WO2021246817A1 - 다중 입출력 안테나 장치 - Google Patents
다중 입출력 안테나 장치 Download PDFInfo
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- WO2021246817A1 WO2021246817A1 PCT/KR2021/006986 KR2021006986W WO2021246817A1 WO 2021246817 A1 WO2021246817 A1 WO 2021246817A1 KR 2021006986 W KR2021006986 W KR 2021006986W WO 2021246817 A1 WO2021246817 A1 WO 2021246817A1
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- main board
- antenna device
- multiple input
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
- H01P1/2053—Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
Definitions
- the present invention relates to a multiple input/output antenna device (MULTI INPUT AND MULTI OUTPUT ANTENNA APPARATUS), and more particularly, it improves antenna performance by efficiently dissipating heat generated from RF elements and heat generated from RF filters to the rear of the main housing. It relates to a multi-input/output antenna device that can be improved.
- MULTI INPUT AND MULTI OUTPUT ANTENNA APPARATUS MULTI INPUT AND MULTI OUTPUT ANTENNA APPARATUS
- a wireless communication technology for example, MIMO (Multiple-Input Multiple-Output) technology
- MIMO Multiple-Input Multiple-Output
- the transmitter transmits different data through each transmit antenna and , it is a spatial multiplexing technique that separates transmitted data through appropriate signal processing in the receiver.
- the channel capacity increases, allowing more data to be transmitted.
- the number of transmit/receive antennas is simultaneously increased, the channel capacity increases, allowing more data to be transmitted.
- the channel capacity increases, allowing more data to be transmitted.
- the number of antennas is secured by using the same frequency band compared to the current single antenna system.
- the number of transmitters and filters also increases.
- a plurality of substrates eg, a printed board assembly (PBA) closely disposed on the rear side in the installation space of the main housing, an antenna board and a PBA or antenna board stacked at a predetermined distance apart from the front side of the PBA
- PBA printed board assembly
- a PSU substrate disposed on one side of the is stacked, and a plurality of RF power supply network elements and RF filters that generate a large amount of driving heat during operation are installed.
- a large amount of driving heat generated inside the main housing during operation must be effectively dissipated to the outside (especially the rear) of the main housing.
- a heating element is mounted on the front side of the PBA.
- a structure for dissipating heat is adopted by processing a plurality of via holes penetrating to the rear of the PBA, which is the mounting surface of the heating element, or by installing a heat transfer coin at positions corresponding to the plurality of via holes.
- the structure for discharging heat through the via hole has a small contact area between the heating element and the via hole, so the heat dissipation efficiency is small, while the structure using a heat transfer coin also has a heating element and There is a problem in that a predetermined heat dissipation effect decreases due to the contact tolerance of the contact surface of the
- the present invention has been devised to solve the above technical problem, and it is an object of the present invention to provide a multiple input/output antenna device capable of maximizing heat dissipation performance through a sub-board separated from the main board so as to be in direct contact with the rear side of the main housing. do it with
- the present invention provides a multi-input/output antenna device that not only expands the ground area but also enables impedance matching with the ground pattern of the sub-board by distributing heat generating elements such as RF power supply network elements on the front and rear surfaces of the sub-board. to provide another purpose.
- a clamshell part is integrally formed at the rear end of the multi-band filter, and the integrated clamshell part is used to shield between Tx/Rx and Tx/Tx in the same multi-band filter to ensure isolation, thereby reducing signal interference. It is another object to provide a multi-input/output antenna device that can
- a main board having an accommodation space formed in a predetermined space form in at least one area, and a plurality of stacked portions on the rear side of the main board, and a plurality of front portions facing the accommodation space It includes a sub-board on which heating elements are mounted, and heat generated from the heating elements is radiated toward a rear surface of the sub-board.
- the main board is disposed in a relatively front part of the sub board, and the sub board is stacked so that the front part is in close contact with a part of the rear part of the main board, and is in a range in which the front part is not in contact with the rear part of the main board.
- the accommodating space may be formed, and the plurality of heating elements may be mounted on a front portion corresponding to the accommodating space.
- the main board is an integrated one-board in which the multi-layer layers stacked in the front and rear are integrally bonded, and forms an accommodating space in which at least a part of the multi-layers are removed in some areas of the rear part, and the sub-board,
- the plurality of heating elements may be stacked on the rear side of the rearmost layer of the main board, and the plurality of heating elements may be mounted on the front portion facing the accommodation space.
- the amount of thermal expansion of the sub-board according to the temperature increase due to the driving of the heating elements may be smaller than the amount of thermal expansion of the main board.
- front and rear thicknesses of the sub board may be smaller than the front and rear thicknesses of the main board.
- first heating elements are disposed on the front part of the main board, and second heating elements are disposed on the front part of the sub-board, and the output power of the second heating elements is higher than the output power of the first heating elements.
- first heating elements may be Rx elements (LNA)
- second heating elements may be Tx elements (PA and DA).
- third heating elements may be further disposed on the rear side of the sub-board.
- the third heating elements may include an FPGA.
- digital semiconductors are mounted on a rear surface of the main board that does not overlap with the front surface of the sub-board, and heat generated from the digital semiconductors of the main board is generated from a plurality of heat generating elements of the sub-board together with heat. It may be characterized in that heat is radiated toward the rear side of the sub-board.
- main board and the sub-board may be made of an epoxy resin material.
- the main board may include a plurality of sections having a plurality of transmission/reception channels, and the sub-board may be formed in a number corresponding to each of the plurality of sections.
- the sub-board may further include an oscillation prevention circuit for preventing oscillation of the heating elements.
- the sub-board may be a multi-layer substrate having at least two layers.
- an active element as a part of the heating elements is mounted on a layer layer corresponding to the front surface of the sub-board, and a passive element as the rest of the heating elements is arranged on a layer layer corresponding to the rear surface of the sub-board, , the heat generated from the active element and the passive element may be radiated to the rear side of the sub-board.
- a ground pattern (GND pattern) is formed between the heating elements among the layer layers corresponding to the rear surface of the sub-board, and the ground pattern is in contact with the inner surface of the main board and the antenna housing in which the sub-board is installed.
- GND pattern is formed between the heating elements among the layer layers corresponding to the rear surface of the sub-board, and the ground pattern is in contact with the inner surface of the main board and the antenna housing in which the sub-board is installed.
- the at least two layer layers may be bonded and formed in the same manner as the multi-layer layer of the main board.
- At least one heat transfer bridge hole for discharging heat generated from the heat generating elements to the rear may be formed in the sub-board.
- the heat transfer bridge hole may be filled with a heat conductive material.
- the sub-board may be a metal PCB.
- the front part is provided with a mounting space in which the main board and the sub-board are installed, and the rear part of the antenna housing part is integrally formed with a plurality of heat sink fins that receive heat generated from the heating elements and radiate heat to the outside.
- the rear part of the antenna housing part is integrally formed with a plurality of heat sink fins that receive heat generated from the heating elements and radiate heat to the outside. may include more.
- the rear surface of the sub board and the inner surface of the antenna housing may be in surface thermal contact so that heat generated from the heating elements is transferred to the rear surface of the sub board and radiated through the plurality of heat sink fins.
- an accommodation space for accommodating the resonator is provided, a plurality of filters seated on the front part of the main board, and a plurality of filters stacked on the front part of the plurality of filters, a predetermined electrical signal line is constructed through the plurality of filters
- a plurality of antenna elements may further include an antenna board mounted on the front side.
- a clamshell portion for shielding signal interference with the electrical signal line may be integrally formed.
- a plurality of transmission channels and reception channels corresponding to the electrical signal lines are provided on the front surface of the main board, and the clamshell unit includes a transmission/reception partition for shielding regions of the transmission and reception channels to be spatially partitioned. It may include ribs.
- the clamshell unit may further include a transmission unit partitioning rib provided as a pair of the transmission channels to shield the transmission circuit patterns spaced apart from each other by a predetermined distance in space.
- At least one position fixing protrusion protruding toward the main board is formed at the rear end of the plurality of filters, and the clamshell part has at least one position fixing protrusion formed at a position corresponding to the main board.
- a pair of mainboard-side RF connectors electrically connected to the main board are provided, and at the front end of the plurality of filters, stacked on the front end of the plurality of filters A pair of antenna board-side RF connectors for electrically connecting to the antenna board may be provided.
- the sub-board by configuring the sub-board as two layers, it is possible to improve the ground shielding effect between the antenna housing and the sub-board.
- the space in which the resonator is installed is expanded, so that the filter performance can be improved.
- a plurality of sections composed of a plurality of transmission/reception channels included in the main board can be individually shielded from electromagnetic waves by one assembly action.
- FIG. 1 is a perspective view showing an embodiment of a multiple input/output antenna device according to the present invention
- Figure 2 is an exploded perspective view of Figure 1
- FIG. 3 is an exploded perspective view of FIG. 1, showing a state in which the sub-board and the multi-band filter are separated from the main board;
- FIG. 4 is a partial cross-sectional view taken along line A-A of FIG. 3;
- FIG. 5A and 5B are an exploded perspective view of FIG. 1, a downward perspective view and an upward perspective view showing a state in which the multi-band filter is separated from the main board;
- FIG. 6 is a bottom perspective view and an upward perspective view showing a multi-band filter in the configuration of FIG. 1;
- FIG. 7 is a cross-sectional view showing a plurality of section regions of the main board partitioned by the clamshell part in the configuration of the multi-band filter;
- FIG. 8 is a front view and a rear view showing a sub-board in the configuration of FIG. 1;
- FIG. 9 is a cross-sectional view taken along line B-B of FIG. 3 as a state in which the multi-band filter is mounted in the configuration of FIG. 1;
- FIG. 10 is a schematic diagram of various embodiments in which the heat dissipation structure of FIG. 9 is detailed.
- main board 150 sub board
- antenna board 320 antenna element
- FIG. 1 is a perspective view showing an embodiment of a multiple input/output antenna device according to the present invention
- FIG. 2 is an exploded perspective view of FIG. 1
- FIG. 3 is an exploded perspective view of FIG. It is an exploded perspective view showing the separated state.
- One embodiment (1) of the multiple input/output antenna device according to the present invention is formed in a rectangular parallelepiped shape having a long and thin front and rear accommodation width in an approximately vertical direction, forming a mounting space opened to the front (upper side in the drawing in FIG. 1)
- the first stacked assembly 100 primarily stacked inside the mounting space of the antenna housing unit (not shown), the second stacked assembly 200 mounted and fixed to the front surface of the first stacked assembly 100 , and the second and a third stacked assembly 300 stacked on the front end of the stacked assembly 200 .
- one embodiment (1) of the multiple input/output antenna device according to the present invention is disposed at one end (lower end) in the longitudinal direction of the first stacked assembly 100 as shown in FIGS. 1 and 2 , and the first A power supply unit (hereinafter, abbreviated as 'PSU') 50 for supplying power to a plurality of RF power supply network components provided in the stacked assembly to the third stacked assembly 100 to 300 is further added.
- 'PSU' the first A power supply unit
- the PSU 50 serves to control the supply of power to a plurality of RF power supply network components provided in the first to third stacked assemblies 100 to 300 to perform calibration feed control and frequency filtering. do.
- the first stacked assembly 100 may include a main board 110 and a sub-board 150 as shown in FIGS. 2 and 3 .
- the plurality of RF power supply network components described above, and the heating elements 111, 151, and 181 that emit predetermined heat during operation according to the application of power are dispersed. can be mounted.
- the main board 110 and the sub-board 150 may each be provided with an F4 resin-based substrate made of an epoxy resin material.
- the main board 100 and the sub-board 150 do not necessarily have to be made of an epoxy resin material, and different materials may be adopted according to the main function of the substrate.
- the sub-board 150 may be made of a metal PCB material in that the heat dissipation function is prioritized, as will be described later.
- the main board 110 has a predetermined thickness, and, as described above, may be formed of a thin rectangular plate made of an epoxy resin material.
- At least one low noise amplifier (LNA), which is an Rx element, may be mounted on the front surface of the main board 110 as a first heating element among the above-described heating elements.
- digital semiconductor devices such as a Filed Programmable Gate Array (FPGA) may be mounted on the rear surface of the main board 110 as the third heating element among the aforementioned heating elements.
- the FPGA is mounted on the rear surface of the main board 110, is mounted on the rear surface of the main board 110 exposed to the rear without overlapping with the sub-board 150, and is in surface thermal contact with the inner surface of the mounting space of the antenna housing unit.
- the generated heat may be directly radiated through a plurality of heat sink fins (not shown) integrally formed on the rear surface of the antenna housing.
- the main board 110 may include a plurality of sections having a plurality of transmission/reception channels.
- the plurality of transmit/receive channels may include a transmitter channel and a receiver channel, and each transmitter channel and receiver channel may be patterned to be spaced apart from each other by a predetermined distance in the left and right width direction of the main board 110 .
- a plurality of sections having such a plurality of transmission/reception channels may be provided to be spaced apart from each other by a predetermined distance in the vertical and longitudinal direction of the main board 110 .
- each section is formed in the number of columns corresponding to the unit multi-band filter 210 in the configuration of the second stacked assembly 200 to be described later, and 16 Tx elements and 16 Rx elements are mounted in one section range. and by having 4 such sections, a Massive MIMO technology with a transmission capacity of 64T/R can be applied.
- two cavities 205 are partitioned inside by a partition wall (reference numerals not indicated), and the resonator 215 in each cavity 205 is provided.
- Two Tx elements (transistor (TR) and power amplifier (PA)), which are second heating elements, may be mounted and disposed in corresponding regions of the main board 110 and the sub-board 150 .
- the sub-board 150 may serve as an auxiliary substrate closely coupled to the rear surface of the main board 110 .
- the thickness of the sub-board 150 is relatively smaller than the thickness of the main board 110 .
- the sub-board 150 is in direct thermal contact with the inner surface of the mounting space of the antenna housing part and additionally performs a function of transferring heat generated from the plurality of heating elements 111, 151, 181, heat transfer is better than that of the epoxy resin material. It is preferable to be provided with an easy metal PCB.
- a pattern circuit in which two Tx elements, which are the second heating elements 151 among the heating elements, are mounted may be printed.
- one second heating element 151 is mounted, respectively, and a transmission channel and a reception channel can be completed by the two pattern circuits.
- the transmit channel and the receive channel may be electrically connected to a pair of mainboard-side RF connectors 233 provided in a unit multi-band filter 210 to be described later, respectively.
- FIGS. 5A and 5B are exploded perspective views of FIG. 1, showing a state in which the multi-band filter is separated from the main board.
- 1 is a bottom perspective view and an upward perspective view showing the multi-band filter
- FIG. 7 is a cross-sectional view showing a plurality of section regions of the main board divided by the clamshell part in the configuration of the multi-band filter.
- the second stacked assembly 200 is disposed between the main board 110 of the first stacked assembly 100 and the antenna board 310 of the third stacked assembly 300 as shown in FIGS. 4 to 6 . It may include a filter 210 that performs frequency filtering.
- the filter 210 may be employed as any one of a cavity filter, a wave-guide filter, and a dielectric filter.
- the filter here does not exclude a multi-band filter (MBF) that covers multiple frequency bands.
- MMF multi-band filter
- a plurality of filters 210 are fixed to cover an area corresponding to a plurality of sections provided on the main board 110, and a pair of transmit and receive channels may be included in the corresponding area. have.
- two cavities 205 are partitioned left and right by a partition wall, and frequency filtering through a transmission channel and a reception channel by a plurality of resonators 215 provided in each cavity 205 can be performed.
- the filter 210 may be provided such that its inner cavity 205 and external noise (such as a signal due to electromagnetic waves) are shielded, and its inner surface is plated in the form of a metal thin film, and as will be described later, the filter (
- the clamshell part 250 integrally formed at the rear end of the 210 may also be the same.
- the main board 110 at least one positioning groove (115a, 115b) for designating each installation position of the unit MBF (210) may be formed.
- at least one positioning protrusion ( 215a, 215b) may be formed.
- a clamshell part 250 for shielding signal interference with an electrical signal line may be integrally formed at the rear end of the filter 210 .
- the clamshell unit 250 is shielded so that the regions of the transmission channel 253 ′′ and the reception channel 251 ′ included in the main board 110 are spatially partitioned, as shown in FIGS. 5A and 5B and FIG. 7 .
- Transmitting unit partition ribs 253a and 253b provided as a pair of the transmission/reception partitioning rib 251 and the transmission channel 253′′ to shield the transmission circuit patterns spaced apart from each other by a predetermined distance are partitioned in space.
- the transmission/reception partitioning rib 251 of the clamshell unit 250 serves to spatially partition and shield a pair of Rx elements, which are the first heating elements 111 mounted on the front surface of the main board 110 . do.
- the transmitter division ribs 253a and 253b of the clamshell unit 250 spatially partition and shield the two Tx elements, which are the second heating elements 151 mounted on each pattern circuit of the sub-board 110 . play a role
- each partition rib 251,253 of the clamshell part 250 integrally formed at the rear end of the filter 210 the influence of electromagnetic waves between the Rx elements and the Tx elements is maximally shielded, and at the same time, a pair of By shielding the signal influence between the Tx elements, the frequency filter performance can be greatly improved.
- the cavity 205 space of the filter 210 is further expanded to the rear side, thereby making the spaced space of the plurality of resonators 215 wider.
- the filter 210 may be assembled to the main board 210 with a predetermined assembly force through an assembly screw (not shown) passing through the positioning protrusions 215a and 215b and the positioning grooves 115a and 115b.
- a pair of mainboard-side RF connectors 230 electrically connected to the main board 110 are provided, and the filter 210 is provided.
- a pair of mainboard-side RF connectors 230 are provided with one connector 230a and the other connector 230b connected to each cavity 205 side of the filter 210 so as to take charge of a transmission channel and a reception channel, respectively.
- the pair of antenna board side RF connectors 240 may also include one connector 240a and the other connector 240b connected to each cavity 205 side of the filter 210 so as to take charge of a transmission channel and a reception channel, respectively. .
- the main board-side RF connector 230 is, as shown in FIG. 4 , a connecting boss 231 , a connecting terminal pin 233 disposed to pass through the inside of the connecting boss 231 and a filter 210 . It may include an elastic ground washer 235 that serves as a ground while absorbing the assembly tolerance between the and the main board 110 .
- the connecting part 140 for inserting and fastening the connecting terminal pin 233 may be provided in the form of a hole, and a dielectric 130 for impedance matching is embedded around the connecting part 140 . (imbeded) may be provided in the form.
- the connecting terminal pin 233 may pass through the dielectric 130 to be electrically signal-connected to the sub-board 150 laminated to the rear side of the main board 110 .
- the sub-board 150 is not provided, but the connecting part 140 is provided on the front surface of the main board 110, and the dielectric 130 for impedance matching with respect to the periphery of the connecting part 140 is provided.
- the sub-board 150 is separated and stacked on the back surface of the main board 110 and the dielectric 130 can be installed as much as the thickness of the main board 110 in an embedded form.
- the above-described impedance matching design between the sub-board 150 and the ground layer has the advantage of being very easy.
- the RF connector 240 on the antenna board side as shown in FIG. 4 , a contact terminal pin 243 that is in contact with a contact part (not shown) provided on the rear side of the antenna board 310, and a contact point
- a contact terminal pin 243 that is in contact with a contact part (not shown) provided on the rear side of the antenna board 310
- a contact point To absorb the assembly tolerance between the dielectric block 241 and the filter 210 and the antenna board 310 for fixing the terminal pin 243 to the filter 210 while maintaining the impedance matching, as well as serving as a ground It may include an elastic ground washer 245 .
- a signal received through the antenna element 320 of the third stacked assembly 300 is transmitted to the second stacked assembly during the signal reception process.
- it is filtered into a predetermined frequency band through the filter 210 , and then is input to the main board 110 of the first stacking assembly 100 and data is processed.
- the signal passes through the receiver channel, but the Rx element and the Tx element are driven to generate heat, and the driving heat generated therefrom passes through the sub-board 150 provided with a metal PCB to facilitate rear heat dissipation. have.
- the signal transmitted from the main board 110 of the first stacked assembly 100 is filtered to a predetermined frequency band through the filter 210 during the configuration of the second stacked assembly 200 and then It may be oscillated through the antenna element 320 of the three-layered assembly 300 .
- the signal passes through the transmitter channel, but the Rx element and the Tx element are driven to generate heat, and the driving heat generated therefrom is rearwardly radiated via the sub-board 150 provided with the metal PCB. have.
- reception channel part and the transmission channel part are spaced apart and shielded by the clamshell part 250 integrally formed at the rear end of the filter 210, so that signal interference can be prevented in advance.
- the third stacked assembly 300 includes an antenna board 310 stacked on the front end of the filter 210 , and a plurality of mounted and fixed antenna boards on the front surface of the antenna board 310 .
- FIG. 8 is a front view and a rear view showing a sub-board in the configuration of FIG. 1
- FIG. 9 is a cross-sectional view taken along line BB of FIG. 3 with a multi-band filter mounted in the configuration of FIG. 1, FIG. It is a schematic diagram of various embodiments in which the heat dissipation structure of FIG. 9 is detailed.
- the multiple input/output antenna device 1 includes a first heating element 111 and a third heating element 181 of a main board 110 that receives power from a PSU 50 and operates; , a considerable amount of driving heat may be generated from the second heat generating element 151 of the sub-board 150 .
- the plurality of heating elements 111, 151, 181 are dispersedly mounted on the front and rear surfaces of the main board 110, and heat generated from the heating elements 111, 151, 181 is radiated to the rear of the main board 110, and the main A structure for dissipating heat through a plurality of heat sink fins of the antenna housing portion disposed to be in thermal contact with the rear surface of the board 110 is adopted.
- the amount of heat generated by the Tx element which is the second heating element 151 among the plurality of heating elements 111, 151, 181 is very large, whereas it is mounted on the front surface of the main board 110 formed of a substrate material with low thermal conductivity.
- the heat transfer efficiency ie, heat dissipation performance
- the multiple input/output antenna device 1 proposes various design methods as follows in order to solve the above-described problems.
- a plurality of heating elements are mounted on the board 110a and the back side of the main board 110a, and are stacked on the front side facing the receiving space 110s-1. and a sub-board 150 .
- a plurality of heating elements 151 are mounted on the front part so as to have a range (refer to reference numeral '110s-2') that is not in contact with the rear part of the main board 110b. and a sub-board 150 .
- the multiple input/output antenna device 1 is an integrated one-board in which the multi-layer layers stacked in the front and rear are integrally bonded, as shown in FIG.
- the main board 110c having the accommodating space 110s-3 from which at least some of the multi-layer layers are removed in a part of the rear portion and the layer layer located at the rearmost side of the main board 110c among the multi-layer layers
- the stacked sub-board 150 may include a plurality of heating elements mounted on the front portion facing the receiving space 110s-3.
- the heat dissipation structure according to the first to third exemplary embodiments is characterized in that heat generated from the heat generating elements 151 is radiated toward the rear surface of the sub-board 150 .
- At least one heat transfer bridge hole 153 for discharging heat generated from the heat generating elements 151 to the rear may be formed in the sub-board 150 .
- the heat transfer bridge hole 153 may be processed in a hole shape to discharge heat generated from the heat generating elements 151 to the rear, and may be filled with a metal material having excellent thermal conductivity.
- heat generated from the heating elements 151 mounted on the front side of the sub-board 150 may be smoothly transferred to the rear side of the sub-board 150 via the heat transfer bridge hole 153 .
- the amount of thermal expansion of the sub-board 150 according to the temperature increase due to the driving of the heating elements 151 is smaller than the amount of thermal expansion of the main board 110 .
- the front and rear thicknesses of the sub board 150 may be designed to be smaller than the front and rear thicknesses of the main board 110 .
- the main board 110 is provided in a form in which a plurality of multi-layer layers are integrally bonded, and a pattern not shown is designed along each layer layer.
- a pattern not shown is designed along each layer layer.
- the thickness of the main board 110 is maintained as the existing design value, but the sub-board 150 is substantially improved in heat dissipation performance. ) is proposed.
- a circuit pattern corresponding to a transmission channel and a reception channel may be printed on the front surface of the sub-board 150 so that the second heating elements 151 expected to generate the most heat among the heating elements 111 , 151 , and 181 are mounted.
- the main board 110, the second heating elements 151 mounted on the above-described sub-board 150 are exposed to the front, or at least in the above-described receiving spaces 110s-1 and 110s-3, the main board 110 and may be formed to be accommodated in a non-contact range (110s-2).
- the accommodating space 110s-1 may be provided in the form of an opening through which the main board 110a is penetrated in the front and rear.
- the non-contact range 110s - 2 may be provided in a form in which a part of the rear surface of the main board 110b is cut rearward.
- the accommodation space 110s-3 is in a form in which at least a portion of the multi-layer layer is removed from a portion of the multi-layer layer provided on the main board 110c. It is also possible to be provided.
- the sub-board 150 has a different name from the main board 110c, but is not physically separated, and is provided in two layers as the same layer as the main board 110c, so that the second heating elements are provided.
- 151 may be integrally bonded to the rear surface of the main board 110 so as to be accommodated in the accommodation space 110s-3 in a state in which the 151 is mounted on the front portion.
- the second heating elements when the first heating elements 111 are disposed on the front part of the main board 110 and the second heating elements 151 are disposed on the front part of the sub-board 150, the second heating elements
- the output power (ie, amount of heat) of 151 is preferably set to be greater than the output power (ie, amount of heat) of the first heat generating elements 111 . This is to maximize heat dissipation performance by locating the second heat generating elements 151 having high output power closer to the plurality of heat sink fins of the antenna housing.
- the Tx element which is the second heating element 151 with the largest relatively large amount of heat among the heating elements 111 , 151 , and 181 , is mounted on the front surface of the sub-board 150 .
- the layout design was adopted.
- digital semiconductors such as FPGAs are mounted on the rear surface of the main board 110 , which does not overlap the front surface of the sub-board 150 , as third heating elements 181 , and the third of the main board 110 .
- the heat generated from the heat generating elements 181 may be radiated toward the rear side of the sub board 150 together with the heat generated from the plurality of second heat generating elements 151 of the sub board 150 .
- the third heating elements 181 are mounted on the rear surface of the main board 110 in a range where the sub-board 181 and the main board 110 do not overlap each other, the surface thermal contact is directly on the inner surface of the antenna housing. It is also possible for heat conduction to occur.
- a layer layer corresponding to the front surface of the sub-board 150 includes one of the heating elements.
- An active element may be mounted as a part, and a passive element may be disposed as the rest of the heat generating elements in a layer layer corresponding to the rear surface of the sub-board 150 .
- heat generated from the active element and the passive element is radiated to the rear side of the sub-board 150 .
- a ground pattern (not shown) may be formed between the heating elements (passive elements) among the layer layers corresponding to the rear surface of the sub-board 150 .
- the ground pattern is in contact with the inner surface of the antenna housing on which the main board 110 and the sub-board 150 are installed, and functions to shield electromagnetic waves generated from the sub-board 150 .
- the ground pattern (GND pattern) that can be formed between the heating elements
- An area may be increased, and an increase in the area of the ground pattern may increase a contact area with the inner surface of the antenna housing portion, thereby achieving a more improved electromagnetic wave shielding rate.
- the sub-board 150 may further include an oscillation prevention circuit for preventing oscillation of the heating elements.
- the oscillation prevention circuit minimizes the driving heat by pre-blocking the high-frequency oscillation of the heat generating elements according to the circuit configuration, and can easily radiate the minimized driving heat to the rear side of the sub-board 150 as described above.
- the heating elements that were intensively mounted on the main board 110 of the conventional one-board type are divided into the sub-board 150 and mounted to prevent heat concentration, and , has the advantage of improving the overall heat dissipation performance by effectively dissipating rear heat through a plurality of heat sink fins of the antenna housing provided on the rear side of the sub-board 150 .
- the present invention provides a multiple input/output antenna device capable of improving heat dissipation performance by more easily dissipating heat generated from heat generating elements to the outside of an antenna housing using a sub-board separately from a main board.
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Abstract
Description
Claims (28)
- 적어도 일 영역에 소정의 공간 형태로 수용 공간이 형성된 메인 보드; 및상기 메인 보드의 후면부 측에 적층되고, 상기 수용 공간을 향하는 전면부에 다수의 발열 소자들이 실장된 서브 보드; 를 포함하고,상기 발열 소자들로부터 발생한 열은 상기 서브 보드의 후면부 측으로 방열되는 것을 특징으로 하는, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,상기 메인 보드는, 상기 서브 보드보다 상대적으로 전방부에 배치되고,상기 서브 보드는, 전면부가 상기 메인 보드의 후면부 일부와 밀착되게 적층 배치되되, 상기 메인 보드의 후면부와 비접촉되는 범위인 상기 수용 공간을 형성하고, 상기 수용 공간에 해당되는 전면부에 상기 다수의 발열 소자들이 실장된, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,상기 메인 보드는, 전후방으로 적층된 멀티 레이어층이 일체로 접합 형성된 일체형 원보드이고, 후면부 중 일부의 영역에서 상기 멀티 레이어층 중 적어도 일부가 제거되어 상기 수용 공간을 형성하고,상기 서브 보드는, 상기 멀티 레이어층 중 상기 메인 보드의 가장 후방에 위치한 레이어층의 후면부 측에 적층되고, 상기 수용 공간을 향하는 전면부에 상기 다수의 발열 소자들이 실장된, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,상기 발열 소자들의 구동에 의한 온도 상승에 따른 상기 서브 보드의 열팽창량은 상기 메인 보드의 열팽창량 보다 작은, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,상기 서브 보드의 전후 두께는 상기 메인 보드의 전후 두께보다 작은, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,상기 메인 보드의 전면부에는 제1발열 소자들이 배치되고, 상기 서브 보드의 전면부에는 제2발열 소자들이 배치되며,상기 제2발열 소자들의 출력 전력은 상기 제1발열 소자들의 출력 전력보다 큰, 다중 입출력 안테나 장치.
- 청구항 6에 있어서,상기 제1발열 소자들은 Rx 소자(LNA)이고, 상기 제2발열 소자들은 Tx 소자(PA 및 DA)인, 다중 입출력 안테나 장치.
- 청구항 6에 있어서,상기 메인 보드의 후면부 측에는 제3발열 소자들이 더 배치되는, 다중 입출력 안테나 장치.
- 청구항 8에 있어서,상기 제3발열 소자들은, FPGA를 포함하는, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,상기 메인 보드의 후면부 중 상기 서브 보드의 전면부와 겹치지 않는 후면부에는 디지털 반도체들이 실장 배치되고,상기 메인 보드의 디지털 반도체들로부터 발생한 열은 상기 서브 보드의 다수의 발열 소자들로부터 발생한 열과 함께 상기 서브 보드의 후면부 측으로 방열되는 것을 특징으로 하는, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,상기 메인 보드와 상기 서브 보드는, 에폭시 수지 재질로 이루어진, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,상기 메인 보드는, 복수의 송수신 채널을 갖는 복수의 섹션을 포함하고,상기 서브 보드는, 상기 복수의 섹션 각각에 대응되는 개수로 이루어진, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,상기 서브 보드는, 상기 발열 소자들의 발진을 방지하는 발진방지회로를 더 포함하는, 다중 입출력 안테나 장치.
- 청구항 3에 있어서,상기 서브 보드는, 적어도 2개의 레이어층을 가지는 다층 기판인, 다중 입출력 안테나 장치.
- 청구항 14에 있어서,상기 서브 보드의 전면에 해당하는 레이어층에는 상기 발열 소자들 중 일부로서 능동소자가 실장 배치되고,상기 서브 보드의 후면에 해당하는 레이어층에는 상기 발열 소자들 중 나머지로서 수동소자가 배치되며,상기 능동소자 및 수동소자로부터 발생한 열은 상기 서브 보드의 후면측으로 방열되는, 다중 입출력 안테나 장치.
- 청구항 15에 있어서,상기 서브 보드의 후면에 해당하는 레이어층 중 상기 발열 소자들 사이에는 접지 패턴(GND 패턴)이 형성되고,상기 접지 패턴은 상기 메인 보드 및 상기 서브 보드가 설치되는 안테나 하우징부의 내부면과 접촉되어 상기 서브 보드에서 발생하는 전자파의 차폐 면적을 증가시키는, 다중 입출력 안테나 장치.
- 청구항 14에 있어서,상기 서브 보드는, 상기 적어도 2개의 레이어층이 상기 메인 보드의 멀티 레이어층과 동일한 방식으로 접합 형성된, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,상기 서브 보드에는, 상기 발열 소자들로부터 발생한 열을 후방으로 배출하기 위한 적어도 하나의 열전달 브릿지 홀이 형성된, 다중 입출력 안테나 장치.
- 청구항 18에 있어서,상기 열전달 브릿지 홀에는, 열전도성 재질이 충진되는, 다중 입출력 안테나 장치.
- 청구항 18에 있어서,상기 서브 보드는, 메탈 PCB인, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,전방부에는 상기 메인 보드 및 상기 서브 보드가 설치되는 장착 공간이 구비되고, 후방부에는 상기 발열 소자들로부터 발생한 열을 전달받아 외부로 방열하는 다수의 히트 싱크 핀이 일체로 형성된 안테나 하우징부; 를 더 포함하는, 다중 입출력 안테나 장치.
- 청구항 21에 있어서,상기 발열 소자들로부터 발생한 열은, 상기 서브 보드의 후면부 측으로 전달되어 상기 다수의 히트 싱크 핀을 통해 방열되도록 상기 서브 보드의 후면부와 상기 안테나 하우징부의 내부면은 표면 열 접촉되는, 다중 입출력 안테나 장치.
- 청구항 1에 있어서,공진기를 수용하는 수용 공간이 구비되고, 상기 메인 보드의 전방부에 안착되는 다수의 필터; 및상기 다수의 필터의 전방부에 적층되되, 상기 다수의 필터를 통해 소정의 전기적인 신호 라인을 구축하는 다수의 안테나 소자가 전면에 실장된 안테나 보드; 를 더 포함하는, 다중 입출력 안테나 장치.
- 청구항 23에 있어서,상기 다수의 필터의 후단부에는, 상기 전기적인 신호 라인과의 신호 간섭을 차폐하기 위한 크램쉘부가 일체로 형성된, 다중 입출력 안테나 장치.
- 청구항 24에 있어서,상기 메인 보드의 전면에는, 상기 전기적인 신호 라인에 대응되는 송신 채널 및 수신 채널이 복수개로 구비되고,상기 크램쉘부는, 상기 송신 채널 및 수신 채널의 영역이 공간상 구획되도록 차폐하는 송수신 구획 리브; 를 포함하는, 다중 입출력 안테나 장치.
- 청구항 25에 있어서,상기 크램쉘부는, 상기 송신 채널 중 한 쌍으로 구비되어 소정 거리 이격되어 있는 송신 회로 패턴이 상호 공간상 구획되도록 차폐하는 송신부 구획 리브; 를 더 포함하는, 다중 입출력 안테나 장치.
- 청구항 26에 있어서,상기 다수의 필터의 후단부에는, 상기 메인 보드 측으로 돌출된 적어도 하나의 위치 고정 돌기가 형성되고,상기 크램쉘부는, 상기 적어도 하나의 위치 고정 돌기가 상기 메인 보드의 대응되는 위치에 형성된 적어도 하나의 위치 설정홈에 안착될 때, 상기 송수신 구획 리브 및 상기 송신부 구획 리브에 의하여 상기 송신 채널 및 수신 채널의 영역 및 상기 송신 회로 패턴을 완전 구획하는, 다중 입출력 안테나 장치.
- 청구항 24에 있어서,상기 다수의 필터의 후단부에는, 상기 메인 보드와 전기적으로 연결하는 한 쌍의 메인보드측 RF 커넥터가 구비되고,상기 다수의 필터의 전단부에는, 상기 다수의 필터의 전단부에 적층된 안테나 보드와 전기적으로 연결하는 한 쌍의 안테나 보드측 RF 커넥터가 구비된, 다중 입출력 안테나 장치.
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EP21817076.9A EP4164054A1 (en) | 2020-06-05 | 2021-06-04 | Multi input and multi output antenna apparatus |
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JP2022574323A JP2023529340A (ja) | 2020-06-05 | 2021-06-04 | 多重入出力アンテナ装置 |
US18/074,597 US20230109083A1 (en) | 2020-06-05 | 2022-12-05 | Multi input and multi output antenna apparatus |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018001007A1 (zh) * | 2016-06-28 | 2018-01-04 | 武汉虹信通信技术有限责任公司 | 一种用于5g系统的密集阵列天线 |
US20180316086A1 (en) * | 2017-04-26 | 2018-11-01 | Telefonaktiebolaget Lm Ericsson (Publ) | Radio assembly with modularized radios and interconnects |
KR20190118979A (ko) * | 2018-04-11 | 2019-10-21 | 주식회사 케이엠더블유 | 다중 입출력 안테나 장치 |
KR20190126336A (ko) * | 2017-03-31 | 2019-11-11 | 주식회사 케이엠더블유 | 안테나 어셈블리 및 안테나 어셈블리를 포함하는 장치 |
KR20200051617A (ko) * | 2017-09-25 | 2020-05-13 | 갭웨이브스 에이비 | 위상 배열 안테나 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102391167B1 (ko) * | 2017-06-08 | 2022-04-27 | 주식회사 만도 | 방열 어셈블리 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018001007A1 (zh) * | 2016-06-28 | 2018-01-04 | 武汉虹信通信技术有限责任公司 | 一种用于5g系统的密集阵列天线 |
KR20190126336A (ko) * | 2017-03-31 | 2019-11-11 | 주식회사 케이엠더블유 | 안테나 어셈블리 및 안테나 어셈블리를 포함하는 장치 |
US20180316086A1 (en) * | 2017-04-26 | 2018-11-01 | Telefonaktiebolaget Lm Ericsson (Publ) | Radio assembly with modularized radios and interconnects |
KR20200051617A (ko) * | 2017-09-25 | 2020-05-13 | 갭웨이브스 에이비 | 위상 배열 안테나 |
KR20190118979A (ko) * | 2018-04-11 | 2019-10-21 | 주식회사 케이엠더블유 | 다중 입출력 안테나 장치 |
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KR102636233B1 (ko) | 2024-02-16 |
CN115836441A (zh) | 2023-03-21 |
EP4164054A1 (en) | 2023-04-12 |
US20230109083A1 (en) | 2023-04-06 |
JP2023529340A (ja) | 2023-07-10 |
KR20230074427A (ko) | 2023-05-30 |
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