KR101887114B1 - Led lighting unit and led lighting equipment having the same - Google Patents

Abstract

Disclosed are an LED lighting unit with improved waterproof performance and LED lighting equipment having the same. The LED lighting unit with improved waterproof performance according to the present invention includes: a circuit board having a front surface on which a plurality of LEDs are mounted, the circuit board being connected to a power line; a heat sink coupled to the front surface of the circuit board and formed with a power passage hole; a lens that transmits the light of the LED and is coupled to a front surface of the heat sink; and a waterproof packing interposed between the lens and the heat sink. The waterproof packing includes: a substrate packing part pressed by the lens and the heat sink from an outside of the circuit board; and a power source packing part extending from the substrate packing part and inserted into the power passage hole at the outside of the circuit board. According to the present invention, provided are the LED lighting unit with improved waterproof performance and the LED lighting equipment having the same, which can secure sufficient waterproof performance while avoiding the dual structure of a waterproof packing for a lens and a waterproof packing for a power line, prevent condensation between the lens and the circuit board, and improve heat radiation performance by changing the structure of a heat sink.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED lighting unit and a LED lighting unit,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED lighting unit having a waterproof performance improving type and an LED lighting apparatus including the same. More particularly, the present invention relates to a waterproof packing An improved type LED lighting unit and an LED lighting device including the same.

LED lighting is suitable for the green industry because it is lightweight, has no deterioration in initial lightness, is environment-friendly without any harmful substances, and has no change in illumination depending on ambient temperature. LED lighting is replacing incandescent and fluorescent lamps with low power consumption and semi-permanent lifetime.

In particular, demand for LED street lamps, LED security lamps, and LED tunnels is growing due to the rapid expansion of road networks and eco-friendly policies. In addition, LED street light, LED security light, and LED tunnel light source functions, as well as the value of formability in the city landscape is increasing.

However, conventional LED street lamps, LED security lamps, and LED tunnels are insufficient in waterproof and heat dissipation characteristics, and thus are not sufficiently expanding the market demand.

In this connection, Korean Patent Registration No. 916113 discloses an LED street light. Patent Document No. 916113 discloses an LED streetlight in which an LED mounted glass is installed in a housing and two or more LEDs are installed at different illumination angles in a housing, and a PCB having an LED mounted on a lamp mount, One or more LED lamp modules which are closely attached to at least two or more irradiation angles and are treated as a single bundle; And a housing in which at least one module installation unit for installing the LED lamp module in a heat exchangeable manner is provided.

Korean Patent No. 916113 discloses a lens packing between an LED lamp module and a light-transmitting cover. Although not shown in detail in Patent Document 916113, conventional LED street lamps use silicon potting, cable glands, special waterproof packing, etc. to protect the holes of the heat sink through which the power line passes.

That is, the conventional LED streetlight has a separate waterproof structure including a waterproof packing and a waterproof packing for a power line in order to improve the waterproof performance of the lens, and the weight, material cost and workload of the LED lighting fixture increase.

In addition, Japanese Patent Publication No. 916113 has a problem in that it can not prevent the condensation phenomenon due to the condensation of moisture penetrating into the space by forming an unnecessary space between the LED lamp module and the transparent cover. The unnecessary space described above causes a decrease in the heat radiation efficiency of the LED lamp through the projection cover.

On the other hand, Korean Patent Registration No. 1742705 discloses an LED illumination lamp. Japanese Patent Application Laid-Open No. 1742705 discloses a first LED module, a second LED module, and a third LED module, each of which includes a plurality of heat dissipation fins and is continuously arranged along the front-rear direction; A contact plate extending from the upper end of the insertion slot in the front-rear direction and the left-right direction, and a contact plate extending from the insertion slot or the upper side of the contact plate A first heat dissipation auxiliary kit including a first heat dissipation auxiliary kit including a first heat dissipation auxiliary kit and a second heat dissipation auxiliary kit; And an upper cover that shields the first LED module, the second LED module, and the third LED module from the heat dissipation fin side and is in contact with the elastic deformation portion while being separated from the heat dissipation fin, wherein the contact plate includes a first LED module and a third LED module And contact with the upper end of the radiating fin of the second LED module which is in contact with the upper end of the radiating fin and is not inserted into the insertion slot.

Japanese Patent No. 1742705 discloses that the conventional dense LED standard module is difficult to dissipate smoothly and a temperature difference between LED modules occurs (for example, a temperature difference between the LED at the center of the module and the LED for the outside is 14 ° C or more) It is possible to increase the overall heat dissipation efficiency of the LED module even when the LED module is densely packed in a limited space inside the illuminating lamp mechanism and to reduce the temperature difference between the LED modules, There is an advantage that it is possible to solve the problems such as deterioration of life of module and occurrence of defective lighting.

However, since Patent Document 1742705 solves the above problem by installing additional components such as the first heat dissipation auxiliary kit, the second heat dissipation auxiliary kit, and the insertion plug, the weight, material cost, I can not solve the problem.

Korean Registered Patent No. 916113 (Registered on August 31, 2009) Korean Registered Patent No. 1742705 (Registered on May 27, 2017)

It is an object of the present invention to provide a waterproof packing for a lens and a waterproof packing for a power supply that is capable of securing a sufficient waterproof performance while avoiding a dual structure of a waterproof packing for a lens and a waterproof packing for a power supply, And to provide an LED lighting unit including the LED lighting unit.

According to an aspect of the present invention, there is provided a display device comprising: a circuit board on which a plurality of LEDs are mounted on a front surface and to which a power line is connected; A heat sink coupled to the front surface of the circuit board and having a power passage hole; A lens that transmits the light of the LED and is coupled to the front surface of the heat sink; And a waterproof packing interposed between the lens and the heat sink, wherein the waterproof packing comprises: a substrate packing part pressed by the lens and the heat sink from the outside of the circuit board; And a power supply packing part extending from the substrate packing part and inserted into the power supply hole from the outside of the circuit board.

And a plurality of waterproof protrusions protruding toward the lens and the heat sink are respectively formed on both sides of the substrate packing part.

Wherein the power passage hole comprises: a first passage hole formed in a front surface of the heat sink; And a second through hole connected to the first through hole and formed on a rear surface of the heat sink, wherein the power source packing portion includes: an insertion portion formed with an annular projection pressed on an inner surface of the first through hole; And a passing portion passing through the second through hole and having an annular latching portion engaged with the rear surface of the heat sink.

Wherein the lens and the heat sink are coupled by a bolt, a through hole through which the bolt passes is formed in a portion of the substrate packing portion where the power supply packing extends, and a front surface So that the latching portion can be formed.

Wherein the waterproof packing includes a heat dissipation unit connected to the substrate packing unit and the power supply packing unit and covering a front surface of the circuit board, wherein the heat of the circuit board is transferred from the heat dissipation unit through the substrate packing unit and the power- And may be conducted to the heat sink.

Wherein a pressing portion for pressing the circuit board with the heat sink is projected from the rear surface of the lens, the heat releasing portion is pressed by the rear surface of the lens and the front surface of the circuit board, And the circuit board is brought into close contact with the front surface of the heat sink by elastic recovery force of the heat dissipation unit.

The heat sink includes: a body having the circuit board coupled to the front surface and having inlet holes through which outdoor air flows into both ends; A plurality of radiating fins protruding from a rear surface of the body; And a plurality of radiating ribs protruding from a rear surface of the body and connecting the plurality of radiating fins. The length of the radiating ribs protruded from the rear surface of the body may be gradually decreased as the radiating ribs are closer to the inflow holes. .

The heat radiating ribs may connect the plurality of radiating fins in a direction perpendicular to an imaginary line connecting the inlet holes to each other and a plurality of heat radiating spaces partitioned from each other in the imaginary line direction may be formed behind the body.

The radiating fin may be formed to have a rhombic cross-section in a direction perpendicular to the projecting direction.

The LED may be mounted on the front surface of the circuit board at a shortest distance from the radiating fin and the radiating rib.

According to the present invention, the object is achieved by a waterproof performance-enhanced LED illumination unit; And a housing to which the LED illumination unit is coupled and coupled to the external structure.

According to the present invention, since the waterproof packing includes the substrate packing portion and the power supply packing portion, sufficient waterproof performance can be secured while breaking away the dual structure of the waterproof packing for lenses and the waterproof packing for power supply, And an LED lighting unit including the LED lighting unit.

In addition, the length of the heat radiating ribs protruding from the rear surface of the body is gradually decreased as the heat radiating rib is closer to the inflow hole, thereby improving the heat radiation performance by changing the structure of the heat sink, and an LED lighting unit . ≪ / RTI >

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a waterproof performance-improving LED lighting device according to an embodiment of the present invention; FIG.
Fig. 2 and Fig. 3 are perspective views of a waterproof performance-improving LED lighting unit of the waterproof performance-improving LED lighting device of Fig.
4 is an exploded perspective view of the waterproof performance improvement type LED lighting unit of Fig. 2;
5 is a cross-sectional view of the waterproof performance-enhancing LED illumination unit of Fig. 2;
Figs. 6 and 7 are partial cross-sectional views of the waterproof performance-enhancing LED illumination unit of Fig. 2;
Fig. 8 is a bottom view of the waterproof performance improvement type LED lighting unit of Fig. 2; Fig.
Fig. 9 is a side view of the waterproof performance improvement type LED lighting unit of Fig. 2; Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, the well-known functions or constructions are not described in order to simplify the gist of the present invention.

INDUSTRIAL APPLICABILITY The LED lighting unit of the waterproof performance improving type of the present invention and the LED lighting apparatus including the LED lamp of the present invention are capable of securing sufficient waterproof performance while avoiding the dual structure of the waterproof packing for a lens and the waterproof packing for a power supply, And the heat dissipation performance is improved by changing the structure of the heat sink.

FIG. 1 is a perspective view of a waterproof performance improvement type LED lighting apparatus according to an embodiment of the present invention, FIGS. 2 and 3 are perspective views of a waterproof performance improvement type LED lighting unit of the waterproof performance improvement type LED lighting apparatus of FIG. 1, FIG. 4 is an exploded perspective view of the waterproof performance improvement type LED lighting unit of FIG. 2, FIG. 5 is a sectional view of the waterproof performance improvement type LED lighting unit of FIG. 2, FIG. 8 is a bottom view of the waterproof performance improvement type LED lighting unit of FIG. 2, and FIG. 9 is a side view of the waterproof performance improvement type LED lighting unit of FIG.

As shown in FIG. 1, the waterproof performance-improving LED lighting device 1 of the present invention is designed to ensure sufficient waterproof performance while breaking away from a dual structure of a waterproof packing for a lens and a waterproof packing for a power source, 10 and a housing 20. As shown in Fig.

The housing 20 is coupled to an external structure (not shown), and a power supply unit (not shown) may be installed therein. The power supply unit supplies power to the circuit board 100 through a power line C to be described later. The above-mentioned external structure means an arm in the case of a streetlight.

The housing 20 in which the LED illumination unit 10 is installed in a street lamp, a security lamp, or a tunnel is manufactured in various forms other than the one shown in FIG. 1 .

1 to 4, the lighting unit 10 has a structure in which light emitting and heat radiation functions are assembled in a module to be mounted on a housing 20 such as a street lamp, a security lamp, and a tunnel, , A heat sink (200), a lens (300), and a waterproof packing (400).

Hereinafter, in order to facilitate understanding of the present invention, the direction in which the light of the LED L is irradiated, that is, the lower side is referred to as forward and the lower side is referred to as the front. In the drawings, the upper side will be referred to as the rear side, and the upper side will be referred to as the rear side.

As shown in FIGS. 4 and 5, the circuit board 100 has a structure in which a plurality of LEDs L are mounted on a front surface thereof, and is manufactured in the form of a square plate. A connector T to which a power line C is connected is provided on a front surface of the circuit board 100.

4 and 5, the heat sink 200 includes a body 210, a heat dissipating fin 220, and a heat dissipating rib 230 to radiate thermal energy of the LED L into the air. do.

The body 210 has a structure in which the circuit board 100 is coupled to the front surface, and is formed in a substantially square plate or block shape. A heat radiation sheet (SH) or a grease may be interposed between the rear surface of the circuit board (100) and the front surface of the body (210).

4, a power passage hole 213 through which the power line C is passed is formed in the body 210. As shown in FIG. And the power line C enters forward from the rear of the body 210 through the power passage hole 213. The power passage hole 213 includes a first passage hole 213A and a second passage hole 213B.

The first through hole 213A is formed on the front surface of the body 210 and the second through hole 213B is formed on the rear surface of the body 210. [ The first through hole 213A and the second through hole 213B are connected to each other. The second through hole 213B is formed to have a smaller diameter than the first through hole 213A and a step is formed between the first through hole 213A and the second through hole 213B .

4 and 5, a wall portion 212 and a pressing protrusion 215 are formed on the front surface of the body 210. As shown in FIG. The wall portion 212 forms a flow boundary of the lens 300 and the edge portion of the lens 300 coupled with the bolt B to the body 210 is in close contact with the inner surface of the wall portion 212. The body 210 is formed with a coupling hole 216 through which the lens 300 is coupled with the bolt B.

The pressing protrusion 215 protrudes from the front surface of the body 210 and forms a boundary between the substrate packing part 410 and the heat dissipating part 430 Thereby pressing the boundary portion.

At both ends of the body 210, a mounting portion 211 to be coupled to the housing 20 is formed. The mounting portion 211 is coupled to the housing 20 through a screw (not shown). The mounting portion 211 is formed with a mounting hole 211A into which a screw is inserted.

1, the heat sink 200 is screwed to the housing 20 in a state in which the lid 21 is placed on the front surface of the mounting portion 211. As shown in FIG. As shown in FIG. 5, the mounting portion 211 is formed with an inflow hole 214 through which outside air flows. The outside air passes through the gap formed in the lid 21 and flows into the radiating fin 220 through the inflow hole 214.

5 and 8, the heat dissipating fin 220 and the heat dissipating rib 230 are configured to discharge the heat energy of the LED L conducted through the body 210 into the air, And protrudes from the rear in a plurality of directions. The plurality of radiating fins 220 are arranged in a matrix form with reference to a virtual line N (see FIG. 4) connecting the inlet holes 214 and a direction perpendicular thereto (hereinafter referred to as 'perpendicular direction').

5 and 8, the LEDs L are mounted on the front surface of the circuit board 100 at the shortest distance from the heat radiating fins 220 and the heat radiating ribs 230. The heat energy of the LED L is conducted from the body 210 to the heat dissipating fin 220 and the heat dissipating rib 230 at the shortest distance and is rapidly discharged into the air.

The heat dissipating ribs 230 connect the plurality of heat dissipating fins 220 in the perpendicular direction. A plurality of heat dissipating spaces A partitioned from each other in the direction of the imaginary line N are formed by the heat dissipating ribs 230 at the rear of the body 210. [ In Fig. 5, the dotted line indicates the height of the heat dissipating space A.

5 and 9, the length of the heat dissipating rib 230 protruding from the rear surface of the body 210 gradually decreases as the distance from the inlet hole 214 increases. That is, the heat capacity and the surface area of the heat dissipating rib 230 increase stepwise as the distance from the inflow hole 214 increases.

The thermal energy of the LEDs L and the circuit board 100 is not concentrated in the central portion of the body 210 but rapidly moves to the heat dissipating fins 220 and the heat dissipating ribs 230 remote from the inflow holes 214, .

1 and 5, hot air rising from the heat dissipation space A is lifted and discharged to the outside through a hole (not shown) formed in the upper portion of the housing 20. The outside air flows into the rear of the body 210 through the gap between the cover 21 and the LED illumination unit 10.

The external air (hereinafter, referred to as 'first inflow air') flowing into the rear of the body 210 through the gap between the cover 21 and the LED illumination unit 10 from both right angle directions is perpendicular to the heat dissipation space A Direction into the heat dissipating space A through both openings.

5, the air (hereinafter, referred to as 'second inflow air') flowing through the inflow hole 214 flows along the upper portion of the heat dissipating rib 230, which gradually increases from the inflow hole 214, 220 and the heat dissipating ribs 230 and then discharged to the outside through holes (not shown) formed in the upper portion of the housing 20. [

As shown in FIG. 8, the radiating fin 220 forms a rhombic cross section in a direction perpendicular to the projecting direction. Accordingly, the heat dissipation fin 220 forms a flow direction and an inclined surface of the first inflow air and the second inflow air, thereby enabling smooth flow of the first inflow air and the second inflow air.

4 to 7, the lens 300 is configured to transmit the light of the LED L and is coupled to the front surface of the body 210 by the bolt B. As shown in FIG. The lens 300 has a plurality of holes 301 through which the bolts B are inserted. 6 and 7, a pushing part 310 for pushing the front surface of the circuit board 100 to the body 210 is protruded from the rear surface of the lens 300 around the LED (L).

As shown in FIGS. 4 to 7, the waterproof packing 400 is interposed between the lens 300 and the heat sink 200 as a unitary structure of the packing for the lens and the packing for the power supply. The waterproof packing 400 includes a substrate packing part 410, a power supply packing part 420, and a heat dissipation part 430.

The substrate packing part 410 is configured to pack the space between the lens 300 and the heat sink 200 and is formed along the edge of the waterproof packing 400. The substrate packing part 410 is pressed by the rim of the lens 300 and the front surface of the body 210 from the outside of the circuit board 100. In the substrate packing part 410, a plurality of through holes 412 through which the bolts B pass are formed.

4, 6, and 7, a plurality of waterproof protrusions 411 protruding toward the rear surface of the lens 300 and the front surface of the body 210 are formed on both surfaces of the substrate packing part 410 . The plurality of waterproof protrusions 411 block the infiltration of outside air through the space between the lens 300 and the body 210 in a multi-stage barrier structure.

4 and 7, the power supply packing part 420 is configured to pack between the power supply through hole 213 and the power supply line C and is extended from the substrate packing part 410 to be connected to the circuit board 100 Through the power passage hole 213 at the outer side. The power supply packing part 420 includes an inserting part 421 and a passing part 422.

A strain relief may be mounted on the end of the power line C. At this time, the power line C is inserted into the power passage hole 213 through the strain relief R. The power supply packing part (420) packs the power supply hole (213) and the strain relief (R). The strain relief R is a well-known technique in the field of lighting equipment, and therefore a detailed description thereof will be omitted.

As shown in Figs. 4 and 7, the insertion portion 421 is formed to have a larger diameter than the passing portion 422, and is configured to pack the first relief hole 213A and the strain relief R therebetween.

An annular projection 421A is formed on the outer surface of the insertion portion 421 so as to be pressed against the inner surface of the first passage hole 213A. The annular protrusions 421A may be formed in plural. The plurality of annular protrusions 421A intercept the infiltration of external air through the first passage hole 213A and the strain relief R in a multi-stage partition structure.

The passage portion 422 is configured to pack between the second passage hole 213B and the strain relief R and has an annular engaging portion 422A formed on the outer surface thereof to be engaged with the rear surface of the body 210. [ The power supply packing part 420 is inserted into the power supply hole 213 at the front surface of the body 210. At this time, in a state where the insertion portion 421 is caught by the latching jaw in the insertion direction, the annular latching portion 422A is caught by the rear surface of the body 210 in the direction opposite to insertion,

7, a through hole 412 is formed in a portion of the substrate packing part 410 where the power supply packing part 420 extends (hereinafter referred to as an 'extended part'). A front engaging portion is formed around the insertion portion 421 so as to be engaged with the front surface of the body 210. Therefore, there is an advantage that the rear surface of the front surface engaging portion is completely brought into close contact with the front surface of the body 210 in a state in which the extension portion is firmly pressed by the rim portion of the lens 300 and the front surface of the body 210.

4 to 7, the heat dissipation unit 430 covers the entire surface of the circuit board 100 and is connected to the substrate packing unit 410 and the power supply packing unit 420, respectively. A light source hole 431 through which the LED L is exposed and a wiring hole 432 through which the connector T and the power line C are exposed are formed in the heat dissipation unit 430.

6 and 7, the heat dissipating unit 430 is interposed between the rear surface of the lens 300 and the front surface of the circuit board 100, and is pressed by the lens 300 and the circuit board 100 . Accordingly, the circuit board 100 firmly maintains the state of being closely adhered to the front surface of the body 210 due to the elastic recovery force of the heat dissipation unit 430. [

The heat dissipation unit 430 maintains the state of being pressed by the rear surface of the lens 300 and the front surface of the circuit board 100 and thus clears the gap between the rear surface of the lens 300 and the front surface of the circuit board 100 The condensation phenomenon between the lens 300 and the circuit board 100 is blocked.

As the heat dissipation unit 430 is kept pressed by the rear surface of the lens 300 and the front surface of the circuit board 100, the heat of the circuit board 100 is transferred from the heat dissipation unit 430 to the substrate packing unit 410 And is then conducted to the heat sink 200 through the power supply packing part 420 and smoothly conducted from the heat dissipating part 430 to the lens 300. Therefore, there is an advantage that the thermal energy of the LED (L) is rapidly discharged into the air.

According to the present invention, since the waterproof packing includes the substrate packing portion and the power supply packing portion, sufficient waterproof performance can be secured while breaking away the dual structure of the waterproof packing for lenses and the waterproof packing for power supply, And an LED lighting unit including the LED lighting unit.

In addition, the length of the heat radiating ribs protruding from the rear surface of the body is gradually decreased as the heat radiating rib is closer to the inflow hole, thereby improving the heat radiation performance by changing the structure of the heat sink, and an LED lighting unit . ≪ / RTI >

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is obvious to those who have. Accordingly, it should be understood that such modifications or alterations should not be understood individually from the technical spirit and viewpoint of the present invention, and that modified embodiments fall within the scope of the claims of the present invention.

1: Lighting fixture
10: Lighting unit
100: circuit board 300: lens
L: LED 310:
C: Power line 400: Waterproof packing
T: connector 410: substrate packing portion
SH: Heat-radiating sheet 411: Water-
R: relief 412: through hole
200: heat sink 420: power source packing part
210: body 421:
211: mounting portion 421A: annular projection
211A: mounting hole 422:
212: wall portion 422A: annular engagement portion
213: power passage hole 430:
213A: first through hole 431: light source hole
213B: second through hole 432: wiring hole
214: inlet hole B: bolt
N: virtual line 20: housing
215: pressing projection 21: cover
216: Coupling hole
A: Heat dissipation space
220: heat sink fin
230: heat radiating rib

Claims (11)

A circuit board on which a plurality of LEDs are mounted on a front surface and to which a power line is connected;
A heat sink coupled to the front surface of the circuit board and having a power passage hole;
A lens that transmits the light of the LED and is coupled to the front surface of the heat sink; And
And a waterproof packing interposed between the lens and the heat sink,
The waterproof packing
A substrate packing part pressed by the lens and the heat sink from the outside of the circuit board; And
And a power supply packing portion extending from the substrate packing portion and inserted into the power supply through hole from the outside of the circuit board,
Wherein the waterproof packing includes a heat radiating portion connected to the substrate packing portion and the power source packing portion and covering a front surface of the circuit board,
And the heat of the circuit board is conducted to the heat sink through the substrate packing part and the power source packing part in the heat radiating part. The method according to claim 1,
And a plurality of waterproof protrusions protruding toward the lens and the heat sink are formed on both sides of the substrate packing part. The method according to claim 1,
The power-
A first passage hole formed in the front surface of the heat sink; And
And a second through hole connected to the first through hole and formed on a rear surface of the heat sink,
The power-
An insertion portion formed with an annular projection pressed on an inner surface of the first passage hole; And
And a passing portion passing through the second through hole and having an annular latching portion engaged with a rear surface of the heat sink. The method of claim 3,
The lens and the heat sink are bolted together,
Wherein the substrate packing portion is provided with a through hole through which the bolt passes at a portion where the power supply packing portion extends,
And a front engaging portion formed on a front surface of the heat sink is formed around the inserting portion. delete The method according to claim 1,
A pressing portion for pressing the circuit board to the heat sink is protruded from the rear surface of the lens,
The heat dissipating unit is pressed by the rear surface of the lens and the front surface of the circuit board,
The heat of the circuit board is conducted from the heat radiation portion to the lens,
Wherein the circuit board is brought into close contact with the front surface of the heat sink by elastic recovery force of the heat dissipation unit. The method according to claim 1,
The heat sink
A body coupled to the front surface of the circuit board and having inlet holes through which outdoor air flows into both ends;
A plurality of radiating fins protruding from a rear surface of the body; And
And a plurality of heat dissipating ribs protruding from a rear surface of the body and connecting the plurality of heat dissipating fins,
Wherein a length of the heat radiating rib protruding from a rear surface of the body is gradually decreased as the temperature of the heat radiating rib is closer to the inflow hole. 8. The method of claim 7,
Wherein the heat radiating ribs connect the plurality of radiating fins in a direction perpendicular to a virtual line connecting the inlet holes to each other,
And a plurality of heat radiation spaces partitioned from each other in the virtual line direction are formed in the rear of the body. 8. The method of claim 7,
Wherein the radiating fin forms a rhombic cross section in a direction perpendicular to the projecting direction. 8. The method of claim 7,
Wherein the LED is mounted on a front surface of the circuit board at a shortest distance position from the heat radiating fin and the heat radiating rib. A waterproof performance improvement type LED lighting unit according to claim 1; And
And a housing coupled with the LED lighting unit and coupled to the external structure.

Images