WO2022039338A1 - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus Download PDF

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Publication number
WO2022039338A1
WO2022039338A1 PCT/KR2021/000861 KR2021000861W WO2022039338A1 WO 2022039338 A1 WO2022039338 A1 WO 2022039338A1 KR 2021000861 W KR2021000861 W KR 2021000861W WO 2022039338 A1 WO2022039338 A1 WO 2022039338A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat
housing
pcb substrate
heat sink
Prior art date
Application number
PCT/KR2021/000861
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French (fr)
Korean (ko)
Inventor
공대원
Original Assignee
주식회사 피티지
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Publication of WO2022039338A1 publication Critical patent/WO2022039338A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a heat dissipation device for effectively dissipating heat by being applied to indoor and outdoor lighting equipment or automobile headlights.
  • the structure of a typical heat sink is divided into a body part that is in contact with a heat dissipation part or a multi-chip, and a heat dissipation piece or a heat dissipation fin that generates heat. take the form of release.
  • a heat dissipation piece or a heat dissipation fin that generates heat. take the form of release.
  • the larger the area of the heat dissipation body the better the heat dissipation is.
  • Materials with excellent thermal conductivity such as aluminum or copper, are mainly used for the material used for the heat dissipation device.
  • aluminum is cheaper than copper, so most heat dissipation devices use aluminum material.
  • the conventional heat sink is mostly formed only in a specific shape, such as a simple square plate or a circular plate, and it is not easy to process, so there is a limit in satisfying the various types and designs of users.
  • Korean Patent Laid-Open Publication No. 10-2019-0011980 discloses a heat dissipation body for dissipating heat generated from a heating object, and a plurality of heat dissipation fins formed on the surface of the heat dissipation body, but the heat dissipation body is boron
  • a heat dissipation device using cilia is disclosed, which is formed of silica gel mixed with nitride, and the heat dissipation fin is formed by pressing one end of the cilia made of graphene, boron nitride, and any one of these compounds into the surface of the heat dissipating body.
  • the present invention was devised to solve the above problems, and by manufacturing the heat dissipation cover coupled to the heat sink with engineering plastic, as well as fitting the heat dissipation cover to the housing to which the PCB board is coupled, the heat dissipation cover generated from the PCB board
  • An object of the present invention is to provide a heat dissipation device to effectively dissipate heat to the outside through the heat dissipation cover.
  • the present invention makes it possible to easily produce a heat dissipation cover made of a material different from the housing by configuring the heat dissipation cover to be fitted on the outer circumferential surface of the housing, and to be easily fitted on the outer surface of the housing as it is made of engineering plastic with good elasticity. It is, of course, to provide a heat dissipation device that can be configured to be integrated without being easily separated after fitting.
  • the heat dissipation device of the present invention for solving the above problems is a heat sink 20 coupled to the PCB substrate 10 for dissipation of heat generated in the PCB substrate 10 provided with the lighting unit 15;
  • a heat dissipation cover 30 coupled to the outside of the heat sink 20 and provided to surround the heat sink, a plurality of cilia 31 protruding at set intervals on the outer surface are integrally formed, and molded of engineering plastic; is made of
  • the lighting unit 15 is composed of an LED chip or an LED module provided on one side or both sides of the PCB substrate 10, and the heat sink 20, the other side of the PCB substrate 10 is accommodated inside
  • the housing 21 having a cylindrical body 21 having one side open to be coupled and having a receiving space 21a therein is coupled by coupling means 40 so as to cover and close the opening on one side of the housing 21, and in the central part It consists of a cover plate 25 provided with a support piece 26 fixed to the fixing means 45 in a state in which both surfaces of the PCB substrate 10 are in surface contact.
  • fitting portions 11 are formed to protrude to a predetermined length, and the fitting portions 11 are fitted on the inner circumferential surface of the housing 21 to fix the PCB substrate 10 to each other.
  • the fitting groove 22 is formed to face each other.
  • the coupling means 40 is composed of a bolt, and a bolt fixing groove 24 is formed on the innermost side of the fitting groove 22 of the housing 21 , and the cover corresponding to the bolt fixing groove 24 . It is preferable that bolt fixing parts 27 are formed on both sides of the plate 25 so that the bolt penetrates and enters the bolt fixing groove 24 to fix the cover plate 25 to the housing 21 .
  • projection inlet grooves 23 are formed at set intervals, and on the inner peripheral surface of the heat dissipation cover 30, the heat dissipation cover 30 is drawn into the protrusion inlet groove 23 as a heat sink.
  • Fitting projections 32 are formed so as to fit the outer peripheral surface of (20).
  • the internal receiving space 21a of the housing 21 may be filled with a heat transfer material 50 serving as a medium to transfer the heat generated from the PCB substrate 10 to the inner peripheral surface of the housing 21 .
  • the heat dissipation device having the above configuration, there is an effect of effectively dissipating heat by conducting the heat generated from the PCB substrate to the heat dissipation cover molded of engineering plastic having a high heat emissivity.
  • the heat dissipation cover is made of engineering plastic, it has good elasticity and can be easily fitted into the housing, as well as the possibility of separation after coupling is low, and has the effect of flexibly coping with external shocks.
  • FIG. 1 is a perspective view of a heat dissipation device according to an embodiment of the present invention
  • Figure 2 is an exploded view of Figure 1;
  • FIG. 3 is an exploded view of a PCB substrate and a cover plate according to the present invention.
  • FIG. 4 is a cross-sectional view taken along line A-A of FIG. 1 ;
  • FIG. 5 is a cross-sectional state view showing a coupling structure of a housing and a heat dissipation cover according to an embodiment of the present invention
  • FIG. 6 is a cross-sectional view of a state in which a heat transfer material is filled in an inner accommodation space of a housing according to an embodiment of the present invention
  • the heat dissipation device is a heat sink 20 coupled to a PCB substrate 10 provided with a large lighting unit 15, the heat sink 20 It is provided to surround the heat dissipation cover 30 for dissipating heat.
  • the PCB substrate 10 is a rectangular or polygonal plate body made of a material with thermal conductivity, and a lighting unit 15 is provided to illuminate by irradiating light on one side, and the heat sink 20 is provided on the other side. Combined, the heat generated from the PCB board is transferred to the heat sink, and then the heat is dissipated.
  • the lighting unit 15 may be composed of an LED chip or an LED module provided on one side or both sides of the PCB substrate 10 .
  • the lighting unit 15 is composed of an LED chip
  • the LED chip will be mounted on the PCB substrate itself. or may be fixed in a number of other ways.
  • LEDs are provided on both sides of one side of the PCB substrate 10, and a control circuit unit is provided on the other side of the PCB substrate coupled to the heat sink.
  • a control circuit unit is provided on the other side of the PCB substrate coupled to the heat sink.
  • it has a structure for effectively dissipating heat generated by the control circuit unit.
  • the heat sink 20 may be made of a metal material having good thermal conductivity, such as aluminum or copper, and it is preferable to make the heat sink 20 from an aluminum material because aluminum is light in weight and easy to process.
  • the heat sink 20 is a known heat sink combined with a PCB substrate, and the shape or structure is not particularly limited, and any heat sink capable of dissipating heat by receiving heat from the PCB substrate is possible.
  • the combination of the PCB substrate 10 and the heat sink 20 suffices as long as a structure capable of transferring the heat of the PCB substrate to the heat sink is sufficient, and the bonding structure is not particularly limited.
  • one side of the PCB substrate 10 is accommodated and coupled to the inside, and one side is opened and a housing 21 having a housing space 21a formed therein is formed in a cylindrical body 21, It may be composed of a cover plate 25 coupled to the coupling means 40 so as to cover and close the opening on one side of the housing 21 .
  • the fitting portion 11 is formed to protrude to a predetermined length on both sides of the other side of the PCB substrate 10, and the fitting portion 11 is formed on the inner circumferential surface of the housing 21 constituting the heat sink.
  • the fitting groove 22 may be formed to face each other so that the part 11 is inserted to fix the PCB substrate 10 .
  • the fitting part 11 is inserting into the fitting groove 22 in a state where the other side of the PCB board 10 is accommodated in the receiving space 21a of the housing 21, the PCB board is attached to the housing 21. that can be combined.
  • the housing 21 may be formed of a cylindrical body having a polygonal shape of a circle or a triangular or more with an open side, and may be manufactured as a whole by casting, or by combining each other after forming half of the housing 21 .
  • the housing 21 is formed as a cylindrical body with an accommodating space formed therein, the air is introduced into the internal accommodating space while the PCB substrate is coupled, and can be delivered to the housing without escaping to the outside. Heat is conducted to the heat dissipation cover and is effectively dissipated by the heat dissipation cover and cilia.
  • the cover plate 25 is coupled by a coupling means 40 so as to close the opening on one side of the housing 21, and the PCB substrate accommodated in the inner receiving space 21a of the housing 21 in the central portion ( 10) is formed on both sides of the support piece 26 fixed by the fixing means 45 in a state in surface contact.
  • the cover plate 25 is provided to cover the opening on one side of the housing, and the support piece 26 is formed in a direction perpendicular to the central portion and is fixed to the side surface of the PCB substrate 10 in a surface contact state. .
  • the cover plate 25 is configured to be separated in half so as to be easily fixed in a state in which the support piece 26 is in close contact with both sides of the PCB substrate 10, as shown in the drawing, and each is fixed. It is preferable to close the opening of one side of the housing through the
  • the cover plate 25 When the cover plate 25 is provided, the heat generated in the PCB substrate 10 accommodated in the accommodation space 21a is blocked from moving in the direction in which the lighting unit 15 is provided inside the accommodation space 21a, thereby accommodating the interior. After the heat present in the space 21a is transferred to the housing as much as possible without external release, it is possible to radiate heat to the outside through the heat dissipation cover.
  • the coupling means 40 may be composed of a bolt, and a bolt fixing groove 24 is formed in the innermost side of the fitting groove 22 of the housing 21 , and a bolt corresponding to the bolt inlet groove 24 is formed.
  • Bolt fixing parts 27 are formed on both sides of the cover plate 25 .
  • the bolt as a coupling means penetrates the bolt fixing part 27 and enters the bolt fixing groove 24 , thereby coupling the cover plate 25 to the housing 21 and fixing it.
  • the fixing means 45 is a means for fixing the PCB substrate 10 and the support piece 26 to each other, and can be fixed using known means such as coupling using rivets or bolts and nuts.
  • the heat dissipation cover 30 is coupled to surround the outside of the heat sink 20 to efficiently dissipate heat transferred to the heat sink. It may be formed to correspond to the shape.
  • the heat dissipation cover 30 may be formed as a hollow circular tube.
  • a plurality of cilia 31 are formed to protrude at intervals set for heat dissipation on the outer surface of the heat dissipation cover 30 .
  • the cilia 31 may be formed separately from the heat dissipation cover 30, but it is preferable to be formed integrally to increase heat dissipation efficiency.
  • the heat dissipation cover 30 may be made of engineering plastic having a good thermal emissivity, and a high thermal conductivity filler is used to increase thermal conductivity than general general-purpose engineering plastics.
  • Engineering plastics are lightweight plastics with excellent strength and elasticity, and are excellent materials for chemical resistance, weather resistance, heat resistance, flame retardancy, and insulation.
  • the heat dissipation cover can be more easily fitted to the housing, and after bonding, it is not easily separated in a state in close contact with the outer circumferential surface of the housing.
  • heat is generated in the PCB substrate 10 due to irradiation of light from the lighting unit 15 , and the generated heat is transferred to the heat sink 20 .
  • the housing 21 After the heat transferred to (21) is conducted to the heat dissipation cover 30 and the cilia 31 closely coupled to the outer circumferential surface, the cilia 31 are in contact with the air or the outer surface of the heat dissipation cover 30 is convection air between the cilia heat dissipation upon exposure to
  • the heat dissipation cover 30 and the cilia 31 are made of engineering plastic, the heat emissivity is good, so that the heat dissipation efficiency can be maximized through effective heat dissipation.
  • the heat sink 20 and the heat dissipation cover 30 may be closely coupled to each other by a fitting method.
  • protrusion inlet grooves 23 are formed at set intervals, and on the inner peripheral surface of the heat dissipation cover 30, the protrusion lead-in grooves 23 are drawn in. It is preferable that the fitting protrusion 32 is formed to couple the heat dissipation cover 30 to the housing 21 .
  • a fitting protrusion may be formed on the outer circumferential surface of the housing 21
  • a protrusion inlet groove may be formed on the inner circumferential surface of the heat dissipation cover 30 .
  • the heat dissipation cover is easy to combine, as well as the heat dissipation cover is made of engineering plastic with good elasticity, so it is not easily separated in the fitted state, It is possible to effectively conduct the heat transferred to the housing to the heat dissipation cover.
  • the heat transfer material 50 serving as a medium to transfer the heat generated in the PCB substrate 10 to the inner circumferential surface of the housing 21 may be filled in the inner accommodation space 21a of the housing 21 .
  • heat transfer material 50 Since the heat transfer material 50 is provided, heat generated from the PCB substrate 10 is directly transferred to the housing, thereby achieving faster heat dissipation.
  • a liquid form may be used, or a gel form may be used by adding carbon nanotubes or graphene to silicon in powder form. It can be used in liquid or gel form.
  • a hole provided for introducing an electric wire or the like on the other side of the housing 21 must be closed using a separate configuration so as not to escape to the outside.
  • the present invention is made of a structure that can maintain a simple and strong bonding state not only between the PCB substrate and the housing that generates heat, but also between the housing and the heat dissipation cover. It has the advantage of significantly increasing productivity along with the reduction of

Abstract

The present invention relates to a heat dissipation apparatus which conducts heat, generated in a PCB substrate by light emission of an LED, to a heat dissipation cover with high heat emissivity through a housing so as to effectively dissipate the heat. The heat dissipation apparatus of the present invention comprises: a heat sink that is coupled to the PCB substrate provided with a lighting unit in order to dissipate heat generated from the PCB substrate; and a heat dissipation cover that is molded from engineering plastic and coupled to the outside of the heat sink so as to surround the heat sink, and has a plurality of cilia protruding at set intervals and integrally formed on the outer surface thereof.

Description

방열장치heat sink
본 발명은 실내외 조명기구나 자동차 헤드라이트에 적용되어 효과적으로 열을 방열시켜 주기 위한 방열장치에 관한 것이다.The present invention relates to a heat dissipation device for effectively dissipating heat by being applied to indoor and outdoor lighting equipment or automobile headlights.
일반적으로, 실내외 조명기구의 사용시에 발광과 함께 열이 발생하는 문제점 때문에 열을 방열시켜주는 방열체의 적용은 필수적이라고 할 수 있다.In general, it can be said that it is essential to apply a heat sink for dissipating heat due to a problem in that heat is generated along with light emission when indoor and outdoor lighting devices are used.
이러한 현상은 70~80%를 열로 방출하는 엘이디 조명 역시 동일한 문제점을 가지고 있으며, 이를 해결하기 위해 모든 엘이디 조명은 광원인 엘이디의 온도를 낮추기 위한 방열체를 적용하고 있다.LED lighting that emits 70-80% of this phenomenon as heat also has the same problem.
통상의 방열체의 구조는 방열 부품이나 멀티칩과 접촉하는 모체 부분과, 발열시키는 방열편이나 방열핀으로 나뉘어지는데, 방열은 모체 부분에서 직·간접적으로 발열 부품에서 열을 전달받아 방열편 또는 방열핀에서 방출되는 형태를 취한다. 이러한 방열 형태는 방열체의 면적이 클수록 방열이 잘 됨은 물론 열 전도도가 높은 재료로 제조된 경우에는 더 높은 방열효과를 발휘하게 된다.The structure of a typical heat sink is divided into a body part that is in contact with a heat dissipation part or a multi-chip, and a heat dissipation piece or a heat dissipation fin that generates heat. take the form of release. In this type of heat dissipation, the larger the area of the heat dissipation body, the better the heat dissipation is.
방열장치로 사용되는 재질에는 알루미늄이나 구리 등과 같이 우수한 열전도성을 지닌 재질이 주로 사용되며, 그 중에서도 알루미늄은 구리에 비해 가격이 저렴해 대부분의 방열장치가 알루미늄 재질을 채택하여 사용하고 있다.Materials with excellent thermal conductivity, such as aluminum or copper, are mainly used for the material used for the heat dissipation device. Among them, aluminum is cheaper than copper, so most heat dissipation devices use aluminum material.
또한, 최근에는 전자회로 칩의 고집적화에 따른 전자기기의 소형화는 물론 전기자동차의 배터리 및 동력부, 조명기기, 전기장치 등을 소형화시키는 추세에 있음에 따라, 탄소 동소체의 하나인 탄소나노튜브를 적용한 방열장치에 대한 연구가 활발하게 진행되고 있으며, 이에 대한 다수의 특허가 공개 및 등록되어 있다.In addition, in recent years, as there is a trend of miniaturization of electronic devices due to high integration of electronic circuit chips, as well as miniaturization of batteries and power units of electric vehicles, lighting devices, and electric devices, carbon nanotubes, one of the carbon allotropes, are applied. Research on the heat dissipation device is being actively conducted, and a number of patents for this have been published and registered.
한편, 종래의 방열체는 단순한 사각판이나 원판 등의 대부분 특정 형상으로만 형성되어 있고, 가공이 용이하지 않아 사용자의 다양한 요구형태 및 디자인을 충족시키는데는 한계가 있었다.On the other hand, the conventional heat sink is mostly formed only in a specific shape, such as a simple square plate or a circular plate, and it is not easy to process, so there is a limit in satisfying the various types and designs of users.
또한, 자동차나 오토바이의 헤드라이트로 사용되는 조명의 경우는 설치공간이 협소하고, 원활하게 통풍되지 않기 때문에 부피를 최소화하면서도 방열효율을 높이기 위한 연구가 끊임없이 이루어지고 있다.In addition, in the case of lighting used as headlights of automobiles or motorcycles, the installation space is narrow and the ventilation is not smoothly conducted.
종래 방열장치의 예로서, 대한민국 공개특허공보 제10-2019-0011980호에는 발열대상물로부터 발생되는 열을 방열하기 위한 방열몸체와, 이 방열몸체의 표면에 다수개의 방열핀을 형성하되, 방열몸체는 보론 나이트라이드가 혼합된 실리카겔로 형성하고, 방열핀은 그래핀과 보론 나이트라이드와 이들의 화합물 중 어느 하나로 제조된 섬모의 일단을 방열몸체의 표면에 압입하여 일체로 구성시킨 섬모를 이용한 방열장치가 개시되어 있다.As an example of a conventional heat dissipation device, Korean Patent Laid-Open Publication No. 10-2019-0011980 discloses a heat dissipation body for dissipating heat generated from a heating object, and a plurality of heat dissipation fins formed on the surface of the heat dissipation body, but the heat dissipation body is boron A heat dissipation device using cilia is disclosed, which is formed of silica gel mixed with nitride, and the heat dissipation fin is formed by pressing one end of the cilia made of graphene, boron nitride, and any one of these compounds into the surface of the heat dissipating body. there is.
상기 기술은 방열몸체와 방열핀을 통한 열 전도성을 대폭 높이면서도 공기와의 접촉면적을 넓혀 방열효과를 극대화시키도록 하였으나, 발열대상물과 방열몸체 간의 열 전도가 신속히 이루어지지 못해 방열효율이 저하되는 문제가 있었다.Although the above technology maximizes the heat dissipation effect by widening the contact area with air while significantly increasing the thermal conductivity through the heat dissipation body and the heat dissipation fin, the heat dissipation efficiency is lowered because heat conduction between the heating object and the heat dissipation body is not performed quickly. there was.
또한, 방열몸체의 표면에 열 전도성을 높이도록 하는 섬모가닥을 압입시키는 구조로 되어 있어, 제조 공정이 복잡함은 물론 제조 시간이 길어지게 되었고, 결과적으로는 제품의 비용 상승을 초래하는 문제점이 발생되었다.In addition, since it has a structure in which ciliary strands are press-fitted to increase thermal conductivity on the surface of the heat dissipation body, the manufacturing process is complicated and the manufacturing time is prolonged, resulting in an increase in product cost. .
본 발명은 상기한 문제점를 해결하기 위하여 창안된 것으로, 히트싱크에 결합되는 방열커버를 엔지니어링플라스틱으로 제조함은 물론, 이 방열커버를 PCB기판이 결합된 하우징에 끼움결합하여 구성함으로써 PCB기판에서 발생되는 열을 방열커버를 통해 효과적으로 외부로 방출시켜 주도록 한 방열장치를 제공함에 있다.The present invention was devised to solve the above problems, and by manufacturing the heat dissipation cover coupled to the heat sink with engineering plastic, as well as fitting the heat dissipation cover to the housing to which the PCB board is coupled, the heat dissipation cover generated from the PCB board An object of the present invention is to provide a heat dissipation device to effectively dissipate heat to the outside through the heat dissipation cover.
또한, 본 발명은 하우징의 외주면에 방열커버가 끼움결합되게 구성함으로써 하우징과 다른 재질로 된 방열커버를 용이하게 생산할 수 있도록 하면서도, 탄성이 좋은 엔지니어링플라스틱으로 제조됨에 따라 하우징의 외표면에 쉽게 끼워줄 수 있음은 물론 끼움결합 후에는 쉽게 분리되지 않고 일체가 되게 구성할 수 있는 방열장치를 제공함에 있다.In addition, the present invention makes it possible to easily produce a heat dissipation cover made of a material different from the housing by configuring the heat dissipation cover to be fitted on the outer circumferential surface of the housing, and to be easily fitted on the outer surface of the housing as it is made of engineering plastic with good elasticity. It is, of course, to provide a heat dissipation device that can be configured to be integrated without being easily separated after fitting.
상기의 과제를 해결하기 위한 본 발명의 방열장치는 조명부(15)가 구비된 PCB기판(10)에서 발생된 열의 방열을 위해 PCB기판(10)에 결합된 히트싱크(20); 상기 히트싱크(20)의 외부에 결합되어 히트싱크를 감싸도록 구비되고, 외표면에는 설정된 간격으로 돌출된 복수개의 섬모(31)가 일체로 형성되며, 엔지니어링 플라스틱으로 성형된 방열커버(30);로 이루어진다.The heat dissipation device of the present invention for solving the above problems is a heat sink 20 coupled to the PCB substrate 10 for dissipation of heat generated in the PCB substrate 10 provided with the lighting unit 15; A heat dissipation cover 30 coupled to the outside of the heat sink 20 and provided to surround the heat sink, a plurality of cilia 31 protruding at set intervals on the outer surface are integrally formed, and molded of engineering plastic; is made of
상기 조명부(15)는 상기 PCB기판(10)의 일측 일면 또는 양면에 구비된 엘이디칩 또는 엘이디모듈로 구성되고, 상기 히트싱크(20)는, 상기 PCB기판(10)의 타측이 내부로 수용되어 결합되게 일측이 개구되고 내부에 수용공간(21a)이 형성된 통체로 된 하우징(21)과, 상기 하우징(21)의 개구된 일측 개구부를 커버하여 폐쇄시켜 주도록 결합수단(40)으로 결합되고 중앙부에는 상기 PCB기판(10)의 양면에 면접촉된 상태로 고정수단(45)으로 고정되는 지지편(26)이 구비된 커버판(25)으로 구성된다.The lighting unit 15 is composed of an LED chip or an LED module provided on one side or both sides of the PCB substrate 10, and the heat sink 20, the other side of the PCB substrate 10 is accommodated inside The housing 21 having a cylindrical body 21 having one side open to be coupled and having a receiving space 21a therein is coupled by coupling means 40 so as to cover and close the opening on one side of the housing 21, and in the central part It consists of a cover plate 25 provided with a support piece 26 fixed to the fixing means 45 in a state in which both surfaces of the PCB substrate 10 are in surface contact.
상기 PCB기판(10)의 타측 양쪽에는 일정 길이로 끼움부(11)가 돌출되어 형성되고, 상기 하우징(21)의 내주면에는 상기 끼움부(11)가 끼워져 PCB기판(10)을 고정시켜 주도록 서로 마주보게 끼움홈(22)이 형성된다.On both sides of the other side of the PCB substrate 10, fitting portions 11 are formed to protrude to a predetermined length, and the fitting portions 11 are fitted on the inner circumferential surface of the housing 21 to fix the PCB substrate 10 to each other. The fitting groove 22 is formed to face each other.
이때, 상기 결합수단(40)은 볼트로 구성되고, 상기 하우징(21)의 끼움홈(22) 최내측에는 볼트고정홈(24)이 형성되며, 상기 볼트고정홈(24)과 대응되는 상기 커버판(25)의 양쪽에는 상기 볼트가 관통하여 볼트고정홈(24)으로 인입되면서 커버판(25)을 하우징(21)에 고정시켜 주도록 볼트고정부(27)가 형성된 것이 바람직하다.At this time, the coupling means 40 is composed of a bolt, and a bolt fixing groove 24 is formed on the innermost side of the fitting groove 22 of the housing 21 , and the cover corresponding to the bolt fixing groove 24 . It is preferable that bolt fixing parts 27 are formed on both sides of the plate 25 so that the bolt penetrates and enters the bolt fixing groove 24 to fix the cover plate 25 to the housing 21 .
그리고 상기 히트싱크(20)의 외주면에는 설정된 간격으로 돌기인입홈(23)이 형성되고, 상기 방열커버(30)의 내주면에는 상기 돌기인입홈(23)으로 인입되어 방열커버(30)를 히트싱크(20)의 외주면에 끼움결합시켜 주도록 끼움돌기(32)가 형성된다.And on the outer circumferential surface of the heat sink 20, projection inlet grooves 23 are formed at set intervals, and on the inner peripheral surface of the heat dissipation cover 30, the heat dissipation cover 30 is drawn into the protrusion inlet groove 23 as a heat sink. Fitting projections 32 are formed so as to fit the outer peripheral surface of (20).
한편, 상기 하우징(21)의 내부 수용공간(21a)에는 상기 PCB기판(10)에서 발생된 열을 하우징(21)의 내주면으로 전달해주도록 매개체역할을 하는 열전달물질(50)이 충전될 수 있다.On the other hand, the internal receiving space 21a of the housing 21 may be filled with a heat transfer material 50 serving as a medium to transfer the heat generated from the PCB substrate 10 to the inner peripheral surface of the housing 21 .
상기의 구성으로 이루어진 방열장치에 따르면, PCB기판에서 발생된 열을 열방사율이 높은 엔지니어링플라스틱으로 성형된 방열커버로 전도시켜 효과적으로 방열시킬 수 있는 효과가 있다.According to the heat dissipation device having the above configuration, there is an effect of effectively dissipating heat by conducting the heat generated from the PCB substrate to the heat dissipation cover molded of engineering plastic having a high heat emissivity.
또한, 방열커버가 엔지니어링플라스틱으로 제조됨에 따라 탄성이 좋아 하우징에 쉽게 끼움결합할 수 있음은 물론 결합 후 분리가능성이 낮으며, 외부 충격에도 유연하게 대처할 수 있는 효과가 있다.In addition, as the heat dissipation cover is made of engineering plastic, it has good elasticity and can be easily fitted into the housing, as well as the possibility of separation after coupling is low, and has the effect of flexibly coping with external shocks.
도 1은 본 발명의 일 실시예에 따른 방열장치의 사시도,1 is a perspective view of a heat dissipation device according to an embodiment of the present invention;
도 2는 도 1의 분리도,Figure 2 is an exploded view of Figure 1;
도 3은 본 발명에 따른 PCB기판과 커버판의 분리도,3 is an exploded view of a PCB substrate and a cover plate according to the present invention;
도 4는 도 1의 A-A에 따른 단면도,4 is a cross-sectional view taken along line A-A of FIG. 1 ;
도 5는 본 발명의 일 실시예에 따른 하우징과 방열커버의 결합구조를 보인 단면상태도,5 is a cross-sectional state view showing a coupling structure of a housing and a heat dissipation cover according to an embodiment of the present invention;
도 6은 본 발명의 일 실시예에 따른 하우징의 내부 수용공간에 열전달물질이 충전된 상태의 단면도.6 is a cross-sectional view of a state in which a heat transfer material is filled in an inner accommodation space of a housing according to an embodiment of the present invention;
이하, 첨부한 도면을 참고하여 본 발명의 일 실시예에 따른 방열장치에 대하여 설명한다.Hereinafter, a heat dissipation device according to an embodiment of the present invention will be described with reference to the accompanying drawings.
도 1 내지 도 6에 도시된 바와 같이, 본 발명의 일 실시예에 따른 방열장치는 크게 조명부(15)가 구비된 PCB기판(10)에 결합되는 히트싱크(20), 이 히트싱크(20)를 감싸도록 구비되어 방열시켜 주기 위한 방열커버(30)로 이루어진다.1 to 6, the heat dissipation device according to an embodiment of the present invention is a heat sink 20 coupled to a PCB substrate 10 provided with a large lighting unit 15, the heat sink 20 It is provided to surround the heat dissipation cover 30 for dissipating heat.
상기 PCB기판(10)은 사각형 또는 다각형의 판체로 열전도성을 갖춘 소재로 제조되는 것이고, 일측에는 빛을 조사하여 조명시켜주도록 조명부(15)가 구비되어 있고, 타측이 상기 히트싱크(20)가 결합되어 PCB기판에서 발생된 열을 히트싱크로 전달시킨 후 방열시키게 된다.The PCB substrate 10 is a rectangular or polygonal plate body made of a material with thermal conductivity, and a lighting unit 15 is provided to illuminate by irradiating light on one side, and the heat sink 20 is provided on the other side. Combined, the heat generated from the PCB board is transferred to the heat sink, and then the heat is dissipated.
상기 조명부(15)는 상기 PCB기판(10)의 일측 일면 또는 양면에 구비된 엘이디칩 또는 엘이디모듈로 구성될 수 있다.The lighting unit 15 may be composed of an LED chip or an LED module provided on one side or both sides of the PCB substrate 10 .
조명부(15)가 엘이디칩으로 구성된 경우에는 PCB기판 자체에 엘이디칩이 실장되게 구비될 것이고, 엘이디모듈로 구성될 경우에는 PCB기판(10)의 표면에 볼트와 너트에 의한 고정 또는 헤밍방식으로 고정되거나 이외에 다수의 방법으로 고정될 수 있다.If the lighting unit 15 is composed of an LED chip, the LED chip will be mounted on the PCB substrate itself. or may be fixed in a number of other ways.
본 발명의 첨부 도면에는 PCB기판(10)의 일측 양면에 엘이디가 구비되어 있으며, 히트싱크와 결합되는 PCB기판의 타측에 제어회로부가 구비되는 것이다. 본 발명에서는 상기 제어회로부에서 발생되는 열을 효과적으로 방열하기 위한 구조로 이루어져 있다.In the accompanying drawings of the present invention, LEDs are provided on both sides of one side of the PCB substrate 10, and a control circuit unit is provided on the other side of the PCB substrate coupled to the heat sink. In the present invention, it has a structure for effectively dissipating heat generated by the control circuit unit.
상기 히트싱크(20)는 알루미늄 또는 구리 등의 열전도성이 좋은 금속재로 제조할 수 있는데, 알루미늄이 무게가 가볍고 가공이 용이함에 따라 알루미늄 소재로 제조하는 것이 바람직할 것이다.The heat sink 20 may be made of a metal material having good thermal conductivity, such as aluminum or copper, and it is preferable to make the heat sink 20 from an aluminum material because aluminum is light in weight and easy to process.
상기 히트싱크(20)는 PCB기판과 결합된 공지의 히트싱크로서, 그 형태나 구조는 특별히 한정되지 않고, PCB기판의 열을 전달받아 방열시킬 수 있는 것이면 모두 가능하다. The heat sink 20 is a known heat sink combined with a PCB substrate, and the shape or structure is not particularly limited, and any heat sink capable of dissipating heat by receiving heat from the PCB substrate is possible.
상기 PCB기판(10)과 히트싱크(20)의 결합은 PCB기판의 열을 히트싱크로 전달할 수 있는 구조이면 충분하고, 결합구조에 특별히 한정되지는 않는다.The combination of the PCB substrate 10 and the heat sink 20 suffices as long as a structure capable of transferring the heat of the PCB substrate to the heat sink is sufficient, and the bonding structure is not particularly limited.
상기 히트싱크(20)에 대한 일실시예로서, 상기 PCB기판(10)의 타측이 내부로 수용되어 결합되게 일측이 개구되고 내부에 수용공간(21a)이 형성된 통체로 된 하우징(21)과, 상기 하우징(21)의 개구된 일측 개구부를 커버하여 폐쇄시켜 주도록 결합수단(40)으로 결합되는 커버판(25)으로 구성될 수 있다.As an embodiment of the heat sink 20, one side of the PCB substrate 10 is accommodated and coupled to the inside, and one side is opened and a housing 21 having a housing space 21a formed therein is formed in a cylindrical body 21, It may be composed of a cover plate 25 coupled to the coupling means 40 so as to cover and close the opening on one side of the housing 21 .
이때, PCB기판과 하우징의 결합구조의 예로서, 상기 PCB기판(10)의 타측 양쪽에 일정 길이로 끼움부(11)가 돌출되어 형성되고, 히트싱크를 이루는 하우징(21)의 내주면에는 상기 끼움부(11)가 끼워져 PCB기판(10)을 고정시켜 주도록 서로 마주보게 끼움홈(22)을 형성할 수 있다.At this time, as an example of the combination structure of the PCB substrate and the housing, the fitting portion 11 is formed to protrude to a predetermined length on both sides of the other side of the PCB substrate 10, and the fitting portion 11 is formed on the inner circumferential surface of the housing 21 constituting the heat sink. The fitting groove 22 may be formed to face each other so that the part 11 is inserted to fix the PCB substrate 10 .
따라서, 상기 PCB기판(10)의 타측을 하우징(21)의 수용공간(21a)에 수용시켜 준 상태로 상기 끼움부(11)를 끼움홈(22)에 끼워줌으로써 PCB기판을 하우징(21)에 결합할 수 있는 것이다.Accordingly, by inserting the fitting part 11 into the fitting groove 22 in a state where the other side of the PCB board 10 is accommodated in the receiving space 21a of the housing 21, the PCB board is attached to the housing 21. that can be combined.
상기 하우징(21)은 일측이 개구된 원형 또는 삼각 이상의 다각형으로 된 통체로 형성될 수 있으며, 통째로 주물로 제작하거나 절반씩 각각 형성한 후 서로 결합하여 제작할 수 있다.The housing 21 may be formed of a cylindrical body having a polygonal shape of a circle or a triangular or more with an open side, and may be manufactured as a whole by casting, or by combining each other after forming half of the housing 21 .
하우징(21)은 내부에 수용공간이 형성된 통체로 형성됨에 따라 PCB기판이 결합된 상태에서 공기가 내부 수용공간으로 인입된 외부로 빠져나가지 않은 상태로 하우징에 그대로 전달될 수 있으며, 하우징에 전달된 열은 방열커버로 전도되어져 방열커버 및 섬모에 의해 효과적으로 방열되는 것이다.As the housing 21 is formed as a cylindrical body with an accommodating space formed therein, the air is introduced into the internal accommodating space while the PCB substrate is coupled, and can be delivered to the housing without escaping to the outside. Heat is conducted to the heat dissipation cover and is effectively dissipated by the heat dissipation cover and cilia.
상기 커버판(25)은 하우징(21)의 일측 개구부를 폐쇄시켜 주도록 결합수단(40)으로 결합되는 것이며, 중앙부에는 상기 하우징(21)의 내부 수용공간(21a)으로 수용되어 있는 상기 PCB기판(10)의 양면에 면접촉된 상태로 고정수단(45)으로 고정되는 지지편(26)이 형성되어 있다.The cover plate 25 is coupled by a coupling means 40 so as to close the opening on one side of the housing 21, and the PCB substrate accommodated in the inner receiving space 21a of the housing 21 in the central portion ( 10) is formed on both sides of the support piece 26 fixed by the fixing means 45 in a state in surface contact.
즉, 상기 커버판(25)은 하우징의 일측 개구부를 커버하도록 구비되는 것이며, 중앙부에 직각방향으로 상기 지지편(26)이 형성되어 PCB기판(10)의 측면에 면접촉된 상태로 고정되는 것이다.That is, the cover plate 25 is provided to cover the opening on one side of the housing, and the support piece 26 is formed in a direction perpendicular to the central portion and is fixed to the side surface of the PCB substrate 10 in a surface contact state. .
이때, 상기 커버판(25)은 도면에 도시된 바와 같이 상기 지지편(26)이 PCB기판(10)의 양면에 각각 밀착시켜 놓은 상태로 용이하게 고정시킬 수 있도록 절반씩 분리되게 구성하여 각각 고정을 통해 하우징의 일측 개구부를 폐쇄하도록 함이 바람직하다.At this time, the cover plate 25 is configured to be separated in half so as to be easily fixed in a state in which the support piece 26 is in close contact with both sides of the PCB substrate 10, as shown in the drawing, and each is fixed. It is preferable to close the opening of one side of the housing through the
상기 커버판(25)이 구비됨으로써 수용공간(21a)에 수용된 PCB기판(10)에서 발생된 열이 수용공간(21a)의 내부에서 조명부(15)가 구비된 방향으로 이동되는 것이 차단됨으로써 내부 수용공간(21a)에 존재하는 열의 외부 방출없이 하우징으로 최대한 전달된 후 방열커버를 통해 외부로 방열시켜 줄 수 있는 것이다.When the cover plate 25 is provided, the heat generated in the PCB substrate 10 accommodated in the accommodation space 21a is blocked from moving in the direction in which the lighting unit 15 is provided inside the accommodation space 21a, thereby accommodating the interior. After the heat present in the space 21a is transferred to the housing as much as possible without external release, it is possible to radiate heat to the outside through the heat dissipation cover.
여기서, 상기 결합수단(40)은 볼트로 구성될 수 있고, 상기 하우징(21)의 끼움홈(22) 최내측에는 볼트고정홈(24)이 형성되며, 상기 볼트인입홈(24)과 대응되는 상기 커버판(25)의 양쪽에는 볼트고정부(27)가 형성된다.Here, the coupling means 40 may be composed of a bolt, and a bolt fixing groove 24 is formed in the innermost side of the fitting groove 22 of the housing 21 , and a bolt corresponding to the bolt inlet groove 24 is formed. Bolt fixing parts 27 are formed on both sides of the cover plate 25 .
따라서, 결합수단인 볼트가 볼트고정부(27)를 관통하여 볼트고정홈(24)으로 인입되면서 커버판(25)을 하우징(21)에 결합하여 고정시켜 주게 되는 것이다.Accordingly, the bolt as a coupling means penetrates the bolt fixing part 27 and enters the bolt fixing groove 24 , thereby coupling the cover plate 25 to the housing 21 and fixing it.
그리고 상기 고정수단(45)은 PCB기판(10)과 지지편(26)을 서로 고정하기 위한 수단으로, 리벳이나 볼트와 너트를 이용한 결합 등 공지의 수단을 이용하여 고정할 수 있다.In addition, the fixing means 45 is a means for fixing the PCB substrate 10 and the support piece 26 to each other, and can be fixed using known means such as coupling using rivets or bolts and nuts.
그리고 본 발명의 주요 특징으로서, 상기 방열커버(30)는 히트싱크(20)의 외부를 감싸도록 결합되어 히트싱크로 전달된 열을 효율적으로 방열하기 위해 구비되는 구성으로서, 히트싱크(20)의 외형상과 대응되게 형성될 수 있다.And as a main feature of the present invention, the heat dissipation cover 30 is coupled to surround the outside of the heat sink 20 to efficiently dissipate heat transferred to the heat sink. It may be formed to correspond to the shape.
예로서, 히트싱크(20)가 구체적으로 하우징(21)의 외형이 원형의 통체로 형성된 경우에 상기 방열커버(30)는 중공된 원형관으로 형성될 수 있는 것이다.For example, when the heat sink 20 is specifically formed as a circular cylindrical body in the outer shape of the housing 21 , the heat dissipation cover 30 may be formed as a hollow circular tube.
이러한 방열커버(30)의 외표면에는 방열을 위해 설정된 간격으로 복수개의 섬모(31)가 돌출되게 형성되어 있다. 상기 섬모(31)는 방열커버(30)와 분리되어 형성될 수도 있으나 방열효율을 높여주기 위해 일체로 형성됨이 바람직할 것이다.A plurality of cilia 31 are formed to protrude at intervals set for heat dissipation on the outer surface of the heat dissipation cover 30 . The cilia 31 may be formed separately from the heat dissipation cover 30, but it is preferable to be formed integrally to increase heat dissipation efficiency.
본 발명에서 상기 방열커버(30)는 열방사율이 좋은 엔지니어링플라스틱으로 제조될 수 있는데, 일반 범용 엔지니어링플라스틱보다 열전도성을 높여주기 위해 고열 전도율 필러를 충전한 것을 사용하도록 한다.In the present invention, the heat dissipation cover 30 may be made of engineering plastic having a good thermal emissivity, and a high thermal conductivity filler is used to increase thermal conductivity than general general-purpose engineering plastics.
엔지니어링플라스틱은 경량이면서도 강도와 탄성이 우수한 플라스틱으로서, 내약품성, 내후성, 내열성, 난연성, 절연성 등이 우수한 소재이다.Engineering plastics are lightweight plastics with excellent strength and elasticity, and are excellent materials for chemical resistance, weather resistance, heat resistance, flame retardancy, and insulation.
엔지니어링플라스틱은 탄성을 가지고 있음에 따라 방열커버를 하우징에 보다 쉽게 끼움결합시킬 수 있는 것이고, 결합 후에는 하우징의 외주면에 밀착된 상태로 쉽게 분리되지 않게 된다.As engineering plastics have elasticity, the heat dissipation cover can be more easily fitted to the housing, and after bonding, it is not easily separated in a state in close contact with the outer circumferential surface of the housing.
상기와 같이 구성된 본 발명에 따르면, 조명부(15)에서 빛의 조사로 인해 PCB기판(10)에는 열이 발생하게 되는데, 이렇게 발생된 열은 히트싱크(20)로 전달된다.According to the present invention configured as described above, heat is generated in the PCB substrate 10 due to irradiation of light from the lighting unit 15 , and the generated heat is transferred to the heat sink 20 .
더욱 구체적으로는 히트싱크(20)를 이루는 하우징(21)의 수용공간(21a)으로 방출되면서 하우징(21)의 내주면으로 전달되거나 하우징과의 결합부위를 통해 하우징(21)으로 전달되어 지고, 하우징(21)으로 전달된 열은 외주면에 밀착결합된 방열커버(30) 및 섬모(31)로 전도된 후 섬모(31)가 공기와 접촉되거나 방열커버(30)의 외표면이 섬모 사이로 대류하는 공기에 노출되면서 방열되어 진다.More specifically, it is transmitted to the inner circumferential surface of the housing 21 while being discharged into the receiving space 21a of the housing 21 constituting the heat sink 20 or transmitted to the housing 21 through a coupling portion with the housing, and the housing After the heat transferred to (21) is conducted to the heat dissipation cover 30 and the cilia 31 closely coupled to the outer circumferential surface, the cilia 31 are in contact with the air or the outer surface of the heat dissipation cover 30 is convection air between the cilia heat dissipation upon exposure to
본 발명에서는 방열커버(30)와 섬모(31)가 엔지니어링 플라스틱으로 제조됨에 따라 열방사율이 좋아 효과적인 방열로 방열효율을 극대화시켜줄 수 있게 된다.In the present invention, since the heat dissipation cover 30 and the cilia 31 are made of engineering plastic, the heat emissivity is good, so that the heat dissipation efficiency can be maximized through effective heat dissipation.
한편, 본 발명에서 상기 히트싱크(20)와 방열커버(30)는 끼움방식으로 서로 밀착되게 결합될 수 있다.Meanwhile, in the present invention, the heat sink 20 and the heat dissipation cover 30 may be closely coupled to each other by a fitting method.
예로서, 상기 히트싱크의 외주면 구체적으로는 하우징(21)의 외주면에는 설정된 간격으로 돌기인입홈(23)이 형성되고, 상기 방열커버(30)의 내주면에는 상기 돌기인입홈(23)으로 인입되어 방열커버(30)를 하우징(21)에 결합시켜 주도록 끼움돌기(32)가 형성된 것이 바람직하다.For example, on the outer peripheral surface of the heat sink, specifically, on the outer peripheral surface of the housing 21, protrusion inlet grooves 23 are formed at set intervals, and on the inner peripheral surface of the heat dissipation cover 30, the protrusion lead-in grooves 23 are drawn in. It is preferable that the fitting protrusion 32 is formed to couple the heat dissipation cover 30 to the housing 21 .
물론, 상기한 구조와 반대로 상기 하우징(21)의 외주면에 끼움돌기가 형성되고, 방열커버(30)의 내주면에 돌기인입홈이 형성될 수도 있다.Of course, contrary to the above structure, a fitting protrusion may be formed on the outer circumferential surface of the housing 21 , and a protrusion inlet groove may be formed on the inner circumferential surface of the heat dissipation cover 30 .
상기와 같이 하우징과 방열커버가 끼움방식으로 서로 결합됨에 따라 방열커버의 결합이 용이함은 물론 방열커버가 탄성이 좋은 엔지니어링 플락스틱으로 제조됨에 따라 밀착력이 좋아 끼움결합된 상태에서 쉽게 분리되지 않게 되며, 하우징으로 전달된 열을 효과적으로 방열커버로 전도시켜 줄 수 있게 된다.As the housing and the heat dissipation cover are coupled to each other by the fitting method as described above, the heat dissipation cover is easy to combine, as well as the heat dissipation cover is made of engineering plastic with good elasticity, so it is not easily separated in the fitted state, It is possible to effectively conduct the heat transferred to the housing to the heat dissipation cover.
그리고, 상기 하우징(21)의 내부 수용공간(21a)에는 상기 PCB기판(10)에서 발생된 열을 하우징(21)의 내주면으로 전달해주도록 매개체역할을 하는 열전달물질(50)이 충전될 수 있다.In addition, the heat transfer material 50 serving as a medium to transfer the heat generated in the PCB substrate 10 to the inner circumferential surface of the housing 21 may be filled in the inner accommodation space 21a of the housing 21 .
상기 열전달물질(50)이 구비됨으로써 PCB기판(10)에서 발생된 열이 하우징으로 직접적으로 전달시켜 줌으로써 보다 신속한 방열을 달성할 수 있게 된다.Since the heat transfer material 50 is provided, heat generated from the PCB substrate 10 is directly transferred to the housing, thereby achieving faster heat dissipation.
열전달물질(50)로서 액상 형태로 이루어진 것이 사용되거나, 실리콘에 탄소나노튜브 또는 그래핀을 분말 형태로 첨가하여 겔 형태로 이루어진 것이 사용될 수 있으며, 이 외에도 열전달물질로 사용되는 공지의 여러종류의 물질이 액상 또는 겔 형태로 사용될 수 있다.As the heat transfer material 50, a liquid form may be used, or a gel form may be used by adding carbon nanotubes or graphene to silicon in powder form. It can be used in liquid or gel form.
열전달물질(50)이 액상으로 구비된 경우에는 외부로 빠져나오지 않도록 하우징(21)의 타측에 전선 등의 인입을 위해 구비해놓은 홀을 별도의 구성을 이용하여 폐쇄시켜 주어야 할 것이다.When the heat transfer material 50 is provided in a liquid phase, a hole provided for introducing an electric wire or the like on the other side of the housing 21 must be closed using a separate configuration so as not to escape to the outside.
본 발명은 열이 발생되는 PCB기판과 하우징의 결합은 물론 하우징과 방열커버의 결합 역시도 간단하면서도 견고한 결합상태를 유지할 수 있는 구조로 이루어져 있어 제작이 용이함은 물론 생산속도를 크게 향상시킬 수 있어 제조비용의 절감과 함께 생산성을 현저하게 증대시킬 수 있는 장점이 있다.The present invention is made of a structure that can maintain a simple and strong bonding state not only between the PCB substrate and the housing that generates heat, but also between the housing and the heat dissipation cover. It has the advantage of significantly increasing productivity along with the reduction of

Claims (6)

  1. 조명부(15)가 구비된 PCB기판(10)에서 발생된 열의 방열을 위해 PCB기판(10)에 결합된 히트싱크(20);a heat sink 20 coupled to the PCB substrate 10 for dissipating heat generated from the PCB substrate 10 provided with the lighting unit 15;
    상기 히트싱크(20)의 외부에 결합되어 히트싱크를 감싸도록 구비되고, 외표면에는 설정된 간격으로 돌출된 복수개의 섬모(31)가 일체로 형성되며, 엔지니어링 플라스틱으로 성형된 방열커버(30);A heat dissipation cover 30 coupled to the outside of the heat sink 20 and provided to surround the heat sink, a plurality of cilia 31 protruding at set intervals on the outer surface are integrally formed, and molded of engineering plastic;
    로 이루어진 것을 특징으로 하는 방열장치.Heat dissipation device, characterized in that consisting of.
  2. 제1항에 있어서,According to claim 1,
    상기 조명부(15)는 상기 PCB기판(10)의 일측 일면 또는 양면에 구비된 엘이디칩 또는 엘이디모듈로 구성되고,The lighting unit 15 is composed of an LED chip or an LED module provided on one side or both sides of the PCB substrate 10,
    상기 히트싱크(20)는, 상기 PCB기판(10)의 타측이 내부로 수용되어 결합되게 일측이 개구되고 내부에 수용공간(21a)이 형성된 통체로 된 하우징(21)과, 상기 하우징(21)의 개구된 일측 개구부를 커버하여 폐쇄시켜 주도록 결합수단(40)으로 결합되고 중앙부에는 상기 PCB기판(10)의 양면에 면접촉된 상태로 고정수단(45)으로 고정되는 지지편(26)이 구비된 커버판(25)으로 구성된 것을 특징으로 하는 방열장치.The heat sink 20 includes a cylindrical housing 21 having one side open so that the other side of the PCB substrate 10 is received and coupled therein, and a receiving space 21a is formed therein, and the housing 21 . A support piece 26 is provided in the central portion that is coupled by a coupling means 40 so as to cover and close the opening on one side of the open side of the PCB substrate 10 and is fixed by means of a fixing means 45 in a state of being in surface contact with each other. A heat dissipation device, characterized in that it is composed of a cover plate (25).
  3. 제2항에 있어서,3. The method of claim 2,
    상기 PCB기판(10)의 타측 양쪽에는 일정 길이로 끼움부(11)가 돌출되어 형성되고,On both sides of the other side of the PCB substrate 10, the fitting portion 11 is formed to protrude to a predetermined length,
    상기 하우징(21)의 내주면에는 상기 끼움부(11)가 끼워져 PCB기판(10)을 고정시켜 주도록 서로 마주보게 끼움홈(22)이 형성된 것을 특징으로 하는 방열장치.Heat dissipation device, characterized in that the fitting portion (11) is fitted on the inner peripheral surface of the housing (21), and fitting grooves (22) are formed to face each other so as to fix the PCB substrate (10).
  4. 제2항에 있어서,3. The method of claim 2,
    상기 결합수단(40)은 볼트로 구성되고,The coupling means 40 is composed of a bolt,
    상기 하우징(21)의 끼움홈(22) 최내측에는 볼트고정홈(24)이 형성되며,A bolt fixing groove 24 is formed on the innermost side of the fitting groove 22 of the housing 21,
    상기 볼트고정홈(24)과 대응되는 상기 커버판(25)의 양쪽에는 상기 볼트가 관통하여 볼트고정홈(24)으로 인입되면서 커버판(25)을 하우징(21)에 고정시켜 주도록 볼트고정부(27)가 형성된 것을 특징으로 하는 방열장치.On both sides of the cover plate 25 corresponding to the bolt fixing groove 24 , the bolt penetrates and enters the bolt fixing groove 24 , and a bolt fixing part fixes the cover plate 25 to the housing 21 . (27) A heat dissipation device, characterized in that formed.
  5. 제1항에 있어서,According to claim 1,
    상기 히트싱크(20)의 외주면에는 설정된 간격으로 돌기인입홈(23)이 형성되고,Protrusion inlet grooves 23 are formed at set intervals on the outer peripheral surface of the heat sink 20,
    상기 방열커버(30)의 내주면에는 상기 돌기인입홈(23)으로 인입되어 방열커버(30)를 히트싱크(20)의 외주면에 끼움결합시켜 주도록 끼움돌기(32)가 형성된 것을 특징으로 하는 방열장치.Heat dissipation device, characterized in that the fitting protrusion 32 is formed on the inner circumferential surface of the heat dissipation cover 30 so as to be introduced into the protrusion inlet groove 23 to fit the heat dissipation cover 30 to the outer circumferential surface of the heat sink 20 . .
  6. 제1항에 있어서,According to claim 1,
    상기 하우징(21)의 내부 수용공간(21a)에는 상기 PCB기판(10)에서 발생된 열을 하우징(21)의 내주면으로 전달해주도록 매개체역할을 하는 열전달물질(50)이 충전된 것을 특징으로 하는 방열장치.Heat dissipation, characterized in that the inner receiving space 21a of the housing 21 is filled with a heat transfer material 50 serving as a medium to transfer the heat generated from the PCB substrate 10 to the inner circumferential surface of the housing 21 Device.
PCT/KR2021/000861 2020-08-21 2021-01-22 Heat dissipation apparatus WO2022039338A1 (en)

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KR1020200105122A KR102430404B1 (en) 2020-08-21 2020-08-21 Heat dissipation device

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KR101464318B1 (en) * 2014-02-21 2014-11-25 정소영 Led lighting apparatus and streetlight using the same
KR101971550B1 (en) * 2017-07-26 2019-04-23 주식회사 오투마 Thermal sync structure by hair-cell

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KR20110010409U (en) * 2010-04-29 2011-11-04 주식회사세이브너 LED Lamp Having Plastic Heat Emitting Means
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KR101971550B1 (en) * 2017-07-26 2019-04-23 주식회사 오투마 Thermal sync structure by hair-cell

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