WO2021254085A1 - 边皮卸料装置及硅棒开方设备 - Google Patents

边皮卸料装置及硅棒开方设备 Download PDF

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Publication number
WO2021254085A1
WO2021254085A1 PCT/CN2021/094835 CN2021094835W WO2021254085A1 WO 2021254085 A1 WO2021254085 A1 WO 2021254085A1 CN 2021094835 W CN2021094835 W CN 2021094835W WO 2021254085 A1 WO2021254085 A1 WO 2021254085A1
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WIPO (PCT)
Prior art keywords
cutting
silicon rod
wire
silicon
wire cutting
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Application number
PCT/CN2021/094835
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English (en)
French (fr)
Inventor
曹奇峰
苏静洪
张王锋
钱春军
潘雪明
卢建伟
Original Assignee
天通日进精密技术有限公司
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Publication of WO2021254085A1 publication Critical patent/WO2021254085A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Definitions

  • This application relates to the technical field of silicon rod processing, and in particular to a silicon rod side skin unloading device and silicon rod preparation equipment.
  • the field of photovoltaic solar power generation has received more and more attention and development.
  • the usual crystalline silicon solar cells are made on high-quality silicon wafers, which are cut by a multi-wire saw after pulling or casting a silicon ingot.
  • the silicon rod square-cutting equipment is used to square the silicon rod.
  • the cutting mechanism feeds along the length of the silicon rod and cuts four parallel planes in the circumferential direction of the silicon rod;
  • the wire slicer slices the squared silicon rod along the length direction to obtain the required silicon wafer.
  • the silicon rod will form a side skin after the square-cutting. Therefore, the formed side skin needs to be unloaded first.
  • Most of the general side skin unloading methods are manually operated by the operator. Separate from the cut silicon rods and move them out of the silicon rod formulating equipment, which is not only inefficient, but also causes the side skins to collide with the cut silicon rods during the handling process, which increases the risk of damage to the cut silicon rods. The skin is difficult to reuse.
  • the purpose of this application is to provide a silicon rod square-out equipment and a side skin unloading device applied to the silicon rod square-out equipment, so as to solve the low efficiency and low efficiency of manual side skin transfer in the prior art.
  • the silicon rod square-out equipment includes a base, a wire cutting device and a silicon rod bearing structure.
  • the silicon rod carrying structure is used to carry the silicon rods placed vertically
  • the wire cutting device includes a wire cutting support that can be raised and lowered and a wire cutting unit provided on the wire cutting support, in the wire cutting unit
  • There is a cutting wire saw which cuts silicon rods to form cut silicon rods and edge skins
  • the edge skin unloading device includes: a edge skin lifting unit for lifting the edge skin to make the top of the edge skin Protruding the cut silicon rod; a side skin clamping unit, including: a support column, which is arranged on the base; a first mounting part, which is arranged on the support column; at least one set of edge skin clamping mechanism, Connected to the first mounting part by a swing arm, used for clamping the side skin and lifting the side skin from the cut silicon rod, and controlled rotation
  • a silicon rod square extraction device which is used to perform square extraction operations on silicon rods with a circular cross-section.
  • a wire cutting device which is arranged above the silicon rod carrying structure and includes a plurality of cutting wheels and at least one cutting wire formed with a cutting wire saw around the plurality of cutting wheels;
  • the edge skin unloading device according to any one of the embodiments.
  • the side skin unloading device for silicon rod square-out equipment and the silicon rod square-out equipment have the following beneficial effects:
  • the side skin discharge device can be stored in the silicon rod in an idle state
  • the edge-cover clamping mechanism can rotate the swing arm around the axis of the swing arm to clamp the edge under the edge-cover clamping and transfer state
  • the skins are transferred to the skin unloading area, thereby shortening the transfer path.
  • the skin unloading device can be provided with multiple sets of skin clamping mechanisms in a one-to-one correspondence with the silicon rod bearing structure of the silicon rod square-out device to improve the edge
  • the efficiency of leather clamping and transportation reduces the time cost.
  • FIG. 1 shows a schematic diagram of the structure of the silicon rod loading and unloading device in an embodiment of the present application.
  • Fig. 2a shows a partial structural diagram of the silicon rod loading and unloading device in a state of clamping the silicon rod to be cut in an embodiment.
  • Fig. 2b shows a bottom view of a part of the structure of the silicon rod loading and unloading device in a state where the silicon rod to be cut is clamped in an embodiment.
  • Fig. 3a shows a partial structural diagram of the silicon rod loading and unloading device in a state of clamping a cut silicon rod in an embodiment.
  • Fig. 3b shows a bottom view of a part of the structure of the silicon rod loading and unloading device in a state of clamping a cut silicon rod in an embodiment.
  • FIG. 4 is a schematic diagram showing the structure of a silicon rod holder in an embodiment of the silicon rod loading and unloading device of the present application.
  • FIG. 5 shows a schematic diagram of the structure of the silicon rod loading and unloading device in an embodiment of the present application.
  • Fig. 6 shows a schematic structural view of a lifting drive mechanism in an embodiment of the silicon rod loading and unloading device of the present application.
  • Figures 7a-7b show schematic structural diagrams of the lifting drive mechanism in an embodiment of the silicon rod loading and unloading device in different states.
  • Figures 8a-8d show schematic diagrams of the silicon rod loading and unloading device of this application in different transport states in an embodiment.
  • FIG. 9 shows a schematic diagram of the structure of the silicon rod moving device of the silicon rod processing equipment of this application in an embodiment.
  • FIG. 10 shows a schematic diagram of an embodiment of the elastic push rod structure of the silicon rod processing equipment of the present application.
  • FIG. 11 shows a schematic diagram of a part of the structure of the silicon rod conveying device of the silicon rod processing equipment of this application in an embodiment.
  • FIG. 12 shows a schematic diagram of the structure of the silicon rod conveying device of the silicon rod processing equipment of this application in an embodiment.
  • FIG. 13 shows a schematic structural view of an embodiment of the silicon rod pressing device of the present application.
  • Fig. 14a shows a schematic structural view of an embodiment of the silicon rod pressing device of the present application.
  • Figures 14b-14c show enlarged schematic diagrams of B in Figure 14a in different locked states.
  • Fig. 15 is an enlarged schematic diagram of the position A in Fig. 13.
  • FIG. 16 shows a schematic diagram of the structure of the wire cutting device according to an embodiment of the present application.
  • FIG. 17 is implemented as a schematic structural diagram of the wire cutting device of the present application applied to a silicon rod square-out device in an embodiment.
  • FIG. 18 is a schematic diagram showing the structure of the wire cutting device of the present application applied to a silicon rod square-out device in an embodiment.
  • FIG. 19 shows a schematic diagram of the structure of the wire cutting unit in an embodiment of the wire cutting device of the present application.
  • Fig. 20 is a schematic diagram showing the structure of the middle cutting wheel and the transition wheel beside it in an embodiment of the wire cutting device.
  • FIG. 21 shows a schematic diagram of a part of the structure of a silicon rod processing device which is a silicon rod cutting device according to an embodiment of the present application.
  • FIG. 22 shows a schematic diagram of a part of the structure of the silicon rod processing equipment of the silicon rod cutting and grinding integrated machine in an embodiment.
  • FIG. 23 shows a schematic diagram of the structure of the wire cutting device in an embodiment of the present application.
  • FIG. 24 shows a schematic diagram of the structure of the transition wheel and the bracket in an embodiment of the wire cutting device of the present application.
  • FIG. 25 is an enlarged schematic diagram of C in FIG. 23.
  • Fig. 26 is an enlarged schematic diagram of D in Fig. 17.
  • Fig. 27 shows a top view of the wire cutting device in an embodiment of the present application.
  • Fig. 28 shows a side view of the wire cutting device in an embodiment of the present application.
  • FIG. 29 is a schematic diagram showing the enlarged structure at E in FIG. 28.
  • FIG. 30 shows a schematic diagram of the structure of the side skin unloading device of the present application applied to a silicon rod square opener in an embodiment.
  • Fig. 31 shows a schematic diagram of the structure of the edge skin unloading device in an embodiment of the present application.
  • Fig. 32 shows a schematic structural diagram of a side skin supporting mechanism in an embodiment of the side skin unloading device of the present application.
  • Fig. 33 shows a schematic structural diagram of a side skin lifting unit in an embodiment of the side skin unloading device of the present application.
  • FIG. 34 shows a schematic diagram of the structure of the clamping assembly in an embodiment of the edge skin unloading device of the present application.
  • 35 shows a schematic cross-sectional view of the clamping assembly in an embodiment of the edge skin unloading device of the present application.
  • FIG. 36 shows a schematic cross-sectional view of the clamping assembly of the edge skin unloading device of the present application in another embodiment.
  • Figures 37a-37e are schematic diagrams showing different states of the side skin unloading device performing side skin transfer in an embodiment.
  • first, second, etc. are used herein to describe various elements or parameters in some examples, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter.
  • first wire groove may be referred to as the second wire groove, and similarly, the second wire groove may be referred to as the first wire groove without departing from the scope of the various described embodiments.
  • the first slot and the second slot are both describing a slot, but unless the context clearly indicates otherwise, they are not the same slot. Similar situations also include the first wire cutting unit and the second wire cutting unit, or the first cutting wheel set and the second cutting wheel set.
  • crystalline silicon is usually processed into the form of silicon wafers and then used in product manufacturing.
  • the original silicon rods include single crystal silicon rods and polycrystalline silicon rods.
  • Single crystal silicon rods are melted by Czochralski method or suspension zone Method to grow rod-shaped single crystal silicon from the melt.
  • single crystal silicon rods with a length of 5000 mm or 5360 mm are common in silicon rod processing, or single crystal silicon rods with a length of about 800 mm.
  • Polycrystalline silicon is used Precipitation technology such as chemical vapor deposition technology to make silicon precipitate on the surface of the silicon core wire silicon rod.
  • the current production process of silicon wafers is generally to first pull the polycrystalline silicon brittle material into a single crystal silicon rod, and then use a square rooting machine to square the square; at this time, the cutting mechanism feeds along the length of the silicon rod and runs around the silicon rod. Cut four parallel planes up by two to make the cross section of the silicon rod resemble a rectangle; after the square is finished, the squared silicon rod is sliced along the length direction with a multi-line slicing machine to obtain the required silicon wafer.
  • the silicon rods to be cut (that is, the silicon rods that have not yet been prescribed) need to be loaded to the preset bearing position on the silicon rod prescribing equipment, so as to cooperate with the wire cutting device to preset
  • the silicon rods are cut with the specifications of the square, after the completion of the square, the cut silicon rods need to be transported away from the bearing structure of the machine base so that the silicon rod square-cutting equipment can continue to cut and process the silicon rods to be cut.
  • the present application provides a silicon ingot loading and unloading device for silicon ingot square-out equipment.
  • the silicon ingot square-out equipment includes a base, a silicon ingot carrying structure, and a wire cutting device.
  • the silicon ingot carrying structure is used to carry the vertical
  • the silicon rod loading and unloading device includes: a first bracket, which is hoisted on the base through a mounting frame; a silicon rod clamp, which is arranged on the first bracket, and is used to hold the silicon to be cut Rods or cut silicon rods; a displacement mechanism for driving the first support and the silicon rod clamps on the mounting frame to shift in at least one direction, so that the silicon rod clamps move to the first predetermined The position is to clamp the to-be-cut silicon rod or the cut silicon rod and move the clamped to-be-cut silicon rod or the cut silicon rod to the second predetermined position.
  • the first predetermined position and the second predetermined position are not limited to a fixed position or area established in the established coordinate system.
  • the loading and unloading device is determined to be
  • the transfer path conforms to the time sequence of the transfer, and takes the start position of the first bracket in the silicon rod handling device in the transfer path as the first predetermined position, and the end position of the first bracket as the second predetermined position.
  • the silicon rod loading and unloading device is performing the loading process, the position where the silicon rod holder clamps the silicon rod to be cut is the first predetermined position, and the moving mechanism moves to move the silicon rod to be cut to the silicon rod.
  • the position where the silicon rod to be cut is placed on the silicon rod supporting structure above the supporting surface of the supporting structure is the second predetermined position; on the contrary, when the silicon rod loading and unloading device executes the cut silicon rod after the square extraction is completed During the unloading process of the transfer out of the machine base, the first bracket is located adjacent to the silicon rod bearing structure, and the position where the cut silicon rod is clamped is used as the starting position, that is, the first predetermined position. The cut silicon rod is transported away from the machine by the silicon rod clamp. The position where it is seated and released is the second predetermined position.
  • FIG. 1 shows a schematic diagram of the structure of the silicon rod loading and unloading device in an embodiment of the present application.
  • the first bracket 31 is hoisted on the base by a mounting frame 33.
  • the first support 31 can be used as a supporting structure for the silicon rod holder 32, and the first support 31 is movably arranged on the mounting frame 33 and can be moved in at least one direction under the action of a displacement mechanism, thereby The movement of the silicon rod to be cut or the silicon rod to be cut clamped by the silicon rod clamp 32 is realized.
  • the mounting frame 33 is arranged above the machine base.
  • the mounting frame 33 can be used to determine the path and range span of the first bracket 31 to move along the mounting frame 33.
  • the mounting frame 33 is arranged above the silicon rod bearing structure of the loading and unloading area in the silicon rod processing platform of the machine base, and at the same time, the length of the mounting frame 33 in the first direction is larger than the loading and unloading area, or, The end of the length of the mounting frame 33 in the first direction is located outside the silicon rod bearing structure in the loading and unloading area, so that the first bracket 31 can move to any silicon rod bearing structure adjacent to the loading and unloading area when moving along the mounting frame 33.
  • the silicon rods to be cut are arranged on the corresponding silicon rod supporting structure or the cut silicon rods on the silicon rod supporting structure are transported away from the loading and unloading area.
  • the loading and unloading area is an area where loading and unloading are performed on the silicon ingot processing platform of the silicon ingot square-out equipment.
  • the mounting frame 33 is arranged parallel to the wire cutting support of the silicon rod square-out equipment, so as to make full use of the vacant equipment space above the machine base.
  • the silicon ingot loading and unloading device 3 can be installed on the base of the silicon ingot square-out equipment through the mounting frame 33.
  • the silicon ingot loading and unloading device 3 can also be used as a separate component to be detached from the silicon ingot square-out device. Points, for example as an independent sales device.
  • the mounting frame 33 is detachably connected to the silicon ingot square-out device, and the installation frame 33, the first support 31 and the silicon ingot clamp 32 can be set on the silicon ingot square-out device; for another example, the first The bracket 31 and the mounting frame 33 are detachably connected, and the first bracket 31 and the silicon rod holder 32 can be set on the silicon rod square-out equipment including the mounting frame 33 or the lifting frame.
  • the silicon rod holder 32 is arranged on the first support 31.
  • the silicon rod holder 32 includes a silicon rod holder, and the silicon rod holder contacts the surface of the silicon rod and performs clamping or release. action.
  • the silicon rod holder 32 includes a silicon rod holder.
  • the clamping surface of the silicon rod holder can be set to have a certain height to ensure the clamping state. The contact area between the silicon rod holder and the side surface of the vertically placed silicon rod can be clamped.
  • FIG. 2a shows a schematic diagram of the structure of the first bracket 31 and the silicon rod holder of the silicon rod loading and unloading device of this application in an example.
  • any one of the silicon rod clamping members on the first support 31 includes a first clamping arm 321 and a second clamping arm 322 that are arranged oppositely, and a clamping arm driving mechanism 320 for driving the The first clamping arm 321 and the first clamping arm 321 perform opening and closing actions.
  • the first clamping arm 321 and the second clamping arm 322 can be arranged in a mirror image or symmetrically.
  • first clamping arm 321 and the second clamping arm 322 When the first clamping arm 321 and the second clamping arm 322 perform a closing action, they can be used to approach and clamp the silicon rod; When the first clamping arm 321 and the second clamping arm 322 perform an opening action, they can be used to release the clamped silicon rod.
  • the first clamping arm and the second clamping arm have a clamping arc surface and a clamping plane.
  • the silicon rod clamping member can be used to clamp the silicon rod to be cut or the silicon rod that has been cut, in order to realize the vertical placement of the clamped silicon rod on the silicon rod supporting structure or the clamping from the silicon rod supporting structure.
  • the first clamping arm and the first clamping arm are clamped on the side of the silicon rod by opening and closing actions, that is, the silicon rod is vertical in the clamping state.
  • the first clamping arm and the first clamping arm have a clamping arc surface adapted to the arc surface of the silicon rod to be cut, and a clamping plane adapted to the side surface of the cut silicon rod.
  • the clamping arc surfaces of the first clamping arm and the second clamping arm are not limited to arc surfaces for contacting silicon rods provided on the clamping arms.
  • FIGS. 2a to 3b are shown as The side view and bottom view of the silicon rod holder of the present application in different clamping states, wherein Figures 2a and 2b are the three-dimensional schematic diagram and bottom view of the silicon rod holder holding the silicon rod to be cut with arc-shaped sides
  • Figures 3a and 3b are a three-dimensional schematic diagram and a bottom view of a silicon rod holder clamping a cut silicon rod.
  • the first clamping arm and the second clamping arm are symmetrically provided with a clamping arc surface and a clamping plane.
  • the clamping arc may be a contact plane set in different directions to conform to the curvature of the silicon rod surface.
  • the planes in different directions on a single clamping arm are symmetrical.
  • the diameter of the cross section of the silicon rod makes the pressure applied to the silicon rod by the first clamping arm 321 and the second clamping arm 322 converge at the center of the cross section of the silicon rod during clamping, so as to prevent the extension of the resultant force of the pressure on the silicon rod in the clamping state
  • the wire is outside of the clamping arc, so that the silicon rod has a tendency to escape from the silicon rod clamping member.
  • the clamping arc surface of the first clamping arm and the second clamping arm exceeds a quarter of the arc of the side surface of the silicon rod to be cut, and the clamping contact surface formed during clamping exceeds the silicon rod.
  • the cushioning pad is made of, for example, elastic rubber materials, or silicone or other materials with elastic deformation, damping characteristics or cushioning characteristics, so as to prevent the surface of the silicon rods to be cut or cut silicon rods from being clamped during transportation. Scratched or bumped into pieces.
  • the clamping arm drive mechanism includes: an opening and closing gear, a rack, and a driving source (not shown); wherein, the first clamping arm and the second clamping arm are respectively provided with opening and closing gears , The opposite sides of the rack are respectively provided with tooth patterns corresponding to the opening and closing gears on the first clamping arm and the second clamping arm, and the driving source is connected with the gear driving member for driving The gear driving member moves.
  • the gear drive member is a rack
  • the rack is located between the first clamping arm and the second clamping arm
  • the two outer surfaces of the clamping arms facing on both sides of the rack are respectively provided with and
  • the opening and closing gears on the first clamping arm and the second clamping arm mesh with corresponding tooth patterns
  • the driving source may be, for example, a driving motor or an air cylinder.
  • the gear rotates externally, and the opening and closing gear drives the clamping arm (the opening and closing gear and the clamping arm can be connected by a shaft) to move down to turn from the loosening state to the clamping state; on the contrary, when the clamping arm needs to be loosened
  • the drive motor or air cylinder
  • the drive source drives the rack as the gear drive to move downwards, and the opening and closing gears meshed on both sides are driven by the rack to rotate internally, and the opening and closing gears are driven during the internal rotation.
  • the clamping arm (the opening and closing gear and the clamping arm can be connected by a rotating shaft) perform an upward movement to turn from the clamping state to the unclamping state.
  • FIG. 4 shows a schematic structural view of a silicon rod holding member of the silicon rod loading and unloading device of this application in an embodiment.
  • the clamping arm drive mechanism 320 includes: a first rack 3201, a second rack 3202, a clamping cylinder 3203, and a transmission gear 3204; the first rack 3201 is linked to the first clamping arm , The second rack 3202 is linked to the second clamping arm, and the transmission gear 3204 meshes with the first rack 3201 and the second rack 3202 for driving the all
  • the first clamping arm and the second clamping arm move toward each other to perform a closing action, and when rotating in a reverse direction, the first clamping arm and the second clamping arm are driven to move back to perform an opening action.
  • the first rack 3201 moves in a direction opposite to the linear velocity of the upper tooth portion of the transmission gear 3204;
  • the two racks 3202 move in the opposite direction of the linear velocity of the lower tooth portion of the transmission gear 3204.
  • the first rack 3201 and the second rack 3202 which are symmetrical about the center of the gear, must satisfy the relationship of the linear velocity in the opposite direction, that is, they appear to move closer to each other or move away from each other.
  • the clamping cylinder 3203 pushes the first rack 3201 or the second rack 3202 to move to drive the transmission gear 3204 to rotate
  • the first rack 3201 and the second rack The racks 3202 approach each other to drive the first clamping arm and the second clamping arm toward each other to perform a closing action
  • the transmission gear 3204 is in the reverse state
  • the first rack 3201 and the second rack 3202 move away from each other to drive
  • the first clamping arm and the second clamping arm are away from each other to perform an opening action.
  • the clamping arm drive mechanism includes a first rack, a second rack, and a drive gear; the first rack is linked to the first clamping arm, and the second rack is linked to
  • the drive gear is connected to the power output shaft (not shown) of the drive motor and meshes with the first rack and the second rack for rotating in the forward direction
  • the first clamping arm and the second clamping arm are driven to move back to perform an opening action.
  • the first rack and the second rack can be meshed on both sides of the driving gear, so that when the driving gear rotates, the linear velocity directions at the first rack and the second rack are opposite, and the driving motor drives the driving gear.
  • the gear rotates so that when the drive gear rotates forward, the first rack and the second rack move toward each other, that is, drive the first clamping arm and the second clamping arm to move toward each other to perform a closing action.
  • the driving gear is driven to rotate in the reverse direction, the first rack and The second rack moves backwards to drive the first clamping arm and the second clamping arm to move backwards to perform an opening action.
  • the silicon rod holder in the silicon rod holder is fixedly arranged on the first support in the lifting direction, and is used to hold the same specification or a preset specification range (for example, a length of 500mm to 800mm). ) Within the silicon rod.
  • multiple sets of silicon rod clamping members may be provided on the first support to ensure that the silicon rods that can be clamped by the silicon rod handling device cover various length specifications.
  • the single-wafer silicon rods are formed by cutting the original long silicon rods, which will inevitably make the size difference between the single-wafer silicon rods very different.
  • the silicon rod holders are used to erect The single-wafer silicon rod in the placed state or the cut silicon rod after the square is clamped. Therefore, for the silicon rod fixture, the influence of the aforementioned size difference is mainly manifested in the difference in the length of the single-wafer silicon rod. Whether the silicon rod holder in the silicon rod holder can be clamped to a single-wafer silicon rod corresponding to the hidden worry.
  • the silicon rod holder In order to reduce or even avoid the risk that the silicon rod holder may not be able to clamp the silicon rod, the silicon rod holder has different design schemes.
  • the silicon rod holder includes at least two silicon rod holders, wherein the two silicon rod holders are arranged on the first support at an interval.
  • the main body of the first support 31 is vertical, and the two silicon rod clamping members in the silicon rod clamp are arranged on the first support 31 at an upper and lower interval.
  • the silicon rod holder can be installed on the first bracket 31 by a holder mounting seat.
  • the holder mounting seat is movably installed on the first bracket 31.
  • a bracket 31 is used to adjust the distance between the silicon rod clamping parts and the silicon rod clamping parts or the silicon rod clamping parts arranged at intervals.
  • the first bracket 31 is provided with a lifting rail, and the clamping member mounting seat can be set as a sliding block movably arranged on the lifting rail, thereby achieving up and down along the first bracket 31 move.
  • the spacing between different silicon rod holding parts can be adjusted, and the clamping of silicon rods of different specifications can be realized based on a small number of silicon rod holding parts such as two.
  • the silicon rod holder further includes a lift drive mechanism, and at least one silicon rod holder of the at least two silicon rod holders is driven by the lift drive mechanism to move along the first support.
  • Lifting movement For example, when the silicon rod holder includes two silicon rod holders, one of the silicon rod holders can be fixed to the first support, and the other silicon rod holder can be movably arranged on the first support. And driven by the lifting drive mechanism to move up and down along the first support; for another example, the two silicon rod clamping members in the silicon rod clamp can be movably arranged on the first support, and the lifting drive mechanism Seek to drive down the first support to move up and down.
  • the lifting drive mechanism includes: a drive chain and at least one locking device; wherein the drive chain is wound around two drive sprockets arranged up and down, and of the two drive sprockets At least one transmission sprocket is axially connected to the sprocket drive source, and the at least one locking device is provided on at least one silicon rod clamping member for switching the lock between the at least one silicon rod clamping member and the transmission chain There are two states: stop and activity.
  • the at least one locking device corresponds to at least one silicon rod holding member.
  • the locking device when there is one locking device, that is, it is set on one silicon rod holding member, when the locking device is two One is set on the two silicon rod clamping pieces, and each locking device is used to control the locking or movable state between a silicon rod clamping piece and the transmission chain, so as to realize the compliance of the silicon rod clamping piece
  • the drive chain is moved or stopped at the preset height of the first bracket to switch.
  • FIG. 5 shows a schematic diagram of the structure of the silicon rod loading and unloading device according to an embodiment of the present application.
  • the lifting drive mechanism 323 is provided with a transmission chain 3231.
  • the transmission chain 3231 can be set as an endless chain (shown in the embodiment shown in FIG. 5) or an open sprocket with an end point.
  • At least one of the 3232 is driven to rotate by a sprocket drive source 3233 such as a drive motor, thereby driving the transmission chain 3231 meshed with the transmission sprocket 3232 to move.
  • the direction of movement of the transmission chain 3231 is determined by the position of the transmission sprocket 3232 set up and down. It is determined, for example, that when the transmission sprockets 3232 arranged up and down are located on the same vertical line, the transmission chain 3231 between the two transmission sprockets 3232 moves in the lifting direction.
  • the locking device 3234 includes a locking sprocket 32341 and a locking mechanism 32340.
  • the locking sprocket 32341 is rotatably arranged on the silicon rod holder and engaged with the silicon rod holder.
  • the transmission chain 3231, the locking mechanism 32340 is provided on the silicon rod holder, and is used to lock the locking sprocket 32341 so that the locking sprocket 32341 is stationary relative to the transmission chain 3231, so that the The silicon rod holder connected to the locking sprocket 32341 and the transmission chain 3231 are switched from the active state to the locked state.
  • the locking sprocket 32341 can be connected to the silicon rod holder through the sprocket shaft.
  • the locking sprocket 32341 is driven by the meshing transmission chain 3231 to wind the chain.
  • the wheel shaft rotates; when the locking mechanism 32340 is in the working state, the locking mechanism 32340 restricts the rotation of the locking sprocket 32341 to lock the sprocket 32341 and the silicon rod holder by driving the movement of the chain 3231 in the lifting direction
  • the force of the movement in the lifting direction therefore, in a state where the movement of the locking sprocket 32341 relative to the transmission chain is stationary, the silicon rod holder can be driven by the transmission chain 3231 to move up and down along the first bracket.
  • the locking mechanism 32340 can restrict the rotation of the locking sprocket 32341 by clamping the teeth of the locking sprocket 32341, for example.
  • the locking mechanism 32340 includes a locking cylinder 32342 and a locking portion 32343, the locking portion 32343 is connected to the telescopic end of the locking cylinder 32342, and The locking cylinder 32342 drives the teeth of the locking sprocket 32341 to lock the locking sprocket 32341.
  • the detailed structure of the locking mechanism 32340 includes a locking cylinder 32342 fixedly installed on the silicon rod holder, and the telescopic rod of the locking cylinder 32342 can lock the sprocket along the 32341 expands and contracts in the radial direction.
  • a locking part 32343 is fixed on the end of the telescopic rod of the locking cylinder 32342.
  • the outer contour of the locking part 32343 is a rectangular block structure.
  • the locking part 32343 is close to the locking sprocket 32341 There is a latch on one side.
  • the locking portion 32343 When the locking portion 32343 is driven by the locking cylinder 32342 to extend into the locking sprocket 32341, the locking portion 32343 is locked to the locking sprocket 32341 so that it no longer faces the transmission chain 3231 Rotate (in the state shown in Figure 7b). At this time, the silicon rod holder connected to the locking mechanism 32340 moves up and down synchronously with the drive chain 3231.
  • the locking portion 32343 shrinks and retreats, so that the locking sprocket 32341 is restored to the state of being rotatably engaged with the transmission chain 3231 (as shown in Figure 7a (Showing state), the silicon rod holder loses the force in the lifting direction transmitted by the locking sprocket 32341, and can be stabilized at a preset height.
  • a holding part is fixed on the silicon rod holding part.
  • the holding part is composed of two pressing plates.
  • a sliding channel parallel to the expansion and contraction direction of the locking cylinder is formed therebetween, and the locking part is slidably arranged in the sliding channel.
  • the holding portion 3235 may also be a rectangular block arranged along the direction of the movement track of the locking portion, in which a sliding groove is arranged, and the locking portion is slidably arranged in the sliding groove, and Movement along the radial direction of the locking sprocket.
  • the transmission chain 3231 may shake during transmission, causing the transmission chain 3231 to disengage from the locking sprocket 32341, so that the silicon rod holder and the transmission chain 3231 are always active state.
  • an anti-separation mechanism 3235 is also provided in the lifting drive mechanism 323. As shown in the embodiment of FIG. 5, the anti-separation mechanism 3235 has a U-shaped structure. The two parallel sides are fixed on the silicon rod holder to follow the silicon rod holder to move up and down synchronously, and the groove bottom of the anti-separation mechanism 3235 at the bottom of the U-shaped structure is close to the drive chain 3231.
  • the locked state of the silicon rod holder following the synchronous movement of the transmission chain 3231 or the switching of the relative active state of the silicon rod holder and the transmission chain 3231 can be realized.
  • the preset adjustment height of the silicon rod holder makes the locking device 3234 lock the silicon rod holder and the drive chain 3231.
  • the stop device 3234 restores the movable state between the silicon rod holding member and the transmission chain 3231, so that the silicon rod holding member can be stabilized at the preset height position of the first bracket 31.
  • the movable range of the silicon rod holding member is related to the first bracket 31, and the silicon rod holding member is movably arranged, and the length specification range of the silicon rod that can be held by the silicon rod holder is increased.
  • the first support 31 and the silicon rod clamp 32 provided on the first support 31 can be displaced on the mounting frame 30 in at least one direction under the action of the displacement mechanism 33, After the silicon rod holder 32 is clamped from the first predetermined position, the silicon rod is transferred to the second predetermined position.
  • the displacement mechanism 33 includes a first direction displacement mechanism
  • the first direction displacement mechanism includes a first direction guide rail 3310 and a first driving device (not shown in the figure).
  • the first direction guide rail 3310 is disposed on the mounting frame 30, and the first driving device is used to drive the first bracket 31 to move along the first direction guide rail on the mounting frame 30.
  • the first bracket is connected to the mounting frame 30 based on a first sliding block 3311 adapted to the first direction guide rail 3310 to form a degree of freedom of movement 3310 along the first direction guide rail.
  • the first bracket 31 is hoisted to the machine base through the installation frame 30, and can move along the installation frame 30 located above the machine base under the driving of the first driving device.
  • the mounting frame 30 is provided with a first direction guide rail 3310 for hoisting the first bracket 31, and the first direction guide rail 3310 can be set to cross the two ends of the base in the first direction, or The length of the first direction guide rail 3310 can cover every silicon rod bearing structure in the loading and unloading area, so that the first frame 31 arranged on the first direction guide rail 3310 can move along the first direction under the driving of the first driving device.
  • the guide rail 3310 moves to the adjacent position of each silicon rod bearing structure in the loading and unloading area.
  • the silicon rod supporting structure of the loading and unloading area of the silicon rod processing platform is arranged on the same straight line in the first direction, and the first direction guide rail 3310 may be arranged above the straight line connecting the silicon rod supporting structure to facilitate The first frame 31 moves above the supporting part of the silicon rod supporting structure to clamp the cut silicon rods carried on the silicon rod supporting structure or to place the to-be-cut silicon rods on the silicon rod supporting structure.
  • the first driving device is, for example, a traveling motor
  • the first bracket may be connected to the first direction guide rail through a traveling screw, and the traveling screw is laid on the first direction rail and connected to the traveling motor at the same time, thereby The first bracket can be driven to move along the guide rail in the first direction under the drive of the traveling motor.
  • the first driving device may also be a driving motor that drives the first support to move by a ball screw, which is not limited in this application.
  • the first bracket 31 can be moved along the mounting frame 30 to realize loading and unloading in the equipment space above the base.
  • the first frame 31 can be moved to The upper part of the machine base can be accommodated, thereby reducing the inconvenience of operation caused by the excessive space occupied by the equipment in the process flow, and then increasing the efficiency of the process flow in the silicon rod processing.
  • the displacement mechanism further includes a second direction displacement mechanism
  • the second direction displacement mechanism includes a second direction guide rail and a second drive device
  • the second direction guide rail is used to set the For the first bracket
  • the second driving device is used to drive the first bracket to move along the guide rail in the second direction.
  • the second driving device is, for example, a traveling motor, which drives the first bracket to move along the guide rail in the second direction through a traveling screw.
  • the second driving device can also be set as another device that can push the first frame to move, such as The movement of the first frame is driven by the chain conveying mechanism, which is not limited in this application.
  • the first bracket 31 is disposed on the first direction rail 3310 of the mounting frame through the second direction rail 3320.
  • the first bracket 31 may pass through the second direction rail 3320.
  • the two sliding blocks 3321 are connected to the second direction guide 3320, and the first bracket 31 can be driven by the first driving device to move in the first direction, that is, the length direction of the base.
  • it can also be driven by the second driving device (Not shown in the figure) Driven by the guide rail 3320 in the second direction to move in the second direction, the moving range of the first bracket 31 and the silicon rod holder 32 in the space is increased, which can be applied to the second position with different spatial relationship.
  • the silicon rod is transferred between a preset position and a second preset position. For example, when the first preset position and the second preset position have a certain distance in the second direction, the silicon rod holder 32 can pass through The guide rail 3320 moves in the second direction to reach the target position.
  • the second preset position is the supporting position of the silicon rod bearing structure
  • the first bracket is at Driven by the first driving device, move to a straight line in the second direction that connects to the first preset position, and then approach the first preset position by the second driving device; of course, it can also be driven by Driven by the second driving device, it moves until the line connecting the first bracket and the first preset position is on a straight line in the first direction, and then is driven by the first driving device to move to the first preset position; it should be explained here
  • the first driving device is independent of the second driving device.
  • the moving path of the first bracket and the silicon rod holder can also be a multi-segment broken line, for example, move a certain distance in the first direction and then in the second direction. Move, and move again in the first direction to the preset position.
  • the aforementioned moving direction is only an example to illustrate some achievable moving paths.
  • the first bracket only needs to move to the preset position; at the same time, in the actual scene , In accordance with the device layout and the direction of the moving guide rail of the moving mechanism, the moving path can also be changed accordingly.
  • the movement path from the first preset position to the second preset position can also be set based on the movement range determined by the displacement mechanism. The transfer can be realized when the range package can cover the first preset position and the second preset position.
  • the moving path has a variety of alternative ways, but based on the setting of the silicon rod loading and unloading device of the present application, the moving path is used for silicon rod transfer through a straight path or a broken line path, and at the same time, the equipment above the machine base is used.
  • the space can be transferred and the equipment space can be used as the accommodating space of the silicon ingot loading and unloading device, which can reduce the occupation of the space outside the silicon ingot square-out equipment base during transportation, and the silicon ingot loading and unloading device can be integrated with the silicon ingot square.
  • the equipment setting eliminates the equipment call procedure of the silicon rod loading and unloading device, making the transfer process easier.
  • FIGS. 8a to 8d show the schematic structural diagrams of the silicon rod loading and unloading device of this application in different transport states.
  • the process of clamping the silicon rod to be cut by the silicon rod loading and unloading device is as follows:
  • the silicon ingot holder moves along the mounting frame 30 under the drive of the first support 31 by the displacement mechanism in the first direction.
  • the silicon ingot holder and the first support 31 can be driven by a first driving device, for example, to move along the mounting frame 30.
  • the first-direction guide rail provided on the mounting frame 30 moves; at the same time, in some scenarios, the first bracket 31 and the silicon rod holder can be driven by a second-direction displacement mechanism, for example, driven by a second driving device Move along the guide rail in the second direction; through the first shifting mechanism or/and the second shifting mechanism, the silicon rod holder moves with the first bracket 31 to approach the silicon rod to be cut located at the first predetermined position ( (Shown in the state shown in Figure 8a); Moreover, in the process of the silicon rod holding member following the movement of the first support, the silicon rod holding member can control the silicon rod based on the moving state (or moving position).
  • the first clamping arm and the second clamping arm of the clamping member perform an opening or closing action.
  • the driving gear of the silicon rod clamping member is driven by the motor to reverse, so that the The first clamping arm is separated from the second clamping arm until the clamping space between the clamping arms is larger than the diameter of the silicon rod or there is a gap between the silicon rod and the silicon rod to form an accommodating space for the silicon rod to be cut.
  • the first bracket 31 drives the silicon rod clamp
  • the holding member moves to the accommodating space between the first clamping arm and the second clamping arm
  • the drive gear rotates forward to control the first clamping arm and the second clamping arm to approach each other, that is, to approach each other.
  • the first clamping arm and the second clamping arm stop moving towards each other when they contact and clamp the silicon rod.
  • the silicon rod holder is held in a clamped state after the silicon rod is clamped.
  • the first direction displacement mechanism or/and the second direction displacement mechanism are driven by the corresponding displacement mechanism.
  • the first bracket 31 and the silicon rod clamping member move the silicon rods along a preset path, until the clamped silicon rods are transported to a second predetermined position (in the state shown in FIG. 8b), the first clamping arm Perform an opening action with the second clamping arm to release the silicon rod.
  • the second predetermined position is, for example, that the clamped silicon rod to be cut is located in front of the supporting surface for supporting the silicon rod in the silicon rod supporting structure.
  • the silicon rod holder performs the process of loading the silicon rod to be cut into the silicon rod supporting structure. It should be understood that after the completion of the transportation of a silicon rod to be cut (In the state shown in Figure 8b), the silicon rod holding member conforms to the drive of the first support in the first direction displacement mechanism or/and the second direction displacement mechanism to return to the first predetermined position (shown in Figure 8a Display status) to continue loading and transporting the next silicon rods to be cut; when the silicon rod loading and unloading device loads all the silicon rods to be cut in the corresponding prescribing operation, for example, as shown in Figure 8a or Figure 8b In the silicon rod squaring equipment in the view, after the silicon rod loading and unloading device has loaded the corresponding silicon rods to be cut on the multiple silicon rod bearing structures in the loading and unloading area on the machine base, the first support 31 and the silicon rod clamping piece It can also be driven by the first direction displacement mechanism or/and the second direction displacement mechanism to return
  • the initial position is, for example, the waiting area of the silicon rod loading and unloading device in the non-working state.
  • the initial position is set based on the layout of the silicon rod prescribing equipment. For example, in the example shown in FIG. 8a or FIG. 8b, the initial position may be set at the end of the mounting frame 30.
  • the silicon rod loading and unloading device performs the unloading process of the cut silicon rods
  • the silicon rod clamp and the first bracket 31 move along the mounting frame 30 in response to the displacement mechanism. Therefore, the movement is stopped at a position adjacent to the silicon rod carrying structure carrying the cut silicon rod, that is, at the first predetermined position (in the state shown in FIG.
  • the first clamping arm and the second clamping arm are close to each other That is, the silicon rods to be clamped are approached to each other, and when the silicon rods are contacted and clamped, they stop moving toward each other; the silicon rod clamp and the first bracket 31 are shifted in the first direction and the second direction shift mechanism according to the second predetermined position Drive down to move along a straight line or a broken line to transfer the cut silicon rods out of the processing platform of the machine base, and transfer the cut silicon rods to a second predetermined position for blanking (in the state shown in FIG. 8d). After the unloading operation is completed, the first bracket 31 and the silicon rod holding member can also return to the aforementioned initial position.
  • the present application also provides a silicon rod square-out equipment, including a base, a silicon rod bearing structure, a wire cutting device, and any one of the embodiments shown in FIGS. 1 to 8d suspended on the base
  • the silicon rod loading and unloading device described in the embodiment wherein, the silicon rod carrying structure is used to carry the silicon rods placed vertically, and the silicon rod loading and unloading device is used to clamp the silicon rods to be cut or the cut silicon rods and hold the silicon rods to be cut or the cut silicon rods. The silicon rod is moved to a predetermined position.
  • the wire cutting device includes a wire cutting support that can be raised and lowered and a wire cutting unit provided on the wire cutting support.
  • the wire cutting unit has a cutting wire saw, which can pass the wire
  • the lifting movement of the cutting support drives the cutting wire saw to cut the silicon rods vertically placed on the silicon rod bearing structure.
  • the silicon rod loading and unloading The device can transfer the silicon rods to be transported from the first predetermined position to the second predetermined position, so as to cooperate with the wire cutting device to cut different silicon rods.
  • the silicon rod loading and unloading device is hoisted on the machine base, and the silicon rod clamp is converted from a first predetermined position to a second predetermined position by a shift mechanism.
  • the silicon rod to be cut is The storage area and the area where the cut silicon rods are placed are far away from the machine base. For example, the silicon rods to be cut need to be transferred to the first predetermined position, and then the silicon rods to be cut are transferred to the silicon by the silicon rod loading and unloading device.
  • the silicon rod loading and unloading device transfers the cut silicon rod from the silicon rod bearing structure to the second predetermined position after the cutting wire saw has completed the square of the silicon rod, and then the second predetermined position The cut silicon rods are transferred to the preset placement area of the cut silicon rods or transferred to the next process equipment.
  • the first predetermined position and the second predetermined position are not limited to the fixed position or area established in the established coordinate system.
  • the transfer path conforms to the time sequence of the transfer, and takes the start position of the first bracket in the silicon rod handling device in the transfer path as the first predetermined position, and the end position of the first bracket as the second predetermined position.
  • the silicon rod loading and unloading device is performing the loading process, the position where the silicon rod holder clamps the silicon rod to be cut is the first predetermined position, and the moving mechanism moves to move the silicon rod to be cut to the silicon rod.
  • the position where the silicon rod to be cut is placed on the silicon rod supporting structure above the supporting surface of the supporting structure is the second predetermined position; on the contrary, when the silicon rod loading and unloading device executes the cut silicon rod after the square extraction is completed During the unloading process of the transfer out of the machine base, the first bracket is located adjacent to the silicon rod bearing structure, and the position where the cut silicon rod is clamped is used as the starting position, that is, the first predetermined position. The cut silicon rod is transported away from the machine by the silicon rod clamp. The position where it is seated and released is the second predetermined position.
  • the silicon rod formulating equipment further includes a silicon rod transport device, the silicon rod transport device includes a feeding transfer part and a feeding driving source, wherein the feeding transfer part is used for conveying the to-be-cut Silicon rods, the feeding driving source is used to drive the feeding transfer part to move to drive the silicon rods to be cut to move.
  • the loading transfer part transfers the carried silicon rods to be cut to the first predetermined position under the driving of the loading driving source, and the silicon rod loading and unloading device can realize silicon rod transfer.
  • the end of the loading transfer part is set at the first predetermined position where the silicon rod loading and unloading device performs the loading process.
  • the loading and transferring part 41 includes a carrying part 411 for carrying the silicon rods to be cut and a chain conveying mechanism 412; wherein, the carrying part 411 has two rows of rollers arranged oppositely, and the chain conveys
  • the mechanism 412 includes a conveyor chain 4121 and also includes a sprocket 4122 which is arranged at least at both ends of the conveyor chain 4121 and engages with the conveyor chain 4121.
  • the supporting portion 411 is a part for supporting the silicon rods, and the silicon rods to be cut are contacted with the silicon rods to be cut through oppositely arranged rollers to realize the horizontal transportation of the silicon rods.
  • At least one of the sprocket 4122 engaged by the conveyor chain is connected to the sprocket driving source as a driving sprocket.
  • the driving sprocket 4122 is connected to a power output shaft of a motor to drive the conveyor chain 4121 to rotate.
  • the conveying distance of the loading transfer part 41 is relatively long, and the corresponding conveying chain 4121 is relatively long.
  • the mechanism 412 is provided with a plurality of sprockets 4122, and the plurality of sprockets 4122 may be arranged at equal intervals, for example, to ensure the tension of the conveying chain 4121 everywhere.
  • the loading transfer part further includes at least one elastic push rod structure connected to the conveying chain for pushing the silicon rod to be cut along the loading transfer part move.
  • FIG. 10 is a schematic diagram showing the structure of the elastic push rod structure 413 in an embodiment.
  • the elastic push rod structure 413 includes a push rod 4131, a torsion spring 4132.
  • the elastic push rod structure 413 is arranged on the conveying chain 4121, and abuts against the end surface of the silicon rod when the conveying chain 4121 of the loading transfer part moves forward (in the arrow direction as shown in FIG.
  • the torsion spring 4132 is located below the push rod 4131 to cooperate with the rotation of the push rod 4131.
  • the push rod 4131 includes a swing rod as the main body, a roller provided at the distal end of the swing rod for contacting the silicon rod to be cut, and a rotation shaft at the proximal end of the swing rod, and the swing rod can rotate along the rotation shaft;
  • the torsion spring 4132 is sleeved on the rotating shaft to provide a torque for the swinging rod to be positioned at a certain angle. For example, when the swinging rod is not subjected to external force, the torsion spring 4132 can be used to stabilize the swinging rod in an upright position.
  • the elastic push rod structure 413 also includes a support base 4133 fixedly connected to the conveyor chain 4121 for setting the push rod 4131 and the spring, and the support base 4133 also includes a limit baffle, such as As shown in the figure, when the swing rod rotates counterclockwise, it will abut the limit baffle to reach the maximum rotation angle.
  • the elastic push rod structure 413 as a whole conforms to the forward movement of the conveying chain 4121, it swings
  • the roller at the far end of the rod touches the end face of the silicon rod to be cut and has a tendency to rotate counterclockwise relative to the shaft. After abutting against the limiting baffle, the rotation stops.
  • the push rod 4131 can be treated based on the limiting effect of the limiting baffle. The thrust of cutting the silicon rod, thereby pushing the silicon rod to be cut to move along the carrying part in the forward direction.
  • FIG. 11 shows a schematic diagram of a part of the structure of an example of the silicon rod conveying device of this application.
  • the carrying portion 411 includes vertical plates 4111 arranged on opposite sides of the conveyor chain 4121, and two rows of rollers 4112 are arranged opposite to each other on the two vertical plates 4111.
  • the silicon rod to be cut and the roller 4112 are in point contact.
  • the two rows of rollers 4112 arranged oppositely are rotatably arranged on the vertical plate 4111 above the conveyor chain 4121.
  • the elastic push rod structure moves with the conveying chain 4121.
  • the push rod abuts against the end surface of the silicon rod to be cut to provide thrust for the silicon rod to be cut to move in the axial direction of the silicon rod.
  • the supporting part 411 including the roller 4112 is arranged in cooperation with the elastic push rod. When the silicon rod to be cut moves along the supporting part 411, the thrust only needs to overcome the rolling friction with the roller 4112 to realize the silicon rod transmission. There is less resistance to overcome.
  • the loading transfer part includes a carrying part and a conveyor belt structure
  • the elastic push rod structure is fixedly arranged on the transmission belt to follow the movement of the conveyor belt, so as to abut against the end surface of the silicon rod to be cut when the conveyor belt moves forward to drive it. Wait for the silicon rod to move in the forward direction.
  • the elastic push rod structure can also be set to abut the silicon rod during the retreat movement of the conveyor chain or conveyor belt.
  • the end surface is used to transport the tape-cut silicon rod to the first predetermined position during the feeding process.
  • the silicon rod transfer device further includes a blanking transfer part and a blanking driving source.
  • the blanking transfer part is used for conveying the cut silicon rods
  • the blanking driving source is used for driving the blanking transfer part to move to drive the cut silicon rods to move.
  • the starting end of the blanking transfer part can be set at the second predetermined position during the blanking process of the silicon rod loading and unloading device, and the silicon rod loading and unloading device removes the cut silicon rod from the silicon rod carrying structure. It is clamped and transported to the unloading transfer part, so that the silicon rod transport device transfers the cut silicon rod to the next process position or the placement area of the cut silicon rod.
  • the material transfer part 42 is a conveyor belt mechanism.
  • the cut silicon rod is a rectangular parallelepiped with a flat side after the square is completed, and the cut silicon rod is placed horizontally on the conveyor belt, which can be formed on the surface of the transmission belt by the weight of the cut silicon rod. Friction for transportation.
  • the unloading driving source is, for example, a driving motor, which rotates the conveyor belt by driving at least one synchronous pulley in the conveyor belt mechanism to rotate.
  • the silicon rod conveying device further includes a turning device for turning the carried silicon rods to be cut from the horizontal state to the vertical state and turning the carried cut silicon rods from the vertical state. To the horizontal state.
  • the silicon rod loading and unloading device in the silicon rod square-out equipment can be used to clamp the vertically placed silicon rods to be cut or the cut silicon rods.
  • the turning device 43 can be used for the silicon rods to be cut from the horizontal state. Turn over to the vertical state so that the silicon rod loading and unloading device performs the loading and transportation of the silicon rods to be cut, or can be used to turn the cut silicon rods transported from the silicon rod carrying structure to the silicon rod transfer device from the vertical state to the horizontal type State to realize the subsequent conveyance of the cut silicon rods.
  • the turning device 43 is docked with the end of the loading transfer part or the starting end of the unloading transfer part.
  • the loading transfer part and the unloading transfer part are arranged on the same side of the machine seat, so that the The silicon rod loading and unloading device moves on the same side of the machine base to reach the loading transfer part and the unloading transfer part.
  • the turning device 43 is provided on the linear movement mechanism 44 to move from the loading transfer part to docking with the unloading transfer part, that is, the turning device 43 can be used between the loading transfer part and the unloading part. Move between transfer departments.
  • the loading transfer part and the unloading transfer part are arranged on the same side of the machine base and are arranged in parallel, and the turning device 43 is arranged on the linear motion mechanism 44 laid in the second direction,
  • the linear motion mechanism 44 includes, for example, a linear guide in the second direction, a traveling motor, and a traveling screw.
  • the traveling screw connects the linear guide and the turning device 43, and the turning device 43 is driven by the traveling motor along the second direction.
  • the movement of the linear guide rail in each direction can make the loading transfer part and the unloading transfer part share the same turning device 43.
  • the turning device 43 turns the silicon rods placed horizontally to be cut into a vertical position at the loading and transferring part, it can move to the docking and unloading transfer part in accordance with the linear guide rail in the second direction. Turn the cut silicon rod placed vertically to a horizontal type.
  • the loading transfer part and the unloading transfer part can also be arranged on both sides of the machine base.
  • the silicon rod processing platform provided with the silicon rod bearing structure is set on the translation mechanism, One side is set as the loading area for loading.
  • the silicon rods are cut by squaring, they are translated toward the side away from the loading area to move the cut silicon rods to the unloading area.
  • the loading transfer part and the unloading transfer part are Corresponding to the loading area and unloading area respectively.
  • the turning device 43 includes a turning table 431, and the turning table 431 is provided with a turning motor for driving the turning table 431 to rotate.
  • the turning table 431 includes: a turning part and a turning shaft.
  • the turning shaft is arranged at the turning part and is pivotally connected to a turning motor, thereby driving the turning part to rotate by a predetermined angle under the driving of the turning motor;
  • the turning part is used to carry the silicon rods to be cut or the silicon rods that have been cut, and the silicon rods to be cut during turning or the silicon rods to be cut are always attached to the turning part by clamping, adsorbing, or limiting.
  • the turning part includes a lifting seat provided on the carrying plate of the turning part and a pressing block or a pressing plate provided on the lifting seat.
  • the turning part may also include Clamping arm or hoop is used as a limiting structure.
  • the turning shaft is arranged on the right side of the turning part.
  • the turning part is driven by the turning motor to rotate 90° clockwise around the turning shaft.
  • Turn the carried silicon rod to be cut into a vertical placement;
  • the turning part is driven by the turning motor to rotate 90° counterclockwise around the turning shaft to transfer the loaded silicon rods.
  • the cutting silicon rod is turned over and placed horizontally.
  • the silicon rod to be cut is transported to the first predetermined position by the silicon rod conveying device, and the silicon rod loading and unloading device can be moved along the mounting frame above the base through the shifting mechanism to reach the The first predetermined position and movable along the mounting frame to transfer the silicon rods to be cut to the silicon rod carrying structure.
  • the transfer between different processes is automated, which can reduce labor costs and is beneficial to avoid silicon rods being damaged by bumps during the transfer and circulation; furthermore, the transfer path of the silicon rod loading and unloading device can be a straight line or a broken line path, and the lifting setting is adopted
  • the method is to place a silicon rod movement device on the ground to reserve equipment space, and the silicon rod square-out equipment can realize the automated process flow in the silicon rod square-out operation by occupying a small equipment space.
  • the existing single crystal silicon rods are generally cylindrical.
  • the weight of the silicon rod is generally set on the silicon rod supporting structure.
  • the cutting line is along the silicon rod.
  • the lengthwise cutting process will cause the jitter of the silicon rod, which makes the cutting surface uneven and the quality of the finished product is poor. Therefore, it is necessary to provide a silicon rod square-out device to ensure that the silicon rod is stably standing on the silicon rod supporting structure during the cutting process.
  • the silicon rod mentioned in this application is a single crystal silicon rod.
  • the application discloses a silicon rod compaction device and a silicon rod square-out device provided with the silicon rod compaction device.
  • the silicon rod compaction device can perform an online cutting device on a single crystal silicon rod on a silicon rod bearing structure.
  • the top of the monocrystalline silicon rod is pressed tightly during cutting, so that the silicon rod is stably standing on the silicon rod supporting structure, and the stability of the silicon rod is ensured during the cutting operation, and the cutting quality of the silicon rod is ensured.
  • the silicon rod pressing device of the present application can be used in the silicon rod square-drawing equipment, and the silicon rod pressing device can be detachably installed in the silicon rod square-drawing equipment as an independent unit to cooperate with the silicon rod square-drawing equipment
  • the silicon rod is compressed during the square root cutting process, so that the silicon rod is in a stable state during the cutting process; of course, it should be understood that in some embodiments, the silicon rod may also be compressed
  • the device is arranged in the silicon rod square-making equipment to form an integrated structure.
  • FIG. 13 shows a schematic diagram of the structure of the silicon rod pressing device in one embodiment.
  • the equipment includes a base 10, a silicon rod carrying structure (not shown in the figure), and a wire cutting device;
  • the silicon rod pressing device includes a pressing support 61 and a plurality of independent pressing components 60, wherein the The pressing bracket 60 is movably arranged on the cutting frame 20, and the plurality of mutually independent pressing components 60 are respectively arranged on the pressing bracket 61 for pressing on the to-be-cut bearing structure carried by the silicon rod
  • each pressing assembly 60 includes a pressing head 601 and a driving mechanism 602 that drives the pressing head 601 to move up and down relative to the pressing support 61.
  • the base 10 is set as the main part of the silicon rod square-out equipment of this application, and is used to provide a square-out work platform.
  • the base 10 has a relatively large volume and weight to provide greater installation. Surface and firmer stability of the whole machine.
  • the silicon rod bearing structure is arranged on the silicon rod processing platform, and is used for supporting the vertically placed silicon rods to be cut.
  • the wire cutting device is provided with at least one wire cutting unit 21, and the wire cutting unit is provided with a cutting wheel, a transition wheel, and a cutting wire wound between the cutting wheel and the transition wheel, so that the wire cutting unit 21 A cutting wire saw for cutting silicon rods is formed.
  • the silicon rod pressing device includes a pressing support 61 and a pressing assembly 60 provided on the pressing support 61 and corresponding to the silicon rod carrying structure located in the cutting area.
  • a sliding block that cooperates with the lifting rail 22 is fixed on the pressing bracket 61, and the pressing bracket 61 is vertically erected on the lifting rail 22 through its sliding block and the lifting rail 22.
  • the pressing assembly 60 is arranged on the pressing support 61 and can be lifted and lowered with the pressing support 61 to release or compress the silicon to be cut located on the silicon rod bearing structure in the cutting zone Great.
  • the pressing support 61 is provided with a plurality of independent pressing assemblies 60, and each pressing assembly 60 includes a pressing head 601 and a pressing head 601 that drives the pressing The driving mechanism 602 for the head 601 to move up and down along the pressing bracket 61, that is, each pressing assembly 60 has the freedom to follow the pressing bracket 61 to move along the cutting frame and the freedom to move up and down relative to the pressing bracket 61 Spend.
  • Each pressing component 60 can be used to perform a pressing operation on a silicon rod placed vertically on a silicon rod bearing structure.
  • the silicon rod pressing device may, for example, adjust the pressing bracket 61 and the setting In the overall lifting position of each pressing assembly 60 on the pressing support 61, after the pressing head 601 of the pressing assembly 60 is within a preset range from the upper end surface of the silicon rod to be cut, based on the silicon rod bearing structure The height of the upper end surface of each silicon rod to be cut is adjusted by the corresponding pressing head 601 lifting amplitude, so that the pressing head 601 contacts and presses the silicon rod to be cut.
  • the wire cutting unit 21 in the wire cutting device is movably installed on the cutting frame 20 through a lifting mechanism
  • the lifting mechanism includes a lifting rail 22 and a lifting motor
  • the pressing bracket 61 is movably installed on the cutting frame 20 through the lifting rail 22. That is, here, the lifting and pressing device and the wire cutting unit 21 can share a lifting rail 22 to realize movement in the lifting direction, and the lifting rail 22 is arranged on the cutting frame 20.
  • the silicon rod pressing device is attached to the mounting beam 214 for supporting the wire cutting unit 21 by its own weight.
  • the lifting motor drives the mounting beam 214 to drive the wire cutting unit 21 to descend along the lifting rail 22, and the silicon rod pressing device is attached to the mounting beam 214 and also descends along the lifting rail 22 to a position in the cutting area.
  • the mechanism 602 drives the wire cutting unit 21 to descend to perform the cutting operation of the silicon rod to be cut.
  • the wire cutting unit and the silicon rod pressing device are respectively equipped with a lifting drive device, and the wire cutting unit may be driven by a lifting motor provided on a mounting beam carrying the wire cutting unit, for example, Follow the installation beam to move up and down; the pressing bracket in the silicon rod pressing device moves along the lifting guide rail of the cutting frame under the driving of the lifting driving device arranged on the pressing bracket.
  • the silicon rod prescribing equipment provided with the silicon rod pressing device includes a first lifting driving mechanism and a second lifting driving mechanism, wherein the first lifting driving mechanism is used to drive the wire
  • the cutting unit moves along the lifting rail; the second lifting drive mechanism is used to drive the silicon rod pressing device to move up and down along the lifting rail.
  • the silicon rod pressing device no longer relies on gravity to attach to the mounting beam, but is driven by the second lifting drive mechanism to move up and down along the lifting rail, and the second lifting drive mechanism is configured as a cylinder assembly Or a screw assembly driven by a motor.
  • the first lifting drive mechanism drives the mounting beam to lower the wire cutting unit carrying the wire cutting unit
  • the second lifting drive mechanism stops driving the silicon rod pressing device so that The silicon rod pressing device is positioned at a predetermined position to compress the silicon rods to be cut
  • the first lifting drive mechanism continues to drive the mounting beam to descend with the wire cutting unit to complete the cutting of the silicon rods to be cut and complete the cutting operation of the silicon rods to be cut
  • the first lifting drive mechanism drives the mounting beam to raise the wire cutting unit
  • the second lifting drive mechanism drives the silicon rod pressing device to rise.
  • the wire cutting unit in the wire cutting device is movably installed on the cutting frame through a first lifting mechanism
  • the silicon rod pressing device is movably installed on the cutting frame through a second lifting mechanism.
  • the first lifting mechanism includes a first lifting rail and a first driving motor
  • the second lifting mechanism includes a second lifting rail and a second driving motor
  • the first lifting guide rail and the second lifting guide rail are respectively guide rails arranged in the vertical direction, that is, the direction of the heavy vertical line, and the first lifting guide rail and the second lifting guide rail are both arranged on both sides of the cutting frame, so
  • the wire cutting unit is arranged on the mounting beam, and the two ends of the mounting beam are respectively connected to the first lifting guide rails on the cutting frame on both sides of the machine base, and driven by the first drive motor to drive the wire cutting unit to move in the lifting direction, Therefore, the cutting line segment in the wire cutting unit moves up and down accordingly, and the silicon rod cutting process can be realized under the control of the first driving motor; the two ends of the pressing support of the silicon rod pressing device are arranged on both sides of the cutting frame Driven by the second driving motor on the second lifting rail, the compression bracket carries the compression component to move along the lifting rail, and the compression head of the compression component can be compressed to the top of the silicon rod.
  • a rail locking mechanism is provided on the compression bracket.
  • a rail locking mechanism is provided on the pressing support of the silicon rod pressing device; for another example, in order to prevent silicon rods from being compressed
  • the device cannot be stabilized at a preset height when moving along the lifting rail or the second lifting rail for setting the compression bracket under the action of the second driving motor, and the compression bracket is provided with a rail locking mechanism.
  • the rail locking mechanism can be used to position the silicon rod pressing device at a predetermined position on the lifting rail (or the second lifting rail), for example, the predetermined position is that the pressing component of the silicon rod pressing device is located corresponding to it.
  • the top of the silicon rod to be cut is 0 to 5cm, but not limited to this, only the pressing assembly is located above the corresponding silicon rod to be cut, and the pressing head in the pressing assembly can be pressed down when it is driven down. It corresponds to the top surface of the silicon rod to be cut.
  • the guide rail locking mechanism includes a locking clamp block and an air cylinder, the locking clamp block is arranged on a compression bracket, and the air cylinder is used to provide a clamping lift rail or a cylinder for the locking clamp block.
  • the locking clamp With the force of the second lifting rail, when the cylinder is pushed out, the locking clamp is pressed against the lifting rail or the second lifting rail connected to the compression bracket. Based on the force of the cylinder in the pushing state, the locking clip is locked After the block abuts against the lifting rail or the second lifting rail, it remains relatively stationary with the rail against which it abuts.
  • Figure 14a shows a schematic structural view of the silicon rod pressing device 6 of this application in an embodiment.
  • Figures 14b and 14c show the silicon rod pressing device 6 in different motion states.
  • the rail locking mechanism 62 is, for example, the pneumatic rail locking mechanism 62 shown in the figure.
  • the silicon rod pressing device 6 is arranged on the lifting rail 22, thereby achieving Movement in the lifting direction to achieve compaction of the silicon rod.
  • the pneumatic rail locking mechanism 62 in this embodiment includes a locking clamp block 621 that cooperates with the lifting rail 22, a cylinder 622 that drives the locking clamp block 621 to act, and a spring 623.
  • the locking clip block 621 and the lifting rail 22 are respectively provided with a rack in the lifting direction, that is, along the rail direction, and the locking clip block 621 is arranged on the compression bracket in the silicon rod compression device 6, and In a moving state, the silicon rod pressing device 6 descends with the mounting beam (shown in the state shown in Figure 14b). At this time, the air cylinder 622 is in a resting state, and the locking clamp block 621 and the lifting rail 22 are in a stopped state.
  • the rack in the middle is separated by the elastic force of the spring 623, whereby the silicon rod pressing device 6 can move along the lifting rail 22.
  • the air cylinder 622 drives the locking clamp block 621 on the pressing bracket to move.
  • the propelling action of the air cylinder 622 overcomes the elastic force of the spring 623, so that the locking clamp block 621 hugs the lifting rail 22 to position the silicon rod pressing device 6 at a predetermined position (shown in the state shown in FIG. 14c), and the locking clamp block 621 and The racks of the lifting rail 22 engage and bite, thereby fixing the silicon rod pressing device 6 on the lifting rail 22 to position the silicon rod pressing device 6 to a predetermined position.
  • the pressing component in the silicon rod pressing device 6 presses its corresponding silicon rod to be cut, and the mounting beam continues to be driven to drive the wire cutting unit to descend to complete the cutting of the silicon rod to be cut, and the cutting of the silicon rod to be cut is completed
  • the air cylinder 622 drives the locking clamp block 621 on the pressing bracket to loosen the lifting rail 22 So that the silicon rod pressing device 6 continues to attach to the mounting beam and rises (in the state shown in Fig. 14b).
  • the pressing bracket 61 is provided with a rail clamp (in the embodiment shown in FIG. 13), and the rail clamp may be arranged at both ends of the pressing bracket 61 to compress the
  • the bracket 61 is connected to the lifting rail 22 or the second lifting rail.
  • the rail clamper 221 can be configured as four, respectively
  • a compression bracket 61 is connected to the double rail on the side.
  • the pressing bracket 61 can be attached to the cutting frame 20 to move along the lifting rail 22 or along the second lifting rail under the action of the second driving motor, and is pressed by the rail clamper 221 after reaching a predetermined position. Tightening the guide rail makes the pressing bracket 61 stable at a preset height.
  • the multiple independent pressing components provided on the pressing support can move along the lifting rail under the driving of the pressing support, and at the same time, the pressing head of each lifting component can be in the driving mechanism. Drive down to move up and down along the lifting bracket.
  • the driving mechanism includes a power structure and a guide rail
  • the compression head is linked with the power structure and controlled by the power structure to move up and down along the guide rail.
  • FIG. 15 is shown as an enlarged schematic diagram of A in FIG. 13.
  • the pressing bracket 61 is provided with a plurality of pressing components 60, which respectively correspond to the silicon rods with a plurality of silicon rod bearing structures in the cutting area, each of which is provided with a pressing component 60.
  • the driving mechanism 602 includes a guide rail 6022 arranged in the lifting direction on the pressing support 61, and a power structure 6021 as the lifting driving source of the pressing head 601.
  • the pressing head 601 can be driven by the power structure 6021 along the lower edge.
  • the guide rail 6022 moves.
  • the power structure 6021 includes: a cylinder or a hydraulic pump and a telescopic element, wherein the telescopic element is connected to the cylinder or the hydraulic pump, and the compression head 601 is arranged on the telescopic element bottom.
  • the telescopic element moves in the lifting direction under the propulsion of the cylinder.
  • the telescopic element is connected to the cylinder piston rod, and the compression head 601 is arranged at the bottom of the telescopic element (ie, the telescopic element).
  • the air cylinder drives the telescopic member to carry the compression head 601 to move up and down to release or compress the silicon rods to be cut located on the silicon rod bearing structure in the cutting zone.
  • the telescopic element is connected to a hydraulic pump, for example, the telescopic element is a rod connected to a piston of a hydraulic cylinder or a lifting cylinder connected to a hydraulic pump, and the telescopic element can be driven by the hydraulic pump. It moves up and down along the guide rail 6022, and drives the pressing head 601 at the bottom of the telescopic member to move up and down to adjust the distance from the pressing head 601 to the end surface of the silicon rod to be cut.
  • the driving mechanism includes a guide rail and a lifting motor (not shown), the guide rail is arranged on a pressing bracket along the lifting direction, and the pressing head is driven by the lifting motor.
  • the relative pressing bracket moves up and down to adjust the distance from the pressing head to the top of the silicon rod to be cut.
  • the power structure includes a lifting motor and a telescopic element, wherein the telescopic element is connected to the lifting motor, and the compression head is arranged at the bottom of the telescopic element.
  • the telescopic member is, for example, a connecting rod between a lifting motor and the compression head
  • the lifting motor is, for example, a traveling motor that can move along a guide rail.
  • the telescopic member is an electric push rod driven by a lifting motor, and the extension end of the electric push rod is connected to the compression head, and the compression is driven by the lifting motor. Head up and down movement.
  • the pressing head is connected to the driving mechanism through an extension arm.
  • the proximal end of the extension arm 6011 is connected to the driving mechanism 602, and the distal end is connected to the pressing head 601, so that the extension arm is driven by the driving mechanism 602 6011 drives the compression head 601 at the distal end to move up and down relative to the compression bracket.
  • the extension arm 6011 can be connected to the telescopic part of the power structure 6021; for example, the distal end of the extension arm 6011 is connected to a slider that can move along the guide rail 6022, and the slider The movement is driven by the lifting motor.
  • the length of the extension arm 6011 can also be adjusted, and the distal end of the extension arm 6011 is the free end when the length is adjusted; here, the guide rail in each pressing assembly 60 is arranged on the side of the silicon rod bearing structure, The guide rail 6022 and its extension direction are outside the corresponding silicon rod to be cut.
  • the guide rail 6022 shown in the view of FIG. The head 601 is located directly above the end surface of the silicon rod to be cut.
  • the extension arm 6011 is, for example, a telescopic rod provided with a telescopic drive device.
  • the extension arm 6011 can be provided with a linear guide rail, and the pressing head 601 is provided on the linear guide rail, which can equivalently realize the effect of adjusting the length of the extension arm 6011 to ensure the pressing head 601 Press the silicon rod at the center of the end face of the silicon rod to be cut.
  • the compression head is a rotary compression head.
  • the silicon rod bearing structure has a rotating mechanism that can drive the silicon rod to be cut on it to rotate to adjust the surface to be cut.
  • the pressing head is connected to the driving structure through a rotating shaft (not shown).
  • a bearing (not shown) is provided at the bottom of the telescopic part connected to the cylinder
  • the compression head has a rotating shaft adapted to the bearing
  • the compression head is rotatably mounted on the shaft through the rotating shaft.
  • each compression head is rotatably arranged at the distal end of the extension arm, and the compression head can be connected to the extension arm via a rotating shaft, and the rotating shaft is arranged in the third direction, that is, the lifting direction.
  • the pressing head In a state where the pressing head is pressing the silicon rod to be cut, the pressing head can rotate along the rotating shaft when the silicon rod bearing structure drives the silicon rod to rotate.
  • a buffer pad (not shown) may be provided between the pressing head and the silicon rods to be cut, and the buffer pad is fixed to the pressing head.
  • the pressing surface (the pressing surface is the lower surface of the pressing head).
  • a detection device (not shown) is further provided at the bottom of the pressing head for detecting the contact state of the silicon rod to be cut by the pressing head.
  • the detection device includes a pressure sensor, which is provided on the lower surface of the pressing head for contacting the silicon rod to be cut.
  • the pressure sensitive element of the pressure sensor contacts the silicon rod to be cut and outputs a contact signal.
  • the pressure sensor can also be used to detect the pressure value to determine that the pressing force of the silicon rod to be cut is within a preset range .
  • the lifting range of the pressing head moving up and down along the pressing support is 200 mm to 400 mm.
  • the silicon rods to be cut may have different lengths and specifications.
  • the silicon rods to be cut are usually the rod-shaped single crystal silicon rods that are grown from the melt by the Czochralski method or the suspension zone melting method. There may be a certain height difference between different silicon rod sections, as shown in Figure 13.
  • the length of the guide rail can be set to 200 mm to 400 mm, or the telescopic distance of the telescopic element can be set to 200 mm to 400 mm.
  • the height difference of the compression heads in the compression assembly arranged on the same compression support can reach 200 mm to 400 mm, and the silicon ingot compression device can compress different silicon ingot bearing structures in the cutting area.
  • silicon rods to be cut with a long length there is no need to group the silicon rods to be cut based on the same length before loading and cutting, which makes the square-out process easier.
  • the silicon rods to be cut can be grouped based on the length and then loaded and cut. For example, in the silicon rod shown in FIG. In the square-cutting equipment, there are 4 silicon rod bearing structures corresponding to the cutting area. Here, the silicon rods to be cut can be divided into four groups, so that the length difference between the silicon rods to be cut in each group is less than 400 mm.
  • the silicon rod pressing device can be used for pressing each group of silicon rods to be cut. Since each group of silicon rods to be cut may have a length difference, there is no need to accurately measure the length when determining the length, which simplifies the prescribing process for silicon rods of different length specifications.
  • the silicon rod pressing device provided in the present application can cooperate with the wire cutting device provided in the silicon rod square-out equipment.
  • the silicon rod pressing device can share a lifting rail with the wire cutting device or move along a lifting rail respectively.
  • the silicon rod pressing device is simply set above the silicon rod to be cut with the aid of the mounting beam in the wire cutting device, or the silicon rod pressing device is equipped with a second driving mechanism to drive the silicon rod pressing device to move in the lifting direction along the lifting rail ;
  • each lifting component in the silicon rod pressing device can move up and down along the pressing support to adapt to pressing different specifications of silicon rods to be cut; before square cutting, the silicon rod pressing device presses Immediately after cutting the top of the silicon rod, make sure that the silicon rod is stably placed vertically on the silicon rod bearing structure to effectively reduce or avoid the jitter, displacement or even overturning of the silicon rod due to disturbance during the subsequent cutting process, and to improve the prescribing process The quality of the finished product.
  • This application also provides a silicon rod square-out device, including a machine base, a silicon rod bearing structure, a wire cutting device, and the silicon rod pressing device according to any one of the embodiments shown in FIGS. 13 to 15 .
  • the machine base has a processing platform, and the silicon rod bearing structure is arranged on the silicon rod processing platform and used to carry the silicon rods placed vertically.
  • the wire cutting device includes a cutting frame arranged on the machine base, and a wire cutting unit movably arranged on the cutting frame; wherein, the wire cutting unit includes a cutting wheel, a transition wheel, and a cutting line, the cutting line At least one cutting wire saw is formed by winding the cutting wheel and the transition wheel in sequence, and the cutting wire saw can be used for square cutting of the silicon rod to be cut.
  • the silicon rod pressing device may cooperate with the wire cutting device for cutting the silicon rod carried by the silicon rod bearing structure in the wire cutting device Press the top of the silicon rod, that is, the upper end surface of the silicon rod, to ensure that the silicon rod is stably placed on the silicon rod supporting structure during the cutting process, thereby avoiding the lack of cutting quality caused by the displacement of the silicon rod. Good, silicon rod overturning and other conditions.
  • wire cutting technology is used in multiple processes of silicon ingot processing, such as cutting operation, square rooting and slicing for silicon ingots.
  • Wire cutting technology is currently the most advanced silicon material processing technology in the world. Its principle is that the high-speed running steel wire drives the cutting edge material attached to the steel wire or directly uses diamond wire to rub the workpiece to be processed, so as to achieve wire cutting. the goal of. In the cutting process, the steel wire or diamond wire is guided by the wire wheel to form a wire saw or a wire net on the cutting roller, and the workpiece to be processed is realized by the rise and fall of the worktable or the rise and fall of the wire saw or the wire net. The feed of the workpiece.
  • the automatic cooling water spray device installed on the equipment sprays the cold water to the cutting parts of the steel wire or diamond wire and the processed parts, and the cutting is generated by the reciprocating movement of the steel wire or diamond wire to remove the material to be processed. Cut into multiple pieces at the same time.
  • Wire cutting technology has the advantages of high efficiency, high productivity, and high precision compared with traditional blade saw blades, grinding wheel blades and internal circular cutting.
  • the polycrystalline silicon brittle material is first pulled into single crystal silicon rods, and the originally obtained single crystal silicon rods are truncated to obtain silicon rod sections with predetermined length specifications, and then open
  • the square machine performs square extraction; at this time, the cutting mechanism feeds along the length of the silicon rod and cuts four parallel planes in the circumferential direction of the silicon rod, so that the cross-section of the silicon rod is almost rectangular; after the square is completed, use more The wire slicer slices the squared silicon rod along the length direction to obtain the required silicon wafer.
  • multiple links in silicon rod processing need to be completed with the help of a wire cutting device.
  • the high-speed running steel wire drives the cutting edge material attached to the steel wire or directly uses the diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting.
  • multiple cutting wheels and transition wheels are configured in multi-wire cutting equipment.
  • the cutting wire is wound on the slot of the cutting wheel and the slot of the transition wheel corresponding to the cutting wheel to form multiple cutting wire saws.
  • the wire saw is used to cut the silicon rods to be cut. After a long time of use, the wire groove on the cutting wheel will be worn, which affects the cutting effect. Therefore, it is necessary to replace the groove position of the cutting wheel.
  • the silicon rod is cut to a preset specification, it will be replaced after the groove is changed.
  • the moving distance of the cutting wheel needs to be adjusted.
  • the positional relationship between the multiple cutting wheels after installation is not easy to change. After one of the wire cutting wheels is worn out, the position of the cutting wheel or other parts needs to be adjusted to change the groove as a whole , And need to further calibrate the parts to adjust the position, the operation is cumbersome and the efficiency is low.
  • the present application also provides a wire cutting device for silicon ingot processing equipment.
  • the silicon ingot processing equipment includes: a machine base with a silicon ingot processing platform; and a silicon ingot carrying device arranged on the silicon ingot processing platform
  • the wire cutting device is used to carry the silicon rods to be cut;
  • the wire cutting device includes: a cutting frame arranged on the base; at least one wire cutting unit movably arranged on the cutting frame;
  • the wire cutting unit includes: A plurality of cutting wheels arranged in sequence in the direction, each of which has at least two cutting line grooves; the cutting line is sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw; at least one pitch adjustment mechanism, Set on the at least one wire cutting unit, and used to drive the plurality of cutting wheels in the at least one wire cutting unit to move in the second direction to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit, or to change
  • the cutting wire is wound around the cutting grooves of the plurality of cutting wheels in the at least
  • the wire cutting device can switch the cutting wire between different cutting grooves of the cutting wheel based on the pitch adjustment mechanism, or adjust the position of the cutting wire saw to change the cutting position (or processing specification) relative to the silicon rod, using the
  • the silicon rod processing equipment of the wire cutting device can be silicon rod square-out equipment, silicon rod cutting equipment, silicon rod cutting and grinding integrated equipment, etc. It should be understood that the wire cutting device is realized by a pitch adjustment mechanism to change the slot or adjust the position of the cutting wire saw It only needs to be realized by a certain structure and winding method of the wire cutting device itself, and is not limited by the specific type of silicon rod processing equipment.
  • the cutting wire saw is a line segment in a certain position area of the cutting line that can be used to feed the silicon rod. It should be understood that the cutting line is in high-speed operation during the cutting process.
  • the position of the cutting wire saw is usually determined by the winding method of the cutting wheel and the cutting wire.
  • the wire cutting of the present application is applied to the silicon rod square preparation equipment as an example for description, but it is not used to limit the application scenarios of the wire cutting device of the present application.
  • FIG. 16 shows a schematic structural diagram of the wire cutting device of this application in an embodiment
  • FIG. 17 realizes that the wire cutting device of this application is applied to silicon rods in an embodiment of the application.
  • the wire cutting device includes a cutting frame 20, at least one wire cutting unit 21, and at least one pitch adjusting mechanism 23.
  • the cutting frame 20 is installed on the machine base 10.
  • the cutting frame 20 is installed on both ends of the machine base 10 to ensure that the cutting frame 20 is installed on the wire cutting unit 21 of the cutting frame 20.
  • the cutting wire saw can cover different processing stations. For example, in the example shown in FIG. A silicon rod supporting structure, and the span of the wire cutting unit 21 includes each silicon rod supporting structure in the cutting area.
  • the at least one wire cutting unit 21 is movably installed on the cutting frame 20; the wire cutting unit 21 includes a plurality of cutting wheels 211 and a cutting wire 213 arranged in sequence along a first direction. In some implementations, as shown in the embodiment shown in FIG.
  • the wire cutting unit 21 is provided on the cutting frame 20 by a wire cutting support 24, and the wire cutting support 24 is provided on the cutting frame 20 and It includes a guide rail arranged in the second direction, and the wire cutting unit 21 is arranged on the guide rail of the wire cutting support 24 to form a degree of freedom of movement in the second direction; of course, the wire cutting support 24 can also be provided
  • the guide groove in the second direction, the sliding rod in the second direction, or other second-direction limiting structure or guide structure are used to set the at least one wire cutting unit 21, which is not limited in this application.
  • the wire cutting unit 21 includes a first-direction mounting beam 214, and both ends of the mounting beam 214 are movable. Connected to the cutting frame 20, a plurality of cutting wheels 211 are sequentially arranged on each mounting beam 214. That is, the one-line cutting unit 21 is composed of a plurality of cutting wheels 211, a cutting line 213, and a supporting structure of the cutting wheels 211 arranged in the same direction (or the same straight line).
  • the multiple cutting wheels 211 in the wire cutting unit 21 are installed on the cutting frame 20 through a bracket, a connecting plate, or a mounting frame.
  • the wire cutting unit 21 provides The carriers of the plurality of cutting wheels 211 can be in different forms, which are not limited in this application.
  • wire cutting device when the wire cutting device is provided with a plurality of wire cutting units 21, different wire cutting units 21 are located on different straight lines, and the two wire cutting units 21 as shown in FIG. 2 are respectively parallel. In some examples, the extension directions of different wire cutting units 21 may also intersect.
  • the first direction is the direction in which the multiple cutting wheels in the wire cutting unit are arranged, for example, the direction of the mounting beam of the wire cutting unit in some examples.
  • the cutting wire saw formed by the cutting wire around the cutting wheel is also in the first direction;
  • the second direction is the orthogonal direction of the first direction, and the at least one pitch adjusting mechanism drives the at least one wire cutting unit along the second direction.
  • Directional movement that is, the cutting wire saw in the wire cutting unit moves along its orthogonal direction.
  • the wire cutting device can realize the cutting processing of the silicon rod based on the lifting movement of the wire cutting unit 21 along the cutting frame 20, and the control of the cutting specification is achieved by adjusting the relative position between the cutting wire saw and the silicon rod in the second direction.
  • the cutting wire saw is moved in the second direction by the pitch adjustment mechanism 23, and the at least one wire cutting can be adjusted.
  • the cutting position of at least one cutting wire saw in the unit 21 can be used to control the cutting amount of the silicon rod.
  • the at least one wire cutting unit further includes at least one transition wheel, and each transition wheel has at least two wire grooves; wherein, a plurality of the at least one wire cutting unit is driven by the at least one pitch adjustment mechanism When the cutting wheel moves in the second direction, the at least one transition wheel and the plurality of cutting wheels in the at least one wire cutting unit remain relatively stationary.
  • the wire cutting unit 21 includes at least one transition wheel 212, and the at least one transition wheel 212 is used To realize the direction guidance or tension adjustment of the cutting line 213 when it is wound around different cutting wheels 211.
  • the at least one transition wheel 212 can be arranged on a carrier carrying a plurality of cutting wheels 211 as shown in the mounting beam 214 shown in FIG.
  • the transition wheel 212 and the plurality of cutting wheels 211 together follow the carrier to move in the second direction.
  • the at least one transition wheel 212 and the plurality of cutting wheels 211 are relatively stationary, that is, the transition wheel 212 and the cutting wheels
  • the positional relationship between 211 remains unchanged.
  • the pitch adjusting mechanism 23 When the pitch adjusting mechanism 23 is used to adjust the cutting position of at least one wire saw in the at least one wire cutting unit 21, the positional relationship of the cutting wire saw relative to the cutting wheel 211 and the transition wheel 212 remains unchanged, that is, only Move in the second direction to adjust the cutting position.
  • a plurality of cutting wheels 211 belonging to the same wire cutting unit 21 are arranged on the mounting beam 214 arranged along the first direction, and the at least one transition wheel 212 is arranged on the mounting beam 214 via a bracket .
  • the pitch adjusting mechanism 23 may be configured to be connected to the mounting beam 214 to drive the plurality of cutting wheels 211 carried by the mounting beam 214 to move in the second direction, and the bracket moves in accordance with the mounting beam 214 and drives at least one transition.
  • the wheel 212 moves in the second direction, so that at least one transition wheel 212 and the plurality of cutting wheels 211 in the wire cutting unit 21 remain relatively stationary.
  • the at least one transition wheel 212 has at least two wire grooves.
  • the at least one pitch adjusting mechanism 23 is used to change the cutting wire 213 around the cutting wire groove positions of the plurality of cutting wheels 211 in the at least one wire cutting unit 21
  • the position of the cutting line 213 corresponding to the at least one transition wheel 212 on the wire groove is changed so that the cutting line around the transition wheel and the wire wheel is still located in a plumb surface after the groove is changed.
  • the commonly used winding method requires that the cutting line between the transition wheel and the cutting wheel is located in the plumb surface.
  • the cutting line groove and the wire groove for winding the cutting line are not in the same plane after the groove is changed, the cutting line has a component force in the second direction on the transition wheel and the cutting wheel, which is not conducive to the efficient operation of the cutting line.
  • setting the transition wheel 212 as at least two wire grooves can be used to realize the direction adjustment of the cutting line 213 after the groove is changed.
  • Each cutting wheel 211 has at least two cutting grooves, the different cutting grooves are parallel to each other and the projection of the cutting groove plane on the horizontal plane is along the first direction, and the different cutting grooves have a cutting offset in the second direction.
  • the cutting line 213 changes to the position of the slot on the cutting wheel 211, the cutting line 213 has a second direction displacement relative to the cutting wheel 211.
  • the transition wheel 212 is opposite to the cutting wheel 211 At rest, if the cutting wire 213 is changed to the slot position of the cutting wheel 211, the cutting wire saw that is wound around the transition wheel and the wire wheel is still in a plumb surface, then the cutting wire 213 is wound around the wire of the transition wheel 212 The slot position also needs to be changed.
  • Each transition wheel 212 has at least two wire grooves, and the at least two wire grooves are parallel to each other, and the projection of the plane where the wire grooves are located on the horizontal plane is along the first direction, and the transition deviation between different wire grooves is in the second direction.
  • the amount of movement, based on the at least two wire grooves, can be used to change the wire groove of the cutting line 213 in the transition wheel 212, so that the cutting wire saw wound around the transition wheel and the wire wheel after the adjustment of the groove is still located in a plumb surface .
  • the transition offset between adjacent wire grooves in the transition wheel 212 is equal to the cutting offset between adjacent cutting line grooves in the cutting wheel 211, so as to realize cutting according to a preset position.
  • Line 213 changes slots.
  • the cutting wheel 211 and the wire wheel can be set in the wire cutting unit 21 in a form of one-to-one correspondence between the wire groove and the cutting wire groove (the correspondence means that the cutting wire groove and the wire groove are coplanar), and the transition The number of wire grooves of the wheel 212 is equal to the number of the cutting wheel 211, or it can be different.
  • the cutting wheel 211 and the transition wheel 212 in the wire cutting unit 21 can be arranged in different positional relationships and configured with different winding methods.
  • a plurality of cutting wheels belonging to the same wire cutting unit form at least two cutting wheel groups in a paired manner, and there are also two adjacent cutting wheel groups in two adjacent cutting wheel groups.
  • a transition wheel is provided, the transition wheel has at least two wire grooves, and the cutting is sequentially wound on the cutting wheel and the transition wheel to form a cutting line between the two cutting wheels in each cutting wheel group Saw, wherein, when the cutting line is wound around two adjacent cutting wheels in the two adjacent cutting wheel sets, it passes through the cutting line groove of the next cutting wheel in the previous cutting wheel set and passes through all the cutting lines.
  • the wire groove of the transition wheel is then passed into the cutting groove of the preceding cutting wheel in the following cutting wheel group; wherein, the at least one pitch adjusting mechanism drives the plurality of cutting wheels in the at least one wire cutting unit along the first When moving in two directions, at least one transition wheel and a plurality of cutting wheels in the at least one wire cutting unit remain relatively stationary.
  • FIG. 18 shows a schematic diagram of the wire cutting device of this application applied to a silicon rod square-out device in an embodiment
  • FIG. 19 shows a wire cutting unit in the wire cutting device.
  • the wire cutting unit in the wire cutting device is provided with 4 cutting wheel sets.
  • a transition wheel 212 is provided between two adjacent cutting wheel sets.
  • the cutting line 213 is wound on the cutting wheel 211 and the transition wheel 212 in sequence to connect the two cutting wheels of each cutting wheel set.
  • a cutting wire saw is formed on the 211, wherein the cutting wire 213 is wound by the cutting wheel 211 of the previous cutting wheel group when it is wound around the two adjacent cutting wheels 211 of the two adjacent cutting wheel groups.
  • the cutting line groove of ⁇ is passed into the cutting line groove of the preceding cutting wheel 211 in the next cutting wheel group.
  • every two adjacent cutting wheel sets share the same transition wheel 212 for guiding, which can reduce the length of the cutting line 213 used for tension adjustment and guiding, so that the cutting line 213 is used to form the cutting of the cutting wire saw.
  • the length ratio of the wire 213 is increased, while simplifying the winding method, the utilization rate of the cutting wire 213 is improved, and the production cost is reduced.
  • Each cutting wire saw can cut a silicon rod corresponding to a silicon rod carrying structure 11. It should be understood that the position distance of the cutting wheel 211 in the first direction is changed, and any cutting line
  • the number of silicon rod bearing structures 11 corresponding to the saw can also be 2, 3, 4, etc.
  • the distance between the two cutting wheels 211 in each cutting wheel group in the first direction can be increased, or , The distance between the silicon rod supporting structure 11 in the first direction is reduced, so that the two cutting wheels 211 in the cutting wheel set are respectively located on two, 3, or 4 silicon rod supporting structures 11 in the second direction.
  • each cutting wire saw can simultaneously cut the silicon rods placed on its corresponding multiple silicon rod bearing structures 11.
  • the number of silicon rod supporting structures 11 corresponding to each cutting wire saw can be selected according to actual conditions to stabilize the processing quality.
  • the multiple cutting wheels belonging to the same wire cutting unit include a first cutting wheel, a tail cutting wheel, and at least one intermediate cutting wheel located between the first cutting wheel and the tail cutting wheel. At least one intermediate cutting wheel is also provided with a transition wheel beside it. The transition wheel has at least two wire grooves.
  • a cutting wire saw is formed on the upper side, wherein when the cutting wire is wound around the middle cutting wheel, it passes through one of the at least two cutting wire grooves on the middle cutting wheel and passes through the side After the transition wheel is penetrated by another cutting line groove of the at least two cutting line grooves on the intermediate cutting wheel, so that any two adjacent cutting line saws have a cutting offset in the second direction ,
  • the cutting offset corresponds to the distance between the two related cutting grooves; wherein, when the plurality of cutting wheels in the at least one wire cutting unit are driven to move in the second direction by the at least one pitch adjusting mechanism, The at least one transition wheel and the plurality of cutting wheels in the at least one wire cutting unit are kept relatively stationary.
  • FIG. 20 shows a schematic structural diagram of an intermediate cutting wheel and a transition wheel arranged beside it in an embodiment of the wire cutting device of the present application.
  • 17 and 20 illustrate the winding method adopted by the wire cutting unit 21 in this example.
  • each intermediate cutting wheel 211 undergoes two windings.
  • the cutting wheel 211 undergoes at least one winding.
  • the cutting line 213 is wound around the middle cutting wheel 211, it passes through the first cutting line groove 2111 of the at least two cutting line grooves on the middle cutting wheel 211 and passes through the side (in the embodiment shown in FIG.
  • the transition wheel 212 on the upper side of the cutting wheel 211 is then penetrated by the second cutting line groove 2112 of the at least two cutting line grooves on the intermediate cutting wheel 211, so that any two adjacent cutting line saws There is a cutting offset in the first direction, and the cutting offset corresponds to the distance between the first cutting groove 2111 and the second cutting groove 2112.
  • the line connecting the axis of the transition wheel and the axis of the cutting wheel is parallel to the heavy vertical line.
  • the length of the cutting lines on both sides of the transition wheel is equal or approximately the same, and the force state during the cutting process is approximately the same, which helps prevent the cutting lines on both sides of the transition wheel from being partially or unilaterally continuously stressed or insufficient. The problem.
  • the transition wheel 212 is set directly above the cutting wheel, and the cutting line 213 passes through the first cutting line groove 2111 of the cutting wheel 211 and is guided through the transition wheel 212 to wind around.
  • the projections of the cutting lines 213 on both sides of the transition wheel 212 formed on the plumb-direction plane are line segments of equal length.
  • the formed cutting wire saw is the tangent line below the cutting line groove of the cutting wheel 211.
  • the transition wheel may also be arranged directly below the cutting wheel, that is, the line connecting the axis of the transition wheel and the cutting wheel is a heavy vertical line.
  • the cutting line winds down from the first cutting groove of the cutting wheel to the transition wheel, and is guided by the transition wheel and then passes upward from the second cutting groove of the cutting wheel.
  • the formed cutting wire saw is a cutting wheel cutting The tangent above the wire slot.
  • the side is mainly used to determine the corresponding relationship between the intermediate cutting wheel and the transition wheel, rather than a specific position.
  • the side can also be the left side, right side, upper side, lower side, or oblique side of the cutting wheel. Fang, etc., this application is not restricted.
  • the arrangement of the multiple cutting wheels, the intermediate cutting wheels, and the cutting line in the wire cutting unit may adopt the method described in Chinese patent application CN2020204403178 (title of invention: silicon rod square preparation equipment).
  • the multiple cutting wheels in the wire cutting unit can be moved along the second line under the action of the at least one pitch adjustment mechanism. Move in the direction to realize the adjustment of the cutting position of the cutting wire saw or change the slot.
  • the cutting wheels 211 belonging to the same wire cutting unit can move in the second direction under the drive of the pitch adjusting mechanism 23. Therefore, the cutting wire saw formed between the cutting wheels 211 is in the first Moving in two directions, the cutting position adjustment of the cutting wire saw can be realized; when the wire cutting unit further includes a transition wheel 212, the at least one pitch adjustment mechanism 23 drives the plurality of cutting wheels 211 in the at least one wire cutting unit along When moving in the second direction, the transition wheel 212 and the cutting wheel 211 remain relatively stationary, and the corresponding cutting wire saw moves in the second direction to realize the adjustment of the cutting position of the cutting wire saw.
  • the cutting line positions before and after the groove change can be determined in advance. Respectively correspond to the cutting line grooves, for example, the position of the cutting line before changing the groove is the cutting line groove a1, and the cutting line is wound around the cutting line groove a2 after the groove is changed, based on the cutting offset between the cutting line groove a1 and the cutting line groove a2
  • the amount of displacement determines the displacement of the plurality of cutting wheels 211 in the wire cutting unit driven by the at least one pitch adjusting mechanism 23 in the second direction, that is, the displacement is set as the cutting between the cutting line groove a1 and the cutting line groove a2.
  • the offset can be used to realize the replacement of the cutting line slot a1 to the cutting line slot a2; it should be noted that the at least one pitch adjustment mechanism 23 drives the multiple cutting wheels 211 in the wire cutting unit in the second direction
  • the moving direction is the direction that the cutting line slot a2 points to the cutting line slot a1.
  • the cutting position of the cutting wire saw in the space remains unchanged, so the step of further calibrating the position of the cutting wheel 211 or other components is omitted.
  • the silicon rod is cut according to the preset cutting amount, so that the slot changing process is simplified.
  • the present application provides the following embodiments.
  • the specific form of the at least one pitch adjusting mechanism can be changed accordingly.
  • the wire cutting device includes a single wire cutting unit; the pitch adjusting mechanism includes: a screw rod arranged along the second direction and threadedly connected with the single wire cutting unit; a driving source for driving the wire The rod turns.
  • the single wire cutting unit is a wire cutting unit
  • the single wire cutting unit in the wire cutting device includes a plurality of cutting wheels arranged along a first direction, and the cutting wire is wound around the plurality of cutting wheels to form at least one cutting Wire saw, and the at least one cutting wire saw is along the same straight line direction.
  • the screw rod of the pitch adjusting mechanism has a distal end and a proximal end.
  • the proximal end of the screw rod can be connected to a driving source and rotated under the driving of the driving source, and the distal end of the screw rod is threadedly connected to the
  • the single-wire cutting unit by means of the connection between the two ends of the screw, the screw can rotate based on the drive source transmission and convert the rotation of the screw into an axial displacement by means of a threaded connection.
  • the axial displacement direction is the setting direction of the screw.
  • the second direction; the single-wire cutting unit can be displaced in the second direction by driving the lead screw in the pitch adjusting mechanism, and the single-wire cutting unit can be displaced in the second direction when the lead screw is driven to rotate in a different direction Forward or backward.
  • the wire cutting device includes a single wire cutting unit; the pitch adjusting mechanism includes: a telescopic member arranged in a second direction and associated with the single wire cutting unit; a driving source for driving the telescopic The piece telescopically moves in the second direction.
  • the telescopic element may be configured as a rod structure and the extension direction of the rod is the second direction.
  • the telescopic element can telescopically move along its extension direction under the driving of a driving source, and one end of the telescopic element may be connected to the driving source,
  • the retractable free end is associated with the single wire cutting unit, and can drive the single wire cutting to move in the second direction under the action of a driving source.
  • the telescopic member is, for example, an electric telescopic rod, or a connecting rod connected to the cone rod of the cylinder, and the cylinder can be used as a driving source, which is not limited in this application.
  • the manner in which the telescopic rod is connected to the single-wire cutting unit may be linear connection or indirect connection, for example, it may be directly connected to the single-wire cutting unit mounting beam, or indirectly connected to the single-wire cutting unit through a support or a bearing. It should be understood that the expansion or contraction of the telescopic element corresponds to the advancement or retreat of the single-wire cutting unit in the second direction.
  • the association may be realized by one or more of engagement, screw locking, bonding, and welding.
  • the telescopic rod may be The wire cutting unit is associated by one or more of snapping, screw locking, bonding, and welding; of course, the realization of the association is not limited to this, but is intended to be in the second direction The transmission.
  • the wire cutting device includes a single wire cutting unit; the pitch adjusting mechanism includes: a rack arranged on the single wire cutting unit along a second direction; a transmission gear meshing with the rack; and driving The source is used to drive the transmission gear to rotate.
  • the transmission gear is driven by the drive source to rotate, and the rack meshed with the transmission gear moves in the direction of the rack step accordingly.
  • the drive source can be moved by matching the rack and the transmission gear.
  • the rotational movement of the drive is transformed into a line conveying along the direction of the rack, and the rack is provided in the single-wire cutting unit along the second direction, which can drive the single-wire cutting unit to move in the second direction.
  • the rotation direction of the transmission gear is controlled by the driving source to switch the displacement direction of the single-wire cutting unit forward or backward in the second direction.
  • the pitch adjustment mechanism may be set to one or more.
  • the single wire cutting unit has a large span in the first direction, it is difficult to drive the single wire by setting a pitch adjustment mechanism.
  • multiple pitch adjustment mechanisms can be set to drive.
  • the single-wire cutting unit is provided with a distance adjustment structure at both ends of the single-wire cutting unit along the first direction or arranged at equal intervals along the first direction.
  • the corresponding multiple distance adjustment mechanisms on the single-wire cutting unit can cooperate to ensure that the multiple distance-adjusting mechanisms drive the multiple distance adjustment mechanisms of the single-wire cutting unit with the same displacement (size and direction).
  • the wire cutting wheel moves in the second direction.
  • the wire cutting device includes a first wire cutting unit and a second wire cutting unit that are arranged opposite to each other in a second direction, and at least one of the first wire cutting unit and the second wire cutting unit passes through the At least one pitch adjusting mechanism drives to move in the second direction, and is used to adjust the wire saw distance between the at least one cutting wire saw in the first wire cutting unit and the at least one cutting wire saw in the second wire cutting unit,
  • the cutting line is wound around the cutting line grooves of the multiple cutting wheels in the first line cutting unit and/or the cutting line grooves of the multiple cutting wheels in the second line cutting unit.
  • the wire cutting device includes two wire cutting units such as a first wire cutting unit and a second wire cutting unit.
  • the first wire cutting unit 21a and the second wire cutting unit 21a The units 21b are arranged parallel to each other along the first direction, and the cutting wire saws in the first wire cutting unit 21a and the second wire cutting unit 21b are also parallel.
  • the wire cutting device can be used in, for example, a silicon rod squaring equipment.
  • the silicon rods on each silicon rod carrying structure in the silicon rod squaring equipment correspond to the first cutting unit and the second cutting in the cutting area.
  • the cutting wire saw of the unit can form two parallel cutting planes on the surface of the silicon rod by one lifting and cutting.
  • the cutting amount of the silicon rod can be controlled.
  • the at least one pitch adjusting mechanism 23 can be set to be connected to the first wire cutting unit 21a or the second wire cutting unit 21b, or to be associated with the first wire cutting unit 21a and the second wire cutting unit 21b at the same time to drive
  • the multiple cutting wheels 211 in the connected or associated first wire cutting unit 21a or/and second wire cutting unit 21b move along the second direction, and adjust the connected or associated first wire cutting unit 21a or/and second wire
  • the cutting position of at least one wire saw in the cutting unit 21b or the cutting slot of the multiple cutting wheels 211 in the connected or associated first wire cutting unit 21a or/and the second wire cutting unit 21b is changed.
  • the pitch adjusting mechanism includes: a screw rod arranged in a second direction and threadedly connected to the first wire cutting unit or the second wire cutting unit; and a driving source for driving the wire The rod turns.
  • the screw rod and the driving source drive the first wire cutting unit or the plurality of cutting wheels in the second wire cutting unit to move in the second direction in a manner similar to the foregoing embodiment, and the first cutting unit is driven by the pitch adjusting mechanism
  • the second wire cutting unit can be regarded as a single wire cutting unit, which will not be repeated here. It should be understood that by providing the pitch adjustment mechanism on any wire cutting unit, the parallel cutting wire saw distance formed between the first wire cutting unit and the second wire cutting unit can be increased and decreased, and the wire cutting device is sufficient. Cut the silicon rods into different specifications.
  • the distance adjustment mechanism includes: a telescopic element, which is arranged in a second direction and is associated with the first wire cutting unit or the second wire cutting unit; and a driving source for driving the telescopic element Telescopic movement in the second direction.
  • the first cutting unit or the second wire cutting unit provided with the pitch adjusting mechanism can be regarded as a single wire cutting unit, and the specific implementation manner can refer to the foregoing embodiment, which will not be repeated here.
  • the pitch adjusting mechanism includes: a rack, which is in a second direction and is associated with the first wire cutting unit or the second wire cutting unit; a transmission gear, which meshes with the rack; The source is used to drive the transmission gear to rotate. Through the meshing transmission gear and the rack, the drive source can control the rack to move linearly along the rack direction, and the first wire cutting unit or the second wire cutting unit associated with the rack can use the tooth The strip drives the plurality of cutting wheels to move in the second direction.
  • the pitch adjusting mechanism includes: a bidirectional screw rod arranged in a second direction and threadedly connected to the first wire cutting unit and the second wire cutting unit; and a driving source for driving the The screw rod rotates to make the first wire cutting unit and the second wire cutting unit move toward or away from each other in a second direction.
  • the bidirectional screw rod 231 is a double-threaded screw rod, and both ends of the bidirectional screw rod 231 are respectively provided with threads and the thread directions are opposite.
  • the driving source 232 It can be set at either end of the bidirectional screw rod 231 to drive the bidirectional screw rod 231 to rotate along the axis of the screw rod 231.
  • the two-way screw rod 231 is driven by the driving source 232 by the threads of opposite directions at both ends of the bidirectional screw rod 231
  • the movement of the two ends of the bidirectional screw rod 231 during rotation is converted into an axial linear movement in the opposite direction, and the axial direction is the second direction in which the bidirectional screw rod 231 is set.
  • the first wire cutting unit 21a and the second wire cutting unit 21b can move toward or away from each other.
  • the pitch adjusting mechanism includes: a first rack, which is in the second direction and is associated with the first wire cutting unit; and a second rack, which is in the second direction and is associated with the second wire cutting unit Associated; transmission gear, meshed with the first and second racks; drive source, used to drive the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit along the second direction Move towards or away from each other.
  • the first rack is linked to the first wire cutting unit
  • the second rack is linked to the second wire cutting unit
  • the transmission gear is connected to a driving source such as a power output of a servo motor.
  • Shaft and meshes with the first rack and the second rack, and is used to drive the first wire cutting unit and the second wire cutting unit to move toward each other when rotating in a forward direction to perform a closing action, and rotate in a reverse direction When driving the first wire cutting unit and the second wire cutting unit to move back.
  • the first rack and the second rack can be meshed on both sides of the transmission gear, so that when the transmission gear rotates, the linear velocities at the first rack and the second rack are in opposite directions, and the drive motor drives the transmission
  • the gear rotates the first rack and the second rack move toward each other when the transmission gear rotates forward, which drives the first wire cutting unit and the second wire cutting unit to move toward each other.
  • the transmission gear is driven to rotate in the reverse direction, the first rack and the second tooth
  • the strip moves back to drive the first wire cutting unit and the second wire cutting unit to move back.
  • the transmission gear may be axially connected to the power output shaft of the driving source, or may be indirectly connected to the power output shaft, for example, the shaft is connected to the rotating part connected to the power output shaft.
  • the wire cutting device may be provided with one or more pitch adjustment mechanisms, each of which is connected to the first wire cutting unit and the second wire cutting unit, and the number of the distance adjustment mechanisms may be based on the drive
  • the power requirements, the force of the screw rod, the smoothness of the movement of the multiple cutting wheels in the drive wire cutting unit, and the equipment space of the wire cutting device are comprehensively determined. For example, when the first wire cutting unit and the second wire cutting unit are in The span in the first direction is small. Only one pitch adjustment mechanism can be used to adjust the cutting position of the cutting wire saw in the cutting unit or to change the cutting line.
  • the first wire cutting unit and the second wire cutting unit move toward or away from each other in the second direction; for another example, when the first wire cutting unit and the second wire cutting unit have a longer span in the first direction, the wire
  • the cutting unit needs to be driven by a relatively large power and needs to satisfy that the power is within the force strength range of the transmission connecting parts such as the screw rod or the rack.
  • the mechanism cooperates to ensure that the multiple pitch adjusting mechanisms drive the multiple wire cutting wheels of the first wire cutting unit and the second wire cutting unit with the same displacement amount (size and direction) to move toward or away from each other in the second direction move.
  • the pitch adjusting mechanism is a servo motor provided in the at least one wire cutting unit.
  • a servo motor is provided on at least one wire cutting unit or each wire cutting unit of the wire cutting device, and the servo motor controls the displacement of the corresponding wire cutting unit in the second direction.
  • the wire cutting unit can pre-determine the cutting offset for slot change or the adjustment amount of the cutting line to change the cutting position, and the precise positioning function of the servo motor drives the multiple cutting wheels in the wire cutting unit to a preset displacement amount Move in the second direction.
  • the wire cutting device is provided with a single wire cutting unit, and the single wire cutting unit is provided with a servo motor to drive the single wire cutting unit to move in the second direction; for another example, the wire cutting device is provided with a first The wire cutting unit and the second wire cutting unit, the first wire cutting unit or/and the second wire cutting unit are relatively independently moved in the second direction under the drive of their corresponding servo motors.
  • the servo motor can also be replaced with a traveling motor and a traveling screw, and the wire cutting unit can be driven by the traveling motor to move on the wire cutting support in the second direction.
  • the wire cutting device of silicon rod processing equipment includes at least one pitch adjustment mechanism and is arranged on at least one wire cutting unit. Under the action of the pitch adjustment mechanism, at least one of the wire cutting devices can be driven The multiple cutting wheels of a wire cutting unit move in the second direction, and at least one cutting wire saw formed around the multiple cutting wheels can thus change the cutting position in the second direction under the action of the pitch adjustment mechanism, or, Based on the movement of the plurality of cutting wheels in the second direction, the position of the cutting line around the grooves of the plurality of cutting wheels can be changed, and the process of changing the position of the cutting line or changing the groove based on the pitch adjustment mechanism is simple, easy to implement, and The operation is convenient, which is helpful to improve the operation efficiency.
  • the present application also provides a silicon rod processing equipment, which includes a base, a silicon rod bearing structure, and a wire cutting device.
  • the machine base has a silicon rod processing platform;
  • the silicon rod carrying device is arranged on the silicon rod processing platform and is used to carry the silicon rods to be cut;
  • the wire cutting device includes a cutting frame, which is arranged on the machine Seat; at least one wire cutting unit, movably installed in the cutting frame;
  • the wire cutting unit includes: a plurality of cutting wheels arranged in sequence along a first direction, each cutting wheel has at least two cutting grooves; cutting line , Sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw;
  • at least one pitch adjustment mechanism is provided on the at least one wire cutting unit, and is used to drive the plurality of cutting wheels in the at least one wire cutting unit along Move in the second direction to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit, or to change the cutting wire around the cutting grooves of the multiple cutting wheels in the
  • the silicon rod processing equipment is a silicon rod squaring equipment
  • the silicon rod supporting device is a silicon rod supporting structure.
  • the silicon rod processing platform may be provided with one or more silicon rod supporting structures, and each silicon rod supporting structure may be used to carry a single silicon rod.
  • the silicon rod processing platform in the cutting area The number of silicon rod bearing structures can correspond to the number of wire saws in the wire cutting unit of the wire cutting device.
  • a wire cutting unit 21 in the wire cutting device includes a multi-segment cutting wire saw to correspond to a plurality of silicon rod supporting structures 11 respectively.
  • the silicon rod processing platform is set on the base 10 through a worktable conversion mechanism.
  • the worktable conversion mechanism may be, for example, a rotation mechanism or a translation mechanism.
  • the rotation mechanism may include, for example, a rotation shaft and a rotation drive unit, the rotation shaft is axially connected to the silicon ingot processing platform, and the rotation drive unit drives the rotation shaft to rotate to drive the silicon ingot processing platform to rotate.
  • the translation mechanism may include, for example, a translation guide rail, a sliding block and a translation drive unit.
  • the translational guide rail is laid on the machine base, the sliding block is arranged at the bottom of the silicon ingot processing platform and is adapted to the translational guide rail to provide translational guidance for the silicon ingot processing platform, and the translational driving unit is used for driving
  • the silicon ingot processing platform moves along the translational guide rail so that the silicon ingot carrying structure on the silicon ingot processing platform is switched between the cutting area and the loading and unloading area.
  • the translation driving unit may adopt a cylinder assembly or a wire driven by a motor. Rod assembly. In other embodiments, the translation mechanism may also be geared.
  • the translation mechanism includes a translation rack and a rotating gear that is driven by a motor and adapted to the translation rack.
  • the translation gear The rail is arranged at the bottom of the silicon ingot processing platform, and may be, for example, at least one rack with a certain length.
  • each rack is fitted with at least two rotating gears arranged at intervals, and a motor The rotating gear is driven to rotate to drive the silicon ingot processing platform to move so that the silicon ingot carrying structure on the silicon ingot processing platform is switched between the cutting area and the loading and unloading area.
  • the position of the silicon rod carried by the silicon rod bearing structure in the second direction can be controlled by the translation mechanism, and the silicon rod determined by the translation mechanism
  • the position and the position of the cutting wire saw determined by the pitch adjusting mechanism of the wire cutting device can determine the cutting amount of the silicon rod; for example, when the wire cutting device is provided with a first wire cutting unit and a second wire cutting unit, The first wire cutting unit or the second wire cutting unit is provided with the pitch adjustment mechanism, and when the pitch adjustment mechanism adjusts the cutting position of at least one wire saw in the first wire cutting unit or the second wire cutting unit,
  • the translation mechanism can adjust the silicon rod position based on the adjusted cutting wire saw position until the silicon rod axis is located on the symmetry line of the cutting wire saws of the first wire cutting unit and the second wire cutting unit, because the cross section of the silicon rod is usually similar. Circular shape, so that the distance between the cutting wire saws of the first wire cutting unit and the second wire cutting unit from the center of the silicon rod cross-
  • the silicon rod squaring equipment may be, for example, the silicon rod squaring equipment of the embodiment shown in FIG. 17 or FIG. 18. Of course, it may also be other types of silicon rod squaring equipment, for example, the center line of the silicon rod squaring equipment
  • the cutting device can be set as a single-wire cutting unit; for another example, the cutting wire saw in the wire cutting unit of the wire cutting device of the silicon rod square rooting equipment is one segment. Of course, the cutting wire saw can also be two-stage, three-stage, or four-stage. Sections, etc., are not limited in this application.
  • the number of silicon ingot carrying structures on the silicon ingot processing platform can be changed accordingly; for another example, each of the wire cutting units in the wire cutting device of the silicon ingot squaring equipment
  • the number of silicon rod bearing structures corresponding to a cutting wire saw can be one, two, three, and so on.
  • the silicon rod square-cutting equipment when the silicon rod square-cutting equipment is provided with the wire cutting device described in any one of the embodiments shown in FIGS. 16 to 20, the silicon rod square-cutting equipment can be based on the
  • the at least one pitch adjusting mechanism adjusts the cutting position of the cutting wire saw to determine the cutting amount of the silicon rod, or the cutting wheel of the silicon rod square-cutting device is worn out during the long-term cutting operation, which can be based on the at least one adjustment
  • the distance mechanism changes the position of the wire groove of the cutting line to ensure the processing accuracy of the silicon rod square-out equipment to continue the square-out operation.
  • the silicon rod cutting machine when the silicon rod processing equipment is a silicon rod cutting machine, the silicon rod cutting machine includes a base, a silicon rod carrying device, and a wire cutting device.
  • the machine base has a silicon rod processing platform, and the silicon rod carrying device is arranged on the silicon rod processing platform.
  • the silicon rod carrying device can be used, for example, to horizontally carry the silicon rods to be cut;
  • the wire cutting device includes a cutting frame arranged on the machine base; at least one wire cutting unit is movably arranged on the cutting frame;
  • the wire cutting unit includes: a plurality of cutting wheels arranged in sequence along a first direction, and each cutting wheel has at least two cutting line grooves; a cutting line is sequentially wound around the plurality of cutting wheels to form at least one cutting wheel Wire saw; at least one pitch adjustment mechanism, provided on the at least one wire cutting unit, used to drive the plurality of cutting wheels in the at least one wire cutting unit to move in the second direction to adjust at least one wire in the at least one wire cutting unit The cutting position of the wire saw, or changing the cutting wire around the cutting slot of the plurality of cutting wheels in the at least one wire cutting unit.
  • the wire cutting unit in the wire cutting device moves up and down
  • the wire cutting device of the silicon rod cutting machine is provided with a plurality of parallel wire cutting units, and the plurality of parallel wire cutting units move up and down along the cutting frame, that is, in one cutting The silicon rod to be cut is cut into multiple silicon rod sections. Adjusting the cutting position of at least one cutting wire saw in the wire cutting unit in the second direction based on the at least one pitch adjusting mechanism of the wire cutting device can cut the silicon rod to be cut into silicon rod sections of different length specifications.
  • the arrangement of the wire cutting device of the silicon rod cutting machine and the form of the silicon rod carrying device can refer to the arrangement disclosed in Chinese Patent CN105196433B.
  • the wire cutting device of the silicon rod cutting machine includes The at least one pitch adjustment mechanism is used to adjust the cutting position of at least one wire saw in the at least one wire cutting unit of the silicon rod cutting machine, or to change the cutting wire around the multiple cutting wheels in the at least one wire cutting unit Trunking.
  • the silicon rod cutting machine is, for example, a double silicon rod cutting device.
  • the silicon rod carrying device of the silicon rod cutting machine is provided with a first processing station and a second processing station, To respectively carry the first silicon rod to be cut and the second silicon rod to be cut.
  • FIG. 21 shows a schematic structural diagram of the wire cutting device of the silicon rod cutting machine in an embodiment.
  • the wire cutting support 24 is provided on the cutting frame 20, and at least one wire cutting unit 21 is respectively provided on both sides of the wire cutting support 24 along the first direction, located on both sides of the wire cutting support 24 The at least one wire cutting unit 21 can respectively cut the silicon rods to be cut at the first processing station and the second processing station.
  • the wire cutting unit 21 is provided with a plurality of cutting wheels 211 and a cutting wire 213 wound around the cutting wheel 211.
  • the wire cutting unit 21 is also provided with a transition wheel 212.
  • the cutting wheel 211 has at least two cutting grooves
  • the transition wheel 212 has at least two wire grooves.
  • either side of the wire cutting support 24 further includes the at least one pitch adjusting mechanism (not shown in the figure), and the pitch adjusting mechanism can be set as the embodiment shown in FIGS. 16 to 20, for example.
  • the pitch adjustment mechanism described in any of the implementations is, for example, connected to the first wire cutting unit or the second wire cutting unit by a screw rod, or connected to the first wire cutting unit and the second wire cutting unit by a bidirectional screw rod , Or if the pitch adjusting mechanism is a servo motor, etc., it will not be repeated here.
  • the distance adjustment mechanism by using the distance adjustment mechanism, the cutting position of the at least one wire saw in the at least one wire cutting unit 21 can be adjusted, or the cutting wire 213 can be changed to cut around the plurality of cutting wheels 211 in the at least one wire cutting unit 21. Trunking.
  • the pitch adjusting mechanism When the pitch adjusting mechanism is used to adjust the position of the at least one cutting wire saw or to change the cutting wire 213 around the cutting wire groove in the cutting wheel 211, the transition wheel 212 and the cutting wheel 211 in the wire cutting unit 21 remain relatively stationary
  • the pitch adjusting mechanism may, for example, drive the cutting wheel 211 and the transition wheel 212 on the wire cutting unit 21 to move in the second direction, and the cutting wire
  • the positional relationship of the saw relative to the cutting wheel 211 and the transition wheel 212 remains unchanged, that is, the cutting position adjustment can be realized only by moving in the second direction;
  • the position of the wire groove in the wheel 211 the position of the wire groove for winding the cutting line 213 in the transition wheel 212 is also changed accordingly, that is, the wire groove and the cutting line used for winding the cutting line 213 after the cutting line 213 is changed.
  • the groove is still in the same plane.
  • the wire cutting units 21 on both sides of the wire cutting support 24 can also form at least a pair of wire cutting units 21, for example, the wire cutting units 21 on both sides of the wire cutting support 24 are in one-to-one correspondence.
  • the connection forms at least a pair of wire cutting units 21, the pair of wire cutting units 21 are located on the same straight line in the first direction, in this example, based on the same pitch adjustment mechanism can drive the pair of wire cutting units 21
  • the plurality of cutting wheels 211 move in the second direction.
  • the pair of wire cutting units 21 can also be driven by a plurality of pitch adjustment mechanisms.
  • the specific form of the silicon rod cutting machine is not limited to the foregoing embodiment.
  • each of the silicon rod cutting machine The cutting wire saw can cut multiple silicon rods at the same time; another example is that the wire cutting device of the silicon rod cutting machine only includes a cutting wire saw, and the cutting wire saw is used to cut a single or multiple silicon rods.
  • the silicon rod cut in one cutting operation during cutting is divided into a silicon rod section; this application is not limited, it should be noted that the wire cutting device of the silicon rod cutting machine includes at least one pitch adjustment mechanism, which can be used The plurality of cutting wheels in the at least one wire cutting unit of the driving wire cutting device are moved along the second direction to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit, or to change the cutting wire around the at least one wire cutting The cutting grooves of multiple cutting wheels in the unit.
  • the silicon rod processing equipment is an integrated silicon rod cutting and grinding machine.
  • the silicon rod cutting and grinding integrated machine includes a base, a silicon rod carrying device, a wire cutting device, and a grinding device.
  • the machine base has a silicon rod processing platform, and in the silicon rod cutting and grinding integrated machine, the silicon rod processing platform can be set as a processing location that performs different processing functions, for example, is composed of a cutting station and a grinding station .
  • the silicon rod carrying device is used to carry the silicon rods to be processed.
  • the wire cutting device includes a cutting frame arranged on the machine base; at least one wire cutting unit is movably arranged on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged in sequence along a first direction, each One cutting wheel has at least two cutting line grooves; the cutting line is sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw; at least one pitch adjustment mechanism is provided on the at least one wire cutting unit for Driving the plurality of cutting wheels in the at least one wire cutting unit to move in the second direction to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit, or to change the cutting wire around the at least one wire cutting unit Cutting grooves for multiple cutting wheels.
  • the silicon rod cutting and grinding integrated machine includes a machine base with a silicon rod processing platform;
  • the silicon rod in the first processing area of the silicon rod is cut in the first direction and the silicon rod in the second processing area of the silicon rod processing platform is cut in the second direction to form a square silicon rod;
  • the grinding device is arranged at The machine base is used to grind and chamfer the square silicon rods on the third processing position of the silicon rod processing platform;
  • a silicon rod conversion device is provided on the silicon rod processing platform, It is used for converting the silicon rods in the first processing location, the second processing location and the third processing location.
  • the wire cutting device includes: a cutting frame 20, a wire cutting support 24, a first cutting unit group, and a second cutting unit group, and the first cutting unit group and the second cutting unit group are used to respectively align The silicon rods in the first processing area and the second processing area are cut.
  • the wire cutting support 24 can be configured with the first cutting unit group and the second cutting unit group, that is, the first cutting unit group and the second cutting unit group share the wire cutting support 24. Therefore, in this embodiment, on the one hand, the cutting frame 20 and the wire cutting support 24 in the wire cutting device are arranged in a middle position between the first processing position and the second processing position. On the other hand, the wire cutting support 24 is specially designed. As shown in FIG. 22, the wire cutting support 24 in this embodiment may include a support main body and a first support side wing and a second support side wing located on opposite sides of the support main body.
  • the support body in the wire cutting support 24 is arranged at 45° to the X axis or the Y axis, and the first support side wing and the support body form an angle of 145° along the Y axis.
  • the angle between the side wings of the second support and the main body of the support is 145° and is arranged along the X axis.
  • the first cutting unit group may include at least four first cutting wheels 211a, and the four first cutting wheels 211a may be combined into a pair of first cutting wheel groups, that is, arranged oppositely along the X axis
  • the two first cutting wheels 211a form a first cutting wheel set
  • the two first cutting wheel sets along the Y axis form a pair of first cutting wheel sets, that is, two parallel first cutting wheel sets are formed along the X direction.
  • the cutting wire 213 is sequentially wound around each first cutting wheel set in the first cutting unit group to form a cutting wire net.
  • the cutting line 213 is sequentially wound around the four first cutting wheels 211a in the first cutting unit group to form two cutting wire saws.
  • the two cutting wire saws are arranged along the X axis and mutually Parallel to form a cutting line network.
  • the cutting line 213 is wound around two first cutting wheels 211a arranged along the X axis in a first cutting wheel set to form a cutting wire saw, and the cutting line 213 is wound around another first cutting wheel set.
  • the two first cutting wheels 211a arranged along the X-axis direction form another cutting wire saw.
  • the second cutting unit group may include at least four second cutting wheels 211b.
  • Two second cutting wheels 211b are arranged opposite to each other along the Y axis to form a second cutting wheel group.
  • the two second cutting wheel sets form a pair of second cutting wheel sets, that is, two parallel wire cutting units 21 arranged in the Y direction;
  • the four second cutting wheels 211b in the unit group form two cutting wire saws.
  • the two cutting wire saws are arranged along the Y-axis direction and are parallel to each other.
  • the silicon rod conversion device is provided in the center area of the silicon rod processing platform, and is used to place the silicon rods on the waiting area, the first processing area, and the second processing area on the silicon rod processing platform. , And the conversion between the third processing zone.
  • the silicon rod conversion device is rotatably arranged on the silicon rod processing platform, and the silicon rod conversion device may further include: a conveying body, which is in the shape of a disc, a square disc, or other similar shapes; and is arranged on the conveying body
  • the silicon rod positioning mechanism ie silicon rod bearing device
  • the conversion drive mechanism is used to drive the conveying body to rotate to drive the silicon rod positioning mechanism to switch positions.
  • the silicon rod positioning mechanism further includes a rotating structure for driving the silicon rod carried on the silicon rod positioning mechanism to rotate along the silicon rod axis to adjust the cutting surface of the silicon rod.
  • the silicon rod to be cut is moved from the first cutting line in the X-axis direction of the wire cutting device at the first processing area.
  • the net is cut to form two axial cut planes along the X axis; then, the conversion drive mechanism drives the conveying body to drive the silicon rod positioning mechanism to position the silicon rods to the second processing position, which is formed by the wire cutting device along the Y axis direction.
  • the wire cutting device further includes at least one pitch adjustment mechanism (not shown in the figure).
  • the The first cutting unit group and the second cutting unit group at the second processing location include at least one pitch adjustment mechanism, which is provided on at least one wire cutting unit in the corresponding cutting unit group, and is used to drive the at least one wire cutting unit A plurality of cutting wheels in the cutting wheel group move along the second direction.
  • the first direction and the second direction are defined based on the carrier coordinate system of the wire cutting unit. Therefore, when the silicon rod processing equipment (in this example, the silicon rod cutting and grinding integrated machine), the direction of multiple wire cutting units Different, the first directions corresponding to the multiple wire cuttings are not the same direction in the external space; correspondingly, the second direction is orthogonal to the first direction, therefore, the driving movement direction performed by the at least one pitch adjustment mechanism It is the orthogonal direction relative to the driven wire cutting unit.
  • the wire cutting unit and the cutting wire saw are arranged along the X axis direction, the first direction in the first cutting unit group is the X axis direction, and the second direction is the Y axis direction;
  • the wire cutting unit and the cutting wire saw are arranged along the Y axis direction, and the first direction in the second cutting unit group is the Y axis direction, and the second direction is the X axis direction.
  • the pitch adjustment mechanism can be associated with the first wire cutting unit or the second wire cutting unit of the two wire cutting units, or both
  • the pitch adjusting mechanism can be configured as the pitch adjusting mechanism described in any implementation of the embodiment shown in FIGS. 16 to 20, for example, a screw rod and a second A wire cutting unit or a second wire cutting unit is connected, another example is connected to the first wire cutting unit and the second wire cutting unit by a bidirectional screw rod, or the pitch adjusting mechanism is a servo motor, etc., which will not be repeated here.
  • the first wire cutting unit Or/and the second wire cutting unit when the at least one pitch adjusting mechanism drives the plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit to move in the second direction, the first wire cutting unit Or/and the second wire cutting unit, for example, can move along the flanks of the first support, that is, along the second direction (Y-axis direction) in the first cutting unit group; it can be used to adjust the first wire cutting unit or/and the first cutting unit group.
  • the structure of the second cutting unit group is similar to that of the first cutting unit group.
  • the main difference is that the arrangement position and direction are different in the silicon rod cutting and grinding integrated machine; but in the second cutting unit group, it is used to drive the first wire.
  • the structure and function of the at least one pitch adjusting mechanism in which the cutting unit or/and the plurality of cutting wheels in the second wire cutting unit move in the second direction are similar to the first cutting unit group, and will not be repeated here.
  • the positional relationship between the first processing location and the second processing location can be changed.
  • the first processing location and the second processing location are set as the silicon rod conversion device carrying the silicon rod to rotate. 60° can switch between the two processing positions, and the direction of the wire cutting unit in the corresponding first cutting unit group and the second cutting unit group may also change.
  • the first cutting unit group and The wire cutting units of the second cutting unit group respectively correspond to the first direction change, but the position adjustment or slot change of the cutting wire saw can still be achieved by at least one pitch adjustment mechanism in the cutting unit group;
  • the different processing stations in the integrated silicon rod cutting and grinding machine include, for example, only single-wire cutting units; in some embodiments, the integrated silicon rod cutting and grinding machine is provided with, for example, only one station for cutting processing.
  • the positional relationship between the multiple cutting wheels in the related wire cutting device is not easily changed after installation. After one of the wire cutting wheels is worn out, the position of the cutting wheel or other parts needs to be changed as a whole. The parts to adjust the position need to be further calibrated, the operation is cumbersome and the efficiency is low.
  • the present application also provides a wire cutting device for silicon ingot processing equipment.
  • the silicon ingot processing equipment includes a base with a silicon ingot processing platform; and a silicon ingot carrier device, which is arranged on the silicon ingot processing platform,
  • the wire cutting device is used to carry the silicon rods to be cut;
  • the wire cutting device includes: a cutting frame arranged on the machine base; at least one wire cutting unit is movably arranged on the cutting frame;
  • the wire cutting unit includes: A plurality of cutting wheels arranged in sequence, each cutting wheel has at least two cutting grooves; at least one transition wheel, each transition wheel has a wire groove; the cutting line is wound around the plurality of cutting wheels and
  • the transition wheel is used to form at least one cutting wire saw; at least one shift mechanism is used to drive the at least one transition wheel to move in the second direction, so that the current wire groove that is cut and wound in the at least one transition wheel is in the second Moving in the direction from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to
  • the high-speed running steel wire drives the cutting blade material attached to the steel wire or directly uses the diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting.
  • the steel wire or diamond wire is guided by the transition wheel to form a wire saw or a wire net on the cutting wheel, and the workpiece to be processed is realized by the rise and fall of the worktable or the rise and fall of the wire saw or the wire net.
  • the feed of the workpiece In the long-term cutting operation, the cutting wire groove of the cutting wheel and the wire groove of the transition wheel are inevitably worn out, which affects the positioning accuracy of the cutting wire, which leads to the need to change the groove.
  • the wire cutting device includes at least one wire cutting unit, and a plurality of cutting wheels in the wire cutting unit are arranged along a first direction, that is, the planes where the cutting grooves of the plurality of cutting wheels are parallel In the first direction, for any one of the plurality of cutting wheels, there is an offset in the second direction between different cutting line grooves; the at least one displacement mechanism can be used to drive at least one transition wheel relative to the line
  • the cutting unit moves in the second direction to move the current wire groove cut and wound in the transition wheel in the second direction from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel .
  • first wire groove also referred to as the first cutting wire groove in this application
  • second wire groove also referred to as the second cutting wire groove in this application
  • the cut and wound wire grooves before and after the displacement mechanism is driven to move in the wheel respectively correspond to the cutting grooves of the cutting wheel.
  • the number of cutting grooves of the cutting wheel is not limited to two.
  • the first wire The groove and the second wire groove need not be adjacent cutting wire grooves on the cutting wheel, but only when they are different cutting wire grooves.
  • the silicon rod processing equipment to which the wire cutting device is applied can be silicon rod square-out equipment, silicon rod cutting equipment, silicon rod cutting and grinding integrated equipment, etc.
  • the wire cutting of this application is applied to silicon rods.
  • the prescription equipment is taken as an example for description, but it is not used to limit the application scenarios of the wire cutting device of this application.
  • FIG. 23 shows a schematic structural diagram of the wire cutting device of this application in an embodiment
  • FIG. 17 shows that the wire cutting device of this application is applied to a silicon rod in an embodiment.
  • the wire cutting device includes a cutting frame 20 and at least one wire cutting unit 21.
  • the cutting frame 20 is installed on the machine base.
  • the cutting frame 20 is installed on both ends of the machine base to ensure the cutting line formed on the wire cutting unit 21 of the cutting frame 20.
  • the saw can cover different processing stations.
  • the cutting frame 20 is a column arranged at both ends of the base, and in the silicon rod square-out equipment, a plurality of silicon rods are provided on the base. Structure, the span of the wire cutting unit 21 includes each silicon rod carrying structure in the cutting area.
  • the wire cutting unit 21 includes a plurality of cutting wheels 211, at least one transition wheel 212, a cutting wire 213, and at least one displacement mechanism 215.
  • the wire cutting unit 21 includes a first-direction mounting beam 214, and both ends of the mounting beam 214 are movable. Connected to the cutting frame 20, a plurality of cutting wheels 211 are sequentially arranged on each mounting beam 214. That is, the one-line cutting unit 21 is composed of a plurality of cutting wheels 211, a cutting line 213, and a supporting structure of the cutting wheel 211 arranged in the same direction (or the same straight line); the plurality of cutting wheels 211 are arranged along the direction in which the mounting beam 214 is arranged. It is the wheel surface of the cutting wheel 211 (or the plane where the cutting line groove is located) along the direction of the mounting beam 214 (that is, the first direction).
  • the wire cutting device when the wire cutting device is provided with a plurality of wire cutting units 21, different wire cutting units 21 are located on different straight lines, as shown in FIG. 23, the two wire cutting units 21 are parallel respectively, In some examples, the extension directions of different wire cutting units 21 may also intersect.
  • the first direction is the direction in which the multiple cutting wheels 211 in the wire cutting unit 21 are set, for example, the direction of the wire cutting unit 21 in some examples.
  • the cutting wire saw formed by the cutting wire 213 around the cutting wheel 211 is also the first direction;
  • the second direction is the orthogonal direction of the first direction, and the at least one pitch adjusting mechanism drives the at least one A wire cutting unit 21 moves in the second direction, that is, the cutting wire saw in the wire cutting unit 21 moves in its orthogonal direction.
  • the at least one transition wheel 212 is used to realize direction guidance or tension adjustment when the cutting line 213 is wound around different cutting wheels 211.
  • a wire cutting unit 21 is taken as an example for description.
  • the wire cutting unit 21 includes at least one transition wheel 212, and the at least one transition wheel 212 can be movably disposed on a carrier that carries a plurality of cutting wheels 211.
  • the plurality of cutting wheels 211 need to be attached to the carrier provided by the wire cutting unit 21.
  • the plurality of cutting wheels 211 belonging to the same wire cutting unit 21 are installed in the installation along the first direction.
  • the two ends of the mounting beam 214 can be movably connected to the cutting frame 20, and each mounting beam 214 is provided with a plurality of cutting wheels 211 in sequence. That is, the one-line cutting unit 21 is composed of a plurality of cutting wheels 211 arranged in the same direction (or the same straight line), a cutting line 213, and a mounting beam 214 on which the cutting wheels 211 are arranged.
  • the multiple cutting wheels 211 in the wire cutting unit 21 are installed on the cutting frame 20 through a mounting frame, a connecting plate, or a frame.
  • the wire cutting unit 21 provides The carriers of the plurality of cutting wheels 211 may be in different forms, which are not limited in this application.
  • a plurality of cutting wheels 211 in the same wire cutting unit 21 are arranged on a mounting beam 214, and the mounting beam 214 is arranged along the first direction and arranged on the at least one displacement mechanism.
  • the positioning mechanism 215 controls the displacement of the transition wheel 212, which can realize that the current wire groove cut and wound in the at least one transition wheel 212 moves in the second direction from the first wire groove corresponding to the cutting wheel 211 to corresponding The second wire groove of the cutting wheel 211.
  • changing the position of the cutting groove corresponding to the wire groove of the at least one transition wheel 212 can realize the slot change of the cutting line 213 on the cutting wheel 211 without adjusting the transition wheel 212, which can effectively simplify Change slot operation.
  • the process of changing the groove can be completed under the condition that the wire groove wound by the cutting wire 213 does not change.
  • the transition wheel 212 is a single wire groove transition wheel 212.
  • the at least one transition wheel is detachably provided in the wire cutting unit.
  • the transition wheel can be set as a replaceable transition wheel, for example, the axle corresponding to the transition wheel is provided in the wire cutting unit, and the tread of the transition wheel is detachably sleeved on the transition wheel corresponding
  • the transition wheel tread can be set as a consumable transition wheel made of plastic material. After the transition wheel is worn out in use, the transition wheel can be disassembled and replaced with a new one.
  • transition wheel can also be integrally detachably provided on the transition wheel support of the online cutting unit,
  • the material of the transition wheel can also be rubber or similar materials, which is not limited in this application.
  • the transition wheel when the transition wheel is a consumable transition wheel, the transition wheel can be set as a single wire groove transition wheel.
  • the transition wheel can also be configured as a transition wheel with at least two wire grooves.
  • the number of wire grooves in the transition wheel can be determined based on the positional relationship between the transition wheel and the cutting wheel and the winding method of the cutting line.
  • the wire wheel is set such that the projection of the plane where the wire groove is located on the horizontal plane is along the first direction, There is a second direction transition offset between different wire grooves.
  • the transition offset between adjacent wire grooves in the transition wheel is equal to the cutting offset between adjacent cutting line grooves in the cutting wheel; in this example, the cutting wheel and The wire wheel on-line cutting unit can be set in the form of a one-to-one correspondence between the wire groove and the cutting wire groove (the correspondence means that the cutting wire groove and the wire groove are coplanar), and the number of wire grooves of the transition wheel is equal to the number of cutting wheels. Can not wait.
  • the wire cutting unit can be configured in different forms.
  • this application provides The wire cutting unit is applied to the following embodiments in the silicon rod square-making equipment:
  • a plurality of cutting wheels belonging to the same wire cutting unit form at least two cutting wheel groups in a paired manner, and there are two adjacent cutting wheel groups in the two adjacent cutting wheel groups.
  • There is a transition wheel the cutting line is wound on the cutting wheel and the transition wheel in sequence to form a cutting wire saw between the two cutting wheels in each cutting wheel group, wherein the cutting line is wound around
  • two adjacent cutting wheels in the two adjacent cutting wheel groups are passed through the cutting line groove of the cutting wheel behind in the previous cutting wheel group, they pass through the wire groove of the transition wheel and then pass into the next one.
  • the cutting groove of the cutting wheel in front of the cutting wheel group.
  • FIG. 18 shows a schematic diagram of the wire cutting device of this application applied to a silicon rod square-out device in an embodiment
  • FIG. 19 shows a wire cutting unit in the wire cutting device.
  • the wire cutting unit 21 in the wire cutting device is provided with 4 cutting wheel sets.
  • a transition wheel 212 is provided between two adjacent cutting wheel sets.
  • the cutting line 213 is wound on the cutting wheel 211 and the transition wheel 212 in sequence to connect the two cutting wheels of each cutting wheel set.
  • a cutting wire saw is formed on the 211, wherein the cutting wire 213 is wound by the cutting wheel 211 of the previous cutting wheel group when it is wound around the two adjacent cutting wheels 211 of the two adjacent cutting wheel groups.
  • the cutting line groove of ⁇ is passed into the cutting line groove of the preceding cutting wheel 211 in the next cutting wheel group.
  • every two adjacent cutting wheel sets share the same transition wheel 212 for guiding, which can reduce the length of the cutting line 213 used for tension adjustment and guiding, so that the cutting line 213 is used to form the cutting of the cutting wire saw.
  • the length ratio of the wire 213 is increased, while simplifying the winding method, the utilization rate of the cutting wire 213 is improved, and the production cost is reduced.
  • any cutting wire saw can be used to correspond to 1 (the embodiment shown in Figure 18), 2, 3, 4, etc. silicon rods.
  • the silicon rod bearing structure is cut.
  • the number of silicon rod bearing structures corresponding to each cutting wire saw can be selected according to the actual situation , In order to stabilize the processing quality.
  • the multiple cutting wheels 211 belonging to the same wire cutting unit 21 include a first cutting wheel 211, a tail cutting wheel 211, and the first cutting wheel 211 and the tail cutting wheel 211.
  • At least one intermediate cutting wheel 211 between the at least one intermediate cutting wheel 211 is also provided with a transition wheel 212 on the side of the at least one intermediate cutting wheel 211, the transition wheel 212 has at least two wire grooves, the cutting wire 213 is sequentially wound around
  • the cutting wheel 211 and the transition wheel 212 are used to form a cutting wire saw on any two adjacent cutting wheels 211, wherein when the cutting wire 213 is wound around the middle cutting wheel 211, the cutting wire 213 is cut by the middle cutting wheel 211
  • One of the at least two cutting grooves on the wheel 211 passes through and passes through the transition wheel 212 on the side by the other of the at least two cutting grooves on the intermediate cutting wheel 211.
  • the cutting offset corresponds
  • the transition wheel and the at least one displacement mechanism can be directly connected or indirectly connected.
  • each of the transition wheels is provided on a bracket, and the bracket moves along the second direction with the transition wheel through the at least one displacement mechanism.
  • the wire cutting unit is provided with a bracket for carrying the transition wheel, the bracket is movably arranged on the mounting beam of the wire cutting unit, and the bracket is driven by the at least one shift mechanism Moving in the second direction, the transition wheel provided on the support follows the support to move in the second direction relative to the mounting beam.
  • FIG. 24 shows a schematic diagram of the structure of the transition wheel and the bracket in an embodiment of the wire cutting device of the present application.
  • the bracket 2121 used to set the transition wheel 212 can be set as a triangular bracket or a truss structure, of course, the bracket 2121 can also be set as other structures such as a vertical bearing plate, etc.
  • the transition wheel 212 It is rotatably arranged on the bracket 2121. When the at least one displacement mechanism drives the bracket 2121 to move in the second direction, the transition wheel 212 carried by the bracket 2121 can be driven to follow the movement.
  • the at least one transition wheel is equipped with mutually independent shift mechanisms, and each transition wheel is driven by a corresponding shift mechanism to move in the second direction; or, the at least one transition wheel
  • the brackets are connected together by connecting beams, and the connecting beams move along the second direction with the at least one transition wheel through the at least one displacement mechanism.
  • each of the at least one transition wheel may be configured with a shift mechanism to independently drive the corresponding transition wheel to move in the second direction, and the shift mechanism may be connected to the transition wheel support; for example,
  • the brackets of the at least one transition wheel are connected together by a connecting beam, and the specific form of the connecting beam is not limited by the beam structure.
  • the connecting beam may be a beam body, a truss structure, a frame structure, etc., and the connecting beam Only when the brackets of the different transition wheels in the wire cutting unit are connected, the at least one displacement mechanism drives the connecting beam to move in the second direction, and each transition wheel and its relative fixed by the connecting beam can be realized.
  • the corresponding support follows the connecting beam to move in the second direction.
  • the shifting mechanism is used to drive the at least one transition wheel to move in the second direction, and at the same time, the shifting mechanism can also movably set the at least one transition wheel in the wire cutting unit .
  • the displacement mechanism includes: a displacement guide rail arranged along the second direction; and a power source for driving the at least one transition wheel to move along the displacement guide rail.
  • FIG. 25 shows a schematic diagram of the enlarged structure at C in FIG. 23.
  • the displacement guide rail 2151 can be arranged on the mounting beam, for example, and used to carry the transition wheel 212 so that the transition wheel 212 is driven by the power source along the guide rail. Move; or used to carry the transition wheel bracket 2121 or the connecting beam 2122 connected to each transition wheel bracket 2121, correspondingly, the power source can drive the transition wheel 212 on the bracket 2121 or the connecting beam 2122.
  • the transition wheel 212, the bracket 2121 or the connecting beam 2122 can be provided on the shift guide rail 2151 through a sliding block, for example, under the action of a power source, the transition wheel 212 carried on the shift guide rail 2151
  • the bracket 2121 or the connecting beam 2122 can be displaced in the second direction under the restriction of the displacement guide 2151.
  • the shift mechanism corresponds to a transition wheel
  • the power source corresponds to the transition wheel provided on the driving shift guide rail
  • the shift guide rail is correspondingly provided with the connecting beam
  • the number of the displacement guide rails can be one, two, three, etc. In actual scenes, the displacement can be determined comprehensively based on factors such as the span length of the connecting beam and the total weight of the connecting beam and the transition wheel carried by it. Number of rails.
  • the power source is a cylinder assembly, including a cylinder or a hydraulic pump, and a telescopic rod; wherein the telescopic rod is connected to the bracket of the transition wheel or the connecting beam.
  • the telescopic rod is arranged in the second direction, one end of the telescopic rod is connected to the cylinder or the hydraulic pump, and the other end, the free end, is connected to the bracket of the transition wheel or the connecting beam.
  • the end is driven by a cylinder or a hydraulic pump to expand and contract, that is, move forward or backward in the second direction, thereby driving the transition wheel bracket or the connecting beam connected to the free end to advance or retreat in the second direction.
  • the position of the wire groove of the transition wheel corresponding to the wheel bracket or the connecting beam thus moves relative to the cutting groove in the second direction.
  • the current wire groove of is moved in the second direction from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel.
  • the power source includes: a screw rod and a driving source; wherein the screw rod is connected to the bracket of the transition wheel or the connecting beam.
  • the screw rod is arranged in the second direction, one end of the screw rod is connected to the driving source to rotate along the screw shaft under the driving of the driving source, and the other end of the screw rod is screwed to the transition wheel support or
  • the connecting beam is used to convert the rotation driven by the driving source into a linear motion along the setting direction of the threaded rod by the threaded rod, and the transition wheel support or the connecting beam is driven by the threaded rod to move along the shift guide rail.
  • one end of the screw rod is connected to the driving source, and the other end is connected to the transition wheel bracket or the connecting beam, and the screw rod is driven by the driving source to move in the second direction, for example, the screw rod is connected to
  • the cylinder piston rod is also connected to other mechanisms that can generate linear motion.
  • the screw rod is driven by the driving source to linearly move in the second direction and drives the bracket or connecting beam of the connected transition wheel to move in the second direction.
  • the at least one transition wheel can move in the second direction under the action of the at least one shift mechanism, and by controlling the moving distance of the at least one transition wheel, the at least one transition wheel can be cut and wound.
  • the current wire groove moves in the second direction from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel, so that the cutting wheel can be changed grooves, and there is no need to switch grooves. Transitional slot changing and calibration are performed, and the slot changing process is simplified.
  • the wire cutting device further includes: at least one pitch adjustment mechanism, which is provided on the at least one wire cutting unit, and is used to drive the plurality of cutting wheels in the at least one wire cutting unit along the second direction. Move to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit, or to change the cutting wire around the cutting grooves of the multiple cutting wheels in the at least one wire cutting unit.
  • at least one pitch adjustment mechanism which is provided on the at least one wire cutting unit, and is used to drive the plurality of cutting wheels in the at least one wire cutting unit along the second direction. Move to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit, or to change the cutting wire around the cutting grooves of the multiple cutting wheels in the at least one wire cutting unit.
  • the wire cutting device can switch the cutting wire between different cutting grooves of the cutting wheel based on the at least one pitch adjustment mechanism, or adjust the position of the cutting wire saw to change the cutting position (or processing specification) relative to the silicon rod .
  • the wire cutting unit 21 can be provided on the cutting frame 20 by a wire cutting support 24, the wire cutting support 24 is provided on the cutting frame 20 and includes a guide rail arranged along the second direction
  • the wire cutting unit 21 is provided on the guide rail of the wire cutting support 24 to form a degree of freedom of movement in the second direction; of course, the wire cutting support 24 can also be provided with a guide groove in the second direction,
  • the second-direction sliding rod or other second-direction limiting structure or guiding structure is used to set the at least one wire cutting unit 21, which is not limited in this application.
  • the at least one pitch adjusting mechanism 23 adjusts the position of the wire cutting unit 21 in the second direction on the wire cutting support 24 by this.
  • the wire cutting device can realize the cutting processing of the silicon rod based on the lifting movement of the wire cutting unit 21 along the cutting frame 20, and the control of the cutting specification is achieved by adjusting the relative position between the cutting wire saw and the silicon rod in the second direction. . 17 and 26 in combination, when the silicon rod is placed on the silicon rod carrying structure, the position is fixed, and the at least one wire cutting can be adjusted by moving the cutting wire saw in the second direction through the pitch adjusting mechanism 23
  • the cutting position of at least one wire saw in the unit 21 can be used to control the cutting amount of the silicon rod. Or, by adjusting the position of the cutting wheel carried by the wire cutting unit 21 in the second direction, the cutting line can be changed and the position of the cutting wire saw in the second direction before and after the change is controlled.
  • the wire cutting device includes a single wire cutting unit
  • the pitch adjusting mechanism includes: a screw rod arranged in a second direction and threadedly connected to the single wire cutting unit; and a driving source for driving the single wire cutting unit. The screw rotates.
  • the single wire cutting unit is a wire cutting unit
  • the single wire cutting unit in the wire cutting device includes a plurality of cutting wheels arranged along a first direction, and the cutting wire is wound around the plurality of cutting wheels to form at least one cutting Wire saw, and the at least one cutting wire saw is along the same straight line direction.
  • the screw rod of the pitch adjusting mechanism has a distal end and a proximal end.
  • the proximal end of the screw rod can be connected to a driving source and rotated under the driving of the driving source, and the distal end of the screw rod is threadedly connected to the
  • the single-wire cutting unit by means of the connection between the two ends of the screw, the screw can rotate based on the drive source transmission and convert the rotation of the screw into an axial displacement by means of a threaded connection.
  • the axial displacement direction is the setting direction of the screw.
  • the second direction; the single-wire cutting unit can be displaced in the second direction by driving the lead screw in the pitch adjusting mechanism, and the single-wire cutting unit can be displaced in the second direction when the lead screw is driven to rotate in a different direction Forward or backward.
  • the wire cutting device includes a single wire cutting unit; the pitch adjusting mechanism includes: a telescopic member arranged in a second direction and associated with the single wire cutting unit; a driving source for driving the telescopic The piece telescopically moves in the second direction.
  • the telescopic element may be configured as a rod structure and the extension direction of the rod is the second direction.
  • the telescopic element can telescopically move along its extension direction under the driving of a driving source, and one end of the telescopic element may be connected to the driving source,
  • the retractable free end is associated with the single wire cutting unit, and can drive the single wire cutting to move in the second direction under the action of a driving source.
  • the telescopic member is, for example, an electric telescopic rod, or a connecting rod connected to the cone rod of the cylinder, and the cylinder can be used as a driving source, which is not limited in this application.
  • the manner in which the telescopic rod is connected to the single-wire cutting unit may be linear connection or indirect connection, for example, it may be directly connected to the single-wire cutting unit mounting beam, or indirectly connected to the single-wire cutting unit through a support or a bearing. It should be understood that the expansion or contraction of the telescopic element corresponds to the advancement or retreat of the single-wire cutting unit in the second direction.
  • the association may be realized by one or more of engagement, screw locking, bonding, and welding.
  • the telescopic rod may be The wire cutting unit is associated by one or more of snapping, screw locking, bonding, and welding; of course, the realization of the association is not limited to this, but is intended to be in the second direction The transmission.
  • the wire cutting device includes a single wire cutting unit; the pitch adjusting mechanism includes: a rack arranged on the single wire cutting unit along a second direction; a transmission gear meshing with the rack; and driving The source is used to drive the transmission gear to rotate.
  • the transmission gear is driven by the drive source to rotate, and the rack meshed with the transmission gear moves in the direction of the rack step accordingly.
  • the drive source can be moved by matching the rack and the transmission gear.
  • the rotational movement of the drive is transformed into a line conveying along the direction of the rack, and the rack is provided in the single-wire cutting unit along the second direction, which can drive the single-wire cutting unit to move in the second direction.
  • the rotation direction of the transmission gear is controlled by the driving source to switch the displacement direction of the single-wire cutting unit forward or backward in the second direction.
  • the pitch adjustment mechanism may be set to one or more.
  • the single wire cutting unit has a large span in the first direction, it is difficult to drive the single wire by setting a pitch adjustment mechanism.
  • multiple pitch adjustment mechanisms can be set to drive.
  • the single-wire cutting unit is provided with a distance adjustment structure at both ends of the single-wire cutting unit along the first direction or arranged at equal intervals along the first direction.
  • the corresponding multiple distance adjustment mechanisms on the single-wire cutting unit can cooperate to ensure that the multiple distance-adjusting mechanisms drive the multiple distance adjustment mechanisms of the single-wire cutting unit with the same displacement (size and direction).
  • the wire cutting wheel moves in the second direction.
  • the wire cutting device includes a first wire cutting unit and a second wire cutting unit that are arranged opposite to each other in a second direction, and at least one of the first wire cutting unit and the second wire cutting unit passes through the
  • the at least one pitch adjusting mechanism drives to move in the second direction, and is used to adjust the wire saw distance between the at least one cutting wire saw in the first wire cutting unit and the at least one cutting wire saw in the second wire cutting unit , Or change the cutting line around the cutting line grooves of the multiple cutting wheels in the first line cutting unit and/or the cutting line grooves of the multiple cutting wheels in the second line cutting unit.
  • the wire cutting device includes two wire cutting units such as a first wire cutting unit and a second wire cutting unit, for example, in the embodiment shown in FIG. 23, the first wire cutting unit and the second wire cutting unit They are arranged parallel to each other along the first direction, and the cutting wire saws in the first wire cutting unit and the second wire cutting unit are also parallel to each other.
  • the wire cutting device can be used in, for example, a silicon rod squaring equipment.
  • the silicon rods on each silicon rod carrying structure in the silicon rod squaring equipment correspond to the first cutting unit and the second cutting in the cutting area.
  • the cutting wire saw of the unit can form two parallel cutting planes on the surface of the silicon rod by one lifting and cutting.
  • the cutting amount of the silicon rod can be controlled.
  • the at least one pitch adjusting mechanism can be set to be connected to the first wire cutting unit or the second wire cutting unit, or to associate the first wire cutting unit and the second wire cutting unit at the same time, so as to drive the connected or associated The plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit move in the second direction, and realize the adjustment of at least one wire saw in the connected or associated first wire cutting unit or/and the second wire cutting unit Cutting position, or changing the cutting line grooves of multiple cutting wheels in the connected or associated first wire cutting unit or/and second wire cutting unit.
  • the pitch adjusting mechanism includes: a screw rod arranged in a second direction and threadedly connected to the first wire cutting unit or the second wire cutting unit; and a driving source for driving the wire The rod turns.
  • the screw rod and the driving source drive the first wire cutting unit or the plurality of cutting wheels in the second wire cutting unit to move in the second direction in a manner similar to the foregoing embodiment, and the first cutting unit is driven by the pitch adjusting mechanism
  • the second wire cutting unit can be regarded as a single wire cutting unit, which will not be repeated here. It should be understood that by providing the pitch adjustment mechanism on any wire cutting unit, the parallel cutting wire saw distance formed between the first wire cutting unit and the second wire cutting unit can be increased and decreased, and the wire cutting device is sufficient. Cut the silicon rods into different specifications.
  • the distance adjustment mechanism includes: a telescopic element, which is arranged in a second direction and is associated with the first wire cutting unit or the second wire cutting unit; and a driving source for driving the telescopic element Telescopic movement in the second direction.
  • the first cutting unit or the second wire cutting unit provided with the pitch adjusting mechanism can be regarded as a single wire cutting unit, and the specific implementation manner can refer to the foregoing embodiment, which will not be repeated here.
  • the pitch adjusting mechanism includes: a rack, which is in a second direction and is associated with the first wire cutting unit or the second wire cutting unit; a transmission gear, which meshes with the rack; The source is used to drive the transmission gear to rotate. Through the meshing transmission gear and the rack, the drive source can control the rack to move linearly along the rack direction, and the first wire cutting unit or the second wire cutting unit associated with the rack can use the tooth The strip moves to move in the second direction.
  • the pitch adjusting mechanism includes: a bidirectional screw rod arranged in a second direction and threadedly connected to the first wire cutting unit and the second wire cutting unit; and a driving source for driving the The screw rod rotates to make the first wire cutting unit and the second wire cutting unit move toward or away from each other in a second direction.
  • the two-way screw is a double-threaded screw, the two ends of the two-way screw are respectively provided with threads and the thread directions are opposite, and the driving source can be arranged at either end of the two-way screw. Drive the two-way screw to rotate along the screw shaft.
  • the axial direction is the second direction in which the bidirectional screw rod is set.
  • the first wire cutting unit and the second wire cutting unit can move toward or away from each other.
  • the pitch adjusting mechanism includes: a first rack, which is in the second direction and is associated with the first wire cutting unit; and a second rack, which is in the second direction and is associated with the second wire cutting unit Associated; transmission gear, meshed with the first and second racks; drive source, used to drive the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit along the second direction Move towards or away from each other.
  • the first rack is linked to the first wire cutting unit
  • the second rack is linked to the second wire cutting unit
  • the transmission gear is connected to a driving source such as a power output of a servo motor.
  • Shaft (not shown), and meshes with the first rack and the second rack, for driving the first wire cutting unit and the second wire cutting unit to move toward each other when rotating forward
  • the closing action drives the first wire cutting unit and the second wire cutting unit to move back when rotating in the reverse direction.
  • the first rack and the second rack can be meshed on both sides of the transmission gear, so that when the transmission gear rotates, the linear velocities at the first rack and the second rack are in opposite directions, and the drive motor drives the transmission
  • the gear rotates the first rack and the second rack move toward each other when the transmission gear rotates forward, which drives the first wire cutting unit and the second wire cutting unit to move toward each other.
  • the transmission gear is driven to rotate in the reverse direction, the first rack and the second tooth
  • the strip moves back to drive the first wire cutting unit and the second wire cutting unit to move back.
  • the transmission gear may be axially connected to the power output shaft of the driving source, or may be indirectly connected to the power output shaft, for example, the shaft is connected to the rotating part connected to the power output shaft.
  • one or more pitch adjustment mechanisms may be provided in the wire cutting device, each of which is connected to the first wire cutting unit and the second wire cutting unit, and the number of the distance adjustment mechanisms may be based on The driving power requirements, the force state of the transmission mechanism such as the screw rod, the smoothness of the movement of the multiple cutting wheels in the driving wire cutting unit, and the equipment space of the wire cutting device are comprehensively determined. For example, when the first wire cutting The unit and the second wire cutting unit have a small span in the first direction. Only one pitch adjustment mechanism can be used to adjust the cutting position of the cutting wire saw in the cutting unit or to change the groove of the cutting line.
  • the pitch adjusting mechanism drives the first wire cutting unit and the second wire cutting unit to move toward or away from each other in the second direction; for another example, when the first wire cutting unit and the second wire cutting unit are in the first direction
  • the span of the wire cutting unit is longer, and the wire cutting unit needs to be driven by a larger power and the power needs to be within the force strength range of the transmission connecting parts such as the screw rod or the rack.
  • the wire cutting device can be provided with multiple pitch adjustment mechanisms , The multiple pitch adjusting mechanisms cooperate to ensure that the multiple pitch adjusting mechanisms drive the multiple wire cutting wheels of the first wire cutting unit and the second wire cutting unit with the same displacement (size and direction) in the first The two directions move towards or away from each other.
  • the pitch adjusting mechanism is a servo motor provided in the at least one wire cutting unit.
  • a servo motor is provided on at least one wire cutting unit or each wire cutting unit of the wire cutting device, and the servo motor controls the displacement of the corresponding wire cutting unit in the second direction.
  • the wire cutting unit can pre-determine the cutting offset for slot change or the adjustment amount of the cutting line to change the cutting position, and the precise positioning function of the servo motor drives the multiple cutting wheels in the wire cutting unit to a preset displacement amount Move in the second direction.
  • the wire cutting device is provided with a single wire cutting unit, and the single wire cutting unit is provided with a servo motor to drive the single wire cutting unit to move in the second direction; for another example, the wire cutting device is provided with a first The wire cutting unit and the second wire cutting unit, the first wire cutting unit or/and the second wire cutting unit are relatively independently moved in the second direction under the drive of their corresponding servo motors.
  • the servo motor can also be replaced with a traveling motor and a traveling screw, and the wire cutting unit can be driven by the traveling motor to move on the wire cutting support in the second direction.
  • the at least one pitch adjusting mechanism drives the lower thread cutting unit to move in a second direction, and the at least one transition wheel and a plurality of cutting wheels together follow the mounting beam to move in the second direction
  • the at least one transition wheel and the plurality of cutting wheels are relatively stationary, that is, the positional relationship between the transition wheel and the cutting wheels remains unchanged.
  • the pitch adjusting mechanism is used to adjust the cutting position of at least one wire saw in the at least one wire cutting unit, the positional relationship of the cutting wire saw relative to the cutting wheel and the transition wheel remains unchanged, that is, it only occurs in the second direction. , You can adjust the cutting position.
  • FIG. 27 shows a top view of the wire cutting device in an embodiment of this application
  • FIG. 28 shows a side view of the wire cutting device in an embodiment of this application
  • FIG. 29 Shown as a schematic diagram of the enlarged structure at E in Figure 28.
  • the at least one pitch adjusting mechanism drives the wire cutting unit 21 to move in the second direction
  • the at least one transition wheel 212 and the plurality of cutting wheels 211 The joint follow the mounting beam 214 to move in the second direction (in the direction of the arrow as shown in FIG. 27)
  • the at least one shifting mechanism 215 drives the at least one transition wheel 212 or is used to connect the transition wheel bracket 2121
  • the connecting beam 2122 moves in the second direction (in the direction of the arrow shown above the bracket 2121 in FIG.
  • the wire groove of the transition wheel 212 can be switched to correspond to different cutting grooves.
  • the distance that the distance adjusting mechanism drives the wire cutting unit 21 to move in the second direction is the same as the distance that the at least one shifting mechanism 215 drives the at least one transition wheel 212 to move in the second direction.
  • the silicon rod can be cut according to the preset before the slot change.
  • the specification continues to perform the silicon rod cutting.
  • the groove changing adjustment of the transition wheel 212 and the position calibration operation of the cutting line 213 and the cutting wheel 211 can be omitted during the groove changing process in this example.
  • the cutting line slot corresponding to the cutting line before and after the slot change can be determined in advance.
  • the position of the cutting line before the slot change is the cutting line slot a1, and the cutting line is wound around the cutting line slot a2 after the slot change.
  • the cutting offset between the cutting groove a1 and the cutting groove a2 determines the displacement of the plurality of cutting wheels in the at least one pitch adjusting mechanism driving the cutting wheels in the second direction, that is, the displacement is set to
  • the cutting offset between the cutting line groove a1 and the cutting line groove a2 can be used to realize the replacement of the cutting line groove a1 to the cutting line groove a2 for the cutting line; it should be noted that the at least one pitch adjusting mechanism drive line
  • the direction in which the plurality of cutting wheels in the cutting unit move in the second direction is the direction in which the cutting line groove a2 points to the cutting line groove a1; at the same time, the shifting mechanism drives the at least one transition wheel to move relative to the wire cutting unit in the second direction ,
  • the moving distance is the cutting offset between the cutting slot a1 and the cutting slot a2
  • the displacement direction of the at least one transition wheel relative to the wire cutting unit is the direction in which the cutting slot a1 points to the cutting slot a2, Before and after the
  • the wire cutting unit includes at least one shift mechanism for driving the at least one transition wheel to move in the second direction, so that the at least one transition wheel The current wire groove wound by the middle warp is moved in the second direction from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel.
  • the wire cutting device provided in the present application can use the at least one shifting mechanism to adjust the slot position of the cutting wire around the wire groove during the slot changing process, and the adjustment and calibration of the transition wheel can be omitted after the slot is changed. ;
  • the transition wheel can adopt a single-slot transition wheel to realize the slot change.
  • the transition wheel can also be set as a replaceable consumable transition wheel. When the wire groove of the transition wheel is worn out, it can be replaced directly The transition wheel is sufficient, which simplifies the equipment maintenance process for equipment wear caused by cutting.
  • the present application also provides a silicon rod processing equipment, which includes a machine base, a silicon rod carrying structure, and a wire cutting device according to any one of the embodiments shown in 23 to 29.
  • the machine base has a silicon rod processing platform
  • the silicon rod carrying device is provided on the silicon rod processing platform and is used to carry the silicon rods to be cut.
  • the silicon rod processing equipment is a silicon rod squaring equipment
  • the silicon rod supporting device is a silicon rod supporting structure.
  • the silicon rod processing platform may be provided with one or more silicon rod supporting structures, and each silicon rod supporting structure may be used to carry a single silicon rod.
  • the silicon rod processing platform in the cutting area The number of silicon rod bearing structures can correspond to the number of wire saws in the wire cutting unit of the wire cutting device.
  • a wire cutting unit 21 in the wire cutting device includes a multi-segment cutting wire saw to correspond to a plurality of silicon rod supporting structures 11 respectively.
  • the silicon rod processing platform is set on the base 10 through a worktable conversion mechanism.
  • the worktable conversion mechanism may be, for example, a rotation mechanism or a translation mechanism.
  • the rotation mechanism may include, for example, a rotation shaft and a rotation drive unit, the rotation shaft is axially connected to the silicon ingot processing platform, and the rotation drive unit drives the rotation shaft to rotate to drive the silicon ingot processing platform to rotate.
  • the translation mechanism may include, for example, a translation guide rail, a sliding block and a translation drive unit.
  • the translational guide rail is laid on the machine base, the sliding block is arranged at the bottom of the silicon ingot processing platform and is adapted to the translational guide rail to provide translational guidance for the silicon ingot processing platform, and the translational driving unit is used for driving
  • the silicon rod processing platform moves along the translational guide rail so that the silicon rod bearing structure is switched between the cutting area and the loading and unloading area; in other embodiments, the translation mechanism may also be geared, specifically, the The translation mechanism includes a translation rack and a rotating gear driven by a motor that is adapted to the translation rack.
  • the translation rack is arranged at the bottom of the silicon rod processing platform, and may be, for example, at least one rack with a certain length.
  • each rack is fitted with at least two rotating gears arranged at intervals, and the motor drives the rotating gears to rotate to drive the silicon ingot bearing structure on the silicon ingot processing platform in the cutting area and loading and unloading. Zone switch.
  • the silicon rod squaring equipment may be, for example, the silicon rod squaring equipment of the embodiment shown in FIG. 17 or FIG. 18. Of course, it may also be other types of silicon rod squaring equipment, for example, the center line of the silicon rod squaring equipment
  • the cutting device can be set as a single-wire cutting unit; for another example, the cutting wire saw in the wire cutting unit of the wire cutting device of the silicon rod square rooting equipment is one segment. Of course, the cutting wire saw can also be two-stage, three-stage, or four-stage. Sections, etc., are not limited in this application.
  • the number of silicon ingot carrying structures on the silicon ingot processing platform can be changed accordingly; for another example, each of the wire cutting units in the wire cutting device of the silicon ingot squaring equipment
  • the number of silicon rod bearing structures corresponding to a cutting wire saw can be one, two, three, and so on.
  • the silicon rod squaring equipment is provided with the wire cutting device described in any one of the embodiments shown in FIGS. 23 to 29.
  • the cutting wheel in the silicon rod squaring equipment performs the square extraction operation to make
  • the shifting mechanism can be used to omit the adjustment of the transition groove and the transition wheel during the groove changing process, so that the groove changing process is easier; some embodiments are provided in Figures 23 to 29
  • at least one pitch adjusting mechanism may be further provided, and the cutting position of the cutting wire saw can be adjusted based on the at least one pitch adjusting mechanism to determine the cutting amount of the silicon rod, and
  • the cutting wheel of the silicon rod square-cutting equipment can change the slot position of the cutting line based on the at least one pitch adjustment mechanism after the groove is worn out during the long-term cutting operation, so as to ensure that the silicon rod square-cutting equipment continues the square-cutting operation At the same time, when the at least one pitch adjusting mechanism and the at least one shifting mechanism
  • the silicon rod cutting machine when the silicon rod processing equipment is a silicon rod cutting machine, the silicon rod cutting machine includes a base, a silicon rod carrying device, and a wire cutting device.
  • the machine base has a silicon rod processing platform
  • the silicon rod carrying device is arranged on the silicon rod processing platform.
  • the silicon rod carrying device can be used to horizontally carry the silicon rods to be cut
  • the wire cutting device includes: a cutting frame arranged on the machine base; at least one wire cutting unit is movably arranged on the cutting frame;
  • the wire cutting unit includes: a plurality of cutting wheels arranged in sequence along a first direction, each cutting wheel has at least two cutting grooves; at least one transition wheel, each of the transition wheels has a wire groove; a cutting line , Sequentially winding around the plurality of cutting wheels and transition wheels to form at least one cutting wire saw; at least one shift mechanism for driving the at least one transition wheel to move in the second direction, so that the at least one transition wheel
  • the current wire groove cut and wound in the wheel moves in the second direction from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel.
  • the wire cutting unit moves up and down relative to the cutting frame to realize the feed
  • the wire cutting device of the silicon rod cutting machine is provided with a plurality of parallel wire cutting units, and the plurality of parallel wire cutting units move up and down along the cutting frame, that is, in one cutting
  • the silicon rod to be cut is cut into multiple silicon rod sections.
  • the cutting slot of the at least one cutting wire saw in the wire cutting unit in the cutting wheel can be adjusted, so that the cutting wheel worn during the cutting operation can be changed after the cutting slot is replaced. Continue to use, at the same time, the process of changing the groove can be realized without adjusting the position of the cutting line on the transition wheel.
  • the arrangement of the wire cutting device of the silicon rod cutting machine and the form of the silicon rod carrying device can refer to the arrangement disclosed in Chinese Patent CN105196433B.
  • the wire cutting device of the silicon rod cutting machine includes The at least one shifting mechanism is used to drive the at least one transition wheel to move in a second direction, so that the current wire groove that has been cut and wound in the at least one transition wheel changes from corresponding to the cutting in the second direction.
  • the first wire groove of the wheel moves to the second wire groove corresponding to the cutting wheel.
  • the silicon rod cutting machine is, for example, a double silicon rod cutting device.
  • the silicon rod carrying device of the silicon rod cutting machine is provided with a first processing station and a second processing station, To respectively carry the first silicon rod to be cut and the second silicon rod to be cut.
  • FIG. 21 shows a schematic structural diagram of the wire cutting device of the silicon rod cutting machine in an embodiment.
  • the wire cutting support 24 is provided on the cutting frame 20, and at least one wire cutting unit 21 is respectively provided on both sides of the wire cutting support 24 along the first direction, located on both sides of the wire cutting support 24 The at least one wire cutting unit 21 can respectively cut the silicon rods to be cut at the first processing station and the second processing station.
  • the wire cutting unit 21 of the wire cutting support 24 includes a cutting wheel 211, a transition wheel 212, a cutting wire 213 wound around the cutting wheel 211, and at least one shift mechanism; wherein, the cutting wheel There are at least two cutting grooves on the 211, and the at least one shifting mechanism is used to drive the at least one transition wheel 212 to move in the second direction, so that the current wire groove that is cut and wound in the at least one transition wheel 212 Move in the second direction from the first wire groove corresponding to the cutting wheel 211 to the second wire groove corresponding to the cutting wheel 211.
  • the relative position between the transition wheel 212 and the cutting wheel 211 in the wire cutting unit of the silicon rod cutting machine can be adjusted in the second direction, and the wire of the transition wheel is driven by the at least one displacement mechanism
  • the grooves can be aligned to different cutting line grooves in the cutting wheel.
  • the form of the at least one displacement mechanism can also refer to the displacement mechanism described in any one of the embodiments shown in FIG. 23 to FIG. 29.
  • the wire cutting units 21 on both sides of the wire cutting support 24 can also form at least a pair of wire cutting units 21, for example, the wire cutting units 21 on both sides of the wire cutting support 24 are in one-to-one correspondence.
  • the connection forms at least a pair of wire cutting units 21, which are located on the same straight line in the first direction.
  • the transition wheels on the pair of wire cutting units 21 can be driven based on the same displacement mechanism. 212 moves in the second direction, for example, when the brackets of the transition wheels 212 of a pair of wire cutting units 21 are connected together by connecting beams; of course, the pair of wire cutting units 21 can also be driven by a plurality of displacement mechanisms, or Each transition wheel 212 is driven by a mutually independent displacement mechanism.
  • the specific form of the displacement mechanism can refer to the implementation manners provided in the embodiments shown in FIG. 23 to FIG. 29, which will not be repeated here.
  • the wire cutting unit may also be provided with the distance adjustment mechanism described in the embodiment provided in the embodiment shown in FIGS. 23 to 29; here, the distance adjustment mechanism and the shift mechanism are For the implementation manner of performing coordinated cooperation with each other to adjust the position of the cutting wire saw or to change the cutting wire around the cutting line groove in the cutting wheel, refer to the implementation manner provided in the embodiments shown in FIGS. 23 to 29.
  • the specific form of the silicon rod cutting machine is not limited to the foregoing embodiment.
  • each of the silicon rod cutting machine The cutting wire saw can cut multiple silicon rods at the same time; another example is that the wire cutting device of the silicon rod cutting machine only includes a cutting wire saw, and the cutting wire saw is used to cut a single or multiple silicon rods.
  • the silicon rod cut in one cutting operation during cutting is divided into a silicon rod section; this application is not limited, it should be noted that the wire cutting device of the silicon rod cutting machine includes the wire cutting device shown in Figure 23 to Figure 29
  • the shift mechanism described in any one of the embodiments is shown to adjust the position of the transition wheel in the wire cutting device relative to the cutting wheel in the second direction.
  • the silicon rod processing equipment is an integrated silicon rod cutting and grinding machine.
  • the silicon rod cutting and grinding integrated machine includes a base, a silicon rod carrying device, a wire cutting device, and a grinding device.
  • the machine base has a silicon rod processing platform, and in the silicon rod cutting and grinding integrated machine, the silicon rod processing platform can be set to a processing location that performs different processing functions, for example, is composed of a cutting station and a grinding station;
  • the silicon rod carrying device is used to carry the silicon rods to be processed;
  • the wire cutting device includes: a cutting frame arranged on the machine base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: A plurality of cutting wheels arranged in sequence along the first direction, each cutting wheel has at least two cutting line grooves; at least one transition wheel, each transition wheel has a wire groove; the cutting line is sequentially wound around the A plurality of cutting wheels and transition wheels to form at least one cutting wire saw; at least one shift mechanism for driving the at least one transition wheel to move in the second direction, so that the current cutting and winding of the at least one transition wheel The wire groove moves in the second direction from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel.
  • the silicon rod cutting and grinding integrated machine includes a machine base with a silicon rod processing platform;
  • the silicon rod in the first processing area of the silicon rod is cut in the first direction and the silicon rod in the second processing area of the silicon rod processing platform is cut in the second direction to form a square silicon rod;
  • the grinding device is arranged at The machine base is used to grind and chamfer the square silicon rods on the third processing position of the silicon rod processing platform;
  • a silicon rod conversion device is provided on the silicon rod processing platform, It is used for converting the silicon rods in the first processing location, the second processing location and the third processing location.
  • the wire cutting device includes: a cutting frame 20, a wire cutting support 24, a first cutting unit group, and a second cutting unit group, and the first cutting unit group and the second cutting unit group are used to respectively align The silicon rods in the first processing area and the second processing area are cut.
  • the wire cutting support 24 can be configured with the first cutting unit and the second cutting unit, that is, the first cutting unit and the second cutting unit share the wire cutting support 24. Therefore, in this embodiment, on the one hand, the cutting frame 20 and the wire cutting support 24 in the wire cutting device are arranged in a middle position between the first processing position and the second processing position. On the other hand, the wire cutting support 24 is specially designed. As shown in FIG. 22, the wire cutting support 24 in this embodiment may include a support main body and a first support side wing and a second support side wing located on opposite sides of the support main body.
  • the support body in the wire cutting support 24 is arranged at 45° to the X axis or the Y axis, and the first support side wing and the support body form an angle of 145° along the Y axis.
  • the angle between the side wings of the second support and the main body of the support is 145° and is arranged along the X axis.
  • the first cutting unit group may include at least four first cutting wheels 211a and two first transition wheels.
  • the four first cutting wheels 211a can be combined into a pair of first cutting wheel groups, that is, Two first cutting wheels 211a are arranged opposite to each other along the X axis to form a first cutting wheel group, and the two first cutting wheel groups along the Y axis form a pair of first cutting wheel groups.
  • the cutting wire 213 is sequentially wound around each first cutting wheel 211a in the first cutting unit group to form a cutting wire net. In practical applications, the cutting line 213 is sequentially wound around the four first cutting wheels 211a in the first cutting unit group to form two cutting wire saws.
  • the first transition wheel is used for reversing or tension adjustment of the cutting line 213.
  • the first transition wheel is parallel to the cutting wheel 211 of the corresponding first cutting wheel set, that is, both are parallel to the first direction. .
  • Two first cutting wheels 211a, a cutting line 213 around them, and a first transition wheel are arranged oppositely along the X axis to form a wire cutting unit.
  • the first cutting unit group Two wire cutting units 21 parallel to each other are formed.
  • the second cutting unit group may include at least four second cutting wheels 211b and two second transition wheels.
  • Two second cutting wheels 211b are arranged opposite to each other along the Y axis to form a second cutting wheel group.
  • a pair of second cutting wheel sets are formed by two second cutting wheel sets along the X axis; in practical applications, the cutting line 213 is sequentially wound around the four second cutting wheels in the second cutting unit set After 211b, two cutting wire saws are formed.
  • the two cutting wire saws are arranged along the Y-axis direction and are parallel to each other.
  • the second transition wheel corresponds to The cutting wheels 211 of the second cutting wheel set are parallel to each other, that is, they are all parallel to the first direction. Two first cutting wheels 211a, a cutting line 213 around them, and a second transition wheel are arranged oppositely along the Y axis to form a wire cutting unit. In this embodiment, the second cutting unit group Two wire cutting units 21 parallel to each other are formed.
  • first direction and the second direction are defined based on the carrier coordinate system of the wire cutting unit. Therefore, when the silicon rod processing equipment (in this example, the silicon rod cutting and grinding machine) has multiple wire cutting units The first directions corresponding to the multiple wire cuttings are not the same in the external space; correspondingly, the second direction is orthogonal to the first direction. Therefore, the driving performed by the at least one displacement mechanism The moving direction of the at least one transition wheel is orthogonal to the driven wire cutting unit.
  • the wire cutting unit and the cutting wire saw are arranged along the X axis direction, the first direction in the first cutting unit group is the X axis direction, and the second direction is the Y axis direction;
  • the wire cutting unit and the cutting wire saw are arranged along the Y axis direction, and in the second cutting unit group, the first direction is the Y axis direction, and the second direction is the X axis direction.
  • the number of cutting wheels and transition wheels in any one of the wire cutting units can be changed accordingly.
  • the number of cutting wheels in one wire cutting unit can also be three. , Four, etc.
  • the number of transition wheels can also be two or more.
  • the silicon rod conversion device is provided in the center area of the silicon rod processing platform, and is used to place the silicon rods on the waiting area, the first processing area, and the second processing area on the silicon rod processing platform. , And the conversion between the third processing zone.
  • the silicon rod conversion device is rotatably arranged on the silicon rod processing platform, and the silicon rod conversion device may further include: a conveying body, which is in the shape of a disc, a square disc, or other similar shapes; and is arranged on the conveying body
  • the silicon rod positioning mechanism ie silicon rod bearing device
  • the conversion drive mechanism is used to drive the rotation of the conveying body to drive the silicon rods to be positioned by the silicon rod positioning mechanism to switch positions.
  • the silicon rod positioning mechanism further includes a rotating structure for driving the silicon rod carried on the silicon rod positioning mechanism to rotate along the silicon rod axis to adjust the cutting surface of the silicon rod.
  • the silicon rod to be cut is moved from the first cutting line in the X-axis direction of the wire cutting device at the first processing area.
  • the net is cut to form two axial cut planes along the X axis; then, the conversion drive mechanism drives the conveying body to drive the silicon rod positioning mechanism to position the silicon rods to the second processing position, which is formed by the wire cutting device along the Y axis direction.
  • each cutting wheel in the wire cutting unit has at least two cutting wire grooves.
  • any wire cutting unit of the wire cutting device further includes At least one shifting mechanism is used to drive the at least one transition wheel to move in the second direction, so that the current wire groove of the at least one transition wheel that has been cut and wound in the second direction moves from the one corresponding to the cutting wheel in the second direction.
  • the first wire groove is moved to the second wire groove corresponding to the cutting wheel.
  • the transition wheel can be a single wire groove transition wheel or a multiple wire groove transition wheel. Based on the driving action of the at least one displacement mechanism, the cutting wire is wound around the wire groove position of the transition wheel Without changing, the cutting line can be changed grooves on the cutting wheel.
  • the cutting wire wound around the cutting wheel is replaced by the shift mechanism
  • the position of the cutting line slot can make the cutting wheel multiplexed.
  • the arrangement of the displacement mechanism can refer to the displacement mechanism described in any implementation of the embodiment shown in FIG. 23 to FIG. 29.
  • the first processing location and the second processing location include two parallel wire cutting units.
  • the first processing location and the second processing location also include at least one Pitch adjustment mechanism, which can be associated with the first wire cutting unit or the second wire cutting unit of the two wire cutting units, or both the first wire cutting unit and the second wire cutting unit at the same time.
  • the mechanism can be set to, for example, the pitch adjustment mechanism described in any implementation of the embodiment shown in FIGS. 23 to 29, for example, by connecting a screw rod with the first wire cutting unit or the second wire cutting unit, or by The bidirectional screw rod is connected to the first wire cutting unit and the second wire cutting unit, or the pitch adjusting mechanism is a servo motor, etc., which will not be repeated here.
  • the first wire cutting unit or/and the second wire cutting unit may be, for example, Move along the flanks of the first support, that is, move along the second direction (Y-axis direction) in the first cutting unit group; it can be used to adjust at least one wire saw in the first wire cutting unit or/and the second wire cutting unit Cutting position, or changing the cutting line around the cutting line grooves of the plurality of cutting wheels in the first line cutting unit or/and the second line cutting unit; at least one of the at least one pitch adjusting mechanism and the line cutting unit is shifted
  • the mechanism is matched, and the slot can be changed without changing the wire slot used for winding the cutting wire in the transition wheel, and the position of the cutting wire saw in the second direction before and after the slot change is unchanged.
  • the structure of the second cutting unit group is similar to that of the first cutting unit group.
  • the main difference is that the arrangement position and direction are different in the silicon rod cutting and grinding integrated machine; but the at least one displacement mechanism at the second cutting unit group And the structure and function of the at least one distance adjustment mechanism are similar to the at least one displacement mechanism and the at least one distance adjustment mechanism in the first cutting unit group, and will not be repeated here.
  • the positional relationship between the first processing location and the second processing location can be changed.
  • the first processing location and the second processing location are set as the silicon rod conversion device carrying the silicon rod to rotate. 60° can switch between the two processing positions, and the direction of the wire cutting unit in the corresponding first cutting unit group and the second cutting unit group may also change.
  • the first cutting unit group and The wire cutting units of the second cutting unit group respectively correspond to the first direction change, but the wire cutting unit in any cutting unit group can still use at least one of the embodiments described in any one of the embodiments shown in FIGS.
  • the silicon rod In the silicon rod squaring operation, the silicon rod will form a side skin after the square cutting. Therefore, the formed side skin needs to be unloaded first.
  • Most of the existing side skin unloading methods are manually operated by the operator to remove the side skin. It is not only inefficient to remove the cut silicon rods and move them out of the silicon rod formulating equipment, but also will cause the side skins to collide with the cut silicon rods during the handling process, which increases the risk of damage to the cut silicon rods. Therefore, it is necessary to provide a silicon rod square-out equipment and a side skin unloading device applied to the silicon rod square-out equipment, so that the side skin can be unloaded in time and improve work efficiency.
  • the present application provides a side skin unloading device.
  • the side skin unloading device is provided with a side skin clamping mechanism for transferring the side skin.
  • the side skin clamping mechanism can transfer the side skin by rotating the swing arm, and can also store the side skin clamping mechanism by rotating the swing arm in the non-transported state, so that the side skin unloading device occupies less equipment space and the transfer path Simplified and improved transfer efficiency.
  • a side skin unloading device applied to a silicon rod square-cutting equipment.
  • the silicon rod square-cutting equipment includes a base, a wire cutting device, and a silicon rod bearing structure.
  • the rod bearing structure is used to carry silicon rods placed vertically, and the wire cutting device includes a wire cutting support that can be raised and lowered and a wire cutting unit provided on the wire cutting support.
  • the wire cutting unit has a cutting A wire saw, wherein the cutting wire saw cuts the silicon rod to form a cut silicon rod and a side skin;
  • the side skin unloading device includes: a side skin lifting unit for lifting the side skin so that the top of the side skin protrudes The cut silicon rod;
  • a side skin clamping unit for clamping and transporting the side skin,
  • the side skin clamping unit includes: a support column, which is arranged on the base; a first mounting part, which is arranged on On the support column; at least one set of edge skin clamping mechanisms, connected to the first mounting portion through a swing arm, for clamping the edge skin and lifting the edge skin from the cut silicon rod, and controlled Rotate around the swing arm shaft to transfer the side skins to the side skin unloading area.
  • Figure 30 shows a schematic structural diagram of the side skin unloading device of this application applied to a silicon rod square opener in an embodiment
  • Figure 31 shows the side skin unloading of this application
  • the silicon rod square-out equipment has a silicon rod carrying structure 11, which can be used to carry the silicon rods placed vertically.
  • the wire saw in the wire cutting device cuts the silicon rods, the formed edge Due to its own gravity and the limiting effect of the silicon rod supporting structure 11, it continues to stay on the silicon rod supporting structure 11 and close to the cut silicon rod. Therefore, it is necessary to make the edge skin formed after cutting and the cut silicon rod have a relative displacement.
  • the protruding parts formed by the staggered displacements clamp the side skin, and then carry out the side skin transfer.
  • the side skin lifting unit described in the present application is used to lift the side skin so that the top of the side skin protrudes from the cut silicon rod .
  • the supporting surface of the silicon rod bearing structure in the silicon rod square-out equipment equipped with the edge skin unloading device is a flat structure, and the edge skin formed after being cut may not have corresponding support.
  • the edge skin unloading device also includes a edge skin supporting mechanism for supporting the edge skin formed after the silicon rod to be cut is squared and cut ,
  • the edge leather lifting unit lifts the mechanism supported by the edge leather supporting machine.
  • the side skin top support mechanism can also be used as a component of the silicon rod square-out equipment, or, the side skin top support mechanism is not in the side skin unloading device or the silicon rod square-out equipment Necessary institutions.
  • the side leather supporting mechanism 53 includes a supporting member, and the supporting member includes a connecting member.
  • the base 531 may also be configured as a flat plate structure, a curved plate structure or other special-shaped structures that are adapted to the side surface of the silicon rod carrying structure 11, which is not limited in this application.
  • the top support portion 532 is configured as two top pillars located on both sides of the base 531, and the extension height of the top pillar is the same as the height of the bearing surface of the silicon rod supporting structure 11.
  • the top support portion 532 It can also be used as a top plate or a top rod extending upward from the base 531.
  • the supporting member can support the corresponding edge skin, thereby effectively preventing the cutting line in the wire cutting device from passing through the silicon rod to be cut.
  • the edge collapse occurs when the rod is used, and the edge skin can be prevented from falling and overturning.
  • the leather top support mechanism includes a movable support member and a locking control member.
  • the movable supporting member includes a movable base connected to one side of the silicon rod bearing structure, a top supporting portion extending upward from the movable base, and a power generating structure that provides the top supporting portion to move up and down .
  • the movable base may be, for example, a flat plate structure adapted to the side surface of the silicon rod bearing structure, but is not limited to this.
  • the movable base may also be, for example, a curved panel structure or other special shapes. structure.
  • the top support portion is at least two top rods extending upward from the movable base, but it is not limited thereto.
  • the top support portion may also be, for example, a top plate or a top post extending upward from the movable base.
  • the power generation structure includes two legs provided at the movable base and two springs respectively sleeved on the two legs, but it is not limited thereto.
  • the power generation structure may also adopt, for example, torsion springs, Shrapnel and other structures. Utilizing the elastic force of the spring, the supporting leg and the connected ejector rod can move up and down relative to the silicon rod bearing structure.
  • the locking control member is used to control the movable supporting member in a locked state when the movable supporting member is against the bottom of the silicon rod to be cut.
  • the locking control member may be, for example, Electromagnetic lock.
  • the ejector rod protrudes from the bearing surface of the silicon rod bearing structure under the action of the feet and the spring.
  • the ejector rod is After the silicon rod is pressed, it overcomes the elastic force of the spring and moves downward until the silicon rod to be cut is completely placed on the bearing surface of the silicon rod bearing structure.
  • the electromagnetic lock as the locking control member is energized and generates magnetism through electricity.
  • the strong magnetic force generated by the principle tightly adsorbs the movable base in the movable supporting member, thereby controlling the ejector rod in the locked state.
  • the movable supporting member in the locked state can support the corresponding edge skin , It can effectively prevent the cutting wire mesh in the wire cutting unit from chipping when passing through the silicon rod to be cut, and can prevent the edge skin from falling and overturning.
  • the edge skin lifting unit and the edge skin clamping unit can be used to project and transfer the edge skin on the silicon rod carrying structure from the cut silicon rod.
  • the side skin lifting unit includes a lifting member capable of lifting and lowering, and the lifting member is controlled to support the side skin to lift the side skin.
  • the side skin lifting unit is arranged on the machine base through a lifting guide rail. After the side skin is formed by cutting, the side skin lifting unit is controlled to be lifted to the bottom of the silicon rod bearing structure and from the bottom of the side skin. The edge skin is raised so that the edge skin protrudes from the cut silicon rod.
  • the edge skin lifting unit is moved up and down by attaching to the wire cutting support that can be raised and lowered in the wire cutting device.
  • FIG. 33 shows an embodiment of the edge skin unloading device of this application.
  • the lifting member 511 supports the bottom of the side skin to lift the side skin after a controlled stretching exercise.
  • the jacking member 511 includes an abutment plate and a support plate, the abutment plate extends upward from the bottom of the support plate, and further, the abutment plate may be a side wall When the abutment plate abuts against the curved surface of the curved surface of the curved plate, it can fully contact with the curved surface of the side skin, and the contact part of the abutment plate and the side skin is of a smooth design Alternatively, a cushioning pad should be added to the inner surface of the abutment plate that is in contact with the edge skin.
  • the supporting plate is used to support the bottom of the side skin, and further, the supporting plate may be an arcuate plate that matches the bottom surface of the side skin. In other embodiments, bumps can be added to the chord side of the arcuate plate as the supporting plate to increase the contact area with the bottom surface of the side skin.
  • the telescopic component 512 is, for example, an air cylinder with a telescopic rod, wherein the telescopic rod can be connected to the supporting plate in the jacking member 511 through a connecting structure, and the air cylinder can drive the telescopic rod.
  • the rod drives the jacking member 511 to expand and contract.
  • the telescopic movement of the jacking member 511 includes contraction and extension of the jacking member 511.
  • the contraction movement of the jacking member 511 is for the air cylinder to drive the telescopic rod to contract to drive
  • the jacking member 511 is far away from the side skin, and the stretching movement of the jacking member 511 specifically refers to that the air cylinder drives the telescopic rod to extend to drive the jacking member 511 to approach the side skin.
  • the aforementioned telescopic component 512 can also be implemented in other ways.
  • the telescopic component 512 can also be, for example, a servo motor with a screw.
  • the screw is connected to the jacking member 511, and the servo motor is To drive the lead screw to rotate to drive the connected jacking member 511 to expand and contract, for example, to drive the lead screw to rotate in a forward direction to drive the jacking member 511 to make a contraction movement, and to drive the lead screw to rotate in a reverse direction Drive the jacking member 511 to extend, or drive the lead screw to rotate in the forward direction to drive the jacking member 511 to extend and drive the lead screw to rotate in the reverse direction to drive the jacking member 511 to move in contraction.
  • the telescopic rod drives the jacking member 511 to be in a contracted state, and the wire cutting unit is driven to descend with the wire cutting support so that the cutting line pairs formed by each cutting line segment in the wire cutting unit
  • the silicon rod to be cut located in the cutting area is subjected to square cutting until the cutting line segment penetrates the silicon rod to be cut to complete a complete cutting of the silicon rod to be cut and form a side skin.
  • the side skin lifting mechanism has followed the wire cutting support.
  • the seat is lowered to the bottom, and the air cylinder drives the telescopic rod to extend to drive the jacking member 511 to approach the side skin until the abutment plate in the jacking member 511 contacts the side skin and achieves abutment, and subsequently, the wire cutting unit is driven to follow
  • the edge skin lifting mechanism follows the wire cutting support to rise, driving the edge skin to rise relative to the silicon rod that has been cut once, so that the top of the edge skin protrudes from the silicon rod to be cut, which is the top of the edge skin.
  • the wire cutting support can be controlled to stop rising.
  • the air cylinder drives the telescopic rod to contract to drive the jacking member 511 back to the initial state while controlling the wire cutting support to drive the wire cutting unit and the edge skin lifting mechanism to continue to rise above the silicon rod to be cut to prepare for the next cutting operation.
  • the side leather lifting unit includes a retractable suction member, and the suction member is controlled to stretch and abut the side leather to lift the side leather.
  • the side skin lifting mechanism may include a suction member and a telescopic member that drives the suction member to expand and contract.
  • the suction member is controlled by the telescopic member to abut the side skin and adsorb the side. Skin.
  • the suction member may further include an abutting plate and a suction element.
  • the abutment plate may be, for example, an arc-shaped plate that fits with the arc-shaped surface of the edge skin, and when the abutment plate is against the edge skin, it can interact with the arc-shaped surface of the edge skin. Full contact.
  • the suction element may be, for example, a vacuum suction cup, and a plurality of vacuum suction cups may be arranged on the contact surface of the abutment plate to be in contact with the edge skin.
  • the telescopic component may be, for example, a cylinder with a telescopic rod or a servo motor with a lead screw. Taking the cylinder with a telescopic rod as an example, the telescopic rod can be connected to the jacking member through a connecting structure.
  • the air cylinder can drive the telescopic rod to shrink to drive the abutment plate away from the side skin, and the air cylinder can drive the telescopic rod to extend to drive the abutment plate to approach the side skin and After the abutment plate is in contact with the edge skin, the suction element adsorbs the edge skin. Subsequently, the wire cutting support is driven to rise, the side skin lifting mechanism and the wire cutting device follow the wire cutting support to rise, and the side skin lifting mechanism uses the adsorption force to drive the side skin to move upward relative to the cut silicon rod. , So that the top end of the edge skin protrudes from the silicon rod that has undergone a cutting operation.
  • the silicon rod squaring equipment is provided with multiple cutting wheel sets to simultaneously cut multiple silicon rods to be cut, so the on-line cutting support is provided with multiple cutting wheel sets corresponding to the multiple cutting wheel sets.
  • Multiple edge skin lifting mechanisms simultaneously discharge multiple silicon rods that have undergone cutting operations.
  • the wire cutting device includes a wire cutting unit
  • the wire cutting device is pressed down to form a side skin at a time
  • the wire cutting support is provided above a pair of cutting wheels corresponding to each silicon rod bearing structure.
  • An edge skin lifting mechanism can discharge the edge skin formed in the cutting operation in time.
  • the wire cutting device can form two side skins by one press-cutting, and the wire cutting support is provided with two sides corresponding to each silicon rod bearing structure.
  • the edge skin lifting mechanism is used to protrude the edge skin top support formed in the cutting operation from the cut silicon rod to realize timely unloading of the edge skin.
  • the side skin clamping unit After forming the protruding part of the side skin relative to the cut silicon rod by the side skin lifting unit, the side skin clamping unit continues to displace the side skin based on the protruding part to clamp the side skin And transfer the side skins to the unloading area.
  • the edge skin clamping unit 52 includes a support column 521 disposed on the silicon rod square-out equipment base 10, and the support column 521 is, for example, as shown in FIG. At least one guide post set in the first direction is shown.
  • the supporting column 521 is provided with a first mounting portion 522 and a side leather clamping mechanism 523 connected to the first mounting portion 522.
  • the supporting column 521 is arranged in the middle of the first direction of the silicon rod square-out device, so as to reduce the distance from the side skin clamping mechanism 523 to the side skin.
  • the supporting column 521 is provided The location is not limited to this.
  • the first mounting portion 522 is disposed on the supporting column 521, and the first mounting portion 522 can be used as a transition part between the edge leather clamping mechanism 523 and the supporting column 521.
  • the first mounting portion 522 A mounting portion 522 is, for example, a bearing block movably or fixedly arranged on the supporting column 521.
  • the at least one set of edge leather clamping mechanism 523 is connected to the first mounting portion 522 through a swing arm 524.
  • the first mounting portion 522 is fixed at a predetermined height of the supporting column 521, and the predetermined height is, for example, the top of the supporting column 521 to ensure that it is connected to the side of the first mounting portion 522.
  • the leather clamping mechanism 523 can lift the edge leather away from the cut silicon rod after clamping the edge leather.
  • the edge skin unloading device further includes a first lifting drive device (not shown) for driving the first mounting portion 522 to move up and down on the support column 521.
  • a first lifting drive device (not shown) for driving the first mounting portion 522 to move up and down on the support column 521.
  • the side leather clamping mechanism 523 connected to the first mounting portion 522 can be driven to move up and down in space.
  • the holding mechanism 523 can thereby realize the clamping and lifting of the side skin.
  • the first lifting driving device drives the first mounting portion 522 to descend so that the side skin clamping mechanism 523 contacts And to clamp the edge skin protruding from the cut silicon rod by being lifted, the first lifting drive device can then drive the edge skin clamping mechanism 523 in the clamped state to rise so that the edge skin separates from the cut silicon rod.
  • the side skin clamping mechanism 523 is a component for carrying out the clamping and transfer of the side skin.
  • the at least one set of the side skin clamping mechanism 523 is connected to the first mounting portion 522 through a swing arm 524, wherein the The swing arm 524 has a proximal end and a distal end.
  • the proximal end of the swing arm 524 is provided at the first mounting portion 522, and the side leather clamping mechanism 523 is provided at the distal end, that is, the extension end, of the swing arm 524.
  • the side leather clamping mechanism 523 is controlled to rotate around the swing arm shaft 525.
  • the set of side leather clamping mechanisms 523 are the extension ends of different swing arms 524 that are commonly used for the same swing arm shaft 525.
  • the set of side leather clamping mechanisms 523 includes two side leather clamping mechanisms 523, and each of the side leather clamping mechanisms 523 is provided on a swing arm 524.
  • the extension ends, and the proximal ends of different swing arms 524 in a group of edge leather clamping mechanisms 523 are connected to the same swing arm rotating shaft 525.
  • the different swing arms 524 connected to the swing arm shaft 525 of the set of edge leather clamping mechanisms 523 can be of equal length (shown as an example shown in FIG.
  • the included angle between different swing arms 524, the length of the swing arm 524, and the position of the swing arm axis 525 can be determined based on the position of the silicon rod bearing structure 11, where the edge skin is on the horizontal plane The position is determined by the silicon rod carrying structure 11 and the position of the cutting wire saw. It should be understood that an edge skin clamping mechanism 523 can be used to clamp the edge skin formed after the silicon rod on the silicon rod carrying structure 11 is cut.
  • the assembly side skin clamping mechanism 523 includes a plurality of side skin clamping mechanisms 523, and each side skin clamping mechanism 523 corresponds to a silicon rod on a silicon rod supporting structure 11, which can be based on the position (or vertical) of the silicon rod supporting structure 11
  • the position of the silicon rod placed in a conventional manner determines the position of the swing arm pivot 525, the length of the different swing arms 524, and the angle between the swing arms 524.
  • the position of the swing arm pivot 525 is preset based on the first mounting part when the edge is lifted.
  • the connection line between the position of the swing arm rotating shaft 525 and the different silicon rod supporting structures 11 determines the length of each swing arm 524 and the angle between the swing arm 524.
  • the silicon rod supporting structure 11 on the silicon rod square-out device is arranged at equal intervals, and each group of edge skin clamping mechanism 523 is used for the cut silicon rods on the two silicon rod supporting structures 11
  • the formed side skins are clamped and transported.
  • the swing arm shaft 525 is on the vertical plane of the two silicon rod supporting structures 11, and the two corresponding swing arm shafts 525 are connected to each other.
  • the two swing arms 524 are equal in length.
  • each of the at least one set of edge skin clamping mechanisms includes at least one edge skin clamping mechanism, that is, the edge skin included in the silicon rod discharging device
  • the clamping mechanism can be one group, two groups, three groups, four groups, etc.; among them, the number of the side skin clamping mechanisms in a group of side skin clamping mechanisms can be one, two, three, etc.
  • each group of side skin clamping mechanisms includes two side skin clamping mechanisms, which are located in the first A set of edge skin clamping mechanisms on both sides of the mounting part respectively remove the edge skins of the cut silicon rods on the two silicon rod bearing structures on the left and right sides of the machine base in the view.
  • the support column may be set at the midpoint of the length of the base, that is, the projection of the first mounting portion on the horizontal plane is located in the middle of the base, and a set of edge gripping mechanisms on opposite sides may be It is symmetrical. It should be understood that based on the symmetrical structure of the silicon rod carrying structure of the silicon rod square-out device, the space occupied by the device can be reduced under this setting.
  • the swing arm shaft 525 further includes a rotation drive device (not shown) for driving the edge gripping mechanism 523 connected to the extension end of the swing arm of the swing arm shaft 525 to clamp Holding the side skins and driving the side skins away from the cut silicon rods and then rotates at a predetermined angle, so as to transfer the side skins to the side skin unloading area.
  • a rotation drive device (not shown) for driving the edge gripping mechanism 523 connected to the extension end of the swing arm of the swing arm shaft 525 to clamp Holding the side skins and driving the side skins away from the cut silicon rods and then rotates at a predetermined angle, so as to transfer the side skins to the side skin unloading area.
  • the swing arm shaft 525 is connected to the power output shaft of a drive motor, and the drive motor controls the swing arm shaft 525 to rotate, thereby driving the swing arm connected to the swing arm shaft 525 to rotate
  • the side skin clamping mechanism 523 at the extension end of the swing arm is transferred to the side skin unloading area through an arc-shaped path formed by the continuous rotation.
  • the side skin clamping mechanism 523 can rotate around the swing arm shaft 525, and through the space above the machine base 10, when the side skin does not need to be transported, for example, when the silicon rod square-out device is in a resting state, it can be based on rotating the swing arm shaft 525.
  • the side leather clamping mechanism 523 can be stored above the machine base 10 to reduce equipment space; furthermore, the side leather clamping mechanism 523 has a degree of freedom of rotation based on the rotation of the swing arm shaft 525, which is compared with a straight path. , Carrying out the side skin transportation through the arc path can reduce the transportation distance, thereby increasing the transportation efficiency of the side skin.
  • the swing arm rotating shafts 525 on both sides rotate in opposite directions in the side skin transfer state, for example, in the state shown in FIG. 30 .
  • the horizontal projection of the side skin clamping mechanism 523 on both sides of the first mounting part 522 is located on the silicon rod bearing structure 11, the left side group of the side skin clamping mechanism 523 in the view rotates around the swing arm shaft 525 during transportation
  • the side leather clamping mechanism 523 is far away from the machine base within a certain angle range in compliance with the direction of rotation; correspondingly, a group of side leather clamping mechanisms 523 on the right side of the view is in transit
  • the direction of rotation around the swing arm shaft 525 is shown by the arrow on the right side in FIG.
  • each group of the side leather clamping mechanisms 523 is respectively equipped with a rotation driving device corresponding to the swing arm shaft 525, and the side leather
  • the direction in which the clamping mechanism 523 rotates around the corresponding swing arm rotation shaft 525 is not limited by this.
  • the method described here includes: based on the position of the swing arm rotation shaft 525, the side skin clamping mechanism 523 corresponding to the swing arm rotation shaft 525 is set at The rotation direction of the side skin is the direction away from the first mounting portion 522 (or the supporting column) when the side skin is transported.
  • the first mounting portion further includes at least one movement mechanism that provides movement in at least one direction, and is used to set the swing arm shaft.
  • the swing arm connected to the swing arm rotating shaft and the edge skin clamping mechanism at the extension end of the swing arm can follow the swing arm rotating shaft and move in at least one direction provided by the at least one moving mechanism.
  • the degree of freedom of movement of the side leather clamping mechanism can be increased to extend the moving range, so as to ensure that the moving range of the side leather clamping mechanism can transfer the side leather to the unloading area; at the same time, the first installation
  • the part and at least one moving mechanism included in it are located above the base, which can be used to save equipment space.
  • opposite sides of the first mounting portion are respectively provided with a set of edge gripping mechanisms through a swing arm rotating shaft.
  • a moving mechanism 5221 is provided on both sides of the first mounting portion 522.
  • the illustrated embodiment shows a linear motion mechanism.
  • the linear motion mechanism includes a linear guide 52211.
  • the guide rail 52211 is arranged along the width direction of the silicon rod square-out device, and the swing arm rotating shaft 525 moves along the linear guide rail 52211 to drive its corresponding set of edge gripping mechanisms to move away from or approach the silicon rod supporting structure 11.
  • the moving mechanism 5221 further includes a moving drive device, such as a traveling motor, provided on the swing arm shaft 525.
  • the traveling motor may be connected to the linear guide 52211 through a traveling screw, for example, by traveling The motor drives the swing arm shaft 525 to move along the linear guide 52211.
  • the moving mechanism 5221 includes a linear guide 52211 and a mobile driving device, wherein the mobile driving device includes a telescopic rod 52212 arranged along the direction of the linear guide 52211 and a driving source.
  • the linear guide 52211 is provided on the first mounting portion 522 and arranged along the width direction of the base; the telescopic rod 52212 and the linear guide 52211 are arranged collinearly, and the telescopic rod 52212 has a distal end and The proximal end, wherein the proximal end of the telescopic rod 52212 is connected to the driving source, the distal end of the telescopic rod 52212 is connected to the swing arm shaft 525, and the distal end of the telescopic rod 52212 is driven by the driving source to move along the axial direction of the telescopic rod 52212 In order to drive the swing arm rotating shaft 525 to move along the linear guide 52211.
  • the telescopic rod can also be replaced with a screw rod that is threadedly connected to the swing arm shaft.
  • the screw rod rotates along the screw shaft to transform into the axial direction of the screw rod at the swing arm shaft.
  • the rotation axis of the swing arm is driven by a servo motor to move along a linear guide rail, which is not limited in this application.
  • each of the at least one set of side skin clamping mechanisms includes: a clamping assembly for clamping or releasing the top end of the side skin; a second lifting drive structure for To drive the lifting and lowering movement of the clamping assembly.
  • the side skin clamping mechanism 523 includes a second lifting driving structure 5232 and a clamping assembly 5231 provided at the bottom of the second lifting driving structure 5232.
  • the second lifting drive structure 5232 is used to drive the clamping assembly 5231 for lifting movement.
  • the second lifting drive structure 5232 may be, for example, a lifting cylinder with a lifting rod, which is connected to the clamping unit 5232.
  • the components 5231 are connected, and the lifting cylinder can be used to control the expansion and contraction of the lifting rod to drive the clamping component 5231 to move up and down, but it is not limited to this.
  • the second lifting driving structure 5232 may also be a screw assembly driven by a motor, the screw assembly is connected to the clamping assembly 5231, and the motor drives the screw assembly to lift to drive the clamping assembly 5231 to move up and down.
  • the clamping assembly is a part for clamping the edge skin.
  • the clamping assembly includes a cover and a retractable clamping member.
  • the cover body is used to cover the side skin
  • the retractable clamping member is provided inside the cover body
  • the clamping member and the cover body are formed to clamp the side skin Clamping space.
  • Figure 34 shows a structural schematic diagram of the clamping assembly in an embodiment of the edge skin unloading device of this application
  • Figure 35 shows the clip of the edge skin unloading device of this application
  • the clamping assembly 5231 includes a cover 52311 and a retractable clamping member 52312.
  • the retractable clamping member 52312 is provided inside the cover 52311, and the clamping member 52312 is connected to the A clamping space for clamping the side skin is formed between the cover bodies 52311.
  • the cover body 52311 is used to cover the edge skin, the cover body 52311 can cover the size slightly larger than the cross-sectional circle of the silicon rod to be cut, and the cover body 52311 is set to be closed or non-closed Round cover, but not limited to this.
  • the top of the main body of the cover body 52311 has an opening for the side skin to be raised to protrude from the cover body 52311. It should be understood that when the side skin protrudes from the cover body 52311, it fits into the cover
  • the contact area of the clamping member 52312 clamped by the body 52311 and the edge skin reaches the maximum, which can be used to ensure the stability of the clamping component 5231 to clamp the edge skin.
  • the inner wall of the cover body 52311 is provided with a nylon toothed strip 523111 for contacting the clamped side skin, so that the friction force between the outer side of the side skin and the cover body 52311 is increased, so as to facilitate the side skinning. The promotion.
  • the clamping assembly includes an arc-shaped plate and a retractable clamping member, and the clamping member is between the arc-shaped plate and the arc-shaped plate. A clamping space for clamping the edge skin is formed.
  • the clamping member is a movable pressure block controlled by an air cylinder, and the movable pressure block is connected to the air cylinder through a rotating arm.
  • the rotating arm has a first rotating shaft, a first cantilever, and a first connecting portion located in the middle of the first cantilever, wherein the proximal end of the first cantilever is connected to the first rotating shaft, and the first cantilever A movable pressure block is connected to the distal end of a cantilever, and the first connecting portion is connected to the piston rod of the cylinder.
  • the cover 52311 is provided with a base 523112 for supporting the clamping member, and the base 523112 carries the clamping member into the cut silicon rod.
  • the air cylinder 52324 is fixed on the side wall of the base 523112 and has a piston rod, and the first rotating shaft 52322 of the rotating arm is hinged to a support seat fixed at the bottom of the base 523112.
  • the second cantilever can rotate around the first rotation axis 52322, and the first rotation axis 52322 is provided at the proximal end of the first cantilever 52321, and the movable pressing block 52321 is fixedly connected to the distal end of the first cantilever 52321 ,
  • the first connecting portion 52323 located between the proximal and distal ends of the first cantilever 52321 is hinged with the piston rod of the air cylinder 52324, and the air cylinder 52324 pushes the piston rod to telescopically move to drive the first cantilever 52321 to rotate around the first rotation axis 52322 That is, here, with the first rotating shaft 52322 as the fulcrum, the piston rod of the cylinder 52324 as the force acting point, and the first cantilever 52321 force lever, the movable pressure block 523121 at the distal end of the first cantilever 52321 can be driven to move.
  • the movable pressure block 52321 at the distal end of the first cantilever 52321 approaches or moves away from the cover 52311, and the clamping space between the movable pressure block 52321 and the cover 52311 can be adjusted.
  • the first rotating shaft 52322 which is set as the force application point of the first cantilever 52321, is located at the proximal end of the cantilever, and the first connecting portion 52323, which is the force point for the movement of the piston rod of the transmission cylinder, is provided in the middle of the first cantilever 52321.
  • the first connecting portion 52323 which is the force point for the movement of the piston rod of the transmission cylinder
  • the cylinder 52324 drives the piston rod to extend to drive the proximal end of the first cantilever 52321 to move down around the first shaft 52322, and the proximal end of the first cantilever 52321 descends around the first shaft 52322 to drive the movable pressing block 523121 to approach
  • the cover body 52311 is abutted against the side skin, the cylinder piston rod is kept stretched to maintain the side skin in a clamped state.
  • the first connecting portion may also be connected to a screw assembly or a telescopic rod driven by a motor, thereby driving the first cantilever to rotate around the first rotating shaft to realize the pressing or releasing of the side skin by the movable pressing block .
  • the rotating arm has a second cantilever, a second connecting portion, and a second rotating shaft located in the middle of the second cantilever, wherein the second connecting portion is provided at the proximal end of the second cantilever and connected to The piston rod of the cylinder and the distal end of the second cantilever are connected to the movable pressure block.
  • FIG. 36 shows a schematic cross-sectional structure diagram of the clamping assembly in another embodiment.
  • the cover body 52311 is provided with a base 523112 for carrying the clamping member 52312, and the base 52312 carries the clamping member 52312 to penetrate between the cut silicon rod and the edge skin.
  • the cylinder 52334 is fixed on the side wall of the base 523112 and has a piston rod.
  • the second rotating shaft 52332 of the rotating arm is hinged with a support seat fixed at the bottom of the base 52311 so that the second cantilever 52331
  • the movable pressing block 523121 is fixedly connected with the distal end of the second cantilever 52331, and the proximal end of the second cantilever 52331 of the rotary arm is hinged with the piston rod of the air cylinder 52334.
  • the cylinder 52334 pushes the piston rod to expand and contract to drive the second cantilever 52331 to rotate around the second rotation shaft 52332, that is, here, the second rotation shaft 52332 is the fulcrum of the force lever of the second cantilever 52331, and the piston rod of the cylinder 52334 acts as a force.
  • the movable pressure block 523121 at the distal end of the second cantilever 52331 approaches or moves away from the cover 52311 when the second cantilever 52331 rotates around the second rotation axis 52332. That is, the clamping space between the movable pressure block 523121 and the cover 52311 can be adjusted.
  • the second connecting portion 52333 connecting the cylinder piston rod, which is set as the force application point of the second cantilever 52331, is located at the proximal end of the cantilever.
  • the proximal end of the second cantilever 52331 receives an upward lifting force, and the distal end of the second cantilever 52331 moves downward and makes the movable pressing block 523121 close to the cover 52311 so as to press the side skin against the cover 52311 (as shown in Figure 36 The direction of the arrow).
  • the air cylinder 52334 drives the piston rod to extend to drive the proximal end of the second cantilever 52331 to move down around the second shaft 52332, and the proximal end of the second cantilever 52331 rises around the second shaft 52332 to drive the movable pressure block 523121 away from all sides.
  • the cover body 52311 returns to the initial state, and the clamping space between the movable pressing block 523121 and the cover body 52311 is increased to facilitate the release of the side skin.
  • the cylinder piston rod is connected above the proximal end of the second cantilever 52331, and the piston rod is contracted to drive the movable pressing block 523121 to compress the side skin; in other examples, when the cylinder piston rod is connected to the second cantilever Below the proximal end of the 52331, the piston rod of the cylinder stretches to lift the proximal end of the second cantilever 52331 upward and rotates upwards, so that the movable pressure block 523121 approaches and compresses the side skin during the downward movement.
  • the second connecting portion can also be connected to a screw assembly or a telescopic rod driven by a motor, thereby driving the second cantilever to rotate around the second rotating shaft to realize the pressing or releasing of the side skin by the movable pressing block .
  • the number of clamping members in the edge skin clamping mechanism can be changed correspondingly based on the form of the wire cutting device in the silicon ingot square rooting equipment.
  • the wire cutting device of the silicon ingot square rooting device has Single wire cutting unit, based on the cutting wire saw formed in the single wire cutting unit, the cutting operation of the silicon rod to be cut requires four single-axis face cutting steps.
  • the number of the clamping members is set to one .
  • each wire cutting device includes two wire cutting units, and the two wire cutting units form relatively parallel cutting wire saws. In one cutting operation, two parallel shaft surfaces are formed by cutting.
  • the clamping members are arranged as two oppositely arranged. Perform the first cutting of two parallel axis surfaces to form two side skins. The two side skins formed at the corresponding positions are clamped and transported to the unloading area with the two clamping parts, and then the silicon rods to be cut are adjusted. Cut the surface (for example, make the silicon rod bearing structure rotate 90 degrees around the silicon rod axis), perform a second cutting to form two parallel axis surfaces and form two side skins, and again use two clamps to set the corresponding positions The formed two side skins are clamped and transferred out.
  • the movable pressure block in order to prevent the movable pressure block from contacting the side skin during long-term clamping, causing wear and damage to each other, in some embodiments, is provided with a cushion for contacting the side skin.
  • the cushioning pad is made of, for example, an elastic rubber material, or silica gel or other materials with elastic deformation, damping characteristics or cushioning characteristics, so as to prevent the surface of the edge skin from being scratched or bumped during the clamping and transportation. Shattered.
  • the side skin unloading device further includes a side skin tube arranged in the side skin unloading area.
  • the barrel mouth of the side leather barrel can be designed to be larger or a bell mouth to facilitate the placement of the side leather without obstacles, and the height of the barrel arm of the side leather barrel is also relatively high to ensure The inserted side skin will not overturn and so on. In this way, the side skin is moved from the cutting area to the side skin tube by the clamping and transfer unit, and then the side skin can be taken out of the side skin tube by the operator.
  • FIGS. 37a to 37e Schematic diagram of the different states of carrying out the side skin transfer in the equipment.
  • the side skin clamping mechanism transfers the side skin to the side skin unloading area by rotating the swing arm around the rotation axis of the swing arm by a preset angle, and the preset angle can be determined based on the position of the side skin unloading area, as shown in Fig. 37a As shown in Fig.
  • the edge skin clamping mechanism 523 is driven by the first driving device to follow the first mounting portion 522 and descend to the end surface of the silicon rod ( As shown in Figure 37a), the side skin is protruded from the end surface of the silicon rod by the side skin lifting unit, the side skin clamping mechanism 523 can thereby clamp the side skin, and the movable pressing block in the clamping assembly presses the side skin against the end surface of the silicon rod. Lean against the cover body or the arc-shaped plate, and then the first driving device drives each side skin clamping mechanism 523 connected to the mounting portion to rise (in the state shown in FIG.
  • the rotation driving device drives the side leather clamping mechanism 523 to rotate a predetermined angle.
  • a set of side leather clamping mechanisms 523 are respectively provided on both sides of the first mounting portion 522, each The side leather clamping mechanism 523 is driven by its corresponding rotating drive device to rotate 120° in a direction away from the first mounting portion 522 to reach above the side leather unloading area, and then the side leather clamping mechanism 523 follows the first
  • the mounting part 522 is driven down by the first lifting driving device, the movable pressing block in the clamping assembly is far away from the side skin to increase the clamping space, and the clamped side skin is placed in the side skin collection device in the side skin unloading area, such as the side skin.
  • the side skin clamping mechanism 523 is driven to rise in accordance with the first mounting portion 522, and rotates a certain angle to return to the waiting position (as shown in Figure 37e). After cutting to form a new edge skin, repeat the aforementioned transfer process to unload the edge skin again.
  • the ascending and descending of the side skin clamping mechanism 523 in the foregoing process can also be driven by the second lifting drive structure, or simultaneously driven by the first lifting drive device and the second lifting drive structure.
  • the side skin unloading device includes a side skin conveying structure, the side skin conveying structure is arranged in the side skin unloading area, and is used for conveying the side skin that has been operated by the side skin clamping mechanism.
  • the edge skin conveying structure may be, for example, a conveyor belt.
  • the side skin unloading area is the area where the side skins are unloaded in the silicon rod opener device. Specifically, the side skin unloading area is the area underneath after the side skin clamping mechanism removes the side skins from the cutting area. Corresponding area.
  • the side skin is transferred from the cutting area to the side skin unloading area by the side skin clamping mechanism, and the clamping component in the side skin clamping mechanism is loosened to release the side skin to the conveyor belt as the side skin conveying structure On the top, the side skins are transported out by the conveyor belt.
  • the side skin unloading device may include a side skin tube and a side skin conveying structure at the same time, wherein the side skin conveying structure may be, for example, a conveyor belt, and the side skin tube is disposed adjacent to the side skin tube.
  • the starting end of the conveyor belt for example, the side skin tube is located beside the starting end of the conveyor belt or directly above the starting end of the conveyor belt, etc.
  • the barrel mouth of the side leather tube can be designed to be larger or a flared mouth, so that the side leather can be inserted without obstacles, and the height of the barrel arm of the side leather tube is also relatively high, which can ensure the inserted side The skin will not overturn and so on.
  • the side skin tube may be of a reversible design. By turning over the side skin tube, each side skin in the side skin tube can be smoothly transferred to the conveyor belt.
  • the bottom of the side skin tube is provided with a turning drive mechanism, and the turning drive mechanism may include a turning plate, a rotating shaft, and a turning drive source (such as a turning motor or a turning cylinder, etc.).
  • the side skin tube is turned over to drive the side skin in the tube to transfer to the conveyor belt, and the side skin is transferred to the conveyor belt by the conveying The belt transports the side skins out.
  • the present application provides a side skin unloading device for silicon rod square-out equipment.
  • the side skin discharge device can be stored in the space above the base of the silicon rod square-out equipment in an idle state to save silicon.
  • the side skin clamping mechanism can be rotated by the swing arm around the swing arm axis to transfer the clamped side skin to the side skin unloading area, thereby shortening the transfer
  • the side skin unloading device can be provided with multiple sets of side skin clamping mechanisms in one-to-one correspondence with the silicon rod bearing structure of the silicon rod square-out equipment, so as to improve the efficiency of the side skin clamping and transportation and reduce the time cost.
  • the application also provides a silicon rod square-out equipment, which includes a base; a silicon rod bearing structure for supporting silicon rods placed vertically; and a wire cutting device, which is arranged above at least two silicon rod bearing structures, It includes a plurality of cutting wheels and at least one cutting line of a cutting wire saw formed around the plurality of cutting wheels; as shown in Fig. 30 to Fig. 37e, the edge skin unloading device according to any one of the embodiments is implemented.
  • the base is set as the main part of the silicon rod square-out equipment of this application, and is used to provide a square-out work platform.
  • the base has a larger volume and weight to provide a larger mounting surface and a firmer The stability of the whole machine.
  • the silicon rod carrying structure is used to carry silicon rods placed vertically, each of the silicon rod supporting structures has a rotating mechanism, and the rotating mechanism is used to drive the silicon rods placed on the silicon rod carrying structure to rotate for adjustment The surface to be cut.
  • the rotating mechanism is configured as a rotating turntable located at the bottom of the silicon rod carrying structure, and the rotating turntable is controlled by a driving device (not shown).
  • the driving device may be, for example, a driving rotating turntable. Rotating servo motor, but not limited to this.
  • the rotating mechanism may adopt a lifting design, that is, the rotating turntable at the bottom of the silicon rod bearing structure can be telescopic after being controlled to drive the silicon rod bearing structure to move up and down, thereby adjusting the silicon rod bearing The height of the silicon rod to be cut on the structure.
  • the wire cutting device includes a cutting frame and a liftable wire cutting support set on the cutting frame.
  • a plurality of cutting wheels are arranged on the wire cutting support and at least one cutting wheel is formed around the plurality of cutting wheels.
  • the cutting line of the wire saw drives the cutting wire saw to lift and feed the silicon rods arranged on the silicon rod carrying structure when the online cutting support moves up and down to cut the silicon rods.
  • the side skin unloading device and the wire cutting device in the silicon rod square-out equipment can cooperate with each other. After the on-line cutting device cuts the silicon rod to form a side skin, the side skin is lifted by the side skin unloading device to protrude and clamp the cut silicon rod.
  • the side skin clamping mechanism in the side skin unloading device can be rotated around the swing arm shaft through the swing arm to transfer the clamped side skin to the side skin unloading area, thereby shortening the transfer path, and at the same time,
  • the side skin unloading device can be provided with multiple sets of side skin clamping mechanisms corresponding to the silicon rod bearing structure of the silicon rod square-out equipment, so as to improve the efficiency of the side skin clamping and transportation, reduce the time cost, and the side skin is transferred and placed. After that, the cut silicon rods are unloaded, and the silicon rod square extraction equipment can continue the square extraction operation of the silicon rods to be cut. Reduce labor costs and improve processing efficiency.

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Abstract

一种用于硅棒开方设备的边皮卸料装置，该边皮卸料装置包括边皮提升单元（51）和边皮夹持单元（52），在闲置状态下边皮夹持单元可收纳于硅棒开方设备机座（10）上方的空间内以节省硅棒开方设备整体占据的设备空间，在边皮夹持转运状态下边皮夹持机构可通过摆臂（524）绕摆臂转轴（525）旋转以将所夹持的边皮转运至边皮卸载区，由此缩短转运路径。以及带有该边皮卸料装置的硅棒开方设备，边皮卸料装置中可设置多组边皮夹持机构（523）与硅棒开方设备的硅棒承载结构（11）一一对应，以提高边皮夹持转运的效率，缩减时间成本。

Description

边皮卸料装置及硅棒开方设备 技术领域
本申请涉及硅棒加工技术领域，尤其涉及一种硅棒边皮卸料装置及硅棒开方设备。
背景技术
目前，随着社会对绿色可再生能源利用的重视和开放，光伏太阳能发电领域越来越得到重视和发展。光伏发电领域中，通常的晶体硅太阳能电池是在高质量硅片上制成的，这种硅片从提拉或浇铸的硅锭后通过多线锯切割而成。一般采用硅棒开方设备对硅棒进行开方，此时，切割机构沿硅棒长度方向进给并在硅棒周向上切割出四个两两平行的平面；开方完毕后，再采用多线切片机沿长度方向对开方后的硅棒进行切片，得到所需硅片。
在相关的硅棒开方作业中，硅棒经开方切割后会形成边皮，因此，需先将形成的边皮予以卸载，一般的边皮卸载方式大多还是由操作人员手工操作将边皮脱离于已切割硅棒并将其搬离出硅棒开方设备，不仅效率低下，且在搬运过程中会使得边皮与已切割硅棒发生碰撞而增加已切割硅棒损伤的风险，则边皮难以再利用。
发明内容
鉴于以上所述相关技术的缺点，本申请的目的在于提供一种硅棒开方设备及应用于硅棒开方设备的边皮卸料装置，以解决现有技术中人工转运边皮效率低下且使得边皮容易损毁的问题。
为实现上述目的及其他相关目的，本申请公开了一种应用于硅棒开方设备的边皮卸料装置，所述硅棒开方设备包括机座、线切割装置和硅棒承载结构，所述硅棒承载结构用于承载立式置放的硅棒，所述线切割装置包括可升降的线切割支座和设于所述线切割支座上的线切割单元，所述线切割单元中具有切割线锯，所述切割线锯切割硅棒形成已切割硅棒和边皮；所述边皮卸料装置包括：边皮提升单元，用于提升所述边皮以使得所述边皮顶端凸出所述已切割硅棒；边皮夹持单元，包括：支撑柱，设于所述机座上；第一安装部，设于所述支撑柱上；至少一组边皮夹持机构，通过摆臂连接至所述第一安装部，用于夹持所述边皮并提升所述边皮脱离已切割硅棒，以及受控绕摆臂转轴转动以将所述边皮转运至边皮卸载区。
在本申请第二方面还提供了一种硅棒开方设备，用于对截面为圆形的硅棒进行开方作业，其特征在于，包括：机座；硅棒承载结构，用于承载立式置放的硅棒；以及线切割装置，设 置在硅棒承载结构的上方，包括多个切割轮以及绕于所述多个切割轮形成有至少一条切割线锯的切割线；如本申请第一方面任一实施方式所述的边皮卸料装置。
综上所述，本申请提供的用于硅棒开方设备的边皮卸料装置及硅棒开方设备，具有如下有益效果：所述边皮卸料装置在闲置状态下可收纳于硅棒开方设备机座上方的空间内以节省硅棒开方设备整体占据的设备空间，在边皮夹持转运状态下边皮夹持机构可通过摆臂绕摆臂转轴旋转以将所夹持的边皮转运至边皮卸载区，由此缩短转运路径，同时，所述边皮卸载装置中可设置多组边皮夹持机构与硅棒开方设备的硅棒承载结构一一对应，以提高边皮夹持转运的效率，缩减时间成本。
附图说明
本申请所涉及的实用新型的具体特征如所附权利要求书所显示。通过参考下文中详细描述的示例性实施方式和附图能够更好地理解本申请所涉及实用新型的特点和优势。对附图简要说明如下：
图1显示为本申请的硅棒装卸装置在一实施例中的结构示意图。
图2a显示为硅棒装卸装置在一实施例中夹持待切割硅棒状态下的部分结构示意图。
图2b显示为硅棒装卸装置在一实施例中夹持待切割硅棒状态下的部分结构仰视图。
图3a显示为硅棒装卸装置在一实施例中夹持已切割硅棒状态下的部分结构示意图。
图3b显示为硅棒装卸装置在一实施例中夹持已切割硅棒状态下的部分结构仰视图。
图4显示为本申请的硅棒装卸装置在一实施例中的一硅棒夹持件的结构示意图。
图5显示为本申请的硅棒装卸装置在一实施例中的结构示意图。
图6显示为本申请的硅棒装卸装置在一实施例中的升降驱动机构的结构示意图。
图7a-7b显示为硅棒装卸装置在一实施例中的升降驱动机构在不同状态的结构示意图。
图8a-8d显示为本申请的硅棒装卸装置在一实施例中处于不同转运状态的示意图。
图9显示为本申请的硅棒加工设备的硅棒运动装置在一实施例中的结构示意图。
图10显示为本申请的硅棒加工设备的弹性推杆结构在一实施例中结构示意图。
图11显示为本申请的硅棒加工设备的硅棒运送装置在一实施例中的部分结构示意图。
图12显示为本申请的硅棒加工设备的硅棒运送装置在一实施例中的结构示意图。
图13显示为本申请的硅棒压紧装置在一实施例中的结构示意图。
图14a显示为本申请的硅棒压紧装置在一实施例中的结构示意图。
图14b-14c显示为图14a中B在不同锁紧状态下的放大示意图。
图15显示为图13中A处放大示意图。
图16显示为本申请的线切割装置在一实施例中的结构示意图。
图17实现为本申请的线切割装置在一实施例中应用于硅棒开方设备中的结构示意图。
图18显示为本申请的线切割装置在一实施例中应用于硅棒开方设备中的结构示意图。
图19显示为本申请的线切割装置中线切割单元在一实施例中的结构示意图。
图20显示为线切割装置在一实施例中的中间切割轮和其旁侧的过渡轮的结构示意图。
图21显示为本申请的为硅棒截断设备的硅棒加工设备在一实施例中的部分结构示意图。
图22显示为硅棒切磨一体机的硅棒加工设备在一实施例中的部分结构示意图。
图23显示为本申请的线切割装置在一实施例中的结构示意图。
图24显示本申请的线切割装置在一实施例中的过渡轮及支架的结构示意图。
图25显示为图23中C处的放大示意图。
图26显示为图17中D处的放大示意图。
图27显示为本申请的线切割装置在一实施例中的俯视图。
图28显示为本申请的线切割装置在一实施例中的侧视图。
图29显示为图28中E处的放大结构示意图。
图30显示为本申请的边皮卸料装置在一实施例中应用于硅棒开方设备中的结构示意图。
图31显示为本申请的边皮卸料装置在一实施例中的结构示意图。
图32显示为本申请的边皮卸料装置在一实施例中边皮顶托机构的结构示意图。
图33显示为本申请的边皮卸料装置在一实施例中的边皮提升单元的结构示意图。
图34显示为本申请的边皮卸料装置在一实施例中的夹持组件的结构示意图。
图35显示为本申请的边皮卸料装置在一实施例中的夹持组件的剖面示意图。
图36显示为本申请的边皮卸料装置在另一实施例中的夹持组件的剖面示意图。
图37a-37e显示为边皮卸料装置在一实施例中执行边皮转运的不同状态示意图。
具体实施方式
以下由特定的具体实施例说明本申请的实施方式，熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本申请的其他优点及功效。
在下述描述中，参考附图，附图描述了本申请的若干实施例。应当理解，还可使用其他实施例，并且可以在不背离本公开的精神和范围的情况下进行机械组成、结构以及操作上的 改变。下面的详细描述不应该被认为是限制性的，并且本申请的实施例的范围仅由公布的专利的权利要求书所限定。这里使用的术语仅是为了描述特定实施例，而并非旨在限制本申请。空间相关的术语，例如“上”、“下”、“左”、“右”、“下面”、“下方”、“下部”、“上方”、“上部”等，可在文中使用以便于说明图中所示的一个元件或特征与另一元件或特征的关系。
虽然在一些实例中术语第一、第二等在本文中用来描述各种元件或参数，但是这些元件或参数不应当被这些术语限制。这些术语仅用来将一个元件或参数与另一个元件或参数进行区分。例如，第一线槽可以被称作第二线槽，并且类似地，第二线槽可以被称作第一线槽，而不脱离各种所描述的实施例的范围。第一线槽和第二线槽均是在描述一个线槽，但是除非上下文以其他方式明确指出，否则它们不是同一个线槽。相似的情况还包括第一线切割单元与第二线切割单元，或者第一切割轮组与第二切割轮组。
晶体硅在工业生产中通常被加工为硅片形态后再用于产品制造，其中，原始获得的硅棒包括单晶硅棒与多晶硅棒，单晶硅棒即通过用直拉法或悬浮区熔法从熔体中生长出棒状单晶硅，例如在硅棒加工中常见的例如为5000mm或5360mm等长度规格的单晶硅棒，又或大约为800mm长度的单晶硅棒等，多晶硅即采用析出技术如化学气相沉积技术使硅在硅芯线表面析出的硅棒。
现有硅片的制作流程，一般是先将多晶硅脆状材料提拉为单晶硅棒，然后采用开方机进行开方；此时，切割机构沿硅棒长度方向进给并在硅棒周向上切割出四个两两平行的平面，使得硅棒截面呈类矩形；开方完毕后，再采用多线切片机沿长度方向对开方后的硅棒进行切片，得到所需硅片。
在对硅棒的开方作业中，需要将待切割硅棒(即还未进行开方的硅棒)装载至硅棒开方设备上预设的承载位置，以便于配合线切割装置以预设的规格对硅棒进行开方切割，在开方完成后，需要将已切割硅棒转运离开机座的承载结构以使得硅棒开方设备可继续切割加工待切割硅棒。
本申请提供了一种用于硅棒开方设备的硅棒装卸装置，所述硅棒开方设备包括机座、硅棒承载结构、以及线切割装置，所述硅棒承载结构用于承载立式置放的硅棒；所述硅棒装卸装置包括：第一支架，通过一安装框吊装于所述机座；硅棒夹具，设于所述第一支架上，用于夹持待切割硅棒或已切割硅棒；移位机构，用于驱动所述第一支架及其上的硅棒夹具在所述安装框上沿至少一个方向移位，使得所述硅棒夹具移动至第一预定位置以夹持待切割硅棒或已切割硅棒并将夹持的待切割硅棒或已切割硅棒移送到第二预定位置。
在此，所述第一预定位置、第二预定位置并部限于在所设立的坐标系中确立的固定位置 或区域，在本申请提供的示例中，通过确定所述装卸装置在进行装卸中的转移路径，顺应转移的时间顺序，将转移路径中硅棒装卸装置中第一支架的起始位置作为第一预定位置，第一支架终点位置作为第二预定位置。在此，当所述硅棒装卸装置执行的是上料过程，则硅棒夹具执行夹持待切割硅棒的位置为第一预定位置，通过移动机构运动以将待切割硅棒移动到硅棒承载结构的承托面上方以将待切割硅棒置放于硅棒承载结构的位置为第二预定位置；反之，当所述硅棒装卸装置执行的是将开方完成后的已切割硅棒移送出机座的下料过程，第一支架位于硅棒承载结构邻位以夹持已切割硅棒的位置作为起始位置也即第一预定位置，已切割硅棒被硅棒夹具转运离开机座并予以释放的位置为第二预定位置。
请参阅图1，显示为本申请的硅棒装卸装置在一实施例中的结构示意图。如图所示，所述第一支架31通过以安装框33吊装于所述机座。在此，所述第一支架31可作为硅棒夹具32的承载结构，所述第一支架31活动设置于所述安装框33上并可在移位机构作用下沿至少一个方向移动，由此实现由硅棒夹具32夹持的待切割硅棒或已切割硅棒移动。
所述安装框33设置于机座上方，在此，所述安装框33可用于确定第一支架31沿安装框33移动的路径与范围跨度，在某些实施方式中，如图1所示的示例中，所述安装框33设置于机座的硅棒加工平台中的装卸区的硅棒承载结构上方，同时，所述安装框33在第一方向的长度范围大于装卸区，或，所述安装框33在第一方向的长度端点位于装卸区的硅棒承载结构外侧，以使得所述第一支架31沿安装框33移动时可移动至装卸区的任一硅棒承载结构邻位以将待切割硅棒安置于对应的硅棒承载结构或将硅棒承载结构上的已切割硅棒转运离装卸区。在此，所述装卸区为在硅棒开方设备的硅棒加工平台上进行装载和卸料的区域。例如，在某些示例中，所述安装框33平行于硅棒开方设备的线切割支座设置，以充分利用机座上方空余的设备空间。
所述硅棒装卸装置3可通过安装框33设于硅棒开方设备的机座上，在某些示例中，所述硅棒装卸装置3也可作为单独的组件与硅棒开方设备拆分，例如作为独立的销售装置。例如，所述安装框33与硅棒开方设备为可拆卸连接，所述安装框33与第一支架31及硅棒夹具32可设置于硅棒开方设备上；又如，所述第一支架31与安装框33为可拆卸连接，所述第一支架31与硅棒夹具32可设置在包括安装框33或吊装架的硅棒开方设备上。
所述硅棒夹具32设于所述第一支架31上，在此，所述硅棒夹具32中包括硅棒夹持件，所述硅棒夹持件接触硅棒表面并执行夹持或释放动作。在某些示例中，所述硅棒夹具32中包括一个硅棒夹持件，在此示例下，所述硅棒夹持件的夹持面可设置为具有一定的高度以确保夹持状态下硅棒夹持件与立式放置的硅棒侧面的接触面积可实现夹持。
请参阅图2a，显示为本申请的硅棒装卸装置的第一支架31及硅棒夹具在一示例中的结构示意图。如图2a所示，所述第一支架31上的任一所述硅棒夹持件包括相对设置的第一夹臂321和第二夹臂322，以及夹臂驱动机构320，用于驱动所述第一夹臂321和第一夹臂321作开合动作。应当理解，所述第一夹臂321与第二夹臂322可为镜像设置或对称设置，当第一夹臂321与第二夹臂322执行闭合动作，即可用于靠近并夹持硅棒；当所述第一夹臂321与第二夹臂322执行张开动作，即可用于释放所夹持的硅棒。
在某些实施方式中，所述第一夹臂及第二夹臂具有夹持弧面和夹持平面。在此，所述硅棒夹持件可用于夹持待切割硅棒或已切割硅棒，为实现将所夹持的硅棒立式放置于硅棒承载结构上或从硅棒承载结构处夹持立式置放的硅棒，所述第一夹臂与第一夹臂通过开合动作在硅棒侧面进行夹持，也即，在夹持状态下所述硅棒为立式。对应地，所述第一夹臂和第一夹臂具有适配于待切割硅棒表面弧面的夹持弧面，以及适配于已切割硅棒的侧面平面的夹持平面。
所述第一夹臂和第二夹臂的夹持弧面并不限于在夹臂上设置用于接触硅棒的弧面，在某些实现方式中，请参阅图2a至图3b，显示为本申请的硅棒夹持件在不同夹持状态下的侧视图和仰视图，其中，图2a和图2b为硅棒夹持件夹持具有弧形侧面的待切割硅棒的立体示意图和仰视图，图3a和图3b为硅棒夹持件夹持已切割硅棒的立体示意图和仰视图。如图所示，所述第一夹臂和第二夹臂上对称的设有夹持弧面和夹持平面。
如图3a、图3b所示，所述夹持弧面可以为顺应硅棒表面弧度设置在不同方向的接触平面，在图3b所示视图下，单个夹臂上的所述不同方向的平面对称于硅棒截面的直径，使得第一夹臂321与第二夹臂322在夹持中施加于硅棒的压力交汇于硅棒截面圆心，以防止夹持状态下硅棒受到的压力合力的延长线在夹持弧面之外而使得硅棒具有脱离硅棒夹持件的倾向。
在某些实现方式中，所述第一夹臂、第二夹臂的夹持弧面超过待切割硅棒侧面四分之一的圆弧，在进行夹持时形成的夹持接触面超过硅棒侧面二分之一圆弧；再者，所述夹持弧面上还可设置有缓冲垫，以避免在夹持状态下损伤硅棒表面。所述缓冲垫例如采用具有弹性的橡胶材料制成，或者硅胶或由其他具有弹性形变、阻尼特性或缓冲特性的材料制成，以防止夹持转运中待切割硅棒或已切割硅棒的表面被划伤或磕碰碎裂。
在某些示例中，所述夹臂驱动机构包括：开合齿轮、齿条及驱动源(未予以图示)；其中，所述第一夹臂及第二夹臂上分别设有开合齿轮，所述齿条的相对两侧分别设有与所述第一夹臂和第二夹臂上的开合齿轮啮合对应的齿纹，所述驱动源连接与所述齿轮驱动件，用于驱动所述齿轮驱动件运动。
在一种实现方式上，齿轮驱动件为齿条，该齿条位于第一夹臂与第二夹臂中间，齿条中分别面向于两侧的夹臂的两个外侧面上分别设有与第一夹臂和第二夹臂上的开合齿轮啮合对应的齿纹，驱动源可例如为驱动电机或气缸。这样，根据上述实现方式，在实际应用中，当需实现夹臂夹合时，由作为驱动源的驱动电机或气缸驱动作为齿轮驱动件的齿条向上移动，由齿条带动两旁啮合的开合齿轮作外旋动作，开合齿轮在外旋过程中带动夹臂(开合齿轮与夹臂可通过转轴连接)作下放动作以由松开状态转入夹合状态；反之，当需实现夹臂松开时，由作为驱动源的驱动电机(或气缸)驱动作为齿轮驱动件的齿条向下移动，由齿条带动两旁啮合的开合齿轮作内旋动作，开合齿轮在内旋过程中带动夹臂(开合齿轮与夹臂可通过转轴连接)作上扬动作以由夹合状态转入松开状态。当然，上述仅为一实施例，并非用于限制硅棒夹持件的工作状态，实际上，前述中的“向上”、“外旋”、“下放”、“向下”、“内旋”、“上扬”、以及“松开”和“夹合”状态变化均可根据夹臂的结构和运作方式、夹臂驱动机构的构造而有其他的变更。
在另一实现方式中，请参阅图4，显示为本申请的硅棒装卸装置的一硅棒夹持件在一实施例中的结构示意图。如图所示，所述夹臂驱动机构320包括：第一齿条3201、第二齿条3202、夹紧气缸3203以及传动齿轮3204；所述第一齿条3201联动于所述第一夹臂，所述第二齿条3202联动于所述第二夹臂，所述传动齿轮3204与所述第一齿条3201及所述第二齿条3202相啮合，用于在正向转动时带动所述第一夹臂及第二夹臂相向运动以执行闭合动作，在逆向转动时带动所述第一夹臂及第二夹臂背向运动以执行张开动作。基于齿轮间或齿轮与齿条间外部啮合的基本规律，所述第一齿条3201在传动齿轮3204旋转时，沿与所述传动齿轮3204上侧齿部的线速度的反方向运动；所述第二齿条3202在传动齿轮3204旋转时，沿所述传动齿轮3204下侧齿部的线速度的反方向运动。所述传动齿轮3204旋转时关于齿轮中心对称的第一齿条3201与第二齿条3202必然满足线速度方向相反的关系，即表现为相向靠近或相互远离的运动。如，当所述夹紧气缸3203推动第一齿条3201或第二齿条3202运动以带动传动齿轮3204旋转，当所述传动齿轮3204处于正转状态，所述第一齿条3201与第二齿条3202相向靠近以驱使第一夹臂和第二夹臂相向靠近执行闭合动作；当所述传动齿轮3204处于反转状态，所述第一齿条3201与第二齿条3202相互远离以驱使第一夹臂和第二夹臂相互远离以执行张开动作。
在又一实现方式中，所述夹臂驱动机构包括第一齿条、第二齿条以及驱动齿轮；所述第一齿条联动于所述第一夹臂，所述第二齿条联动于所述第二夹臂，所述驱动齿轮连接于驱动电机的动力输出轴(未予以图示)，并与所述第一齿条及所述第二齿条相啮合，用于在正向转 动时带动所述第一夹臂及第二夹臂相向运动以执行闭合动作，在逆向转动时带动所述第一夹臂及第二夹臂背向运动以执行张开动作。所述第一齿条与第二齿条可啮合于所述驱动齿轮的两侧，使得驱动齿轮旋转时第一齿条和第二齿条处的线速度方向相反，由驱动电机带动所述驱动齿轮旋转，令驱动齿轮正转时第一齿条与第二齿条相向运动即带动第一夹臂与第二夹臂相向运动以执行闭合动作，驱动齿轮被带动逆向转动时第一齿条与第二齿条背向运动以带动第一夹臂和第二夹臂背向运动以执行张开动作。
在某些示例中，所述硅棒夹具中的硅棒夹持件在升降方向固定设置于所述第一支架上，用于夹持同一规格或预设的规格范围(例如长度为500mm至800mm)内的硅棒。在某些示例中，所述第一支架上可设置多组硅棒夹持件以确保所述硅棒装卸装置可夹持的硅棒涵盖各类长度规格。
在此，针对单晶圆硅棒，是通过对原初的长硅棒进行截断作业而形成的，势必使得单晶圆硅棒之间的尺寸差异迥异，鉴于硅棒夹持件是用于对竖立放置状态下的单晶圆硅棒或开方后的已切割硅棒进行夹持，因此，对于硅棒夹具而言，前述尺寸差异的影响主要就表现在单晶圆硅棒的长度差异性对硅棒夹具中的硅棒夹持件是否能对应夹持到单晶圆硅棒的隐忧。
为减少甚至是免除上述硅棒夹持件可能会无法夹持到硅棒的风险，硅棒夹具会有不同的设计方案。
在某些示例中，所述硅棒夹具中包括至少两个硅棒夹持件，其中两个硅棒夹持件间距设置于所述第一支架上。例如图2a、图3a所示实施例中，所述第一支架31主体呈立式，所述硅棒夹具中的两个硅棒夹持件上下间隔设置在第一支架31上。在具体实现方式中，所述硅棒夹持件可藉由夹持件安装座设于所述第一支架31，在某些示例中，所述夹持件安装座为活动设置在所述第一支架31上，用以调整所述硅棒夹持件相对于硅棒的夹持部位或间隔设置的硅棒夹持件之间的距离。例如在图示实施例中，所述第一支架31设有升降导轨，所述夹持件安装座可设置为活动设于所述升降导轨的滑块，由此可实现沿第一支架31上下移动。在此设置下，不同硅棒夹持件之间的间距可调整，即可基于数量较少如为两个的硅棒夹持件实现对不同规格的硅棒的夹持。
在某些示例中，所述硅棒夹具还包括升降驱动机构，所述至少两个硅棒夹持件中的至少一个硅棒夹持件由所述升降驱动机构驱动沿所述第一支架作升降运动。例如，当所述硅棒夹具中包括两个硅棒夹持件，可将其中一个硅棒夹持件固定于所述第一支架，另一硅棒夹持件活动设置于所述第一支架并由所述升降驱动机构带动沿第一支架升降运动；又如，所述硅棒夹具中的两个硅棒夹持件均可活动设置于所述第一支架，并在所述升降驱动机构求驱动下沿 第一支架升降运动。
在某些示例中，所述升降驱动机构包括：传动链条以及至少一个锁止装置；其中，所述传动链条绕设于上下设置的两个传动链轮上，所述两个传动链轮中的至少一个传动链轮轴接于链轮驱动源，所述至少一个锁止装置设于至少一硅棒夹持件上，用于转换所述至少一硅棒夹持件与所述传动链条之间锁止和活动两种状态。
在此，所述至少一个锁止装置与至少一硅棒夹持件对应，例如，当所述锁止装置为一个，即设置在一个硅棒夹持件上，当所述锁止装置为两个，则设置在两个硅棒夹持件上，每一锁止装置用于对一个硅棒夹持件与传动链条之间的锁止或活动状态的控制，以实现硅棒夹持件顺应传动链条运动或停止在第一支架上的预设高度的状态切换。
请参阅图5，显示为本申请的硅棒装卸装置在一实施例中的结构示意图。所述升降驱动机构323中设有传动链条3231，所述传动链条3231可设置为环状链条(呈如图5所示实施例)或开放的具有端点的链轮，所绕设的传动链轮3232中至少一个由例如驱动电机的链轮驱动源3233驱动旋转，由此带动啮合于传动链轮3232的传动链条3231运动，所述传动链条3231运动的方向由上下设置的传动链轮3232的位置确定，例如，当所述上下设置的传动链轮3232位于同一铅垂线上，两个传动链轮3232之间的传动链条3231即在升降方向运动。
请参阅图6，显示为本申请的升降驱动机构的部分结构在一实施例中的简化示意图。在某些实施方式中，所述锁止装置3234包括：锁止链轮32341以及锁紧机构32340，所述锁止链轮32341可转动的设置于所述硅棒夹持件上并啮合于所述传动链条3231，所述锁紧机构32340设于所述硅棒夹持件，用于锁紧所述锁止链轮32341使得所述锁止链轮32341相对传动链条3231静止，以使所述锁止链轮32341连接的硅棒夹持件与传动链条3231之间从活动状态切换至锁止状态。在此，所述锁止链轮32341可通过链轮转轴连接至硅棒夹持件，在锁紧机构32340停息状态下，所述锁止链轮32341在相啮合的传动链条3231带动下绕链轮转轴旋转；当所述锁紧机构32340处于工作状态，锁紧机构32340限制锁止链轮32341转动以藉由传动链条3231在升降方向的运动以给予锁止链轮32341以及硅棒夹持件升降方向运动的力，因此，在锁止链轮32341相对于传动链条的运动为静止的状态下，所述硅棒夹持件可在传动链条3231带动下沿第一支架升降运动。在此，所述锁紧机构32340例如可通过夹持锁止链轮32341轮齿的方式限制锁止链轮32341旋转。
请参阅图7a和图7b，显示为本申请的升降驱动机构在一实施例中不同锁止状态的结构示意图。在某些实施方式中，如图所示，所述锁紧机构32340包括锁紧气缸32342以及锁紧部32343，所述锁紧部32343连接于所述锁紧气缸32342的伸缩端，在所述锁紧气缸32342驱 动下进入所述锁止链轮32341的轮齿以锁止所述锁止链轮32341。
在一具体实施方式上，所述锁紧机构32340的详细结构为：包括一台固定安装在硅棒夹持件上的锁紧气缸32342，该锁紧气缸32342的伸缩杆可沿锁止链轮32341的径向伸缩，同时在锁紧气缸32342的伸缩杆的端部上固定有一锁紧部32343，该锁紧部32343外部轮廓为矩形块结构，在该锁紧部32343靠近锁止链轮32341一侧设置有一插销，当锁紧部32343被锁紧气缸32342带动伸入锁止链轮32341时，锁紧部32343卡死锁止链轮32341，使之与传动链条3231之间不再产生相对转动(呈如图7b所示状态)。此时，锁紧机构32340连接的硅棒夹持件随传动链条3231同步升降运动。当所述硅棒夹持件升降至预设高度后，所述锁紧部32343收缩回退，使所述锁止链轮32341恢复可转动的啮合于传动链条3231的状态(呈如图7a所示状态)，所述硅棒夹持件失去由锁止链轮32341传递的升降方向的力，即可稳定在预设的高度。
同时，在具体实施过程中，因为锁紧部在进入锁止链轮后，其所受的来自锁止链轮的作用力较大，容易导致锁紧气缸的伸缩杆在长时间的受力过程中产生形变，影响锁紧气缸的使用寿命。为了解决该问题，在某些示例中，在硅棒夹持件上固定的设置有一保持部，该保持部由两块压板构成，分设在锁紧部的两侧，且与硅棒夹持件之间形成一平行于锁止气缸伸缩方向的滑动通道，锁紧部可滑动的设置在该滑动通道中。当锁紧部受到来自锁止链轮的较大作用力而要改变锁紧气缸的伸缩杆形态时，保持部压制在锁紧部外侧，可起一定的稳定作用。
在其他可实现方式中，该保持部3235还可以是一沿着锁紧部运动轨迹方向设置的长方块，在该长方块中设置有一滑槽，锁紧部滑动设置在该滑槽中，并沿着锁止链轮径向的运动。
在某些情况下，传动链条3231在传动过程中可能会出现抖动情况，导致传动链条3231与锁止链轮32341之间脱离啮合，从而使得硅棒夹持件与传动链条3231之间始终为活动状态。为了消除该种情况出现的可能，在某些实施方式中，所述升降驱动机构323中还设置了一个防脱离机构3235，如图5所示实施例，该防脱离机构3235为U型结构，其两条平行侧边固定在所述硅棒夹持件上以跟随硅棒夹持件同步升降，而防脱离机构3235的位于U型结构底部的槽底则与传动链条3231相贴近。当传动链条3231抖动而即将与锁止链轮32341脱离啮合时，防脱离机构3235的槽底则必然对传动链条3231施加一个朝向锁止链轮32341径向的作用力，从而阻挡传动链条3231从锁止链轮32341上脱离。
在此，基于所述锁止装置3234即可实现硅棒夹持件顺应传动链条3231同步运动的锁止状态或硅棒夹持件与传动链条3231相对活动状态的切换，在实际场景中，基于预设的硅棒夹持件的调整高度，令锁止装置3234将硅棒夹持件与传动链条3231锁止，当硅棒夹持件在传 动链条3231驱动下升降到预设的高度后锁止装置3234恢复硅棒夹持件与传动链条3231之间的活动状态，使硅棒夹持件可稳定在第一支架31的预设高度位置。当然，所述硅棒夹持件的活动范围与第一支架31有关，通过此活动设置的硅棒夹持件，所述硅棒夹具可夹持的硅棒的长度规格范围增加。
请结合参考图1和图5，所述第一支架31以及第一支架31上设置的硅棒夹具32可在移位机构33的作用下在所述安装框30上沿至少一个方向移位，使得硅棒夹具32从第一预定位置进行夹持后将硅棒移送至第二预设位置。
在某些实施方式中，所述移位机构33包括第一方向移位机构，所述第一方向移位机构包括第一方向导轨3310以及第一驱动装置(图中未予以显示)，所述第一方向导轨3310设置于所述安装框30上，所述第一驱动装置用于驱动所述第一支架31在所述安装框30上沿第一方向导轨移位。所述第一支架基于适配于所述第一方向导轨3310的第一滑块3311连接至所述安装框30，以形成沿所述第一方向导轨运动3310的自由度。
在此，所述第一支架31通过安装框30吊装于机座，即可在第一驱动装置的驱动下沿位于机座上方的安装框30移动。在实际场景中，所述安装框30上设有第一方向导轨3310以吊装所述第一支架31，所述第一方向导轨3310可设置为跨越机座第一方向的两端，又或所述第一方向导轨3310的长度可涵盖至装卸区内的每一硅棒承载结构，使得设置于第一方向导轨3310上的第一机架31可在第一驱动装置的驱动下沿第一方向导轨3310移动至装卸区的每一硅棒承载结构邻位。在某些示例中，所述硅棒加工平台装卸区的硅棒承载结构设置于第一方向的同一直线上，所述第一方向导轨3310可设置在连接硅棒承载结构的直线上方，以便于第一机架31移动至硅棒承载结构承托部分的上方以对硅棒承载结构上承载的已切割硅棒进行夹持或将待切割硅棒放置于硅棒承载结构上。
所述第一驱动装置例如为行进电机，所述第一支架可通过行进丝杠连接至所述第一方向导轨，所述行进丝杠铺设于第一方向导轨并同时连接至行进电机，由此可在行进电机的驱动下带动所述第一支架沿第一方向导轨运动。在某些示例中，所述第一驱动装置还可为藉由滚珠丝杠带动第一支架运动的驱动电机，本申请不做限制。
所述第一支架31通过沿所述安装框30移动，即可在机座上方的设备空间内实现上下料，在硅棒开方设备处于空闲状态时，所述第一机架31可移动至机座上方以实现收纳，由此缩减了工序流转中设备占据空间过大带来的操作的不便利性，继而可增加硅棒加工中工序流转的效率。
在某些实施方式中，所述移位机构还包括第二方向移位机构，所述第二方向移位机构包 括第二方向导轨及第二驱动装置，所述第二方向导轨用于设置所述第一支架，所述第二驱动装置用于驱动所述第一支架沿第二方向导轨移动。所述第二驱动装置例如为行进电机，通过行进丝杠带动第一支架沿第二方向导轨移动，当然，第二驱动装置可也设置为别的可实现推动第一机架移动的装置，例如通过链条输送机构带动所述第一机架移动，本申请不做限制。
请继续结合参考图1和图5，在此，所述第一支架31通过第二方向导轨3320设置于安装框的第一方向导轨3310上，在此，所述第一支架31例如可通过第二滑块3321连接至所述第二方向导轨3320，所述第一支架31即可基于第一驱动装置驱动沿第一方向即机座的长度方向运动，同时，也可在第二驱动装置(图中未予以显示)驱动下沿第二方向导轨3320在第二方向运动，第一支架31及硅棒夹具32在空间中的移动范围被增大，即可适用于在空间位置关系不同的第一预设位置与第二预设位置之间移送硅棒，例如，当所述第一预设位置与第二预设位置在第二方向上有一定的间距，所述硅棒夹具32可通过沿第二方向导轨3320移动以到达目标位置。
在一场景中，当所述第一预设位置为机座外侧的置放待切割硅棒的位置，所述第二预设位置为硅棒承载结构的承托位置，所述第一支架在第一驱动装置驱动下移动至与所述第一预设位置的连线为第二方向的直线，而后在第二驱动装置驱动下趋近所述第一预设位置；当然，也可先由第二驱动装置驱动下移动至第一支架与第一预设位置的连线在第一方向的直线上，而后通过所述第一驱动装置的驱动移动至第一预设位置；在此应当说明，所述第一驱动装置与第二驱动装置相独立，因此，所述第一支架与硅棒夹具的移动路径也可为多段折线，例如先沿第一方向移动一定距离，而后沿第二方向移动，又再次沿第一方向移动以至预设位置，前述移动方向仅为举例说明一些可实现的移动路径，所述第一支架只需实现移动至预设位置即可；同时，在实际场景中，顺应设备布局以及移动机构的移动导轨的方向设置，所述移动路径也可随之变更。类似的，所述第一支架在达到第一预设位置后，从第一预设位置移动至第二预设位置的移动路径也可基于移位机构确定的移动范围设定，当所述移动范围包可涵盖第一预设位置与第二预设位置时即可实现移送。
在此，所述移动路径具有多种可选的方式，但基于本申请的硅棒装卸装置的设置，所述移动路径通过直线路径或折线路径进行硅棒移送，同时利用了机座上方的设备空间进行移送并可将其设备空间作为硅棒装卸装置的容纳空间，在转运时可减小对硅棒开方设备机座外侧的空间的占用，同时硅棒装卸装置可一体与硅棒开方设备设置，则免去了硅棒装卸装置的设备调用的工序，使得转运过程更为简易。
请参阅图8a至图8d，显示为本申请的硅棒装卸装置在不同转运状态的结构示意图。
在本申请的一实施例中，所述硅棒装卸装置对待切割硅棒进行夹持的过程如下：
所述硅棒夹持件顺应第一支架31在第一方向移位机构的带动下沿安装框30移动，所述硅棒夹持件及第一支架31可例如由第一驱动装置驱动以沿设置在安装框30上的第一方向导轨移动；同时，在某些场景中，所述第一支架31及硅棒夹持件可由第二方向移位机构驱动，例如在第二驱动装置的驱动下沿第二方向导轨移动；通过所述第一移位机构或/及第二移位机构，硅棒夹持件跟随第一支架31移动以趋近位于第一预定位置的待切割硅棒(呈如图8a所示状态)；再者，在所述硅棒夹持件跟随第一支架移动过程中，所述硅棒夹持件可基于所处的移动状态(或移动位置)控制硅棒夹持件的第一夹臂及第二夹臂执行张开或闭合动作，例如：在到达所述第一预定位置前，硅棒夹持件的驱动齿轮在电机带动下反转，令所述第一夹臂与第二夹臂分离至夹臂间的夹持空间大于硅棒直径或与硅棒间存在间隙以形成对待切割硅棒的容纳空间，当所述第一支架31带动硅棒夹持件运动至待切割硅棒位于第一夹臂与第二夹臂间的容纳空间时，所述驱动齿轮正转以控制所述第一夹臂与第二夹臂相互靠近即相互趋近待夹持硅棒，所述第一夹臂与第二夹臂接触并夹紧硅棒时停止相向运动。
所述硅棒夹持件在夹持了硅棒后保持夹紧状态，根据预设的硅棒的摆放位置，相应的由第一方向移位机构或/及第二方向移位机构驱动所述第一支架31与硅棒夹持件沿预设的路径移送硅棒，至将所夹持的硅棒运送至第二预定位置(呈如图8b所示状态)后所述第一夹臂与第二夹臂执行张开动作以释放硅棒，在此，所述第二预定位置例如为被夹持的待切割硅棒位于硅棒承载结构中用于承载硅棒的承托面的正上方。
在如图8a和图8b所示实施例中，所述硅棒夹持件执行将待切割硅棒装载至硅棒承载结构的过程，应理解的，当完成对一待切割硅棒的运送后(呈如图8b所示状态)，所述硅棒夹持件顺应第一支架在第一方向移位机构或/及第二方向位移机构驱动下回到第一预定位置(呈如图8a所示状态)，以继续执行对下一待切割硅棒的装载运送；当所述硅棒装卸装置将对应的开方作业中的待切割硅棒均装载完毕后，例如图8a或图8b所示视图的硅棒开方设备中，硅棒装卸装置对机座上的装卸区的多个硅棒承载结构均装载完毕对应的待切割硅棒后，所述第一支架31及硅棒夹持件还可在第一方向移位机构或/及第二方向位移机构驱动下回到一初始位置，所述初始位置例如为硅棒装卸装置在非工作状态下的等待区位，在实际场景中，可基于硅棒开方设备的布局设定所述初始位置，例如，在图8a或图8b所示示例中可将所述初始位置设于安装框30末端。
在某些示例中，当所述硅棒装卸装置执行对已切割硅棒的卸料过程，类似地，所述硅棒夹具与第一支架31顺应移位机构的带动沿安装框30移动，在此，在运动至承载有已切割硅 棒的硅棒承载结构邻位处即第一预定位置处停止运动(呈如图8c所示状态)，所述第一夹臂与第二夹臂相互靠近即相互趋近待夹持硅棒，接触并夹紧硅棒时停止相向运动；所述硅棒夹具与第一支架31根据第二预定位置在第一方向移位机构及第二方向移位机构驱动下沿直线或折线运动以将已切割硅棒转运出机座的加工平台，并将已切割硅棒转移至用于下料的第二预定位置(呈如图8d所示状态)。在卸料作业结束后，所述第一支架31及硅棒夹持件还可回到前述初始位置。
本申请在另一方面还提供了一种硅棒开方设备，包括机座、硅棒承载结构、线切割装置、以及吊装于所述机座如图1至图8d所示实施例中任一实施方式所述的硅棒装卸装置。其中，所述硅棒承载结构用于承载立式置放的硅棒，所述硅棒装卸装置用于夹持待切割硅棒或已切割硅棒并将夹持的待切割硅棒或已切割硅棒移送到预定位置。
在某些示例中，所述线切割装置中包括可升降的线切割支座与设于所述线切割支座上的线切割单元，所述线切割单元中具有切割线锯，即可通过线切割支座的升降运动带动切割线锯对硅棒承载结构上立式置放的硅棒进行切割。在切割前需要将待切割硅棒放置于硅棒开方设备的装卸区，并在切割完成后将已切割硅棒及时转运出去以进行对不同硅棒开方的流水作业，所述硅棒装卸装置即可将待转运的硅棒从所述第一预定位置转移至第二预定位置，以配合线切割装置进行不同硅棒的切割。
在此，所述硅棒装卸装置吊装于所述机座上，硅棒夹具藉由移位机构实现在第一预定位置至第二预定位置之间的转换，在一些场景中，待切割硅棒的置物区以及已切割硅棒放置的区域与机座有较远的距离，例如需要将待切割硅棒转运至第一预定位置，继而由所述硅棒装卸装置将待切割硅棒转运至硅棒承载结构处；又如在切割线锯对硅棒开方完成后，所述硅棒装卸装置将已切割硅棒从硅棒承载结构转移至第二预定位置，再而将第二预定位置处的已切割硅棒转运到预设的已切割硅棒的放置区域或转运至下一工序设备处。
在此，所述第一预定位置、第二预定位置并不限于在所设立的坐标系中确立的固定位置或区域，在本申请提供的示例中，通过确定所述装卸装置在进行装卸中的转移路径，顺应转移的时间顺序，将转移路径中硅棒装卸装置中第一支架的起始位置作为第一预定位置，第一支架终点位置作为第二预定位置。在此，当所述硅棒装卸装置执行的是上料过程，则硅棒夹具执行夹持待切割硅棒的位置为第一预定位置，通过移动机构运动以将待切割硅棒移动到硅棒承载结构的承托面上方以将待切割硅棒置放于硅棒承载结构的位置为第二预定位置；反之，当所述硅棒装卸装置执行的是将开方完成后的已切割硅棒移送出机座的下料过程，第一支架位于硅棒承载结构邻位以夹持已切割硅棒的位置作为起始位置也即第一预定位置，已切割硅 棒被硅棒夹具转运离开机座并予以释放的位置为第二预定位置。
在某些示例中，所述硅棒开方设备还包括硅棒运送装置，所述硅棒转运装置包括上料转运部以及上料驱动源，其中，所述上料转运部用于输送待切割硅棒，所述上料驱动源用于驱动所述上料转运部运动以带动待切割硅棒移动。
所述上料转运部在上料驱动源的驱动下将所承载的待切割硅棒转运至所述第一预定位置，所述硅棒装卸装置即可实现硅棒转运。在某些示例中，所述上料转运部的末端即设置于硅棒装卸装置执行上料过程的所述第一预定位置。
请参阅图9，显示为本申请的硅棒加工设备的硅棒运送装置在一实施例中的结构示意图。在某些示例中，所述上料转运部41包括用于承载待切割硅棒的承载部411以及链条输送机构412；其中，所述承载部411具有相对设置的两列滚轮，所述链条输送机构412包括输送链条4121，还包括至少设置在输送链条4121两端并与输送链条4121相啮合的链轮4122。在此，所述承载部411为用于实现硅棒承托的部位，通过相对设置的滚轮以接触待切割硅棒的并实现卧式运输硅棒。所述输送链所啮合的链轮4122中至少一个作为主动链轮连接至链轮驱动源，例如主动链轮4122轴接于一电机的动力输出轴以带动输送链条4121转动。
在某些示例中，所述上料转运部41进行输送的距离较长，对应的输送链条4121长度较长，为防止输送链条4121出现松弛、与链轮4122脱离啮合等情况，所述链条输送机构412中设有多个链轮4122，所述多个链轮4122例如可等间距设置，以确保输送链条4121各处的张力。
在某些示例中，所述上料转运部还包括至少一弹性推杆结构，所述至少一弹性推杆结构与所述输送链条连接，用于推动待切割硅棒沿所述上料转运部移动。
请结合参阅图9、图10，其中，图10显示为所述弹性推杆结构413在一实施例中结构示意图。如图所示，所述弹性推杆结构413包括推杆4131、扭转弹簧4132。所述弹性推杆结构413设置在输送链条4121上，在所述上料转运部的输送链条4121前进运动(如图9所示箭头方向)时抵靠至硅棒端面，以配合所述转运部将所抵靠的硅棒移动至预设位置，以及在所述输送链条4121回退运动(如图9所示箭头的反方向)时避开障碍物也即在此场景中的待切割硅棒；所述扭转弹簧4132设于所述推杆4131下方，用以配合所述推杆4131的转动运动。
在此，所述推杆4131包括作为主体的摆动杆子，设于摆动杆子远端的用于接触待切割硅棒的滚轮，以及摆动杆子近端的转轴，所述摆动杆子即可沿转轴转动；所述扭转弹簧4132套设于转轴，以提供所述摆动杆子在一定角度被定位的扭矩例如当摆动杆子不受外力作用时可藉由扭转弹簧4132稳定在摆动杆子为直立的位置。所述弹性推杆结构413中还包括一支承底 座4133，固定连接至所述输送链条4121，用于设置所述推杆4131与弹簧，所述支承底座4133中还包括一限位挡板，如图所示，当所述摆动杆子逆时针转动，则将抵靠至所述限位挡板而达到最大转动角度，在所述弹性推杆结构413整体顺应输送链条4121前进运动的过程中，摆动杆子远端的滚轮接触待切割硅棒端面而产生相对转轴逆时针转动的倾向，在抵靠限位挡板后转动停止，所述推杆4131即可基于限位挡板的限位作用产生对待切割硅棒的推力，从而推动待切割硅棒以前进方向沿承载部移动。
请参阅图11，显示为本申请的硅棒运送装置在一示例中的部分结构示意图。如图所示，在一具体实现方式中，所述承载部411包括设置于输送链条4121相对两侧的立板4111，两侧立板4111上设置有相对设置的两列滚轮4112，应当理解，所述待切割硅棒与滚轮4112之间为点接触，在某些示例中，相对设置的两列滚轮4112为可转动的设置在输送链条4121上方的立板4111上。所述弹性推杆结构随输送链条4121运动，在输送链条4121前进运动的过程中，推杆抵靠至待切割硅棒端面即可提供给待切割硅棒沿硅棒轴向运动的推力，通过所述包括滚轮4112的承载部411与弹性推杆结构配合的设置，当所述待切割硅棒沿承载部411移动，所述推力只需克服与滚轮4112之间的滚动摩擦，实现硅棒传动所需克服的阻力较小。
在某些示例中，所述上料转运部例如包括承载部与传送带结构，所述弹性推杆结构固定设置在传动带上跟随传送带运动，以在传送带前进运动时抵靠待切割硅棒端面以带动待硅棒沿前进方向移动。
当然，根据实际场景中硅棒上料过程中转运方向的需要，在某些示例中，也可将所述弹性推杆结构设置为顺应输送链条或传送带回退运动的过程中抵靠至硅棒端面，以将带切割硅棒运送至上料过程中的所述第一预定位置。
在某些示例中，所述硅棒转运装置还包括下料转运部、以及下料驱动源。所述下料转运部用于输送已切割硅棒，所述下料驱动源用于驱动下料转运部运动以带动已切割硅棒移动。在此，所述下料转运部的起始端例如可设置在硅棒装卸装置下料过程中的所述第二预定位置，由所述硅棒装卸装置将已切割硅棒从硅棒承载结构处夹持转运至下料转运部，从而由所述硅棒运送装置将已切割硅棒转移至下一工序位置或已切割硅棒的放置区域。
请参阅图12，显示为本申请的硅棒运送装置在一实施例中的结构示意图。在某些示例中，所述下料转运部42为传送带机构。应当理解，所述已切割硅棒为开方完成后侧面为平面的类长方体，将所述已切割硅棒卧式置放在传送带上，即可凭借已切割硅棒的自重在传动带表面形成的摩擦实现运送。在此，所述下料驱动源例如为驱动电机，通过带动传送带机构中的至少一个同步带轮转动以使传送带发生转动。
在某些示例中，所述硅棒运送装置还包括翻转装置，用于将所承载的待切割硅棒从卧式状态翻转至立式状态以及将所承载的已切割硅棒从立式状态翻转至卧式状态。
所述硅棒开方设备中的硅棒装卸装置可用于夹持立式置放的待切割硅棒或已切割硅棒，在此，所述翻转装置43可用于待切割硅棒从卧式状态翻转至立式状态以使得硅棒装卸装置执行对待切割硅棒的装载运送，又或可用于将从硅棒承载结构处运送至硅棒转运装置的已切割硅棒从立式状态翻转至卧式状态以实现后续的对已切割硅棒的输送。
所述翻转装置43对接与上料转运部的末端或下料转运部的起始端，在某些示例中，所述上料转运部与下料转运部设置在机座同侧，以使得所述硅棒装卸装置在机座同侧移动即可到达上料转运部与下料转运部。在此，所述翻转装置43设于一直线运动机构44上以从所述上料转运部移动至对接所述下料转运部，即，所述翻转装置43可在上料转运部与下料转运部之间移动。
请结合参阅图8c、图12，所述上料转运部与下料转运部设置在机座同侧并为平行设置，所述翻转装置43设置在铺设于第二方向的直线运动机构44上，所述直线运动机构44例如包括第二方向的直线导轨、行进电机以及行进丝杠，所述行进丝杠连接直线导轨与所述翻转装置43，所述翻转装置43在行进电机驱动下沿第二方向的直线导轨运动，即可令所述上料转运部与下料转运部共用同一翻转装置43。例如，在实际场景中，所述翻转装置43在上料转运部将卧式置放的待切割硅棒翻转为立式后，即可顺应第二方向的直线导轨运动至对接下料转运部，以将立式置放的已切割硅棒翻转为卧式。
当然，在实际场景中，所述上料转运部与下料转运部也可设置在机座的两侧，例如当设置有硅棒承载结构的硅棒加工平台设置于平移机构上，将机座一侧设置为上料的装载区，当硅棒被开方切割后朝向远离装载区的一侧平移，以将已切割硅棒移动至卸载区，所述上料转运部与下料转运部即分别对应所述装载区与卸载区。
在某些示例中，如图12所示，所述翻转装置43包括翻转台431，所述翻转台431设有翻转电机，用于驱动所述翻转台431转动。在此，所述翻转台431包括：翻转部以及翻转转轴，所述翻转转轴设置于所述翻转部，并轴接于一翻转电机，从而在翻转电机的驱动下带动翻转部旋转预定角度；所述翻转部用于承载待切割硅棒或已切割硅棒，并通过夹持、吸附、或限位等作用使得翻转中待切割硅棒或以切割硅棒始终贴合于翻转部。在一具体实现方式中，所述翻转部包括设置于翻转部的承载板上的升降座以及设于升降座上的压制块或压制板，在另一些实现方式中，所述翻转部也可包括夹持臂或套箍以作为限位结构。
在如图12所示视图中，所述翻转转轴设置于翻转部右侧，当所述翻转装置对应于上料转 运部，所述翻转部在翻转电机驱动下绕翻转转轴顺时针转动90°以将所承载的待切割硅棒翻转为立式置放；当所述翻转装置对应于下料转运部，所述翻转部在翻转电机驱动下绕翻转转轴逆时针转动90°以将所承载的已切割硅棒翻转为卧式置放。
由此，本申请的硅棒开方设备，通过硅棒运送装置将待切割硅棒运送至第一预定位置，硅棒装卸装置即可通过移位机构沿机座上方的安装框移动到达所述第一预定位置，并可沿安装框移动以将待切割硅棒转运至硅棒承载结构上，所述硅棒运送装置与硅棒装卸装置配合线切割装置进行硅棒的转运与切割加工，使得不同工序之间的流转为自动化，可减少人力成本并有益于在转运流转中避免硅棒被磕碰损害；再者，所述硅棒装卸装置的转运路径可为直线或折线路径，并采用吊装设置的方式为在地面摆放设置例如硅棒运动装置预留了设备空间，所述硅棒开方设备即可通过占据较小的设备空间即实现硅棒开方作业中自动化的工序流转。
现有的单晶硅棒一般为圆柱形结构，现有的开方设备中一般是依靠硅棒自身的重力设置于硅棒承载结构上，在线切割装置对硅棒切割时，切割线沿硅棒长度方向切割过程中会造成硅棒的抖动，使得切割表面不平整，成品质量差。因此，有必要提出一种硅棒开方设备，使得在切割过程中能保证硅棒稳定的立于硅棒承载结构上，本申请中所提及的硅棒为单晶硅棒。本申请公开了一种硅棒压紧装置以及设置有所述硅棒压紧装置的硅棒开方设备，所述硅棒压紧装置可在线切割装置对硅棒承载结构上的单晶硅棒进行切割时压紧单晶硅棒的顶部，使硅棒稳定的立于硅棒承载结构上，在进行切割作业时保证硅棒的平稳，保证了硅棒的切割质量。
本申请的硅棒压紧装置可用于硅棒开方设备中，所述硅棒压紧装置可作为独立的单元可拆卸的设置在硅棒开方设备中，以在硅棒开方设备中配合硅棒开方作业，在开方切割过程中压紧硅棒，使得硅棒在切割过程中处于稳定的状态；当然，应当理解，在某些实施方式中，也可将所述硅棒压紧装置设置在硅棒开方设备中形成一体的结构。
请参阅图13，显示为所述硅棒压紧装置在一实施例中的结构示意图，如图所示，所述硅棒压紧装置应用于硅棒开方设备中，所述硅棒开方设备包括机座10、硅棒承载结构(图中未予以显示)、以及线切割装置；所述硅棒压紧装置包括压紧支架61以及多个相互独立的压紧组件60，其中，所述压紧支架60活动设于所述切割架20，所述多个相互独立的压紧组件60分别设于所述压紧支架61上，用于压紧于所述硅棒承载结构承载的待切割硅棒的顶部，每一个所述压紧组件60包括压紧头601和驱动所述压紧头601相对所述压紧支架61作升降移动的驱动机构602。
所述机座10设置为本申请硅棒开方设备的主体部件，用于提供开方作业平台，在一种示例中，所述机座10的体积和重量均较大以提供更大的安装面以及更牢固的整机稳固度。
所述硅棒承载结构设置在硅棒加工平台上，用于承载立式放置的待切割硅棒。
所述线切割装置上设置的有至少一线切割单元21，所述线切割单元中设置有切割轮、过渡轮、以及缠绕于切割轮和过渡轮之间的切割线，由此，线切割单元21形成用于对硅棒进行切割的切割线锯。
所述硅棒压紧装置包括压紧支架61和设于所述压紧支架61上且与位于切割区的硅棒承载结构对应的压紧组件60。在一示例中，所述压紧支架61上固定有与所述升降导轨22相配合的滑块，所述压紧支架61通过其滑块与所述升降导轨22配合可升降地架设于所述切割架上且位于所述线切割装置上方，所述压紧组件60设置于压紧支架61上并可随压紧支架61升降以释放或压紧位于切割区硅棒承载结构上的待切割硅棒。
受制造工艺的影响，位于切割区硅棒承载结构上的待切割硅棒在高度上并不完全一致，压紧组件60跟随压紧支架61下降并不能保证每个压紧组件60都紧压在其对应的硅棒承载结构所承载的待切割硅棒上。在此，本申请提供的硅棒压紧装置中，所述压紧支架61上设有多个相互独立的压紧组件60，每一压紧组件60包括压紧头601和驱动所述压紧头601沿所述压紧支架61作升降移动的驱动机构602，也即每一压紧组件60具有跟随压紧支架61沿切割架移动的自由度与相对所述压紧支架61升降移动的自由度。
每一压紧组件60可用于执行对一硅棒承载结构上的立式置放的硅棒的压紧操作，在实际场景中，所述硅棒压紧装置例如可调节压紧支架61及设置于压紧支架61上的每一压紧组件60的整体升降位置，在压紧组件60的压紧头601距离待切割硅棒的上端面距离在预设范围内后，基于硅棒承载结构上每一待切割硅棒的上端面高度调节对应的压紧头601升降幅度，以使所述压紧头601接触并压紧待切割硅棒。
在某些实施方式中，所述线切割装置中的线切割单元21通过升降机构活动设于所述切割架20，所述升降机构包括升降导轨22和升降电机，所述硅棒压紧装置中的压紧支架61通过所述升降导轨22活动设于所述切割架20。即，在此，所述升降压紧装置与所述线切割单元21可共用一升降导轨22实现在升降方向的移动，所述升降导轨22设置于所述切割架20上。
为了简化本申请硅棒开方设备的结构，降低设备的制造成本，在一种实施方式中，所述硅棒压紧装置依靠自身重力搭附于用于支撑线切割单元21的安装梁214上，可跟随安装梁214沿着升降导轨22作升降运动。所述升降电机驱动安装梁214带动线切割单元21沿着所述升降导轨22下降，所述硅棒压紧装置搭附着所述安装梁214也沿着所述升降导轨22下降至位于切割区的硅棒承载结构承载的待切割硅棒的顶部，其压紧组件60中的驱动结构驱动压 紧头601升降运动以压紧所对应的待切割硅棒，而安装梁214将继续被第一驱动机构602驱动带着线切割单元21下降进行待切割硅棒的切割作业。
在某些实施方式中，所述线切割单元和所述硅棒压紧装置分别配置有升降驱动装置，所述线切割单元例如可由设置于承载线切割单元的安装梁上的升降电机驱动，以跟随安装梁升降活动；所述硅棒压紧装置中的压紧支架在设置于压紧支架的升降驱动装置的驱动下沿切割架的升降导轨运动。
在一种示例中，设有所述硅棒压紧装置的硅棒开方设备中包括第一升降驱动机构与第二升降驱动机构，其中，所述第一升降驱动机构用于驱动所述线切割单元沿升降导轨移动；所述第二升降驱动机构用于驱动硅棒压紧装置沿所述升降导轨作升降运动。此时，所述硅棒压紧装置不再依靠重力搭附于安装梁，而是被第二升降驱动机构驱动沿着所述升降导轨作升降运动，所述第二升降驱动机构设置为气缸组件或藉由电机驱动的丝杆组件。于实际应用中，第一升降驱动机构驱动安装梁载着线切割单元下降，第二升降驱动机构驱动硅棒压紧装置下降至预定位置时，第二升降驱动机构停止驱动硅棒压紧装置使得硅棒压紧装置定位于预定位置对待切割硅棒进行压紧，而第一升降驱动机构继续驱动安装梁载着线切割单元下降以完成待切割硅棒的切割，完成待切割硅棒的切割作业后，第一升降驱动机构驱动安装梁载着线切割单元上升，第二升降驱动机构驱动硅棒压紧装置上升。
在某些实施方式中，所述线切割装置中的线切割单元通过第一升降机构活动设于所述切割架，所述硅棒压紧装置通过第二升降机构活动设于所述切割架。
在某些实施方式中，所述第一升降机构包括第一升降导轨和第一驱动电机，所述第二升降机构包括第二升降导轨和第二驱动电机。
在此，所述第一升降导轨与第二升降导轨分别为布置在竖直方向也即重垂线方向的导轨，所述第一升降导轨与第二升降导轨均设置于切割架两侧，所述线切割单元设置在安装梁上，安装梁两端分别连接至机座两侧的切割架上的第一升降导轨，并在第一驱动电机的驱动下带动线切割单元在升降方向运动，在此，线切割单元中的切割线段随之升降运动，即可在第一驱动电机控制下实现对硅棒的切割加工；所述硅棒压紧装置的压紧支架两端设置在切割架两侧的第二升降导轨上，在第二驱动电机驱动下，压紧支架载着压紧组件沿升降导轨运动，即可实现由压紧组件的压紧头压紧至硅棒顶部。
在某些实施方式中，所述压紧支架上设有导轨锁紧机构。例如，为了防止硅棒压紧装置持续跟随安装梁下降而损坏待切割硅棒，在所述硅棒压紧装置的压紧支架上设置有导轨锁紧 机构；又如，为了防止硅棒压紧装置在第二驱动电机作用下沿用于设置压紧支架的升降导轨或第二升降导轨运动时不能稳定在预设高度，所述压紧支架上设置有导轨锁紧机构。
所述导轨锁紧机构可用于将所述硅棒压紧装置定位于升降导轨(或第二升降导轨)上预定位置，例如，预定位置为硅棒压紧装置中的压紧组件位于其所对应的待切割硅棒上方0至5cm，但并以此为限，只需压紧组件位于其所对应的待切割硅棒上方，在压紧组件中的压紧头被驱动下降时能够压紧于其对应的待切割硅棒的顶面。
在一实现方式中，所述导轨锁紧机构包括锁紧夹块和气缸，所述锁紧夹块设于压紧支架，所述气缸用于对所述锁紧夹块提供夹紧升降导轨或第二升降导轨的作用力，在气缸推出状态下所述锁紧夹块受力抵靠至连接压紧支架的升降导轨或第二升降导轨上，基于气缸推出状态下的作用力，锁紧夹块在抵靠升降导轨或第二升降导轨后与所抵靠的导轨保持相对静止。
请参阅图14a、14b、图14c，图14a显示为本申请的硅棒压紧装置6在一实施例中的结构示意图，图14b、图14c显示为硅棒压紧装置6在不同运动状态下图14a中的B的放大示意图。如图所示，所述导轨锁紧机构62例如为图中显示的气动导轨锁紧机构62，如图14a所示，所述硅棒压紧装置6设置在升降导轨22上，由此实现在升降方向的移动以实现对硅棒的压紧。如图14b或14c所示，本实施例中的气动导轨锁紧机构62包括与升降导轨22相配合的锁紧夹块621以及驱动锁紧夹块621动作的气缸622以及弹簧623，在此，所述锁紧夹块621与升降导轨22上分别设置有升降方向也即沿导轨方向的齿条，所述锁紧夹块621设置于所述硅棒压紧装置6中的压紧支架上，在一运动状态中，所述硅棒压紧装置6跟安装梁下降(呈如图14b所示状态)，此时所述气缸622处于停息状态，所述锁紧夹块621与升降导轨22之间的齿条藉由弹簧623弹力处于分离状态，由此，硅棒压紧装置6可沿升降导轨22移动，到预定位置时，气缸622驱动压紧支架上的锁紧夹块621移动，在此气缸622的推进作用克服弹簧623弹力，使得锁紧夹块621抱紧升降导轨22而将硅棒压紧装置6定位于预定位置(呈如图14c所示状态)，锁紧夹块621与升降导轨22的齿条啮合咬紧，由此将所述硅棒压紧装置6固定在升降导轨22上，以将硅棒压紧装置6定位至预定位置。所述硅棒压紧装置6中的压紧组件压紧其相应的待切割硅棒，而安装梁继续被驱动带动线切割单元下降完成待切割硅棒的切割，在完成待切割硅棒的切割作业之后，所述安装梁被第一驱动机构驱动带动线切割单元上升至硅棒压紧装置6所定位的位置时，所述气缸622驱动压紧支架上的锁紧夹块621放松升降导轨22以使得硅棒压紧装置6继续搭附于安装梁上升(呈如图14b所示状态)。
在某些实施方式中，所述压紧支架61上设有导轨钳制器(呈如图13所示实施例)，所述 导轨钳制器可设置于压紧支架61两端以将所述压紧支架61连接至升降导轨22或第二升降导轨上，当所述切割架20两侧的升降导轨22或第二升降导轨为双导轨，所述导轨钳制器221可配置为4个，分别在两侧的双导轨处连接压紧支架61。在实际场景中，所述压紧支架61可搭附于切割架20以沿升降导轨22移动或在第二驱动电机作用下沿第二升降导轨移动，在达到预定位置后由导轨钳制器221压紧导轨使得压紧支架61稳定在预设高度。
在此，所述压紧支架上设置的多个相互独立的压紧组件即可在压紧支架的带动下沿升降导轨移动，同时，每一个所述升降组件的压紧头可在驱动机构的驱动下沿所述升降支架升降移动。
在某些实施方式中，所述驱动机构包括动力结构和导向轨道，所述压紧头与所述动力结构联动并受控于所述动力结构以沿所述导向轨道作升降移动。
请结合参阅图13和图15，其中，图15显示为图13中A处的放大示意图。如图所示，所述压紧支架61上设置有多个压紧组件60，分别对应于硅棒开方设置切割区的多个硅棒承载结构，每一压紧组件60中设有压紧头601与驱动机构602。所述驱动机构602包括在压紧支架61上沿升降方向设置的导向轨道6022、以及作为压紧头601升降驱动源的动力结构6021，所述压紧头601即可在动力结构6021驱动下沿导向轨道6022移动。
在某些实施方式中，所述动力结构6021包括：气缸或液压泵以及伸缩件，其中，所述伸缩件与所述气缸或液压泵连接，所述压紧头601设置在所述伸缩件的底部。
在一具体实现方式中，所述伸缩件在气缸的推进作用下沿升降方向运动，例如，所述伸缩件连接至气缸活塞杆，所述压紧头601设置在伸缩件的底部(即伸缩件朝向位于切割区的硅棒承载结构的端面上)，所述气缸驱动伸缩件带着压紧头601作升降运动以释放或压紧位于切割区硅棒承载结构上的待切割硅棒。
在另一具体实现方式中，所述伸缩件连接至液压泵，例如所述伸缩件为连接至液压缸活塞的杆体或连接至液压泵的升降油缸，所述伸缩件即可在液压泵驱动下沿导向轨道6022升降运动，并带动伸缩件底部的压紧头601升降运动以调整压紧头601至待切割硅棒端面的距离。
在又一具体实现方式中，所述驱动机构包括导向轨道和升降电机(未予以图示)，所述导向轨道沿升降方向设置在压紧支架上，所述压紧头在升降电机的驱动下相对压紧支架升降运动，以调整压紧头至待切割硅棒顶部的距离。
在某些实施方式中，所述动力结构包括升降电机以及伸缩件，其中，所述伸缩件与所述升降电机连接，所述压紧头设置在所述伸缩件的底部。在此，所述伸缩件例如为升降电机与 压紧头的连接杆，所述升降电机例如为可沿导向轨道移动的行进电机，伸缩件在行进电机的运动下带动压紧头升降运动，以实现压紧头至待切割硅棒端面的距离调整；又或，所述伸缩件为升降电机驱动的电动推杆，所述电动推杆延伸端连接至压紧头，藉由升降电机驱动带动压缩头升降运动。
在某些实施方式中，所述压紧头通过延长臂连接于所述驱动机构。
请继续参阅图15，在一具体实现方式中，所述延长臂6011近端连接至所述驱动机构602，远端连接至压紧头601，以在所述驱动机构602驱动下所述延长臂6011带动远端的压紧头601相对压紧支架升降运动。在实际场景中，所述延长臂6011例如可连接至所述动力结构6021的伸缩件；又如，所述延长臂6011远端连接至可沿导向轨道6022移动的滑块上，所述滑块由升降电机驱动运动。
所述延长臂6011还可设置为长度可调节的形式，延长臂6011远端为长度调节时的自由端；在此，每一压紧组件60中的导向导轨设置在硅棒承载结构一侧，使得导向轨道6022及其延伸方向在对应的待切割硅棒外，例如图1视图中显示的导向轨道6022位于硅棒承载结构右侧，所述延长臂6011远端向左侧延伸以使得压紧头601位于待切割硅棒端面正上方。
通过所述长度可调节的延长臂6011连接压紧头601，即可避免压紧头601位置不在待切割硅棒中心使得压紧效果不佳甚而产生具有倾覆作用的力矩；同时，所述延长臂6011的长度调节易于实现并可通过小型的部件移动即可实现对硅棒压紧位置的调整，调整过程中不会对其他硅棒压紧装置或硅棒开方设备中其他结构或部件造成干扰。所述延长臂6011例如为设有伸缩驱动装置的伸缩杆。在某些示例中，所述延长臂6011上可设置直线导轨，所述压紧头601设置于直线导轨上，即可等效的实现延长臂6011长度可调节的效果，以确保压紧头601在待切割硅棒端面中心处压紧硅棒。
在某些示例中，所述压紧头为一转动压紧头。
在某些示例中，在设置有所述硅棒压紧装置的硅棒开方设备中，硅棒承载结构具有转动机构，可带动位于其上的待切割硅棒进行旋转以调整待切割面。为了配合硅棒承载结构的转动机构，在一实现方式中，所述压紧头通过转轴(未予以图示)与所述驱动结构连接。例如，在连接至气缸的伸缩件的底部设置一轴承(未予以图示)，所述压紧头具有一与所述轴承相适配的转轴，所述压紧头通过转轴可转动的安装于所述伸缩件的轴承上，如此，在压紧头压紧待切割硅棒时硅棒承载结构带动待切割硅棒转动，所述压紧头也可配合于待切割硅棒转动。
在某些示例中，每一压紧头可转动的设置于所述延长臂远端，所述压紧头可通过转轴连 接至延长臂，所述转轴设置于第三方向也即升降方向，在压紧头压紧待切割硅棒的状态下，所述压紧头可在硅棒承载结构带动硅棒转动时沿所述转轴转动。
在某些示例中，为了更好的保护待切割硅棒，可在所述压紧头和待切割硅棒之间设置缓冲垫(未图示)，该缓冲垫固定于所述压紧头的压紧面(该压紧面即为所述压紧头的下表面)。
在某些实施方式中，所述压紧头底部还设置有检测装置(未予以图示)，用于检测压紧头对待切割硅棒的接触状态。在一实现方式中，所述检测装置包括压力传感器，设于所述压紧头下表面用以接触待切割硅棒。所述压力传感器的压力敏感元件接触到所述待切割硅棒，输出接触信号，所述压力传感器还可用于检测压力值的大小以确定待切割硅棒承受的压紧力在预设的范围内。
在某些实施方式中，所述压紧头沿所述压紧支架作升降移动的升降幅度为200毫米至400毫米。在开方加工中，待切割硅棒可能长度规格不同，所述待切割硅棒通常为将通过直拉法或悬浮区熔法从熔体中生长出棒状单晶硅棒截断后的硅棒截段，不同硅棒截段之间可能存在一定的高度差，呈如图13所示状态。
在具体实现方式上，例如可将所述导向轨道长度设置为200毫米至400毫米，又或将伸缩件的伸缩距离设置为200毫米至400毫米。由此，设置于同一压紧支架上的压紧组件中压紧头的高度差可达200毫米至400毫米，所述硅棒压紧装置即可压紧于切割区的硅棒承载结构上不同长度的待切割硅棒，则无需基于相同的长度对待切割硅棒进行分组后再进行装载与切割，使得开方过程更为简易。
在实际场景中，当所述待切割硅棒间的高度差大于400毫米，即可将所述待切割硅棒基于长度进行分组后进行装载与切割，例如，在如图1所示的硅棒开方设备中，切割区对应有4个硅棒承载结构，在此可将待切割硅棒分为每四个一组，令每一组中待切割硅棒间的长度差在400毫米以下，所述硅棒压紧装置即可用于对每一组待切割硅棒的压紧。由于每一组待切割硅棒可存在长度差，在确定长度时无需精准测量，可使对不同长度规格硅棒的开方加工流程简化。
在此，本申请提供的硅棒压紧装置，可与硅棒开方设备中设置的线切割装置协同配合，硅棒压紧装置可与线切割装置共用一升降导轨或分别沿一升降导轨运动，将硅棒压紧装置借助线切割装置中的安装梁简易设置在待切割硅棒上方，或对硅棒压紧装置配置第二驱动机构以驱动硅棒压紧装置沿升降导轨在升降方向运动；同时，所述硅棒压紧装置中每一升降组件可沿压紧支架升降移动，以适应于对不同规格的待切割硅棒进行压紧；在开方切割前，硅棒 压紧装置压紧待切割硅棒的顶部，确定硅棒稳定的立式放置在硅棒承载结构上，有效减小或避免后续切割过程中硅棒受扰动发生抖动、位移甚至倾覆的情况，提升开方加工的成品质量。
本申请还提供了一种硅棒开方设备，包括机座、硅棒承载结构、线切割装置、以及如图13至图15所示实施例中任一实施方式所述的硅棒压紧装置。
所述机座具有加工平台，所述硅棒承载结构设于所述硅棒加工平台上并用于承载立式置放的硅棒。所述线切割装置包括设于所述机座的切割架，活动设于所述切割架的线切割单元；其中，所述线切割单元包括切割轮、过渡轮、以及切割线，所述切割线顺次缠绕于所述切割轮和过渡轮形成至少一切割线锯，所述切割线锯即可用于对待切割硅棒进行开方切割。
在此，本申请提供的硅棒开方设备中，所述硅棒压紧装置可配合所述线切割装置，用于在所述线切割装置对所述硅棒承载结构承载的硅棒进行切割时压紧所述硅棒的顶部即硅棒的上端面，以此确保切割过程中，硅棒稳妥的立式置放在硅棒承载结构上，从而避免由硅棒移位导致的切割质量不佳、硅棒倾覆等状况。
在硅棒加工技术中，线切割技术为硅棒加工的多个流程所采用，例如针对硅棒的截断作业、开方作业及切片。
线切割技术是目前世界上较先进的硅材料加工技术，它的原理是由高速运行的钢线带动附着在钢线上的切割刃料或者直接采用金刚线对待加工工件进行摩擦，从而达到线切割的目的。在切割过程中，钢线或金刚线通过导线轮引导，在切割辊上形成一根线锯或者一张线网，而待加工工件通过工作台的上升下降或线锯或线网的上升下降实现工件的进给。在压力泵的作用下，装配在设备上的冷却水自动喷洒装置将冷水喷洒至钢线或金刚线和加工件的切削部位，由钢线或金刚线往复运行产生切削，以将待加工材料一次同时切割为多块。线切割技术与传统的刀锯片、砂轮片及内圆切割相比具有效率高、产能高、精度高等优点。
在硅棒加工技术领域中，一般是先将多晶硅脆状材料提拉为单晶硅棒，对原始获得的单晶硅棒进行截断，获得在预定长度规格下的硅棒截段，然后采用开方机进行开方；此时，切割机构沿硅棒长度方向进给并在硅棒周向上切割出四个两两平行的平面，使得硅棒截面呈类矩形；开方完毕后，再采用多线切片机沿长度方向对开方后的硅棒进行切片，得到所需硅片。
在此，硅棒加工中多个环节需要借助线切割装置完成，高速运行的钢线带动附着在钢线上的切割刃料或者直接采用金刚线对待加工工件进行摩擦，从而达到线切割的目的。一般在多线切割设备中配置有多个切割轮和过渡轮，由切割线在切割轮的线槽以及与切割轮对应的过渡轮的线槽上依次缠绕形成多条切割线锯，从而利用多条切割线锯对待切割硅棒进行切割。 经长时间使用后，切割轮上的线槽会产生磨损，影响切割效果，因此需要更换切割轮的线槽槽位，通常，为确保将硅棒切割为预设的规格，在换槽后还需调整切割轮的移动距离。
诚如背景技术所述，在相关线切割装置中多个切割轮在安装后相互间的位置关系不轻易变动，在其中一个线切割轮磨损后需通过调整切割轮或其他部件位置进行整体换槽，并对调整位置的部件需进一步校准，操作繁琐且效率低下。
有鉴于此，本申请还提供了一种硅棒加工设备的线切割装置，所述硅棒加工设备包括：机座，具有硅棒加工平台；硅棒承载装置，设于所述硅棒加工平台上，用于承载待切割硅棒；所述线切割装置包括：切割架，设于所述机座；至少一线切割单元，活动设于所述切割架；所述线切割单元包括：沿第一方向依序设置的多个切割轮，每一个切割轮上具有至少两个切割线槽；切割线，顺次绕于所述多个切割轮以形成至少一切割线锯；至少一调距机构，设于所述至少一线切割单元上，用于驱动所述至少一线切割单元中多个切割轮沿第二方向移动，以调整所述至少一线切割单元中至少一线割线锯的切割位置、或者变换切割线绕于所述至少一线切割单元中多个切割轮的切割线槽。
所述线切割装置可基于调距机构实现切割线在切割轮不同切割槽之间的切换，又或调整切割线锯的位置以改变相对于硅棒的切割位置(或加工规格)，应用所述线切割装置的硅棒加工设备可以是硅棒开方设备、硅棒截断设备、硅棒切磨一体设备等，应当理解，所述线切割装置由调距机构实现换槽或调整切割线锯位置仅需以一定的线切割装置本身的结构和绕线方式实现，而不以硅棒加工设备的具体类型为限制。
在此，本申请提供的实施例中，所述切割线锯即为切割线中可用于对硅棒进给加工的一定位置区域内的线段，应当理解，切割加工中切割线处于高速运转中，切割线锯的位置通常由切割轮与切割线缠绕方式确定。
在以下提供的实施例中，以本申请的线切割应用于硅棒开方设备为例进行说明，但并非用于限制本申请的线切割装置的应用场景。
请结合参阅图16和图17，其中，图16显示为本申请的线切割装置在一实施例中的结构示意图，图17实现为本申请的线切割装置在一实施例中应用于硅棒开方设备中的结构示意图。如图所示，所述线切割装置包括切割架20、至少一线切割单元21、及至少一调距机构23。
其中，所述切割架20设于所述机座10，在某些实施方式中，所述切割架20设于机座10的两端以确保架设于切割架20的线切割单元21上形成的切割线锯可覆盖不同加工工位，例如图2所示的示例中，所述切割架20为设置于机座10两端的柱体，所述硅棒开方设备中机 座10上设有多个硅棒承载结构，所述线切割单元21的跨距包括切割区内的每一硅棒承载结构。
所述至少一线切割单元21活动设于所述切割架20；所述线切割单元21包括沿第一方向依序设置的多个切割轮211及切割线213。在一些实现方式中，如图2所示实施例，所述线切割单元21藉由线切割支座24设于所述切割架20，所述线切割支座24设于所述切割架20并包括沿第二方向设置的导轨，所述线切割单元21设于线切割支座24的导轨上以形成沿第二方向运动的自由度；当然，所述线切割支座24的上还可设置为第二方向的导向槽、第二方向的滑杆或其他第二方向的限位结构或导向结构以用于设置所述至少一线切割单元21，本申请不做限制。
应当理解，所述多个切割轮211需要依附于线切割单元21提供的载体，在一些示例中，所述线切割单元21中包括第一方向的安装梁214，所述安装梁214两端活动连接至切割架20，每一安装梁214上依序设置多个切割轮211。即，一线切割单元21由沿同一方向(或同一直线)的设置的多个切割轮211、切割线213及切割轮211的承载结构组成。
在另一些实施方式中，所述线切割单元21中的多个切割轮211通过支架、连接板、或安装框架设于所述切割架20，在此，由线切割单元21提供的用于设置多个切割轮211的载体可以为不同形式，本申请不作限制。
在某些示例中，当所述线切割装置中设有多个线切割单元21，不同的线切割单元21分属位于不同直线上，如图2所示的两个线切割单元21分别平行，在一些示例中，不同线切割单元21的延伸方向也可为相交。
应当说明，在本申请提供的所述线切割装置的各实施例中，所述第一方向即设置线切割单元中多个切割轮的方向，例如在一些示例中的线切割单元的安装梁方向，由切割线绕于切割轮形成的切割线锯也为第一方向；所述第二方向为第一方向的正交方向，所述至少一调距机构驱动所述至少一线切割单元沿第二方向移动，即使得线切割单元中的切割线锯沿其正交方向移动。
应当理解，线切割装置可基于线切割单元21沿切割架20的升降运动实现对硅棒的切割加工，而控制切割规格则通过调整切割线锯与硅棒之间在第二方向的相对位置实现。结合参考图16和图17，当所述硅棒置放于硅棒承载结构上其位置固定，通过所述调距机构23使切割线锯沿第二方向移动，即可调整所述至少一线切割单元21中至少一切割线锯的切割位置，可用以实现对硅棒的切割量控制。
在某些示例中，所述至少一线切割单元还包括至少一过渡轮，每一个过渡轮具有至少两个导线槽；其中，通过所述至少一调距机构驱动所述至少一线切割单元中多个切割轮沿第二方向移动时，所述至少一线切割单元中的至少一过渡轮与多个切割轮保持相对静止。
在一些实现方式中，请结合图16、图17，以线切割装置中的一个线切割单元21为例进行说明，线切割单元21中包括至少一过渡轮212，所述至少一过渡轮212用于实现切割线213绕于不同切割轮211时的方向导向或张力调整。所述至少一过渡轮212可设置于承载多个切割轮211的载体如图17所示的安装梁214，所述调距机构23可用于驱动所述载体沿第二方向运动，所述至少一过渡轮212与多个切割轮211共同跟随载体发生沿第二方向的移动，在此状态下，所述至少一过渡轮212与多个切割轮211为相对静止，即，过渡轮212与切割轮211之间的位置关系不变。当所述调距机构23用于调整所述至少一线切割单元21中至少一线割线锯的切割位置，所述切割线锯相对于切割轮211、过渡轮212的位置关系不变，即仅发生沿第二方向的移动，即可实现切割位置调整。
在某些实施方式中，属于同一线切割单元21中的多个切割轮211设于沿第一方向设置的安装梁214上，所述至少一过渡轮212通过支架设于所述安装梁214上。在此，所述调距机构23可设置为连接至所述安装梁214以驱动安装梁214承载的多个切割轮211沿第二方向移动，所述支架顺应安装梁214运动并带动至少一过渡轮212沿第二方向移动，以使得线切割单元21中的至少一过渡轮212与多个切割轮211保持相对静止。
所述至少一过渡轮212具有至少两个导线槽，在所述至少一调距机构23用于变换切割线213绕于所述至少一线切割单元21中多个切割轮211的切割线槽位置时，所述至少一过渡轮212对应的变换切割线213在导线槽上的位置以使得换槽后绕于过渡轮与导线轮的切割线仍位于一铅锤面中。实际场景中，通常采用的绕线方式需要使得过渡轮与切割轮之间的切割线位于铅锤面内。应当理解，当换槽后用于缠绕切割线的切割线槽与导线槽不在同一平面内，切割线对过渡轮及切割轮具有沿第二方向的分力，不利于切割线高效运行。在此，将所述过渡轮212设置为至少两个导线槽即可用于实现换槽后的切割线213的方向调整。
每一切割轮211上具有至少两个切割线槽，不同切割线槽相互平行且切割线槽平面在水平面上的投影沿第一方向，不同切割线槽间具有第二方向的切割偏移量，当所述切割线213变换绕于所述切割轮211上的线槽位置，则切割线213相对于切割轮211具有第二方向的位移，应当理解，由于所述过渡轮212与切割轮211相对静止，要使切割线213在变换在切割轮211的线槽位置后绕于过渡轮与导线轮的切割线锯仍位于一铅锤面中，则切割线213绕于 所述过渡轮212的线槽位置也需改变。
所述每一过渡轮212具有至少两个导线槽，所述至少两个导线槽相互平行，且导线槽所在平面在水平面上的投影沿第一方向，不同导线槽间具有第二方向的过渡偏移量，基于所述至少两个导线槽即可用于变换切割线213在过渡轮212中的导线槽，使得换槽调整后绕于过渡轮与导线轮的切割线锯仍位于一铅锤面中。
在一些实现方式中，所述过渡轮212中相邻导线槽间的过渡偏移量与所述切割轮211中相邻切割线槽间的切割偏移量相等，以便于依预设位置实现切割线213换槽。在此示例下，所述切割轮211与导线轮在线切割单元21中可设置为导线槽与切割线槽一一对应的形式(所述对应即切割线槽与导线槽共面)，所述过渡轮212的导线槽数量与切割轮211数量相等，也可以不等。
在不同的硅棒加工设备中，所述线切割单元21中的切割轮211与过渡轮212之间可设置为不同位置关系，并配置不同的绕线方式。
在某些实施方式中，属于同一线切割单元中的多个切割轮以两两配对的方式形成至少两个切割轮组，在相邻两个切割轮组中相邻两个切割轮之间还设有过渡轮，所述过渡轮具有至少两个导线槽，所述切割顺次绕于所述切割轮和过渡轮上以在每一个切割轮组中的两个切割轮之间形成一个切割线锯，其中，所述切割线在绕于所述相邻两个切割轮组中相邻两个切割轮时由前一个切割轮组中在后的一个切割轮的切割线槽穿出并经由所述过渡轮的导线槽之后穿进后一个切割轮组中在前的一个切割轮的切割线槽；其中，通过所述至少一调距机构驱动所述至少一线切割单元中多个切割轮沿第二方向移动时，所述至少一线切割单元中的至少一过渡轮与多个切割轮保持相对静止。
请参阅图18和图19，其中图18显示为本申请的线切割装置在一实施例中应用于硅棒开方设备中的结构示意图，图19显示为所述线切割装置中线切割单元在一实施例中的结构示意图。如图所示，所述线切割装置中的线切割单元中设置有4个切割轮组。其中，相邻的两个切割轮组之间设置有过渡轮212，在此，切割线213顺次缠绕于所述切割轮211和过渡轮212上以在每一个切割轮组的两个切割轮211上形成一个切割线锯，其中，所述切割线213在缠绕于所述相邻两个切割轮组中相邻两个切割轮211时由前一个切割轮组中在后的一个切割轮211的切割线槽穿出并经由所述过渡轮212之后穿进后一个切割轮组中在前的一个切割轮211的切割线槽。在此，每两个相邻的切割轮组中间共用同一过渡轮212进行导向，可减小用于进行张力调节和导向的切割线213长度，使得切割线213中用于形成切割线锯的切割线213 长度比例增加，在化简绕线方式的同时，提高切割线213的利用率，降低生产成本。
请结合参考图18、图19，每一切割线锯可对应于一硅棒承载结构11上的硅棒进行切割，应当理解，变更切割轮211在第一方向设置的位置间距，任一个切割线锯对应的硅棒承载结构11也可以是2个、3个、4个等，在具体实现方式上，例如可将每一切割轮组中两个切割轮211在第一方向的距离增加，或，将硅棒承载结构11在第一方向的间距减小，使得在第二方向上切割轮组中的两个切割轮211分别位于2个、3个、或4个硅棒承载结构11的两端；在升降装置带动线切割单元升降运动时，每一切割线锯即可同时对其对应的多个硅棒承载结构11上放置的硅棒进行切割。在具体实施方式中，为防止出现切割线锯过长使得切割线213中张力不均的情形，每一切割线锯对应的硅棒承载结构11数量可根据实际情况选择，以稳定加工质量。
在某些实施方式中，属于同一线切割单元中的多个切割轮包括首切割轮、尾切割轮、以及位于所述首切割轮和尾切割轮之间的至少一中间切割轮，在所述至少一中间切割轮的旁侧还设有过渡轮，所述过渡轮具有至少两个导线槽，所述切割线顺次缠绕于所述切割轮和过渡轮以在任意相邻的两个切割轮上形成一个切割线锯，其中，所述切割线在缠绕于所述中间切割轮时，由所述中间切割轮上至少两个切割线槽中的一切割线槽穿出并经由旁侧的所述过渡轮之后由所述中间切割轮上至少两个切割线槽中的另一切割线槽穿进，从而使得任意相邻两个切割线锯之间在第二方向上具有一切割偏移量，所述切割偏移量对应于相关的两个切割线槽之间的间距；其中，通过所述至少一调距机构驱动所述至少一线切割单元中多个切割轮沿第二方向移动时，所述至少一线切割单元中的至少一过渡轮与多个切割轮保持相对静止。
请参阅图20，显示为本申请的线切割装置在一实施例中的一中间切割轮和其旁侧设置的过渡轮的结构示意图。结合图17和图20说明在此示例下所述线切割单元21采用的绕线方式，当切割线213对一线切割单元21中的切割轮组进行缠绕，每一中间切割轮211经历两次绕线，首尾切割轮211经历至少一次绕线。所述切割线213在缠绕于中间切割轮211时，由中间切割轮211上至少两个切割线槽中的第一切割线槽2111穿出并经由旁侧(在图20所示实施例中为切割轮211的上侧)的所述过渡轮212之后由所述中间切割轮211上至少两个切割线槽中的第二切割线槽2112穿进，从而使得任意相邻两个切割线锯之间在第一方向上具有一切割偏移量，所述切割偏移量对应于所述第一切割线槽2111和所述第二切割线槽2112之间的间距。
在一些实现方式中，对每一中间切割轮及其旁侧设置的一过渡轮，所述过渡轮的轴心与所述切割轮的轴心的连线与重垂线平行。在此情况下，过渡轮两侧的切割线长度相等或近似 相等，在切割过程中受力状态近似相同，有利于防止过渡轮两侧的切割线局部或单侧持续受力过大或张力不足的问题。
在一种示例中，如图20所示，在此，将过渡轮212设置于切割轮正上方，切割线213从切割轮211的第一切割线槽2111穿出并经由过渡轮212导向后绕至切割轮211的第二切割线槽2112，形成的过渡轮212两侧的切割线213在铅锤方向的平面上的投影为等长的线段。在此示例中，所形成的切割线锯为切割轮211的切割线槽下方的切线。
在另一示例中，所述过渡轮也可以为设置在切割轮的正下方，也即，过渡轮与切割轮的轴心连线为一重垂线。切割线从切割轮第一切割线槽向下缠绕至过渡轮，并由过渡轮导向后向上从切割轮第二切割线槽穿进，在此示例中，所形成的切割线锯为切割轮切割线槽上方的切线。
应当理解，所述旁侧主要用于确定中间切割轮与过渡轮的对应关系而并非特定的位置方位，例如旁侧还可以是切割轮的左侧、右侧、上侧、下侧、斜侧方等，本申请不做限制。具体的，所述线切割单元中多个切割轮与中间切割轮及切割线的布置方式可采用中国专利申请CN2020204403178(发明名称：硅棒开方设备)中描述的方式。
在前述各示例中，虽切割轮与过渡轮的相对位置关系、以及切割线的绕线方式不同，但线切割单元中多个切割轮均可在所述至少一调距机构作用下沿第二方向移动，以实现切割线锯切割位置调整或换槽。
请继续参阅图16，在前述各示例中已说明，属于同一线切割单元的各切割轮211可在调距机构23驱动下沿第二方向移动，因此切割轮211间形成的切割线锯在第二方向移动，即可实现切割线锯的切割位置调整；当线切割单元中还包括有过渡轮212，在所述至少一调距机构23驱动所述至少一线切割单元中多个切割轮211沿第二方向移动时，所述过渡轮212与切割轮211保持相对静止，对应的切割线锯在第二方向移动即可实现切割线锯的切割位置调整。
当所述至少一调距机构23用于实现变换切割线绕于所述至少一线切割单元21中多个切割轮211的切割线槽，在实际场景中，可预先确定的换槽前后切割线所分别对应的切割线槽，例如，换槽前切割线所在位置为切割线槽a1，换槽后切割线绕于切割线槽a2，基于切割线槽a1与切割线槽a2之间的切割偏移量确定所述至少一调距机构23驱动线切割单元中的多个切割轮211在第二方向移动的位移量，即将所述位移量设置为切割线槽a1与切割线槽a2之间的切割偏移量，即可用于实现切割线用切割线槽a1至切割线槽a2的更换；应当说明的是，所述至少一调距机构23驱动线切割单元中多个切割轮211在第二方向移动的方向为切割线 槽a2指向切割线槽a1的方向，换槽后所述切割线锯在空间中的切割位置不变，则省去了进一步校准切割轮211或其他部件位置的步骤即可按照预设的切割量对硅棒进行切割，使得换槽过程被简化。
为进一步说明所述至少一调距机构实现对线切割单元中多个切割轮沿第二方向移动的实现方式，本申请提供了以下实施例。在某些示例中，当所述线切割中的线切割单元数量不同，所述至少一调距机构的具体形式可作相应变化。
在一实施例中，所述线切割装置包括单线切割单元；所述调距机构包括：丝杆，沿第二方向设置且与所述单线切割单元螺纹连接；驱动源，用于驱动所述丝杆转动。
在此，所述单线切割单元即为一个线切割单元，线切割装置中的单线切割单元中包括沿第一方向设置的多个切割轮，切割线缠绕于多个切割轮由此形成至少一切割线锯，且所述至少一切割线锯沿同一直线方向。所述调距机构的丝杆具有远端及近端，在具体实现方式中，例如可将丝杆近端连接至驱动源并在驱动源驱动下转动，丝杆远端以螺纹连接至所述单线切割单元，藉由丝杆两端的连接方式，所述丝杆可基于驱动源传动发生转动并借助螺纹连接将丝杆转动转化为轴线位移，所述轴向位移方向为丝杆的设置方向即第二方向；通过调距机构中驱动源驱动丝杠转动即可实现单线切割单元在第二方向位移，所述丝杠被驱动转动的旋向不同，即可实现单线切割单元在第二方向位移的前进或后退。
在另一实施例中，所述线切割装置包括单线切割单元；所述调距机构包括：伸缩件，沿第二方向设置且与所述单线切割单元关联；驱动源，用于驱动所述伸缩件沿第二方向作伸缩运动。在此，所述伸缩件可设置为杆体结构且杆体延伸方向即为第二方向，所述伸缩件在驱动源驱动下可沿其延伸方向伸缩运动，伸缩件一端可连接至所述驱动源，可伸缩的自由端关联所述单线切割单元，即可在驱动源作用下带动所述单线切割在第二方向移动。所述伸缩件例如为电动伸缩杆，又如为连接至气缸锥杆的连接杆，所述气缸即可作为驱动源，本申请不做限制。所述伸缩杆关联至所述单线切割单元的方式可为直线连接或间接连接，例如可直接连接至单线切割单元安装梁，又或通过支座或轴承间接连接至所述单线切割单元。应当理解，所述伸缩件伸张或收缩即可对应于单线切割单元沿第二方向的前进或回退。
在此，在本申请提供的实施例中，所述关联例如可通过卡合、螺锁、粘接、及焊接中的一种或多种实现，例如在上述实施例中，所述伸缩杆可通过卡合、螺锁、粘接、及焊接中的一种或多种方式关联所述线切割单元；当然，所述关联的实现方式并不以此为限，而旨在于实现在第二方向的传动。
在又一实施例中，所述线切割装置包括单线切割单元；所述调距机构包括：齿条，沿第二方向设置于所述单线切割单元；传动齿轮，与所述齿条啮合；驱动源，用于驱动所述传动齿轮转动。所述传动齿轮在驱动源驱动下转动，啮合于所述传动齿轮的齿条相应的沿齿条步骤方向移动，在此示例中，藉由所述齿条与传动齿轮配合，即可将驱动源驱动的转动运动转化为沿齿条方向的线运送，所述齿条沿第二方向设于所述单线切割单元，即可带动所述单线切割单元沿第二方向移动。同时，由所述驱动源控制切换所述传动齿轮的旋向，即可使得所述单线切割单元在切换沿第二方向前进或回退的位移方向。
在前述各实施例中，所述调距机构可设置为一个或多个，例如，当所述单线切割单元在第一方向的跨距较大，当通过设置一调距机构难以带动所述单线切割单元中多个切割轮沿第二方向移动时，可设置多个调距机构进行驱动，例如在单线切割单元沿第一方向的两端分别设置调距结构或沿第一方向等间距设置多个调距机构，在此，单线切割单元上对应的多个调距机构之间可协同作用，以确保所述多个调距机构以相同的位移量(大小和方向)驱动单线切割单元的多个线切割轮的在第二方向移动。
在一实施例中，所述线切割装置包括沿第二方向相对设置的第一线切割单元和第二线切割单元，所述第一线切割单元和第二线切割单元中的至少一者通过所述至少一调距机构驱动沿第二方向移动，用于调整所述第一线切割单元中至少一切割线锯与所述第二线切割单元中至少一切割线锯之间的线割线锯间距、或者变换切割线绕于所述第一线切割单元中多个切割轮的切割线槽和/或所述第二线切割单元中多个切割轮的切割线槽。
在某些实施方式中，所述线切割装置包括两个线切割单元如第一线切割单元和第二线切割单元，例如图16所示实施例，所述第一线切割单元21a和第二线切割单元21b相互平行的沿第一方向设置，第一线切割单元21a与第二线切割单元21b中的切割线锯也相平行。在实际场景中，所述线切割装置例如可用于硅棒开方设备中，硅棒开方设备中每一硅棒承载结构上的硅棒在切割区内对应于第一切割单元与第二切割单元的切割线锯，则一次升降切割可在硅棒表面加工形成两个相平行的切面。在此，通过调整所述第一线切割单元21a与第二线切割单元21b在第二方向间距，即可控制对硅棒的切割量。
所述至少一调距机构23即可设置为连接至所述第一线切割单元21a或第二线切割单元21b，又或同时关联所述第一线切割单元21a和第二线切割单元21b，以驱动所连接或关联的第一线切割单元21a或/及第二线切割单元21b中多个切割轮211沿第二方向移动，并实现调整所连接或关联的第一线切割单元21a或/及第二线切割单元21b中至少一线割线锯的切割位 置、或者变换所连接或关联的第一线切割单元21a或/及第二线切割单元21b中多个切割轮211的切割线槽。
在一实施例中，所述调距机构包括：丝杆，沿第二方向设置且与所述第一线切割单元或所述第二线切割单元螺纹连接；以及驱动源，用于驱动所述丝杆转动。所述丝杆与驱动源驱动第一线切割单元或所述第二线切割单元中多个切割轮在第二方向移动的方式与前述实施例类似，被调距机构驱动的所述第一切割单元或所述第二线切割单元可看作单线切割单元，此处不做赘述。应当理解，在任一线切割单元上设置所述调距机构，即可实现第一线切割单元与第二线切割单元间形成的相平行的切割线锯间距增加及减小，所述线切割装置即可将硅棒切割为不同规格。
在另一实施例中，所述调距机构包括：伸缩件，沿第二方向设置且与所述第一线切割单元或所述第二线切割单元关联；驱动源，用于驱动所述伸缩件沿第二方向作伸缩运动。在此，设置有所述调距机构的所述第一切割单元或所述第二线切割单元即可看作单线切割单元，具体实现方式可参照前述实施例，此处不再赘述。
在又一实施例中，所述调距机构包括：齿条，沿第二方向且与所述第一线切割单元或所述第二线切割单元关联；传动齿轮，与所述齿条啮合；驱动源，用于驱动所述传动齿轮转动。通过相啮合的传动齿轮与齿条，所述驱动源可控制所述齿条沿齿条方向线运动，关联于所述齿条的第一线切割单元或第二线切割单元可藉由所述齿条带动多个切割轮沿第二方向移动。
在一实施例中，所述调距机构包括：双向丝杆，沿第二方向设置且与所述第一线切割单元和所述第二线切割单元螺纹连接；以及驱动源，用于驱动所述丝杆转动以使得所述第一线切割单元和所述第二线切割单元沿第二方向相向移动或相背移动。在一种实施方式中，呈如图16所示实施例，所述双向丝杆231为双螺纹丝杆，所述双向丝杆231两端分别设有螺纹且螺纹方向相反，所述驱动源232可设置在双向丝杆231的任一一端以带动双向丝杆231沿丝杆231轴转动，藉由双向丝杆231两端方向相反的螺纹，所述双向丝杆231在驱动源232驱动下转动时双向丝杆231两端的运动被转化为方向相反的轴向线运动，所述轴向即设置双向丝杆231的第二方向。在所述驱动源232驱动下，所述第一线切割单元21a与第二线切割单元21b即可相向运动或相背运动。
在一实施例中，所述调距机构包括：第一齿条，沿第二方向且与所述第一线切割单元关联；第二齿条，沿第二方向且与所述第二线切割单元关联；传动齿轮，与所述第一齿条和第二齿条啮合；驱动源，用于驱动所述传动齿轮转动以使得所述第一线切割单元和所述第二线 切割单元沿第二方向相向移动或相背移动。
在实施方式中，所述第一齿条联动于所述第一线切割单元，所述第二齿条联动于所述第二线切割单元，所述传动齿轮连接于驱动源例如伺服电机的动力输出轴，并与所述第一齿条及所述第二齿条相啮合，用于在正向转动时带动所述第一线切割单元及第二线切割单元相向运动以执行闭合动作，在逆向转动时带动所述第一线切割单元及第二线切割单元背向运动。所述第一齿条与第二齿条可啮合于所述传动齿轮的两侧，使得传动齿轮旋转时第一齿条和第二齿条处的线速度方向相反，由驱动电机带动所述传动齿轮旋转，令传动齿轮正转时第一齿条与第二齿条相向运动即带动第一线切割单元与第二线切割单元相向运动，传动齿轮被带动逆向转动时第一齿条与第二齿条背向运动以带动第一线切割单元和第二线切割单元背向运动。在此，所述传动齿轮可以轴连接至驱动源的动力输出轴，也可间接连接至所述动力输出轴例如轴连接至连接动力输出轴的转动部。
在此，所述线切割装置中可设置一个或多个调距机构，每一调距机构与所述第一线切割单元和第二线切割单元连接，所述调距机构的数量可基于驱动的动力需要、丝杆受力、驱动线切割单元中多个切割轮移动的平稳度、以及线切割装置的设备空间等因素综合确定，例如，当所述第一线切割单元和第二线切割单元在第一方向的跨距较小，仅采用一个调距机构即可实现对切割单元中切割线锯的切割位置调整或切割线换槽，则可在线切割装置中设置一调距机构以驱动所述第一线切割单元和所述第二线切割单元沿第二方向相向移动或相背移动；又如，当所述第一线切割单元和第二线切割单元在第一方向的跨距较长，线切割单元需要较大的动力驱动且需满足该动力在丝杆或齿条等传动连接部件的受力强度范围内，所述线切割装置中可设置多个调距机构，所述多个调距机构间协同作用以确保所述多个调距机构以相同的位移量(大小和方向)驱动第一线切割单元和第二线切割单元的多个线切割轮的在第二方向相向移动或相背移动。
在某些实施方式中，所述调距机构为设于所述至少一线切割单元的伺服电机。在实际场景中，在所述线切割装置的至少一线切割单元上或每一线切割单元上设置伺服电机，由所述伺服电机控制对应的线切割单元在第二方向的位移。所述线切割单元可预先确定的换槽的切割偏移量或切割线变换切割位置的调整量，藉由伺服电机精确定位的功能带动所述线切割单元中多个切割轮以预设位移量沿第二方向运动。例如，所述线切割装置中设有单线切割单元，所述单线切割单元上设有伺服电机以带动所述单线切割单元沿第二方向移动；又如，所述线切割装置中设有第一线切割单元和第二线切割单元，所述第一线切割单元或/和第二线切割单 元在其对应的伺服电机带动下相对独立的沿第二方向移动。在某些示例中，所述伺服电机也可更换为行进电机与行进丝杠，所述线切割单元可藉由行进电机驱动在线切割支座上沿第二方向运动。
在此，本申请提供的硅棒加工设备的线切割装置，其中包括至少一调距机构并设于至少一线切割单元上，在所述调距机构作用下，可驱动所述线切割装置中至少一线切割单元的多个切割轮沿第二方向移动，绕于所述多个切割轮形成的至少一切割线锯由此可在调距机构作用下更改在第二方向的切割位置，又或，基于所述多个切割轮在第二方向移动可变换切割线绕于所述多个切割轮的线槽位置，基于所述调距机构实现切割线位置变换或换槽的过程简易，易于实现且操作便捷，有利于提高操作效率。
本申请在另一方面还提供了一种硅棒加工设备，包括机座、硅棒承载结构、以及线切割装置。其中，所述机座具有硅棒加工平台；所述硅棒承载装置设于所述硅棒加工平台上，用于承载待切割硅棒；所述线切割装置包括切割架，设于所述机座；至少一线切割单元，活动设于所述切割架；所述线切割单元包括：沿第一方向依序设置的多个切割轮，每一个切割轮上具有至少两个切割线槽；切割线，顺次绕于所述多个切割轮以形成至少一切割线锯；至少一调距机构，设于所述至少一线切割单元上，用于驱动所述至少一线切割单元中多个切割轮沿第二方向移动，以调整所述至少一线切割单元中至少一线割线锯的切割位置、或者变换切割线绕于所述至少一线切割单元中多个切割轮的切割线槽。
在某些实施方式中，所述硅棒加工设备为硅棒开方设备，所述硅棒承载装置为硅棒承载结构。
在此，所述硅棒加工平台上可以设有一个或多个硅棒承载结构，每一硅棒承载结构可用于承载单根硅棒，对应地，所述硅棒加工平台上切割区内的硅棒承载结构数量可对应于所述线切割装置的线切割单元中切割线锯的数量，例如图17或图18所示实施例，所述硅棒加工平台的切割区内设有多个硅棒承载结构11，所述线切割装置中的一线切割单元21中包括多段切割线锯以分别对应多个硅棒承载结构11。
以图17所示实施例中所述硅棒加工设备为硅棒开方设备为例进行说明，在某些实施方式中，所述硅棒加工平台通过工作台转换机构设于所述机座10，在此，所述工作台转换机构例如可为转动机构或平移机构。
所述转动机构例如可包括转动轴和转动驱动单元，所述转动轴轴接于所述硅棒加工平台，所述转动驱动单元驱动所述转动轴转动以带动所述硅棒加工平台转动。
所述平移机构例如可包括平移导轨、滑块和平移驱动单元。所述平移导轨铺设于机座上，所述滑块设于所述硅棒加工平台的底部并与所述平移导轨相适配以为硅棒加工平台提供平移导向，所述平移驱动单元用于驱动所述硅棒加工平台沿着所述平移导轨移动以使得位于硅棒加工平台上的硅棒承载结构在切割区和装卸区切换，所述平移驱动单元可采用气缸组件或藉由电机驱动的丝杆组件。在其他实施例中，所述平移机构也可采用齿轮传动的方式，具体地，所述平移机构包括平移齿轨和藉由电机驱动的与平移齿轨相适配的转动齿轮，所述平移齿轨设置于所述硅棒加工平台的底部，可例如为具有一定长度的至少一个齿条，为了使得硅棒加工平台平稳的移动，各齿条适配有至少两个间隔设置的转动齿轮，电机驱动转动齿轮转动，以带动硅棒加工平台移动使位于硅棒加工平台上的硅棒承载结构在切割区和装卸区切换。
在某些示例中，当所述工作台转换机构为平移机构，通过所述平移机构可控制所述硅棒承载结构承载的硅棒在第二方向的位置，由所述平移机构确定的硅棒位置与所述线切割装置调距机构确定的切割线锯位置，即可决定对硅棒的切割量；例如，当所述线切割装置中设有第一线切割单元与第二线切割单元，所述第一线切割单元或第二线切割单元中设有所述调距机构，当所述调距机构调整所述第一线切割单元或第二线切割单元中至少一线割线锯的切割位置后，所述平移机构可基于调整后的切割线锯位置将硅棒位置调整至硅棒轴心位于第一线切割单元与第二线切割单元的切割线锯的对称线上，由于硅棒截面通常为类圆形，令第一线切割单元与第二线切割单元的切割线锯距硅棒截面圆心的距离相等，则切削加工后在硅棒表面形成的两个相对的切面的规格大致相同。
所述硅棒开方设备可以为例如图17或图18所示实施例的硅棒开方设备，当然，也可为其他类型的硅棒开方设备，例如，所述硅棒开方设备中线切割装置中可设置为单线切割单元；又如，所述硅棒开方设备的线切割装置中线切割单元中的切割线锯为一段，当然，切割线锯也可为两段、三段、四段等，本申请不做限制，对应的，所述硅棒加工平台上的硅棒承载结构的数量可相应变换；再如，所述硅棒开方设备的线切割装置中线切割单元中的每一切割线锯对应的硅棒承载结构数量可以为一个、两个、三个等。
应当理解，当所述硅棒开方设备中设有如图16至图20所示实施例中任一项所述的线切割装置，所述硅棒开方设备在开方切割中即可基于所述至少一调距机构调整切割线锯的切割位置以确定对硅棒的切割量，又或所述硅棒开方设备的切割轮在长期切割作业中线槽磨损后，可基于所述至少一调距机构变换切割线的线槽位置，以确保所述硅棒开方设备继续开方作业的加工精度。
在某些实施方式中，当所述硅棒加工设备为硅棒截断机，所述硅棒截断机中包括机座、硅棒承载装置、以及线切割装置。
其中，所述机座具有硅棒加工平台，所述硅棒承载装置设于所述硅棒加工平台上。在此，所述硅棒承载装置例如可用于卧式承载待切割硅棒；所述线切割装置包括切割架，设于所述机座；至少一线切割单元，活动设于所述切割架；所述线切割单元包括：沿第一方向依序设置的多个切割轮，每一个切割轮上具有至少两个切割线槽；切割线，顺次绕于所述多个切割轮以形成至少一切割线锯；至少一调距机构，设于所述至少一线切割单元上，用于驱动所述至少一线切割单元中多个切割轮沿第二方向移动，以调整所述至少一线切割单元中至少一线割线锯的切割位置、或者变换切割线绕于所述至少一线切割单元中多个切割轮的切割线槽。所述线切割装置中的线切割单元相对于切割架升降运动即可实现对待切割硅棒的进给切割。
在某些示例中，所述硅棒截断机的线切割装置中设有多个相平行的线切割单元，所述多个相平行的线切割单元沿切割架升降运动，即可在一次切割中将待切割硅棒截取为多个硅棒截段。基于所述线切割装置的至少一调距机构调整线切割单元中的至少一切割线锯在第二方向的切割位置，即可将待切割硅棒截取为不同长度规格的硅棒截段。在一实现方式中，所述硅棒截断机的线切割装置的设置方式以及硅棒承载装置的形式可参照中国专利CN105196433B公开的布置方式，当然，所述硅棒截断机的线切割装置中包括所述至少一调距机构，以调整所述硅棒截断机的至少一线切割单元中至少一线割线锯的切割位置、或者变换切割线绕于所述至少一线切割单元中多个切割轮的切割线槽。
在某些示例中，所述硅棒截断机例如为双根硅棒截断设备，在此，所述硅棒截断机的硅棒承载装置中设有第一加工工位与第二加工工位，以分别对应承载第一待切割硅棒与第二待切割硅棒。请参阅图21，显示为所述硅棒截断机的线切割装置在一实施例中的结构示意图。在此示例中，所述线切割支座24设于切割架20上，线切割支座24沿第一方向的两侧分别设置有至少一线切割单元21，位于所述线切割支座24两侧的至少一线切割单元21即可分别对第一加工工位、第二加工工位处的待切割硅棒进行切割。所述线切割单元21中设有多个切割轮211、绕于所述切割轮211的切割线213，在某些示例中线切割单元21中还设有过渡轮212。其中，所述切割轮211具有至少两个切割槽，所述过渡轮212具有至少两个导线槽。在此，所述线切割支座24任一一侧还包括所述至少一调距机构(图中未予以显示)，所述调距机构例如可设置为如图16至图20所示实施例的任一实现方式中所述的调距机构，例如藉由丝杆与第一线切割单元或第二线切割单元连接、又如藉由双向丝杆与第一线切割单元及第二线切 割单元连接、或如所述调距机构为伺服电机等，此处不再赘述。如此，利用所述调距机构，可调整所述至少一线切割单元21中至少一线割线锯的切割位置、或者变换切割线213绕于所述至少一线切割单元21中多个切割轮211的切割线槽。
当所述调距机构用于调整所述至少一切割线锯位置或变换切割线213绕于切割轮211中的切割线槽时，线切割单元21中的过渡轮212与切割轮211保持相对静止；其中，当所述调距机构用于调整切割线锯位置时，所述调距机构例如可带动线切割单元21上的切割轮211与过渡轮212均沿第二方向移动，所述切割线锯相对于切割轮211、过渡轮212的位置关系不变，即仅发生沿第二方向的移动，即可实现切割位置调整；当所述调距机构用于实现对变换切割线213绕于切割轮211中的线槽位置时，所述过渡轮212中用于缠绕切割线213的导线槽位置也相应改变，即可使得切割线213换槽后用于缠绕切割线213的导线槽与切割线槽仍在同一平面内。
在某些实施方式中，所述线切割支座24两侧的线切割单元21还可组成至少一对线切割单元21，例如，将线切割支座24两侧的线切割单元21一一对应的连接形成至少一对线切割单元21，所述一对线切割单元21位于第一方向的同一直线上，在此示例下，基于同一调距机构可驱动所述一对线切割单元21中的多个切割轮211在第二方向移动，当然，所述一对线切割单元21也可由多个调距机构协同驱动。
当然，所述硅棒截断机的具体形式不以前述实施例为限制，例如，基于硅棒承载装置上硅棒的摆放位置与切割线锯的位置关系，所述硅棒截断机中每一切割线锯可同时对多根硅棒进行截断切割；又如所述硅棒截断机的线切割装置中仅包括一段切割线锯，所述一段切割线锯用于对单根或多根硅棒进行截断时一次截断作业中被切割的硅棒被分割出一硅棒截段；本申请不做限制，应当说明的是，所述硅棒截断机的线切割装置包括至少一调距机构，可用于驱动线切割装置的至少一线切割单元中多个切割轮沿第二方向移动，以调整所述至少一线切割单元中至少一线割线锯的切割位置、或者变换切割线绕于所述至少一线切割单元中多个切割轮的切割线槽。
在某些实施方式中，所述硅棒加工设备为硅棒切磨一体机。在此，所述硅棒切磨一体机包括机座、硅棒承载装置、线切割装置、以及研磨装置。
其中，所述机座具有硅棒加工平台，在所述硅棒切磨一体机中，所述硅棒加工平台可设置为执行不同加工功能的加工区位，例如由切割工位与研磨工位组成。所述硅棒承载装置用于承载待加工硅棒。所述线切割装置包括切割架，设于所述机座；至少一线切割单元，活动 设于所述切割架；所述线切割单元包括：沿第一方向依序设置的多个切割轮，每一个切割轮上具有至少两个切割线槽；切割线，顺次绕于所述多个切割轮以形成至少一切割线锯；至少一调距机构，设于所述至少一线切割单元上，用于驱动所述至少一线切割单元中多个切割轮沿第二方向移动，以调整所述至少一线切割单元中至少一线割线锯的切割位置、或者变换切割线绕于所述至少一线切割单元中多个切割轮的切割线槽。
请参阅图22，显示为本申请的硅棒切磨一体机在一实施例中的结构示意图。在此示例中，如图22所示，所述硅棒切磨一体机包括机座，具有硅棒加工平台；线切割装置，设于所述机座上，用于对所述硅棒加工平台的第一加工区位上的硅棒进行第一方向侧面切割以及对所述硅棒加工平台的第二加工区位上的硅棒进行第二方向侧面切割，形成方形的硅棒；研磨装置，设于所述机座上，用于对所述硅棒加工平台的第三加工区位上的所述方形的硅棒进行磨面及倒角；硅棒转换装置，设于所述硅棒加工平台上，用于将所述硅棒在第一加工区位、第二加工区位以及第三加工区位上进行转换。
在此，所述线切割装置包括：切割架20、线切割支座24、第一切割单元组、以及第二切割单元组，所述第一切割单元组、第二切割单元组用以分别对第一加工区位、第二加工区位上的硅棒进行切割。
在本实施例中，由于线切割支座24可供配置第一切割单元组和第二切割单元组，即，第一切割单元组和第二切割单元组共用线切割支座24。因此，在本实施例中，一方面，线切割装置中的切割架20和线切割支座24设于第一加工区位和第二加工区位之间的居中位置。另一方面，线切割支座24作了特别的设计。如图22所示，本实施例中的线切割支座24可包括支座主体和位于支座主体相对两旁侧的第一支座侧翼和第二支座侧翼。在某些实施方式中，线切割支座24中的支座主体以与X轴或Y轴呈45°设置，第一支座侧翼与支座主体之间呈145°夹角并以沿Y轴设置，第二支座侧翼与支座主体之间呈145°夹角并以沿X轴设置。
在某些实施例中，第一切割单元组可至少包括四个第一切割轮211a，这四个第一切割轮211a可组合成一对第一切割轮组，即，由沿着X轴相对设置两个第一切割轮211a形成一个第一切割轮组，由沿着Y轴的两个第一切割轮组就组成一对第一切割轮组，即形成沿X方向布置的相平行的两个线切割单元21。切割线213依序绕设于第一切割单元组中的各个第一切割轮组后形成切割线网。于实际的应用中，切割线213依序绕设于第一切割单元组中的四个第一切割轮211a后形成两条切割线锯，这两条切割线锯即沿X轴方向设置并相互平行，构成切割线网。具体地，切割线213绕设于一个第一切割轮组中沿X轴方向设置的两个第一切割 轮211a后形成一条切割线锯，切割线213绕设于另一个第一切割轮组中沿X轴方向设置的两个第一切割轮211a后形成另一条切割线锯。如此，这两条相互平行的切割线锯配合形成沿X轴方向呈“＝”字型的第一切割线网。
类似地，所述第二切割单元组可至少包括四个第二切割轮211b，由沿着Y轴相对设置两个第二切割轮211b成一个第二切割轮组，由沿着X轴的两个第二切割轮组就组成一对第二切割轮组，即形成沿Y方向布置的相平行的两个线切割单元21；于实际的应用中，切割线213依序绕设于第二切割单元组中的四个第二切割轮211b后形成两条切割线锯，这两条切割线锯即沿Y轴方向设置并相互平行，两条相互平行的切割线锯配合形成沿Y轴方向呈“＝”字型的第二切割线网。
在某些示例中，所述硅棒转换装置设于所述硅棒加工平台的居中区域，用于将硅棒在所述硅棒加工平台上的等待区位、第一加工区位、第二加工区位、以及第三加工区位之间转换。在一实施方式中，硅棒转换装置旋转设置于所述硅棒加工平台上，硅棒转换装置可进一步包括：输送本体，呈圆盘状、方盘状或其他类似状；设于输送本体上的硅棒定位机构(即硅棒承载装置)，用于对硅棒进行定位；转换驱动机构，用于驱动输送本体转动以带动硅棒定位机构所定位的硅棒转换位置。在某些示例中，所述硅棒定位机构还包括一转动结构，用于带动承载于硅棒定位机构上的硅棒沿硅棒轴心转动以调整硅棒的切割面。
在此，待切割硅棒被置放定位于硅棒定位机构上后，待切割硅棒在第一加工区位处由线切割装置中的沿X轴方向呈“＝”字型的第一切割线网进行切割形成沿X轴方向的两个轴切面；而后，所述转换驱动机构驱动输送本体带动硅棒定位机构将硅棒定位至第二加工区位，由线切割装置中的沿Y轴方向呈“＝”字型的第二切割线网进行切割形成沿Y轴方向的两个轴切面，即形成截面为类矩形的已切割硅棒；所述已切割硅棒还可转换至第三加工区位进行后续的研磨作业。
在所述硅棒切磨一体机的前述各示例中，所述线切割装置中还包括至少一调距机构(图中未予以显示)，在一具体实施方式中，在第一加工区位处的第一切割单元组与在第二加工区位处的第二切割单元组中包括至少一调距机构，设于对应的切割单元组中的至少一线切割单元上，用于驱动所述至少一线切割单元切割轮组中多个切割轮沿第二方向移动。
在此，所述第一方向与第二方向基于线切割单元的载体坐标系定义，因此，当硅棒加工设备(在此示例中为硅棒切磨一体机)中多个线切割单元的方向不同，多个线切割所分别对应的第一方向在外部空间不是同一方向；对应地，所述第二方向正交于第一方向，因此，由 所述至少一调距机构执行的驱动移动方向为相对于所驱动的线切割单元的正交方向。例如，在所述第一切割单元组中，线切割单元与切割线锯沿X轴方向设置，第一切割单元组中所述第一方向为X轴方向，第二方向为Y轴方向；在所述第二切割单元组中，线切割单元与切割线锯沿Y轴方向设置，第二切割单元组中所述第一方向为Y轴方向，第二方向为X轴方向。
以所述第一切割单元组为例，其中包括两个线切割单元，所述调距机构例如可关联至两个线切割单元的第一线切割单元或第二线切割单元，又或同时关联至第一线切割单元与第二线切割单元，所述调距机构例如可设置为如图16至图20所示实施例的任一实现方式中所述的调距机构，例如藉由丝杆与第一线切割单元或第二线切割单元连接、又如藉由双向丝杆与第一线切割单元及第二线切割单元连接、或如所述调距机构为伺服电机等，此处不再赘述。
在所述第一切割单元组中，当所述至少一调距机构驱动第一线切割单元或/及第二线切割单元中的多个切割轮沿第二方向移动，所述第一线切割单元或/及第二线切割单元例如可为沿第一支座侧翼移动即沿第一切割单元组中的第二方向(Y轴方向)移动；可用以调整所述第一线切割单元或/及第二线切割单元中至少一线割线锯的切割位置、或者变换切割线绕于所述第一线切割单元或/及第二线切割单元中多个切割轮的切割线槽。
所述第二切割单元组与第一切割单元组的结构形式类似，主要区别在于在硅棒切磨一体机中布置位置与方向不同；但在第二切割单元组中，用于驱动第一线切割单元或/及第二线切割单元中的多个切割轮沿第二方向移动的所述至少一调距机构的结构与功能类似第一切割单元组，此处不再赘述。
应当理解，在某些实施方式中，所述第一加工区位与第二加工区位的位置关系可作变换，例如将第一加工区位与第二加工区位设置为硅棒转换装置载着硅棒转动60°即可实现在两个加工区位间切换，对应的所述第一切割单元组与第二切割单元组中线切割单元的方向也可能改变，在此示例下，所述第一切割单元组与第二切割单元组的线切割单元分别对应的第一方向改变，但仍可藉由切割单元组中的至少一调距机构实现切割线锯位置调整或换槽；在某些实施方式中，所述硅棒切磨一体机中不同加工工位处例如只包括单线切割单元；在某些实施方式中，所述硅棒切磨一体机例如仅设置有一个用于进行切割加工的工位，在一种具体实现方式上，所述切割加工的工位中可设置“＝”字型切割线网，硅棒定位机构驱动硅棒转动90°再次进行切割；所述硅棒切磨一体机具有多种变形形式，本申请不做限制。
一般来说，在相关线切割装置中多个切割轮在安装后相互间的位置关系不轻易变动，在其中一个线切割轮磨损后需通过调整切割轮或其他部件位置进行整体换槽，并对调整位置的 部件需进一步校准，操作繁琐且效率低下。
在此，本申请还提供了一种硅棒加工设备的线切割装置，所述硅棒加工设备包括机座，具有硅棒加工平台；硅棒承载装置，设于所述硅棒加工平台上，用于承载待切割硅棒；所述线切割装置包括：切割架，设于所述机座；至少一线切割单元，活动设于所述切割架；所述线切割单元包括：沿第一方向依序设置的多个切割轮，每一个切割轮上具有至少两个切割线槽；至少一过渡轮，每一个所述过渡轮具有导线槽；切割线，顺次绕于所述多个切割轮和过渡轮以形成至少一切割线锯；至少一移位机构，用于驱动所述至少一过渡轮沿第二方向移动，以使所述至少一过渡轮中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮的第一线槽移动至对应于所述切割轮的第二线槽。
应当理解，在线切割装置中，由高速运行的钢线带动附着在钢线上的切割刃料或者直接采用金刚线对待加工工件进行摩擦，从而达到线切割的目的。在切割过程中，钢线或金刚线通过过渡轮引导，在切割轮上形成一根线锯或者一张线网，而待加工工件通过工作台的上升下降或线锯或线网的上升下降实现工件的进给。在长期的切割作业中，切割轮的切割线槽与过渡轮的导线槽不可避免的产生磨损，则影响切割线的定位精度，由此引申了换槽的需要。
在本申请提供的以下实施例中，所述线切割装置中包括至少一线切割单元，所述线切割单元中多个切割轮沿第一方向设置，即多个切割轮的切割线槽所在平面平行于第一方向，对所述多个切割轮中的任一切割轮，其不同切割线槽间具有第二方向的偏移；所述至少一移位机构可用于驱动至少一过渡轮相对于线切割单元沿第二方向移动，即可将过渡轮中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮的第一线槽移动至对应于所述切割轮的第二线槽。
在此，所述第一线槽(在本申请中也称作第一切割线槽)与第二线槽(在本申请中也称作第二切割线槽)用于指代所述至少一过渡轮中在移位机构驱动移动前后的经切割缠绕的导线槽分别对应的切割轮的切割线槽，所述切割轮的切割线槽数量并不以两个为限，同时，所述第一线槽与第二线槽不必要为切割轮上的相邻切割线槽，仅当为不同切割线槽。
应用所述线切割装置的硅棒加工设备可以是硅棒开方设备、硅棒截断设备、硅棒切磨一体设备等，在以下提供的实施例中，以本申请的线切割应用于硅棒开方设备为例进行说明，但并非用于限制本申请的线切割装置的应用场景。
请结合参阅图23和图17，其中图23显示为本申请的线切割装置在一实施例中的结构示意图，图17显示为本申请的线切割装置在一实施例中应用于硅棒开方设备中的结构示意图。如图所示，所述线切割装置包括切割架20、以及至少一线切割单元21。
其中，所述切割架20设于所述机座，在某些实施方式中，所述切割架20设于机座的两端以确保架设于切割架20的线切割单元21上形成的切割线锯可覆盖不同加工工位，例如图2所示的示例中，所述切割架20为设置于机座两端的柱体，所述硅棒开方设备中机座上设有多个硅棒承载结构，所述线切割单元21的跨距包括切割区内的每一硅棒承载结构。
所述线切割单元21中包括多个切割轮211、至少一过渡轮212、切割线213、以及至少一移位机构215。
应当理解，所述多个切割轮211需要依附于线切割单元21提供的载体，在一些示例中，所述线切割单元21中包括第一方向的安装梁214，所述安装梁214两端活动连接至切割架20，每一安装梁214上依序设置多个切割轮211。即，一线切割单元21由沿同一方向(或同一直线)的设置的多个切割轮211、切割线213及切割轮211的承载结构组成；所述多个切割轮211沿安装梁214设置的方向为切割轮211轮面(或切割线槽所在平面)沿安装梁214方向(即第一方向)。
在某些示例中，当所述线切割装置中设有多个线切割单元21，不同的线切割单元21分属位于不同直线上，如图23所示的两个线切割单元21分别平行，在一些示例中，不同线切割单元21的延伸方向也可为相交。
应当说明，在本申请提供的所述线切割装置的各实施例中，所述第一方向即设置线切割单元21中多个切割轮211的方向，例如在一些示例中的线切割单元21的安装梁214方向，由切割线213绕于切割轮211形成的切割线锯也为第一方向；所述第二方向为第一方向的正交方向，所述至少一调距机构驱动所述至少一线切割单元21沿第二方向移动，即使得线切割单元21中的切割线锯沿其正交方向移动。
所述至少一过渡轮212用于实现切割线213绕于不同切割轮211时的方向导向或张力调整。
在一些实现方式中，以一线切割单元21为例进行说明，线切割单元21中包括至少一过渡轮212，所述至少一过渡轮212可活动设置于承载多个切割轮211的载体。
应当理解，所述多个切割轮211需要依附于线切割单元21提供的载体，在某些实施方式中，属于同一线切割单元21中的多个切割轮211设于沿第一方向设置的安装梁214上。所述安装梁214两端可活动连接至切割架20，每一安装梁214上依序设置多个切割轮211。即，一线切割单元21由沿同一方向(或同一直线)的设置的多个切割轮211、切割线213及设置切割轮211的安装梁214组成。在另一些实施方式中，所述线切割单元21中的多个切割轮211通过安装架、连接板、或框架设于所述切割架20，在此，由线切割单元21提供的用于设 置多个切割轮211的载体可以为不同形式，本申请不做限制。
如图17所示实施例，在此，同一线切割单元21中的多个切割轮211设置于一安装梁214上，所述安装梁214沿第一方向设置并在所述至少一移位机构215的驱动下沿第二方向相对所述安装梁214运动，所述至少一过渡轮212即发生相对于线切割单元21中多个切割轮211在第二方向的移动，由所述至少一移位机构215控制过渡轮212的位移，即可实现所述至少一过渡轮212中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮211的第一线槽移动至对应于所述切割轮211的第二线槽。在实际场景中，变换所述至少一过渡轮212的导线槽对应的切割线槽位置，则无需对过渡轮212进行调整即可实现切割线213在切割轮211上的换槽，可有效化简换槽操作。
在此，换槽过程可在切割线213所缠绕的导线槽不发生更变的情形下完成，在某些示例中，所述过渡轮212为单导线槽过渡轮212。
在一实施例中，所述至少一过渡轮可拆卸的设于所述线切割单元。在此，所述过渡轮可设置为可更换的过渡轮，例如，所述过渡轮对应的轮轴设于所述线切割单元，所述过渡轮的轮面为可拆卸的套设在过渡轮对应的轮轴上，在实际场景中，为降低生产成本，所述过渡轮轮面例如可设置为塑料材质的消耗性的过渡轮，在使用中过渡轮被磨损后，拆卸更换新过渡轮即可，即可省去对过渡轮换槽时安装定位、校准等操作，使得线切割装置的设备维护更为简易；当然，所述过渡轮也可为整体可拆卸的设置在线切割单元的过渡轮支架上，所述过渡轮的材质还可为橡胶及其类似材质，本申请不做限制。在此，当所述过渡轮为消耗性过渡轮，所述过渡轮可设置为单导线槽过渡轮。
当然，在另一些示例中，所述过渡轮也可设置为具有至少两个导线槽的过渡轮。在此，所述过渡轮中导线槽的数量可基于过渡轮与切割轮的位置关系与切割线的绕线方式确定。
当所述每一过渡轮具有至少两个导线槽，所述至少两个导线槽相互平行，在一示例中，将所述导线轮设置为导线槽所在平面在水平面上的投影沿第一方向，不同导线槽间具有第二方向的过渡偏移量。在一些实现方式中，所述过渡轮中相邻导线槽间的过渡偏移量与所述切割轮中相邻切割线槽间的切割偏移量相等；在此示例下，所述切割轮与导线轮在线切割单元中可设置为导线槽与切割线槽一一对应的形式(所述对应即切割线槽与导线槽共面)，所述过渡轮的导线槽数量与切割轮数量相等，也可以不等。
在此，基于选择所述过渡轮的结构形式例如导线槽数量、以及过渡轮与切割轮的位置关系、切割线的缠绕方式，所述线切割单元可设置为不同形式，例如本申请提供了将所述线切割单元应用于硅棒开方设备中的以下实施例：
在某些实施方式中，属于同一线切割单元中的多个切割轮以两两配对的方式形成至少两个切割轮组，在相邻两个切割轮组中相邻两个切割轮之间设有过渡轮，所述切割线顺次绕于所述切割轮和过渡轮上以在每一个切割轮组中的两个切割轮之间形成一个切割线锯，其中，所述切割线在绕于所述相邻两个切割轮组中相邻两个切割轮时由前一个切割轮组中在后的一个切割轮的切割线槽穿出并经由所述过渡轮的导线槽之后穿进后一个切割轮组中在前的一个切割轮的切割线槽。
请参阅图18和图19，其中图18显示为本申请的线切割装置在一实施例中应用于硅棒开方设备中的结构示意图，图19显示为所述线切割装置中线切割单元在一实施例中的结构示意图。如图所示，所述线切割装置中的线切割单元21中设置有4个切割轮组。其中，相邻的两个切割轮组之间设置有过渡轮212，在此，切割线213顺次缠绕于所述切割轮211和过渡轮212上以在每一个切割轮组的两个切割轮211上形成一个切割线锯，其中，所述切割线213在缠绕于所述相邻两个切割轮组中相邻两个切割轮211时由前一个切割轮组中在后的一个切割轮211的切割线槽穿出并经由所述过渡轮212之后穿进后一个切割轮组中在前的一个切割轮211的切割线槽。在此，每两个相邻的切割轮组中间共用同一过渡轮212进行导向，可减小用于进行张力调节和导向的切割线213长度，使得切割线213中用于形成切割线锯的切割线213长度比例增加，在化简绕线方式的同时，提高切割线213的利用率，降低生产成本。
基于每一切割轮组中切割轮211与硅棒承载结构的位置关系，任一个切割线锯可用于对应1个(如图18所示实施例)、2个、3个、4个等硅棒承载结构的硅棒进行切割，在具体实施方式中，为防止出现切割线锯过长使得切割线213中张力不均的情形，每一切割线锯对应的硅棒承载结构数量可根据实际情况选择，以稳定加工质量。
在另一些实施方式中，如图2所示，属于同一线切割单元21中的多个切割轮211包括首切割轮211、尾切割轮211、以及位于所述首切割轮211和尾切割轮211之间的至少一中间切割轮211，在所述至少一中间切割轮211的旁侧还设有过渡轮212，所述过渡轮212具有至少两个导线槽，所述切割线213顺次缠绕于所述切割轮211和过渡轮212以在任意相邻的两个切割轮211上形成一个切割线锯，其中，所述切割线213在缠绕于所述中间切割轮211时，由所述中间切割轮211上至少两个切割线槽中的一切割线槽穿出并经由旁侧的所述过渡轮212之后由所述中间切割轮211上至少两个切割线槽中的另一切割线槽穿进，从而使得任意相邻两个切割线锯之间在第二方向上具有一切割偏移量，所述切割偏移量对应于相关的两个切割线槽之间的间距。
所述过渡轮与所述至少一移位机构可直接连接，又或为间接连接。
在某些实施方式中，每一个所述过渡轮设于支架上，所述支架通过所述至少一移位机构带着所述过渡轮沿第二方向移动。
在一实施例中，线切割单元中设有用于承载过渡轮的支架，所述支架为活动设置在所述线切割单元的安装梁上，所述支架在所述至少一移位机构的驱动下沿第二方向移动，设于支架的所述过渡轮跟随支架相对于安装梁沿第二方向运动。
请参阅图24，显示为本申请的线切割装置在一实施例中的过渡轮及支架的结构示意图。如图所示，用于设置过渡轮212的所述支架2121例如可设置为三角支架或桁架结构，当然，所述支架2121也可设置为其他结构如立式承载板等，所述过渡轮212可转动的设置于支架2121，当所述至少一移位机构带动支架2121沿第二方向移动，即可带动支架2121所承载的过渡轮212跟随移动。
在某些实施方式中，所述至少一过渡轮配置有相互独立的移位机构上，每一过渡轮由对应的一移位机构驱动沿第二方向移动；或，所述至少一过渡轮的支架通过连接梁连接在一起，所述连接梁通过所述至少一移位机构带着所述至少一过渡轮沿第二方向移动。
在此，所述至少一过渡轮中的每一过渡轮例如可配置一移位机构以独立驱动对应的过渡轮在第二方向移动，所述移位机构可连接至过渡轮支架；再如，所述至少一过渡轮的支架通过连接梁连接在一起，所述连接梁的具体形式不以梁结构为限制，例如所述连接梁可为梁体、桁架结构、框架结构等，所述连接梁仅当对线切割单元中不同过渡轮的支架实现连接即可，所述至少一移位机构驱动所述连接梁沿第二方向移动，即可实现由连接梁相对固定的每一过渡轮及其对应的支座跟随连接梁在第二方向移动。
在某些实施方式中，所述移位机构用于驱动所述至少一过渡轮沿第二方向移动，同时，所述移位机构也可将所述至少一过渡轮活动设置于线切割单元中。
在一些示例中，所述移位机构包括：移位导轨，沿第二方向设置；动力源，用于驱动所述至少一过渡轮沿移位导轨移动。
请参阅图25，显示为图23中C处的放大结构示意图。结合图23及图25，如图所示，所述移位导轨2151例如可设置于所述安装梁上，并用于承载所述过渡轮212以令所述过渡轮212在动力源带动下沿导轨移动；又或用于承载过渡轮支架2121或连接各过渡轮支架2121的连接梁2122，对应的，所述动力源可驱动所述过渡轮212的支架2121或连接梁2122上。在具体实现方式中，所述过渡轮212、支架2121或连接梁2122例如可通过滑块设于所述移位导轨2151，在动力源作用下，所述移位导轨2151上承载的过渡轮212、支架2121或连接梁2122可在移位导轨2151的限位作用下发生沿第二方向的位移。
应当说明的是，在本申请提供的实施例中，当所述至少一过渡轮中的每一过渡轮配置一移位机构以独立驱动对应的过渡轮在第二方向移动，所述移位机构中移位导轨对应于一过渡轮，动力源对应驱动移位导轨上设置的过渡轮；当所述至少一过渡轮的支架通过连接梁连接在一起，所述移位导轨对应设置所述连接梁，所述移位导轨的数量可以为一根、两根、三根等，在实际场景中，可基于连接梁跨距长度与连接梁及其承载的过渡轮总重等因素综合确定设置的移位导轨数量。
在某些实施方式中，所述动力源为气缸组件，包括气缸或液压泵，以及伸缩杆；其中，所述伸缩杆连接至所述过渡轮的支架或所述连接梁。
在此，所述伸缩杆沿第二方向设置，伸缩杆一端连接至所述气缸或液压泵，另一端即自由端连接至所述过渡轮的支架或所述连接梁，所述伸缩杆的自由端在气缸或液压泵驱动下伸缩运动，即发生沿第二方向的前进或回退的运动，由此带动自由端连接的过渡轮支架或所述连接梁沿第二方向前进或回退，过渡轮支架或所述连接梁对应的过渡轮的导线槽位置由此相对切割线槽发生沿第二方向的移动，通过控制所述伸缩杆自由端的位移，即可将对应的过渡轮中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮的第一线槽移动至对应于所述切割轮的第二线槽。
在某些实施方式中，所述动力源包括：丝杆及驱动源；其中，所述丝杆连接至所述过渡轮的支架或所述连接梁。
在一实现方式中，所述丝杆设置于第二方向，丝杠一端连接所述驱动源以在驱动源驱动下沿丝杆轴转动，丝杠另一端通过螺纹连接至所述过渡轮支架或连接梁，藉由螺纹连接形式所述丝杆将驱动源驱动的转动转化为沿丝杆设置方向的线运动，所述过渡轮支架或连接梁由丝杆传动沿移位导轨移动。
在另一实现方式中，所述丝杆一端连接至所述驱动源，另一端连接所述过渡轮支架或连接梁，所述丝杆在驱动源驱动下沿第二方向移动例如丝杆连接至气缸活塞杆，又如连接至其他可产生直线运动的机构，所述丝杆在驱动源驱动下沿第二方向直线运动并带动所连接的过渡轮的支架或连接梁发生第二方向的位移。
在此，所述至少一过渡轮在所述至少一移位机构作用下可沿第二方向移动，通过控制所述至少一过渡轮的移动距离即可使得所述至少一过渡轮中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮的第一线槽移动至对应于所述切割轮的第二线槽，由此可进行对切割轮的换槽，切换槽过程中无需进行过渡轮换槽及校准，换槽过程被简化。
在实际切割作业中，在执行换槽操作后，切割线从第一线槽移动至第二线槽，则切割线 锯在第二方向的位置改变，基于加工需要，通常还要调整切割线锯的位置，以依照预设的切割量进行硅棒加工。为化简此过程，本申请还提供了以下实施例：
在某些实施方式中，所述线切割装置中还包括：至少一调距机构，设于所述至少一线切割单元上，用于驱动所述至少一线切割单元中多个切割轮沿第二方向移动，以调整所述至少一线切割单元中至少一线割线锯的切割位置、或者变换切割线绕于所述至少一线切割单元中多个切割轮的切割线槽。
所述线切割装置可基于所述至少一调距机构实现切割线在切割轮不同切割槽之间的切换，又或调整切割线锯的位置以改变相对于硅棒的切割位置(或加工规格)。
在一些实现方式中，请参阅图26，显示为图17中D处的放大示意图。如图所示，所述线切割单元21可藉由线切割支座24设于所述切割架20，所述线切割支座24设于所述切割架20并包括沿第二方向设置的导轨，所述线切割单元21设于线切割支座24的导轨上以形成沿第二方向运动的自由度；当然，所述线切割支座24的上还可设置为第二方向的导向槽、第二方向的滑杆或其他第二方向的限位结构或导向结构以用于设置所述至少一线切割单元21，本申请不做限制。所述至少一调距机构23藉由此调整所述线切割单元21在线切割支座24上的第二方向上的位置。
应当理解，线切割装置可基于线切割单元21沿切割架20的升降运动实现对硅棒的切割加工，而控制切割规格则通过调整切割线锯与硅棒之间在第二方向的相对位置实现。结合参考图17和图26，当所述硅棒置放于硅棒承载结构上时位置固定，通过所述调距机构23使切割线锯沿第二方向移动，即可调整所述至少一线切割单元21中至少一线割线锯的切割位置，可用以实现对硅棒的切割量控制。又或，通过调整所述线切割单元21承载的切割轮沿第二方向的位置，即可对切割线进行换槽且控制换槽前后切割线锯在第二方向的位置不变。
在某些实施例中，所述线切割装置包括单线切割单元，所述调距机构包括：丝杆，沿第二方向设置且与所述单线切割单元螺纹连接；驱动源，用于驱动所述丝杆转动。
在此，所述单线切割单元即为一个线切割单元，线切割装置中的单线切割单元中包括沿第一方向设置的多个切割轮，切割线缠绕于多个切割轮由此形成至少一切割线锯，且所述至少一切割线锯沿同一直线方向。所述调距机构的丝杆具有远端及近端，在具体实现方式中，例如可将丝杆近端连接至驱动源并在驱动源驱动下转动，丝杆远端以螺纹连接至所述单线切割单元，藉由丝杆两端的连接方式，所述丝杆可基于驱动源传动发生转动并借助螺纹连接将丝杆转动转化为轴线位移，所述轴向位移方向为丝杆的设置方向即第二方向；通过调距机构 中驱动源驱动丝杠转动即可实现单线切割单元在第二方向位移，所述丝杠被驱动转动的旋向不同，即可实现单线切割单元在第二方向位移的前进或后退。
在另一实施例中，所述线切割装置包括单线切割单元；所述调距机构包括：伸缩件，沿第二方向设置且与所述单线切割单元关联；驱动源，用于驱动所述伸缩件沿第二方向作伸缩运动。在此，所述伸缩件可设置为杆体结构且杆体延伸方向即为第二方向，所述伸缩件在驱动源驱动下可沿其延伸方向伸缩运动，伸缩件一端可连接至所述驱动源，可伸缩的自由端关联所述单线切割单元，即可在驱动源作用下带动所述单线切割在第二方向移动。所述伸缩件例如为电动伸缩杆，又如为连接至气缸锥杆的连接杆，所述气缸即可作为驱动源，本申请不做限制。所述伸缩杆关联至所述单线切割单元的方式可为直线连接或间接连接，例如可直接连接至单线切割单元安装梁，又或通过支座或轴承间接连接至所述单线切割单元。应当理解，所述伸缩件伸张或收缩即可对应于单线切割单元沿第二方向的前进或回退。
在此，在本申请提供的实施例中，所述关联例如可通过卡合、螺锁、粘接、及焊接中的一种或多种实现，例如在上述实施例中，所述伸缩杆可通过卡合、螺锁、粘接、及焊接中的一种或多种方式关联所述线切割单元；当然，所述关联的实现方式并不以此为限，而旨在于实现在第二方向的传动。
在又一实施例中，所述线切割装置包括单线切割单元；所述调距机构包括：齿条，沿第二方向设置于所述单线切割单元；传动齿轮，与所述齿条啮合；驱动源，用于驱动所述传动齿轮转动。所述传动齿轮在驱动源驱动下转动，啮合于所述传动齿轮的齿条相应的沿齿条步骤方向移动，在此示例中，藉由所述齿条与传动齿轮配合，即可将驱动源驱动的转动运动转化为沿齿条方向的线运送，所述齿条沿第二方向设于所述单线切割单元，即可带动所述单线切割单元沿第二方向移动。同时，由所述驱动源控制切换所述传动齿轮的旋向，即可使得所述单线切割单元在切换沿第二方向前进或回退的位移方向。
在前述各实施例中，所述调距机构可设置为一个或多个，例如，当所述单线切割单元在第一方向的跨距较大，当通过设置一调距机构难以带动所述单线切割单元中多个切割轮沿第二方向移动时，可设置多个调距机构进行驱动，例如在单线切割单元沿第一方向的两端分别设置调距结构或沿第一方向等间距设置多个调距机构，在此，单线切割单元上对应的多个调距机构之间可协同作用，以确保所述多个调距机构以相同的位移量(大小和方向)驱动单线切割单元的多个线切割轮的在第二方向移动。
在某些实施例中，所述线切割装置包括沿第二方向相对设置的第一线切割单元和第二线 切割单元，所述第一线切割单元和第二线切割单元中的至少一者通过所述至少一调距机构驱动沿第二方向移动，用于调整所述第一线切割单元中至少一切割线锯与所述第二线切割单元中至少一切割线锯之间的线割线锯间距、或者变换切割线绕于所述第一线切割单元中多个切割轮的切割线槽和/或所述第二线切割单元中多个切割轮的切割线槽。
在某些实施方式中，所述线切割装置包括两个线切割单元如第一线切割单元和第二线切割单元，例如图23所示实施例，所述第一线切割单元和第二线切割单元相互平行的沿第一方向设置，第一线切割单元与第二线切割单元中的切割线锯也相平行。在实际场景中，所述线切割装置例如可用于硅棒开方设备中，硅棒开方设备中每一硅棒承载结构上的硅棒在切割区内对应于第一切割单元与第二切割单元的切割线锯，则一次升降切割可在硅棒表面加工形成两个相平行的切面。在此，通过调整所述第一线切割单元与第二线切割单元在第二方向间距，即可控制对硅棒的切割量。
所述至少一调距机构即可设置为连接至所述第一线切割单元或第二线切割单元，又或同时关联所述第一线切割单元和第二线切割单元，以驱动所连接或关联的第一线切割单元或/及第二线切割单元中多个切割轮沿第二方向移动，并实现调整所连接或关联的第一线切割单元或/及第二线切割单元中至少一线割线锯的切割位置、或者变换所连接或关联的第一线切割单元或/及第二线切割单元中多个切割轮的切割线槽。
在一实施例中，所述调距机构包括：丝杆，沿第二方向设置且与所述第一线切割单元或所述第二线切割单元螺纹连接；以及驱动源，用于驱动所述丝杆转动。所述丝杆与驱动源驱动第一线切割单元或所述第二线切割单元中多个切割轮在第二方向移动的方式与前述实施例类似，被调距机构驱动的所述第一切割单元或所述第二线切割单元可看作单线切割单元，此处不做赘述。应当理解，在任一线切割单元上设置所述调距机构，即可实现第一线切割单元与第二线切割单元间形成的相平行的切割线锯间距增加及减小，所述线切割装置即可将硅棒切割为不同规格。
在另一实施例中，所述调距机构包括：伸缩件，沿第二方向设置且与所述第一线切割单元或所述第二线切割单元关联；驱动源，用于驱动所述伸缩件沿第二方向作伸缩运动。在此，设置有所述调距机构的所述第一切割单元或所述第二线切割单元即可看作单线切割单元，具体实现方式可参照前述实施例，此处不再赘述。
在又一实施例中，所述调距机构包括：齿条，沿第二方向且与所述第一线切割单元或所述第二线切割单元关联；传动齿轮，与所述齿条啮合；驱动源，用于驱动所述传动齿轮转动。 通过相啮合的传动齿轮与齿条，所述驱动源可控制所述齿条沿齿条方向线运动，关联于所述齿条的第一线切割单元或第二线切割单元可藉由所述齿条带动以沿第二方向移动。
在一实施例中，所述调距机构包括：双向丝杆，沿第二方向设置且与所述第一线切割单元和所述第二线切割单元螺纹连接；以及驱动源，用于驱动所述丝杆转动以使得所述第一线切割单元和所述第二线切割单元沿第二方向相向移动或相背移动。在一种实施方式中，所述双向丝杆为双螺纹丝杆，所述双向丝杆两端分别设有螺纹且螺纹方向相反，所述驱动源可设置在双向丝杆的任一一端以带动双向丝杆沿丝杆轴转动，藉由双向丝杆两端方向相反的螺纹，所述双向丝杆在驱动源驱动下转动时双向丝杆两端的运动被转化为方向相反的轴向线运动，所述轴向即设置双向丝杆的第二方向。在所述驱动源驱动下，所述第一线切割单元与第二线切割单元即可相向运动或相背运动。
在一实施例中，所述调距机构包括：第一齿条，沿第二方向且与所述第一线切割单元关联；第二齿条，沿第二方向且与所述第二线切割单元关联；传动齿轮，与所述第一齿条和第二齿条啮合；驱动源，用于驱动所述传动齿轮转动以使得所述第一线切割单元和所述第二线切割单元沿第二方向相向移动或相背移动。
在实施方式中，所述第一齿条联动于所述第一线切割单元，所述第二齿条联动于所述第二线切割单元，所述传动齿轮连接于驱动源例如伺服电机的动力输出轴(未予以图示)，并与所述第一齿条及所述第二齿条相啮合，用于在正向转动时带动所述第一线切割单元及第二线切割单元相向运动以执行闭合动作，在逆向转动时带动所述第一线切割单元及第二线切割单元背向运动。所述第一齿条与第二齿条可啮合于所述传动齿轮的两侧，使得传动齿轮旋转时第一齿条和第二齿条处的线速度方向相反，由驱动电机带动所述传动齿轮旋转，令传动齿轮正转时第一齿条与第二齿条相向运动即带动第一线切割单元与第二线切割单元相向运动，传动齿轮被带动逆向转动时第一齿条与第二齿条背向运动以带动第一线切割单元和第二线切割单元背向运动。在此，所述传动齿轮可以轴连接至驱动源的动力输出轴，也可间接连接至所述动力输出轴例如轴连接至连接动力输出轴的转动部。
在实际场景中，所述线切割装置中可设置一个或多个调距机构，每一调距机构与所述第一线切割单元和第二线切割单元连接，所述调距机构的数量可基于驱动的动力需要、传动机构如丝杆的受力状态、驱动线切割单元中多个切割轮移动的平稳度、以及线切割装置的设备空间等因素综合确定，例如，当所述第一线切割单元和第二线切割单元在第一方向的跨距较小，仅采用一个调距机构即可实现对切割单元中切割线锯的切割位置调整或切割线换槽，则 可在线切割装置中设置一调距机构以驱动所述第一线切割单元和所述第二线切割单元沿第二方向相向移动或相背移动；又如，当所述第一线切割单元和第二线切割单元在第一方向的跨距较长，线切割单元需要较大的动力驱动且需满足该动力在丝杆或齿条等传动连接部件的受力强度范围内，所述线切割装置中可设置多个调距机构，所述多个调距机构间协同作用以确保所述多个调距机构以相同的位移量(大小和方向)驱动第一线切割单元和第二线切割单元的多个线切割轮的在第二方向相向移动或相背移动。
在某些实施方式中，所述调距机构为设于所述至少一线切割单元的伺服电机。在实际场景中，在所述线切割装置的至少一线切割单元上或每一线切割单元上设置伺服电机，由所述伺服电机控制对应的线切割单元在第二方向的位移。所述线切割单元可预先确定的换槽的切割偏移量或切割线变换切割位置的调整量，藉由伺服电机精确定位的功能带动所述线切割单元中多个切割轮以预设位移量沿第二方向运动。例如，所述线切割装置中设有单线切割单元，所述单线切割单元上设有伺服电机以带动所述单线切割单元沿第二方向移动；又如，所述线切割装置中设有第一线切割单元和第二线切割单元，所述第一线切割单元或/和第二线切割单元在其对应的伺服电机带动下相对独立的沿第二方向移动。在某些示例中，所述伺服电机也可更换为行进电机与行进丝杠，所述线切割单元可藉由行进电机驱动在线切割支座上沿第二方向运动。
在某些实施方式中，所述至少一调距机构于驱动所述下线切割单元沿第二方向运动，所述至少一过渡轮与多个切割轮共同跟随安装梁发生沿第二方向的移动，在此状态下，所述至少一过渡轮与多个切割轮为相对静止，即，过渡轮与切割轮之间的位置关系不变。当所述调距机构用于调整所述至少一线切割单元中至少一线割线锯的切割位置，所述切割线锯相对于切割轮、过渡轮的位置关系不变，即仅发生沿第二方向的移动，即可实现切割位置调整。
请参阅图27、图28及图29，图27显示为本申请的线切割装置在一实施例中的俯视图，图28显示为本申请的线切割装置在一实施例中的侧视图，图29显示为图28中E处的放大结构示意图。
请结合参考图27及图28，在某些实施方式中，当所述至少一调距机构驱动所述线切割单元21沿第二方向运动，所述至少一过渡轮212与多个切割轮211共同跟随安装梁214发生沿第二方向的移动(呈如图27所示箭头方向)，同时，所述至少一移位机构215驱动所述至少一过渡轮212或用于连接过渡轮支架2121的连接梁2122顺应移位导轨沿第二方向移动(呈如图28中支架2121上方所示的箭头方向)，即使所述至少一过渡轮212相对所述安装梁214沿第二方向移动，以使所述至少一过渡轮212中经切割缠绕的当前导线槽在第二方向上 从对应于所述切割轮211的第一线槽移动至对应于所述切割轮211的第二线槽，结合参考图29，当所述过渡轮212相对切割轮211沿第二方向移动，过渡轮212的导线槽即可切换对应至不同的切割线槽。在此状态下，控制所述调距机构驱动线切割单元21沿第二方向移动的距离与所述至少一移位机构215驱动所述至少一过渡轮212沿第二方向移动的距离相等且方向相反，即可用于实现对切割线213相对于切割轮211的换槽，且换槽前后切割线213的空间位置不变，即在换槽后可依照换槽前预设的对硅棒的切割规格继续进行硅棒切割，在此示例下换槽过程中可省去对过渡轮212的换槽调整、以及对切割线213和切割轮211的位置校准操作。
在实际场景中，可预先确定的换槽前后切割线所分别对应的切割线槽，例如，换槽前切割线所在位置为切割线槽a1，换槽后切割线绕于切割线槽a2，基于切割线槽a1与切割线槽a2之间的切割偏移量确定所述至少一调距机构驱动线切割单元中的多个切割轮在第二方向移动的位移量，即将所述位移量设置为切割线槽a1与切割线槽a2之间的切割偏移量，即可用于实现切割线用切割线槽a1至切割线槽a2的更换；应当说明的是，所述至少一调距机构驱动线切割单元中多个切割轮在第二方向移动的方向为切割线槽a2指向切割线槽a1的方向；同时，所述移位机构驱动所述至少一过渡轮相对线切割单元沿第二方向移动，移动距离即为切割线槽a1与切割线槽a2之间的切割偏移量，且所述至少一过渡轮相对线切割单元的位移方向为切割线槽a1指向切割线槽a2的方向，在移动前后，所述至少一过渡轮在空间中(例如以机座为参照)的第二方向的位置不变；在此，换槽后所述切割线锯在空间中的切割位置不变，则省去了进一步校准切割轮或其他部件位置的步骤即可按照预设的切割量对硅棒进行切割，使得换槽过程被简化。
在此，本申请提供的硅棒加工设备的线切割装置，其线切割单元中包括至少一移位机构用于驱动所述至少一过渡轮沿第二方向移动，以使所述至少一过渡轮中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮的第一线槽移动至对应于所述切割轮的第二线槽。本申请提供的线切割装置在可藉由所述至少一移位机构在换槽过程中无需调整切割线绕于导线槽的槽位，换槽后可省去对过渡轮的调整、校准等操作；同时，所述过渡轮可采用单槽过渡轮即可实现换槽，在实际场景中，还可将过渡轮设置为可更换式的消耗性过渡轮，当过渡轮的导线槽磨损后直接更换过渡轮即可，使得对切割造成的设备磨损的设备维护过程化简。
本申请在另一方面还提供了一种硅棒加工设备，包括机座、硅棒承载结构、以及如23至图29所示实施例中任一实现方式所述的线切割装置。其中，所述机座具有硅棒加工平台，所述硅棒承载装置设于所述硅棒加工平台上，用于承载待切割硅棒。
在某些实施方式中，所述硅棒加工设备为硅棒开方设备，所述硅棒承载装置为硅棒承载结构。
在此，所述硅棒加工平台上可以设有一个或多个硅棒承载结构，每一硅棒承载结构可用于承载单根硅棒，对应的，所述硅棒加工平台上切割区内的硅棒承载结构数量可对应于所述线切割装置的线切割单元中切割线锯的数量，例如图17或图18所示实施例，所述硅棒加工平台的切割区内设有多个硅棒承载结构11，所述线切割装置中的一线切割单元21中包括多段切割线锯以分别对应多个硅棒承载结构11。
以图17所示实施例中所述硅棒加工设备为硅棒开方设备为例进行说明，在某些实施方式中，所述硅棒加工平台通过工作台转换机构设于所述机座10，在此，所述工作台转换机构例如可为转动机构或平移机构。
所述转动机构例如可包括转动轴和转动驱动单元，所述转动轴轴接于所述硅棒加工平台，所述转动驱动单元驱动所述转动轴转动以带动所述硅棒加工平台转动。
所述平移机构例如可包括平移导轨、滑块和平移驱动单元。所述平移导轨铺设于机座上，所述滑块设于所述硅棒加工平台的底部并与所述平移导轨相适配以为硅棒加工平台提供平移导向，所述平移驱动单元用于驱动所述硅棒加工平台沿着所述平移导轨移动以使得硅棒承载结构在切割区和装卸区切换；在其他实施例中，所述平移机构也可采用齿轮传动的方式，具体地，所述平移机构包括平移齿轨和藉由电机驱动的与平移齿轨相适配的转动齿轮，所述平移齿轨设置于所述硅棒加工平台的底部，可例如为具有一定长度的至少一个齿条，为了使得硅棒加工平台平稳的移动，各齿条适配有至少两个间隔设置的转动齿轮，电机驱动转动齿轮转动，以带动位于硅棒加工平台上的硅棒承载结构在切割区和装卸区切换。
所述硅棒开方设备可以为例如图17或图18所示实施例的硅棒开方设备，当然，也可为其他类型的硅棒开方设备，例如，所述硅棒开方设备中线切割装置中可设置为单线切割单元；又如，所述硅棒开方设备的线切割装置中线切割单元中的切割线锯为一段，当然，切割线锯也可为两段、三段、四段等，本申请不做限制，对应的，所述硅棒加工平台上的硅棒承载结构的数量可相应变换；再如，所述硅棒开方设备的线切割装置中线切割单元中的每一切割线锯对应的硅棒承载结构数量可以为一个、两个、三个等。
所述硅棒开方设备中设有如图23至图29所示实施例中任一项所述的线切割装置，在此，所述硅棒开方设备中切割轮在执行开方作业使得切割线槽磨损后，可藉由所述移位机构在换槽过程中省去对过渡轮换槽及过渡轮的校准，使得换槽过程更为简易；在图23至图29所提 供的一些实施例中，所述硅棒开方设备的线切割装置中还可设置有至少一调距机构，基于所述至少一调距机构可调整切割线锯的切割位置以确定对硅棒的切割量，又或所述硅棒开方设备的切割轮在长期切割作业中线槽磨损后，可基于所述至少一调距机构变换切割线的线槽位置，以确保所述硅棒开方设备继续开方作业的加工精度，同时，所述至少一调距机构与所述至少一移位机构协同配合的情形下，所述硅棒开方设备变换切割线槽时无需调整过渡轮中用于缠绕切割线的导向槽，同时换槽后的切割线锯在第二方向位置可保持与换槽前一致即可省去切割线位置校准操作，使得换槽过程被化简。
在某些实施方式中，当所述硅棒加工设备为硅棒截断机，所述硅棒截断机中包括机座、硅棒承载装置、以及线切割装置。
其中，所述机座具有硅棒加工平台，所述硅棒承载装置设于所述硅棒加工平台上。在此，所述硅棒承载装置例如可用于卧式承载待切割硅棒，所述线切割装置包括：切割架，设于所述机座；至少一线切割单元，活动设于所述切割架；所述线切割单元包括：沿第一方向依序设置的多个切割轮，每一个切割轮上具有至少两个切割线槽；至少一过渡轮，每一个所述过渡轮具有导线槽；切割线，顺次绕于所述多个切割轮和过渡轮以形成至少一切割线锯；至少一移位机构，用于驱动所述至少一过渡轮沿第二方向移动，以使所述至少一过渡轮中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮的第一线槽移动至对应于所述切割轮的第二线槽。所述线切割单元相对于切割架升降运动即可实现对待切割硅棒的进给切割。
在某些示例中，所述硅棒截断机的线切割装置中设有多个相平行的线切割单元，所述多个相平行的线切割单元沿切割架升降运动，即可在一次切割中将待切割硅棒截取为多个硅棒截段。基于所述线切割装置的至少一移位机构可调整线切割单元中的至少一切割线锯在切割轮中的切割线槽，即可使得截断作业中被磨损的切割轮在更换切割线槽后继续使用，同时，换槽过程无需调整切割线在过渡轮上的导线槽位置即可实现。
在一实施方式中，所述硅棒截断机的线切割装置的设置方式以及硅棒承载装置的形式可参照中国专利CN105196433B公开的布置方式，当然，所述硅棒截断机的线切割装置中包括所述至少一移位机构，用于驱动所述至少一过渡轮沿第二方向移动，以使所述至少一过渡轮中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮的第一线槽移动至对应于所述切割轮的第二线槽。
在某些示例中，所述硅棒截断机例如为双根硅棒截断设备，在此，所述硅棒截断机的硅棒承载装置中设有第一加工工位与第二加工工位，以分别对应承载第一待切割硅棒与第二待 切割硅棒。请参阅图21，显示为所述硅棒截断机的线切割装置在一实施例中的结构示意图。在此示例中，所述线切割支座24设于切割架20上，线切割支座24沿第一方向的两侧分别设置有至少一线切割单元21，位于所述线切割支座24两侧的至少一线切割单元21即可分别对第一加工工位、第二加工工位处的待切割硅棒进行切割。在此，所述线切割支座24的线切割单元21中包括切割轮211、过渡轮212、绕于所述切割轮211的切割线213、以及至少一移位机构；其中，所述切割轮211上具有至少两个切割线槽，所述至少一移位机构用于驱动所述至少一过渡轮212沿第二方向移动，以使所述至少一过渡轮212中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮211的第一线槽移动至对应于所述切割轮211的第二线槽。基于所述至少一移位机构，所述硅棒截断机的线切割单元中过渡轮212与切割轮211间在第二方向的相对位置可调节，在至少一移位机构驱动下过渡轮的导线槽可对齐至切割轮中的不同切割线槽。在实际场景中，对所述切割轮211进行切割线换槽时无需改变切割线213绕于所述过渡轮212中的导线槽，即可使得换槽前后用于缠绕切割线213的导线槽与切割线槽在第二方向上对齐。
在此，所述至少一移位机构的形式还可参照如图23至图29所示实施例中任一项所述的移位机构。
在某些实施方式中，所述线切割支座24两侧的线切割单元21还可组成至少一对线切割单元21，例如，将线切割支座24两侧的线切割单元21一一对应的连接形成至少一对线切割单元21，所述一对线切割单元21位于第一方向的同一直线上，在此示例下，基于同一移位机构可驱动一对线切割单元21上的过渡轮212沿第二方向移动，例如当一对线切割单元21的过渡轮212的支架通过连接梁连接在一起；当然，所述一对线切割单元21也可由多个移位机构协同驱动，又或每一过渡轮212由相互独立的移位机构驱动。
在此，所述移位机构的具体形式可参照如图23至图29所示实施例中提供的实施方式，在此不再赘述。在某些示例中，所述线切割单元中还可设置如图23至图29所示实施例提供的实施方式中所述的调距机构；在此，所述调距机构与移位机构之间协同配合以执行对切割线锯的位置调整或变换切割线绕于切割轮中的切割线槽的实现方式可参照如图23至图29所示实施例中提供的实现方式。
当然，所述硅棒截断机的具体形式不以前述实施例为限制，例如，基于硅棒承载装置上硅棒的摆放位置与切割线锯的位置关系，所述硅棒截断机中每一切割线锯可同时对多根硅棒进行截断切割；又如所述硅棒截断机的线切割装置中仅包括一段切割线锯，所述一段切割线锯用于对单根或多根硅棒进行截断时一次截断作业中被切割的硅棒被分割出一硅棒截段；本 申请不做限制，应当说明的是，所述硅棒截断机的线切割装置包括如图23至图29所示实施例中任一实施方式所述的移位机构，以对线切割装置中的过渡轮相对切割轮在第二方向的位置进行调整。
在某些实施方式中，所述硅棒加工设备为硅棒切磨一体机。在此，所述硅棒切磨一体机包括机座、硅棒承载装置、线切割装置、以及研磨装置。
所述机座具有硅棒加工平台，在所述硅棒切磨一体机中，所述硅棒加工平台可设置为执行不同加工功能的加工区位，例如由切割工位与研磨工位组成；所述硅棒承载装置用于承载待加工硅棒；所述线切割装置包括：切割架，设于所述机座；至少一线切割单元，活动设于所述切割架；所述线切割单元包括：沿第一方向依序设置的多个切割轮，每一个切割轮上具有至少两个切割线槽；至少一过渡轮，每一个所述过渡轮具有导线槽；切割线，顺次绕于所述多个切割轮和过渡轮以形成至少一切割线锯；至少一移位机构，用于驱动所述至少一过渡轮沿第二方向移动，以使所述至少一过渡轮中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮的第一线槽移动至对应于所述切割轮的第二线槽。
请参阅图22，显示为本申请的硅棒切磨一体机在一实施例中的结构示意图。在此示例中，如图22所示，所述硅棒切磨一体机包括机座，具有硅棒加工平台；线切割装置，设于所述机座上，用于对所述硅棒加工平台的第一加工区位上的硅棒进行第一方向侧面切割以及对所述硅棒加工平台的第二加工区位上的硅棒进行第二方向侧面切割，形成方形的硅棒；研磨装置，设于所述机座上，用于对所述硅棒加工平台的第三加工区位上的所述方形的硅棒进行磨面及倒角；硅棒转换装置，设于所述硅棒加工平台上，用于将所述硅棒在第一加工区位、第二加工区位以及第三加工区位上进行转换。
在此，所述线切割装置包括：切割架20、线切割支座24、第一切割单元组、以及第二切割单元组，所述第一切割单元组、第二切割单元组用以分别对第一加工区位、第二加工区位上的硅棒进行切割。
在本实施例中，由于线切割支座24可供配置第一切割单元和第二切割单元，即，第一切割单元和第二切割单元共用线切割支座24。因此，在本实施例中，一方面，线切割装置中的切割架20和线切割支座24设于第一加工区位和第二加工区位之间的居中位置。另一方面，线切割支座24作了特别的设计。如图22所示，本实施例中的线切割支座24可包括支座主体和位于支座主体相对两旁侧的第一支座侧翼和第二支座侧翼。在某些实施方式中，线切割支座24中的支座主体以与X轴或Y轴呈45°设置，第一支座侧翼与支座主体之间呈145°夹角 并以沿Y轴设置，第二支座侧翼与支座主体之间呈145°夹角并以沿X轴设置。
在某些实施例中，第一切割单元组可至少包括四个第一切割轮211a与两个第一过渡轮，这四个第一切割轮211a可组合成一对第一切割轮组，即，由沿着X轴相对设置两个第一切割轮211a形成一个第一切割轮组，由沿着Y轴的两个第一切割轮组就组成一对第一切割轮组。切割线213依序绕设于第一切割单元组中的各个第一切割轮211a后形成切割线网。于实际的应用中，切割线213依序绕设于第一切割单元组中的四个第一切割轮211a后形成两条切割线锯，这两条切割线锯即沿X轴方向设置并相互平行，构成切割线网。具体地，两条相互平行的切割线锯配合形成沿X轴方向呈“＝”字型的第一切割线网；同时所述切割线213在绕于所述第一切割轮组时，绕于所述第一过渡轮以进行切割线213换向或张力调整，在此，所述第一过渡轮与对应的第一切割轮组的切割轮211轮面平行，即，均平行于第一方向。由沿着X轴相对设置两个第一切割轮211a、绕于其中的切割线213以及一个第一过渡轮，即可形成一线切割单元，在此实施例中，所述第一切割单元组中形成两个相互平行的线切割单元21。
类似的，所述第二切割单元组可至少包括四个第二切割轮211b及两个第二过渡轮，由沿着Y轴相对设置两个第二切割轮211b成一个第二切割轮组，由沿着X轴的两个第二切割轮组就组成一对第二切割轮组；于实际的应用中，切割线213依序绕设于第二切割单元组中的四个第二切割轮211b后形成两条切割线锯，这两条切割线锯即沿Y轴方向设置并相互平行，两条相互平行的切割线锯配合形成沿Y轴方向呈“＝”字型的第二切割线网；同时所述切割线213在绕于所述第二切割轮组时，绕于所述第二过渡轮以进行切割线213换向或张力调整，在此，所述第二过渡轮与对应的第二切割轮组的切割轮211轮面平行，即，均平行于第一方向。由沿着Y轴相对设置两个第一切割轮211a、绕于其中的切割线213以及一个第二过渡轮，即可形成一线切割单元，在此实施例中，所述第二切割单元组中形成两个相互平行的线切割单元21。
应当说明的是，所述第一方向与第二方向基于线切割单元的载体坐标系定义，因此，当硅棒加工设备(在此示例中为硅棒切磨一体机)中多个线切割单元的方向不同，多个线切割所分别对应的第一方向在外部空间不是同一方向；对应的，所述第二方向正交于第一方向，因此，由所述至少一移位机构执行的驱动至少一过渡轮的移动方向为相对于所驱动的线切割单元的正交方向。例如，在所述第一切割单元组中，线切割单元与切割线锯沿X轴方向设置，第一切割单元组中所述第一方向为X轴方向，第二方向为Y轴方向；在所述第二切割单元组中，线切割单元与切割线锯沿Y轴方向设置，第二切割单元组中所述第一方向为Y轴方向， 第二方向为X轴方向。
当然，在第一切割单元组及第二切割单元组中，任一所述线切割单元中切割轮与过渡轮数量可作相应变换，例如，一个线切割单元中切割轮数量还可为三个、四个等，过渡轮数量也可为两个及以上。
在某些示例中，所述硅棒转换装置设于所述硅棒加工平台的居中区域，用于将硅棒在所述硅棒加工平台上的等待区位、第一加工区位、第二加工区位、以及第三加工区位之间转换。在一实施方式中，硅棒转换装置旋转设置于所述硅棒加工平台上，硅棒转换装置可进一步包括：输送本体，呈圆盘状、方盘状或其他类似状；设于输送本体上的硅棒定位机构(即硅棒承载装置)，用于对硅棒进行定位；转换驱动机构，用于驱动输送本体转动以带动硅棒定位机构所定位的硅棒转换位置。在某些示例中，所述硅棒定位机构还包括一转动结构，用于带动承载于硅棒定位机构上的硅棒沿硅棒轴心转动以调整硅棒的切割面。
在此，待切割硅棒被置放定位于硅棒定位机构上后，待切割硅棒在第一加工区位处由线切割装置中的沿X轴方向呈“＝”字型的第一切割线网进行切割形成沿X轴方向的两个轴切面；而后，所述转换驱动机构驱动输送本体带动硅棒定位机构将硅棒定位至第二加工区位，由线切割装置中的沿Y轴方向呈“＝”字型的第二切割线网进行切割形成沿Y轴方向的两个轴切面，即形成截面为类矩形的已切割硅棒；所述已切割硅棒还可转换至第三加工区位进行后续的研磨作业。
在所述硅棒切磨一体机的前述各示例中，所述线切割单元中的每一切割轮具有至少两个切割线槽，在此，所述线切割装置的任一线切割单元中还包括至少一移位机构，用于驱动所述至少一过渡轮沿第二方向移动，以使所述至少一过渡轮中经切割缠绕的当前导线槽在第二方向上从对应于所述切割轮的第一线槽移动至对应于所述切割轮的第二线槽。在此设置下，所述过渡轮可为单导线槽过渡轮，也可为多导线槽过渡轮，基于所述至少一移位机构的驱动作用，切割线绕于所述过渡轮的导线槽位置无需改变，即可实现切割线在切割轮上的换槽。当所述第一切割单元组或第二切割单元组的线切割单元中的切割轮执行开方作业而使得切割线槽被磨损后，通过所述移位机构更换切割线绕于所述切割轮的切割线槽位置即可令切割轮复用，通过所述至少一移位机构，在换槽过程中无需调整切割线与过渡轮的相对位置。在此，所述移位机构的设置方式可参照如图23至图29所示实施例的任一实现方式中所述的移位机构。
在所述硅棒研磨一体机中，第一加工区位及第二加工区位处包括两个相平行的线切割单元，在某些示例中，第一加工区位及第二加工区位处还包括至少一调距机构，所述调距机构 例如可关联至两个线切割单元的第一线切割单元或第二线切割单元，又或同时关联至第一线切割单元与第二线切割单元，所述调距机构例如可设置为如图23至图29所示实施例的任一实现方式中所述的调距机构，例如藉由丝杆与第一线切割单元或第二线切割单元连接、又如藉由双向丝杆与第一线切割单元及第二线切割单元连接、或如所述调距机构为伺服电机等，此处不再赘述。
当所述至少一调距机构驱动第一线切割单元或/及第二线切割单元中的多个切割轮沿第二方向移动，所述第一线切割单元或/及第二线切割单元例如可为沿第一支座侧翼移动即沿第一切割单元组中的第二方向(Y轴方向)移动；可用以调整所述第一线切割单元或/及第二线切割单元中至少一线割线锯的切割位置、或者变换切割线绕于所述第一线切割单元或/及第二线切割单元中多个切割轮的切割线槽；所述至少一调距机构与线切割单元中的至少一移位机构配合，在无需改变过渡轮中用于缠绕切割线的导线槽的状态下即可实现换槽，同时换槽前后切割线锯在第二方向的位置不变。
所述第二切割单元组与第一切割单元组的结构形式类似，主要区别在于在硅棒切磨一体机中布置位置与方向不同；但在第二切割单元组处的所述至少一位移机构以及所述至少一调距机构的结构与功能与第一切割单元组中至少一位移机构及所述至少一调距机构类似，此处不再赘述。
应当理解，在某些实施方式中，所述第一加工区位与第二加工区位的位置关系可作变换，例如将第一加工区位与第二加工区位设置为硅棒转换装置载着硅棒转动60°即可实现在两个加工区位间切换，对应的所述第一切割单元组与第二切割单元组中线切割单元的方向也可能改变，在此示例下，所述第一切割单元组与第二切割单元组的线切割单元分别对应的第一方向改变，但在任一切割单元组中线切割单元仍可藉由如图23至图29所示实施例中任一实施方式所述的至少一移位机构实现过渡轮相对切割轮在第二方向的位置调整；在某些实施方式中，所述硅棒切磨一体机中不同加工工位处例如只包括单线切割单元；在某些实施方式中，所述硅棒切磨一体机例如仅设置有一个用于进行切割加工的工位，在一种具体实现方式上，所述切割加工的工位中可设置“＝”字型切割线网，在经由切割线网一次升降切割硅棒后由所述硅棒定位机构驱动硅棒转动90°再次进行切割；所述硅棒切磨一体机具有多种变形形式，本申请不做限制。
在硅棒开方作业中，硅棒经开方切割后会形成边皮，因此，需先将形成的边皮予以卸载，现有的边皮卸载方式大多还是由操作人员手工操作将边皮脱离于已切割硅棒并将其搬离出硅棒开方设备，不仅效率低下，且在搬运过程中会使得边皮与已切割硅棒发生碰撞而增加已切 割硅棒损伤的风险。因此，有必要提出一种硅棒开方设备及应用于硅棒开方设备的边皮卸料装置，使得能够及时的将边皮卸离，提高作业效率。
再者，在边皮卸料装置中基于将边皮从切割区转运至边皮卸载区的需要会占据一定的设备空间，通过确定边皮卸料装置的结构和转运路径，边皮卸料装置的设备布局的简易程度、转运效率等也不同，在此，本申请提供了一种边皮卸料装置，所述边皮卸料装置中设置有用于转运边皮的边皮夹持机构，所述边皮夹持机构可通过摆臂转动的方式转运边皮，也可在未转运状态下通过摆臂转动收纳边皮夹持机构，使得边皮卸料装置占据设备空间减小，同时转运路径化简，转运效率提高。
在申请提供的各实施例中，提供了一种应用于硅棒开方设备的边皮卸料装置，所述硅棒开方设备包括机座、线切割装置和硅棒承载结构，所述硅棒承载结构用于承载立式置放的硅棒，所述线切割装置包括可升降的线切割支座和设于所述线切割支座上的线切割单元，所述线切割单元中具有切割线锯，所述切割线锯切割硅棒形成已切割硅棒和边皮；所述边皮卸料装置包括：边皮提升单元，用于提升所述边皮以使得所述边皮顶端凸出所述已切割硅棒；用于进行边皮夹持及转运的边皮夹持单元，所述边皮夹持单元包括：支撑柱，设于所述机座上；第一安装部，设于所述支撑柱上；至少一组边皮夹持机构，通过摆臂连接至所述第一安装部，用于夹持所述边皮并提升所述边皮脱离已切割硅棒，以及受控绕摆臂转轴转动以将所述边皮转运至边皮卸载区。
请参阅图30及图31，其中，图30显示为本申请的边皮卸料装置在一实施例中应用于硅棒开方设备中的结构示意图，图31显示为本申请的边皮卸料装置在一实施例中的结构示意图。如图所示，所述硅棒开方设备中具有硅棒承载结构11，可用于承载立式置放的硅棒，当线切割装置中切割线锯切割硅棒后，所形成的边皮依靠于自身重力作用与硅棒承载结构11的限位作用继续停留在硅棒承载结构11上并紧靠已切割硅棒，因此需要令切割后形成的边皮与已切割硅棒发生相对位移，通过位移交错形成的凸出部分夹持边皮，后续进行边皮转运，本申请所述的边皮提升单元即用于提升所述边皮以使得所述边皮顶端凸出所述已切割硅棒。
在一些示例中，设有所述边皮卸料装置的硅棒开方设备中的硅棒承载结构的承托面为一平面结构，则被切割后形成的边皮可能因没有相应的支撑而存在发生掉落或倾覆等风险；在某些实施例中，所述边皮卸料装置中还包括边皮顶托机构，用于顶托待切割硅棒进行开方切割后所形成的边皮，所述边皮提升单元对藉由边皮顶托机支撑的机构进行提升。应当说明的是，所述边皮顶托机构也可作为硅棒开方设备的组成部分，又或，所述边皮顶托机构并非所述边皮卸料装置或硅棒开方设备中的必要机构。
在一实施例中，参阅图32，显示为一实施例中边皮顶托机构的结构示意图，如图所示，所述边皮顶托机构53包括承托件，所述承托件包括连接于硅棒承载结构11其中一侧面的底座531和由底座531向上延伸的顶托部532。所述底座531也可设置为与硅棒承载结构11的侧面相适配的平面板结构、曲面板结构或其他异型结构，本申请不做限制。所述顶托部532设置为位于所述底座531两侧的两个顶柱，所述顶柱延伸的高度与硅棒承载结构11的承载面的高度一致，实际中，所述顶托部532也可采用为由所述底座531向上延伸的顶板或顶杆。当线切割装置对硅棒承载结构11上的待切割硅棒进行开方切割时，承托件即可托住对应的边皮，从而有效防止线切割装置中的切割线段在穿出待切割硅棒时出现崩边的状况，且可避免边皮发生掉落和倾覆。
在另一实施例中，所述边皮顶托机构包括活动承托件和锁定控制件。在本实施例中所述活动承托件包括连接于硅棒承载结构其中一侧面的活动底座、由所述活动底座向上延伸的顶托部、以及提供所述顶托部上下运动的动力产生结构。在一实现方式中，所述活动底座可例如为与硅棒承载结构的侧面相适配的平面板结构，但并不以此为限，所述活动底座也可例如为曲面板结构或其他异型结构。所述顶托部为由所述活动底座向上延伸的至少两个顶杆，但并不以此为限，所述顶托部也可例如为由所述活动底座向上延伸的顶板或顶柱。所述动力产生结构包括设于所述活动底座处的两个支脚以及分别套设于两个支脚的两个弹簧，但并不以此为限，所述动力产生结构也可采用例如扭簧、弹片等结构。利用所述弹簧的弹力，可使得所述支脚及相连的所述顶杆能相对于硅棒承载结构作上下运动。在本实施例中所述锁定控制件用于在活动承托件抵靠于待切割硅棒的底部时将活动承托件控制在锁定状态，在一实现方式中，锁定控制件则可例如为电磁锁。在初始状态下，所述顶杆在所述支脚和所述弹簧的作用下凸露于硅棒承载结构的承载面，当将待切割硅棒进行置放时，所述顶杆在受到待切割硅棒的压制后克服所述弹簧的弹力而向下运动直至于待切割硅棒完全置放于硅棒承载结构的承载面上，此时，作为锁定控制件的电磁锁通电并通过电生磁原理产生的强磁力紧紧地吸附住活动承托件中的活动底座，从而将所述顶杆控制在锁定状态。当线切割装置对硅棒转换装置中对应于切割区的硅棒承载结构所承载的待切割硅棒进行开方切割时，处于锁定状态下的活动承托件即可顶托住对应的边皮，能有效防止线切割单元中的切割线网在穿出待切割硅棒时出现崩边的状况，且可避免边皮发生掉落和倾覆等。
所述边皮提升单元与边皮夹持单元即可用于将位于硅棒承载结构上的边皮凸出已切割硅棒并予以转移。
在某些示例中，所述边皮提升单元包括可升降运动的顶升件，所述顶升件受控承托所述 边皮以提升所述边皮。
在一种示例中，所述边皮提升单元通过升降导轨设置于机座上，在切割形成所述边皮后，所述边皮提升单元受控升降至硅棒承载结构底部并从边皮底部提升所述边皮以使得边皮凸出已切割硅棒。
在另一示例中，所述边皮提升单元藉由依附于线切割装置中可升降的线切割支座进行升降运动，请参阅图33，显示为本申请的边皮卸料装置在一实施例中的边皮提升单元51的结构示意图，所述边皮提升单元51包括设于所述线切割支座上的顶升件511，所述顶升件被一伸缩部件512驱动可做伸缩运动，所述顶升件511受控作伸展运动后托住所述边皮的底部以顶升所述边皮。
在一实施例中，所述顶升件511包括抵靠板和承托板，所述抵靠板自所述承托板的底部向上延伸，进一步地，所述抵靠板可为与边皮的弧形表面相适配的弧形板，当所述抵靠板抵靠于边皮时，能与边皮的弧形表面充分接触，所述抵靠板与边皮接触的部位为圆滑设计或者在所述抵靠板中要有与边皮接触的内表面增设缓冲垫。所述承托板用于承托住边皮的底部，进一步地，所述承托板可为与边皮的底面相适配弓形板。在其他实施例中，作为承托板的弓形板的弦边还可增设凸块，以增加与边皮的底面的接触面积。
在一实施例中，伸缩部件512例如为带有伸缩杆的气缸，其中，所述伸缩杆可通过连接结构与顶升件511中的所述承托板连接，所述气缸可驱动所述伸缩杆以带动顶升件511作伸缩运动。在此，所述顶升件511的伸缩运动包括顶升件511的收缩及伸展运动，在实际场景中，所述顶升件511的收缩运动是为所述气缸驱动所述伸缩杆收缩以带动顶升件511远离边皮，顶升件511的伸展运动具体指的是所述气缸驱动所述伸缩杆伸展以带动顶升件511靠近边皮。当然，前述伸缩部件512也可采用其他实现方式，例如，所述伸缩部件512也可例如为带有丝杠的伺服电机，所述丝杠与所述顶升件511相连，由所述伺服电机的驱动所述丝杠转动以带动相连的所述顶升件511作伸缩运动，例如，驱动所述丝杠正向转动带动所述顶升件511作收缩运动，及驱动所述丝杠逆向转动带动所述顶升件511作伸展运动，或者，驱动所述丝杠正向转动带动所述顶升件511作伸展运动及驱动所述丝杠逆向转动带动所述顶升件511作收缩运动。
于实际应用中，在初始状态下，所述伸缩杆带动顶升件511处于收缩状态，线切割单元被驱动随着线切割支座下降以使得线切割单元中各个切割线段所形成的切割线对位于切割区的待切割硅棒进行开方切割，直至所述切割线段贯穿待切割硅棒，完成对待切割硅棒的一次完全切割并形成边皮，此时，边皮提升机构已跟随线切割支座下降至底部，所述气缸驱动所 述伸缩杆伸展以带动顶升件511靠近边皮直至顶升件511中的抵靠板与边皮接触并实现抵靠，后续，线切割单元被驱动跟随线切割支座上升，边皮提升机构跟随线切割支座上升，带动边皮相对已进行一次切割的硅棒发生上升位移，使得边皮的顶端凸出于待切割硅棒，当边皮的顶端相较于待切割硅棒凸出部分满足设定条件时，则可控制线切割支座停止上升，如此，边皮的顶端即可作为进行抓取的着力部位，使得边皮被抓取卸料，然后，气缸驱动伸缩杆收缩以带动顶升件511回到初始状态的同时控制线切割支座带动线切割单元和边皮提升机构继续上升至待切割硅棒上方以备执行下一次切割作业。
在某些示例中，所述边皮提升单元包括可伸缩运动的吸附件，所述吸附件受控作伸展运动后抵靠于所述边皮以提升所述边皮。
在一实现方式中，所述边皮提升机构可包括吸附件和驱动所述吸附件作伸缩运动的伸缩部件，所述吸附件受控于所述伸缩部件而抵靠于边皮并吸附住边皮。所述吸附件更可包括抵靠板和吸附元件。所述抵靠板可例如为与所述边皮的弧形表面相适配的弧形板，当所述抵靠板抵靠于所述边皮时，能与所述边皮的弧形表面充分接触。所述吸附元件可例如为真空吸盘，多个真空吸盘可布设于所述抵靠板中要与所述边皮接触的接触面上。所述伸缩部件可例如为带有伸缩杆的气缸或是带有丝杠的伺服电机，以带有伸缩杆的气缸为例，所述伸缩杆可通过连接结构与所述顶升件中的抵靠板连接，所述气缸可驱动所述伸缩杆收缩以带动所述抵靠板远离所述边皮，所述气缸可驱动所述伸缩杆伸展以带动所述抵靠板靠近所述边皮并在所述抵靠板与所述边皮接触后由所述吸附元件吸附住所述边皮。后续，线切割支座被驱动上升，所述边皮提升机构和线切割装置跟随线切割支座上升，所述边皮提升机构利用吸附力可带动边皮相对所述已切割硅棒发生上升位移，使得所述边皮的顶端凸出于所述已进行一次切割作业的硅棒。
需要说明的是，在一些示例中，所述硅棒开方设备设置有多个切割轮组同时对多个待切割硅棒进行切割，故而在线切割支座上对应于多个切割轮组设置有多个边皮提升机构同时对已进行切割作业的多个硅棒进行边皮卸料。在线切割装置中包括一个线切割单元的情况下，所述线切割装置的一次下压切割形成一个边皮，在线切割支座上对应于每个硅棒承载结构的一对切割轮的上方设有一个边皮提升机构以将切割作业中形成的边皮及时卸料。在线切割装置中设有两个线切割单元的情况下，所述线切割装置的一次下压切割形成两个边皮，在线切割支座上对应于每个硅棒承载结构的上方设有两个边皮提升机构以将切割作业中形成的边皮顶托凸出已切割硅棒以实现对边皮的及时卸料。
经由所述边皮提升单元形成所述边皮相对于已切割硅棒的凸出部分后，所述边皮夹持单 元基于该凸出部分继续进行对边皮的位移，以夹持所述边皮并将边皮转运至卸载区。
请继续参阅图30、图31，如图30所示，所述边皮夹持单元52包括设置于所述硅棒开方设备机座10上的支撑柱521，所述支撑柱521例如为图示的至少一根设置在第一方向的导柱。所述支撑柱521上设置有第一安装部522、以及连接至第一安装部522的边皮夹持机构523。在图示的示例中，所述支撑柱521设置于硅棒开方设备第一方向的中部，以便于减小边皮夹持机构523至边皮的距离，当然，所述支撑柱521设置的位置不以此为限。
所述第一安装部522设置于所述支撑柱521上，所述第一安装部522可作为边皮夹持机构523与所述支撑柱521的转接部分，在一些示例中，所述第一安装部522例如为活动设置或固定设置于所述支撑柱521的承载块体。
所述至少一组边皮夹持机构523通过摆臂524连接至所述第一安装部522。在某些示例中，所述第一安装部522固定于在所述支撑柱521的预设高度，所述预设高度例如为支撑柱521顶部以确保连接至所述第一安装部522的边皮夹持机构523在夹持所述边皮后可将边皮提升脱离已切割硅棒。
在另一些示例中，所述边皮卸料装置还包括第一升降驱动装置(未予以图示)，用于驱动所述第一安装部522升降活动于所述支撑柱521。在此，基于所述第一升降驱动装置控制第一安装部522沿支撑柱521运动，即可带动连接至第一安装部522的边皮夹持机构523在空间升降运动，所述边皮夹持机构523可藉由此实现对边皮的夹持及提升，例如，当切割形成边皮后，所述第一升降驱动装置带动第一安装部522下降以致所述边皮夹持机构523接触并夹持由被提升凸出已切割硅棒的边皮，第一升降驱动装置进而可带动夹持态下的边皮夹持机构523上升使得边皮脱离已切割硅棒。
所述边皮夹持机构523为用于进行边皮夹持与转运的部件，所述至少一组边皮夹持机构523通过摆臂524连接至所述第一安装部522，其中，所述摆臂524具有近端及远端，所述摆臂524近端设于第一安装部522，边皮夹持机构523设于摆臂524远端也即延伸端。
所述边皮夹持机构523受控绕摆臂转轴525转动，在某些示例中，所述一组边皮夹持机构523即为共用于同一摆臂转轴525的不同摆臂524延伸端分别设置的边皮夹持机构523，如图30所示，所述一组边皮夹持机构523中包括两个边皮夹持机构523，每一个边皮夹持机构523设于一摆臂524延伸端，且一组边皮夹持机构523中的不同摆臂524近端连接至同一摆臂转轴525。在此，对应于所述一组边皮夹持机构523的摆臂转轴525连接的不同摆臂524之间可为等长(呈如图30所示的示例)，当然，也可设置为不等长；在实际场景中，不同摆臂524之间的夹角、摆臂524长度以及摆臂转轴525位置可基于硅棒承载结构11的位置确 定，在此，所述边皮在水平面上的位置由硅棒承载结构11与切割线锯位置确定，应当理解，一个边皮夹持机构523可用于夹持一硅棒承载结构11上的硅棒被切割后形成的边皮，当所述一组边皮夹持机构523中包括多个边皮夹持机构523，每一边皮夹持机构523对应于一个硅棒承载结构11上的硅棒，即可基于硅棒承载结构11位置(或立式置放的硅棒的位置)确定摆臂转轴525位置、不同摆臂524长度及摆臂524间夹角，例如，基于第一安装部预先设定提升边皮时摆臂转轴525位置，基于摆臂转轴525位置与不同硅棒承载结构11的连线确定各摆臂524长度与摆臂524间的角度。
例如，如图30所示的示例，基于硅棒开方设备上硅棒承载结构11为等间距设置，每一组边皮夹持机构523对两个硅棒承载结构11上的已切割硅棒形成的边皮进行夹持转运，在将边皮从硅棒承载结构11上开始提升时摆臂转轴525处于两个硅棒承载结构11的中垂面上，对应的连接摆臂转轴525的两个摆臂524等长。
在某些示例中，所述至少一组边皮夹持机构中的每一组边皮夹持机构中包括至少一个边皮夹持机构，即，所述硅棒卸料装置中包括的边皮夹持机构可以为一组、两组、三组、四组等；其中，一组边皮夹持机构中边皮夹持机构的数量可以为一个、两个、三个等。
在如图30所示的示例中，位于线切割装置下方的切割区内设有四个硅棒承载结构，每一组边皮夹持机构包括两个边皮夹持机构，分属位于第一安装部两侧的一组边皮夹持机构分别对视图中机座左侧、右侧的各两个硅棒承载结构上的已切割硅棒进行边皮卸除。在一些示例中，所述支撑柱可设置于机座长度方向的中点，也即所述第一安装部在水平面上的投影位于机座中部，相对两侧的一组边皮夹持机构可呈对称设置，应当理解，基于硅棒开方设备硅棒承载结构的对称结构，在此设置下可减小设备占据空间。
在某些示例中，所述摆臂转轴525还包括转动驱动装置(未予以图示)，用于驱动连接于所述摆臂转轴525的摆臂延伸端的所述边皮夹持机构523在夹持所述边皮并驱动边皮脱离已切割硅棒后转动预设角度，以将所述边皮转运至边皮卸载区。在一种实现方式中，所述摆臂转轴525连接于一驱动电机的动力输出轴，由所述驱动电机控制摆臂转轴525转动，以此带动连接于所述摆臂转轴525的摆臂转动一定角度，摆臂延伸端的边皮夹持机构523即通过顺延转动形成的弧形路径转移至边皮卸载区。
所述边皮夹持机构523可绕摆臂转轴525转动，通过机座10上方的空间，在无需进行边皮转运时例如在硅棒开方设备处于停息状态时，可基于转动摆臂转轴525将边皮夹持机构523收纳至机座10上方，即可用于减省设备空间；再者，所述边皮夹持机构523具有基于摆臂转轴525转动的转动自由度，相比于直线路径，通过弧线路径进行边皮转运可减小转运距离， 以此增加边皮的转运效率。
在某些示例中，当所述第一安装部522相对两侧设有摆臂转轴525，两侧的摆臂转轴525在边皮转运状态下旋向相反，例如，在图30所述状态下，第一安装部522两侧的边皮夹持机构523在水平面上的投影位于硅棒承载结构11上，视图中左侧的一组边皮夹持机构523在转运中绕摆臂转轴525转动的方向如图30中左侧箭头所示，在一定角度范围内顺应转动方向，边皮夹持机构523远离机座；对应的，视图中右侧的一组边皮夹持机构523在转运中绕摆臂转轴525转动的方向如图30中右侧箭头所示，在一定角度范围内顺应转动方向，边皮夹持机构523远离机座。当然，第一安装部522两侧的边皮夹持机构523可相对独立的转动，例如每一组边皮夹持机构523分别配置有对应于摆臂转轴525的转动驱动装置，所述边皮夹持机构523绕对应的摆臂转轴525旋转的方向并不以此为限制，在此说明的方式包括：基于摆臂转轴525的位置，令摆臂转轴525对应的边皮夹持机构523在转运边皮时其旋转方向为远离第一安装部522(或支撑柱)的方向。
在某些实施方式中，所述第一安装部还包括提供至少一个方向移动的至少一个移动机构，用于设置所述摆臂转轴。
在此，连接于所述摆臂转轴的摆臂及摆臂延伸端的边皮夹持机构即可跟随所述摆臂转轴，沿所述至少一个移动机构提供的至少一个方向移动。由此，即可增加所述边皮夹持机构移动自由度以延展移动范围，以确使所述边皮夹持机构的移动范围可将边皮转运至卸载区；同时，所述第一安装部及其所包括的至少一个移动机构位于机座上方，可用于节省设备空间。
在某些示例中，所述第一安装部的相对两侧分别通过一摆臂转轴设有一组边皮夹持机构。如图30或图31所示，所述第一安装部522的两侧分别设置有一移动机构5221，图示实施例显示为直线运动机构，所述直线运动机构中包括直线导轨52211，所述直线导轨52211沿硅棒开方设备的宽度方向设置，所述摆臂转轴525沿直线导轨52211移动即可带动其对应的一组边皮夹持机构远离或靠近硅棒承载结构11。在某些示例中，所述移动机构5221处还包括设于所述摆臂转轴525的移动驱动装置例如行进电机，所述行进电机例如可通过行进丝杠连接于直线导轨52211，以藉由行进电机带动摆臂转轴525沿所述直线导轨52211移动。
在一实施例中，如图31所示，所述移动机构5221包括直线导轨52211及移动驱动装置，其中，所述移动驱动装置包括沿直线导轨52211方向布置的伸缩杆52212及驱动源。在此示例中，所述直线导轨52211设于所述第一安装部522并沿机座的宽度方向布置；所述伸缩杆52212与所述直线导轨52211共线设置，伸缩杆52212具有远端及近端，其中，伸缩杆52212近端连接至所述驱动源，伸缩杆52212远端连接至所述摆臂转轴525，在所述驱动源驱动下 伸缩杆52212远端沿伸缩杆52212轴向运动以带动所述摆臂转轴525沿直线导轨52211移动。
在其他可实现方式中，所述伸缩杆也可替换为与摆臂转轴螺纹连接的丝杆，在驱动源作用下丝杆沿丝杆轴转动以在摆臂转轴处转化为沿丝杆轴向的直线运动；又或，所述摆臂转轴由伺服电机驱动沿直线导轨运动，本申请不做限制。
在某些示例中，所述至少一组边皮夹持机构中的每一边皮夹持机构包括：夹持组件，用于夹持或释放所述边皮的顶端；第二升降驱动结构，用于驱动夹持组件升降运动。
请继续参阅图31，如图所示，所述边皮夹持机构523包括第二升降驱动结构5232和以及设置在第二升降驱动结构5232底部的夹持组件5231。在实施例中，所述第二升降驱动结构5232用于驱动夹持组件5231作升降运动，所述第二升降驱动结构5232可例如为带有升降杆的升降气缸，所述升降杆与夹持组件5231相连，利用升降气缸可控制所述升降杆伸缩以带动夹持组件5231作升降运动，但并不以此为限。例如所述第二升降驱动结构5232还可为藉由电机驱动的丝杆组件，所述丝杆组件与夹持组件5231相连，利用电机驱动丝杆组件升降以带动夹持组件5231作升降运动。
所述夹持组件即用于进行边皮夹持的部位，在某些示例中，所述夹持组件包括罩体以及可伸缩的夹持件。所述罩体用于罩设于边皮，所述可伸缩的夹持件设于所述罩体内部，所述夹持件与所述罩体主体之间形成供夹持所述边皮的夹持空间。
请结合参阅图34和图35，其中，图34显示为本申请的边皮卸料装置在一实施例中的夹持组件的结构示意图，图35显示为本申请的边皮卸料装置的夹持组件在一实施例中的剖面示意图。如图所示，所述夹持组件5231包括罩体52311和可伸缩的夹持件52312，所述可伸缩的夹持件52312设于所述罩体52311内部，所述夹持件52312与所述罩体52311之间形成供夹持所述边皮的夹持空间。在实施例中，所述罩体52311用于罩设于边皮，所述罩体52311的可罩入尺寸要略大于待切割硅棒的截面圆，所述罩体52311设置为封闭或者非封闭的圆形罩，但并不以此为限。
在某些示例中，所述罩体52311主体顶部具有开口，以供所述边皮被提升至凸出所述罩体52311，应当理解，当所述边皮凸出罩体52311，配合于罩体52311进行夹持的夹持件52312与边皮的接触面积即达到最大，可用于确保夹持组件5231夹持边皮的稳定性。
在某些示例中，所述罩体52311内壁设置有尼龙齿形条523111，用于接触所夹持的边皮，使得边皮外侧与罩体52311接触的摩擦力增大，以便于进行边皮的提升。
所述夹持组件的结构并不以此为限，在其他实施例中，所述夹持组件包括弧形板和可伸缩的夹持件，所述夹持件与所述弧形板之间形成供夹持所述边皮的夹持空间。
在某些示例中，所述夹持件为由一气缸控制的活动压块，所述活动压块通过一旋转臂与所述气缸连接。
在某些示例中，所述旋转臂具有第一转轴、第一悬臂、以及位于第一悬臂中间的第一连接部，其中，所述第一悬臂近端连接所述第一转轴，所述第一悬臂远端连接活动压块，所述第一连接部连接所述气缸的活塞杆。
在一实施例中，如图35所示，所述罩体52311内部设置有一用于承载所述夹持件的基座523112，所述基座523112承载所述夹持件探入已切割硅棒与边皮之间的凹陷区，所述气缸52324固定于基座523112的侧壁上且具有活塞杆，所述旋转臂的第一转轴52322与一固定于基座523112底部的支撑座相铰接以使得第二悬臂能够以所述绕第一转轴52322转动，同时所述第一转轴52322设于所述第一悬臂52321的近端，所述活动压块523121与第一悬臂52321的远端固定相连，位于所述第一悬臂52321近端与远端中间的第一连接部52323与所述气缸52324的活塞杆相铰接，气缸52324推动活塞杆伸缩运动以带动第一悬臂52321绕第一转轴52322转动，即在此，以第一转轴52322为支点，气缸52324的活塞杆为力的作用点，以第一悬臂52321受力杠杆，即可带动第一悬臂52321远端的活动压块523121运动，第一悬臂52321在绕第一转轴52322转动的过程中第一悬臂52321远端的活动压块523121靠近或远离罩体52311，即可调整活动压块523121与罩体52311之间的夹持空间。
应当理解，仅需第一悬臂52321形成具有支点的杠杆，第一悬臂52321远端连接的活动压块523121即可由第一悬臂52321的转动远离或靠近罩体52311，在图35所实示例中，设置为第一悬臂52321的受力作用点的第一转轴52322位于悬臂近端，作为传动气缸活塞杆运动受力点的第一连接部52323设于第一悬臂52321中间，在图35的示例中，当气缸活塞杆收缩，第一悬臂52321近端受到向上提升的力，第一悬臂52321远端向上运动并使得活动压块523121远离罩体52311从而增加夹持空间，在此状态下即可释放所夹持的边皮。在需要夹持边皮时，气缸52324驱动活塞杆伸展从而带动第一悬臂52321近端绕第一转轴52322向下运动，第一悬臂52321近端绕第一转轴52322下降而带动活动压块523121靠近所述罩体52311并至抵靠边皮，气缸活塞杆保持伸展即可将边皮维持于被夹持状态。
在某些示例中，所述第一连接部也可连接至电机驱动的丝杠组件或伸缩杆，由此带动第一悬臂绕第一转轴转动从而实现活动压块对边皮的压紧或释放。
在一些实施方式中，所述旋转臂具有第二悬臂、第二连接部、以及位于第二悬臂中间的第二转轴，其中，所述第二连接部设于所述第二悬臂近端并连接所述气缸的活塞杆，所述第二悬臂远端连接所述活动压块。
请参阅图36，显示为所述夹持组件在另一实施例中的剖面结构示意图。如图所示，所述罩体52311内部设置有一用于承载所述夹持件52312的基座523112，所述基座523112承载所述夹持件52312探入已切割硅棒与边皮之间的凹陷区，所述气缸52334固定于基座523112的侧壁上且具有活塞杆，所述旋转臂的第二转轴52332与一固定于基座523112底部的支撑座相铰接以使得第二悬臂52331能够以所述绕第二转轴52332转动，所述活动压块523121与第二悬臂52331的远端固定相连，所述旋转臂的第二悬臂52331近端与所述气缸52334的活塞杆相铰接，气缸52334推动活塞杆作伸缩以带动第二悬臂52331绕第二转轴52332转动，即在此，第二悬臂52331的受力杠杆中以第二转轴52332为支点，气缸52334的活塞杆为力的作用点，即可带动第二悬臂52331远端的活动压块523121运动，第二悬臂52331在绕第二转轴52332转动的过程中第二悬臂52331远端的活动压块523121靠近或远离罩体52311，即可调整活动压块523121与罩体52311之间的夹持空间。
应当理解，仅需第二悬臂52331形成具有支点的杠杆，第二悬臂52331远端连接的活动压块523121即可由第二悬臂52331的转动远离或靠近罩体52311，在图36所实示例中，设置为第二悬臂52331的受力作用点的连接气缸活塞杆的第二连接部52333位于悬臂近端，作为转动支点的第二转轴52332设于悬臂中间，在图示中，当气缸活塞杆收缩，第二悬臂52331近端受到向上提升的力，第二悬臂52331远端向下运动并使得活动压块523121靠近罩体52311从而将边皮抵靠压紧至罩体52311上(如图36中的箭头方向)。在需要释放边皮时，气缸52334驱动活塞杆伸展从而带动第二悬臂52331近端绕第二转轴52332向下运动，第二悬臂52331近端绕第二转轴52332上升而带动活动压块523121远离所述罩体52311即回到初始状态，增大了活动压块523121与罩体52311之间的夹持空间以便于释放边皮。
在此，应当理解，基于所述气缸活塞杆连接至第二连接部52333的方向，气缸活塞杆的收缩与伸展运动对应于活动压块523121释放或压紧边皮的状态不同，例如，图36所示实施例中气缸活塞杆连接于第二悬臂52331近端上方，通过活塞杆收缩以带动活动压块523121压紧边皮；在另一些示例中，当所述气缸活塞杆连接至第二悬臂52331近端下方，气缸活塞杆伸展以向上顶升第二悬臂52331近端向上转动，从而使得活动压块523121在向下运动过程中靠近并压紧边皮。
在某些示例中，所述第二连接部也可连接至电机驱动的丝杠组件或伸缩杆，由此带动第二悬臂绕第二转轴转动从而实现活动压块对边皮的压紧或释放。
需要说明的是，所述边皮夹持机构中夹持件的数量可基于硅棒开方设备中线切割装置的形式作相应变换，例如，当所述硅棒开方设备的线切割装置中具有单线切割单元，基于所述 单线切割单元中形成的切割线锯对待切割硅棒进行切割作业需要执行四次单轴面切割步骤，在这种实施方式中，所述夹持件的数量设置为一个。执行第一次单轴面切割，形成一个边皮，利用一个夹持件将该边皮夹持住并再通过第一升降驱动结构、第二升降驱动结构、移位机构、以及摆臂转轴中的一个或多个将所述边皮予以转送出去，再调整待切割硅棒的切割面(例如令所述硅棒承载结构绕硅棒轴心转动90度)，执行第二次单轴面切割，再次形成一个边皮，重复进行前述夹持及转运，在此不做赘述。在另一些实施方式中，各线切割装置中包括两个线切割单元，两个线切割单元中形成相对平行的切割线锯，在一次切割作业中切割形成两个平行轴面，在这种实施方式中，所述夹持件设置为相对设置的两个。执行第一次两个平行轴面的切割，形成两个边皮，利用两个夹持件将对应位置上形成的两个边皮夹持并转运至卸料区，再调整待切割硅棒的切割面(例如令所述硅棒承载结构绕硅棒轴心转动90度)，执行第二次切割形成两个平行轴面并形成两个边皮，再次利用两个夹持件将对应位置上形成的两个边皮夹持住夹持并转送出去。
在一些示例中，为了避免活动压块在长期夹持中与边皮接触，互相产生磨损和伤害，在一些实施例中，所述活动压块设有用于与所述边皮接触的缓冲垫。所述缓冲垫例如采用具有弹性的橡胶材料制成，或者硅胶或由其他具有弹性形变、阻尼特性或缓冲特性的材料制成，以防止夹持转运中所述边皮的表面被划伤或磕碰碎裂。
在某些示例中，所述边皮卸料装置还包括边皮筒，设于所述边皮卸载区。在一些实现方式中，所述边皮筒的桶口可设计较大或呈喇叭口，便于边皮无障碍地置入，且，所述边皮筒的桶臂的高度也较高，可确保置入的边皮不会发生倾覆等。如此，由所述夹持转运单元将边皮由切割区移动至所述边皮筒，而后可由操作人员将边皮从所述边皮筒内取出。
为便于对本申请的边皮卸料装置所执行的边皮夹持转运过程的理解，请参阅图37a至图37e，显示为本申请的边皮卸料装置在一实施例中于硅棒开方设备中执行边皮转运的不同状态示意图。
在此，所述边皮夹持机构通过摆臂绕摆臂转轴转动预设角度后将边皮转运至边皮卸载区，所述预设角度可基于边皮卸载区的位置确定，如图37a至图37e所示，在进行边皮夹持及转运的实际场景中，当切割形成边皮后，边皮夹持机构523顺应第一安装部522由第一驱动装置驱动下降至硅棒端面(呈如图37a所示状态)，藉由边皮提升单元将边皮凸出硅棒端面，边皮夹持机构523由此可夹持边皮，夹持组件中的活动压块将边皮抵靠至罩体或弧形板，而后由第一驱动装置带动连接至安装部的各边皮夹持机构523上升(呈如图37b所示状态)以将边皮提升并脱离已切割硅棒；所述转动驱动装置驱动边皮夹持机构523转动预设角度，在此， 如图37c所示，所述第一安装部522两侧分别设有一组边皮夹持机构523，其中每一组边皮夹持机构523在其对应的转动驱动装置驱动下向远离第一安装部522的方向旋转120°，以达所述边皮卸载区上方，而后所述边皮夹持机构523跟随第一安装部522由第一升降驱动装置驱动下降，夹持组件中活动压块远离边皮增加夹持空间，将所夹持的边皮放置在边皮卸载区的边皮收集装置例如所述边皮筒(呈如图37d所示状态)，在边皮卸载完成后，所述边皮夹持机构523顺应第一安装部522被驱动上升，并转动一定角度回到等待位置(呈如图37e所示状态)；当切割形成新的边皮后，重复前述转运过程，即可再次进行边皮卸载。当然，应当理解，前述过程中所述边皮夹持机构523的上升及下降还可由第二升降驱动结构驱动，又或同时由第一升降驱动装置和第二升降驱动结构驱动。
在一实施例中，所述边皮卸料装置包括边皮输送结构，所述边皮输送结构设置在所述边皮卸载区，用于将经边皮夹持机构运转过来的边皮进行输送，在一种实现方式中，所述边皮输送结构可例如为输送带。应当理解的是，所述边皮卸载区为硅棒开方设备中边皮卸载的区域，具体地，所述边皮卸载区为边皮夹持机构将边皮运离切割区后其下方所对应的区域。在实际操作中，由边皮夹持机构将边皮由切割区移送至边皮卸载区，边皮夹持机构中的夹持组件松开以将边皮释放至作为边皮输送结构的输送带上，由所述输送带将边皮输送出去。
当然，对待切割硅棒进行切割后形成的边皮予以卸料并不限于此。例如，在其他实施方式中，所述边皮卸料装置可同时包括边皮筒和边皮输送结构，其中，所述边皮输送结构可例如为输送带，所述边皮筒邻设于所述输送带的起始端(例如，所述边皮筒位于所述输送带的起始端的旁侧或直接位于所述输送带的起始端的上方等)。其中，所述边皮筒的桶口可设计较大或呈喇叭口，便于边皮无障碍地置入，且，所述边皮筒的桶臂的高度也较高，可确保置入的边皮不会发生倾覆等。于实际的应用中，所述边皮筒更可为可翻转设计，通过翻转所述边皮筒，使得所述边皮筒内的各个边皮顺畅地转移至所述输送带上。例如，所述边皮筒的底部设有翻转驱动机构，所述翻转驱动机构可包括翻转板、转轴及翻转驱动源(例如翻转电机或翻转气缸等)。如此，由所述边皮夹持机构将边皮由切割区移送至所述边皮筒内后，所述边皮筒翻转带动筒内的边皮转移至所述输送带上，由所述输送带将边皮输送出去。
在此，本申请提供了一种用于硅棒开方设备的边皮卸料装置，所述边皮卸料装置在闲置状态可收纳于硅棒开方设备机座上方的空间内以节省硅棒开方设备整体占据的设备空间，在边皮夹持转运状态下边皮夹持机构可通过摆臂绕摆臂转轴旋转以将所夹持的边皮转运至边皮卸载区，由此缩短转运路径，同时，所述边皮卸载装置中可设置多组边皮夹持机构与硅棒开方设备的硅棒承载结构一一对应，以提高边皮夹持转运的效率，缩减时间成本。
本申请还提供了一种硅棒开方设备，包括机座；硅棒承载结构，用于承载立式置放的硅棒；以及线切割装置，设置在至少两个硅棒承载结构的上方，包括多个切割轮以及绕于所述多个切割轮形成有至少一条切割线锯的切割线；如图30至图37e所示实施中任一实施方式所述的边皮卸料装置。
所述机座设置为本申请硅棒开方设备的主体部件，用于提供开方作业平台，较佳地，所述机座的体积和重量均较大以提供更大的安装面以及更牢固的整机稳固度。
所述硅棒承载结构用于承载立式置放的硅棒，各所述硅棒承载结构具有转动机构，所述转动机构用于带动置放于硅棒承载结构上的硅棒进行转动以调整待切割面。在一示例性实施例中，所述转动机构设置为位于硅棒承载结构底部的旋转转盘，该旋转转盘受控于一驱动装置(未予以图示)，所述驱动装置可例如为驱动旋转转盘转动的伺服电机，但并不以此为限。在一可选实施例中，所述转动机构可采用升降式设计，即，硅棒承载结构底部的旋转转盘受控后可作伸缩动作以带动硅棒承载结构作升降运动，从而调整硅棒承载结构上待切割硅棒的高度。
所述线切割装置包括切割架及架设于所述切割架的可升降的线切割支座，所述线切割支座上设置多个切割轮以及绕于所述多个切割轮形成有至少一条切割线锯的切割线，在线切割支座升降运动时带动切割线锯对设于硅棒承载结构上的硅棒升降进给以进行对硅棒的切割。
所述硅棒开方设备中边皮卸料装置与线切割装置可配合运作，在线切割装置切割硅棒形成边皮后由边皮卸料装置将边皮提升凸出已切割硅棒并予以夹持转运，其中，边皮卸料装置中的边皮夹持机构可通过摆臂绕摆臂转轴旋转以将所夹持的边皮转运至边皮卸载区，由此缩短转运路径，同时，所述边皮卸载装置中可设置多组边皮夹持机构与硅棒开方设备的硅棒承载结构一一对应，以提高边皮夹持转运的效率，缩减时间成本，边皮被转运置放后将已切割硅棒予以卸载，所述硅棒开方设备即可继续进行待切割硅棒的开方作业，开方流程中边皮转运借助边皮卸料装置完成使得自动化程度提高，减小了人工成本并提升了加工效率。
上述实施例仅例示性说明本申请的原理及其功效，而非用于限制本申请。任何熟悉此技术的人士皆可在不违背本申请的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本申请所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本申请的权利要求所涵盖。

Claims (18)

  1. 一种应用于硅棒开方设备的边皮卸料装置，其特征在于，所述硅棒开方设备包括机座、线切割装置和硅棒承载结构，所述硅棒承载结构用于承载立式置放的硅棒，所述线切割装置包括可升降的线切割支座和设于所述线切割支座上的线切割单元，所述线切割单元中具有切割线锯，所述切割线锯切割硅棒形成已切割硅棒和边皮；所述边皮卸料装置包括：
    边皮提升单元，用于提升所述边皮以使得所述边皮顶端凸出所述已切割硅棒；
    边皮夹持单元，包括：
    支撑柱，设于所述机座上；
    第一安装部，设于所述支撑柱上；
    至少一组边皮夹持机构，通过摆臂连接至所述第一安装部，用于夹持所述边皮并提升所述边皮脱离已切割硅棒，以及受控绕摆臂转轴转动以将所述边皮转运至边皮卸载区。
  2. 根据权利要求1所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述边皮提升单元包括可升降运动的顶升件，所述顶升件受控承托所述边皮以提升所述边皮。
  3. 根据权利要求1所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述边皮提升机构包括可伸缩运动的吸附件，所述吸附件受控抵靠于所述边皮并吸附所述边皮以提升所述边皮。
  4. 根据权利要求1所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述第一安装部还包括提供至少一个方向移动的至少一个移动机构，用于设置所述摆臂转轴。
  5. 根据权利要求1或4所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，还包括：
    第一升降驱动装置，用于驱动所述第一安装部升降活动于所述支撑柱。
  6. 根据权利要求4所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述第一安装部的相对两侧分别通过一摆臂转轴设有一组边皮夹持机构。
  7. 根据权利要求1所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述一组边皮夹持机构包括至少一个边皮夹持机构，所述至少一个边皮夹持机构中的每一边皮夹持机构 设置于一摆臂延伸端。
  8. 根据权利要求1所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述至少一组边皮夹持机构中的每一边皮夹持机构包括：
    夹持组件，用于夹持或释放所述边皮的顶端；
    第二升降驱动结构，用于驱动夹持组件升降运动。
  9. 根据权利要求8所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述夹持组件包括：
    罩体，用于罩设于边皮；以及
    可伸缩的夹持件，设于所述罩体内部；所述夹持件与所述罩体主体之间形成供夹持所述边皮的夹持空间。
  10. 根据权利要求9所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述罩体主体顶部具有开口，以供所述边皮被提升至凸出罩体。
  11. 根据权利要求8所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述夹持组件包括：
    弧形板；以及
    可伸缩的夹持件，所述夹持件与所述弧形板之间形成供夹持所述边皮的夹持空间。
  12. 根据权利要求9或11所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述夹持件为由一气缸控制的活动压块，所述活动压块通过一旋转臂与所述气缸连接。
  13. 根据权利要求12所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述旋转臂具有第一转轴、第一悬臂、以及位于第一悬臂中间的第一连接部，其中，所述第一悬臂近端连接所述第一转轴，所述第一悬臂远端连接活动压块，所述第一连接部连接所述气缸的活塞杆。
  14. 根据权利要求12所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述旋转臂具有第二悬臂、第二连接部、以及位于第二悬臂中间的第二转轴，其中，所述第二连接部设于所述第二悬臂近端并连接所述气缸的活塞杆，所述第二悬臂远端连接所述活动压块。
  15. 根据权利要求12所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述活动压块设有用于与所述边皮接触的缓冲组件。
  16. 根据权利要求1所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，还包括：边皮筒，设于所述边皮卸载区。
  17. 根据权利要求1所述的应用于硅棒开方设备的边皮卸料装置，其特征在于，所述摆臂转轴还包括转动驱动装置，用于驱动连接于所述摆臂转轴的摆臂延伸端的所述边皮夹持机构在夹持所述边皮并驱动边皮脱离切割后硅棒后转动预设角度，以将所述边皮转运至边皮卸载区。
  18. 一种硅棒开方设备，用于对截面为圆形的硅棒进行开方作业，其特征在于，包括：
    机座；
    硅棒承载结构，用于承载立式置放的硅棒；以及
    线切割装置，设置在硅棒承载结构的上方，包括多个切割轮以及绕于所述多个切割轮形成有至少一条切割线锯的切割线；
    如权利要求1～17中任一项所述的边皮卸料装置。
PCT/CN2021/094835 2020-06-15 2021-05-20 边皮卸料装置及硅棒开方设备 WO2021254085A1 (zh)

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