WO2020221132A1 - 多工位开方设备及其切割方法 - Google Patents

多工位开方设备及其切割方法 Download PDF

Info

Publication number
WO2020221132A1
WO2020221132A1 PCT/CN2020/086747 CN2020086747W WO2020221132A1 WO 2020221132 A1 WO2020221132 A1 WO 2020221132A1 CN 2020086747 W CN2020086747 W CN 2020086747W WO 2020221132 A1 WO2020221132 A1 WO 2020221132A1
Authority
WO
WIPO (PCT)
Prior art keywords
cutting
silicon rod
cut
clamping
wire
Prior art date
Application number
PCT/CN2020/086747
Other languages
English (en)
French (fr)
Inventor
李鑫
张峰
钱春军
裴忠
苏静洪
Original Assignee
天通日进精密技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 天通日进精密技术有限公司 filed Critical 天通日进精密技术有限公司
Publication of WO2020221132A1 publication Critical patent/WO2020221132A1/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Definitions

  • This application relates to the technical field of silicon rod processing, and in particular to a multi-station prescription equipment and a cutting method thereof.
  • the field of photovoltaic solar power generation has received more and more attention and development.
  • the usual crystalline silicon solar cells are made on high-quality silicon wafers, which are cut by a multi-wire saw after pulling or casting a silicon ingot.
  • the traditional single crystal silicon rod square-out machine uses a "well"-shaped cutting method to square the single-crystal silicon rod, so that the silicon rod after the square is roughly rectangular, and then the silicon rod is ground, rounded and polished. After processing, a multi-line slicing machine is used to slice the squared silicon rod along the length direction to obtain the required silicon wafer. In this way, a large amount of raw materials will be wasted during the surface grinding operation of the similar rectangular silicon rods and the obtained silicon wafer surface area is small, and this cutting method has many wire wheels and complicated wiring.
  • the purpose of this application is to disclose a multi-station prescription device and a cutting method thereof.
  • the first aspect of the application discloses a multi-station prescribing device, which includes: at least two silicon ingot loading platforms for supporting vertically placed monocrystalline silicon ingots, each The silicon rod bearing table has a rotating mechanism; and a wire cutting device, which is arranged above the at least two silicon rod bearing tables, includes a plurality of cutting wheels and a cutting line segment or parallel to each other formed around the plurality of cutting wheels The cutting line of two cutting line segments; wherein, during the square rooting operation, the line cutting device is driven to descend, and the one cutting line or two cutting line segments simultaneously treat the multiple silicon rods carried by the multiple silicon rod bearing platforms.
  • the crystalline silicon rod is cut along its length direction in the first direction; after that, the rotation mechanism is used to drive the silicon rod carrier so that the single crystal silicon rod is converted to the surface to be cut, and the wire cutting device is driven to descend.
  • the one cutting line segment or the two cutting line segments simultaneously cut the plurality of single crystal silicon rods carried by the plurality of silicon rod bearing platforms along the length direction thereof in the second direction side.
  • the cutting line when the wire cutting device cuts the side surface of the single crystal silicon rod in the first direction is different from the cutting line of the single crystal silicon rod.
  • the intersection of the cutting lines when cutting the side of the rod in the second direction is located in the cross section of the single crystal silicon rod.
  • the at least two silicon ingot carrying platforms may be provided on a silicon ingot worktable, and a worktable conversion mechanism is provided on the silicon ingot worktable for driving the The silicon ingot worktable makes a conversion movement so that the silicon ingot bearing platform on the silicon ingot worktable is switched between the loading and unloading area and the cutting area.
  • the worktable conversion mechanism is a rotating mechanism
  • the rotating mechanism includes: a rotating shaft, which is axially connected to the silicon rod worktable; and a rotating drive unit for driving The rotation shaft rotates to drive the silicon rod worktable to rotate.
  • the workbench conversion mechanism is a translation mechanism
  • the translation mechanism includes: a translation guide rail, which is laid on a workpiece processing table; and a slider, which is arranged on the silicon rod to work. The bottom of the table; and a translation drive unit for driving the silicon rod table to move along the translation guide rail.
  • the multi-station prescription equipment further includes a silicon rod loading and unloading device adjacent to the silicon rod bearing platform.
  • an edge skin supporting mechanism is provided on the periphery of the silicon rod bearing platform for supporting the edge skin formed by cutting the single crystal silicon rod.
  • the edge skin top support mechanism includes: a movable support member; and a locking control member for holding the movable support member against the bottom of the single crystal silicon rod The movable supporting member is controlled in a locked state.
  • the multi-station square-cutting equipment further includes an edge skin unloading device for unloading the edge skin formed by the wire cutting device.
  • the edge skin unloading device includes: a edge skin lifting mechanism for lifting the edge skin so that the top of the edge skin protrudes from the cut silicon Baton.
  • the edge skin unloading device further includes: a clamping and transferring unit, which is arranged above the at least two silicon rod bearing platforms, and is used to clamp the edge skin And pull up the edge skin to separate the squared monocrystalline silicon rod and transfer the edge skin to the edge skin discharge area.
  • a clamping and transferring unit which is arranged above the at least two silicon rod bearing platforms, and is used to clamp the edge skin And pull up the edge skin to separate the squared monocrystalline silicon rod and transfer the edge skin to the edge skin discharge area.
  • the clamping and transferring unit includes a side skin clamping mechanism
  • the side skin clamping mechanism includes: a clamping movement mechanism that provides movement in at least one direction; and a liftable At least one clamping component.
  • the clamping assembly includes: a cover body for covering the side skin; and a retractable clamping member disposed inside the cover; the clip A clamping space for clamping the side skin is formed between the holder and the cover body.
  • the clamping assembly includes: an arc-shaped plate; and a retractable clamping member, and a clamping place is formed between the clamping member and the arc-shaped plate. The clamping space of the side skin.
  • the wire cutting device includes at least two cutting wheel sets corresponding to the number of silicon rod bearing platforms, and each cutting wheel set includes a pair of cutting wheels or two pairs of cutting wheels.
  • Cutting wheel a cutting line segment is formed between two cutting wheels in any pair of cutting wheels; a transition wheel is provided between two adjacent cutting wheel groups, and the wire groove of the transition wheel is connected to the cutting wheel in the cutting wheel group The grooves are in the same plane.
  • the cutting wheel includes a first wire groove and a second wire groove for winding a cutting line, and the cutting wheel uses an automatic groove changing mechanism to transfer the cutting line from the first One wire slot is moved to the second wire slot.
  • the automatic slot changing mechanism includes: a cutting wheel, including a first slot and a second slot for winding the cutting line; a slot changing cylinder, and the cutting wheel Linkage, used to drive the cutting wheel to move along its axial direction to move the cutting line from the first wire groove to the second wire groove, including a barrel body, and mutual communication provided on the barrel body
  • the first rail and the second rail, the drop between the first rail and the second rail corresponds to the slot distance between the first wire groove and the second wire groove;
  • the positioning member is relatively slidably arranged on the The first guide rail or the second guide rail is used for sliding in the first guide rail or the second guide rail to drive the groove changing cylinder to rotate when the groove changing cylinder moves in the axial direction, so as to force the cutting wheel The cutting line is switched from the first slot to the second slot.
  • the multi-station square-out device further includes a silicon rod pressing device, and the silicon rod pressing device and the wire cutting device share the same guide rail.
  • the silicon rod pressing device is provided with a rail locking unit.
  • the second aspect of the application discloses a multi-station cutting method applied to a multi-station square-running device.
  • the multi-station square-running device includes at least two silicon rod bearing tables and a wire cutting device.
  • the table has a rotating mechanism, the wire cutting device includes a cutting line segment or two cutting line segments parallel to each other, and the multi-station cutting method includes the following steps: placing a single crystal silicon rod vertically on a silicon rod carrying table; The wire cutting device is driven down, and one or two cutting lines in the wire cutting device simultaneously cut the single crystal silicon rods carried by the at least two silicon rod supporting tables along the length direction of the single crystal silicon rods in the first direction.
  • the multi-station prescription equipment and its cutting method disclosed in the present application have the beneficial effect that the multi-station prescription equipment and the cutting method of the present application can simultaneously complete the prescription operation of multiple silicon rods, and
  • the cross-section of the silicon rod is rectangular after the square-cutting treatment, and the square-cut silicon rod is a rectangular parallelepiped as a whole and the number of side skins formed is four, which can improve the cutting efficiency of the silicon rod square-cutting and increase the cross-section of the square-cut silicon rod
  • the area also reduces the overall cost and risk of silicon rod prescription.
  • Figure 1a shows a cross-sectional schematic diagram of a silicon rod to be cut which is shaped like a rectangular parallelepiped after being cut by a well-shaped cutting method.
  • Fig. 1b shows a schematic cross-sectional view of a silicon rod to be cut which is a rectangular parallelepiped after being cut by a tick-shaped cutting method.
  • FIG. 2 shows a schematic diagram of the overall structure of an embodiment of the multi-station prescription device of this application.
  • FIG. 3 shows a schematic diagram of the worktable conversion mechanism as a rotating mechanism in an embodiment of the multi-station prescription equipment of this application.
  • Fig. 4a shows a schematic diagram of a state in which the worktable conversion mechanism is a translation mechanism in an embodiment of the multi-station prescription device of this application.
  • Fig. 4b shows another state schematic diagram of the worktable conversion mechanism as a translation mechanism in an embodiment of the multi-station prescription device of this application.
  • FIG. 5 shows a schematic structural diagram of a silicon rod loading and unloading device in an embodiment of the multi-station prescription equipment of this application.
  • Fig. 6 is a top view of Fig. 5.
  • FIG. 7 shows a cross-sectional view of the first clamp of the silicon rod loading and unloading device in an embodiment of the multi-station prescription equipment of the present application.
  • FIG. 8 shows a schematic diagram of the first driving structure of an embodiment of the multi-station prescription device of the present application.
  • FIG. 9 is a schematic diagram showing the structure of a pair of cutting wheels in each cutting wheel group in the wire cutting device in an embodiment of the multi-station prescription equipment of the present application.
  • FIG. 10 shows a schematic diagram of the structure in which each cutting wheel group has two pairs of cutting wheels in the wire cutting device in an embodiment of the multi-station square-making device of the present application.
  • Fig. 11 is a schematic side view of Fig. 10.
  • FIG. 12 shows a schematic diagram of the guide wheel winding in the case where each cutting wheel set has two pairs of cutting wheels in the wire cutting device in an embodiment of the multi-station square-making device of the present application.
  • FIG. 13 is a schematic diagram showing the structure of the automatic slot changing mechanism in an embodiment of the multi-station square-cutting device of the present application arranged on the wire cutting device.
  • FIG. 14 shows a schematic cross-sectional structure diagram of an automatic slot changing mechanism in an embodiment of the multi-station square opening device of the present application.
  • Fig. 15 is a partial enlarged view of part B of Fig. 14.
  • Figures 16a to 16d show the structural schematic diagrams of the movement process of the automatic slot changing mechanism of the multi-station square-opening equipment of this application.
  • FIG. 17 is a schematic diagram showing the structure of a silicon rod pressing device in an embodiment of the multi-station prescription equipment of the present application.
  • FIG. 18 shows a schematic structural diagram of a skin top support mechanism in an embodiment of the multi-station prescription equipment of this application.
  • FIG. 19 shows a schematic structural diagram of a side skin lifting mechanism in an embodiment of the multi-station prescription equipment of the present application.
  • Fig. 20 is a partial enlarged view of part A in Fig. 3.
  • FIG. 21 is a schematic diagram showing the external structure of the side skin clamping mechanism in an embodiment of the multi-station prescription equipment of the present application.
  • FIG. 22 is a schematic diagram showing a cross-sectional structure of the clamping assembly in an embodiment of the multi-station prescription device of the present application.
  • FIG. 23 shows a flowchart of an embodiment of the multi-station cutting method of this application.
  • first, second, etc. are used herein to describe various elements or parameters in some examples, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one or parameter from another or parameter.
  • first wire groove may be referred to as the second wire groove, and similarly, the second wire groove may be referred to as the first wire groove without departing from the scope of the various described embodiments.
  • the first slot and the second slot are both describing a slot, but unless the context clearly indicates otherwise, they are not the same slot. Similar situations also include the first guide rail and the second guide rail, or the first direction and the second direction.
  • A, B or C or "A, B and/or C” means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C” .
  • An exception to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.
  • the existing single crystal silicon rods generally have a cylindrical structure.
  • the silicon rods are squared by a silicon rod square-cutting equipment. Please refer to Figure 1a and Figure 1b.
  • Figure 1a shows the shape of a rectangular parallelepiped after being cut by a well-shaped cutting method.
  • FIG. 1b shows a schematic cross-sectional view of the silicon rod to be cut that is a rectangular parallelepiped after being cut by a Tic-shaped cutting method.
  • the existing silicon rod square-cutting equipment most of the silicon rods are squared into a rectangular parallelepiped (including four vertical cut surfaces and located between two adjacent vertical cut surfaces) by using a Tic-Tac cut method.
  • the chamfered surface is as shown in Figure 1a). Subsequent grinding of the squared silicon rod will consume a large amount of material, and the surface area of the silicon wafer obtained by slicing the silicon rod that has been squared and ground is small. Low power generation efficiency.
  • the cross-sectional area of the silicon rod to be cut is increased.
  • the subsequent grinding operation only the rectangular parallelepiped silicon rod is required
  • the right angles between the four vertical cut surfaces can be polished in a small amount. In this way, the material lost due to the surface grinding is greatly reduced and the surface area of the silicon wafer obtained by slicing the silicon rod that has been pre-cut and polished is larger.
  • the silicon ingot to be cut is squared.
  • Eight side skins are formed on the cutting surface, including four large side skins 10 and four small side skins 11 (as shown in Figure 1b).
  • the four small side skins 11 will mislead the cutting line during the cutting process. , Causing the cutting line to be skewed, and the cutting surface is uneven.
  • the four small side skins are easy to fall due to the too small supporting bottom surface, which is easy to cause problems such as chipping.
  • This application discloses a multi-station squaring equipment, which is used to perform squaring operations on single crystal silicon rods with a circular cross-section (also referred to as silicon rods in this application), including at least two silicon rod bearing platforms and Wire cutting device.
  • the at least two silicon rod bearing platforms are used for bearing the single crystal silicon rods placed vertically, and each of the silicon rod bearing platforms has a rotating mechanism.
  • the wire cutting device is arranged above the at least two silicon rod bearing platforms, and the wire cutting device includes a plurality of cutting wheels and a cutting wire, and the cutting wire is wound around the plurality of cutting wheels to form a cutting line or Two cutting lines parallel to each other.
  • the wire cutting device is driven to descend, and the multiple single crystal silicon rods carried by the multiple silicon rod bearing platforms are simultaneously processed along the length direction by the one or two cutting line segments.
  • Cutting of the side in the first direction after that, the rotating mechanism is used to drive the silicon rod carrier to convert the single crystal silicon rod to the surface to be cut, and the wire cutting device is driven to descend, and the one or two cutting lines are cut
  • the line segment simultaneously cuts the side surfaces of the plurality of single crystal silicon rods carried by the plurality of silicon rod bearing platforms along the length direction thereof in the second direction.
  • the intersection of the cutting line when the wire cutting device cuts the side surface of the single crystal silicon rod in the first direction and the cutting line when cutting the side surface of the single crystal silicon rod in the second direction Located in the cross section of the single crystal silicon rod.
  • the multi-station square rooting equipment of this application is applied to square root cutting operations of silicon rods.
  • the multi-station prescribing equipment of this application can complete the prescribing operation of multiple silicon rods at the same time, and the cross-section of the silicon rods is rectangular after the prescribing process, while the squared silicon rods as a whole are rectangular (only including four vertical Cut surface) and the number of edges formed is four, which can improve the cutting efficiency of the silicon rod square, increase the cross-sectional area of the square silicon rod, and reduce the overall cost and risk of the silicon rod square.
  • FIG. 2 shows a schematic diagram of the overall structure of an embodiment of the multi-station prescription device of this application.
  • the multi-station prescription device further includes a base 20, and the base 20 It is set as the main component of the multi-station prescribing equipment of this application to provide a prescribing work platform.
  • the volume and weight of the base 20 are relatively large to provide a larger mounting surface and a firmer structure. Machine stability.
  • the at least two silicon rod carrying platforms 21 are used to carry silicon rods placed vertically, each of the silicon rod carrying platforms 21 has a rotating mechanism 210, and the rotating mechanism 210 is used to drive the silicon rod carrying platform 21
  • the upper silicon rod rotates to adjust the surface to be cut.
  • the rotating mechanism 210 is configured as a rotating turntable located at the bottom of the silicon rod carrier 21, and the rotating turntable is controlled by a driving device (not shown).
  • the driving device may be, for example, a driving device.
  • the servo motor that rotates the turntable, but not limited to this.
  • the rotating mechanism 210 may adopt a lifting design, that is, the rotating turntable at the bottom of the silicon rod bearing table 21 can be telescoped after being controlled to drive the silicon rod bearing table 21 to move up and down, thereby adjusting The height of the silicon rod to be cut on the silicon rod carrier 21.
  • each silicon rod bearing platform 21 (the supporting surface is the upper surface of the silicon rod bearing platform for A buffer pad is fixed on the supporting silicon rod to be cut, so that the buffer pad is located between the silicon rod supporting table 21 and the silicon rod to be cut when the silicon rod to be cut is placed.
  • the at least two silicon rod bearing platforms 21 are directly arranged on the machine base and arranged in a straight line at intervals in the cutting area.
  • the centers of the supporting silicon rods to be cut are located on the same straight line (as shown in Figure 2).
  • the cutting area is a multi-station square The area where the equipment performs silicon rod cutting. Specifically, the cutting area is, for example, the area below the wire cutting device in the multi-station square-cutting equipment.
  • the multi-station prescription equipment can perform cutting work and loading and unloading work at the same time.
  • Figure 3 shows the workbench conversion mechanism in an embodiment of the multi-station prescription equipment of this application. It is a schematic diagram of the rotating mechanism.
  • the at least two silicon ingot carrying platforms 21 may be arranged on the silicon ingot worktable 22, and the silicon ingot worktable 22 is provided with a worktable.
  • the conversion mechanism 220 is used to drive the silicon rod worktable 21 to perform conversion movement so that the silicon rod bearing table on the silicon rod worktable 21 is converted between the loading and unloading area and the cutting area.
  • the area is the area for loading and unloading in the multi-station prescribing equipment, specifically, for example, the areas corresponding to the two sides of the silicon ingot worktable in the multi-station prescribing equipment.
  • the area on the equipment where the cutting operation of the silicon rod to be cut is performed specifically, for example, the area under the cutting device in the multi-station square-out equipment.
  • the silicon ingot workbench 22 is set on the machine base 20 and is set as at least one, and each silicon ingot workbench 22 is provided with at least two silicon rod bearing platforms 21, and each silicon rod workbench 22 is At least one silicon rod carrier 21 is located in the cutting area, at least one silicon rod carrier 21 is located in the loading and unloading area, and the silicon rod supporting platforms 21 located in the cutting area on each silicon rod workbench 22 are sequentially in a straight line They are arranged sequentially at intervals, so that when the silicon rods to be cut are supported by each silicon rod carrier 21 located in the cutting area, the centers of the supported silicon rods to be cut are on the same straight line.
  • FIG. 1 exemplary embodiment, referring to FIG.
  • silicon ingot workbenches 22 are provided on the machine base, and four silicon ingot carrier platforms 21 are provided on each silicon ingot workbench 22, and each silicon ingot workbench 22 is Two of the silicon ingot loading platforms 21 are located in the cutting area, the other two silicon ingot loading platforms 21 are located in the loading and unloading area.
  • the lines are arranged sequentially and spaced in sequence, but not limited to this.
  • the silicon rod worktable 22 may also be provided with one or more.
  • the worktable conversion mechanism 220 is a rotating mechanism, and the rotating mechanism includes a rotating shaft 2200 and a rotating drive unit (not shown).
  • the rotating shaft 2200 is axially connected to the silicon ingot worktable 22 for driving the rotating shaft 2200 to rotate to drive the silicon ingot worktable 22 to rotate.
  • the rotating shaft 2200 is arranged in the central area of the bottom of the silicon rod table 22 and connected to the base 20.
  • the silicon rod bearing table 21 located in the cutting area and the silicon rod bearing table 21 located in the loading and unloading area rotate relative to each other.
  • the shaft 2200 is centrally symmetric, so that the silicon ingot table 22 can be driven to rotate so that the silicon ingot carrier 21 on the silicon ingot table 22 can be switched between the cutting area and the loading and unloading area.
  • the worktable conversion mechanism 220 is set as a rotating mechanism, the loading and unloading is performed on one side of the multi-station squaring equipment. In actual operations, the silicon rods should be placed in the cutting area and loading and unloading.
  • first rotating the drive unit (such as a common drive motor) drives the rotating shaft 2200 to drive the silicon ingot table 22 to rotate (for example, 180°), so that the silicon ingot carrier 21 originally located in the cutting area is transferred to the loading and unloading area for unloading
  • the new material is loaded, and the silicon rod carrying table 21 originally located in the loading and unloading area is converted to the cutting area for cutting.
  • the rotating mechanism for driving the silicon ingot worktable to rotate may also adopt other methods.
  • the rotating mechanism may also be geared, specifically, a transmission wheel is provided at the bottom of the silicon ingot worktable.
  • a driving wheel meshing with the transmission wheel is provided on the base 20, and the driving wheel is controlled by a rotating drive motor.
  • the driving motor drives the driving wheel to rotate to drive the driven wheel to rotate, so that the silicon rod table 22 follows
  • the driven wheel rotates to drive the silicon rod carrier 21 to switch between the loading and unloading area and the cutting area.
  • FIG. 4a shows a schematic diagram of a state in which the workbench conversion mechanism is a translation mechanism in an embodiment of the multi-station prescription device of this application
  • FIG. 4b shows Another state schematic diagram of the multi-station prescription equipment of the present application in an embodiment of the worktable conversion mechanism is the translation mechanism.
  • the table conversion mechanism 220 is a translation mechanism
  • the translation mechanism includes a translation guide rail 2201, a slider 2202 and a translation drive unit (not shown).
  • the translational guide rail 2201 is laid on the base 20, and the sliding block 2202 is provided at the bottom of the silicon ingot worktable 22 and is adapted to the translational guide rail 2201 to provide translational guidance for the silicon ingot worktable 22.
  • the translation drive unit is used to drive the silicon rod table 22 to move along the translation guide rail 2201 (in the direction of the arrow in FIG. 4a and FIG. 4b) so that the silicon rod carrier 21 on the silicon rod table 22 is at The cutting zone and the loading and unloading zone are switched, and the translation drive unit adopts a cylinder assembly or a screw assembly driven by a motor.
  • the worktable conversion mechanism 220 is a translation mechanism
  • loading and unloading are performed on both sides of the multi-station square-preparation equipment.
  • the silicon rod worktable is located in the cutting area.
  • the translation drive unit drives the silicon rod worktable 22 along Moving in the X direction of the slide rail (in the direction of the arrow in Figure 4a)
  • the silicon rod carrier 21 in the cutting area carries the cut silicon rods and moves to the loading and unloading area on the other side for unloading and loading the silicon rods to be cut, at the same time.
  • the silicon rod bearing table 21 in the side loading and unloading area carries the silicon rod to be cut and moves to the cutting area to cut the silicon rod to be cut (shown in the state shown in Figure 4b), and then the translation drive unit drives the silicon rod worktable 22 to move back along the slide rail ( (Shown in the direction of the arrow in Figure 4b) so that the silicon ingot carrier 21 that has been loaded with silicon ingots to be cut on the other side returns to the cutting area for cutting operations, while the silicon ingot carrier 21 that has completed the cutting operation in the cutting area returns to one
  • the side loading and unloading area continues to unload and load the silicon rods to be cut (shown as position 4a in the figure).
  • the translation mechanism may also be geared.
  • the translation mechanism includes a translation rack and a rotating gear that is driven by a motor and adapted to the translation rack.
  • the rail is arranged at the bottom of the silicon rod worktable, and may be, for example, at least one rack with a certain length.
  • each rack is fitted with at least two rotating gears arranged at intervals. The rotating gear is driven to rotate to drive the silicon rod worktable to move, so that the silicon rod bearing table on the silicon rod worktable is switched between the cutting area and the loading and unloading area.
  • the multi-station prescribing equipment of the present application further includes a silicon rod loading and unloading device, the silicon rod loading and unloading device is adjacent to the silicon rod bearing platform, and further, the silicon rod The rod loading and unloading device is arranged on one side or opposite sides of the silicon rod worktable, and is used to load the silicon rods to be cut in the loading area onto the silicon rod bearing platform located in the loading area on the silicon rod worktable to remove the silicon rods.
  • the worktable sends the silicon rods to be cut to the cutting area for cutting, and transfers the cut silicon rods transferred from the cutting area to the loading and unloading area by the silicon rod worktable to the holding area to unload the cut silicon rods.
  • the silicon rod loading and unloading device is arranged on one side of the silicon rod worktable, and the worktable conversion mechanism of the silicon rod worktable is the above-mentioned rotating mechanism at this time.
  • the silicon rods are loaded and unloaded on one side; in another embodiment, the silicon rod loading and unloading devices are arranged on both sides of the silicon rod worktable, and the worktable conversion mechanism of the silicon rod worktable is as described above.
  • the translation mechanism is used for loading and unloading silicon rods on both sides of the silicon rod worktable. It is easy to understand that the storage area is an area adjacent to the multi-station prescribing equipment and used to place or store the silicon rods to be cut and the silicon rods that have been cut.
  • FIG. 5 shows a schematic structural diagram of a silicon rod loading and unloading device in an embodiment of the multi-station prescription equipment of this application.
  • FIG. 6 shows the top view of FIG. 5 and FIG. A cross-sectional view of the first clamp of the silicon rod loading and unloading device in an embodiment of the station preparation equipment.
  • the silicon rod loading and unloading device is arranged on a bottom mounting structure, and the bottom mounting structure is protruding from the machine base.
  • the silicon rod unloading device includes a reversing carrier 230, a first clamp, and a second clamp.
  • the reversing carrier 230 is used for reversing movement.
  • the first and second clamps are arranged on the reversing carrier. 230.
  • the first clamp and the second clamp arranged on the reversing carrier 230 can be switched between the storage area and the loading and unloading area to transfer and hold the cut silicon rod and the waiting area. Cutting silicon rod.
  • the reversing carrier 230 is arranged on the bottom mounting structure and can perform reversing movement relative to the bottom mounting structure.
  • the reversing carrier 230 realizes reversing movement through a reversing mechanism.
  • the reversing mechanism may include a rotating shaft and a reversing motor, and the reversing carrier 230 is connected to the bottom mounting structure thereunder through the rotating shaft.
  • the reversing motor is activated to drive the rotating shaft to rotate to drive the reversing carrier 230 to rotate to realize the reversing movement.
  • the aforementioned driving rotation shaft rotation can be designed to be unidirectional rotation or bidirectional rotation.
  • the unidirectional rotation can be, for example, clockwise rotation or counterclockwise rotation
  • the bidirectional rotation can be, for example, clockwise rotation and counterclockwise rotation
  • the angle at which the rotating shaft is driven can be set according to the actual structure of the silicon rod loading and unloading device.
  • the actual structure of the silicon rod loading and unloading device may be, for example, the angle at which the rotating shaft rotates according to the distance between the storage area and the loading and unloading area.
  • the structure of the reversing carrier 230 The center position of the reversing base in the reversing carrier 230 is connected to the rotating shaft.
  • the shape of the reversing base can be a disk structure, but it is not limited to this, and it can also be a square disk or an oval disk.
  • the first clamp is set in the first clamp area of the reversing carrier 230 for clamping the silicon rod to be cut, and the second clamp is set in the second clamp area of the reversing carrier 230 for holding Cutting the silicon rod.
  • the first clamping area and the second clamping area can be set according to the actual device structure.
  • the first clamping area and the second clamping area are two locations that are set back in the reversing carrier 230
  • the first clamping area and the second clamping area can be 180° apart, so that the storage area and the loading and unloading area are connected in a line (of course, it can also be understood that: the storage area and the loading and unloading area are connected in a line and are located on the reversing carrier. Therefore, the first clamp area used to set the first clamp and the second clamp area used to set the second clamp in the reversing carrier 230 can be different by 180°). In this way, when the reversing load After the tool 230 is rotated by 180°, the first clamp and the second clamp can exchange positions.
  • first clamping area and the second clamping area can also be different by 90°, for example.
  • first clamp area and the second clamp area may be different from any position within a suitable range, as long as there is no unnecessary interference between the first clamp area and the second clamp area.
  • the first clamp further includes a first clamp mounting member 231 and at least two first clamping members 232, wherein the at least two first clamping members 232 are spaced apart from the first clamp mounting member 231 for clamping the Cutting the silicon rod.
  • the aforementioned silicon rods to be cut on the silicon rod carrier are placed upright, therefore, at least two first clamping members 232 are vertically spaced apart from the first clamp mounting member 231, that is, At least two first clamping members 232 are arranged up and down.
  • any of the first clamping members 232 further includes: a first clamping arm mounting seat 2320 and at least two first clamping arms 2321, wherein the first clamping arm mounting seat 2320 is installed on the first clamp On the member 231, at least two first clamping arms 2321 are movably arranged on the first clamping arm mounting seat 2320.
  • the first clamping member 232 is a circular workpiece clamp as a whole, and the first clamping arm 2321 constituting the first clamping member 232 is symmetrical Two, a single first clamping arm 2321 is designed to have an arc-shaped clamping surface.
  • the arc-shaped clamping surface of a single first clamping arm 2321 is more than a quarter of the arc, so that the two The arc clamping surface of the first clamping member 232 formed by the first clamping arms 2321 is more than half of the arc.
  • the curved clamping surface of the first clamping arm 2321 can be additionally provided with a buffer pad to avoid damage to the surface of the silicon rod to be cut during the process of clamping the silicon rod to be cut, and to protect the silicon rod to be cut.
  • the center of the clamping space formed by the two first clamping arms 2321 coincides with the center of the silicon rod to be cut.
  • the two first clamping arms 2321 in the first clamping member 232 contract, and the first clamping arm 2321 The arc-shaped clamping surface abuts against the silicon rod to be cut.
  • the silicon rod to be cut is pushed by the two first clamping arms 2321 on both sides and moves toward the central area of the clamping space until the silicon rod to be cut is The two first clamping arms 2321 in the first clamping member 232 are clamped. At this time, the center of the silicon rod to be cut can be located at the center of the clamping space of the first clamping member 232.
  • the first clamping member 232 further includes a first clamping arm driving mechanism , Used to drive at least two first clamping arms 134 to open and close.
  • the first clamping arm driving mechanism further includes: a first opening and closing gear 2322, a first gear driving member 2323, and a first driving source 2324.
  • the first opening and closing gear 2322 is arranged on the corresponding first clamping arm 2321.
  • the first gear driving member 2323 has a tooth pattern meshing with the first opening and closing gear 2322 on the first clamping arm 2321.
  • the first driving source 2324 is connected to the first gear driving member 2323 for driving the first gear driving member 2323 to move.
  • the first gear driving member 2323 is a first rack
  • the first rack is located in the middle of the two first clamping arms 2321, and the first clamping arms of the first rack facing on both sides respectively
  • the two outer surfaces of 2321 are respectively provided with tooth patterns corresponding to the first opening and closing gears 2322 on the two first clamping arms 2321
  • the first driving source 2324 may be, for example, a driving motor or a cylinder.
  • the first opening and closing gear 2322 meshed on both sides is driven by the first rack to make an external rotation.
  • the first opening and closing gear 2322 drives the first clamping arm 2321 during the external rotation (the first opening and closing gear 2322 and the first clamping arm 2321 can be lowered through the shaft connection) to switch from the loosening state to the clamping state; on the contrary, when the first clamping arm 2321 needs to be loosened, it is driven by the drive motor (or cylinder) as the first drive source 2324.
  • the first rack of the first gear driving member 2323 moves downward, and the first opening and closing gear 2322 meshed on both sides is driven by the first rack to perform internal rotation.
  • the first opening and closing gear 2322 drives the first clamp during internal rotation.
  • the arm 2321 (the first opening/closing gear 2322 and the first clamping arm 2321 can be connected by a rotating shaft) performs an upward movement to turn from the clamping state to the releasing state.
  • the foregoing is only an embodiment, and is not used to limit the working state of the first clamping member 232.
  • the aforementioned “upward”, “external rotation”, “downward”, “downward” and “internal rotation” ",” “up”, and “released” and “clamped” state changes can be changed according to the structure and operation mode of the first clamp arm 2321, and the structure of the first clamp arm drive mechanism.
  • the silicon rods to be cut are formed by cutting the original long silicon rods, which will inevitably make the size difference between the silicon rods to be cut very different.
  • the first clamp is used for Clamp the silicon rod to be cut in the upright state. Therefore, for the first clamp, the influence of the aforementioned size difference is mainly reflected in the difference in the length of the silicon rod to be cut on the first clamp in the first clamp. Whether the holding member 232 can hold the silicon rod to be cut corresponding to the hidden worry.
  • the first clamping member 232 In order to reduce or even avoid the risk that the first clamping member 232 may not be able to clamp the silicon rod to be cut, the first clamp has different design solutions.
  • the first clamp adopts a fixed clamping member, that is, as many first clamping members 232 are fixed vertically on the reversing carrier 230, and these first clamping members
  • the distance between two adjacent first clamping members 232 in the member 232 is as small as possible, so that the use of these first clamping members can cover silicon rods to be cut of various specifications and lengths.
  • the more first clamping members 232 on the reversing carrier 230 are used for clamping; if the length of the silicon rod to be cut is shorter, the reversing carrier 230 is used.
  • the fewer first clamping members 232 participate in the clamping, for example, several first clamping members 232 located below participate in the clamping, and the first clamping members located above and higher than the silicon rod to be cut 232 does not participate.
  • the first clamp adopts a movable clamp, that is, the first clamp 232 is vertically movably arranged on the first clamp area of the reversing carrier 230, because the first clamp It is a movable design, therefore, the number of the first clamping members 232 can be greatly reduced, and generally two or three are sufficient. In this way, the use of movable clamps can cover silicon rods to be cut of various specifications and lengths.
  • the first clamp mounting part 231 in the first clamp can be used to guide the movable setting.
  • the guiding function of the first clamping member 232 can be realized in a manner that the first clamp mounting member 231 can adopt a guide post structure, and the first clamp arm mounting seat 2320 can adopt a movable block structure sleeved on the guide post structure.
  • the guide column structure as the first clamp mounting member 231 includes two guide columns arranged vertically and in parallel, and the movable block structure as the first clamp arm mounting seat 2320 is provided with the guide column Two through holes or two clips corresponding to the two guide posts in the structure. If a through hole is used, the movable block is sleeved on the guide post and can slide along the guide post. If a clip is used, the movable block can be clipped to the guide post and can slide along the guide post. In practical applications, the clip can be clipped to at least half of the guide post section.
  • the movable design of the first clamping member 232 may be provided with a first guiding and driving mechanism.
  • the first guide driving mechanism can drive the movable first clamping member 232 to move up and down along the first clamp mounting member 231.
  • the first guide driving mechanism may include, for example, a first guide screw 2325 and a first guide motor 2326, wherein the first guide screw 2325 is arranged upright, and one end of the first guide screw 2325 is connected On the first clamp arm mounting seat 2320, the other end of the first guide screw 2325 is connected to the first guide motor 2326.
  • the first guide motor 2326 can be arranged on the top of the reversing carrier 230, but is not limited to this. .
  • the two first clamping members 232 are both movable in design, so that in practical applications, they can be adjusted by the movement of the two first clamping members 232 of movable design.
  • the first guide driving mechanism can be arranged in the two second On one of the clamping members 232, or on the two first clamping members at the same time.
  • the first clamping member 232 above the two first clamping members 232 is provided with a first guide driving mechanism.
  • the first of the two first clamping members 232 A clamp arm mounting seat 2320 and the first clamp mounting member 231 are movably connected, that is, the first clamp arm mounting seat 2320 and the first clamp arm 2321 on any one of the first clamp members 232 are along the first The clamp mounting member 231 can move up and down.
  • the first guide driving mechanism provided includes a first guide screw 2325 and a first guide motor 2326. One end of the first guide screw 2325 is connected to the upper first clamping member.
  • the other end of the first guide screw 2325 is connected to the first guide motor 2326, and the first guide motor 2326 can be arranged on the top of the reversing carrier 230.
  • the first guide motor 2326 drives the first guide screw 2325 to rotate, and the first guide screw 2325 drives the first clamping member 232 along the The first clamp mounting member 231 moves up and down.
  • the first guide motor 2326 drives the first guide screw 2325 to rotate clockwise, which drives the upper first clamping member 232 to move upward along the first clamp mounting member 231 to move away from below
  • the first clamping member 232 increases the clamping distance between the two first clamping members 232; the first guide motor 2326 drives the first guide screw 2325 to rotate in the reverse direction, and then drives the upper first clamping member 232 along
  • the clamping distance between the two first clamping members 232 is reduced.
  • the clamping distance between the two first clamping members 232 can be adjusted, thereby effectively clamping the silicon rods 101 to be cut with different specification lengths.
  • the first guide driving mechanism can not only adjust the clamping distance between the two first clamping members 232, to adjust the length of different specifications.
  • the purpose of lifting and lowering the silicon rod 101 to be cut can also be realized.
  • the drive The first clamping member 232 moves up and down to lift the silicon rod 101 to be cut.
  • the upper first clamping member 232 moves up and down along the first clamp mounting member 231 through the first guide driving mechanism.
  • the clamping distance with the lower first clamping member 232 is adjusted; then, the first clamping arm drive mechanism in each first clamping member 232 is used to drive the corresponding two first clamping arms 2321 for clamping action To smoothly and firmly clamp the silicon rod 101 to be cut; then, the upper first clamping member 232 is driven by the first guide driving mechanism to move upward along the first clamp mounting member 231.
  • the clamped silicon rod 101 to be cut and the lower first clamping member 232 move upward together, wherein the clamped silicon rod 101 to be cut moves upward using the upper first clamping member
  • the friction force between 232 and the silicon rod 101 to be cut, the upward movement of the first clamping member 232 utilizes the friction force between the silicon rod 101 to be cut and the first clamping member 232 below, so as to achieve lifting The effect of the silicon rod 101 to be cut.
  • the upper first clamping member 232 is driven by the first guide driving mechanism to drive the silicon rod 101 to be cut and the first clamping member 232 below it to move downward in the same process, so as to realize the lowering of the silicon rod 101 to be cut. The effect will not be repeated here.
  • a first guide driving mechanism is provided on the lower first clamping member 232 of the two first clamping members 232, the structure and arrangement of the first guide driving mechanism and The driving mode is similar to the first guide driving mechanism of the upper first clamping member 232, for example, the lower first clamping member 232 is driven by the first guide driving mechanism up and down along the first clamp mounting member 231 Move to adjust the clamping distance with the upper first clamping member 232, and the lower first clamping member 232 is driven by the first guide driving mechanism to drive the to-be-cut silicon rod 101 and the upper first clamping The pieces 232 move up and down along the first jig mounting piece 231 together.
  • the two first clamping members 232 are provided with a first guide driving mechanism, the setting mode and driving mode of the first guide driving mechanism and the movement mode of the two first clamping members 232 need not be mentioned here. No longer.
  • the movable first clamping member 232 moves up and down along the first clamp mounting member 231 to adapt to the silicon rods to be cut of different specifications and lengths for clamping, except that the first clamping member 232 uses movable
  • the first clamping member 232 needs to be provided with a first guiding drive mechanism, etc., it is bound to know the specification length of the silicon rod to be cut that needs to be clamped currently.
  • the workpiece transfer device in the present application may also include a height detector (not shown in the figure) for the height of the silicon rod to be cut that is placed upright, so as to serve as a movable first clamp The member 232 subsequently moves upward or downward along the first fixture mounting member 231 and the basis of the moving distance.
  • the cross-section of the cut silicon rod in this application is rectangular, so the structure of the second clamp is similar to that of the first clamp.
  • the structure is the same, including a second clamp mounting member 233 and at least two second clamping members 234.
  • Any second clamping member 234 further includes: a second clamping arm mounting seat 2340 and at least two second clamping arms 2341, wherein ,
  • the second clamping arm mounting seat 2340 is arranged on the second clamp mounting member 233, and at least two second clamping arms 2341 are movably arranged on the second clamping arm mounting seat 2340.
  • the second clamp of the second clamp is a square workpiece clamp as a whole.
  • the second clamp arms 2341 that make up the second clamp 234 are two symmetrically designed, a single second clamp
  • the arm 2341 is designed to have a single straight clamping surface (see FIG. 5 and FIG. 6), and other structures of the second clamp are not repeated here.
  • the wire cutting device is arranged above the at least two silicon rod carrying tables 21 for cutting silicon rods to be cut.
  • the wire cutting device It includes a cutting frame 24 and a wire cutting unit 25.
  • the wire cutting unit 25 is supported by the cutting frame 24 above the at least two silicon rod bearing tables 21, and the cutting frame 24 is fixed to the base 20 on.
  • the cutting frame 24 includes two supporting columns 240 arranged opposite to each other, and a mounting frame 241 straddling opposite sides of the two supporting columns.
  • the mounting frame 241 is used to place the wire cutting unit. 25 is driven by the first drive mechanism to rise and fall to perform cutting operations.
  • lifting rails 242 are provided on opposite sides of the two support columns.
  • the frame 241 is provided with a sliding block (not given reference numerals) matching the lifting rail 242, and the first driving mechanism drives the mounting frame 241 to drive the wire cutting unit 25 to rise and fall along the lifting rail 242 to perform Cutting operation of silicon rods to be cut.
  • the first driving mechanism is configured as a cylinder assembly or a screw assembly.
  • FIG. 8 shows a schematic diagram of the first driving structure in an embodiment of the multi-station prescribing equipment of this application.
  • the first driving mechanism is configured as a screw assembly, and the screw assembly includes With the screw rod 243 and the motor 244, one end of the screw rod 243 is connected with the mounting frame 241, and the other end is connected with the motor 244 and driven by the motor 244 to drive the mounting frame 241 up and down.
  • the first driving mechanism may also be a cylinder assembly.
  • the wire cutting unit 25 includes a plurality of cutting wheel sets 251 corresponding to the number of the silicon rod bearing tables 21, and each cutting wheel set 251 includes a pair of cutting wheels or two pairs of cutting wheels, A cutting line segment is formed between two cutting wheels in any pair of cutting wheels, and a transition wheel 252 is provided between two adjacent cutting wheel sets 251.
  • the wire groove of the transition wheel 252 is connected to the cutting wheel set 251.
  • the grooves of the cutting wheel are in the same plane.
  • the number of the multiple cutting wheel sets 251 is the same as the number of silicon rod holders 21 located in the cutting area and corresponds to each other one to one. In this way, during the cutting operation, each cutting wheel set 251 cuts the silicon rods to be cut on the corresponding silicon rod carrier 21.
  • the plurality of cutting wheel sets 251 are arranged on the mounting frame 241 in a linear manner.
  • each cutting wheel set includes a pair of cutting wheels, a pair of cutting wheels in each cutting wheel set are sequentially arranged on the same side of the mounting frame, and a pair of cutting wheels in two adjacent cutting wheel sets
  • There is only one transition wheel to guide the cutting line so that a cutting line segment is formed between the two cutting wheels in each pair of cutting wheels, and the wire groove of the transition wheel and the wire groove of the cutting wheel in the adjacent cutting wheel group Located in the same plane, so that the cutting line segments between the two cutting wheels of each cutting wheel set are located on the same straight line.
  • the length of each formed cutting line segment is slightly larger than the diameter of the cross-sectional circle of the silicon rod to be cut.
  • FIG. 9 shows a schematic structural diagram of a pair of cutting wheels in each cutting wheel set in the wire cutting device in an embodiment of the multi-station square preparation equipment of this application, as shown in the figure, the wire cutting unit includes four cutting wheel sets Take the winding description as an example.
  • the four cutting wheel groups are the first cutting wheel group 251a, the second cutting wheel group 251b, the third cutting wheel group 251c, and the fourth cutting wheel group 251d.
  • the first cutting wheel group 251a A first transition wheel 252a is provided between the second cutting wheel group 251b, a second transition wheel 252b, a third cutting wheel group 251c, and a fourth cutting wheel group 251c are provided between the second cutting wheel group 251b and the third cutting wheel group 251c.
  • a third transition wheel 252c is arranged between the wheel sets 251d, and a single continuous cutting line is used to sequentially wrap around a pair of cutting wheels of the first cutting wheel set 251a, thereby forming a pair of cutting wheels on the first cutting wheel set 251a
  • the first cutting line segment L10 is then wound around the first transition wheel 252a to guide the cutting line, and then sequentially wound around the pair of cutting wheels of the second cutting wheel set 251b, on the pair of cutting wheels of the second cutting wheel set 251b
  • a second cutting line segment L20 is formed, and then the cutting line is guided by the second transition wheel 252b, and then the pair of cutting wheels of the third cutting wheel group 251c are sequentially wound on the pair of cutting wheels of the third cutting wheel group 251c
  • the third cutting line segment L30 is formed, and finally the cutting line is guided by the third transition wheel 252c, and then the fourth cutting line segment L40 is formed on a pair of cutting wheels of the fourth cutting wheel set 251d in sequence, and then the line
  • the wire cutting unit performs a down-cutting process, which can simultaneously complete the cutting of one axis section of the four silicon rods to be cut.
  • the cutting process of four axis sections is required.
  • the silicon ingot carrier 21 needs to be rotated (90 degrees each time) through the rotation mechanism 210 of the silicon ingot carrier 21 to adjust the to-be-cut surface of the silicon ingot to be cut. Ensure that the squared silicon rod is in the shape of a rectangular parallelepiped.
  • the intersection of the cutting line when the wire cutting unit performs four single-axis cuts on the silicon rod is located within the cross-sectional circle of the silicon rod to be cut (including the case where the intersection is located on the circumference of the cross-sectional circle ).
  • each cutting wheel set includes two pairs of cutting wheels, the two pairs of cutting wheels in each cutting wheel set are respectively arranged on opposite sides of the mounting frame, and the mounting frame is also provided with a guide wheel set Reversing the cutting line to guide the cutting line from the cutting wheel on one side of the mounting frame to the cutting wheel on the other side of the mounting frame.
  • a transition wheel set is provided between two adjacent cutting wheel sets to guide the cutting line ,
  • the transition wheel set includes two transition wheels, one of which guides a pair of cutting wheels in two adjacent cutting wheel sets, and the other transition wheel pair is the other pair of two adjacent cutting wheel sets
  • the cutting wheel is guided so that a cutting line is formed between the two cutting wheels in any pair of cutting wheels, and the wire groove of the transition wheel on the same side and the wire groove of the cutting wheel are located in the same plane to make multiple cutting wheel sets
  • the cutting line segments between the two cutting wheels located on the same side are located on the same straight line.
  • the length of each formed cutting line segment is slightly larger than the diameter of the cross-sectional circle of the silicon rod to be cut.
  • FIG. 10 shows a schematic diagram of the structure in which each cutting wheel set has two pairs of cutting wheels in the wire cutting device in an embodiment of the multi-station square preparation device of the present application.
  • FIG. 11 shows the structure of FIG. 10 Side structure diagram
  • FIG. 12 shows a schematic diagram of guide wheel winding when each cutting wheel group has two pairs of cutting wheels in the wire cutting device in an embodiment of the multi-station square preparation device of the present application.
  • the wire cutting device in the figure includes four cutting wheel sets as an example for winding description.
  • the four cutting wheel sets are the first cutting wheel set 251a, the second cutting wheel set 251b, the third cutting wheel set 251c, and the second cutting wheel set.
  • a first transition wheel group is provided between the first cutting wheel group 251a and the second cutting wheel group 251b
  • a second transition wheel group is provided between the second cutting wheel group 251b and the third cutting wheel group 251c Group
  • the cutting line is a single continuous cutting line
  • there is also a guide wheel group 253 between the two sides of the mounting frame The direction of the cutting line is reversed to guide the cutting line from the cutting wheel on one side of the mounting frame 241 to the cutting wheel on the other side of the mounting frame 241.
  • the cutting line is wound from one side of the mounting frame, and the cutting line is sequentially wound around the pair of cutting wheels 251a' of the first cutting wheel set 251a, thereby forming the first cutting wheel 251a' of the first cutting wheel set 251a.
  • a cutting line segment L11 is then passed around a transition wheel 252a' in the first transition wheel group to guide the cutting line, and then sequentially wound around a pair of cutting wheels 251b' of the second cutting wheel group 251b.
  • a second cutting line segment L21 is formed on a pair of cutting wheels 251b' of the group 251b, and then a transition wheel 252b' in the second transition wheel group is passed around to guide the cutting line, and then a third cutting wheel group 251c is sequentially wound.
  • a third cutting line segment L31 is formed on a pair of cutting wheels 251c′ of the third cutting wheel group 251c, and finally a transition wheel 252c′ in the third transition wheel group is guided around the cutting line
  • the fourth cutting line segment L41 is formed on the pair of cutting wheels 251d' sequentially wound around the fourth cutting wheel group 251d, the cutting line then passes through the guide wheels 253a, 253b, and 253c in the guide wheel group 253 in turn.
  • the cutting line is guided from a pair of cutting wheels 251d′ of the fourth cutting wheel set 251d on one side of the mounting frame 241 to another pair of cutting wheels 251d′′ in the fourth cutting wheel set 251d on the other side of the mounting frame 241, and cut After the wire forms the fifth cutting line segment L42 on the other pair of cutting wheels 251d" in the fourth cutting wheel group 251d, it then goes around the other transition wheel 252c" in the third transition wheel group to guide the cutting line and then follow it.
  • the eighth cutting line segment L12 is formed on the other pair of cutting wheels 251a of the first cutting wheel set 251a, and then the line exits.
  • the first cutting line segment L11 and the eighth cutting line segment L12 are the two cutting line segments of the first cutting wheel set
  • the second cutting line segment L21 and the seventh cutting line segment L22 are the two cutting line segments of the second cutting wheel group
  • the third cutting line segment L31 and the sixth cutting line segment L32 are the two cutting line segments of the third cutting wheel group.
  • the fourth cutting line segment L41 and the fifth cutting line segment L42 are the two cutting line segments of the fourth cutting wheel set, and the two cutting line segments of each cutting wheel set are used to cut two parallel axis cut surfaces of the silicon rod to be cut.
  • the wire cutting unit performs a down-cutting, and can complete four to-be-cuts at the same time
  • the process of two parallel-axis sections is required to be performed twice in the completion of a square extraction operation.
  • the rotation mechanism of the silicon rod bearing table is used The silicon rod carrier is rotated (rotated by 90 degrees) to adjust the to-be-cut surface of the silicon rod to be cut.
  • the horizontal distance between the grooves of the two pairs of cutting wheel sets of the cutting wheel set is less than or equal to the side length of the square inscribed in the cross section of the silicon rod to be cut , So as to ensure that the intersection of the cutting line when the wire cutting unit performs two horizontal-axis cuts on the silicon rod is located within the cross-sectional circle of the silicon rod to be cut (including the case where the intersection is located on the circumference of the cross-sectional circle).
  • the wire cutting device further includes a wire take-up barrel 255 and a wire pay-off barrel 254 arranged on the machine base 20.
  • the wire take-up barrel 255 and the wire pay-off barrel 254 is used to retract and unwind the cutting line in the square-out operation.
  • the wire cutting device can be used to perform square cutting on the silicon rod to be cut to form the cut silicon rod and the edge skin. After the on-line cutting device is used for a long time, the wire groove around the cutting line in the cutting wheel will be worn, which affects the cutting effect. Therefore, the cutting wheel of the general wire cutting device is equipped with multiple wire grooves, and it is necessary to change the groove. The cutting wire is changed to other wire grooves of the cutting wheel. At this time, it is necessary to follow the groove of the other wire groove and the current wire groove. Distance, adjust the moving distance of the cutting wheel.
  • the multi-station square-opening equipment also includes an automatic slot changing mechanism.
  • Figure 13 shows a schematic structural view of the automatic slot changing mechanism in an embodiment of the multi-station opening device of this application provided on the wire cutting device
  • Figure 14 shows the multi-station opening device of this application.
  • the automatic slot changing mechanism 29 includes a cutting wheel 290, a slot changing cylinder 292, and a positioning member 291.
  • the cutting wheel includes a first slot and a second wire for winding the cutting line.
  • the slot changing cylinder 292 includes a cylinder body, and a first guide rail 293 and a second guide rail 294 connected to each other opened on the cylinder body.
  • the height difference between the first guide rail 293 and the second guide rail 294 corresponds to the The groove distance between the first and second wire grooves
  • the positioning member 291 is relatively slidably arranged in the first guide rail 293 or the second guide rail 294, and is used to move the groove changing cylinder 292 along the axis
  • sliding in the first guide rail 293 or the second guide rail 294 drives the slot changing cylinder 292 to rotate, so as to force the cutting line on the cutting wheel 290 to switch from the first slot to the second slot .
  • FIG. 15 is a partial enlarged view of part B of FIG. 14.
  • the automatic slot changing mechanism will be described in detail below by taking the cutting wheel including two wire slots as an example.
  • the cutting wheel 290 includes a first wire groove and a second wire groove (not shown) for winding a cutting wire.
  • the cutting wheel 290 includes a first wire groove and a second wire groove.
  • the direction of the arrow shown in FIG. 14 is the front, and the direction opposite to the arrow is the rear.
  • the cutting wire is initially wound around the first slot.
  • the second wire slot is located on the rear side of the first wire slot and is adjacent to the first wire slot.
  • the slot changing cylinder 292 is linked with the cutting wheel 290, and is used to drive the cutting wheel 290 to move along its axial direction to move the cutting line from the one slot to another adjacent slot
  • the slot changing cylinder 292 includes a cylinder body and a first guide rail 293 and a second guide rail 294 communicating with each other opened on the cylinder body, and the drop between the first guide rail 293 and the second guide rail 294 corresponds to the The slot distance between the first slot and the second slot.
  • the positioning member 291 is relatively slidably disposed in the first guide rail 293 or the second guide rail 294, and is used to move the groove changing cylinder 292 along the axial direction on the first guide rail 293 or the second guide rail 294.
  • the inner slippage drives the slot changing cylinder 292 to rotate, so as to force the cutting line on the cutting wheel 290 to switch from the first slot to the second slot.
  • the slot changing cylinder 292 is arranged on the mounting frame 241 of the cutting frame 24, a positioning shaft (not shown) is arranged at the front end of the slot changing cylinder 292, and the cutting wheel 290 passes A bearing is rotatably arranged on the positioning shaft, and the groove changing cylinder 292 moves along its axial direction to drive the cutting wheel 290 to move along its axial direction to move the cutting line from the first groove to the second groove .
  • the slot changing cylinder 292 is driven by a driving device 295 to move along its axial direction.
  • the driving device 295 includes a cylinder assembly or a screw assembly driven by a motor.
  • the driving device 295 is configured as an air cylinder assembly.
  • the air cylinder assembly includes an air cylinder and a telescopic rod driven by the air cylinder.
  • the rear end of the slot changing cylinder 292 is arranged on the telescopic rod through a bearing, so that the slot changing The cylinder 292 can be pushed by the cylinder assembly to move along its axial direction and can also rotate under force.
  • it is not limited to this.
  • the driving device 295 may also be a screw assembly driven by a motor, and the rear end of the slot changing cylinder 292 is disposed on the screw assembly through a bearing.
  • the motor drives the screw assembly to extend or retract so that the slot changing cylinder 292 moves along its axial direction and can rotate under force at the same time.
  • the moving distance of the cutting wheel 290 is adjusted every time the slot distance between the first wire slot and the second wire slot. Therefore, the drop H between the first rail 293 and the second rail 294 corresponds to The slot distance between the first wire groove and the second wire groove
  • the first guide rail 293 has a first seating end 2930, and the first seating end 2930 is connected to the first
  • the wire slot has a first distance
  • the second guide rail 294 has a second landing end 2940
  • the second landing end 2940 and the second wire slot have a second distance
  • the first distance is equal to the second distance.
  • the drop H between the first guide rail 293 and the second guide rail 294 is equal to the slot distance between the first wire groove and the second wire groove.
  • the first seating end A transition end 296 is provided between 2930 and the second seating end 2940.
  • the first seating end 2930 and the transition end There is an upward section 297 between 296 to provide an upward passage for the positioning member 291, and a downward section 298 between the transition end 296 and the second positioning end 2940 to provide a downward passage for the positioning member 291.
  • the upward section 297 is in a contracted state from the direction of the first landing end to the direction of the transition end
  • the downward section 298 is in a contracted state from the direction of the transition end to the second landing end.
  • the transition end 296 has a first passage 2960 connected to the upward section 297, and the transition end 296 has a first passage 2960 connected to the downward section 297.
  • the second channel 2961, the width of the first channel 2960 is smaller than the second channel 2961.
  • the positioning member 291 In order to prevent the positioning member 291 from sliding back at the transition end 296, that is, the positioning member 291 cannot smoothly slide along the first channel 2960 of the transition end 296 to the second channel 2961 of the transition end 296 into the down section 298, and the transition end 296
  • the first channel 2960 enters the upward section 297 and returns to the first seating end 2930, making it impossible to realize automatic slot change.
  • the apex of the transition end 296 near the cutting wheel 290 is located in the second channel 2961, which means that the horizontal distance between the first channel 2961 and the cutting wheel 290 is greater than that between the second channel 2961 and the second channel 2961.
  • the horizontal distance between the cutting wheels 290 is such that the positioning member 291 slides from the first channel 2960 to the second channel 2961 in an upward slope with a slope, so that the slot changing cylinder 292 moves backward along its axial direction.
  • the positioning member 291 slides from the first channel 2960 to the second channel 2961 while driving the slot changing cylinder 292 to rotate to realize the switching of the positioning member from the first guide rail 293 to the second guide rail 294.
  • the projection of the vertex of the first seating end 2930 away from the cutting wheel 290 is located in the upward section 297.
  • the positioning member 291 is fixedly connected to a fixing seat 299, and the fixing seat 299 is connected to the mounting frame 241 of the wire cutting device of the multi-station cutting equipment, and is used to set the positioning member 291 on the first Inside the guide rail 293 or the second guide rail 294.
  • the fixing seat 299 is set as a cover covering the groove changing cylinder 292, one end of the positioning member 299 is fixed on the wall of the groove changing cylinder 292, and the other end extends into the In the first guide rail 293 or the second guide rail 294, when the slot changing cylinder 292 is driven to move along its axial direction, the positioning member 291 slides in the first guide rail 293 or the second guide rail 294.
  • the fixing seat 299 is not limited to this.
  • the fixing seat 299 can also be configured as a fixing rod placed in the slot changing cylinder 292, and one end of the positioning member 291 is connected to the The other end of the outer wall of the fixed rod extends into the first guide rail 293 or the second guide rail 294.
  • the positioning member 291 is positioned on the first guide rail 293 or the second guide rail 294. Sliding inside the two guide rails 294.
  • Figures 16a to 16d show the structural schematic diagrams of the movement process of the automatic slot changing mechanism of the multi-station square-opening equipment of this application.
  • the cutting line is initially located at the first position of the cutting wheel 290 In a wire slot
  • the positioning member 291 is located at the first seating end 2930 of the first guide rail 293 (as shown in FIG. 16a).
  • First drive the slot changing cylinder 292 to move back along its axial direction (in the direction of the arrow in FIG. 16a) so that the positioning member 291 enters the ascending section 297 from the first position 2930 and ascends to the first passage 2960 of the transition end.
  • the cutting wheel includes two wire grooves, a first wire groove and a second wire groove, respectively, and the groove changing cylinder is provided with two guide rails, a first guide rail and a second wire groove, respectively.
  • the cutting wheel includes three wire grooves.
  • the cutting wheel includes a third wire groove in addition to the first wire groove and the second wire groove in the above embodiment. It is adjacent to the rear side of the second wire groove.
  • the number of guide rails provided in the slot changing cylinder is consistent with the number of the wire grooves, and is set to three.
  • the slot changing cylinder is provided with the first guide rail and the second guide rail in the above-mentioned embodiment.
  • a third guide rail is provided, and the third guide rail is connected to the second guide rail and the gap between the third guide rail and the second guide rail corresponds to the slot distance between the second wire groove and the third wire groove, that is, the third guide rail
  • There is a third position end, the third position end and the third wire slot have a third distance, and the third distance is equal to the second distance.
  • the first There is also a transition end between the two positioning ends and the third positioning end.
  • there is an upward section between the second positioning end and the transition end and the upward section has a side wall with a first slope
  • There is a downward section between the transition end and the third landing end and the downward section has side walls with a second slope.
  • the upward section is contracted from the direction of the second landing end to the transition end. In the state, the descending section is in a contracted state from the direction of the transition end to the direction of the third landing end.
  • the transition end In order to guide the positioning member to slide quickly and accurately through the transition end, the transition end has a first passage communicating with the upward section and a second passage communicating with the downward section.
  • the width of the first passage is smaller than that of the second passage. .
  • the positioning member In order to avoid the positioning member from sliding back at the transition end, that is, the positioning member cannot smoothly slide along the first channel of the transition end to the second channel of the transition end to enter the down section, and from the first channel of the transition end into the up section and return to the second section
  • the landing end makes it impossible to move the cutting line from the second slot to the third slot.
  • the apex of the transition end near the cutting wheel is located in the second channel, which means that the horizontal distance between the first channel and the cutting wheel is greater than the horizontal distance between the second channel and the cutting wheel So that the operating state of the positioning member sliding from the first channel to the second channel is an upward slope with a slope, so that when the slot changing cylinder moves backward along its axial direction, the positioning member slides from the first channel at the transition end When reaching the second channel, the slot changing cylinder is driven to rotate to realize the switching of the positioning member from the second guide rail to the third guide rail. Similarly, in order to prevent the positioning member from sliding smoothly to the transition end at the second landing end, the projection of the second landing end away from the apex of the cutting wheel is located in the first channel.
  • the number of wire grooves on the cutting groove may also be 4, 5, and so on.
  • the cutting wheel may also include multiple wire grooves, and the changing
  • the grooved cylinder can also be provided with a plurality of mutually connected guide rails consistent with the number of the wire grooves.
  • the diameter of the grooved cylinder needs to be increased, which will not be repeated here.
  • the silicon rods to be cut have a relatively high self-weight, they can be placed on the silicon rod carrying table through their own weight which is relatively stable. However, in the subsequent silicon rod cutting operations, the silicon rods to be cut will be subjected to wire The pulling action of the cutting line in the cutting unit causes the risk of disturbance, dislocation or even overturning. In order to avoid the occurrence of the above-mentioned various risks, a silicon ingot pressing device capable of lifting motion is also provided above the silicon ingot carrying table located in the cutting area.
  • the silicon ingot pressing device is erected on the lifting rail and is located Above the wire cutting device, that is, the silicon rod pressing device and the wire cutting device share the same lifting rail, and the silicon rod pressing device is used for the silicon rod bearing platform of the cutting area of the wire cutting device When cutting the upper silicon rod to be cut, press the top of the silicon rod to be cut.
  • FIG. 17 shows a schematic structural diagram of a silicon rod pressing device in an embodiment of the multi-station prescription equipment of this application.
  • the silicon rod pressing device 26 includes a pressing support 260 and A pressing unit 261 arranged on the pressing support and corresponding to the silicon rod bearing table 21 located in the cutting area.
  • a sliding block 262 that cooperates with the lifting rail 242 is fixed on the pressing bracket 260, and the pressing bracket 260 is vertically erected on the cutting machine through the cooperation of the sliding block 262 and the lifting rail 242.
  • the pressing unit 261 is arranged on the pressing bracket 260 and can be lifted and lowered with the pressing bracket 260 to release or compress the silicon rod carrier 21 in the cutting area. To be cut on the silicon rod.
  • the pressing unit 261 follows the pressing bracket 260 to descend, which does not guarantee that each pressing unit 261 is pressed tightly.
  • the pressing unit 261 includes a pressing block 2610 and a driving structure for driving the pressing block to move up and down.
  • the driving structure is configured as a cylinder assembly
  • the cylinder assembly includes a cylinder 2611 and a telescopic member 2612 connected to the cylinder
  • the pressure block 2610 is provided at the bottom of the telescopic member 2612 (that is, the telescopic member 2612 faces the
  • the air cylinder 2611 drives the telescopic member 2612 with the pressing block 2610 to move up and down to release or compress the silicon rod to be cut on the silicon rod bearing table 21 in the cutting zone.
  • the silicon rod carrier 21 has a rotating mechanism 210, the silicon rod to be cut located on it can be driven to rotate to adjust the surface to be cut.
  • the pressing block 2610 is connected to the driving structure through a rotating shaft (not shown).
  • a bearing (not shown) is provided at the bottom of the telescopic member 2612 of the cylinder assembly, the pressure block 2610 has a rotating shaft that matches the bearing, and the pressure block 2610 is rotatably installed through the shaft On the bearing of the telescopic member 2612, in this way, when the pressing block 2610 compresses the silicon rod to be cut, the silicon rod bearing table 21 drives the silicon rod to be cut to rotate, and the pressing block 2610 can also rotate with the silicon rod to be cut. .
  • a buffer pad (not shown) can be arranged between the pressure block 2610 and the silicon rod to be cut.
  • the buffer pad is fixed on the pressing surface of the pressure block 2610 (the The pressing surface is the lower surface of the pressing block).
  • the silicon rod pressing device 26 is attached to the mounting frame 241 for installing the wire cutting unit by its own gravity.
  • the upper part moves up and down along the lifting rail 242.
  • the first drive mechanism drives the mounting frame 241 to drive the wire cutting unit 25 to descend along the lifting rail 242, and the silicon rod pressing device 26 is attached to the mounting frame 241 and also descends along the lifting rail 242 to a position On the top of the silicon rod to be cut carried by the silicon rod bearing table 21 in the cutting zone, the drive structure in the pressing unit 261 drives the pressing block 2610 to press the corresponding silicon rod to be cut, and the mounting frame 241 will continue to be driven by the first The mechanism drive brings the wire cutting unit 25 down to perform the cutting operation of the silicon rod to be cut.
  • a rail locking unit 263 is provided on the pressing bracket 260 of the silicon rod pressing device 26, and the rail locking unit 263 is used to position the silicon rod pressing device 26 at a predetermined position on the lifting guide rail 242.
  • the predetermined position is that the pressing unit 261 in the silicon rod pressing device 26 is located above the corresponding silicon rod to be cut. 5cm, but not limited to this, only the pressing unit 261 is located above the corresponding silicon rod to be cut.
  • the guide rail locking unit 263 adopts a pneumatic guide rail locking device.
  • the pneumatic guide rail locking device in this embodiment includes a locking clamp block that cooperates with the lifting guide rail 242 and a drive locking clamp
  • the locking clamp block is set on the pressing bracket 260 in the silicon rod pressing device 26.
  • the cylinder is driven to press
  • the locking clamp block on the tightening bracket hugs the lifting rail 242 to position the silicon rod pressing device 26 at a predetermined position.
  • the pressing unit 261 in the silicon rod pressing device 26 presses its corresponding silicon rod to be cut,
  • the mounting frame 241 continues to be driven to drive the wire cutting unit 25 down to complete the cutting of the silicon rods to be cut.
  • the mounting frame 241 is driven by the first drive mechanism to drive the wire cutting unit 25 up to
  • the air cylinder drives the locking clamp block on the pressing bracket 260 to relax the lifting rail 242 so that the silicon rod pressing device 26 continues to attach to the mounting frame 241 to rise.
  • the silicon rod pressing device 26 is erected on the lifting rail 242 and driven by a second driving mechanism to move up and down along the lifting rail 242, and the second driving mechanism is configured as Cylinder assembly or screw assembly driven by a motor.
  • the first drive mechanism drives the mounting frame 241 to lower the wire cutting unit 25, and when the second drive mechanism drives the silicon rod pressing device 26 down to a predetermined position, the second drive mechanism stops driving the silicon rod pressing device 26
  • the silicon rod pressing device 26 is positioned at a predetermined position to compress the silicon rods to be cut, and the first driving mechanism continues to drive the mounting frame 241 to lower the wire cutting unit 25 carrying the wire cutting unit 25 to complete the cutting of the silicon rods to be cut and complete the silicon rods to be cut
  • the first drive mechanism drives the mounting frame 241 to raise the wire cutting unit 25, and the second drive mechanism drives the silicon rod pressing device 26 to rise.
  • the silicon rod carrier is a mesa structure with a circular cross-section or a rectangular cross-section.
  • the size of the load-bearing surface in contact with the silicon rod in the mesa structure is larger than the cross-section of the silicon rod to be cut after the silicon rod is cut. Therefore, the mesa structure is provided with a section for the cutting line to enter.
  • the cutting groove specifically, the table structure is provided with four cutting grooves for the cutting line segment to enter.
  • the cutting line formed in the cutting device performs a square cut on the silicon rod to be cut carried by the silicon rod bearing table located in the cutting area, and the cutting line reaches the bottom of the silicon rod to be cut At this time, it can continue to descend without hindrance until the silicon rod to be cut is penetrated to achieve complete cutting of the silicon rod to be cut.
  • the structure of the silicon rod bearing platform is not limited to this.
  • the silicon rod bearing table is a mesa structure with a rectangular cross-section, and the size of the supporting surface in contact with the silicon rod in the mesa structure is slightly smaller than that of the squared silicon rod formed after the silicon rod to be cut is cut. Section.
  • the wire cutting unit of the wire cutting device follows the cutting frame to descend relative to the base, and the cutting line segment formed in the cutting unit performs square cutting on the silicon rod to be cut carried by the silicon rod bearing table located in the cutting area, and the cutting line reaches When the bottom of the silicon rod is to be cut, it can continue to descend without obstruction until it penetrates the silicon rod to be cut, and complete cutting of the silicon rod to be cut is realized.
  • the silicon rod bearing table is a mesa structure with a rectangular cross section.
  • the size of the supporting surface in contact with the silicon rod in the mesa structure is slightly smaller than the cross section of the silicon rod to be cut after the silicon rod is cut. In this way, it can be ensured that the cutting line segment in the wire cutting unit unimpededly cuts the to-be-cut silicon rods carried by the silicon rod bearing platform located in the cutting area.
  • this design also brings a problem: after the silicon rods to be cut on the silicon rod carrier in the cutting area have completed the square cutting operation, the edges formed after being cut may exist without corresponding supports. Risk of falling or overturning occurs. Therefore, the multi-station square-cutting equipment of the present application also includes a side skin supporting mechanism for supporting the side skin formed by the square-cutting of the silicon rod to be cut.
  • the edge skin supporting mechanism disclosed in the present application is arranged on the periphery of the silicon rod bearing platform. After the wire cutting device cuts the silicon rod to be cut carried by the silicon rod bearing platform in the cutting area, edge skin will be formed on the cut side surface. . Therefore, in practical applications, a side skin supporting mechanism is respectively provided on the four sides of the periphery of the silicon rod bearing platform with a rectangular cross-sectional mesa structure to support a corresponding side skin.
  • the side skin supporting mechanism disclosed in this application can support the side skin formed by the warp wire cutting device after the square-cutting operation of the silicon rod to be cut, avoiding relative displacement between the side skin and the square-cut silicon rod, and preventing wire cutting
  • the cutting line segment in the device passes through the silicon rod to be cut, the edge will collapse, and the edge skin can be prevented from falling and overturning, and the square silicon rod is damaged due to the touch of the edge skin.
  • the side leather top support mechanism 27 includes a bearing
  • the supporting member includes a base 270 connected to one side of the silicon rod bearing platform 21 and a top supporting portion 271 extending upward from the base.
  • the base 270 is configured as a flat plate structure adapted to the side surface of the silicon rod carrier 21, but it is not limited to this.
  • the base 270 can also be configured as a curved panel structure or other special shapes.
  • the top support portion 271 is set as two top pillars located on both sides of the base 270, and the extension height of the top pillars is consistent with the height of the bearing surface of the silicon rod bearing platform 21.
  • the top support The portion 271 can also be adopted as a top plate or a top rod extending upward from the base 270.
  • the leather top support mechanism includes a movable support member and a locking control member.
  • the movable supporting member includes a movable base connected to one side of the silicon rod bearing platform, a top support portion extending upward from the movable base, and a power generating structure for providing the top support portion to move up and down .
  • the movable base may be, for example, a flat plate structure adapted to the side surface of the silicon rod bearing table, but is not limited thereto.
  • the movable base may also be, for example, a curved panel structure or other special shapes. structure.
  • the top support portion is at least two top rods extending upward from the movable base, but not limited thereto.
  • the top support portion may also be, for example, a top plate or a top pillar extending upward from the movable base.
  • the power generating structure includes two legs provided at the movable base and two springs respectively sleeved on the two legs, but it is not limited thereto.
  • the power generating structure may also adopt, for example, torsion springs, Structures such as shrapnel. Utilizing the elastic force of the spring, the supporting foot and the connected top rod can move up and down relative to the silicon rod bearing platform.
  • the locking control member is used to control the movable supporting member in a locked state when the movable supporting member is against the bottom of the silicon rod to be cut.
  • the locking control member may be, for example, Electromagnetic lock.
  • the ejector rod protrudes from the bearing surface of the silicon rod bearing platform under the action of the feet and the spring.
  • the ejector rod is After the silicon rod is pressed, it overcomes the elastic force of the spring and moves downwards until the silicon rod to be cut is completely placed on the bearing surface of the silicon rod bearing table.
  • the electromagnetic lock as the locking control member is energized and generates magnetism through electricity.
  • the strong magnetic force generated by the principle tightly adsorbs the movable base in the movable supporting member, thereby controlling the ejector rod in the locked state.
  • the movable supporting member in the locked state can support the corresponding edge skin. It can effectively prevent the cutting wire mesh in the wire cutting unit from chipping when passing through the silicon rod to be cut, and can prevent the edge skin from falling and overturning.
  • the silicon rods to be cut will form side skins after square cutting.
  • the side skins need to be discharged in time.
  • most of the general side skin discharge methods It is still manual operation by the operator to separate the side skins from the prescribed silicon rods and move them out of the silicon ingot multi-station prescribing equipment, which is not only inefficient, but also makes the side skins and the prescribed silicon rods during the handling process A collision increases the risk of damage to the prescribed silicon rod.
  • the multi-station squaring equipment of the present application also includes a side skin unloading device, which is used for discharging the side skin formed after the wire cutting device performs square cutting of the silicon rod to be cut.
  • FIG. 19 shows a schematic structural view of a side skin lifting mechanism in an embodiment of the multi-station square preparation equipment of this application.
  • the side skin discharging device 28 includes a side skin lifting mechanism 280 for lifting the side skin. So that the top end of the side skin 10 protrudes from the cut silicon rod.
  • the side skin lifting mechanism 280 includes a jacking member 2800 arranged on the mounting frame 241, the jacking member 2800 is driven by a telescopic member 2801 to make a telescopic movement, and the jacking member 2800 is controlled to make an extension movement. Then support the bottom of the side skin 10 to lift the side skin 10.
  • the jacking member 2800 includes an abutment plate and a support plate, the abutment plate extends upward from the bottom of the support plate, and further, the abutment plate may be a
  • the arc-shaped plate adapted to the arc-shaped surface of the side skin 10 can fully contact the arc-shaped surface of the side skin 10 when the abutment plate abuts against the side skin 10.
  • the contacting part is of a round design or a cushion pad should be added to the inner surface in contact with the side skin 10 in the abutment plate.
  • the supporting plate is used to support the bottom of the side skin 10, and further, the supporting plate may be an arcuate plate that fits the bottom surface of the side skin 10. In other embodiments, bumps can be added to the chord side of the arcuate plate serving as the supporting plate to increase the contact area with the bottom surface of the side skin 10.
  • the telescopic component 2801 may be, for example, an air cylinder with a telescopic rod, wherein the telescopic rod may be connected to the supporting plate in the jacking member 2800 through a connecting structure, and the air cylinder may drive the The telescopic rod drives the jacking member 2800 for telescopic movement.
  • the telescopic movement of the jacking member 2800 includes the contraction movement of the jacking member 2800 and the extension movement of the jacking member.
  • the contraction movement of the jacking member 2800 specifically refers to the air cylinder driving the telescopic rod to contract to drive the jacking member.
  • the lifting member 2800 is far away from the side skin 10, and the stretching movement of the lifting member 2800 specifically refers to that the air cylinder drives the telescopic rod to extend to drive the lifting member 2800 to approach the side skin 10.
  • the aforementioned telescopic component 2801 can also be implemented in other ways.
  • the telescopic component 2801 can also be, for example, a servo motor with a lead screw.
  • the lead screw is connected to the jacking member and is driven by the servo motor.
  • drive the lead screw to rotate forward to drive the jacking member 2800 to contract and drive the lead screw to rotate in reverse.
  • the jacking member 2800 performs an extension movement, or the jacking member 2800 is driven to make an extension movement by driving the lead screw to rotate in a forward direction and the jacking member 2800 is driven to make a contraction movement by driving the lead screw to rotate in a reverse direction.
  • the telescopic rod drives the lifting member 2800 to be in a contracted state, and the wire cutting unit 25 is driven to descend with the mounting frame 241 so that the cutting line formed by each cutting line segment in the wire cutting unit 25 Perform square cutting on the silicon rod to be cut in the cutting area until the cutting line segment penetrates the silicon rod to be cut to complete a complete cutting of the silicon rod to be cut and form the side skin 10.
  • the side skin lifting mechanism 280 has followed The wire mounting frame 241 is lowered to the bottom, and the air cylinder drives the telescopic rod to extend to drive the jacking member 2800 to approach the side skin 10 until the abutment plate in the jacking member 2800 contacts the side skin 10 and achieves abutment.
  • the cutting unit 25 is driven to follow the mounting frame 241 to rise, and the side skin lifting mechanism 280 follows the mounting frame 241 to rise, driving the side skin 10 to rise and displace relative to the silicon rod that has been cut once, so that the top of the side skin 10 protrudes from the silicon to be cut.
  • the mounting frame 241 can be controlled to stop rising.
  • the top of the side skin can be used as a force point for grasping, so that The side skin is grabbed and discharged, and then the air cylinder drives the telescopic rod to contract to drive the jacking member 2800 back to the initial state while controlling the mounting frame 241 to drive the wire cutting unit 25 and the side skin lifting mechanism 280 to continue to rise above the silicon rod to be cut Prepare for the next cutting operation.
  • the side skin lifting mechanism may include a suction member and a telescopic member that drives the suction member to expand and contract.
  • the suction member is controlled by the telescopic member to abut the side skin and adsorb the side. skin.
  • the suction member may further include an abutting plate and a suction element.
  • the abutment plate may be, for example, an arc-shaped plate that fits with the arc-shaped surface of the edge skin, and when the abutment plate is against the edge skin, it can interact with the arc-shaped surface of the edge skin. Full contact.
  • the suction element may be, for example, a vacuum suction cup, and a plurality of vacuum suction cups may be arranged on the contact surface of the abutment plate to be in contact with the edge skin.
  • the telescopic component may be, for example, a cylinder with a telescopic rod or a servo motor with a lead screw. Taking a cylinder with a telescopic rod as an example, the telescopic rod can be connected to the jacking member through a connecting structure.
  • the air cylinder can drive the telescopic rod to shrink to drive the abutment plate away from the side skin, and the air cylinder can drive the telescopic rod to extend to drive the abutment plate close to the side skin and After the abutment plate is in contact with the edge skin, the suction element adsorbs the edge skin. Subsequently, the mounting frame is driven to rise, the side skin lifting mechanism and the wire cutting device follow the mounting frame to rise, and the side skin lifting mechanism can use the adsorption force to drive the side skin to rise and shift relative to the silicon rod that has been cut once. , So that the top end of the edge skin protrudes from the silicon rod that has been cut once.
  • the multi-station square-out equipment of this application is provided with multiple cutting wheel sets to cut multiple silicon rods to be cut at the same time, there are multiple edge skins corresponding to the multiple cutting wheel sets on the mounting frame.
  • the lifting mechanism simultaneously discharges the edges of multiple silicon rods that have been cut.
  • each cutting wheel set is provided with a pair of cutting wheels, one press-cutting of the wire cutting device forms a side skin, and a pair of cutting wheels corresponding to each cutting wheel set is provided on the mounting frame.
  • An edge skin lifting mechanism can discharge the edge skin formed in the cutting operation in time.
  • each cutting wheel group is provided with two pairs of cutting wheels
  • one press-cutting of the wire cutting device forms two side skins, which correspond to the two pairs of cutting wheels of each cutting wheel group on the mounting frame.
  • Each side skin lifting mechanism is provided to discharge the side skin formed in the cutting operation in time.
  • the edge skin unloading device 28 also includes a clamping and transferring unit 281, which is arranged above the silicon rod bearing platform 21, and is used to clamp the top end of the edge skin and pull up the edge skin to separate from the opened square. Silicon rods and transfer the side skins to the side skin discharge area.
  • the clamping and transferring unit 281 includes a moving mechanism 283 that provides movement in at least one direction and a side leather clamping mechanism 284, the side leather clamping mechanism 284 is connected to the moving mechanism 283 And be driven to move in at least one direction.
  • a supporting plate 282 for supporting the clamping and transferring unit 281 is straddled at the top ends of the two supporting columns 240 arranged opposite to the cutting frame 24, and the clamping and transferring unit 281 is arranged at The supporting plate 282 corresponds to the upper side of the silicon rod carrier in the cutting area.
  • the edge skin clamping mechanism 284 may be provided in a number of one-to-one correspondence with the silicon rod bearing platforms located in the cutting area.
  • two adjacent edge leather clamping mechanisms 284 share a moving mechanism 283 that provides movement in at least one direction.
  • FIG. 20 is a partial enlarged view of part A in FIG. 3.
  • the moving mechanism 283 that moves in at least one direction is an X-direction moving mechanism.
  • the X-direction moving mechanism includes an X-direction guide rail 2830, an X-direction slider 2831, and an X-direction drive source 2832.
  • the X-direction guide rail 2830 is laid on the support plate 282, and the X-direction slider 2831 is adapted to the X
  • a mounting seat 2833 is provided on the guide rail 2830 and on the X-direction slider 2831.
  • the two edge gripping mechanisms 284 are respectively located on the left and right sides of the mounting seat 2833.
  • the X-direction driving source 2832 may be, for example, an X-direction telescopic cylinder assembly. Or X-direction motor.
  • a dual guide rail design is adopted in this embodiment, that is, two X-direction guide rails 2830 are adopted, and the two X-direction guide rails 2830 are arranged in parallel along the X direction.
  • the X-direction drive source 2832 drives the mounting seat 2833 on the X-direction slider 2831 to move the two side leather clamping mechanisms 284 thereon to move in the X-direction along the X-direction guide rail 2830.
  • the moving direction of the moving mechanism 283 is not limited to this.
  • the moving mechanism may also include a Y-direction moving mechanism or a Z-direction moving mechanism.
  • FIG. 21 shows a schematic diagram of the external structure of the side leather clamping mechanism in an embodiment of the multi-station prescribing equipment of this application.
  • the side leather clamping mechanism 284 includes a lifting drive structure 2841 and a clamping assembly at the bottom of the lifting drive structure.
  • the lifting drive structure 2841 is used to drive the clamping assembly for lifting movement.
  • the lifting drive structure 2841 can be, for example, a lifting cylinder with a lifting rod connected to the clamping assembly, and The air cylinder can control the expansion and contraction of the lifting rod to drive the clamping assembly to move up and down, but it is not limited to this.
  • the lifting drive structure may also be a screw assembly driven by a motor, the screw assembly is connected to the clamping assembly, and the motor drives the screw assembly to lift to drive the clamping assembly to move up and down.
  • FIG. 22 shows a schematic cross-sectional structure diagram of a clamping assembly in an embodiment of the multi-station prescribing equipment of the present application.
  • the clamping assembly includes a cover 2842 and a retractable clamp A holding member, the retractable clamping member is disposed inside the cover body 2842, and a clamping space 2843 for clamping the edge skin is formed between the clamping member and the cover body 2842.
  • the cover body 2842 is used to cover the edge skin
  • the coverable size of the cover body 2842 is slightly larger than the cross-sectional circle of the silicon rod to be cut
  • the cover body 2842 is set to be closed or non-closed Round cover, but not limited to this.
  • the clamping assembly includes an arc-shaped plate and a retractable clamping member, between the clamping member and the arc-shaped plate A clamping space for clamping the edge skin is formed.
  • the clamping member is a movable pressure block 2844 controlled by a cylinder 2845, and the movable pressure block 2844 is connected to the cylinder 2845 through a turning arm 2846.
  • the turning arm 2846 has a mounting portion and a first connecting portion and a second connecting portion located on opposite sides of the mounting portion, wherein the first connecting portion is connected to the piston rod 2848 of the cylinder 2845.
  • the second connecting part is connected to the movable pressing block 2844.
  • the cover 2842 is provided with a base 2847 for supporting the clamping member, and the base 2847 carries the clamping member to penetrate between the cut silicon rod and the edge skin.
  • the cylinder 2845 is fixed on the side wall of the base 2847 and has a piston rod 2848.
  • the mounting part of the turning arm 2846 is hinged with a support seat 2849 fixed at the bottom of the base 2847 to enable the turning arm 2846 Rotating up and down with the mounting part as the axis, the movable pressing block 2844 is fixedly connected to the second connecting part of the turning arm 2846, the first connecting part of the turning arm 2846 is hinged with the piston rod 2848 of the cylinder, and the cylinder 2845 pushes The piston rod 2848 expands and contracts to drive the first connecting part of the turning arm 2846 to fall or lift with the support base 2849 as the center point, so that the second connecting part of the turning arm 2846 is raised or lowered with the support base 2849 as the center point.
  • the movable pressing block 2844 connected to the second connecting part of the turning arm is far away from or close to the cover 2842, and the clamping space 2843 between it and the cover 2842 is adjusted.
  • the second connecting portion of the turning arm 2846 is higher than the first connecting portion, and the movable pressing block 2844 is away from the cover 2842.
  • the cylinder 2845 drives the piston rod 2848 to retract, thereby pulling the first connecting part of the turning arm 2846 up with the support base 2849 as the center point, and the second connecting part of the turning arm 2846 takes the supporting base 2849 as the center point.
  • the lowering of the center point drives the movable pressure block 2844 to approach the cover 2842 (in the direction of the arrow in FIG. 22), which reduces the clamping space 2843 between the movable pressure block 2844 and the cover 2842 to clamp the side skin.
  • the cylinder 2845 drives the piston rod 2848 to extend, thereby driving the first connecting portion of the turning arm 2846 to fall with the support base 2849 as the center point, and the second connecting portion of the turning arm 2846 to rise with the support base 2849 as the center point
  • Driving the movable pressure block 2844 away from the cover body 2842 returns to the initial state, which increases the clamping space 2843 between the movable pressure block 2844 and the cover body 2842 to facilitate the release of the side skin.
  • the movable pressure block 2844 is provided with a cushion for contacting the side skin.
  • the wire cutting unit 24 includes a plurality of cutting wheel sets 251.
  • each cutting wheel set 251 includes a pair of cutting wheels, and the pair of cutting wheels is used for cutting.
  • the silicon rod cutting operation requires four single-axis face cutting steps.
  • the number of the clamping member is set to one.
  • each cutting wheel set 251 includes two pairs of cutting wheels, and using the two pairs of cutting wheels to perform cutting operations on the silicon rod to be cut requires two parallel-axis cutting operations.
  • the clamping pieces are arranged as two oppositely arranged. Perform the first cutting of two parallel axis surfaces to form two side skins.
  • the two side skins formed at the corresponding positions are clamped by the two clamping members, and all the sides are held by the lifting drive structure 2841 and the X-direction moving mechanism.
  • the two side skins are transferred out, and then adjust the cutting surface of the silicon rod to be cut (for example, rotate 90 degrees), and perform a second cutting of two parallel axis surfaces to form two side skins again.
  • the parts clamp the two side skins formed at the corresponding positions and transfer the two side skins through the lifting drive structure 2841 and the X-direction moving mechanism.
  • the side skin unloading device includes a side skin conveying structure, the side skin conveying structure is arranged in the side skin unloading area, and is used for conveying the side skin that has been operated by the clamping transfer unit,
  • the edge skin conveying structure may be, for example, a conveyor belt. It is easy to understand that the side skin unloading area is the area where the side skins are unloaded in the multi-station opener equipment. Specifically, the side skin unloading area is the area below the side skins after the clamping transfer unit transports the side skins from the cutting area. Corresponding area.
  • the side skin is transferred from the cutting area to the side skin unloading area by the clamping and transfer unit, and the clamping component in the clamping and transfer unit is loosened to release the side skin to the conveyor belt as the side skin conveying structure.
  • the side skins are transported out by the conveyor belt.
  • the side skin unloading device includes a side skin tube, and the side skin tube is arranged in the side skin unloading area.
  • the barrel mouth of the side leather tube can be designed to be larger or a bell mouth, which is convenient for the side leather to be inserted without obstacles, and the height of the barrel arm of the side leather tube is also relatively high, which can ensure the inserted side leather No overturning, etc. will occur.
  • the side skin is moved from the cutting area to the side skin tube by the clamping and transfer unit, and then the side skin can be taken out of the side skin tube by the operator.
  • the side skin unloading device may include both a side skin tube and a side skin conveying structure, wherein the side skin conveying structure may be, for example, a conveyor belt, and the side skin tube is adjacent to the The starting end of the conveyor belt (for example, the side skin tube is located beside the starting end of the conveyor belt or directly above the starting end of the conveyor belt, etc.).
  • the barrel mouth of the side leather tube can be designed to be larger or a flared mouth, so that the side leather can be placed in a barrier-free manner, and the height of the barrel arm of the side leather tube is also relatively high to ensure The skin will not overturn.
  • the side skin tube can be of a reversible design.
  • each side skin in the side skin tube can be smoothly transferred to the conveyor belt.
  • the bottom of the side skin tube is provided with a turning drive mechanism, and the turning drive mechanism may include a turning plate, a rotating shaft, and a turning drive source (such as a turning motor or a turning cylinder, etc.).
  • the side skin tube is turned to drive the side skin in the tube to be transferred to the conveyor belt, and the side skin is transferred to the conveyor belt by the conveyor belt. Transport the side skins.
  • the multi-station squaring equipment of the present application can complete the squaring operation of multiple silicon rods at the same time, and the cross-section of the silicon rods is rectangular after the squaring treatment, while the squared silicon rods are generally rectangular and the number of sides formed is Four, it can improve the efficiency of the cutting operation of the silicon rod square, increase the cross-sectional area of the square silicon rod, and reduce the overall cost and risk of the silicon rod square
  • the multi-station slicing method applied to the multi-station squaring equipment includes the following steps: standing a single crystal silicon rod
  • the wire cutting device is driven down, and one or two cutting line segments in the wire cutting device simultaneously align the single crystal silicon rods carried by the at least two silicon rod bearing platforms.
  • the longitudinal direction of the cutting is performed on the side of the first direction; the wire cutting device is driven to rise, and the rotating mechanism is used to drive the silicon rod bearing table to convert the single crystal silicon rod to the surface to be cut; the wire cutting device is driven to descend, and the wire cutting device is driven down.
  • the cutting line segment or the two cutting line segments simultaneously cut the single crystal silicon rods carried by the at least two silicon rod bearing platforms along the length direction of the single crystal silicon rods in the second direction.
  • each cutting wheel group has two pairs of cutting wheels as an example, that is, each cutting wheel group in the wire cutting device has two pairs of cutting wheels.
  • FIG. 23 shows a flowchart of an embodiment of the multi-station cutting method of this application. As shown in the figure, the multi-station cutting method includes the following steps:
  • step S10 the single crystal silicon rod is vertically placed on the silicon rod carrier.
  • the single crystal silicon rod is transferred and placed on the silicon rod bearing platform by the silicon rod loading and unloading device.
  • the first clamp in the silicon rod loading and unloading device clamps the single crystal silicon to be cut in the holding area.
  • the reversing carrier is driven to make a reversing movement so that the first clamp takes the clamped monocrystalline silicon rod to be cut to the loading and unloading area, and then the first clamp is released so that the clamped monocrystalline silicon rod Placed on the silicon rod carrying platform in the loading and unloading area
  • the worktable conversion mechanism of the silicon ingot working table transfers the monocrystalline silicon rods to be cut on the silicon rod carrying platform in the loading and unloading area to the cutting area.
  • FIGS. 5 to 7 for the silicon rod loading and unloading device, and refer to the description of FIGS. 3, 4a, and 4b for the silicon rod workbench.
  • the monocrystalline silicon rod can be erected on the station in the storage area by manual handling or mechanical grabbing by a manipulator, and the first clamp is adjusted by driving the reversing carrier to rotate.
  • the height in the erected state drives the corresponding first clamping piece in the first clamp to move up and down on the reversing carrier to adjust the clamping distance formed by each first clamping piece.
  • drive the first clamping arms of the first clamping members participating in the clamping in the first clamp to perform clamping action, so that these first clamping members can clamp the monocrystalline silicon rods on the work position of the object area. Hold on. Please refer to the description of FIGS. 5 to 7 for the silicon rod loading and unloading device.
  • the monocrystalline silicon rod clamped by the first clamp before driving the reversing carrier for reversing movement, preferably, the monocrystalline silicon rod clamped by the first clamp needs to be separated from the work position of the holding area, and the way to achieve separation can be as follows Any one or a combination of them: 1. Under the condition of ensuring that the first fixture clamps the workpiece in the first form, use the first fixture to move upward along the reversing carrier to lift the single crystal silicon rod; 2. Drive the change Move upward to the carrier relative to the installation foundation to lift the monocrystalline silicon rod. Then, the reversing carrier is driven to rotate relative to the installation foundation, so that the first carrier on the reversing carrier corresponds to the silicon rod bearing platform in the loading and unloading area through the reversing movement. Please refer to the description of FIGS. 5 to 7 for the silicon rod loading and unloading device.
  • the single crystal silicon rod when releasing the first clamp, the single crystal silicon rod needs to be dropped on the silicon rod bearing platform in the loading and unloading area.
  • the way to realize the positioning can be any one of the following or a combination of them: 1. Under the condition of ensuring that the first clamp is holding the monocrystalline silicon rod, use the first clamp to move down the reversing carrier to drop the monocrystalline silicon rod; second, drive the reversing carrier to move down relative to the installation foundation to land Single crystal silicon rod. Please refer to the description of FIGS. 5 to 7 for the silicon rod loading and unloading device.
  • step S11 the wire cutting device is driven to descend, and the two cutting line segments in the wire cutting device simultaneously cut the single crystal silicon rods carried by the at least two silicon rod supporting tables along the length direction of the single crystal silicon rods in the first direction.
  • the silicon rod pressing device compresses the single crystal silicon rod on the silicon rod carrier.
  • the first drive mechanism drives the mounting frame in the cutting frame to lower the wire cutting unit along the lifting rail while the silicon rod pressing device is attached to the mounting frame and descends.
  • the cylinder in the pneumatic guide rail locking device drives the locking clamp block to hold Lift the guide rail to position the silicon rod pressing device, and then the pressing unit of the silicon rod pressing device is driven to press against the top of the corresponding single crystal silicon rod, and the wire cutting unit continues to descend with the mounting frame ,
  • the two cutting line segments in each cutting wheel group cut the corresponding compressed single crystal silicon rod along the length direction of the single crystal silicon rod in the first direction to form two parallel axial cut surfaces.
  • FIG. 3 and FIGS. 10 to 12 for the wire cutting device, and refer to the description of FIG. 17 for the silicon rod pressing device.
  • step S12 the wire cutting device is driven to rise, and the rotating mechanism is used to drive the silicon rod carrier to convert the single crystal silicon rod to the surface to be cut.
  • the wire cutting unit cuts the single crystal silicon rod along its length to form two parallel axial cutting planes, at the same time two side skins are generated, which hinders the ascent of the cutting line segment in the wire cutting device.
  • the two side skins formed by the above cutting need to be unloaded from the silicon rod carrier by the side skin unloading device.
  • the side skin unloading device The side skin lifting mechanism in the rim skin lifts the side skin so that the top end of the side skin protrudes from the cut silicon rod.
  • the side skin lifting mechanism is installed on the mounting frame
  • the jacking member is driven by a telescopic member to make a telescoping movement, and the jacking member is controlled to make a stretch motion and then supports the bottom of the side skin to lift the side skin so that the side skin
  • the top end of the side skin protrudes from the cut silicon rod; then the top of the side skin is clamped by the clamping and transfer unit in the side skin unloading device and the side skin is pulled up from the cut silicon rod and
  • the side skins are transferred to the side skin discharge area. Please refer to the description of Figures 19-22.
  • the mounting frame in the cutting frame is driven by the first drive mechanism to lift the wire cutting unit along the lifting guide rail to the silicon
  • the rod pressing device is attached to each other, and then the rotating mechanism at the bottom of the silicon rod bearing table is used to cooperate with the rotating shaft in the pressing unit to drive the silicon rod bearing table to rotate 90° clockwise or counterclockwise to adjust the single crystal silicon that has been cut once.
  • the side of the rod to be cut Please refer to the description for Figure 2, Figure 3 and Figure 17.
  • step S13 the wire cutting device is driven to descend, and the two cutting line segments simultaneously cut the single crystal silicon rods carried by the at least two silicon rod bearing platforms along their length directions in the second direction.
  • the online cutting device cuts the side of the single crystal silicon rod that has been cut in the first direction along its length in the second direction
  • two side skins will be formed.
  • the side skin unloading device is required Unloading the two side skins formed by the side cutting in the second direction from the silicon rod carrier is specifically: first, the side skin lifting mechanism in the side skin unloading device lifts the side skin so that the The top end protrudes from the cut silicon rod.
  • the side skin lifting mechanism adopts a jacking member provided on the mounting frame, and the jacking member is driven by a telescopic member to expand and contract After the lifting member performs a controlled stretching exercise, the bottom of the side skin is supported to lift the side skin so that the top end of the side skin protrudes from the cut silicon rod;
  • the clamping and transferring unit in the unloading device clamps the top end of the side skin and pulls the side skin away from the cut silicon rod and transfers the side skin to the side skin discharge area. Please refer to the description of Figures 19-22.
  • the single crystal silicon rod after removing the edge skin formed by side cutting in the second direction, the single crystal silicon rod has completed its square rooting operation and the whole is a rectangular parallelepiped, and the wire cutting device and the silicon rod pressing device need to be driven back to the original The position is prepared for the next prescribing operation.
  • the first drive mechanism drives the wire cutting unit on the mounting frame of the wire cutting device to rise along the lifting rail until the mounting frame is in contact with the silicon rod pressing device,
  • the pressing unit in the silicon rod pressing device is driven to release the pressure on the corresponding single crystal silicon rod that has completed the cutting operation, and then, the air cylinder in the pneumatic rail locking device drives the locking clamp block to relax the lifting rail
  • the pressing device of the silicon rod is attached to the mounting frame and the wire cutting device continues to rise back to the initial position.
  • the cut single crystal silicon rod needs to be transported away from the cutting area. Specifically, first, the worktable conversion mechanism of the silicon rod worktable will be located in the cutting area.
  • the cut single crystal silicon rods on the silicon rod carrier are transferred to the loading and unloading area, and then the cut single crystal silicon rods in the loading and unloading area are clamped by the second clamp in the silicon rod loading and unloading device, and then the reversing carrier is driven to operate
  • the reversing movement causes the second clamp to transfer the clamped cut single crystal silicon rod to the storage area, and then release the second clamp so that the clamped cut single crystal silicon rod is placed in the storage area.
  • FIG. 3 and FIGS. 10 to 12 for the wire cutting device, and refer to the description of FIG. 17 for the silicon rod pressing device.
  • the second clamp is adjusted by driving the reversing carrier to rotate to realize the silicon rod carrier table corresponding to the loading and unloading area. If necessary, according to the vertical placement state of the cut single crystal silicon rod The lower height drives the corresponding second clamping piece in the second clamp to move up and down on the reversing carrier to adjust the clamping distance formed by each second clamping piece. Then, drive the second clamping arms of each of the second clamping members participating in the clamping in the second clamp to perform a clamping action, so that these second clamping members can hold the cut sheet on the silicon rod carrier in the loading and unloading area.
  • the crystalline silicon rod is clamped. Please refer to the description of Figures 5 to 7.
  • the cut single crystal silicon rod clamped by the second clamp needs to be detached from the silicon rod carrier in the loading and unloading area to realize the detachment
  • the method can be any one of the following or a combination of them: 1. Under the condition of ensuring that the second clamp clamps the cut single crystal silicon rod, use the second clamp to move upward along the reversing carrier to lift the cut sheet Crystal silicon rod; Second, drive the reversing carrier to move upward relative to the installation foundation to lift the cut single crystal silicon rod. Then, the reversing carrier is driven to rotate relative to the installation foundation, so that the second carrier on the reversing carrier corresponds to the work position of the storage area through the reversing movement. Please refer to the description of Figures 5 to 7.
  • the single crystal silicon rod when releasing the second clamp, the single crystal silicon rod needs to be dropped on the silicon rod bearing platform in the loading and unloading area.
  • the way to achieve the positioning can be any one of the following or a combination of them: 1.
  • the second clamp When ensuring that the second clamp clamps the cut single crystal silicon rod, use the second clamp to move down the reversing carrier to drop the cut single crystal silicon rod; second, drive the reversing carrier relative to the installation base direction Move down to land the cut monocrystalline silicon rod. Please refer to the description of Figures 5 to 7.
  • each cutting wheel set includes two pairs of cutting wheels, that is, one single crystal silicon rod to be cut is correspondingly configured with two cutting line segments, therefore, a total of four axes are completed for the single crystal silicon rod to be cut.
  • the square-cutting operation of the cut surface requires two cutting processes, namely, the above-mentioned side cutting in the first direction and the side cutting in the second direction.
  • each cutting wheel set includes a pair of cutting wheels, that is, a single crystal silicon rod to be cut is configured with a cutting line segment, then the square operation of a total of four axial sections of the single crystal silicon rod to be cut is completed. Perform four single-axis cutting processes, that is, two side cuttings in the first direction and two side cuttings in the second direction.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

一种多工位开方设备及其切割方法，包括至少两个硅棒承载台（21），用于承载立式置放的单晶硅棒，各硅棒承载台（21）具有转动机构（210）；以及线切割装置，设置在至少两个硅棒承载台（21）的上方，包括多个切割轮（290）以及绕于多个切割轮（290）形成有一条切割线段或相互平行的两条切割线段的切割线。

Description

多工位开方设备及其切割方法 技术领域
本申请涉及硅棒加工技术领域，特别是涉及一种多工位开方设备及其切割方法。
背景技术
目前，随着社会对绿色可再生能源利用的重视和开放，光伏太阳能发电领域越来越得到重视和发展。光伏发电领域中，通常的晶体硅太阳能电池是在高质量硅片上制成的，这种硅片从提拉或浇铸的硅锭后通过多线锯切割而成。
传统的单晶硅棒开方机采用“井”字形的切割方式对单晶硅棒进行开方，使得开方后的硅棒整体呈类长方形，然后再对硅棒进行磨面、滚圆及抛光等处理，最后采用多线切片机沿长度方向对开方后的硅棒进行切片得到所需硅片。如此在对类长方形硅棒进行磨面作业中会浪费大量的原材料且获得的硅片表面积小，而且这种切割方式导线轮多、布线复杂。
另外，为了提高工作效率，很多开方设备可同时切割多个硅棒，但是现有的多硅棒同时切割的开方设备，或是采用一个硅棒切割设备对应多个待切割硅棒执行开方作业，这种方式由于切割单晶硅棒的数量多，导致切割轮的间距越来越大，从而带来效率低下、截断面与中心线偏差大、崩边的问题；或是采用一次性能够完成多根硅棒开方切割的结构设计，但是这种硅棒开方机，由于硅棒根数较多，切割机构中切割线在布置走线时需要经过很多导线轮转向，使其工作时能耗损失大，降低了切割效率，为了保证切割效果，切割机构进给速度通常很慢，故整体切割效率实际并不高。
发明内容
鉴于以上所述相关技术的缺失，本申请的目的在于公开一种多工位开方设备及其切割方法。
为实现上述目的及其他目的，本申请的第一方面公开一种多工位开方设备，包括：至少两个硅棒承载台，用于承载立式置放的单晶硅棒，各所述硅棒承载台具有转动机构；以及线切割装置，设置在所述至少两个硅棒承载台的上方，包括多个切割轮以及绕于所述多个切割轮形成有一条切割线段或相互平行的两条切割线段的切割线；其中，在开方作业时，驱动所述线切割装置下降，由所述一条切割线段或两条切割线段同时对所述多个硅棒承载台所承载的多个单晶硅棒沿其长度方向进行第一方向侧面的切割；之后，利用所述转动机构驱动硅棒承载台以使所述单晶硅棒转换待切割面，驱动所述线切割装置下降，由所述一条切割线段或 两条切割线段同时对所述多个硅棒承载台所承载的多个单晶硅棒沿其长度方向进行第二方向侧面的切割。
在本申请第一方面的某些实施方式中，在所述开方作业中，所述线切割装置对所述单晶硅棒的第一方向侧面切割时的切割线与对所述单晶硅棒的第二方向侧面切割时的切割线的交点位于所述单晶硅棒的截面内。
在本申请第一方面的某些实施方式中，所述至少两个硅棒承载台可设于硅棒工作台上，所述硅棒工作台上设有工作台转换机构，用于驱动所述硅棒工作台作转换运动以令所述硅棒工作台上的硅棒承载台在装卸区和切割区之间转换。
在本申请第一方面的某些实施方式中，所述工作台转换机构为转动机构，所述转动机构包括：转动轴，轴接于所述硅棒工作台；以及转动驱动单元，用于驱动所述转动轴转动以带动所述硅棒工作台转动。
在本申请第一方面的某些实施方式中，所述工作台转换机构为平移机构，所述平移机构包括：平移导轨，铺设于一工件加工台上；滑块，设于所述硅棒工作台的底部；以及平移驱动单元，用于驱动所述硅棒工作台沿着所述平移导轨移动。
在本申请第一方面的某些实施方式中，所述多工位开方设备还包括邻设于所述硅棒承载台的硅棒装卸装置。
在本申请第一方面的某些实施方式中，在所述硅棒承载台的周边设有边皮顶托机构，用于顶托单晶硅棒进行切割后所形成的边皮。
在本申请第一方面的某些实施方式中，所述边皮顶托机构包括：活动承托件；以及锁定控制件，用于在活动承托件抵靠于单晶硅棒的底部时将所述活动承托件控制在锁定状态。
在本申请第一方面的某些实施方式中，所述多工位开方设备还包括边皮卸料装置，用于将所述线切割装置进行切割后形成的边皮予以卸料。
在本申请第一方面的某些实施方式中，所述边皮卸料装置包括：边皮提升机构，用于提升所述边皮以使所述边皮的顶端凸出于所述已切割硅棒。
在本申请第一方面的某些实施方式中，所述边皮卸料装置还包括：夹持转运单元，设于所述至少两个硅棒承载台的上方，用于夹持住所述边皮的顶端并拉升所述边皮以脱离所述已开方单晶硅棒以及将所述边皮转运至边皮卸料区。
在本申请第一方面的某些实施方式中，所述夹持转运单元包括边皮夹持机构，所述边皮夹持机构包括：提供至少一个方向移动的夹持移动机构；以及可升降的至少一夹持组件。
在本申请第一方面的某些实施方式中，所述夹持组件包括：罩体，用于罩设于边皮；以及可伸缩的夹持件，设于所述罩体内部；所述夹持件与所述罩体主体之间形成供夹持所述边 皮的夹持空间。
在本申请第一方面的某些实施方式中，所述夹持组件包括：弧形板；以及可伸缩的夹持件，所述夹持件与所述弧形板之间形成供夹持所述边皮的夹持空间。
在本申请第一方面的某些实施方式中，在所述线切割装置中，包括与硅棒承载台数量对应的至少两个切割轮组，每一个切割轮组包括一对切割轮或两对切割轮，在任一对切割轮中的两个切割轮之间形成一条切割线段；相邻两个切割轮组之间设有过渡轮，所述过渡轮的线槽与切割轮组中的切割轮的线槽在同一平面内。
在本申请第一方面的某些实施方式中，所述切割轮包括用于绕设切割线的第一线槽及第二线槽，所述切割轮通过自动换槽机构将切割线由所述第一线槽移至第二线槽内。
在本申请第一方面的某些实施方式中，所述自动换槽机构包括：切割轮，包括用于绕设切割线的第一线槽及第二线槽；换槽筒，与所述切割轮相联动，用于带动所述切割轮沿其轴向移动以将所述切割线由所述第一线槽移至第二线槽内，包括筒本体，以及开设于所述筒本体上的相互连通第一导轨及第二导轨，所述第一导轨与第二导轨之间的落差对应于所述第一线槽及第二线槽之间的槽距；定位件，可相对滑动地设置在所述第一导轨或第二导轨内，用于在所述换槽筒沿轴向移动时在所述第一导轨或第二导轨内滑移带动所述换槽筒旋转，以迫使所述切割轮上的切割线由所述第一线槽切换至第二线槽。
在本申请第一方面的某些实施方式中，所述多工位开方设备还包括硅棒压紧装置，所述硅棒压紧装置和所述线切割装置共用同一导轨。
在本申请第一方面的某些实施方式中，所述硅棒压紧装置设有导轨锁紧单元。
本申请的第二方面公开一种应用于多工位开方设备的多工位切割方法，所述多工位开方设备包括至少两个硅棒承载台和线切割装置，所述硅棒承载台具有转动机构，所述线切割装置包括一条切割线段或相互平行的两条切割线段，所述多工位切割方法包括如下步骤：将单晶硅棒立式置放于硅棒承载台上；驱动线切割装置下降，由所述线切割装置中的一条切割线段或两条切割线段同时对所述至少两个硅棒承载台所承载的单晶硅棒沿其长度方向进行第一方向侧面的切割；驱动线切割装置上升，利用转动机构驱动硅棒承载台以使所述单晶硅棒转换待切割面；驱动所述线切割装置下降，由所述一条切割线段或两条切割线段同时对所述至少两个硅棒承载台所承载的单晶硅棒沿其长度方向进行第二方向侧面的切割。
本申请公开的一种多工位开方设备及其切割方法，其有益效果在于，通过本申请的多工位开方设备及其切割方法可同时完成对多个硅棒的开方作业，且使得硅棒在开方处理后截面呈矩形，而已开方硅棒整体呈长方体且形成边皮数量为四个，能够提高硅棒开方的切割作业效率，增大已开方硅棒的横截面面积的同时降低了硅棒开方的整体成本和风险性。
附图说明
图1a显示为采用井字型切割方式切割后呈类长方体的待切割硅棒截面示意图。
图1b显示为采用井字形切割方式切割后呈长方体的待切割硅棒截面示意图。
图2显示为本申请多工位开方设备在一实施例中的整体结构示意图。
图3显示为本申请多工位开方设备在一实施例中工作台转换机构为转动机构的示意图。
图4a显示为本申请多工位开方设备在一实施例中工作台转换机构为平移机构的一个状态示意图。
图4b显示为本申请多工位开方设备在一实施例中工作台转换机构为平移机构的另一个状态示意图。
图5显示为本申请多工位开方设备在一实施例中的硅棒装卸装置的结构示意图。
图6显示为图5的俯视图。
图7显示为本申请多工位开方设备在一实施例中的硅棒装卸装置的第一夹具的剖视图。
图8显示为本申请多工位开方设备在一实施例中的第一驱动结构示意图。
图9显示为本申请多工位开方设备在一实施例中的线切割装置中各切割轮组具有一对切割轮的结构示意图。
图10显示为本申请多工位开方设备在一实施例中的线切割装置中各切割轮组具有两对切割轮的结构示意。
图11显示为图10的侧面结构示意图。
图12显示为本申请多工位开方设备在一实施例中的线切割装置中各切割轮组具有两对切割轮情况下的导向轮绕线示意图。
图13显示为本申请多工位开方设备在一实施例中的自动换槽机构设置于线切割装置上的结构示意图。
图14显示为本申请多工位开方设备在一实施例中的自动换槽机构的剖面结构示意图。
图15显示为图14的B部分的局部放大图。
图16a至图16d显示为本申请多工位开方设备的自动换槽机构的运动过程结构示意图。
图17显示为本申请多工位开方设备在一实施例中的具有硅棒压紧装置的结构示意图。
图18显示为本申请多工位开方设备在一实施例中的边皮顶托机构的结构示意图。
图19显示为本申请多工位开方设备在一实施例中的边皮提升机构的结构示意图。
图20显示为图3中A部分的局部放大图。
图21显示为本申请多工位开方设备在一实施例中的边皮夹持机构的外部结构示意图。
图22显示为本申请多工位开方设备在一实施例中的夹持组件的剖面结构示意图。
图23显示为本申请的多工位切割方法在一实施例中的流程图。
具体实施方式
以下由特定的具体实施例说明本申请的实施方式，熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本申请的其他优点及功效。
在下述描述中，参考附图，附图描述了本申请的若干实施例。应当理解，还可使用其他实施例，并且可以在不背离本申请的精神和范围的情况下进行机械组成、结构以及操作上的改变。下面的详细描述不应该被认为是限制性的，并且本申请的实施例的范围仅由公布的专利的权利要求书所限定。这里使用的术语仅是为了描述特定实施例，而并非旨在限制本申请。空间相关的术语，例如“上”、“下”、“左”、“右”、“下面”、“下方”、“下部”、“上方”、“上部”等，可在文中使用以便于说明图中所示的一个元件或特征与另一元件或特征的关系。
虽然在一些实例中术语第一、第二等在本文中用来描述各种元件或参数，但是这些元件或参数不应当被这些术语限制。这些术语仅用来将一个或参数件与另一个或参数进行区分。例如，第一线槽可以被称作第二线槽，并且类似地，第二线槽可以被称作第一线槽，而不脱离各种所描述的实施例的范围。第一线槽和第二线槽均是在描述一个线槽，但是除非上下文以其他方式明确指出，否则它们不是同一个线槽。相似的情况还包括第一导轨与第二导轨，或者第一方向与第二方向。
再者，如同在本文中所使用的，单数形式“一”、“一个”和“该”旨在也包括复数形式，除非上下文中有相反的指示。应当进一步理解，术语“包含”、“包括”表明存在所述的特征、步骤、操作、元件、组件、项目、种类、和/或组，但不排除一个或多个其他特征、步骤、操作、元件、组件、项目、种类、和/或组的存在、出现或添加。此处使用的术语“或”和“和/或”被解释为包括性的，或意味着任一个或任何组合。因此，“A、B或C”或者“A、B和/或C”意味着“以下任一个：A；B；C；A和B；A和C；B和C；A、B和C”。仅当元件、功能、步骤或操作的组合在某些方式下内在地互相排斥时，才会出现该定义的例外。
现有的单晶硅棒一般为圆柱形结构，通过硅棒开方设备对硅棒进行开方，请参阅图1a和图1b，图1a显示为采用井字型切割方式切割后呈类长方体的待切割硅棒截面示意图，图1b显示为采用井字形切割方式切割后呈长方体的待切割硅棒截面示意图。如图所示，在现有的硅棒开方设备中，大多都是采用井字型切割方式将硅棒开方为呈类长方体(包括四个竖切面和位于相邻两个竖切面之间的倒角面，呈如图1a所示)，后续对开方后的硅棒进行磨面会损耗大量的材料，且对已经开方打磨作业的硅棒进行切片后得到的硅片表面积较小，发电效率 低。
鉴于此，为了提高硅片的有效使用面积，在切割间距不变的情况下期望增大已开方的硅棒的横截面面积，故本申请中采用增大待切割硅棒的截面圆面积，使得待切割硅棒被开方后呈长方体(仅包括四个竖切面而不存在倒角面，呈如图1b所示)，在后续磨面作业中仅需对呈长方体的已开方硅棒的四个竖切面之间的直角进行少量的打磨即可，如此，因磨面而损耗的材料大大减小且对已经开方打磨作业的硅棒进行切片后得到的硅片表面积较大。
需要注意的是，此时如果依然采用传统的具有四条切割线段的井字型线切割装置的硅棒开方设备对待切割硅棒进行开方，则在开方作业中在待切割硅棒对应的切割面上会形成八个边皮，其中包括四个大边皮10和四个小边皮11(呈如图1b所示)，四个小边皮11一方面在切割过程中会误导切割线，引起切割线走歪，切割表面凹凸不平，另一方面四个小边皮由于支撑底面过小，易倾倒，从而易产生崩边等问题。因此，对于本领域技术人员来说，有必要研发一种多工位开方设备及硅棒开方方法，使得硅棒开方后呈长方体同时又不会增加边皮的数量(即边皮的数量依然为四个)，以便于能提高硅棒开方的切割作业效率，增大已开方硅棒的横截面面积的同时降低硅棒开方的整体成本和风险性。
本申请公开了一种多工位开方设备，用于对截面为圆形的单晶硅棒(本申请中也称之为硅棒)进行开方作业，包括至少两个硅棒承载台和线切割装置。
所述至少两个硅棒承载台用于承载立式置放的单晶硅棒，各所述硅棒承载台具有转动机构。
所述线切割装置设置在所述至少两个硅棒承载台的上方，所述线切割装置包括多个切割轮和切割线，所述切割线绕于所述多个切割轮形成一条切割线段或相互平行的两条切割线段。
其中，在开方作业时，驱动所述线切割装置下降，由所述一条切割线段或两条切割线段同时对所述多个硅棒承载台所承载的多个单晶硅棒沿其长度方向进行第一方向侧面的切割；之后，利用所述转动机构驱动硅棒承载台以使所述单晶硅棒转换待切割面，驱动所述线切割装置下降，由所述一条切割线段或两条切割线段同时对所述多个硅棒承载台所承载的多个单晶硅棒沿其长度方向进行第二方向侧面的切割。在所述开方作业中，所述线切割装置对所述单晶硅棒的第一方向侧面切割时的切割线与对所述单晶硅棒的第二方向侧面切割时的切割线的交点位于所述单晶硅棒的截面内。
本申请多工位开方设备应用于硅棒的开方切割作业中。通过本申请的多工位开方设备可同时完成对多个硅棒的开方作业，且使得硅棒在开方处理后截面呈矩形，而已开方硅棒整体呈长方体(仅包括四个竖切面)且形成边皮数量为四个，能够提高硅棒开方的切割作业效率，增大已开方硅棒的横截面面积的同时降低了硅棒开方的整体成本和风险性。
以下实施例中将结合图2至图22对本申请的多工位开方设备进行详细说明。
请参阅图2，显示为本申请多工位开方设备在一实施例中的整体结构示意图，如图所示，所述多工位开方设备还包括一机座20，所述机座20设置为本申请多工位开方设备的主体部件，用于提供开方作业平台，较佳地，所述机座20的体积和重量均较大以提供更大的安装面以及更牢固的整机稳固度。
所述至少两个硅棒承载台21用于承载立式置放的硅棒，各所述硅棒承载台21具有转动机构210，所述转动机构210用于带动置放于硅棒承载台21上的硅棒进行转动以调整待切割面。在一示例性实施例中，所述转动机构210设置为位于硅棒承载台21底部的旋转转盘，该旋转转盘受控于一驱动装置(未予以图示)，所述驱动装置可例如为驱动旋转转盘转动的伺服电机，但并不以此为限。在一可选实施例中，所述转动机构210可采用升降式设计，即，硅棒承载台21底部的旋转转盘受控后可作伸缩动作以带动硅棒承载台21作升降运动，从而调整硅棒承载台21上待切割硅棒的高度。
为了更好地保护硅棒承载台上的待切割硅棒，在一示例性实施例中，在各硅棒承载台21的承托面(该承托面为硅棒承载台的上表面用于承托待切割硅棒)上固定有缓冲垫，使得待切割硅棒被置放时缓冲垫位于硅棒承载台21和待切割硅棒之间。
在一实施例中，参见图2，所述至少两个硅棒承载台21直接设置于所述机座上且以一直线的方式依次间隔排列于切割区，当至少两个硅棒承载台21承托了待切割硅棒后，被承托的这些待切割硅棒的中心即位于同一条直线上(呈如图2所示)，容易理解的是，所述切割区为多工位开方设备进行硅棒切割的区域，具体地，所述切割区例如为多工位开方设备中线切割装置下方的区域。
于实际应用中，为了提高工作效率，使得多工位开方设备能同时执行切割工作和装卸工作，请参阅图3，显示为本申请多工位开方设备在一实施例中工作台转换机构为转动机构的示意图，如图所示，在另一实施例中，所述至少两个硅棒承载台21可设于硅棒工作台22上，所述硅棒工作台22上设有工作台转换机构220，用于驱动所述硅棒工作台21作转换运动以令所述硅棒工作台21上的硅棒承载台在装卸区和切割区之间转换，容易理解的是，所述装卸区为在多工位开方设备进行装载和卸料的区域，具体例如为多工位开方设备中硅棒工作台的两侧所对应的区域，所述切割区为在多工位开方设备上进行待切割硅棒切割作业的区域，具体例如为多工位开方设备中切割装置下方的区域。
在本实施例中，所述硅棒工作台22设置在机座20上且设置为至少一个，各硅棒工作台22上设置有至少两个硅棒承载台21，各硅棒工作台22上的其中至少一个硅棒承载台21位于所述切割区，至少一个硅棒承载台21位于所述装卸区，各硅棒工作台22上位于切割区的硅 棒承载台21以一直线的方式依次序间隔排列，如此，当位于切割区的各硅棒承载台21承托了待切割硅棒后，被承托的这些待切割硅棒的中心即位于同一条直线上。在一示例性实施例中，参见图3，所述机座上设置两个硅棒工作台22，各硅棒工作台22上设置有四个硅棒承载台21，各硅棒工作台22上的其中两个硅棒承载台21位于所述切割区，另外两个硅棒承载台21位于所述装卸区，两个硅棒工作台22上位于切割区的四个硅棒承载台21以一直线的方式依次序间隔排列，但并不以此为限，在其他示例性实施例中，所述硅棒工作台22也可设置为一个或多个。
在一示例性实施例中，请参见图3，如图所示，所述工作台转换机构220为转动机构，所述转动机构包括转动轴2200和转动驱动单元(未予以图示)。所述转动轴2200轴接于所述硅棒工作台22，用于驱动所述转动轴2200转动以带动所述硅棒工作台22转动。在本实施例中所述转动轴2200设置于硅棒工作台22底部的中央区域并连接于机座20，位于切割区的硅棒承载台21和位于装卸区的硅棒承载台21相对于转动轴2200呈中心对称，从而可通过驱动硅棒工作台22转动以使得位于硅棒工作台22上的硅棒承载台21在切割区和装卸区切换。需要说明的是，在所述工作台转换机构220设置为转动机构的实施例中是在多工位开方设备的一侧进行装卸料，在实际作业中，要将硅棒在切割区和装卸区进行转换，首先转动驱动单元(例如常见的驱动电机)驱动转动轴2200带动硅棒工作台22转动(例如旋转180°)，使得原位于切割区的硅棒承载台21转到装卸区进行卸载并装载新料，并使得原位于装卸区的硅棒承载台21转换到切割区进行切割，如此循环使得本申请多工位开方设备能同时进行切割工作和装卸工作，提高了工作效率。在其他实施例中，实现驱动硅棒工作台作转动的转动机构也可采用其他方式，例如，所述转动机构也可采用齿轮传动的方式，具体为在硅棒工作台底部设置一传动轮，在机座20上设置一与所述传动轮相啮合的主动轮，所述主动轮受控于一转动驱动电机，驱动电机驱动主动轮转动以带动从动轮转动，从而使得硅棒工作台22跟随从动轮转动以带动硅棒承载台21在装卸区和切割区切换。
在另一示例性实施例中，请参阅图4a和图4b，图4a显示为本申请多工位开方设备在一实施例中工作台转换机构为平移机构的一个状态示意图，图4b显示为本申请多工位开方设备在一实施例中工作台转换机构为平移机构的另一个状态示意图。如图所示，所述工作台转换机构220为平移机构，所述平移机构包括平移导轨2201、滑块2202和平移驱动单元(未予以图示)。所述平移导轨2201铺设于机座20上，所述滑块2202设于所述硅棒工作台22的底部并与所述平移导轨2201相适配以为硅棒工作台22提供平移导向，所述平移驱动单元用于驱动所述硅棒工作台22沿着所述平移导轨2201移动(呈如图4a和图4b中的箭头方向)以使得位于硅棒工作台22上的硅棒承载台21在切割区和装卸区切换，所述平移驱动单元采 用气缸组件或藉由电机驱动的丝杆组件。需要说明的是，在所述工作台转换机构220为平移机构的实施例中是在多工位开方设备的两侧进行装卸料，在实际作业中，在硅棒工作台上位于切割区的硅棒承载台21承载的硅棒被切割同时位于一侧的装卸区的硅棒承载台21已装载待切割硅棒后(呈如图4a中状态)，平移驱动单元驱动硅棒工作台22沿着滑轨X方向(呈如图4a中箭头方向)前进使得位于切割区的硅棒承载台21承载已切割的硅棒平移到另一侧装卸区进行卸载并装载待切割硅棒，同时位于一侧装卸区的硅棒承载台21承载待切割硅棒平移到切割区进行待切割硅棒的切割(呈如图4b中状态)，然后平移驱动单元驱动硅棒工作台22沿着滑轨后退(呈如图4b中箭头方向)使得在另一侧已装载待切割硅棒的硅棒承载台21回到切割区进行切割作业，同时在切割区已完成切割作业的硅棒承载台21回到一侧装卸区继续卸载并装载待切割硅棒(呈如图中4a位置)，如此往复使得本申请多工位开方设备能同时进行切割工作和装卸工作，工作效率显著提高。在其他实施例中，所述平移机构也可采用齿轮传动的方式，具体地，所述平移机构包括平移齿轨和藉由电机驱动的与平移齿轨相适配的转动齿轮，所述平移齿轨设置于所述硅棒工作台的底部，可例如为具有一定长度的至少一个齿条，为了使得硅棒工作台平稳的移动，各齿条适配有至少两个间隔设置的转动齿轮，电机驱动转动齿轮转动以带动硅棒工作台移动，使得位于硅棒工作台上的硅棒承载台在切割区和装卸区切换。
需要补充的是，为了便于对硅棒进行装卸作业，本申请多工位开方设备还包括硅棒装卸装置，所述硅棒装卸装置邻设于硅棒承载台，更进一步地，所述硅棒装卸装置设置于硅棒工作台的一侧或相对两侧，用于将位于置物区的待切割的硅棒装载至硅棒工作台上的位于装载区的硅棒承载台上以由硅棒工作台将待切割硅棒送至切割区进行切割，以及将被硅棒工作台由切割区转移至装卸区的已切割硅棒转移至置物区以对已切割硅棒进行卸载。在一种实施方式中，所述硅棒装卸装置设置于硅棒工作台的一侧，此时所述硅棒工作台的工作台转换机构为如上所述的转动机构，在硅棒工作台的一侧对硅棒进行装卸；在另一种实施方式中，所述硅棒装卸装置设置于硅棒工作台的两侧，此时所述硅棒工作台的工作台转换机构为如上所述的平移机构，在硅棒工作台的两侧对硅棒进行装卸。容易理解的是，所述置物区为邻设于多工位开方设备且用于放置或存储待切割硅棒和已切割硅棒的区域。
请参阅图5至图7，图5显示为本申请多工位开方设备在一实施例中的硅棒装卸装置的结构示意图，图6显示为图5的俯视图，图7显示为本申请多工位开方设备在一实施例中的硅棒装卸装置的第一夹具的剖视图。如图所示，所述硅棒装卸装置设置在一底部安装结构上，所述底部安装结构凸设于机座。所述硅棒卸载装置包括换向载具230、第一夹具、第二夹具，所述换向载具230用于作换向运动，所述第一夹具和第二夹具配置于换向载具230，藉由驱 动换向载具作换向运动，可使得换向载具230上配置的第一夹具和第二夹具在置物区和装卸区转换以转运夹持住已切割的硅棒和待切割的硅棒。
所述换向载具230设置于底部安装结构上且可相对底部安装结构作换向运动。在一实施方式中，所述换向载具230是通过一换向机构来实现换向运动的。所述换向机构可包括转动轴和换向电机，换向载具230通过转动轴轴连接于其下的底部安装结构。在实施转向运动时，则启动换向电机，驱动转动轴转动以带动换向载具230作转动以实现换向运动。前述驱动转动轴转动可设计为单向转动也可设计为双向转动，所述单向转动可例如为顺时针转动或逆时针转动，所述双向转动则可例如为顺时针转动和逆时针转动。另外，驱动转动轴转动的角度可根据硅棒装卸装置的实际构造等设定，其中，所述硅棒装卸装置的实际构造可例如为驱动转动轴转动的角度可根据置物区与装卸区之间的位置关系或者换向载具230的结构等。换向载具230中的换向底座中央位置与转动轴连接，一般地，换向底座的形状可采用圆盘的结构，但并不以此为限，其也可采用方形盘或椭圆盘。所述第一夹具设于换向载具230的第一夹具区，用于夹持待切割硅棒，所述第二夹具设于换向载具230的第二夹具区，用于夹持已切割硅棒。在实施例中，所述第一夹具区和第二夹具区可依据实际装置结构而设定，例如，第一夹具区和第二夹具区为换向载具230中背向设置的两个区位，进一步地，第一夹具区和第二夹具区可相差180°，如此使得置物区与装卸区连成一线(当然也可以这样理解：置物区与装卸区连成一线且分别位于换向载具230的相对两侧，因此，换向载具230中用于设置第一夹具的第一夹具区与用于设置第二夹具的第二夹具区可相差180°)，这样，当将换向载具230转动180°之后，第一夹具和第二夹具可实现互换位置。不过，在实际应用中，针对第一夹具区及第二夹具区或者上下料工位及作业工位的设置关系并非须如此苛求，第一夹具区和第二夹具区也可例如相差90°，甚至于，第一夹具区和第二夹具区可相差合适范围内的任一位置，只要第一夹具区与第二夹具区之间确保不会产生不必要干扰的话。
第一夹具进一步包括第一夹具安装件231和至少两个第一夹持件232，其中，至少两个第一夹持件232相对于第一夹具安装件231而间隔设置，用于夹持待切割硅棒。在一实施方式中，前述位于硅棒承载台上的待切割硅棒为竖立置放，因此，至少两个第一夹持件232相对于第一夹具安装件231为竖向间隔设置，即，至少两个第一夹持件232为上下设置。
在具体实现方式上，任一个第一夹持件232更包括：第一夹臂安装座2320和至少两个第一夹臂2321，其中，第一夹臂安装座2320是设于第一夹具安装件231上，至少两个第一夹臂2321是活动设于第一夹臂安装座2320上。鉴于待切割硅棒的截面为圆形，在一种可选实施例中，第一夹持件232整体而言为圆形工件夹具，组成第一夹持件232的第一夹臂2321为对称设计的两个，单个第一夹臂2321设计为具有弧形夹持面，较佳地，单个第一夹臂2321 的弧形夹持面要超过四分之一的圆弧，这样，由两个第一夹臂2321所组成的第一夹持件232的弧形夹持面要超过二分之一的圆弧。当然，第一夹臂2321中的弧形夹持面上还可额外增设缓冲垫，用于避免在夹持待切割硅棒的过程中造成对待切割硅棒表面的损伤，起到保护待切割硅棒的良好效果。一般情形下，第一夹持件232中的第一夹臂2321在夹合状态下，两个第一夹臂2321所构成的夹持空间的中心是与待切割硅棒的中心相重合的。因此，当利用第一夹持件232去夹持置物区竖立置放的待切割硅棒时，第一夹持件232中的两个第一夹臂2321收缩，由第一夹臂2321中的弧形夹持面抵靠于待切割硅棒。在第一夹臂2321收缩并夹合待切割硅棒的过程中，待切割硅棒被两旁的两个第一夹臂2321所推动并朝向夹持空间的中央区域移动，直至待切割硅棒被第一夹持件232中的两个第一夹臂2321夹紧住，此时，待切割硅棒的中心就可位于第一夹持件232的夹持空间的中心。
为使得第一夹持件232中的至少两个第一夹臂2321能顺畅且稳固地夹持住不同尺寸规格的单晶圆硅棒，第一夹持件232还包括第一夹臂驱动机构，用于驱动至少两个第一夹臂134作开合动作。
请参阅图7，如图所示，在具体实现上，所述第一夹臂驱动机构进一步包括：第一开合齿轮2322、第一齿轮驱动件2323、以及第一驱动源2324。第一开合齿轮2322是设置于对应的第一夹臂2321上。第一齿轮驱动件2323具有与第一夹臂2321上的第一开合齿轮2322啮合的齿纹。第一驱动源2324连接于第一齿轮驱动件2323，用于驱动第一齿轮驱动件2323运动。在一种实现方式上，第一齿轮驱动件2323为第一齿条，该第一齿条位于两个第一夹臂2321的中间，第一齿条中分别面向于两侧的第一夹臂2321的两个外侧面上分别设有与两个第一夹臂2321上的第一开合齿轮2322啮合对应的齿纹，第一驱动源2324可例如为驱动电机或或气缸。这样，根据上述实现方式，在实际应用中，当需实现第一夹臂2321夹合时，由作为第一驱动源2324的驱动电机或气缸驱动作为第一齿轮驱动件2323的第一齿条向上移动，由第一齿条带动两旁啮合的第一开合齿轮2322作外旋动作，第一开合齿轮2322在外旋过程中带动第一夹臂2321(第一开合齿轮2322与第一夹臂2321可通过转轴连接)作下放动作以由松开状态转入夹合状态；反之，当需实现第一夹臂2321松开时，由作为第一驱动源2324的驱动电机(或气缸)驱动作为第一齿轮驱动件2323的第一齿条向下移动，由第一齿条带动两旁啮合的第一开合齿轮2322作内旋动作，第一开合齿轮2322在内旋过程中带动第一夹臂2321(第一开合齿轮2322与第一夹臂2321可通过转轴连接)作上扬动作以由夹合状态转入松开状态。当然，上述仅为一实施例，并非用于限制第一夹持件232的工作状态，实际上，前述中的“向上”、“外旋”、“下放”、“向下”、“内旋”、“上扬”、以及“松开”和“夹合”状态变化均可根据第一夹臂2321的结构和运作方式、第一夹臂驱动机构的构造而有其他的变更。
诚如本领域技术人员所知，针对待切割硅棒，是通过对原初的长硅棒进行截断作业而形成的，势必使得待切割硅棒之间的尺寸差异迥异，鉴于第一夹具是用于对竖立置放状态下的待切割硅棒进行夹持，因此，对于第一夹具而言，前述尺寸差异的影响主要就表现在待切割硅棒的长度差异性对第一夹具中的第一夹持件232是否能对应夹持到待切割硅棒的隐忧。
为减少甚至是免除上述第一夹持件232可能会无法夹持到待切割硅棒的风险，第一夹具会有不同的设计方案。
在一种实现方式中，第一夹具采用固定式夹持件，即，在换向载具230上以竖向方式固定设置尽可能多的第一夹持件232，且，这些第一夹持件232中相邻两个第一夹持件232的间距尽可能地小，如此，利用这些第一夹持件可涵盖各类规格长度的待切割硅棒。例如，若待切割硅棒的长度较长，则使用换向载具230上较多的第一夹持件232参与夹持；若待切割硅棒的长度较短，则使用换向载具230上较少的第一夹持件232参与夹持，例如，位于下方的若干个第一夹持件232参与夹持，而位于上方的且高于待切割硅棒的那些个第一夹持件232就不参与。
在其他实现方式中，第一夹具采用活动式夹持件，即，在换向载具230的第一夹具区上以竖向方式活动设置第一夹持件232，由于，第一夹持件为活动式设计，因此，第一夹持件232的数量就可大幅减少，一般为两个或三个即可满足。如此，利用活动式夹持件可涵盖各类规格长度的待切割硅棒。例如，若待切割硅棒的长度较长，则移动活动设置的第一夹持件232，延长两个第一夹持件232的夹持间距；若待切割硅棒的长度较短，则移动活动设置的第一夹持件232，缩短两个第一夹持件232的夹持间距。在第一夹具采用活动式夹持件的实现方式中，为便于活动式夹持件顺畅平稳的上下活动以调整位置，可利用第一夹具中的第一夹具安装件231起到引导活动设置的第一夹持件232的导向作用，一种可实现的方式中，第一夹具安装件231可采用导向柱结构，第一夹臂安装座2320则采用套接于导向柱结构的活动块结构。具体地，作为第一夹具安装件231的所述导向柱结构包括竖立设置且并行的两个导向柱，作为第一夹臂安装座2320的所述活动块结构中则设有与所述导向柱结构中的两个导向柱对应的两个贯孔或两个夹扣。若采用贯孔，所述活动块套设于所述导向柱并可实现沿着所述导向柱滑移。若采用夹扣，所述活动块夹扣于所述导向柱并可实现沿着所述导向柱滑移，其中，在实际应用中，所述夹扣可夹扣于所述导向柱的至少一半部分。
为实现第一夹持件232的移动，所述活动式设计的第一夹持件232可设有导第一导向驱动机构。利用第一导向驱动机构可驱动活动式设计的第一夹持件232沿着第一夹具安装件231上下移动。在一种实现方式中，第一导向驱动机构可例如包括：第一导向丝杠2325和第一导向电机2326，其中，第一导向丝杠2325为竖立设置，第一导向丝杠2325的一端连接于第一 夹臂安装座2320，第一导向丝杠2325的另一端则连接于第一导向电机2326，第一导向电机2326可设置在换向载具230的顶部，但并不以此为限。
在另一种可选实施例中，两个第一夹持件232均为活动式设计，这样，在实际应用中，可通过活动式设计的两个第一夹持件232的移动来调整它们相互之间的夹持间距。由于第一夹持件232为活动式设计，那么，两个第一夹持件232中的至少一个第一夹持件232需设置第一导向驱动机构，用于驱动两个第一夹持件232沿着第一夹具安装件231运动。相对于前一种可选实施例，在本可选实施例中，既然第一夹具中的两个第一夹持件232均为活动式，则可将第一导向驱动机构设置于两个第一夹持件232中的其中一个上，或同时设置在两个第一夹持件上。
现以在两个第一夹持件232中上方的第一夹持件232设置了第一导向驱动机构为例，在这种情形下，一来，两个第一夹持件232中的第一夹臂安装座2320与第一夹具安装件231之间为活动连接，即，任一个第一夹持件232中第一夹臂安装座2320及其上的第一夹臂2321沿着第一夹具安装件231而上下活动，另外，设置的第一导向驱动机构包括第一导向丝杠2325和第一导向电机2326，其中，第一导向丝杠2325的一端连接于上方的第一夹持件232中的第一夹臂安装座2320上，第一导向丝杠2325的另一端则连接于第一导向电机2326，第一导向电机2326可设置在换向载具230的顶部。如此，在需要调整上方的第一夹持件232的位置时，由第一导向电机2326驱动第一导向丝杠2325旋转，第一导向丝杠2325旋转过程中带动第一夹持件232沿着第一夹具安装件231上下移动，例如：第一导向电机2326驱动第一导向丝杠2325顺时针旋转，则带动上方的第一夹持件232沿着第一夹具安装件231向上运动以远离下方的第一夹持件232，增加两个第一夹持件232之间的夹持间距；第一导向电机2326驱动第一导向丝杠2325逆向旋转，则带动上方的第一夹持件232沿着第一夹具安装件231向下运动以靠近下方的第一夹持件232，减小两个第一夹持件232之间的夹持间距。如此，通过控制活动式设计的第一夹持件232，可调整两个第一夹持件232之间的夹持间距，从而对不同规格长度的待切割硅棒101进行有效夹持。
实际上，在两个第一夹持件232均为活动式设计的情形下，利用第一导向驱动机构不仅可调整两个第一夹持件232之间的夹持间距来对不同规格长度的待切割硅棒101进行有效夹持之外，还可对夹持的待切割硅棒101实现升降的目的，当两个第一夹持件232有效夹持住待切割硅棒101之后，通过驱动第一夹持件232的上下移动而升降待切割硅棒101。具体地，仍以上方的第一夹持件232设置了第一导向驱动机构为例，首先，上方的第一夹持件232通过第一导向驱动机构沿着第一夹具安装件231上下移动而调整了与下方第一夹持件232之间的夹持间距；接着，利用每一个第一夹持件232中的第一夹臂驱动机构驱动相应的两个第一 夹臂2321作夹合动作以顺畅且稳固地夹持住待切割硅棒101；随后，上方的第一夹持件232再通过第一导向驱动机构驱动而沿着第一夹具安装件231向上运动，此时，由于摩擦力作用，夹持住的待切割硅棒101及下方的第一夹持件232一并随之向上运动，其中，夹持住的待切割硅棒101向上运动利用的是上方的第一夹持件232与待切割硅棒101之间的摩擦力作用，第一夹持件232向上运动则利用的是待切割硅棒101与下方的第一夹持件232之间的摩擦力作用，从而实现抬升待切割硅棒101的效果。上方的第一夹持件232在第一导向驱动机构的驱动下带动待切割硅棒101和下方的第一夹持件232向下运动亦是相同的过程，从而实现降落待切割硅棒101的效果，在此不再赘述。
需说明的是，在其他变化例中，例如是在两个第一夹持件232中下方的第一夹持件232上设置第一导向驱动机构，第一导向驱动机构的结构、设置方式以及驱动工作方式与前述上方的第一夹持件232的第一导向驱动机构相类似，例如由下方的第一夹持件232在第一导向驱动机构的驱动下沿着第一夹具安装件231上下移动而调整与上方第一夹持件232之间的夹持间距，以及由下方的第一夹持件232在第一导向驱动机构的驱动下带动待切割硅棒101和上方的第一夹持件232一起沿着第一夹具安装件231上下移动等方式。再例如两个第一夹持件232均设置了第一导向驱动机构，则第一导向驱动机构的设置方式和驱动工作方式以及两个第一夹持件232的运动方式自不待言，在此不再赘述。
在针对活动式设置的第一夹持件232沿着第一夹具安装件231上下移动以适配于不同规格长度的待切割硅棒进行夹持的情形中，除了第一夹持件232采用活动式的结构设计、第一夹持件232需设置第一导向驱动机构等之外，势必还需要获知当前需要夹持的待切割硅棒的规格长度。有鉴于此，本申请中的工件转运装置还可包括高度检测仪(未在图式中予以显示)，用于竖立置放的待切割硅棒的高度，从而作为活动式设置的第一夹持件232在后续沿着第一夹具安装件231向上移动或向下移动以及移动距离的依据。
鉴于第二夹具设置于所述第二夹具区，是用来夹持已切割硅棒，本申请中所述已切割硅棒的截面为矩形，故所述第二夹具的结构与上述第一夹具结构相同，包括第二夹具安装件233和至少两个第二夹持件234，任一个第二夹持件234更包括：第二夹臂安装座2340和至少两个第二夹臂2341，其中，第二夹臂安装座2340是设于第二夹具安装件233上，至少两个第二夹臂2341是活动设于第二夹臂安装座2340上。所不同之处仅在于所述第二夹具的第二夹持件整体为方形工件夹具，具体地，组成第二夹持件234的第二夹臂2341为对称设计的两个，单个第二夹臂2341设计为具有单一平直夹持面(参见图5和图6)，所述第二夹具的其他结构在此不再赘述。
请参阅图3，如图所示，所述线切割装置设置在所述至少两个硅棒承载台21的上方，用 于对待切割硅棒进行切割，在一实施例中，所述线切割装置包括切割机架24以及线切割单元25，所述线切割单元25被切割机架24支撑于所述至少两个硅棒承载台21的上方，所述切割机架24固定于所述机座20上。
在一实施例中，所述切割机架24包括相对而设的两个支撑柱240和跨设于两个支撑柱相对两侧的安装架241，所述安装架241用于置放线切割单元25并被第一驱动机构驱动上升和下降以进行切割作业，为了给线切割单元25提供上升和下降的方向导向，在所述两个支撑柱的相对两侧设置有升降导轨242，所述安装架241上设置有匹配于所述升降导轨242的滑块(未给予附图标记)，所述第一驱动机构驱动安装架241带动线切割单元25沿着所述升降导轨242上升和下降以进行待切割硅棒的切割作业。
在一实施例中，所述第一驱动机构设置为气缸组件或丝杆组件。请参阅图8，显示为本申请多工位开方设备在一实施例中的第一驱动结构示意图，如图所示，所述第一驱动机构设置为丝杆组件，所述丝杆组件包括与丝杆243和电机244，所述丝杆243的一端与安装架241相连，另一端与电机244相连并被电机244驱动带动安装架241上升和下降。但并不局限于此，在其他的实施方式中，所述第一驱动机构也可以是气缸组件。
请参阅图3，如图所示，所述线切割单元25包括与硅棒承载台21数量对应的多个切割轮组251，每一个切割轮组251包括一对切割轮或两对切割轮，在任一对切割轮中的两个切割轮之间形成一条切割线段，在相邻两个切割轮组251之间设有过渡轮252，所述过渡轮252的线槽与切割轮组251中的切割轮的线槽在同一平面内。为了能够同时进行多个待切割硅棒的切割作业，在本实施例中，所述多个切割轮组251的数量与位于切割区的硅棒承载台21的数量相同并且相互间一一对应，这样在切割作业中，每个切割轮组251切割其相对应的硅棒承载台21上的待切割硅棒。
鉴于现有的线切割装置的切割轮空间布局复杂，需采用大量过渡轮对切割线进行换向，使得绕线复杂，开放设备占据空间大，制造成本高，故，在一实施例中，如图3所示，所述多个切割轮组251以一直线分布的方式设置于安装架241上。
在一种情形下，每个切割轮组包括一对切割轮，每个切割轮组中的一对切割轮依次设置在安装架的同一侧，相邻两个切割轮组中的一对切割轮之间仅设有一个过渡轮对切割线进行导向使得在每对切割轮中的两个切割轮之间形成一条切割线段，过渡轮的线槽与其相邻切割轮组中的切割轮的线槽位于同一平面内，从而使得各切割轮组的两个切割轮之间的切割线段位于同一直线上，较佳地，所形成的各个切割线段的长度略大于待切割硅棒的截面圆的直径。
请参阅图9，显示为本申请多工位开方设备在一实施例中的线切割装置中各切割轮组具有一对切割轮的结构示意图，以图示中线切割单元包括四个切割轮组为例进行绕线说明，所 述四个切割轮组分别为第一切割轮组251a、第二切割轮组251b、第三切割轮组251c和第四切割轮组251d，第一切割轮组251a和第二切割轮组251b之间设有第一过渡轮252a，第二切割轮组251b和第三切割轮组251c之间设有第二过渡轮252b，第三切割轮组251c和第四切割轮组251d之间设有第三过渡轮252c，采用单一连续的切割线顺次缠绕于第一切割轮组251a的一对切割轮，从而在第一切割轮组251a的一对切割轮上形成第一条切割线段L10，而后绕经第一过渡轮252a对切割线进行导向后接着顺次缠绕第二切割轮组251b的一对切割轮，在第二切割轮组251b的一对切割轮上形成第二条切割线段L20，再绕经第二过渡轮252b对切割线进行导向后顺次缠绕第三切割轮组251c的一对切割轮，在第三切割轮组251c的一对切割轮上形成第三条切割线段L30，最后绕经第三过渡轮252c对切割线进行导向后顺次缠绕第四切割轮组251d的一对切割轮上形成第四条切割线段L40后出线。在这种情形下，线切割单元进行一次下压切割，可同时完成四个待切割硅棒的一个轴切面的切割，在完成一次开方作业中，需要执行四个轴切面的切割流程，每完成一个轴切面的切割，需要通过硅棒承载台21的转动机构210对硅棒承载台21进行旋转(每次旋转90度)以调节待切割硅棒的待切割面，需要注意的是，为了保证使得开方后的硅棒整体呈长方体形，线切割单元对硅棒进行四次单个轴切面时的切割线的交点位于待切割硅棒的截面圆内(包括交点位于截面圆圆周上的情况)。
在另一种情形下，每个切割轮组包括两对切割轮，每个切割轮组中的两对切割轮分别依次设置在安装架的相对两侧，在安装架上还设置有导向轮组对切割线进行换向以将切割线从安装架一侧的切割轮导向安装架另一侧上的切割轮上，在相邻两个切割轮组之间设有过渡轮组对切割线进行导向，所述过渡轮组包括两个过渡轮，其中一个过渡轮对相邻两个切割轮组中的一对切割轮进行导向，另一个过渡轮对相邻两个切割轮组中的另一对切割轮进行导向，使得在任一对切割轮中的两个切割轮之间形成一条切割线段，位于同一侧的过渡轮的线槽与切割轮的线槽位于同一平面内以使得多个切割轮组中位于同一侧的两个切割轮之间的切割线段位于同一直线上，较佳地，所形成的各个切割线段的长度略大于待切割硅棒的截面圆的直径。
请参阅图10至图12，图10显示为本申请多工位开方设备在一实施例中的线切割装置中各切割轮组具有两对切割轮的结构示意，图11显示为图10的侧面结构示意图，图12显示为本申请多工位开方设备在一实施例中的线切割装置中各切割轮组具有两对切割轮情况下的导向轮绕线示意图。以图示中线切割装置包括四个切割轮组为例进行绕线说明，所述四个切割轮组分别为第一切割轮组251a、第二切割轮组251b、第三切割轮组251c和第四切割轮组251d，第一切割轮组251a和第二切割轮组251b之间设有第一过渡轮组，第二切割轮组251b和第三切割轮组251c之间设有第二过渡轮组，第三切割轮组251c和第四切割轮组251d之间设有第 三过渡轮组，鉴于切割线为单一连续的切割线，在安装架的两侧之间还设有导向轮组253对切割线进行换向以将切割线从安装架241一侧的切割轮导向安装架241另一侧上的切割轮上。采用切割线从安装架的一侧起绕，切割线顺次缠绕于第一切割轮组251a的一对切割轮251a′，从而在第一切割轮组251a的一对切割轮251a′上形成第一条切割线段L11，而后绕经第一过渡轮组中的一个过渡轮252a′对切割线进行导向后接着顺次缠绕第二切割轮组251b的一对切割轮251b′，在第二切割轮组251b的一对切割轮251b′上形成第二条切割线段L21，再绕经第二过渡轮组中的一个过渡轮252b′对切割线进行导向后顺次缠绕第三切割轮组251c的一对切割轮251c′，在第三切割轮组251c的一对切割轮251c′上形成第三条切割线段L31，最后绕经第三过渡轮组中的一个过渡轮252c′对切割线进行导向后顺次缠绕第四切割轮组251d的一对切割轮251d′上形成第四条切割线段L41后，切割线再依次绕经导向轮组253中的导向轮253a，导向轮253b，导向轮253c将切割线从安装架241的一侧第四切割轮组251d的一对切割轮251d′上导向安装架241另一侧上的第四切割轮组251d中的另一对切割轮251d〞上，切割线在第四切割轮组251d中的另一对切割轮251d〞上形成第五条切割线段L42后，接着绕经第三过渡轮组中的另一个过渡轮252c〞对切割线进行导向后顺次缠绕第三切割轮组251c中的另一对切割轮251c〞，在第三切割轮组251c的另一对切割轮251c〞上形成第六条切割线段L32后，绕经第二过渡轮组中的另一个过渡轮252b〞对切割线进行导向后顺次缠绕第二切割轮组251b中的另一对切割轮251b〞，在第二切割轮组251b的另一对切割轮251b〞上形成第七条切割线段L22后，再绕经第一过渡轮组中的另一个过渡轮252a〞对切割线进行导向后顺次缠绕第一切割轮组251a中的另一对切割轮251a〞，在第一切割轮组251a的另一对切割轮251a〞上形成第八条切割线段L12后出线，其中第一条切割线段L11和第八条切割线段L12为第一切割轮组的两条切割线段，第二条切割线段L21和第七条切割线段L22为第二切割轮组的两条切割线段，第三条切割线段L31和第六条切割线段L32为第三切割轮组的两条切割线段，第四条切割线段L41和第五条切割线段L42为第四切割轮组的两条切割线段，各切割轮组的两条切割线段用于对待切割硅棒的两个平行轴切面进行切割。在这种情形下，线切割单元进行一次下压切割，可同时完成四个待切割硅棒两个平行轴切面的切割，在完成一次开方作业中，需要执行两次两个平行轴切面的流程，在完成一次两个平行轴切面的切割后通过硅棒承载台的转动机构对硅棒承载台进行旋转(旋转90度)以调整待切割硅棒的待切割面。需要注意的是，为了保证使得开方后的硅棒整体呈长方体形，切割轮组的两对切割轮组的线槽的水平距离小于等于待切割硅棒的截面圆的内接正方形的边长，从而保证线切割单元对硅棒进行两次水平轴切面时的切割线的交点位于待切割硅棒的截面圆内(包括交点位于截面圆圆周上的情况)。
在一实施例中，请参见图3，如图所示，所述线切割装置还包括设置在机座20上的收线筒255和放线筒254，所述收线筒255和放线筒254在开方作业中用于对切割线进行收放。
利用上述线切割装置可对待切割硅棒实施开方切割以形成已切割硅棒和边皮。在线切割装置长期使用后，切割轮中绕有切割线的线槽会产生磨损，影响切割效果。因此，一般线切割装置的切割轮上布设有多个线槽，需要进行换槽作业，将切割线改绕切割轮的其他线槽，此时，就需要根据其他线槽与当前线槽的槽距，调整切割轮的移动距离。
鉴于此，所述多工位开方设备还包括自动换槽机构。请参阅图13和图14，图13显示为本申请多工位开方设备在一实施例中的自动换槽机构设置于线切割装置上的结构示意图，图14显示为本申请多工位开方设备在一实施例中的自动换槽机构的剖面结构示意图。如图所示，在实施例中，所述自动换槽机构29包括切割轮290、换槽筒292以及定位件291，所述切割轮包括用于绕设切割线的第一线槽及第二线槽，所述换槽筒与所述切割轮290相联动，用于带动所述切割轮290沿其轴向移动以将所述切割线由所述一个线槽移至相邻的另一线槽内，所述换槽筒292包括筒本体，以及开设于所述筒本体上的相互连通第一导轨293及第二导轨294，所述第一导轨293与第二导轨294之间的落差对应于所述第一线槽及第二线槽之间的槽距，所述定位件291可相对滑动地设置在所述第一导轨293或第二导轨内294，用于在所述换槽筒292沿轴向移动时在所述第一导轨293或第二导轨294内滑移带动所述换槽筒292旋转，以迫使所述切割轮290上的切割线由所述第一线槽切换至第二线槽。
请参阅图13、图14和图15，图15显示为图14的B部分的局部放大图，以下以切割轮包括两个线槽为例对自动换槽机构进行详细说明。
所述切割轮290包括用于绕设切割线的第一线槽和第二线槽(未给予图示)。在一实施例中，所述切割轮290包括第一线槽和第二线槽，以图14中示出的箭头方向为前，与箭头相反的方向为后，切割线最初绕设于所述第一线槽上，所述第二线槽位于第一线槽的后侧且与第一线槽相邻。
所述换槽筒292与所述切割轮290相联动，用于带动所述切割轮290沿其轴向移动以将所述切割线由所述一个线槽移至相邻的另一个线槽内，所述换槽筒292包括筒本体和开设于所述筒本体上相互连通的第一导轨293和第二导轨294，所述第一导轨293与第二导轨294之间的落差对应于所述第一线槽及第二线槽之间的槽距。
所述定位件291可相对滑动地设置在所述第一导轨293或第二导轨294内，用于在所述换槽筒292沿轴向移动时在所述第一导轨293或第二导轨294内滑移带动所述换槽筒292旋转，以迫使所述切割轮290上的切割线由所述第一线槽切换至第二线槽。
在一实施例中，所述换槽筒292设置于前述切割机架24的安装架241上，所述换槽筒 292的前端设置一定位轴(未予以图示)，所述切割轮290通过一轴承可转动的设置于所述定位轴上，换槽筒292沿其轴向移动则可带动切割轮290沿其轴向移动以将所述切割线由第一线槽移至第二线槽内。
在一实施例中，所述换槽筒292被一驱动装置驱动295沿其轴向作伸缩移动，所述驱动装置295包括气缸组件或藉由电机驱动的丝杆组件，在本实施例中，所述驱动装置295设置为气缸组件，所述气缸组件包括气缸和被气缸驱动伸缩的伸缩杆，所述换槽筒292的后端通过一轴承设置于所述伸缩杆上，使得所述换槽筒292可被气缸组件推动沿其轴向移动同时也可受力发生转动。但并不以此为限，在其他实施例中，所述驱动装置295也可为藉由电机驱动的丝杆组件，所述换槽筒292的后端通过一轴承设置于所述丝杆组件上，电机驱动丝杆组件伸展或回缩使得换槽筒292沿其轴向移动且同时可受力发生转动。
为了能够实现自动换槽，每次调整切割轮290的移动距离为第一线槽与第二线槽之间的槽距，故，所述第一导轨293与第二导轨294之间的落差H对应于所述第一线槽及第二线槽之间的槽距，在一实施例中，所述第一导轨293具有第一落位端2930，所述第一落位端2930与所述第一线槽具有第一距离，所述第二导轨294具有第二落位端2940，所述第二落位端2940与所述第二线槽具有第二距离，所述第一距离等于第二距离。如此，第一导轨293与第二导轨294之间的落差H等于第一线槽与第二线槽之间的槽距。
为了便于引导定位件291由第一导轨293的第一落位端2930相对滑动至第二导轨294的第二落位端2940以实现自动换槽，在实施例中，所述第一落位端2930与所述第二落位端2940之间具有过渡端296。
为了进一步地方便定位件291快速的由第一落位端2930滑移至过渡端296并由过渡端296滑移至第二落位端2940，所述第一落位端2930与所述过渡端296之间具有上行段297以为定位件291提供上行通道，所述过渡端296与第二落位端2940之间具有下行段298以为定位291件提供下行通道。在实施例中，所述上行段297由第一落位端方向至过渡端方向呈收缩状态，所述下行段298由过渡端方向至第二落位端方向呈收缩状态。
较佳地，为了引导定位件291快速准确的滑移通过过渡端296，所述过渡端296具有连通所述上行段297的第一通道2960，所述过渡端296具有连通所述下行段297的第二通道2961，所述第一通道2960的宽度小于上述第二通道2961。
为了避免定位件291在过渡端296出现回滑，即定位件291不能顺利的沿着过渡端296的第一通道2960滑向过渡端296的第二通道2961进入下行段298，而由过渡端296的第一通道2960进入上行段297回到第一落位端2930，使得不能实现自动换槽。在一实施例中，所述过渡端296临近所述切割轮290的顶点位于所述第二通道2961，即可理解为第一通道 2961与切割轮290之间的水平距离大于第二通道2961与切割轮290之间的水平距离以使得所述定位件291由第一通道2960滑移至第二通道2961的运行状态为带有坡度的上行，使得所述换槽筒292沿其轴向后移时，定位件291由第一通道2960滑移至第二通道2961的同时带动所述换槽筒292发生旋转以实现定位件由第一导轨293至第二导轨294的切换。同样，为了避免定位件291在第一落位端2920不能顺利的滑移至所述上行段297，所述第一落位端2930远离所述切割轮290的顶点的投影位于上行段297内。
所述定位件291固定连接于一固定座299上，所述固定座299连接于所述多工位切割设备的线切割装置的安装架241上，用于将定位件291设置于所述第一导轨293或第二导轨294内。在实施例中，所述固定座299设置为套设所述换槽筒292的罩体，所述定位件299的一端固定于所述换槽筒292的筒壁上，另一端伸入所述第一导轨293或第二导轨294内，在所述换槽筒292被驱动沿其轴向移动时，所述定位件291在第一导轨293或第二导轨294内滑移。但所述固定座299并不以此为限，在其他实施例中，所述固定座299还可设置为置于换槽筒292内的固定杆，所述定位件291的一端连接于所述固定杆的外壁，另一端伸入所述第一导轨293或第二导轨294内，在所述换槽筒292被驱动沿其轴向移动时，所述定位件291在第一导轨293或第二导轨294内滑移。
请参阅图16a至图16b，图16a至图16d显示为本申请多工位开方设备的自动换槽机构的运动过程结构示意图，如图所示，所述切割线最初位于切割轮290的第一线槽内，与之对应的，所述定位件291位于所述第一导轨293的第一落位端2930(呈如图16a所示)，在所述自动换槽机构进行换槽时，首先驱动所述换槽筒292沿其轴向后移(图16a中箭头方向)以使得所述定位件291由第一落位2930进入所述上行段297上行至所述过渡端的第一通道2960(呈如图16b所示)，而后，驱动所述换槽筒292沿其轴向继续后移使得定位件291配合过渡端296迫使换槽筒292旋转(图16b中箭头方向)，从而使得定位件291由过渡端的第一通道2960滑移至过渡端的第二通道2961(呈如图16c所示)，最后，驱动所述换槽筒292沿其轴向前移(如图16c中箭头方向)以使得所述定位件291由过渡端的第二通道2961进入下行段298下滑至第二落位端2940(呈如图16d所示)，以此，使得所述换筒槽292沿其轴向前移了第一线槽和第二线槽之间槽距的距离，使得切割线由第一线槽切换至第二线槽。
值得说明的是，在上述实施例中，所述切割轮包括两个线槽，分别为第一线槽和第二线槽，所述换槽筒开设有两个导轨，分别为第一导轨和第二导轨，但所述切割轮包括的线槽的数量和所述换槽筒开设的导轨的数量并不以此为限。
在其他实施例中，所述切割轮包括三个线槽，可例如所述切割轮除包括上述实施例中的第一线槽和第二线槽外，还包括第三线槽，所述第三线槽邻设于上述第二线槽的后侧。
所述换槽筒开设的导轨的数量与所述线槽的数量相一致，设置为三个，可例如所述换槽筒除开设有上述实施例中的第一导轨和第二导轨外，还开设有第三导轨，所述第三导轨连通于上述第二导轨且与第二导轨之间的落差对应于上述第二线槽及所述第三线槽之间的槽距，即所述第三导轨具有第三落位端，所述第三落位端与所述第三线槽具有第三距离，所述第三距离等于上述第二距离。
为了便于引导定位件由上述第二导轨的第二落位端相对滑动至第三导轨的第三落位端以实现切割线由上述第二线槽切换至第三线槽，在实施例中，上述第二落位端与所述第三落位端之间也具有过渡端，同样的，上述第二落位端与该过渡端之间具有上行段，所述上行段具有第一坡度的侧壁，该过渡端与第三落位端之间具有下行段，所述下行段具有第二坡度的侧壁，在实施例中，所述上行段由第二落位端方向至该过渡端方向呈收缩状态，所述下行段由该过渡端方向至第三落位端方向呈收缩状态。
为了引导定位件快速准确的滑移通过该过渡端，该过渡端具有连通所述上行段的第一通道和连通所述下行段的第二通道，所述第一通道的宽度小于上述第二通道。
为了避免定位件在该过渡端出现回滑，即定位件不能顺利的沿着过渡端的第一通道滑向过渡端的第二通道进入下行段，而由过渡端的第一通道进入上行段回到第二落位端，使得不能实现切割线由第二线槽移至第三线槽。在一实施例中，该过渡端临近所述切割轮的顶点位于所述第二通道，即可理解为第一通道与切割轮之间的水平距离大于第二通道与切割轮之间的水平距离以使得所述定位件由第一通道滑移至第二通道的运行状态为带有坡度的上行，使得所述换槽筒沿其轴向后移时，定位件由过渡端的第一通道滑移至第二通道的同时带动所述换槽筒发生旋转以实现定位件由第二导轨至第三导轨的切换。同样，为了避免定位件在第二落位端不能顺利的滑移至该过渡端，所述第二落位端远离所述切割轮的顶点的投影位于第一通道内。
但并不局限于此，在实际的实施形态中，所述切割槽上的线槽还可以为4个、5个，以此类推，所述切割轮还可包括多个线槽，所述换槽筒还可开设有与所述线槽数量相一致的相互连通的多个导轨，当然，随着导轨数量的增加，需要增加所述换槽筒的直径，在此不作赘述。
一般情况下，由于待切割硅棒本身自重较大，其可通过本身的自重较为稳定的立式置放于硅棒承载台上，不过在后续硅棒切割作业中，待切割硅棒会受到线切割单元中切割线的拉扯作用而出现扰动、错位甚至倾覆等风险。为了避免上述各类风险的出现，在位于切割区的硅棒承载台的上方还设置有可做升降运动的硅棒压紧装置，所述硅棒压紧装置架设于所述升降导轨上且位于所述线切割装置上方，即，所述硅棒压紧装置和所述线切割装置共用同一升 降导轨，所述硅棒压紧装置用于在所述线切割装置对切割区的硅棒承载台上的待切割硅棒进行切割时压紧待切割硅棒的顶部。
请参阅图17，显示为本申请多工位开方设备在一实施例中的具有硅棒压紧装置的结构示意图，如图所示，所述硅棒压紧装置26包括压紧支架260和设于所述压紧支架上且与位于切割区的硅棒承载台21对应的压紧单元261。所述压紧支架260上固定有与所述升降导轨242相配合的滑块262，所述压紧支架260通过其滑块262与所述升降导轨242的配合可升降的架设于所述切割机架24的支撑柱240上且位于所述线切割装置上方，所述压紧单元261设置于压紧支架260上并可随压紧支架260升降以释放或压紧位于切割区硅棒承载台21上的待切割硅棒。
受制造工艺的影响，位于切割区硅棒承载台21上的待切割硅棒在高度上并不完全一致，压紧单元261跟随压紧支架260下降并不能保证每个压紧单元261都紧压在其对应的硅棒承载台21所承载的待切割硅棒上。鉴于此，所述压紧单元261包括压块2610和驱动所述压块作升降活动的驱动结构。在一实施例中，所述驱动结构设置为气缸组件，所述气缸组件包括气缸2611和与气缸相连的伸缩件2612，所述压块2610设置在伸缩件2612的底部(即伸缩件2612朝向位于切割区的硅棒承载台21的表面上)，所述气缸2611驱动伸缩件2612带着压块2610作升降运动以释放或压紧位于切割区硅棒承载台21上的待切割硅棒。
鉴于硅棒承载台21具有转动机构210，可带动位于其上的待切割硅棒进行旋转以调整待切割面。为了配合硅棒承载台21的转动机构210，在一实施例中，所述压块2610通过转轴(未予以图示)与所述驱动结构连接。具体地，在气缸组件的伸缩件2612的底部设置一轴承(未予以图示)，所述压块2610具有一与所述轴承相适配的转轴，所述压块2610通过转轴可转动的安装于所述伸缩件2612的轴承上，如此，在压块2610压紧待切割硅棒时硅棒承载台21带动待切割硅棒转动，所述压块2610也可配合于待切割硅棒发生旋转。
为了更好的保护待切割硅棒，可在所述压块2610和待切割硅棒之间设置缓冲垫(未予以图示)，该缓冲垫固定于所述压块2610的压紧面(该压紧面即为所述压块的下表面)。
为了简化本申请多工位开方设备的结构，降低设备的制造成本，在一种实施方式中，所述硅棒压紧装置26依靠自身重力搭附于用于安装线切割单元的安装架241上沿着升降导轨242作升降运动。所述第一驱动机构驱动安装架241带动线切割单元25沿着所述升降导轨242下降，所述硅棒压紧装置26搭附着所述安装架241也沿着所述升降导轨242下降至位于切割区的硅棒承载台21承载的待切割硅棒的顶部，其压紧单元261中的驱动结构驱动压块2610压紧所对应的待切割硅棒，而安装架241将继续被第一驱动机构驱动带着线切割单元25下降进行待切割硅棒的切割作业。为了防止硅棒压紧装置26跟随安装架241继续下降而损坏待切 割硅棒，在所述硅棒压紧装置26的压紧支架260上设置有导轨锁紧单元263，所述导轨锁紧单元263用于将所述硅棒压紧装置26定位于升降导轨242上预定位置，例如，预定位置为硅棒压紧装置26中的压紧单元261位于其所对应的待切割硅棒上方0～5cm，但并以此为限，只需压紧单元261位于其所对应的待切割硅棒上方，在压紧单元261中的压块2610被驱动下降时能够压紧于其对应的待切割硅棒的顶面。
在一实施例中，所述导轨锁紧单元263采用气动导轨锁紧装置，具体地，本实施例中的气动导轨锁紧装置包括与升降导轨242相配合的锁紧夹块以及驱动锁紧夹块动作的气缸，所述锁紧夹块设置于所述硅棒压紧装置26中的压紧支架260上，所述硅棒压紧装置26跟安装架241下降到预定位置时，气缸驱动压紧支架上的锁紧夹块抱紧升降导轨242而将硅棒压紧装置26定位于预定位置，所述硅棒压紧装置26中的压紧单元261压紧其相应的待切割硅棒，而安装架241继续被驱动带动线切割单元25下降完成待切割硅棒的切割，在完成待切割硅棒的切割作业之后，所述安装架241被第一驱动机构驱动带动线切割单元25上升至硅棒压紧装置26所定位的位置时，所述气缸驱动压紧支架260上的锁紧夹块放松升降导轨242以使得硅棒压紧装置26继续搭附于安装架241上升。
在另一种实施方式中，所述硅棒压紧装置26架设于所述升降导轨242上并被第二驱动机构驱动沿着所述升降导轨242作升降运动，所述第二驱动机构设置为气缸组件或藉由电机驱动的丝杆组件。于实际应用中，第一驱动机构驱动安装架241载着线切割单元25下降，第二驱动机构驱动硅棒压紧装置26下降至预定位置时，第二驱动机构停止驱动硅棒压紧装置26使得硅棒压紧装置26定位于预定位置对待切割硅棒进行压紧，而第一驱动机构继续驱动安装架241载着线切割单元25下降以完成待切割硅棒的切割，完成待切割硅棒的切割作业后，第一驱动机构驱动安装架241载着线切割单元25上升，第二驱动机构驱动硅棒压紧装置26上升。
另外，考虑到为实现对待切割硅棒的完全切割以及为避免切割线因受到阻挡而产生损伤等情况，在一实施例中，硅棒承载台为呈圆形截面或矩形截面的台面结构，所述台面结构中与硅棒接触的承载面的尺寸要大于待切割硅棒经开方切割后形成的已开方硅棒的截面，因此，所述台面结构上设置有供所述切割线段进入的切割槽，具体地，所述台面结构上设置有供切割线段进入的四段切割槽。这样，线切割装置跟随安装架下降时，切割装置中所形成的切割线段对位于切割区的硅棒承载台所承载的待切割硅棒进行开方切割，所述切割线段到达待切割硅棒的底部时，就可以无阻碍的继续下降直至贯穿待切割硅棒，实现对待切割硅棒的完全切割，当然，硅棒承载台的结构并不以此为限。
在其他实施例中，硅棒承载台为呈矩形截面的台面结构，所述台面结构中与硅棒接触的 承载面的尺寸要略小于待切割硅棒经开方切割后形成的已开方硅棒的截面。这样，线切割装置中线切割单元跟随切割机架相对机座下降，切割单元中所形成的切割线段对位于切割区的硅棒承载台所承载的待切割硅棒进行开方切割，所述切割线段到达待切割硅棒的底部时，就可以无阻碍的继续下降直至贯穿待切割硅棒，实现对待切割硅棒的完全切割。
如上所述，硅棒承载台为呈矩形截面的台面结构，所述台面结构中与硅棒接触的承载面的尺寸要略小于待切割硅棒经开方切割后形成的已开方硅棒的截面，这样，可确保线切割单元中的切割线段无阻碍地对位于切割区的硅棒承载台所承载的待切割硅棒进行开方切割。不过，这样的设计同时也带来了一个问题：待位于切割区的硅棒承载台上的待切割硅棒完成开方切割作业后，被切割后形成的边皮可能因没有相应的支撑而存在发生掉落或倾覆等风险。因此，本申请多工位开方设备还包括边皮顶托机构，用于顶托待切割硅棒进行开方切割后所形成的边皮。
本申请所公开的边皮顶托机构设于硅棒承载台的周边，线切割装置对切割区的硅棒承载台所承载的待切割硅棒进行一次切割后，被切割的侧面上会形成边皮。因此，在实际应用中，在呈矩形截面台面结构的硅棒承载台的周边四侧处分别对应设有一个边皮顶托机构，以顶托对应的一个边皮。通过本申请所公开的边皮顶托机构，可顶托住经线切割装置对待切割硅棒进行开方切割作业后形成的边皮，避免边皮与已开方硅棒发生相对位移，防止线切割装置中的切割线段在穿出待切割硅棒时出现崩边的状况，且可避免边皮发生掉落和倾覆等，以及已开方硅棒因受到边皮触碰而损伤等现象。
在一实施例中，参阅图18，显示为本申请多工位开方设备在一实施例中的边皮顶托机构的结构示意图，如图所示，所述边皮顶托机构27包括承托件，所述承托件包括连接于硅棒承载台21其中一侧面的底座270和由底座向上延伸的顶托部271。在本实施例中，所述底座270设置为与硅棒承载台21的侧面相适配的平面板结构，但并不以此为限，所述底座270也可设为曲面板结构或其他异型结构，所述顶托部271设置为位于所述底座270两侧的两个顶柱，所述顶柱延伸的高度与硅棒承载台21的承载面的高度一致，实际中，所述顶托部271也可采用为由所述底座270向上延伸的顶板或顶杆。当线切割装置对硅棒承载台21上的待切割硅棒进行开方切割时，承托件即可托住对应的边皮，从而有效防止线切割装置中的切割线段在穿出待切割硅棒时出现崩边的状况，且可避免边皮发生掉落和倾覆。
在另一实施例中，所述边皮顶托机构包括活动承托件和锁定控制件。在本实施例中所述活动承托件包括连接于硅棒承载台其中一侧面的活动底座、由所述活动底座向上延伸的顶托部、以及提供所述顶托部上下运动的动力产生结构。在一实现方式中，所述活动底座可例如为与硅棒承载台的侧面相适配的平面板结构，但并不以此为限，所述活动底座也可例如为曲 面板结构或其他异型结构。所述顶托部为由所述活动底座向上延伸的至少两个顶杆，但并不以此为限，所述顶托部也可例如为由所述活动底座向上延伸的顶板或顶柱。所述动力产生结构包括设于所述活动底座处的两个支脚以及分别套设于两个支脚的两个弹簧，但并不以此为限，所述动力产生结构也可采用例如扭簧、弹片等结构。利用所述弹簧的弹力，可使得所述支脚及相连的所述顶杆能相对于硅棒承载台作上下运动。在本实施例中所述锁定控制件用于在活动承托件抵靠于待切割硅棒的底部时将活动承托件控制在锁定状态，在一实现方式中，锁定控制件则可例如为电磁锁。在初始状态下，所述顶杆在所述支脚和所述弹簧的作用下凸露于硅棒承载台的承载面，当将待切割硅棒进行置放时，所述顶杆在受到待切割硅棒的压制后克服所述弹簧的弹力而向下运动直至于待切割硅棒完全置放于硅棒承载台的承载面上，此时，作为锁定控制件的电磁锁通电并通过电生磁原理产生的强磁力紧紧地吸附住活动承托件中的活动底座，从而将所述顶杆控制在锁定状态。当线切割装置对硅棒转换装置中对应于切割区的硅棒承载台所承载的待切割硅棒进行开方切割时，处于锁定状态下的活动承托件即可顶托住对应的边皮，能有效防止线切割单元中的切割线网在穿出待切割硅棒时出现崩边的状况，且可避免边皮发生掉落和倾覆等。
根据上述可知，待切割硅棒经开方切割后会形成边皮，为了不妨碍线切割装置的上升，需要及时对边皮卸料，针对边皮的卸料，一般的边皮卸料方式大多还是由操作人员手工操作将边皮脱离于已开方硅棒并将其搬离出硅棒多工位开方设备，不仅效率低下，且在搬运过程中会使得边皮与已开方硅棒发生碰撞而增加已开方硅棒损伤的风险。有鉴于此，本申请多工位开方设备还包括边皮卸料装置，用于将线切割装置对待切割硅棒进行开方切割后形成的边皮予以卸料。
请参阅图19，显示为本申请多工位开方设备在一实施例中的边皮提升机构的结构示意图，所述边皮卸料装置28包括边皮提升机构280，用于提升所述边皮以使所述边皮10的顶端凸出于所述已切割硅棒。所述边皮提升机构280包括设于所述安装架241上的顶升件2800，所述顶升件2800被一伸缩部件2801驱动可做伸缩运动，所述顶升件2800受控作伸展运动后托住所述边皮10的底部以顶升所述边皮10。
在一实施例中，所述顶升件2800包括抵靠板和承托板，所述抵靠板自所述承托板的底部向上延伸出，进一步地，所述抵靠板更可为与边皮10的弧形表面相适配的弧形板，当所述抵靠板抵靠于边皮10时，能与边皮10的弧形表面充分接触，所述抵靠板与边皮10接触的部位为圆滑设计或者在所述抵靠板中要有与边皮10接触的内表面增设缓冲垫。所述承托板用于承托住边皮10的底部，进一步地，所述承托板更可为与边皮10的底面相适配弓形板。在其他实施例中，作为承托板的弓形板的弦边还可增设凸块，以可增加与边皮10的底面的接触面积。
在一实施例中，伸缩部件2801可例如为带有伸缩杆的气缸，其中，所述伸缩杆可通过连接结构与顶升件2800中的所述承托板连接，所述气缸可驱动所述伸缩杆以带动顶升件2800作伸缩运动。这里，顶升件2800作伸缩运动包括顶升件2800的收缩运动和顶升件的伸展运动，其中，顶升件2800的收缩运动具体指的是所述气缸驱动所述伸缩杆收缩以带动顶升件2800远离边皮10，顶升件2800的伸展运动具体指的是所述气缸驱动所述伸缩杆伸展以带动顶升件2800靠近边皮10。当然，前述伸缩部件2801也可采用其他实现方式，例如，所述伸缩部件2801也可例如为带有丝杠的伺服电机，所述丝杠与所述顶升件相连，由所述伺服电机的驱动所述丝杠转动以带动相连的所述顶升件2800作伸缩运动，例如，驱动所述丝杠正向转动带动所述顶升件2800作收缩运动及驱动所述丝杠逆向转动带动所述顶升件2800作伸展运动，或者，驱动所述丝杠正向转动带动所述顶升件2800作伸展运动及驱动所述丝杠逆向转动带动所述顶升件2800作收缩运动。
于实际应用中，在初始状态下，所述伸缩杆带动顶升件2800处于收缩状态，线切割单元25被驱动随着安装架241下降以使得线切割单元25中各个切割线段所形成的切割线对位于切割区的待切割硅棒进行开方切割，直至所述切割线段贯穿待切割硅棒，完成对待切割硅棒的一次完全切割并形成边皮10，此时，边皮提升机构280已跟随线安装架241下降至底部，所述气缸驱动所述伸缩杆伸展以带动顶升件2800靠近边皮10直至顶升件2800中的抵靠板与边皮10接触并实现抵靠，后续，线切割单元25被驱动跟随安装架241上升，边皮提升机构280跟随安装架241上升，带动边皮10相对已进行一次切割的硅棒发生上升位移，使得边皮10的顶端凸出于待切割硅棒，当边皮10的顶端相较于待切割硅棒凸出部分满足设定条件时，则可控制安装架241停止上升，如此，边皮的顶端即可作为进行抓取的着力部位，使得边皮被抓取卸料，然后，气缸驱动伸缩杆收缩以带动顶升件2800回到初始状态的同时控制安装架241带动线切割单元25和边皮提升机构280继续上升至待切割硅棒上方以备执行下一次切割作业。
在其他实施例中，所述边皮提升机构可包括吸附件和驱动所述吸附件作伸缩运动的伸缩部件，所述吸附件受控于所述伸缩部件而抵靠于边皮并吸附住边皮。所述吸附件更可包括抵靠板和吸附元件。所述抵靠板可例如为与所述边皮的弧形表面相适配的弧形板，当所述抵靠板抵靠于所述边皮时，能与所述边皮的弧形表面充分接触。所述吸附元件可例如为真空吸盘，多个真空吸盘可布设于所述抵靠板中要与所述边皮接触的接触面上。所述伸缩部件可例如为带有伸缩杆的气缸或是带有丝杠的伺服电机，以带有伸缩杆的气缸为例，所述伸缩杆可通过连接结构与所述顶升件中的抵靠板连接，所述气缸可驱动所述伸缩杆收缩以带动所述抵靠板远离所述边皮，所述气缸可驱动所述伸缩杆伸展以带动所述抵靠板靠近所述边皮并在所述抵 靠板与所述边皮接触后由所述吸附元件吸附住所述边皮。后续，安装架被驱动上升，所述边皮提升机构和线切割装置跟随安装架上升，所述边皮提升机构利用吸附力可带动边皮相对所述已进行一次切割作业的硅棒发生上升位移，使得所述边皮的顶端凸出于所述已进行一次切割作业的硅棒。
需要说明的是，由于本申请多工位开方设备设置有多个切割轮组同时对多个待切割硅棒进行切割，故而在安装架上对应于多个切割轮组设置有多个边皮提升机构同时对已进行切割作业的多个硅棒进行边皮卸料。在每个切割轮组设置有一对切割轮的情况下，所述线切割装置的一次下压切割形成一个边皮，在安装架上对应于每个切割轮组的一对切割轮的上方设有一个边皮提升机构以将切割作业中形成的边皮及时卸料。在每个切割轮组设置有两对切割轮的情况下，所述线切割装置的一次下压切割形成两个边皮，在安装架上对应于每个切割轮组的两对切割轮的上方各设有一个边皮提升机构以将切割作业中形成的边皮及时卸料。
所述边皮卸料装置28还包括夹持转运单元281，设于硅棒承载台21的上方，用于夹持住所述边皮的顶端并拉升所述边皮以脱离所述已开方硅棒以及将所述边皮转运至边皮卸料区。
请参阅图3，如图所示，所述夹持转运单元281包括提供至少一个方向移动的移动机构283和边皮夹持机构284，所述边皮夹持机构284与所述移动机构283相连并被带动在至少一个方向移动。
在一实施例中，在所述切割机架24的相对而设的两个支撑柱240的顶端跨设有一用于支撑夹持转运单元281的支撑板282，所述夹持转运单元281设于支撑板282上并对应于位于切割区的硅棒承载台的上方。
在一实施例中，所述边皮夹持机构284可设置为与位于切割区的硅棒承载台一一对应的多个。为了简化机构、降低制造成本以及降低工作能耗，在实施例中，相邻两个边皮夹持机构284共用一个提供至少一个方向移动的移动机构283。
在一实施例中，参见图3和图20，图20显示为图3中A部分的局部放大图，如图所示，所述至少一个方向移动的移动机构283为X向移动机构，所述X向移动机构包括X向导轨2830、X向滑块2831以及X向驱动源2832，其中，所述X向导轨2830铺设于支撑板282上，所述X向滑块2831适配于所述X向导轨2830并在X向滑块2831上设置一安装座2833，两个边皮夹持机构284分别位于安装座2833的左右两侧，所述X向驱动源2832可例如为X向伸缩气缸组件或X向电机。为了使得边皮夹持机构284能够平稳的在X向移动，本实施例中采用双导轨设计，即，采用两个X向导轨2830，这两个X向导轨2830沿着X向并行设置。如此，由X向驱动源2832驱动X向滑块2831上的安装座2833载着其上的两个边皮夹持机构284沿着X向导轨2830作X向运动。于实际应用中，所述移动机构283的移动方向并不 以此为限，在其他实施例中，移动机构还可包括Y向移动机构，还可包括Z向移动机构。
请参阅图21，图21显示为本申请多工位开方设备在一实施例中的边皮夹持机构的外部结构示意图，如图所示，所述边皮夹持机构284包括升降驱动结构2841和以及设置在升降驱动结构底部的夹持组件。在实施例中，所述升降驱动结构2841用于驱动夹持组件作升降运动，所述升降驱动结构2841可例如为带有升降杆的升降气缸，所述升降杆与夹持组件相连，利用升降气缸可控制所述升降杆伸缩以带动夹持组件作升降运动，但并不以此为限。例如所述升降驱动结构还可为藉由电机驱动的丝杆组件，所述丝杆组件与夹持组件相连，利用电机驱动丝杆组件升降以带动夹持组件作升降运动。
请参阅图22，图22显示为本申请多工位开方设备在一实施例中的夹持组件的剖面结构示意图，如图所示，所述夹持组件包括罩体2842和可伸缩的夹持件，所述可伸缩的夹持件设于所述罩体2842内部，所述夹持件与所述罩体2842之间形成供夹持所述边皮的夹持空间2843。在实施例中，所述罩体2842用于罩设于边皮，所述罩体2842的可罩入尺寸要略大于待切割硅棒的截面圆，所述罩体2842设置为封闭或者非封闭的圆形罩，但并不以此为限。
所述夹持组件的结构并不以此为限，在其他实施例中，所述夹持组件包括弧形板和可伸缩的夹持件，所述夹持件与所述弧形板之间形成供夹持所述边皮的夹持空间。
如图22所示，所述夹持件为由一气缸2845控制的活动压块2844，所述活动压块2844通过一翻转臂2846与所述气缸2845连接。在实施例中，所述翻转臂2846具有一安装部和分别位于所述安装部相对两侧的第一连接部和第二连接部，其中，第一连接部连接所述气缸2845的活塞杆2848，第二连接部连接活动压块2844。
在一实施例中，所述罩体2842内部设置有一用于承载所述夹持件的基座2847，所述基座2847承载所述夹持件探入已切割硅棒与边皮之间的凹陷区，所述气缸2845固定于基座2847的侧壁上且具有活塞杆2848，所述翻转臂2846的安装部与一固定于基座2847底部的支撑座2849相铰接以使得翻转臂2846能够以安装部为轴心上下转动，所述活动压块2844与翻转臂2846的第二连接部固定相连，所述翻转臂2846第一连接部与所述气缸的活塞杆2848相铰接，气缸2845推动活塞杆2848作伸缩以带动翻转臂2846的第一连接部以支撑座2849为中心点下降或提升，从而使得翻转臂2846的第二连接部以支撑座2849为中心点提升或下降，从而使得与翻转臂的第二连接部相连的活动压块2844相对于罩体2842远离或靠近，调整其与罩体2842之间的夹持空间2843。具体地，参见图22，在初始状态为翻转臂2846的第二连接部高于其第一连接部，活动压块2844远离罩体2842。在需要夹持边皮时，气缸2845驱动活塞杆2848回缩从而提拉翻转臂2846的第一连接部以支撑座2849为中心点上升，翻转臂2846的第二连接部则以支撑座2849为中心点下降而带动活动压块2844靠近所述罩体2842(如图 22中的箭头方向)，减小了活动压块2844与罩体2842之间的夹持空间2843以夹紧边皮。在需要释放边皮时，气缸2845驱动活塞杆2848伸展从而带动翻转臂2846的第一连接部以支撑座2849为中心点下降，翻转臂2846的第二连接部则以支撑座2849为中心点上升而带动活动压块2844远离所述罩体2842即回到初始状态，增大了活动压块2844与罩体2842之间的夹持空间2843以便于释放边皮。为了避免活动压块2844在长期夹持中与边皮接触，互相产生磨损和伤害，在一实施例中，所述活动压块2844设有用于与所述边皮接触的缓冲垫。
需要说明的是，如前所述，线切割单元24包括有多个切割轮组251，在某些实施方式中，各切割轮组251包括一对切割轮，利用所述一对切割轮对待切割硅棒进行切割作业需要执行四次单轴面切割步骤，在这种实施方式中，所述夹持件的数量设置为一个。执行第一次单轴面切割，形成一个边皮，利用一个夹持件将该边皮夹持住并再通过升降驱动结构2841和X向移动机构将所述边皮予以转送出去，再调整待切割硅棒的切割面(例如旋转90度)，执行第二次单轴面切割，再次形成一个边皮，再次利用一个夹持件将该边皮夹持住并再通过升降驱动结构2841和X向移动机构将所述边皮予以转送出去，执行第三次和第四次单轴面切割形成的边皮均以该方式转送出去，在此不做赘述。在另一些实施方式中，各切割轮组251包括两对切割轮，利用所述两对切割轮对待切割硅棒进行切割作业需要执行两次两个平行轴面的切割，在这种实施方式中，所述夹持件设置为相对设置的两个。执行第一次两个平行轴面的切割，形成两个边皮，利用两个夹持件将对应位置上形成的两个边皮夹持住并通过升降驱动结构2841和X向移动机构将所述两个边皮予以转送出去，再调整待切割硅棒的切割面(例如旋转90度)，执行第二次两个平行轴面的切割，再次形成两个边皮，再次利用两个夹持件将对应位置上形成的两个边皮夹持住并通过升降驱动结构2841和X向移动机构将所述两个边皮予以转送出去。
在一实施例中，所述边皮卸料装置包括边皮输送结构，所述边皮输送结构设置在所述边皮卸载区，用于将经夹持转运单元运转过来的边皮进行输送，在一种实现方式中，所述边皮输送结构可例如为输送带。容易理解的是，所述边皮卸载区为多工位开方设备中边皮卸载的区域，具体地，所述边皮卸载区为夹持转运单元将边皮运离切割区后其下方所对应的区域。在实际操作中，由夹持转运单元将边皮由切割区移送至边皮卸载区，夹持转运单元中的夹持组件松开以将边皮释放至作为边皮输送结构的输送带上，由所述输送带将边皮输送出去。
在另一实施例中，所述边皮卸料装置包括边皮筒，所述边皮筒设于边皮卸载区。其中所述边皮筒的桶口可设计较大或呈喇叭口，便于边皮无障碍地置入，且，所述边皮筒的桶臂的高度也较高，可确保置入的边皮不会发生倾覆等。如此，由所述夹持转运单元将边皮由切割区移动至所述边皮筒，而后可由操作人员将边皮从所述边皮筒内取出。
当然，对待切割硅棒进行切割后形成的边皮予以卸料并不限于此。例如，在其他实施方式中，所述边皮卸料装置可同时包括边皮筒和边皮输送结构，其中，所述边皮输送结构可例如为输送带，所述边皮筒邻设于所述输送带的起始端(例如，所述边皮筒位于所述输送带的起始端的旁侧或直接位于所述输送带的起始端的上方等)。其中，所述边皮筒的桶口可设计较大或呈喇叭口，便于边皮无障碍地置入，且，所述边皮筒的桶臂的高度也较高，可确保置入的边皮不会发生倾覆等。于实际的应用中，所述边皮筒更可为可翻转设计，通过翻转所述边皮筒，使得所述边皮筒内的各个边皮顺畅地转移至所述输送带上。例如，所述边皮筒的底部设有翻转驱动机构，所述翻转驱动机构可包括翻转板、转轴及翻转驱动源(例如翻转电机或翻转气缸等)。如此，由所述夹持转运单元将边皮由切割区移送至所述边皮筒内后，所述边皮筒翻转带动筒内的边皮转移至所述输送带上，由所述输送带将边皮输送出去。
通过本申请的多工位开方设备可同时完成对多个硅棒的开方作业，且使得硅棒在开方处理后截面呈矩形，而已开方硅棒整体呈长方体且形成边皮数量为四个，能够提高硅棒开方的切割作业效率，增大已开方硅棒的横截面面积的同时降低了硅棒开方的整体成本和风险性
本申请另提供一种多工位切割方法，应用于前述的多工位开方设备中，所述应用于多工位开方设备的多工位切割方法包括以下步骤：将单晶硅棒立式置放于硅棒承载台上；驱动线切割装置下降，由所述线切割装置中的一条切割线段或两条切割线段同时对所述至少两个硅棒承载台所承载的单晶硅棒沿其长度方向进行第一方向侧面的切割；驱动线切割装置上升，利用转动机构驱动硅棒承载台以使所述单晶硅棒转换待切割面；驱动所述线切割装置下降，由所述一条切割线段或两条切割线段同时对所述至少两个硅棒承载台所承载的单晶硅棒沿其长度方向进行第二方向侧面的切割。
以下针对应用于前述的多工位开方设备在实施例中，进行切割作业过程进行说明。在本实施例中，以各切割轮组具有两对切割轮为例，即，所述线切割装置中各切割轮组具有两对切割轮，进行说明。请参阅图23，显示为本申请的多工位切割方法在一实施例中的流程图，如图所示，所述多工位切割方法包括以下步骤：
在步骤S10，将单晶硅棒立式置放于硅棒承载台上。
在该步骤中，所述单晶硅棒由上述硅棒装卸装置转移置放于硅棒承载台上，具体为，硅棒装卸装置中的第一夹具夹持住位于置物区待切割单晶硅棒，而后驱动换向载具作换向运动使得所述第一夹具带着夹持住的待切割单晶硅棒转换至装卸区，接着释放第一夹具使得将夹持住的单晶硅棒置放于装卸区的硅棒承载台上，由硅棒工作台的工作台转换机构将位于装卸区的硅棒承载台上的待切割单晶硅棒的转移至切割区。其中所述硅棒装卸装置请参阅针对图5至图7的说明，所述硅棒工作台请参阅针对图3、图4a和图4b的说明。
在一实施例中，单晶硅棒可通过人工搬运或机械手机械抓取等方式竖立置放于置物区的工位上，所述第一夹具则是通过驱动换向载具转动来调棒的竖立置放状态下的高度，驱动第一夹具中相应的第一夹持件在换向载具上的上下移动以调整各个第一夹持件所形成的夹持间距。接着，驱动第一夹具中参与夹持的各个第一夹持件中的第一夹臂作夹合动作，以使得这些第一夹持件能将置物区的工位上的单晶硅棒夹持住。其中所述硅棒装卸装置请参阅针对图5至图7的说明。
在一实施例中，在驱动换向载具作换向运动之前，较佳地，需将由第一夹具夹持住的单晶硅棒脱离于置物区的工位，实现脱离的方式可采取如下的任一种或者它们的结合：一，在确保第一夹具夹持住第一形态工件的情形下，利用第一夹具沿着换向载具向上移动以抬升单晶硅棒；二，驱动换向载具相对安装基础向上移动以抬升单晶硅棒。接着，驱动换向载具相对安装基础转动，使得换向载具上的第一载具通过换向运动而对应于装卸区的硅棒承载台。其中所述硅棒装卸装置请参阅针对图5至图7的说明。
在一实施例中，在释放第一夹具时，需要将单晶硅棒落位于装卸区的硅棒承载台上，实现落位的方式可采取如下的任一种或者它们的结合：一，在确保第一夹具夹持住单晶硅棒的情形下，利用第一夹具沿着换向载具向下移动以降落单晶硅棒；二，驱动换向载具相对安装基础向下移动以降落单晶硅棒。其中所述硅棒装卸装置请参阅针对图5至图7的说明。
在步骤S11，驱动线切割装置下降，由所述线切割装置中的两条切割线段同时对所述至少两个硅棒承载台所承载的单晶硅棒沿其长度方向进行第一方向侧面的切割。
在一实施例中，在所述线切割装置对单晶硅棒沿其长度方向进行第一方向侧面的切割之前，由所述硅棒压紧装置将单晶硅棒压紧于硅棒承载台上，具体为，所述第一驱动机构驱动切割机架中的安装架载着线切割单元沿着升降导轨下降的同时所述硅棒压紧装置也搭附于所述安装架下降，当硅棒压紧装置搭附于安装架下降到预定位置时，即，位于切割区的硅棒承载台承载的单晶硅棒顶部预定位置，气动导轨锁紧装置中的气缸驱动锁紧夹块抱紧升降导轨以定位所述硅棒压紧装置，接着硅棒压紧装置的压紧单元被驱动紧压于其所述对应的单晶硅棒的顶部，所述线切割单元继续随着安装架下降，各切割轮组中的两条切割线段对其对应的已压紧的单晶硅棒沿单晶硅棒长度方向进行第一方向侧面的切割而形成两个平行的轴切面。其中所述线切割装置请参阅针对图3以及图10至图12的说明，所述硅棒压紧装置请参阅针对图17的说明。
在步骤S12，驱动线切割装置上升，利用转动机构驱动硅棒承载台以使所述单晶硅棒转换待切割面。
鉴于线切割单元对单晶硅棒沿其长度方向切割形成两个平行的轴切面的同时会产生两个 边皮，阻碍线切割装置中切割线段的上升。
在一实施例中，在驱动线切割装置上升之前，需藉由边皮卸料装置将上述切割形成的两个边皮卸离硅棒承载台，具体为，首先由所述边皮卸料装置中的边皮提升机构提升所述边皮以使所述边皮的顶端凸出于所述已切割硅棒，在一种实现方式上，所述边皮提升机构采用设于所述安装架上的顶升件，所述顶升件被一伸缩部件驱动可做伸缩运动，所述顶升件受控作伸展运动后托住所述边皮的底部以顶升所述边皮使所述边皮的顶端凸出于所述已切割硅棒；接着由所述边皮卸料装置中的夹持转运单元夹持住所述边皮的顶端并拉升所述边皮脱离所述已切割硅棒并将所述边皮转运至边皮卸料区。请参阅针对图19至图22的说明。
在一实施例中，在边皮卸料完成后，驱动线切割装置上升作业中，由第一驱动机构驱动切割机架中的安装架载着线切割单元沿着升降导轨上升至与所述硅棒压紧装置相贴，而后利用硅棒承载台底部的转动机构配合所述压紧单元中的转轴驱动硅棒承载台顺时针或逆时针旋转90°以调整已进行一次切割后的单晶硅棒的待切割面。请参阅针对图2、图3和图17的说明。
在步骤S13，驱动所述线切割装置下降，由所述两条切割线段同时对所述至少两个硅棒承载台所承载的单晶硅棒沿其长度方向进行第二方向侧面的切割。
在一实施例中，在线切割装置对已进行第一方向切面切割的单晶硅棒沿其长度方向进行第二方向侧面的切割后，会形成两个边皮，需藉由边皮卸料装置将第二方向侧面的切割形成的两个边皮卸离硅棒承载台，具体为，首先由所述边皮卸料装置中的边皮提升机构提升所述边皮以使所述边皮的顶端凸出于所述已切割硅棒，在一种实现方式上，所述边皮提升机构采用设于所述安装架上的顶升件，所述顶升件被一伸缩部件驱动可做伸缩运动，所述顶升件受控作伸展运动后托住所述边皮的底部以顶升所述边皮使所述边皮的顶端凸出于所述已切割硅棒；接着由所述边皮卸料装置中的夹持转运单元夹持住所述边皮的顶端并拉升所述边皮脱离所述已切割硅棒并将所述边皮转运至边皮卸料区。请参阅针对图19至图22的说明。
在一实施例中，在将第二方向侧面切割形成的边皮卸离后，单晶硅棒已完成了其开方作业整体呈长方体，需驱动线切割装置和硅棒压紧装置回到初始位置以备下一次开方作业，具体为，第一驱动机构驱动线切割装置中的安装架载着线切割单元沿升降导轨上升至所述安装架与所述硅棒压紧装置相贴时，所述硅棒压紧装置中的压紧单元被驱动释放对其相应的已完成切割作业的单晶硅棒的压力，而后，气动导轨锁紧装置中的气缸驱动锁紧夹块放松对升降导轨的紧压以使得硅棒压紧装置搭附于安装架上随线切割装置继续上升回到初始位置。在一实施例中，完成对单晶硅棒的切割作业后，还需将已切割的单晶硅棒运离切割区，具体为，首先由硅棒工作台的工作台转换机构将位于切割区的硅棒承载台上的已切割单晶硅棒的转移 至装卸区，而后由硅棒装卸装置中的第二夹具夹持住位于装卸区已切割单晶硅棒，而后驱动换向载具作换向运动使得所述第二夹具带着夹持住的已切割单晶硅棒转换至置物区，接着释放第二夹具使得将夹持住的已切割的单晶硅棒置放于置物区的工位上。其中所述线切割装置请参阅针对图3以及图10至图12的说明，所述硅棒压紧装置请参阅针对图17的说明。
在一实施例中，所述第二夹具则是通过驱动换向载具转动来调整位置以实现对应于装卸区的硅棒承载台，必要时，根据已切割单晶硅棒的竖立置放状态下的高度，驱动第二夹具中相应的第二夹持件在换向载具上的上下移动以调整各个第二夹持件所形成的夹持间距。接着，驱动第二夹具中参与夹持的各个第二夹持件中的第二夹臂作夹合动作，以使得这些第二夹持件能将装卸区的硅棒承载台上的已切割单晶硅棒夹持住。请参阅针对图5至图7的说明。
在一实施例中，在驱动换向载具作换向运动之前，较佳地，需将由第二夹具夹持住的已切割单晶硅棒脱离于装卸区的硅棒承载台，实现脱离的方式可采取如下的任一种或者它们的结合：一，在确保第二夹具夹持住已切割单晶硅棒的情形下，利用第二夹具沿着换向载具向上移动以抬升已切割单晶硅棒；二，驱动换向载具相对安装基础向上移动以抬升已切割单晶硅棒。接着，驱动换向载具相对安装基础转动，使得换向载具上的第二载具通过换向运动而对应于置物区的工位。请参阅针对图5至图7的说明。
在一实施例中，在释放第二夹具时，需要将单晶硅棒落位于装卸区的硅棒承载台上，实现落位的方式可采取如下的任一种或者它们的结合：一，在确保第二夹具夹持住已切割单晶硅棒的情形下，利用第二夹具沿着换向载具向下移动以降落已切割单晶硅棒；二，驱动换向载具相对安装基础向下移动以降落已切割单晶硅棒。请参阅针对图5至图7的说明。
总体而言，在上述实施例中，由于各切割轮组包括两对切割轮，即，一个待切割单晶硅棒对应配置两条切割线段，因此，完成待切割单晶硅棒共四个轴切面的开方作业，需执行两次切割流程即上述第一方向侧面的切割和第二方向侧面的切割。与之相比，若各切割轮组包括一对切割轮，即，一个待切割单晶硅棒相应配置一条切割线段，则完成待切割单晶硅棒共四个轴切面的开方作业，需执行四次单轴切面的切割流程即两次第一方向侧面的切割和两次第二方向侧面的切割。
上述实施例仅例示性说明本申请的原理及其功效，而非用于限制本申请。任何熟悉此技术的人士皆可在不违背本申请的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本申请所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本申请的权利要求所涵盖。

Claims (21)

  1. 一种多工位开方设备，用于对截面为圆形的单晶硅棒进行开方作业，其特征在于，包括：
    至少两个硅棒承载台，用于承载立式置放的单晶硅棒，各所述硅棒承载台具有转动机构；以及
    线切割装置，设置在所述至少两个硅棒承载台的上方，包括多个切割轮以及绕于所述多个切割轮形成有一条切割线段或相互平行的两条切割线段的切割线；
    其中，在开方作业时，驱动所述线切割装置下降，由所述一条切割线段或两条切割线段同时对所述多个硅棒承载台所承载的多个单晶硅棒沿其长度方向进行第一方向侧面的切割；之后，利用所述转动机构驱动硅棒承载台以使所述单晶硅棒转换待切割面，驱动所述线切割装置下降，由所述一条切割线段或两条切割线段同时对所述多个硅棒承载台所承载的多个单晶硅棒沿其长度方向进行第二方向侧面的切割。
  2. 根据权利要求1所述的多工位开方设备，其特征在于，在所述开方作业中，所述线切割装置对所述单晶硅棒的第一方向侧面切割时的切割线与对所述单晶硅棒的第二方向侧面切割时的切割线的交点位于所述单晶硅棒的截面内。
  3. 根据权利要求1所述的多工位开方设备，其特征在于，所述至少两个硅棒承载台可设于硅棒工作台上，所述硅棒工作台上设有工作台转换机构，用于驱动所述硅棒工作台作转换运动以令所述硅棒工作台上的硅棒承载台在装卸区和切割区之间转换。
  4. 根据权利要求3所述的多工位开方设备，其特征在于，所述工作台转换机构为转动机构，所述转动机构包括：
    转动轴，轴接于所述硅棒工作台；以及
    转动驱动单元，用于驱动所述转动轴转动以带动所述硅棒工作台转动。
  5. 根据权利要求3所述的多工位开方设备，其特征在于，所述工作台转换机构为平移机构，所述平移机构包括：
    平移导轨，铺设于一工件加工台上；
    滑块，设于所述硅棒工作台的底部；以及
    平移驱动单元，用于驱动所述硅棒工作台沿着所述平移导轨移动。
  6. 根据权利要求1所述的多工位开方设备，其特征在于，还包括邻设于所述硅棒承载台的硅 棒装卸装置。
  7. 根据权利要求1所述的多工位开方设备，其特征在于，在所述硅棒承载台的周边设有边皮顶托机构，用于顶托单晶硅棒进行切割后所形成的边皮。
  8. 根据权利要求7所述的多工位开方设备，其特征在于，所述边皮顶托机构包括：
    活动承托件；以及
    锁定控制件，用于在活动承托件抵靠于单晶硅棒的底部时将所述活动承托件控制在锁定状态。
  9. 根据权利要求1所述的多工位开方设备，其特征在于，还包括边皮卸料装置，用于将所述线切割装置进行切割后形成的边皮予以卸料。
  10. 根据权利要求9所述的多工位开方设备，其特征在于，所述边皮卸料装置包括：边皮提升机构，用于提升所述边皮以使所述边皮的顶端凸出于所述已切割硅棒。
  11. 根据权利要求10所述的多工位开方设备，其特征在于，所述边皮卸料装置还包括：夹持转运单元，设于所述至少两个硅棒承载台的上方，用于夹持住所述边皮的顶端并拉升所述边皮以脱离所述已开方单晶硅棒以及将所述边皮转运至边皮卸料区。
  12. 根据权利要求11所述的多工位开方设备，其特征在于，所述夹持转运单元包括：
    提供至少一个方向移动的夹持移动机构；以及
    可升降的边皮夹持机构，与所述移动机构相连并被带动在至少一个方向移动。
  13. 根据权利要求12所述的多工位开方设备，其特征在于，所述边皮夹持机构包括：
    升降驱动结构；以及
    夹持组件，设于所述升降驱动结构的底部，用于夹持或释放所述边皮的顶端。
  14. 根据权利要求13所述的多工位开方设备，其特征在于，所述夹持组件包括：
    罩体，用于罩设于边皮；以及
    可伸缩的夹持件，设于所述罩体内部；所述夹持件与所述罩体主体之间形成供夹持所 述边皮的夹持空间。
  15. 根据权利要求13所述的多工位开方设备，其特征在于，所述夹持组件包括：
    弧形板；以及
    可伸缩的夹持件，所述夹持件与所述弧形板之间形成供夹持所述边皮的夹持空间。
  16. 根据权利要求1所述的多工位开方设备，其特征在于，在所述线切割装置中，包括与硅棒承载台数量对应的至少两个切割轮组，每一个切割轮组包括一对切割轮或两对切割轮，在任一对切割轮中的两个切割轮之间形成一条切割线段；相邻两个切割轮组之间设有过渡轮，所述过渡轮的线槽与切割轮组中的切割轮的线槽在同一平面内。
  17. 根据权利要求1所述的多工位开方设备，其特征在于，所述切割轮包括用于绕设切割线的第一线槽及第二线槽，所述切割轮通过自动换槽机构将切割线由所述第一线槽移至第二线槽内。
  18. 根据权利要求17所述的多工位开方设备，其特征在于，所述自动换槽机构包括：
    切割轮，包括用于绕设切割线的第一线槽及第二线槽；
    换槽筒，与所述切割轮相联动，用于带动所述切割轮沿其轴向移动以将所述切割线由所述第一线槽移至第二线槽内，包括筒本体，以及开设于所述筒本体上的相互连通第一导轨及第二导轨，所述第一导轨与第二导轨之间的落差对应于所述第一线槽及第二线槽之间的槽距；
    定位件，可相对滑动地设置在所述第一导轨或第二导轨内，用于在所述换槽筒沿轴向移动时在所述第一导轨或第二导轨内滑移带动所述换槽筒旋转，以迫使所述切割轮上的切割线由所述第一线槽切换至第二线槽。
  19. 根据权利要求1所述的多工位开方设备，其特征在于，还包括硅棒压紧装置，所述硅棒压紧装置和所述线切割装置共用同一导轨。
  20. 根据权利要求19所述的多工位开方设备，其特征在于，所述硅棒压紧装置设有导轨锁紧单元。
  21. 一种应用于多工位开方设备的多工位切割方法，其特征在于，所述多工位开方设备包括至 少两个硅棒承载台和线切割装置，所述硅棒承载台具有转动机构，所述线切割装置包括一条切割线段或相互平行的两条切割线段，所述多工位切割方法包括如下步骤：
    将单晶硅棒立式置放于硅棒承载台上；
    驱动线切割装置下降，由所述线切割装置中的一条切割线段或两条切割线段同时对所述至少两个硅棒承载台所承载的单晶硅棒沿其长度方向进行第一方向侧面的切割；
    驱动线切割装置上升，利用转动机构驱动硅棒承载台以使所述单晶硅棒转换待切割面；
    驱动所述线切割装置下降，由所述一条切割线段或两条切割线段同时对所述至少两个硅棒承载台所承载的单晶硅棒沿其长度方向进行第二方向侧面的切割。
PCT/CN2020/086747 2019-04-30 2020-04-24 多工位开方设备及其切割方法 WO2020221132A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910361097.1 2019-04-30
CN201910361097.1A CN111844490A (zh) 2019-04-30 2019-04-30 多工位开方设备及其切割方法

Publications (1)

Publication Number Publication Date
WO2020221132A1 true WO2020221132A1 (zh) 2020-11-05

Family

ID=72965702

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/086747 WO2020221132A1 (zh) 2019-04-30 2020-04-24 多工位开方设备及其切割方法

Country Status (2)

Country Link
CN (1) CN111844490A (zh)
WO (1) WO2020221132A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113134918A (zh) * 2021-04-21 2021-07-20 曲靖阳光能源硅材料有限公司 一种新式的单晶硅双棒双工位开方机
EP4321318A4 (en) * 2021-11-01 2024-08-07 Qingdao Gaoce Tech Co Ltd SILICON ROD CUTTING SYSTEM
WO2024161340A1 (en) 2023-02-02 2024-08-08 Lubrizol Advanced Materials, Inc. Compositions comprising hydrophilic active ingredients in oil

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111203991A (zh) * 2020-02-26 2020-05-29 青岛高测科技股份有限公司 一种晶硅立式开方机及其使用方法
CN114454365A (zh) * 2021-07-13 2022-05-10 青岛高测科技股份有限公司 硅棒切割方法、设备及系统
CN113815137A (zh) * 2021-07-30 2021-12-21 隆基绿能科技股份有限公司 一种硅棒加工方法
CN114454369A (zh) * 2021-08-19 2022-05-10 青岛高测科技股份有限公司 硅棒切割设备及系统
CN114454360A (zh) * 2021-08-19 2022-05-10 青岛高测科技股份有限公司 硅棒切割方法、设备及系统
CN113997436B (zh) * 2021-11-01 2024-02-02 青岛高测科技股份有限公司 硅棒切割系统的切割装置及硅棒切割系统
CN114589824B (zh) * 2021-11-01 2024-02-02 青岛高测科技股份有限公司 硅棒切割系统的切割装置及硅棒切割系统
CN114750317A (zh) * 2022-04-21 2022-07-15 青岛高测科技股份有限公司 三线中垂切割硅棒的方法、切割设备及切割系统
CN114750316A (zh) * 2022-04-21 2022-07-15 青岛高测科技股份有限公司 双线单线切割硅棒的方法、切割设备及切割系统
CN114750314A (zh) * 2022-04-21 2022-07-15 青岛高测科技股份有限公司 单线三线切割硅棒的方法、切割设备及切割系统
CN114750315A (zh) * 2022-04-21 2022-07-15 青岛高测科技股份有限公司 双线平行切割硅棒的方法、切割设备及切割系统
CN114750313A (zh) * 2022-04-21 2022-07-15 青岛高测科技股份有限公司 双线十字线切割硅棒的方法、切割设备及切割系统
CN114872213B (zh) * 2022-05-31 2024-10-18 青岛高测科技股份有限公司 棒体切割系统
CN116872060B (zh) * 2023-09-07 2023-11-24 赣州富尔特电子股份有限公司 一种可去除钕铁硼磁体毛边的切割装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007276029A (ja) * 2006-04-04 2007-10-25 Sumco Corp ワイヤガイド装置
CN106181610A (zh) * 2016-08-31 2016-12-07 上海日进机床有限公司 硅棒多工位组合加工机
CN206066730U (zh) * 2016-10-14 2017-04-05 上海日进机床有限公司 硅棒开方机
CN208148231U (zh) * 2018-02-09 2018-11-27 天通日进精密技术有限公司 硅棒多线切割设备和硅棒转运系统
CN109049369A (zh) * 2018-09-03 2018-12-21 天通日进精密技术有限公司 多线切割设备及其换槽机构

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007276029A (ja) * 2006-04-04 2007-10-25 Sumco Corp ワイヤガイド装置
CN106181610A (zh) * 2016-08-31 2016-12-07 上海日进机床有限公司 硅棒多工位组合加工机
CN206066730U (zh) * 2016-10-14 2017-04-05 上海日进机床有限公司 硅棒开方机
CN208148231U (zh) * 2018-02-09 2018-11-27 天通日进精密技术有限公司 硅棒多线切割设备和硅棒转运系统
CN109049369A (zh) * 2018-09-03 2018-12-21 天通日进精密技术有限公司 多线切割设备及其换槽机构

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113134918A (zh) * 2021-04-21 2021-07-20 曲靖阳光能源硅材料有限公司 一种新式的单晶硅双棒双工位开方机
EP4321318A4 (en) * 2021-11-01 2024-08-07 Qingdao Gaoce Tech Co Ltd SILICON ROD CUTTING SYSTEM
WO2024161340A1 (en) 2023-02-02 2024-08-08 Lubrizol Advanced Materials, Inc. Compositions comprising hydrophilic active ingredients in oil

Also Published As

Publication number Publication date
CN111844490A (zh) 2020-10-30

Similar Documents

Publication Publication Date Title
WO2020221132A1 (zh) 多工位开方设备及其切割方法
CN109129947B (zh) 硅棒开方设备、硅棒开方方法及边皮卸载装置
WO2020221134A1 (zh) 硅棒开方设备及应用于硅棒开方设备的边皮卸料装置
CN111844489B (zh) 硅棒多工位开方设备及其多工位切割方法
CN212578936U (zh) 应用于硅棒开方设备的边皮卸料装置及硅棒开方设备
CN110126107B (zh) 硅棒转换装置、硅棒开方设备及硅棒开方方法
WO2021254084A1 (zh) 硅棒装卸装置及硅棒开方设备
WO2021254085A1 (zh) 边皮卸料装置及硅棒开方设备
CN110126108B (zh) 硅棒开方设备、硅棒开方方法及边皮卸载装置
WO2020221133A1 (zh) 多线切割设备及应用于多线切割设备中的自动换槽机构
CN109049369B (zh) 多线切割设备及其换槽机构
WO2021254083A1 (zh) 线切割装置及硅棒加工设备
CN217196245U (zh) 边皮卸料装置、硅棒开方机及硅棒切磨一体机
WO2021254082A1 (zh) 线切割装置及硅棒加工设备
CN212919964U (zh) 硅棒压紧装置及硅棒开方机
CN209832246U (zh) 硅棒开方设备及边皮卸载装置
CN212554512U (zh) 硅棒装卸装置及硅棒开方设备
CN214562090U (zh) 边皮卸料装置及多工位开方设备
CN210999501U (zh) 多线切割设备及应用于多线切割设备中的自动换槽机构
CN213563660U (zh) 硅棒压紧装置及硅棒开方设备
CN217225598U (zh) 一种钢板搬运机械手
CN210791579U (zh) 硅棒开方设备及应用于硅棒开方设备的边皮卸料装置
CN210791586U (zh) 多工位开方设备
CN212498399U (zh) 硅棒开方机
CN214687340U (zh) 硅棒装卸装置及多工位开方设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20798554

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20798554

Country of ref document: EP

Kind code of ref document: A1