WO2021228204A1

WO2021228204A1 - Electronic device

Info

Publication number: WO2021228204A1
Application number: PCT/CN2021/093659
Authority: WO
Inventors: 钟培强; 陈灿; 张洪岽; 吴伟
Original assignee: 华为技术有限公司
Priority date: 2020-05-13
Filing date: 2021-05-13
Publication date: 2021-11-18
Also published as: CN113676793A

Abstract

Provided is an electronic device, which relates to the technical field of communications and is used to solve the problems in the prior art of complex wiring and high networking costs for realizing full mesh networking. The electronic device comprises a first processing chip, a second processing chip, and a first port, a second port, a third port and a fourth port which are arranged in order, wherein the first processing chip is coupled to the first port, and the first processing chip is further coupled to the fourth port; the second processing chip is coupled to the second port, and the second processing chip is further coupled to the third port; the first port, the second port, the third port and the fourth port comprise optical fiber channels which are used for connecting to pluggable optical modules; and the pluggable optical modules can be connected to other electronic devices by means of optical fiber cables.

Description

An electronic device

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 202010402864.1, and the application name is "an electronic device" on May 13, 2020, the entire content of which is incorporated into this application by reference.

Technical field

This application relates to the field of communication technology, and in particular to an electronic device.

Background technique

In order to optimize the overall performance of a network system including multiple nodes, the current networking technology generally adopts a full mesh networking mode, that is, as shown in Figure 1, between any two nodes in the network Connected. For example, multiple processing chips included in the same server in a network system are interconnected, a server is connected to a switch, a memory is connected to a switch, a switch is connected to a switch, or multiple storage units in a storage array are connected. When the number of network devices in the network system is large, the wiring of the fully connected networking mode is more complicated, and the networking is prone to errors.

Exemplarily, in the current 100G bandwidth networking, a four-channel small form-factor pluggable optical module (Quad Small Form-factor Pluggable, QSFP) can be used to realize a fully connected networking. If low-density QSFP28 ports are used, the point-to-point interconnection of four nodes requires four external cables; if the number of nodes is increased by one, four external cables are required, which means that the connection complexity is doubled and the network wiring is complicated. And the cable cost is higher.

Another existing implementation scheme is to solve the interconnection problem by configuring an external switch, that is, all nodes are connected to the external switch through external cables, and the interconnection of the nodes is realized by the internal lines of the external switch. However, this solution still needs to be configured with the same number of external cables as the number of nodes, in addition to the need to configure external switches, and the networking cost is relatively high.

Summary of the invention

The present application provides an electronic device, which solves the problems of complex wiring and high networking cost for realizing full-connected networking in the prior art.

In order to achieve the above objectives, this application adopts the following technical solutions:

In a first aspect, an electronic device is provided. The electronic device includes a first processing chip and a second processing chip, and a first port, a second port, a third port, and a fourth port that are arranged in sequence; a first processing chip Coupled with the first port, the first processing chip is also coupled with the fourth port; the second processing chip is coupled with the second port, and the second processing chip is also coupled with the third port; the first port, the second port, the third port, and The fourth port includes an optical fiber channel for connecting a pluggable optical module, and the pluggable optical module can be connected to other electronic devices through an optical fiber cable.

In the above technical solution, the cross interconnection of four nodes can be realized through the wiring mode of the cross interconnection of two ports, for example, the third port and the fourth port are cross interconnected to the first processing chip and the second processing chip, That is, the second processing chip is coupled to the third port, and the first processing chip is coupled to the fourth port, so that the external pluggable optical module is connected through the two ports, and other electronic devices can be connected through the optical fiber cable through the pluggable optical module. Realize the fully connected network of four nodes. Compared with the prior art, the cost of external cables can be saved, the complexity of networking and wiring can be reduced, and errors in the insertion and removal of optical modules can be avoided.

In a possible design manner, the first port is adjacent to the second port, and the third port is adjacent to the fourth port. In the above possible implementation manners, two adjacent ports are cross-connected with different chips on the electronic device, so that after the two adjacent ports are connected to the pluggable optical module, they can realize the connection to the external communication node. Cross interconnection, thereby reducing the external cable cost and wiring complexity of the network.

In a possible design manner, the electronic device further includes: when the first port, the second port, the third port, and the fourth port include four-core fiber channels, the first port and the second port pass through the first double density The four-channel small pluggable optical module QSFP-DD is connected with other electronic devices; the third port and the fourth port are connected with other electronic devices through the second QSFP-DD.

In the above possible implementation manners, for the ports of the four-core fiber channel, the QSFP-DD optical module can be used for networking. The first port and the second port connect the first processing chip and the second processing chip through the first QSFP-DD optical module. The chips are respectively connected to two other communication nodes in the network, for example, node 3 and node 4 (the first processing chip is connected to node 3, and the second processing chip is connected to node 4). And because the third port and the fourth port are cross-connected with the first processing chip and the second processing chip, that is, the first processing chip and the second processing chip can be connected through the second QSFP-DD optical module through the third port and the fourth port. The second processing chip is cross-connected to the two other communication nodes in the network, for example, the first processing chip is connected to the node 4, and the second processing chip is connected to the node 3. In this way, the performance of the network can be improved by saving external cables.

In a possible design manner, the electronic device further includes: when the first port, the second port, the third port, and the fourth port include four-core fiber channels, the first port and the second port pass through the first four-channel The small pluggable optical module QSFP28 and the second QSFP28 are connected with other electronic devices; the third port and the fourth port are connected with other electronic devices through the third QSFP28 and the fourth QSFP28.

In the foregoing possible implementation manners, for the ports of the four-core optical fiber channel, the networking can be performed through the double-layer QSFP28 optical module, that is, the two adjacent ports are respectively inserted into the two QSFP28 optical modules with the double-layer connector. For example, the first port and the second port connect the first processing chip and the second processing chip to two other communication nodes in the network through two QSFP28 optical modules, for example, node 3 and node 4 (the first processing chip passes through The first QSFP28 is connected to the node 3, and the second processing chip is connected to the node 4 through the second QSFP28). And because the third port and the fourth port are cross-connected with the first processing chip and the second processing chip, that is, the third port and the fourth port can connect the first processing chip and the second processing chip through two QSFP28 optical modules. Cross-connected to the two other communication nodes in the network, for example, the first processing chip connects to the node 4 through the third QSFP28, and the second processing chip connects to the node 3 through the fourth QSFP28. In this way, the performance of the network can be improved by saving external cables.

In a possible design manner, the electronic device is a storage array, a processor cluster, a server cluster, or a node array.

In the foregoing possible implementation manners, the foregoing electronic device may specifically be a switch, a router, a storage array, a processor cluster, a server cluster, or a node array, etc. The electronic device provided in the present application can realize two-by-two among multiple nodes in the network. The communication interconnection between the two can improve the performance of the network and the reliability of the communication, and save the cost of the network.

Description of the drawings

FIG. 1 is a schematic diagram of a fully connected networking structure provided by an embodiment of the application;

FIG. 2 is a schematic diagram of comparison between two kinds of pluggable optical modules provided by an embodiment of the application;

Figure 3 is a schematic diagram of a network connection between electronic devices;

Figure 4a is a schematic diagram of another networking connection between electronic devices;

Figure 4b is a schematic diagram of another networking connection between electronic devices;

FIG. 5 is a schematic structural diagram of an electronic device provided by an embodiment of this application;

FIG. 6 is a schematic diagram of a connection between electronic devices according to an embodiment of the application;

FIG. 7 is a schematic diagram of another connection between electronic devices according to an embodiment of the application.

Detailed ways

Hereinafter, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present embodiment, unless otherwise specified, "plurality" means two or more.

It should be noted that in this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or illustrations. Any embodiment or design solution described as "exemplary" or "for example" in this application should not be construed as being more preferable or advantageous than other embodiments or design solutions. To be precise, words such as "exemplary" or "for example" are used to present related concepts in a specific manner.

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

In the networking of the communication network, the fully connected method shown in Figure 1 enables any two nodes to be connected. Therefore, the networking method is the most efficient, which can make the multiple electronic devices in the network system communicate with each other. Both can realize mutual access and data transmission.

Exemplarily, the network system may include multiple switches, one switch may include multiple switching chips, and every two switching chips in the multiple switches may be interconnected by cables. Alternatively, the network system includes a server cluster composed of multiple servers, or a storage array composed of multiple storage units. Each server or storage unit may include multiple processing chips, and any two processing chips in the network system They can be interconnected by cables. In addition, there may be an interconnection between a memory and a switch, or an interconnection between a processor and a switch, and so on.

In the current 100G bandwidth networking, pluggable optical modules are usually used to connect other electronic devices through fiber optic cables, such as Quad Small Form-factor Pluggable (QSFP) or double-density four-channel small Pluggable optical modules (Quad Small Form Factor Pluggable-Double Density, QSFP-DD), etc.

Among them, QSFP is a compact, hot-swappable transceiver that can be used for data communication. QSFP has four independent full-duplex transceiver channels, and each channel supports transmission rates from 100Mb/s to 10Gb/s. In addition, QSFP+ optical modules and QSFP28 optical modules have been expanded on the basis of QSFP technology. Among them, the four channels of QSFP+ can support 10Gb/s transmission rate, which is an enhanced version of QSFP. Compared with QSFP, QSFP+ has a higher bandwidth. The QSFP28 optical module is a high-density, high-speed transmission transceiver designed for 100Gb/s applications. It has the same form factor as the QSFP+ transceiver. QSFP28 provides four-channel high-speed signals, and the data rate of each channel ranges from 25Gb/s to 40Gb/s, which can enhance the transmission requirements of 100Gb/s Ethernet (4×25Gb/s).

QSFP-DD has eight independent full-duplex transceiver channels, each with a transmission rate of up to 25Gb/s (NRZ modulation) or 50Gb/s (PAM4 modulation), providing up to 200Gb/s or 400Gb/s aggregation solutions . QSFP-DD can achieve up to 14.4Tb/s aggregate bandwidth in a single switch slot.

As shown in Figure 2, the system port width of QSFP-DD and QSFP+/QSFP28 optical modules are the same, while the port density of QSFP-DD is twice that of QSFP28 optical modules. Because each QSFP28 optical module can accommodate four optical fiber channels, and the QSFP-DD optical module can accommodate eight optical fiber channels. As a result, QSFP-DD doubles the number of ASIC (Application Specific Integrated Circuit, ASIC) ports of the existing interfaces it supports, and QSFP-DD is more conducive to the networking and interconnection of a large number of nodes.

Usually in the networking between electronic devices, QSFP28 optical modules can be used to achieve networking interconnection. Exemplarily, as shown in FIG. 3, a processing chip 1 and a processing chip 2 are configured on the first electronic device, and a processing chip 3 and a processing chip 4 are configured on the second electronic device. On the first electronic device, processing chip 1 is connected to port 1 and port 2 through wiring, processing chip 2 is connected to port 3 and port 4, processing chip 1 and processing chip 2 can be connected through internal wiring. On the second electronic device, the processing chip 3 is connected to the port 1 and the port 2 through wiring, the processing chip 4 is connected to the port 3 and the port 4, and the processing chip 3 and the processing chip 4 can be connected through the internal wiring. As shown in Figure 3, four QSFP28 optical modules and four external optical cables can be used to interconnect the processing chip 1, processing chip 2, processing chip 3, and processing chip 4 in pairs to achieve a fully connected networking. Wherein, the port 1 of the first electronic device can be connected with the port 2 of the second electronic device, the port 2 of the first electronic device can be connected with the port 4 of the second electronic device, and the port 3 of the first electronic device can be connected with the second electronic device. The port 3 of the electronic device is connected, and the port 4 of the first electronic device is connected with the port 1 of the second electronic device.

Combined with the network connection layout diagram, it can be seen that the four nodes are interconnected point-to-point through four QSFP28 optical modules and four external optical fiber cables. However, the four external cables are arranged crosswise, the wiring is complicated, and it is easy to make mistakes when plugging and unplugging the QSFP28 optical module. In addition, when the number of electronic equipment or the number of processing chips inside the electronic equipment increases, the number of nodes in the network increases, the external cables required for networking will double, the complexity of wiring doubles, and the cost will be higher. .

In addition, QSFP-DD optical modules can usually be used to achieve network interconnection. Exemplarily, as shown in FIGS. 4a and 4b, a processing chip 1 and a processing chip 2 are configured on the first electronic device, and a processing chip 3 and a processing chip 4 are configured on the second electronic device. As shown in Figure 4a, on the first electronic device, processing chip 1 is connected to port 1 and port 2 through wiring, processing chip 2 is connected to port 3 and port 4, processing chip 1 and processing chip 2 can be connected through internal wiring. On the second electronic device, the processing chip 3 is connected to the port 1 and the port 2 through wiring, the processing chip 4 is connected to the port 3 and the port 4, and the processing chip 3 and the processing chip 4 can be connected through the internal wiring. Through a QSFP-DD optical module and an external optical fiber cable, the port 1 and port 2 of the first electronic device are connected with the port 1 and port 2 of the second electronic device. Among them, due to the symmetry of the internal arrangement of the optical fiber cables connected to the optical module, the port 1 of the first electronic device is connected to the port 1 of the second electronic device, and the port 2 of the first electronic device is connected to the port 2 of the second electronic device. . In addition, the port 3 and port 4 of the first electronic device are connected with the port 3 and port 4 of the second electronic device through a QSFP-DD optical module and an external optical fiber cable. Wherein, the port 3 of the first electronic device is connected with the port 3 of the second electronic device, and the port 4 of the first electronic device is connected with the port 4 of the second electronic device. In this way, the processing chip 1 and the processing chip 3 are interconnected, the processing chip 2 and the processing chip 4 are interconnected, the processing chip 1 and the processing chip 4 are not interconnected, and the processing chip 2 and the processing chip 3 are not interconnected. Therefore, although the number of external cables and wiring complexity are reduced by using QSFP-DD optical modules, the two-to-two interconnection of four nodes cannot be realized, and the networking performance is poor.

Therefore, the implementation of this application provides an electronic device with cross-wiring of ports and a networking method. Through the cross interconnection of the port wiring inside the electronic device, port stacking is used to increase the transmission channel density (for example, QSFP-DD optical module or QSFP28). Double-layer connectors, etc.) to achieve node interconnection. So as to solve the problems of complicated wiring of the existing port networking technology, high external cable cost or poor network performance.

An embodiment of the present application provides an electronic device with cross-wiring of ports. The electronic device includes a first processing chip and a second processing chip, and a first port, a second port, a third port, and a fourth port arranged in sequence. The first processing chip is coupled with the first port, and the first processing chip is also coupled with the fourth port. The second processing chip is coupled with the second port, and the second processing chip is also coupled with the third port. The first port, the second port, the third port, and the fourth port include fiber channels for connecting pluggable optical modules. The pluggable optical modules can be connected to other electronic devices through fiber optic cables.

Wherein, the first port may be adjacent to the second port, and the third port may be adjacent to the fourth port.

It should be noted that coupling refers to the process of energy propagation from one medium (for example, a metal wire, optical fiber) to another medium. Coupling refers to the transfer of energy from one circuit part to another, which can be achieved through direct electrical connection or indirect connection. The embodiment of the present application does not specifically limit the coupling form, and the following embodiments only exemplarily express the coupling relationship by connecting or interconnecting.

As shown in FIG. 5, the processing chip 1 and the processing chip 2 are deployed on the electronic device, and the first port, the second port, the third port, and the fourth port of the electronic device are 1, 2, and 3 in FIG. 5, respectively. And 4, the processing chip 1 and the processing chip 2 are interconnected to the above-mentioned four ports through the wiring cross. That is, the processing chip 1 is coupled to the port 1, and the processing chip is also coupled to the port 4. The processing chip 2 is coupled to the port 2, and the processing chip 2 is also coupled to the port 3.

Therefore, the electronic device can be connected to the pluggable optical module at the first port-1, the second port-2, the third port-3, and the fourth port-4, and other electronic devices can be connected through the optical fiber cable. Exemplarily, as shown in FIG. 6, the electronic device 1 may be connected to the processing chip 3 and the processing chip 4 on the electronic device 2 through a pluggable optical module and an external optical fiber cable.

In the above-mentioned electronic device 1, the cross interconnection of four nodes can be realized through the wiring manner of the port cross interconnection. Therefore, the cost of external cables can be saved, the wiring complexity can be reduced, and plugging and unplugging errors can be avoided.

Further, when the first port, the second port, the third port, and the fourth port include four-core optical fiber channels, the first port and the second port are connected to the QSFP-DD through the first double-density four-channel small pluggable optical module QSFP-DD Connect with other electronic devices. The third port and the fourth port communicate with other electronic devices through the second QSFP-DD.

Exemplarily, as shown in FIG. 6, the

ports

1, 2, 3, and 4 on the electronic device 1 are all four-core fiber channels, and the first QSFP-DD is inserted into the

ports

1 and 2 on the electronic device 1. The QSFP-DD at the other end of the optical fiber cable connected with the first QSFP-DD is inserted into port 1 and port 2 on the electronic device 2. Insert the second QSFP-DD into port 3 and port 4 on the electronic device 1, and insert the QSFP-DD at the other end of the optical fiber cable connected with the second QSFP-DD into the port 3 and port 4 on the electronic device 2.

Therefore, the processing chip 1 on the electronic device 1 is connected to the processing chip 3 on the electronic device 2 through the first QSFP-DD and the external cable, and the processing chip 2 on the electronic device 1 is connected to the processing chip 3 on the electronic device 1 through the first QSFP-DD and the external cable. The processing chip 4 on the electronic device 2 is connected; the processing chip 1 on the electronic device 1 is connected with the processing chip 4 on the electronic device 2 through the second QSFP-DD and an external cable, and the processing chip 2 on the electronic device 1 passes through the second The QSFP-DD and external cables are connected to the processing chip 3 on the electronic device 2. Since the QSFP-DD single port is a combination of two 100Gb/s transmission rates, it is combined into a 200Gb/s port in an asymmetric manner.

It can be seen that the above-mentioned electronic equipment provided by the present application can realize a fully connected network between four nodes through two pluggable optical modules and corresponding two external cables, reducing the number of external cables, and Reduce the wiring complexity of external cables and save the cost of networking. In addition, when a node in the network is damaged or access is abnormal, this networking method will not affect the communication between other nodes in the network, and the reliability of the networking is also guaranteed.

In another possible implementation manner, when the first port, the second port, the third port, and the fourth port include four-core optical fiber channels, the first port and the second port pass through the first four-channel small pluggable optical fiber channel. The module QSFP28 and the second QSFP28 communicate with other electronic devices. The third port and the fourth port communicate with other electronic devices through the third QSFP28 and the fourth QSFP28.

In other words, the network can be realized through the QSFP28 double-layer connector composed of two QSFP28s. For example, the first QSFP28 and the second QSFP28 may be combined into a double-layer connector, and the third QSFP28 and the fourth QSFP28 may be combined into a double-layer connector. Insert the first QSFP28 and the second QSFP28 into the first port and the second port of the first electronic device, respectively, and insert the third QSFP28 and the fourth QSFP28 into the third port and the fourth port of the first electronic device, respectively, so as to communicate with other electronic devices. The equipment is connected.

The above-mentioned electronic equipment provided by the present application can realize a fully connected network between four nodes through a combination of two double-layer connectors and corresponding external cables, reduce the number of external cables, and reduce the number of external cables. The wiring complexity of external cables saves the cost of networking.

In another possible implementation manner, when the number of nodes in the network increases, for example, the network also includes a processing chip 5 and a processing chip 6. Therefore, the number of ports required to realize a fully connected network also needs to be increased, and

ports

1, 2, 3, 4, 5, 6, 7, and 8 need to be used on electronic devices. Among them, the two processing chips on the electronic device can be connected in pairs with 8 ports arranged in sequence through wiring, and there are two adjacent ports to achieve cross interconnection. For example, as shown in FIG. 7, on the electronic device 1 The traces of port 7 and port 8 are cross-connected, that is, the processing chip 1 on the electronic device 1 is coupled to

ports

1, 3, 5, and 8 respectively, and the processing chip 2 is coupled to

ports

2, 4, 6 and 7 respectively. The port routing mode of other electronic devices in the network is also the same as that of electronic device 1, so that according to the networking diagram shown in Figure 7, the full connection between the 8 processing chips on

electronic devices

1, 2 and 3 can be realized. Networking.

It can be seen from Figure 7 that by connecting an external optical fiber cable with a pluggable optical module, processing chip 1 and processing chip 4 can be connected, processing chip 2 and processing chip 3 are connected, processing chip 1 and processing chip 3 are connected, processing chip 2 is connected with processing chip 4, processing chip 1 is connected with processing chip 5, processing chip 2 is connected with processing chip 6, processing chip 1 is connected with processing chip 6, processing chip 2 is connected with processing chip 5, processing chip 3 is connected with processing chip 6 Connected, the processing chip 4 and the processing chip 5 are connected, the processing chip 3 and the processing chip 5 are connected, and the processing chip 4 and the processing chip 6 are connected.

It should be noted that the above-mentioned cross-wiring ports on the electronic device are only exemplary, and it is not necessary to follow the above-mentioned methods. For example, the ports 5 and 6 on the electronic device can also be cross-wiring, i.e. processing chip 1. Coupling with port 6, coupling of processing chip 2 with port 5, or cross-wiring of two other adjacent ports can realize the technical solution of the present application.

The above electronic equipment provided by this application can realize a fully connected network between six nodes through six pluggable optical modules and corresponding six external cables, reducing the number of external cables and reducing the number of external cables. The cabling complexity of the cable saves the cost of networking.

Further, the above-mentioned electronic device may specifically be a switch, a router, a storage array, a processor cluster, a server cluster, or a node array, etc. The electronic device provided in this application can realize the communication between two of multiple nodes in the network. Connect, improve the performance of the network, and save the cost of the network.

Finally, it should be noted that the above are only specific implementations of this application, but the scope of protection of this application is not limited to this. Any changes or substitutions within the technical scope disclosed in this application shall be covered by this application. Within the scope of protection applied for. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

An electronic device, characterized in that the electronic device includes a first processing chip and a second processing chip, and a first port, a second port, a third port, and a fourth port arranged in sequence;

The first processing chip is coupled to the first port, and the first processing chip is also coupled to the fourth port;

The second processing chip is coupled to the second port, and the second processing chip is also coupled to the third port;

The first port, the second port, the third port, and the fourth port include fiber channels for connecting pluggable optical modules, and the pluggable optical modules can be connected to other ports through fiber optic cables. Electronic equipment.
The electronic device according to claim 1, wherein the first port is adjacent to the second port, and the third port is adjacent to the fourth port.
The electronic device according to claim 1 or 2, wherein the electronic device further comprises:

When the first port, the second port, the third port, and the fourth port include four-core optical fiber channels, the first port and the second port pass through the first double-density four-channel compact The pluggable optical module QSFP-DD is connected with other electronic equipment;

The third port and the fourth port communicate with other electronic devices through a second QSFP-DD.
The electronic device according to claim 1 or 2, wherein the electronic device further comprises:

When the first port, the second port, the third port, and the fourth port include four-core fiber channels, the first port and the second port are small and pluggable through the first four-channel Unplug the optical module QSFP28 and the second QSFP28 to communicate with other electronic devices;

The third port and the fourth port communicate with other electronic devices through the third QSFP28 and the fourth QSFP28.
The electronic device according to claim 1 or 2, wherein the electronic device is a storage array, a processor cluster, a server cluster, or a node array.