CN102103236A - Double-channel compact small-sized pluggable optical module - Google Patents
Double-channel compact small-sized pluggable optical module Download PDFInfo
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- CN102103236A CN102103236A CN2011100480645A CN201110048064A CN102103236A CN 102103236 A CN102103236 A CN 102103236A CN 2011100480645 A CN2011100480645 A CN 2011100480645A CN 201110048064 A CN201110048064 A CN 201110048064A CN 102103236 A CN102103236 A CN 102103236A
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Abstract
The invention discloses a double-channel compact small-sized pluggable optical module, and relates to an optical communication technology, in particular to a compact small-sized pluggable optical receiving and transmitting module. The technical key points are that: two groups of conventional free space coupling light receiving and transmitting module interface components of TO56/TO46 size chip packages are adopted; signal switching between the two groups of light receiving and transmitting module interface components and a printed circuit board (PCB) is realized through a soft board; and the two groups of light receiving and transmitting module interface components are arranged in a module shell in parallel. The module has the advantages of flexibly meeting the customized design requirements of different optical device chip combinations, along with low cost and small size, and is mainly used for photoelectric signal switching in the field of optical communication.
Description
Technical field
The present invention relates to optical communication technique, especially a kind of compact pluggable light transceiving module.
Background technology
The abbreviation definition:
BOSA:(Bi-directional Optical Sub-Assembly) optical transceiver module interface module;
CSFP:(Compact Small From-Factor Pluggable) compact pluggable optical module;
SFP:(Small From-Factor Pluggable) SFP optical module;
MSA:(Multi-Source Agreement) multi-source agreement;
PLC:(Planar optical waveguide) planar optical waveguide;
PCB:(Printed Circuit Board) printed circuit board;
TO38/TO56/TO46: the packing forms of the different mechanical dimensions of optical device chip, more expensive being of little use of the less price of TO38 size wherein, TO56 and TO46 are mechanical dimension's structure commonly used.Be the optical transceiver module interface module after the TO optical chip is packaged into BOSA.
Along with the development of optical fiber communication, optical transmission system is had higher requirement to optical module.Optical module develops to low cost, small size, high capacity direction gradually.In order to reach high capacity requirement and undersized requirement, twin-channel CSFP transceiver is realized the bidirectional transmit-receive of following two passages of original same overall dimensions, thereby and then makes original SFP panel space obtain double utilization to have improved port utilization ratio.These highly integrated CSFP/CSFF bi-directional transceivers make network system supplier double port density, have improved data throughout, thereby have reduced network equipment cost.The composition of binary channels CSFP optical module is consistent with conventional SFP, mainly comprises: mechanical structured member, two optical transceiver module interface module, logic control element, Laser Drive and amplitude limit amplifying unit.Wherein, the cost of two optical transceiver module interface modules accounts for the chief component of whole C SFP optical module cost, has directly influenced the performance and the price of optical module.
CSFP MSA(Multi Source Agreement) League of Nations has defined and has adopted traditional SFP industrial standard overall dimensions single channel SFP MSA physical construction need realize the CSFP optical module of binary channels data transmission.
In order to satisfy the small size requirement, binary channels CSFP solution generally adopts the less PLC structured light transceiver module interface module of size at present, as Fig. 1, or the free space coupling light transceiver module interface module of TO38 encapsulation.
But it is high that currently used PLC technology light transmitting-receiving subassembly exists encapsulation technology to require, shortcomings such as the higher and design flexibility difference of cost, simultaneously, this light transmitting-receiving subassembly production and sell overseas enterprise's monopolization is all arranged.In addition, adopt PLC technology, laser instrument and light signal receiving end chip all need be installed on the fixed position of optical waveguide, need newly research and develop overall optical transceiver module interface module if need to change the chip model, can not satisfy the customization requirement.
Though the free space coupling light transceiver module interface module size of TO38 encapsulation is less, TO38 size optical chip can not use in optical modules such as the SFP of routine and SFF, and this has also caused its price higher, and encapsulation technology is immature.Simultaneously, utilize the BOSA structure of this TO38 size encapsulation also to be offbeat form, further increased the cost of optical module.
Compare with the optical transceiver module interface module that adopts the TO38 encapsulation with employing PLC technology, adopt the free space coupling light transmitting-receiving subassembly of traditional TO56/TO46 size Chip Packaging, be widely used in conventional optical module productions such as SFP, but CSFP for the binary channels data transmission, the optical transceiver module interface module that adopts this technology to encapsulate has the shortcoming that physical dimension is big and the optical receiving end chip pin can't directly be connected with PCB, and promptly enables direct the connection with PCB also will exist the part HW High Way can't match condition.
Summary of the invention
Consider traditional free space coupling light transceiver module interface module of TO56/TO46 size Chip Packaging, its chip size and packaging technology thereof are all very ripe, can satisfy the customization demand of the different optical device chip portfolios of client, and it is with low cost, the objective of the invention is defective, provide on the basis of the traditional free space coupling light transceiver module interface module that adopts TO56/TO46 size Chip Packaging that a kind of to have a cost low at prior art, size is little, can satisfy the binary channels compact pluggable optical module of the customization demand of the different optical device chip portfolios of client.
The technical solution used in the present invention is such: a kind of binary channels compact pluggable optical module, comprise the first optical transceiver module interface module, second optical transceiver module interface module and the pcb board, be provided with receiving end chip pin and transmitting terminal chip pin on two groups of optical transceiver module interface modules, it is characterized in that, also comprise soft board; The described first optical transceiver module interface module and the second optical transceiver module interface module parallel arranged, the receiving end chip pin place direction of two groups of optical transceiver module interface modules is identical, and the transmitting terminal chip pin place direction of two groups of optical transceiver module interface modules is identical; Described two groups of optical transceiver module interface modules all carry out signal exchange by soft board and pcb board.
Preferably, the described first optical transceiver module interface module is identical with the second optical transceiver module interface module specification.
Preferably, also comprise module housing, module housing comprises base and cover plate again; The described first optical transceiver module interface module, the second optical transceiver module interface module, pcb board and soft board are arranged in the base, and described cover plate is placed on the base.
Preferably, described optical transceiver module interface module comprises receiving end chip and transmitting terminal chip; Described receiving end Chip Packaging specification is TO46; Described transmitting terminal Chip Packaging specification is TO56.
Preferably, the receiving end chip pin unification of the described first optical transceiver module interface module and the second optical transceiver module interface module is towards the base bottom.
Preferably, the receiving end chip pin of the described first optical transceiver module interface module be connected to the first signal receiving interface on the pcb board by soft board, the transmitting terminal chip pin of the described first optical transceiver module interface module is connected to the first signal transmission interface on the pcb board by soft board.
Preferably, the receiving end chip pin of the described first optical transceiver module interface module is connected to the first signal receiving interface on the pcb board by soft board, and the transmitting terminal chip pin of the described first optical transceiver module interface module is directly connected to the first signal transmission interface on the pcb board.
Preferably, the receiving end chip pin of the described second optical transceiver module interface module is connected to secondary signal receiving interface on the pcb board by soft board, and the transmitting terminal chip pin of the described second optical transceiver module interface module is connected to secondary signal transmission interface on the pcb board by soft board.
Preferably, the receiving end chip pin of the described second optical transceiver module interface module is connected to secondary signal receiving interface on the pcb board by soft board, and the transmitting terminal chip pin of the described second optical transceiver module interface module is directly connected to the secondary signal transmission interface on the pcb board.
In sum, the invention has the beneficial effects as follows:
The present invention adopts cheap TO56/TO46 encapsulation free space coupling light transceiver module interface module to replace adopting in the industry the optical transceiver module interface module of PLC technology, has avoided employing PLC technology cost height, shortcomings such as design flexibility difference; The problems such as expensive and high encapsulation difficulty that adopt expensive TO38 structured light device to bring have also been avoided; Has the advantage that cost is low, size is little, can satisfy the customization design requirement of different optical device chip portfolios flexibly.
Description of drawings
The present invention will illustrate by example and with reference to the mode of accompanying drawing, wherein:
Fig. 1 is a PLC technology optical transceiver module interface module synoptic diagram.
Fig. 2 is a free space coupling light transceiver module interface module structural representation.
Fig. 3 is the first embodiment of the invention structural representation.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the second embodiment of the invention structural representation.
Fig. 6 is the vertical view of Fig. 5.
Mark among the figure: the receiving terminal chip pin 202 of the transmitting terminal chip pin 201 second optical transceiver module interface modules of the receiving terminal chip pin 102 second optical transceiver module interface modules of the transmitting terminal chip pin 101 first optical transceiver module interface modules of the first optical transceiver module interface module, 1 second optical transceiver module interface module, 2 pcb boards, 3 soft boards, 4 transmitting terminal chips, 5 receiving terminal chips, 6 filter plates, 7 light splitting pieces, 8 bases, 9 cover plates, 10 first optical transceiver module interface modules.
Embodiment
This paper Key Term is explained:
The base bottom: be interpreted as to be positioned at base, and that face relative with cover plate.
Sending direction: be interpreted as with electric signal to transfer the signal flow of light signal to consistent direction.
Receive direction: be interpreted as with light signal to transfer the signal flow of electric signal to consistent direction.
Disclosed all features in this instructions, or the step in disclosed all methods or the process except mutually exclusive feature and/or step, all can make up by any way.
Disclosed arbitrary feature in this instructions (comprising any accessory claim, summary and accompanying drawing) is unless special narration all can be replaced by other equivalences or the alternative features with similar purpose.That is, unless special narration, each feature is an example in a series of equivalences or the similar characteristics.
Traditional free space coupling light transceiver module interface module of the TO56/TO46 encapsulation that the present invention that shown in Figure 2 is adopts, comprise receiving end chip 6, transmitting terminal chip 5, light splitting piece 8 and optical filter 7, its receiving end chip pin place direction is vertical mutually with transmitting terminal chip pin place direction, and in transmitting terminal chip pin place direction and this assembly light signal input and output direction on same straight line.The receiving end Chip Packaging is TO56 or TO46 in the optical transceiver module interface module, the transmitting terminal chip be encapsulated as TO56 or TO46.As of the present invention preferred embodiment a kind of, the receiving end Chip Packaging is TO46, the transmitting terminal chip be encapsulated as TO56.
Shown in Fig. 3 or 5, optical module of the present invention comprises module housing, the first optical transceiver module interface module 1, the second optical transceiver module interface module 2, soft board 4, pcb board 3.
Described module housing comprises base 9 and cover plate 10 again, and the described first optical transceiver module interface module 1, the second optical transceiver module interface module 2, soft board 4, pcb board 3 are positioned in the base 9, and cover plate 10 is placed on the base 9.
First and second optical transceiver module interface module putting with the position in shell has uniqueness, two groups of optical transceiver module interface module parallel arranged, and its receiving end chip pin 102,202 makes one-piece construction put compactness towards base 9 bottoms.
The receiving end chip pin 102 of the described first optical transceiver module interface module is connected to the first signal receiving interface on the pcb board by soft board 4, the transmitting terminal chip pin 101 of the described first optical transceiver module interface module can be connected to the first signal transmission interface on the pcb board by soft board 4, also can be directly be connected with the first signal transmission interface on the pcb board.The connected mode of the second optical transceiver module interface module and pcb board and the connected mode of the first optical transceiver module interface module and pcb board are consistent, that is: the receiving end chip pin 202 of the second optical transceiver module interface module is connected to secondary signal receiving interface on the pcb board by soft board, the transmitting terminal chip pin 201 of the described second optical transceiver module interface module can be connected to secondary signal transmission interface on the pcb board by soft board, also can be directly be connected with secondary signal transmission interface on the pcb board.
Described soft board is provided with impedance transmission lines, with the receiving end chip of assurance optical transceiver module interface module or the impedance matching between transmitting terminal chip and the pcb board signaling interface.
Fig. 3, shown in Figure 4 be the first embodiment of the present invention, promptly the receiving end chip pin of optical transceiver module interface module, transmitting terminal chip pin are connected on the pcb board by two groups of soft boards.Fig. 5, shown in Figure 6 be the second embodiment of the present invention, promptly the receiving end chip pin of optical transceiver module interface module is connected on the pcb board by soft board, the transmitting terminal chip pin is directly connected on the pcb board.
The present invention is not limited to aforesaid embodiment.The present invention expands to any new feature or any new combination that discloses in this manual, and the arbitrary new method that discloses or step or any new combination of process.
Claims (10)
1. binary channels compact pluggable optical module, comprise the first optical transceiver module interface module, second optical transceiver module interface module and the pcb board, be provided with receiving end chip pin and transmitting terminal chip pin on two groups of optical transceiver module interface modules, it is characterized in that, also comprise soft board; The described first optical transceiver module interface module and the second optical transceiver module interface module parallel arranged, the receiving end chip pin place direction of two groups of optical transceiver module interface modules is identical, and the transmitting terminal chip pin place direction of two groups of optical transceiver module interface modules is identical; Described two groups of optical transceiver module interface modules all carry out signal exchange by soft board and pcb board.
2. a kind of binary channels compact pluggable optical module according to claim 1 is characterized in that, the described first optical transceiver module interface module is identical with second optical transceiver module interface module encapsulation specification.
3. a kind of binary channels compact pluggable optical module according to claim 1 is characterized in that described optical transceiver module interface module comprises receiving end chip and transmitting terminal chip; Described receiving end Chip Packaging specification is TO46; Described transmitting terminal Chip Packaging specification is TO56.
4. a kind of binary channels compact pluggable optical module according to claim 1 is characterized in that also comprise module housing, module housing comprises base and cover plate again; The described first optical transceiver module interface module, the second optical transceiver module interface module, pcb board and soft board are arranged in the base, and described cover plate is placed on the base.
5. a kind of binary channels compact pluggable optical module according to claim 4 is characterized in that, the described first optical transceiver module interface module is identical with the second optical transceiver module interface module specification.
6. a kind of binary channels compact pluggable optical module according to claim 5 is characterized in that, the receiving end chip pin unification of the described first optical transceiver module interface module and the second optical transceiver module interface module is towards the base bottom.
7. a kind of binary channels compact pluggable optical module according to claim 1, it is characterized in that, the receiving end chip pin of the described first optical transceiver module interface module be connected to the first signal receiving interface on the pcb board by soft board, the transmitting terminal chip pin of the described first optical transceiver module interface module is connected to the first signal transmission interface on the pcb board by soft board.
8. a kind of binary channels compact pluggable optical module according to claim 1, it is characterized in that, the receiving end chip pin of the described first optical transceiver module interface module is connected to the first signal receiving interface on the pcb board by soft board, and the transmitting terminal chip pin of the described first optical transceiver module interface module is directly connected to the first signal transmission interface on the pcb board.
9. according to any described a kind of binary channels compact pluggable optical module in the claim 1 to 8, it is characterized in that, the receiving end chip pin of the described second optical transceiver module interface module is connected to secondary signal receiving interface on the pcb board by soft board, and the transmitting terminal chip pin of the described second optical transceiver module interface module is connected to secondary signal transmission interface on the pcb board by soft board.
10. according to any described a kind of binary channels compact pluggable optical module in the claim 1 to 8, it is characterized in that, the receiving end chip pin of the described second optical transceiver module interface module is connected to secondary signal receiving interface on the pcb board by soft board, and the transmitting terminal chip pin of the described second optical transceiver module interface module is directly connected to the secondary signal transmission interface on the pcb board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011100480645A CN102103236B (en) | 2011-03-01 | 2011-03-01 | Double-channel compact small-sized pluggable optical module |
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| CN2011100480645A CN102103236B (en) | 2011-03-01 | 2011-03-01 | Double-channel compact small-sized pluggable optical module |
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| CN102103236A true CN102103236A (en) | 2011-06-22 |
| CN102103236B CN102103236B (en) | 2013-04-03 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102394702A (en) * | 2011-11-14 | 2012-03-28 | 索尔思光电（成都）有限公司 | OTDR optical transceiver module |
| CN102801475A (en) * | 2012-08-08 | 2012-11-28 | 青岛海信宽带多媒体技术有限公司 | Single-fiber bidirectional optical assembly and dual-transmitter dual-receiver optical module |
| CN106341742A (en) * | 2016-09-30 | 2017-01-18 | 乐视控股（北京）有限公司 | Interface device |
| CN106842443A (en) * | 2017-03-23 | 2017-06-13 | 中航光电科技股份有限公司 | Photoelectric conversion connector |
| CN108173597A (en) * | 2018-01-02 | 2018-06-15 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module, optical line terminal and passive optical network |
| CN110346881A (en) * | 2018-04-05 | 2019-10-18 | 住友电气工业株式会社 | The optical transceiver of built-in multiple optical sub-assemblies |
| WO2021228204A1 (en) * | 2020-05-13 | 2021-11-18 | 华为技术有限公司 | Electronic device |
| CN114040274A (en) * | 2021-10-29 | 2022-02-11 | 四川天邑康和通信股份有限公司 | Flexible circuit applied to XGSPON optical module |
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| CN2876809Y (en) * | 2006-03-09 | 2007-03-07 | 深圳飞通光电子技术有限公司 | Small SFP single fiber double port light transceiving integrated module |
| CN201397407Y (en) * | 2009-05-19 | 2010-02-03 | 深圳新飞通光电子技术有限公司 | Single-fiber bidirectional SFP optical receiving-transmitting integral light module |
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| CN202019358U (en) * | 2011-03-01 | 2011-10-26 | 成都新易盛通信技术有限公司 | Two-channel, compact and small-sized pluggable optical module |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102394702A (en) * | 2011-11-14 | 2012-03-28 | 索尔思光电（成都）有限公司 | OTDR optical transceiver module |
| CN102394702B (en) * | 2011-11-14 | 2016-01-20 | 索尔思光电（成都）有限公司 | A kind of OTDR optical transceiver module |
| CN102801475A (en) * | 2012-08-08 | 2012-11-28 | 青岛海信宽带多媒体技术有限公司 | Single-fiber bidirectional optical assembly and dual-transmitter dual-receiver optical module |
| CN106341742A (en) * | 2016-09-30 | 2017-01-18 | 乐视控股（北京）有限公司 | Interface device |
| CN106842443A (en) * | 2017-03-23 | 2017-06-13 | 中航光电科技股份有限公司 | Photoelectric conversion connector |
| CN106842443B (en) * | 2017-03-23 | 2019-02-15 | 中航光电科技股份有限公司 | Photoelectric conversion connector |
| CN108173597A (en) * | 2018-01-02 | 2018-06-15 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module, optical line terminal and passive optical network |
| CN110346881A (en) * | 2018-04-05 | 2019-10-18 | 住友电气工业株式会社 | The optical transceiver of built-in multiple optical sub-assemblies |
| WO2021228204A1 (en) * | 2020-05-13 | 2021-11-18 | 华为技术有限公司 | Electronic device |
| CN114040274A (en) * | 2021-10-29 | 2022-02-11 | 四川天邑康和通信股份有限公司 | Flexible circuit applied to XGSPON optical module |
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| CN102103236B (en) | 2013-04-03 |
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Address after: Hite Industrial Park No. 21 High-tech Zone Gaopeng road in Chengdu city of Sichuan province 610041 No. 2 Building 5 floor Applicant after: Eoptolink Technology Inc., Ltd. Address before: 610041 Sichuan province Chengdu city Chengdu high tech Zone Gaopeng Road No. 21, Industrial Park No. 2 Building 5 floor Applicant before: Eoptolink Technology Inc. |
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Effective date of registration: 20160216 Address after: 610213 Sichuan city of Chengdu province Shuangliu County Xing Zhen Wu Lian Street No. 127 Patentee after: SICHUAN XINYISHENG COMMUNICATIONS TECHNOLOGY CO., LTD. Address before: Hite Industrial Park No. 21 High-tech Zone Gaopeng road in Chengdu city of Sichuan province 610041 No. 2 Building 5 floor Patentee before: Eoptolink Technology Inc., Ltd. |