WO2021259210A1 - 辐射换热板、辐射换热板组及辐射换热系统 - Google Patents

辐射换热板、辐射换热板组及辐射换热系统 Download PDF

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Publication number
WO2021259210A1
WO2021259210A1 PCT/CN2021/101302 CN2021101302W WO2021259210A1 WO 2021259210 A1 WO2021259210 A1 WO 2021259210A1 CN 2021101302 W CN2021101302 W CN 2021101302W WO 2021259210 A1 WO2021259210 A1 WO 2021259210A1
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Prior art keywords
heat exchange
radiation
radiation heat
exchange plate
plate
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PCT/CN2021/101302
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English (en)
French (fr)
Inventor
晏飞
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Shuchuang Electric Tech Liaoning Co Ltd
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Shuchuang Electric Tech Liaoning Co Ltd
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Publication of WO2021259210A1 publication Critical patent/WO2021259210A1/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D15/00—Other domestic- or space-heating systems
    • F24D15/04—Other domestic- or space-heating systems using heat pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0003—Exclusively-fluid systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
    • F25B29/003—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously of the compression type system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/06—Heat pumps characterised by the source of low potential heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/04—Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Definitions

  • the utility model relates to the field of air-conditioning/heat pump (radiation air-conditioning) waterless floor heating, in particular to a radiation heat exchange plate, a radiation heat exchange plate group and a radiation heat exchange system.
  • the air source heat pump waterless floor heating system is mainly composed of the air source heat pump heat source unit, the radiation system and the controller system.
  • the working principle is that the compressor drives the refrigerant to perform work, replaces the "free” heat energy in the air, and is buried in the heating.
  • the "high temperature” heat energy released by the refrigerant in the capillary coils under the indoor ground (or roof) condenses to heat the ground floor (or roof) radiation system, thereby realizing radiant heating of the indoor space.
  • the existing waterless floor heating system has the following problems:
  • the inlet and return ports of the laid multi-channel capillary coils are connected by a pair (or fewer pairs) of distributor heads, so all the multiple pipes at the distributor head are concentrated, resulting in heat distribution on the ground Unevenness and large temperature difference (generally above 5 ⁇ 10°C), resulting in a relative decrease in the heat exchange capacity of the system, low unit energy efficiency ratio, uneven indoor temperature distribution, and poor living comfort.
  • the location of the capillary coil is only on the ground or the ceiling.
  • the single radiating surface formed is not easy to meet the indoor (cooling and heating load) distribution needs, and the radiating surface is easily blocked by furniture and other indoor facilities, which affects the work efficiency of the unit and the human settlement. Comfort.
  • the purpose of the utility model is to provide a radiant heat exchange plate, a radiant heat exchange plate group and a radiant heat exchange system, which can solve to a certain extent the capillary plate existing in the air conditioner/heat pump (radiant air conditioner) waterless floor heating system in the prior art
  • Unreasonable tube design leads to problems such as unsatisfactory working conditions of the unit, insufficient energy efficiency ratio, difficulty in laying and laying capillary coils, and poor living comfort.
  • the present invention provides a radiant heat exchange plate, comprising a plate main body, the plate main body is provided with a medium inlet and a medium outlet, and the inside or side of the plate main body is formed to communicate with the medium inlet and The microchannel at the outlet of the medium is used to provide a circulation path and a phase change space for the medium.
  • the microchannels are distributed in the plate main body in a linear or curved shape, and the extension direction of the microchannels is parallel to the plate surface of the plate main body;
  • the microchannel is in the shape of a straight tube or a special-shaped tube; and/or
  • the microchannel includes a plurality of connected straight branches or a plurality of irregular branches.
  • the number of the microchannels in the plate main body is multiple, and the multiple microchannels are arranged at intervals;
  • a plurality of the microchannels are arranged in series, and one end of the plurality of microchannels connected in series is connected to the medium inlet, and the other end is connected to the medium outlet;
  • At least two of the microchannels are arranged in parallel in the plurality of microchannels, and one end of the microchannels connected in parallel is connected to the medium inlet, and the other end is connected to the medium outlet;
  • a plurality of the microchannels are mixed in series and parallel, and one end of the microchannel after the series and parallel mixing is connected to the medium inlet, and the other end is connected to the medium outlet.
  • the distance between the side where the plurality of microchannels connect to the medium inlet is greater than the distance between the side where the medium outlet is connected.
  • the diameter of the microchannel is less than or equal to 2.5 mm;
  • the board main body is in the shape of a flat plate, and the area of its one-sided board surface is greater than or equal to 0.2m2, and the thickness of the board main body is 1mm-12mm.
  • the main body or surface of the radiation heat exchange plate is a non-metal plate with high radiation emissivity and/or doped with materials with high radiation emissivity, or is a non-metal plate with high radiation emissivity and
  • the corrosion-resistant metal plate that has undergone passivation coating or adhesion coating treatment may also be a non-metal and metal "combination" optimized plate with high radiation emissivity.
  • a switching distribution channel is formed in the plate body corresponding to the medium inlet and the medium outlet, and the switching distribution channel includes at least one branch channel, and two of the microchannels The ends are respectively communicated with the branch channels at the medium inlet and the medium outlet in a one-to-one correspondence, so as to communicate the medium inlet and the medium outlet through the switching distribution channel.
  • the board main body further includes a shock-absorbing layer provided on the first side of the board main body and arranged in parallel with the board main body; and/or
  • the board body further includes a heat-conducting layer, the heat-conducting layer is arranged on the first side of the board body and is arranged in parallel with the board body; and/or
  • the board body further includes a hollow barrier layer, the hollow barrier layer is arranged on the first side of the board body, covers or wraps the microchannel, and is arranged in parallel with the board body; and/or
  • the board body further includes a veneer layer, the veneer layer is arranged on the outermost layer of the first side of the board body, and is arranged in parallel with the board body; and/or
  • the board main body further includes an electric heating auxiliary layer, the electric heating auxiliary layer is arranged on the second side of the board main body, and is arranged in parallel with the board main body; and/or
  • the board body further includes a heat reflection layer, the heat reflection layer is arranged on the second side of the board body and is arranged in parallel with the board body; and/or
  • the board main body further includes a temperature insulation layer which is arranged on the second side of the board main body and is arranged in parallel with the board main body.
  • the structure of the first side layer and the second side layer of the board body can be "omitted" to optimize the combination.
  • the present application also provides a radiation heat exchange plate assembly, which includes a combination of the multiple radiation heat exchange plates described in any one of the above installed at different positions;
  • a plurality of the radiant heat exchange plates are used to be installed on the indoor floor, roof or wall at the same time;
  • Part of the plurality of radiant heat exchange plates is used for installation on the indoor floor and/or lower wall, and part of the plurality of radiant heat exchange plates is used for installation on the roof and/or upper wall of the ceiling, and a plurality of The part of the radiation heat exchange plate is used to install on the lower wall and/or the upper wall, and the part of the multiple radiation heat exchange plates is used to install on the ground and/or the upper wall.
  • the part of the radiant heat exchange plate is used to install on the lower wall and/or roof and other different positions.
  • the radiation temperature of any two or more radiant heat exchange plates in different positions is different (realized by the control system), so it can There are more than "two" (radiation working surfaces) different temperature ranges formed in the indoor environment space.
  • the present application also provides a radiation heat exchange system, which includes a compressor, a condenser, a throttling component, an evaporator, a control valve, and the radiation heat exchange plate (group);
  • the compressor, the radiant heat exchange plate (group), the throttling component and the evaporator form a first circulation loop.
  • the radiation heat exchange plate (group) serves as a radiation heat exchange plate (group) condenser;
  • the compressor, the throttling component, the condenser and the The radiation heat exchange plate (group) forms a second circulation loop.
  • the radiation heat exchange plate (group) serves as a radiation heat exchange plate (group) evaporator; the medium is in the first circulation loop. Or circulate in the second circulation loop.
  • the radiation heat exchange system includes a compressor, a condenser, a throttling component, an evaporator, a control valve, and the radiation heat exchange plate (group);
  • the compressor, the radiant heat exchange plate (group), the condenser, the throttling component, and the evaporator form a first circulation loop.
  • the radiant heat exchange plate serves as a radiant heat exchange plate (group) condenser and works simultaneously with the condenser in series or parallel;
  • the compression The machine, the throttling component, the condenser and the evaporator and the radiation heat exchange plate (group) form a second circulation loop.
  • the radiation heat exchange plate (set) As a radiation heat exchange plate evaporator and the evaporator work simultaneously in series or parallel; the medium circulates in the first circulation loop or the second circulation loop;
  • the radiation heat exchange system includes a compressor, a control valve, a throttling component, and a plurality of the radiation heat exchange plates (groups), and the plurality of the radiation heat exchange plates includes a first radiation heat exchange plate (group) and a first radiation heat exchange plate (group). Two radiant heat exchange plates (group);
  • the compressor, the throttling component, the first radiation heat exchange plate (group) and the second radiation heat exchange plate (group) form a heat exchange circulation loop; in the heat exchange circulation loop, when The control valve is located at the first communication position, the first radiation heat exchange plate (group) is used as a radiation heat exchange plate (group) condenser, and the second radiation heat exchange plate (group) is used as a radiation heat exchange plate ( Group) type evaporator; when the control valve is in the second communication position, the first radiation heat exchange plate (group) serves as a radiation heat exchange plate (group) type evaporator, and the second radiation heat exchange plate (group) ) As a radiant heat exchange plate (group) condenser.
  • the number of the radiation heat exchange plate as the radiation heat exchange plate condenser and/or the radiation heat exchange plate as the radiation heat exchange plate evaporator is respectively multiple ;
  • a plurality of the radiation heat exchange plates as the radiation heat exchange plate condenser or a plurality of the radiation heat exchange plates as the radiation heat exchange plate evaporator are sequentially spliced, and a plurality of the radiation heat exchange plates
  • the microchannels are arranged in series in sequence, and the medium outlet of one of the two adjacent radiant heat exchange plates is connected to the medium inlet of the other radiant heat exchange plate; or
  • a plurality of the radiation heat exchange plates as the radiation heat exchange plate condenser or a plurality of the radiation heat exchange plates as the radiation heat exchange plate evaporator are sequentially spliced, and a plurality of the radiation heat exchange plates There are at least two microchannels of the radiant heat exchange plate arranged in parallel, and the medium inlet and medium outlet of the radiant heat exchange plate arranged in parallel are respectively connected to the first circulation loop and the second circulation loop; or
  • a plurality of the radiation heat exchange plates as the radiation heat exchange plate condenser or a plurality of the radiation heat exchange plates as the radiation heat exchange plate evaporator are sequentially spliced, and a plurality of the radiation heat exchange plates There are at least two or more microchannels of the radiant heat exchange plate in series and parallel mixed arrangement, and the medium inlet and medium outlet of the radiant heat exchange plate mixed in series and parallel are connected to the first circulation loop and the medium outlet respectively.
  • the second circulation loop is at least two or more microchannels of the radiant heat exchange plate in series and parallel mixed arrangement, and the medium inlet and medium outlet of the radiant heat exchange plate mixed in series and parallel are connected to the first circulation loop and the medium outlet respectively.
  • the radiation heat exchange plate provided by the present application includes a plate main body, the plate main body is provided with a medium inlet and a medium outlet, and microchannels connecting the medium inlet and the medium outlet are formed inside or on the side of the plate main body.
  • the medium can enter the microchannel through the medium inlet, vaporize or liquefy in the microchannel, and then flow out of the microchannel through the medium outlet.
  • the microchannel provides a phase change space for the medium in it, and the medium phase change "work” process will absorb or release heat, so as to "absorb" the heat of the object in the environment through the main body of the plate or transfer the heat to the object in the environment Radiation is "released", which in turn changes the temperature of objects in the surrounding environment.
  • the radiation heat exchange plate provided by this application When the radiation heat exchange plate provided by this application is installed on the indoor floor, wall and ceiling (and/or wall), it can form a "closed cavity" with multiple radiating surfaces up, down, left and right in the entire indoor environment space, similar to For the "black body” in the radiation theory, the rationality of radiant heat exchange, the comfort of indoor living, and the energy-saving performance of the unit can achieve the optimal combination of capabilities.
  • the radiation heat exchange plate set provided by this application includes a plurality of radiation heat exchange plates, and the multiple radiation heat exchange plates can be used to be laid at different positions in the room at the same time to form "two" or more radiation working surfaces.
  • the radiation temperature of the surface is different (implemented by the control system), so different temperature ranges can be formed in the indoor environment space, which further fully reflects the superior performance of radiation heat exchange and improves the comfort of indoor living.
  • the radiation heat exchange system provided by this application includes radiation heat exchange plates (groups) and compressors, condensers, throttling components, evaporators and control valves; by changing the connection position of the control valves, the radiation heat exchange system forms different cycles Circuit, to realize the radiation heat exchange plate (group) as the radiation heat exchange plate (group) type evaporator or the radiation heat exchange plate (group) condenser under different requirements, so as to continue to carry out the object or the human body in the environment Radiant cooling or heating.
  • Figure 1 is a schematic diagram of the first structure of a radiation heat exchange plate provided by an embodiment of the utility model
  • FIG. 2 is a schematic diagram of the second structure of the radiation heat exchange plate provided by the embodiment of the utility model
  • FIG. 3 is a schematic diagram of a third structure of the radiation heat exchange plate provided by the embodiment of the utility model
  • FIG. 4 is a schematic diagram of the fourth structure of the radiation heat exchange plate provided by the embodiment of the utility model
  • FIG. 5 is a schematic diagram of a connection mode between the radiation heat exchange plates provided by the embodiment of the utility model
  • Fig. 6 is a schematic diagram of another connection method between the radiation heat exchange plates provided by the embodiment of the present invention.
  • Fig. 7 is a graph showing changes in spectral emissivity and wavelength of various materials in the prior art.
  • 1-plate main body 11-medium inlet, 12-medium outlet, 13-microchannel, 14-shaped branch pipe, 15-transfer distribution channel.
  • connection should be understood in a broad sense.
  • it can be a fixed connection or an optional connection.
  • the present application provides a radiant heat exchange plate, including a plate main body 1, the plate main body 1 is provided with a medium inlet 11 and a medium outlet 12, inside the plate main body 1 (including the inner and side surfaces) A microchannel 13 connecting the medium inlet 11 and the medium outlet 12 is formed.
  • the medium can enter the microchannel 13 through the medium inlet 11, and can be vaporized or liquefied in the microchannel 13, and then exit the microchannel 13 through the medium outlet 12.
  • the microchannel 13 provides a phase change space for the medium in it, and heat is absorbed or released during the phase change "work” process of the medium, so that the plate body 1 radiates and "absorbs" the heat of objects in the environment or transfers the heat to the environment.
  • the radiation of the object which in turn changes the temperature of the object in the surrounding environment.
  • the medium used in the radiant heat exchange plate is refrigerant, which can be selected from R410A, R290, R32 or R744.
  • the medium will vaporize or liquefy in the micropores of the plate body 1, and heat will be released or inhaled after "work".
  • the plate main body 1 exchanges heat with objects in the surrounding environment through radiation. Specifically, when the medium in the microchannel 13 is condensed, it can release heat to the environment, and the released heat is radiated to the environment through the panel body 1, thereby heating the room. When the medium in the microchannel 13 evaporates, the temperature of the plate main body 1 is lower than the indoor air temperature, so that the plate main body 1 can absorb heat from the environment and play a role in cooling the room.
  • the application of radiant heat exchange plates (groups) to solve the temperature problem of indoor "heat” load is completely achievable.
  • the radiation heat exchange capacity of the radiation heat exchange plate (group) can reach more than 50% of the total heat exchange.
  • the radiant work surface is a single layer (ground or roof)
  • heating is required in winter
  • the radiant heat exchange board can be laid on the indoor floor or wall to radiate heat to the room to meet the indoor requirements.
  • the need for heating In areas with higher temperatures, where cooling is required in summer, radiant heat exchange panels can be laid on indoor sheds or walls to absorb indoor heat, reduce indoor temperature, and meet indoor cooling requirements.
  • the radiant heat exchange plate can also be used as a heat exchange device to directly act in the required environment without laying on the ground or wall.
  • the so-called radiant heat exchange means that when there is a temperature difference between objects, the objects exchange energy in the form of thermal radiation, so that high-temperature objects lose heat and low-temperature objects gain heat.
  • This heat transfer is called radiation Heat transfer.
  • thermal radiation refers to the process of stimulating the vibration of microscopic particles inside an object due to heat, converting thermal energy into radiant energy, radiating outward to surrounding objects in the form of electromagnetic waves, and then converting the radiant energy into thermal energy.
  • Thermal radiation is the inherent nature of all objects in nature. Its characteristic is that objects can achieve energy “conversion” transfer without contact, until the heat balance is achieved and “continuous transfer” is also achieved.
  • the radiant heat exchange plate of this embodiment can use the "heat or cold” of the plate itself to generate radiant energy to exchange energy with objects or human bodies in the environment without touching objects, so as to achieve the goal of radiating energy to objects or human bodies in the environment. For heating or cooling. Specifically, in this embodiment, the temperature of the plate body 1 is changed by the heat released or absorbed by the medium in the radiating heat exchange plate, that is, the “heat or cold” contained in the plate body 1 is changed, and the “heat or cold” inside the plate body 1 is changed.
  • the same wavelength different materials have different absorption ratios (related to the surface of the object); the same material, different wavelengths have different absorption ratios (the absorption of the object is selective).
  • the influencing factors are mainly in two aspects, one is the surface condition—the material of the surface, the color of the surface, the roughness of the surface, the oxidation of the surface, etc.; the other is the projected radiation source—the temperature of the radiation source (radiation panel), and The distance, position, and direction of the irradiated object are related.
  • the factors that affect radiant heat transfer include the shape and size of the surface of the object, the relative position between the surface of the object, the wavelength of the object's radiation, and the radiation and absorption characteristics of the surface of the object.
  • the first aspect is that the surface temperature of an object is related to the "heat" inside the object, that is, the higher the "heat” contained in the object, the higher the temperature transferred to the surface of the object.
  • the present application generates a large amount of heat (generally 303 ⁇ 10k) in the microchannel 13 by the refrigerant of the plate main body 1, which can make the surface temperature of the plate main body 1 rise rapidly, thereby converting the heat energy on the surface of the plate main body 1 into radiation It can radiate outward, thereby improving the efficiency of radiation heat exchange with objects or human bodies in the environment, and the temperature of objects or human bodies in the environment;
  • the second aspect is the shape and size of the surface of the object, and the radiant heat exchange between the surfaces of the two objects It has a lot to do with the relative position between the surfaces of the two objects.
  • the indoor floor radiation panel should be fully paved as far as possible under the premise of avoiding obstructions (that is, the paved area is ⁇ 75%); And under the conditions of the surface material, temperature and shape of the object, the radiant energy of the object is proportional to the size of the object surface. Therefore, within a reasonable range, the larger the surface size of the radiator (object), the greater the overall radiant energy.
  • the third aspect the distance between the surface of the object, and under the conditions of the surface material, temperature, and shape of the object, the smaller the distance between the radiant heat exchange objects, and the radiant plate (body) and the radiated heat exchange When the object is in a plane as much as possible and the angle formed is the normal direction, the radiation heat transfer efficiency is higher; the fourth aspect, the radiation spectral emissivity of the object changes with the wavelength.
  • the spectral emission of most media The rate decreases with the increase of wavelength, and the mechanism of infrared radiation absorption is spectral matching resonance absorption, that is, when the radiation wavelength of the radiation source is consistent with the absorption wavelength of the irradiated object, the object will absorb a large amount of infrared radiation; heat rays
  • the wavelength of the radiation is 0.1-100 ⁇ m, and the wavelength of radiation for solid objects is 0.4-20 ⁇ m, most of which are in the infrared region of 0.8-20 ⁇ m.
  • the radiation wavelength of the radiation panel of the radiant air conditioner is about 2-20 ⁇ m, which is basically the same as the radiation wavelength of solids.
  • the human body In the infrared region of the heat rays overlap; for the human body, the human body itself is a good "infrared” absorber, the radiation wavelength range of the human body surface is 2.5-15 ⁇ m (peak wavelength is about 9.3 ⁇ m); the radiation absorption wavelength is 8- 14 ⁇ m is the main body (approximately 46% of the total radiant energy of the human body), so the radiation wavelength of the radiant panel of the radiant air conditioner already covers the absorption wavelength of the human body, which can fully achieve matching resonance, and provide efficient heat radiation to the human body, so that the human body can feel " "Warm” is accompanied by "infrared health care.”
  • the radiant emissivity ⁇ (blackness) of an object is a property of the object's material itself and has nothing to do with external factors.
  • the type of substance is especially the outermost material on the surface.
  • the type has a greater influence on the radiation emissivity.
  • the radiation emissivity of metals is small, while the radiation emissivity of non-metals is larger, generally between 0.85 and 0.95. Therefore, the larger the radiation emissivity will be Better heat radiation.
  • the medium inlet 11 and the medium outlet 12 of the plate main body 1 in order to facilitate the inflow or outflow of the medium, the medium inlet 11 and the medium outlet 12 are opened on the plate surface (the plate surface in the length or width direction) of the plate main body 1, and the thickness of the plate main body 1
  • the plate surface in the direction forms a heat radiating surface.
  • the medium inlet 11 and the medium outlet 12 of the board main body 1 can be arranged on the same side of the board main body 1, or on different sides of the board main body 1, and can be selected according to specific laying requirements.
  • the diameter is less than or equal to 2.5mm, preferably 0.5 to 1mm.
  • the plate surface temperature provides space, so that all the media passing through the microchannel 13 complete phase change as much as possible to "work”, thereby improving the heat exchange capacity of the plate body 1 and radiating more heat to the environment (indoor).
  • the radiant heat exchange plate of the present application is arranged on the microchannel 13 of the plate body 1 to greatly reduce the inner diameter of the microchannel 13 as much as possible, improve the heat exchange rate of the medium and the energy efficiency ratio of the unit, and improve the radiant air conditioner after matching with the plate body 1.
  • the overall structure and performance of the system (the use of small units makes the heat pump system more reasonable, its light weight, small size, suitable for high-floor assembly, and there will be no "cold bridge" air faults between the units), and the installation speed is improved. It solves the problems of the complexity of the building supporting, the comfort of the living environment, and the energy-saving performance of the unit.
  • the panel body 1 in order to achieve the best heat radiation effect, under the premise that the indoor objects and facilities (furniture) are relatively fixed, it depends on the size and relative position of the radiant panel surface, and the upper and lower (ground and roof) are parallel. Laying radiant panels (conditions allow symmetrical and parallel laying on the wall) can obtain the largest angular coefficient. For this reason, the surface of the radiating panel is preferably flat.
  • the two sides of the panel body 1 in the thickness direction form heat radiating surfaces for Perform radiation heat exchange with the environment.
  • the area of the single-sided board surface of the board main body 1 is greater than or equal to 0.2m 2 , specifically, 1m 2 , 2m 2 , 3m 2, etc.
  • the thickness of the board body 1 is 1mm-12mm, which can be specifically selected according to the size of the microchannel 13 in the board body 1 and the strength and structure requirements of the board body 1. For example, when the diameter of the microchannel 13 in the board body 1 is 1mm When the thickness of the board body 1 is preferably 2mm; when the diameter of the microchannel 13 in the board body 1 is 0.3mm or 0.5mm, the thickness of the board body 1 is preferably 1mm or 1.5mm; and the thickness of the board body 1 In the direction, the microchannel 13 is located in the middle of the plate main body 1 to ensure that the thickness of the plate main body 1 on both sides of the microchannel 13 is consistent.
  • the microchannel 13 can also be arranged on one side of the plate main body 1 as required.
  • the board body 1 is a stone plastic (spc) board, a crop straw board, a bamboo (wood) fiber or a metal board
  • the thickness of the board body 1 is preferably 1-12mm, and more preferably 2.5mm, 4.5mm, 6mm, 8mm , 10mm, 11mm.
  • the board body 1 is a polyurethane board or a phenolic foam board (EPS board, XPS board)
  • the thickness of the board body 1 is preferably 10-55 mm, and more preferably 30 mm, 35 mm, or 40 mm.
  • the radiant heat exchange plate of this embodiment can be directly laid on the whole plate, and the microchannel 13 in the main body 1 of the plate is made in advance (according to the actual cooling and heating load at the installation site) in the factory "standard", without the need for manual on-site calculation of laying and welding pipelines It saves time and effort, and the paving efficiency is high.
  • the surface of the radiant heat exchange plate can be treated by special methods such as chemical passivation coating or adhesion (spraying) coating or filming (high temperature pressing) to become a corrosion-resistant radiant plate to improve the acid and alkali resistance of the radiant heat exchange plate, etc. Corrosion performance and service life in special environments (such as harsh environments such as paving in wet bathrooms and covering in cement).
  • Kirchhoff heat radiation law indicates that at a given temperature, a material with a larger absorption coefficient has a stronger ability to radiate electromagnetic waves.
  • the temperature of the radiant panel of this radiant air conditioning system is generally 303 ⁇ 10k. At this temperature, the metal radiant emissivity is low (below 0.1), while the radiant emissivity of other non-metallic materials is higher.
  • the wavelength is About 8 ⁇ m and the temperature is between 200 ⁇ 1000k is ideal; since the human body absorbs infrared heat radiation with a wavelength of 8-14 ⁇ m, choosing materials with a radiation wavelength close to this wavelength range can achieve better radiation heat exchange with the human body Effect.
  • FIG 7 it shows the spectral emissivity of common copper, iron, silver, gold, aluminum and graphite in a certain wavelength range.
  • graphite or "graphene”
  • the spectral emissivity of is much greater than other metal materials, so the material of the plate body 1 of the present application can be graphite (or “graphene”) materials or non-metallic materials containing carbon black.
  • the spectral emissivity of metals is lower in comparison, and the spectral emissivity of non-metals is higher, generally greater than 0.8; but the spectral emissivity of metals increases with the increase of temperature. And when the oxide layer is formed on the surface, it can be increased by a factor of 10 or more. Therefore, the metal material after oxidation treatment can also be used, but because its emissivity near 10 ⁇ m is still quite low; therefore, the board of this embodiment
  • the surface material of the main body 1 is preferably a non-metallic material. Specifically, it can be a plate made of non-metallic materials such as stone plastic, crop straw, bamboo (wood) fiber, or a metal plate after oxidation treatment, or a combination of metal and non-metal. And the formed plate.
  • the microchannel 13 in order to increase the extension length of the microchannel 13 in the plate main body 1, to increase the phase change space of the medium in the plate main body 1 and the distribution area of the plate main body 1, the microchannel 13 is in the plate main body 1. It extends and distributes in a bent shape, and the extension direction of the microchannel 13 is parallel to the plate surface of the plate main body 1. One end of the microchannel 13 is connected to the medium inlet 11 and the other end is connected to the medium outlet 12.
  • the microchannel 13 may be in a straight tube shape or a special-shaped tube shape, preferably a corrugated tube shape, so as to further extend and increase the length and width of the microchannel 13 in the plate main body 1.
  • each microchannel 13 can also be in the form of multiple connected straight branches (not shown in the figure) or multiple connected special-shaped branches, that is, the microchannel 13 can include multiple Special-shaped branch pipes 14 (such as corrugated branch pipes) arranged in parallel, and have the same channel inlet and channel outlet, to further reduce the flow resistance of the medium in the microchannel of the plate main body 1 and increase the medium in the microchannel of the plate main body 1 The phase change space and the surface area of the board.
  • Special-shaped branch pipes 14 such as corrugated branch pipes
  • the number of microchannels 13 in the plate main body 1 is multiple, and the multiple microchannels 13 are arranged at intervals.
  • a plurality of microchannels 13 can be arranged in series. When multiple microchannels 13 are arranged in series in sequence, one end of the multiple microchannels 13 connected in series is connected to the medium inlet 11 and the other end is connected to the medium outlet 12.
  • the microchannels 13 in the parallel section have the same channel inlet and channel outlet, and the microchannels 13 arranged in parallel are connected in series with other microchannels 13 to form multiple One end of the microchannel 13 is connected to the medium inlet 11 and the other end is connected to the medium outlet 12.
  • the microchannels 13 in the parallel part have the same channel inlet and channel outlet and are connected in parallel with the remaining microchannels 13, and then connect the medium inlet 11 and the medium outlet 12 respectively. That is, a plurality of microchannels 13 can be arranged in series, parallel or mixed in series and parallel.
  • the microchannel 13 in the plate main body 1 has multiple branches or the plate main body 1 has multiple microchannels 13, in order to ensure the uniformity of the heat exchange of the medium entering the microchannel 13 corresponding to each position of the plate main body 1 ( In actual heating applications, when the medium flowing in the plate body 1 releases heat outward, the temperature of the plate body 1 corresponding to the medium inlet 11 is high, and the temperature corresponding to the medium outlet 12 is low. Sometimes there is a difference of more than ten between the two Degree, or even higher), a plurality of microchannels 13 are arranged at intervals, and the distance between the sides of the plurality of microchannels 13 or branches connected to the medium inlet 11 is greater than the distance between the sides of the medium outlet 12 connected.
  • the density of the microchannel 13 or branch pipe on the side corresponding to the medium inlet 11 in the plate main body 1 is less than the density of the microchannel 13 or branch pipe on the side corresponding to the medium outlet 12, so that the medium flows in the microchannel 13 correspondingly
  • the temperature of the plate surface at the end of the medium inlet 11 and the plate surface at the end of the medium outlet 12 are more balanced.
  • the transfer distribution channel 15 is formed in the plate main body 1 at the corresponding medium inlet 11 and the medium outlet 12 respectively.
  • the transfer distribution channel 15 includes one Branch channel, the two ends of the micro channel 13 are respectively connected to the branch channels corresponding to the transfer distribution channel 15 at the medium inlet 11 and the medium outlet 12; when there are multiple micro channels 13 in the plate main body 1, the transfer distribution channel 15 includes a plurality of branch channels. The two ends of the plurality of microchannels 13 are respectively connected to the branch channels of the switching distribution channel 15 at the medium inlet 11 and the medium outlet 12 in a one-to-one correspondence, so that the medium can pass through the switching distribution channel.
  • the transfer distribution channel 15 smoothly enters into the microchannel 13 and flows out of the microchannel 13 smoothly through the switching distribution channel 15.
  • the transfer distribution channel 15 can be in the form of an inlet and outlet connected to a plurality of parallel branch channels, or a composite (series, parallel or Series and parallel connection) are formed.
  • the main body 1 of the plate can adopt a whole-plate structure, and the microchannels 13 in the main body 1 can be formed by processes such as erosion (corrosion) or extrusion (stretching), engraving, etc.
  • the board main body 1 can adopt a structure formed by buckling two plates, respectively forming micro-channels on the two plates (or only on one plate) by laser, etching, etc.
  • Half of 13, after the two plates are fastened, the microchannel 13 can be formed in the main body 1.
  • the medium in the microchannel 13 can leak.
  • the two plates can be sealed and fastened by bonding, welding, pressing (high temperature), etc. to form a complete plate body 1; on the other hand, it can also be attached to one side of the plate body 1 or attached after grooves are cut.
  • the ultra-fine tubing forms the microchannel 13.
  • the radiant heat exchange plate of this embodiment can be used as a prefabricated plate according to the actual cooling and heating load requirements of the installation site, which can be prefabricated in the factory through unified standardization.
  • the radiant heat exchange plate is used for indoor radiation heat exchange Radiant panels of different specifications can be designed according to different room types, and the finished radiant heat exchange panels can be spliced and laid directly on site without manual laying of pipelines, so the radiant heat transfer performance is greatly improved while the laying is greatly improved. efficient.
  • the radiant heat exchange plate of this embodiment is a radiant heat exchange plate group.
  • the ground is laid first under the premise of heating.
  • paving unobstructed walls below 1.5m
  • the ground radiation panel and the human body front
  • the radiant energy when the radiation panel is parallel to the human body (object) is the largest, and the ground radiation panel and the human body (front) are generally at 90°, so only about 1/2 of the radiant energy is obtained; if the wall is Radiant panels can also be laid on the surface. Below 1.5m from the ground, it is in the normal direction to the human body, and the maximum radiant energy can be obtained at this time.
  • the second embodiment is an improvement on the basis of the first embodiment.
  • the technical content disclosed in the foregoing embodiment will not be described repeatedly, and the content disclosed in the foregoing embodiment also belongs to the content disclosed in the second embodiment.
  • the radiation heat exchange plate of this embodiment can be installed on the indoor floor, wall and ceiling at the same time to form multiple radiation "working surfaces" up, down, left and right; multiple radiation “working surfaces” can be designed as ground + lower wall according to site needs (Less than 1.5m) and the combination of the roof + upper wall (above 1.5m), it can also be the combination of the ground and the upper wall, it can also be the combination of the lower wall and the roof, and it can also be the lower wall and the upper wall.
  • the upper wall and other different combinations; the radiation "working surface” can also be laid separately on the ground or on the roof or on the wall according to the needs of the site.
  • the main body of the radiation heat exchange plate of this embodiment includes a heat conduction layer, an electric heating auxiliary layer, a shock absorption layer, a finishing layer, a heat reflection layer, and a temperature insulation layer, and the finish layer and the shock absorption layer, the electric heating auxiliary layer, and the heat conduction layer are parallel Attached to the first side of the board body, the first side is the side (upper surface) facing the installation space where the radiant heat exchange plate is located, that is, the side facing away from the ground, wall or shed surface, and the heat-conducting layer , The electric heating auxiliary layer and the shock absorption layer are located between the facing layer and the main body of the board.
  • the heat reflection layer and the temperature insulation layer are attached to the second side of the board body in parallel.
  • the second side is the side (lower surface) away from the installation space where the radiation heat exchange board is located, that is, facing the ground, wall or shed
  • the heat reflection layer is located between the main body of the board and the temperature insulation layer.
  • the veneer layer on the one hand, it is used to improve the aesthetics of the radiant heat exchange plate of this embodiment; on the other hand, when the veneer layer is attached to the main body of the board, the surface of the veneer layer forms a heat radiation surface.
  • the thermal radiation principle of the radiant heat exchange plate in Example 1 when the spectral emissivity of the material used in the main body of the plate is not very ideal, the material with higher spectral emissivity can be used as the finishing layer to form the thermal radiation effect. Better radiation surface.
  • the material of the plate main body is preferably a material with good thermal conductivity, such as metal materials such as aluminum and copper, or non-metals such as stone plastic.
  • Material; and the facing layer is preferably a layer of carbon black (and/or "graphene") stone plastic material, cork, crop straw, bamboo (wood) fiber, etc. (graphite, "graphene”) material layer, metal oxide Materials with good heat radiation properties such as material layers.
  • the veneer layer and the board main body may be integrally formed to form a veneer layer on the surface of the board main body; or the outer surface of the board main body directly serves as the veneer layer.
  • the thermal conductive layer has the function of heat conduction and temperature uniformity.
  • the metal thin film material can also be selected from carbon crystal film or "graphene" with good thermal conductivity.
  • the electric heating auxiliary layer it has the function of auxiliary heating, and the ultra-thin graphene electric heating film can be selected to ensure that the air source heat pump can be used as an appropriate heat supplement in the extremely cold environment when the heat supply of the air source heat pump is insufficient.
  • the shock-absorbing layer since both the facing layer and the main body of the board are made of hard materials, in order to avoid collision and wear between the facing layer and the main body of the board when the radiation heat exchange board of the present application is laid on the ground. Or in the case of abnormal noise, add a shock-absorbing layer between the two to avoid the above problems.
  • the shock-absorbing layer may be formed of any soft material such as a cork sheet, rubber or artificial chemically synthesized IXPE material like cork, a sheet of non-metallic material, and the like.
  • the plate main body faces the ground, wall or
  • One side of the shed is provided with a heat reflection layer and a temperature insulation layer.
  • the heat reflection layer and the temperature insulation layer are arranged parallel to the main body of the board. The heat reflection layer can reflect most of the heat back to the main body of the board.
  • the structure layer of the smooth metal reflective coating with the effect, and the metal reflective coating is set toward the main body of the board;
  • the temperature insulating layer is preferably a material with poor thermal conductivity, such as foamed polyurethane, aerogel thermal insulation material, rock wool board, extruded plastic Plates, benzene plates, foamed cement and ceramic plates, etc., to block the downward (outward, upward) heat transfer of the main body of the plate, so that the heat generated in the microchannel of the main body of the plate is radiated out through the heat radiating surface.
  • a hollow isolation layer is also provided on the side of the radiant heat exchange plate facing the room.
  • special pipes with anti-condensation coatings such as graphene
  • part of the raised radiant heat exchange plate facing the indoor surface Avoid the dew point temperature by 1 ⁇ 2°C higher than the dew point
  • the indoor fresh air dehumidifier to help remove the indoor humid air (most of the latent heat and part of the Sensible heat)
  • the fresh air blower has many outlets and the air is soft, and the living feeling is not obvious, so as to achieve the purpose of cooling the room "without blowing feeling", and at the same time realize the reduction of condensation.
  • the board main body can be used as a radiation heat exchange "substrate”; it can also be used as a radiation heat exchange "decorative panel".
  • the main body of the plate can optionally include one or more of the above-mentioned thermal conductivity layer, shock absorption layer, hollow insulation layer, heat reflection layer and temperature insulation layer.
  • the board body can optionally include one or more of the above-mentioned thermally conductive layer, hollow spacer, and decorative layer.
  • the third embodiment is an improvement on the basis of the first and second embodiments.
  • the technical content disclosed in the above-mentioned embodiments will not be described repeatedly, and the content disclosed in the above-mentioned embodiment also belongs to the content disclosed in the third embodiment.
  • This embodiment provides a radiant heat exchange plate group, which includes a combination of multiple radiant heat exchange plates of any one of the above-mentioned embodiments installed in different positions.
  • Multiple radiation heat exchange panels can be installed on the indoor floor, wall and roof at the same time to form multiple radiation "working surfaces” up, down, left, and right; multiple radiation “working surfaces” can also be designed as ground + lower wall according to site needs ( 1.5m or less) and the combination of roof + upper wall (1.5m or more) and lower wall (1.5m or less) + upper wall (1.5m or more), or the combination of ground and upper wall, or It is a combination of various forms such as the combination of the lower wall and the roof;
  • the radiation "working surface” can also be laid separately on the ground or on the roof or on the wall according to the needs of the site.
  • the fourth embodiment is an improvement on the basis of the first, second and third embodiments.
  • the technical content disclosed in the above embodiments will not be described repeatedly, and the content disclosed in the above embodiment also belongs to the content disclosed in the fourth embodiment. .
  • This embodiment provides a radiation heat exchange system, including a compressor, a condenser, a throttling component, an evaporator, a control valve, and the radiation heat exchange plate (indoor unit) of the above embodiment.
  • the control valve When the unit is heating, the control valve is in the first communication position, the compressor, radiant heat exchange plate (group), throttling components and evaporator form the first circulation loop.
  • the radiant heat exchange plate (group) acts as Radiant heat exchange plate (group) condenser;
  • the compressor, throttling components, condenser and radiant heat exchange plate (group) form a second circulation loop.
  • the radiation The heat exchange plate (group) is used as a radiation heat exchange plate evaporator; the medium circulates in the first circulation loop or the second circulation loop.
  • the first circulation loop is connected.
  • the compressor is connected to the medium inlet of the radiant heat exchange plate (group) condenser (located in the room) through the pipeline.
  • the microchannel and the medium outlet form the front section of the first circulation loop.
  • the medium is compressed by the compressor to form a high-temperature and high-pressure medium.
  • the high-temperature and high-pressure medium enters the microchannel of the radiant heat exchange plate (group) condenser for cooling and condensation.
  • the objects in the environment or the human body radiate heat, and then play a role in heating the objects or the human body in the indoor environment.
  • the throttling component and the evaporator (located outdoors) form the back section of the first circulation loop.
  • the medium flows out of the radiant heat exchange plate (group) condenser and passes through the throttling component. After the pressure drops sharply, it changes from liquid to vapor through the evaporator. At the same time, the heat is replaced from the outdoor environment, and the low-pressure superheated steam enters the return port of the compressor, and circulates in this way to realize the energy-saving operation of the heat pump (radiant air conditioning) system and the continuous radiation heat exchange of the radiation heat exchange plate (group).
  • the above process is mainly applicable to situations where indoor heating is required in low temperature environments such as winter.
  • the second circulation circuit When the control valve is in the second communication position, the second circulation circuit is connected. At this time, the compressor and the condenser form the front stage of the second circulation circuit.
  • the medium is compressed into a high-temperature and high-pressure medium by the compressor, and the high-temperature and high-pressure medium enters the condensation Cooling and condensing inside the evaporator (located outdoors), the heat is released to the outdoor environment while changing from a gaseous state to a liquid state; after throttling by the throttling component, it enters the radiant heat exchange plate (group) type evaporator (located indoors) or indoor unit
  • the pressure drops sharply after the medium "flows into” the throttling component, and then changes from liquid to vapor through the radiant heat exchange plate (group) type evaporator or indoor unit while replacing it from the indoor environment.
  • the heat plays a role in cooling objects or human bodies in the indoor environment.
  • the low-pressure superheated steam enters the return port of the compressor and circulates in this way to realize the normal "energy-saving" operation and radiation exchange of the indoor unit of the air conditioning (radiation air conditioning) system.
  • the continuous heating plate (group) provides radiant cooling to the room. The above process is mainly applicable to situations where indoor cooling is required in high temperature environments such as summer.
  • control valve is a four-way valve.
  • the radiation heat exchange system of this embodiment is used as a radiation heat exchange plate type
  • the number of radiant heat exchange plates of the condenser is multiple, and the multiple radiant heat exchange plates are spliced sequentially to form a complete heat radiating surface.
  • the microchannels in each radiant heat exchange plate can be connected in series or connected in parallel and mixed in series and parallel.
  • the microchannels 13 of the multiple radiant heat exchange plates are connected in sequence, that is, the microchannels 13 of the multiple radiant heat exchange plates are arranged in series, and one of the two adjacent radiant heat exchange plates
  • the medium outlet 12 of the radiant heat exchange plate is connected to the medium inlet 11 of another radiant heat exchange plate.
  • One end of the complete microchannel formed by splicing multiple radiant heat exchange plates in sequence forms a total medium inlet, and the other end forms a total medium outlet ,
  • the multiple radiant heat exchange plates can form a larger radiant heat exchange surface after splicing, so as to better realize the uniform heat exchange with the indoor environment.
  • microchannels 13 of the multiple radiant heat exchange plates are arranged in parallel.
  • the medium inlet 11 and the medium outlet of each radiant heat exchange plate 12 enters the medium separately, and multiple medium inlets 11 and multiple medium outlets 12 are respectively connected to the circulation loop.
  • the radiant heat exchange plate of the series The media inlet and the media outlet are connected in sequence to form a total media inlet and a total media outlet.
  • the media inlet and outlet of the parallel part and the media inlet and outlet of the series part are respectively connected to the circulation loop (that is, the parallel part and the series part are arranged in parallel) ;
  • the second type, the serial part forms the total medium inlet, the parallel part's medium inlet is connected to the series part's total medium outlet, and the parallel part's medium outlet is respectively connected to the circulation loop. That is, when only some of the multiple radiant heat exchange plates are connected in parallel, the system may have the form of series-parallel hybrid connection.
  • the radiation heat exchange system of this embodiment has multiple radiation heat exchange plates as a radiation heat exchange plate evaporator, and the splicing method of multiple radiation heat exchange plates is the same as that of a radiation heat exchange plate condenser.
  • the splicing method of the hot plate is the same, that is, series splicing, parallel splicing, or series-parallel hybrid splicing can also be used, which will not be repeated here.
  • the fifth embodiment is an improvement on the basis of the first to the fourth embodiments.
  • the technical content disclosed in the foregoing embodiments will not be described repeatedly, and the content disclosed in the foregoing embodiment also belongs to the content disclosed in the fifth embodiment.
  • the radiant heat exchange system includes a compressor, a control valve, a throttling component, and a plurality of radiant heat exchange plates, and the plurality of radiant heat exchange plates includes a first radiant heat exchange plate (group) and a second radiant heat exchange plate (Group); the compressor, the throttling component, the first radiation heat exchange plate (group) and the second radiation heat exchange plate (group) form a heat exchange circulation loop; in the heat exchange circulation loop, when the control valve is in the first communication Position, the first radiation heat exchange plate (group) is used as a radiation heat exchange plate condenser, and the second radiation heat exchange plate (group) is used as a radiation heat exchange plate evaporator; when the control valve is in the second communication position, the first radiation heat exchange The plate (group) serves as a radiation heat exchange plate type evaporator, and the second radiation heat exchange plate (group) serves as a radiation heat exchange plate condenser.
  • the first radiant heat exchange plate (group) is arranged indoors, and the second radiant heat exchange plate (group) is arranged outside the room.
  • the first radiation heat exchange plate (group) serves as a radiation heat exchange plate condenser
  • the second radiation heat exchange plate (group) serves as a radiation heat exchange plate evaporator.
  • the process of the medium circulating between the compressor, the radiation heat exchange plate condenser, the throttling component and the radiation heat exchange plate evaporator is the same as the principle of the radiation heat exchange plate condenser located indoors to radiate heat to the room in the third embodiment; and
  • the first radiation heat exchange plate (group) is used as a radiation heat exchange plate evaporator, and the second radiation heat exchange plate (group) is used as a radiation heat exchange plate condenser.
  • the splicing method of the radiation heat exchange plate (group) as the radiation heat exchange plate evaporator and the radiation heat exchange plate (group) as the radiation heat exchange plate condenser in this embodiment is also the same as that in the third embodiment.
  • the splicing method of the plates is the same, that is, the radiant heat exchange plates in this embodiment can also be arranged in series, in parallel, or mixed in series and parallel, which will not be repeated here.
  • the sixth embodiment is an improvement on the basis of the first to the fifth embodiments.
  • the technical content disclosed in the foregoing embodiments will not be described repeatedly, and the content disclosed in the foregoing embodiment also belongs to the content disclosed in the sixth embodiment.
  • the radiant heat exchange plate (group) set in the room includes a set of radiant heat exchange plates and two sets of radiant heat exchange plates arranged in parallel.
  • Heat exchange plate, one set of radiant heat exchange plate is laid on the ground and wall, two sets of radiant heat exchange plate are laid on the shed and wall, one set of radiant heat exchange plate and two sets of radiant heat exchange plate can be connected to the circulation circuit respectively
  • one set of radiant heat exchange plates or two sets of radiant heat exchange plates are respectively connected to the circulation loop, so as to realize that a set of radiant heat exchange plates is connected to the circulation loop for heating only (assistant cooperation if necessary)
  • Two sets of radiant heat exchange plates are used for refrigeration) or two sets of radiant heat exchange plates are connected to the circulation loop for only cooling (if necessary, a set of radiant heat exchange plates are assisted for heating).
  • the specific heat exchange and refrigeration principles have been specifically described in the above embodiments, and will not be repeated here.
  • a set of radiant heat exchange plates and two sets of radiant heat exchange plates can be switched and controlled by control valves (such as solenoid valves or electronic expansion valves), so that one set of radiant heat exchange plates or two sets of radiant heat exchange plates They are respectively connected to the circulation loop formed under different working conditions.
  • control valves such as solenoid valves or electronic expansion valves
  • the radiation heat exchange plate (group) and the unit can achieve large-area high-efficiency heating or cooling indoors, which overturns
  • the indoor cold and heat exchange methods in the prior art can realize the independent control of multi-function (with fresh air function) indoor temperature and humidity of a small unit, improve the heat exchange efficiency of the system, and realize "standardized" production and easy paving. Easy to do, it also improves the comfort of human settlements for the modernization of the building.
  • Table 1 is the radiant heat transfer per unit area at different temperatures (when the indoor floor area is ⁇ 75%, the shielding coefficient of the furniture and the loss of the downward heat transfer from the ground radiation are not considered for the time being).

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Abstract

本申请涉及辐射空调领域，具体涉及辐射换热板、辐射换热板组和辐射换热系统。辐射换热板包括板主体内部或侧部有连通介质入口和介质出口的微通道。微通道为介质提供流通路径和相变空间，且介质流通会使板主体"辐射吸收"环境中的热量或将热量向环境中"辐射放出"。辐射换热板组，包括多个辐射换热板用于同时安装在室内地面、棚顶或墙面等形成上、下"两个"以上不同的辐射工作面，以构成更加合理的环境温度空间。辐射换热系统包括辐射换热板以及压缩机、冷凝器、节流部件、蒸发器和控制阀；通过改变控制阀的连通位形成不同的循环回路，以实现辐射换热板作为辐射换热板式蒸发器或辐射换热板式冷凝器，持续向环境中的物体或人体辐射制冷或制热。

Description

辐射换热板、辐射换热板组及辐射换热系统 技术领域
本实用新型涉及空调/热泵(辐射空调)无水地暖领域，具体而言，涉及一种辐射换热板、辐射换热板组和辐射换热系统。
背景技术
现有技术中，空气源热泵无水地暖系统主要由空气源热泵热源机组、辐射系统以及控制器系统组成，工作原理为压缩机驱动冷媒做功，置换空气中“免费”热能，制热时埋在室内地面下(或棚顶)的毛细盘管中冷媒冷凝后释放出的“高温”热能，把地面地板(或棚顶)辐射系统加热，进而对室内空间实现辐射供暖。
而现有的无水地暖系统存在以下问题：
1.埋在室内地面下的毛细盘管的排布需要现场“制作”完成，制作过程复杂，需要人工完善的工序较多，现场存在许多不可控的因素，无形中埋下故障隐患，结果自然是制作困难、成本高且耗费工时。
2.铺设的多路毛细盘管的进口和回口由一对(或较少几对)分配器头集中连接，因此分配器头处所有多根管路是集中在一起的，导致地面热量分布不均、温差较大(一般在5～10℃以上)，从而造成系统换热能力相对下降、机组能效比低、室内温度分布不均、人居舒适度差。
3、毛细盘管铺装的位置只在地面或顶棚，所形成的辐射面单一不易满足室内(冷热负荷)分布需要，且辐射面容易被家具等室内设施遮挡，影响机组工作效率及人居舒适性。
实用新型内容
本实用新型的目的在于提供一种辐射换热板、辐射换热板组和辐射换热系统，能够在一定程度上解决现有技术中空调/热泵(辐射空调)无水地暖系统存在的毛细盘管设计不合理导致机组工况不理想、能效比不够高以及毛细盘管不易铺装和布设困难、人居舒适度差等问题。
第一方面，本实用新型提供一种辐射换热板，包括板主体，所述板主体上开设有介质入口和介质出口，所述板主体的内部或侧部形成有连通所述介质入口和所述介质出口的微通道，所述微通道用于为介质提供流通路径和相变空间。
在上述技术方案中，优选地，所述微通道在所述板主体内呈或直线弯曲状分布，且所述微 通道的延伸方向平行于所述板主体的板面；
所述微通道呈直管状或异形管状；和/或
所述微通道包括相连通的多根直线支路或多根异形支路。
在上述技术方案中，优选地，所述微通道在所述板主体内的数量为多个，多个所述微通道间隔设置；
多个所述微通道串联设置，且串联后的多个所述微通道的一端连通所述介质入口，另一端连通所述介质出口；或
多个所述微通道中至少存在两个所述微通道并联设置，并联后的所述微通道的一端连通所述介质入口，另一端连通所述介质出口；或
多个所述微通道串、并联混合设置，串、并联混合后的所述微通道的一端连通所述介质入口，另一端连通所述介质出口。
在上述技术方案中，优选地，多个所述微通道连接所述介质入口处的一侧之间的间距大于连接所述介质出口处的一侧之间的间距。
在上述技术方案中，优选地，所述微通道的通径小于等于2.5mm；
所述板主体呈平板状，且其单侧板面的面积大于等于0.2m2，所述板主体的厚度为1mm-12mm。
在上述技术方案中，优选地，所述辐射换热板的板主体或板面为具有高辐射发射率和/或掺杂辐射发射率高的材料的非金属板或为具有高辐射发射率且经过钝化镀层或附着镀膜处理的耐腐蚀金属板亦或为具有高辐射发射率的非金属和金属“结合”优化板。
在上述技术方案中，优选地，所述板主体内对应所述介质入口和所述介质出口处分别形成转接分配通道，所述转接分配通道包括至少一个分支通道，所述微通道的两端分别与所述介质入口和所述介质出口处的所述分支通道一一对应地连通，以通过所述转接分配通道连通所述介质入口和所述介质出口。
在上述技术方案中，优选地，所述板主体还包括减震层，所述减震层设置于所述板主体的第一侧部，且与所述板主体平行设置；和/或
所述板主体还包括导热层，所述导热层设置于所述板主体的第一侧部，且与所述板主体平行设置；和/或
所述板主体还包括中空隔层，所述中空隔层设置于所述板主体的第一侧部，覆盖或包裹住所述微通道，且与所述板主体平行设置；和/或
所述板主体还包括饰面层，所述饰面层设置于所述板主体的第一侧部的最外层，且与所述板主体平行设置；和/或
所述板主体还包括电热辅层，所述电热辅层设置于所述板主体的第二侧部，且与所述板主体平行设置；和/或
所述板主体还包括热反射层，所述热反射层设置于所述板主体的第二侧部，且与所述板主体平行设置；和/或
所述板主体还包括隔温层，所述隔温层设置于所述板主体的第二侧部，并与所述板主体平行设置。
在上述技术方案中，所述板主体的第一侧部层和第二侧部层的结构可以“省略”优化组合。
第二方面，本申请还提供一种辐射换热板组，包括上述任一项所述的多个辐射换热板安装在不同位置的组合；
多个所述辐射换热板用于同时安装在室内地面、棚顶或墙面；或
多个所述辐射换热板中的部分用于安装在室内地面和/或下部墙面，多个所述辐射换热板中的部分用于安装在棚顶和/或上部墙面，多个所述辐射换热板中的部分用于安装在下部墙面和/或上部墙面，多个所述辐射换热板中的部分用于安装在地面和/或上部墙面，多个所述辐射换热板中的部分用于安装在下部墙面和/或棚顶等不同位置，其任意两个以上不同位置的辐射换热板的辐射温度是不同的(由控制系统实现)，因此可以在室内环境空间形成上、下“两个”以上(辐射工作面)不同的温度区间。
第三方面，本申请还提供一种辐射换热系统，所述辐射换热系统包括压缩机、冷凝器、节流部件、蒸发器、控制阀和所述的辐射换热板(组)；
当所述控制阀位于第一连通位，所述压缩机、所述辐射换热板(组)、所述节流部件和所述蒸发器形成第一循环回路，在所述第一循环回路，所述辐射换热板(组)作为辐射换热板(组)式冷凝器；当所述控制阀位于第二连通位，所述压缩机、所述节流部件、所述冷凝器和所述辐射换热板(组)形成第二循环回路，在所述第二循环回路，所述辐射换热板(组)作为辐射换热板(组)式蒸发器；介质在所述第一循环回路或所述第二循环回路内循环。
或
所述辐射换热系统包括压缩机、冷凝器、节流部件、蒸发器、控制阀和所述的辐射换热板(组)；
当所述控制阀位于第一连通位，所述压缩机、所述辐射换热板(组)和所述冷凝器、所述节流部件及所述蒸发器形成第一循环回路，在所述第一循环回路，所述辐射换热板作为辐射换热板(组)式冷凝器与所述冷凝器以串联或并联的方式同时工作；当所述控制阀位于第二连通位，所述压缩机、所述节流部件、所述冷凝器及所述蒸发器和所述辐射换热板(组)形成第二循环回路，在所述第二循环回路，所述辐射换热板(组)作为辐射换热板式蒸发器与所述蒸发器以串联或并联的方式同时工作；介质在所述第一循环回路或所述第二循环回路内循环；
或
所述辐射换热系统包括压缩机、控制阀、节流部件和多个所述的辐射换热板(组)，多个所述辐射换热板包括第一辐射换热板(组)和第二辐射换热板(组)；
所述压缩机、所述节流部件、所述第一辐射换热板(组)和所述第二辐射换热板(组)形成换热循环回路；在所述换热循环回路中，当所述控制阀位于第一连通位，所述第一辐射换热板(组)作为辐射换热板(组)式冷凝器，所述第二辐射换热板(组)作为辐射换热板(组)式蒸发器；当所述控制阀位于第二连通位，所述第一辐射换热板(组)作为辐射换热板(组)式蒸发器，所述第二辐射换热板(组)作为辐射换热板(组)式冷凝器。
在上述技术方案中，优选地，作为所述辐射换热板式冷凝器的所述辐射换热板和/或作为所述辐射换热板式蒸发器的所述辐射换热板的数量分别为多个；
作为所述辐射换热板式冷凝器的多个所述辐射换热板或作为所述辐射换热板式蒸发器的多个所述辐射换热板顺次拼接，且多个所述辐射换热板的微通道顺次串联设置，相邻的两个所述辐射换热板中的一个所述辐射换热板的介质出口连通另一个所述辐射换热板的介质入口；或
作为所述辐射换热板式冷凝器的多个所述辐射换热板或作为所述辐射换热板式蒸发器的多个所述辐射换热板顺次拼接，且多个所述辐射换热板中至少存在两个所述辐射换热板的微通道并联设置，且并联设置的所述辐射换热板的介质入口和介质出口分别连通所述第一循环回路以及所述第二循环回路；或
作为所述辐射换热板式冷凝器的多个所述辐射换热板或作为所述辐射换热板式蒸发器的多个所述辐射换热板顺次拼接，且多个所述辐射换热板中至少存在两个以上所述辐射换热板的微通道串、并联混合设置，且串、并联混合设置的所述辐射换热板的介质入口和介质出口分别连通所述第一循环回路以及所述第二循环回路。
本实用新型实施例的有益效果是：
本申请提供的辐射换热板，包括板主体，板主体上开设有介质入口和介质出口，板主体内部或侧部形成有连通介质入口和介质出口的微通道。介质可通过介质入口进入微通道内，并可在微通道内完成汽化或液化，再通过介质出口流出微通道。微通道为其内的介质提供了相变空间，且介质相变“做功”过程会有热量的吸入或放出，从而通过板主体辐射“吸收”环境中物体的热量或将热量向环境中的物体辐射“释放”，进而改变周围环境中物体的温度。
本申请提供的辐射换热板在安装于室内地面、墙面和棚顶(和/或墙面)时，可在室内整个环境空间形成具有上下左右多个辐射面的“密闭腔体”，类似于辐射理论中的“黑体”，其辐射换热的合理性，室内居住的舒适性，机组工况的节能性等均可达到最优化的能力组合。
本申请提供的辐射换热板组包括多个辐射换热板，且多个辐射换热板可用于同时铺设在室内不同位置，以形成上下“两个”以上的辐射工作面，其不同辐射工作面的辐射温度是不同的(由控制系统实现)，因此在室内环境空间可以形成不同的温度区间，进一步充分地体现辐射换热优越性能，和提高室内居住的舒适性。
本申请提供的辐射换热系统包括辐射换热板(组)以及压缩机、冷凝器、节流部件、蒸发器和控制阀；通过改变控制阀的连通位，使辐射换热系统形成不同的循环回路，以在不同的需 求下实现辐射换热板(组)作为辐射换热板(组)式蒸发器或辐射换热板(组)式冷凝器，从而能够持续向环境中的物体或人体进行辐射制冷或制热。
附图说明
为了更清楚地说明本实用新型具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本实用新型的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本实用新型实施例提供的辐射换热板的第一种结构示意图；
图2为本实用新型实施例提供的辐射换热板的第二种结构示意图；
图3为本实用新型实施例提供的辐射换热板的第三种结构示意图；
图4为本实用新型实施例提供的辐射换热板的第四种结构示意图；
图5为本实用新型实施例提供的辐射换热板之间的一种连接方式示意图；
图6为本实用新型实施例提供的辐射换热板之间的另一种连接方式示意图；
图7为现有技术中多种材料的光谱发射率与波长的变化图。
附图标记：
1-板主体，11-介质入口，12-介质出口，13-微通道，14-异形支管，15-转接分配通道。
具体实施方式
下面将结合附图对本实用新型的技术方案进行清楚、完整地描述，显然，所描述的实施例是本实用新型一部分实施例，而不是全部的实施例。
通常在此处附图中描述和显示出的本实用新型实施例的组件可以以各种不同的配置来布置和设计。因此，以下对在附图中提供的本实用新型的实施例的详细描述并非旨在限制要求保护的本实用新型的范围，而是仅仅表示本实用新型的暂选定实施例。
基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
在本实用新型的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”“内部”、“侧部”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本实用新型和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本实用新型的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本实用新型的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本实用新型中的具体含义。
下面参照图1至图4描述根据本实用新型一些实施例的辐射换热板、辐射换热板组和辐射换热系统。
实施例一
参见图1至图4所示，本申请提供了一种辐射换热板，包括板主体1，板主体1上开设有介质入口11和介质出口12，板主体1内(包括内部和侧表面)形成有连通介质入口11和介质出口12的微通道13。介质可通过介质入口11进入微通道13内，并可在微通道13内完成汽化或液化，再通过介质出口12流出微通道13。微通道13为其内的介质提供了相变空间，且介质相变“做功”过程会有热量的吸入或放出，从而通过板主体1辐射“吸收”环境中物体的热量或将热量向环境中的物体辐射，进而改变周围环境中的物体的温度。
辐射换热板所采用的介质为冷媒，可以选用R410A、R290、R32或R744等，介质在板主体1的微孔道内会发生汽化或液化，“做功”后会有热量的放出或吸入，从而通过板主体1与周围环境中的物体发生辐射换热。具体地，微通道13内的介质发生冷凝时能够向环境中释放热量，释放的热量是通过板主体1辐射至环境中的，从而起到给室内供暖的作用。微通道13内的介质发生蒸发时板主体1的温度低于室内空气温度，从而能够通过板主体1从环境中吸收热量，起到对给室内降温的作用。
为此，应用辐射换热板(组)来解决室内“热”负荷的温度问题是完全可以实现的。辐射换热板(组)在实际应用中其辐射换热能力可以达到总换热量的50％以上。利用上下左右多个辐射板铺装在不同位置的方式(地面、墙面和棚顶)，在房间内形成辐射工作面“包围状”，类似于热辐射的“黑体”密闭腔，能够“迅速”提升(降低)室内温度，并使室内空间形成合理的温度梯度(体高温度差＜3℃)，温度竖向分布始终是下热上凉，符合人体健康足热头凉的舒适需要，空气流速和辐射不对称性都明显减少，更没有令人不舒适的“吹风感”，居住的舒适性得到完美改善和提高；而且多个辐射换热板可以选择铺设在人体所在的活动区间内，结合智能新风感应风口实现局部区域控制，从而更有效地提升了机组的节能效果。
还有，辐射工作面为单层(地面或棚顶)时，在温度较低的地区，冬季需要取暖，辐射换热板可铺设于室内的地面或墙面，以向室内辐射热量，满足室内供暖的需求。在温度较高的地 区，夏季需要制冷，辐射换热板可铺设于室内的棚面或墙面，以吸收室内的热量，降低室内的温度，满足室内供冷的需求。此外，辐射换热板亦可作为换热器件直接作用于所需的环境中，无需铺设于地面或墙面等。
值得解释的是，所谓辐射换热，是指当物体之间存在温差时，物体之间以热辐射的方式进行能量交换，使高温物体失去热量，低温物体获得热量，这种热量传递称为辐射换热。而所谓热辐射，是指因热的原因激发物体内部微观粒子振动，将热能转变成辐射能，以电磁波的形式向外辐射给周围环境物体再将辐射能转化为热能的过程。
热辐射是自然界中一切物体的内在秉性，它的特点是物体不需要接触就可实现能量“转换”式传递，直到实现热平衡也在“不停的传递”。本实施例的辐射换热板能够在不接触物体的前提下，利用板自身的“热或冷”产生辐射能与环境中的物体或人体进行辐射换能，以达到对环境中的物体或人体进行供热或降温的作用。具体地，本实施例通过辐射换热板内介质释放的热量或吸收的热量改变板主体1的温度，即改变板主体1所含有的“热或冷”，板主体1内部的“热或冷”再通过板主体1的表面以热辐射的方式与环境中的物体或人体发生辐射换能，最终将热或冷传递给环境中的物体或人体，从而达到为环境中的物体或人体取暖或降温的效果。
对于热辐射还有：波长相同，材料不同其吸收比不同(与物体的表面有关)；材料相同，波长不同其吸收比也不同(物体的吸收具有选择性)。其影响的因素主要有两个方面，一是表面状况—表面的材质、表面的颜色、表面的粗糙度、表面的氧化情况等；二是投射辐射源—辐射源(辐射板)的温度、与被辐射物体的距离、位置、方向等有关。
此外，影响辐射换热的因素包括物体表面的形状及尺寸、物体表面间相对位置、物体辐射波长以及物体表面的辐射及吸收特性。
针对上述影响辐射换热的因素，第一方面，对于物体表面的温度，其与物体内部“热量”有关，即物体内部含有的“热量”越高，则传至物体表面的温度就越高，基于此，本申请通过板主体1的冷媒在微通道13内的产生大量热(一般在303±10k)能够使得板主体1的表面温度快速升高，从而将板主体1表面的热能转化成辐射能向外辐射，进而提高了与环境中物体或人体的辐射换热效率，以及环境中物体或人体的温度；第二方面，物体表面的形状和尺寸，两物体表面之间的辐射换热量与两物体表面之间的相对位置有很大关系，为达到最优的辐射效果，室内地面辐射板在避开遮挡物的前提下，尽量实现满铺(即铺设面积≥75％为佳)；且在物体表面材料、温度、形状一定的条件下，物体的辐射能与物体表面的尺寸成正比，因此在合理的范围内，辐射板(物体)表面尺寸越大，整体产生的辐射能就越多；第三方面，物体表面间的距离位置，且在物体表面材料、温度、形状一定的条件下，进行辐射换热的物体之间间距越小， 且辐射板(体)与被辐射换热物体尽可能在一个平面内且所成的角度为法向时，辐射换热效率越高；第四方面，物体的辐射光谱发射率随波长变化而变化，在红外区域，大多数介质的光谱发射率随波长的增加而降低，并且红外辐射吸收的机理是光谱匹配共振吸收，即当辐射源的辐射波长与被辐射物体的吸收波长相一致时，该物体就会吸收大量的红外辐射；热射线的波长在0.1～100μm，对于固体物体辐射的波长在0.4～20μm，其中大部分都在红外线区0.8～20μm，而辐射空调的辐射板的辐射波长约在2～20μm，基本与固体的辐射波长在热射线的红外线区重合；对于人体来讲，人体自身是良好的“红外”吸收体，人体表面的辐射波长范围2.5-15μm(峰值波长约在9.3μm处)；其中辐射吸收波长以8-14μm为主(约占人体总辐射能量46％)，因此辐射空调的辐射板的辐射波长已经涵盖人体的吸收波长，完全能实现匹配共振，并向人体提供高效的热辐射，使人体感受到“温暖””的同时附带“红外保健”。第五方面，物体的辐射发射率ε(黑度)是物体材料本身的一种性质与外界因素无关，其物质的种类特别是表面最外层的材料种类对辐射发射率的影响较大，一般来说，金属的辐射发射率较小，而非金属的辐射发射率较大，一般在0.85～0.95之间，因此取较大辐射发射率就会获得较好的热辐射。
基于上述分析，对本实施例的辐射换热板的具体结构进行说明。
对于板主体1的介质入口11和介质出口12，为便于介质流入或流出，介质入口11和介质出口12开设于板主体1的板面(长度或宽度方向的板面)，板主体1的厚度方向的板面形成热辐射面。
对于板主体1的介质入口11和介质出口12，介质入口11和介质出口12可设置于板主体1的同一侧，亦可设置于板主体1的不同侧，可根据具体铺设需求选择设置。
对于板主体1内的微通道13，其通径小于等于2.5mm，优选为0.5～1mm，微通道13的内径(在满足介质流通量的前提下)越小，则在板内形成的“分布”面积就越大，其流经的介质换热率也越高，在等量介质通过时可向板主体1相对产生更多的热能，从而扩大板面的换热面积、也为提升和均衡板面温度提供空间，使所有通过微通道13的介质尽可能多的完成相变来“做功”，进而提高板主体1的换热能力，向环境中(室内)辐射更多的热量。本申请的辐射换热板设置于板主体1的微通道13尽可能极大地减小了微通道13的内径，提高介质的换热率和机组的能效比，配合板主体1后改善了辐射空调系统的整体结构性能(采用小型机组使热泵系统更加合理，其重量轻、体积小、适合高楼层装配，机组之间也不会出现“冷桥式”空气断层)，并提高了安装速度，解决了建筑配套的复杂性、人居环境的舒适性、机组工作的节能性等问题。
对于板主体1，为达到最优的热辐射效果，在室内物体设施(家具)位置相对摆放固定的前提下，取决于辐射板表面的大小和相对位置，而上下(地面和棚顶)平行铺设辐射板(条件 允许在墙面左右对称平行铺设)，可以获得最大的角系数，为此辐射板表面优选为平面状，板主体1的厚度方向的两侧板面形成热辐射面，用于与环境进行辐射换热。板主体1的单侧板面的面积大于等于0.2m 2，具体可根据现场要求(建筑室内冷热负荷需要)选择1m 2、2m 2、3m 2等。板主体1的厚度为1mm-12mm，具体可根据板主体1内的微通道13的尺寸以及板主体1的强度和结构要求而选择，如当板主体1内的微通道13的通径为1mm时，板主体1的厚度优选为2mm；当板主体1内的微通道13的通径为0.3mm或0.5mm时，板主体1的厚度优选为1mm或1.5mm；且沿板主体1的厚度方向，微通道13位于板主体1的中部，以保证微通道13两侧的板主体1的厚度一致，当然根据需要微通道13也可以设置于板主体1的一侧。当板主体1为石塑(spc)板、农作物秸秆板、竹(木)纤维或金属板时，板主体1的厚度优选为1-12mm，且进一步优选为2.5mm、4.5mm、6mm、8mm、10mm、11mm。当板主体1为聚氨酯板或酚醛发泡板(EPS板、XPS板)时，板主体1的厚度优选为10-55mm，且进一步优选为30mm、35mm或40mm。本实施例的辐射换热板可直接整板铺设，板主体1内的微通道13为事先(根据安装现场实际的冷热负荷)在工厂“标准”制作，无需人工现场计算铺设、焊接管路等工序，省时省力，铺装效率高。
此外，辐射换热板的板面可以经过化学钝化镀层或附着(喷涂)镀膜或贴膜(高温压膜)等特殊方法处理成为耐腐蚀的辐射板，以提高辐射换热板的耐酸碱等腐蚀性能和在特殊环境(如铺装在潮湿的卫生间和覆盖在水泥里等恶劣的环境)下的使用寿命。
对于板主体1的材质，基尔霍夫的热辐射定律表明，在给定温度下，吸收系数越大的材料其辐射电磁波的能力越强。本辐射空调系统的辐射板温度一般在303±10k，在此温度下的金属辐射发射率较低(在0.1以下)，而其它非金属材料的辐射发射率较高，对于非金属材料，波长在8μm左右、温度在200～1000k之间较为理想；由于人体吸收红外线热辐射波长以8-14μm为主，那么选择辐射波长接近此波长范围内的材料即可达到较优的与人体的辐射换热效果。如图7所示，示出了常见的铜、铁、银、金、铝和石墨在一定波长范围内的光谱发射率，在波长为8-14μm的范围内，石墨(或“石墨烯”)的光谱发射率远大于其它金属材料，因此本申请的板主体1的材质可以选石墨(或“石墨烯”)材料或含有炭黑的非金属材料。
此外，对于金属材料和非金属材料，相比之下金属的光谱发射率较低，非金属的光谱发射率要高些，一般大于0.8；但金属的光谱发射率随温度的升高而增高，且当表面形成氧化层时，可以成10倍或更大倍数地增高，因此也可以选用经过氧化处理后的金属材料，只是由于其在10μm附近发射率还相当低；因此，本实施例的板主体1的表面材料材质优选为非金属材料，具体可以选用石塑、农作物秸秆、竹(木)纤维等非金属材料形成的板件或经氧化处理后的金属板件亦或金属与非金属组合而形成的板件。
下面将结合图1至图4，对微通道13在板主体1内的分布方式具体说明。
如图1所示，为提高微通道13在板主体1内的延伸长度，以增大介质在板主体1内的相变空间以及板主体1的自身分布面积，微通道13在板主体1内呈弯折状延伸分布，且微通道13的延伸方向平行于板主体1的板面。微通道13的一端连通介质入口11，另一端连通介质出口12。
微通道13可以呈直管状或异形管状，优选为波形管状，以进一步延长增加微通道13在板主体1内的长度和宽度空间。
如图4所示，每一条微通道13还可以为包括多根相连通的直线支路(图中未示出)或多根相连通的异形支路的形式，即微通道13可包括多个并联设置的异形支管14(例如波形支管)，且其并具有相同的通道入口和通道出口，以进一步减小介质在板主体1微通道内的流通阻力和增大介质在板主体1微通道内的相变空间和板面面积。
此外，板主体1内的微通道13的数量为多个，多个微通道13间隔设置。多个微通道13可串联设置。当多个微通道13顺次串联设置时，串联后的多个微通道13的一端连通介质入口11，另一端连通介质出口12。多个微通道13中可存在至少两个(部分或全部)并联设置的微通道13；当多个微通道13全部并联时，多个微通道13分别连通介质入口11和介质出口12；当多个微通道13部分并联时，存在两种情况，第一种，并联部分的微通道13具有相同的通道入口和通道出口，且并联设置的微通道13与其它微通道13串联，形成的多个微通道13的一端连通介质入口11，另一端连通介质出口12。第二种，并联部分的微通道13具有相同的通道入口和通道出口并与其余的微通道13并联，之后分别连通介质入口11和介质出口12。即多个微通道13可串联、并联或串并联混合设置，通过设置多个微通道13能够减小介质的流通阻力和增大介质的相变空间，且能够增加辐射换热板的面积，以满足不同的辐射换热要求。
当板主体1内的微通道13具有多个支路或板主体1内具有多个微通道13时，为保证进入微通道13内的介质对应板主体1的各个位置的换热的均匀性(在实际制热应用中，当板主体1内流动的介质向外释放热量时，板主体1对应介质入口11处的温度高，对应介质出口12处的温度低，两者之间有时相差十多度，甚至更高)，多个微通道13间隔设置，多个微通道13或多个支路连接介质入口11的一侧之间的间距大于连接介质出口12的一侧之间的间距。即板主体1内对应介质入口11的一侧的微通道13或支管的密度小于对应介质出口12的一侧的微通道13或支管的密度，以使得介质在微通道13内流动过程中，对应介质入口11端的板面和介质出口12端的板面的温度更为均衡。
如图1至图4所示，板主体1内对应介质入口11和介质出口12处分别形成转接分配通道 15，当板主体1内设置有一条微通道13时，转接分配通道15包括一个分支通道，微通道13的两端分别与对应介质入口11和介质出口12处的转接分配通道15的分支通道相连通；当板主体1内设置有多条微通道13时，转接分配通道15包括多个分支通道，多个微通道13的两端分别与对应介质入口11和介质出口12处的转接分配通道15的分支通道一一对应地连通，从而使得介质能够通过转接分配通道15流畅地进入微通道13内和通过转接分配通道15顺畅地流出微通道13。需要说明的是，转接分配通道15可以是一个进出口连通多个并联的分支通道的形式，亦可为多个包括一个或多个分支通道的转接分配通道15的复合(串联、并联或串并联混联)形成。
对于板主体1内微通道13的形成，一方面，板主体1可采用整板式结构，板主体1内的微通道13可通过冲蚀(腐蚀)或挤出(拉伸)、雕刻等工艺形成于板主体1内部；一方面，板主体1可采用两个板件扣合形成的结构，分别在两个板件上(或只在一个板件上)通过激光、刻蚀等工艺形成微通道13的一半，两个板件扣合后即可在板主体1内形成微通道13，同时为了避免扣合后的板件之间形成的间隙导致微通道13内的介质发生渗漏，扣合的两个板件之间可通过粘接、焊接、压合(高温)等方式密闭扣合形成完整的板主体1；另一方面，还可以在板主体1的一侧附着或刻沟后附着超细管路形成微通道13。
此外，需要说明的是，本实施例的辐射换热板可根据安装现场实际的冷热负荷需要作为预制板，即可通过统一标准化在工厂预制，当辐射换热板用于室内进行辐射换热时，可以根据不同的房型设计不同规格的辐射板，并现场直接将做好的辐射换热板拼接铺装，无需人工铺设管路，因此在提高了辐射换热性能的同时极大地提高了铺设效率。
此外，还需要说明的是，本实施例的辐射换热板为辐射换热板组，当无法实现上下(地面和棚顶)铺装时，在以供暖为主前提下优先铺装地面的同时尽可能考虑铺装不被遮挡的墙面(1.5m以下部分)，在以供冷为主前提下优先铺装棚面的同时在不能满足要求时考虑铺装不被遮挡的墙面(1.5m以上部分)。由兰贝特定律可知辐射板与人(物)体成平行设置时的辐射能为最大，地面辐射板与人体(正面)一般成90°，所以只获得约1/2的辐射能；若墙面也能铺设辐射板，在距地面1.5m以下，就与人体成法向方向，此时获得的辐射能才最大。
实施例二
本实施例二是在实施例一基础上的改进，上述实施例中公开的技术内容不重复描述，上述实施例中公开的内容也属于本实施例二公开的内容。
本实施例的辐射换热板可同时安装于室内地面、墙面和棚顶，形成上下左右多个辐射“工作面”；多个辐射“工作面”可根据现场需要设计为地面+下部墙面(1.5m以下)和棚顶+上部墙面(1.5m以上)的结合，也可以是地面和上部墙面的结合，还可以是下部墙面和棚顶的结合，更可以是下部墙面和上部墙面等多种不同组合形式；辐射“工作面”还可以根据现场需要单独以地面或棚顶或墙面的方式铺设。
本实施例的辐射换热板的板主体包括导热层、电热辅层、减震层、饰面层、热反射层和隔温层，饰面层和减震层、电热辅层、导热层平行贴附于板主体的第一侧部，第一侧部为面向辐射换热板所在的安装空间的一侧(上表面)，即为背离地面、墙体或棚面的一侧，且导热层、电热辅层、减震层位于饰面层和板主体之间。热反射层和隔温层平行贴附于板主体的第二侧部，第二侧部为背离辐射换热板所在的安装空间的一侧(下表面)，即为朝向地面、墙体或棚面的一侧，且热反射层位于板主体和隔温层之间。
对于饰面层，其一方面用于提高本实施例的辐射换热板的美观度，另一方面当饰面层贴附于板主体上时，饰面层的表面形成热辐射面，基于实施例一中对于辐射换热板的热辐射原理的说明，当板主体所采用的材料的光谱发射率不是很理想时，可选用光谱发射率较高的材料作为饰面层，以形成热辐射效果更好的辐射面。并且为了将板主体的微通道内介质产生的热量更好的传递至板主体和饰面层，板主体的材质优选为导热性能好的材料，如铝、铜等金属材料或石塑等非金属材料；而饰面层则优选为含炭黑(和/或“石墨烯”)石塑材料层，软木、农作物秸秆、竹(木)纤维等(石墨、“石墨烯”)材料层，氧化金属材料层等热辐射性能好的材料。此外，饰面层与板主体可以为一体成型设置，以在板主体的表面形成饰面层；或板主体的外表面直接作为饰面层。
对于导热层，具有导热和均温的作用，可选金属薄膜材料也可选导热性能好的碳晶膜或“石墨烯”等材料。
对于电热辅层，具有辅助供热的作用，可选用超薄的石墨烯电热膜，以保证在极寒冷的环境下空气源热泵供热量不足时，可作为适当的热能补充。
对于减震层，由于饰面层和板主体均采用硬质材料，因此为避免当本申请的辐射换热板铺设于地面时，饰面层和板主体受力后两者之间产生碰撞磨损或产生异响的情况，在两者之间增加减震层以避免上述问题的产生。优选地，减震层可以由为软木薄板、或类似于软木形式的橡胶或人工化学合成等IXPE材质地垫、非金属材料的薄板等任意软质材料形成。
此外，为了避免板主体的微通道内介质产生的热量通过板主体的另一侧面(即朝向地面、墙体或棚面的一侧)流失，本实施例在板主体的朝向地面、墙体或棚面的一侧设置热反射层和 隔温层，热反射层和隔温层平行于板主体设置，热反射层能够将大部分热量反射回板主体，热反射层可以为表面附着有“反光”效果的光滑金属反射涂层的结构层，且金属反射涂层朝向板主体设置；隔温层优选为导热性能差的材料，如发泡聚氨酯、气凝胶保温材料、岩棉板、挤塑板、苯板、发泡水泥和陶瓷板等，以阻挡板主体的热量向下(向外、向上)传递，使板主体微通道内产生的热量更多的通过热辐射面辐射出去。
另外，当辐射换热板作用于湿度较高的室内制冷时，为避免辐射换热板朝向室内的一侧出现结露的现象，在辐射换热板朝向室内的一侧还设置有中空隔离层，以避免辐射换热板的“冷”面或管路直接接触室内的潮湿空气和使用防结露涂层的特殊管材(如：石墨烯)及部分升高辐射换热板朝向室内一侧表面的温度(以高于露点1～2℃以上的方式避开露点温度)，以此来“辐射吸收”降低室内温度，同时配合有室内新风除湿机帮助除去室内的湿空气(大部分潜热和部分显热)，新风机出口多且出风柔和，人居体感不明显，达到给室内“无吹风感”制冷的目的，同时实现降低结露情况的产生。
所述板主体可以作为辐射换热“基板”；也可以作为辐射换热“饰面板”。当其作为辐射换热“基板”时，板主体可选择性地包括上述的导热层、减震层、中空隔层、热反射层和隔温层中的一种或多种。当其作为辐射换热“饰面板”时，板主体可选择性地包括上述的导热层、中空隔层、饰面层中的一种或多种。
实施例三
本实施例三是在实施例一和实施例二基础上的改进，上述实施例中公开的技术内容不重复描述，上述实施例中公开的内容也属于本实施例三公开的内容。
本实施例提供了一种辐射换热板组，包括多个上述任一实施例的多个辐射换热板安装在不同位置的组合。
多个辐射换热板可同时安装于室内地面、墙面和棚顶，形成上下左右多个辐射“工作面”；多个辐射“工作面”也可根据现场需要设计为地面+下部墙面(1.5m以下)和棚顶+上部墙面(1.5m以上)和下部墙面(1.5m以下)+上部墙面(1.5m以上)的结合，也可以是地面和上部墙面的结合，还可以是下部墙面和棚顶的结合等多种形式的组合；
此外，辐射“工作面”还可以根据现场需要单独以地面或棚顶或墙面的方式铺设。
实施例四
本实施例四是在实施例一、实施例二和实施例三基础上的改进，上述实施例中公开的技术内容不重复描述，上述实施例中公开的内容也属于本实施例四公开的内容。
本实施例提供一个辐射换热系统，包括压缩机、冷凝器、节流部件、蒸发器、控制阀和上述实施例的辐射换热板(室内机)。
当机组制热时控制阀位于第一连通位，压缩机、辐射换热板(组)、节流部件和蒸发器形成第一循环回路，在第一循环回路，辐射换热板(组)作为辐射换热板(组)式冷凝器；当控制阀位于第二连通位，压缩机、节流部件、冷凝器和辐射换热板(组)形成第二循环回路，在第二循环回路，辐射换热板(组)作为辐射换热板式蒸发器；介质在第一循环回路或第二循环回路内循环。
具体地，当机组制热时，控制阀位于第一连通位时，第一循环回路连通，此时压缩机通过管路连通辐射换热板(组)式冷凝器(位于室内)的介质入口、微通道和介质出口，并形成第一循环回路的前段。在第一循环回路内，介质经压缩机被压缩形成高温高压的介质，高温高压介质进入辐射换热板(组)式冷凝器的微通道内进行冷却凝结，由气态变为液态的同时向室内环境中的物体或人体辐射热量，进而起到对室内环境中的物体或人体供暖的作用。节流部件、蒸发器(位于室外)形成第一循环回路的后段，介质从辐射换热板(组)式冷凝器流出经过节流部件后压力骤降，再经蒸发器由液态变为汽态的同时从室外环境中置换热量，低压过热蒸汽进入压缩机的回气口，如此循环，实现热泵(辐射空调)系统的节能运行及辐射换热板(组)的持续辐射换热。上述过程主要适用于冬季等温度较低的环境下需要向室内供暖的情况。
当所述控制阀位于第二连通位时，第二循环回路连通，此时压缩机、冷凝器形成第二循环回路的前段，介质经压缩机被压缩成高温高压的介质，高温高压介质进入冷凝器(位于室外)内进行冷却凝结，由气态变为液态的同时向室外环境释放热量；再经过节流部件节流后，进入辐射换热板(组)式蒸发器(位于室内)或室内机形成的第二循环回路的后段，介质“流入”节流部件后压力骤降，再经辐射换热板(组)式蒸发器或室内机由液体变为汽态的同时从室内环境中置换热量，进而起到对室内环境中的物体或人体降温的作用，低压过热蒸汽进入压缩机的回气口，如此循环，实现空调(辐射空调)系统室内机除湿功能的正常“节能”运行及辐射换热板(组)的持续给室内提供辐射换冷。上述过程主要适用于夏季等温度较高的环境下需要向室内制冷的情况。
优选地，控制阀为四通阀。
此外，为满足机组辐射换热能力的需求和实现对环境内更大范围的热辐射，即实现地面、墙体或棚面的全面铺设，本实施例的辐射换热系统的作为辐射换热板式冷凝器的辐射换热板的 数量为多个，多个辐射换热板顺次拼接，以形成完整的热辐射面。而多个辐射换热板顺次拼接时，各个辐射换热板内的微通道可串联连通或存在并联以及串、并联混合的情况。
参见图5所示，当多个辐射换热板的微通道13顺次连通，即多个辐射换热板的微通道13之间为串联设置，相邻的两个辐射换热板中的一个辐射换热板的介质出口12连通另一个辐射换热板的介质入口11，而多个辐射换热板顺次拼接后形成的完整的微通道的一端形成总介质入口，另一端形成总介质出口，以实现介质的流入和流出，因此多个辐射换热板拼接后能够形成更大的辐射换热面，以更好地实现均匀地与室内环境的换热。
此外，多个辐射换热板的微通道13中存在部分或全部并联设置的形式，参见图6所示，多个辐射换热板全部并联时，各个辐射换热板的介质入口11和介质出口12单独进入介质，多个介质入口11和多个介质出口12分别连入循环回路。当多个辐射换热板中仅有部分并联时(图中未示出)，存在两种情况，第一种，并联部分的介质入口和介质出口单独进出介质，串联部分的辐射换热板的介质入口和介质出口顺次连通形成一个总介质入口和总介质出口，并联部分的介质入口和介质出口以及串联部分的介质入口和介质出口分别连入循环回路(即并联部分和串联部分并联设置)；第二种，串联部分的形成总介质入口，并联部分的介质入口连通串联部分的形成的总介质出口，并联部分的介质出口分别连入循环回路。即当多个辐射换热板中仅有部分并联时，系统可存在串并联混联的形式。
此外，本实施例的辐射换热系统的作为辐射换热板式蒸发器的辐射换热板的数量为多个，且多个辐射换热板的拼接方式与作为辐射换热板式冷凝器的辐射换热板的拼接方式相同，即亦可串联拼接、并联拼接或串并联混合拼接，在此不再赘述。
实施例五
本实施例五是在实施例一至实施例四的基础上的改进，上述实施例中公开的技术内容不重复描述，上述实施例中公开的内容也属于本实施例五公开的内容。
本实施例中，辐射换热系统包括压缩机、控制阀、节流部件和多个辐射换热板，多个辐射换热板包括第一辐射换热板(组)和第二辐射换热板(组)；压缩机、节流部件、第一辐射换热板(组)和第二辐射换热板(组)形成换热循环回路；在换热循环回路中，当控制阀位于第一连通位，第一辐射换热板(组)作为辐射换热板式冷凝器，第二辐射换热板(组)作为辐射换热板式蒸发器；当控制阀位于第二连通位，第一辐射换热板(组)作为辐射换热板式蒸发器，第二辐射换热板(组)作为辐射换热板式冷凝器。
在常规该实施例中，第一辐射换热板(组)设置于室内，第二辐射换热板(组)设置于室 外。在换热循环回路中，当控制阀位于第一连通位，第一辐射换热板(组)作为辐射换热板式冷凝器，第二辐射换热板(组)作为辐射换热板式蒸发器，介质在压缩机、辐射换热板式冷凝器、节流部件和辐射换热板式蒸发器之间循环的过程同实施例三中辐射换热板式冷凝器位于室内以向室内辐射热量的原理相同；而在制冷循环回路中，当控制阀位于第二连通位，第一辐射换热板(组)作为辐射换热板式蒸发器，第二辐射换热板(组)作为辐射换热板式冷凝器，介质在压缩机、辐射换热板式冷凝器、节流部件和辐射换热板式蒸发器之间循环的过程同实施例三中辐射换热板式蒸发器位于室内以从室内置换热量的原理相同，因此对于上述原理不再赘述。
此外，对于本实施例中作为辐射换热板式蒸发器的辐射换热板(组)和作为辐射换热板式冷凝器的辐射换热板(组)的拼接方式也与实施例三中辐射换热板的拼接方式相同，即本实施例中的辐射换热板也可为串联设置、并联设置或串并联混合设置，在此不再重复说明。
实施例六
本实施例六是在实施例一至实施例五的基础上的改进，上述实施例中公开的技术内容不重复描述，上述实施例中公开的内容也属于本实施例六公开的内容。
本实施例对实施例四和实施例五中设置于室内的辐射换热板进行了改进设置，设置于室内的辐射换热板(组)包括并联设置的一套辐射换热板和二套辐射换热板，一套辐射换热板铺设于地面和墙面，二套辐射换热板铺设于棚面和墙面，一套辐射换热板和二套辐射换热板能够分别接入循环回路内，在不同工况的需求下一套辐射换热板或二套辐射换热板分别接入循环回路，以实现一套辐射换热板接入循环回路中只进行制热(必要时辅助配合二套辐射换热板进行制冷)或二套辐射换热板接入循环回路中只进行制冷(必要时辅助配合一套辐射换热板进行制热)。具体换热和制冷原理在上述实施例中已经具体说明，在此不再赘述。
具体的，一套辐射换热板和二套辐射换热板之间可通过控制阀(例如电磁阀或电子膨胀阀)进行切换控制，以使一套辐射换热板或二套辐射换热板分别接入在不同工况时所构成的循环回路中。
需要说明的是，对于本申请的实施例四、实施例五和实施例六的辐射换热系统，通过辐射换热板(组)配合机组能够对室内实现大面积的高效供暖或制冷，颠覆了现有技术中的室内换冷、热方式，可实现小机组多功能(带有新风功能的)室内温湿度独立控制，系统的换热效率提高，同时还可实现“标准化”制作，铺装简便易行，也为建筑现代化提升了人居的舒适度。
下面根据试验和计算，对本申请实施例的辐射换热系统在辐射换热板表面达到不同温度时对应不同环境温度下的单位面积辐射传热量的说明。
其中，表1是辐射换热板(室内地面敷设面积≥75％时，暂不考虑家具的遮挡系数、地面辐射向下传热量的损失时)在不同温度下的单位面积辐射传热量。
表1
Figure PCTCN2021101302-appb-000001
以表1中示出的第一种情况即辐射供暖室内温度18℃、非加热面的加权平均温度18℃、地面辐射表面平均温度25℃为例，具体说明辐射换热板(组)以地面辐射时的单位面积实际辐射传热量q (地)。
q (地)＝q f+q d
式中：q f-辐射面单位面积辐射传热量，q d-辐射面单位面积对流传热量；
设t n＝18℃   (辐射供暖室内空间温度℃)
设tpj＝25℃  (地面辐射表面平均温度℃)
房间地面供暖时(辐射面单位面积对流传热量)：
q d＝2.13|t pj-t n|^ 0.31(t pj-t n)
＝27.26W/m 2
房间地面辐射单位面积辐射传热量(假设室内非加热表面的面积加权平均温度tfj≤t n，为18℃)：
q f＝5×10^ ﹣8[(t pj+273)^ 4－(t fj+273)^ 4]
＝35.76(W/m 2)
房间以地面辐射时的单位面积总辐射传热量：
q (地)＝q f+q d
q＝35.76+27.26
＝63.02W/m 2
由上述结果可知，当室内的供热方式以辐射为主，且辐射面足够大时，房间供热能力为地面辐射及对流两种方式的和(q (地)＝qf+qd)，其值约大于单一方式一倍；另外，不论室温、地面温度为多少，地面单位表面积辐射传热量始终大于地面单位表面积对流传热量；当室内温度升高时，室内地面单位表面积对流传热量的值变小，室内地面单位表面积辐射传热量的值也变小，但此时在室内地面单位表面积对流传热量所占室内单位面积地面总辐射传热量的百分比在逐渐变小，而室内地面单位表面积辐射传热量所占室内单位面积地面总辐射传热量的百分比却在逐渐变大。
最后应说明的是：以上各实施例仅用以说明本实用新型的技术方案，而非对其限制，所有方案并不能一一列出；尽管参照前述各实施例对本实用新型进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本实用新型各实施例技术方案的范围。

Claims (11)

  1. 一种辐射换热板，其特征在于，包括板主体，所述板主体上开设有介质入口和介质出口，所述板主体的内部或侧部形成有连通所述介质入口和所述介质出口的微通道，所述微通道用于为介质提供流通路径和相变空间。
  2. 根据权利要求1所述的辐射换热板，其特征在于，所述微通道在所述板主体内呈直线或弯曲状分布，且所述微通道的延伸方向平行于所述板主体的板面；
    所述微通道呈直管状或异形管状；和/或
    所述微通道包括相连通的多根直线支路或多根异形支路。
  3. 根据权利要求1所述的辐射换热板，其特征在于，所述微通道在所述板主体内的数量为多个，多个所述微通道间隔设置；
    多个所述微通道串联设置，且串联后的多个所述微通道的一端连通所述介质入口，另一端连通所述介质出口；或
    多个所述微通道中至少存在两个所述微通道并联设置，并联后的所述微通道的一端连通所述介质入口，另一端连通所述介质出口；或
    多个所述微通道串、并联混合设置，串、并联混合后的所述微通道的一端连通所述介质入口，另一端连通所述介质出口。
  4. 根据权利要求3所述的辐射换热板，其特征在于，多个所述微通道连接所述介质入口处的一侧之间的间距大于连接所述介质出口处的一侧之间的间距。
  5. 根据权利要求1所述的辐射换热板，其特征在于，所述微通道的通径小于等于2.5mm；
    所述板主体呈平板状，且其单侧板面的面积大于等于0.2m2，所述板主体的厚度为1mm-12mm。
  6. 根据权利要求1所述的辐射换热板，其特征在于，所述辐射换热板的板主体或板面为具有高辐射发射率和/或掺杂辐射发射率高的材料的非金属板或为具有高辐射发射率且经过钝化镀层或附着镀膜处理的耐腐蚀金属板亦或为具有高辐射发射率的非金属和金属结合的优化板。
  7. 根据权利要求1所述的辐射换热板，其特征在于，所述板主体内对应所述介质入口和所述介质出口处分别形成转接分配通道，所述转接分配通道包括至少一个分支通道，所述微通道的两端分别与所述介质入口和所述介质出口处的所述分支通道一一对应地连通，以通过所述转接分配通道连通所述介质入口和所述介质出口。
  8. 根据权利要求1所述的辐射换热板，其特征在于，
    所述板主体还包括导热层，所述导热层设置于所述板主体的第一侧部，且与所述板主体平行设置；和/或
    所述板主体还包括减震层，所述减震层设置于所述板主体的第一侧部，且与所述板主体平 行设置；和/或
    所述板主体还包括中空隔层，所述中空隔层设置于所述板主体的第一侧部，覆盖或包裹住所述微通道，且与所述板主体平行设置；和/或
    所述板主体还包括饰面层，所述饰面层设置于所述板主体的第一侧部的最外层，且与所述板主体平行设置；和/或
    所述板主体还包括电热辅层，所述电热辅层设置于所述板主体的第二侧部，且与所述板主体平行设置；和/或
    所述板主体还包括热反射层，所述热反射层设置于所述板主体的第二侧部，且与所述板主体平行设置；和/或
    所述板主体还包括隔温层，所述隔温层设置于所述板主体的第二侧部，并与所述板主体平行设置。
  9. 一种辐射换热板组，其特征在于，包括权利要求1至8中任一项所述的多个辐射换热板安装在不同位置的组合；
    多个所述辐射换热板用于同时安装在室内地面、棚顶或墙面；或
    多个所述辐射换热板中的部分用于安装在室内地面和/或下部墙面，多个所述辐射换热板中的部分用于安装在棚顶和/或上部墙面，多个所述辐射换热板中的部分用于安装在地面和/或上部墙面，多个所述辐射换热板中的部分用于安装在下部墙面和/或上部墙面，多个所述辐射换热板中的部分用于安装在下部墙面和/或棚面的多种不同位置的组合，其任意两个以上不同位置的辐射换热板的辐射温度是不同的,可由控制系统来实现，以在室内环境空间形成上、下两个以上不同的温度区间。
  10. 一种辐射换热系统，其特征在于，
    所述辐射换热系统包括压缩机、冷凝器、节流部件、蒸发器、控制阀和权利要求1至8中任一项所述的辐射换热板；
    当所述控制阀位于第一连通位，所述压缩机、所述辐射换热板、所述节流部件和所述蒸发器形成第一循环回路，在所述第一循环回路，所述辐射换热板作为辐射换热板式冷凝器；当所述控制阀位于第二连通位，所述压缩机、所述节流部件、所述冷凝器和所述辐射换热板形成第二循环回路，在所述第二循环回路，所述辐射换热板作为辐射换热板式蒸发器；介质在所述第一循环回路或所述第二循环回路内循环；或
    所述辐射换热系统包括压缩机、冷凝器、节流部件、蒸发器、控制阀和权利要求1至8中任一项所述的辐射换热板；
    当所述控制阀位于第一连通位，所述压缩机、所述辐射换热板和所述冷凝器、所述节流部件及所述蒸发器形成第一循环回路，在所述第一循环回路，所述辐射换热板作为辐射换热板式冷凝器与所述冷凝器以串联或并联的方式同时工作；当所述控制阀位于第二连通位，所述压缩 机、所述节流部件、所述冷凝器及所述蒸发器和所述辐射换热板形成第二循环回路，在所述第二循环回路，所述辐射换热板作为辐射换热板式蒸发器与所述蒸发器以串联或并联的方式同时工作；介质在所述第一循环回路或所述第二循环回路内循环；或
    所述辐射换热系统包括压缩机、控制阀、节流部件和多个权利要求1至8中任一项所述的辐射换热板，多个所述辐射换热板包括第一辐射换热板和第二辐射换热板；
    所述压缩机、所述节流部件、所述第一辐射换热板和所述第二辐射换热板形成换热循环回路；在所述换热循环回路中，当所述控制阀位于第一连通位，所述第一辐射换热板作为辐射换热板式冷凝器，所述第二辐射换热板作为辐射换热板式蒸发器；当所述控制阀位于第二连通位，所述第一辐射换热板作为辐射换热板式蒸发器，所述第二辐射换热板作为辐射换热板式冷凝器。
  11. 根据权利要求10所述的辐射换热系统，其特征在于，作为所述辐射换热板式冷凝器的所述辐射换热板和/或作为所述辐射换热板式蒸发器的所述辐射换热板的数量分别为多个；
    作为所述辐射换热板式冷凝器的多个所述辐射换热板或作为所述辐射换热板式蒸发器的多个所述辐射换热板顺次拼接，且多个所述辐射换热板的微通道顺次串联设置，相邻的两个所述辐射换热板中的一个所述辐射换热板的介质出口连通另一个所述辐射换热板的介质入口；或
    作为所述辐射换热板式冷凝器的多个所述辐射换热板或作为所述辐射换热板式蒸发器的多个所述辐射换热板顺次拼接，且多个所述辐射换热板中至少存在两个所述辐射换热板的微通道并联设置，且并联设置的所述辐射换热板的介质入口和介质出口分别连通所述第一循环回路以及所述第二循环回路；或
    作为所述辐射换热板式冷凝器的多个所述辐射换热板或作为所述辐射换热板式蒸发器的多个所述辐射换热板顺次拼接，且多个所述辐射换热板中至少存在两个以上所述辐射换热板的微通道串、并联混合设置，且串、并联混合设置的所述辐射换热板的介质入口和介质出口分别连通所述第一循环回路以及所述第二循环回路。
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