WO2021251209A1 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
WO2021251209A1
WO2021251209A1 PCT/JP2021/020808 JP2021020808W WO2021251209A1 WO 2021251209 A1 WO2021251209 A1 WO 2021251209A1 JP 2021020808 W JP2021020808 W JP 2021020808W WO 2021251209 A1 WO2021251209 A1 WO 2021251209A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electronic device
conductor
signal conductor
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/020808
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
智浩 永井
伸郎 池本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2022530485A priority Critical patent/JP7582311B2/ja
Priority to CN202190000526.3U priority patent/CN218941409U/zh
Publication of WO2021251209A1 publication Critical patent/WO2021251209A1/ja
Priority to US17/983,445 priority patent/US12237556B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout

Definitions

  • the present invention relates to an electronic device including a signal conductor for transmitting a high frequency signal.
  • Patent Document 1 describes an electronic device including a first substrate and a second substrate.
  • the second substrate is mounted on the surface of the first substrate.
  • the second board is provided with a high frequency transmission line.
  • the second substrate includes a signal conductor and a plurality of ground conductors. In the thickness direction of the second substrate, the plurality of ground conductors are arranged on both sides of the signal conductor. That is, the second substrate has a configuration in which a plurality of grounds and signal conductors are arranged at intervals in the thickness direction.
  • an object of the present invention is to provide an electronic device that suppresses the loss of a high frequency transmission line and realizes a low profile configuration.
  • the electronic device of the present invention includes a first substrate and a second substrate.
  • a first signal conductor extending along the transmission direction of the high frequency signal is arranged on the first substrate.
  • a first ground conductor is arranged on the second substrate. There is a gap between the first signal conductor and the first ground conductor.
  • the first signal conductor has a bent portion in a plan view.
  • the first ground conductor overlaps with the first signal conductor in a plan view and has a bending point along the first signal conductor.
  • a transmission line is formed by a pair of a first signal conductor and a first ground conductor.
  • the second substrate is thin because it is configured to include the first ground conductor and not the first signal conductor. Therefore, a low-profile transmission line is configured. Further, since there is a gap between the first ground conductor and the first signal conductor, the capacitance between the first ground conductor and the first signal conductor can be reduced, and the desired impedance can be realized while the height is further lowered. become.
  • FIG. 1 is a perspective view of the electronic device 10 according to the first embodiment.
  • FIG. 2 is an exploded perspective view of the electronic device 10 according to the first embodiment.
  • FIG. 3 is a plan view of the electronic device 10 according to the first embodiment.
  • 4 (A), 4 (B), and 4 (C) are cross-sectional views of the electronic device 10 according to the first embodiment.
  • FIG. 5 is a plan view of the first substrate 20.
  • 6 (A) is a first plan view of the second substrate 30, and
  • FIG. 6 (B) is a second plan view of the second substrate 30.
  • 7 (A), 7 (B), and 7 (C) are cross-sectional views showing the configuration of the type of the electronic device 10 according to the first embodiment.
  • FIG. 8 is a plan view of the electronic device 10A according to the second embodiment.
  • FIG. 9 is a cross-sectional view of the electronic device 10A according to the second embodiment.
  • FIG. 10 is a perspective view of the electronic device 10B according to the third embodiment.
  • FIG. 11 is a plan view of the electronic device 10B according to the third embodiment.
  • 12 (A) and 12 (B) are cross-sectional views of the electronic device 10B according to the third embodiment.
  • FIG. 13 is a plan view of the first substrate of the electronic device 10B according to the third embodiment.
  • FIG. 14 is a plan view of the second substrate 30B of the electronic device 10B according to the third embodiment.
  • 15 (A) and 15 (B) are cross-sectional views of the second substrate 30B of the electronic device 10B according to the third embodiment.
  • FIG. 16 is a side view showing a derivative mode of the electronic device 10B according to the third embodiment.
  • FIG. 1 is a perspective view of an electronic device according to the first embodiment.
  • FIG. 2 is an exploded perspective view of the electronic device 10 according to the first embodiment.
  • FIG. 3 is a plan view of the electronic device 10 according to the first embodiment.
  • 4 (A), 4 (B), and 4 (C) are cross-sectional views of the electronic device 10 according to the first embodiment.
  • FIG. 5 is a plan view of the first substrate 20. In each figure, the dimensions are appropriately exaggerated so that the features of the present invention can be easily understood.
  • the electronic device 10 includes a first substrate 20, a second substrate 30, and a plurality of electronic devices 10.
  • a component 50 is provided.
  • the number of parts 50 is 3, but is not limited to this in this embodiment.
  • the first substrate 20 includes a base material 21, a signal conductor 22, a plurality of ground conductors 23, a plurality of ground conductors 24, a plurality of component land conductors 25, and an insulating protective film 29.
  • the base material 21 is made of, for example, a solid insulating resin substrate. Various conductor patterns for realizing the electronic device 10 are formed inside the base material 21, but detailed description and illustration thereof will be omitted.
  • the base material 21 is flat and has a main surface 211.
  • the signal conductor 22 is arranged on the main surface 211 of the base material 21.
  • the signal conductor 22 is made of, for example, a thin conductor film such as copper foil.
  • the signal conductor 22 has a shape extending in the transmission direction of a high frequency signal.
  • the signal conductor 22 has a bent portion CV1 at an intermediate position in the extending direction.
  • the bent portion CV1 is a portion where the extending direction of the signal conductor 22 changes. For example, in the example of FIGS. 1, 2, and 3, the signal conductor 22 extends from one end in the x-axis direction, bends at the bending point CV1, extends in the y-axis direction, and bends at another bending point CV1.
  • Both ends of the signal conductor 22 are connected to another conductor pattern by an interlayer connecting conductor or the like formed on the base material 21 (not shown).
  • the signal conductor 22 corresponds to the "first signal conductor" of the present invention.
  • the bent portion CV1 of the signal conductor 22 is not formed by bending the signal conductor 22 at the bent portion CV1, but is formed by processing the conductor pattern so as to have the bent portion CV1. More specifically, for example, the signal conductor 22 is formed in the next manufacturing process. First, a substrate having a conductor (electrode) formed on one side is prepared. Next, a conductor pattern having a bent portion CV1 is formed by pattern etching or the like. By this step, the signal conductor 22 having the bent portion CV1 is formed.
  • the plurality of ground conductors 23 are rectangular in a plan view.
  • the plurality of ground conductors 23 are arranged around one end of the signal conductor 22 and around the other end, respectively.
  • the plurality of ground conductors 23 are connected to the ground conductor of the base material 21 via an interlayer connecting conductor or the like formed on the base material 21 (not shown).
  • the plurality of ground conductors 24 are rectangular in a plan view.
  • the plurality of ground conductors 24 are arranged at intervals along the extending direction of the signal conductor 22.
  • the plurality of ground conductors 24 are arranged on both sides in the width direction orthogonal to the extending direction of the signal conductor 22.
  • the plurality of ground conductors 24 are connected to the ground conductor of the base material 21 via an interlayer connecting conductor or the like formed on the base material 21 (not shown).
  • the land conductors 25 for a plurality of parts are rectangular in a plan view.
  • the plurality of land conductors 25 for parts are arranged according to the mounting positions of the parts 50.
  • the positions of the plurality of component land conductors 25 are arranged at positions separated from the positions where the signal conductor 22, the plurality of ground land conductors 23, and the plurality of ground land conductors 24 are formed.
  • the signal conductor 22, the plurality of ground conductors 23, and the plurality of ground conductors 24 are arranged at positions separated from the positions of the plurality of component land conductors 25. That is, the signal conductor 22 is arranged so as to avoid the positions of the land conductors 25 for a plurality of parts, in other words, the mounting positions of the parts 50. At this time, since the signal conductor 22 has the bent portion CV1, the signal conductor 22 can be appropriately arranged according to the arrangement positions of the land conductors 25 for a plurality of parts.
  • the insulating protective film 29 is arranged on the main surface 211 of the base material 21.
  • the insulating protective film 29 has an opening that exposes a plurality of ground conductors 23, a plurality of ground conductors 24, and a plurality of component land conductors 25 to the outside.
  • the insulating protective film 29 may have an opening that exposes the signal conductor 22 to the outside.
  • FIG. 6 (A) is a first plan view of the second substrate
  • FIG. 6 (B) is a second plan view of the second substrate.
  • the second substrate 30 includes a base material 31 and an insulating protective film 32.
  • the base material 31 is, for example, a metal plate.
  • the base material 31 is thicker than the signal conductor 22. More specifically, the base material 31 has a thickness having rigidity that allows the shape to be maintained only by the base material 31.
  • the base material 31 has a shape extending in the transmission direction of the high frequency signal. In other words, in a plan view, the base material 31 has a shape similar to that of the signal conductor 22. Therefore, the base material 31, that is, the second substrate 30, has a bent portion CV2 at an intermediate position in the extending direction.
  • the bent portion CV2 is a portion where the extending direction of the base material 31 changes.
  • the bent portion CV2 of the base material 31 is not formed by bending the base material 31 at the bent portion CV2, but is formed by cutting out the base material 31 so as to have the bent portion CV2. More specifically, for example, the base material 31 is formed in the next manufacturing process. First, a pattern that is the basis of the plurality of base materials 31 is formed on an aggregate substrate (a substrate having a size capable of forming the plurality of base materials 31). Next, punching is performed with a die having a bent shape so as to have the shape of the base material 31 having the bent portion CV2. By this step, the base material 31 having the bent portion CV2 is formed.
  • the base material 31 having the bent portion CV2 can be formed not only by the above-mentioned punching process but also by cutting out with a laser.
  • the width of the base material 31 (the length in the direction orthogonal to the extending direction) is larger than the width of the signal conductor 22 (the length in the direction orthogonal to the extending direction). More specifically, the width of the base material 31 is about the sum of the width of the signal conductor 22 and the width of the two ground conductors 24 running in parallel thereof, and is larger than this length. ..
  • the insulating protective film 32 is arranged on one main surface of the base material 31.
  • the insulating protective film 32 is formed with an opening AP321, a plurality of openings AP322, and a plurality of openings AP323.
  • the opening AP321, the plurality of openings AP322, and the plurality of openings AP323 expose one main surface of the base material 31 to the outside.
  • the opening AP321 has a shape similar to the shape of the base material 31, in other words, the shape of the signal conductor 22 in a plan view. That is, the opening AP321 has a bent portion in the middle position in the extending direction.
  • the width of the opening AP321 is larger than the width of the signal conductor 22 and smaller than the distance between the plurality of ground conductors 24 adjacent to each other on both sides of the signal conductor 22 in the width direction.
  • the plurality of openings AP322 are rectangular in a plan view.
  • the plurality of openings AP322 are arranged around one end of the opening AP321 and around the other end, respectively.
  • the arrangement pattern of the plurality of openings AP322 is substantially the same as the arrangement pattern of the plurality of ground conductors 23.
  • the plurality of openings AP323 are rectangular in a plan view.
  • the plurality of openings AP323 are arranged at intervals along the extending direction of the openings AP321.
  • the plurality of openings AP323 are arranged on both sides in the width direction of the openings AP321.
  • the arrangement pattern of the plurality of openings AP323 is substantially the same as the arrangement pattern of the plurality of ground conductors 24.
  • the second substrate 30 can be made thin (low profile).
  • the plurality of parts 50 are mounted on the land conductors 25 for a plurality of parts by using a conductive bonding material such as solder.
  • the component 50 corresponds to the "third component" of the present invention.
  • the second substrate 30 is arranged on the first substrate 20 so that the surface on which the insulating protective film 32 is formed faces the main surface 211 of the first substrate 20.
  • the opening AP321 faces the signal conductor 22, the plurality of openings AP322 face each of the plurality of ground land conductors 23, and the plurality of openings AP323 face the plurality of ground land conductors 24, respectively.
  • the two substrates 30 are arranged on the first substrate 20.
  • the opening AP321 can be omitted. In this case, for example, the protective effect of the base material 31 made of a metal plate can be obtained.
  • the plurality of ground conductors 23 are electrically and physically bonded to the surface of the base material 31 of the second substrate 30 exposed by the plurality of openings AP322 using a conductive bonding material 40 such as solder (FIG. 6). 4 (B)).
  • the plurality of ground conductors 24 are electrically and physically bonded to the surface of the base material 31 of the second substrate 30 exposed by the plurality of openings AP323 using a conductive bonding material 40 such as solder (FIG. 6). 4 (A)).
  • the electronic device 10 realizes a microstrip type transmission line in which the signal conductor 22 is a signal line and the base material 31 is a ground (corresponding to the "first ground conductor” of the present invention).
  • a ground conductor (corresponding to the "internal ground conductor” of the present invention) may be further provided inside the base material 21 of the first substrate 20. In this case, the electronic device can realize a triplate strip type transmission line.
  • the thickness of the second substrate 30 is substantially the same as the thickness of the base material 31. Therefore, the second substrate 30 has a lower profile than the conventional structure in which various conductor patterns are arranged on the second substrate 30 in the thickness direction. As a result, the configuration in which the second board 30 is mounted on the first board 20 can be made low in height, and the electronic device 10 can be realized in low back.
  • the void CA may have a structure filled with resin.
  • This structure can be realized by a resin member (spacer) formed to match the size of the void CA and a resist film formed on the second substrate 30. Further, this structure can also be realized by injecting a fluid resin into the void CA and solidifying it after mounting the electronic device 10. This facilitates the mounting of the electronic device 10. Further, the structure may be such that the void CA is not completely filled with the resin and the void remains partially (a structure in which the void and the resin are mixed).
  • a plurality of openings of the insulating protective film 29 of the first substrate 20 and a plurality of openings AP322 and AP323 of the insulating protective film 32 of the second substrate 30 are provided, and the conductive bonding material 40 is provided by these openings. You can control the amount of. Thereby, the distance between the signal conductor 22 and the base material 31 can be stably controlled. Therefore, the electronic device 10 can realize a transmission line having a stable characteristic impedance.
  • the insulating protective film 29 exists between the signal conductor 22 and the base material 31 while having a gap CA. As a result, an unnecessary short circuit between the signal conductor 22 and the base material 31 can be suppressed.
  • the height of the component 50 is set to be equal to or less than the thickness of the second substrate 30, it is possible to reduce the overall height of the electronic device 10.
  • the insulating protective film 29 covers the signal conductor 22 and has the same thickness as the other portions. Further, in the second substrate 30, the insulating protective film 32 has an opening AP321 in a portion facing the signal conductor 22.
  • FIGS. 7 (A), 7 (B), and 7 (C) are cross-sectional views showing the configuration of a type of electronic device according to the first embodiment.
  • the basic configuration of each type of electronic device is the same as that of the electronic device 10, and only different parts will be described below.
  • the electronic device 10X1 includes a first substrate 20X1.
  • the insulating protective film 29 has a thin portion TF29 in a region overlapping the signal conductor 22.
  • the thin portion TF 29 is formed between two ground conductors 24 sandwiching the signal conductor 22.
  • the thin portion TF 29 is thicker than the signal conductor 22 and thinner than the other portions of the insulating protective film 29.
  • the electronic device 10X1 can increase the ratio of the void CA01 between the signal conductor 22 and the base material 31. As a result, the distance between the first substrate 20X1 and the second substrate 30 can be further shortened, the electronic device 10X1 becomes even shorter, and the loss of the transmission line can be reduced.
  • the electronic device 10X2 includes a first substrate 20X2.
  • the insulating protective film 29 has an opening AP29 that overlaps with the signal conductor 22.
  • the signal conductor 22 is exposed on the second substrate 30 side.
  • the electronic device 10X2 has a gap CA02 as a whole between the signal conductor 22 and the base material 31.
  • the distance between the first substrate 20X2 and the second substrate 30 can be further shortened, the electronic device 10X2 becomes even shorter, and the loss of the transmission line can be reduced.
  • the electronic device 10X3 includes a first substrate 20X2 and a second substrate 30X3.
  • the insulating protective film 32 is also formed in a region facing the signal conductor 22.
  • the electronic device 10X3 can suppress an unnecessary short circuit between the signal conductor 22 and the base material 31.
  • the signal conductor 22 may be covered with the base material 21.
  • the signal conductor 22 may be arranged in the vicinity of the main surface 211 inside the base material 21.
  • the insulating protective film overlapping the signal conductor 22 can be omitted.
  • both the signal conductor 22 and the base material 31 may be covered with an insulating protective film. In this case, it is possible to prevent a short circuit between the signal conductor 22 and the base material 31 and protect the conductor and the metal surface.
  • FIG. 8 is a plan view of the electronic device according to the second embodiment.
  • FIG. 9 is a cross-sectional view of the electronic device 10A according to the second embodiment. In each figure, the dimensions are appropriately exaggerated so that the features of the present invention can be easily understood.
  • the electronic device 10A according to the second embodiment is different from the electronic device 10 according to the first embodiment in the configuration of the second substrate 30A.
  • Other configurations of the electronic device 10A are the same as those of the electronic device 10, and the description of the same parts will be omitted.
  • the shape of the second substrate 30A in a plan view is substantially the same as the shape of the second substrate 30 in a plan view.
  • the second substrate 30A includes a conductive base material 31A, an insulating protective film 32, and an insulating base material 33.
  • the insulating base material 33 is made of, for example, a flexible material containing a liquid crystal polymer as a main component.
  • the insulating base material 33 is not limited to that having flexibility.
  • the conductive base material 31A is made of, for example, a copper foil or the like similar to the signal conductor 22.
  • the conductive substrate 31A may be as thin as possible within the desired conductor loss range.
  • the conductive base material 31A is arranged on substantially the entire surface of one main surface of the insulating base material 33.
  • the insulating protective film 32 is formed so as to cover the conductive base material 31A.
  • the insulating protective film 32 is formed with an opening AP321, a plurality of openings AP322, and a plurality of openings AP323. These openings partially expose the conductive substrate 31A.
  • the conductive base material 31A is connected to the plurality of ground conductors 24 of the first substrate 20 by the conductive bonding material 40 in the plurality of openings AP322 and the plurality of openings AP323.
  • the electronic device 10A has the same function and effect as the electronic device 10.
  • the surface of the conductive base material 31A opposite to the signal conductor 22 side is covered with the insulating base material 33. This makes it possible to suppress an unnecessary short circuit between the conductive base material 31A and the electric circuit outside the electronic device 10A. That is, it is possible to suppress an unnecessary short circuit between the ground of the transmission line formed by the electronic device 10A and the electric circuit outside the electronic device 10A.
  • the mode of the insulating protective film covering the signal conductor 22 and the conductive base material 31A and the mode of embedding in the base material are also described in the above-mentioned first embodiment with respect to the second embodiment.
  • the embodiment for the signal conductor 22 and the base material 31 shown in the embodiment can be applied.
  • FIG. 10 is a perspective view of the electronic device 10B according to the third embodiment.
  • FIG. 11 is a plan view of the electronic device 10B according to the third embodiment.
  • 12 (A) and 12 (B) are cross-sectional views of the electronic device 10B according to the third embodiment.
  • FIG. 13 is a plan view of the first substrate 20B of the electronic device 10B according to the third embodiment.
  • FIG. 14 is a plan view of the second substrate 30B of the electronic device 10B according to the third embodiment.
  • 15 (A) and 15 (B) are cross-sectional views of the second substrate 30B of the electronic device 10B according to the third embodiment.
  • the device 10B is different from the electronic device 10A according to the second embodiment in that it further includes a transmission line unit.
  • Other configurations of the electronic device 10B are the same as those of the electronic device 10A, and the description of the same parts will be omitted.
  • the electronic device 10B includes a first substrate 20B and a second substrate 30B.
  • the first substrate 20B is different from the first substrate 20 in that it includes a signal conductor 22B and a ground conductor 26.
  • the signal conductor 22B has a bent portion CV1 in the middle of the extending direction, and has a portion extending in the x-axis direction and a portion extending in the y-axis direction.
  • the ground conductor 26 is arranged on the side opposite to the portion extending in the x-axis direction with respect to the portion extending in the y-axis direction of the signal conductor 22B.
  • the ground conductor 26 has a shape extending in the x-axis direction. One end of the ground conductor 26 in the extending direction is close to the end of the portion of the signal conductor 22B extending in the y-axis direction.
  • the width of the ground conductor 26 is larger than the width of the signal conductor 22B.
  • the second substrate 30B has a first portion 301 and a second portion 302.
  • the first portion 301 has a bent portion CV2, and has a portion extending in the x-axis direction and a portion extending in the y-axis direction.
  • the basic configuration of the first portion 301 of the second substrate 30B is the same as that of the second substrate 30A according to the second embodiment.
  • the first portion 301 of the second substrate 30B includes an insulating base material 33B1, a conductive base material 31B, and an insulating protective film 32B.
  • the conductive base material 31B is arranged on one main surface of the insulating base material 33B1.
  • the insulating protective film 32B covers the conductive base material 31B.
  • the insulating protective film 32B is formed with an opening AP321, a plurality of openings AP322, and a plurality of openings AP323.
  • the first portion 301 of the second substrate 30B has the above-mentioned bending portion CV2, and has a portion extending in the x-axis direction and a portion extending in the y-axis direction.
  • the second portion 302 of the second substrate 30B includes an insulating base material 33B2, a linear conductor 34, a flat conductor 35, a plurality of connecting conductors 362, and a plurality of interlayer connecting conductors 372. Be prepared.
  • the insulating base material 33B2 is a laminate of the insulator layer 331 and the insulator layer 332.
  • the insulator layer 331 is integrally formed with the insulating base material 33B1 of the first portion 301.
  • the linear conductor 34 is arranged on the surface of the insulator layer 331 opposite to the contact surface with the insulator layer 332, that is, on one main surface of the insulating base material 33B2.
  • the linear conductor 34 has a shape extending along the extending direction of the second portion 302.
  • the flat conductor 35 is arranged at the interface between the insulator layer 331 and the insulator layer 332.
  • the flat conductor 35 is arranged on substantially the entire surface of the insulating base material 33B2.
  • the plurality of connecting conductors 362 are arranged on one main surface of the insulating base material 33B2, similarly to the linear conductor 34.
  • the plurality of connecting conductors 362 are arranged side by side with the linear conductor 34 along the extending direction of the linear conductor 34.
  • the plurality of interlayer connection conductors 372 penetrate the insulator layer 331 and connect each of the plurality of connection conductors 362 to the flat conductor 35.
  • the second substrate 30B is composed of a low-profile first portion 301, which is composed of a single layer of insulator and has a single conductor, and a two-layer insulator layer, and has two layers of conductors. It is composed of a second part 302 capable of realizing a more complicated circuit pattern.
  • the surface on which the insulating protective film 32B is formed is formed on one main surface of the first substrate 20B, more specifically. Specifically, it is arranged on the first substrate 20B so as to face one of the main surfaces of the portion of the first substrate 20B where the signal conductor 22B is arranged.
  • the opening AP321 faces the signal conductor 22B
  • the plurality of openings AP322 face each of the plurality of ground land conductors 23
  • the plurality of openings AP323 face the plurality of ground land conductors 24.
  • the first portion 301 of the two substrates 30B is arranged on the first substrate 20B.
  • the plurality of ground conductors 23 are electrically and physically bonded to the surface exposed by the plurality of openings AP322 in the conductive base material 31B of the second substrate 30B by using a conductive bonding material 40 such as solder. ..
  • the plurality of ground conductors 24 are electrically and physically bonded to the surface exposed by the plurality of openings AP323 in the conductive base material 31B of the second substrate 30B by using a conductive bonding material 40 such as solder. (See FIG. 12 (A)).
  • a configuration is realized in which the conductive base material 31B and the signal conductor 22 face each other at a predetermined distance and the conductive base material 31B is connected to the ground. That is, in the electronic device 10B, a microstrip type transmission line having the signal conductor 22B as the signal line and the conductive base material 31B as the ground is realized at the position of the first portion 301 of the second substrate 30B. As a result, a low-profile transmission line is realized at the location of the first portion 301 of the second substrate 30B.
  • the second portion 302 of the second substrate 30B has a surface on which the connecting conductor 362 is formed, which is one main surface of the first substrate 20B, more specifically. Is arranged on the first substrate 20B so as to face one of the main surfaces of the portion of the first substrate 20B where the ground conductor 26 is arranged. At this time, the second portion 302 of the second substrate 30B is arranged on the first substrate 20B so that the linear conductor 34 and the plurality of connecting conductors 362 face the ground conductor 26.
  • the ground conductor 26 of the first substrate 20B is electrically and physically bonded to each of the plurality of connecting conductors 362 of the second substrate 30B by using a conductive bonding material 40 such as solder.
  • the linear conductor 34 is arranged between the ground conductor 26 and the planar conductor 35 so as to face each other at a predetermined distance from each other.
  • the plane conductor 35 is electrically connected to the ground conductor 26 via a plurality of interlayer connecting conductors 372 and a plurality of connecting conductors 362.
  • the signal line realized by the linear conductor 34 becomes the ground conductor 26.
  • a triplate strip type transmission line sandwiched by a ground realized by the plane conductor 35 (corresponding to the "second ground conductor” of the present invention) is realized.
  • a transmission line is realized separately from the above-mentioned low profile portion.
  • the electronic device 10B can realize a wider variety of transmission line modes while being provided with a portion that realizes the above-mentioned effects.
  • a gap CA is provided between the linear conductor 34 and the ground conductor 26 in the triplate strip type transmission line.
  • the triplate strip type transmission line has a lower profile and can suppress dielectric loss as compared with the embodiment having no void CA.
  • the linear conductor 34 that functions as a signal conductor is arranged closer to the first substrate 20B than the flat conductor 35 that functions as a ground conductor.
  • the unnecessary wave radiated from the linear conductor 34 is shielded by the flat conductor 35.
  • unnecessary waves from the outside are shielded by the plane conductor 35 and are difficult to propagate to the linear conductor 34.
  • the second substrate 30B has a low profile in the portion corresponding to the first portion 301, as shown in FIG. 10, a substrate type electron realized by another transmission line or the like is realized.
  • the element 60 can be passed through the second substrate 30B and arranged.
  • the electronic device 10B can realize the transmission line of the other place by the transmission line of the desired mode while making the transmission line of the place through which the other electronic element 60 passes low. Therefore, even if other substrate-type electronic elements 60 are overlapped and arranged on the electronic device 10B, these complexes can be realized with a low profile.
  • a transmission line of another mode such as a coplanar type transmission line can also be adopted.
  • the mode of the insulating protective film covering the signal conductor 22 and the conductive base material 31A and the mode of embedding in the base material are also described in the above-mentioned first embodiment with respect to the second embodiment.
  • the embodiment for the signal conductor 22 and the base material 31 shown in the embodiment can be applied.
  • the insulating property covering various conductors such as the linear conductor 34 and various conductive substrates such as the conductive substrate 31B is also applied to the third embodiment.
  • the mode for the signal conductor 22 and the base material 31 shown in the first embodiment described above can be applied.
  • FIG. 16 is a side view showing a derivative aspect of the electronic device according to the third embodiment.
  • the electronic device 10C includes a first substrate 20, a second substrate 30C, and a third substrate 70.
  • the first substrate 20 has the same configuration as the portion of the first substrate 20B described above in which the first portion 301 of the second substrate 30B faces.
  • the second substrate 30C includes a first portion 301C and a second portion 302C.
  • the first portion 301C has the same configuration as the first portion 301 described above
  • the second portion 302C has the same configuration as the second portion 302 described above.
  • the first portion 301C of the second substrate 30C is joined to the first substrate 20.
  • a connector is attached to the second portion 302C of the second substrate 30C.
  • the connector connects to the transmission line formed in the second portion 302C.
  • the second portion 302 of the second substrate 30C is connected to the third substrate 70 by using this connector.
  • the surface of the first substrate 20 to which the first portion 301C of the second substrate 30C is joined and the surface of the third substrate 70 to which the second portion 302C of the second substrate 30C is connected are in the z-axis direction.
  • the position (height of the surface) is different.
  • the second substrate 30C has a bent portion BT.
  • the bent portion BT is a portion where the thickness direction of the second substrate 30C changes when viewed from the side.
  • the bent portion BT is formed in the second portion 302C of the second substrate 30C.
  • the second part 302C can be realized by a transmission line in a desired mode. Therefore, by realizing the second portion 302C by, for example, a transmission line using a flexible insulating base material, the bent portion BT can be easily formed with respect to the second portion 302C. At this time, the shape of the bent portion BT can be easily maintained by using a material that can be plastically deformed.
  • a mode of realizing a transmission line having one signal conductor on the first substrate is shown.
  • the above configuration can also be applied to a transmission line in which a plurality of signal conductors run in parallel on the first substrate, such as a differential line.
  • a ground conductor made of a second substrate may be arranged facing each of the signal conductors, or one ground conductor facing all of the plurality of signal conductors may be arranged. good.
  • the second substrate, or both the first substrate and the second substrate may be bent in the horizontal direction (direction parallel to the xy plane) or the stacking direction (z-axis direction).
  • the aspects in which the sizes of the first substrate and the second substrate in the xy plane are different are shown.
  • the first substrate and the second substrate may have the same outer shape in the xy plane.
  • the substrate-type electronic element 60 is passed through the second substrate 30B and arranged, it is preferable that the first substrate is larger in the xy plane than the second substrate.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguides (AREA)
PCT/JP2021/020808 2020-06-08 2021-06-01 電子機器 Ceased WO2021251209A1 (ja)

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JP2022530485A JP7582311B2 (ja) 2020-06-08 2021-06-01 電子機器
CN202190000526.3U CN218941409U (zh) 2020-06-08 2021-06-01 电子设备
US17/983,445 US12237556B2 (en) 2020-06-08 2022-11-09 Electronic device

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Citations (5)

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JPS5413981A (en) * 1977-07-01 1979-02-01 Toshiba Corp Micro strip line
JPH0746009A (ja) * 1993-08-03 1995-02-14 Matsushita Electric Ind Co Ltd 高周波半導体装置
JP2011182311A (ja) * 2010-03-03 2011-09-15 Sony Corp 伝送線路
WO2016088693A1 (ja) * 2014-12-01 2016-06-09 株式会社村田製作所 電子機器
WO2017098921A1 (ja) * 2015-12-07 2017-06-15 株式会社村田製作所 樹脂基板および電子機器

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Publication number Priority date Publication date Assignee Title
JP3077487B2 (ja) * 1993-12-24 2000-08-14 松下電器産業株式会社 高周波回路
US5510758A (en) 1993-04-07 1996-04-23 Matsushita Electric Industrial Co., Ltd. Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
JP2004201135A (ja) 2002-12-19 2004-07-15 Kyocera Corp 高周波用配線基板およびその製造方法
JP5546270B2 (ja) 2010-02-01 2014-07-09 三菱電機株式会社 高周波伝送線路
CN205828619U (zh) * 2014-05-29 2016-12-21 株式会社村田制作所 高频信号线路以及包括该高频信号线路的电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5413981A (en) * 1977-07-01 1979-02-01 Toshiba Corp Micro strip line
JPH0746009A (ja) * 1993-08-03 1995-02-14 Matsushita Electric Ind Co Ltd 高周波半導体装置
JP2011182311A (ja) * 2010-03-03 2011-09-15 Sony Corp 伝送線路
WO2016088693A1 (ja) * 2014-12-01 2016-06-09 株式会社村田製作所 電子機器
WO2017098921A1 (ja) * 2015-12-07 2017-06-15 株式会社村田製作所 樹脂基板および電子機器

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US12237556B2 (en) 2025-02-25
JPWO2021251209A1 (https=) 2021-12-16
CN218941409U (zh) 2023-04-28

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