WO2021227872A1 - 粉末浆料超声场助压印成型微结构装置 - Google Patents

粉末浆料超声场助压印成型微结构装置 Download PDF

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Publication number
WO2021227872A1
WO2021227872A1 PCT/CN2021/090431 CN2021090431W WO2021227872A1 WO 2021227872 A1 WO2021227872 A1 WO 2021227872A1 CN 2021090431 W CN2021090431 W CN 2021090431W WO 2021227872 A1 WO2021227872 A1 WO 2021227872A1
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molding
ultrasonic
powder
powder slurry
microstructure device
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English (en)
French (fr)
Inventor
王春举
程利冬
贺海东
刘楠
孙立宁
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Suzhou University
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Suzhou University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2202/00—Treatment under specific physical conditions
    • B22F2202/01—Use of vibrations

Definitions

  • the invention relates to a powder slurry ultrasonic field assisted imprinting and molding microstructure device, which belongs to the technical field of powder molding microstructure manufacturing.
  • the traditional powder metallurgy process is mainly used for the manufacture of simple shape parts blanks, and subsequent machining processes such as grinding are required to manufacture the final parts.
  • the purpose of the present invention is to provide a powder slurry ultrasonic field assisted imprinting and molding microstructure device, which can improve the flow performance, transmission performance and compactness of the powder slurry.
  • a powder slurry ultrasonic field assisted imprinting and molding microstructure device including:
  • a powder molding component which is arranged on the base and used for imprinting and molding the powder
  • a molding force component connected with the powder molding component
  • the powder molding assembly includes a heating guide provided on the base, and an ultrasonic indenter connected to the molding force component and sliding along the heating guide, and the heating guide has a position for placing the powder slurry
  • a molding template is placed at the bottom of the accommodating tank; the ultrasonic indenter moves along the heating guide under the driving of the molding force component and imprints the powder slurry to make the powder
  • the slurry is closely matched with the forming template.
  • the ultrasonic indenter is in clearance fit with the inner wall of the accommodating groove.
  • the shaping force component is connected to the base through a guide post, one end of the guide post is fixedly arranged on the base, and the shaping force component can be moved relative to the guide post to change the position The spacing between the pedestals.
  • the forming force applying component includes:
  • a sliding plate which is in sliding fit with the guide post
  • the ultrasonic vibrator is fixedly arranged on the sliding plate;
  • the forming force component further includes an horn, one end of the horn is connected to the ultrasonic vibrator through the through hole, and the other end of the horn is connected to the ultrasonic vibrator. Connected with the ultrasonic indenter.
  • the forming force component further includes a fixed plate connected to the sliding plate through a column, and an excitation ceramic used to connect the ultrasonic vibrator and the fixed plate.
  • the sliding plate is also provided with a guide sleeve slidingly fitted with the guide post.
  • a backing plate is also provided between the base and the heating guide.
  • the molding template is provided with protrusions on a side facing the ultrasonic indenter.
  • the shape of the cross section of the protrusion is any one of a wave shape, an arc shape, a slope shape, a wedge shape, and a rectangle shape.
  • the vibration frequency of the ultrasonic vibrator is 10-40 kHz, and the longitudinal amplitude is 0.1-10 ⁇ m.
  • the beneficial effect of the present invention is that by providing a heating guide and an ultrasonic indenter, the heating guide has an accommodation groove for placing the powder slurry, and the bottom of the accommodation groove is provided with a molding template, and the ultrasonic indenter applies force during the molding process. Under the action of the component, it slides along the heating guide to improve the fluidity and force transmission performance of the powder slurry, soften the adhesive, reduce the viscosity of the adhesive, and improve its fluidity;
  • the forming force component includes an ultrasonic vibrator connected with an ultrasonic indenter, and the ultrasonic vibrator transmits vibration to the ultrasonic indenter so that the small-sized solid in the powder slurry fills the gap of the large-sized solid to improve the compactness of the molded part.
  • Fig. 1 is a schematic structural diagram of a powder slurry ultrasonic field-assisted imprinting and molding microstructure device of the present invention.
  • Fig. 2 is a schematic diagram of part of the structure in Fig. 1.
  • a powder slurry ultrasonic field assisted imprinting and molding microstructure device is connected to external equipment such as precision material testing machines, presses, etc., so that load can be applied. , Displacement real-time display and precise control purpose shall prevail, and run under the drive of external equipment.
  • the powder slurry ultrasonic field assisted imprinting and molding microstructure device includes a base 1, a powder molding component 2 arranged on the base 1 and used to imprint the powder, and a molding connected to the powder molding component 2.
  • the force applying component 3 is connected to an external device, and the force applying component 3 is driven by the external device to transfer force to the powder molding component 2 to imprint the powder, which is fast and convenient.
  • the powder forming assembly includes a heating guide 21 arranged on the base 1, and an ultrasonic indenter 22 connected to the forming force component 3 and sliding along the heating guide 21.
  • the heating guide 21 It is equipped with a heating resistor, and the powder slurry can be heated to the required temperature as needed to reduce the binder’s annual life and improve the flow performance of the powder slurry in order to better shape the microstructure.
  • the heating guide 21 also has a built-in sensor or a contact sensor to measure the temperature of the powder slurry. When the temperature reaches a suitable temperature for the adhesive, the heating resistor stops heating.
  • the heating guide 21 has a containing groove 211 for placing powder, and a molding template 23 is placed at the bottom of the containing groove 211; The heating guide 21 moves and imprints the powder so that the powder closely fits with the forming template.
  • the powder can be ceramics, diamonds, metal materials, etc., and the binder can be made of low-melting organic materials such as paraffin, which is not specifically limited here, and depends on the actual situation.
  • the ultrasonic indenter 22 is in clearance fit with the inner wall of the accommodating groove 211, and the inner wall provides a guiding function for the ultrasonic indenter 22.
  • the purpose of this arrangement is to ensure that the ultrasonic indenter 22 moves smoothly while ensuring that the powder slurry does not overflow from the gap.
  • the molding template 23 is provided with protrusions on one side facing the ultrasonic indenter 22, and the cross-sectional shape of the protrusions is any of wave shape, arc shape, slope shape, wedge shape, groove shape, and rectangle shape. kind.
  • a groove may be provided on the side of the molding template 23 facing the ultrasonic indenter 22, and the cross-sectional shape of the groove may be wavy, arc, slope, or wedge. Any one of groove shape and rectangle shape is not specifically limited here, and it depends on the actual situation, but the size of the protrusion or groove is greater than or equal to 2 ⁇ m.
  • the forming force component 3 is connected to the base 1 through a guide post 4, one end of the guide post 4 is fixedly arranged on the base 1, and the forming force component 3 is movable relative to the guide post 4 To change the distance from the base 1.
  • the forming force component 3 includes a sliding plate 31 slidably fitted with the guide post 4, and an ultrasonic vibrator 32 fixedly arranged on the sliding plate 31, and the sliding plate 31 is provided with a through hole 311
  • the forming force component 3 further includes an horn 33, one end of the horn 33 passes through the through hole 311 and is connected to the ultrasonic vibrator 32, and the other end of the horn 33 is connected to the ultrasonic vibrator 32.
  • the ultrasonic indenter 22 is connected.
  • the ultrasonic indenter 22 and the horn 33 are tightly fixed by threads, and the horn 33 is also tightly fixed with the ultrasonic vibrator 32 by threads.
  • the horn 33 is used to amplify the amplitude of the high-frequency ultrasonic vibration generated by the ultrasonic vibrator 32, and then act on the powder slurry through the ultrasonic indenter 22, which is quick and convenient.
  • the through hole 311 is opened in the middle of the sliding plate 31.
  • the through hole 311 can also be opened in other positions of the sliding plate 31, which is not specifically limited here, and is based on actual conditions.
  • the vibration frequency of the ultrasonic vibrator 32 is 10-40 kHz, and the longitudinal amplitude is 0.1-10 ⁇ m. It is true that in other embodiments, the vibration frequency and longitudinal amplitude of the ultrasonic vibrator 32 can also be other, which is not specifically limited here, and depends on the actual situation.
  • the sliding plate 31 is also provided with a guide sleeve 5 that is slidingly matched with the guide post 4, and the guide sleeve 5 cooperates with the guide post 4 to guide the forming force component 3, thereby improving the compactness of the final molded part .
  • the forming force component 3 also includes a fixed plate 34 connected to the sliding plate 31 through a column 36, an excitation ceramic 35 for connecting the ultrasonic vibrator 32 and the fixed plate 34, and the excitation ceramic 35 is externally high-frequency. Under the action of the power source, high-frequency telescopic deformation is generated, thereby driving the ultrasonic vibrator 32 with the same frequency to generate high-frequency ultrasonic vibration. Under vibration conditions, it is more conducive for the small-sized solid particles in the powder to fill the gaps between the large-sized particles, thereby improving the compactness of the microstructures.
  • the shape and size of the ultrasonic vibrator 32, the horn 33 and the ultrasonic indenter 22 need to be designed.
  • the design principle refers to the principle of resonance. Ensure the transmission efficiency of ultrasonic vibration and reduce energy loss. As a kind of energy, ultrasonic vibration can be absorbed by the adhesive, thereby increasing the temperature, reducing the viscosity, and improving the flow performance.
  • a backing plate 6 is also provided between the base 1 and the heating guide 21.
  • a notch is provided in the backing plate 6 to allow circulating water to cool the molded part.
  • the cooling rate is determined according to the specific requirements of the molded part. It is worth noting that the cooling rate should not be too fast, because the molded part will produce internal stress when the temperature gradient is too large, resulting in defects such as cracks.
  • the specific implementation process of the powder slurry ultrasonic field assisted imprint molding microstructure device of the present invention is as follows: according to the size of the molded part, different proportions of powder and binder are selected for mixing to prepare powder slurry.
  • the prepared powder slurry is placed in the containing tank 211, and the external device is turned on, so that the external device drives the forming force component 3 to move to the powder forming component 2 through the guide post 4.
  • the ultrasonic indenter 22 contacts the powder slurry and generates a certain pressure (the external equipment has a pressure test device), it stops moving.
  • the heating resistor in the heating guide 21 is turned on to preheat the powder slurry, and the temperature is measured by the sensor.
  • the heating resistor stops heating.
  • the ultrasonic vibrator 32 and external equipment are turned on, so that the ceramic 35 and the ultrasonic vibrator 32 are excited to work to form the powder slurry.
  • the ultrasonic vibration is stopped, and circulating water is introduced into the backing plate 6 to cool the powder slurry to room temperature, and the final molded part is obtained.
  • the heating guide 21 and the ultrasonic indenter 22 are provided, the heating guide 21 has a containing groove 211 for placing the powder slurry, and the bottom of the containing groove 211 is provided with a forming template 23, the ultrasonic indenter 22 Sliding along the heating guide 21 under the action of the forming force component 3 to improve the fluidity and force transmission performance of the powder slurry, soften the adhesive, reduce the viscosity of the adhesive, and improve its fluidity;
  • the forming force component 3 includes an ultrasonic vibrator 32 connected with the ultrasonic indenter 22.
  • the ultrasonic vibrator 32 transmits vibration to the ultrasonic indenter 22 so that the small-sized solid in the powder slurry fills the gap of the large-sized solid to improve the compactness of the molded part. sex.

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  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)

Abstract

本申请涉及一种粉末浆料超声场助压印成型微结构装置，包括: 底座; 粉末成型组件，设置在所述底座上且用以将粉末压印成型; 成型施力组件，与所述粉末成型组件连接; 所述粉末成型组件包括设置在所述底座上的加热导向件、及与所述成型施力组件连接且沿所述加热导向件滑动的超声压头，所述加热导向件具有用以放置粉末浆料的容置槽，所述容置槽的底部放置有成型模板; 述超声压头在所述成型施力组件的驱动下沿所述加热导向件移动并将粉末浆料压印以使得粉末浆料与成形模板紧密配合，其能够提高粉末浆料流动性能、传动性能及致密性。

Description

粉末浆料超声场助压印成型微结构装置 技术领域
本发明涉及一种粉末浆料超声场助压印成型微结构装置，属于粉末成型微结构制造技术领域。
背景技术
随着重要装备极端工作环境需求越来越多，对工件的材料也提出了更高要求，如陶瓷、金刚石、硬脆难变形金属材料等，在耐高温、机械强度、传热等方面具有更高的性能。然而，这些硬脆等特殊性能的材料，塑性差、强度高、硬度大、耐磨性强，很难采用传统的塑性变形、机械加工等工艺制造复杂结构件。为此，通常采用粉末冶金等工艺，比如粉末热压烧结等，制造上述材料的零件。但是，受工艺方法的限制，粉末之间存在间隙，非常难以消除，制造的零件致密性不高，影响了零件的性能。粉末冶金过程中需要采用高压力、高温等特殊工艺条件，减小粉末颗粒之间的间隙，提高粉末零件的致密性。粉末颗粒传力性能、流动性能等很差，必须采用了石蜡等有机粘合剂，提高粉末颗粒的流动性能，依然难以致密的充填复杂形状或微小尺寸型腔。因此，传统的粉末冶金工艺主要用于简单形状零件毛坯的制造，后续还需要磨削等机械加工工艺制造最终的零件，不但周期长、成本高，而且零件形状、尺寸等均受到非常大的制约。并且，粉末成型的仅是毛坯件，需要采用烧结等工艺提高粉末之间的结合强度，才能满足机械强度等性能要求。然而，烧结过程中石蜡等有机粘合剂气化后，在粉末制备的微小结构件内留下了大量孔洞，也是制约致密性提高的一个重要因素。
发明内容
本发明的目的在于提供一种粉末浆料超声场助压印成型微结构装置，其能够提高粉末浆料流动性能、传动性能及致密性。
为达到上述目的，本发明提供如下技术方案：一种粉末浆料超声场助压印成型微结构装置，包括：
底座；
粉末成型组件，设置在所述底座上且用以将粉末压印成型；
成型施力组件，与所述粉末成型组件连接；
所述粉末成型组件包括设置在所述底座上的加热导向件、及与所述成型施力组件连接且沿所述加热导向件滑动的超声压头，所述加热导向件具有用以放置粉末浆料的容置槽，所述容置槽的底部放置有成型模板；所述超声压头在所述成型施力组件的驱动下沿所述加热导向件移动并将粉末浆料压印以使得粉末浆料与成形模板紧密配合。
进一步地，所述超声压头与所述容置槽的内壁间隙配合。
进一步地，所述成型施力组件通过导柱与所述底座连接，所述导柱的一端固定设置在所述底座上，所述成型施力组件可相对于所述导柱移动以改变与所述底座之间的间距。
进一步地，所述成型施力组件包括：
滑动板，与所述导柱滑动配合；
超声振子，固定设置在所述滑动板上；
所述滑动板上开设有通孔，所述成型施力组件还包括变幅杆，所述变幅杆的一端穿过所述通孔与所述超声振子连接，所述变幅杆的另一端与所述超声压头连接。
进一步地，所述成型施力组件还包括通过立柱与所述滑动板连接的固定板、用以连接所述超声振子和所述固定板的激励陶瓷。
进一步地，所述滑动板上还设置有与所述导柱滑动配合的导套。
进一步地，所述底座与所述加热导向件之间还设置有垫板。
进一步地，所述成型模板朝向所述超声压头的一面上设置有凸起。
进一步地，所述凸起的横截面的形状为波浪形、弧形、斜坡形、楔形及矩形中的任一种。
进一步地，所述超声振子的振动频率为10-40kHz，纵向振幅为0.1-10μm。
本发明的有益效果在于：通过设置有加热导向件及超声压头，加热导向件 具有用以放置粉末浆料的容置槽且容置槽的底部设置有成型模板，超声压头在成型施力组件的作用下沿加热导向件滑动以提高粉末浆料的流动性能和传力性能，软化粘合剂，降低粘合剂粘度，提高其流动性；
成型施力组件包括与超声压头连接的超声振子，超声振子传递振动至超声压头继而使得粉末浆料内的小尺寸固体填充大尺寸固体的间隙，以提高成型件的致密性。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，并可依照说明书的内容予以实施，以下以本发明的较佳实施例并配合附图详细说明如后。
附图说明
图1为本发明的粉末浆料超声场助压印成型微结构装置的结构示意图。
图2为图1中的部分结构示意图。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。
请参见图1及图2，本发明的一较佳实施例中的一种粉末浆料超声场助压印成型微结构装置与精密材料试验机、压力机等外界设备连接，以可以实现载荷施加、位移实时显示和精确控制的目的为准，并在外界设备的驱动下运行。其中，粉末浆料超声场助压印成型微结构装置包括底座1、设置在所述底座1上且用以将粉末压印成型的粉末成型组件2、及与所述粉末成型组件2连接的成型施力组件3，成型施力组件3与外界设备连接，成型施力组件3在外界设备的驱动下将力传递至所述粉末成型组件2以将粉末压印成型，快速方便。
所述粉末成形组件包括设置在所述底座1上的加热导向件21、及与所述成型施力组件3连接且沿所述加热导向件21滑动的超声压头22，该加热导向件21内设置有加热电阻，可根据需要将粉末浆料加热至所需温度，以降低粘合剂的年度，提高粉末浆料流动性能，以便于更好的成型微结构。该加热导向件21还具有内置传感器或接触式传感器对粉末浆料的温度进行测量，当温度达到粘 合剂适合的温度时，加热电阻停止加热。所述加热导向件21具有用以放置粉末的容置槽211，所述容置槽211的底部放置有成型模板23；所述超声压头22在所述成型施力组件3的驱动下沿所述加热导向件21移动并将粉末压印以使得粉末与成形模板紧密配合。粉末可以为陶瓷、金刚石、金属材料等，粘合剂可采用石蜡等低熔点有机材料，在此不做具体限定，根据实际情况而定。
所述超声压头22与所述容置槽211的内壁间隙配合，且所述内壁给所述超声压头22提供导向作用。这样设置的目的在于：在保证超声压头22运动顺畅的同时，又保证粉末浆料不会自间隙溢出。所述成型模板23朝向所述超声压头22的一面上设置有凸起，所述凸起的横截面的形状为波浪形、弧形、斜坡形、楔形、沟槽形及矩形中的任一种。诚然，在其他实施例中，所述成型模板23朝向所述超声压头22的一面上也可以设置有凹槽，该凹槽的横截面的形状可为波浪形、弧形、斜坡形、楔形、沟槽形及矩形中的任一种，在此不做具体限定，根据实际情况而定，但是凸起或凹槽的尺寸大于等于2μm。
所述成型施力组件3通过导柱4与所述底座1连接，所述导柱4的一端固定设置在所述底座1上，所述成型施力组件3可相对于所述导柱4移动以改变与所述底座1之间的间距。具体的，所述成型施力组件3包括与所述导柱4滑动配合的滑动板31、及固定设置在所述滑动板31上的超声振子32，所述滑动板31上开设有通孔311，所述成型施力组件3还包括变幅杆33，所述变幅杆33的一端穿过所述通孔311与所述超声振子32连接，所述变幅杆33的另一端与所述超声压头22连接。具体的，超声压头22与变幅杆33通过螺纹紧密固定，变幅杆33也通过螺纹与超声振子32紧密固定。该变幅杆33用以将超声振子32产生的高频超声振动进行振幅放大后，通过超声压头22作用于粉末浆料上，快捷方便。
在本实施例中，通孔311开设在滑动板31的中间，诚然，在其他模式实例中，该通孔311也可开设在滑动板31的其他位置，在此不做具体限定，根据实际情况而定。所述超声振子32的振动频率为10-40kHz，纵向振幅为0.1-10μm。诚然，在其他实施例中，超声振子32的振动频率及纵向振幅也可为其他，在此 不做具体限定，根据实际情况而定。所述滑动板31上还设置有与所述导柱4滑动配合的导套5，该导套5与导柱4配合以给成型施力组件3导向，从而提高最终成型的成型件的致密性。
所述成型施力组件3还包括通过立柱36与所述滑动板31连接的固定板34、用以连接所述超声振子32和所述固定板34的激励陶瓷35，激励陶瓷35在外部高频电源的作用下，产生高频率的伸缩变形，从而带动具有同一频率的超声振子32产生高频率的超声振动。振动条件下，更利于粉末中的小尺寸固体颗粒填充大尺寸颗粒间隙，从而提高微小结构件致密性。为了将激励陶瓷35产生的高频超声振动更好的作用于粉末浆料上，需要对超声振子32、变幅杆33以及超声压头22的形状和尺寸进行设计，设计原理参考共振原理，以保证超声振动的传递效率，减小能量损耗。由于超声振动作为一种能量，可以被粘合剂吸收，从而升高温度、降低粘度、提高流动性能。
所述底座1与所述加热导向件21之间还设置有垫板6。当成型结束后，停止超声振动且直至成型件冷却至室温。为了加快成型件的冷却速度，在本实施例中，垫板6内设置有槽口，以通入循环水对成型件进行冷却，冷却速度根据成型件的具体需求而定。值得注意的是，冷却速度不宜过快，因为成型件在温度梯度过大时会产生内应力从而出现裂纹等缺陷。
本发明的粉末浆料超声场助压印成型微结构装置的具体实施过程为：根据成型件的尺寸，选择不同比例的粉末和粘合剂进行混料以制备粉末浆料。将制备好后的粉末浆料放置于容置槽211内，开启外界设备，以使得外界设备驱动成型施力组件3通过导柱4向粉末成型组件2移动。当超声压头22接触粉末浆料后并产生一定压力后(外界设备上具有压力测试装置)，停止运动。开启加热导向件21内的加热电阻，对粉末浆料进行预热，并通过传感器对温度进行测量，放温度达到粘合剂适合的温度时，加热电阻停止加热。开启超声振子32及外界设备，以使得激励陶瓷35、超声振子32工作对粉末浆料进行成型处理。当成型结束后，停止超声振动，并向垫板6内通入循环水以使得粉末浆料冷却至室温，获得最终的成型件。
综上所述：通过设置有加热导向件21及超声压头22，加热导向件21具有用以放置粉末浆料的容置槽211且容置槽211的底部设置有成型模板23，超声压头22在成型施力组件3的作用下沿加热导向件21滑动以提高粉末浆料的流动性能和传力性能，软化粘合剂，降低粘合剂粘度，提高其流动性；
成型施力组件3包括与超声压头22连接的超声振子32，超声振子32传递振动至超声压头22继而使得粉末浆料内的小尺寸固体填充大尺寸固体的间隙，以提高成型件的致密性。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种粉末浆料超声场助压印成型微结构装置，其特征在于，包括：
    底座；
    粉末成型组件，设置在所述底座上且用以将粉末压印成型；
    成型施力组件，与所述粉末成型组件连接；
    所述粉末成型组件包括设置在所述底座上的加热导向件、及与所述成型施力组件连接且沿所述加热导向件滑动的超声压头，所述加热导向件具有用以放置粉末浆料的容置槽，所述容置槽的底部放置有成型模板；所述超声压头在所述成型施力组件的驱动下沿所述加热导向件移动并将粉末浆料压印以使得粉末浆料与成形模板紧密配合。
  2. 如权利要求1所述的粉末浆料超声场助压印成型微结构装置，其特征在于，所述超声压头与所述容置槽的内壁间隙配合。
  3. 如权利要求1所述的粉末浆料超声场助压印成型微结构装置，其特征在于，所述成型施力组件通过导柱与所述底座连接，所述导柱的一端固定设置在所述底座上，所述成型施力组件可相对于所述导柱移动以改变与所述底座之间的间距。
  4. 如权利要求3所述的粉末浆料超声场助压印成型微结构装置，其特征在于，所述成型施力组件包括：
    滑动板，与所述导柱滑动配合；
    超声振子，固定设置在所述滑动板上；
    所述滑动板上开设有通孔，所述成型施力组件还包括变幅杆，所述变幅杆的一端穿过所述通孔与所述超声振子连接，所述变幅杆的另一端与所述超声压头连接。
  5. 如权利要求4所述的粉末浆料超声场助压印成型微结构装置，其特征在于，所述成型施力组件还包括通过立柱与所述滑动板连接的固定板、用以连接所述超声振子和所述固定板的激励陶瓷。
  6. 如权利要求4所述的粉末浆料超声场助压印成型微结构装置，其特征在于，所述滑动板上还设置有与所述导柱滑动配合的导套。
  7. 如权利要求1所述的粉末浆料超声场助压印成型微结构装置，其特征在于，所述底座与所述加热导向件之间还设置有垫板。
  8. 如权利要求1所述的粉末浆料超声场助压印成型微结构装置，其特征在于，所述成型模板朝向所述超声压头的一面上设置有凸起。
  9. 如权利要求8所述的粉末浆料超声场助压印成型微结构装置，其特征在于，所述凸起的横截面的形状为波浪形、弧形、斜坡形、楔形及矩形中的任一种。
  10. 如权利要求1所述的粉末浆料超声场助压印成型微结构装置，其特征在于，所述超声振子的振动频率为10-40kHz，纵向振幅为0.1-10μm。
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