WO2021243791A1 - 激光封装装置 - Google Patents

激光封装装置 Download PDF

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Publication number
WO2021243791A1
WO2021243791A1 PCT/CN2020/100178 CN2020100178W WO2021243791A1 WO 2021243791 A1 WO2021243791 A1 WO 2021243791A1 CN 2020100178 W CN2020100178 W CN 2020100178W WO 2021243791 A1 WO2021243791 A1 WO 2021243791A1
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WO
WIPO (PCT)
Prior art keywords
reflective
packaging device
laser packaging
laser
reflecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/100178
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English (en)
French (fr)
Inventor
张亮
李金川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Publication of WO2021243791A1 publication Critical patent/WO2021243791A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Definitions

  • This application relates to the field of packaging technology, and in particular to a laser packaging device.
  • the traditional packaging device is shown in Figure 1, including a machine 10, a light source 20, and a mask 30.
  • a substrate 100 is placed on the machine 10.
  • the laser 200 emitted by the light source 20 is irradiated to the packaging area of the substrate 100 through the mask 30. 101.
  • the prior art has the technical problem of uneven irradiation energy in the packaging area.
  • the present application provides a laser packaging device to alleviate the existing technical problem of uneven energy irradiation in the packaging area.
  • This application provides a laser packaging device, including:
  • the machine is used to carry the substrate
  • the mask plate includes a cover part and a hollow part, and the light emitted by the light source passes through the hollow part and irradiates the packaging area of the substrate;
  • the cover part in a direction away from the light source, the cover part converges toward the hollow part to form a reflection part.
  • the cover part is an integrally formed structure.
  • the reflecting surface of the reflecting part is a tapered surface
  • the cross section is a straight line
  • the reflecting surface of the reflecting part is a tapered surface
  • the cross section is a curved line
  • the cover portion includes a glass plate, a heat dissipation film, and a reflective film, and the reflective portion is formed of the reflective film.
  • the material of the reflection part is the same as the material of the reflection film.
  • the cover portion includes a glass plate, a heat dissipation film, and a reflective film, and the reflection portion is formed by the heat dissipation film.
  • the material of the reflection part is the same as that of the heat dissipation film, and the reflection surface of the reflection part is increased with a reflection material.
  • the cover portion includes a glass plate, a heat dissipation film, and a reflective film, and the reflective portion is formed by the glass plate.
  • the reflective part is made of the same material as the glass plate, and the reflective surface of the reflective part is made of reflective material.
  • the mask plate has a combined structure.
  • the covering portion includes a first covering portion and a second covering portion that are disposed oppositely, a first reflecting portion of the first covering portion and a second reflecting portion of the second covering portion
  • the first reflecting part has a first reflecting surface
  • the second reflecting part has a second reflecting surface
  • the first reflection part and the second reflection part have the same shape.
  • the first reflection surface of the first reflection portion is a flat surface.
  • the angle between the plane and the light incident direction is greater than 0 degrees and less than 45 degrees.
  • the first reflective surface of the first reflective portion is a curved surface.
  • the covering portion includes a first covering portion and a second covering portion that are disposed oppositely, a first reflecting portion of the first covering portion and a second reflecting portion of the second covering portion Asymmetrical setting.
  • the cover portion includes a glass plate, a heat dissipation film, and a reflective film; the first reflective portion and the second reflective portion are formed of different reflective film layers.
  • the first reflection part and the second reflection part have different shapes.
  • the first reflecting part and the second reflecting part have different materials.
  • the present application provides a laser packaging device, including a machine for carrying a substrate; a light source; a mask plate, including a cover part and a hollow part, the light emitted by the light source passes through the hollow part and irradiates the packaging of the substrate Area; wherein, in the direction away from the light source, the cover part converges to the hollow part to form a reflection part; when the light emitted by the light source passes through the hollow part, the energy directly incident to the encapsulation area is high energy, which is incident to the reflection
  • the energy of the reflecting surface of the part is low energy, and the low energy is reflected by the reflecting surface to the edge area of the packaging area, and superimposed with the energy directly incident on the edge area of the packaging area, so that the energy of the edge area of the packaging area is the same as that of the central area.
  • the energy difference is reduced, that is, the energy in the entire packaging area tends to be evenly distributed, which makes up for the energy difference between the center area and the edge area of the packaging area, and
  • Figure 1 is a schematic diagram of an existing packaging method.
  • FIG. 2 is a schematic structural diagram of a laser packaging device provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of a first structure of a mask of a laser packaging device provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of light rays of a laser packaging device provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of a second structure of the mask plate of the laser packaging device provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of a third structure of the mask plate of the laser packaging device provided by an embodiment of the application.
  • FIG. 7 is a fourth structural schematic diagram of the mask plate of the laser packaging device provided by the embodiment of the application.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, "a plurality of" means two or more than two, unless otherwise specifically defined.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be mechanically connected, it can be electrical connection or it can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relation.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be mechanically connected, it can be electrical connection or it can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relation.
  • the "above” or “below” of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them.
  • “above”, “above” and “above” the second feature of the first feature include the first feature being directly above and obliquely above the second feature, or merely indicating that the level of the first feature is higher than that of the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • the present application provides a laser packaging device to alleviate the existing technical problem of uneven energy irradiation in the packaging area.
  • FIG. 2 it is a schematic structural diagram of a laser packaging device provided by an embodiment of this application.
  • the laser packaging device includes a machine 21, a light source 22, and a mask 23.
  • the machine 21 is used to place a substrate 210.
  • the substrate 210 includes two glass plates placed up and down. A glass glue 211 is coated between the two glass plates. The area where the glass glue 211 is located is the substrate 210. ⁇ encapsulation area 2101.
  • the light source 22 is used to emit light 220 to irradiate the packaging area 2101 of the substrate 210 to cure the glass glue 211.
  • the light 220 is a laser.
  • the mask plate 23 includes a cover part 231 and a hollow part 232.
  • the cover part 231 In a direction away from the light source 22, the cover part 231 converges toward the hollow part 232 to form a reflection part 233.
  • the light 220 passes through the hollow portion 232 and reaches the packaging area 2101.
  • Part of the light 220 emitted by the light source 22 is directly irradiated to the encapsulation area 2101, and the other part is irradiated to the reflective surface 2331 of the reflecting portion 233, and then reflected to the edge area of the encapsulation area 2101, and directly The energy of the light irradiated to the edge area of the encapsulation area 2101 is superimposed.
  • the mask 23 may be a combined structure or an integrally formed structure. A detailed description will be given below with reference to FIGS. 3 to 5.
  • FIG. 3 it is a schematic diagram of the first structure of the mask of the laser packaging device provided by the embodiment of this application.
  • the mask has a combined structure.
  • the mask plate includes a cover part 31 and a hollow part 32.
  • the cover part 31 includes a first cover part 311 and a second cover part 312 that are arranged oppositely.
  • the first reflection part 3111 of the first cover part 311 and the hollow part 32 The second reflecting part 3121 of the second covering part 312 is symmetrically arranged, the first reflecting part 3111 has a first reflecting surface 31111, and the second reflecting part 3121 has a second reflecting surface 31211.
  • the first reflecting portion 3111 and the second reflecting portion 3121 have the same shape.
  • the first reflective surface 31111 of the first reflective portion 3111 is a flat surface.
  • the first reflective surface 31111 of the first reflective portion 3111 is a curved surface.
  • the angle between the plane and the incident direction of the light is greater than 0 degrees and less than 45 degrees.
  • the incident angle formed by the plane and the incident direction of the light is different, the reflected light after the incident light passes through the reflecting surface of the reflecting part and the packaging area will form a different positional relationship:
  • the incident angle ⁇ formed by the incident light and the reflecting surface is greater than 45 degrees, that is, the incident angle ⁇ 1 of the incident light is less than 45 degrees, and the reflection angle ⁇ 2 is also less than 45 degrees. Reflected to the direction away from the substrate, that is, the reflected light does not intersect the packaging area, and cannot satisfy the energy difference between the center area and the edge area of the packaging area.
  • the incident angle ⁇ formed by the incident light and the reflecting surface is equal to 45 degrees, that is, the incident angle ⁇ 1 of the incident light is 45 degrees, and the reflection angle ⁇ 2 is also 45 degrees, that is, the reflected light and
  • the incident surface of the light source is vertical, and the reflected light does not intersect the packaging area, which cannot satisfy the energy difference between the center area and the edge area of the packaging area.
  • the incident angle ⁇ formed by the incident light and the reflective surface is less than 45 degrees, that is, the incident angle ⁇ 1 of the incident light is greater than 45 degrees, and the reflection angle ⁇ 2 is also greater than 45 degrees, and the reflected light will irradiate To the edge area of the package area.
  • the angle between the plane and the light incident direction is greater than 0 degrees and less than 45 degrees.
  • the laser energy has a Gaussian distribution, that is, the center energy is larger and the edge energy is lower.
  • the energy directly incident on the packaging area is high energy
  • the energy incident on the reflective surface of the reflective part is Low energy
  • the low energy is reflected by the reflective surface to the edge area of the packaging area, and superimposed with the energy directly incident on the edge area of the packaging area, so that the energy difference between the edge area of the packaging area and the energy of the center area is reduced, That is, the energy in the entire packaging area tends to be evenly distributed, which alleviates the technical problem of uneven energy irradiation in the packaging area.
  • FIG. 5 it is a schematic diagram of the second structure of the mask of the laser packaging device provided by the embodiment of the present application.
  • the covering portion 231 is an integrally formed structure.
  • the mask plate includes a cover part 41 and a hollow part 42. In a direction away from the light source, the cover part 41 converges toward the hollow part 42 to form a reflection part 43.
  • the reflecting surface 431 of the reflecting portion 43 is a tapered surface, and the cross section is a straight line.
  • the angle between the straight line and the incident direction of the light is greater than 0 degrees and less than 45 degrees.
  • the incident angle formed by the plane and the incident direction of the light is different, the reflected light after the incident light passes through the reflecting surface of the reflecting part and the packaging area will form a different positional relationship.
  • the principle is as mentioned above, please refer to Fig. 4 for details, which will not be repeated here.
  • the reflecting surface 431 of the reflecting portion 43 is a tapered surface, and the cross section is a curved line.
  • FIG. 6 it is a third structural schematic diagram of the mask plate of the laser packaging device provided by the embodiment of this application.
  • the mask plate includes a cover part 61 and a hollow part 62. In the direction away from the light source, the cover part 61 converges toward the hollow part 62 to form a reflection part 63.
  • the cover part 61 includes a glass plate 611 and a heat sink. A film 612 and a reflective film 613, and the reflective portion 63 is formed by the reflective film 613.
  • the material of the reflective portion 63 is the same as the material of the reflective film 613.
  • the reflective portion 63 is formed by the heat dissipation film 612.
  • the reflective portion 63 is made of the same material as the heat dissipation film 612, and a reflective material is provided on the reflective surface 631 of the reflective portion 63.
  • the reflection part 63 is formed by the glass plate 611.
  • the reflective portion 63 is made of the same material as the glass plate 611, and a reflective material is provided on the reflective surface 631 of the reflective portion 63.
  • FIG. 7 it is a fourth structural schematic diagram of the mask plate of the laser packaging device provided by the embodiment of this application.
  • the mask plate includes a cover portion 71 and a hollow portion 72, and the cover portion 71 includes a glass plate 711, a heat dissipation film 712, and a reflective film 713.
  • the covering portion 71 includes a first covering portion 711 and a second covering portion 712 that are disposed oppositely, and the first reflecting portion 7111 of the first covering portion 711 and the second covering portion The second reflection portion 7121 of the 712 is arranged asymmetrically.
  • the first reflective portion 7111 and the second reflective portion 7121 are formed of different reflective film layers.
  • the first reflection portion 7111 is formed by the heat dissipation film 712
  • the second reflection portion 7121 is formed by the reflection film 711.
  • the structure of the mask is not limited to this.
  • the first reflective portion 7111 is formed by the reflective film 711 and the heat dissipation film 712
  • the second reflective portion 7121 is formed by the heat dissipation film 712 and the heat dissipation film 712.
  • the glass plates 713 are formed together.
  • the first reflection portion 7111 and the second reflection portion 7121 have different shapes.
  • the reflective surface of the first reflective portion 7111 is a flat surface
  • the reflective surface of the second reflective portion 7121 is a curved surface.
  • the first reflective portion 7111 and the second reflective portion 7121 have different materials.
  • the material of the first reflection part 7111 is the same as the material of the heat dissipation film 712
  • the material of the second reflection part 7121 is the same as the material of the reflection film 711.
  • the embodiment of the present application provides a laser packaging device, including a machine table for carrying a substrate; a light source; a mask plate, including a cover part and a hollow part, the light emitted by the light source passes through the hollow part and irradiates the substrate Wherein, in the direction away from the light source, the cover part converges toward the hollow part to form a reflection part; when the light emitted by the light source passes through the hollow part, the energy directly incident to the packaging area is high energy, and the incident The energy to the reflecting surface of the reflecting part is low energy, and the low energy is reflected by the reflecting surface to the edge area of the encapsulation area and superimposed with the energy directly incident on the edge area of the encapsulation area, so that the energy of the edge area of the encapsulation area is equal to The energy difference in the central area is reduced, that is, the energy in the entire packaging area tends to be evenly distributed, which compensates for the energy difference between the central area and the edge area of the packaging area, and alleviates the technical

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Abstract

本申请提供一种激光封装装置，光源发射的光线穿过镂空部时，直接入射至封装区的能量为高能量，入射至反射部的反射面的能量为低能量，所述低能量经反射面反射至封装区的边缘区域，与直接入射至封装区的边缘区域的能量叠加起来，使得封装区的边缘区域的能量与中心区域的能量差值减小，即整个封装区内能量趋于均匀分布。

Description

激光封装装置 技术领域
本申请涉及封装技术领域，尤其涉及一种激光封装装置。
 背景技术
传统封装装置如图1所示，包括机台10、光源20、掩膜板30，机台10上放置有基板100，光源20发出的激光200，通过掩膜板30照射到基板100的封装区101，使封装区101的玻璃胶102融化，达到封装的效果，由于激光能量呈高斯分布，中心能量较大，边缘能量较低，当中心区域能量合适时，边缘能量不足，玻璃胶不能充分熔融封装，而当边缘能量合适,中心区域能量过大，玻璃胶会烧坏。
因此，现有技术存在封装区照射能量不均匀的技术问题。
 技术问题
本申请提供一种激光封装装置，以缓解现有的封装区能量照射不均的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种激光封装装置，包括：
机台，用于承载基板；
光源；
掩膜板，包括掩盖部和镂空部，光源所发射的光线穿过所述镂空部，照射在所述基板的封装区域；
其中，在远离光源的方向上，所述掩盖部向所述镂空部汇聚，形成反射部。
在本申请的激光封装装置中，所述掩盖部为一体成型结构。
在本申请的激光封装装置中，所述反射部的反射面为锥形面，截面为直线。
在本申请的激光封装装置中，所述反射部的反射面为锥形面，截面为曲线。
在本申请的激光封装装置中，所述掩盖部包括玻璃板、散热膜、以及反射膜，所述反射部由所述反射膜形成。
在本申请的激光封装装置中，所述反射部材料与所述反射膜材料相同。
在本申请的激光封装装置中，所述掩盖部包括玻璃板、散热膜、以及反射膜，所述反射部由所述散热膜形成。
在本申请的激光封装装置中，所述反射部与散热膜材料相同，所述反射部的反射面增加反射材料。
在本申请的激光封装装置中，所述掩盖部包括玻璃板、散热膜、以及反射膜，所述反射部由所述玻璃板形成。
在本申请的激光封装装置中，所述反射部与玻璃板材料相同，所述反射部的反射面为反射材料。
在本申请的激光封装装置中，所述掩膜板为组合结构。
在本申请的激光封装装置中，所述掩盖部包括相对设置的第一掩盖部和第二掩盖部，所述第一掩盖部的第一反射部和所述第二掩盖部的第二反射部对称设置，所述第一反射部有第一反射面，所述第二反射部有第二反射面。
在本申请的激光封装装置中，所述第一反射部与所述第二反射部形状相同。
在本申请的激光封装装置中，所述第一反射部的所述第一反射面为平面。
在本申请的激光封装装置中，所述平面与光线入射方向的角度大于0度小于45度。
在本申请的激光封装装置中，所述第一反射部的所述第一反射面为曲面。
在本申请的激光封装装置中，所述掩盖部包括相对设置的第一掩盖部和第二掩盖部，所述第一掩盖部的第一反射部和所述第二掩盖部的第二反射部不对称设置。
在本申请的激光封装装置中，所述掩盖部包括玻璃板、散热膜、以及反射膜；所述第一反射部和所述第二反射部由不同的反射膜层形成。
在本申请的激光封装装置中，所述第一反射部与所述第二反射部形状不同。
在本申请的激光封装装置中，所述第一反射部与所述第二反射部材料不同。
 有益效果
本申请提供一种激光封装装置，包括机台，用于承载基板；光源；掩膜板，包括掩盖部和镂空部，光源所发射的光线穿过所述镂空部，照射在所述基板的封装区域；其中，在远离光源的方向上，所述掩盖部向所述镂空部汇聚，形成反射部；光源发射的光线穿过镂空部时，直接入射至封装区的能量为高能量，入射至反射部的反射面的能量为低能量，所述低能量经反射面反射至封装区的边缘区域，与直接入射至封装区的边缘区域的能量叠加起来，使得封装区的边缘区域的能量与中心区域的能量差值减小，即整个封装区内能量趋于均匀分布，弥补了封装区的中心区域与边缘区域的能量差异，缓解了封装区能量照射不均的技术问题。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有的封装方式的示意图。
图2为本申请实施例提供的激光封装装置的结构示意图。
图3为本申请实施例提供的激光封装装置的掩膜板的第一结构示意图。
图4为本申请实施例提供的激光封装装置的光线示意图。
图5为本申请实施例提供的激光封装装置的掩膜板的第二结构示意图。
图6为本申请实施例提供的激光封装装置的掩膜板的第三结构示意图。
图7为本申请实施例提供的激光封装装置的掩膜板的第四结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
本申请提供一种激光封装装置，以缓解现有的封装区能量照射不均的技术问题。
如图2所示，为本申请实施例提供的激光封装装置的结构示意图，所述激光封装装置包括机台21、光源22、掩膜板23。
所述机台21用于放置基板210，所述基板210包括上下放置的两块玻璃板，两块玻璃板之间涂覆有玻璃胶211，所述玻璃胶211所在的区域为所述基板210的封装区2101。
所述光源22用于发射光线220，照射在所述基板210的所述封装区2101，以固化所述玻璃胶211，在本申请中，所述光线220为激光。
所述掩膜板23，包括掩盖部231和镂空部232，在远离所述光源22的方向上，所述掩盖部231向所述镂空部232汇聚，形成反射部233，所述光源22发射的所述光线220，穿过所述镂空部232，到达所述封装区2101。
所述光源22发出的所述光线220，一部分直接照射至所述封装区2101，另一部分照射至所述反射部233的反射面2331，然后反射至所述封装区2101的边缘区域，并与直接照射至所述封装区2101的边缘区域的光线能量叠加。
所述掩膜板23，可以是组合结构，也可以是一体成型结构。以下结合图3至图5进行具体的说明。
如图3所示，为本申请实施例提供的激光封装装置的掩膜板第一结构示意图。所述掩膜板为组合结构。所述掩膜板包括掩盖部31和镂空部32，所述掩盖部31包括相对设置的第一掩盖部311和第二掩盖部312，所述第一掩盖部311的第一反射部3111和所述第二掩盖部312的第二反射部3121对称设置，所述第一反射部3111有第一反射面31111，所述第二反射部3121有第二反射面31211。
在一种实施例中，所述第一反射部3111与所述第二反射部3121形状相同。
在一种实施例中，所述第一反射部3111的所述第一反射面31111为平面。
在一种实施例中，所述第一反射部3111的所述第一反射面31111为曲面。
在一种实施例中，所述平面与光线入射方向的角度大于0度小于45度。当所述平面与光线入射方向所形成的入射角不同时，入射光线经过反射部的反射面后的反射光线与封装区将形成不同的位置关系：
如图4中的a所示，入射光线与反射面所形成的入光角度θ大于45度，即入射光线的入射角θ1小于45度，此时反射角θ2也小于45度，反射光线将光线反射至远离基板的方向，即反射光线与封装区不相交，不能满足弥补封装区的中心区域与边缘区域的能量差异。
如图4中的b所示，入射光线与反射面所形成的入光角度θ等于45度，即入射光线的入射角θ1为45度，此时反射角θ2也为45度，即反射光线与光源入射面垂直，反射光线与封装区不相交，不能满足弥补封装区的中心区域与边缘区域的能量差异。
如图4中的c所示，入射光线与反射面所形成的入光角度θ小于45度，即入射光线的入射角θ1大于45度，此时反射角θ2也大于45度，反射光线将照射到封装区的边缘区域。
因此，所述平面与光线入射方向的角度大于0度小于45度。此时，由于激光能量呈高斯分布，即中心能量较大，边缘能量较低，当光线穿过镂空部时，直接入射至封装区的能量为高能量，入射至反射部的反射面的能量为低能量，所述低能量经反射面反射至封装区的边缘区域，与直接入射至封装区的边缘区域的能量叠加起来，使得封装区的边缘区域的能量与中心区域的能量差值减小，即整个封装区内能量趋于均匀分布，缓解了封装区能量照射不均的技术问题。
如图5所示，为本申请实施例提供的激光封装装置的掩膜板的第二结构示意图。所述掩盖部231为一体成型结构。所述掩膜板包括掩盖部41和镂空部42，在远离光源的方向上，所述掩盖部41向所述镂空部42汇聚，形成反射部43。
在一种实施例中，所述反射部43的反射面431为锥形面，截面为直线。
在一种实施例中，所述直线与光线入射方向的角度大于0度小于45度。当所述平面与光线入射方向所形成的入射角不同时，入射光线经过反射部的反射面后的反射光线与封装区将形成不同的位置关系。原理如前所述，具体请参照图4，在此不再赘述。
在一种实施例中，所述反射部43的反射面431为锥形面，截面为曲线。
如图6所示，为本申请实施例提供的激光封装装置的掩膜板的第三结构示意图。所述掩膜板包括掩盖部61和镂空部62，在远离光源的方向上，所述掩盖部61向所述镂空部62汇聚，形成反射部63，所述掩盖部61包括玻璃板611、散热膜612、以及反射膜613，所述反射部63由所述反射膜613形成。
在一种实施例中，所述反射部63材料与所述反射膜613材料相同。
在一种实施例中，所述反射部63由所述散热膜612形成。所述反射部63与所述散热膜612材料相同，所述反射部63的反射面631上设置有反射材料。
在一种实施例中，所述反射部63由所述玻璃板611形成。所述反射部63与所述玻璃板611材料相同，所述反射部63的反射面631上设置有反射材料。
如图7所示，为本申请实施例提供的激光封装装置的掩膜板的第四结构示意图。所述掩膜板包括掩盖部71和镂空部72，所述掩盖部71包括玻璃板711、散热膜712、以及反射膜713。在本申请的激光封装装置中，所述掩盖部71包括相对设置的第一掩盖部711和第二掩盖部712，所述第一掩盖部711的第一反射部7111和所述第二掩盖部712的第二反射部7121不对称设置。
在一种实施例中，所述第一反射部7111和所述第二反射部7121由不同的反射膜层形成。例如，所述第一反射部7111由所述散热膜712形成，所述第二反射部7121由所述反射膜711形成。
当然，所述掩膜板的结构不限于此，例如所述第一反射部7111由所述反射膜711和所述散热膜712共同形成，所述第二反射部7121由所述散热膜712和所述玻璃板713共同形成。
在一种实施例中，所述第一反射部7111与所述第二反射部7121形状不同。例如，所述第一反射部7111的反射面为平面，所述第二反射部7121的反射面为曲面。
在一种实施例中，所述第一反射部7111与所述第二反射部7121材料不同。例如，所述第一反射部7111的材料与所述散热膜712材料相同，所述第二反射部7121与所述反射膜711材料相同。
根据上述实施例可知：
本申请实施例提供一种激光封装装置，包括机台，用于承载基板；光源；掩膜板，包括掩盖部和镂空部，光源所发射的光线穿过所述镂空部，照射在所述基板的封装区域；其中，在远离光源的方向上，所述掩盖部向所述镂空部汇聚，形成反射部；光源发射的光线穿过镂空部时，直接入射至封装区的能量为高能量，入射至反射部的反射面的能量为低能量，所述低能量经反射面反射至封装区的边缘区域，与直接入射至封装区的边缘区域的能量叠加起来，使得封装区的边缘区域的能量与中心区域的能量差值减小，即整个封装区内能量趋于均匀分布，弥补了封装区的中心区域与边缘区域的能量差异，缓解了封装区能量照射不均的技术问题。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种激光封装装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种激光封装装置，其包括：
    机台，用于承载基板；
    光源；
    掩膜板，包括掩盖部和镂空部，光源所发射的光线穿过所述镂空部，照射在所述基板的封装区域；
    其中，在远离光源的方向上，所述掩盖部向所述镂空部汇聚，形成反射部。
  2. 如权利要求1所述的激光封装装置，其中，所述掩盖部为一体成型结构。
  3. 如权利要求2所述的激光封装装置，其中，所述反射部的反射面为锥形面，截面为直线。
  4. 如权利要求2所述的激光封装装置，其中，所述反射部的反射面为锥形面，截面为曲线。
  5. 如权利要求1所述的激光封装装置，其中，所述掩盖部包括玻璃板、散热膜、以及反射膜，所述反射部由所述反射膜形成。
  6. 如权利要求5所述的激光封装装置，其中，所述反射部材料与所述反射膜材料相同。
  7. 如权利要求1所述的激光封装装置，其中，所述掩盖部包括玻璃板、散热膜、以及反射膜，所述反射部由所述散热膜形成。
  8. 如权利要求7所述的激光封装装置，其中，所述反射部与散热膜材料相同，所述反射部的反射面增加反射材料。
  9. 如权利要求1所述的激光封装装置，其中，所述掩盖部包括玻璃板、散热膜、以及反射膜，所述反射部由所述玻璃板形成。
  10. 如权利要求9所述的激光封装装置，其中，所述反射部与玻璃板材料相同，所述反射部的反射面为反射材料。
  11. 如权利要求1所述的激光封装装置，其中，所述掩膜板为组合结构。
  12. 如权利要求11所述的激光封装装置，其中，所述掩盖部包括相对设置的第一掩盖部和第二掩盖部，所述第一掩盖部的第一反射部和所述第二掩盖部的第二反射部对称设置，所述第一反射部有第一反射面，所述第二反射部有第二反射面。
  13. 如权利要求12所述的激光封装装置，其中，所述第一反射部与所述第二反射部形状相同。
  14. 如权利要求13所述的激光封装装置，其中，所述第一反射部的所述第一反射面为平面。
  15. 如权利要求14所述的激光封装装置，其中，所述平面与光线入射方向的角度大于0度小于45度。
  16. 如权利要求13所述的激光封装装置，其中，所述第一反射部的所述第一反射面为曲面。
  17. 如权利要求11所述的激光封装装置，其中，所述掩盖部包括相对设置的第一掩盖部和第二掩盖部，所述第一掩盖部的第一反射部和所述第二掩盖部的第二反射部不对称设置。
  18. 如权利要求17所述的激光封装装置，其中，所述掩盖部包括玻璃板、散热膜、以及反射膜；所述第一反射部和所述第二反射部由不同的反射膜层形成。
  19. 如权利要求17所述的激光封装装置，其中，所述第一反射部与所述第二反射部形状不同。
  20. 如权利要求17所述的激光封装装置，其中，所述第一反射部与所述第二反射部材料不同。
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CN205508888U (zh) * 2016-03-17 2016-08-24 京东方科技集团股份有限公司 封装设备、显示面板及显示装置
CN106125313A (zh) * 2016-06-29 2016-11-16 昆山国显光电有限公司 降低熔结密封过程中气泡的调节结构

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