WO2021227739A1 - 一种触控面板及其制备方法、显示面板 - Google Patents

一种触控面板及其制备方法、显示面板 Download PDF

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Publication number
WO2021227739A1
WO2021227739A1 PCT/CN2021/086542 CN2021086542W WO2021227739A1 WO 2021227739 A1 WO2021227739 A1 WO 2021227739A1 CN 2021086542 W CN2021086542 W CN 2021086542W WO 2021227739 A1 WO2021227739 A1 WO 2021227739A1
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WIPO (PCT)
Prior art keywords
sub
layer
electrode
touch panel
color
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Application number
PCT/CN2021/086542
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English (en)
French (fr)
Inventor
崔国意
侯鹏
杨阳
丁小琪
任怀森
李�杰
贾立
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/631,297 priority Critical patent/US11755162B2/en
Publication of WO2021227739A1 publication Critical patent/WO2021227739A1/zh
Priority to US18/363,011 priority patent/US20240019972A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

Definitions

  • the embodiments of the present disclosure belong to the field of display technology, and specifically relate to a touch panel, a manufacturing method thereof, and a display panel.
  • OLED Organic Light-Emitting Diode
  • OLED Organic Light-Emitting Diode
  • the embodiments of the present disclosure provide a touch panel, a manufacturing method thereof, and a display panel.
  • an embodiment of the present disclosure provides a touch panel including a substrate, the substrate includes a first area and a second area, the first area is in a mesh shape, and the second area is formed by the first area.
  • a grid area is formed around the area, a color resist layer is arranged in the second area, a black matrix and a touch control structure are arranged in the first area, and the touch control structure is partially located in the black matrix.
  • the touch control structure includes a first electrode, a second electrode, and an insulating layer disposed between the first electrode and the second electrode, and the insulating layer uses the color resist layer material.
  • the first electrode includes an electrode body and a bridge electrode, an opening is opened in the black matrix, the bridge electrode is disposed in the opening, and the insulating layer and the electrode body are sequentially stacked On the side of the bridge electrode away from the substrate;
  • the bridge electrode is connected to the electrode body, and the electrode body and the second electrode are arranged in the same layer and spaced apart from each other.
  • the color resist layer includes a red resist layer, a green resist layer, and a blue resist layer.
  • the color resist layers are arranged in an array, and the column direction of the array is the first direction.
  • the row direction is the second direction;
  • the red resistive layer, the green resistive layer, and the blue resistive layer are alternately arranged in sequence; and along the second direction, the red resistive layer, the green resistive layer, and the The blue resistive layers are arranged alternately in turn;
  • the surface of the color resist layer, the insulating layer, and the black matrix side facing away from the substrate are flush.
  • the color of the insulating layer located on both sides of the color resist layer of any color and close to the color resist layer is the same as the color of the color resist layer.
  • the color of the barrier layer is different.
  • the insulating layer includes a first sub-portion and a second sub-portion. Along the first direction, the first sub-portion and the second sub-portion are sequentially arranged along the first In two directions, the first sub-portion and the second sub-portion are arranged in sequence;
  • the colors of the color resist layer materials of the first sub-part and the second sub-part are different, and are located on both sides of the color resist layer of any color along the first direction and the second direction.
  • the colors of the first sub-portion and the second sub-portion close to the color resist layer are different from the color of the color resist layer.
  • the insulating layer includes a first sub-portion, a second sub-portion, and a third sub-portion.
  • the three subsections are arranged in sequence; and along the second direction, the first subsection, the second subsection and the third subsection are arranged in sequence;
  • the color of the color resist layer material of the first sub-portion, the second sub-portion and the third sub-portion is different, and is located in any color along the first direction and the second direction.
  • the colors of the first sub-portion and the third sub-portion on both sides of the color resistance layer and close to the color resistance layer are different from the color of the color resistance layer.
  • the insulating layer includes a first sub-portion, a second sub-portion, and a third sub-portion, and the first sub-portion, the second sub-portion, and the third sub-portion are far away from the The direction of the substrate is stacked one by one;
  • the colors of the color resist layer materials of the first sub-section, the second sub-section and the third sub-section are different.
  • the surface of the color resist layer, the black matrix and the insulating layer facing away from the substrate is a rough surface with unevenness.
  • a protective layer is further included, and the protective layer is disposed on a side of the touch structure and the color resist layer away from the substrate.
  • embodiments of the present disclosure provide a display panel, including a display substrate, the display substrate including a pixel defining area and a pixel area defined by the pixel defining area, and further including the above touch panel, the touch The panel is disposed on the display side of the display substrate, and the first area of the touch panel corresponds to the pixel defining area, and the second area of the touch panel corresponds to the pixel area.
  • the display substrate includes a substrate and a pixel drive circuit and a light-emitting element sequentially disposed on the substrate, the light-emitting element is located in the pixel area, and the pixel drive circuit is connected to the light-emitting element, To drive the light-emitting element to emit light.
  • the light-emitting color of the light-emitting element is the same as the color of the color resist layer in the second region corresponding to the light-emitting element.
  • the display substrate further includes an encapsulation layer disposed on a side of the light-emitting element away from the substrate, and the encapsulation layer is used to encapsulate the light-emitting element.
  • the base of the touch panel is used as an encapsulation layer of the display substrate, and the encapsulation layer is used to encapsulate the light-emitting element.
  • inventions of the present disclosure provide a method for manufacturing a touch panel.
  • the touch panel includes a substrate.
  • the substrate includes a first region and a second region.
  • the second area is a grid area surrounded by the first area
  • the preparation method includes forming a color resist layer in the second area, and the preparation method further includes forming in the first area
  • a black matrix and a touch structure the touch structure is partially located in the black matrix
  • forming the touch structure includes forming a first electrode, a second electrode, and an insulating layer, the insulating layer being formed on the first electrode Between the second electrode and the second electrode, the insulating layer is made of the color resist layer material.
  • forming the first electrode includes forming an electrode body and a bridge electrode; forming the color resist layer includes forming a red resist layer, a green resist layer, and a blue resist layer; and the method of manufacturing the touch panel includes :
  • the black matrix is formed in the first area
  • the bridge electrode Forming a pattern of the bridge electrode; the bridge electrode is located in the opening;
  • Color resist layers of different colors are sequentially formed, and at the same time, the insulating layers of different colors are sequentially formed; wherein, the color resist layers are formed in the second region, and the insulating layer is formed in the first region; the same color The color resistance layer and the insulating layer are formed through a single process;
  • the electrode body is connected to the bridge electrode;
  • forming the first electrode includes forming an electrode body and a bridge electrode; forming the color resist layer includes forming a red resist layer, a green resist layer, and a blue resist layer; and forming the insulating layer includes forming first sub-layers of different colors. Or, forming the insulating layer includes forming the first, second, and third sub-parts of different colors; the manufacturing method of the touch panel includes:
  • the black matrix is formed in the first area
  • the bridge electrode Forming a pattern of the bridge electrode; the bridge electrode is located in the opening;
  • the color resist layers of different colors are sequentially formed, and at the same time, the sub-parts of the insulating layer of different colors are sequentially formed; wherein the color resist layer is formed in the second region, and the sub-parts of the insulating layer are formed in the The first region; the color resistance layer and the insulating layer of the same color are formed by a single process;
  • a pattern of the electrode body and the second electrode is formed through a single process; the electrode body is connected to the bridge electrode.
  • Figure 1 is a cross-sectional view of the structure of an OLED display device in the disclosed technology
  • FIG. 2 is a top view of a macro partial structure of a touch panel in an embodiment of the disclosure
  • FIG. 3 is a top view of a microscopic partial structure of a touch panel in an embodiment of the disclosure
  • FIG. 4 is a cross-sectional view of the structure of the touch panel in FIG. 3 along a section line AA;
  • step S1 of the touch panel manufacturing method in the embodiment of the disclosure is completed
  • FIG. 6 is a structural cross-sectional view of the touch panel after step S2 of the touch panel manufacturing method in the embodiment of the disclosure is completed;
  • step S3 is a cross-sectional view of the structure of the touch panel after step S3 of the method for manufacturing the touch panel in the embodiment of the disclosure is completed;
  • step S4 of the touch panel manufacturing method in the embodiment of the disclosure is completed;
  • step S5 of the method for preparing the touch panel in the embodiment of the disclosure is completed;
  • FIG. 10 is a cross-sectional view of another structure of the touch panel in FIG. 3 along the AA section line;
  • FIG. 11 is a cross-sectional view of another structure of the touch panel in FIG. 3 along the AA section line;
  • FIG. 12 is a cross-sectional view of another structure of the touch panel in FIG. 3 along the AA section line;
  • FIG. 13 is a cross-sectional view of a structure of a display panel in an embodiment of the disclosure.
  • Substrate 101, first zone; 102, second zone; 2. color resist layer; 21, red resist layer; 22, green resist layer; 23, blue resist layer; 3. black matrix; 30, opening; 4. Touch structure; 41, first electrode; 411, electrode body; 412, bridge electrode; 42, second electrode; 43, insulating layer; 431, first sub-part; 432, second sub-part; 433, first Three subsections; 5.
  • Protective layer 6.
  • the filter is integrated on the OLED display device.
  • the touch panel is integrated on the OLED display device.
  • the touch panel and the filter are directly integrated on the OLED display device, which not only increases the thickness of the OLED display device, but also reduces the bending performance of the OLED display device, while also increasing the OLED display device.
  • the manufacturing process of the display device has increased the production cost; in addition, the direct integration of the touch panel on the OLED display device directly causes the thickness of the OLED display device to increase, which will cause the signal line of the touch electrode to pass through a larger Only the height difference can be routed to the binding area of the OLED display device, and the route is prone to open or short circuit after a large height difference, which affects the quality of the OLED display device.
  • the film layer structure of the OLED display device is set as shown in FIG.
  • the touch panel 7 and the filter 8 are directly prepared on the encapsulation layer 64.
  • the preparation of the touch panel 7 includes sequentially forming a substrate 1, a bridge electrode 412, an insulating layer 9, a first touch electrode 10 and a second touch electrode 11, and a first flat layer 12 on the encapsulation layer 64;
  • the control electrode 10 is connected to the bridge electrode 412 through a via hole opened in the insulating layer 9.
  • the preparation of the filter 8 includes: sequentially forming a pattern of the black matrix 3, a pattern of the color resist layer 2 of different colors, and a second flat layer 13 on the display substrate of the finished touch panel 7.
  • the structure of the aforementioned OLED display device not only increases the thickness of the OLED display device, but also reduces the bending performance of the OLED display device.
  • the preparation process of the aforementioned OLED display device also increases the preparation process of the OLED display device, thereby increasing Production cost; in addition, the direct integration of the touch panel on the OLED display device will increase the thickness of the OLED display device, which will cause the signal line of the touch electrode to go through a large height difference before it can be routed to the OLED display device In the bonding area, the wiring is prone to open or short circuit after a large height difference, which affects the quality of the OLED display device.
  • the embodiments of the present disclosure provide a touch panel and a manufacturing method thereof, a display panel and a manufacturing method thereof.
  • an embodiment of the present disclosure provides a touch panel, as shown in FIGS. 2 to 4, including a substrate 1.
  • the substrate 1 includes a first region 101 and a second region 102.
  • the second area 102 is a grid area surrounded by the first area 101, the second area 102 is provided with a color resist layer 2, the first area 101 is provided with a black matrix 3 and a touch structure 4, and the touch structure 4 is partially located In the black matrix 3, the touch structure 4 includes a first electrode 41, a second electrode 42 and an insulating layer 43 disposed between the first electrode 41 and the second electrode 42.
  • the insulating layer 43 is made of the color resist layer 2 material.
  • the second area 102 corresponds to the pixel area, and the pixel areas are arranged in an array, that is, the color resist layers 2 are arranged in an array, and the second area 102 is also arranged in an array.
  • the first electrode 41 is a grid electrode extending along the array column direction, that is, the first direction Y
  • the second electrode 42 is a grid electrode extending along the array row direction, that is, the second direction X.
  • the first electrode 41 and the second electrode 42 are disconnected from each other to be insulated from each other, and the first electrode and the second electrode 42 are separated by an insulating layer 43 at a bridging position that crosses each other to be insulated from each other.
  • Figure 3 shows a schematic view of the microstructure of a part of the first electrode 41 and a part of the second electrode 42 from a microscopic point of view. Since it is a top view, the gap between the first electrode 41 and the second electrode 42 is not shown in Figure 3 Disconnected from each other.
  • the partial microstructure of the first electrode 41 and the partial microstructure of the second electrode 42 shown in FIG. 3 are only one of the structural arrangements of the touch structure 4, the microstructure of the first electrode 41 and the microstructure of the second electrode 42
  • the structure can also be other grid-like structure arrangements, and is not limited to the one shown in Figure 3; for example, the first electrode and the second electrode can be microscopically arranged in the first area as a sheet Grid electrode lines, etc.
  • the touch panel can be integrated on the display side of the OLED display device.
  • the color resist layer 2 can function as a filter to make the color of the light emitted by the light-emitting element in the OLED display device more pure.
  • the arrangement of the black matrix 3 can avoid cross-color light emitted by adjacent light-emitting elements.
  • the touch panel is integrated on the OLED display device, so that the OLED display device can not only touch, but also improve the color purity of its display.
  • the structure of the touch panel can integrate the filter and the touch panel. Compared with the filter and the touch panel directly integrated in the OLED display device in the public technology, the color resist layer 2 material is used.
  • the insulating layer 43 can replace the insulating layer that needs to be separately provided in the original touch panel; by using the black matrix 3, it can replace the first flat layer that needs to be separately provided in the original touch panel; thereby reducing the filter and the touch panel
  • the film setting when integrated together reduces the thickness of the film when the filter is integrated with the touch panel, and improves the bending performance of the touch panel; at the same time, the filter and touch panel in this implementation
  • the touch panel integrated with the control panel reduces the preparation process of the insulating layer and the first flat layer, thereby reducing the production cost; in addition, because the filter is integrated with the touch panel The overall thickness of the touch panel is reduced.
  • the signal lines of the touch structure 4 in the touch panel can be routed to the binding of the OLED display device after a small height difference Since the black matrix 3 has a certain leveling property, in the process of directly preparing the touch panel on the OLED display device, the black matrix 3 can be compared from the display area of the OLED display device to its binding area.
  • the gentle slope enables the signal lines of the touch structure 4 to be routed smoothly to the bonding area of the OLED display device, thereby avoiding the phenomenon of open circuit or short circuit in the signal line routing from the display area to the bonding area. Ensure the quality of the touch panel.
  • the first electrode 41 includes an electrode body 411 and a bridge electrode 412.
  • the black matrix 3 is provided with an opening, the bridge electrode 412 is disposed in the opening, and the insulating layer 43 and the electrode body 411 are sequentially stacked on the bridge electrode 412. A side away from the substrate 1; the bridge electrode 412 is connected to the electrode body 411, and the electrode body 411 and the second electrode 42 are arranged in the same layer and spaced apart from each other.
  • the electrode body 411 of the first electrode 41 and the second electrode 42 are located on the same layer, the bridge electrode 412 of the first electrode 41 and the second electrode 42 are in different layers, and the bridge electrode 412 and the second electrode 42 and the electrode An insulating layer 43 is arranged between the main body 411, so that the first electrode 41 and the second electrode 42 are vertically and horizontally cross-insulated.
  • the color resist layer 2 includes a red resist layer 21, a green resist layer 22, and a blue resist layer 23.
  • the color resist layer 2 is arranged in an array.
  • the column direction of the array is the first direction Y, and the row direction of the array is Is the second direction X; along the first direction Y, the red resist layer 21, the green resist layer 22, and the blue resist layer 23 are alternately arranged in sequence; along the second direction X, the red resist layer 21, the green resist layer 22 and the blue resist layer
  • the resist layers 23 are arranged alternately in sequence; the surface of the color resist layer 2, the insulating layer 43 and the black matrix 3 away from the substrate 1 is flush.
  • the color resist layer 2 is arranged corresponding to the pixel unit, the pixel units are arranged in an array, and the color resist layer 2 is also arranged in an array, that is, the second area 102 is arranged in an array.
  • the color of the insulating layer 43 located on both sides of the color resist layer 2 of any color and close to the color resist layer 2 is different from the color of the color resist layer 2.
  • the surface of the color resist layer 2, the black matrix 3 and the insulating layer 43 facing away from the substrate 1 is a rough surface with unevenness.
  • the touch panel further includes a protective layer 5 disposed on the side of the touch structure 4 and the color resist layer 2 away from the substrate 1.
  • the protective layer 5 usually adopts an organic resin material, and the protective layer 5 can form a good protection for the touch structure 4 and the color resist layer 2 in the touch panel.
  • the first electrode 41 and the second electrode 42 may be block-shaped or mesh-shaped.
  • the first electrodes 41 arranged in the first direction Y are connected as one body and connected to a signal line; the second electrodes 42 arranged in the second direction X are connected as one body and connected to a signal line.
  • the first electrode 41 is a driving electrode and the second electrode 42 is a sensing electrode.
  • the driving voltage signal is input to the second electrode 42 row by row along the second direction X, and receives the driving voltage signal along the first electrode.
  • the coupling between the electrodes 42 changes the capacitance between the first electrode 41 and the second electrode 42; when the mutual capacitance is detected, the driving voltage signal is sequentially input to the second electrode 42 in the second direction X, and the first direction
  • the first electrode 41 of Y receives signals at the same time, and the capacitance values of all the intersections of the first direction Y and the second direction X can be obtained, that is, the capacitance of the entire two-dimensional plane of the touch panel, according to the two-dimensional plane of the touch panel
  • the capacitance change data the coordinates of each touch point can be calculated, so as to realize the mutual capacitance touch of the touch panel.
  • the substrate 1 uses a release film. That is, the substrate 1 can be peeled off from the touch panel, so that the touch panel can be attached to the OLED display device.
  • the touch panel can also be directly prepared on the display side of the OLED display device. In this case, the touch panel does not need to be provided with the substrate 1, and the touch panel can be directly prepared on the display side of the encapsulated OLED display device. .
  • the release film used in the substrate 1 may be a PE release film, a PET release film, a PC release film, a PMMA release film, or the like.
  • the substrate 1, the black matrix 3, the color resist layer 2, the insulating layer 43, and the protective layer 5 are all made of organic film materials, the touch panel has good bending performance and is suitable for flexible display panels. Touch.
  • the touch panel includes a substrate.
  • the substrate includes a first area and a second area.
  • the first area is in a mesh shape and the second area is It is a grid area surrounded by the first area.
  • the preparation method includes forming a color resist layer in the second area, and further includes forming a black matrix and a touch structure in the first area, and the touch structure is partially Located in the black matrix, forming the touch control structure includes forming a first electrode, a second electrode, and an insulating layer.
  • the insulating layer is formed between the first electrode and the second electrode, and the insulating layer is made of a color resist layer material.
  • forming the first electrode includes forming an electrode body and a bridge electrode; forming a color resist layer includes forming a red resist layer, a green resist layer, and a blue resist layer; the manufacturing method of the touch panel specifically includes: Figure 5- Shown in Figure 9.
  • Step S1 A pattern of the black matrix 3 is formed on the substrate 1 through a single process, and an opening 30 is formed in the black matrix 3; the black matrix 3 is formed in the first region 101, as shown in FIG. 5.
  • a layer of black matrix film is coated on the substrate 1, and then the pattern of the black matrix 3 is formed by exposure and development. At the same time, the pattern of the opening 30 is formed in the black matrix 3. The pattern of the black matrix 3 is formed at the same time. The pattern of the formation area of the color resist layer.
  • Step S2 forming a pattern of the bridge electrode 412; the bridge electrode 412 is located in the opening 30, as shown in FIG. 6.
  • a layer of conductive metal film is deposited, and the pattern of the bridge electrode 412 is formed through a patterning process (including steps of exposure, development, and etching); at the same time, the pattern of the signal line connecting the first electrode ( Figure Not shown in).
  • Step S3 sequentially form the color resist layers 2 of different colors, and at the same time, sequentially form the insulating layers 43 of different colors; wherein the color resist layers 2 are formed in the second region 102, and the insulating layer 43 is formed in the first region;
  • the resist layer 2 and the insulating layer 43 are formed through a single process, as shown in FIG. 7.
  • a color resist layer film of one color such as a red resist layer film
  • a pattern of the red resist layer 21 and a pattern of a part of the insulating layer 43 using a red resist layer material are formed through exposure and development processes.
  • the pattern of the green resist layer 22 and the pattern of the part of the insulating layer 43 using the green resist material, the pattern of the blue resist layer 23 and the pattern of the part of the insulating layer 43 using the blue resist material are formed.
  • Step S4 forming patterns of the electrode body 411 and the second electrode 42 through a single process; the electrode body 411 is connected to the bridge electrode 412, as shown in FIG. 8.
  • a conductive metal film layer is deposited, and the pattern of the electrode body 411 and the second electrode 42 is formed through a patterning process (including exposure, development, etching, etc.); at the same time, the pattern of the second electrode 42 can also be formed.
  • Figure of the signal line (not shown in the figure).
  • step S4 when the pattern of the electrode body 411 and the second electrode 42 is formed by etching, a process of processing the surface of the color resist layer 2, the insulating layer 43 and the black matrix 3 can be added to remove the color resist layer 2 The surface of the insulating layer 43 and the black matrix 3 away from the substrate 1 is processed into a rough surface with unevenness.
  • the specific process of the treatment is as follows: oxygen is introduced into the process chamber, and the oxygen reacts with the surface of the color resist layer 2, the insulating layer 43 and the black matrix 3 to form an uneven surface; or, bombard the color resist with inert gas in the process chamber The surface of the layer 2, the insulating layer 43 and the black matrix 3 forms an uneven surface; or, the above two treatment processes can be used at the same time to process the color resist layer 2, the insulating layer 43 and the surface of the black matrix 3 away from the substrate 1 into The uneven surface is used to enhance the OLED display device using the touch panel.
  • the manufacturing method of the touch panel further includes: Step S5: forming a protective layer 5, as shown in FIG. 9.
  • the protective layer 5 is formed by a coating method.
  • the preparation process of the silicon nitride insulating layer and the preparation of the first flat layer are reduced. Therefore, the production cost is reduced, and the thickness of the touch panel is also reduced, and the bending performance is improved.
  • the embodiment of the present disclosure provides a touch panel.
  • the insulating layer 43 includes a first sub-part 431 and a second sub-part 432.
  • the sub-sections 431 and the second sub-sections 432 are arranged in sequence, and along the second direction, the first sub-sections 431 and the second sub-sections 432 are arranged in sequence; the color resist layer materials of the first sub-sections 431 and the second sub-sections 432
  • the colors are different, and along the first direction Y and the second direction, the color of the first sub-part 431 and the second sub-part 432 of any color resist layer 2 located on both sides of the color resist layer 2 and the color resist The color of layer 2 is different.
  • This arrangement can also prevent the light emitted by the light emitting element corresponding to the color resist layer 2 from exiting through the insulating layer 43 located on both sides thereof, thereby avoiding cross-color light emitted by two adjacent light emitting elements.
  • this embodiment also provides a method for manufacturing the touch panel.
  • the difference from the above-mentioned method for manufacturing the touch panel is that forming an insulating layer includes forming a first layer of different colors.
  • the sub-part and the second sub-part; the preparation method of the touch panel specifically includes:
  • Step S1 forming a black matrix pattern through a single process, and forming an opening in the black matrix; the black matrix is formed in the first area.
  • Step S2 forming a pattern of the bridge electrode; the bridge electrode is located in the opening.
  • Step S3 sequentially forming the color resist layers of different colors, and at the same time, sequentially forming the sub-portions of the insulating layers of different colors; that is, sequentially forming the first sub-portion and the second sub-portion of the insulating layers of different colors; wherein the color resist layer is formed In the second zone, the sub-parts of the insulating layer (that is, the first sub-part and the second sub-part) are formed in the first zone; Part) is formed through a single process.
  • Step S4 forming the pattern of the electrode body and the second electrode through a single process; the electrode body is connected to the bridge electrode.
  • the embodiment of the present disclosure provides a touch panel.
  • the difference from the above-mentioned embodiment is that, as shown in FIG. In a direction Y, the first sub-portion 431, the second sub-portion 432, and the third sub-portion 433 are arranged in sequence; and along the second direction, the first sub-portion 431, the second sub-portion 432, and the third sub-portion 433 are arranged in sequence
  • the first sub-section 431, the second sub-section 432 and the third sub-section 433 of the color resist layer materials are different in color, and along the first direction Y and the second direction, located on either side of the color resist layer 2 and
  • the color of the first sub-part 431 and the third sub-part 433 close to the color resist layer 2 is different from the color of the color resist layer 2.
  • This arrangement also prevents the light emitted by the light emitting element corresponding to the color resist layer 2 from exiting through the insulating layer 43 located on both sides thereof, thereby avoiding cross-color light emitted by two adjacent light emitting elements.
  • this embodiment also provides a method for manufacturing the touch panel.
  • the difference from the above-mentioned method for manufacturing the touch panel is that forming an insulating layer includes forming a first layer of different colors.
  • step S3 is specifically: forming color resist layers of different colors in sequence, and at the same time, forming sub-portions of insulating layers of different colors in sequence; that is, The first sub-section, the second sub-section and the third sub-section of the insulating layer of different colors are sequentially formed; wherein the color resist layer is formed in the second region, and the sub-sections of the insulating layer (ie, the first sub-section, the second sub-section And the third sub-portion) are formed in the first region; the sub-portions of the color resist layer and the insulating layer of the same color (that is, the first sub-portion, the second sub-portion, and the third sub-portion) are formed through a single process.
  • the embodiment of the present disclosure also provides a touch panel.
  • the insulating layer 43 includes a first sub-part 431, a second sub-part 432, and a third sub-part 433.
  • a sub-section 431, a second sub-section 432, and a third sub-section 433 are sequentially stacked in a direction away from the substrate 1; the color of the color resist layer materials of the first sub-section 431, the second sub-section 432 and the third sub-section 433 different.
  • This arrangement can also prevent the light emitted by the light emitting element corresponding to the color resist layer 2 from exiting through the insulating layer 43 located on both sides thereof, thereby avoiding cross-color light emitted by two adjacent light emitting elements.
  • this embodiment also provides a method for preparing the touch panel.
  • the difference from the above-mentioned method for preparing the touch panel is that the specific preparation process of step S3 is: first coating A color resist layer film of one color, such as a red resist layer film, is fabricated; then, the pattern of the red resist layer and the pattern of the first sub-part of the insulating layer using the red resist layer material are formed through the exposure and development process of a gray-scale mask.
  • the pattern of the green resist layer and the pattern of the second sub-part of the insulating layer using the green resist layer material and the pattern of the blue resist layer and the insulating layer using the blue resist layer material are formed through the gray-scale mask exposure and development process.
  • the colors of the first sub-part, the second sub-part, and the third sub-part may not be the above-mentioned red, green, and blue settings, but green, red, and blue settings or blue, red, and green settings, etc., No matter how the colors of the first sub-part, the second sub-part, and the third sub-part are set, it can prevent the light emitted by the light-emitting element corresponding to the color resist layer from exiting through the insulating layer located on both sides of it, thereby avoiding The light emitted by two adjacent light-emitting elements has a cross-color effect.
  • the touch panel provided in the above disclosed embodiment can integrate the filter and the touch panel. Compared with the filter and the touch panel directly integrated in the OLED display device in the disclosed technology, the color resist is used.
  • the insulating layer of layer material can replace the insulating layer that needs to be separately provided in the original touch panel; by adopting the black matrix, it can replace the first flat layer that needs to be separately provided in the original touch panel; thereby reducing the filter and touch
  • the film setting when the panels are integrated together reduces the thickness of the film when the filter is integrated with the touch panel, and improves the bending performance of the touch panel; at the same time, the filter and the touch panel in this implementation
  • the touch panel is integrated with the touch panel, because the preparation of the insulating layer and the first flat layer is reduced, so the preparation process is reduced, thereby reducing the production cost; in addition, because the filter is integrated with the touch panel The overall thickness of the touch panel is reduced.
  • the signal lines of the touch structure in the touch panel can be routed to the binding of the OLED display device after a small height difference
  • the black matrix has certain leveling properties, in the process of directly preparing the touch panel on the OLED display device, the black matrix extends from the display area of the OLED display device to its binding area to form a relatively gentle The slope, so that the signal lines of the touch structure can be routed smoothly to the bonding area of the OLED display device, thereby avoiding open or short circuits in the signal line routing from the display area to the bonding area, ensuring this The quality of the touch panel.
  • an embodiment of the present disclosure provides a display panel, as shown in FIG. 13, including a display substrate 6.
  • the display substrate 6 includes a pixel defining area and a pixel area defined by the pixel defining area, and further includes any one of the above embodiments.
  • the touch panel 7 is disposed on the display side of the display substrate 6, and the first area of the touch panel 7 corresponds to the pixel defined area, and the second area of the touch panel 7 corresponds to the pixel area.
  • the pixel defining area is the interval area between the pixel areas, and the pixel defining area is usually used for setting the pixel defining layer and part of the circuit wiring.
  • the filter and the touch panel are directly integrated on the OLED display device, which not only reduces the thickness of the display panel, but also The bending performance of the display panel is improved; and the production cost of the display panel is reduced; in addition, because the overall thickness of the touch panel 7 is reduced, when the touch panel 7 is integrated on the display substrate 6, the touch panel 7
  • the signal lines of the middle touch structure can be routed to the binding area on the display substrate 6 through a small height difference, and because the black matrix has a certain leveling property, the touch panel 7 is directly prepared on the display substrate During the above process, the black matrix extends from the display area of the display substrate 6 to its binding area to form a relatively gentle slope, so that the signal lines of the touch structure can be routed smoothly to the binding area of the display substrate 6, and then The signal line routing from the display area to the bonding area is prevented from being broken or short-circuited, and the quality of the display panel is ensured.
  • the display substrate 6 includes a substrate 61 and a pixel driving circuit 62 and a light emitting element 63 sequentially disposed on the substrate 61.
  • the light emitting element 63 is located in the pixel area, and the pixel driving circuit 62 is connected to the light emitting element 63 to drive the light emitting element. 63 shine.
  • the light-emitting element 63 may be an OLED (Organic Light-Emitting Diode) or an LED (Light Emitting Diode).
  • the pixel driving circuit 62 adopts a conventional pixel circuit design that is relatively mature at present, and the pixel driving circuit 62 is not improved in this embodiment, and will not be repeated here.
  • the light-emitting color of the light-emitting element 63 is the same as the color of the color resist layer 2 in the second region corresponding to the light-emitting element 63. That is, the light-emitting element 63 includes a red light-emitting element, a green light-emitting element, and a blue light-emitting element.
  • the color resistance layer 2 can make the color of the light emitted by the light-emitting element 63 more pure, thereby enhancing the display color effect of the display panel.
  • the light-emitting element may also be a blue organic light-emitting diode.
  • the color resistance layer can realize the color display of the display panel.
  • the display substrate 6 further includes an encapsulation layer 64 disposed on a side of the light-emitting element 63 away from the substrate 61, and the encapsulation layer 64 is used to encapsulate the light-emitting element 63.
  • the encapsulation layer 64 is formed by alternately overlapping a plurality of organic film layers and a plurality of inorganic film layers, which can prevent external water and oxygen from intruding and causing damage to the light-emitting element 63.
  • the base 1 of the touch panel 7 may be directly disposed on the encapsulation layer 64, or the base 1 of the touch panel 7 may be peeled off, so that the remaining part is disposed on the encapsulation layer 64.
  • the display substrate may not be provided with an encapsulation layer
  • the base of the touch panel is used as the encapsulation layer of the display substrate
  • the encapsulation layer is used to encapsulate the light-emitting element.
  • this embodiment also provides a method for preparing a display panel, including preparing a display substrate.
  • the display substrate includes a pixel defining area and a pixel area defined by the pixel defining area.
  • the touch panel in any of the above embodiments is prepared on the display side of the substrate; wherein the first area of the touch panel corresponds to the pixel defining area, and the second area of the touch panel corresponds to the pixel area.
  • preparing the display substrate includes sequentially forming a pixel driving circuit and a light-emitting element on the substrate, and then preparing an encapsulation layer to encapsulate the light-emitting element.
  • the pixel driving circuit and the light-emitting element are prepared by using traditional techniques, which will not be repeated here.
  • the touch panel is prepared on the encapsulation layer of the display substrate.
  • the encapsulation layer can be used as the base of the touch panel, and the black matrix, the color resist layer and the touch structure can be directly prepared on the encapsulation layer.
  • the substrate of the touch panel, the black matrix, the color resist layer, and the touch structure can also be prepared on the encapsulation layer.
  • the touch panel prepared by the preparation method in the above embodiments can also be attached to the display side of the display substrate; wherein, the base of the touch panel can be peeled off, and then the touch panel can be peeled off.
  • the rear touch panel is attached to the display side of the display substrate.
  • the display substrate in the display panel may also be a liquid crystal display substrate, and other structural settings of the liquid crystal display substrate are conventional structures that can realize normal display.
  • the liquid crystal display substrate includes a back light for providing a backlight.
  • the panel and the array substrate, the touch panel and the array substrate are aligned, and liquid crystal is filled in the gap; in addition, upper and lower polarizers are attached to the light entrance side of the array substrate and the light exit side of the touch panel.
  • the touch panel can not only realize the touch control of the liquid crystal display panel, but also realize the color display of the liquid crystal display panel.
  • the touch panel in any of the above embodiments, compared to the direct integration of the filter and the touch panel on the OLED display device in the disclosed technology, it not only reduces the The thickness of the display panel improves the bending performance of the display panel; and reduces the production cost of the display panel; in addition, because the overall thickness of the touch panel is reduced, when the touch panel is integrated on the display substrate, the touch The signal lines of the touch structure in the panel can be routed to the binding area on the display substrate after a small height difference, and because the black matrix has a certain leveling property, the touch panel is directly prepared on the display substrate During the process, the black matrix extends from the display area of the display substrate to its binding area to form a relatively gentle slope, so that the signal lines of the touch structure can be routed smoothly to the binding area of the display substrate, thereby avoiding the display The signal line from the area to the bonding area is open or short-circuited, which ensures the quality of the display panel.
  • the display panel provided by the embodiment of the present disclosure may be any product or component with display function, such as an OLED panel, an OLED TV, an LED panel, an LED TV, an LCD panel, an LCD TV, a display, a mobile phone, or a navigator.

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Abstract

一种触控面板和显示面板，所述触控面板包括基底(1)，所述基底(1)包括第一区(101)和第二区(102)，所述第一区(101)呈网状，所述第二区(102)是由所述第一区(101)围设形成的网格区，所述第二区(102)内设置有色阻层(2)，所述第一区(101)内设置有黑矩阵(3)和触控结构(4)，所述触控结构(4)局部位于所述黑矩阵(3)中，所述触控结构(4)包括第一电极(41)、第二电极(42)和设置于所述第一电极(41)和所述第二电极(42)之间的绝缘层(43)，所述绝缘层(43)采用所述色阻层(2)材料。所述显示面板包括显示基板(6)，所述显示基板(6)包括像素界定区和由所述像素界定区界定形成的像素区，还包括上述触控面板(7)，所述触控面板(7)设置于所述显示基板(6)的显示侧，且所述触控面板(7)的第一区(101)对应所述像素界定区，所述触控面板(7)的第二区(102)对应所述像素区。

Description

一种触控面板及其制备方法、显示面板 技术领域
本公开实施例属于显示技术领域，具体涉及一种触控面板及其制备方法、显示面板。
背景技术
随着OLED(Organic Light-Emitting Diode，有机发光二极管)显示器件的迅猛发展，人们在追求其色域广、颜色艳丽、可以曲面和全面屏化等的同时，对其更加轻薄，可弯折等有了更高的要求。
发明内容
本公开实施例提供一种触控面板及其制备方法、显示面板。
第一方面，本公开实施例提供一种触控面板，包括基底，所述基底包括第一区和第二区，所述第一区呈网状，所述第二区是由所述第一区围设形成的网格区，所述第二区内设置有色阻层，所述第一区内设置有黑矩阵和触控结构，所述触控结构局部位于所述黑矩阵中，所述触控结构包括第一电极、第二电极和设置于所述第一电极和所述第二电极之间的绝缘层，所述绝缘层采用所述色阻层材料。
在一些实施例中，所述第一电极包括电极本体和桥电极，所述黑矩阵中开设有开口，所述桥电极设置于所述开口中，所述绝缘层和所述电极本体依次叠置于所述桥电极的背离所述基底的一侧；
所述桥电极连接所述电极本体，所述电极本体与所述第二电极同层设置且相互间隔。
在一些实施例中，所述色阻层包括红色阻层、绿色阻层和蓝色阻层， 所述色阻层排布呈阵列，所述阵列的列方向为第一方向，所述阵列的行方向为第二方向；
沿所述第一方向，所述红色阻层、所述绿色阻层和所述蓝色阻层依次交替排布；沿所述第二方向，所述红色阻层、所述绿色阻层和所述蓝色阻层依次交替排布；
所述色阻层、所述绝缘层和所述黑矩阵的背离所述基底的一侧表面平齐。
在一些实施例中，沿所述第一方向和所述第二方向，位于任一颜色所述色阻层两侧且靠近该所述色阻层的所述绝缘层的颜色与该所述色阻层的颜色不同。
在一些实施例中，所述绝缘层包括第一子部和第二子部，沿所述第一方向，所述第一子部和所述第二子部依次排布，且沿所述第二方向，所述第一子部和所述第二子部依次排布；
所述第一子部和所述第二子部的所述色阻层材料的颜色不同，且沿所述第一方向和所述第二方向，位于任一颜色所述色阻层两侧且靠近该所述色阻层的所述第一子部和所述第二子部的颜色与该所述色阻层的颜色不同。
在一些实施例中，所述绝缘层包括第一子部、第二子部和第三子部，沿所述第一方向，所述第一子部、所述第二子部和所述第三子部依次排布；且沿所述第二方向，所述第一子部、所述第二子部和所述第三子部依次排布；
所述第一子部、所述第二子部和所述第三子部的所述色阻层材料的颜色不同，且沿所述第一方向和所述第二方向，位于任一颜色所述色阻层两侧且靠近该所述色阻层的所述第一子部和所述第三子部的颜色与该所述色阻层的颜色不同。
在一些实施例中，所述绝缘层包括第一子部、第二子部和第三子部， 所述第一子部、所述第二子部和所述第三子部沿远离所述基底的方向依次叠置；
所述第一子部、所述第二子部和所述第三子部的所述色阻层材料的颜色不同。
在一些实施例中，所述色阻层、所述黑矩阵和所述绝缘层的背离所述基底的一侧表面为凹凸不平的粗糙表面。
在一些实施例中，还包括保护层，所述保护层设置于所述触控结构和所述色阻层的背离所述基底的一侧。
第二方面，本公开实施例提供一种显示面板，包括显示基板，所述显示基板包括像素界定区和由所述像素界定区界定形成的像素区，还包括上述触控面板，所述触控面板设置于所述显示基板的显示侧，且所述触控面板的第一区对应所述像素界定区，所述触控面板的第二区对应所述像素区。
在一些实施例中，所述显示基板包括基板和依次设置于所述基板上的像素驱动电路和发光元件，所述发光元件位于所述像素区，所述像素驱动电路与所述发光元件连接，以驱动所述发光元件发光。
在一些实施例中，所述发光元件的发光颜色与对应该所述发光元件的所述第二区内的色阻层的颜色相同。
在一些实施例中，所述显示基板还包括封装层，所述封装层设置于所述发光元件的背离所述基板的一侧，所述封装层用于对所述发光元件进行封装。
在一些实施例中，所述触控面板的基底复用作所述显示基板的封装层，所述封装层用于对所述发光元件进行封装。
第三方面，本公开实施例提供一种触控面板的制备方法，所述触控面板包括基底，所述基底包括第一区和第二区，所述第一区呈网状，所述第二区是由所述第一区围设形成的网格区，所述制备方法包括，在所述第二区内形成色阻层，所述制备方法还包括，在所述第一区内形成黑矩阵和触 控结构，所述触控结构局部位于所述黑矩阵中，形成所述触控结构包括形成第一电极、第二电极和绝缘层，所述绝缘层形成于所述第一电极和所述第二电极之间，所述绝缘层采用所述色阻层材料。
在一些实施例中，形成所述第一电极包括形成电极本体和桥电极；形成所述色阻层包括形成红色阻层、绿色阻层和蓝色阻层；所述触控面板的制备方法包括：
通过一次工艺形成所述黑矩阵的图形，并在所述黑矩阵中形成开口；所述黑矩阵形成于所述第一区；
形成所述桥电极的图形；所述桥电极位于所述开口中；
依次形成不同颜色的色阻层，同时，依次形成不同颜色的所述绝缘层；其中，所述色阻层形成于所述第二区，所述绝缘层形成于所述第一区；相同颜色的所述色阻层与所述绝缘层通过一次工艺形成；
通过一次工艺形成所述电极本体和所述第二电极的图形；所述电极本体连接所述桥电极；
或者，形成所述第一电极包括形成电极本体和桥电极；形成所述色阻层包括形成红色阻层、绿色阻层和蓝色阻层；形成所述绝缘层包括形成不同颜色的第一子部和第二子部；或者，形成所述绝缘层包括形成不同颜色的第一子部、第二子部和第三子部；所述触控面板的制备方法包括：
通过一次工艺形成所述黑矩阵的图形，并在所述黑矩阵中形成开口；所述黑矩阵形成于所述第一区；
形成所述桥电极的图形；所述桥电极位于所述开口中；
依次形成不同颜色的色阻层，同时，依次形成不同颜色的所述绝缘层的子部；其中，所述色阻层形成于所述第二区，所述绝缘层的子部形成于所述第一区；相同颜色的所述色阻层与所述绝缘层的子部通过一次工艺形成；
通过一次工艺形成所述电极本体和所述第二电极的图形；所述电极本体连接所述桥电极。
附图说明
附图用来提供对本公开实施例的进一步理解，并且构成说明书的一部分，与本公开实施例一起用于解释本公开，并不构成对本公开的限制。通过参考附图对详细示例实施例进行描述，以上和其它特征和优点对本领域技术人员将变得更加显而易见，在附图中：
图1为公开技术中OLED显示器件的结构剖视图；
图2为本公开实施例中触控面板的宏观局部结构俯视图；
图3为本公开实施例中触控面板的微观局部结构俯视图；
图4为图3中触控面板沿AA剖切线的结构剖视图；
图5为本公开实施例中触控面板制备方法步骤S1完成后触控面板的结构剖视图；
图6为本公开实施例中触控面板制备方法步骤S2完成后触控面板的结构剖视图；
图7为本公开实施例中触控面板制备方法步骤S3完成后触控面板的结构剖视图；
图8为本公开实施例中触控面板制备方法步骤S4完成后触控面板的结构剖视图；
图9为本公开实施例中触控面板制备方法步骤S5完成后触控面板的结构剖视图；
图10为图3中触控面板沿AA剖切线的另一种结构剖视图；
图11为图3中触控面板沿AA剖切线的又一种结构剖视图；
图12为图3中触控面板沿AA剖切线的又一种结构剖视图；
图13为本公开实施例中一种显示面板的结构剖视图。
其中附图标记为：
1、基底；101、第一区；102、第二区；2、色阻层；21、红色阻层；22、绿色阻层；23、蓝色阻层；3、黑矩阵；30、开口；4、触控结构；41、第一电极；411、电极本体；412、桥电极；42、第二电极；43、绝缘层；431、第一子部；432、第二子部；433、第三子部；5、保护层；6、显示基板；61、基板；62、像素驱动电路；63、发光元件；64、封装层；7、触控面板；8、滤光片；9、氮化硅绝缘层；10、第一触控电极；11、第二触控电极；12、第一平坦层；13、第二平坦层；14、OLED显示基板；Y、第一方向；X、第二方向。
具体实施方式
为使本领域技术人员更好地理解本公开实施例的技术方案，下面结合附图和具体实施方式对本公开实施例提供的一种触控面板及其制备方法、显示面板作进一步详细描述。
在下文中将参考附图更充分地描述本公开实施例，但是所示的实施例可以以不同形式来体现，且不应当被解释为限于本公开阐述的实施例。反之，提供这些实施例的目的在于使本公开透彻和完整，并将使本领域技术人员充分理解本公开的范围。
本公开实施例不限于附图中所示的实施例，而是包括基于制造工艺而形成的配置的修改。因此，附图中例示的区具有示意性属性，并且图中所示区的形状例示了区的具体形状，但并不是旨在限制性的。
为了提升OLED显示器件的颜色效果，将滤光片集成到OLED显示器件上，为了实现OLED显示器件的触控显示，将触控面板集成到OLED显示器件上。但目前公开的技术中，触控面板和滤光片是直接集成在OLED显示器件上，这不仅增大了OLED显示器件的厚度，而且降低了OLED显示器件的 弯折性能，同时还增加了OLED显示器件的制备工艺，以致增加了生产成本；另外，将触控面板直接集成到OLED显示器件上，直接导致OLED显示器件的厚度增大，这会导致触控电极的信号线需要经过较大的高度差才能走线至OLED显示器件的绑定区，走线经过较大的高度差容易出现断路或短路的现象，影响OLED显示器件的品质。
公开技术中，OLED显示器件的膜层结构设置如图1所示，OLED显示基板14包括基板61和依次设置于基板61上的像素驱动电路62、发光元件63和封装层64。在OLED显示基板14封装完成后，直接在封装层64上制备触控面板7和滤光片8。其中，触控面板7的制备包括依次在封装层64上形成基底1、桥电极412、绝缘层9、第一触控电极10和第二触控电极11、第一平坦层12；第一触控电极10通过开设在绝缘层9中的过孔连接桥电极412。滤光片8的制备包括：在制备完成触控面板7的显示基板上依次形成黑矩阵3的图形、不同颜色色阻层2的图形和第二平坦层13。
可见，上述OLED显示器件的结构，不仅增大了OLED显示器件的厚度，而且降低了OLED显示器件的弯折性能，上述OLED显示器件的制备过程还增加了OLED显示器件的制备工艺，以致增加了生产成本；另外，将触控面板直接集成到OLED显示器件上，会导致OLED显示器件的厚度增大，这会导致触控电极的信号线需要经过较大的高度差才能走线至OLED显示器件的绑定区，走线经过较大的高度差容易出现断路或短路的现象，影响OLED显示器件的品质。
针对将触控面板和滤光片直接集成在OLED显示基板上所导致的上述问题，本公开实施例提供一种触控面板及其制备方法、显示面板及其制备方法。
第一方面，本公开实施例提供一种触控面板，如图2-图4所示，包括基底1，基底1包括第一区101和第二区102，第一区101呈网状，第二区 102是由第一区101围设形成的网格区，第二区102内设置有色阻层2，第一区101内设置有黑矩阵3和触控结构4，触控结构4局部位于黑矩阵3中，触控结构4包括第一电极41、第二电极42和设置于第一电极41和第二电极42之间的绝缘层43，绝缘层43采用色阻层2材料。
其中，第二区102对应像素区，像素区排布呈阵列，即色阻层2排布呈阵列，第二区102也排布呈阵列。如图2所示，从宏观的角度看，第一电极41为沿阵列列方向即第一方向Y延伸的网格状电极，第二电极42为沿阵列行方向即第二方向X延伸的网格状电极，第一电极41与第二电极42之间相互断开以彼此绝缘，第一电极与第二电极42在相互交叉的桥接位置通过绝缘层43隔开以彼此绝缘。如图3所示为从微观的角度看，第一电极41局部和第二电极42局部的微观结构示意图，由于是俯视图，所以图3中未示出第一电极41和第二电极42之间彼此断开的位置。图3中所示的第一电极41局部的微观结构和第二电极42局部的微观结构只是触控结构4的其中一种结构设置方式，第一电极41的微观结构和第二电极42的微观结构也可以是其他的网格状结构设置方式，并不限于图3中的一种结构设置方式；如：第一电极和第二电极从微观结构上可以是设置于第一区的成片的网格状电极线等。
该触控面板可以集成于OLED显示器件的显示侧。色阻层2能起到滤光片的作用，使OLED显示器件中发光元件发出的光线颜色更纯。黑矩阵3的设置，能够避免相邻的发光元件发出的光线发生串色。将该触控面板集成于OLED显示器件上，使该OLED显示器件既能触控，又能提升其显示的色纯度。
该触控面板的结构设置，能够将滤光片与触控面板集成在一起，相对于公开技术中直接集成于OLED显示器件中的滤光片和触控面板，通过采用色阻层2材料的绝缘层43，能够替代原触控面板中需要单独设置的绝缘层；通过采用黑矩阵3，能够替代原触控面板中需要单独设置的第一平坦层；从 而减少了滤光片与触控面板集成在一起时的膜层设置，进而减小了滤光片与触控面板集成在一起时的膜层厚度，提升了该触控面板的弯折性能；同时，本实施中滤光片与触控面板集成在一起的该触控面板，由于减少了绝缘层和第一平坦层的制备，所以减少了制备工艺，从而降低了生产成本；另外，由于滤光片与触控面板集成在一起的该触控面板整体厚度减小，将该触控面板集成到OLED显示器件上时，触控面板中触控结构4的信号线经过较小的高度差即可走线至OLED显示器件的绑定区，且由于黑矩阵3具有一定的流平性，在将该触控面板直接制备于OLED显示器件上的过程中，黑矩阵3由OLED显示器件的显示区延伸至其绑定区能够形成比较缓和的坡度，从而使触控结构4的信号线能够平缓地走线至OLED显示器件的绑定区，进而避免由显示区走线至绑定区的信号线走线出现断路或短路的现象，确保了该触控面板的品质。
在一些实施例中，第一电极41包括电极本体411和桥电极412，黑矩阵3中开设有开口，桥电极412设置于开口中，绝缘层43和电极本体411依次叠置于桥电极412的背离基底1的一侧；桥电极412连接电极本体411，电极本体411与第二电极42同层设置且相互间隔。即本实施例中，第一电极41的电极本体411与第二电极42位于同一层上，第一电极41的桥电极412与第二电极42不同层，桥电极412与第二电极42和电极本体411之间设置有绝缘层43，从而实现第一电极41与第二电极42的纵横交叉绝缘设置。
在一些实施例中，色阻层2包括红色阻层21、绿色阻层22和蓝色阻层23，色阻层2排布呈阵列，阵列的列方向为第一方向Y，阵列的行方向为第二方向X；沿第一方向Y，红色阻层21、绿色阻层22和蓝色阻层23依次交替排布；沿第二方向X，红色阻层21、绿色阻层22和蓝色阻层23依次交替排布；色阻层2、绝缘层43和黑矩阵3的背离基底1的一侧表面平齐。其中，色阻层2对应像素单元设置，像素单元排布呈阵列，色阻层2也排 布呈阵列，即第二区102排布呈阵列。
在一些实施例中，沿第一方向Y和第二方向X，位于任一颜色色阻层2两侧且靠近该色阻层2的绝缘层43的颜色与该色阻层2的颜色不同。如此设置，使该色阻层2对应的发光元件发出的光线不会通过位于其两侧的绝缘层43出射，从而避免了相邻两发光元件发出的光线发生串色。
在一些实施例中，色阻层2、黑矩阵3和绝缘层43的背离基底1的一侧表面为凹凸不平的粗糙表面。如此设置，能使发光元件发出的近似平行的光线经过色阻层2之后转变为漫散射光线，从而改善OLED显示器件从正面和侧面观看显示色偏较大的问题。
在一些实施例中，触控面板还包括保护层5，保护层5设置于触控结构4和色阻层2的背离基底1的一侧。保护层5通常采用有机树脂材料，保护层5能对该触控面板中的触控结构4和色阻层2形成很好的保护。
在一些实施例中，第一电极41和第二电极42可以为块状，也可以为网状。
在一些实施例中，沿第一方向Y排布的第一电极41连接为一体且连接一条信号线；沿第二方向X排布的第二电极42连接为一体且连接一条信号线。
如第一电极41为驱动电极，第二电极42为感应电极，该触控面板在触控时，沿第二方向X，逐行向第二电极42中输入驱动电压信号，并接收沿第一方向X各第一电极41上输出的电压信号；该触控面板进行互电容触控，其触控原理为：当手指触摸到触控面板时，影响了触摸点附近第一电极41与第二电极42之间的耦合，从而改变了第一电极41与第二电极42之间的电容量；检测互电容大小时，依次向第二方向X的第二电极42输入驱动电压信号，第一方向Y的第一电极41同时接收信号，可以得到所有第一方向Y和第二方向X交汇点的电容值大小，即整个触控面板的二维平面的电容大小，根据触控面板二维平面内的电容变化量数据，可以计算出每 一个触摸点的坐标，从而实现该触控面板的互电容触控。
另外，在一些实施例中，基底1采用离型膜。即基底1可以从触控面板上剥离，以便将该触控面板贴设于OLED显示器件上。当然，该触控面板也可以直接制备于OLED显示器件的显示侧，这种情况下，该触控面板无需设置基底1，将触控面板直接制备于封装完成的OLED显示器件的显示侧即可。
其中，基底1所采用的离型膜可以为PE离型膜、PET离型、PC离型膜或PMMA离型膜等。本实施例中，由于基底1、黑矩阵3、色阻层2、绝缘层43以及保护层5均采用有机膜层材料，所以使得该触控面板具有良好的弯折性能，适用于柔性显示面板的触控。
基于触控面板的上述结构，本公开实施例还提供一种该触控面板的制备方法，触控面板包括基底，基底包括第一区和第二区，第一区呈网状，第二区是由所述第一区围设形成的网格区，该制备方法包括，在第二区内形成色阻层，还包括，在第一区内形成黑矩阵和触控结构，触控结构局部位于黑矩阵中，形成触控结构包括形成第一电极、第二电极和绝缘层，绝缘层形成于第一电极和第二电极之间，绝缘层采用色阻层材料。
在一些实施例中，形成第一电极包括形成电极本体和桥电极；形成色阻层包括形成红色阻层、绿色阻层和蓝色阻层；触控面板的制备方法具体包括：如图5-图9所示。
步骤S1：通过一次工艺在基底1上形成黑矩阵3的图形，并在黑矩阵3中形成开口30；黑矩阵3形成于第一区101，如图5所示。
该步骤中，在基底1上涂覆一层黑矩阵膜，然后通过曝光、显影形成黑矩阵3的图形，同时在黑矩阵3中形成开口30的图形；黑矩阵3图形形成的同时，形成了色阻层的形成区域的图形。
步骤S2：形成桥电极412的图形；桥电极412位于开口30中，如图6所示。
该步骤中，沉积一层导电金属膜层，通过一次构图工艺(包括曝光、显影、刻蚀等步骤)形成桥电极412的图形；同时，还可以形成连接第一电极的信号线的图形(图中未示出)。
步骤S3：依次形成不同颜色的色阻层2，同时，依次形成不同颜色的绝缘层43；其中，色阻层2形成于第二区102，绝缘层43形成于第一区；相同颜色的色阻层2与绝缘层43通过一次工艺形成，如图7所示。
该步骤中，首先涂布一种颜色的色阻层膜，如红色阻层膜；然后通过曝光、显影工艺形成红色阻层21的图形以及采用红色阻层材料的部分绝缘层43的图形。同理，形成绿色阻层22的图形和采用绿色阻层材料的部分绝缘层43的图形以及蓝色阻层23的图形和采用蓝色阻层材料的部分绝缘层43的图形。
步骤S4：通过一次工艺形成电极本体411和第二电极42的图形；电极本体411连接桥电极412，如图8所示。
该步骤中，沉积一层导电金属膜层，通过一次构图工艺(包括曝光、显影、刻蚀等步骤)形成电极本体411和第二电极42的图形；同时，还可以形成连接第二电极42的信号线的图形(图中未示出)。
另外，在步骤S4中，刻蚀形成电极本体411和第二电极42的图形时，可以增加一步对色阻层2、绝缘层43和黑矩阵3表面进行处理的工艺，以便将色阻层2、绝缘层43和黑矩阵3的背离基底1的表面处理成凹凸不平的粗糙表面。处理的具体工艺为：在工艺腔室内通入氧气，氧气与色阻层2、绝缘层43和黑矩阵3的表面发生反应，形成凹凸不平表面；或者，在工艺腔室内用惰性气体轰击色阻层2、绝缘层43和黑矩阵3的表面，形成凹凸不平表面；或者，上述两种处理工艺可以同时使用，将色阻层2、绝缘层43和黑矩阵3的背离基底1的表面处理成凹凸不平表面，以提升采用该触控面板的OLED显示器件。
该触控面板的制备方法在形成电极本体411和第二电极42的图形之后 还包括：步骤S5：形成保护层5，如图9所示。保护层5采用涂布的方法形成。
通过采用上述制备方法制备触控面板，相对于公开技术中直接将滤光片和触控面板集成于OLED显示器件中，减少了一步氮化硅绝缘层的制备工艺和第一平坦层的制备，从而降低了生产成本，同时还减小了该触控面板的厚度，提升了其弯折性能。
本公开实施例提供一种触控面板，与上述实施例中不同的是，如图10所示，绝缘层43包括第一子部431和第二子部432，沿第一方向Y，第一子部431和第二子部432依次排布，且沿第二方向，第一子部431和第二子部432依次排布；第一子部431和第二子部432的色阻层材料的颜色不同，且沿第一方向Y和第二方向，位于任一颜色色阻层2两侧且靠近该色阻层2的第一子部431和第二子部432的颜色与该色阻层2的颜色不同。
如此设置，同样能使该色阻层2对应的发光元件发出的光线不会通过位于其两侧的绝缘层43出射，从而避免了相邻两发光元件发出的光线发生串色。
本实施例中触控面板的其他结构与上述实施例中相同，此处不再赘述。
基于本公开实施例中触控面板的上述结构，本实施例还提供一种该触控面板的制备方法，与上述触控面板的制备方法不同的是，形成绝缘层包括形成不同颜色的第一子部和第二子部；触控面板的制备方法具体包括：
步骤S1：通过一次工艺形成黑矩阵的图形，并在黑矩阵中形成开口；黑矩阵形成于第一区。
步骤S2：形成桥电极的图形；桥电极位于开口中。
步骤S3：依次形成不同颜色的色阻层，同时，依次形成不同颜色的绝缘层的子部；即依次形成不同颜色的绝缘层的第一子部和第二子部；其中，色阻层形成于第二区，绝缘层的子部(即第一子部和第二子部)形成于第 一区；相同颜色的色阻层与绝缘层的子部(即第一子部和第二子部)通过一次工艺形成。
步骤S4：通过一次工艺形成电极本体和第二电极的图形；电极本体连接桥电极。
本实施例中触控面板制备方法中各步骤的具体工艺以及制备方法的其他步骤与上述实施例中相同，此处不再赘述。
本公开实施例提供一种触控面板，与上述实施例中不同的是，如图11所示，绝缘层43包括第一子部431、第二子部432和第三子部433，沿第一方向Y，第一子部431、第二子部432和第三子部433依次排布；且沿第二方向，第一子部431、第二子部432和第三子部433依次排布；第一子部431、第二子部432和第三子部433的色阻层材料的颜色不同，且沿第一方向Y和第二方向，位于任一颜色色阻层2两侧且靠近该色阻层2的第一子部431和第三子部433的颜色与该色阻层2的颜色不同。
如此设置，同样能使该色阻层2对应的发光元件发出的光线不会通过位于其两侧的绝缘层43出射，从而避免了相邻两发光元件发出的光线发生串色。
本实施例中触控面板的其他结构与上述实施例中相同，此处不再赘述。
基于本公开实施例中触控面板的上述结构，本实施例还提供一种该触控面板的制备方法，与上述触控面板的制备方法不同的是，形成绝缘层包括形成不同颜色的第一子部、第二子部和第三子部；该触控面板的制备方法中，步骤S3具体为：依次形成不同颜色的色阻层，同时，依次形成不同颜色的绝缘层的子部；即依次形成不同颜色的绝缘层的第一子部、第二子部和第三子部；其中，色阻层形成于第二区，绝缘层的子部(即第一子部、第二子部和第三子部)形成于第一区；相同颜色的色阻层与绝缘层的子部(即第一子部、第二子部和第三子部)通过一次工艺形成。
本实施例中触控面板制备方法中各步骤的具体工艺以及制备方法的其他步骤与上述实施例中相同，此处不再赘述。
本公开实施例还提供一种触控面板，与上述实施例中不同的是，如图12所示，绝缘层43包括第一子部431、第二子部432和第三子部433，第一子部431、第二子部432和第三子部433沿远离基底1的方向依次叠置；第一子部431、第二子部432和第三子部433的色阻层材料的颜色不同。
如此设置，同样能使该色阻层2对应的发光元件发出的光线不会通过位于其两侧的绝缘层43出射，从而避免了相邻两发光元件发出的光线发生串色。
本实施例中触控面板的其他结构与上述实施例中相同，此处不再赘述。
基于本公开实施例中触控面板的上述结构，本实施例还提供一种该触控面板的制备方法，与上述触控面板的制备方法不同的是，步骤S3的具体制备过程为：首先涂布一种颜色的色阻层膜，如红色阻层膜；然后通过灰度掩膜板曝光、显影工艺形成红色阻层的图形以及采用红色阻层材料的绝缘层第一子部的图形。同理，通过灰度掩膜板曝光、显影工艺形成绿色阻层的图形和采用绿色阻层材料的绝缘层第二子部的图形以及蓝色阻层的图形和采用蓝色阻层材料的绝缘层第三子部的图形。
需要说明的是，第一子部、第二子部和第三子部的颜色也可以不是上述设红、绿、蓝设置，而是绿、红、蓝设置或者蓝、红、绿设置等，无论第一子部、第二子部和第三子部的颜色如何设置，都能起到使该色阻层对应的发光元件发出的光线不会通过位于其两侧的绝缘层出射，从而避免相邻两发光元件发出的光线发生串色的作用。
本实施例中触控面板制备方法的其他步骤以及制备方法中其他各步骤的具体工艺与上述实施例中相同，此处不再赘述。
上述公开实施例中所提供的触控面板，能够将滤光片与触控面板集成 在一起，相对于公开技术中直接集成于OLED显示器件中的滤光片和触控面板，通过采用色阻层材料的绝缘层，能够替代原触控面板中需要单独设置的绝缘层；通过采用黑矩阵，能够替代原触控面板中需要单独设置的第一平坦层；从而减少了滤光片与触控面板集成在一起时的膜层设置，进而减小了滤光片与触控面板集成在一起时的膜层厚度，提升了该触控面板的弯折性能；同时，本实施中滤光片与触控面板集成在一起的该触控面板，由于减少了绝缘层和第一平坦层的制备，所以减少了制备工艺，从而降低了生产成本；另外，由于滤光片与触控面板集成在一起的该触控面板整体厚度减小，将该触控面板集成到OLED显示器件上时，触控面板中触控结构的信号线经过较小的高度差即可走线至OLED显示器件的绑定区，且由于黑矩阵具有一定的流平性，在将该触控面板直接制备于OLED显示器件上的过程中，黑矩阵由OLED显示器件的显示区延伸至其绑定区能够形成比较缓和的坡度，从而使触控结构的信号线能够平缓地走线至OLED显示器件的绑定区，进而避免由显示区走线至绑定区的信号线走线出现断路或短路的现象，确保了该触控面板的品质。
第二方面，本公开实施例提供一种显示面板，如图13所示，包括显示基板6，显示基板6包括像素界定区和由像素界定区界定形成的像素区，还包括上述任意一个实施例中的触控面板7，触控面板7设置于显示基板6的显示侧，且触控面板7的第一区对应像素界定区，触控面板7的第二区对应像素区。
其中，像素界定区即像素区之间的间隔区域，像素界定区内通常用于设置像素界定层以及部分电路走线。
通过在显示基板6上设置上述任意一个实施例中的触控面板7，相对于公开技术中直接将滤光片和触控面板集成于OLED显示器件上，不仅减小了该显示面板的厚度，提升了该显示面板的弯折性能；而且降低了该显示面 板的生产成本；另外，由于触控面板7整体厚度减小，将该触控面板7集成到显示基板6上时，触控面板7中触控结构的信号线经过较小的高度差即可走线至显示基板6上的绑定区，且由于黑矩阵具有一定的流平性，在将该触控面板7直接制备于显示基板上的过程中，黑矩阵由显示基板6的显示区延伸至其绑定区能够形成比较缓和的坡度，从而使触控结构的信号线能够平缓地走线至显示基板6的绑定区，进而避免由显示区走线至绑定区的信号线走线出现断路或短路的现象，确保了该显示面板的品质。
在一些实施例中，显示基板6包括基板61和依次设置于基板61上的像素驱动电路62和发光元件63，发光元件63位于像素区，像素驱动电路62与发光元件63连接，以驱动发光元件63发光。
其中，发光元件63可以是OLED(Organic Light-Emitting Diode，有机发光二极管)或者LED(Light Emitting Diode，发光二极管)。像素驱动电路62采用常规的目前比较成熟的像素电路设计，本实施例对像素驱动电路62未做改进，这里不再赘述。
在一些实施例中，发光元件63的发光颜色与对应该发光元件63的第二区内的色阻层2的颜色相同。即发光元件63包括红色发光元件、绿色发光元件和蓝色发光元件。色阻层2能使发光元件63发出的光线颜色更纯，从而提升显示面板的显示色彩效果。
需要说明的是，发光元件也可以为蓝光有机发光二极管。此时，色阻层能够实现该显示面板的彩色显示。
在一些实施例中，显示基板6还包括封装层64，封装层64设置于发光元件63的背离基板61的一侧，封装层64用于对发光元件63进行封装。
其中，封装层64采用多个有机膜层和多个无机膜层相互交替叠置构成，能够防止外界水氧侵入对发光元件63造成损害。
需要说明的是，触控面板7的基底1可以直接设置于封装层64上，也可以将触控面板7的基底1剥离，使剩余部分设置于封装层64上。
另外需要说明的是，显示基板中也可以不设置封装层，触控面板的基底复用作显示基板的封装层，封装层用于对发光元件进行封装。
基于本公开实施例提供的上述显示面板，该实施例还提供一种显示面板的制备方法，包括制备显示基板，显示基板包括像素界定区和由像素界定区界定形成的像素区，还包括在显示基板的显示侧制备上述任一实施例中的触控面板；其中，触控面板的第一区对应像素界定区，触控面板的第二区对应像素区。
在一些实施例中，制备显示基板包括在基板上依次形成像素驱动电路和发光元件，然后制备封装层，对发光元件进行封装。像素驱动电路和发光元件的制备均采用传统工艺，这里不再赘述。
在一些实施例中，在显示基板的封装层上制备触控面板。其中，封装层可以作为触控面板的基底，直接在封装层上制备黑矩阵、色阻层和触控结构即可。在一些实施例中，也可以在封装层上制备触控面板的基底以及黑矩阵、色阻层和触控结构。
需要说明的是，在一些实施例中，也可以将采用上述实施例中的制备方法制备的触控面板贴设于显示基板的显示侧；其中，可以将触控面板的基底剥离，然后将剥离后的触控面板贴设于显示基板的显示侧。
另外需要说明的是，该显示面板中的显示基板也可以是液晶显示基板，液晶显示基板的其他结构设置均为其能够实现正常显示的常规结构，如液晶显示基板包括用于提供背光源的背板和阵列基板，触控面板与阵列基板对盒，对盒间隙中填充液晶；另外，在阵列基板的入光侧和触控面板的出光侧分别贴设上下偏光片，该液晶显示面板的其他结构这里不再赘述。其中，触控面板不仅能实现该液晶显示面板的触控，而且能够实现该液晶显示面板的彩色显示。
本公开实施例中所提供的显示面板，通过采用上述任一实施例中的触控面板，相对于公开技术中直接将滤光片和触控面板集成于OLED显示器件 上，不仅减小了该显示面板的厚度，提升了该显示面板的弯折性能；而且降低了该显示面板的生产成本；另外，由于触控面板整体厚度减小，将该触控面板集成到显示基板上时，触控面板中触控结构的信号线经过较小的高度差即可走线至显示基板上的绑定区，且由于黑矩阵具有一定的流平性，在将该触控面板直接制备于显示基板上的过程中，黑矩阵由显示基板的显示区延伸至其绑定区能够形成比较缓和的坡度，从而使触控结构的信号线能够平缓地走线至显示基板的绑定区，进而避免由显示区走线至绑定区的信号线走线出现断路或短路的现象，确保了该显示面板的品质。
本公开实施例所提供的显示面板可以为OLED面板、OLED电视、LED面板、LED电视、LCD面板、LCD电视、显示器、手机、导航仪等任何具有显示功能的产品或部件。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (16)

  1. 一种触控面板，其特征在于，包括基底，所述基底包括第一区和第二区，所述第一区呈网状，所述第二区是由所述第一区围设形成的网格区，所述第二区内设置有色阻层，所述第一区内设置有黑矩阵和触控结构，所述触控结构局部位于所述黑矩阵中，所述触控结构包括第一电极、第二电极和设置于所述第一电极和所述第二电极之间的绝缘层，所述绝缘层采用所述色阻层材料。
  2. 根据权利要求1所述的触控面板，其特征在于，所述第一电极包括电极本体和桥电极，所述黑矩阵中开设有开口，所述桥电极设置于所述开口中，所述绝缘层和所述电极本体依次叠置于所述桥电极的背离所述基底的一侧；
    所述桥电极连接所述电极本体，所述电极本体与所述第二电极同层设置且相互间隔。
  3. 根据权利要求2所述的触控面板，其特征在于，所述色阻层包括红色阻层、绿色阻层和蓝色阻层，所述色阻层排布呈阵列，所述阵列的列方向为第一方向，所述阵列的行方向为第二方向；
    沿所述第一方向，所述红色阻层、所述绿色阻层和所述蓝色阻层依次交替排布；沿所述第二方向，所述红色阻层、所述绿色阻层和所述蓝色阻层依次交替排布；
    所述色阻层、所述绝缘层和所述黑矩阵的背离所述基底的一侧表面平齐。
  4. 根据权利要求3所述的触控面板，其特征在于，沿所述第一方向和 所述第二方向，位于任一颜色所述色阻层两侧且靠近该所述色阻层的所述绝缘层的颜色与该所述色阻层的颜色不同。
  5. 根据权利要求3所述的触控面板，其特征在于，所述绝缘层包括第一子部和第二子部，沿所述第一方向，所述第一子部和所述第二子部依次排布，且沿所述第二方向，所述第一子部和所述第二子部依次排布；
    所述第一子部和所述第二子部的所述色阻层材料的颜色不同，且沿所述第一方向和所述第二方向，位于任一颜色所述色阻层两侧且靠近该所述色阻层的所述第一子部和所述第二子部的颜色与该所述色阻层的颜色不同。
  6. 根据权利要求3所述的触控面板，其特征在于，所述绝缘层包括第一子部、第二子部和第三子部，沿所述第一方向，所述第一子部、所述第二子部和所述第三子部依次排布；且沿所述第二方向，所述第一子部、所述第二子部和所述第三子部依次排布；
    所述第一子部、所述第二子部和所述第三子部的所述色阻层材料的颜色不同，且沿所述第一方向和所述第二方向，位于任一颜色所述色阻层两侧且靠近该所述色阻层的所述第一子部和所述第三子部的颜色与该所述色阻层的颜色不同。
  7. 根据权利要求3所述的触控面板，其特征在于，所述绝缘层包括第一子部、第二子部和第三子部，所述第一子部、所述第二子部和所述第三子部沿远离所述基底的方向依次叠置；
    所述第一子部、所述第二子部和所述第三子部的所述色阻层材料的颜色不同。
  8. 根据权利要求2所述的触控面板，其特征在于，所述色阻层、所述黑矩阵和所述绝缘层的背离所述基底的一侧表面为凹凸不平的粗糙表面。
  9. 根据权利要求1所述的触控面板，其特征在于，还包括保护层，所述保护层设置于所述触控结构和所述色阻层的背离所述基底的一侧。
  10. 一种显示面板，包括显示基板，所述显示基板包括像素界定区和由所述像素界定区界定形成的像素区，其特征在于，还包括权利要求1-9任意一项所述的触控面板，所述触控面板设置于所述显示基板的显示侧，且所述触控面板的第一区对应所述像素界定区，所述触控面板的第二区对应所述像素区。
  11. 根据权利要求10所述的显示面板，其特征在于，所述显示基板包括基板和依次设置于所述基板上的像素驱动电路和发光元件，所述发光元件位于所述像素区，所述像素驱动电路与所述发光元件连接，以驱动所述发光元件发光。
  12. 根据权利要求11所述的显示面板，其特征在于，所述发光元件的发光颜色与对应该所述发光元件的所述第二区内的色阻层的颜色相同。
  13. 根据权利要求11所述的显示面板，其特征在于，所述显示基板还包括封装层，所述封装层设置于所述发光元件的背离所述基板的一侧，所述封装层用于对所述发光元件进行封装。
  14. 根据权利要求11所述的显示面板，其特征在于，所述触控面板的基底复用作所述显示基板的封装层，所述封装层用于对所述发光元件进行 封装。
  15. 一种触控面板的制备方法，所述触控面板包括基底，所述基底包括第一区和第二区，所述第一区呈网状，所述第二区是由所述第一区围设形成的网格区，所述制备方法包括，在所述第二区内形成色阻层，其特征在于，所述制备方法还包括，在所述第一区内形成黑矩阵和触控结构，所述触控结构局部位于所述黑矩阵中，形成所述触控结构包括形成第一电极、第二电极和绝缘层，所述绝缘层形成于所述第一电极和所述第二电极之间，所述绝缘层采用所述色阻层材料。
  16. 根据权利要求15所述的触控面板的制备方法，其特征在于，形成所述第一电极包括形成电极本体和桥电极；形成所述色阻层包括形成红色阻层、绿色阻层和蓝色阻层；所述触控面板的制备方法包括：
    通过一次工艺形成所述黑矩阵的图形，并在所述黑矩阵中形成开口；所述黑矩阵形成于所述第一区；
    形成所述桥电极的图形；所述桥电极位于所述开口中；
    依次形成不同颜色的色阻层，同时，依次形成不同颜色的所述绝缘层；其中，所述色阻层形成于所述第二区，所述绝缘层形成于所述第一区；相同颜色的所述色阻层与所述绝缘层通过一次工艺形成；
    通过一次工艺形成所述电极本体和所述第二电极的图形；所述电极本体连接所述桥电极；
    或者，形成所述第一电极包括形成电极本体和桥电极；形成所述色阻层包括形成红色阻层、绿色阻层和蓝色阻层；形成所述绝缘层包括形成不同颜色的第一子部和第二子部；或者，形成所述绝缘层包括形成不同颜色的第一子部、第二子部和第三子部；所述触控面板的制备方法包括：
    通过一次工艺形成所述黑矩阵的图形，并在所述黑矩阵中形成开口；所述黑矩阵形成于所述第一区；
    形成所述桥电极的图形；所述桥电极位于所述开口中；
    依次形成不同颜色的色阻层，同时，依次形成不同颜色的所述绝缘层的子部；其中，所述色阻层形成于所述第二区，所述绝缘层的子部形成于所述第一区；相同颜色的所述色阻层与所述绝缘层的子部通过一次工艺形成；
    通过一次工艺形成所述电极本体和所述第二电极的图形；所述电极本体连接所述桥电极。
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