WO2021238439A1 - Panneau d'affichage oled et son procédé de fabrication - Google Patents

Panneau d'affichage oled et son procédé de fabrication Download PDF

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WO2021238439A1
WO2021238439A1 PCT/CN2021/086143 CN2021086143W WO2021238439A1 WO 2021238439 A1 WO2021238439 A1 WO 2021238439A1 CN 2021086143 W CN2021086143 W CN 2021086143W WO 2021238439 A1 WO2021238439 A1 WO 2021238439A1
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layer
array substrate
organic material
away
metal layer
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PCT/CN2021/086143
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English (en)
Chinese (zh)
Inventor
王云浩
高涛
郭远征
鲍建东
王彦强
任怀森
侯鹏
崔国意
李岢恒
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Publication of WO2021238439A1 publication Critical patent/WO2021238439A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to an OLED display panel and a manufacturing method thereof.
  • the OLED display devices not only have self-luminous, wide viewing angle, high brightness, and fast response time, but also have the characteristics that R, G, B full-color and Touch (touch module) components can be produced.
  • the structural characteristics of the OLED display device are conducive to the integration of multiple functions, such as Touch, antenna, Pol-Less (polarizer), etc., to realize multifunctional flexible display.
  • the COE process mainly includes the process steps of manufacturing the black matrix layer (BM) and RGB color filters, and patterning is achieved through processes such as glue coating, exposure and development.
  • the black matrix layer in the COE is a black organic photoresist.
  • one purpose of the present disclosure is to provide an OLED display panel in which a blackened first metal layer is used to replace the black matrix BM, which saves the use of BM glue and two BM Mark processes, thereby avoiding the occurrence of BM.
  • the Mark counterpoint problem is to provide an OLED display panel in which a blackened first metal layer is used to replace the black matrix BM, which saves the use of BM glue and two BM Mark processes, thereby avoiding the occurrence of BM.
  • the Mark counterpoint problem is to provide an OLED display panel in which a blackened first metal layer is used to replace the black matrix BM, which saves the use of BM glue and two BM Mark processes, thereby avoiding the occurrence of BM.
  • the present disclosure provides an OLED display panel.
  • the OLED display panel includes: an array substrate; an OLED structure layer disposed on the surface of the array substrate; a plurality of color filters arranged at intervals, the color filter The sheet is arranged on the side of the OLED structure layer away from the array substrate, and there are gaps between the plurality of color filters; the first organic material layer, the first organic material layer is arranged on the OLED structure The side of the layer away from the array substrate, wherein the surface of the first organic material layer away from the array substrate has a plurality of first rough surfaces arranged at intervals, and the first rough surface is on the array substrate.
  • the orthographic projection covers at least a part of the orthographic projection of the gap on the array substrate; a blackened first metal layer that shields light, and the first metal layer is located on the first rough surface. Therefore, the blackened first metal layer is used in the display panel to replace the black matrix BM (that is, the blackened first metal layer can play the role of BM), saving the use of BM glue and two BM Mark processes, and then Avoid the Mark alignment problem caused by BM; and after replacing BM, the thickness of the film layer can be reduced, thereby increasing the L-Decay angle (brightness attenuation angle), thereby improving the light extraction efficiency of the display panel.
  • the OLED display panel further includes: an encapsulation film layer disposed on the surface of the OLED structure layer away from the array substrate, wherein the color filter is disposed on the surface of the array substrate.
  • the packaging film layer is on the surface away from the array substrate, and the first organic material layer is located on the surface of the color filter away from the array substrate, and covers the surface of the packaging film layer exposed by the gap .
  • the OLED display panel further includes: a plurality of second metal layers arranged at intervals, the second metal layer being arranged on the surface of the packaging film layer away from the array substrate, and the second metal layer
  • the orthographic projection of the two metal layers on the array substrate is located inside the orthographic projection of the gap on the array substrate; wherein the first organic material layer has a through hole penetrating the first organic material layer, The through hole exposes at least part of the surface of the second metal layer, and at least a part of the first metal layer is electrically connected to the second metal layer through the through hole, and the first metal layer is a touch Among the electrodes, the first touch electrode and the second metal layer are bridge electrodes for electrically connecting the first touch electrode.
  • the OLED display panel further includes: an encapsulation film layer, the encapsulation film layer includes a first inorganic layer, the first organic material layer, and a second inorganic layer, wherein the first inorganic layer Is disposed on the surface of the OLED structure layer away from the array substrate, the first organic material layer is disposed on the surface of the first inorganic layer away from the array substrate, and the second inorganic layer is disposed on the surface of the array substrate.
  • the OLED display panel further includes: a second organic material layer disposed between the color filter and the second inorganic layer and covering the color The filter and the gap.
  • the surface of the second organic material away from the array substrate has a plurality of second rough surfaces arranged at intervals, and the orthographic projection of the second rough surface on the array substrate covers the At least a part of the orthographic projection of the gap on the array substrate, the display panel further includes a blackened third metal layer that shields light, and the third metal layer is located on the second rough surface.
  • the distance between the lowest point and the highest point of the concave-convex structure in the first rough surface and the second rough surface is 200-400 nm, respectively.
  • the materials of the first organic material layer and the second organic material layer are OC photoresist, respectively.
  • a method for manufacturing an OLED display panel includes: providing an array substrate; forming an OLED structure layer on the surface of the array substrate; forming a plurality of spaces on the side of the OLED structure layer away from the array substrate A plurality of color filters are provided, and there are gaps between the plurality of color filters; a first organic material layer is formed on the side of the OLED structure layer away from the array substrate, and a first organic material layer is formed on the first organic material A predetermined area of the surface of the layer away from the array substrate forms a plurality of first rough surfaces arranged at intervals, and the orthographic projection of the first rough surface on the array substrate covers the orthographic projection of the gap on the array substrate At least a part of; on the first rough surface is deposited to form a blackened first metal layer that shields light.
  • the blackened first metal layer is used in the display panel to replace the black matrix BM (that is, the blackened first metal layer can play the role of BM), saving the use of BM glue and two BM Mark processes, and then Avoid the Mark alignment problem caused by BM; and after replacing BM, the thickness of the film layer can be reduced, and the L-Decay angle (brightness attenuation angle) can be increased, thereby improving the light extraction efficiency of the display panel; further, the above manufacturing method Simple and easy to implement, mature industrialization, convenient for industrialized mass production, and low production cost.
  • the method of manufacturing an OLED display panel further includes: forming an encapsulation film layer on the surface of the OLED structure layer away from the array substrate, wherein the color filter is formed on the encapsulation film layer On the surface away from the array substrate, the first organic material layer is formed on the surface of the color filter away from the array substrate, and covers the surface of the packaging film layer exposed by the gap.
  • the method of manufacturing an OLED display panel further includes: forming a plurality of second metal layers arranged at intervals on the surface of the encapsulation film layer away from the array substrate, and the second metal layers are The orthographic projection on the array substrate is located inside the orthographic projection of the gap on the array substrate; a through hole penetrating the first organic material layer is formed, and the through hole exposes at least the second metal layer Part of the surface, and at least a part of the first metal layer is electrically connected to the second metal layer through the through hole, the first metal layer is the first touch electrode in the touch electrode, and the second metal layer It is a bridge electrode for electrically connecting the first touch electrode.
  • the method of manufacturing an OLED display panel further includes: forming an encapsulation film layer, the encapsulation film layer including a first inorganic layer, a second inorganic layer, and the first organic material layer, forming the encapsulation film
  • the layer method includes: forming the first inorganic layer on the surface of the OLED structure layer away from the array substrate; forming the first organic material layer on the surface of the first inorganic layer away from the array substrate Forming the second inorganic layer on the side of the first organic material layer away from the array substrate, wherein the color filter is formed on the surface of the first organic material layer away from the array substrate .
  • the method of manufacturing an OLED display panel further includes: forming a second organic material layer between the color filter and the second inorganic layer, and the second organic material layer covers the Color filters and the gap.
  • the method for manufacturing an OLED display panel further includes: forming a plurality of second rough surfaces arranged at intervals on the surface of the second organic material away from the array substrate, and the second rough surface is on the surface of the second organic material.
  • the orthographic projection on the array substrate covers at least a part of the orthographic projection of the gap on the array substrate, and a third metal layer that is blackened and shielded from light is deposited on the second rough surface.
  • the first rough surface and the second rough surface are formed by a dry etching method, and the etching gas of the dry etching includes carbon tetrafluoride and oxygen, wherein the four The flow ratio of the fluorinated carbon and the oxygen is 2:1 to 5:1.
  • the flow rate of the oxygen is 60-150 sccm.
  • FIG. 1 is a schematic diagram of the structure of an OLED display panel in an embodiment of the present disclosure
  • FIG. 2 is an enlarged view of the dashed box in FIG. 1, and (b) in FIG. 2 is a schematic diagram of the blackened first metal layer;
  • FIG. 3 is a schematic structural diagram of an OLED display panel in another embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of the structure of an OLED display panel in another embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of an OLED display panel in another embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of the structure of an OLED display panel in another embodiment of the present disclosure.
  • FIG. 7 is a schematic structural diagram of an OLED display panel in another embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of a process of manufacturing an OLED display panel in another embodiment of the present disclosure.
  • FIG. 9 is a schematic diagram of a process of manufacturing an OLED display panel in another embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram of a process of manufacturing an OLED display panel in another embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of a process of manufacturing an OLED display panel in another embodiment of the present disclosure.
  • the present disclosure provides an OLED display panel.
  • the OLED display panel includes: an array substrate 10; an OLED structure layer 20 disposed on the surface of the array substrate 10; a plurality of color filters arranged at intervals
  • the color filter 30 is arranged on the side of the OLED structure layer 20 away from the array substrate 10, and there is a gap 31 between the plurality of color filters 30; the first organic material layer 40 and the first organic material layer 40 are arranged
  • the surface of the first organic material layer 40 away from the array substrate 10 has a plurality of first rough surfaces 41 arranged at intervals.
  • the orthographic projection covers at least a part of the orthographic projection of the gap 31 on the array substrate 10.
  • the orthographic projection on the array substrate 10 completely covers the orthographic projection of the gap 31 on the array substrate 10;
  • a metal layer 50, the first metal layer 50 is located on the first rough surface 41 (refer to Figure 2, Figure 2 (a) is the partial first rough surface and the first metal layer in Figure 1 (the dashed frame part ) Is an enlarged view, (b) in FIG. 2 is the surface of the first metal layer that shields light after blackening).
  • the blackened first metal layer is used in the display panel to replace the black matrix BM (that is, the blackened first metal layer can play the role of BM), saving the use of BM glue and two BM Mark processes, and then Avoid the Mark alignment problem caused by BM; and after replacing BM, the thickness of the film layer can be reduced, thereby increasing the L-Decay angle (brightness attenuation angle), thereby improving the light extraction efficiency of the display panel.
  • replacing the BM with the first metal layer can perfectly eliminate the above-mentioned technical problems caused by the BM, thereby improving the reliability and display quality of the display panel.
  • a plurality of first rough surfaces are formed on the surface of a predetermined area of the first organic material, and then a metal layer is deposited, and other metal layers on the non-first rough surface are removed Partly, the first metal layer is obtained. Since the surface of the first rough surface is an uneven rough surface, and the deposited metal layer is of equal thickness, the first metal layer is non-uniform distributed along with the uneven first rough surface. Flat surface, so the light irradiated on the surface of the first metal layer is diffusely reflected, which causes the surface of the first metal layer to blacken and appear black. This can replace BM and play the role of a black matrix. Therefore, the display panel of the present disclosure does not require Then set the black matrix, so that not only can save the production process, but also can avoid the Mark alignment problem caused by BM.
  • the array substrate may be a TFT substrate, and its specific structure has no special requirements. Those skilled in the art can flexibly design the specific structure of the array substrate according to actual production requirements.
  • the array substrate includes: a substrate; a buffer layer disposed on the surface of the substrate; an active layer disposed on the surface of the buffer layer away from the substrate; a gate insulating layer disposed on the surface of the buffer layer away from the substrate , And the gate insulating layer covers the active layer; the gate arranged on the surface of the gate insulating layer away from the substrate; the interlayer dielectric layer arranged on the surface of the gate insulating layer away from the substrate and covering the gate; arranged on the interlayer dielectric layer Far away from the source and drain on the surface of the substrate, and the source and drain are respectively electrically connected to the active layer through via holes; a flat layer disposed on the interlayer dielectric layer away from the surface of the substrate and covering the source and drain .
  • the OLED structure layer is arranged on the surface
  • the specific structure of the OLED structure layer has no special requirements, and those skilled in the art can flexibly choose the current conventional OLED structure layer according to actual conditions.
  • the OLED structure layer includes: a pixel defining layer with a plurality of openings, an anode provided in the opening (the anode is electrically connected to the drain through a via hole), and the HTL (hole Transport layer), light-emitting layer, ETL (electron transport layer) and cathode. Therefore, the voltage-current characteristics of the OLED device are better, and the luminous efficiency of the OLED device is improved.
  • the types of multiple color filters include red filters, green filters, and blue filters; in other embodiments, the types of multiple color filters include red filters. Filter, green filter, blue filter and yellow filter; in other embodiments, the types of multiple color filters include red filter, green filter, blue filter, Yellow filter and white filter.
  • the OLED display panel further includes: an encapsulation film layer 60, wherein, in some embodiments, the color filter 30 may be disposed on the surface of the encapsulation film layer 60 away from the array substrate 10, and the structural diagram may be Refer to Figure 1, Figure 3 and Figure 4; in some other embodiments, the color filter 30 may be embedded in the packaging film layer 60, and the structure diagram can refer to Figures 5 to 7, and the details are as follows:
  • the encapsulation film layer 60 is disposed on the surface of the OLED structure layer 20 away from the array substrate 10, and the color filter 30 is disposed on the surface of the encapsulation film layer 60 away from the array substrate 10.
  • An organic material layer 40 is located on the surface of the color filter 30 away from the array substrate 10 and covers the surface of the packaging film layer 60 exposed by the gap 31. Therefore, the OLED display panel with the above structure has better performance, and can effectively reduce the thickness of the film layer, thereby increasing the L-Decay angle (brightness attenuation angle), thereby improving the light output efficiency of the display panel.
  • the OLED display panel further includes: a plurality of second metal layers 70 arranged at intervals, the second metal layer 70 is arranged on the surface of the packaging film layer 60 away from the array substrate 10, and the second metal layer 70
  • the orthographic projection on the array substrate 10 is located inside the orthographic projection of the gap 31 on the array substrate 10 (that is, the second metal layer is arranged inside the gap); wherein, the first organic material layer 40 has a through-hole through the first organic material layer 40
  • the through hole 42 of the through hole exposes at least part of the surface of the second metal layer 70, and at least a part of the first metal layer 50 is electrically connected to the second metal layer 70 through the through hole 42 (so the sidewall of the through hole 42
  • the surface is also a first rough surface, that is, the first metal layer part of the side wall is also an uneven surface), the first metal layer 50 is the first touch electrode in the touch electrode, and the second metal layer 70 is used for electrical The bridge electrode connected to the first touch electrode.
  • the first metal layer is used as the first touch electrode of the touch module (the first touch electrode can be TX or RX) to obtain a touch display panel with a FMLOC process structure; and the surface of the first metal layer is also uneven
  • the first metal layer has a larger surface area, so the resistance of TX/RX can be reduced, thereby improving the touch sensitivity of the touch panel.
  • the second metal layer can be provided in each gap in the color filter; in other examples, the second metal layer is provided in a part of the gap, so only the second metal layer 70 is provided. Where it is necessary to form through holes accordingly, and make the first metal layer corresponding to the second metal layer electrically connect to the second metal layer through the through holes (as shown in Figures 3 and 4).
  • the design of the first touch electrode in the touch module requires flexible selection and design, and there is no restriction here.
  • the through hole 42 penetrates the first organic material layer 40, the exposed surface of the second metal layer does not have the first organic material layer, and therefore there is no first rough surface. Therefore, the first metal layer and The contact part of the second metal layer is flat, not uneven, so the part of the first metal layer contacting the second metal layer is not blackened, but due to the contact area of the first metal layer and the second metal layer It is very small, so in the embodiment, the non-blackened first metal layer part does not greatly affect the display effect of the display panel, and the user will not see the light leakage point when viewing the display screen.
  • the thickness of the second metal layer is 150 nm to 300 nm, so as to effectively ensure good electrical properties of the second metal layer and good contact performance with the first metal layer.
  • the display panel further includes a third organic material layer 43.
  • the third organic material layer 43 is disposed on the surface of the first organic material layer 40 away from the array substrate 10 and fills the through holes 42.
  • the third organic material can provide a flat surface for subsequent fabrication of structures such as touch modules.
  • the specific material of the third organic material layer has no special requirements. Those skilled in the art can flexibly choose according to the actual situation, as long as it has a better leveling effect and provides a flat surface.
  • the third The material of the organic material layer is OC photoresist.
  • the thickness of the third organic material layer is 2.0-2.5 micrometers, thus, the good surface flatness of the third organic material can be effectively ensured.
  • the color filter 30 may be embedded in the encapsulation film layer 60.
  • the encapsulation film layer 60 includes a first inorganic layer 61, a first organic material layer 40, and a second inorganic layer 62.
  • the first inorganic layer 61 is disposed on the surface of the OLED structure layer away from the array substrate 10
  • the first organic material layer 40 is disposed on the surface of the first inorganic layer 61 away from the array substrate 10
  • the second inorganic layer 62 is disposed on the first surface.
  • the organic material layer 40 is away from the side of the array substrate 10, wherein the color filter 30 is disposed on the surface of the first organic material layer 40 away from the array substrate 10.
  • the first organic material layer replaces the IJP ink layer in the thin-film encapsulation layer in the prior art.
  • the thin-film encapsulation layer of the present disclosure still has a good encapsulation effect and better surface flatness. It satisfies the requirements for the use of film packaging, and reduces the IJP process, which can further reduce the manufacturing cost of the display panel.
  • the OLED display panel further includes: a second organic material layer 80, the second organic material layer 80 is disposed between the color filter 30 and the second inorganic layer 62, and covers the color filter 30 And gap 31.
  • the arrangement of the second organic material layer can improve the leveling effect of the film layer, thereby improving the flatness of the surface of the second inorganic layer, so as to facilitate the subsequent operation of the bonding process of the touch module and the glass cover.
  • the surface of the second organic material 80 away from the array substrate 10 has a plurality of second rough surfaces 81 arranged at intervals, and the orthographic projection of the second rough surface 81 on the array substrate 10 covers the gap 31 in the array At least a part of the orthographic projection on the substrate 10, the display panel further includes a third metal layer 90 that shields light after blackening, and the third metal layer 90 is located on the second rough surface 81.
  • the double-layer blackened metal layer (the first metal layer and the third metal layer) can further improve the light-emitting efficiency of the display panel and improve the display quality of the display panel.
  • the distance D between the lowest point and the highest point of the concave-convex structure in the first rough surface is 200 nm to 400 nm (for example, 200 nm, 230 nm, 250 nm, 280 nm, 300 nm, 330 nm, 350 nm, 380 nm, 400 nm)
  • the distance between the lowest point and the highest point of the concave-convex structure in the second rough surface is 200 nm to 400 nm (for example, 200 nm, 230 nm, 250 nm, 280 nm, 300 nm, 330 nm, 350 nm, 380 nm, 400 nm). Therefore, the uneven structure of the above-mentioned size helps light diffuse reflection on the surfaces of the first metal layer and the third metal layer, and further contributes to the blackening of the first metal layer and the third metal layer.
  • the materials of the first organic material layer and the second organic material layer are OC photoresist, respectively. Therefore, the use of OC photoresist not only has better light transmittance, but also helps to improve the light-emitting effect of the display panel; it also facilitates the production of the first rough surface and the second rough surface, that is, in the first organic material layer and the second rough surface. After the surface of the second organic material layer is coated with PR photoresist, the first rough surface and the second rough surface can be obtained by a dry etching method.
  • the thicknesses of the first organic material layer and the second organic material layer are respectively 2.0-2.5 micrometers, such as 2.0 micrometers, 2.1 micrometers, 2.2 micrometers, 2.3 micrometers, 2.4 micrometers, 2.5 micrometers. Therefore, even in the production of the first organic material layer and the second organic material layer, the performance is better.
  • the thickness of the first metal layer and the third metal layer are respectively 150 nm to 300 nm (such as 150 nm, 180 nm, 200 nm, 220 nm, 240 nm, 260 nm, 280 nm, 300 nm). Therefore, it is possible to ensure better electrical conductivity of the first metal layer, and good contact performance between the first metal layer and the second metal layer, and to ensure that the first metal layer and the third metal layer are easier to diffuse reflection. The blackening occurs, and the blackening effect is better to ensure that it can play a good BM role.
  • the materials of the first metal layer and the third metal layer are respectively selected from at least one of titanium, aluminum, and titanium aluminum alloy. Therefore, the conductivity is better, the resistance is lower, it is easy to blacken in the diffusion, and the use performance is better.
  • the display panel further includes a touch module (Touch) disposed on the surface of the second inorganic layer away from the array substrate, so as to realize the touch function of the display panel.
  • Touch touch module
  • a method of manufacturing an OLED display panel includes: providing an array substrate; forming an OLED structure layer on the surface of the array substrate; and forming a plurality of spaced color filters on the side of the OLED structure layer away from the array substrate , And there are gaps between the plurality of color filters; a first organic material layer is formed on the side of the OLED structure layer away from the array substrate, and a plurality of spaced arrangements are formed in a predetermined area of the first organic material layer away from the surface of the array substrate.
  • the first rough surface of the first rough surface, the orthographic projection of the first rough surface on the array substrate covers at least a part of the orthographic projection of the gap on the array substrate; a first metal layer that is blackened and shielded is deposited on the first rough surface.
  • the blackened first metal layer is used in the display panel to replace the black matrix BM (that is, the blackened first metal layer can play the role of BM), saving the use of BM glue and two BM Mark processes, and then Avoid the Mark alignment problem caused by BM; and after replacing BM, the thickness of the film layer can be reduced, and the L-Decay angle (brightness attenuation angle) can be increased, thereby improving the light extraction efficiency of the display panel; further, the above manufacturing method Simple and easy to implement, mature industrialization, convenient for industrialized mass production, and low production cost.
  • the specific structure of the array substrate is consistent with the requirements of the structure of the array substrate described above, and will not be repeated here.
  • there are no special restrictions on the manufacturing process of the array substrate and those skilled in the art can make the manufacturing process according to the prior art manufacturing process, which will not be repeated here.
  • the specific structure of the OLED structure is consistent with the requirements of the OLED structure layer described above, and will not be repeated here.
  • there are no special restrictions on the manufacturing process of the OLED structure and those skilled in the art can manufacture according to the manufacturing process of the prior art, which will not be repeated here.
  • the manufacturing method of the OLED display panel further includes the step of manufacturing an encapsulation film layer 60, wherein, in some embodiments, the encapsulation film layer 60 is formed before the color filter 30, that is, before the encapsulation film After the layer 60 is formed, the color filter 30 can be fabricated.
  • the color filter 30 can be embedded in the packaging film layer 60, that is, The color filter 30 is formed at the same time in the process of manufacturing the packaging film layer 60.
  • the schematic diagram of the structure can be referred to FIG. 5 to FIG. 7 and FIG. 11. The specific introduction is as follows:
  • a method of manufacturing an OLED display panel includes: forming an encapsulating film layer 60 on the surface of the OLED structure layer 20 away from the array substrate 10, wherein the color filter 30 is formed on the encapsulating film layer 60 away from On the surface of the array substrate 10, the first organic material layer 40 is formed on the surface of the color filter 30 away from the array substrate 10, and covers the surface of the packaging film layer 60 exposed by the gap 31.
  • the OLED display panel with the above structure has better performance, and can effectively reduce the thickness of the film layer, thereby increasing the L-Decay angle (brightness attenuation angle), thereby improving the light output efficiency of the display panel.
  • the method of manufacturing an OLED display panel further includes: forming a plurality of second metal layers 70 spaced apart on the surface of the packaging film layer 60 away from the array substrate 10, and the second metal layer 70 is formed on the array substrate 10.
  • the orthographic projection of the upper surface is located inside the orthographic projection of the gap 31 on the array substrate 10; a through hole 42 penetrating the first organic material layer 40 is formed, and the through hole 42 exposes at least part of the surface of the second metal layer 70, and at least a part of the first A metal layer 50 is electrically connected to the second metal layer 40 through the through hole 42.
  • the first metal layer is the first touch electrode of the touch electrodes, and the second metal layer is a bridge electrode for electrically connecting the first touch electrode.
  • the first metal layer is used as the first touch electrode of the touch module (the first touch electrode can be TX or RX) to obtain a touch display panel with a FMLOC process structure; and the surface of the first metal layer is also uneven
  • the first metal layer has a larger surface area, so the resistance of TX/RX can be reduced, thereby improving the touch sensitivity of the touch panel.
  • the PR photoresist layer 44 is patterned on the surface of the first organic material layer 40 in advance to filter the color during the process of forming the through hole and forming the first rough surface.
  • the light sheet 30 is protected; then the through hole 42 is formed, and then a predetermined area (the surface not covered by the PR photoresist) of the first organic material layer is ion bombarded by a dry etching method to obtain a first rough surface 41;
  • the PR photoresist 44 is removed, the entire surface of the metal layer 51 is deposited on the entire surface of the first organic material layer, and then part of the metal layer on the non-first rough surface is removed by an etching process to obtain the first metal layer 50
  • Illumination processing is performed on the first metal layer 50, and the light is diffusely reflected in the first metal layer, so that the first metal layer 50 is blackened, thereby having a light-shielding effect.
  • the above-mentioned preparation process is relatively mature, convenient for operation and industrialized management, and the first rough surface with better surface performance can be obtained by the dry etching method, and it is convenient to control the lowest point and the highest point in the uneven structure of the first rough surface.
  • the size of the spacing D is relatively mature, convenient for operation and industrialized management, and the first rough surface with better surface performance can be obtained by the dry etching method, and it is convenient to control the lowest point and the highest point in the uneven structure of the first rough surface.
  • the color filter 30 may be embedded in the packaging film layer 60, that is, the color filter 30 is formed at the same time in the process of making the packaging film layer 60.
  • the packaging film layer 60 includes a first inorganic layer 61, a second inorganic layer 62, and a first organic material layer 40.
  • the method for forming the encapsulation film layer includes: forming a first inorganic layer 61 on the surface of the OLED structure layer 20 away from the array substrate 10; A first organic material layer 40 is formed on the surface of the first inorganic layer 61 away from the array substrate 10; a second inorganic layer 62 is formed on the side of the first organic material layer 40 away from the array substrate 10, wherein the color filter 30 is formed On the surface of the first organic material layer 40 away from the array substrate 10.
  • embedding the color filter 30 in the encapsulation film layer can effectively reduce the distance between the color filter and the light-emitting layer in the OLED structure layer, thereby effectively improving the light output efficiency; and, at this time, the first A metal layer 50 is located in the gap 31, which can further improve the light utilization efficiency.
  • the manufacturing steps include: forming a first inorganic layer 61 by CVD deposition on the surface of the OLED structure layer 20 away from the array substrate 10; coating the surface of the first inorganic layer 61 to form a second inorganic layer An organic material layer 40; the surface of the first organic material layer is coated to form a PR photoresist 44, and the PR photoresist is patterned during exposure and development, and then the non-PR photoresist 44 is protected by a dry etching process
  • the surface of the first organic material layer is subjected to ion bombardment to obtain the first rough surface 41, and then the PR photoresist 44 is removed; then the entire surface of the first organic material layer 40 is sputtered and deposited to form an entire metal layer 51 ; Afterwards, the entire surface of the metal layer 51 is etched to remove part of the metal layer that is not the first rough surface to obtain the first metal layer 50; the first metal layer 50 is illuminated, and the light diffuses in the first metal
  • the method of manufacturing an OLED display panel further includes: forming a second organic material layer 80 between the color filter 30 and the second inorganic layer 62, and the second organic material layer 80 covers the color filter 30 and the gap 31 ,
  • the structure diagram can refer to Figure 6.
  • the arrangement of the second organic material layer can improve the leveling effect of the film layer, thereby improving the flatness of the surface of the second inorganic layer, so as to facilitate the subsequent operation of the bonding process of the touch module and the glass cover.
  • the method of manufacturing an OLED display panel further includes: forming a plurality of second rough surfaces 81 spaced apart on the surface of the second organic material 80 away from the array substrate, and the orthographic projection of the second rough surface 81 on the array substrate 10 At least a part of the orthographic projection of the covering gap 31 on the array substrate 10 is deposited on the second rough surface 81 to form a blackened third metal layer 90 that shields light.
  • the double-layer blackened metal layer (the first metal layer and the third metal layer) can further improve the light-emitting efficiency of the display panel and improve the display quality of the display panel.
  • the manufacturing steps of the blackened third metal layer are the same as the manufacturing steps of the first metal layer described above, and will not be repeated here.
  • the first rough surface and the second rough surface are formed by dry etching.
  • the etching gas for dry etching includes carbon tetrafluoride and oxygen.
  • the oxygen gas reacts chemically with the organic material layer (including the first organic material layer and the second organic material layer, or OC photoresist) to form the first rough surface and the second rough surface.
  • the flow ratio of carbon tetrafluoride and oxygen is 2:1 to 5:1, for example, the flow ratio of carbon tetrafluoride and oxygen is 2:1, 3:1, 4:1, 5:1. Therefore, the etching process can be better controlled within the above-mentioned ratio range, which helps to obtain the first rough surface and the second rough surface of suitable size.
  • the flow rate of oxygen is 60-150 sccm, such as 60 sccm, 70 sccm, 80 sccm, 90 sccm, 100 sccm, 110 sccm, 120 sccm, 130 sccm, 140 sccm, 150 sccm.
  • the oxygen flow rate within the above range can better control the etching process, and help to obtain the first rough surface and the second rough surface of suitable size; if the flow rate is less than 60sccm, the etching process on the surface of the organic material layer The etching effect is poor, and the size of the uneven structure on the rough surface is small, which is not conducive to the blackening of the metal layer; if the flow rate is greater than 150sccm, the size of the uneven structure on the rough surface may be too large, and even the organic material layer may be carved through.
  • the flow rate of oxygen used when blackening the first metal layer and the test results of the absorbance (OD) and transmittance of the first metal layer after blackening are referred to Table 1 below.
  • the absorbance and transmittance of the first metal layer can be adjusted by controlling the flow of oxygen. As the flow of oxygen increases, the deeper the blackening of the first metal layer, the greater the shading effect. Good, so that the greater the absorbance of the first metal layer, the lower the transmittance. When the oxygen flow rate reaches 150sccm, the obtained first metal layer has excellent absorbance and lower transmittance, which can perform well. The role of the black matrix.
  • the method of manufacturing an OLED display panel can be used to manufacture the aforementioned OLED display panel, wherein, in the method of manufacturing an OLED display panel, the first metal layer, the second metal layer, and the third metal Layer, first rough surface, second rough surface, first organic material layer, second organic material layer, color filter, and other structural requirements, and the aforementioned OLED display panel for the first metal layer,
  • the second metal layer, the third metal layer, the first rough surface, the second rough surface, the first organic material layer, the second organic material layer, the color filter, etc. have the same requirements for each structure, and will not be one by one here. Go into details.
  • the present disclosure provides a display device including the aforementioned OLED display panel.
  • the display quality of the display device can be effectively improved.
  • the display device has all the features and advantages of the aforementioned OLED display panel, and will not be repeated here.
  • the specific type of the display device may be any display device with a display function, such as a mobile phone, a TV, a notebook, an ipad, a Kindle, and a game console.
  • the display device also includes the necessary structures and components of a conventional display device. Take a mobile phone as an example.
  • the mobile phone also includes a battery. Covers, glass covers, camera modules, audio modules, motherboards, batteries and other conventional structures and components.
  • first and second in the text are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the present disclosure, “plurality” means two or more, unless otherwise specifically defined.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un panneau d'affichage à diodes électroluminescentes organiques (OLED) ainsi qu'un procédé de fabrication associé. Le panneau d'affichage OLED comprend : un substrat de réseau ; une couche structurelle OLED, la couche structurelle OLED étant disposée sur une surface du substrat de réseau ; une pluralité de filtres de couleur agencés à des intervalles, les filtres de couleur étant agencés sur le côté de la couche structurelle OLED qui est à l'opposé du substrat de réseau, et des espaces existant entre la pluralité de filtres de couleur ; une première couche de matériau organique, la première couche de matériau organique étant disposée sur le côté de la couche structurelle OLED qui est à l'opposé du substrat de réseau, la surface de la première couche de matériau organique qui est à l'opposé du substrat de réseau étant pourvue d'une pluralité de premières surfaces rugueuses agencées à des intervalles, et les projections orthographiques des premières surfaces rugueuses sur le substrat de réseau recouvrant au moins une partie des projections orthographiques des espaces sur le substrat de réseau ; et des premières couches métalliques qui protègent la lumière après avoir été noircies, les premières couches métalliques étant situées sur les premières surfaces rugueuses.
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CN111477764B (zh) * 2020-05-25 2022-12-23 京东方科技集团股份有限公司 Oled显示面板及其制作方法
CN112002821B (zh) * 2020-08-07 2022-03-08 深圳市华星光电半导体显示技术有限公司 Oled显示面板以及电子装置
CN112420952B (zh) * 2020-11-18 2022-08-05 武汉华星光电半导体显示技术有限公司 一种显示面板及其制备方法

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