WO2022000747A1 - Method for preparing array substrate, and array substrate and display panel - Google Patents
Method for preparing array substrate, and array substrate and display panel Download PDFInfo
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- WO2022000747A1 WO2022000747A1 PCT/CN2020/112083 CN2020112083W WO2022000747A1 WO 2022000747 A1 WO2022000747 A1 WO 2022000747A1 CN 2020112083 W CN2020112083 W CN 2020112083W WO 2022000747 A1 WO2022000747 A1 WO 2022000747A1
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- base substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 215
- 238000000034 method Methods 0.000 title claims abstract description 23
- 229920002120 photoresistant polymer Polymers 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 12
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000005286 illumination Methods 0.000 claims description 3
- 238000002161 passivation Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 351
- 238000005538 encapsulation Methods 0.000 description 5
- 239000002346 layers by function Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
Definitions
- the present application relates to the technical field of OLED displays, and in particular, to a method for preparing an array substrate, an array substrate and a display panel.
- a separate light-shielding layer mask is usually required to form the light-shielding layer pattern, and the formed light-shielding layer pattern is used to block external light from entering the channel region of the active layer and prevent the leakage current of the TFT device.
- the phenomenon occurs, but the use of a light-shielding layer mask to form the light-shielding layer pattern alone increases the production cost.
- the existing array substrate has the technical problem that the cost of forming the light shielding layer is relatively high.
- the embodiment of the present application provides an array substrate, which can alleviate the technical problem of high cost of forming a light shielding layer in the existing array substrate.
- Embodiments of the present application provide a method for fabricating an array substrate, including:
- a semiconductor layer is prepared on the buffer layer, and the active layer mask is used to pattern the semiconductor layer again to form an active layer that is consistent and coincident with the light shielding layer pattern;
- a gate insulating layer, a gate electrode, a passivation layer, a source/drain electrode, and a flat layer are sequentially prepared on the semiconductor layer to form the array substrate.
- the method further includes:
- the opaque photoresist layer is exposed through an active layer mask and uniform light perpendicular to the active layer mask, and a developing solution is applied to form a pattern of the light shielding layer.
- the method further includes:
- the method further includes:
- the opaque photoresist layer is exposed through an active layer mask and light with uneven light intensity perpendicular to the active layer mask, and a developing solution is applied to form a pattern of the light shielding layer.
- the method further includes:
- the orthographic projection of the light shielding layer pattern on the base substrate covers the orthographic projection of the active layer pattern on the base substrate.
- Embodiments of the present application provide an array substrate, including:
- the light-shielding layer is disposed on the base substrate, and the light-shielding layer includes a light-shielding layer pattern;
- the active layer disposed on the buffer layer, the active layer including an active layer pattern
- the orthographic projection of the light shielding layer pattern on the base substrate covers the orthographic projection of the active layer pattern on the base substrate.
- the orthographic projection of the light shielding layer pattern on the base substrate overlaps with the orthographic projection of the active layer pattern on the base substrate.
- the orthographic shape of the light shielding layer pattern and the active layer pattern on the base substrate is the same.
- the cross-sectional shape of the light shielding layer pattern is any one of a rectangle, a rhombus, a parallelogram, and a circle.
- the orthographic projection of the light shielding layer pattern on the base substrate is the same as the area of the orthographic projection of the active layer pattern on the base substrate.
- the area of the orthographic projection of the light shielding layer pattern on the base substrate is larger than the area of the orthographic projection of the active layer pattern on the base substrate.
- the orthographic projection of the light-shielding layer pattern on the base substrate and the orthographic projection of the active layer pattern on the base substrate are both a mosaic of multiple rectangles combination.
- the head and tail ends of the rectangle are connected to each other.
- the light shielding layer pattern is any one of two, three, or four rectangular splicing combinations.
- the orthographic projection of the light shielding layer pattern on the base substrate is an enlarged figure of the orthographic projection of the active layer pattern on the base substrate.
- the display panel provided by the embodiment of the present application includes an array substrate, and the array substrate includes: a light shielding layer, a buffer layer disposed on the light shielding layer, and an active layer disposed on the buffer layer, the light shielding layer provided on the base substrate, the light-shielding layer includes a light-shielding layer pattern, and the active layer includes an active layer pattern, wherein the orthographic projection of the light-shielding layer pattern on the base substrate covers the active layer.
- the orthographic projection of the source layer pattern on the base substrate includes: a light shielding layer, a buffer layer disposed on the light shielding layer, and an active layer disposed on the buffer layer, the light shielding layer provided on the base substrate, the light-shielding layer includes a light-shielding layer pattern, and the active layer includes an active layer pattern, wherein the orthographic projection of the light-shielding layer pattern on the base substrate covers the active layer.
- the orthographic projection of the source layer pattern on the base substrate includes: a light shield
- the orthographic projection of the light shielding layer pattern on the base substrate overlaps with the orthographic projection of the active layer pattern on the base substrate.
- the shape of the orthographic projection of the light shielding layer pattern and the active layer pattern on the base substrate is the same.
- the orthographic projection of the light shielding layer pattern on the base substrate is the same as the area of the orthographic projection of the active layer pattern on the base substrate.
- the orthographic projection of the light-shielding layer pattern on the base substrate and the orthographic projection of the active layer pattern on the base substrate are both a mosaic combination of multiple rectangles.
- the method for preparing an array substrate includes using an active layer mask to form the light shielding layer pattern, and then using the active layer mask to form an active layer pattern, and the light shielding layer pattern is formed on the base substrate.
- the projection covers the orthographic projection of the active layer pattern on the base substrate; the light shielding layer and the active layer are formed by sharing an active layer mask, which saves a light shielding layer mask and solves the problem of existing array substrates.
- the technical problem of high cost of forming the light shielding layer includes using an active layer mask to form the light shielding layer pattern, and then using the active layer mask to form an active layer pattern, and the light shielding layer pattern is formed on the base substrate.
- the projection covers the orthographic projection of the active layer pattern on the base substrate; the light shielding layer and the active layer are formed by sharing an active layer mask, which saves a light shielding layer mask and solves the problem of existing array substrates.
- the technical problem of high cost of forming the light shielding layer includes using an active layer mask to form the light shielding
- FIG. 1 is a schematic flowchart of a method for fabricating an array substrate according to an embodiment of the present application
- FIG. 2 is a schematic cross-sectional view of an array substrate provided by an embodiment of the present application.
- FIG. 3 is a schematic top view of a light-shielding pattern and an active layer pattern of an array substrate according to an embodiment of the present application.
- a base substrate 10 a light shielding layer 201 , a buffer layer 202 , an active layer 203 , a pixel definition layer 30 , a light-emitting functional layer 40 , and an encapsulation layer 50 .
- first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as “first”, “second” may expressly or implicitly include one or more of said features. In the description of the present application, “plurality” means two or more, unless otherwise expressly and specifically defined.
- the steps of forming the array substrate include:
- S5 prepare a semiconductor layer on the buffer layer 202, and use the active layer 203 mask to pattern the semiconductor layer again to form an active layer that is consistent with and overlaps the pattern of the light shielding layer 201 203;
- S6 sequentially preparing a gate insulating layer, a gate electrode, a passivation layer, a source/drain electrode, and a flat layer on the semiconductor layer to form the array substrate.
- the method for fabricating the array substrate includes using the active layer 203 mask to form the light shielding layer 201 pattern, and then using the active layer 203 mask to form the active layer 203 pattern, and the light shielding layer 201 pattern in the
- the orthographic projection on the base substrate 10 covers the pattern of the active layer 203 on the base substrate 10; the light shielding layer 201 and the active layer 203 share a mask for the active layer 203, which saves one light shielding
- the layer 201 mask solves the technical problem of high cost of forming the light shielding layer 201 in the existing array substrate.
- the step of forming the pattern of the light shielding layer 201 it further includes:
- the opaque photoresist layer is exposed through the mask of the active layer 203 and the uniform light perpendicular to the mask of the active layer 203 , and a developing solution is applied to form a pattern of the light shielding layer 201 .
- step of forming the pattern of the active layer 203 it further includes:
- the orthographic projection of the pattern on the base substrate 10 overlaps with the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 .
- the step of forming the pattern of the light shielding layer 201 it further includes:
- the opaque photoresist layer is exposed through the mask of the active layer 203 and the light with uneven light intensity perpendicular to the mask of the active layer 203 , and a developing solution is applied to form a pattern of the light-shielding layer 201 .
- the step of forming the pattern of the light shielding layer 201 it further includes:
- the array substrate provided in this embodiment of the present application includes a light-shielding layer 201 , a buffer layer 202 , and an active layer 203 , the light-shielding layer 201 is disposed on the base substrate 10 , and the light-shielding layer 201 includes a light-shielding layer 201 .
- layer 201 pattern the buffer layer 202 is arranged on the light shielding layer 201, the active layer 203 is arranged on the buffer layer 202, the active layer 203 includes the pattern of the active layer 203, wherein the The orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 covers the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the array substrate includes a light-shielding layer 201, a buffer layer 202, and an active layer 203
- the light-shielding layer 201 is disposed on the base substrate 10
- the light-shielding layer 201 includes a pattern of the light-shielding layer 201
- the The buffer layer 202 is disposed on the light-shielding layer 201
- the active layer 203 is disposed on the buffer layer 202
- the active layer 203 includes a pattern of the active layer 203, wherein the pattern of the light-shielding layer 201 is in all
- the orthographic projection on the base substrate 10 covers the orthographic projection of the pattern of the active layer 203 on the base substrate 10; the light-shielding layer 201 and the active layer 203 share a mask for the active layer 203, which saves money.
- a light shield for the light shielding layer 201 solves the technical problem of high cost of forming the light shielding layer 201 in the existing array substrate.
- the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 overlaps with the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the shape of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the area of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the cross-sectional shape of the pattern of the light shielding layer 201 is a rectangle.
- the cross-sectional shape of the pattern of the light shielding layer 201 is a rhombus.
- the cross-sectional shape of the pattern of the light shielding layer 201 is a parallelogram.
- the cross-sectional shape of the pattern of the light shielding layer 201 is a circle.
- the orthographic projection shapes of the light shielding layer 201 pattern and the active layer 203 pattern on the base substrate 10 are the same.
- the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 and the orthographic projection of the pattern of the active layer 203 on the base substrate 10 are both a mosaic of multiple rectangles combination.
- the pattern of the light-shielding layer 201 may be a mosaic combination of three rectangles.
- the pattern of the light-shielding layer 201 may also be a splicing combination of four rectangles.
- the head and tail ends of the rectangle are connected to each other.
- the OLED display panel includes a base substrate 10 , an array substrate, a pixel definition layer 30 , a light-emitting functional layer 40 , and an encapsulation layer 50 , wherein the array substrate includes a light-shielding layer 201 , a buffer layer layer 202, an active layer 203, the light shielding layer 201 is disposed on the base substrate 10, the light shielding layer 201 includes a pattern of the light shielding layer 201, the buffer layer 202 is disposed on the light shielding layer 201, the The active layer 203 is disposed on the buffer layer 202 , and the active layer 203 includes a pattern of the active layer 203 , wherein the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 covers the active layer 203 .
- the orthographic projection of the layer 203 pattern on the base substrate 10 includes a pattern of the base substrate 10 .
- the OLED display panel includes an array substrate, the array substrate includes a base substrate 10, an array substrate, a pixel definition layer 30, a light-emitting functional layer 40, and an encapsulation layer 50, the array substrate includes a light shielding layer 201, a buffer layer layer 202, active layer 203, the light shielding layer 201 is disposed on the base substrate 10, the light shielding layer 201 includes a pattern of the light shielding layer 201, the buffer layer 202 is disposed on the light shielding layer 201, the The active layer 203 is disposed on the buffer layer 202 , and the active layer 203 includes a pattern of the active layer 203 , wherein the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 covers the active layer 203 .
- Orthographic projection of the pattern of the layer 203 on the base substrate 10; the light-shielding layer 201 and the active layer 203 are formed by sharing a mask of the active layer 203, saving a mask of the light-shielding layer 201 and solving the problem of existing array substrates. It is a technical problem that the cost of forming the light shielding layer 201 is relatively high.
- the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 overlaps with the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the shape of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the area of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the cross-sectional shape of the pattern of the light shielding layer 201 is a rectangle.
- the cross-sectional shape of the pattern of the light shielding layer 201 is a rhombus.
- the cross-sectional shape of the pattern of the light shielding layer 201 is a parallelogram.
- the cross-sectional shape of the pattern of the light shielding layer 201 is a circle.
- the orthographic shape of the pattern of the light shielding layer 201 and the pattern of the active layer 203 on the base substrate 10 is the same.
- the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 and the orthographic projection of the pattern of the active layer 203 on the base substrate 10 are the same It is a splicing combination of multiple rectangles.
- the pattern of the light-shielding layer 201 may be a mosaic combination of three rectangles.
- the pattern of the light-shielding layer 201 may also be a splicing combination of four rectangles.
- the head and tail ends of the rectangle are connected to each other.
- the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the orthographic projection of the pattern of the active layer 203 on the base substrate 10 Zoom in on the graph.
- the OLED display device includes an array substrate, an optical film, a reflective sheet, a glass substrate, and a diffuser.
- the array substrate includes a base substrate 10 , an array substrate, a pixel definition layer 30 , The light-emitting functional layer 40 and the encapsulation layer 50, the array substrate includes a light-shielding layer 201, a buffer layer 202, and an active layer 203, the light-shielding layer 201 is disposed on the base substrate 10, and the light-shielding layer 201 includes a light-shielding layer 201 pattern, the buffer layer 202 is arranged on the light shielding layer 201, the active layer 203 is arranged on the buffer layer 202, the active layer 203 includes the pattern of the active layer 203, wherein the light shielding layer 203
- the orthographic projection of the pattern of the layer 201 on the base substrate 10 covers the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the OLED display device includes an array substrate, the array substrate includes a base substrate 10, an array substrate, a pixel definition layer 30, a light-emitting functional layer 40, and an encapsulation layer 50, the array substrate includes a light shielding layer 201, a buffer layer layer 202, an active layer 203, the light shielding layer 201 is disposed on the base substrate 10, the light shielding layer 201 includes a pattern of the light shielding layer 201, the buffer layer 202 is disposed on the light shielding layer 201, the The active layer 203 is disposed on the buffer layer 202 , and the active layer 203 includes a pattern of the active layer 203 , wherein the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 covers the active layer 203 .
- the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 overlaps with the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the shape of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the area of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
- the cross-sectional shape of the pattern of the light shielding layer 201 is a rectangle.
- the cross-sectional shape of the pattern of the light shielding layer 201 is a rhombus.
- the cross-sectional shape of the pattern of the light shielding layer 201 is a parallelogram.
- the cross-sectional shape of the pattern of the light shielding layer 201 is a circle.
- the orthographic shape of the pattern of the light shielding layer 201 and the pattern of the active layer 203 on the base substrate 10 is the same.
- the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 and the orthographic projection of the pattern of the active layer 203 on the base substrate 10 are the same It is a splicing combination of multiple rectangles.
- the pattern of the light-shielding layer 201 may be a mosaic combination of three rectangles.
- the pattern of the light-shielding layer 201 may also be a splicing combination of four rectangles.
- the head and tail ends of the rectangle are connected to each other.
- the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the pattern of the active layer 203 on the base substrate Enlarged figure in orthographic projection on 10.
- the display panel provided by the embodiment of the present application includes an array substrate, and the array substrate includes: a light shielding layer, a buffer layer disposed on the light shielding layer, and an active layer disposed on the buffer layer, the light shielding layer provided on the base substrate, the light-shielding layer includes a light-shielding layer pattern, and the active layer includes an active layer pattern, wherein the orthographic projection of the light-shielding layer pattern on the base substrate covers the active layer.
- the orthographic projection of the source layer pattern on the base substrate includes: a light shielding layer, a buffer layer disposed on the light shielding layer, and an active layer disposed on the buffer layer, the light shielding layer provided on the base substrate, the light-shielding layer includes a light-shielding layer pattern, and the active layer includes an active layer pattern, wherein the orthographic projection of the light-shielding layer pattern on the base substrate covers the active layer.
- the orthographic projection of the source layer pattern on the base substrate includes: a light shield
- the orthographic projection of the light shielding layer pattern on the base substrate overlaps with the orthographic projection of the active layer pattern on the base substrate.
- the shape of the orthographic projection of the light shielding layer pattern and the active layer pattern on the base substrate is the same.
- the orthographic projection of the light shielding layer pattern on the base substrate is the same as the area of the orthographic projection of the active layer pattern on the base substrate.
- the orthographic projection of the light-shielding layer pattern on the base substrate and the orthographic projection of the active layer pattern on the base substrate are both a mosaic combination of multiple rectangles.
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Abstract
A method for preparing an array substrate. The method comprises: forming a light-shielding layer pattern by using an active layer mask, and then forming an active layer pattern by using the active layer mask, wherein an orthographic projection of the light-shielding layer pattern on a base substrate covers an orthographic projection of the active layer pattern on the base substrate. A light-shielding layer and an active layer are formed by using the same active layer mask, such that a light-shielding layer mask is saved, thereby solving the technical problem of it being relatively costly to form a light-shielding layer for an existing array substrate.
Description
本申请涉及OLED显示技术领域,尤其涉及一种阵列基板制备方法、一种阵列基板和一种显示面板。The present application relates to the technical field of OLED displays, and in particular, to a method for preparing an array substrate, an array substrate and a display panel.
现有阵列基板制备方法中,通常需要单独的遮光层光罩来形成所述遮光层图案,形成的所述遮光层图案用于遮外部光线进入有源层的沟道区,防止TFT器件漏电流现象的发生,但是单独采用遮光层光罩来形成遮光层图案增加了生产成本。In the existing array substrate preparation method, a separate light-shielding layer mask is usually required to form the light-shielding layer pattern, and the formed light-shielding layer pattern is used to block external light from entering the channel region of the active layer and prevent the leakage current of the TFT device. The phenomenon occurs, but the use of a light-shielding layer mask to form the light-shielding layer pattern alone increases the production cost.
因此,现有阵列基板存在形成遮光层的成本较高的技术问题。Therefore, the existing array substrate has the technical problem that the cost of forming the light shielding layer is relatively high.
本申请实施例提供一种阵列基板,可缓解现有阵列基板存在形成遮光层的成本较高的技术问题。The embodiment of the present application provides an array substrate, which can alleviate the technical problem of high cost of forming a light shielding layer in the existing array substrate.
本申请实施例提供一种阵列基板制备方法,包括:Embodiments of the present application provide a method for fabricating an array substrate, including:
提供一衬底基板;providing a base substrate;
在所述衬底基板上制备一不透光的光阻层;preparing an opaque photoresist layer on the base substrate;
使用有源层光罩对所述光阻层进行图案化处理,形成遮光层; using an active layer mask to pattern the photoresist layer to form a light shielding layer;
在所述遮光层上方形成缓冲层;forming a buffer layer over the light shielding layer;
在所述缓冲层上制备一半导体层,再次使用所述有源层光罩对所述半导体层进行图案化处理,形成与所述遮光层图案一致且相重合的有源层;A semiconductor layer is prepared on the buffer layer, and the active layer mask is used to pattern the semiconductor layer again to form an active layer that is consistent and coincident with the light shielding layer pattern;
依次在所述半导体层上制备栅绝缘层、栅极、钝化层、源/漏极、以及平坦层,形成所述阵列基板。A gate insulating layer, a gate electrode, a passivation layer, a source/drain electrode, and a flat layer are sequentially prepared on the semiconductor layer to form the array substrate.
在本申请实施例提供的阵列基板制备方法中,在形成所述遮光层图案的步骤中,还包括:In the method for fabricating the array substrate provided in the embodiment of the present application, in the step of forming the light-shielding layer pattern, the method further includes:
通过有源层光罩、以及垂直于所述有源层光罩的均匀光线曝光所述不透光的光阻层,涂布显影液形成一所述遮光层图案。The opaque photoresist layer is exposed through an active layer mask and uniform light perpendicular to the active layer mask, and a developing solution is applied to form a pattern of the light shielding layer.
在本申请实施例提供的阵列基板制备方法中,在形成所述有源层图案的步骤中,还包括:In the method for fabricating the array substrate provided in the embodiment of the present application, in the step of forming the active layer pattern, the method further includes:
通过有源层光罩、以及垂直于所述有源层光罩的均匀光线曝光所述半导体层,涂布显影液形成一所述有源层图案,形成的所述有源层图案在所述衬底基板上的正投影与所述遮光层图案在所述衬底基板上的正投影重叠。Expose the semiconductor layer through an active layer mask and uniform light perpendicular to the active layer mask, apply a developer to form a pattern of the active layer, and the active layer pattern formed is in the The orthographic projection on the base substrate overlaps with the orthographic projection of the light shielding layer pattern on the base substrate.
在本申请实施例提供的阵列基板制备方法中,在形成所述遮光层图案的步骤中,还包括:In the method for fabricating the array substrate provided in the embodiment of the present application, in the step of forming the light-shielding layer pattern, the method further includes:
通过有源层光罩、以及垂直于所述有源层光罩的光照强度不均的光线曝光所述不透光的光阻层,涂布显影液形成一所述遮光层图案。The opaque photoresist layer is exposed through an active layer mask and light with uneven light intensity perpendicular to the active layer mask, and a developing solution is applied to form a pattern of the light shielding layer.
在本申请实施例提供的阵列基板制备方法中,在形成所述遮光层图案的步骤中,还包括:In the method for fabricating the array substrate provided in the embodiment of the present application, in the step of forming the light-shielding layer pattern, the method further includes:
通过有源层光罩、以及与所述有源层光罩呈锐角且光照强度不均的光线曝光所述不透光的光阻层,涂布显影液形成一所述遮光层图案,得到的遮光层图案在所述衬底基板上的正投影覆盖所述有源层图案在所述衬底基板上的正投影。Expose the opaque photoresist layer through the active layer mask and the light at an acute angle with the active layer mask and with uneven illumination intensity, and apply a developer to form a pattern of the light shielding layer. The orthographic projection of the light shielding layer pattern on the base substrate covers the orthographic projection of the active layer pattern on the base substrate.
本申请实施例提供一种阵列基板,包括:Embodiments of the present application provide an array substrate, including:
遮光层,所述遮光层设置在所述衬底基板上,所述遮光层包括遮光层图案;以及a light-shielding layer, the light-shielding layer is disposed on the base substrate, and the light-shielding layer includes a light-shielding layer pattern; and
设置在所述遮光层上的缓冲层;以及a buffer layer disposed on the light shielding layer; and
设置在所述缓冲层上的有源层,所述有源层包括有源层图案;an active layer disposed on the buffer layer, the active layer including an active layer pattern;
其中,所述遮光层图案在所述衬底基板上的正投影覆盖所述有源层图案在所述衬底基板上的正投影。Wherein, the orthographic projection of the light shielding layer pattern on the base substrate covers the orthographic projection of the active layer pattern on the base substrate.
在本申请实施例提供的阵列基板中,所述遮光层图案在所述衬底基板上的正投影与所述有源层图案在所述衬底基板上的正投影重叠。In the array substrate provided by the embodiment of the present application, the orthographic projection of the light shielding layer pattern on the base substrate overlaps with the orthographic projection of the active layer pattern on the base substrate.
在本申请实施例提供的阵列基板中,所述遮光层图案和所述有源层图案在所述衬底基板上的正投影形状相同。In the array substrate provided in the embodiment of the present application, the orthographic shape of the light shielding layer pattern and the active layer pattern on the base substrate is the same.
在本申请实施例提供的阵列基板中,所述遮光层图案的截面形状为矩形、菱形、平行四边形、圆形中的任一种。In the array substrate provided in the embodiment of the present application, the cross-sectional shape of the light shielding layer pattern is any one of a rectangle, a rhombus, a parallelogram, and a circle.
在本申请实施例提供的阵列基板中,所述遮光层图案在所述衬底基板上的正投影与所述有源层图案在所述衬底基板上的正投影的面积相同。In the array substrate provided in the embodiment of the present application, the orthographic projection of the light shielding layer pattern on the base substrate is the same as the area of the orthographic projection of the active layer pattern on the base substrate.
在本申请实施例提供的阵列基板中,所述遮光层图案在所述衬底基板上的正投影的面积大于所述有源层图案在所述衬底基板上的正投影的面积。In the array substrate provided in the embodiment of the present application, the area of the orthographic projection of the light shielding layer pattern on the base substrate is larger than the area of the orthographic projection of the active layer pattern on the base substrate.
在本申请实施例提供的阵列基板中,所述遮光层图案在所述衬底基板上的正投影和所述有源层图案在所述衬底基板上的正投影均为多个矩形的拼接组合。In the array substrate provided in the embodiment of the present application, the orthographic projection of the light-shielding layer pattern on the base substrate and the orthographic projection of the active layer pattern on the base substrate are both a mosaic of multiple rectangles combination.
在本申请实施例提供的阵列基板中,所述矩形的首尾端互呈连接状态。In the array substrate provided by the embodiment of the present application, the head and tail ends of the rectangle are connected to each other.
在本申请实施例提供的阵列基板中,所述遮光层图案为两个、三个、四个矩形的拼接组合中的任一种。In the array substrate provided in the embodiment of the present application, the light shielding layer pattern is any one of two, three, or four rectangular splicing combinations.
在本申请实施例提供的阵列基板中,所述遮光层图案在所述衬底基板上的正投影为所述有源层图案在所述衬底基板上的正投影的放大图形。In the array substrate provided in the embodiment of the present application, the orthographic projection of the light shielding layer pattern on the base substrate is an enlarged figure of the orthographic projection of the active layer pattern on the base substrate.
本申请实施例提供的显示面板包括阵列基板,所述阵列基板包括:遮光层、以及设置在所述遮光层上的缓冲层、以及设置在所述缓冲层上的有源层,所述遮光层设置在所述衬底基板上,所述遮光层包括遮光层图案,所述有源层包括有源层图案,其中,所述遮光层图案在所述衬底基板上的正投影覆盖所述有源层图案在所述衬底基板上的正投影。The display panel provided by the embodiment of the present application includes an array substrate, and the array substrate includes: a light shielding layer, a buffer layer disposed on the light shielding layer, and an active layer disposed on the buffer layer, the light shielding layer provided on the base substrate, the light-shielding layer includes a light-shielding layer pattern, and the active layer includes an active layer pattern, wherein the orthographic projection of the light-shielding layer pattern on the base substrate covers the active layer. The orthographic projection of the source layer pattern on the base substrate.
在一种实施例中,所述遮光层图案在所述衬底基板上的正投影与所述有源层图案在所述衬底基板上的正投影重叠。In one embodiment, the orthographic projection of the light shielding layer pattern on the base substrate overlaps with the orthographic projection of the active layer pattern on the base substrate.
在一种实施例中,所述遮光层图案和所述有源层图案在所述衬底基板上的正投影形状相同。In one embodiment, the shape of the orthographic projection of the light shielding layer pattern and the active layer pattern on the base substrate is the same.
在一种实施例中,所述遮光层图案在所述衬底基板上的正投影与所述有源层图案在所述衬底基板上的正投影的面积相同。In one embodiment, the orthographic projection of the light shielding layer pattern on the base substrate is the same as the area of the orthographic projection of the active layer pattern on the base substrate.
在一种实施例中,所述遮光层图案在所述衬底基板上的正投影和所述有源层图案在所述衬底基板上的正投影均为多个矩形的拼接组合。In an embodiment, the orthographic projection of the light-shielding layer pattern on the base substrate and the orthographic projection of the active layer pattern on the base substrate are both a mosaic combination of multiple rectangles.
本申请实施例提供的阵列基板制备方法包括采用有源层光罩形成所述遮光层图案,再利用有源层光罩形成有源层图案,所述遮光层图案在所述衬底基板上正投影覆盖所述有源层图案在所述衬底基板上的正投影;通过遮光层和有源层共用一有源层光罩形成,节省了一道遮光层光罩,解决了现有阵列基板存在形成遮光层的成本较高的技术问题。The method for preparing an array substrate provided in the embodiment of the present application includes using an active layer mask to form the light shielding layer pattern, and then using the active layer mask to form an active layer pattern, and the light shielding layer pattern is formed on the base substrate. The projection covers the orthographic projection of the active layer pattern on the base substrate; the light shielding layer and the active layer are formed by sharing an active layer mask, which saves a light shielding layer mask and solves the problem of existing array substrates. The technical problem of high cost of forming the light shielding layer.
下面结合附图,通过对本申请的具体实施方式详细描述,将使本申请的技术方案及其它有益效果显而易见。The technical solutions and other beneficial effects of the present application will be apparent through the detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings.
图1为本申请实施例提供的阵列基板制备方法的流程示意图;FIG. 1 is a schematic flowchart of a method for fabricating an array substrate according to an embodiment of the present application;
图2为本申请实施例提供的阵列基板的截面示意图;FIG. 2 is a schematic cross-sectional view of an array substrate provided by an embodiment of the present application;
图3为本申请实施例提供的阵列基板的遮光图案和有源层图案的俯视示意图。FIG. 3 is a schematic top view of a light-shielding pattern and an active layer pattern of an array substrate according to an embodiment of the present application.
图中标示如下:衬底基板10、遮光层201、缓冲层202、有源层203、像素定义层30、发光功能层40、封装层50。The figures are marked as follows: a base substrate 10 , a light shielding layer 201 , a buffer layer 202 , an active layer 203 , a pixel definition layer 30 , a light-emitting functional layer 40 , and an encapsulation layer 50 .
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.
在本申请的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.
如图1所示,本申请实施例提供的阵列基板制备方法,形成阵列基板的步骤包括:As shown in FIG. 1 , in the method for fabricating an array substrate provided by an embodiment of the present application, the steps of forming the array substrate include:
S1:提供一衬底基板10;S1: provide a base substrate 10;
S2:在所述衬底基板10上制备一不透光的光阻层;S2: prepare an opaque photoresist layer on the base substrate 10;
S3:使用有源层203光罩对所述光阻层进行图案化处理,形成遮光层;S3: use the active layer 203 mask to pattern the photoresist layer to form a light shielding layer;
S4:在所述遮光层201上方形成缓冲层202;S4: forming a buffer layer 202 above the light shielding layer 201;
S5:在所述缓冲层202上制备一半导体层,再次使用所述有源层203光罩对所述半导体层进行图案化处理,形成与所述遮光层201图案一致且相重合的有源层203;S5: prepare a semiconductor layer on the buffer layer 202, and use the active layer 203 mask to pattern the semiconductor layer again to form an active layer that is consistent with and overlaps the pattern of the light shielding layer 201 203;
S6:依次在所述半导体层上制备栅绝缘层、栅极、钝化层、源/漏极、以及平坦层,形成所述阵列基板。S6: sequentially preparing a gate insulating layer, a gate electrode, a passivation layer, a source/drain electrode, and a flat layer on the semiconductor layer to form the array substrate.
在本实施例中, 阵列基板制备方法包括采用有源层203光罩形成所述遮光层201图案,再利用有源层203光罩形成有源层203图案,所述遮光层201图案在所述衬底基板10上正投影覆盖所述有源层203图案在所述衬底基板10上的正投影;通过遮光层201和有源层203共用一有源层203光罩形成,节省了一道遮光层201光罩,解决了现有阵列基板存在形成遮光层201的成本较高的技术问题。In this embodiment, the method for fabricating the array substrate includes using the active layer 203 mask to form the light shielding layer 201 pattern, and then using the active layer 203 mask to form the active layer 203 pattern, and the light shielding layer 201 pattern in the The orthographic projection on the base substrate 10 covers the pattern of the active layer 203 on the base substrate 10; the light shielding layer 201 and the active layer 203 share a mask for the active layer 203, which saves one light shielding The layer 201 mask solves the technical problem of high cost of forming the light shielding layer 201 in the existing array substrate.
在一种实施例中,在形成所述遮光层201图案的步骤中,还包括:In an embodiment, in the step of forming the pattern of the light shielding layer 201, it further includes:
通过有源层203光罩、以及垂直于所述有源层203光罩的均匀光线曝光所述不透光的光阻层,涂布显影液形成一所述遮光层201图案。The opaque photoresist layer is exposed through the mask of the active layer 203 and the uniform light perpendicular to the mask of the active layer 203 , and a developing solution is applied to form a pattern of the light shielding layer 201 .
在一种实施例中,在形成所述有源层203图案的步骤中,还包括:In an embodiment, in the step of forming the pattern of the active layer 203, it further includes:
通过有源层203光罩、以及垂直于所述有源层203光罩的均匀光线曝光所述半导体层,涂布显影液形成一所述有源层203图案,形成的所述有源层203图案在所述衬底基板10上的正投影与所述遮光层201图案在所述衬底基板10上的正投影重叠。Expose the semiconductor layer through a mask of the active layer 203 and a uniform light perpendicular to the mask of the active layer 203, apply a developer to form a pattern of the active layer 203, and the active layer 203 is formed. The orthographic projection of the pattern on the base substrate 10 overlaps with the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 .
在一种实施例中,在形成所述遮光层201图案的步骤中,还包括:In an embodiment, in the step of forming the pattern of the light shielding layer 201, it further includes:
通过有源层203光罩、以及垂直于所述有源层203光罩的光照强度不均的光线曝光所述不透光的光阻层,涂布显影液形成一所述遮光层201图案。The opaque photoresist layer is exposed through the mask of the active layer 203 and the light with uneven light intensity perpendicular to the mask of the active layer 203 , and a developing solution is applied to form a pattern of the light-shielding layer 201 .
在一种实施例中,在形成所述遮光层201图案的步骤中,还包括:In an embodiment, in the step of forming the pattern of the light shielding layer 201, it further includes:
通过有源层203光罩、以及与所述有源层203光罩呈锐角且光照强度不均的光线曝光所述不透光的光阻层,涂布显影液形成一所述遮光层201图案,得到的遮光层201图案在所述衬底基板10上的正投影覆盖所述有源层203图案在所述衬底基板10上的正投影。Expose the opaque photoresist layer through the mask of the active layer 203 and the light at an acute angle with the mask of the active layer 203 and with uneven illumination intensity, and apply a developer to form a pattern of the light-shielding layer 201 , the obtained orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 covers the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
如图2所示,本申请实施例提供的阵列基板包括遮光层201、缓冲层202、有源层203,所述遮光层201设置在所述衬底基板10上,所述遮光层201包括遮光层201图案,所述缓冲层202设置在所述遮光层201上,所述有源层203设置在所述缓冲层202上,所述有源层203包括有源层203图案,其中,所述遮光层201图案在所述衬底基板10上的正投影覆盖所述有源层203图案在所述衬底基板10上的正投影。As shown in FIG. 2 , the array substrate provided in this embodiment of the present application includes a light-shielding layer 201 , a buffer layer 202 , and an active layer 203 , the light-shielding layer 201 is disposed on the base substrate 10 , and the light-shielding layer 201 includes a light-shielding layer 201 . layer 201 pattern, the buffer layer 202 is arranged on the light shielding layer 201, the active layer 203 is arranged on the buffer layer 202, the active layer 203 includes the pattern of the active layer 203, wherein the The orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 covers the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
在本实施例中, 阵列基板包括遮光层201、缓冲层202、有源层203,所述遮光层201设置在所述衬底基板10上,所述遮光层201包括遮光层201图案,所述缓冲层202设置在所述遮光层201上,所述有源层203设置在所述缓冲层202上,所述有源层203包括有源层203图案,其中,所述遮光层201图案在所述衬底基板10上的正投影覆盖所述有源层203图案在所述衬底基板10上的正投影;通过遮光层201和有源层203共用一有源层203光罩形成,节省了一道遮光层201光罩,解决了现有阵列基板存在形成遮光层201的成本较高的技术问题。In this embodiment, the array substrate includes a light-shielding layer 201, a buffer layer 202, and an active layer 203, the light-shielding layer 201 is disposed on the base substrate 10, the light-shielding layer 201 includes a pattern of the light-shielding layer 201, and the The buffer layer 202 is disposed on the light-shielding layer 201, the active layer 203 is disposed on the buffer layer 202, and the active layer 203 includes a pattern of the active layer 203, wherein the pattern of the light-shielding layer 201 is in all The orthographic projection on the base substrate 10 covers the orthographic projection of the pattern of the active layer 203 on the base substrate 10; the light-shielding layer 201 and the active layer 203 share a mask for the active layer 203, which saves money. A light shield for the light shielding layer 201 solves the technical problem of high cost of forming the light shielding layer 201 in the existing array substrate.
在一种实施例中,所述遮光层201图案在所述衬底基板10上的正投影与所述有源层203图案在所述衬底基板10上的正投影重叠。In an embodiment, the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 overlaps with the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
其中,所述遮光层201图案在所述衬底基板10上的正投影与所述有源层203图案在所述衬底基板10上的正投影的形状相同。The shape of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
其中,所述遮光层201图案在所述衬底基板10上的正投影与所述有源层203图案在所述衬底基板10上的正投影的面积相同。The area of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
在一种实施例中,所述遮光层201图案的截面形状为矩形。In an embodiment, the cross-sectional shape of the pattern of the light shielding layer 201 is a rectangle.
在一种实施例中,所述遮光层201图案的截面形状为菱形。In an embodiment, the cross-sectional shape of the pattern of the light shielding layer 201 is a rhombus.
在一种实施例中,所述遮光层201图案的截面形状为平行四边形。In an embodiment, the cross-sectional shape of the pattern of the light shielding layer 201 is a parallelogram.
在一种实施例中,所述遮光层201图案的截面形状为圆形。In an embodiment, the cross-sectional shape of the pattern of the light shielding layer 201 is a circle.
在一种实施例中,所述遮光层201图案和所述有源层203图案在所述衬底基板10上的正投影形状相同。In one embodiment, the orthographic projection shapes of the light shielding layer 201 pattern and the active layer 203 pattern on the base substrate 10 are the same.
在一种实施例中,所述遮光层201图案在所述衬底基板10上的正投影和所述有源层203图案在所述衬底基板10上的正投影均为多个矩形的拼接组合。In an embodiment, the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 and the orthographic projection of the pattern of the active layer 203 on the base substrate 10 are both a mosaic of multiple rectangles combination.
其中,所述遮光层201图案可以为三个矩形的拼接组合。Wherein, the pattern of the light-shielding layer 201 may be a mosaic combination of three rectangles.
其中,所述遮光层201图案也可以为四个矩形的拼接组合。Wherein, the pattern of the light-shielding layer 201 may also be a splicing combination of four rectangles.
其中,矩形的首尾端互呈连接状态。The head and tail ends of the rectangle are connected to each other.
如图2所示,本申请实施例提供的 OLED显示面板包括衬底基板10、阵列基板、像素定义层30、发光功能层40、封装层50,其中,所述阵列基板包括遮光层201、缓冲层202、有源层203,所述遮光层201设置在所述衬底基板10上,所述遮光层201包括遮光层201图案,所述缓冲层202设置在所述遮光层201上,所述有源层203设置在所述缓冲层202上,所述有源层203包括有源层203图案,其中,所述遮光层201图案在所述衬底基板10上的正投影覆盖所述有源层203图案在所述衬底基板10上的正投影。As shown in FIG. 2 , the OLED display panel provided in the embodiment of the present application includes a base substrate 10 , an array substrate, a pixel definition layer 30 , a light-emitting functional layer 40 , and an encapsulation layer 50 , wherein the array substrate includes a light-shielding layer 201 , a buffer layer layer 202, an active layer 203, the light shielding layer 201 is disposed on the base substrate 10, the light shielding layer 201 includes a pattern of the light shielding layer 201, the buffer layer 202 is disposed on the light shielding layer 201, the The active layer 203 is disposed on the buffer layer 202 , and the active layer 203 includes a pattern of the active layer 203 , wherein the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 covers the active layer 203 . The orthographic projection of the layer 203 pattern on the base substrate 10 .
在本实施例中, OLED显示面板包括阵列基板,所述阵列基板包括衬底基板10、阵列基板、像素定义层30、发光功能层40、封装层50,所述阵列基板包括遮光层201、缓冲层202、有源层203,所述遮光层201设置在所述衬底基板10上,所述遮光层201包括遮光层201图案,所述缓冲层202设置在所述遮光层201上,所述有源层203设置在所述缓冲层202上,所述有源层203包括有源层203图案,其中,所述遮光层201图案在所述衬底基板10上的正投影覆盖所述有源层203图案在所述衬底基板10上的正投影;通过遮光层201和有源层203共用一有源层203光罩形成,节省了一道遮光层201光罩,解决了现有阵列基板存在形成遮光层201的成本较高的技术问题。In this embodiment, the OLED display panel includes an array substrate, the array substrate includes a base substrate 10, an array substrate, a pixel definition layer 30, a light-emitting functional layer 40, and an encapsulation layer 50, the array substrate includes a light shielding layer 201, a buffer layer layer 202, active layer 203, the light shielding layer 201 is disposed on the base substrate 10, the light shielding layer 201 includes a pattern of the light shielding layer 201, the buffer layer 202 is disposed on the light shielding layer 201, the The active layer 203 is disposed on the buffer layer 202 , and the active layer 203 includes a pattern of the active layer 203 , wherein the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 covers the active layer 203 . Orthographic projection of the pattern of the layer 203 on the base substrate 10; the light-shielding layer 201 and the active layer 203 are formed by sharing a mask of the active layer 203, saving a mask of the light-shielding layer 201 and solving the problem of existing array substrates. It is a technical problem that the cost of forming the light shielding layer 201 is relatively high.
在一种实施例中,在OLED显示面板中,所述遮光层201图案在所述衬底基板10上的正投影与所述有源层203图案在所述衬底基板10上的正投影重叠。In an embodiment, in the OLED display panel, the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 overlaps with the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
其中,所述遮光层201图案在所述衬底基板10上的正投影与所述有源层203图案在所述衬底基板10上的正投影的形状相同。The shape of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
其中,所述遮光层201图案在所述衬底基板10上的正投影与所述有源层203图案在所述衬底基板10上的正投影的面积相同。The area of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
在一种实施例中,在OLED显示面板中,所述遮光层201图案的截面形状为矩形。In an embodiment, in the OLED display panel, the cross-sectional shape of the pattern of the light shielding layer 201 is a rectangle.
在一种实施例中,在OLED显示面板中,所述遮光层201图案的截面形状为菱形。In an embodiment, in the OLED display panel, the cross-sectional shape of the pattern of the light shielding layer 201 is a rhombus.
在一种实施例中,在OLED显示面板中,所述遮光层201图案的截面形状为平行四边形。In an embodiment, in the OLED display panel, the cross-sectional shape of the pattern of the light shielding layer 201 is a parallelogram.
在一种实施例中,在OLED显示面板中,所述遮光层201图案的截面形状为圆形。In an embodiment, in the OLED display panel, the cross-sectional shape of the pattern of the light shielding layer 201 is a circle.
在一种实施例中,在OLED显示面板中,所述遮光层201图案和所述有源层203图案在所述衬底基板10上的正投影形状相同。In an embodiment, in the OLED display panel, the orthographic shape of the pattern of the light shielding layer 201 and the pattern of the active layer 203 on the base substrate 10 is the same.
在一种实施例中,在OLED显示面板中,所述遮光层201图案在所述衬底基板10上的正投影和所述有源层203图案在所述衬底基板10上的正投影均为多个矩形的拼接组合。In an embodiment, in the OLED display panel, the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 and the orthographic projection of the pattern of the active layer 203 on the base substrate 10 are the same It is a splicing combination of multiple rectangles.
其中,所述遮光层201图案可以为三个矩形的拼接组合。Wherein, the pattern of the light-shielding layer 201 may be a mosaic combination of three rectangles.
其中,所述遮光层201图案也可以为四个矩形的拼接组合。Wherein, the pattern of the light-shielding layer 201 may also be a splicing combination of four rectangles.
其中,矩形的首尾端互呈连接状态。The head and tail ends of the rectangle are connected to each other.
在一种实施例中,如图3所示,所述遮光层201图案在所述衬底基板10上的正投影为所述有源层203图案在所述衬底基板10上的正投影的放大图形。In an embodiment, as shown in FIG. 3 , the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the orthographic projection of the pattern of the active layer 203 on the base substrate 10 Zoom in on the graph.
本申请实施例提供的OLED显示装置包括阵列基板、光学膜片、反射片、玻璃基板、扩散片,如图2所示,所述阵列基板包括衬底基板10、阵列基板、像素定义层30、发光功能层40、封装层50,所述阵列基板包括遮光层201、缓冲层202、有源层203,所述遮光层201设置在所述衬底基板10上,所述遮光层201包括遮光层201图案,所述缓冲层202设置在所述遮光层201上,所述有源层203设置在所述缓冲层202上,所述有源层203包括有源层203图案,其中,所述遮光层201图案在所述衬底基板10上的正投影覆盖所述有源层203图案在所述衬底基板10上的正投影。The OLED display device provided in the embodiment of the present application includes an array substrate, an optical film, a reflective sheet, a glass substrate, and a diffuser. As shown in FIG. 2 , the array substrate includes a base substrate 10 , an array substrate, a pixel definition layer 30 , The light-emitting functional layer 40 and the encapsulation layer 50, the array substrate includes a light-shielding layer 201, a buffer layer 202, and an active layer 203, the light-shielding layer 201 is disposed on the base substrate 10, and the light-shielding layer 201 includes a light-shielding layer 201 pattern, the buffer layer 202 is arranged on the light shielding layer 201, the active layer 203 is arranged on the buffer layer 202, the active layer 203 includes the pattern of the active layer 203, wherein the light shielding layer 203 The orthographic projection of the pattern of the layer 201 on the base substrate 10 covers the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
在本实施例中, OLED显示装置包括阵列基板,所述阵列基板包括衬底基板10、阵列基板、像素定义层30、发光功能层40、封装层50,所述阵列基板包括遮光层201、缓冲层202、有源层203,所述遮光层201设置在所述衬底基板10上,所述遮光层201包括遮光层201图案,所述缓冲层202设置在所述遮光层201上,所述有源层203设置在所述缓冲层202上,所述有源层203包括有源层203图案,其中,所述遮光层201图案在所述衬底基板10上的正投影覆盖所述有源层203图案在所述衬底基板10上的正投影;通过遮光层201和有源层203共用一有源层203光罩形成,节省了一道遮光层201光罩,解决了现有阵列基板存在形成遮光层201的成本较高的技术问题。In this embodiment, the OLED display device includes an array substrate, the array substrate includes a base substrate 10, an array substrate, a pixel definition layer 30, a light-emitting functional layer 40, and an encapsulation layer 50, the array substrate includes a light shielding layer 201, a buffer layer layer 202, an active layer 203, the light shielding layer 201 is disposed on the base substrate 10, the light shielding layer 201 includes a pattern of the light shielding layer 201, the buffer layer 202 is disposed on the light shielding layer 201, the The active layer 203 is disposed on the buffer layer 202 , and the active layer 203 includes a pattern of the active layer 203 , wherein the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 covers the active layer 203 . Orthographic projection of the pattern of the layer 203 on the base substrate 10; the light shielding layer 201 and the active layer 203 are formed by sharing a mask of the active layer 203, which saves a mask for the light shielding layer 201 and solves the problem of existing array substrates. It is a technical problem that the cost of forming the light shielding layer 201 is relatively high.
在一种实施例中,在OLED显示装置中,所述遮光层201图案在所述衬底基板10上的正投影与所述有源层203图案在所述衬底基板10上的正投影重叠。In an embodiment, in the OLED display device, the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 overlaps with the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
其中,所述遮光层201图案在所述衬底基板10上的正投影与所述有源层203图案在所述衬底基板10上的正投影的形状相同。The shape of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
其中,所述遮光层201图案在所述衬底基板10上的正投影与所述有源层203图案在所述衬底基板10上的正投影的面积相同。The area of the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the same as that of the orthographic projection of the pattern of the active layer 203 on the base substrate 10 .
在一种实施例中,在OLED显示装置中,所述遮光层201图案的截面形状为矩形。In an embodiment, in the OLED display device, the cross-sectional shape of the pattern of the light shielding layer 201 is a rectangle.
在一种实施例中,在OLED显示装置中,所述遮光层201图案的截面形状为菱形。In an embodiment, in the OLED display device, the cross-sectional shape of the pattern of the light shielding layer 201 is a rhombus.
在一种实施例中,在OLED显示装置中,所述遮光层201图案的截面形状为平行四边形。In an embodiment, in the OLED display device, the cross-sectional shape of the pattern of the light shielding layer 201 is a parallelogram.
在一种实施例中,在OLED显示装置中,所述遮光层201图案的截面形状为圆形。In an embodiment, in the OLED display device, the cross-sectional shape of the pattern of the light shielding layer 201 is a circle.
在一种实施例中,在OLED显示装置中,所述遮光层201图案和所述有源层203图案在所述衬底基板10上的正投影形状相同。In an embodiment, in the OLED display device, the orthographic shape of the pattern of the light shielding layer 201 and the pattern of the active layer 203 on the base substrate 10 is the same.
在一种实施例中,在OLED显示装置中,所述遮光层201图案在所述衬底基板10上的正投影和所述有源层203图案在所述衬底基板10上的正投影均为多个矩形的拼接组合。In an embodiment, in the OLED display device, the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 and the orthographic projection of the pattern of the active layer 203 on the base substrate 10 are the same It is a splicing combination of multiple rectangles.
其中,所述遮光层201图案可以为三个矩形的拼接组合。Wherein, the pattern of the light-shielding layer 201 may be a mosaic combination of three rectangles.
其中,所述遮光层201图案也可以为四个矩形的拼接组合。Wherein, the pattern of the light-shielding layer 201 may also be a splicing combination of four rectangles.
其中,矩形的首尾端互呈连接状态。The head and tail ends of the rectangle are connected to each other.
在一种实施例中,在OLED显示装置中,如图3所示,所述遮光层201图案在所述衬底基板10上的正投影为所述有源层203图案在所述衬底基板10上的正投影的放大图形。In an embodiment, in the OLED display device, as shown in FIG. 3 , the orthographic projection of the pattern of the light shielding layer 201 on the base substrate 10 is the pattern of the active layer 203 on the base substrate Enlarged figure in orthographic projection on 10.
本申请实施例提供的显示面板包括阵列基板,所述阵列基板包括:遮光层、以及设置在所述遮光层上的缓冲层、以及设置在所述缓冲层上的有源层,所述遮光层设置在所述衬底基板上,所述遮光层包括遮光层图案,所述有源层包括有源层图案,其中,所述遮光层图案在所述衬底基板上的正投影覆盖所述有源层图案在所述衬底基板上的正投影。The display panel provided by the embodiment of the present application includes an array substrate, and the array substrate includes: a light shielding layer, a buffer layer disposed on the light shielding layer, and an active layer disposed on the buffer layer, the light shielding layer provided on the base substrate, the light-shielding layer includes a light-shielding layer pattern, and the active layer includes an active layer pattern, wherein the orthographic projection of the light-shielding layer pattern on the base substrate covers the active layer. The orthographic projection of the source layer pattern on the base substrate.
在一种实施例中,所述遮光层图案在所述衬底基板上的正投影与所述有源层图案在所述衬底基板上的正投影重叠。In one embodiment, the orthographic projection of the light shielding layer pattern on the base substrate overlaps with the orthographic projection of the active layer pattern on the base substrate.
在一种实施例中,所述遮光层图案和所述有源层图案在所述衬底基板上的正投影形状相同。In one embodiment, the shape of the orthographic projection of the light shielding layer pattern and the active layer pattern on the base substrate is the same.
在一种实施例中,所述遮光层图案在所述衬底基板上的正投影与所述有源层图案在所述衬底基板上的正投影的面积相同。In one embodiment, the orthographic projection of the light shielding layer pattern on the base substrate is the same as the area of the orthographic projection of the active layer pattern on the base substrate.
在一种实施例中,所述遮光层图案在所述衬底基板上的正投影和所述有源层图案在所述衬底基板上的正投影均为多个矩形的拼接组合。In an embodiment, the orthographic projection of the light-shielding layer pattern on the base substrate and the orthographic projection of the active layer pattern on the base substrate are both a mosaic combination of multiple rectangles.
Claims (20)
- 一种阵列基板制备方法,其包括:A method for preparing an array substrate, comprising:提供一衬底基板;providing a base substrate;在所述衬底基板上制备一不透光的光阻层;preparing an opaque photoresist layer on the base substrate;使用有源层光罩对所述光阻层进行图案化处理,形成遮光层; using an active layer mask to pattern the photoresist layer to form a light shielding layer;在所述遮光层上方形成缓冲层;forming a buffer layer over the light shielding layer;在所述缓冲层上制备一半导体层,再次使用所述有源层光罩对所述半导体层进行图案化处理,形成与所述遮光层图案一致且相重合的有源层;A semiconductor layer is prepared on the buffer layer, and the active layer mask is used to pattern the semiconductor layer again to form an active layer that is consistent and coincident with the light shielding layer pattern;依次在所述半导体层上制备栅绝缘层、栅极、钝化层、源/漏极、以及平坦层,形成所述阵列基板。A gate insulating layer, a gate electrode, a passivation layer, a source/drain electrode, and a flat layer are sequentially prepared on the semiconductor layer to form the array substrate.
- 如权利要求1所述的阵列基板制备方法,其中,在形成所述遮光层图案的步骤中,还包括:The method for fabricating an array substrate according to claim 1, wherein, in the step of forming the light shielding layer pattern, further comprising:通过有源层光罩、以及垂直于所述有源层光罩的均匀光线曝光所述不透光的光阻层,涂布显影液形成一所述遮光层图案。The opaque photoresist layer is exposed through an active layer mask and uniform light perpendicular to the active layer mask, and a developing solution is applied to form a pattern of the light shielding layer.
- 如权利要求2所述的阵列基板制备方法,其中,在形成所述有源层图案的步骤中,还包括:The method for fabricating an array substrate according to claim 2, wherein, in the step of forming the active layer pattern, further comprising:通过有源层光罩、以及垂直于所述有源层光罩的均匀光线曝光所述半导体层,涂布显影液形成一所述有源层图案,形成的所述有源层图案在所述衬底基板上的正投影与所述遮光层图案在所述衬底基板上的正投影重叠。Expose the semiconductor layer through an active layer mask and uniform light perpendicular to the active layer mask, apply a developer to form a pattern of the active layer, and the active layer pattern formed is in the The orthographic projection on the base substrate overlaps with the orthographic projection of the light shielding layer pattern on the base substrate.
- 如权利要求1所述的阵列基板制备方法,其中,在形成所述遮光层图案的步骤中,还包括:The method for fabricating an array substrate according to claim 1, wherein, in the step of forming the light shielding layer pattern, further comprising:通过有源层光罩、以及垂直于所述有源层光罩的光照强度不均的光线曝光所述不透光的光阻层,涂布显影液形成一所述遮光层图案。The opaque photoresist layer is exposed through an active layer mask and light with uneven light intensity perpendicular to the active layer mask, and a developing solution is applied to form a pattern of the light shielding layer.
- 如权利要求1所述的阵列基板制备方法,其中,在形成所述遮光层图案的步骤中,还包括:The method for fabricating an array substrate according to claim 1, wherein, in the step of forming the light shielding layer pattern, further comprising:通过有源层光罩、以及与所述有源层光罩呈锐角且光照强度不均的光线曝光所述不透光的光阻层,涂布显影液形成一所述遮光层图案,得到的遮光层图案在所述衬底基板上的正投影覆盖所述有源层图案在所述衬底基板上的正投影。Expose the opaque photoresist layer through the active layer mask and the light at an acute angle with the active layer mask and with uneven illumination intensity, and apply a developer to form a pattern of the light shielding layer. The orthographic projection of the light shielding layer pattern on the base substrate covers the orthographic projection of the active layer pattern on the base substrate.
- 一种阵列基板,其包括:An array substrate, comprising:遮光层,所述遮光层设置在所述衬底基板上,所述遮光层包括遮光层图案;以及a light-shielding layer, the light-shielding layer is disposed on the base substrate, and the light-shielding layer includes a light-shielding layer pattern; and设置在所述遮光层上的缓冲层;以及a buffer layer disposed on the light shielding layer; and设置在所述缓冲层上的有源层,所述有源层包括有源层图案;an active layer disposed on the buffer layer, the active layer including an active layer pattern;其中,所述遮光层图案在所述衬底基板上的正投影覆盖所述有源层图案在所述衬底基板上的正投影。Wherein, the orthographic projection of the light shielding layer pattern on the base substrate covers the orthographic projection of the active layer pattern on the base substrate.
- 如权利要求6所述的阵列基板,其中,所述遮光层图案在所述衬底基板上的正投影与所述有源层图案在所述衬底基板上的正投影重叠。6. The array substrate of claim 6, wherein an orthographic projection of the light shielding layer pattern on the base substrate overlaps with an orthographic projection of the active layer pattern on the base substrate.
- 如权利要求6所述的阵列基板,其中,所述遮光层图案和所述有源层图案在所述衬底基板上的正投影形状相同。6. The array substrate of claim 6, wherein the orthographic shapes of the light shielding layer pattern and the active layer pattern on the base substrate are the same.
- 如权利要求8所述的阵列基板,其中,所述遮光层图案的截面形状为矩形、菱形、平行四边形、圆形中的任一种。The array substrate according to claim 8, wherein the cross-sectional shape of the light shielding layer pattern is any one of a rectangle, a rhombus, a parallelogram, and a circle.
- 如权利要求6所述的阵列基板,其中,所述遮光层图案在所述衬底基板上的正投影与所述有源层图案在所述衬底基板上的正投影的面积相同。6. The array substrate of claim 6, wherein the orthographic projection of the light shielding layer pattern on the base substrate has the same area as the orthographic projection of the active layer pattern on the base substrate.
- 如权利要求6所述的阵列基板,其中,所述遮光层图案在所述衬底基板上的正投影的面积大于所述有源层图案在所述衬底基板上的正投影的面积。6. The array substrate of claim 6, wherein an area of an orthographic projection of the light shielding layer pattern on the base substrate is larger than an area of an orthographic projection of the active layer pattern on the base substrate.
- 如权利要求8所述的阵列基板,其中,所述遮光层图案在所述衬底基板上的正投影和所述有源层图案在所述衬底基板上的正投影均为多个矩形的拼接组合。The array substrate of claim 8, wherein the orthographic projection of the light shielding layer pattern on the base substrate and the orthographic projection of the active layer pattern on the base substrate are both rectangular Splicing combination.
- 如权利要求12所述的阵列基板,其中,所述矩形的首尾端互呈连接状态。13. The array substrate of claim 12, wherein the head and tail ends of the rectangle are connected to each other.
- 如权利要求12所述的阵列基板,其中,所述遮光层图案为两个、三个、四个矩形的拼接组合中的任一种。The array substrate according to claim 12, wherein the light shielding layer pattern is any one of two, three and four rectangular splicing combinations.
- 如权利要求6所述的阵列基板,其中,所述遮光层图案在所述衬底基板上的正投影为所述有源层图案在所述衬底基板上的正投影的放大图形。The array substrate according to claim 6, wherein the orthographic projection of the light shielding layer pattern on the base substrate is an enlarged figure of the orthographic projection of the active layer pattern on the base substrate.
- 一种显示面板,其包括阵列基板和彩膜基板,所述阵列基板包括:A display panel comprising an array substrate and a color filter substrate, the array substrate comprising:遮光层,所述遮光层设置在所述衬底基板上,所述遮光层包括遮光层图案;以及a light-shielding layer, the light-shielding layer is disposed on the base substrate, and the light-shielding layer includes a light-shielding layer pattern; and设置在所述遮光层上的缓冲层;以及a buffer layer disposed on the light shielding layer; and设置在所述缓冲层上的有源层,所述有源层包括有源层图案;an active layer disposed on the buffer layer, the active layer including an active layer pattern;其中,所述遮光层图案在所述衬底基板上的正投影覆盖所述有源层图案在所述衬底基板上的正投影。Wherein, the orthographic projection of the light shielding layer pattern on the base substrate covers the orthographic projection of the active layer pattern on the base substrate.
- 如权利要求16所述的显示面板,其中,所述遮光层图案在所述衬底基板上的正投影与所述有源层图案在所述衬底基板上的正投影重叠。The display panel of claim 16, wherein an orthographic projection of the light shielding layer pattern on the base substrate overlaps with an orthographic projection of the active layer pattern on the base substrate.
- 如权利要求16所述的显示面板,其中,所述遮光层图案和所述有源层图案在所述衬底基板上的正投影形状相同。The display panel of claim 16, wherein the orthographic shape of the light shielding layer pattern and the active layer pattern on the base substrate is the same.
- 如权利要求16所述的显示面板,其中,所述遮光层图案在所述衬底基板上的正投影与所述有源层图案在所述衬底基板上的正投影的面积相同。The display panel of claim 16, wherein an area of an orthographic projection of the light shielding layer pattern on the base substrate is the same as an area of an orthographic projection of the active layer pattern on the base substrate.
- 如权利要求16所述的显示面板,其中,所述遮光层图案在所述衬底基板上的正投影和所述有源层图案在所述衬底基板上的正投影均为多个矩形的拼接组合。The display panel of claim 16, wherein the orthographic projection of the light shielding layer pattern on the base substrate and the orthographic projection of the active layer pattern on the base substrate are both rectangular Splicing combination.
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