WO2022000581A1 - 空气微带线天线单元及天线系统 - Google Patents

空气微带线天线单元及天线系统 Download PDF

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Publication number
WO2022000581A1
WO2022000581A1 PCT/CN2020/102774 CN2020102774W WO2022000581A1 WO 2022000581 A1 WO2022000581 A1 WO 2022000581A1 CN 2020102774 W CN2020102774 W CN 2020102774W WO 2022000581 A1 WO2022000581 A1 WO 2022000581A1
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WIPO (PCT)
Prior art keywords
layer
air
microstrip
microstrip circuit
circuit
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PCT/CN2020/102774
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English (en)
French (fr)
Inventor
沈亚川
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瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
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Publication of WO2022000581A1 publication Critical patent/WO2022000581A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems

Definitions

  • the utility model relates to the technical field of communication, in particular to an air microstrip line antenna unit and an antenna system.
  • 5G is the focus of research and development in the global industry. Among them, 5G antennas are the main means to achieve ultra-high data transmission rates due to their high carrier frequency and large bandwidth. Therefore, the rich bandwidth resources of 5G frequency bands provide a guarantee for high-speed transmission rates.
  • 5G antennas of the related art often adopt a patch antenna design, or a double-layer patch antenna design to form an array antenna system, which is fed by a probe.
  • the design bandwidth of the patch antenna is narrow, and the stacked patch design can effectively increase the bandwidth, but it will inevitably increase the height of the antenna profile; especially, large-scale antenna array systems need to carry dozens of oscillators.
  • the vibrator is stacked and fixed on the grounding support, and the upper and lower patches, which are respectively arranged on the upper and lower layers of the vibrator, are connected to each other and connected to the ground.
  • the molding process is limited and is not suitable for Laser Direct Structuring Direct Structuring, LDS) process technology, high production cost; and there is no obvious adjustment area for isolation, which makes its coverage band limited.
  • the technical problem to be solved by the utility model is to provide an air microstrip line antenna unit and an antenna system with low profile, low production cost, large isolation and large bandwidth.
  • the utility model provides an air microstrip line antenna unit, and the air microstrip line antenna unit includes:
  • the vibrator is stacked and supported on the ground layer;
  • a lower layer air patch is attached to the side of the vibrator close to the ground layer and is spaced from the ground layer to form a first air gap
  • the lower layer air patch includes a microstrip circuit surrounded by a lower layer.
  • the lower layer microstrip circuit comprises a square ring-shaped first lower layer microstrip circuit, surrounding the first lower layer microstrip circuit.
  • the feed circuit It includes two and extends away from the first lower microstrip circuit from the position of two corners of the second lower microstrip circuit, the third lower microstrip circuit includes four, and every two of the first
  • the three lower-layer microstrip circuits are a group, wherein two of the third lower-layer microstrip circuits in one group are arranged along one of the diagonal lines of the second lower-layer microstrip circuit, and two of the other group of the The third lower-layer microstrip circuit is arranged along the other diagonal of the second lower-layer microstrip circuit; the two ends of each third lower-layer microstrip circuit are respectively connected to the second lower-layer microstrip circuit and the said second lower-layer microstrip circuit. the positions of the corners corresponding to the first lower-layer microstrip circuits, the two groups of the third lower-layer microstrip circuit
  • the upper-layer air patch is attached to the side of the vibrator away from the ground layer and is arranged opposite to the lower-layer air patch;
  • the upper air patch is coupled and fed with the lower microstrip circuit.
  • the upper air patch comprises a main body, a ring-shaped surrounding part surrounding the main body and spaced apart from each other, and a connecting part connecting the main body and the surrounding part.
  • the surrounding portion is square and is arranged opposite to the second lower-layer microstrip circuit
  • the main body portion is circular and arranged opposite to the first lower-layer microstrip circuit
  • the connecting portion includes four , the four connecting parts are respectively disposed opposite to the third lower-layer microstrip circuit and respectively connect the four corners of the surrounding part to the main body part.
  • the four corners of the second lower-layer microstrip circuit and/or the four corners of the surrounding portion form a chamfered or rounded corner structure.
  • the vibrator includes a top plate disposed opposite to the ground layer, a connecting plate extending from the top plate toward the ground layer and spaced from the ground layer, and extending outward from the periphery of the connecting plate a bottom plate spaced from the ground layer, and a support plate extending from the periphery of the bottom plate to the ground layer and connected with the ground layer, the cross section of the connecting plate matching the shape of the lower microstrip circuit;
  • the upper-layer air patch is attached to the side of the top plate away from the bottom plate
  • the lower-layer microstrip circuit is attached to the side of the connection plate away from the top plate
  • the feed circuit is attached to the bottom plate close to the bottom plate. side of the ground plane.
  • the vibrator is made of plastic; the lower air patch and the upper air patch are formed on the vibrator by electroplating or LDS process.
  • the distance from the side of the ground layer away from the upper air patch to the side of the upper air patch away from the ground layer is less than or equal to 9 mm.
  • the present invention further provides an antenna system, the antenna system includes a plurality of the above-mentioned air microstrip line antenna units provided by the present invention, and the plurality of the air microstrip line antenna units are arranged in an array.
  • the lower layer microstrip circuit and the upper layer air patch, the lower layer microstrip circuit and the upper layer are respectively attached to the opposite sides of the vibrator to form the lower layer window structure.
  • the air patches are spaced apart from each other for coupling feeding, and the lower microstrip circuit and the ground layer form a first air space.
  • the first lower-layer microstrip circuit structure design of the lower-layer microstrip circuit effectively increases the isolation, which can be improved by 2-3dB, and the main part of the upper-layer microstrip circuit can generate a resonance, which effectively expands the air microstrip line.
  • the bandwidth of the antenna unit and the antenna system improves the radiation gain performance; in addition, the structure setting of the upper-layer window structure and the lower-layer air patch effectively reduces the radiation height of the upper-layer air patch and the lower-layer air patch, making the air microstrip line
  • the lower profile and miniaturization of the antenna unit and antenna system further increase the radiation gain and bandwidth.
  • Fig. 1 is the three-dimensional structure schematic diagram of the air microstrip line antenna unit of the present invention
  • Fig. 2 is the partial three-dimensional structure exploded schematic diagram of the air microstrip line antenna unit of the present invention
  • FIG. 3 is a schematic structural diagram of another viewing angle of FIG. 2;
  • Fig. 4 is a sectional view along line A-A in Fig. 1;
  • FIG. 5 is an enlarged view of the part shown in B in FIG. 4 .
  • the present invention provides an air microstrip line antenna unit 100, the air microstrip line antenna unit includes a ground layer 1, a vibrator 2, a lower layer air patch 3 and an upper layer air patch Sheet 4.
  • the vibrator 2 is stacked and supported on the ground layer 1 , the lower air patch 3 and the upper air patch 4 are respectively attached to opposite sides of the vibrator 2 and are spaced apart from the ground layer 1 , and the lower air patch 4 is attached to the ground layer 1 .
  • the sheet 3 forms a coupled feed with the upper air patch 4 .
  • the lower air patch 3 is attached to the side of the vibrator 2 close to the ground layer 1 and is spaced from the ground layer 1 to form a first air gap 10 .
  • the lower-layer air patch 3 includes a lower-layer window structure 30 surrounded by a lower-layer microstrip circuit 31 and a feeding circuit 32 extending outward from the lower-layer microstrip circuit 31 .
  • the lower-layer microstrip circuit 31 includes a first lower-layer microstrip circuit 311 in the shape of a square ring, and a second lower-layer microstrip in a square ring shape that surrounds the first lower-layer microstrip circuit 311 and is spaced apart from each other. circuit 312 and a third lower microstrip circuit 313 connecting the first lower microstrip circuit 311 and the second lower microstrip circuit 312 .
  • the feeding circuit 32 includes two and extends away from the first lower microstrip circuit 311 from two adjacent corners of the second lower microstrip circuit 312 respectively.
  • the third lower-layer microstrip circuit 313 includes four, and every two third lower-layer microstrip circuits 313 is a group, and two of the third lower-layer microstrip circuits 313 in a group are along the second lower-layer One of the microstrip circuits 312 is arranged diagonally, and two of the third lower-layer microstrip circuits 313 in the other group are arranged along the other diagonal of the second lower-layer microstrip circuit 312; Both ends of the third lower-layer microstrip circuit 313 are respectively connected to the corners of the second lower-layer microstrip circuit 312 and the first lower-layer microstrip circuit 311, so that two groups of the third lower-layer microstrip circuit
  • the strip circuits 313 form an orthogonal structure.
  • the lower-layer window opening structure 30 is formed into a square shape, for example, a square with a side of 24.95 mm.
  • the first lower-layer microstrip circuit 311 is square, for example, a square with a side length of 6.82 mm.
  • one of the feeding circuits 32 is connected to a corner of the second lower microstrip circuit 312, and the second lower microstrip circuit 312 between the corner and its opposite corner is formed as The first path and the second path through which the current flows, the third lower-layer microstrip circuit 313 and the first lower-layer microstrip circuit 311 between the corner and its opposite corner serve as the third path, and the current of the first path and the second path
  • the formed radiations cancel each other in the far field direction perpendicular to the third path, and the radiations formed by the currents of the first path and the second path superimpose each other in the far field parallel to the third path to generate a first resonance.
  • the other feeding circuit 32 generates a second resonance with the second lower microstrip circuit 312, the third lower microstrip circuit 313, and the first lower microstrip circuit 311, and forms ⁇ 45° of dual polarization to increase radiation performance.
  • the arrangement of the first lower-layer microstrip circuit 311 effectively increases the isolation of the ports of the two feeding circuits 32.
  • the isolation can be improved by 2-3 dB, which significantly improves the antenna performance.
  • the four corners of the second lower-layer microstrip circuit 312 and/or the four corners of the surrounding portion 412 form a chamfered or rounded structure, because the first resonance and the second resonance are different.
  • the frequency difference is related to the corresponding path length difference, so this structural arrangement enables tuning of the frequency distances of the first and second resonances described above.
  • the four corners of the second lower-layer microstrip circuit 312 and/or the four corners of the surrounding portion 412 are not limited to the shapes of chamfered and rounded corners.
  • the upper air patch 4 is attached to the side of the vibrator 2 away from the ground layer 1 and is spaced apart from the lower air patch 3 .
  • the upper air patch 4 includes a main body portion 411 , an annular surrounding portion 412 surrounding the main body portion 411 and spaced apart from each other, and a connecting portion 413 connecting the main body portion 411 and the surrounding portion 412 ,
  • the number of the second upper-layer microstrip circuits 413 matches the number of the third lower-layer microstrip circuits 313 .
  • the structural design of the main body portion 411 can make the air microstrip line antenna unit 100 generate one more resonance, thereby effectively expanding the bandwidth of the air microstrip line antenna unit 100 .
  • the surrounding portion 412 is square and rectangular, and is disposed opposite to the second lower-layer microstrip circuit 312.
  • the orthographic projection of the surrounding portion 412 to the second lower-layer microstrip circuit 312 is the same as the second lower-layer microstrip circuit
  • the circuits 312 are overlapped to improve the radiation effect.
  • the main body portion 411 is circular and disposed opposite to the first lower-layer microstrip circuit 311, and the two cooperate to expand the bandwidth.
  • the connecting portions 413 include four pieces.
  • the four connecting portions 413 are respectively disposed opposite to the third lower-layer microstrip circuit and respectively connect the four corners of the surrounding portion 412 to the main body portion 411 .
  • the vibrator 2 is made of non-conductive materials such as plastic; the lower air patch 3 and the upper air patch 4 are formed on the vibrator 2 by electroplating or LDS process, which is simple to process and has no A large amount of manual assembly is required in the later stage, which reduces the cost and achieves the effect of high precision and low cost.
  • the vibrator 2 includes a top plate 21 disposed opposite to the ground layer 1 at intervals, a connecting plate 22 extending from the top plate 21 to the ground layer 1 and spaced from the ground layer 1 , The peripheral edge of the connection plate 22 extends outward and is spaced from the grounding layer 1 , and a support plate 24 extends from the peripheral edge of the bottom plate 23 to the grounding layer 1 and is connected to the grounding layer 1 .
  • the cross section of the connecting plate 22 matches the shape of the lower microstrip circuit 31 .
  • the upper air patch 4 is attached to the side of the top plate 21 away from the bottom plate 23
  • the lower microstrip circuit 31 is attached to the side of the connection plate 22 away from the top plate 21
  • the feed circuit 32 is attached to the side of the bottom plate 23 close to the ground layer 1 .
  • the position of the connecting plate 22 is not limited to the above-mentioned embodiment, and only needs to achieve a support function.
  • the distance from the side of the ground layer 1 away from the upper air patch 4 to the side of the upper air patch 4 away from the ground layer 1 is less than or equal to 9 mm. It is 8.34mm, that is, the section of the air microstrip line antenna unit 100 does not exceed 8.34mm, which not only has the characteristics of large bandwidth, but also has a low section.
  • the present invention also provides an antenna system, the antenna system includes a plurality of the air microstrip line antenna units provided by the present invention, and the plurality of the air microstrip line antenna units are arranged in an array.
  • the lower layer microstrip circuit and the upper layer air patch, the lower layer microstrip circuit and the upper layer are respectively attached to the opposite sides of the vibrator to form the lower layer window structure.
  • the air patches are spaced apart from each other for coupling feeding, and the lower microstrip circuit and the ground layer form a first air space.
  • the first lower-layer microstrip circuit structure design of the lower-layer microstrip circuit effectively increases the isolation, which can be improved by 2-3dB, and the main part of the upper-layer microstrip circuit can generate a resonance, which effectively expands the air microstrip line.
  • the bandwidth of the antenna unit and the antenna system improves the radiation gain performance; in addition, the structure setting of the upper-layer window structure and the lower-layer air patch effectively reduces the radiation height of the upper-layer air patch and the lower-layer air patch, making the air microstrip line
  • the lower profile and miniaturization of the antenna unit and antenna system further increase the radiation gain and bandwidth.

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  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

本实用新型提供一种空气微带线天线单元，包括接地层、支撑于接地层的振子以及分别贴设于振子相对两侧的下层空气贴片和上层空气贴片；下层空气贴片与接地层间隔形成第一空气间隙，其包括由下层微带电路围成的下层开窗结构以及由下层微带电路延伸的馈电电路，上层空气贴片并与下层空气贴片间隔相对设置；上层空气贴片与下层微带电路耦合馈电。本实用新型还提供一种天线系统。与相关技术相比，本实用新型的空气微带线天线单元及天线系统剖面低、生产成本低、隔离度大且带宽大。

Description

空气微带线天线单元及天线系统 技术领域
本实用新型涉及一种通讯技术领域，尤其涉及一种空气微带线天线单元及天线系统。
 背景技术
随着移动通讯技术的发展，手机、PAD、笔记本电脑等逐渐成为生活中不可或缺的电子产品，并且该类电子产品都更新为增加天线系统使其具有通讯功能的电子通讯产品。
5G作为全球业界的研发焦点，其中，5G天线因具有的高载频、大带宽特性是实现5G超高数据传输速率的主要手段，因此，5G频段丰富的带宽资源为高速传输速率提供了保障。
 技术问题
然而，相关技术的5G天线往往采用贴片天线设计，或双层贴片天线设计形成阵列天线系统，采用探针馈电。贴片天线设计带宽较窄，叠层贴片设计可有效增加带宽，但不可避免会增加天线剖面高度；特别是大型天线阵列系统需要搭载几十个振子。而相关技术中，所述振子叠设固定于接地支，并将分别设置于振子的上层和下层的上层贴片与下层贴片相互连通并与地层连接，其成型工艺方式受限，不适用于激光直接成型（Laser Direct Structuring，LDS）工艺技术，生产成本高；而且隔离度无明显调节区域，使得其覆盖频带受限。
因此，有必要提供一种新的空气微带线天线单元及天线系统解决上述问题。
 技术解决方案
本实用新型需要解决的技术问题是提供一种剖面低、生产成本低、隔离度大且带宽大的空气微带线天线单元及天线系统。
为解决上述技术问题，本实用新型提供了一种空气微带线天线单元，所述空气微带线天线单元包括：
接地层；
振子，所述振子叠设支撑于所述接地层；
下层空气贴片，所述下层空气贴片附着于所述振子靠近所述接地层的一侧并与所述接地层间隔形成第一空气间隙，所述下层空气贴片包括由下层微带电路围成的下层开窗结构以及由所述下层微带电路向外延伸的馈电电路；所述下层微带电路包括呈方形环状的第一下层微带电路、环绕所述第一下层微带电路并相互间隔的呈方形环状的第二下层微带电路以及连接所述第一下层微带电路与所述第二下层微带电路的第三下层微带电路；所述馈电电路包括两条且分别由所述第二下层微带电路相信两个角的位置向远离所述第一下层微带电路延伸，所述第三下层微带电路包括四条，每两条所述第三下层微带电路为一组，其中一组中的两条所述第三下层微带电路沿所述第二下层微带电路的其中一对角线设置，另外一组中的两条所述第三下层微带电路沿所述第二下层微带电路的另一对角线设置；每一条所述第三下层微带电路的两端分别连接于所述第二下层微带电路与所述第一下层微带电路相对应的角的位置，两组所述第三下层微带电路形成正交结构；以及，
上层空气贴片，所述上层空气贴片附着于所述振子远离所述接地层的一侧并与所述下层空气贴片间隔相对设置；
所述上层空气贴片与所述下层微带电路耦合馈电。
优选的，所述上层空气贴片包括主体部、环绕所述主体部并相互间隔的呈环状的环绕部以及连接所述主体部和所述环绕部的连接部。
优选的，所述环绕部呈方形，且与所述第二下层微带电路相对设置，所述主体部呈圆形且与所述第一下层微带电路相对设置；所述连接部包括四条，四条所述连接部分别与所述第三下层微带电路相对设置且分别将所述环绕部的四个角连接至所述主体部。
优选的，所述第二下层微带电路的四个角和/或所述环绕部的四个角形成倒角或倒圆角结构。
优选的，所述振子包括与所述接地层间隔相对设置的顶板、由所述顶板向所述接地层方向延伸并与所述接地层间隔的连接板、由所述连接板的周缘向外延伸并与所述接地层间隔的底板，以及由所述底板的周缘向接地层延伸并与所述接地层连接的支撑板，所述连接板的横截面与所述下层微带电路的形状匹配；所述上层空气贴片附着于所述顶板远离所述底板的一侧，所述下层微带电路附着于所述连接板远离所述顶板的一侧，所述馈电电路附着于所述底板靠近所述接地层的一侧。
优选的，所述振子由塑料制成；所述下层空气贴片和所述上层空气贴片通过电镀或LDS工艺形成于所述振子。
优选的，所述接地层远离所述上层空气贴片的一侧至所述上层空气贴片远离所述接地层的一侧的距离小于或等于9mm。
本实用新型还提供一种天线系统，所述天线系统包括本实用新型提供的多个上述空气微带线天线单元，且多个所述空气微带线天线单元呈阵列排布。
 有益效果
与相关技术相比，本实用新型的空气微带线天线单元及天线系统中，将振子相对两侧分别附着形成下层开窗结构的下层微带电路和上层空气贴片，下层微带电路和上层空气贴片相互间隔以耦合馈电，且下层微带电路与地层形成第一空气间隔，该结构使得空气微带线天线单元无焊点，适用于塑料LDS和塑料电镀工艺，设计更灵活，从而降低了生产成本；下层微带电路的第一下层微带电路结构设计有效增加了隔离度，可提升2-3dB，上层微带电路的主体部可产生一个谐振，有效拓展了空气微带线天线单元及天线系统的带宽，改善了辐射增益性能；另外，上层开窗结构和下层空气贴片的结构设置有效的降低了上层空气贴片和下层空气贴片的辐射高度，使得空气微带线天线单元及天线系统的剖面更低、更小型化的特点，而且进一步提高了辐射增益和带宽。
 附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本实用新型空气微带线天线单元的立体结构示意图；
图2为本实用新型空气微带线天线单元的部分立体结构分解示意图；
图3为图2的另一视角结构示意图；
图4为沿图1中A-A线的剖示图；
图5为图4中B所示部分放大图。
 本发明的实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
请同时参图1-5所示，本实用新型提供了一种空气微带线天线单元100，所述空气微带线天线单元包括接地层1、振子2、下层空气贴片3以及上层空气贴片4。
所述振子2叠设支撑于所述接地层1，下层空气贴片3与所述上层空气贴片4分别附着于振子2的相对两侧且均与接地层1间隔，且所述下层空气贴片3与所述上层空气贴片4形成耦合馈电。
本实施方式中，所述下层空气贴片3附着于所述振子2靠近所述接地层1的一侧并与所述接地层1间隔形成第一空气间隙10。所述下层空气贴片3包括由下层微带电路31围成的下层开窗结构30以及由所述下层微带电路31向外延伸的馈电电路32。
具体的，所述下层微带电路31包括呈方形环状的第一下层微带电路311、环绕所述第一下层微带电路311并相互间隔的呈方形环状的第二下层微带电路312以及连接所述第一下层微带电路311与所述第二下层微带电路312的第三下层微带电路313。
所述馈电电路32包括两条且分别由所述第二下层微带电路312相邻两个角的位置向远离所述第一下层微带电路311延伸。所述第三下层微带电路313包括四条，每两条所述第三下层微带电路313为一组，其中一组中的两条所述第三下层微带电路313沿所述第二下层微带电路312的其中一对角线设置，另外一组中的两条所述第三下层微带电路313沿所述第二下层微带电路312的另一对角线设置；每一条所述第三下层微带电路313的两端分别连接于所述第二下层微带电路312与所述第一下层微带电路311相对应的角的位置，则使得两组所述第三下层微带电路313形成正交结构。
具体的，所述第二下层微带电路312因呈方形结构 ，则使得下层开窗结构30形成方形，比如为边24.95mm的正方形。所述第一下层微带电路311呈方形，比如为边长为6.82mm的正方形。
上述下层空气贴片3的结构中，其中一个所述馈电电路32与所述第二下层微带电路312的一个角连接，该角与其对角之间的第二下层微带电路312形成为电流流经的第一路径和第二路径，该角与其对角之间的第三下层微带电路313及第一下层微带电路311作为第三路径，第一路径与第二路径的电流形成的辐射在垂直于第三路径的远场方向上相互抵消，第一路径与第二路径的电流形成的辐射在平行于第三路径的远场相互叠加产生第一个谐振。同理，另一个所述馈电电路32与所述第二下层微带电路312、第三下层微带电路313、第一下层微带电路311产生第二个谐振，并形成了±45°的双极化，增加辐射性能。
第一下层微带电路311的设置，有效的增加了两馈电电路32端口的隔离度，本实施方式中可提将隔离度提高2-3dB，显著改善了天线性能。
更优的，所述第二下层微带电路312的四个角和/或所述环绕部412的四个角形成倒角或倒圆角结构，因上述第一个谐振与第二个谐振的频率差值与对应的路径长度差值相关，因此该结构设置可实现对上述第一个谐振和第二个谐振的频率距离进行调谐。当然，所述第二下层微带电路312的四个角和/或所述环绕部412的四个角不限于倒角和倒圆角的形状。
所述上层空气贴片4附着于所述振子2远离所述接地层1的一侧并与所述下层空气贴片3间隔设置。
具体的，所述上层空气贴片4包括主体部411、环绕所述主体部411并相互间隔的呈环状的环绕部412以及连接所述主体部411与所述环绕部412的连接部413，所述第二上层微带电路413的数量与所述第三下层微带电路313的数量匹配。
主体部411的结构设计可使空气微带线天线单元100多产生一个谐振，从而有效拓展了空气微带线天线单元100的带宽。
本实施方式中，具体的，所述环绕部412方矩形，且与所述第二下层微带电路312相对设置，环绕部412向第二下层微带电路312的正投影与第二下层微带电路312重合，以改善辐射效果。
所述主体部411呈圆形且与所述第一下层微带电路311相对设置，二者配合以拓展带宽。
所述连接部413包括四条，四条所述连接部413分别与所述第三下层微带电路相对设置且分别将所述环绕部412的四个角连接至所述主体部411。
本实施方式中，所述振子2由塑料等非导电材料制成；所述下层空气贴片3和所述上层空气贴片4通过电镀或LDS工艺形成于所述振子2，加工简单，且无需要在后期进行大量人工装配，减小成本，实现了高精度和低成本的效果。
本实施方式中，实现上述第一空气间隙10、上层空气贴片4与下层空气贴片3间隔是由振子2的结构设计实现。具体的，所述振子2包括与所述接地层1间隔相对设置的顶板21、由所述顶板21向所述接地层1方向延伸并与所述接地层1间隔的连接板22、由所述连接板22的周缘向外延伸并与所述接地层1间隔的底板23，以及由所述底板23的周缘向接地层1延伸并与所述接地层1连接的支撑板24。所述连接板22的横截面与所述下层微带电路31的形状匹配。所述上层空气贴片4附着于所述顶板21远离所述底板23的一侧，所述下层微带电路31附着于所述连接板22远离所述顶板21的一侧，所述馈电电路32附着于所述底板23靠近所述接地层1的一侧。连接板22的位置不限上述实施方式，只需要实现支撑作用即可。
通过上述结构设计，所述接地层1远离所述上层空气贴片4的一侧至所述上层空气贴片4远离所述接地层1的一侧的距离小于或等于9mm，本实施方式中具体为8.34mm，即空气微带线天线单元100的剖面不超过8.34mm，其不仅具有带宽大的特点，且剖面低，。
本实用新型还提供一种天线系统，所述天线系统包括多个本实用新型提供的上述空气微带线天线单元，且多个所述空气微带线天线单元呈阵列排布。
与相关技术相比，本实用新型的空气微带线天线单元及天线系统中，将振子相对两侧分别附着形成下层开窗结构的下层微带电路和上层空气贴片，下层微带电路和上层空气贴片相互间隔以耦合馈电，且下层微带电路与地层形成第一空气间隔，该结构使得空气微带线天线单元无焊点，适用于塑料LDS和塑料电镀工艺，设计更灵活，从而降低了生产成本；下层微带电路的第一下层微带电路结构设计有效增加了隔离度，可提升2-3dB，上层微带电路的主体部可产生一个谐振，有效拓展了空气微带线天线单元及天线系统的带宽，改善了辐射增益性能；另外，上层开窗结构和下层空气贴片的结构设置有效的降低了上层空气贴片和下层空气贴片的辐射高度，使得空气微带线天线单元及天线系统的剖面更低、更小型化的特点，而且进一步提高了辐射增益和带宽。
以上所述仅为本实用新型的实施例，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本实用新型的专利保护范围内。

Claims (8)

  1. 一种空气微带线天线单元，其特征在于，所述空气微带线天线单元包括：
    接地层；
    振子，所述振子叠设支撑于所述接地层；
    下层空气贴片，所述下层空气贴片附着于所述振子靠近所述接地层的一侧并与所述接地层间隔形成第一空气间隙，所述下层空气贴片包括由下层微带电路围成的下层开窗结构以及由所述下层微带电路向外延伸的馈电电路；所述下层微带电路包括呈方形环状的第一下层微带电路、环绕所述第一下层微带电路并相互间隔的呈方形环状的第二下层微带电路以及连接所述第一下层微带电路与所述第二下层微带电路的第三下层微带电路；所述馈电电路包括两条且分别由所述第二下层微带电路相邻两个角的位置向远离所述第一下层微带电路延伸，所述第三下层微带电路包括四条，每两条所述第三下层微带电路为一组，其中一组中的两条所述第三下层微带电路沿所述第二下层微带电路的其中一对角线设置，另外一组中的两条所述第三下层微带电路沿所述第二下层微带电路的另一对角线设置；每一条所述第三下层微带电路的两端分别连接于所述第二下层微带电路与所述第一下层微带电路相对应的角的位置，两组所述第三下层微带电路形成正交结构；以及，
    上层空气贴片，所述上层空气贴片附着于所述振子远离所述接地层的一侧并与所述下层空气贴片间隔相对设置；
    所述上层空气贴片与所述下层微带电路耦合馈电。
  2. 根据权利要求1所述的空气微带线天线单元，其特征在于，所述上层空气贴片包括主体部、环绕所述主体部并相互间隔的呈环状的环绕部以及连接所述主体部和所述环绕部的连接部。
  3. 根据权利要求2所述的空气微带线天线单元，其特征在于，所述环绕部呈方形，且与所述第二下层微带电路相对设置，所述主体部呈圆形且与所述第一下层微带电路相对设置；所述连接部包括四条，四条所述连接部分别与所述第三下层微带电路相对设置且分别将所述环绕部的四个角连接至所述主体部。
  4. 根据权利要求3所述的空气微带线天线单元，其特征在于，所述第二下层微带电路的四个角和/或所述环绕部的四个角形成倒角或倒圆角结构。
  5. 根据权利要求1所述的空气微带线天线单元，其特征在于，所述振子包括与所述接地层间隔相对设置的顶板、由所述顶板向所述接地层方向延伸并与所述接地层间隔的连接板、由所述连接板的周缘向外延伸并与所述接地层间隔的底板，以及由所述底板的周缘向接地层延伸并与所述接地层连接的支撑板，所述连接板的横截面与所述下层微带电路的形状匹配；所述上层空气贴片附着于所述顶板远离所述底板的一侧，所述下层微带电路附着于所述连接板远离所述顶板的一侧，所述馈电电路附着于所述底板靠近所述接地层的一侧。
  6. 根据权利要求1所述的空气微带线天线单元，其特征在于，所述振子由塑料制成；所述下层空气贴片和所述上层空气贴片通过电镀或LDS工艺形成于所述振子。
  7. 根据权利要求1所述的空气微带线天线单元，其特征在于，所述接地层远离所述上层空气贴片的一侧至所述上层空气贴片远离所述接地层的一侧的距离小于或等于9mm。
  8. 一种天线系统，其特征在于，所述天线系统包括多个如权利要求1-7任意一项所述的空气微带线天线单元，且多个所述空气微带线天线单元呈阵列排布。
PCT/CN2020/102774 2020-06-30 2020-07-17 空气微带线天线单元及天线系统 WO2022000581A1 (zh)

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