KR101824802B1 - Forced heat dissipation type LED lights using thermoelectric element - Google Patents

Abstract

The present invention relates to a forced heat dissipation type LED lighting using a thermoelectric element, and more particularly, to a heat dissipation type LED lighting using a thermoelectric element, and more particularly, to a heat dissipation type LED lighting device using a thermoelectric element and a heat sink, To a forced heat dissipation type LED lighting using a thermoelectric element such that the temperature of the LED lighting can be maintained at an optimal temperature for driving the heat of the LED lighting by heat dissipation through a heat sink.
To this end, a forced heat dissipative LED lighting using a thermoelectric device according to the present invention includes an LED module and a heat sink formed behind the LED module and absorbing heat from the LED module, And a thermoelectric element is formed between the heat sink and the heat sink to absorb heat from the LED module to control the temperature of the LED module.

Description

Forced heat dissipation type LED lights using thermoelectric element [

The present invention relates to a forced heat dissipation type LED lighting using a thermoelectric element, and more particularly, to a heat dissipation type LED lighting using a thermoelectric element, and more particularly, to a heat dissipation type LED lighting device using a thermoelectric element and a heat sink, To a forced heat dissipation type LED lighting using a thermoelectric element such that the temperature of the LED lighting can be maintained at an optimal temperature for driving the heat of the LED lighting by heat dissipation through a heat sink.

In general, an illumination light is used to convert electric energy into light energy to provide light for identifying an object at night, indoors, outdoors, or an enclosed space. Recently, illumination has been used for interior decoration or various colors Until now, incandescent lamps, fluorescent lamps, halogen lamps, mercury lamps, sodium lamps, metal halides, etc. have been used as illumination lamps.

However, incandescent lamps have a short life span, low luminous efficiency, high luminance, glare to the user and much heat.

In addition, fluorescent lamps have higher energy efficiency than incandescent lamps, resulting in lower power consumption, but have a longer lighting standby time and short life span.

In addition, sodium, mercury lamps, metal halides, etc. have high power consumption, can cause glare, and have a short life span.

Recently, an illumination lamp using a light emitting diode (LED) that has a semi-permanent lifetime, low power consumption, and high efficiency can be obtained due to the above-mentioned problems, and has been widely used for various purposes.

Here, LED lighting has advantages such as high processing speed and low power consumption, and it is increasingly used because it is environment-friendly and has high energy efficiency.

In addition, LED lighting lamps have a 60 ~ 80% power saving compared to general lighting lamps and have a semi-permanent lifetime of 50,000 hours or more.

However, since the LED lighting lamp is used by mounting one LED on a printed circuit board or by mounting several LEDs, the heat generated by the LED lighting lamp is large, The efficiency is lowered. If such a state is maintained for a long time, the lifetime is shortened or broken.

In order to solve the above problems, Korean Registered Patent No. 10-1257283 (hereinafter referred to as "Prior Art Document 1") discloses "a heat radiator of LED lighting lamp".

Prior Art 1 discloses a heat sink having a heat sink provided on an upper surface of an LED module and having a first radiating fin and a second radiating fin; An upper case located above the heat sink and receiving the heat sink; A lower case coupled to the upper case to form an internal space in which the heat sink is received; And a packing is inserted between the upper case and the lower case to be screwed together.

In this prior art reference 1, heat generated in the LED module can be dissipated through contact with outside air through the heat-radiating fins of the heat sink, and two heat dissipation can be performed through the case by directly contacting some heat dissipating fins with the case It is possible to extend the lifetime of the LED lighting lamp and to reduce the maintenance cost of the LED lighting lamp because it does not use any other mechanical cooling element such as the cooling fan have.

However, in the prior art document 1, the heat energy dissipated through the first radiating fins is restricted to the outside due to the upper case, so that even when the thermal energy is collected in the upper case, the heat dissipation through the first radiating fin is limited. There is a problem that the LED module which can not be discharged is damaged.

Further, since the heat sink is formed only of metal, there is a problem that the cost becomes excessive.

Further, since the driving temperature of the LED lighting lamp can not be adjusted according to the surrounding environment, there is a problem that the LED lighting lamp may be damaged.

Prior Art 1: Korean Patent Registration No. 10-1257283

SUMMARY OF THE INVENTION The present invention has been conceived to solve the above problems, and it is an object of the present invention to provide a forced heat dissipative LED illumination using a thermoelectric element, The temperature of which can be adjusted to a desired temperature.

Another object of the present invention is to provide a device capable of improving the durability and reducing the manufacturing cost by reducing the weight of the heat sink that discharges heat while maintaining its performance.

According to an aspect of the present invention, there is provided an LED light including an LED module and a heat sink formed behind the LED module and absorbing heat from the LED module, And a thermoelectric element is formed between the LED module and the heat sink so that the temperature of the LED module can be adjusted by forcibly absorbing heat from the LED module.

In addition, a module unit for integrating the thermoelectric element and the LED module is formed in the thermoelectric element so that heat transfer with the LED module can smoothly proceed.

A unit for sealing the thermoelectric element in a state in which the heat sink and the thermoelectric element are in contact with each other is formed in the thermoelectric element so that damage to the thermoelectric element is not caused by condensation caused by a temperature difference between the thermoelectric elements .

The thermoelectric element is further provided with a switch for changing a direction of a current flowing through the thermoelectric element so that the thermoelectric element can absorb heat or dissipate heat from the LED module.

The heat sink is formed of a plastic material so that the heat sink can be lightened while maintaining the heat radiation performance, and the heat sink is metal plated to conduct heat to the outer surface of the heat sink.

Further, the heat sink is plated with copper having a high thermal conductivity.

The heat sink may include a heat dissipation block in contact with the thermoelectric element, a plurality of heat dissipation fins slidably coupled to the heat dissipation block to discharge heat transferred from the thermoelectric element, Is slidably coupled in a parallel direction to the structure of the groove, and is not separable in the vertical direction.

In addition, a heat dissipation fan is formed outside the heat dissipation fin so as to move air between the heat dissipation fins to improve efficiency and performance of heat dissipation.

The heat dissipation block includes a heat pipe which is vertically bent so that heat can be efficiently transmitted to the heat dissipation fin and the upper and lower portions thereof are coupled through the heat dissipation block and the heat dissipation fin, respectively.

The heat pipe coupled to the heat dissipation block is exposed to the outside of the heat dissipation block to be in contact with the thermoelectric device so that heat can be effectively transferred from the thermoelectric device.

The heat pipe coupled to the heat releasing pin may be provided in a region of the heat releasing pin where the heat releasing pin is not positioned so that the heat transferred from the thermally conductive element can be totally transferred to the heat releasing pin. do.

In addition, a circulation fan is formed in the end portion of the heat pipe so as to circulate the air inside the heat pipe and to dissipate heat and heat.

Further, the LED module is characterized in that the auxiliary battery is formed so that the main battery can be operated even when the main power source is cut off during a power failure or an emergency.

In addition, the auxiliary battery is characterized in that a solar cell is formed so as to be charged through sunlight.

According to the present invention having the above-described characteristics, the forced heat-dissipative LED illumination using the thermoelectric element includes a thermoelectric element, so that the heat generated from the LED module can be rapidly dissipated. As a result, It is possible to prevent shortening of the service life.

Further, by applying a module unit that integrates the thermoelectric element and the LED module, heat transfer between the thermoelectric element and the LED module can be rapidly performed.

Further, by applying a unit for sealing the thermoelectric element in a state where the thermoelectric element and the heat sink are in contact with each other, it is possible to prevent damage to the thermoelectric element due to condensation caused by temperature difference between both surfaces of the thermoelectric element .

Further, by applying a switch for changing the flow of current flowing through the thermoelectric element, the temperature of the LED module can be adjusted to a temperature optimum for operation of the LED module by absorbing or dissipating heat from the LED module through the thermoelectric element.

Further, the material of the heat sink is made of a plastic material, and its outer surface is plated with copper, so that the heat conduction performance is maintained while being lightweight, thereby reducing maintenance and durability.

Also, by applying the heat pipe coupled through the heat dissipation block and the heat dissipation fin, heat transfer from the heat dissipation block to the heat dissipation fin can be more effectively transmitted.

Further, by applying the auxiliary battery to the LED module, there is an effect that the main battery can be operated without interruption even if the main power source is cut off during a power failure or an emergency.

Further, by applying the solar cell to the auxiliary battery, there is an effect that even if the main power source is cut off during a power failure or emergency, it is operated for a long period of time.

1 is a perspective view showing a forced heat-dissipating LED lighting using a thermoelectric element according to the present invention;
FIG. 2 is a bottom perspective view showing a forced heat dissipative LED lighting using the thermoelectric element of FIG.
Fig. 3 is an exploded perspective view showing a forced heat-dissipating LED lighting using the thermoelectric element shown in Fig.
Fig. 4 is a cross-sectional view showing the coupling relationship of the thermoelectric elements of Fig. 3
Fig. 5 is a perspective view showing the heat sink of Fig.
FIG. 6 is an exploded perspective view showing the heat sink of FIG.
7 is a perspective view showing the heat dissipation block of Fig.
8 is a perspective view showing the heat releasing pin of Fig.
Fig. 9 is a schematic view showing the heat pipe of Fig. 6
Fig. 10 is a front view showing the heat sink of Fig. 5
11 is a plan view showing the heat sink of Fig. 5
12 is a detailed view showing the operation of the switch of Fig.

The term used in the present invention is a general term that is widely used at present. However, in some cases, there is a term selected arbitrarily by the applicant. In this case, the term used in the present invention It is necessary to understand the meaning.

Hereinafter, the technical structure of the present invention will be described in detail with reference to preferred embodiments shown in the accompanying drawings. Here, it should be noted that the expressions related to the directions of up and down, left and right, right, left, and bottom are all described based on the drawings.

The forced heat-dissipating LED illumination using the thermoelectric device according to the present invention forcibly absorbs heat generated from the LED module during the operation of the LED module through the thermoelectric device to control the temperature of the LED module, thereby preventing shortening and damage to the life of the LED module .

1 to 3, the LED module according to the present invention includes a LED module 10, a plurality of LED modules 10, A module unit (30) formed on the thermoelectric element to integrate the thermoelectric element and the LED module so that heat transfer between the thermoelectric element and the LED module can smoothly proceed; A unit 40 for sealing the thermoelectric element in a state in which the heat sink and the thermoelectric element are in contact with each other so that the product is not damaged by the condensation generated by the temperature difference between the both surfaces of the thermoelectric element, And a switch A which is formed on the thermoelectric element and changes the direction of the flowing current of the thermoelectric element.

The LED module 10 is an LED module (light source) mounted on a substrate. Since the LED module 10 is a conventional LED module having a semi-permanent lifetime, low power consumption and high efficiency, do.

The thermoelectric element 20 is a conventional thermoelectric element using a Peltier effect, which is a phenomenon in which heat is generated by endothermic or heat generation due to current, and is a pair of a pair of vidermustelite, antimony alloy, etc., do.

The module unit 30 is configured such that the LED module 10 and the thermoelectric element 20 are fixed in a surface contact state so that the thermoelectric element can be stably and rapidly absorbed from the LED module.

3 and 4, the module unit 30 is formed in a frame shape corresponding to the LED module and the thermoelectric element, so that the LED module and the thermoelectric element are in fluid contact with each other It can be argued that it does not exist.

Further, the module unit locking step 31 is formed at the edge of the module unit, so that the LED module and the thermoelectric element are fixed in the module unit 30 while being wrapped.

The unit 40 is fixed in a state where the thermoelectric element 20 and the heat sink 50 are in surface contact with each other so as to prevent damage to the product due to condensation generated by temperature difference between the both surfaces of the thermoelectric element, And the heat sink can receive heat from the thermoelectric element in a stable and rapid manner.

3 and 4, the unit 40 is formed in a frame shape corresponding to the thermoelectric element and the heat sink, thereby allowing the thermoelectric element and the heat sink to flow in a surface contact state We can prevent it.

At this time, when the thermoelectric element is coupled with the module unit, the unit 40 is formed in a shape corresponding to the module unit, thereby restricting the module unit.

 Further, the unit engaging step 41 is formed at the rim of the unit, so that the thermoelectric element and the heat sink are fixed while being wrapped around the unit 40.

In addition, when the unit is coupled to the heat sink, the heat sink is formed so as to correspond to the shape of the heat sink, so that the unit is not in contact with the thermoelectric element even if condensation is generated.

The heat sink 50 receives heat from the thermoelectric element and dissipates heat quickly.

5 and 6, the heat sink 50 includes a heat dissipation block 51 provided to be in contact with the thermoelectric element 20, and a heat-sliding block 51 slidingly joined to the heat dissipation block 51. [ And a heat pipe 55 formed by bending the heat dissipation fin 53 and having upper and lower ends thereof penetrating through the heat dissipation fin 53 and the heat dissipation block 51, respectively.

7, the heat dissipation block 51 is formed as a hexahedron and is provided in a surface contact with the upper surface of the thermoelectric element, and a mounting groove 511 and a connection groove 513 Or a coupling protrusion 515 is formed.

The mounting groove 511 is a groove having a heat pipe 55 penetrated therethrough. A plurality of mounting grooves 511 are formed on both sides of the lower surface of the heat dissipation block 51. The inner circumferential surface of the mounting groove 511 is formed to have a curvature corresponding to the heat pipe 55 and the lower end of the mounting groove 511 is formed to be opened to the lower surface of the heat dissipation block 110.

A coupling groove 513 or a coupling protrusion 515 parallel to the mounting groove 511 may be formed at the center of the upper surface of the heat dissipation block 51. The coupling groove 513 or the coupling protrusion 515 is a groove or a projection for coupling with the heat releasing pin 53. When the coupling protrusion 532 is formed on the heat releasing pin 53, When the coupling groove 533 is formed in the heat releasing pin 53 and the coupling groove 533 is formed in the heat releasing block 53 in a shape corresponding to the coupling groove 533, And the engaging protrusion 515 is protruded.

The coupling grooves 513 and the coupling protrusions 515 of the heat dissipation block 51 may be formed in various polygonal coupling structures. Due to the various coupling structures, the heat dissipation block 51 and the heat dissipation fin 53 are slidably engaged in a parallel direction (forward and backward directions), and are coupled in a state in which they can not be separated in a vertical direction (vertical direction).

More specifically, the heat dissipation block and the heat dissipation fin are coupled to the heat dissipation block in a vertical direction while being coupled with the protrusion and the groove structure.

Through the combination of the protrusions of the heat dissipation block and the heat dissipation fin and the groove structure, the heat dissipation block and the heat dissipation fin have a mutual coupling force, thereby not only dispersing the load transferred to the heat pipe but also maximizing heat dissipation efficiency .

In addition, when the heat dissipating fin is separated from the heat dissipating fin by the mechanical coupling that slidingly engages with the heat dissipating block while the heat dissipating fin passes through the heat pipe, if any one of the plurality of heat dissipating fins is broken, The pin can be slid and removed from the heat dissipation block and the heat pipe, and then replaced with a new heat dissipation fin.

In addition, since the heat dissipation fin is slidingly coupled to the heat dissipation block while being penetrated by the heat dissipation block, it is possible to replace only the heat dissipation pipe without disassembling the heat dissipation block and the heat dissipation block, There is a maximizing effect.

In the meantime, the latching protrusion 517 is formed on the edge of the heat-radiating block so that the unit is more stably coupled when the unit is coupled.

As shown in FIG. 8, the heat-radiating fin 53 is a thin plate having a plurality of through holes 535 formed at both sides thereof for passing through the heat pipe 55, A bead portion 531 for reinforcing the strength of the heat releasing pin 53 is formed and protruded.

A coupling protrusion 532 or an engagement groove 533 corresponding to the coupling groove 513 or the coupling protrusion 515 of the heat dissipation block 51 described above is formed in the center of the lower surface of the heat dissipation fin 53, May be slidably coupled to the block (110).

The coupling structure between the heat dissipation fin 53 and the heat dissipation block 51 is a dovetail coupling structure in which the coupling protrusions 532 and 515 and the coupling recesses 513 and 533 are movable in the horizontal direction And a coupling structure that can not be separated in the vertical direction is applicable regardless of its shape.

11, the heat dissipation fin 53 may be configured to maximize the heat dissipation performance of the heat dissipation fin through the heat dissipation fin by forming the heat dissipation fan 537 so as to move the air through the gap between the heat dissipation fins have.

9, the heat pipe 55 is formed so as to be connected to the upper and lower portions by a vertical bent portion 553 bent in a "⊃" shape so that the upper portion (hereinafter, referred to as "upper heat pipe" (Hereinafter, referred to as "lower heat pipe") is provided through the heat dissipation block 51. The heat dissipation block 51 may be a heat dissipation block. At this time, the vertical bent portion 553 is inclined obliquely.

The heat pipes 55 are provided on both sides with respect to the bead portion 531 of the central portion of the heat releasing pin 53 and the heat pipes 55 provided on both sides are provided with the upper heat pipe 55 and the lower heat The pipe 55 is formed as one by the vertical bent portion 553.

10, the lower heat pipe 55 of the heat dissipation block 51 is exposed to the outside through the lower surface of the heat dissipation block 51. At this time, A flat portion 551 which is flush with the lower surface of the heat radiating block 51 is formed on the lower heat pipe 55 exposed to the outside. The upper surface of the thermoelectric element 20 is in contact with the lower surface of the heat radiating block 51 and is brought into contact with the flat portion 551 of the lower heat pipe 55 so that the thermoelectric element 20 can have an excellent thermal conductivity.

The upper heat pipe 55 coupled to the heat releasing pin 53 is integrally extended from the lower heat pipe 55 and bent outward so that the heat releasing pin 53, As shown in Fig. Since the heat pipes 55 penetrating the heat dissipation block 51 and the heat dissipation fin 53 are provided at different positions as described above, the heat dissipation block 51 provided at the center of the lower surface of the heat dissipation fin 53 The heat conduction path that can be concentrated only in the central portion of the heat releasing pin 53 is extended to the entire surface of the heat releasing pin 53 through the heat pipe 55,

Meanwhile, a circulation fan 555 for cooling the air is formed at the end of the heat pipe 55 as described above, thereby enhancing the heat radiating effect through the heat pipe.

In addition, the heat dissipation block and the heat dissipation fin except for the heat pipe are made of a plastic material, and the outer surface of the heat dissipation block and the heat dissipation fin are plated with copper, so that the heat conduction performance is maintained and the weight is reduced.

Referring to FIG. 12, the switch A is formed in the thermoelectric element and changes the flow of current flowing in the thermoelectric element, thereby allowing the thermoelectric element to absorb heat from the LED module or dissipate the heat.

Further, the switch A can regulate the amount of endothermic or heat radiation by adjusting the current flow step by step.

Accordingly, the thermoelectric element can maintain an appropriate temperature for driving the LED module, and the LED module can prevent shortening and breakage of life due to overheating or overcooling.

Meanwhile, the LED module and the thermoelectric element can be operated without problems even in an emergency in which electric power such as a power failure or a fire is shut off by connecting an auxiliary battery (not shown) so that the main body of the LED module and the thermoelectric element can operate.

In addition, since the solar cell (not shown) is formed outside the auxiliary battery, it can be used for a long time while being charged through the sunlight even in a disaster such as power failure or fire in which the main power is shut off.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention. Various modifications and variations will be possible without departing from the spirit of the invention. Therefore, the scope of the present invention should be construed as being covered by the scope of the appended claims, and technical scope within the scope of equivalents thereof should be construed as being included in the scope of the present invention.

10: LED module 20: thermoelectric element
30: Module unit 31: Module unit holding jaw
40: Unit 41: Unit jaw chin
50: Heat sink 51: Heat block
53: heat release pin 55: heat pipe

Claims (14)

An LED lighting device including an LED module and a heat sink formed behind the LED module and absorbing heat from the LED module,
A thermoelectric element is formed between the LED module and the heat sink so as to forcibly absorb heat from the LED module to control the temperature of the LED module,
A module unit for integrating the thermoelectric element and the LED module is formed in the thermoelectric element so that heat transfer with the thermoelectric element can smoothly proceed with the thermoelectric element,
Wherein the module unit includes a module unit engaging jaw formed in a rim for enclosing the LED module and the thermoelectric element,
A unit for sealing the thermoelectric element in a state in which the heat sink and the thermoelectric element are in contact with each other is formed in the thermoelectric element so that damage to the product is not caused by condensation caused by a temperature difference between the both surfaces of the thermoelectric element,
Wherein the unit includes a unit holding jaw which is formed at a rim so as to surround the module unit and surround the periphery of the heat sink,
The heat sink is provided with a heat sink A locking jaw is formed,
The heat sink includes a heat dissipation block in contact with the thermoelectric element,
And a plurality of heat-radiating fins slidably coupled to the heat-radiating block to discharge heat transferred from the thermoelectric elements,
The heat dissipation block and the heat dissipation fin are slidably coupled in a parallel direction to the protrusion and the groove structure,
The heat dissipation block includes a heat pipe which is vertically bent so that heat can be effectively transmitted to the heat dissipation fin and the upper and lower portions of the heat dissipation block pass through the heat dissipation block and the heat dissipation fin,
A heat radiating fan is formed on the outside of the heat radiating fin to move air between the heat radiating fin to improve heat efficiency and performance,
A circulation fan is formed in the end portion of the heat pipe so as to circulate the air inside the heat pipe and to be able to radiate heat and heat.
Wherein the thermoelectric element is provided with a switch for changing a direction of a current flowing in the thermoelectric element so that the thermoelectric element can absorb heat or heat from the LED module,
The heat sink is made of a plastic material so that the heat sink can be made lighter while maintaining the heat radiation performance. The heat sink is metal plated so that heat can be conducted to the outer surface of the heat sink,
Wherein the heat pipe coupled to the heat dissipation block is exposed to the outside of the heat dissipation block and is in contact with the thermoelectric device so that heat can be effectively transferred from the thermoelectric device.
delete delete delete delete The method according to claim 1,
Wherein the heat sink is plated with copper having a high thermal conductivity.
delete delete delete delete The method according to claim 1,
Wherein the heat pipe coupled to the heat releasing pin is provided in a region of the heat releasing pin where the heat releasing pin is not positioned so that the heat transferred from the thermally conductive element can be totally transferred to the heat releasing pin. Forced heat type LED lighting using element
delete The method according to claim 1,
Wherein the auxiliary battery is formed on the LED module so that the main battery can be operated even if the main power source is cut off during an electrostatic or emergency situation.
14. The method of claim 13,
And a solar cell is formed on the auxiliary battery so that the auxiliary battery can be charged with solar light.

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