WO2022006787A1 - 一种3d打印电路板的制备方法 - Google Patents

一种3d打印电路板的制备方法 Download PDF

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WO2022006787A1
WO2022006787A1 PCT/CN2020/100914 CN2020100914W WO2022006787A1 WO 2022006787 A1 WO2022006787 A1 WO 2022006787A1 CN 2020100914 W CN2020100914 W CN 2020100914W WO 2022006787 A1 WO2022006787 A1 WO 2022006787A1
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conductive
circuit board
printed circuit
preparing
insulating liquid
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PCT/CN2020/100914
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English (en)
French (fr)
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王成勇
郭紫莹
刘志华
姚俊雄
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广东工业大学
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Priority to PCT/CN2020/100914 priority Critical patent/WO2022006787A1/zh
Publication of WO2022006787A1 publication Critical patent/WO2022006787A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the invention relates to the technical field of circuit boards, in particular to a preparation method of a 3D printed circuit board.
  • circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board Thin circuit boards, printed (copper etching technology) circuit boards, etc.
  • the circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances.
  • the circuit board can be called a printed circuit board or a printed circuit board, the English name is (Printed Circuit Board) PCB, (Flexible Printed Circuit board) FPC circuit board (FPC circuit board is also called flexible circuit board Flexible circuit board is based on polyimide Or polyester film as the base material is a highly reliable, excellent flexible printed circuit board. It has the characteristics of high wiring density, light weight, thin thickness and good bending.) and soft and hard Combination plate (reechas, Soft and hard combination plate) - The birth and development of FPC and PCB gave birth to the new product of soft and hard combination plate.
  • the flexible and rigid board is a flexible circuit board and a rigid circuit board, which are combined according to relevant process requirements through lamination and other processes to form a circuit board with FPC characteristics and PCB characteristics; 3D printing usually uses digital technology materials. printer to achieve. It is often used to make models in the fields of mold manufacturing, industrial design, etc., and is gradually used for the direct manufacturing of some products. There are already parts printed using this technology.
  • the technology has applications in jewelry, footwear, industrial design, architecture, engineering and construction (AEC), automotive, aerospace, dental and medical industries, education, geographic information systems, civil engineering, firearms, and more.
  • 3D printing technology is also used in the production process of existing circuit boards.
  • the conductive layer or insulating layer is usually printed by layer-by-layer printing.
  • the printing equipment and its printing process are complex, which increases the difficulty of preparation.
  • it is necessary to print a variety of materials with different properties so that the insulating layer and conductive layer of the circuit board will be bent and connected due to the difference in material properties such as thermal expansion coefficient during layer-by-layer printing. Defects such as loose or burnt.
  • the purpose of the present invention is to avoid the deficiencies in the prior art and provide a method for preparing a 3D printed circuit board, which can print with a single material, simplify equipment and processes, and can effectively avoid insulating layers and conductive layers. Defects such as bending, weak connection or burning due to differences in material properties such as thermal expansion coefficient during layer-by-layer printing.
  • a preparation method of a 3D printed circuit board comprising the following steps:
  • Curing molding is performed to make the insulating liquid adhere to the surface of the conductive circuit.
  • the 3D printing technology is one of the selective laser melting technology, the selective laser sintering technology, the laser cladding technology, the electron beam melting technology and the fused deposition modeling technology.
  • the material of the conductive circuit is a conductive material selected from a metal conductive material and a non-metal composite conductive material
  • the metal conductive material is a conductive metal selected from copper, silver, and gold.
  • the non-metal composite conductive material is a non-metal composite conductive material selected from conductive ceramics, conductive resins, and conductive rubber.
  • the insulating liquid is a resin selected from epoxy resin, polyetheretherketone, polyimide, and polyethersulfone.
  • step (2) during the process of applying the insulating liquid to the conductive lines, the conductive lines should be repeatedly leached in the insulating liquid.
  • step (2) the conductive line is in a high-frequency vibration state when immersed in the insulating liquid.
  • the frequency of the high frequency vibration is not less than 20KHz.
  • step (3) after the curing and forming is completed, the position of the exposed circuit in the conductive circuit is to be cut.
  • step (3) during the curing process of the conductive line, the conductive line should rotate.
  • step (3) the curing method is photocuring.
  • the preparation method is first manufactured by 3D printing technology, the conductive lines can be printed with a single material during the production process, thereby simplifying the equipment and process, and then immersed in insulating liquid to make the surface of the conductive lines solidify and insulate It can effectively avoid defects such as bending, weak connection or burning due to the difference in material properties such as thermal expansion coefficient during the layer-by-layer printing of the insulating layer and the conductive layer.
  • FIG. 1 is a process flow diagram of a method for preparing a 3D printed circuit board of the present invention.
  • FIG. 2 is an operational flow chart of a method for preparing a 3D printed circuit board of the present invention.
  • the figure includes: conductive line 1, insulating liquid 2.
  • this embodiment provides a method for preparing a 3D printed circuit board, including the following steps:
  • Curing molding is performed, so that the insulating liquid 2 is attached to the surface of the conductive line 1 .
  • the 3D printing technology includes selective laser melting technology, selective laser sintering technology, laser cladding technology, electron beam melting technology and fused deposition modeling technology.
  • the material of the conductive circuit 1 is a conductive material selected from a metal conductive material and a non-metallic composite conductive material, and the metal conductive material is copper, silver, or gold.
  • the non-metal composite conductive material is a non-metal composite conductive material selected from conductive ceramics, conductive resins and conductive rubbers;
  • the insulating liquid 2 is a resin selected from epoxy resin, polyetheretherketone, polyimide, and polyethersulfone.
  • step (2) during the process of applying the insulating liquid to the conductive circuit 1, the conductive circuit should be repeatedly leached in the insulating liquid 2, which can improve the curing quality of the conductive circuit 1. and rate.
  • the conductive circuit 1 in step (2), is in a high-frequency vibration state when immersed in the insulating liquid 2, and further, the frequency of the high-frequency vibration is not less than 20KHz, which can eliminate air bubbles in the resin .
  • step (3) after the curing and forming, the position of the exposed circuit in the conductive circuit 1 is cut, so that the exposed part can be used for connecting electronic components.
  • step (3) during the curing process of the conductive circuit 1, the conductive circuit 1 needs to rotate.
  • the curing method is photocuring, which can improve the uniformity of photocuring.
  • This embodiment provides a method for preparing a 3D printed circuit board, comprising the following steps:
  • Preparation of conductive lines use 3D printing technology to make conductive lines; the specific process is: use selective laser melting technology to print copper lines layer by layer;
  • Coating insulating liquid immersing the conductive line in the insulating liquid; the specific process is: immersing the conductive line in the insulating photosensitive liquid, and repeatedly leaching the conductive line while vibrating with low amplitude over frequency, the high-frequency vibration The frequency is 21KHz, and the insulating liquid is epoxy resin;
  • Curing molding Curing and molding are performed to make the insulating liquid adhere to the surface of the conductive line; the specific process is: photocuring the immersed conductive line, and ensuring that the conductive line rotates during the process of photocuring, and finally to the conductive line. The position of the exposed circuit in the circuit is cut, and the exposed part is used to connect electronic components to obtain the final 3D printed PCB board.
  • This embodiment provides a method for preparing a 3D printed circuit board, comprising the following steps:
  • Preparation of conductive lines use 3D printing technology to make conductive lines; the specific process is: use selective laser sintering technology to print silver lines layer by layer;
  • Coating insulating liquid immersing the conductive line in the insulating liquid; the specific process is: immersing the conductive line in the insulating photosensitive liquid, and repeatedly leaching the conductive line while vibrating with low amplitude over frequency, the high-frequency vibration The frequency is 22KHz, and the insulating liquid is polyether ether ketone;
  • Curing molding Curing and molding are performed to make the insulating liquid adhere to the surface of the conductive line; the specific process is: photocuring the immersed conductive line, and ensuring that the conductive line rotates during the process of photocuring, and finally to the conductive line. The position of the exposed circuit in the circuit is cut, and the exposed part is used to connect electronic components to obtain the final 3D printed PCB board.
  • This embodiment provides a method for preparing a 3D printed circuit board, comprising the following steps:
  • Preparation of conductive lines use 3D printing technology to make conductive lines; the specific process is: use selective laser melting technology to print gold lines layer by layer;
  • Coating insulating liquid immersing the conductive line in the insulating liquid; the specific process is: immersing the conductive line in the insulating photosensitive liquid, and repeatedly leaching the conductive line while vibrating with low amplitude over frequency, the high-frequency vibration The frequency is 20KHz, and the insulating liquid is polyimide;
  • Curing molding Curing and molding are performed to make the insulating liquid adhere to the surface of the conductive line; the specific process is: photocuring the immersed conductive line, and ensuring that the conductive line rotates during the process of photocuring, and finally to the conductive line. The position of the exposed circuit in the circuit is cut, and the exposed part is used to connect electronic components to obtain the final 3D printed PCB board.
  • the preparation method is first manufactured by 3D printing technology, the conductive lines can be printed with a single material during the production process, thereby simplifying equipment and processes, and then immersed in insulating liquid to make the conductive lines
  • the insulating layer is cured on the surface, which can effectively avoid defects such as bending, weak connection or burning caused by the difference in material properties such as thermal expansion coefficient during the layer-by-layer printing of the insulating layer and the conductive layer.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

一种3D打印电路板的制备方法，包括以下步骤：（1）制备导电线路，使用3D打印技术制作导电线路；（2）涂履绝缘液，将导电线路浸没在绝缘液体中；（3）固化成型，进行固化成型，使得绝缘液体附着在导电线路表面。该制备方法能够用单一材料进行打印，简化设备和工艺，同时能够有效避免绝缘层和导电层在逐层打印时因热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦等缺陷。

Description

一种3D打印电路板的制备方法 技术领域
本发明涉及线路板技术领域，特别是涉及一种3D打印电路板的制备方法。
背景技术
电路板的名称有：陶瓷电路板，氧化铝陶瓷电路板，氮化铝陶瓷电路板，线路板，PCB板，铝基板，高频板，厚铜板，阻抗板，PCB，超薄线路板，超薄电路板，印刷(铜刻蚀技术)电路板等。电路板使电路迷你化、直观化，对于固定电路的批量生产和优化用电器布局起重要作用。电路板可称为印刷线路板或印刷电路板，英文名称为(Printed Circuit Board)PCB、(Flexible Printed Circuit board)FPC线路板(FPC线路板又称柔性线路板柔性电路板是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板。具有配线密度高、重量轻、厚度薄、弯折性好的特点。)和软硬结合板(reechas，Soft and hard combination plate)-FPC与PCB的诞生与发展，催生了软硬结合板这一新产品。因此，软硬结合板，就是柔性线路板与硬性线路板，经过压合等工序，按相关工艺要求组合在一起，形成的具有FPC特性与PCB特性的线路板；3D打印通常是采用数字技术材料打印机来实现的。常在模具制造、工业设计等领域被用于制造模型，后逐渐用于一些产品的直接制造，已经有使用这种技术打印而成的零部件。该技术在珠宝、鞋类、工业设计、建筑、工程和施工(AEC)、汽车，航空航天、牙科和医疗产业、教育、地理信息系统、土木工程、枪支以及其他领域都有所应用。
现有的电路板在制作的过程当中也会用到3D打印技术，目前在使用3D打印技术制备电路板时，通常是采用逐层打印的方法打印导电层或绝缘层，但是这种方法不仅使得打印设备及其打印工艺复杂、提高制备难度，同时需要对多种不同性质材料进行打印，使得电路板的绝缘层和导电层在逐层打印时会受热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦等缺陷。
发明内容
本发明的目的在于避免现有技术中的不足之处而提供一种3D打印电路板的制备方法，该制备方法能够用单一材料的打印，简化设备和工艺，同时能够有效避免绝缘层和导电层在逐层打印时因热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦等缺陷。
本发明的目的通过以下技术方案实现：
一种3D打印电路板的制备方法，包括以下步骤：
(1)制备导电线路：使用3D打印技术制作导电线路；
(2)涂履绝缘液：将导电线路浸没在绝缘液体中；
(3)固化成型：进行固化成型，使得绝缘液体附着在导电线路表面。
进一步的，步骤(1)中，所述3D打印技术为选区激光熔化成型技术、选区激光烧结成型技术、激光熔覆成型技术、电子束熔化技术和熔融沉积成形技术中的一种技术。
进一步的，步骤(1)中，所述导电线路的材料为金属导电材质、非金属复合型导电材质中的一种导电材质，所述金属导电材质为铜，银，金中的一种导电金属或多种合金导电金属；所述非金属复合型导电材料为导电陶瓷、导电树脂、导电橡胶中的一种非金属复合型导电材料。
进一步的，步骤(2)中，所述绝缘液体为环氧树脂、聚醚醚酮、聚酰亚胺、聚醚砜中的一种树脂。
进一步的，步骤(2)中，所述导电线路在涂履绝缘液涂履绝缘液的过程当中，导电线路要在在绝缘液体中反复浸提。
进一步的，步骤(2)中，所述导电线路浸没在绝缘液体中时为高频振动状态。
进一步的，所述高频振动的频率不小于20KHz。
进一步的，步骤(3)中，所述固化成型结束后，要对导电线路中暴露电路的位置进行切削。
进一步的，步骤(3)中，所述导电线路在固化的过程中，导电线路要发生转动。
进一步的，步骤(3)中，所述固化方式为光固化。
有益效果：由于该制备方法首先通过用3D打印技术制造，使得导电线路在制作的过程当中能够用单一材料的打印，进而简化设备和工艺，然后通过浸泡在绝缘液体中，使得导电线路表面固化绝缘层，进而能够有效避免绝缘层和导电层在逐层打印时因热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦等缺陷。
附图说明
利用附图对发明作进一步说明，但附图中的实施例不构成对本发明的任何限制，对于本领域的普通技术人员，在不付出创造性劳动的前提下，还可以根据以下附图获得其它的附图。
图1是本发明的一种3D打印电路板的制备方法的工艺流程图。
图2是本发明的一种3D打印电路板的制备方法的操作流程图。
图中包括有：导电线路1、绝缘液体2。
具体实施方式
结合以下实施例对本发明作进一步描述。
如图1-2所示，本实施例提供一种3D打印电路板的制备方法，包括以下步骤：
(1)制备导电线路1：使用3D打印技术制作导电线路1；
(2)涂履绝缘液：将导电线路1浸没在绝缘液体2中；
(3)固化成型：进行固化成型，使得绝缘液体2附着在导电线路1表面。
在优选实施例中，步骤(1)中，所述3D打印技术包括有选区激光熔化成型技术、选区激光烧结成型技术、激光熔覆成型技术、电子束熔化技术和熔融沉积成形技术。
在优选实施例中，步骤(1)中，所述导电线路1的材料为金属导电材质、非金属复合型导电材质中的一种导电材质，所述金属导电材质为铜，银，金中的一种导电金属或多种合金导电金属；所述非金属复合型导电材料为导电陶瓷、导电树脂、导电橡胶中的一种非金属复合型导电材料；
在优选实施例中，步骤(2)中，所述绝缘液体2为环氧树脂、聚醚醚酮、聚酰亚胺、聚醚砜中的一种树脂。
在优选实施例中，步骤(2)中，所述导电线路1在涂履绝缘液涂履绝缘液的过程当中，导电线路要在在绝缘液体2中反复浸提，可以提高导电线路1固化质量和速率。
在优选实施例中，步骤(2)中，所述导电线路1浸没在绝缘液体2中时为高频振动状态，进一步的，所述高频振动的频率不小于20KHz，可以消除树脂中的气泡。
在优选实施例中，步骤(3)中，所述固化成型结束后，要对导电线路1中暴露电路的位置进行切削，可以使得暴露的局部用于连接电子元件。
在优选实施例中，步骤(3)中，所述导电线路1在固化的过程中，导电线路1要发生转动，进一步的，所述固化方式为光固化，可以提高光固化的均匀。
实施例1
本实施例提供一种3D打印电路板的制备方法，包括以下步骤：
(1)制备导电线路：使用3D打印技术制作导电线路；具体工艺是：使用选区激光熔化成型技术逐层打印铜线路；
(2)涂履绝缘液：将导电线路浸没在绝缘液体中；具体工艺是：将导电线路浸泡在绝缘光敏液体中，导电线路在超频低幅度震动的同时反复浸提,所述高频振动的频率为21KHz，所述绝缘液体为环氧树脂；
(3)固化成型：进行固化成型，使得绝缘液体附着在导电线路表面；具体工艺是：将浸泡 后的导电线路进行光固化，并且在光固化的过程当中保证导电线路发生转动，最后将要对导电线路中暴露电路的位置进行切削，暴露的局部用于连接电子元件，获得最终的3D打印PCB板材。
实施例2
本实施例提供一种3D打印电路板的制备方法，包括以下步骤：
(1)制备导电线路：使用3D打印技术制作导电线路；具体工艺是：使用选区激光烧结成型技术逐层打印银线路；
(2)涂履绝缘液：将导电线路浸没在绝缘液体中；具体工艺是：将导电线路浸泡在绝缘光敏液体中，导电线路在超频低幅度震动的同时反复浸提,所述高频振动的频率为22KHz，所述绝缘液体为聚醚醚酮；
(3)固化成型：进行固化成型，使得绝缘液体附着在导电线路表面；具体工艺是：将浸泡后的导电线路进行光固化，并且在光固化的过程当中保证导电线路发生转动，最后将要对导电线路中暴露电路的位置进行切削，暴露的局部用于连接电子元件，获得最终的3D打印PCB板材。
实施例3
本实施例提供一种3D打印电路板的制备方法，包括以下步骤：
(1)制备导电线路：使用3D打印技术制作导电线路；具体工艺是：使用选区激光熔化成型技术逐层打印金线路；
(2)涂履绝缘液：将导电线路浸没在绝缘液体中；具体工艺是：将导电线路浸泡在绝缘光敏液体中，导电线路在超频低幅度震动的同时反复浸提,所述高频振动的频率为20KHz，所述绝缘液体为聚酰亚胺；
(3)固化成型：进行固化成型，使得绝缘液体附着在导电线路表面；具体工艺是：将浸泡后的导电线路进行光固化，并且在光固化的过程当中保证导电线路发生转动，最后将要对导电线路中暴露电路的位置进行切削，暴露的局部用于连接电子元件，获得最终的3D打印PCB板材。
本发明的有益效果：由于该制备方法首先通过用3D打印技术制造，使得导电线路在制作的过程当中能够用单一材料的打印，进而简化设备和工艺，然后通过浸泡在绝缘液体中，使得导电线路表面固化绝缘层，进而能够有效避免绝缘层和导电层在逐层打印时因热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦等缺陷。
最后应当说明的是，以上实施例仅用以说明本发明的技术方案，而非对本发明保护 范围的限制，尽管参照较佳实施例对本发明作了详细地说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的实质和范围。

Claims (10)

  1. 一种3D打印电路板的制备方法，其特征在于：包括以下步骤：
    (1)制备导电线路：使用3D打印技术制作导电线路；
    (2)涂履绝缘液：将导电线路浸没在绝缘液体中；
    (3)固化成型：进行固化成型，使得绝缘液体附着在导电线路表面。
  2. 如权利要1所述的一种3D打印电路板的制备方法，其特征在于：步骤(1)中，所述3D打印技术为选区激光熔化成型技术、选区激光烧结成型技术、激光熔覆成型技术、电子束熔化技术和熔融沉积成形技术中的一种技术。
  3. 如权利要求1所述的一种3D打印电路板的制备方法，其特征在于：步骤(1)中，所述导电线路的材料为金属导电材质、非金属复合型导电材质中的一种导电材质，所述金属导电材质为铜，银，金中的一种导电金属或多种合金导电金属；所述非金属复合型导电材料为导电陶瓷、导电树脂、导电橡胶中的一种非金属复合型导电材料。
  4. 如权利要求1所述的一种3D打印电路板的制备方法，其特征在于：步骤(2)中，所述绝缘液体为环氧树脂、聚醚醚酮、聚酰亚胺、聚醚砜中的一种树脂。
  5. 如权利要1所述的一种3D打印电路板的制备方法，其特征在于：步骤(2)中，所述导电线路在涂履绝缘液涂履绝缘液的过程当中，导电线路要在在绝缘液体中反复浸提。
  6. 如权利要1所述的一种3D打印电路板的制备方法，其特征在于：步骤(2)中，所述导电线路浸没在绝缘液体中时为高频振动状态。
  7. 如权利要1所述的一种3D打印电路板的制备方法，其特征在于：所述高频振动的频率不小于20KHz。
  8. 如权利要1所述的一种3D打印电路板的制备方法，其特征在于：步骤(3)中，所述固化成型结束后，要对导电线路中暴露电路的位置进行切削。
  9. 如权利要1所述的一种3D打印电路板的制备方法，其特征在于：步骤(3)中，所述导电线路在固化的过程中，导电线路要发生转动。
  10. 如权利要1所述的一种3D打印电路板的制备方法，其特征在于：步骤(3)中，所述固化方式为光固化。
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