective film protecting the adhesive layer and then laminates the lower cover film 400 on the upper surface of the lower release film 300 .
도 6을 참조하도록 한다.Please refer to FIG. 6 .
다음으로, 하부 커버필름(400)의 상면에서 기 설계된 위치에 복수 개의 하부 버스바(700)를 적층한다.Next, a plurality of lower bus bars 700 are stacked at a previously designed position on the upper surface of the lower cover film 400 .
버스바(Busbar)는 막대형 전도체로, 전기적 연결을 수행하는 역할을 한다. 후술할 연성인쇄회로기판과 연결되며, 버스바는 해당 분야에서 공지된 기술인 바, 상세한 설명은 생략하도록 한다.A busbar is a rod-shaped conductor and serves to perform electrical connection. It is connected to a flexible printed circuit board to be described later, and the bus bar is a well-known technology in the relevant field, so a detailed description thereof will be omitted.
도 7을 참조하도록 한다.Please refer to FIG. 7 .
다음으로, 하부 커버필름(400) 및 하부 버스바(700)의 상면에 시트(800)를 적층한다. 도 15를 참조하면, 시트(800)는 본딩 시트(Bonding sheet) 역할로, 절연필름(810), 절연필름(810)의 상하면에 적층된 상부 시트(820) 및 하부 시트(830)로 구성되는 것이 바람직하다. 상부 시트(820) 및 하부 시트(830)는 접착층을 지닌다. 이로 인해, 하부 커버필름(400), 상부 커버필름(1100), 연성인쇄회로기판(1000), 하부 버스바(700) 및 상부 버스바(900)를 결합시킬 수 있다.Next, the sheet 800 is laminated on the upper surface of the lower cover film 400 and the lower bus bar 700 . 15, the sheet 800 serves as a bonding sheet, and is composed of an insulating film 810, an upper sheet 820 and a lower sheet 830 laminated on the upper and lower surfaces of the insulating film 810. it is preferable The top sheet 820 and the bottom sheet 830 have adhesive layers. For this reason, the lower cover film 400 , the upper cover film 1100 , the flexible printed circuit board 1000 , the lower bus bar 700 , and the upper bus bar 900 can be combined.
도 8을 참조하도록 한다.Reference is made to FIG. 8 .
다음으로, 시트(800)의 상면에서 기 설계된 위치에 복수 개의 상부 버스바(900)를 적층한다. 하부 버스바(700)와 일반적으로 수직 방향으로 동일한 위치가 되지 않도록 배치되며, 버스바에 관한 설명은 전술한 바, 중복 설명을 방지하기 위해 상세한 설명은 생략한다.Next, a plurality of upper bus bars 900 are stacked at a previously designed position on the upper surface of the sheet 800 . The lower bus bar 700 and the lower bus bar 700 are generally disposed so as not to be positioned at the same position in the vertical direction, and the description of the bus bar has been described above, and thus a detailed description thereof will be omitted to avoid overlapping description.
*도 9를 참조하도록 한다.* Refer to FIG. 9 .
다음으로, 시트(800)의 상면에서 기 설계된 위치에 기판(1000)을 적층한다. 기판(1000)은 일 예로 연성인쇄회로기판(FPCB)인 것이 바람직하다. 연성인쇄회로기판은 휘어짐이 가능한 회로 기판으로, 해당 분야에서 공지된 기술인 바, 상세한 설명은 생략하도록 한다.Next, the substrate 1000 is laminated at a pre-designed position on the upper surface of the sheet 800 . The substrate 1000 may be, for example, a flexible printed circuit board (FPCB). A flexible printed circuit board is a circuit board that can be bent, and is a well-known technology in the art, and detailed description thereof will be omitted.
일 예로, 연성인쇄회로기판(1000)은 버스바(700, 900)와 버스바 플레이트(1001)를 통해 전기적으로 연결될 수 있다. 버스바(700, 900)와 버스바 플레이트(1001)는 일 예로 레이저 용접으로 결합될 수 있고, 버스바 플레이트(1001)와 연성인쇄회로기판(1001)은 일 예로 솔더링(Soldering)으로 결합될 수 있다. 도면부호 '1002'는 솔더링 된 페이스트를 도시한 것이다.For example, the flexible printed circuit board 1000 may be electrically connected to the bus bars 700 and 900 and the bus bar plate 1001 . The bus bars 700 and 900 and the bus bar plate 1001 may be coupled, for example, by laser welding, and the bus bar plate 1001 and the flexible printed circuit board 1001 may be coupled, for example, by soldering. there is. Reference numeral '1002' denotes a soldered paste.
도 10을 참조하도록 한다.Reference is made to FIG. 10 .
다음으로, 시트(800), 상부 버스바(900), 기판(1000)의 상면에 상부 커버필름(1100)을 적층한다. 이때, 하부 커버필름(400)과 마찬가지의 원리로, 상부 커버필름(1100)은 상부 지그(1400)의 표면 형상에 대응되는 형상을 지니는 것이 바람직하다. 이로 인해, 커버필름의 충진성이 향상되는 장점이 있다.Next, an upper cover film 1100 is laminated on the sheet 800 , the upper bus bar 900 , and the upper surface of the substrate 1000 . At this time, in the same principle as the lower cover film 400 , the upper cover film 1100 preferably has a shape corresponding to the surface shape of the upper jig 1400 . For this reason, there is an advantage in that the fillability of the cover film is improved.
또한, 하부 커버필름(400)과 마찬가지의 원리로, 상부 커버필름(1100)에는 접착층이 있어 상부 커버필름(1100)의 하면에 적층되는 부품(버스바, 연성인쇄회로기판 등)을 접착 및 고정할 수 있게 된다. 본 발명에서는 상부 커버필름(1100)의 하면에 접착층이 형성되고, 작업자는 접착층을 보호하고 있는 보호필름을 벗겨낸 뒤 적층하게 된다.In addition, on the same principle as the lower cover film 400 , the upper cover film 1100 has an adhesive layer to adhere and fix parts (bus bars, flexible printed circuit boards, etc.) stacked on the lower surface of the upper cover film 1100 . be able to do In the present invention, an adhesive layer is formed on the lower surface of the upper cover film 1100, and the worker peels off the protective film protecting the adhesive layer and then laminates it.
도 11을 참조하도록 한다.Reference is made to FIG. 11 .
다음으로, 상부 커버필름(1100)의 상면에 상부 이형필름(1200)을 적층한다. 상부 이형필름(1200)은 상부 지그(1400)의 표면 형상에 대응되는 형상을 지니는 것이 바람직하다. 또한, 상부 지그(1400) 뿐만 아니라, 하부 지그(100)로부터 기 적층된 부분의 표면 형상에 대응되는 형상을 지니는 것이 바람직하다. 이로 인해, 커버필름의 충진성이 향상되는 장점이 있다.Next, the upper release film 1200 is laminated on the upper surface of the upper cover film 1100 . The upper release film 1200 preferably has a shape corresponding to the surface shape of the upper jig 1400 . In addition, it is preferable to have a shape corresponding to the surface shape of the portion pre-stacked from the lower jig 100 as well as the upper jig 1400 . For this reason, there is an advantage in that the fillability of the cover film is improved.
도 12를 참조하도록 한다.Reference is made to FIG. 12 .
다음으로, 상부 이형필름(1200)의 상면에 상부 러버(1300)를 적층한다. 상부 러버(1300)는 상부 지그(1400)의 표면 형상에 대응되는 형상을 지니는 것이 바람직하다. 또한, 상부 지그(1400) 뿐만 아니라, 하부 지그(100)로부터 기 적층된 부분의 표면 형상에 대응되는 형상을 지니는 것이 바람직하다. 이로 인해, 커버필름의 충진성이 향상되는 장점이 있다. 상부 러버(1300)는 하부 러버(200)와 동일한 재질인 것이 바람직하다.Next, the upper rubber 1300 is laminated on the upper surface of the upper release film 1200 . The upper rubber 1300 preferably has a shape corresponding to the surface shape of the upper jig 1400 . In addition, it is preferable to have a shape corresponding to the surface shape of the portion pre-stacked from the lower jig 100 as well as the upper jig 1400 . For this reason, there is an advantage in that the fillability of the cover film is improved. The upper rubber 1300 is preferably made of the same material as the lower rubber 200 .
좀 더 상세히 설명하자면, 하부 러버(200)는 시트(800)와 하부 버스바(700)의 수직 방향의 높이차로 인해 발생된 단차부 부근의 하부 커버필름(400)을 충진할 수 있고, 상부 러버(1300)는 시트(800)와 상부 버스바(900), 기판(1000), 버스바 플레이트(1001) 등의 수직 방향의 높이차로 인해 발생된 단차부 부근의 상부 커버 필름(1100)을 충진할 수 있게 된다. 이와 같이, 양면 모두 충진성이 향상될 수 있는 장점이 있다.In more detail, the lower rubber 200 may fill the lower cover film 400 near the step portion generated due to the height difference between the seat 800 and the lower bus bar 700 in the vertical direction, and the upper rubber 1300 fills the upper cover film 1100 near the step portion generated due to the height difference in the vertical direction of the sheet 800, the upper bus bar 900, the substrate 1000, the bus bar plate 1001, etc. be able to As such, there is an advantage that the filling properties can be improved on both surfaces.
도 13을 참조하도록 한다.Reference is made to FIG. 13 .
다음으로, 상부 지그(1400)를 상부 러버(1300)를 향하여 가압한다. 이때, 상부 지그(1400)의 표면은 적층되어 있는 버스바 조립체(A)의 상면의 형상에 상보적(相補的)으로 결합되도록 형성되는 것이 바람직하다. 전술한 하부 지그(100)와 같은 원리로, 단차가 형성된 부분에도 커버필름이 충진될 수 있는 장점이 있다.Next, the upper jig 1400 is pressed toward the upper rubber 1300 . In this case, the surface of the upper jig 1400 is preferably formed to be complementary to the shape of the upper surface of the bus bar assembly (A) stacked. In the same principle as the above-described lower jig 100, there is an advantage that the cover film can be filled even in the portion where the step is formed.
상부 지그(1400)는 일 예로 상부 지그 프레임(1410), 복수 개의 가이드 홈(1420)이 형성될 수 있다. 상부 지그 프레임(1410)은 도 13과 같이 하부 지그 프레임(110)과 합치될 수 있으며, 가이드 핀(130)은 가이드 홈(1420)을 일부 관통하여 버스바 조립체(A)의 고정성을 향상시킬 수 있다.The upper jig 1400 may include, for example, an upper jig frame 1410 and a plurality of guide grooves 1420 . The upper jig frame 1410 may coincide with the lower jig frame 110 as shown in FIG. 13 , and the guide pin 130 partially penetrates the guide groove 1420 to improve the fixability of the bus bar assembly A. can
도 16은 본 발명에 따른 제조 방법을 통해 제조된 배터리 센싱 모듈의 부품 부근을 확대한 실제 사진이다.16 is an enlarged actual photograph of the vicinity of the parts of the battery sensing module manufactured through the manufacturing method according to the present invention.
도 1과 비교하면, 종래와는 달리 단차 부근에 필름이 들떠 있지 않은 모습을 확인할 수 있다. 즉, 충진성이 향상된 것을 확인할 수 있다.Compared with FIG. 1 , it can be seen that the film is not floating in the vicinity of the step unlike in the prior art. That is, it can be confirmed that the filling properties are improved.
이상에서 본 발명의 바람직한 실시예에 대하여 상세하게 설명하였지만 본 발명의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명의 권리범위에 속하는 것이다.Although preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention as defined in the following claims are also provided. is within the scope of the
본 발명은 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법에 관한 발명으로, 보다 상세하게는 하부 지그 및 상부 지그의 표면의 형상이 버스바 조립체의 하면 및 상면의 형상에 상보적으로 결합되도록 형성되어, 단차 부분의 필름의 충진성을 향상시킬 수 있게 된다.The present invention relates to a method of manufacturing a busbar assembly for a battery module that can easily be filled with a high level difference, and more particularly, the shapes of the surfaces of the lower jig and the upper jig are complementary to the shapes of the lower and upper surfaces of the busbar assembly. Formed to be coupled, it is possible to improve the filling properties of the film of the stepped portion.

Claims (9)

  1. 하부 지그를 배치하는 단계;disposing a lower jig;
    상기 하부 지그의 상면에 버스바 조립체를 배치하는 단계:disposing a bus bar assembly on the upper surface of the lower jig:
    상부 지그를 상기 버스바 조립체를 향하여 가압하는 단계;를 포함하고,Including; pressing the upper jig toward the bus bar assembly;
    상기 하부 지그 및 상기 상부 지그의 표면의 형상은 각각 상기 버스바 조립체의 하면 및 상면의 형상에 상보적으로 결합되도록 형성되는 것을 특징으로 하는The shapes of the surfaces of the lower jig and the upper jig are formed to be complementary to the shapes of the lower surface and the upper surface of the bus bar assembly, respectively.
    고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법.A method of manufacturing a busbar assembly for a battery module that is easy to fill with a high level difference.
  2. 제1항에 있어서,According to claim 1,
    상기 버스바 조립체는,The bus bar assembly,
    커버필름, 버스바, 기판 및 시트를 포함하는 것을 특징으로 하는 고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법.A method of manufacturing a busbar assembly for a battery module that is easy to fill with a high level difference, comprising a cover film, a busbar, a substrate and a sheet.
  3. 제2항에 있어서,3. The method of claim 2,
    상기 커버필름은,The cover film is
    상기 시트의 하면 및 상면에 각각 결합되는 하부 커버필름 및 상부 커버필름을 포함하는 것을 특징으로 하는and a lower cover film and an upper cover film respectively coupled to the lower surface and upper surface of the sheet.
    고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법.A method of manufacturing a busbar assembly for a battery module that is easy to fill with a high level difference.
  4. 제3항에 있어서,4. The method of claim 3,
    상기 버스바는,The bus bar is
    상기 시트의 하면과 상기 하부 커버필름 사이에 배치되는 하부 버스바; 및a lower bus bar disposed between the lower surface of the sheet and the lower cover film; and
    상기 시트의 상면과 상기 상부 커버필름 사이에 배치되는 상부 버스바;를 포함하는 것을 특징으로 하는and an upper bus bar disposed between the upper surface of the sheet and the upper cover film.
    고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법.A method of manufacturing a busbar assembly for a battery module that is easy to fill with a high level difference.
  5. 제4항에 있어서,5. The method of claim 4,
    상기 기판은,The substrate is
    상기 시트의 상면과 상기 상부 커버필름 사이에 배치되어 상기 버스바와 전기적으로 연결되는 것을 특징으로 하는It is disposed between the upper surface of the sheet and the upper cover film, characterized in that it is electrically connected to the bus bar.
    고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법.A method of manufacturing a busbar assembly for a battery module that is easy to fill with a high level difference.
  6. 제2항에 있어서,3. The method of claim 2,
    상기 기판은,The substrate is
    연성인쇄회로기판(FPCB)인 것을 특징으로 하는characterized in that it is a flexible printed circuit board (FPCB)
    고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법.A method of manufacturing a busbar assembly for a battery module that is easy to fill with a high level difference.
  7. 제2항에 있어서,3. The method of claim 2,
    상기 시트는,The sheet is
    절연필름을 포함하는 것을 특징으로 하는characterized in that it comprises an insulating film
    고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법.A method of manufacturing a busbar assembly for a battery module that is easy to fill with a high level difference.
  8. 제1항에 있어서,According to claim 1,
    상기 버스바 조립체와 상기 상부 지그 또는 상기 하부 지그 사이에 러버를 적층하는 단계;를 더 포함하는Laminating a rubber between the bus bar assembly and the upper jig or the lower jig; further comprising
    고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법.A method of manufacturing a busbar assembly for a battery module that is easy to fill with a high level difference.
  9. 제1항에 있어서,The method of claim 1,
    상기 버스바 조립체와 상기 상부 지그 또는 상기 하부 지그 사이에 이형 필름을 적층하는 단계;를 더 포함하는 것인Laminating a release film between the bus bar assembly and the upper jig or the lower jig; further comprising
    고단차부 충진이 용이한 배터리 모듈용 버스바 조립체의 제조방법.A method of manufacturing a busbar assembly for a battery module that is easy to fill with a high level difference.
PCT/KR2021/009845 2020-08-26 2021-07-29 Method for manufacturing busbar assembly for battery module, through which high stepped portion is easily filled WO2022045602A1 (en)

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KR102542324B1 (en) * 2021-06-16 2023-06-13 한국단자공업 주식회사 Flexible circuit board manufacturing device and flexible circuit board manufacturing method using this

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