WO2021237747A1

WO2021237747A1 - Optical system, precision apparatus, and electronic device

Info

Publication number: WO2021237747A1
Application number: PCT/CN2020/093535
Authority: WO
Inventors: 李德熙
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2020-05-29
Filing date: 2020-05-29
Publication date: 2021-12-02
Also published as: CN113508324A

Abstract

Provided in embodiments of the present invention are an optical system, a precision apparatus, and an electronic device, wherein the optical system comprises a base (10); a light transmission member (20) arranged on the base (10), the light transmission member (20) comprising a first side face (21) located within the base (10); an optical module (30) arranged within the base (10), a gap being present between the optical module (30) and the light transmission member (20), and the optical module (30) comprising a second side face (31) oriented towards the light transmission member (20); and a light transmission thermal insulation layer (40), the light transmission thermal insulation layer (40) being essentially sealingly fit with the first side face (21) and/or the second side face (31) A technical solution provided by the present invention can effectively prevent the production of water vapor inside an electronic device, and can effectively prevent fogging.

Description

Optical system, precision device and electronic equipment

Technical field

The embodiments of the present invention relate to the technical field of mechanical structure design, in particular to optical systems, precision devices, and electronic equipment.

Background technique

For electronic equipment with glass, such as shooting equipment, laser sensors, and mobile phones, there are generally cavities inside the electronic equipment. The cavity contains air and water vapor. When the electronic equipment is working, the electronic equipment is in the process of working. , The internal electronic components will generate heat, and when the outside temperature of the glass that is in direct contact with the outside air is low, the electronic equipment will cause fogging inside the electronic equipment due to the temperature difference between the inside and outside. For example, for shooting equipment, It will cause the glass camera to shoot blurry. For mobile phones, the inside of the glass is the screen, which will cause the user to lose sight of the screen.

Summary of the invention

In view of the foregoing defects in the prior art, embodiments of the present invention provide an optical system, a precision device, and an electronic device.

The first aspect of the embodiments of the present invention provides an optical system, which is applied to an electronic device, and the optical system includes:

Base

The light-transmitting member is arranged on the base, and the light-transmitting member includes a first side surface located in the base;

The optical module is arranged in the base, there is a gap between the optical module and the light-transmitting member, and the optical module includes a second side surface facing the light-transmitting member;

A light-transmitting heat-insulating layer, the light-transmitting heat-insulating layer and the first side surface and/or the second side surface are substantially sealed and adhered.

In the optical system provided by the embodiment of the present invention, since the light-transmitting part is arranged on the base and the optical module is arranged in the base, there is a gap between the light-transmitting part and the optical module. A light-transmitting and heat-insulating layer is arranged between the second sides of the module, and the light-transmitting and heat-insulating layer is substantially sealed and attached to the first side and/or the second side, so that the light-transmitting and heat-insulating layer is placed in the electronic device The light-transmitting heat-insulating layer prevents the heat of the optical module from being transferred to the light-transmitting parts due to the effect of heat insulation. The temperature difference between the light-transmitting heat-insulating layer and the optical module is small. Prevent fogging between the light-transmitting part and the optical module.

A second aspect of the embodiments of the present invention provides an optical system, which is applied to an electronic device, and the optical system includes:

Base

The light-transmitting part is arranged on the base;

The optical module is arranged in the base, and there is a gap between the optical module and the light-transmitting part;

The light-transmitting adhesive layer fills the gap between the optical module and the light-transmitting part, so that the light-transmitting part and the optical module are substantially sealed.

In the optical system provided by the embodiment of the present invention, since the light-transmitting part is arranged on the base and the optical module is arranged in the base, there is a gap between the light-transmitting part and the optical module, and there is a gap between the light-transmitting part and the optical module. The gap is filled with the light-transmitting adhesive layer, so that the light-transmitting part and the optical module are basically sealed. Because the light-transmitting adhesive layer fills the gap between the light-transmitting part and the optical module, the light-transmitting part and the optical module There is no air between the groups, which effectively prevents the air between the light-transmitting part and the optical module from condensing and fogging due to the temperature difference.

A third aspect of the embodiments of the present invention provides a precision device applied to electronic equipment, wherein the precision device includes:

Base

The first component is provided on the base, and the first component includes a first side surface located in the base;

A second component is provided in the base, there is a gap between the second component and the first component, and the second component includes a second side surface facing the first component;

A heat-insulating layer, the heat-insulating layer and the first side surface and/or the second side surface are substantially hermetically attached to each other.

In the precision device provided by the embodiment of the present invention, since the first part is arranged on the base and the second part is arranged in the base, there is a gap between the first part and the second part. A thermal insulation layer is arranged between the second side surfaces of the two components, and the thermal insulation layer is substantially sealed and attached to the first side and/or the second side. As a result, the thermal insulation layer is placed in the electronic device. The effect of heat prevents the heat of the second part from being transferred to the first part. The temperature difference between the heat insulation layer and the second part is small. The smaller the temperature difference, the more difficult it is for water vapor to condense. Fogging occurs.

The fourth aspect of the present invention provides a precision device applied to electronic equipment, and the precision device includes:

Base

The first component is arranged on the base;

The second part is arranged in the base, and there is a gap between the second part and the first part;

The adhesive layer fills the gap between the second component and the first component, so that the first component and the second component are substantially sealed.

In the precision device provided by the embodiment of the present invention, since the first part is arranged on the base and the second part is arranged in the base, there is a gap between the first part and the second part, and there is a gap between the first part and the second part. The gap is filled with the adhesive layer to make the first part and the second part basically sealed. Since the adhesive layer fills the gap between the first part and the second part, there is no gap between the first part and the second part. The presence of air effectively prevents the air between the first component and the second component from condensing and fogging due to the temperature difference.

A fifth aspect of the embodiments of the present invention provides an electronic device, including a housing and an optical system, where the housing is used to fix the optical system;

The optical system includes:

Base

The electronic device provided by the embodiment of the present invention includes a housing, and an optical system is fixed on the housing. Since the light-transmitting part is provided on the base, and the optical module is arranged in the base, there is a gap between the light-transmitting part and the optical module , A light-transmitting heat-insulating layer is provided between the first side surface of the light-transmitting member and the second side surface of the optical module, and the light-transmitting heat-insulating layer is substantially sealed and attached to the first side surface and/or the second side surface. , The light-transmitting heat insulation layer is placed in the electronic equipment, and the heat of the optical module is not transferred to the light-transmitting parts due to the heat insulation effect of the light-transmitting heat insulation layer, and the temperature difference between the light-transmitting heat insulation layer and the optical module is small , The smaller the temperature difference, the more difficult it is for water vapor to condense, thereby effectively preventing fogging between the light-transmitting part and the optical module.

A sixth aspect of the implementation of the present invention provides an electronic device, including a housing and an optical system, where the housing is used to fix the optical system; the optical system includes:

Base

The light-transmitting part is arranged on the base;

The electronic device provided by the embodiment of the present invention includes a housing, and an optical system is arranged on the housing. Since the light-transmitting part is provided on the base, the optical module is arranged in the base, and there is a gap between the light-transmitting part and the optical module , The light-transmitting adhesive layer is filled in the gap between the light-transmitting part and the optical module, so that the light-transmitting part and the optical module are basically sealed, because the light-transmitting adhesive layer is filled between the light-transmitting part and the optical module There is no air between the light-transmitting part and the optical module due to the gap between the light-transmitting parts and the optical module, which effectively prevents the air between the light-transmitting part and the optical module from condensing and fogging due to the temperature difference.

A seventh aspect of the embodiments of the present invention provides an electronic device, including a housing and a precision device, where the housing is used to fix the precision device;

The precision device includes:

Base

The electronic device provided by the embodiment of the present invention includes a housing, and a precision device is arranged on the housing. Since the first part is arranged on the base and the second part is arranged in the base, there is a gap between the first part and the second part , An insulation layer is provided between the first side surface of the first component and the second side surface of the second component, and the insulation layer is substantially sealed and attached to the first side surface and/or the second side surface. As a result, the insulation layer Placed in electronic equipment, the heat insulation layer prevents the heat of the second part from being transferred to the first part due to the effect of heat insulation. The temperature difference between the heat insulation layer and the second part is small. Effectively prevent fogging between the first part and the second part.

An eighth aspect of the embodiments of the present invention provides an electronic device, a housing, and a precision device. The housing is used to fix the precision device, and the precision device includes:

Base

The first component is arranged on the base;

The electronic device provided by the embodiment of the present invention includes a housing, and a precision device is arranged on the housing. Since the first part is arranged on the base and the second part is arranged in the base, there is a gap between the first part and the second part , The adhesive layer is filled in the gap between the first part and the second part, so that the first part and the second part are basically sealed, because the adhesive layer fills the gap between the first part and the second part, There is no air between the first part and the second part, which effectively prevents the air between the first part and the second part from condensing and fogging due to the temperature difference.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor.

Figure 1 is an isometric view of an electronic device provided by an embodiment of the present invention;

Figure 2 is a side view of an electronic device provided by an embodiment of the present invention;

Fig. 3 is a cross-sectional view taken along line A-A in Fig. 1.

Detailed ways

The following clearly describes the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.

The "including" mentioned in the entire specification and claims is an open term, so it should be interpreted as "including but not limited to". "Approximately" means that within the acceptable error range, those skilled in the art can solve the technical problem within a certain error range, and basically achieve the technical effect.

In addition, the term "connected" here includes any direct and indirect means of connection. Therefore, if it is described in the text that a first device is connected to a second device, it means that the first device can be directly connected to the second device, or indirectly connected to the second device through other devices.

It should be understood that the term "and/or, and/or" used in this text is only an association relationship describing the associated objects, which means that there can be three relationships, for example, A1 and/or B1, which can mean that A1 exists alone, There are three cases of A1 and B1 at the same time, and B1 alone. In addition, the character "/" in this text generally indicates that the associated objects before and after are in an "or" relationship.

Hereinafter, some embodiments of the present invention will be described in detail with reference to the accompanying drawings. If there is no conflict with each other, those skilled in the art can combine and combine the different embodiments or examples and the features of the different embodiments or examples described in this specification.

The inventor found through creative work that, for shooting equipment, for example, handheld cameras, cameras mounted on drones, and even mobile phones, which include a housing and an optical system assembled in the housing, the optical system can be Including a lens module, a display screen may also be provided in the housing, the lens module is used for shooting images, and the display screen is used for displaying images shot by the shooting equipment.

A light-transmitting lens is provided on the housing and at a position opposite to the lens module, so that external light can be transmitted to the lens through the light-transmitting lens to realize the shooting function. A light-transmitting lens is provided on the housing and opposite to the display screen, so that the user can watch the content displayed on the display screen. During the working process of the shooting equipment, the lens module and the display screen will generate a lot of heat. When the electronic device is working, the internal air temperature will increase, or when the shooting device is quickly placed from a place with a higher temperature to a place with a lower temperature, the temperature of the air outside the shooting device will be lower than the air temperature inside the shooting device , The light-transmitting lens fixed on the shooting device is in contact with the outside air, and its temperature will be close to the temperature of the outside air, causing the temperature of the inner side of the light-transmitting lens to be lower than the temperature of the air inside the shooting device. When the hot air inside the shooting device When encountering a colder light-transmitting lens, condensation will occur on the inner surface of the light-transmitting lens, that is, a fogging phenomenon will occur, which will seriously affect the shooting effect and display effect of the shooting device.

In order to at least solve the above technical problems, the present invention provides the following embodiments, which can effectively prevent the fogging phenomenon of the photographing device and has the advantages of low cost.

This embodiment provides an optical system, which is applied to an electronic device. In this embodiment, preferably, in some embodiments, the optical system may include a lens module, specifically, it may be a camera mounted on a handheld camera, a camera mounted on a drone pan/tilt, a mobile phone, etc. Module.

Figure 1 is an axonometric view of an electronic device provided by an embodiment of the present invention; in a specific embodiment, as shown in Figure 1 is a schematic structural diagram of a camera, the camera may include a display screen X and a lens module 30a, The group 30a captures images, and the display screen 30a can be electrically connected to the lens module 30a to display the images captured by the lens module 30a for the user to view. Both the display screen X and the lens module 30a may be covered with a light-transmitting member. In a preferred embodiment, the light-transmitting member may specifically include light-transmitting glass or light-transmitting resin.

Fig. 2 is a side view of an electronic device provided by an embodiment of the present invention; Fig. 3 is a cross-sectional view of A-A in Fig. 2. Please refer to FIG. 1 to FIG. 3, the optical system includes: a base 10, a light-transmitting member 20, an optical module 30 and a light-transmitting heat-insulating layer 40. The optical system of this embodiment may be fixed in the housing 100 of the electronic device, and the base 10 of the optical system may be integrally formed with the housing 100, or the base 10 may be detachably connected with the housing 100, for example, the base 10 may be connected to the housing 100 by a card The buckle is detachably connected to the housing 100, so that the optical system can be disassembled from the housing 100 as a whole, which is convenient for assembly, assembly and maintenance. In this embodiment, the optical module 30 may include a lens module 30a, or other modules composed of various optical elements.

The light-transmitting member 20 is disposed on the base 10, and the light-transmitting member 20 includes a first side surface 21 located in the base 10. The light-transmitting member 20 can be a fully transparent part or a translucent part, as long as it can realize the basic light-transmitting function. Specifically, the light-transmitting member 20 can be sealed and connected with the base 10 to make the light-transmitting member 20 It can play a role in dust and water resistance to protect the internal parts of the electronic equipment from damage or erosion. The light-transmitting member 20 may be in the shape of a flat plate, or may be in the shape of a convex lens, a concave lens, or even an uneven shape, which is not limited in this embodiment.

The base 10 may be provided with an installation opening, and the light-transmitting member 20 is installed in the installation opening. Specifically, for example, the light-transmitting member 20 may be clamped to the installation opening, and the edge of the installation opening may be provided with the light-transmitting member 20. When the card slot is inserted, the edge of the light-transmitting member 20 is inserted into the edge of the installation opening during installation. In some embodiments, the light-transmitting member 20 may be directly covered and pasted above the installation opening, or directly pasted below the installation opening. Furthermore, the light-transmitting member 20 may be connected to the edge of the installation port in a sealed manner, for example, by applying a sealant on the edge of the light-transmitting member 20 and the installation port, or the light-transmitting member 20 and the slot of the installation port are provided between The sealing ring is connected in a sealed manner. For example, an O-shaped sealing ring made of rubber is squeezed between the light-transmitting part 20 and the groove of the installation port to ensure the squeezing and sealing of the light-transmitting part 20 and the base 10. No matter what kind of sealing method is adopted, a sealed connection between the light-transmitting member 20 and the base 10 can be achieved, so as to effectively prevent external moisture from entering the inside of the electronic device.

The optical module 30 is disposed in the base 10, there is a gap between the optical module 30 and the light-transmitting member 20, and the optical module 30 includes a second side surface 31 facing the light-transmitting member 20. The optical module 30 may include one or more optical elements, such as at least one of a convex lens, a concave lens, a transmissive mirror, a reflecting mirror, etc. The multiple optical elements are combined to form an optical module 30 with a predetermined optical path to realize an imaging function. The optical module 30 may be fixedly arranged in the base 10 or movably arranged in the base 10, for example, may be movable or rotatably arranged in the base 10. Preferably, the optical module 30 may be fixedly arranged in the base 10, and the second side surface 31 of the optical module 30 may be at least hermetically connected with the base 10, so that a seal is formed between the light-transmitting member 20 and the optical module 30 In this way, even if there is water vapor in the housing space, the water vapor will not enter the interior of the optical module 30, so that the optical module 30 is not damaged, and the service life of the optical module 30 will not be affected.

The light-transmitting and heat-insulating layer 40 is disposed in the gap between the light-transmitting member 20 and the optical module 30. The light-transmitting and heat-insulating layer 40 is substantially sealed and attached to the first side 21 of the light-transmitting member 20 and/or the second side 31 of the optical module 30. The so-called light-transmitting and heat-insulating layer 40 refers to that the layer can transmit light and can block the transmission of heat insulation. The light path between the light pieces 20.

The light-transmitting heat-insulating layer 40 may be attached to only the first side surface 21 of the light-transmitting member 20, the light-transmitting heat-insulating layer 40 may also be attached to the second side 31 of the optical module 30 only, or the light-transmitting heat-insulating layer One side of 40 is bonded to the first side surface 21 of the light-transmitting member 20, and the other side is bonded to the second side surface 31 of the optical module 30. In the present embodiment, the light-transmitting heat-insulating layer 40 and the first side 21 and/or the second side 31 are substantially sealed and attached to each other, which means that the light-transmitting heat-insulating layer 40 is between the first side 21 and/or the second side 31 There is no gap, or only a small gap locally, to form a substantially sealed state, so that there is substantially no air between the light-transmitting and heat-insulating layer 40 and the first side surface 21 and/or the second side surface 31.

In this way, while the light-transmitting heat-insulating layer 40 prevents heat transfer from the optical module 30 to the light-transmitting member 20, although the temperature of the light-transmitting heat-insulating layer 40 on the side close to the optical module 30 is higher than that of the light-transmitting heat-insulating layer 40 The temperature of the side of the layer 40 close to the light-transmitting member 20 is high, but since the light-transmitting heat-insulating layer 40 and the first side surface 21 of the light-transmitting member 20 are substantially sealed and bonded, the light-transmitting heat-insulating layer 40 and the light-transmitting member 20 are There is basically no air, so that no fogging will occur between the light-transmitting heat-insulating layer 40 and the light-transmitting member 20, and since the light-transmitting heat-insulating layer 40 itself is insulated, the light-transmitting heat-insulating layer 40 is close to the optical module The temperature on one side of the 30 is close to the temperature of the optical module 30, and the temperature difference between the two is small, so there will be no fogging between the light-transmitting heat-insulating layer 40 and the optical module 30.

In some embodiments, the light-transmitting heat-insulating layer 40 and the second side surface 31 of the optical module 30 are substantially sealed and bonded, and the light-transmitting heat-insulating layer 40 is fixed to the optical module 30, completely obstructing the heat of the optical module 30. It is transmitted to the light-transmitting member 20, so that the temperature difference between the light-transmitting member 20 and the light-transmitting member 20 on the light-transmitting heat insulation layer 40 is small, so that the phenomenon of fogging is not prone to occur.

In some embodiments, while the light-transmitting heat-insulating layer 40 is substantially sealed and bonded to the first side 21 of the light-transmitting member 20, the light-transmitting heat-insulating layer 40 may also be substantially sealed and bonded to the second side 31 of the optical module 30. It is not limited in this embodiment.

It should be noted that since the light-transmitting heat-insulating layer 40 is substantially sealed and bonded to the first side 21 of the light-transmitting member 20, or the light-transmitting heat-insulating layer 40 is substantially sealed and bonded to the second side 31 of the optical module 30 Fit. Then the light-transmitting and heat-insulating layer 40 can be directly bonded to the first side 21 of the light-transmitting member 20, or directly to the second side 31 of the optical module 30, without the need to connect the light-transmitting and heat-insulating layer 40 to the base 10 Fixed connection can effectively reduce costs. In other embodiments, the edge of the light-transmitting heat-insulating layer 40 can be sealed and fixedly connected to the base 10 by a sealant, instead of bonding the light-transmitting heat-insulating layer 40 to the first side 21 or the first side surface of the light-transmitting member 20. Bonded to the second side 31 of the optical module 30. In this embodiment, it is preferable to pass the light-transmitting heat insulation layer 40 and the first side 21 of the light-transmitting member 20 and/or the second side 31 of the optical module 30 through The adhesive is directly bonded together to achieve a basic sealing fit. Even if the seal between the edge of the light-transmitting and heat-insulating layer 40 and the base 10 is not strong, it will not cause the heat generated by the optical module 30 to pass through the air. The gap between the light-transmitting heat-insulating layer 40 and the base 10 is transferred to the first side surface 21 of the light-transmitting member 20. Therefore, the anti-fogging effect of the light-transmitting heat-insulating layer 40 can be ensured, and no fogging in the electronic device can be ensured.

In the optical system provided by the embodiment of the present invention, since the light-transmitting part is arranged on the base and the optical module is arranged in the base, there is a gap between the light-transmitting part and the optical module. A light-transmitting and heat-insulating layer is arranged between the second sides of the module, and the light-transmitting and heat-insulating layer is substantially sealed and attached to the first side and/or the second side, so that the light-transmitting and heat-insulating layer is placed in the electronic device The light-transmitting heat-insulating layer prevents the heat of the optical module from being transferred to the light-transmitting parts due to the effect of heat insulation. The temperature difference between the light-transmitting heat-insulating layer and the optical module is small. Prevent fogging between the light-transmitting part and the optical module. For shooting equipment, when the optical system is applied to the lens module, it can prevent the lens module from fogging and ensure the shooting effect. In addition, the technical solution provided by this embodiment only needs to add a light-transmitting and heat-insulating layer 40, which is smaller in size and lower in cost.

In some embodiments, the light-transmitting heat insulation layer 40 can fill the gap between the optical module 30 and the light-transmitting member 20. In this way, the light-transmitting and heat-insulating layer 40 is sealed and bonded to the first side 21 of the light-transmitting member 20 and the second side 31 of the optical module 30. In this way, on the one hand, it can ensure that the optical module 30 and the light-transmitting member 20 are in contact with each other. There is no air between them. On the other hand, the thermal insulation between the optical module 30 and the light-transmitting part 20 can be ensured, and the heat transfer of the optical module 30 to the light-transmitting part 20 can be prevented, thereby preventing the optical module 30 and the light-transmitting part to the greatest extent. Fogging between 20.

In some embodiments, the light-transmitting heat insulation layer 40 and the first side surface 21 of the light-transmitting member 20 are substantially sealed and attached. As shown in FIG. 3, one side of the light-transmitting heat-insulating layer 40 is substantially sealed and bonded to the first side 21 of the light-transmitting member 20, and the other side of the light-transmitting heat-insulating layer 40 can be connected to the second side of the optical module 30. There is a gap between 31.

Optionally, the light-transmitting heat-insulating layer 40 and the second side surface 31 of the optical module 30 are substantially sealed and adhered. One side of the light-transmitting heat-insulating layer 40 is substantially sealed and attached to the second side 31 of the optical module 30, and the other side of the light-transmitting heat-insulating layer 40 can leave a gap with the first side 21 of the light-transmitting member 20 .

Regardless of the above-mentioned method, as long as it is ensured that one side of the light-transmitting heat-insulating layer 40 can be sealed and bonded to at least one of the first side 21 of the light-transmitting member 20 and the second side 31 of the optical module 30, this The invention is not limited.

As shown in FIG. 3, specifically, the light-transmitting and heat-insulating layer 40 may include: a light-transmitting adhesive layer 41 and a light-transmitting heat-insulating plate 42; The first side 21 and/or the second side 31 of the optical module 30 are bonded.

Among them, the light-transmitting adhesive layer 41 can be an optical glue, which is colorless and transparent, and has a light transmittance of more than 90%. The optical glue can include two types of natural resin optical glue and synthetic resin optical glue. Natural resin optical glue. It is made from the resin of the secretion of the fir subfamily tree species of the Pinaceae or the resin of the coniferous species secretion. For working and use under conditions, those skilled in the art can specifically select a suitable optical glue as the light-transmitting adhesive layer 41 according to actual needs.

The light-transmitting heat insulation board 42 is made of a transparent or translucent heat-insulating plate-like material. Specifically, the light-transmitting heat insulation board 42 may include at least one of the following: toughened glass, a transparent resin board, and a transparent plastic board. In this embodiment, it is more preferable that the light-transmitting heat insulation board 42 is a transparent plastic board, and the plastic material itself is heat-insulated, and the cost of the plastic material is low, and the molding process is simple, which is beneficial to effective cost saving.

In the process of bonding the light-transmitting heat insulation board 42 to the first side surface 21 of the light-transmitting member 20 and/or the second side surface 31 of the optical module 30, the optical glue may be applied to the light-transmitting heat insulation board 42 first. To form a light-transmitting adhesive layer 41, and then bond the light-transmitting adhesive layer 41 and the light-transmitting heat insulation board 42 together with the first side surface 21 of the light-transmitting member 20 and/or the second side surface 31 of the optical module 30 .

Optionally, the light-transmitting heat insulation layer 40 may only include the light-transmitting adhesive layer 41, and the light-transmitting adhesive layer 41 may fill the gap between the light-transmitting member 20 and the optical module 30. That is to say, the adhesive such as optical glue is filled in the gap between the light-transmitting member 20 and the optical module 30, so that there is no air between the light-transmitting member 20 and the optical module 30, and there is no moisture. Possibly, in this way, even if the optical module 30 generates heat during the working process, the phenomenon of fogging will not occur in the gap between the light-transmitting member 20 and the optical module 30. In this embodiment, the light-transmitting adhesive layer 41 may be formed of a light-transmitting and heat-insulating adhesive. In other embodiments, the light-transmitting adhesive layer 41 may be formed of a light-transmitting and non-heat-insulating adhesive. The present invention is not limited.

An anti-reflection film (not shown in the figure) is provided on the first side 21 and/or the third side 22 of the light-transmitting member 20, wherein the first side 21 and the third side 22 are disposed oppositely. For the light-transmitting member 20, it includes a first side surface 21 facing the optical module 30, and a third side surface 22 disposed opposite to the first side surface 21. In specific applications, the third side surface 22 can be understood as a light-transmitting member 20 is located on the outer surface outside the electronic device, and the first side surface 21 is the inner surface of the light-transmitting member 20. The optical path of the optical system passes through the first side 21 and the third side 22 of the light-transmitting member 20. An anti-reflection film is provided on at least one of the first side 21 and the third side 22 of the light-transmitting member 21, which can effectively The reflected light on the optical surface of the light-transmitting member 20 is reduced or eliminated, thereby increasing the amount of light transmitted by the light-transmitting member 20 and reducing or eliminating stray light of the optical system.

An anti-reflection film (not shown in the figure) is provided on the inner side and/or outer side of the light-transmitting heat insulation board 42. It should be noted that the inner side surface of the light-transmitting heat insulation board 42 refers to the side surface facing the optical module 30, and the outer side surface of the light-transmitting heat insulation board 42 refers to the side surface facing the light-transmitting member 20. An anti-reflection film may be provided on at least one of the inner and outer side surfaces of the light-transmitting and heat-insulating plate 42, thereby increasing the transmittance of the light-transmitting and heat-insulating plate 42.

It can be understood that the more surfaces provided on the antireflection film, the better the transmission effect of the entire optical system. Therefore, it is preferable that the first side 21 and the third side 22 of the light-transmitting member 20, and the light-transmitting and heat-insulating Both the inner side and the outer side of the plate 42 are provided with antireflection films.

An antireflection film is provided on at least one of the first side surface 21 and/or the third side surface 22 of the light-transmitting member 20 and the inner and outer side surfaces of the light-transmitting heat insulation board 42, which can effectively improve the perspective effect of the lens module and facilitate the transmission of the light path. Improve the camera effect.

It should be noted that, in addition to being applied to photographing equipment, the optical system provided in this embodiment can also be applied to laser sensors or other sensors, or to microscopes, diving goggles and other technical fields where optical systems are applied. The present invention is not limited to this.

Some embodiments of the present invention also provide another optical system, which is applied to electronic equipment. The optical system includes: a base 10, a light-transmitting member 20, an optical module 30, and a light-transmitting adhesive layer 41.

The light-transmitting member 20 is provided in the base 10, the optical module 30 is provided in the base 10, there is a gap between the optical module 30 and the light-transmitting member 20, and the light-transmitting adhesive layer 41 fills the optical module 30 and the light-transmitting member. The gap between the light elements 20 is such that the light transmission element 20 and the optical module 30 are substantially sealed. In this way, there is no air between the optical module 30 and the light-transmitting member 20, which fundamentally eliminates the phenomenon of fogging between the two, and the light-transmitting adhesive layer 41 transmits light, which does not affect the normality of the optical module 30 usage of.

In this embodiment, the light-transmitting adhesive layer 41 may include a non-heat-insulating adhesive layer. In other words, the light-transmitting adhesive layer 41 of this embodiment does not have the property of heat insulation, as long as the light-transmitting adhesive layer 41 occupies the gap between the light-transmitting member 20 and the optical module 30, the light-transmitting member 20 and the optical module 30 It is sufficient if there is no air between the groups 30.

The inventor also found that for some electronic devices such as precision instruments, they are highly sensitive to moisture. When this kind of device encounters cold air, its internal layout is prone to condensation, which causes the internal air to liquefy and moisture accumulates. On parts with lower temperature, not only fogging will occur, but also the normal use of parts there will be affected.

In order to solve the above technical problems, the present invention provides the following embodiments to prevent condensation and fogging inside the precision instrument, which affects the use of the instrument, and improves the sensitivity and accuracy of the precision instrument.

The precision device provided in this embodiment is applied to electronic equipment, and the precision device may include a sensing system of some sensors. The precision device may include the display module. Specifically, the display module may be an assembly of transparent glass or transparent resin and a display screen of a camera, mobile phone, computer, etc. In some other embodiments, the precision device It may also be a precision device inside the sensor such as a laser sensor.

The precision device includes: a base 10, a first part 20, a second part 30 and a heat insulation layer 40. The precision device of this embodiment may be fixed in the housing 100 of the electronic device. The base 10 of the precision device may be integrally formed with the housing 100, or the base 10 may be detachably connected to the housing 100. For example, the base 10 may be connected to the housing 100 by a card The buckle is detachably connected with the housing 100, so that the precision device can be disassembled from the housing 100 as a whole, which is convenient for assembly, assembly and maintenance.

The first component 20 is disposed on the base 10, and the first component 20 includes a first side surface 21 located in the base 10. Specifically, the first component 20 may be connected to the base 10 in a sealed manner, so that the light-transmitting member 20 can play a role of dustproof and waterproof, so as to protect the internal components of the electronic device from damage or erosion. The first component 20 may be in the shape of a flat plate, or may be in the shape of a convex lens, a concave lens, or even an uneven shape, which is not limited in this embodiment. It is worth noting that, for the display module, the first component 20 can be transparent glass or transparent resin, and the second component 30 can be a display screen.

The base 10 may be provided with an installation port, and the first component 20 may be installed in the installation port. Specifically, for example, the first component 20 may be clamped to the installation port, and the edge of the installation port may be provided with the first component 20. When the card slot is inserted, the edge of the first component 20 is inserted into the edge of the installation opening during installation. In some embodiments, the first component 20 may be directly covered and pasted above the installation opening, or directly pasted below the installation opening. Furthermore, the first component 20 can be connected to the edge of the installation port in a sealed manner, for example, by applying a sealant on the edge of the first component 20 and the installation port, or the first component 20 and the slot of the installation port are provided between The sealing ring is connected in a sealed manner. For example, an O-shaped sealing ring made of rubber is squeezed between the first part 20 and the groove of the installation port to ensure the squeeze seal between the first part 20 and the base 10. No matter what kind of sealing method is adopted, the sealing connection between the first component 20 and the base 10 can be realized, so as to effectively prevent external moisture from entering the inside of the electronic device.

The second component 30 is disposed in the base 10, there is a gap between the second component 20 and the first component 10, and the second component 30 includes a second side surface 22 facing the first component 10. The second component 30 may be fixedly arranged in the base 10 or movably arranged in the base 10, for example, may be movable or rotatably arranged in the base 10. Preferably, the second component 30 can be fixedly arranged in the base 10, and the second side surface 31 of the second component 30 can be at least hermetically connected with the base 10, so that a seal is formed between the first component 20 and the second component 30 In this way, even if there is water vapor in the housing space, the water vapor will not enter the interior of the second component 30, so that the second component 30 is not damaged, and the service life of the second component 30 will not be affected.

The heat insulation layer 40 is provided in the gap between the first member 20 and the second member 30. The thermal insulation layer 40 is substantially sealed and attached to the first side surface 21 of the first component 20 and/or the second side surface 31 of the second component 30.

The heat-insulating layer 40 may only be attached to the first side surface 21 of the first member 20, the heat-insulating layer 40 may also be attached only to the second side surface 31 of the second member 30, or one side of the heat-insulating layer 40 may be attached to the first side The first side surface 21 of one component 20 is attached to each other, and the other side is attached to the second side surface 31 of the second component 30. In the present embodiment, that the thermal insulation layer 40 and the first side surface 21 and/or the second side surface 31 are substantially sealed and fit means that there is no gap between the thermal insulation layer 40 and the first side surface 21 and/or the second side surface 31 , Or there is only a small gap locally to form a substantially sealed state, so that there is substantially no air between the thermal insulation layer 40 and the first side surface 21 and/or the second side surface 31.

In this way, the heat insulation layer 40 prevents the heat transfer from the second component 30 to the first component 20, although the temperature on the side of the heat insulation layer 40 closer to the second component 30 is higher than that of the heat insulation layer 40 closer to the first component. The temperature on one side of the 20 is high, but since the thermal insulation layer 40 is substantially sealed and attached to the first side surface 21 of the first component 20, there is basically no air between the thermal insulation layer 40 and the first component 20, so that the thermal insulation layer 40 Fogging will not occur between the first component 20 and the thermal insulation layer 40 itself, and the temperature of the side of the thermal insulation layer 40 close to the second component 30 is close to that of the second component 30. The temperature difference between the two is small, so there will be no fogging between the thermal insulation layer 40 and the second member 30.

In some embodiments, the thermal insulation layer 40 and the second side surface 31 of the second component 30 are substantially sealed and attached, and the thermal insulation layer 40 is fixed to the second component 30, completely obstructing the transfer of heat from the second component 30 to the first component 30. The component 20 makes the temperature difference between the heat insulation layer 40 of the first component 20 close to the first component 20 small, so that the phenomenon of fogging is not prone to occur.

In some embodiments, while the heat insulation layer 40 is substantially sealed and bonded to the first side 21 of the first component 20, the heat insulation layer 40 may also be substantially sealed and bonded to the second side 31 of the second component 30. This embodiment The examples are not limited.

It should be noted that the heat insulation layer 40 is substantially sealed and bonded to the first side 21 of the first component 20, or the heat insulation layer 40 is substantially sealed and bonded to the second side 31 of the second component 30. Then the heat insulation layer 40 can be directly bonded to the first side 21 of the first component 20, or directly bonded to the second side 31 of the second component 30, without the need to fixedly connect the heat insulation layer 40 to the base 10. Effectively reduce costs. In some other embodiments, the edge of the thermal insulation layer 40 can be sealed and fixedly connected to the base 10 through a sealant, instead of bonding the thermal insulation layer 40 to the first side 21 of the first component 20 or to the first side The second side 31 of the two parts 30, preferably in this embodiment, the heat insulation layer 40 is directly bonded to the first side 21 of the first part 20 and/or the second side 31 of the second part 30 through an adhesive To achieve a basic sealing fit, even if the seal between the edge of the insulating layer 40 and the base 10 is not strong, it will not cause the heat generated by the second component 30 to pass through the air from the insulating layer 40 and the base 10 The gap therebetween is transferred to the first side surface 21 of the first component 20, and therefore, the anti-fogging effect of the heat insulation layer 40 can be ensured, and no fogging in the electronic device can be ensured.

In the precision device provided by the embodiment of the present invention, since the first part is arranged on the base and the second part is arranged in the base, there is a gap between the first part and the second part. A thermal insulation layer is arranged between the second side surfaces of the two components, and the thermal insulation layer is substantially sealed and attached to the first side and/or the second side. As a result, the thermal insulation layer is placed in the electronic device. The effect of heat prevents the heat of the second part from being transferred to the first part. The temperature difference between the heat insulation layer and the second part is small. The smaller the temperature difference, the more difficult it is for water vapor to condense. Fogging occurs, so that the parts inside the precision instrument will not affect the service life of some parts due to the partial condensation of water vapor in the air. When the precision device is a display module, the first component can be transparent glass or transparent resin, and the second component can be a display screen. By placing a heat insulation layer between the two, it can effectively prevent the transparent glass or transparent resin from rising up. Fog, thereby ensuring the display effect of the display.

In some embodiments, the heat insulation layer 40 may fill the gap between the first part and the second part. In this way, the heat insulation layer 40 is sealed and attached to the first side 21 of the first component 20 and the second side 31 of the second component 30. In this way, on the one hand, it can ensure that there is no gap between the second component 30 and the first component 20. The presence of air, on the other hand, can ensure heat insulation between the second part 30 and the first part 20, hinder the heat transfer of the second part 30 to the first part 20, thereby preventing the second part 30 and the first part 20 to the greatest extent. Fog in between.

In some embodiments, the thermal insulation layer 40 and the first side surface 21 of the first component 20 are substantially sealed and attached. As shown in FIG. 3, one side of the thermal insulation layer 40 is substantially sealed and attached to the first side 21 of the first component 20, and the other side of the thermal insulation layer 40 can be left between the second side 31 of the second component 30. There are gaps.

Optionally, the heat insulation layer 40 and the second side surface 31 of the second component 30 are substantially sealed and adhered. One side surface of the thermal insulation layer 40 and the second side surface 31 of the second component 30 are substantially sealed and attached, and a gap may be left between the other side surface of the thermal insulation layer 40 and the first side surface 21 of the first component 20.

No matter which method is adopted, as long as it is ensured that one side of the thermal insulation layer 40 can be hermetically attached to at least one of the first side surface 21 of the first member 20 and the second side surface 31 of the second member 30, the present invention does not Make a limit.

As shown in FIG. 3, specifically, the heat insulation layer 40 may include: an adhesive layer 41 and a heat insulation board 42; The second side 31 of the component 30 is bonded.

Among them, the adhesive layer 41 can be an optical glue, which is colorless and transparent and has a light transmittance of more than 90%. The optical glue can include natural resin optical glue and synthetic resin optical glue. Natural resin optical glue is used The resin of the secretion of the fir subfamily of the Pinaceae or the secretion of the coniferous tree species is made by processing, and the synthetic resin adhesive has high bonding strength, good resistance to high and low temperatures, and can be used under harsh conditions such as vibration and radiation. For working use, in other embodiments, the adhesive layer 41 may be other resin adhesives, and those skilled in the art can specifically select a suitable adhesive as the adhesive layer 41 according to actual needs.

The heat insulation board 42 is made of a transparent or translucent or opaque heat insulation board-like material. Specifically, the heat insulation board 42 may include at least one of the following: tempered glass, resin board, and plastic board. In this embodiment, it is more preferable that the heat insulation board 42 is a plastic board, and the plastic material itself is heat insulated, and the cost of the plastic material is low, and the molding process is simple, which is beneficial to effective cost saving.

It is worth noting that when the first component 20 is transparent glass or transparent resin, and the second component 30 is a display screen, the heat shield 42 can be a transparent heat shield to avoid affecting the display effect of the display module. The user can See clearly what is displayed on the display.

In the process of bonding the heat insulation board 42 to the first side surface 21 of the first component 20 and/or the second side surface 31 of the second component 30, an adhesive may be applied to the insulation board 42 to form The adhesive layer 41 is then bonded to the first side 21 of the first component 20 and/or the second side 31 of the second component 30 together with the adhesive layer 41 and the heat insulation board 42.

Optionally, the heat insulation layer 40 may only include the adhesive layer 41, and the adhesive layer 41 may fill the gap between the first component 20 and the second component 30. That is to say, the adhesive is filled in the gap between the first part 20 and the second part 30, so that there is no air between the first part 20 and the second part 30, and there is no possibility of water vapor. As a result, even if the second component 30 generates heat during operation, no fogging will occur in the gap between the first component 20 and the second component 30. In this embodiment, the adhesive layer 41 may be formed of a light-transmitting and heat-insulating adhesive. In other embodiments, the adhesive layer 41 may be formed of a light-transmitting and non-heat-insulating adhesive, which is not used in the present invention. limited.

The precision device provided in this embodiment can be fixed in the housing 100 to form electronic equipment such as precision instruments. The interior of the precision device is not prone to condensation, and its internal parts will not be corroded by condensed water, effectively ensuring that the interior The service life of components.

Some embodiments of the present invention also provide another precision device, which is applied to electronic equipment. The precision device includes: a base 10, a first component 20, a second component 30, and an adhesive layer 41.

Among them, the first member 20 is provided in the base 10, the second member 30 is provided in the base 10, there is a gap between the second member 30 and the first member 20, and the adhesive layer 41 fills the second member 30 and the first member. There is a gap between 20, so that the first part 20 and the second part 30 are substantially sealed. In this way, there is no air between the second component 30 and the first component 20, which fundamentally eliminates the phenomenon of fogging between the two, and the adhesive layer 41 transmits light, which does not affect the normal use of the first component 20 .

In this embodiment, the adhesive layer 41 may include a non-insulation adhesive layer. In other words, the adhesive layer 41 of this embodiment does not have the property of heat insulation, as long as the adhesive layer 41 occupies the gap between the first member 20 and the second member 30 so that the gap between the first member 20 and the second member 30 No air is required, so that the precision device will not be fogged.

As shown in FIG. 1, in some embodiments, an electronic device is also provided. The electronic device includes a housing 100 and an optical system. The housing 100 is used to fix the optical system. The optical system may include a lens module, specifically, it may be a camera module set on a handheld camera, a camera mounted on a drone pan/tilt, a mobile phone, etc. The lens module is used to capture images, and the display module includes The display screen and the light-transmitting part covering the display screen are used to display the images taken by the lens module. In some embodiments, the optical system may include a lens module, and specifically may be a camera module installed on a handheld camera, a camera mounted on a drone pan/tilt, a mobile phone, and other devices. In some other embodiments, the optical system may also be an optical system inside a sensor such as a laser sensor.

In a specific embodiment, as shown in FIG. 1 is a schematic structural diagram of a camera. The camera may include a display screen X and a lens module 30a. The lens module 30a captures images, and the display screen 30a may be electrically connected to the lens module 30a. , To display the image taken by the lens module 30a, which is convenient for the user to watch. Both the display screen X and the lens module 30a may be covered with a light-transmitting member. In a preferred embodiment, the light-transmitting member may specifically include light-transmitting glass or light-transmitting resin.

In this embodiment, as shown in FIG. 1, the optical system (lens module 30a) may be arranged on one side of the housing 100, and the display screen X may be arranged on the other side of the housing 100, which is away from the optical system. The optical system and the display screen X can be arranged on the same side of the housing 100. The housing 100 and the optical system can be fixed by glue.

Please refer to FIG. 1 to FIG. 3, the optical system includes: a base 10, a light-transmitting member 20, an optical module 30 and a light-transmitting heat-insulating layer 40. The optical system of this embodiment may be fixed in the housing 100 of the electronic device, and the base 10 of the optical system may be integrally formed with the housing 100, or the base 10 may be detachably connected with the housing 100, for example, the base 10 may be connected to the housing 100 by a card The buckle is detachably connected to the housing 100, so that the optical system can be disassembled from the housing 100 as a whole, which is convenient for assembly, assembly and maintenance.

An optical module 30 may be disposed in the housing 100, and the optical module 30 is close to the electronic components, or the optical module 30 is electrically connected to the electronic components. When the electronic components work, the optical module 30 may generate heat due to the heat generated by the electronic components, or the optical module 30 may generate heat during operation.

The light-transmitting heat-insulating layer 40 may be attached to only the first side surface 21 of the light-transmitting member 20, the light-transmitting heat-insulating layer 40 may also be attached to the second side 31 of the optical module 30 only, or the light-transmitting heat-insulating layer One side of 40 is bonded to the first side surface 21 of the light-transmitting member 20, and the other side is bonded to the second side surface 31 of the optical module 30. In the present embodiment, the light-transmitting heat-insulating layer 40 and the first side 21 and/or the second side 31 are basically sealed and attached to each other, which means that the light-transmitting heat-insulating layer 40 is between the first side 21 and/or the second side 31 There is no gap, or only a small gap locally, to form a substantially sealed state, so that there is substantially no air between the light-transmitting and heat-insulating layer 40 and the first side surface 21 and/or the second side surface 31.

In some embodiments, while the light-transmitting heat-insulating layer 40 is substantially sealed and bonded to the first side 21 of the light-transmitting member 20, the light-transmitting heat-insulating layer 40 may also be substantially sealed and bonded to the second side 31 of the optical module 30. Therefore, this embodiment does not make a limitation.

The electronic device provided by the embodiment of the present invention includes a housing and an optical system. Since the light-transmitting part is arranged on the base and the optical module is arranged in the base, there is a gap between the light-transmitting part and the optical module. A light-transmitting heat-insulating layer is provided between the first side surface of the optical module and the second side surface of the optical module, and the light-transmitting heat-insulating layer is substantially sealed and attached to the first side and/or the second side. As a result, the light-transmitting heat-insulation The layer is placed in the electronic equipment, the light-transmitting heat-insulating layer prevents the heat of the optical module from being transferred to the light-transmitting parts due to the effect of heat insulation. The temperature difference between the light-transmitting heat-insulating layer and the optical module is small, and the smaller the temperature difference is The harder it is to condense, thereby effectively preventing fogging between the light-transmitting part and the optical module. For shooting equipment, when the optical system is applied to the lens module, it can prevent the lens module from fogging and ensure the shooting effect . In addition, the technical solution provided by this embodiment only needs to add a light-transmitting and heat-insulating layer 40, which is smaller in size and lower in cost.

An anti-reflection film (not shown in the figure) is provided on the inner side and/or outer side of the light-transmitting heat insulation board 42. It should be noted that the inner side surface of the light-transmitting heat insulation board 42 refers to the side surface facing the optical module 30, and the outer side surface of the light-transmitting heat insulation board 42 refers to the side surface facing the light-transmitting member 20. An anti-reflection film may be provided on at least one of the inner and outer sides of the light-transmitting heat insulation board 42 to thereby increase the transmittance of the light-transmitting heat insulation board 42.

It should be noted that the electronic equipment system provided in this embodiment may be not only a photographing device, but also a laser sensor or other sensors, or other equipment such as a microscope and diving goggles, and the present invention is not limited to this.

On the premise of no conflict, other specific structures and specific functions of the optical system in the electronic device provided in this embodiment are the same as those in the foregoing embodiment. For details, reference may be made to the description of the foregoing embodiment, which will not be repeated here.

The embodiment of the present invention also provides another electronic device. The electronic device of this embodiment may include at least one of the following: a photographing device, a laser radar, a mobile terminal, an ultrasonic instrument, a distance sensor, and an angle sensor.

The electronic equipment provided in this embodiment includes a precision device and a housing 100. The precision device may be fixed in the housing 100, and the precision device may include a sensing system of some sensors. The precision device may include a display module. Specifically, the display module may be an assembly of transparent glass or transparent resin and a display screen of a camera, mobile phone, computer, etc. In some other embodiments, the precision device may also It may be a precision device inside the sensor such as a laser sensor.

The housing 100 may be provided with electronic components, and the precision device may be close to the electronic components, or the precision device may be electrically connected to the electronic components. When the electronic components work, the precision device will generate heat due to the heat generated by the electronic components, or the precision device itself will generate heat.

The first component 20 is disposed on the base 10, and the first component 20 includes a first side surface 21 located in the base 10. Specifically, the first component 20 may be connected to the base 10 in a sealed manner, so that the light-transmitting member 20 can play a role of dustproof and waterproof, so as to protect the internal components of the electronic device from damage or erosion.

The second component 30 is disposed in the base 10, there is a gap between the second component 20 and the first component 10, and the second component 30 includes a second side surface 22 facing the first component 10. Preferably, the second component 30 can be fixedly arranged in the base 10, and the second side surface 31 of the second component 30 can be at least hermetically connected with the base 10, so that a seal is formed between the first component 20 and the second component 30 In this way, even if there is water vapor in the housing space, the water vapor will not enter the interior of the second component 30, so that the second component 30 is not damaged, and the service life of the second component 30 will not be affected.

The electronic device provided by the embodiment of the present invention includes a precision device. Since the first part is arranged on the base and the second part is arranged in the base, there is a gap between the first part and the second part. A heat insulation layer is provided between one side and the second side of the second component, and the heat insulation layer is substantially sealed and attached to the first side and/or the second side. In this way, the heat insulation layer is placed in the electronic device to isolate Due to the effect of heat insulation, the heat of the second part will not be transferred to the first part by the thermal layer. The temperature difference between the heat insulation layer and the second part is small. The smaller the temperature difference, the more difficult it is for water vapor to condense. Fogging occurs between the two parts, so that the parts inside the precision instrument will not affect the service life of some parts due to the partial condensation of water vapor in the air. When the precision device is a display module, the first component can be transparent glass or transparent resin, and the second component can be a display screen. By placing a heat insulation layer between the two, it can effectively prevent the transparent glass or transparent resin from rising up. Fog, thereby ensuring the display effect of the display.

In some embodiments, the heat insulation layer 40 may fill the gap between the first part and the second part. In this way, the thermal insulation layer 40 is hermetically attached to the first side surface 21 of the first component 20 and the second side surface 31 of the second component 30, thereby preventing the second component 30 and the first component 20 from lifting to the greatest extent. fog.

Optionally, the heat insulation layer 40 may only include the adhesive layer 41, and the adhesive layer 41 may fill the gap between the first component 20 and the second component 30.

In the electronic device provided by this embodiment, condensation is not easy to occur inside, and the internal parts will not be corroded due to the condensation water, which effectively guarantees the service life of the internal parts.

On the premise of no conflict, other specific structures and specific functions of the precision device in the electronic equipment provided in this embodiment are the same as those of the precision device provided in the foregoing embodiment. For details, please refer to the description of the foregoing embodiment. Repeat it again.

An embodiment of the present invention also provides an electronic device, as shown in FIG. 3, including a housing 100 and an optical system, the housing 100 is used to fix the optical system; the optical system includes: a base 10, a light transmitting member 20, and an optical module 30和light-transmitting adhesive layer 41.

An embodiment of the present invention also provides an electronic device. As shown in FIG. 3, it includes a housing 100 and a precision device. The housing 100 is used to fix the precision device. The precision device includes a base 10, a first component 20, and a second component 30.和胶层41。 And adhesive layer 41.

In this embodiment, the adhesive layer 41 may include a non-insulation adhesive layer. In other words, the adhesive layer 41 of this embodiment does not have the property of heat insulation, as long as the adhesive layer 41 occupies the gap between the first member 20 and the second member 30 so that the gap between the first member 20 and the second member 30 The absence of air is sufficient, so that the electronic equipment will not be fogged.

In the several embodiments provided by the present invention, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be electrical or mechanical. Or other forms.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. Scope.

Claims

An optical system applied to electronic equipment, characterized in that the optical system includes:

Base

The light-transmitting member is arranged on the base, and the light-transmitting member includes a first side surface located in the base;

The optical module is arranged in the base, there is a gap between the optical module and the light-transmitting member, and the optical module includes a second side surface facing the light-transmitting member;

A light-transmitting heat-insulating layer, the light-transmitting heat-insulating layer and the first side surface and/or the second side surface are substantially sealed and adhered.
The optical system according to claim 1, wherein the light-transmitting member comprises a transparent panel.
The optical system of claim 1, wherein the light-transmitting heat-insulating layer fills the gap between the optical module and the light-transmitting member.
The optical system according to claim 1, wherein the light-transmitting heat-insulating layer is substantially hermetically attached to the first side surface of the light-transmitting member.
The optical system of claim 1, wherein the light-transmitting and heat-insulating layer is substantially hermetically attached to the second side surface of the optical module.
The optical system according to any one of claims 1 to 5, wherein the light-transmitting heat insulation layer comprises: a light-transmitting adhesive layer and a light-transmitting heat insulation board;

The light-transmitting heat insulation board is bonded to the first side surface of the light-transmitting member and/or the second side surface of the optical module through the light-transmitting adhesive layer.
The optical system according to claim 6, wherein the light-transmitting heat insulation board comprises at least one of the following: toughened glass, transparent resin board, and transparent plastic board.
The optical system according to any one of claims 1-5, wherein the light-transmitting heat-insulating layer comprises a light-transmitting adhesive layer, and the light-transmitting adhesive layer fills the light-transmitting part and the optical The gap between the modules.
The optical system according to claim 1, wherein the light-transmitting member comprises light-transmitting glass or light-transmitting resin.
The optical system according to claim 1, wherein the optical module comprises a lens module.
The optical system according to claim 1, wherein the light-transmitting member is in hermetically connected with the base.
The optical system according to claim 11, wherein the second side surface of the optical module is hermetically connected to the base to form a sealed housing between the light-transmitting member and the optical module space.
The optical system according to claim 1, wherein an antireflection film is provided on the first side surface and/or the third side surface of the light-transmitting member, wherein the first side surface is opposite to the third side surface set up.
The optical system according to claim 6, wherein an anti-reflection film is provided on the inner side and/or the outer side of the light-transmitting heat insulation board.
A precision device applied to electronic equipment, characterized in that the precision device includes:

Base

The first component is provided on the base, and the first component includes a first side surface located in the base;

A second component is provided in the base, there is a gap between the second component and the first component, and the second component includes a second side surface facing the first component;

A heat-insulating layer, the heat-insulating layer and the first side surface and/or the second side surface are substantially hermetically attached to each other.
The precision device according to claim 15, wherein the heat insulation layer fills the gap between the first part and the second part.
The precision device according to claim 15, wherein the heat insulation layer is substantially sealed and attached to the first side surface of the first component.
The precision device according to claim 15, wherein the heat insulation layer is substantially sealed and attached to the second side surface of the second component.
The precision device according to any one of claims 15-18, wherein the heat insulation layer comprises: an adhesive layer and a heat insulation board;

The heat insulation board is bonded to the first side surface of the first component and/or the second side surface of the second component through the adhesive layer.
The precision device according to any one of claims 15-18, wherein the heat insulation layer comprises an adhesive layer, and the adhesive layer fills the gap between the first part and the second part .
The precision device according to claim 15, wherein the first component comprises light-transmitting glass or light-transmitting resin.
The precision device according to claim 15, wherein the first component is in hermetically connected with the base.
The precision device according to claim 22, wherein the second side surface of the second component is connected to the base in a sealed manner to form a sealed housing between the first component and the second component space.
An electronic device, characterized by comprising a housing and an optical system, the housing is used to fix the optical system;

The optical system includes:

Base

The light-transmitting member is arranged on the base, and the light-transmitting member includes a first side surface located in the base;

The optical module is arranged in the base, there is a gap between the optical module and the light-transmitting member, and the optical module includes a second side surface facing the light-transmitting member;

A light-transmitting heat-insulating layer, the light-transmitting heat-insulating layer and the first side surface and/or the second side surface are substantially sealed and adhered.
The electronic device according to claim 24, wherein the light-transmitting member comprises a transparent panel.
24. The electronic device of claim 24, wherein the light-transmitting heat-insulating layer fills the gap between the optical module and the light-transmitting member.
24. The electronic device according to claim 24, wherein the light-transmitting heat-insulating layer and the first side surface of the light-transmitting member are substantially sealed and attached to each other.
22. The electronic device of claim 24, wherein the light-transmitting and heat-insulating layer is substantially hermetically attached to the second side surface of the optical module.
The electronic device according to any one of claims 24-28, wherein the light-transmitting heat insulation layer comprises: a light-transmitting adhesive layer and a light-transmitting heat insulation board;

The light-transmitting heat insulation board is bonded to the first side surface of the light-transmitting member and/or the second side surface of the optical module through the light-transmitting adhesive layer.
The electronic device according to claim 29, wherein the light-transmitting heat insulation board comprises at least one of the following: toughened glass, transparent resin board, and transparent plastic board.
The electronic device according to any one of claims 24-28, wherein the light-transmitting heat insulation layer comprises a light-transmitting adhesive layer, and the light-transmitting adhesive layer fills the light-transmitting part and the optical The gap between the modules.
The electronic device according to claim 24, wherein the light-transmitting member comprises light-transmitting glass or light-transmitting resin.
The electronic device according to claim 24, wherein the optical module comprises a lens module.
The electronic device according to claim 24, wherein the light-transmitting member is in hermetically connected with the base.
The electronic device according to claim 34, wherein the second side surface of the optical module is hermetically connected to the base to form a sealed housing between the light-transmitting member and the optical module space.
The electronic device according to claim 24, wherein an antireflection film is provided on the first side surface and/or the third side surface of the light-transmitting member, wherein the first side surface is opposite to the third side surface set up.
The electronic device according to claim 29, wherein an anti-reflection film is provided on the inner side and/or the outer side of the light-transmitting heat insulation board.
The electronic device according to claim 24, wherein the housing is provided with electronic components.
The electronic device according to claim 24, wherein the base of the optical system and the housing of the electronic device are detachably connected or integrally formed.
The electronic device according to claim 38 or 39, wherein the optical module is close to the electronic component, or the optical module is electrically connected to the electronic component.
The electronic device according to claim 24, wherein the electronic device comprises: a display screen, and the display screen is configured to display an image generated by the optical system.
The electronic device according to claim 41, wherein the housing is used to fix the display screen.
42. The electronic device according to claim 42, wherein the optical system is provided on one side of the housing, and the display screen is provided on the other side of the housing, away from the optical system.
The electronic device according to claim 42, wherein the optical system and the display screen are provided on the same side of the housing.
The electronic device according to claim 24, wherein the housing and the optical system are fixed by glue.
An electronic device, characterized by comprising a housing and a precision device, the housing being used for fixing the precision device;

The precision device includes:

Base

The first component is provided on the base, and the first component includes a first side surface located in the base;

A second component is provided in the base, there is a gap between the second component and the first component, and the second component includes a second side surface facing the first component;

A heat-insulating layer, the heat-insulating layer and the first side surface and/or the second side surface are substantially hermetically attached to each other.
The electronic device according to claim 46, wherein the thermal insulation layer fills the gap between the first component and the second component.
The electronic device according to claim 47, wherein the heat insulation layer is substantially sealed and attached to the first side surface of the first component.
The electronic device according to claim 47, wherein the heat insulation layer is substantially sealed and attached to the second side surface of the second component.
The electronic device according to any one of claims 47-49, wherein the heat insulation layer comprises: an adhesive layer and a heat insulation board;

The heat insulation board is bonded to the first side surface of the first component and/or the second side surface of the second component through the adhesive layer.
The electronic device according to any one of claims 47-49, wherein the thermal insulation layer comprises an adhesive layer, and the adhesive layer fills the gap between the first component and the second component .
The electronic device according to claim 47, wherein the first component comprises light-transmitting glass or light-transmitting resin.
The electronic device according to claim 47, wherein the first component is hermetically connected to the base.
The electronic device according to claim 53, wherein the second side surface of the second component is hermetically connected to the base to form a sealed housing between the first component and the second component space.
The electronic device according to claim 47, wherein the housing is provided with electronic components.
The electronic device according to claim 47, wherein the base of the precision device and the housing of the electronic device are detachably connected or integrally formed.
The electronic device according to claim 47, wherein the second component is close to the electronic component, or the second component is electrically connected to the electronic component.
The electronic device according to any one of claims 46-59, wherein the electronic device comprises at least one of the following: a photographing device, a laser radar, a mobile terminal, an ultrasonic instrument, a distance sensor, and an angle sensor.
An optical system applied to electronic equipment, characterized in that the optical system includes:

Base

The light-transmitting part is arranged on the base;

The optical module is arranged in the base, and there is a gap between the optical module and the light-transmitting part;

The light-transmitting adhesive layer fills the gap between the optical module and the light-transmitting part, so that the light-transmitting part and the optical module are substantially sealed.
The optical system of claim 59, wherein the light-transmitting adhesive layer comprises a non-heat-insulating adhesive layer.
A precision device, characterized in that it is applied to electronic equipment, and the precision device includes:

Base

The first component is arranged on the base;

The second part is arranged in the base, and there is a gap between the second part and the first part;

The adhesive layer fills the gap between the second component and the first component, so that the first component and the second component are substantially sealed.
The precision device according to claim 61, wherein the adhesive layer includes a non-heat-insulating adhesive layer.
An electronic device, characterized by comprising a housing and an optical system, the housing is used to fix the optical system; the optical system includes:

Base

The light-transmitting part is arranged on the base;

The optical module is arranged in the base, and there is a gap between the optical module and the light-transmitting part;

The light-transmitting adhesive layer fills the gap between the optical module and the light-transmitting part, so that the light-transmitting part and the optical module are substantially sealed.
The electronic device according to claim 63, wherein the light-transmitting adhesive layer comprises a non-heat-insulating adhesive layer.
An electronic device, characterized in that it comprises a casing and a precision device, the casing is used to fix the precision device, and the precision device comprises:

Base

The first component is arranged on the base;

The second part is arranged in the base, and there is a gap between the second part and the first part;

The adhesive layer fills the gap between the second component and the first component, so that the first component and the second component are substantially sealed.
The electronic device of claim 65, wherein the adhesive layer comprises a non-heat-insulating adhesive layer.