TWI515469B - Electronic device with camera - Google Patents

Electronic device with camera Download PDF

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Publication number
TWI515469B
TWI515469B TW102125636A TW102125636A TWI515469B TW I515469 B TWI515469 B TW I515469B TW 102125636 A TW102125636 A TW 102125636A TW 102125636 A TW102125636 A TW 102125636A TW I515469 B TWI515469 B TW I515469B
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TW
Taiwan
Prior art keywords
lens
electronic device
cover
adhesive
refractive index
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TW102125636A
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Chinese (zh)
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TW201508368A (en
Inventor
張志清
余政賢
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業成光電(深圳)有限公司
英特盛科技股份有限公司
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Publication of TW201508368A publication Critical patent/TW201508368A/en
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Publication of TWI515469B publication Critical patent/TWI515469B/en

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  • Optical Elements Other Than Lenses (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Description

具有攝像功能的電子裝置 Electronic device with camera function

本發明涉及一種具有攝像功能的電子裝置,尤其涉及一種能夠提高拍攝的影像品質的電子裝置。 The present invention relates to an electronic device having an imaging function, and more particularly to an electronic device capable of improving the quality of captured images.

現今的一些可擕式電子裝置(如手機和平板電腦等)的照相功能越來越普及。參考圖1,為一具有照相功能的電子裝置50的示意圖。鏡頭模組51的鏡頭510通常被安裝在蓋板52的背部,同時鏡頭510和蓋板20的之間設置有開設孔部的墊片53和外觀油墨54。外界光透過上述蓋板52和墊片53的通孔後穿過鏡頭510。 The camera functions of some portable electronic devices (such as mobile phones and tablets) are becoming more and more popular. Referring to Figure 1, a schematic diagram of an electronic device 50 having a camera function is shown. The lens 510 of the lens module 51 is usually mounted on the back of the cover 52, and a spacer 53 having an opening portion and an appearance ink 54 are disposed between the lens 510 and the cover 20. External light passes through the through holes of the cover 52 and the spacer 53 and passes through the lens 510.

然而,上述設計中,外界光在穿透蓋板52後容易在其與孔部連接處發生反射,同時透過孔部的光在通孔與鏡頭510的連接處也容易發生反射,造成外界光進入到鏡頭的透光率降低(可見光的反射率大約為9-10%),同時導致拍攝的影響品質下降。為了提升拍攝的影像品質,現有技術主要通過分別在蓋板和鏡頭與上述孔部的連接處鍍抗反射膜55來減少上述反射(可見光的反射率通常可低至3%),進而提高透光率的同時改善影像鬼影以及雜散光。然而,上述鍍膜的成本較高,造成電子裝置的成本升高,這對於短生命週期的電子裝置是不划算的。 However, in the above design, the external light is easily reflected at the junction with the hole portion after penetrating the cover plate 52, and the light transmitted through the hole portion is also easily reflected at the connection between the through hole and the lens 510, thereby causing external light to enter. The light transmittance to the lens is reduced (the reflectance of visible light is about 9-10%), and the quality of the effect of shooting is degraded. In order to improve the image quality of the photographing, the prior art mainly reduces the above reflection (the reflectance of visible light is usually as low as 3%) by plating the anti-reflection film 55 at the joint between the cover plate and the lens and the above-mentioned hole portion, thereby improving the light transmission. The rate also improves image ghosting and stray light. However, the cost of the above coating is high, resulting in an increase in the cost of the electronic device, which is not cost effective for short life cycle electronic devices.

有鑒於此,有必要提供一種電子裝置,其能夠提高透光率且成本 相對較低。 In view of this, it is necessary to provide an electronic device capable of improving light transmittance and cost. relatively low.

本發明提供一種電子裝置,包括一鏡頭模組及一蓋板,該鏡頭模組安裝於蓋板的背部且包括一鏡頭,該鏡頭模組的鏡頭通過透明黏貼劑固定連接至上述蓋板的背部,該透明黏貼劑的折射率與上述蓋板和鏡頭的折射率相近。 The present invention provides an electronic device including a lens module and a cover plate. The lens module is mounted on the back of the cover plate and includes a lens. The lens of the lens module is fixedly connected to the back of the cover plate by a transparent adhesive. The refractive index of the transparent adhesive is similar to the refractive index of the cover plate and the lens.

本發明提供的電子裝置的製造成本相對低廉,且能夠在提高透光率的同時改善影像鬼影以及雜散光。 The electronic device provided by the present invention is relatively inexpensive to manufacture, and can improve image ghosting and stray light while improving light transmittance.

100‧‧‧電子裝置 100‧‧‧Electronic devices

10‧‧‧鏡頭模組 10‧‧‧Lens module

11‧‧‧鏡頭 11‧‧‧ lens

20‧‧‧蓋板 20‧‧‧ Cover

30‧‧‧透明黏貼劑 30‧‧‧Transparent adhesive

40‧‧‧油墨層 40‧‧‧Ink layer

41‧‧‧通孔 41‧‧‧through hole

圖1係現有具有攝像功能的電子裝置的部分剖視圖,其示意出鏡頭和蓋板。 1 is a partial cross-sectional view of an existing electronic device having an imaging function, which illustrates a lens and a cover.

圖2係本發明一較佳實施方式的電子裝置的部分剖視圖,其示意出鏡頭和蓋板。 2 is a partial cross-sectional view of an electronic device in accordance with a preferred embodiment of the present invention, illustrating a lens and a cover.

圖2為本發明一較佳實施方式電子裝置100的立體圖。電子裝置100包括一鏡頭模組10及一透明蓋板20,其中該蓋板20可為單一元件,也可為設置於該電子裝置100前方的觸控面板的一部分。鏡頭模組10包括一鏡頭11,其中該鏡頭11和蓋板20主要成分為SiO2,通常其折射率大致為1.5。 2 is a perspective view of an electronic device 100 in accordance with a preferred embodiment of the present invention. The electronic device 100 includes a lens module 10 and a transparent cover 20 . The cover 20 can be a single component or a part of the touch panel disposed in front of the electronic device 100 . The lens module 10 includes a lens 11, wherein the lens 11 and the cover plate 20 are mainly composed of SiO2, and generally have a refractive index of approximately 1.5.

在本發明中,該電子裝置100通過透明塑膠黏貼劑30將鏡頭模組10的鏡頭11黏貼固定至上述蓋板20的背部。該黏貼劑30的的面積大於上述鏡頭11的與黏貼劑30臨近表面面積,使得黏貼劑30能夠完全覆蓋於該鏡頭11上。在本實施方式當中,可在真空環境下貼合上述鏡頭模組10至蓋板20上並通過加壓脫泡等方式來克服空氣 進入上述鏡頭模組10和蓋板20之間。該透明黏貼劑30與上述鏡頭11和蓋板20的折射率相近。在較佳實施方式當中,該黏貼劑30的折射率介於鏡頭11和蓋板20的折射率之間。 In the present invention, the electronic device 100 adheres and fixes the lens 11 of the lens module 10 to the back of the cover 20 through the transparent plastic adhesive 30. The area of the adhesive 30 is larger than the surface area of the lens 11 adjacent to the adhesive 30, so that the adhesive 30 can completely cover the lens 11. In the present embodiment, the lens module 10 can be attached to the cover plate 20 in a vacuum environment and overcome by air by pressure defoaming or the like. Entering between the lens module 10 and the cover 20 described above. The transparent adhesive 30 has a refractive index close to that of the lens 11 and the cover 20 described above. In a preferred embodiment, the adhesive 30 has a refractive index that is between the refractive indices of the lens 11 and the cover 20.

與現有技術先比,本發明的黏貼劑30的折射率大於空氣的折射率(空氣的折射率約為1),能夠使得外界光在鏡頭11和蓋板20與黏貼劑30的連接處的反射率降低,進而提高透光率的同時改善影像鬼影以及雜散光。根據實驗測試,上述結構的電子裝置100對於可見光反射率低至4%。 Compared with the prior art, the adhesive 30 of the present invention has a refractive index greater than that of air (the refractive index of air is about 1), which enables external light to be reflected at the junction of the lens 11 and the cover 20 and the adhesive 30. The rate is reduced, thereby improving the light transmittance while improving image ghosting and stray light. According to experimental tests, the electronic device 100 of the above structure has a reflectance of visible light as low as 4%.

在另一實施方式當中,該蓋板20安裝鏡頭模組10的鏡頭11位置設置有一油墨層40,用於提升該電子裝置100的外觀效果。該油墨層40中間形成一通孔41,該通孔41的尺寸大於上述鏡頭11的尺寸。上述黏貼劑30正對該鏡頭11的部分收容於該通孔41內,進而允許外界光穿透該通孔41內的黏貼劑30部分後進入鏡頭11內。 In another embodiment, the cover lens 20 is mounted with the ink layer 40 at the position of the lens 11 of the lens module 10 for improving the appearance of the electronic device 100. A through hole 41 is formed in the middle of the ink layer 40, and the size of the through hole 41 is larger than the size of the lens 11 described above. The adhesive 30 is received in the through hole 41 in the portion of the lens 11 to allow external light to pass through the portion of the adhesive 30 in the through hole 41 and enter the lens 11.

儘管對本發明的優選實施方式進行了說明和描述,但是本領域的技術人員將領悟到,可以作出各種不同的變化和改進,這些都不超出本發明的真正範圍。因此期望,本發明並不局限於所公開的作為實現本發明所設想的最佳模式的具體實施方式,本發明包括的所有實施方式都有所附權利要求書的保護範圍內。 While the preferred embodiment of the invention has been shown and described, it will be understood Therefore, it is intended that the invention not be limited to the embodiments disclosed herein,

100‧‧‧電子裝置 100‧‧‧Electronic devices

10‧‧‧鏡頭模組 10‧‧‧Lens module

11‧‧‧鏡頭 11‧‧‧ lens

20‧‧‧蓋板 20‧‧‧ Cover

30‧‧‧透明黏貼劑 30‧‧‧Transparent adhesive

40‧‧‧油墨層 40‧‧‧Ink layer

41‧‧‧通孔 41‧‧‧through hole

Claims (3)

一種電子裝置,包括一鏡頭模組及一蓋板,該鏡頭模組安裝於蓋板的背部且包括一鏡頭,其改良在於:該鏡頭模組的鏡頭通過透明黏貼劑固定連接至上述蓋板的背部,該透明黏貼劑的折射率與上述蓋板和鏡頭的折射率相近,該黏貼劑的折射率介於鏡頭和蓋板的折射率之間。 An electronic device includes a lens module and a cover plate mounted on the back of the cover plate and including a lens, wherein the lens of the lens module is fixedly connected to the cover plate by a transparent adhesive On the back side, the refractive index of the transparent adhesive is similar to the refractive index of the cover plate and the lens, and the refractive index of the adhesive is between the refractive index of the lens and the cover. 如申請專利範圍第1項所述之電子裝置,其中:該鏡頭模組的鏡頭和蓋板的材質為玻璃。 The electronic device of claim 1, wherein the lens and the cover of the lens module are made of glass. 如申請專利範圍第1項所述之電子裝置,其中:該蓋板安裝鏡頭模組的鏡頭位置設置有一油墨層,其中該油墨層中間形成一通孔,上述黏貼劑部分位元於該通孔內。 The electronic device of claim 1, wherein: the lens mounting lens module is provided with an ink layer at a lens position, wherein a through hole is formed in the ink layer, and the adhesive portion is in the through hole. .
TW102125636A 2013-06-13 2013-07-17 Electronic device with camera TWI515469B (en)

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Application Number Priority Date Filing Date Title
CN2013102325183A CN103338324A (en) 2013-06-13 2013-06-13 Electronic device with camera function

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TW201508368A TW201508368A (en) 2015-03-01
TWI515469B true TWI515469B (en) 2016-01-01

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Publication number Priority date Publication date Assignee Title
CN103676068A (en) * 2013-12-20 2014-03-26 信利半导体有限公司 Microphotographic device
CN113140165B (en) * 2021-04-14 2022-07-12 武汉华星光电半导体显示技术有限公司 Display device and manufacturing method thereof

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JP2002189151A (en) * 2000-10-11 2002-07-05 Matsushita Electric Ind Co Ltd Optical receiving module, optical transmitting and receiving module, and method for manufacturing
US6744109B2 (en) * 2002-06-26 2004-06-01 Agilent Technologies, Inc. Glass attachment over micro-lens arrays
KR20070045922A (en) * 2005-10-28 2007-05-02 마츠시타 덴끼 산교 가부시키가이샤 Manufacturing method for a solid-state imaging apparatus, and the solid-state imaging apparatus
JP2009088407A (en) * 2007-10-02 2009-04-23 Panasonic Corp Solid-state image sensing device and method for manufacturing same
JP5434252B2 (en) * 2009-05-14 2014-03-05 ソニー株式会社 Solid-state imaging device, manufacturing method thereof, and electronic apparatus

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