JP7144786B2 - small optical transceiver - Google Patents

Description

The present invention relates to compact optical transceivers. More specifically, the present invention relates to an ultra-compact optical transceiver in which a laser array and a PD array are directly attached to the end face of a multi-core fiber, and applications of the transceiver.

With the development of various Internet services, high-performance mobile services, and cloud services, the amount of information flowing through data centers is increasing year by year, and the scale and capacity of data centers are increasing. On the other hand, in the future, when all kinds of things are connected to the Internet (IoT) and intelligent transportation systems (ITS) such as automatic driving develop, it will be difficult to process such information in a conventional large-scale data center located in the suburbs. A large delay time occurs and becomes a problem. Therefore, low-latency edge computing technology is being studied by distributing small-scale micro data centers around the metro network. In this way, data centers are an essential part of our lives, and their speed, latency, and power consumption have become major issues.

The network in the data center is basically built with Ethernet (registered trademark), but its transmission speed continues to increase year by year, and the standardization of 400 GbE was established at the end of December 2017. FIG. 1 is a conceptual diagram showing a configuration example of a data center network. In the future, as shown in Fig. 1, it is expected that 25G signals from servers will be converted to 100G by ToR switches and converted to 400G by Leaf switches for large-capacity transmission.

FIG. 2 is a conceptual diagram showing a configuration example of a leaf/spine switch device. As shown in Fig. 2, such a switch device is composed of a plurality of switch ASICs (LSIs), and the scale of the ASICs is expanding year by year, and the number of optical transceivers that can be accommodated in one ASIC is also increasing. is doing. In addition, as the scale of data centers increases (increase in the number of servers), the switch device itself is also required to scale up (increase the number of ports). However, the size of existing optical transceivers (devices for converting between electrical and optical signals) limits the number of devices that can be mounted on a single switch board, so it is necessary to divide them into multiple boards.

Furthermore, the inter-board wiring divided in this way is generally connected by an electric cable, but as the scale of the switch increases, it becomes extremely complicated, leading to an increase in the size of the switch device. Moreover, the wiring between ASIC chips placed on a single board also poses serious problems such as increased propagation loss as the signal speed increases. Therefore, research is being conducted on optical interconnection technology between these boards and between chips, but with the current optical transceiver technology, high-density mounting is difficult.

FIG. 3 is a conceptual diagram showing a configuration example of an optical transceiver for 400GbE. As shown in FIG. 3, there are many types of optical transceivers for 400GbE. 400GBase-SR16 is an optical transceiver for short distances within 100 m, and achieves 400 Gb/s transmission by 25 Gbaud (NRZ) x 16 parallel. Here, 16 multimode fibers (MMF) formed into ribbons are used for the input and output optical fibers, and 16 vertical cavity surface emitting laser (VCSEL) arrays (wavelength: 850 nm) and a 16 PIN-PD array is used. Since MMF has a larger core system than single-mode fiber (SMF), lens-free coupling is possible by bringing these optical elements close to MMF.

400GBase-DR4 is an optical transceiver for medium distances within 500 m, and achieves 400 Gb/s transmission by 50 Gbaud x PAM4 (quaternary multilevel signal) x 4 parallel. Here, four SMFs are used for the input and output optical fibers, a waveguide laser array (wavelength: 1.3 μm) is generally used for the light source, and a lens array is used for coupling them. In addition, an encoder/decoder is required to convert the (0,1) digital data to (0,1,2,3) PAM4 data.

400GBase-LR8 is an optical transceiver for a long distance of 10 km, and achieves 400 Gb/s transmission with 25 Gbaud x PAM4 x 8 wavelengths. Here, eight lasers with different wavelengths are used, and the lights are multiplexed by a MUX circuit and transmitted by one SMF. For reception, the optical signals of each wavelength are separated by the DEMUX circuit and then received by eight PD arrays.

In this way, although the form of the optical signal differs depending on the type of optical transceiver, the switch ASIC and the optical transceiver are all shared and exchanged by 25Gx16 parallel electrical signals. In addition, because the waveform of the electrical signal deteriorates during this time, a discriminating and reproducing IC, generally called a retimer, is incorporated.
These optical transceivers are manufactured as small modules conforming to the form factor called CFP8 or QSFP-DD, and as shown in Fig. 4(a), they are attached to the front (or rear) panel of the switch device in a detachable state. It is common to Although the size of the optical transceiver module is getting smaller year by year, the current limit is about 36 modules even if the front and rear panels are used. Furthermore, at this time, the distance between the optical switch ASIC and the optical transceiver becomes longer, making it difficult to send 25G electrical signals with a commonly used inexpensive PCB, requiring a retimer for waveform identification and reproduction at the midpoint of the board. Become.

FIG. 4 is a conceptual diagram showing an implementation example of an optical transceiver. In order to solve the above problem, development of an On-Board type (also called Mid-Board) optical transceiver as shown in FIG. 4B is underway. At this time, it is possible to remove the re-timer placed at the midpoint of the board, which is advantageous in terms of power consumption and cost. Furthermore, the optical transceiver is connected to the connector on the front panel by an optical fiber, and another device is connected by an optical fiber through the connector. Since the connectors can be mounted in any number of layers in the height direction of the panel, it is possible to mount as many optical transceivers as the area on the board allows.

Furthermore, as shown in FIG. 4(c), the development of On-Package type (also called MCM: Multi-Chip Module) optical transceivers has been actively promoted in recent years. The optical transceiver is mounted close to the switch ASIC on the same package, and high-speed 25G electrical signals are transmitted only on the high-performance internal substrate inside the package. Therefore, it is possible to remove the re-timer part of the optical transceiver and implement only the opto-electrical (OE) conversion part, which promotes further miniaturization and lower power consumption. However, in order to realize this, it is necessary to develop an extremely small optical transceiver.

Furthermore, as an ultimate goal, research on the On-Chip type shown in FIG. 4(d) is underway. Here, the OE converter of the optical transceiver is monolithically or hybridly integrated on the switch ASIC using silicon photonics technology. As a result, further miniaturization and lower power consumption are expected, but there are many problems to be solved, such as the difficulty of laser oscillation due to the large amount of heat generated by the large-scale switch ASIC.

JP-A-2011-193459 describes an MCF transmission system including network components using multi-core fibers (MCF).

JP 2011-193459 A

To provide a compact optical transceiver.

Basically, this invention achieves an ultra-compact optical transceiver (for example, a few millimeters square) by attaching a laser array and a PD array to the end face of a multi-core fiber, and can be mounted inside an ASIC package (MCM). It is based on the knowledge that it can be applied to optical interconnection between chips and between boards.

The first invention disclosed in this specification relates to an optical transceiver 1 . This optical transceiver 1 includes a first substrate 3, a vertical cavity surface emitting laser (VCSEL) array 5 provided on the surface of the first substrate 3, and a VCSEL array 5 on the back surface of the first substrate. and a first multi-core fiber (MCF) 7 adhered at a position corresponding to .
The first substrate 3 is a semiconductor substrate that transmits light emitted from the VCSEL array 5 .

This optical transceiver consists of a second substrate 13, a photodetector (PD) array 15 provided on the surface of the second substrate, and a position corresponding to the PD array on the back surface of the second substrate. A second multi-core fiber (MCF) 17 is preferred. The second substrate 13 is preferably a semiconductor substrate that transmits light incident on the PD array 15 . Also, the first and second multicore fibers 7 and 17 are preferably fixed by a third substrate 19 .

The next invention disclosed in this specification relates to a switch application specific integrated circuit (ASIC) package 21 . This package 21 includes a plurality of the optical transceivers described above. The switch ASIC package is configured to include an application specific integrated circuit (ASIC) 23 and a plurality of optical transceivers 1 located around the ASIC 23 .

The next invention disclosed in this specification relates to an optical connection device. Assuming that the configuration of a specific optical connection device includes a first package 21a and a second package 21b, the optical transceivers 1a and 1b of the first package and the second package are connected by a common MCF 25. Information can be exchanged between ASICs through a common MCF. The common MCF 25, which is the MCF connecting the two transceivers, is usually two (or a plurality of) MCFs.

The next invention disclosed in this specification relates to the switch device 31 . In this switch device 31, the first optical transceiver of the first package 21a of the plurality of packages 21 is connected to the optical transceiver of the second package 21b by the common MCF 35, and the first package 21 is connected through the common MCF 35. and the ASIC of the second package, and the second optical transceiver of the first package is connected to the external device 37 . The common MCF 35, which is the MCF connecting the two transceivers, is usually two (or a plurality of) MCFs.

The next invention disclosed in this specification relates to a data center network. This intra-data center network 41 is a network including the switch device 31 described above. The external device 37 is a server, and the server is connected to one of the cores of the MCF via a single mode fiber.

According to the present invention and its preferred embodiments, it is possible to provide an on-package type optical transceiver that has low power consumption, low cost, long-distance transmission capability, and is extremely small in size of several millimeters square.

FIG. 1 is a conceptual diagram showing a configuration example of a data center network (conventional example). FIG. 2 is a conceptual diagram showing a configuration example of a leaf/spine switch device (conventional example). FIG. 3 is a conceptual diagram showing a configuration example of an optical transceiver for 400GbE (conventional example). FIG. 4 is a conceptual diagram showing an implementation example of an optical transceiver (reference example). FIG. 5 is a conceptual diagram showing a configuration example of the optical transceiver of the present invention. FIG. 6 is a conceptual diagram showing a switch application-specific integrated circuit package of the present invention. FIG. 7 is a conceptual diagram for explaining the optical connection device of the present invention. FIG. 8 is a conceptual diagram for explaining the switch device of the present invention. FIG. 9 is a conceptual diagram showing a configuration example of a microminiature optical transceiver using the MCF of the present invention. FIG. 10 is a conceptual diagram showing another configuration example of a microminiature optical transceiver using the MCF of the present invention. FIG. 11 is a conceptual diagram showing an example of application of the ultra-miniature optical transceiver of the present invention to optical interconnection between chips. FIG. 12 is a conceptual diagram showing an example in which the ultra-compact optical transceiver of the present invention is applied to an ultra-multi-port switch device. FIG. 13 is a conceptual diagram showing an example of applying the super multi-port switch device of FIG. 12 to a micro data center.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments for carrying out the present invention will be described below with reference to the drawings. The present invention is not limited to the embodiments described below, and includes appropriate modifications within the scope obvious to those skilled in the art from the following embodiments.

2. Optical Transceiver FIG. 5 is a conceptual diagram showing a configuration example of an optical transceiver. As shown in FIG. 5, this optical transceiver 1 includes a first substrate 3, a vertical cavity surface emitting laser (VCSEL) array 5 provided on the surface of the first substrate 3, and a first substrate. and a first multi-core fiber (MCF) 7 adhered to the back surface of the VCSEL array 5 at a position corresponding to the VCSEL array 5 . Optical transceivers (or optical transceiver modules) are preferably small. An example of the shape of an optical transceiver is a square or a rectangle, and the size of the optical transceiver can be adjusted according to the application. Adjustment may be made within a range of 7 mm or less.

The optical transceiver is a known device as described in Japanese Patent No. 6350308 and Japanese Patent No. 6170527, for example. A substrate used in an optical transceiver may be used as appropriate. In this specification, the first substrate 3 is a semiconductor substrate that transmits light emitted from the VCSEL array 5 . The surface of the first substrate 3 is one surface of the first substrate on which the VCSEL array 5 is provided. The back surface of the first substrate means the surface opposite to the surface on which the VCSEL array 5 is provided. A first multi-core fiber (MCF) 7 is adhered to a position corresponding to the VCSEL array 5 on the rear surface of the first substrate. The position corresponding to the VCSEL array 5 means that each core included in the MCF exists at a position where light can be exchanged with the VCSEL included in the VCSEL array 5 via the first substrate. means The VCSEL array 5 preferably has VCSELs at positions similar to the positions of the cores of the multi-core fiber. However, all the cores of the multicore fiber need not have corresponding VCSELs. Some cores of a multicore fiber may be used for detection or other applications, not for communication. The multi-core fiber may employ a layer structure such as a central core, a first layer surrounding it, and a second layer surrounding the first layer.

This optical transceiver consists of a second substrate 13, a photodetector (PD) array 15 provided on the surface of the second substrate, and a position corresponding to the PD array on the back surface of the second substrate. A second multi-core fiber (MCF) 17 is preferred.
The second substrate 13 is preferably a semiconductor substrate that transmits light incident on the PD array 15 . The second substrate 13 may be the same as the first substrate 3 . Moreover, the first substrate 3 and the second substrate 13 do not need to be separate substrates, and one substrate may serve as both the first substrate 3 and the second substrate 13 . A photodetector (PD) array 15 is provided in the same direction as the VCSEL array 5 . A second multi-core fiber (MCF) 17 is provided in the same direction as the first MCF 17 .

The first and second multicore fibers 7 and 17 are preferably fixed by a third substrate 19. FIG. An example of the third substrate 19 is a V-groove substrate, and a V-groove substrate made of glass can be preferably used. Alignment can be easily achieved by setting the first and second multicore fibers 7 and 17 in the grooves of the V-groove substrate.

In the example shown in FIG. 5, each light emitted from the VCSEL array 5 passes through the first substrate 3 and enters the corresponding core of the first MCF 7 . Then, it propagates to other optical elements via the first MCF 7 . On the other hand, light that has passed through each core of the second MCF 17 passes through the second substrate 13 and is received by the corresponding PD in the PD array 15 .

Switch Application Specific Integrated Circuit (ASIC) Package FIG. 6 is a conceptual diagram showing a switch application specific integrated circuit package. As shown in FIG. 6, this package 21 includes a plurality of optical transceivers 1 described above. The switch ASIC package is configured to include an application specific integrated circuit (ASIC) 23 and a plurality of optical transceivers 1 located around the ASIC 23 . The ASIC 23 is connected to each optical transceiver 1 so as to be able to exchange information. In the example of FIG. 6, an ASIC is installed on the interior board and wired to each transceiver 1 . Also, each transceiver is designed to be connectable to elements other than the ASIC. A switch application-specific integrated circuit package is a chip (communication component/communication element) for an ASIC (application-specific integrated circuit) used in a switch device.

Optical Connection Device FIG. 7 is a conceptual diagram for explaining an optical connection device. The optical connection device shown in FIG. 7 includes a first package 21a and a second package 21b. The optical transceiver 1a of the first package and the optical transceiver 1b of the second package are connected by a common MCF 25 so that information can be exchanged through the common MCF. The common MCF 25, which is the MCF connecting the two transceivers, is usually two (or a plurality of) MCFs. The same applies to other packages in this optical connection device.

Switch Device FIG. 8 is a conceptual diagram for explaining the switch device. As shown in FIG. 8, this switch device 31 includes a plurality of packages 21a and 21b, and one of the packages is connected to an external device 37 so that information can be exchanged. In the example of FIG. 8, the first optical transceiver of the first package 21a of the plurality of packages 21 is connected to the optical transceiver of the second package 21b through the common MCF 35. In FIG. Information can be exchanged between the ASICs of the first package and the second package through the common MCF 35 . The common MCF 35, which is the MCF connecting the two transceivers, is usually two (or a plurality of) MCFs.
A second optical transceiver of the first package (a transceiver not connected to the optical transceiver of the second package) is connected to the external device 37 . Then, information can be exchanged between the external device 37 and the first package.

Data Center Network This data center network is a network including the switch device 31 described above (see FIG. 8). As for the data center network, the external device 37 in FIG. be. A data center is a facility for installing and operating computer networks such as server computers for providing functions and services to the outside.

EXAMPLES The present invention will be specifically described below using examples. The present invention is not limited to the following examples, and includes those employing known configurations and known conditions as appropriate.

FIG. 9 is a conceptual diagram showing a configuration example of a microminiature optical transceiver using MCF. FIG. 9A is a conceptual diagram showing a configuration example of an optical transceiver. The first point of this transceiver is to use a multi-core fiber (MCF), in which multiple cores are integrated into one optical fiber, instead of using a conventional ribbon fiber. FIG. 9(b) is a conceptual diagram showing a cross-sectional view of a multi-core fiber. As shown in FIG. 9B, for example, in a 19-core MCF, 19 single-mode cores with a diameter of 10 μm are covered with a clad with a diameter of 250 μm to form one optical fiber.

The second point of this optical transceiver is that it has a structure in which the back side of the VCSEL and PD array substrates are attached directly to the end faces of two MCFs fixed by a V-groove glass substrate or the like. FIG. 9(c) is a conceptual diagram showing an arrangement example of a PD or VCSEL array. The element layout of the PD and VCSEL arrays is made to match the core layout of the MCF. As shown in FIG. 9(c), for example, in order to perform optical transmission at 400 Gb/s using a 19-core MCF, 16 cores at 25 Gb/s should be used per core, and the remaining cores A portion can be used for monitoring. FIG. 9(d) is a conceptual diagram showing an example of connection between a PD or VCSEL array and a CMOS circuit. As shown in Fig. 9(d), the CMOS circuit (TIA for amplifying and identifying the PD output) is used as the ground terminal of the electric wiring without arranging the device at the position corresponding to the center of the MCF. It is possible to directly flip-chip bond on an IC (integrated with a limiting amplifier, a driver amplifier for driving the VCSEL, etc.). In order to protect the strength of the joints, these parts are packaged as a small module as shown in FIG. 9(a) and mounted on an interior substrate within the switch ASIC package.

FIG. 10 is a conceptual diagram showing another configuration example of a microminiature optical transceiver using MCF. A switch package is provided on the printed wiring board. A package interior substrate is provided on the upper portion thereof, and a switch ASIC, various amplifiers, drivers, etc. are provided, and an optical transceiver is formed on the amplifier. As shown in FIG. 10, by putting the CMOS circuit portion outside the module, the size of the PD/VCSEL array portion module can be greatly reduced.

This ultra-compact optical transceiver is not the conventional pluggable module type, but is intended to be an On-Package type optical transceiver installed near the switch ASIC. Contributes to low power consumption and miniaturization.

In this optical transceiver, a very compact optical transceiver is realized by directly attaching a high-density integrated PD/VCSEL array to the MCF end surface without using a lens array. In particular, further miniaturization is possible by separating the CMOS circuit for driving the PD/VCSEL outside the module.

Using this optical transceiver, for example, 400 Gb/s optical transmission can be achieved by using 16 cores with 25 Gb/s non-return-to-zero (NRZ) signals. That is, there is no need to use a ribbon fiber such as the SR16 or DR4 of the conventional optical transceiver shown in FIG. 3, and the wiring of the fiber is facilitated. In addition, there is no need to use the 50Gbaud high-speed signal used in DR4, and as a modulation format, there is no need to use PAM4 such as DR4 and LR8, and the simplest NRZ can be used, so the DSP for the encoder/decoder can be used. becomes unnecessary. Furthermore, since it is not necessary to use wavelength multiplexing as in LR8, no MUX/DEMUX circuit is required, and furthermore, the wavelength variation of the VCSEL array with respect to temperature is largely permissible, eliminating the need for temperature control with a Peltier or the like. In addition, since the core of the MCF used is single-mode like DR4 and LR8, long-distance transmission is possible.

As described above, this optical transceiver does not require a retimer, lens array, DSP, temperature control, MUX/DEMUX circuit, etc., so that it is possible to significantly reduce the size, power consumption, and cost.

Next, a usage example of this optical transceiver will be described.
The size of switch ASICs is increasing year by year, and it is believed that a single chip will achieve a throughput exceeding 25 Tb/s in the near future. At that time, one switch ASIC can accommodate 32 ports of 400G optical transceivers, but it is extremely difficult to implement with the conventional pluggable module type. Since the ultra-miniature optical transceiver disclosed in this specification is extremely small, it is possible to mount a large number of optical transceivers on-package.

Furthermore, as described above with reference to Figure 2, leaf/spine switch devices in data center networks consist of a large number of switch ASIC groups. Therefore, it is necessary to divide it into multiple switchboards. Therefore, it is necessary to connect switch ASICs between boards, which is a big problem. Furthermore, when the signal speed becomes as high as 400G, the electrical wiring becomes extremely difficult even between ASICs on the same board.

FIG. 11 is a conceptual diagram showing an application example of an ultra-compact optical transceiver to optical interconnection between chips. As shown in Fig. 11, when an ultra-compact optical transceiver (on-package type) is used, optical connections between ASICs can be realized extremely easily, and all necessary retimers are unnecessary between distant ASICs. Therefore, it contributes to low power consumption.

FIG. 12 is a conceptual diagram showing an example of applying a micro optical transceiver to a super multi-port switch device. As shown in Figure 12, the use of ultra-compact optical transceivers makes it possible to mount a large number of optical transceivers at high density on a switch ASIC package, and it can also be used for optical connections between ASICs. As a result, it is possible to realize a compact super-multi-port switch device in which many switch ASICs are mounted on one board.

FIG. 13 is a conceptual diagram showing an example of applying the super multi-port switch device of FIG. 12 to a micro data center. As shown in FIG. 13, this switch device is composed of 16 switch ASICs, each of which is equipped with 32 optical transceivers of the present invention (16 of which are for chip-to-chip connection). 16 are for external connection), and each optical transceiver is assumed to be connected by 16-core MCF of 25G each for input and output (400G in total). A fan-out connector is attached to the MCF for external connection, and one MCF is separated into 16 SMFs, each of which is connected to a different server.

Conventional optical transceivers (DR4, LR8, etc.) convert the input 400G electrical signal (16 parallel electrical signals of 25G) into various formats (NRZ → PAM4, 25G → 50G, 8λ WDM), It is output as an optical signal. In other words, the 16 parallel signals of 25G are regarded as one block, and the independence of the 16 parallel signals is not guaranteed. However, in the ultra-compact optical transceiver, the input 16 parallel electrical signals of 25G are OE-converted as they are, and each of the 16 25G signals can be treated as an independent and different signal. Therefore, a 25G optical path is formed between arbitrary servers, and the signal output from the server is transferred to the destination server while maintaining the 25G signal format. At this time, it is possible to extend up to 16×16×16=4096 servers with one switch device. That is, in a general micro data center with a scale of 1,000 units, it is possible to construct a network with one switch device.

Furthermore, as explained with reference to FIG. 1, generally in a data center network, signals output from servers are aggregated by leaf switches and transferred while converting the speed. Therefore, the input signal needs to be temporarily stored in the buffer of the switching device (Store & Forward), which causes a large delay time. In large-scale data centers with hundreds of thousands of units, this method is rational because it guarantees data transfer between large numbers of servers, but in micro data centers with thousands of units, it is extremely inefficient. . Micro data centers require high-speed signal processing for automated driving, etc., so low-latency communication between servers is essential. transfer as is) is ideal. When this switch device is used, the same signal format can be transferred between servers without any signal speed or format conversion, making it ideal for cut-through operation and an extremely low-latency network. can be constructed.

INDUSTRIAL APPLICABILITY The present invention can be used in the field of optical information communication.

1 optical transceiver 3 first substrate 5 vertical cavity surface emitting laser array 7 first multicore fiber 13 second substrate 15 photodetector array 17 second multicore fiber 19 third substrate

Claims (7)

A first substrate (3), a vertical cavity surface emitting laser (VCSEL) array (5) provided on the surface of the first substrate (3) , and the back surface of the first substrate (3), an optical transceiver (1) comprising a first multi-core fiber (MCF) (7) glued at a position corresponding to the VCSEL array (5),
The first substrate (3) is an optical transceiver, which is a semiconductor substrate through which light emitted from the VCSEL array (5) is transmitted ,
The optical transceiver, wherein the first multicore fiber is a single mode multicore fiber . An optical transceiver according to claim 1,
further comprising a V-groove substrate (19) which is a substrate different from the first substrate (3);
A first multi-core fiber (MCF) (7) is a single-mode multi-core fiber installed in the groove of said V-groove substrate (19) and fixed by said V-groove substrate (19) . An optical transceiver according to claim 1,
a second substrate ( 13 ), a photodetector (PD) array (15) provided on the surface of the second substrate (13) , and the PD array on the back surface of the second substrate (13) a second multi-core fiber (MCF) (17), which is a single-mode multi -core fiber glued in corresponding positions;
further comprising a V-groove substrate (19) which is a substrate different from the first substrate (3) and the second substrate (13);
The second substrate (13) is a semiconductor substrate that transmits light incident on the PD array (15),
a first multi-core fiber (MCF) (7) and a second multi-core fiber (MCF) (17) are placed in grooves of said V-groove substrate (19) and fixed by said V-groove substrate (19);
optical transceiver. A switch application specific integrated circuit (ASIC) package (21) comprising a plurality of optical transceivers (1) according to claim 3 , comprising:
The switch ASIC package includes an application specific integrated circuit (ASIC) (23) and a plurality of the optical transceivers (1) installed around the ASIC (23). An optical connection device comprising a first package (21a) and a second package (21b) each being a package according to claim 4 ,
An optical connection device in which the optical transceivers (1a, 1b) of the first package and the second package are connected by a common MCF (25). A switch device (31) comprising a plurality of packages (21) according to claim 4 ,
A first optical transceiver of a first package (21a) of the plurality of packages (21) is connected to an optical transceiver of a second package (21b) by a common MCF (35),
exchange information between the ASICs of the first package and the second package through the common MCF (35);
A switch device, wherein the second optical transceiver of the first package is connected with an external device (37). A data center network including the switch device (31) according to claim 6 ,
the external device (37) is a server,
Network within the data center.

Images