WO2022027470A1 - Puce et procédé de mise sous boîtier de puce et dispositif électronique - Google Patents

Puce et procédé de mise sous boîtier de puce et dispositif électronique Download PDF

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Publication number
WO2022027470A1
WO2022027470A1 PCT/CN2020/107483 CN2020107483W WO2022027470A1 WO 2022027470 A1 WO2022027470 A1 WO 2022027470A1 CN 2020107483 W CN2020107483 W CN 2020107483W WO 2022027470 A1 WO2022027470 A1 WO 2022027470A1
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WO
WIPO (PCT)
Prior art keywords
metal plate
plate area
chip
lead frame
resin
Prior art date
Application number
PCT/CN2020/107483
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English (en)
Chinese (zh)
Inventor
王超宏
Original Assignee
深圳市汇顶科技股份有限公司
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Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2020/107483 priority Critical patent/WO2022027470A1/fr
Publication of WO2022027470A1 publication Critical patent/WO2022027470A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present application relates to the field of semiconductor technology, and in particular, to a chip, a chip packaging method, and an electronic device.
  • 3D imaging can record the distance information between the shooting target object and the camera, and obtain the three-dimensional coordinate information of the shooting target object by modeling the static or dynamic three-dimensional coordinate information of the shooting target object. Therefore, 3D imaging has great application potential in physical recognition, action recognition, scene recognition, etc.
  • active vision system is an imaging technology that uses an independent artificial light source and actively projects it to the observation object to measure the depth of field, such as structured light 3D and TOF. Due to the advanced nature of the system technology, it has been widely used in terminal equipment.
  • VCSEL Vertical-Cavity Surface-Emitting Laser
  • the packaging method of VCSEL is mainly realized by the ceramic substrate, that is, the ceramic substrate package is formed by the ceramic material, and the ceramic substrate has a cavity for accommodating the chip, and the chip is arranged in the cavity. Since the ceramic substrate is an insulator, Drilling holes are usually required at the bottom of the ceramic substrate to realize the connection between the chip and the pins on the outer bottom of the ceramic substrate, and then conduct connection with other devices through the pins.
  • the cost of the ceramic itself is relatively high, and the molding process of the ceramic substrate package is complex and expensive, resulting in high cost of VCSEL chip packaging.
  • the present invention provides a chip, a chip packaging method, and an electronic device, so as to solve the problem of high packaging cost caused by the existing chip packaging method using a ceramic substrate.
  • a first aspect of the present invention is a chip, comprising:
  • the chip body is used to emit light
  • the lead frame includes a first metal plate area and a second metal plate area, and the first metal plate area and the second metal plate area are insulated from each other, and the first metal plate area is used for fixing the chip body and being connected with all the the chip body is electrically connected, and the second metal plate area is used to electrically connect the chip body to an external circuit;
  • a resin bracket fixedly connected to the lead frame and enclosing a receiving cavity with a first opening with the lead frame, the chip body is located in the receiving cavity, and the light emitted by the chip body is directed toward the first opening Open your mouth.
  • the resin bracket includes a first bracket part and a second bracket part, the first bracket part is arranged around the outer peripheral side wall of the lead frame, and the second bracket part is located in the Above the lead frame, the second bracket portion forms a side wall of the accommodating cavity.
  • first bracket part and the second bracket part are integrally formed on the lead frame by means of mold hot pressing.
  • the first bracket part is formed on the lead frame by means of mold hot pressing, and the second bracket part is formed separately from the first bracket part and the lead frame .
  • an adhesive layer is also included, the first bracket portion is formed on the lead frame by means of mold hot pressing, and the second bracket portion is disposed on the lead frame through the adhesive layer. on the lead frame described above.
  • an optical device is also included, at least two opposite sides of the resin support have stepped structures, the optical device is arranged on the stepped structure, and the optical device is located on the chip body Glowing light on the road.
  • the stepped structure or the stepped structure and the adjacent resin support form a second opening
  • the optical device covers the second opening
  • the stepped structure is provided with an exhaust gas
  • the accommodating cavity communicates with the external environment through the exhaust hole.
  • the optical device includes at least a collimating mirror, a diffractive optical element or a diffusing sheet.
  • the optical device includes a collimating mirror and a diffractive optical element, the collimating mirror is located above the chip body, the diffractive optical element is located above the collimating mirror, and the chip The light emitted by the body passes through the collimating mirror and the diffractive optical element in sequence and then exits.
  • the optical device includes a collimating mirror and a diffusing sheet, the collimating mirror is located above the chip body, the diffusing sheet is located above the collimating mirror, and the chip body emits The light is emitted after passing through the collimating mirror and the diffusing sheet in sequence.
  • a photodiode is further included, the photodiode is located in the accommodating cavity, the lead frame further includes a third metal plate area and a fourth metal plate area, and the first metal plate area , the second metal plate area, the third metal plate area and the fourth metal plate area are insulated from each other;
  • the photodiode is disposed on the third metal plate area, and the cathode of the photodiode is in electrical contact with the third metal plate area, and the anode of the photodiode is electrically connected with the fourth metal plate area, so
  • the photodiode is used for detecting the optical power signal emitted by the chip body and outputting it as a feedback signal.
  • the chip body is an infrared laser light-emitting chip
  • the lead frame further includes a fifth metal plate region, the first metal plate region, the second metal plate region, the third metal plate region, the fourth metal plate region, and the fifth metal plate region Areas are insulated from each other;
  • the cathode of the chip body is in electrical contact with the first metal plate area, and the anode of the chip body is electrically connected to the second metal plate area and the fifth metal plate area through metal leads, respectively.
  • the chip body includes a plurality of light-emitting units, the first metal plate area has cathode pads, and the cathodes of the plurality of light-emitting units are in electrical contact with the cathode pads, and the plurality of light-emitting units are in electrical contact with the cathode pads.
  • the anodes of each of the light emitting units are respectively electrically connected to the second metal plate area and the fifth metal plate area through the metal leads.
  • the first metal plate region, the second metal plate region, the third metal plate region, the fourth metal plate region and the fifth metal plate region There is an insulating gap between two adjacent metal plate areas;
  • the resin bracket further includes a filling part, and the filling part is filled in the insulating gap.
  • the first metal plate area, the second metal plate area, the third metal plate area, the fourth metal plate area and the fifth metal plate area are far away from all the
  • the lateral cross-sectional shape of the outer sidewall of one end of the chip body is zigzag.
  • the sawtooth shape is composed of a plurality of sawtooth shapes, and the shape of the sawtooth at least includes one or more of a square, a triangle, a fan, and a trapezoid.
  • the wavelength of the emitted light of the chip body is 780nm-3000nm;
  • the molding material of the resin bracket includes black thermosetting resin.
  • the material of the resin support includes at least one of silica, carbon black, epoxy resin, hardener, and catalyst.
  • a second aspect of the present invention provides a chip packaging method, the method comprising:
  • a lead frame and a chip body are provided, the lead frame includes a first metal plate area and a second metal plate area, and the first metal plate area and the second metal plate area are insulated and arranged;
  • a resin bracket is formed on the lead frame, the resin bracket is fixedly connected with the lead frame, and forms a receiving cavity with a first opening with the lead frame;
  • the chip body is electrically connected to the second metal plate area.
  • the resin bracket includes a first bracket part and a second bracket part
  • the forming the resin bracket on the lead frame includes:
  • a first mold is provided, the first mold including opposing upper and lower molds enclosing a cavity for accommodating the lead frame, the upper mold facing the lower mold
  • One end of the mold has a flat portion and a groove portion surrounding the outer periphery of the flat portion, and the end face of the lower mold facing the upper mold is a flat surface;
  • the lead frame is located in the cavity, the lead frame is sandwiched between the flat portion and the flat surface, and the groove portion is located on the outer periphery of the lead frame;
  • the resin is injected into the first mold and molded, the resin located on the outer peripheral side wall of the lead frame forms the first bracket part, and the resin located in the groove part forms the second bracket part; demolding.
  • the resin bracket includes a first bracket part and a second bracket part
  • the forming the resin bracket on the lead frame includes:
  • a first mold is provided, the first mold including opposing upper and lower molds enclosing a cavity for accommodating the lead frame, the upper and lower molds
  • the opposite end face is a flat face
  • the lead frame is positioned in the cavity, the lead frame is sandwiched between the flat surfaces, a resin is injected and molded in the first mold, and the resin on the outer peripheral side wall of the lead frame forms the Describe the first bracket part, demoulding;
  • a second mold is provided, the second mold has a groove at a position corresponding to the outer periphery of the lead frame, a resin is injected into the second mold and molded, and the second bracket portion is formed by demolding;
  • the second bracket portion is provided on the lead frame.
  • the disposing the second bracket portion on the lead frame includes:
  • the second bracket portion is bonded to the lead frame.
  • the forming a resin bracket on the lead frame further includes: forming a stepped structure on at least two opposite sides of the resin bracket;
  • the method further includes:
  • the optical device is arranged on the stepped structure.
  • the forming a stepped structure on at least two opposite sides of the resin support further includes: forming a vent hole on the stepped structure, and the accommodating cavity passes through the vent hole Connect with the external environment.
  • the lead frame further includes a third metal plate area and a fourth metal plate area, the first metal plate area, the second metal plate area, and the third metal plate area and the fourth metal plate area is insulated from each other;
  • the method further includes:
  • the photodiode is electrically connected to the fourth metal plate region.
  • the chip body is an infrared laser light-emitting chip
  • the lead frame further includes a fifth metal plate area, the first metal plate area, the second metal plate area, the the third metal plate area, the fourth metal plate area and the fifth metal plate area are insulated from each other;
  • the disposing the chip body on the first metal plate area includes: electrically contacting the cathode of the chip body with the first metal plate area;
  • the method further includes: electrically connecting the anode of the chip body and the fifth metal plate region through metal leads.
  • the method further includes:
  • the first metal plate area, the second metal plate area, the third metal plate area, the fourth metal plate area and the fifth metal plate area are far away from the outer sidewall of one end of the chip body
  • the transverse cross-sectional shape is zigzag.
  • a third aspect of the present invention provides a chip obtained by any one of the above-mentioned chip packaging methods.
  • a fourth aspect of the present invention provides an electronic device including any of the above-mentioned chips.
  • the invention provides a chip, a chip packaging method, and an electronic device.
  • the chip includes a chip body, a lead frame and a resin bracket arranged on the lead frame.
  • the lead frame and the resin bracket form an accommodating cavity, and the chip body is located in the accommodating cavity.
  • the chip body is arranged on the lead frame, so that the chip body is packaged in the accommodating cavity enclosed by the lead frame and the resin support.
  • the cost of resin materials is lower, and the process method of forming resin brackets through resin is relatively simple, which can improve production efficiency and further help reduce costs, thereby effectively reducing the cost of chips and solving existing problems.
  • Chips are packaged using ceramic substrates, which leads to the problem of high cost of chip packaging.
  • the metal lead frame can better dissipate heat to the chip body, and the circuit can be directly connected without drilling, which reduces the parasitic inductance in the circuit, thereby improving the performance of the chip.
  • FIG. 1 is a schematic top-view structural diagram of a chip according to Embodiment 1 of the present invention.
  • Fig. 2 is a schematic cross-sectional view along line A-A of Fig. 1;
  • FIG. 3 is a schematic front view of the lead frame used in the chip provided by the first embodiment of the present invention.
  • Fig. 4 is the sectional schematic diagram along A-A line of Fig. 3;
  • Fig. 5 is the sectional schematic diagram along B-B line of Fig. 3;
  • FIG. 6 is a schematic diagram of a backside structure of a lead frame adopted by the chip provided in Embodiment 1 of the present invention.
  • FIG. 7 is a schematic diagram of a backside structure of another lead frame adopted by the chip provided in the first embodiment of the present invention.
  • FIG. 8 is a schematic diagram of the front structure of the lead frame and the resin support used in the chip provided in the first embodiment of the present invention after molding;
  • Fig. 9 is the sectional structure schematic diagram of line A-A in Fig. 8;
  • Fig. 10 is the cross-sectional structure schematic diagram of line B-B in Fig. 8;
  • FIG. 11 is a schematic diagram of the backside structure of the lead frame and the resin support used in the chip provided in the first embodiment of the present invention after molding;
  • FIG. 12 is a schematic flowchart of a packaging method adopted by the chip provided in Embodiment 1 of the present invention.
  • FIG. 13 is a schematic structural diagram of the chip provided by the second embodiment of the present invention along the line A-A;
  • FIG. 14 is a schematic diagram of the front structure of the lead frame and the first support part of the resin support used in the chip provided in the second embodiment of the present invention after molding;
  • Figure 15 is a schematic cross-sectional view along line A-A of Figure 14;
  • Figure 16 is a schematic cross-sectional view along line B-B of Figure 14;
  • 17 is a schematic front view of the structure of the second support portion of the resin support used in the chip provided in the second embodiment of the present invention.
  • FIG. 18 is a schematic diagram of the rear structure of the second support portion in the resin support used in the chip provided in the second embodiment of the present invention.
  • Figure 19 is a schematic cross-sectional view along line A-A of Figure 17;
  • Figure 20 is a schematic cross-sectional view along line B-B of Figure 17;
  • 21 is a schematic cross-sectional view along the line A-A after the lead frame and the resin support used in the chip provided by the second embodiment of the present invention are formed;
  • FIG. 22 is a schematic cross-sectional view along the B-B line after the lead frame and the resin support used in the chip provided by the second embodiment of the present invention are formed.
  • the chip may be a laser chip, such as a VCSEL chip, or any other chip capable of emitting light.
  • a laser chip such as a VCSEL chip
  • FIG. 1 is a schematic top-view structural diagram of a chip provided in this embodiment, which shows a top-view of the chip
  • FIG. 2 is a schematic cross-sectional view taken along the line A-A in FIG. 1 .
  • a chip 10 provided in an embodiment of the present application includes a chip body 11 , a lead frame 12 and a resin support 13 .
  • the resin support 13 is fixedly connected to the lead frame 12 and surrounds the lead frame 12 to form an accommodation cavity 14 having a first opening 136 , the chip body 11 is located in the accommodating cavity 14 , and the light emitted by the chip body faces the first opening 136 .
  • the resin bracket 13 may include at least two opposite ends (eg, bottom and top), and the lead frame 12 is fixed on one end of the resin bracket 13 (eg, the resin bracket 13 ). bottom), and the resin bracket 13 is enclosed on the lead frame 12, and the resin bracket 13 and the lead frame 12 together form the accommodating cavity 14.
  • the lead frame 12 forms the bottom surface of the accommodating cavity 14, and the resin bracket 13 forms the accommodating cavity 14.
  • the side wall of the cavity 14 and the other end of the resin bracket 13 opposite to the lead frame 12 have a first opening 136.
  • the first opening 136 communicates with the accommodating cavity 14, and the chip body 11, the photodiode 40, etc. can pass through the first opening 136.
  • the opening 136 is provided in the receiving cavity 14 .
  • the chip body 11 may be a bare wafer, the chip body 11 is located in the accommodating cavity 14 , and the lead frame 12 may include a first metal plate area 121 and a second metal plate area 122 , the first metal plate area 121 and the second metal plate area 122
  • the first metal plate area 121 is used to fix the chip body 11 and is electrically connected to the chip body 11, that is, the chip body 11 is arranged on the first metal plate area 121 of the lead frame 12, and the chip body 11 is connected to the second metal plate.
  • the area 122 is electrically connected, and the second metal plate area 122 is used to electrically connect the chip body 11 to an external circuit, so as to realize communication with an external device circuit.
  • the chip body 11 is encapsulated in the accommodating cavity 14 formed by the lead frame 12 and the resin support 13 , so as to realize the encapsulation of the chip body 11 .
  • the resin bracket 13 is a bracket structure formed by a resin material, and the cost of the resin material is low. Molding or injection molding, the process method is relatively simple, which can effectively improve mass production efficiency, and also help to reduce production costs and further reduce chip costs. Specifically, compared with ceramic packaging, it can reduce packaging costs by about 60% .
  • the lead frame 12 may be a plate-like structure, including a plurality of metal plate regions, and an insulating gap 126 may be provided between two adjacent metal plate regions (as shown in the first metal plate region 121 and the third metal plate in FIG. 4 ). There is an insulating gap 126) between the regions 123, so as to realize the insulating arrangement between two adjacent metal plate regions.
  • the resin bracket 13 may also include a filling portion 133, and the filling portion 133 is filled in the insulating gap 126, so that when the resin bracket 11 is formed, the resin can be filled into the insulating gap 126 to form the filling portion 133, and the resin bracket 11 and the lead frame can be improved. 12 connection fastness.
  • the chip body 11 is disposed on the first metal plate area 121 and can be in electrical contact with the first metal plate area 121. Specifically, the cathode of the chip body 11 can be contacted and fixed on the first metal plate area 121 by conductive silver paste or the like. , the anode of the chip body 11 may be connected to the second metal plate region 122 through the metal lead 50 .
  • the chip body 11 is disposed on the first metal plate area 121 and can be in electrical contact with the first metal plate area 121.
  • the metal plate area is a metal material plate, and its thermal conductivity is higher than that of ceramics. Therefore, the chip body 11 can be better dissipated, and the heat dissipation effect of the chip body 11 can be improved. Specifically, the temperature rise of the chip can be reduced by about 18.5%.
  • the steeper the current pulse flowing through the VCSEL chip the stronger the anti-interference ability of the laser emitted by the chip to the ambient light, and the entire laser emission. The better the performance.
  • the outer bottom of the ceramic substrate usually has pins, and the packaged chip is conductively connected to other devices through the pins.
  • the bottom of the ceramic substrate usually needs to be drilled to avoid Connect the chip to the pins on the outer bottom.
  • the lead frame 12 is used as the bottom surface of the accommodating cavity 14 , the chip body 11 is disposed on the first metal plate area 121 , and the cathode of the chip body 11 can be in electrical contact with the first metal plate area 121 .
  • the anode of the main body 11 is electrically connected to the second metal plate area 122, the first metal plate area 121 and the second metal plate area 122 can be conductive, and the outer bottom of the first metal plate area 121 and the second metal plate area 122 can be provided with
  • the chip body 11 is directly electrically connected to the pins, without drilling, the connection path is shortened, the parasitic inductance is reduced, the induced voltage of the inductance is reduced, and the anti-interference ability of the light emitted by the chip 10 is improved.
  • the performance of the chip 10 is improved, specifically, the parasitic inductance can be reduced by about 70%-80% compared with the chip packaged in ceramic.
  • the metal leads 50 may be silver wires, copper wires, aluminum wires, gold wires, metal alloy wires, etc.
  • the metal wires are gold wires with a wire diameter of 0.8 mil-1.5 mil.
  • an optical device 30 is further included. At least two opposite sides of the resin support 13 have stepped structures 134 .
  • the optical device 30 is disposed on the stepped structure 134 , and the optical device 30 Located on the light-emitting optical path of the chip body 11 , the emitted light emitted by the chip body 11 is emitted after passing through the optical device 30 .
  • the optical device 30 can filter light and improve the optical characteristics of the emitted light, thereby improving the performance of the chip 10 .
  • the stepped structures 134 may be closed, that is, the four side walls of the resin support 13 have stepped structures 134, or the stepped structures 134 may be non-closed Yes, the first resin bracket 13 only has the stepped structure 134 on the opposite sides.
  • the optical device 30 can be adhered to the stepped structure 134 by an adhesive, and the adhesive can be transparent silica gel.
  • the optical device 30 can be a collimating mirror, a diffractive optical element or a diffuser, etc.
  • the optical device 30 can also be other optical elements.
  • the specific type of the optical device 30 can be selected according to the design requirements of the chip. Certainly.
  • the optical device 30 may include a collimating mirror and a diffractive optical element, the collimating mirror is located above the chip body 11, the diffractive optical element is located above the collimating mirror, and the light emitted by the chip body 11 is collimated in sequence The mirror and the diffractive optical element are then emitted out of the accommodating cavity 14 .
  • the collimating mirror can collimate the light emitted by the chip body 11 to improve the intensity of the emitted light.
  • the functions of the diffractive optical element can be various, for example, the point light source emitted by the chip body 11 can be reproduced, or the point light source can be distributed and controlled.
  • the optical device 30 may include a collimating mirror and a diffusing sheet, the collimating mirror is located above the chip body, the diffusing sheet is located above the collimating mirror, and the light emitted by the chip body 11 sequentially passes through the collimating mirror and the diffusing sheet. The diffusing sheet is then ejected out of the accommodating cavity 14 .
  • the diffuser sheet can form a point light source emitted by the chip body 11 into a uniform surface light source.
  • the stepped structure 134 may include a step on which the optical device 30 is disposed. Alternatively, the stepped structure 134 may also be composed of multiple steps. If the optical device 30 is composed of multiple optical elements, then multiple steps may be provided to facilitate the arrangement of multiple optical elements.
  • the collimating mirror may be It is formed by stacking multiple sheets, and one sheet can be set on each step.
  • the collimating mirror may be arranged on one step, and the diffractive optical element may be arranged on the other step.
  • the optical device 30 includes a collimating mirror and a diffusing sheet
  • the collimating mirror may be provided on one step, and the diffusing sheet may be provided on the other step.
  • the stepped structure 134 or the stepped structure 134 and the adjacent resin support form a second opening 137, and the second opening 137 corresponds to the first opening 136.
  • the stepped structure when the resin support has the stepped structure 134 in the circumferential direction, the stepped structure
  • the side wall 134 encloses the second opening 137 .
  • the stepped structures 134 and the adjacent resin brackets 13 together form the second opening 137 .
  • the optical device 30 may cover the second opening 137 , so that the accommodating cavity 14 is a sealed cavity, so as to better encapsulate the chip body 11 in the accommodating cavity 14 .
  • the accommodating cavity 14 communicates with the external environment through the exhaust hole 135 , and the optical device 30 covers the second opening 137 so that the accommodating cavity 14 becomes a closed cavity.
  • the optical device 30 may be opened due to thermal expansion and cold contraction, and the exhaust hole 135 is connected to the accommodating cavity 14 and the external environment, which can effectively avoid the occurrence of the above phenomenon. , thereby improving the installation stability of the optical device 30 and the packaging stability of the chip 10 .
  • the chip 10 further includes a photodiode 40 , the photodiode 40 is located in the accommodating cavity 14 , and the lead frame further includes a third metal plate area 123 and a fourth metal plate area 124.
  • the first metal plate area 121, the second metal plate area 122, the third metal plate area 123, and the fourth metal plate area 124 are insulated from each other, and the photodiode 40 is arranged on the third metal plate area 123, and the photodiode 40
  • the cathode of the photodiode 40 is in electrical contact with the third metal plate region 123
  • the anode of the photodiode 40 is electrically connected with the fourth metal plate region 124 .
  • the photodiode 40 is used to detect the optical power signal emitted by the chip body 11 and output it as a feedback signal. Specifically, after the chip body 11 emits the emitted light, part of the emitted light will be refracted by the optical device 30, and part of the emitted light will be reflected by the optical device 30 to form reflected light.
  • the photodiode 40 can receive and detect the optical power signal of the reflected light, and then The optical power signal is converted into an electrical signal and output as a feedback signal. For example, if it is output to the control unit in the electronic device, the control unit can judge the optical power of the light refracted from the optical device 30 according to the feedback signal, so as to realize the control of the chip body. 11 detects the light power of the light emitted so as to control the chip body 11 .
  • the optical device 30 when the optical device 30 is broken, cracked or peeled off (for example, the diffuser film is formed by evaporation on glass, if the diffuser film is partially peeled off), the light emitted by the chip body 11, especially the infrared light etc., may be emitted through the broken part of the optical device 30, thereby causing certain damage to human eyes.
  • the optical device 30 is broken or cracked, the optical power of the reflected light returned from the optical device 30 will change.
  • the photodiode 40 can detect the change, so that the chip body can be controlled in time. 11 stops emitting light, thereby avoiding damage to the user's eyes and improving the safety and reliability of the operation of the chip 10 .
  • the photodiode 40 can be electrically connected to the control unit in the electronic device. When the photodiode 40 detects the change of the photoelectric signal, it can output a feedback signal to the control unit, and the control unit controls the chip body 10 to stop emitting light.
  • the chip body 11 may be an infrared laser light-emitting chip.
  • the lead frame 12 further includes a fifth metal plate area 125, a first metal plate area 121, a second metal plate area 122, a third metal plate area 123, a fourth metal plate area 124 and a fifth metal plate area
  • the regions 125 are arranged insulated from each other.
  • the cathode of the chip body 11 is in electrical contact with the first metal plate area 121 , and the anode of the chip body 11 can be electrically connected to the second metal plate area 122 and the fifth metal plate area 125 through the metal leads 50 respectively.
  • the chip body 11 may include a plurality of light-emitting units, and multiple beams of light emitted by the plurality of light-emitting units form a beam of emitted light emitted by the chip body 11 .
  • the anodes of the plurality of light emitting units are respectively electrically connected to the second metal plate area 122 and the fifth metal plate area 125 through the metal leads 50 .
  • FIG. 3 is a schematic view of the front structure of the metal plate area in the lead frame used in the chip provided by the present embodiment
  • FIG. 4 is a schematic cross-sectional view along line AA of FIG. 3
  • FIG. 5 is a schematic cross-sectional view along line BB of FIG. 3
  • FIG. 6 is A schematic diagram of a backside structure of a lead frame used in the chip provided in this embodiment
  • FIG. 7 is a schematic diagram of a backside structure of another lead frame used in the chip provided in this embodiment.
  • the forming material of the metal plate area may be a metal with good electrical conductivity such as iron, copper, copper alloy, or the metal plate area may also be a gold-plated, silver-plated or nickel-palladium-gold alloy-plated copper material.
  • the metal plate area may be formed by chemical etching or precision die stamping on a flat metal plate through the metal plate, wherein the shape of the metal plate area may be square, rectangle, circle or other shapes. As shown in FIG. 3 , an insulating gap 126 is provided between two adjacent metal plate regions, so that the metal plate regions are insulated.
  • the first metal plate area 121 , the second metal plate area 122 , the third metal plate area 123 , and the fourth metal plate area 124 The lateral cross-sectional shape of the outer sidewall at the end of the fifth metal plate region 125 away from the chip body 11 is zigzag, which increases the length of the outer peripheral sidewall of the metal plate region, and further increases the resin and leads when the resin is filled into the insulating gap 126.
  • the contact area of the frame 12 is increased, thereby improving the bonding fastness of the resin bracket 13 and the lead frame 12 and improving the reliability of the resin bracket 13 .
  • only the outer sidewall of one end of the metal plate area away from the chip body 11 may be zigzag.
  • the outer sidewall of the board area 122 is divided into upper and lower parts, wherein the first part is close to the chip body 11, and the second part is far away from the chip body 11.
  • the transverse cross-sectional shape of the first part is a rectangle with smooth edges.
  • the cross-sectional shape of the second part is a rectangle with serrated edges.
  • the thickness of the metal plate area is 0.2 mm
  • the thickness of the zigzag outer side wall is less than 0.2 mm, for example, only the outer side wall with a thickness of 0.1 mm is zigzag.
  • the complexity of the outer sidewall of the metal plate area can be increased, the contact area between the metal plate area and the resin can be increased, and the connection fastness of the lead frame 12 and the resin support 11 can be further improved.
  • the sawtooth shape is composed of a plurality of sawtooths 127, and the shapes of the sawtooths 127 may be quadrilateral and fan-shaped as shown in FIG. 6 and FIG.
  • the shape of the saw teeth 127 can also be a triangle as shown in FIG. 7 (eg, the outer sidewall of the second metal plate area 122 ).
  • the shape of the saw teeth 127 can also be a trapezoid as shown in FIG. 7 (eg, the outer sidewall of the third metal plate area 123 ).
  • other regular or irregular shapes are also possible.
  • the outer sidewall of the metal plate area may be zigzag-shaped by chemical etching or die stamping.
  • the chip body 11 can be fixed on the lead frame 12 in a variety of ways, such as silver paste bonding, solder paste bonding, flux bonding, solder bonding or hot pressing of metal plating at the bottom of the chip body. Crystal and other methods.
  • the light-emitting type of the chip body 11 can be selected and set according to the functional requirements of the chip.
  • the wavelength of the emitted light emitted by the chip body 11 is 780nm-3000nm.
  • the molding resin material of the resin bracket 12 can use black thermosetting resin, and the black resin has lower cost, which helps to further reduce the packaging cost of the chip 10.
  • the resin material includes at least silicon dioxide, carbon black, epoxy resin, One of inorganic fillers such as hardener and catalyst.
  • a chip 10 provided by this embodiment of the present application includes a chip body 11, a lead frame 12 and a resin support 13.
  • the resin support 13 and the lead frame together form a accommodating cavity 14, the chip body 11 is located in the accommodating cavity 14, and the lead frame 12 includes a first metal plate area and a second metal plate area that are insulated and arranged, the chip body 11 is arranged on the first metal plate area of the lead frame 12, and the chip body 11 is electrically connected to the second metal plate area to realize the connection with the external device. on.
  • the chip body 11 is encapsulated in the accommodating cavity 14 surrounded by the lead frame 12 and the resin bracket 13 .
  • the cost of the resin material is lower, and the process method of forming the resin bracket 13 by resin is relatively simple.
  • the production efficiency can be improved, and the cost can be further reduced, thereby effectively reducing the cost of the chip 10 .
  • the chip body 11 is arranged on the metal plate area, which can better dissipate heat to the chip body 11 compared with ceramics, and the lines can be directly connected without drilling, which reduces the parasitic inductance in the lines, thereby improving the chip 10 performance.
  • the resin bracket 13 includes a first bracket part 131 and a second bracket part 132 , wherein the first bracket part 131 is arranged around the outer peripheral side wall of the lead frame 12 .
  • a bracket portion 131 is combined and fixed with the side surface of the lead frame 12 .
  • the end surface of the first bracket portion 131 near the chip body 11 is flush with the end surface of the lead frame 12 near the chip body 11 .
  • the first bracket portion 131 surrounds the Around the lead frame 12 , the first bracket portion 131 can provide a horizontal clamping and fixing function to the lead frame 12 .
  • the second bracket portion 132 extends upward from the first bracket portion 131 and protrudes out of the lead frame 12 , that is, the second bracket portion 132 is located above the first bracket portion 131 and the lead frame 12 , and the second bracket portion 132 surrounds the lead frame 12 . It is understood that the second bracket portion 132 is fixed in combination with the upper surface of the lead frame 12, the second bracket portion 132 forms the side wall of the accommodating cavity 14, and the end of the second bracket portion 132 away from the lead frame 12 encloses a first An opening 136 is provided, and the stepped structure 134 is located on the second bracket portion 132 .
  • FIG. 8 is a schematic view of the front structure of the lead frame and resin support used in the chip provided in this embodiment after molding
  • FIG. 9 is a schematic view of the cross-sectional structure of the line AA in FIG. 7
  • FIG. 10 is a schematic view of the cross-sectional structure of the line BB in FIG. 7
  • FIG. 11 is a schematic diagram of the backside structure of the lead frame and the resin support used in the chip provided in this embodiment after molding.
  • the first bracket portion 131 and the second bracket portion 132 are integrally formed on the lead frame 12 by means of mold hot pressing. Specifically, the first bracket portion and the second bracket portion are formed on the lead frame 12 by means of mold hot pressing. Wherein, in the process of hot pressing of the mold, the resin can also be filled into the insulating gap between the two adjacent metal plate regions to form a filling portion.
  • FIG. 12 is a schematic flowchart of the packaging method adopted by the chip provided by this embodiment. Referring to FIG. 12 , the method includes:
  • S101 Provide a lead frame and a chip body, where the lead frame includes a first metal plate area and a second metal plate area that are insulated from each other.
  • the resin bracket 13 can be formed on the lead frame 12 by a method of mold thermocompression injection.
  • the resin bracket 13 is fixedly connected to the lead frame 12 and surrounds the lead frame 12 to form a receiving cavity 14 having a first opening 136 .
  • the lead frame 12 can be fixed on one end of the resin bracket 13, the resin bracket 13 is enclosed on the lead frame 12, and the resin bracket 13 and the lead frame 12 together form an accommodating cavity 14, the resin bracket 13 and the lead frame 14.
  • a first opening 136 communicated with the accommodating cavity 14 is formed on the opposite end of the 12 .
  • the chip body 11 can be disposed on the first metal plate area 121 of the lead frame 12 by methods such as silver paste bonding, solder paste bonding, flux bonding, solder bonding, or hot-pressing eutectic for metal plating at the bottom of the chip body.
  • the light emitted by the chip body faces the first opening 136 .
  • S104 Electrically connect the chip body and the second metal plate area.
  • the electrical connection between the chip body 11 and the second metal plate region 122 can be realized by using metal wires.
  • the resin support 13 can be arranged on the lead frame 12, and the resin support 13 and the lead frame 12 can enclose the accommodating cavity 14, and the chip body 11 is arranged in the accommodating cavity 14, so as to realize the integration of the chip body 11 Compared with the ceramic package, the process is simpler and easier to implement, has higher mass production efficiency, further reduces the manufacturing cost, and further reduces the cost of the chip 10 .
  • the resin bracket 13 includes a first bracket part 131 and a second bracket part 132, and forming the resin bracket on the lead frame in step S102 includes:
  • S112 Provide a first mold, the first mold includes an upper mold and a lower mold opposite, the upper mold and the lower mold enclose a cavity for accommodating the lead frame, and an end of the upper mold facing the lower mold has a flat portion and surrounds the flat portion
  • the groove portion on the outer periphery, and the end face of the lower mold facing the upper mold is a flat surface.
  • the lead frame is positioned in the cavity, the lead frame is sandwiched between the flat portion and the flat surface, and the groove portion is located on the outer periphery of the lead frame.
  • the lead frame 12 when the lead frame 12 is located in the cavity, there is a certain gap between the lead frame 12 and the inner wall of the cavity, so that the resin can surround the outer peripheral sidewall of the lead frame 12 after being injected.
  • the first bracket part 131 and the second bracket part 132 are formed on the lead frame 12 by using the first mold by the above method, that is, the first bracket part 131 and the second bracket part 132 are formed on the lead frame 12
  • the upper is integrally formed.
  • forming the resin bracket 13 on the lead frame 12 further includes: forming stepped structures 134 on at least opposite sides of the resin bracket 13 .
  • the stepped structure 134 may be formed by thermocompression injection molding by forming the stepped structure in the upper mold.
  • the optics are arranged on the stepped structure.
  • the optical device 30 may be disposed on the stepped structure 134 by means of bonding.
  • forming a stepped structure on at least two opposite sides of the resin support further includes: forming an exhaust hole on the stepped structure, and the accommodating cavity communicates with the external environment through the exhaust hole.
  • the vent holes 135 can be formed on the stepped structure 134 by designing the structure of the upper mold.
  • the lead frame 12 further includes a third metal plate area 123 and a fourth metal plate area 124 , the first metal plate area 121 , the second metal plate area 122 , the third metal plate area 123 and the fourth metal plate area 121
  • the plate regions 124 are insulated from each other.
  • a photodiode is positioned on the third metal plate area, and the cathode of the photodiode is in electrical contact with the third metal plate area.
  • the photodiode 40 may be disposed on the third metal plate region 123 by methods such as silver paste bonding, solder paste bonding, flux bonding, solder bonding, or hot pressing eutectic for metal plating at the bottom of the chip body.
  • the photodiode is electrically connected to the fourth metal plate region.
  • the electrical connection between the photodiode 40 and the fourth metal plate region 124 can be achieved through metal leads, and the metal leads can be gold wires, silver wires, copper wires, aluminum wires, metal alloy wires, and the like.
  • the chip body 11 may be an infrared laser light-emitting chip
  • the lead frame 12 further includes a fifth metal plate area 125 , a first metal plate area 121 , a second metal plate area 122 , a third metal plate area 123 , and a fourth metal plate area 124 and the fifth metal plate region 125 are insulated from each other.
  • Step S103 includes: electrically contacting the cathode of the chip body 11 with the first metal plate region 121 .
  • the method further includes: electrically connecting the anode of the chip body 11 to the fifth metal plate region 125 through the metal lead 50 .
  • the method further includes:
  • An insulating gap is provided between two adjacent metal plate regions among the first metal plate region, the second metal plate region, the third metal plate region, the fourth metal plate region and the fifth metal plate region;
  • the lateral cross-sectional shape of the outer sidewall at one end of the first metal plate area, the second metal plate area, the third metal plate area, the fourth metal plate area and the fifth metal plate area away from the chip body is zigzag.
  • the metal plate area can be formed on the metal plate by chemical etching or die stamping, and at the same time, the cross-sectional shape of the outer side wall at one end of the metal plate area away from the chip body 11 is zigzag, and the two adjacent metal plate areas are in a zigzag shape. There are insulating gaps 126 therebetween.
  • the resin When the lead frame 12 is placed in the cavity of the first mold and resin is injected into the first mold, the resin may be filled into the insulating gap 126 to form the filling portion 133 .
  • FIG. 13 is a schematic structural diagram of the chip provided in this embodiment along the line A-A.
  • the chip 10 provided in the embodiment of the present application is different from the first embodiment in that the first bracket part 131 is formed on the lead frame 12 by means of mold hot pressing, and the second bracket part 132 is divided into two parts. forming.
  • FIG. 14 is a schematic view of the front structure of the lead frame and the first support portion of the resin support used in the chip provided in this embodiment after molding
  • FIG. 15 is a schematic cross-sectional view along the line AA of FIG. 14, and
  • FIG. 16 is the line BB of FIG. 14. Schematic cross section.
  • the first bracket portion 131 is formed on the outer peripheral side wall of the lead frame by the first mold, and the filling portion 133 is formed in the insulating gap between the two adjacent metal plate regions.
  • FIG. 17 is a schematic diagram of the front structure of the second bracket part in the resin bracket used in the chip provided in this embodiment
  • FIG. 18 is a schematic diagram of the rear structure of the second bracket part in the resin bracket used in the chip provided in this embodiment
  • FIG. 18 17 is a schematic cross-sectional view taken along line AA
  • FIG. 19 is a cross-sectional schematic view taken along line BB of FIG. 17 .
  • the second bracket portion 132 can be formed by a second mold.
  • the second mold is an annular structure with grooves on the outer periphery of the annular structure, so that the formed second bracket portion 132 is an outer periphery.
  • the first mold may include an upper mold and a lower mold, wherein the upper mold and the lower mold enclose a cavity for accommodating the lead frame 12, and there is a certain gap between the periphery of the lead frame 12 and the side wall of the mold, The opposite end faces of the upper mold and the lower mold are flat surfaces, and resin is injected into the first mold. After molding, the resin located on the outer peripheral side wall of the lead frame 12 forms the first bracket portion 131. Compared with the first embodiment, the first bracket portion 131 is formed by the resin.
  • the first mold does not need to set up a flat part and a groove part, so the cost of the mold can be effectively saved
  • the second mold is a ring mold with a groove at a position opposite to the outer periphery of the lead frame 12, and the mold type is more common
  • it is easy to obtain does not need to pay the expensive cost of a special mold, greatly reduces the manufacturing cost, and further reduces the cost of the chip 10 .
  • the second bracket part 132 is separately formed by the second mold, so that the wall thickness and height of the second bracket part 132 and the size of the enclosed first opening 136 can be modified and adjusted at any time according to design requirements and optical path requirements. flexible and easy to change.
  • FIG. 21 is a schematic cross-sectional view along line AA of the lead frame and resin support used in the chip provided in this embodiment after molding
  • FIG. 22 is a cross-sectional view along line BB of the lead frame and resin support used in the chip provided in this embodiment after molding Schematic.
  • the adhesive layer 20 is also included.
  • the first bracket portion 131 is formed on the lead frame 12 by means of mold hot pressing.
  • the adhesive layer 20 provided on the lead frame 12 .
  • the adhesive layer 20 may be an adhesive layer formed by super glue, and the super glue may be transparent silica gel or black silica gel, or may be any other glue with strong adhesion.
  • the chip 10 further includes an optical device 30
  • the resin bracket 13 has stepped structures 134 on at least two opposite sides.
  • the second bracket portion 132 has steps on at least two opposite sides.
  • the optical device 30 is disposed on the stepped structure 134 , and the optical device 30 is located on the light-emitting optical path of the chip body 11 .
  • the stepped structure 134 may be a stepped structure that protrudes toward the groove on the inner wall of the groove of the second mold when the second support portion 132 is formed by using the second mold.
  • a stepped structure 134 is formed on the portion 132 .
  • the arrangement of the stepped structure 134 increases the complexity of the mold. Compared with the first embodiment, the use of a separate second mold to form the second bracket portion 132 with the stepped structure 134 can relatively reduce the complexity of the mold used, thereby reducing the complexity of the mold. cost, thereby reducing the cost of the chip 10 .
  • the arrangement of the optical device 30 , the number of steps of the stepped structure 134 and the arrangement of the air vents 135 on the stepped structure 134 may refer to Embodiment 1, which will not be repeated in this embodiment of the present application.
  • the chip 10 further includes a photodiode 40 , and the arrangement of the photodiode 40 can be referred to in Embodiment 1, which will not be repeated in this embodiment of the present application.
  • the resin support 13 further includes a filling portion 133
  • the lead frame 12 includes a first metal plate area 121 , a second metal plate area 122 , a third metal plate area 123 , a fourth metal plate area 124 and a fifth metal plate area 121 .
  • an insulating gap 126 is formed between two adjacent metal plate regions, and the filling portion 133 fills the insulating gap 126, and the filling portion 133 plays the role of insulating filling.
  • the resin in the first mold can fill the insulating gap 126 A filling portion 133 is formed therein.
  • the arrangement of the metal plate area of the lead frame 12 and the shape of the sidewall of the metal plate area can refer to Embodiment 1, which will not be repeated in this embodiment of the present application.
  • the chip body 11 may also include a plurality of light-emitting units, and the connection method of the plurality of light-emitting units may refer to Embodiment 1, which will not be repeated in this embodiment of the present application.
  • the first bracket part 131 and the second bracket part 132 are separately formed.
  • the bracket portion 132 is formed on the lead frame 12 after being formed by the second mold, so that the first mold does not need to specially set up a flat portion and a groove portion, and the second mold is a relatively common mold, which effectively saves the cost of the mold and does not require
  • the high cost of paying for the special mold greatly reduces the manufacturing cost and further reduces the cost of the chip 10 .
  • the embodiment of the present application also provides a chip packaging method, which is different from the first embodiment in that the forming a resin support on the lead frame in step S102 includes:
  • S202 Provide a first mold, the first mold includes an upper mold and a lower mold opposite, the upper mold and the lower mold enclose a cavity for accommodating the lead frame, and the opposite end faces of the upper mold and the lower mold are flat surfaces.
  • the lead frame is positioned in the cavity, the lead frame is sandwiched between the flat surfaces, and resin is injected and molded in a first mold, and the resin located on the outer peripheral side wall of the lead frame forms a first bracket portion and is demolded.
  • the first bracket portion 131 surrounding the outer peripheral side wall of the lead frame is formed on the lead frame 12 by the first mold
  • the second bracket portion 132 is formed by the second mold
  • the second bracket portion 132 is set On the lead frame 12 , the lead frame 12 , the first bracket part 131 and the second bracket part 132 are formed to enclose a receiving cavity 14 , and the chip body 11 is disposed in the receiving cavity 14 to realize the packaging of the chip body 11 .
  • the second bracket portion 132 is formed separately from the first bracket portion 131 and the lead frame 12, the first mold does not need to be specially provided with a flat portion and a groove portion.
  • the second mold is an easily obtained mold, which can be extremely The cost of the mold is greatly saved, and the cost of the chip 10 is reduced.
  • arranging the second bracket part on the lead frame includes: adhering the second bracket part on the lead frame.
  • Forming the resin support on the lead frame further includes forming a stepped structure on at least opposite sides of the resin support.
  • stepped structures 134 are formed on at least two opposite sides of the second bracket portion 132 , and the stepped structures 134 can be formed by thermocompression injection molding by forming the stepped structures in the second mold.
  • Forming a stepped structure on at least two opposite sides of the resin support further includes: forming an exhaust hole on the stepped structure, and the accommodating cavity communicates with the external environment through the exhaust hole.
  • the vent holes 135 may be formed on the stepped structure 134 by structural design of the second mold.
  • the embodiment of the present application further provides a chip 10, and the chip 10 is obtained by the packaging method of the chip 10 in the above-mentioned embodiment.
  • the encapsulation method realizes the encapsulation of the chip body 11 through the resin bracket 13 and the lead frame 12.
  • the resin bracket 13 has lower cost, and the process method is relatively simple, which helps to improve the production efficiency and further reduces the production cost.
  • An embodiment of the present application further provides an electronic device, including the chip 10 in any of the foregoing embodiments.
  • the electronic device may be an electronic product or component such as a mobile phone, a tablet computer, a TV, a notebook computer, a digital photo frame, and a fingerprint lock.
  • the electronic device includes a chip 10, and the chip 10 realizes the packaging of the chip 10 through the resin bracket 13 and the lead frame 12, which has lower cost, and has better heat dissipation performance and anti-interference performance, effectively reducing the electronic device. cost, and improve the performance of electronic equipment.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Puce (10) et procédé de mise sous boîtier de puce (10) et dispositif électronique. La puce (10) comprend un corps de puce (11), une grille de connexion (12) et un support en résine (13), le support en résine (13) étant relié de manière fixe à la grille de connexion (12) et entourant une cavité de confinement (14) présentant une première ouverture (136) avec la grille de connexion (12) ; le corps de puce (11) est situé dans la cavité de confinement (14) ; la grille de connexion (12) comprend une première zone de plaque métallique (121) et une seconde zone de plaque métallique (122) qui sont isolées l'une de l'autre ; la première zone de plaque métallique (121) est utilisée pour fixer le corps de puce (11) et est connectée électriquement au corps de puce (11) ; et la seconde zone de plaque métallique (122) est utilisée pour connecter électriquement le corps de puce (11) à un circuit externe, c'est-à-dire que la mise sous boîtier du corps de puce (11) est réalisée au moyen du support en résine (13) et de la grille de connexion (12). Le matériau en résine est peu coûteux, et le procédé de traitement permettant de former le support en résine (13) au moyen du matériau en résine est simple, ce qui permet d'améliorer l'efficacité de production, et de résoudre le problème selon lequel le coût de mise sous boîtier est élevé en raison du fait qu'un substrat céramique est utilisé pour la mise sous boîtier.
PCT/CN2020/107483 2020-08-06 2020-08-06 Puce et procédé de mise sous boîtier de puce et dispositif électronique WO2022027470A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/107483 WO2022027470A1 (fr) 2020-08-06 2020-08-06 Puce et procédé de mise sous boîtier de puce et dispositif électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/107483 WO2022027470A1 (fr) 2020-08-06 2020-08-06 Puce et procédé de mise sous boîtier de puce et dispositif électronique

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201069781Y (zh) * 2007-06-12 2008-06-04 一诠精密工业股份有限公司 发光二极管导线架及具有发光二极管导线架的发光二极管
US20080261339A1 (en) * 2007-04-17 2008-10-23 Koung Chia-Yin Packaging method to manufacture package for a high-power light emitting diode
CN105576109A (zh) * 2008-09-03 2016-05-11 日亚化学工业株式会社 发光装置、树脂封装体、树脂成形体及它们的制造方法
CN208781887U (zh) * 2018-10-17 2019-04-23 昆山丘钛微电子科技有限公司 一种发射模组及电子设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080261339A1 (en) * 2007-04-17 2008-10-23 Koung Chia-Yin Packaging method to manufacture package for a high-power light emitting diode
CN201069781Y (zh) * 2007-06-12 2008-06-04 一诠精密工业股份有限公司 发光二极管导线架及具有发光二极管导线架的发光二极管
CN105576109A (zh) * 2008-09-03 2016-05-11 日亚化学工业株式会社 发光装置、树脂封装体、树脂成形体及它们的制造方法
CN208781887U (zh) * 2018-10-17 2019-04-23 昆山丘钛微电子科技有限公司 一种发射模组及电子设备

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