WO2021244008A1 - 胶接结构缺陷试块的制造方法 - Google Patents

胶接结构缺陷试块的制造方法 Download PDF

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Publication number
WO2021244008A1
WO2021244008A1 PCT/CN2020/137425 CN2020137425W WO2021244008A1 WO 2021244008 A1 WO2021244008 A1 WO 2021244008A1 CN 2020137425 W CN2020137425 W CN 2020137425W WO 2021244008 A1 WO2021244008 A1 WO 2021244008A1
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Prior art keywords
adhesive
heating
board
adhesive layer
curing
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PCT/CN2020/137425
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English (en)
French (fr)
Inventor
张婷
黄爱华
李向前
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中国航发商用航空发动机有限责任公司
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Priority to US17/615,923 priority Critical patent/US11951725B2/en
Priority to JP2021562900A priority patent/JP2023529029A/ja
Priority to EP20936074.2A priority patent/EP4163630A4/en
Publication of WO2021244008A1 publication Critical patent/WO2021244008A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/30—Arrangements for calibrating or comparing, e.g. with standard objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/043—Analysing solids in the interior, e.g. by shear waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0231—Composite or layered materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects

Definitions

  • the present disclosure relates to the field of non-destructive testing, and in particular to a manufacturing method of a test block for bonding structural defects.
  • Kiss-bonds is a type of defect in the glued structure.
  • the close-fitted connection refers to a defect in which two surfaces in the glued structure are in close contact, that is, there is no bond between the two surfaces.
  • the close-fitting connection will result in a reduction in the load capacity of the structure.
  • a defect similar to the close-fitting connection defect is a weak bond, that is, the bond between two surfaces is not sufficiently bonded. Due to some structural continuity, weak connections may be more difficult to assess. Close-fitting connection and weak connection defects may occur in single-piece, interlayer, bonded or repaired composite materials, which may be introduced during the manufacturing process, or may be caused by damage or insufficient repair. The loss of structural strength and the potential growth of defects under loading conditions in use (that is, growth from weak connection/close-fitting connection to debonding) make the detection and evaluation of this type of defect particularly important.
  • the present disclosure provides a method for manufacturing a bonding structure test block, which includes the following steps:
  • the adhesive layer is heated and cured for the second time to form an adhesive structure test block.
  • At least part of the area includes a plurality of preset area blocks spaced apart on the adhesive layer, and the first heating and curing of at least part of the area of the adhesive layer includes independent heating of the plurality of preset area blocks of the adhesive layer .
  • the manufacturing method further includes determining the position and area of the plurality of preset area blocks according to the preset position and the preset area of the defect before independently heating the plurality of preset area blocks of the adhesive layer.
  • a pre-curing device is used to independently heat a plurality of preset area blocks of the adhesive layer.
  • the pre-curing device includes a heating plate and a plurality of heating columns movably arranged on the heating plate. The position corresponds to a plurality of preset area blocks on the adhesive layer.
  • laying adhesive glue on the upper surface of the first glue board to form the glue layer includes laying an adhesive agent on an area near the end of the upper surface of the first glue board to make the second glue board Overlap on the first adhesive board.
  • the manufacturing method further includes performing a temperature-rising rheological performance test on the adhesive and obtaining the rheological curve of the adhesive, and selecting the temperature for the first heating and curing and the temperature for the second heating and curing according to the rheology curve .
  • laying the adhesive glue on the upper surface of the first glued board to form the glue layer includes laying the glue on the entire area of the upper surface of the first glued board so that the glue layer covers the first glued board. At least part of the upper surface of the adhesive layer includes the entire area of the adhesive layer, and the manufacturing method further includes: before the first heating and curing of the entire area of the adhesive layer, first lay the second adhesive board on the adhesive layer and then apply the adhesive The first heating and curing of the layer; after the first heating and curing occurs in all areas of the adhesive layer, separate the first adhesive plate and the second adhesive plate from the middle of the adhesive layer and separate the first adhesive plate and The second glue board is stacked, and the glue layer is heated and cured for the second time.
  • both the first heating curing and the second heating curing are heated and curing using an autoclave, and the temperature of the first heating curing and the second heating curing are the same, and the heating time is different.
  • cracks are preset on the adhesive layer.
  • the adhesive glue is a glue film, and the glue film is laid on the upper surface of the first glue board to form the glue layer.
  • a first glued board and a second glued board made of composite materials are provided, and the composite material of the first glued board and the composite material of the second glued board are the same or different.
  • ultrasonic scanning is performed on the test block after obtaining the test block to confirm defect information.
  • the manufacturing method of the test block for the bonding structure defect includes providing a first bonding board and a second bonding board; laying an adhesive glue on the upper surface of the first bonding board to form a glue layer; At least a part of the adhesive layer is heated and cured for the first time; the second adhesive bonding plate is placed on the adhesive layer; and the adhesive layer is heated and cured for the second time to form a bonding structure test block.
  • the present disclosure realizes the controllable manufacturing of defects by first heating and curing at least part of the adhesive layer and causing a chemical reaction to form defects in at least part of the area.
  • the test block with the defect is used for mechanical testing to simulate the actual defective product.
  • the manufacturing method of the present disclosure simulates weak connection defects of different bonding strengths and close-fitting connection defects by controlling the size of the percentage of at least part of the area in the entire area of the adhesive layer.
  • FIG. 1 is a schematic diagram of the steps of a method for manufacturing a defect test block for a bonding structure according to an embodiment of the disclosure
  • Figure 2 is the rheological curve of the adhesive film of the embodiment of the disclosure.
  • FIG. 3 is a schematic diagram of the structure of a pre-curing device used in an embodiment of the disclosure.
  • FIGs 4 to 7 are schematic diagrams of the decomposition steps of manufacturing weak connection defect test blocks according to the embodiments of the present disclosure.
  • the board is lapped on the first glued board
  • FIG. 6 shows an enlarged structure diagram of the glue layer in FIG. 5
  • FIG. 7 shows a schematic diagram of the structure of a defective test block formed after the second heating and curing;
  • FIG. 8 to 10 are schematic diagrams of the exploded steps of manufacturing a close-fitting connection defect test block according to an embodiment of the present disclosure, in which, FIG. 8 shows the stacking of the first glue board, the glue layer, and the second glue board, and FIG. 9 shows Separate the first bonding board and the second bonding board of the intermediate bonding structure after the first heating and curing.
  • FIG. 10 shows a schematic structural diagram of the defective test block formed after the second heating and curing.
  • the method for manufacturing a defect test block for a bonding structure includes the following steps:
  • Step 101 Provide a first glued board 1 and a second glued board 2;
  • Step 102 Lay adhesive glue on the upper surface of the first glued board 1 to form the glue layer 3;
  • Step 103 Perform heating and curing for the first time on at least a part of the adhesive layer 3;
  • Step 104 Place the second adhesive board 2 on the adhesive layer 3;
  • Step 105 heat and cure the adhesive layer 3 a second time to form a bonded structure test block.
  • At least part of the area of the adhesive layer 3 is first heated and cured and a chemical reaction occurs to make at least part of the area to form defects, thereby achieving controllable manufacturing of defects.
  • the test block with the defect is used for mechanical testing to simulate the actual defective product.
  • the manufacturing method of the present disclosure simulates weak connection defects with different bonding strengths by controlling the size of at least a part of the area in the entire area of the adhesive layer.
  • FIG. 6 is a structural diagram of the adhesive layer 3 after the first heating and curing, where 31 is a non-cured area, and 32 is a cured area.
  • 31 is a non-cured area
  • 32 is a cured area.
  • the manufacturing method of this embodiment further includes determining the position and area of the plurality of preset area blocks according to the preset position and the preset area of the defect before independently heating the plurality of preset area blocks of the adhesive layer.
  • the preset area block is the curing area.
  • an embodiment of the present disclosure provides a method for manufacturing a weak connection defect test block. As shown in FIG. 4, at least part of the area of this embodiment includes a plurality of preset area blocks spaced apart on the adhesive layer 3. The first heating and curing of at least part of the adhesive layer 3 includes the Each preset area block is heated independently.
  • a pre-curing device 5 as shown in FIG. 3 is used to independently heat a plurality of preset area blocks of the adhesive layer 3.
  • the pre-curing device 5 includes a heating plate 51 and a plurality of heating pillars 52 movably arranged on the heating plate 51, and the positions of the plurality of heating pillars 52 are adjusted to correspond to a plurality of preset area blocks on the glue layer 3.
  • the pre-curing device 5 of this embodiment further includes a positioning groove 53, the heating column 52 is arranged in the positioning groove 53, and the position of the positioning groove 53 is adjusted to change the position of the heating column 52 .
  • a plurality of heating pillars 52 are abutted on the adhesive layer 3 so that the plurality of preset areas of the adhesive layer 3 are heated and cured for the first time, and the adhesive layer 3 after the first heating and curing is as follows Shown in Figure 6.
  • laying adhesive glue on the upper surface of the first glued board 1 to form the glue layer 3 includes forming the glue layer 3 on the upper surface of the first glued board 1 near the end area and make the second The glued board 2 is overlapped on the first glued board 1.
  • the manufacturing method of this embodiment also includes conducting a temperature-rising rheological performance test on the adhesive and obtaining the rheological curve of the adhesive. According to the rheological curve, the first heating curing temperature and the second curing temperature are selected. Heat curing temperature.
  • the temperature of the first heating and curing is lower than the temperature of the second heating and curing.
  • the composite material of the first adhesive board 1 and the composite material of the second adhesive board 2 are the same, which is CYCOM X850, and the material of the adhesive film is PL7000.
  • a rheometer was used to test the temperature-rising rheological properties of the film. During the test, a parallel plate clamp was used to make the glue film into a disc with a diameter of 25mm at room temperature, and 3 pieces of glue film were stacked and compacted to obtain a test sample, and the rheological curve of the glue film was obtained, as shown in Figure 2.
  • the first glued board 1 is laid and glued on the surface of the first glued board 1.
  • the heating column 51 in the pre-curing device 5 is adjusted according to the preset position and the preset area of the designed weak connection defect and connected to the upper surface of the adhesive film. Specifically, in this embodiment, 50 needle-shaped heating columns are arranged, and the heating column 51 is circular and has a diameter of 0.2 mm.
  • the pre-curing equipment 5 is used to perform partial pre-curing of the adhesive film.
  • the heating rate of the adhesive film contacting the heating column 51 on the adhesive film is 2-3° C./min, the curing temperature is 100° C. ⁇ 10° C., and the time is 30 minutes.
  • the pre-curing equipment 5 is removed, and the second adhesive bonding board 2 is laid on the adhesive film to obtain a single-lap adhesive bonding structure.
  • test block is ultrasonically scanned to obtain defect signals. And then machined to obtain a single lap test block that meets the standard.
  • the present disclosure provides a method for manufacturing a close-fitting defect test block.
  • the glue layer 3 covers the upper surface of the first glued board 1, at least part of the area includes all areas of the glue layer 3.
  • the manufacturing method further includes: first heating and curing all areas of the glue layer 3 Previously, the second adhesive board 2 was first laid on the adhesive layer 3 and then the adhesive layer 3 was heated and cured for the first time; after the first heating and curing occurred in all areas of the adhesive layer 3, as shown in Figure 9, Separate the first glued board 1 and the second glued board 2 from the middle of the glue layer 3 and stack the separated first glued board 1 and the second glued board 2 (Figure 10 shows the after separation The first glued board 1 and the second glued board 2 are stacked again), and then the overall glued structure is heated and cured to realize the second heating and curing of the glue layer 3.
  • both the first heating curing and the second heating curing adopt a hot autoclave for heating curing, and the temperature of the first heating curing and the second heating curing are the same, and the heating time is different.
  • cracks can also be preset on the adhesive layer 3 according to the setting requirements of the defects.
  • the adhesive glue of this embodiment is a glue film, and the glue film is laid on the upper surface of the first glue board to form the glue layer 3.
  • the manufacturing method of this embodiment provides a first glued board 1 and a second glued board 2 made of composite materials.
  • the composite material of the first glued board 1 and the composite material of the second glued board 2 are the same or different.
  • test block After obtaining the test block, perform an ultrasonic scan on the test block to confirm the defect information.
  • the composite material of the first adhesive board 1 and the composite material of the second adhesive board 2 are the same, which is CYCOM 970/PWC T300 3K ST (CCF), and the material of the adhesive film is PL7000.
  • a crack 33 is preset on the glue film and the first glued board 1, the glue film and the second glued board 2 are laid in sequence to form an intermediate glued structure, and the intermediate glued structure is placed one by one on top Peelable cloth, isolation film, air felt and pressure equalizing board auxiliary materials, and use a vacuum bag to encapsulate the intermediate bonding structure, and put it in a hot autoclave for the first heating and curing.
  • the curing temperature is 177°C ⁇ 10°C
  • heat preservation 120min curing pressure is 0.7Mpa.
  • the first glued board 1 and the second glued board 2 are separated by external force and the first glued board 1 and the second glued board 2 are separated from the middle of the glue layer 3.
  • Figure 10 does not show the adhesive layer, but it includes the adhesive layer
  • the adhesive layer which the adhesive board 1 and the second adhesive board 2 and perform a second curing, which The curing temperature is 177°C ⁇ 10°C, the heat preservation is 60min, the curing pressure is 0.7Mpa, and the sample block with prefabricated cracks and close-fitting connection defects is obtained by demolding.

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Abstract

一种胶接结构缺陷试块的制造方法。该方法包括提供第一胶接板和第二胶接板（S101）；在第一胶接板的上表面铺设粘接胶以形成胶层（S102）；对胶层的至少部分区域进行第一次加热固化（S103）；将第二胶接板放置于胶层上（S104）；以及对胶层进行第二次加热固化以形成胶接结构试块（S105）。通过将胶层的至少部分区域先进行第一加热固化并发生化学反应以使得至少部分区域形成缺陷，实现了缺陷的可控制造。利用带有该缺陷的试块进行力学检测以模拟实际缺陷产品。而且该制造方法通过对至少部分区域占胶层全部区域的百分比的大小控制来模拟不同粘接强度的弱连接缺陷以及紧贴型连接缺陷。

Description

胶接结构缺陷试块的制造方法
本申请是以CN申请号为202010507968.9，申请日为2020年6月5日的申请为基础，并主张其优先权，该CN申请的公开内容在此作为整体引入本申请中。
技术领域
本公开涉及无损检测领域，特别涉及一种胶接结构缺陷试块的制造方法。
背景技术
随着民用航空的快速发展，要求民用飞机结构材料必须朝着低密度、高强度、高韧性、耐高温和耐腐蚀性等方向发展。在传统的民用航空结构中，需要使用大量的铆钉将零部件连接起来形成某些部件，通常一架小型飞机上包含有上万个铆钉，这必然使得飞机的重量较高。胶接结构代替铆接已被大量应用到民用飞机结构上，但是由于胶接结构在制造过程中不可避免的会引入各种缺陷，包括裂纹、空隙/孔洞、脱粘、弱连接等。
紧贴型连接(Kiss-bonds)是胶接结构中的一种缺陷类型，紧贴型连接指的是胶接结构中两个表面紧密接触的一种缺陷，即两个表面之间没有结合，紧贴型连接将导致结构负载能力的降低。另外，与紧贴型连接缺陷类似的缺陷还有弱连接(weak bond)，即两个表面之间的键结合不充分。由于存在某种结构连续性，使得弱连接可能更难以评估。紧贴型连接和弱连接缺陷可能出现在单片、夹层、粘合或修补的复合材料中，其可能在制造过程中引入，也可能是由于损坏或修补不足造成的。结构强度的损失以及在使用中加载条件下缺陷的潜在增长(即从弱连接/紧贴型连接增长到脱粘)，使得对这种缺陷类型的检测和评估变得尤为重要。
为了测试缺陷，必须首先创建带有缺陷的对比试块。而对比试块的制造本身就是个难题，因此可控的制造出带紧贴型连接(Kiss-bonds)和弱连接(weak bond)缺陷的试块并检测出来内部缺陷是至关重要的。
公开内容
本公开提供一种胶接结构试块的制造方法，包括如下步骤：
提供第一胶接板和第二胶接板；
在第一胶接板的上表面铺设粘接胶以形成胶层；
对胶层的至少部分区域进行第一次加热固化；
将第二胶接板放置于胶层上；以及
对胶层进行第二次加热固化以形成胶接结构试块。
在一些实施例中，至少部分区域包括间隔分布于胶层上的多个预设区域块，对胶层的至少部分区域进行第一次加热固化包括对胶层的多个预设区域块独立加热。
在一些实施例中，制造方法还包括在对胶层的多个预设区域块独立加热之前，根据缺陷的预设位置和预设面积确定多个预设区域块的位置和面积。
在一些实施例中，利用预固化设备对胶层的多个预设区域块独立加热，预固化设备包括加热板和可移动地设置于加热板上的多个加热柱，调节多个加热柱的位置以与胶层上的多个预设区域块对应。
在一些实施例中，在第一胶接板的上表面铺设粘接胶以形成胶层包括在第一胶接板的上表面的靠近端部的区域铺设粘接剂以使第二胶接板搭接于第一胶接板上。
在一些实施例中，制造方法还包括对粘接胶进行升温流变性能测试并获得粘接胶的流变曲线，根据流变曲线选择第一次加热固化的温度和第二次加热固化的温度。
在一些实施例中，在第一胶接板的上表面铺设粘接胶以形成胶层包括在第一胶接板的上表面的全部区域铺设粘接剂以使胶层覆盖第一胶接板的上表面，至少部分区域包括胶层的全部区域，制造方法还包括：在对胶层的全部区域进行第一次加热固化之前，先将第二胶接板铺贴于胶层上再对胶层进行第一次加热固化；在胶层的全部区域发生第一次加热固化后，将第一胶接板和第二胶接板从胶层的中间分开并将分开的第一胶接板和第二胶接板叠置，再对胶层进行第二次加热固化。
在一些实施例中，第一次加热固化和第二次加热固化均采用热压罐进行加热固化，且第一次加热固化和第二次加热固化的温度相同，加热时间不同。
在一些实施例中，在胶层上预设裂纹。
在一些实施例中，粘接胶为胶膜，在第一胶接板的上表面铺设胶膜以形成胶层。
在一些实施例中，提供由复合材料制成的第一胶接板和第二胶接板，第一胶接板的复合材料和第二胶接板的复合材料相同或者不同。
在一些实施例中，在获得试块后对试块进行超声波扫描以确认缺陷信息。
基于本公开提供的技术方案，胶接结构缺陷试块的制造方法包括提供第一胶接板和第二胶接板；在第一胶接板的上表面铺设粘接胶以形成胶层；对胶层的至少部分区 域进行第一次加热固化；将第二胶接板放置于胶层上；以及对胶层进行第二次加热固化以形成胶接结构试块。本公开通过将胶层的至少部分区域先进行第一加热固化并发生化学反应以使得至少部分区域形成缺陷，实现了缺陷的可控制造。利用带有该缺陷的试块进行力学检测以模拟实际缺陷产品。而且本公开的制造方法通过对至少部分区域占胶层全部区域的百分比的大小控制来模拟不同粘接强度的弱连接缺陷以及紧贴型连接缺陷。
通过以下参照附图对本公开的示例性实施例的详细描述，本公开的其它特征及其优点将会变得清楚。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开中记载的一些实施例，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。
图1为本公开实施例的胶接结构缺陷试块的制造方法的步骤示意图；
图2为本公开实施例的胶膜的流变曲线；
图3为本公开实施例利用的预固化设备的结构示意图；
图4至图7为本公开实施例制造弱连接缺陷试块的分解步骤示意图，其中，图4示出利用预固化设备对胶层进行第一次加热固化，图5示出将第二胶接板搭接于第一胶接板上，图6示出图5中胶层的放大结构图，图7示出经过第二次加热固化后形成的缺陷试块的结构示意图；
图8至图10为本公开实施例制造紧贴型连接缺陷试块的分解步骤示意图，其中，图8示出将第一胶接板、胶层和第二胶接板层叠，图9示出将经过第一次加热固化的中间胶接结构的第一胶接板和第二胶接板分开，图10示出经过第二次加热固化后形成的缺陷试块的结构示意图。
具体实施方式
为了使本公开的目的、技术方案及优点更加清楚明白，以下通过实施例，并结合附图，对本公开的胶接结构缺陷试块的制造方法进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本公开，并不用于限定本公开。
如图1所示，本公开实施例的胶接结构缺陷试块的制造方法包括如下步骤：
步骤101：提供第一胶接板1和第二胶接板2；
步骤102：在第一胶接板1的上表面铺设粘接胶以形成胶层3；
步骤103：对胶层3的至少部分区域进行第一次加热固化；
步骤104：将第二胶接板2放置于胶层3上；和
步骤105：对胶层3进行第二次加热固化以形成胶接结构试块。
本公开实施例通过将胶层3的至少部分区域先进行第一加热固化并发生化学反应以使得至少部分区域形成缺陷，实现了缺陷的可控制造。利用带有该缺陷的试块进行力学检测以模拟实际缺陷产品。而且本公开的制造方法通过对至少部分区域占胶层全部区域的百分比的大小控制来模拟不同粘接强度的弱连接缺陷。
在此需要说明的是，在上述各个步骤之间还可以进行别的步骤。
参考图6，图6为胶层3在经过第一次加热固化以后的结构图，其中，31为无固化区域，32为固化区域。在制造胶接结构缺陷试块之前，首先确定想要制造缺陷试块的缺陷的预设位置和预设面积。本实施例的制造方法还包括在对胶层的多个预设区域块独立加热之前，根据缺陷的预设位置和预设面积确定多个预设区域块的位置和面积。也就是说，预设区域块就是固化区域。
在一个实施例中，本公开实施例提供弱连接缺陷试块的制造方法。如图4所示，本实施例的至少部分区域包括间隔分布于胶层3上的多个预设区域块，对胶层3的至少部分区域进行第一次加热固化包括对胶层3的多个预设区域块独立加热。
具体在本实施例中，利用如图3所示的预固化设备5对胶层3的多个预设区域块独立加热。预固化设备5包括加热板51和可移动地设置于加热板51上的多个加热柱52，调节多个加热柱52的位置以与胶层3上的多个预设区域块对应。
为了适用于不同缺陷大小和位置试块的制造，本实施例的预固化设备5还包括定位槽53，加热柱52设置于定位槽53内，调节定位槽53的位置来改变加热柱52的位置。
如图4所示，将多个加热柱52抵接于胶层3上以使得胶层3的多个预设区域块发生第一次加热固化，在第一次加热固化后的胶层3如图6所示。
如图7所示，在第一胶接板1的上表面铺设粘接胶以形成胶层3包括在第一胶接板1的上表面的靠近端部的区域形成胶层3并使第二胶接板2搭接于第一胶接板1上。
如图2所示，本实施例的制造方法还包括对粘接胶进行升温流变性能测试并获得 粘接胶的流变曲线，根据流变曲线选择第一次加热固化的温度和第二次加热固化的温度。
具体地，第一次加热固化的温度小于第二次加热固化的温度。
对弱连接缺陷试块的制造方法，下面结合具体实例进行详细说明。
首先选择第一胶接板1、第二胶接板2以及胶膜的材料。本实施例的第一胶接板1的复合材料和第二胶接板2的复合材料相同，为CYCOM X850，胶膜的材料为PL7000。
采用流变仪对胶膜进行升温流变性能测试。测试时使用平行板夹具，将胶膜在室温下制成直径25mm的圆片，采用3片胶膜叠放后压实制得测试样品，获得胶膜的流变曲线，如图2所示。
如图4所示，将第一胶接板1铺贴好，并将胶膜铺贴在第一胶接板1的表面。
将预固化设备5中的加热柱51按设计的弱连接缺陷的预设位置和预设面积调整好并连接到胶膜上表面。具体地，本实施例布置了50根针状加热柱，加热柱51为圆形，直径为0.2mm。
使用预固化设备5对胶膜进行局部预固化，胶膜上与加热柱51接触的胶膜的升温速率为：2-3℃/min，固化温度为100℃±10℃，时间为30min。
如图5所示，撤去预固化设备5，在胶膜上面完成第二胶接板2的铺贴，得到单搭接胶接结构。
将铺贴好的单搭接胶接结构上方依次放上可剥布、隔离膜，透气毡和均压板辅助材料，并用真空袋对试块进行封装，放入热压罐中进行固化，其固化温度为180℃，保温120min，固化压力为0.7Mpa。
脱模得到如图7所示含有局部弱连接的单搭接试块。
将试块进行超声扫描，获得缺陷信号。并再进行机加工获得满足标准的单搭接试块。
将单搭接试块进行力学性能测试。
在另一实施例中，本公开提供紧贴型缺陷试块的制造方法。如图8所示，胶层3覆盖第一胶接板1的上表面，至少部分区域包括胶层3的全部区域，制造方法还包括：在对胶层3的全部区域进行第一次加热固化之前，先将第二胶接板2铺贴于胶层3上再对胶层3进行第一次加热固化；在胶层3的全部区域发生第一次加热固化后，如图9所示，将第一胶接板1和第二胶接板2从胶层3的中间分开并将分开的第一胶接板 1和第二胶接板2叠置(图10示出的是分开以后的第一胶接板1和第二胶接板2再叠置)，再对整体胶接结构进行加热固化而实现对胶层3的第二次加热固化。
如图9所示，在将第一胶接板1和第二胶接板2从胶层3的中间分开，此时第一胶接板1的上表面设置有胶层分体3a，第二胶接板2的下表面设置有胶层分体3b。
在本实施例中，第一次加热固化和第二次加热固化均采用热压罐进行加热固化，且第一次加热固化和第二次加热固化的温度相同，加热时间不同。
在上述各个实施例中，还可以根据缺陷的设置需要在胶层3上预设裂纹。
为方便胶层3的形成，本实施例的粘接胶为胶膜，在第一胶接板的上表面铺设胶膜以形成胶层3。
本实施例的制造方法提供由复合材料制成的第一胶接板1和第二胶接板2，第一胶接板1的复合材料和第二胶接板2的复合材料相同或者不同。
在获得试块后对试块进行超声波扫描以确认缺陷信息。
对紧贴型连接缺陷试块的制造方法，下面结合具体实例进行详细说明。
首先准备第一胶接板1、第二胶接板2和胶膜。本实施例的第一胶接板1的复合材料和第二胶接板2的复合材料相同，为CYCOM 970/PWC T300 3K ST(CCF)，胶膜的材料为PL7000。
如图8所示，在胶膜上预设裂纹33并将第一胶接板1、胶膜和第二胶接板2依次铺好形成中间胶接结构，将中间胶接结构上方依次放上可剥布、隔离膜，透气毡和均压板辅助材料，并用真空袋对中间胶接结构进行封装，放入热压罐中进行第一次加热固化，其固化温度为177℃±10℃，保温120min，固化压力为0.7Mpa。
如图9所示，利用外力将第一胶接板1和第二胶接板2分开且要使得第一胶接板1和第二胶接板2从胶层3的中间分开。
如图10所示(图10未示出胶层，但是其是包括胶层的)，再将分开的第一胶接板1和第二胶接板2叠置并进行第二次固化，其固化温度为177℃±10℃，保温60min，固化压力为0.7Mpa，脱模得到胶接界面含有预制裂纹和紧贴型连接缺陷的试块。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。相反，当元件被称作“直接在”另一元件“上”时，不存在中间元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
在本公开描述中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。
同时，本说明书中所引用的如“上”、“下”、“左”、“右”、“中间”及“一”等的用语，亦仅为便于叙述的明了，而非用以限定本公开可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当亦视为本公开可实施的范畴。
以上所述实施例仅表达了本公开的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本公开专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本公开构思的前提下，还可以做出若干变形和改进，这些都属于本公开的保护范围。因此，本公开专利的保护范围应以所附权利要求为准。

Claims (12)

  1. 一种胶接结构缺陷试块的制造方法，包括如下步骤：
    提供第一胶接板(1)和第二胶接板(2)；
    在所述第一胶接板(1)的上表面铺设粘接胶以形成胶层(3)；
    对所述胶层(3)的至少部分区域进行第一次加热固化；
    将所述第二胶接板(2)放置于所述胶层(3)上；以及
    对所述胶层(3)进行第二次加热固化以形成胶接结构试块。
  2. 根据权利要求1所述的胶接结构缺陷试块的制造方法，其中，所述至少部分区域包括间隔分布于所述胶层(3)上的多个预设区域块(32)，对所述胶层(3)的至少部分区域进行第一次加热固化包括对所述胶层(3)的多个预设区域块(32)独立加热。
  3. 根据权利要求2所述的胶接结构缺陷试块的制造方法，还包括在对所述胶层(3)的多个预设区域块(32)独立加热之前，根据缺陷的预设位置和预设面积确定所述多个预设区域块(32)的位置和面积。
  4. 根据权利要求2所述的胶接结构缺陷试块的制造方法，其中，利用预固化设备(5)对所述胶层(3)的多个预设区域块(32)独立加热，所述预固化设备(5)包括加热板(51)和可移动地设置于所述加热板(51)上的多个加热柱(52)，调节所述多个加热柱(52)的位置以与所述胶层(3)上的多个预设区域块(32)对应。
  5. 根据权利要求1所述的胶接结构缺陷试块的制造方法，其中，在所述第一胶接板(1)的上表面铺设粘接胶以形成胶层包括在所述第一胶接板(1)的上表面的靠近端部的区域铺设所述粘接剂以使所述第二胶接板(2)搭接于所述第一胶接板(1)的端部。
  6. 根据权利要求1所述的胶接结构缺陷试块的制造方法，还包括对所述粘接胶进行升温流变性能测试并获得粘接胶的流变曲线，根据所述流变曲线选择所述第一次加热固化的温度和所述第二次加热固化的温度。
  7. 根据权利要求1所述的胶接结构缺陷试块的制造方法，其中，在所述第一胶接板(1)的上表面铺设粘接胶以形成胶层包括在所述第一胶接板(1)的上表面的全部区域铺设所述粘接剂以使所述胶层(3)覆盖所述第一胶接板(1)的上表面，所述至少部分区域包括所述胶层(3)的全部区域，所述制造方法还包括：在对所述胶层(3)的所述全部区域进行第一次加热固化之前，先将所述第二胶接板(2)铺贴于所述胶层(3)上再对所述胶层(3)进行第一次加热固化；在所述胶层(3)的全部区域发生第一次加热固化后，将所述第一胶接板(1)和所述第二胶接板(2)从所述胶层(3)的中间分开并将分开的第一胶接板(1)和第二胶接板(2)叠置，再对所述胶层(3)进行第二次加热固化。
  8. 根据权利要求7所述的胶接结构缺陷试块的制造方法，其中，所述第一次加热固化和所述第二次加热固化均采用热压罐进行加热固化，且所述第一次加热固化和所述第二次加热固化的温度相同，加热时间不同。
  9. 根据权利要求1所述的胶接结构缺陷试块的制造方法，还包括，在所述胶层(3)上预设裂纹(33)。
  10. 根据权利要求1所述的胶接结构缺陷试块的制造方法，其中，所述粘接胶为胶膜，在所述第一胶接板(1)的上表面铺设胶膜以形成胶层(3)。
  11. 根据权利要求1所述的胶接结构缺陷试块的制造方法，其中，提供由复合材料制成的所述第一胶接板(1)和所述第二胶接板(2)，所述第一胶接板(1)的复合材料和所述第二胶接板(2)的复合材料相同或者不同。
  12. 根据权利要求1所述的胶接结构缺陷试块的制造方法，还包括：在获得所述缺陷试块后对所述缺陷试块进行超声波扫描以确认缺陷信息。
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