WO2022040864A1 - 一种具有可动镜面的可调法珀腔器件及其制造方法 - Google Patents

一种具有可动镜面的可调法珀腔器件及其制造方法 Download PDF

Info

Publication number
WO2022040864A1
WO2022040864A1 PCT/CN2020/110828 CN2020110828W WO2022040864A1 WO 2022040864 A1 WO2022040864 A1 WO 2022040864A1 CN 2020110828 W CN2020110828 W CN 2020110828W WO 2022040864 A1 WO2022040864 A1 WO 2022040864A1
Authority
WO
WIPO (PCT)
Prior art keywords
movable mirror
glass
mirror
substrate
silicon
Prior art date
Application number
PCT/CN2020/110828
Other languages
English (en)
French (fr)
Inventor
郭斌
黄锦标
Original Assignee
深圳市海谱纳米光学科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市海谱纳米光学科技有限公司 filed Critical 深圳市海谱纳米光学科技有限公司
Priority to CN202080102174.2A priority Critical patent/CN115698816A/zh
Priority to KR1020227043703A priority patent/KR20230007521A/ko
Priority to JP2022573622A priority patent/JP7409721B2/ja
Priority to EP20950539.5A priority patent/EP4155804A4/en
Priority to US18/042,576 priority patent/US20230324670A1/en
Priority to PCT/CN2020/110828 priority patent/WO2022040864A1/zh
Publication of WO2022040864A1 publication Critical patent/WO2022040864A1/zh

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032Packages or encapsulation
    • B81B7/0067Packages or encapsulation for controlling the passage of optical signals through the package
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • B81C1/00317Packaging optical devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02Details
    • G01J3/0291Housings; Spectrometer accessories; Spatial arrangement of elements, e.g. folded path arrangements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12Generating the spectrum; Monochromators
    • G01J3/26Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0858Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • G02B5/28Interference filters
    • G02B5/284Interference filters of etalon type comprising a resonant cavity other than a thin solid film, e.g. gas, air, solid plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/04Optical MEMS
    • B81B2201/045Optical switches

Definitions

  • the present invention relates to the field of semiconductor devices, and in particular, to a tunable Fa-Per cavity device with a movable mirror and a manufacturing method thereof.
  • Fa-Per cavity devices in the visible-near-infrared range usually use optical glass (such as synthetic quartz glass) as a substrate, form mirror chips through optical and semiconductor processing, and then combine the two mirror chips with an external piezoelectric actuator (piezo actuator). ) into a Faber cavity module, the resulting Faber cavity module has a large volume and a high driving voltage, which is not suitable for applications in devices with extremely limited space size, such as a handheld hyperspectral camera.
  • optical glass such as synthetic quartz glass
  • piezoelectric actuator piezoelectric actuator
  • the Fa-Per cavity devices formed by micromachining are mainly of bulk process type and surface process type.
  • the surface process type device forms a movable mirror surface by a suspended thin film;
  • the bulk process type device forms a movable mirror surface by a substrate with a cantilever beam structure.
  • Fa-Per cavity devices in the visible-near-infrared range usually use optical glass (such as synthetic quartz glass) as the substrate, first of all, usually the glass can only be etched with chemical solvents (such as hydrofluoric acid), but the etching speed is very slow (less than 1 micron/min), which makes the processing of the substrate very difficult, and the size of the lines that can be processed is limited by the thickness of the substrate (usually 400 microns to 700 microns) and cannot be finely processed; secondly, processing on the substrate The cantilever beam will increase the complexity of device design and processing and thus increase the cost; thirdly, the elastic structure (spring) and the mirror surface of the bulk process device are provided by the same substrate, which causes the mirror surface to be affected by the elastic structure and has its own stress and deformation; Finally, since the cantilever beam structure occupies a large chip area, the size of the mirror itself is also limited.
  • optical glass such as synthetic quartz glass
  • chemical solvents such as hydrofluoric acid
  • the present invention proposes a tunable Fa-Per cavity device with a movable mirror surface and a manufacturing method thereof, In order to try to solve the problems of controllability, stability and design flexibility of the movable mirror in the Fa-Per cavity device in the prior art.
  • the present invention proposes an adjustable Fa-Per cavity device with a movable mirror surface, the movable mirror surface is arranged opposite to another mirror surface, and the movable mirror surface and the other mirror surface are bonded to each other at the periphery to be
  • a Faber cavity is formed between the mirror surfaces
  • the movable mirror surface includes a silicon film inlaid with glass, and the middle area of the silicon film is inlaid with glass to form a light-transmitting area, and the light-transmitting area faces the cavity
  • the surface of the body is formed with a mirror material, and the transition region between the bonded peripheral region and the central region of the silicon thin film is inlaid with glass to form an elastic structure.
  • the silicon film inlaid with glass can have good mechanical strength and stable elastic coefficient, and is not affected by stress, so that the movable mirror has good controllability and stability.
  • the damascene combination of glass and silicon can increase the flexibility of device design. By adjusting the design of the damascene structure, the same device structure can be applied to devices of different sizes, and the conductivity of silicon materials can be adjusted by doping and other methods.
  • the movable mirror can also form an electrode structure for the electrodes of the outer leads of the tunable Fa-Per cavity device.
  • the silicon layer remaining between the transition region and the middle region of the silicon thin film forms an annular support structure.
  • the mechanical flatness of the movable mirror can be enhanced by virtue of the annular support structure formed by the silicon layer.
  • the annular support structure is partially removed to form vent through holes.
  • the ventilation through holes facilitate the rapid circulation of the air in the Faber cavity and the outside air, thereby increasing the transient response speed when the movable mirror of the Faber cavity moves.
  • the movable mirror is made of an SOI wafer, wherein the glass is filled into the SOI wafer by etching the silicon layer of the SOI wafer.
  • the diversification of the manufacturing forms of the movable mirror surface can be selected according to the actual needs.
  • the other mirror surface also includes a silicon film embedded with glass.
  • a silicon film embedded with glass Another variety of mirrors can be selected according to actual needs, which increases the flexibility of design.
  • the other mirror surface includes a fixed mirror surface
  • the fixed mirror surface includes a glass substrate and a mirror surface material disposed on the glass substrate.
  • Another variety of mirrors can be selected according to actual needs, which increases the flexibility of design.
  • another movable mirror surface is also bonded to the other surface of the fixed mirror surface away from the movable mirror surface, and the other movable mirror surface is connected to the other surface of the fixed mirror surface.
  • Another Faber cavity is formed on the surface.
  • Another variety of mirrors can be selected according to actual needs, which increases the flexibility of design.
  • the thickness of the glass-inlaid silicon thin film is between 10-200 microns.
  • the thickness of the thin film in the damascene form is much smaller than that of a conventional glass substrate (above 300 microns), making the device more compact.
  • the material of the optical mirror surface includes silicon, silicon oxide or a combination thereof, or silver.
  • the diversification of mirror materials can choose the appropriate material according to the actual needs.
  • the bonding manner includes eutectic bonding, polymer or anodic bonding.
  • the structures can be tightly combined to ensure the stability of the tunable optical filter element.
  • the movable mirror surface is provided with a driving device for controlling the relative displacement of the movable mirror surface.
  • the adjustable optical filtering function is realized by adjusting the interval between the cavities by causing the movable mirror surface to produce relative displacement with another mirror surface by the driving device.
  • the driving device includes a capacitive driving and an actuator driving with a piezoelectric thin film structure.
  • the relative displacement of the movable mirror is controlled by the actuator drive of the capacitive drive or the piezoelectric film structure, thereby realizing the effect of adjustable optical filtering.
  • the driving device includes a first electrode and a second electrode disposed on the periphery of the surface of the movable mirror opposite to the mirror, and in the damascene silicon layer region.
  • the driving device includes a piezoelectric film structure disposed on the periphery of the surface of the movable mirror opposite to the mirror.
  • the method of depositing the piezoelectric film on the movable mirror includes sputtering or sol-gel.
  • the piezoelectric thin film structure includes a lead zirconate titanate thin film, an aluminum nitride thin film or a zinc oxide thin film.
  • the material diversity of the piezoelectric film structure can be selected according to actual needs.
  • a method for manufacturing a tunable Fa-Per cavity device with a movable mirror characterized in that it comprises the following steps:
  • S1 Provide a substrate, and etch a pattern with a certain depth on the substrate;
  • S4 depositing an optical mirror material on the surface of the glass-inlaid substrate to form an optical mirror
  • S5 also includes the following steps:
  • the substrate provided in S1 is a silicon substrate or an SOI substrate.
  • the S1 includes the following steps:
  • S11 Provide an SOI substrate, and etch the silicon layer on the SOI substrate to form a pattern of a certain depth;
  • S12 Provide a glass substrate, and bond the glass substrate and the SOI substrate to each other.
  • the tunable Faroese cavity device of the present invention has a movable mirror surface formed by inlaying glass and silicon. Since the Young's hardness of silicon is much higher than that of glass, the movable mirror surface inlaid with glass and silicon can have good mechanical strength and stability. The elastic coefficient of the glass and silicon is not affected by stress, so that the movable mirror has good controllability and stability, and the damascene combination of glass and silicon can increase the flexibility of device design. By adjusting the design of the damascene structure, the same device structure It can be applied to devices of different sizes, and the addition of silicon material can adjust its conductivity, so the movable mirror can also form an electrode structure for the electrode of the outer lead of the adjustable Fa-Per cavity device.
  • FIG. 1 is a cross-sectional view of a tunable optical filter device according to one embodiment of the present invention
  • FIG. 2 is a top view of a tunable optical filter device according to an embodiment of the present invention.
  • FIG. 3 is a diagram illustrating the formation of a movable mirror according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a tunable optical filter device according to a second embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a tunable optical filter device according to a third embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a tunable optical filter device according to a fourth embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a tunable optical filter device according to a fifth embodiment of the present invention.
  • FIG. 1 is a cross-sectional view of a tunable optical filter device according to one embodiment of the present invention.
  • an adjustable Fa-Per cavity device with a movable mirror surface includes a movable mirror surface, and the movable mirror surface is a thin film formed by inlaying a glass 12 and a silicon layer 11.
  • the silicon film 10, the middle area of the silicon film 10 is inlaid with glass 12 to form a light-transmitting area, a mirror material is deposited on the silicon film 10 to form an optical mirror 30, the movable mirror is arranged opposite to another mirror, and the movable mirror is opposite to the other mirror.
  • a mirror surface is bonded to each other at the periphery by a bonding compound 60 to form a Faber cavity between the mirror surfaces, and the transition region between the bonded peripheral region and the central region of the silicon film is inlaid with glass to form an elastic structure.
  • the other mirror surface also includes a silicon film 10 inlaid with glass.
  • the movable mirror is a silicon film 10 inlaid with glass, the thickness of which is between 10-200 microns, which is lower than that of ordinary glass substrates (greater than 300 microns), which can make the device more miniaturized.
  • the silicon layer 11 remaining between the transition region and the middle region of the silicon thin film 10 forms an annular support structure.
  • the annular support structure can enhance the mechanical flatness of the movable mirror.
  • the shape of the annular support structure is not limited to a circle, but can also be other regular or irregular shapes such as ellipse, rectangle, etc., and a suitable etching method is selected to etch the desired shape according to the specific usage scenario.
  • the shape and position of the silicon layer 11 can be designed in different styles as required, and the bonding compound 60 can also be arranged in different positions as required.
  • a mirror surface material is deposited on the silicon film 10 to form the optical mirror surface 30.
  • the material of the optical mirror surface includes silicon, silicon oxide or a combination thereof, or silver.
  • the silicon material can The conductivity is adjusted by doping or the like, and the electrode 40 can be placed on the surface of the silicon layer 11 .
  • the silicon layer with good conductivity forms a driving conductive path through the silicon film 10 and the optical mirror surface 30 on the other side.
  • the electrode 40 of the same material as the optical mirror surface 30 can be formed by the same layer process in micromachining, so as to form a driving device for controlling the relative displacement of the movable mirror surface, such as capacitive driving.
  • the bonding method between the movable mirror surface and the other mirror surface may be eutectic bonding, polymer or anodic bonding.
  • Eutectic bonding is to use metal as a transition layer to realize the bonding between silicon and silicon. It has low requirements on the surface, low bonding temperature and high bonding strength; anodic bonding has low bonding temperature, which is incompatible with other processes. It has the advantages of good capacitance, high bonding strength and stability, and can be used for bonding between silicon/silicon substrates, non-silicon materials and silicon materials, and mutual bonding between glass, metal, semiconductor, and ceramics.
  • the bonding between the two glass films can be realized by selecting an appropriate bonding method according to the actual bonding surface process and material.
  • the damascene movable mirror can be fabricated through the following steps: S1: provide a silicon substrate, and etch a pattern with a certain depth on the silicon substrate; S2: melt the glass and fill it to etch S3: grinding the surface of the glass-filled silicon substrate to form a glass-inlaid silicon substrate; S4: depositing an optical mirror material on the surface of the glass-inlaid silicon substrate to form Optical mirror surface; S5: grinding or etching to remove the redundant silicon substrate to form a movable mirror surface of a silicon thin film structure inlaid with glass. Since the Young's modulus of silicon is much higher than that of glass, the silicon layer can be made into the entire silicon film and maintain its flatness. At the same time, since silicon is opaque in the visible-near-far-infrared range, its silicon layer 11 can also play a role in The effect of blocking or reflecting light.
  • another step of S5 can also be used, which can be specifically: S51: bond two glass-inlaid substrates with optical mirror surfaces to each other to form a Faber cavity between the mirror surfaces; S52 : Grinding or etching to remove excess substrate to form a Faber cavity with a thin film structure inlaid with glass.
  • the movable mirror surface is made of an SOI wafer 13, as shown in FIG. 3, the main difference between the manufacturing steps and the steps of the above-mentioned embodiment is S1, specifically: S11: providing the SOI substrate 13, and The silicon layer on the SOI substrate is etched to form a pattern with a certain depth; S12: Provide a glass substrate 14, and bond the glass substrate and the SOI substrate to each other.
  • S2 Melt the glass and fill it on the etched silicon substrate;
  • S3 Grind the surface of the glass-filled silicon substrate to form a glass-inlaid silicon substrate;
  • S4 Deposit an optical mirror material on the glass-inlaid silicon substrate on the surface of the silicon substrate to form an optical mirror surface;
  • S5 grinding or etching to remove the redundant silicon substrate to form a movable mirror surface of the silicon thin film structure inlaid with glass.
  • the movable mirror is provided with a driving device for controlling the relative displacement of the movable mirror, specifically, the outer periphery of the surface of the movable mirror opposite to the mirror, and on the first part of the inlaid silicon layer 11 region An electrode 40 and a second electrode 40 .
  • the movable mirror can be driven to displace to adjust the gap of the cavity.
  • FIG. 4 is a cross-sectional view of a tunable optical filter device according to a second embodiment of the present invention.
  • the main difference from the above-mentioned embodiment is that another mirror surface adopts a fixed mirror surface 21 , and the fixed mirror surface includes a glass substrate and a mirror surface material arranged on the glass substrate.
  • Another variety of mirrors can be selected according to actual needs, which increases the flexibility of design.
  • FIG. 5 is a cross-sectional view of a tunable optical filter device according to a third embodiment of the present invention.
  • the annular support structure in the silicon layer 11 is partially removed to form the vent hole 15 , and the removal of the silicon can be accomplished by dry or wet etching.
  • the ventilation through holes facilitate the rapid circulation of the air in the Faber cavity and the outside air, thereby increasing the transient response speed when the movable mirror of the Faber cavity moves.
  • a tunable Faroese cavity device with a movable mirror surface includes two movable mirror surfaces with a silicon film 10 embedded with glass and a fixed mirror surface 21 , and the fixed mirror surface 21 adopts a glass substrate and the upper and lower The uniform deposition optical mirror surface 30, the two movable mirror surfaces are respectively bonded with the fixed mirror surface 21 up and down to form two upper and lower Faber cavities.
  • the mirror materials of the two Faber cavities can be the same or different.
  • FIG. 7 is a cross-sectional view of a tunable optical filter device according to a fifth embodiment of the present invention.
  • an actuator using a piezoelectric thin film structure is used for driving.
  • the driving device includes a piezoelectric thin film structure 50 disposed on the periphery of the surface of the movable mirror surface opposite to the mirror surface.
  • the method of depositing the piezoelectric film on the movable mirror includes sputtering or sol-gel, and the structure of the piezoelectric film includes lead zirconate titanate film, aluminum nitride film or zinc oxide film, which can be selected according to practical applications.
  • the movable mirror surface of the present invention is formed by inlaying glass and silicon. Since the Young's hardness of silicon is much higher than that of glass, the movable mirror surface inlaid with glass and silicon can have good mechanical strength and stable elastic coefficient, and is not affected by stress. , the movable mirror has good controllability and stability, and the damascene combination of glass and silicon can increase the flexibility of device design. By adjusting the design of the damascene structure, the same device structure can be applied to devices of different sizes, and The addition of silicon material adjusts its conductivity, so the movable mirror can also form an electrode structure for the electrode of the outer lead of the adjustable Fa-Per cavity device.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)

Abstract

一种具有可动镜面的可调法珀腔器件,所述可动镜面与另一镜面相对设置,所述可动镜面与所述另一镜面在外围相互键合以在所述镜面之间形成法珀腔体,所述可动镜面包括镶嵌有玻璃(12)的硅薄膜(10),所述硅薄膜的中部区域被镶嵌有玻璃以形成透光区域,并且所述透光区域面对所述腔体的表面形成有镜面材料,所述硅薄膜的被键合的外围区域与所述中部区域之间的过渡区域被镶嵌有玻璃以形成弹性结构。由于硅的杨氏硬度远高于玻璃,镶嵌有玻璃的硅薄膜可以具有良好的机械强度和稳定的弹性系数,而且不受应力影响,使得可动镜面具有良好的可控性和稳定性,并且玻璃与硅的镶嵌结合可以增加器件设计的灵活性。

Description

一种具有可动镜面的可调法珀腔器件及其制造方法 技术领域
本发明涉及一种半导体器件领域,并且特别涉及一种具有可动镜面的可调法珀腔器件及其制造方法。
背景技术
基于Fabry-Perot(法珀腔)干涉的可调滤光器件(tuneable FPI)可以被用来制造微型光谱仪和小型甚至迷你高光谱相机。在可见光-近红外范围的法珀腔器件通常使用光学玻璃(例如合成石英玻璃)作为衬底,通过光学和半导体加工形成镜面芯片,然后将两个镜面芯片同外置压电执行器(piezo actuator)组装成法伯腔模组,由此形成的法珀腔模组体积大,驱动电压高,不适应应用在空间尺寸极为受限的器件,如手持式高光谱相机。
另一方面,微机械加工(micromachining)形成的法珀腔器件主要是体工艺型和表面工艺型。表面工艺型器件由悬空的薄膜形成可动的镜面;体工艺型器件由具有悬臂梁结构的衬底形成可动镜面。
由于在可见光-近红外范围的法珀腔器件通常使用光学玻璃(例如合成石英玻璃)作为衬底,首先,通常玻璃只能用化学溶剂(如氢氟酸)刻蚀,但刻蚀速度很慢(小于1微米/分钟),导致对衬底的加工非常困难,并且可加工的线条尺寸受到衬底厚度的限制(一般是400微米至700微米)无法做精细加工;其次,在衬底上加工悬臂梁会增加器件设计和加工的复杂度从而增加成本;再次,体工艺器件中弹性结构(spring)和镜面由同一个衬底提供,导致了镜面受到弹性结构的影响存在本身的应力和形变;最后,由于悬臂梁结构要占用很大的芯片面积,也限制了镜面本身的尺寸。
发明内容
为了解决现有技术中法珀腔器件中可动镜面的可控性、稳定性和设计灵活性的问题,本发明提出了一种具有可动镜面的可调法珀腔器件及其制造方法,以试图解决现有技术中法珀腔器件中可动镜面的可控性、稳定性和设计灵活性的问题。
本发明提出了一种具有可动镜面的可调法珀腔器件,所述可动镜面与另一镜面相对设置,所述可动镜面与所述另一镜面在外围相互键合以在所述镜面之间形成法珀腔体,所述可动镜面包括镶嵌有玻璃的硅薄膜,所述硅薄膜的中部区域被镶嵌有玻璃以形成透光区域,并且所述透光区域面对所述腔体的表面形成有镜面材料,所述硅薄膜的被键合的外围区域与所述中部区域之间的过渡区域被镶嵌有玻璃以形成弹性结构。由于硅的杨氏模量远高于玻璃,镶嵌有玻璃的硅薄膜可以具有良好的机械强度和稳定的弹性系数,而且不受应力影响,使得可动镜面具有良好的可控性和稳定性,并且玻璃与硅的镶嵌结合可以增加器件设计的灵活性,通过调节镶嵌结构的设计,同种器件结构可以适用于不同大小的器件,并且硅材料可以通过掺杂等方式调整其导电率,所以该可动镜面还可以形成电极结构用于可调法珀腔器件的对外引线的电极。
在一个优选的实施例中,在所述硅薄膜的所述过渡区域与所述中部区域之间存留的硅层形成环形支撑结构。凭借硅层形成的环形支撑结构,可以加强可动镜面的机械平整度。
在一个优选的实施例中,所述环形支撑结构被部分移除以形成通气通孔。凭借通气通孔有利于法珀腔内的空气与外部的空气快速流通,进而增加法珀腔可动镜面移动时的瞬时态响应速度。
在一个优选的实施例中,所述可动镜面利用SOI晶圆制成,其中所述玻璃是通过将所述SOI晶圆的硅层刻蚀后被填充到所述SOI晶圆中的。可动镜面的制成形式的多样化可根据实际的需求选择合适的制成。
在一个优选的实施例中,所述另一镜面同样包括镶嵌有玻璃的硅薄膜。另一镜面的多样化选择可根据实际需求选择合适的镜面,增加设计的灵活性。
在一个优选的实施例中,所述另一镜面包括固定镜面,所述固定镜面包括玻璃基板和设置在玻璃基板上的镜面材料。另一镜面的多样化选择可根据实际需求选择合适的镜面,增加设计的灵活性。
在一个优选的实施例中,在所述固定镜面背离所述可动镜面的另一表面同样键合有另一可动镜面,所述另一可动镜面与所述固定镜面的所述另一表面形成有另一法珀腔体。另一镜面的多样化选择可根据实际需求选择合适的镜面,增加设计的灵活性。
在一个优选的实施例中,所述镶嵌有玻璃的硅薄膜的厚度在10-200微米之间。镶嵌形式的薄膜的厚度比常规的玻璃衬底(300微米以上)小很多,使得器件更加小巧。
在一个优选的实施例中,所述光学镜面的材质包括硅、氧化硅或其组合或银。镜面材质的多样化可根据实际的需求选择合适的材质。
在一个优选的实施例中,所述键合的方式包括共晶键合、聚合物或阳极键合。凭借键合的方式可将结构紧密结合,保证可调光学滤波器件的稳定性。
在一个优选的实施例中,所述可动镜面上设置有用于控制所述可动镜面相对位移的驱动装置。通过驱动装置使得可动镜面与另一镜面产生相对位移来调节腔体之间的间隔从而实现可调的光学滤波功能。
在一个优选的实施例中,所述驱动装置包括电容驱动和压电薄膜结构的执行器驱动。凭借电容驱动或压电薄膜结构的执行器驱动控制可动镜面的相对位移,进而实现可调光学滤波的效果。
在一个优选的实施例中,所述驱动装置包括设置于所述可动镜面与镜面相背的表面的外围,并且在镶嵌的硅层区域的第一电极和第二电极。凭借第一电极和第二电极之间形成的电容结构,可以驱动可动镜面位移以调节腔体的间隙。
在一个优选的实施例中,所述驱动装置包括设置于所述可动镜面与镜面相背的表面的外围的压电薄膜结构。凭借设置于可动镜面上的压电薄膜结构,可以使可动镜面产生形变,进而使可动镜面产生位移。
在一个优选的实施例中,所述压电薄膜沉积于所述可动镜面上的方式包括溅射或溶胶凝胶。
在一个优选的实施例中,所述压电薄膜结构包括锆钛酸铅薄膜、氮化铝薄膜或氧化锌薄膜。压电薄膜结构的材质多样性可根据实际的需求选择合适的材质。
一种具有可动镜面的可调法珀腔器件的制造方法,其特征在于,包括以下步骤:
S1:提供衬底,并在衬底上刻蚀出具有一定深度的图形;
S2:融化玻璃并填充到刻蚀后的衬底上;
S3:研磨填入玻璃后的衬底的表面以形成镶嵌有玻璃的衬底;
S4:将光学镜面材料沉积在镶嵌有玻璃的衬底的表面上以形成光学镜面;
S5:研磨或者刻蚀移除多余的衬底,以形成镶嵌有玻璃的薄膜结构的可动镜面或法珀腔。
在一个优选的实施例中,S5还包括以下步骤:
S51:将两片具有光学镜面的镶嵌有玻璃的衬底相互键合以在镜面之间形成法珀腔体;
S52:研磨或者刻蚀去除多余的衬底,以形成镶嵌有玻璃的薄膜结构的法珀腔。
在一个优选的实施例中,所述S1中提供的衬底采用硅衬底或者SOI衬底。
在一个优选的实施例中,所述S1包括以下步骤:
S11:提供SOI衬底,并刻蚀SOI衬底上的硅层以形成一定深度的图形;
S12:提供玻璃衬底,将玻璃衬底与SOI衬底相互键合。
本发明的可调法珀腔器件,具有通过玻璃和硅镶嵌形成的可动镜面,由于硅的杨氏硬度远高于玻璃,镶嵌有玻璃和硅的可动镜面可以具有良好的机械强度和稳定的弹性系数,而且不受应力影响,使得可动镜面具有良好的可控性和稳定性,并且玻璃与硅的镶嵌结合可以增加器件设计的灵活性,通过调节镶嵌结构的设计,同种器件结构可以适用于不同大小的器件,并且硅材料的加入调整其导电率,所以该可动镜面还可以形成电极结构用于可调法珀腔器件的对外引线的电极。
附图说明
包括附图以提供对实施例的进一步理解并且附图被并入本说明书中并且构成本说明书的一部分。附图图示了实施例并且与描述一起用于解释本发明的原理。将容易认识到其它实施例和实施例的很多预期优点,因为通过引用以下详细描述,它们变得被更好地理解。附图的元件不一定是相互按照比例的。同样的附图标记指代对应的类似部件。
图1是根据本发明的一个实施例的可调光学滤波器件的截面图;
图2是根据本发明的一个实施例的可调光学滤波器件的俯视图;
图3是根据本发明的一个实施例中的一种可动镜面的形成方式图示;
图4是根据本发明的第二个实施例的可调光学滤波器件的截面图;
图5是根据本发明的第三个实施例的可调光学滤波器件的截面图;
图6是根据本发明的第四个实施例的可调光学滤波器件的截面图;
图7是根据本发明的第五个实施例的可调光学滤波器件的截面图。
具体实施方式
在以下详细描述中,参考附图,该附图形成详细描述的一部分,并且通过其中可实践本发明的说明性具体实施例来示出。对此,参考描述的图的取向来使用方向术语,例如“顶”、“底”、“左”、“右”、“上”、“下”等。因为实施例的部件可被定位于若干不同取向中,为了图示的目的使用方向术语并且方向术语绝非限制。应当理解的是,可以利用其他实施例或可以做出逻辑改变,而不背离本发明的范围。因此以下详细描述不应当在限 制的意义上被采用,并且本发明的范围由所附权利要求来限定。
图1是本发明的一个实施例的可调光学滤波器件的截面图。如图1所示,一种具有可动镜面的可调法珀腔器件,包括可动镜面,可动镜面为一玻璃12和硅层11镶嵌形成的薄膜,具体可以为一包括镶嵌有玻璃的硅薄膜10,硅薄膜10的中部区域被镶嵌有玻璃12以形成透光区域,硅薄膜10上沉积有镜面材料以形成光学镜面30,可动镜面与另一镜面相对设置,可动镜面与另一镜面在外围通过键合物60相互键合以在镜面之间形成法珀腔体,硅薄膜的被键合的外围区域与中部区域之间的过渡区域被镶嵌有玻璃以形成弹性结构,在本实施例中,另一镜面为同样包括镶嵌有玻璃的硅薄膜10。
在具体实施例中,可动镜面为一镶嵌有玻璃的硅薄膜10,其厚度在10-200微米之间,低于普通玻璃衬底(大于300微米)的厚度,可以使器件更加小型化。硅薄膜10的过渡区域与中部区域之间存留的硅层11形成环形支撑结构,可参考图2,环形支撑结构可以加强可动镜面的机械平整度。应当认识到,环形支撑结构的形状不限于圆形,也可以是椭圆、矩形等其他规则或不规则形状,视具体的使用场景选择合适的刻蚀方式刻蚀所需的形状。同时硅层11的形状和位置可以根据需要设计不同的式样,键合物60也可以根据需要布置在不同位置。
在具体实施例中,硅薄膜10上沉积有镜面材料以形成光学镜面30,光学镜面的材质包括硅、氧化硅或其组合或银,当光学镜面30使用银等导电材料时,由于硅材料可以通过掺杂等方式调整其导电率,电极40可放在硅层11的表面上,具有良好导电性的硅层通过硅薄膜10与另一面的光学镜面30形成驱动导电通路。再者,可以通过微加工中由同一层工艺形成与光学镜面30同一材料的电极40,以形成控制可动镜面相对位移的驱动装置,如电容驱动。
在具体实施例中,可动镜面与另一镜面键合方式具体可以为共晶键合、聚合物或阳极键合的方式。共晶键合是采用金属作为过渡层从而实现硅-硅之间的键合,对表面要求不高,键合温度低、键合强度高;阳极键合具有键合温度低,与其他工艺相容性好,键合强度及稳定性高等优点,可用于硅/硅基片之间的键合、非硅材料与硅材料、以及玻璃、金属、半导体、陶瓷之间的互相键合。可针对实际的键合的表面工艺以及材料选择合适的键合方式实现两玻璃薄膜之间的键合。
在具体实施例中,镶嵌式的可动镜面可通过如下步骤制成:S1:提供硅衬底,并在硅 衬底上刻蚀出具有一定深度的图形;S2:融化玻璃并填充到刻蚀后的硅衬底上;S3:研磨填入玻璃后的硅衬底的表面以形成镶嵌有玻璃的硅衬底;S4:将光学镜面材料沉积在镶嵌有玻璃的硅衬底的表面上以形成光学镜面;S5:研磨或者刻蚀移除多余的硅衬底,以形成镶嵌有玻璃的硅薄膜结构的可动镜面。由于硅的杨氏模量远高于玻璃,所以硅层可以制成整个硅薄膜并且保持其平整度,同时由于硅在可见光-近远红外范围内不透光,其硅层11还可以起到遮挡或反射光线的作用。
在具体实施例中,还可以采用另一种S5的步骤,具体可以是:S51:将两片具有光学镜面的镶嵌有玻璃的衬底相互键合以在镜面之间形成法珀腔体;S52:研磨或者刻蚀去除多余的衬底,以形成镶嵌有玻璃的薄膜结构的法珀腔。
在具体实施例中,可动镜面利用SOI晶圆13制成,如图3所示,其制成步骤与上述实施例的步骤主要区别在S1,具体为:S11:提供SOI衬底13,并刻蚀SOI衬底上的硅层以形成一定深度的图形;S12:提供玻璃衬底14,将玻璃衬底与SOI衬底相互键合。S2:融化玻璃并填充到刻蚀后的硅衬底上;S3:研磨填入玻璃后的硅衬底的表面以形成镶嵌有玻璃的硅衬底;S4:将光学镜面材料沉积在镶嵌有玻璃的硅衬底的表面上以形成光学镜面;S5:研磨或者刻蚀移除多余的硅衬底,以形成镶嵌有玻璃的硅薄膜结构的可动镜面。
在具体实施例中,可动镜面上设置有用于控制所述可动镜面相对位移的驱动装置,具体为,可动镜面与镜面相背的表面的外围,并且在镶嵌的硅层11区域的第一电极40和第二电极40。凭借第一电极和第二电极之间形成的电容结构,可以驱动可动镜面位移以调节腔体的间隙。
图4根据本发明的第二个实施例的可调光学滤波器件的截面图。如图4所示,与上述实施例主要的区别在于,另一镜面采用固定镜面21,固定镜面包括玻璃基板和设置在玻璃基板上的镜面材料。另一镜面的多样化选择可根据实际需求选择合适的镜面,增加设计的灵活性。
图5根据本发明的第三个实施例的可调光学滤波器件的截面图。如图5所示,在上述实施例的基础上,将硅层11中的环形支撑结构部分移除以形成通气通孔15,硅的移除可以由干法或者湿法刻蚀完成。凭借通气通孔有利于法珀腔内的空气与外部的空气快速流通,进而增加法珀腔可动镜面移动时的瞬时态响应速度。
图6根据本发明的第四个实施例的可调光学滤波器件的截面图。如图6所示,一种具有可动镜面的可调法珀腔器件,包括两个具有镶嵌有玻璃的硅薄膜10的可动镜面和一固定镜面21,固定镜面21采用玻璃衬底且上下均沉积光学镜面30,两个可动镜面分别与固定镜面21上下相键合以形成上下两个法珀腔体,两个法珀腔体的镜面材料可以相同也可以不同,通过调整两个法珀腔体的透光特性,可以实现单一法珀腔无法实现的滤光功能。
图7所示本发明的第五个实施例的可调光学滤波器件的截面图。如图7所示,驱动采用压电薄膜结构的执行器驱动,具体的,驱动装置包括设置于可动镜面与镜面相背的表面的外围的压电薄膜结构50。压电薄膜沉积于所述可动镜面上的方式包括溅射或溶胶凝胶,压电薄膜结构包括锆钛酸铅薄膜、氮化铝薄膜或氧化锌薄膜,可根据实际应用去做选择。
本发明通过玻璃和硅镶嵌形成的可动镜面,由于硅的杨氏硬度远高于玻璃,镶嵌有玻璃和硅的可动镜面可以具有良好的机械强度和稳定的弹性系数,而且不受应力影响,使得可动镜面具有良好的可控性和稳定性,并且玻璃与硅的镶嵌结合可以增加器件设计的灵活性,通过调节镶嵌结构的设计,同种器件结构可以适用于不同大小的器件,并且硅材料的加入调整其导电率,所以该可动镜面还可以形成电极结构用于可调法珀腔器件的对外引线的电极。
显然,本领域技术人员在不偏离本发明的精神和范围的情况下可以作出对本发明的实施例的各种修改和改变。以该方式,如果这些修改和改变处于本发明的权利要求及其等同形式的范围内,则本发明还旨在涵盖这些修改和改变。词语“包括”不排除未在权利要求中列出的其它元件或步骤的存在。某些措施记载在相互不同的从属权利要求中的简单事实不表明这些措施的组合不能被用于获利。权利要求中的任何附图标记不应当被认为限制范围。

Claims (20)

  1. 一种具有可动镜面的可调法珀腔器件,其特征在于,所述可动镜面与另一镜面相对设置,所述可动镜面与所述另一镜面在外围相互键合以在所述镜面之间形成法珀腔体,其特征在于,所述可动镜面包括镶嵌有玻璃的硅薄膜,所述硅薄膜的中部区域被镶嵌有玻璃以形成透光区域,并且所述透光区域面对所述腔体的表面形成有镜面材料,所述硅薄膜的被键合的外围区域与所述中部区域之间的过渡区域被镶嵌有玻璃以形成弹性结构。
  2. 根据权利要求1所述的一种具有可动镜面的可调法珀腔器件,其特征在于,在所述硅薄膜的所述过渡区域与所述中部区域之间存留的硅层形成环形支撑结构。
  3. 根据权利要求2所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述环形支撑结构被部分移除以形成通气通孔。
  4. 根据权利要求1所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述可动镜面利用SOI晶圆制成,其中所述玻璃是通过将所述SOI晶圆的硅层刻蚀后被填充到所述SOI晶圆中的。
  5. 根据权利要求1所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述另一镜面同样包括镶嵌有玻璃的硅薄膜。
  6. 根据权利要求1所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述另一镜面包括固定镜面,所述固定镜面包括玻璃基板和设置在玻璃基板上的镜面材料。
  7. 根据权利要求6所述的一种具有可动镜面的可调法珀腔器件,其特征在于,在所述固定镜面背离所述可动镜面的另一表面同样键合有另一可动镜面,所述另一可动镜面与所述固定镜面的所述另一表面形成有另一法珀腔体。
  8. 根据权利要求1所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述镶嵌有玻璃的硅薄膜的厚度在10-200微米之间。
  9. 根据权利要求1所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述光学镜面的材质包括硅、氧化硅或其组合或银。
  10. 根据权利要求1所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述键合的方式包括共晶键合、聚合物或阳极键合。
  11. 根据权利要求1所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述可动镜面上设置有用于控制所述可动镜面相对位移的驱动装置。
  12. 根据权利要求11所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述驱动装置包括电容驱动和压电薄膜结构的执行器驱动。
  13. 根据权利要求11所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述驱动装置包括设置于所述可动镜面与镜面相背的表面的外围,并且在镶嵌的硅层区域的第一电极和第二电极。
  14. 根据权利要求11所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述驱动装置包括设置于所述可动镜面与镜面相背的表面的外围的压电薄膜结构。
  15. 根据权利要求14所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述压电薄膜沉积于所述可动镜面上的方式包括溅射或溶胶凝胶。
  16. 根据权利要求11所述的一种具有可动镜面的可调法珀腔器件,其特征在于,所述压电薄膜结构包括锆钛酸铅薄膜、氮化铝薄膜或氧化锌薄膜。
  17. 一种具有可动镜面的可调法珀腔器件的制造方法,其特征在于,包括以下步骤:
    S1:提供衬底,并在衬底上刻蚀出具有一定深度的图形;
    S2:融化玻璃并填充到刻蚀后的衬底上;
    S3:研磨填入玻璃后的衬底的表面以形成镶嵌有玻璃的衬底;
    S4:将光学镜面材料沉积在镶嵌有玻璃的衬底的表面上以形成光学镜面;
    S5:研磨或者刻蚀移除多余的衬底,以形成镶嵌有玻璃的薄膜结构的可动镜面或法珀腔。
  18. 根据权利要求17所述的一种具有可动镜面的可调法珀腔器件的制造方法,其特征在于,S5还包括以下步骤:
    S51:将两片具有光学镜面的镶嵌有玻璃的衬底相互键合以在镜面之间形成法珀腔体;
    S52:研磨或者刻蚀去除多余的衬底,以形成镶嵌有玻璃的薄膜结构的法珀腔。
  19. 根据权利要求17所述的一种具有可动镜面的可调法珀腔器件的制造方法,其特征在于,所述S1中提供的衬底采用硅衬底或者SOI衬底。
  20. 根据权利要求17所述的一种具有可动镜面的可调法珀腔器件的制造方法,其特征在于,所述S1包括以下步骤:
    S11:提供SOI衬底,并刻蚀SOI衬底上的硅层以形成一定深度的图形;
    S12:提供玻璃衬底,将玻璃衬底与SOI衬底相互键合。
PCT/CN2020/110828 2020-08-24 2020-08-24 一种具有可动镜面的可调法珀腔器件及其制造方法 WO2022040864A1 (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN202080102174.2A CN115698816A (zh) 2020-08-24 2020-08-24 一种具有可动镜面的可调法珀腔器件及其制造方法
KR1020227043703A KR20230007521A (ko) 2020-08-24 2020-08-24 가동 경면을 갖는 조정 가능한 파브리 페로 캐비티 소자 및 이의 제조 방법
JP2022573622A JP7409721B2 (ja) 2020-08-24 2020-08-24 可動ミラーを有する調整可能なファブリーペローキャビティデバイス及びその製造方法
EP20950539.5A EP4155804A4 (en) 2020-08-24 2020-08-24 TUNABLE FABRY-PEROT CAVITY DEVICE HAVING A MOVING MIRROR SURFACE AND METHOD FOR MANUFACTURING SAME
US18/042,576 US20230324670A1 (en) 2020-08-24 2020-08-24 Tunable fabry-perot cavity device having movable mirror and manufacturing method therefor
PCT/CN2020/110828 WO2022040864A1 (zh) 2020-08-24 2020-08-24 一种具有可动镜面的可调法珀腔器件及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/110828 WO2022040864A1 (zh) 2020-08-24 2020-08-24 一种具有可动镜面的可调法珀腔器件及其制造方法

Publications (1)

Publication Number Publication Date
WO2022040864A1 true WO2022040864A1 (zh) 2022-03-03

Family

ID=80354285

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/110828 WO2022040864A1 (zh) 2020-08-24 2020-08-24 一种具有可动镜面的可调法珀腔器件及其制造方法

Country Status (6)

Country Link
US (1) US20230324670A1 (zh)
EP (1) EP4155804A4 (zh)
JP (1) JP7409721B2 (zh)
KR (1) KR20230007521A (zh)
CN (1) CN115698816A (zh)
WO (1) WO2022040864A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1719302A (zh) * 2004-07-09 2006-01-11 精工爱普生株式会社 可调波长滤波器及其制造方法、以及检测装置
CN1996088A (zh) * 2006-01-05 2007-07-11 精工爱普生株式会社 光学设备、光扫描仪以及图像形成装置
JP2012108371A (ja) * 2010-11-18 2012-06-07 Denso Corp ファブリペロー干渉計及びその製造方法
CN105242395A (zh) * 2015-08-31 2016-01-13 西北工业大学 电磁驱动微机械可调谐珐珀滤波器及其制作方法
JP2016065937A (ja) * 2014-09-24 2016-04-28 パイオニア株式会社 波長可変光フィルタ及び波長可変光フィルタの製造方法
CN105549199A (zh) * 2016-01-30 2016-05-04 西北工业大学 电磁驱动微机械双向调谐珐珀滤波器及其制作方法
CN105992964A (zh) * 2014-02-13 2016-10-05 浜松光子学株式会社 法布里-珀罗干涉滤光器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3801099B2 (ja) * 2002-06-04 2006-07-26 株式会社デンソー チューナブルフィルタ、その製造方法、及びそれを使用した光スイッチング装置
US7187453B2 (en) 2004-04-23 2007-03-06 Opsens Inc. Optical MEMS cavity having a wide scanning range for measuring a sensing interferometer
NO336140B1 (no) * 2009-09-18 2015-05-26 Sintef Aktuator for mikro optisk enhet
JP2011169943A (ja) * 2010-02-16 2011-09-01 Seiko Epson Corp 波長可変干渉フィルター、光センサーおよび分析機器
JP2016097454A (ja) 2014-11-19 2016-05-30 セイコーエプソン株式会社 Mems構造体の製造方法
US20220026274A1 (en) * 2018-11-26 2022-01-27 Unispectral Ltd. A tunable filter having different gaps

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1719302A (zh) * 2004-07-09 2006-01-11 精工爱普生株式会社 可调波长滤波器及其制造方法、以及检测装置
CN1996088A (zh) * 2006-01-05 2007-07-11 精工爱普生株式会社 光学设备、光扫描仪以及图像形成装置
JP2012108371A (ja) * 2010-11-18 2012-06-07 Denso Corp ファブリペロー干渉計及びその製造方法
CN105992964A (zh) * 2014-02-13 2016-10-05 浜松光子学株式会社 法布里-珀罗干涉滤光器
JP2016065937A (ja) * 2014-09-24 2016-04-28 パイオニア株式会社 波長可変光フィルタ及び波長可変光フィルタの製造方法
CN105242395A (zh) * 2015-08-31 2016-01-13 西北工业大学 电磁驱动微机械可调谐珐珀滤波器及其制作方法
CN105549199A (zh) * 2016-01-30 2016-05-04 西北工业大学 电磁驱动微机械双向调谐珐珀滤波器及其制作方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4155804A4 *

Also Published As

Publication number Publication date
EP4155804A1 (en) 2023-03-29
JP7409721B2 (ja) 2024-01-09
JP2023532411A (ja) 2023-07-28
EP4155804A4 (en) 2024-02-14
KR20230007521A (ko) 2023-01-12
US20230324670A1 (en) 2023-10-12
CN115698816A (zh) 2023-02-03

Similar Documents

Publication Publication Date Title
EP2074445B1 (en) Method for manufacturing adjustable lens
TWI224878B (en) Piezoelectric actuator for tunable electronic components
US7655995B2 (en) Semiconductor device using MEMS technology
TWI424546B (zh) 半導體裝置及其製造方法
CN110065924B (zh) 微机电系统装置及其制造方法
US9561954B2 (en) Method of fabricating MEMS devices having a plurality of cavities
CN111204703B (zh) 微机电系统装置的制造方法
CN111983801A (zh) 用于补偿不期望的运动的压电mems致动器及其制造工艺
CN109292729B (zh) 一种全硅环境隔离mems器件的制备方法
WO2022040864A1 (zh) 一种具有可动镜面的可调法珀腔器件及其制造方法
CN110636421A (zh) 一种mems结构及其制造方法
US7705412B2 (en) SOI substrate and semiconductor acceleration sensor using the same
US20020126455A1 (en) Tiled microelectromechanical device modules and fabrication methods
US10454017B2 (en) Semiconductor pressure sensor
CN111924797B (zh) 一种具有可动镜面的法珀腔器件及其制作工艺
CN114868068B (zh) 一种可调光学滤波装置
CN107764459B (zh) 压力传感器以及其制造方法
CN114981701B (zh) 一种可调光学滤波器件
KR100501723B1 (ko) Sms 웨이퍼를 이용한 자이로스코프 제조방법 및 이방법에 의해 제조된 자이로스코프
TWI542019B (zh) 壓力感測器以及其製造方法
TWI699330B (zh) 微機電系統裝置及其製造方法
CN116216629A (zh) 一种器件芯片中凹槽及间隙的加工方法
JP2007104466A (ja) 音響センサおよびその製造方法
Dae-Sung et al. PZT Actuated Seesaw SPDT RF MEMS Switch

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20950539

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022573622

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20227043703

Country of ref document: KR

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2020950539

Country of ref document: EP

Effective date: 20221219

NENP Non-entry into the national phase

Ref country code: DE