WO2022021920A1 - 一种含铜离子的水性清洗剂 - Google Patents
一种含铜离子的水性清洗剂 Download PDFInfo
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- WO2022021920A1 WO2022021920A1 PCT/CN2021/084417 CN2021084417W WO2022021920A1 WO 2022021920 A1 WO2022021920 A1 WO 2022021920A1 CN 2021084417 W CN2021084417 W CN 2021084417W WO 2022021920 A1 WO2022021920 A1 WO 2022021920A1
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- parts
- water
- cleaning agent
- copper
- mixture
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 30
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 229910001431 copper ion Inorganic materials 0.000 title claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 22
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 150000001879 copper Chemical class 0.000 claims abstract description 14
- 239000013538 functional additive Substances 0.000 claims abstract description 11
- 239000008367 deionised water Substances 0.000 claims abstract description 10
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 10
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 claims description 10
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 7
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 7
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 7
- 239000004115 Sodium Silicate Substances 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 5
- 229910000160 potassium phosphate Inorganic materials 0.000 claims description 5
- 235000011009 potassium phosphates Nutrition 0.000 claims description 5
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 5
- 239000002280 amphoteric surfactant Substances 0.000 claims description 2
- 125000000129 anionic group Chemical group 0.000 claims description 2
- 239000003945 anionic surfactant Substances 0.000 claims description 2
- 125000002091 cationic group Chemical group 0.000 claims description 2
- 239000003093 cationic surfactant Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000002736 nonionic surfactant Substances 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 230000000844 anti-bacterial effect Effects 0.000 abstract description 7
- 238000004140 cleaning Methods 0.000 abstract description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 239000003899 bactericide agent Substances 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000005202 decontamination Methods 0.000 abstract description 2
- 230000003588 decontaminative effect Effects 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 239000008235 industrial water Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 230000009972 noncorrosive effect Effects 0.000 abstract 1
- 231100000252 nontoxic Toxicity 0.000 abstract 1
- 230000003000 nontoxic effect Effects 0.000 abstract 1
- 239000000839 emulsion Substances 0.000 description 7
- 229920002545 silicone oil Polymers 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- -1 Alcohol ether carboxylic acid Chemical class 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 239000000417 fungicide Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 2
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 2
- ONJQDTZCDSESIW-UHFFFAOYSA-N polidocanol Chemical compound CCCCCCCCCCCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO ONJQDTZCDSESIW-UHFFFAOYSA-N 0.000 description 2
- 230000000638 stimulation Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 201000004624 Dermatitis Diseases 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 239000008233 hard water Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 206010042772 syncope Diseases 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XFLNVMPCPRLYBE-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate;tetrahydrate Chemical compound O.O.O.O.[Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O XFLNVMPCPRLYBE-UHFFFAOYSA-J 0.000 description 1
- 230000008673 vomiting Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/06—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using emulsions
Definitions
- the invention relates to the technical field of industrial aqueous cleaning, in particular to an aqueous cleaning agent containing copper ions.
- metal cleaning agents are widely used in industrial production. They are often used for surface degreasing and descaling before and after metal processing, and cleaning processes before finished product assembly or packaging.
- the commonly used metal cleaning agents are divided into solvent type, semi-solvent type and water-based type.
- solvent-based metal cleaning agents petroleum solvents are flammable, explosive and waste resources.
- Chlorofluorocarbons are commonly used solvent-based metal cleaners, but are banned due to their damage to the atmospheric ozone layer. Therefore, solvent-based metal cleaners are gradually being replaced by semi-solvent and water-based metal cleaners.
- CFCs chlorofluorocarbons
- the water-soluble industrial cleaning agent has good cleaning performance and water dilution ratio, easy to separate and reprocess, and has a long service cycle.
- bactericides are organic fungicides such as morpholine and triazine.
- Such organic fungicides are generally highly corrosive and have a pungent odor, and will inevitably volatilize into the air during use, and contact with the operator's skin may cause the operator to vomit, skin allergy or even fainting; have adverse effects on the surrounding environment.
- a low-toxicity water-based metal cleaning agent which has excellent antibacterial properties, cleaning performance, no peculiar smell, friendly to human body, no harm, no stimulation, can ensure the health and safety of operators, and does not cause pollution to the surrounding environment; , it will not be rancid and deteriorated in a long period of time, and it can be added and used in a long-term cycle, which has a lower cost of use.
- the present invention proposes a specific solution based on solving the above-mentioned defects of the prior art.
- An aqueous industrial cleaning agent containing copper ions is composed of the following components by weight: 0.5-10 parts of water-soluble copper salt, 1-30 parts of inorganic alkali mixture, 1-30 parts of emulsifier Mixture, 0-20 parts of other functional additives, the balance of deionized water is added to 100 parts.
- the water-soluble copper salt is at least one of copper chloride, copper sulfate or other water-soluble copper salts. It should be understood that other water-soluble copper ions can also be ionized in water. water-soluble copper salts instead of copper chloride or copper sulfate;
- the inorganic base is potassium hydroxide or at least one of sodium hydroxide, sodium silicate and potassium phosphate.
- the emulsifier is one of commercially available anionic, nonionic, cationic or amphoteric surfactants such as AEO-9, AEO-3, TX-10, 6501, L62, etc. or a mixture of several;
- the other functional additives are one or a mixture of more than two functional additives including a defoamer, an anti-hard water agent, and other additives.
- the water-soluble copper salt is 0.5 part
- the inorganic base mixture is 1 part
- the emulsifier mixture is 1 part
- the water-soluble copper salt is 5 parts
- the inorganic base mixture is 15 parts
- the emulsifier mixture is 15 parts
- other functional additives are 10 parts
- the water-soluble copper salt is 10 parts
- the inorganic base mixture is 30 parts
- the emulsifier mixture is 30 parts
- other functional additives are 20 parts.
- the present invention also provides a method for using a copper ion-containing aqueous industrial cleaning agent, wherein the copper ion-containing aqueous cleaning agent and water are diluted 1:20-50 times by weight.
- the water-based industrial cleaning agent of the invention not only has strong decontamination ability and long service life, but also does not contain formaldehyde-releasing fungicides, is friendly to human body, has no toxicity, no stimulation and no corrosion, can effectively protect the health and safety of operators, and does not It will pollute the surrounding environment; at the same time, because the existence of copper ions has a good bactericidal and anti-corrosion effect, the working fluid will not be rancid and deteriorated, and it can be recycled and used without polluting the environment.
- Embodiment 1 is a diagrammatic representation of Embodiment 1:
- a water-based industrial cleaning agent is composed of the following components by weight: 0.5 part of copper chloride, 1 part of potassium hydroxide, 1 part of AEO9 emulsifier, 1 part of disodium ethylenediaminetetraacetate (EDTA2Na), the balance of Deionized water was added to 100 parts.
- Embodiment 2 is a diagrammatic representation of Embodiment 1:
- An aqueous industrial cleaning agent consisting of the following components by weight: 5 parts of copper sulfate, 15 parts of sodium hydroxide, 15 parts of AEO-3 emulsifier, 10 parts of silicone oil emulsion and disodium EDTA, the balance of deionized water to 100 parts.
- Embodiment 3 is a diagrammatic representation of Embodiment 3
- An aqueous industrial cleaning agent is composed of the following components by weight: 10 parts of copper sulfate, 30 parts of sodium silicate, 30 parts of TX-10 emulsifier, 20 parts of silicone oil emulsion and tetrasodium EDTA, the balance of deionized water to 100 parts.
- Embodiment 4 is a diagrammatic representation of Embodiment 4:
- An aqueous industrial cleaning agent consisting of the following components in parts by weight: 8 parts of copper chloride, 25 parts of potassium phosphate, 25 parts of 6501 emulsifier, 15 parts of silicone oil emulsion and tetrasodium EDTA, and the remaining Ionized water was added to 100 parts.
- Embodiment 5 is a diagrammatic representation of Embodiment 5:
- An aqueous industrial cleaning agent is composed of the following components in parts by weight: 8 parts of copper chloride, 10 parts of potassium hydroxide, 15 parts of sodium hydroxide, 25 parts of L62 emulsifier, 15 parts of silicone oil emulsion and ethylenediaminetetraacetic acid tetra Sodium, balance deionized water to 100 parts.
- Embodiment 6 is a diagrammatic representation of Embodiment 6
- An aqueous industrial cleaning agent is composed of the following components by weight: 8 parts of copper chloride, 10 parts of potassium hydroxide, 15 parts of sodium silicate, 10 parts of AEO-9, 10 parts of AEO-3, 18 parts of silicone oil emulsion and Alcohol ether carboxylic acid, the balance of deionized water was added to 100 parts.
- Embodiment 7 is a diagrammatic representation of Embodiment 7:
- An aqueous industrial cleaning agent is composed of the following components by weight: 10 parts of copper sulfate, 10 parts of sodium silicate, 15 parts of potassium phosphate, 15 parts of L62, 10 parts of TX-10, 16 parts of silicone oil emulsion and alcohol ether carboxylic acid , the balance of deionized water was added to 100 parts.
- Embodiment 8 is a diagrammatic representation of Embodiment 8
- An aqueous industrial cleaning agent consisting of the following components by weight: 3 parts of copper sulfate, 10 parts of sodium hydroxide, 12 parts of potassium phosphate, 12 parts of AEO-3, 10 parts of 6501 emulsifier, 16 parts of silicone oil emulsion and alcohol ether Carboxylic acid, balance deionized water added to 100 parts.
- the above industrial cleaning agent When the above industrial cleaning agent is used, it can be directly diluted with water by 1:50 times by weight, and can be used for ultrasonic and manual manual cleaning of various metal parts with heavy oil pollution.
- the sterilization ability of the copper ion cleaning agent provided by the present invention is not much different from that of the commercially available cleaning agent, but the service life is 2-3 times that of the commercially available cleaning agent. Good bactericidal effect.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Detergent Compositions (AREA)
Abstract
本发明涉及工业水性清洗技术领域,特别涉及一种含铜离子的水性清洗剂,提供了一种含铜离子的水性清洗剂,所述水性金属清洗剂的原料按重量份由以下组份组成:0.5-10份水溶性铜盐、1-30份无机碱混合物、1-30乳化剂混合物、0-20份其他功能添加剂,余量的去离子水添加至100份。本发明的水性工业清洗剂不仅去污能力强、使用寿命长,并且不含甲醛释放型杀菌剂,对人体友好无毒害、无刺激、无腐蚀,能有效保障操作人员的健康和安全,不会对周围环境造成污染;同时因为铜离子的存在具有很好的杀菌防腐效果,工作液不会酸败变质,可以循环添加使用,不会污染环境。
Description
本发明涉及工业水性清洗技术领域,特别涉及一种含铜离子的水性清洗剂。
目前金属清洗剂在工业生产中应用十分广泛,常用于金属加工前后的表面除油、除垢及成品组装或包装前的清洗工艺。目前,常用的金属清洗剂分溶剂型、半溶剂型和水基型。溶剂型金属清洗剂中,石油溶剂易燃、易爆而且浪费资源。氯氟烃是常用的溶剂型金属清洗剂,但由于其对大气臭氧层的破坏而被禁用。因而,溶剂型金属清洗剂正逐步被半溶剂型和水基型金属清洗剂所替代。随着氟氯烃(CFC)替代日期的逼近,水基清洗剂的研究和应用受到各方面的关注。
水溶性工业清洗剂具有良好的清洗性和兑水稀释比例,容易分离回处理,且使用周期较长。为了降低成本,延长水性金属清洗剂的使用周期,需要防止水性金属清洗剂腐败变质,固在其中添加杀菌剂成分,而目前普遍使用的杀菌剂为吗啉、三嗪等有机杀菌剂类。此类有机杀菌剂类物质一般都具有强烈腐蚀性,气味刺鼻,而且在使用过程中不可避免的会挥发到空气中,接触到操作员皮肤,可能会造成操作员呕吐,皮肤过敏甚至昏厥;对周围环境具有不良影响。
因此,需要一种低毒性水性金属清洗剂,具有优良的抗菌性能、清洗性能,无异味,对人体友好无伤害、无刺激,能保障操作人员的健康和安全,并不对周围环境造成污染;同时,需较长周期不会酸败变质,可以长周期循环添加使用,具有较低的使用成本。
本发明正是基于解决上述现有技术的缺陷而提出具体的解决方案。
发明内容
本发明采用的技术方案如下:
一种含铜离子的水性工业清洗剂,所述水性金属清洗剂的原料按重量份由以下组份组成:0.5-10份水溶性铜盐、1-30份无机碱混合物、1-30乳化剂混合物、0-20份其他功能添加剂,余量的去离子水添加至100份。
在一个具体的实施方式中,所述水溶性铜盐为氯化铜、硫酸铜或者其他水溶性铜盐类中的至少一种,应当理解的是,也可以以其他可以在水中电离出铜离子的水溶性铜盐代替氯化铜或硫酸铜;
在一个具体的实施方式中,所述无机碱为氢氧化钾或者氢氧化钠、硅酸钠、磷酸钾中的的至少一种。
在一个具体的实施方式中,所述乳化剂为市售常见的阴离子、非离子、阳离子或者两性表面活性剂如AEO-9、AEO-3、TX-10、6501、L62等中的一种或者几种的混合物;
在一个优选的实施方式中,所述其他功能添加剂为功能添加剂包括消泡剂、抗硬水剂、以及其他添加剂中的一种或两种以上的混合物。
在一个具体的实施方式中,所述水溶性铜盐为0.5份,无机碱混合物为1份,乳化剂混合物为1份;
在一个具体的实施方式中,所述水溶性铜盐为5份,无机碱混合物为15份,乳化剂混合物为15份,其他功能添加剂为10份;
在一个具体的实施方式中,所述水溶性铜盐为10份,无机碱混合物为30份,乳化剂混合物为30份,其他功能添加剂为20份。
此外本发明还提供了一种含铜离子的水性工业清洗剂的使用方法,含铜离子水性清洗剂与水按重量比1:20-50倍稀释。
本发明的有益技术效果:
本发明的水性工业清洗剂不仅去污能力强、使用寿命长,并且不含甲醛释放型杀菌剂,对人体友好无毒害、无刺激、无腐蚀,能有效保障操作人员的健康和安全,不会对周围环境造成污染;同时因为铜离子的存在具有很好的杀菌防腐效果,工作液不会酸败变质,可以循环添加使用,不会污染环境。
实施方式1:
一种水性工业清洗剂,按重量份由以下组份组成:0.5份氯化铜、1份氢氧化钾、1份AEO9乳化剂、1份乙二胺四乙酸二钠(EDTA2Na),余量的去离子水添加至100份。
实施方式2:
一种水性工业清洗剂,按重量份由以下组份组成:5份硫酸铜、15份氢氧化钠、15份AEO-3乳化剂、10份硅油乳液与乙二胺四乙酸二钠,余量的去离子水添加至100份。
实施方式3:
一种水性工业清洗剂,按重量份由以下组份组成:10份硫酸铜、30份硅酸钠、30份TX-10乳化剂、20份硅油乳液与乙二胺四乙酸四钠,余量的去离子水添加至100份。
实施方式4:
一种水性工业清洗剂,按重量份由以下组份组成:8份氯化铜、25份磷酸钾、25份6501乳化剂、15份硅油乳液与乙二胺四乙酸四钠,余量的去离子水添加至100份。
实施方式5:
一种水性工业清洗剂,按重量份由以下组份组成:8份氯化铜、10份氢氧化钾、15氢氧化钠、25份L62乳化剂、15份硅油乳液与乙二胺四乙酸四钠,余量的去离子水添加至100份。
实施方式6:
一种水性工业清洗剂,按重量份由以下组份组成:8份氯化铜、10份氢氧化钾、15硅酸钠、10份AEO-9、10份AEO-3、18份硅油乳液与醇醚羧酸,余量的去离子水添加至100份。
实施方式7:
一种水性工业清洗剂,按重量份由以下组份组成:10份硫酸铜、10份硅酸钠、15磷酸钾、15份L62、10份TX-10、16份硅油乳液与醇醚羧酸,余量的去离子水添加至100份。
实施方式8:
一种水性工业清洗剂,按重量份由以下组份组成:3份硫酸铜、10份氢氧化钠、12磷酸钾、12份AEO-3、10份6501乳化剂、16份硅油乳液与醇醚羧酸,余量的去离子水添加至100份。
上述工业清洗剂使用时,直接将其与水按重量比1:50倍稀释,用于各种金属件重油污超声波、人工手动清洗即可。
按照JB/T4323.2-1999金属清洗剂的测试方法,对比本发明的铜离子清洗剂与市售某品牌的离子清洗剂。测试结果见下表。
在本测试方法中,清洗力下降20%以上认为清洗剂寿命已到。
从上表中可以看出,本发明提供的铜离子清洗剂与市售清洗剂杀菌能力差异不大,但使用寿命却是市售清洗剂使用寿命的2-3倍,得益于铜离子的良好杀菌效果。
对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现 本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。
此外,应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。
Claims (8)
- 一种含铜离子的水性工业清洗剂,所述水性金属清洗剂按重量份由以下组份组成:0.5-10份水溶性铜盐、1-30份无机碱混合物、1-30乳化剂混合物、0-20份其他功能添加剂,余量的去离子水添加至100份。
- 根据权利要求1所述的含铜离子的水性工业清洗剂,其特征在于:所述水溶性铜盐为氯化铜或硫酸铜或者其他水溶性铜盐类中的至少一种。
- 根据权利要求1所述的含铜离子的水性工业清洗剂,其特征在于:所述无机碱为氢氧化钾或者氢氧化钠、硅酸钠、磷酸钾中的至少一种。
- 根据权利要求1所述的含铜离子的水性工业清洗剂,其特征在于:所述乳化剂为阴离子、非离子、阳离子或者两性表面活性剂中的一种或者几种的混合物。
- 根据权利要求1所述的含铜离子的水性工业清洗剂,其特征在于:所述其他功能添加剂为功能添加剂包括消泡剂、抗硬水剂中的一种或两种以上的混合物。
- 根据权利要求1所述的含铜离子的水性工业清洗剂,其特征在于:所述水溶性铜盐为0.5份,无机碱混合物为1份,乳化剂混合物为1份。
- 根据权利要求1所述的含铜离子的水性工业清洗剂,其特征在于:所述水溶性铜盐为5份,无机碱混合物为15份,乳化剂混合物为15份,其他功能添加剂为10份。
- 根据权利要求1所述的含铜离子的水性工业清洗剂,其特征在于所述水溶性铜盐为10份,无机碱混合物为30份,乳化剂混合物为30份,其他功能添加剂为20份。
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