WO2021223840A1 - Système de transport pour déplacer un dispositif dans un système de traitement sous vide, système de traitement de substrat le comprenant et procédé de fonctionnement d'un système de transport - Google Patents

Système de transport pour déplacer un dispositif dans un système de traitement sous vide, système de traitement de substrat le comprenant et procédé de fonctionnement d'un système de transport Download PDF

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Publication number
WO2021223840A1
WO2021223840A1 PCT/EP2020/062335 EP2020062335W WO2021223840A1 WO 2021223840 A1 WO2021223840 A1 WO 2021223840A1 EP 2020062335 W EP2020062335 W EP 2020062335W WO 2021223840 A1 WO2021223840 A1 WO 2021223840A1
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WO
WIPO (PCT)
Prior art keywords
vacuum
transport system
housing
interior space
drive unit
Prior art date
Application number
PCT/EP2020/062335
Other languages
English (en)
Inventor
Christian Wolfgang Ehmann
Wolf-Eckart Fritsche
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to PCT/EP2020/062335 priority Critical patent/WO2021223840A1/fr
Priority to CN202080094100.9A priority patent/CN115003852A/zh
Publication of WO2021223840A1 publication Critical patent/WO2021223840A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations

Definitions

  • Embodiments of the present disclosure relate to apparatuses and methods for transporting carriers, particularly carriers for carrying substrates or masks during processing. More specifically, embodiments of the present disclosure relate to apparatuses and methods for transporting carriers in a vacuum processing system employing magnetic levitation.
  • Coated substrates can be used in several applications and in several technical fields. For instance, coated substrates may be used in the field of display devices. Display devices can be used for the manufacture of television screens, computer monitors, mobile phones, other hand held devices, and the like for displaying information. Typically, displays are produced by coating a substrate with a stack of layers of different materials. [0003] In order to deposit a layer stack, an in-line arrangement of processing modules can be used.
  • An in-line processing system includes a plurality of processing modules, such as deposition modules and optionally further processing modules, e.g., cleaning modules and/or etching modules, wherein processing aspects are subsequently conducted in the processing modules such that a plurality of substrates can continuously or quasi-continuously be processed in the in-line processing system.
  • processing modules such as deposition modules and optionally further processing modules, e.g., cleaning modules and/or etching modules, wherein processing aspects are subsequently conducted in the processing modules such that a plurality of substrates can continuously or quasi-continuously be processed in the in-line processing system.
  • the substrate may be carried by a carrier, i.e. a carrying device for carrying the substrate in the vacuum system.
  • the carrier carrying the substrate is typically transported through the vacuum system using a transport system.
  • a main challenge during substrate processing, particularly for display manufacturing, is to avoid particle generation.
  • magnetic levitation systems have been proposed, such that the carrier can be transported essentially contactlessly.
  • magnetic transportation systems in a vacuum environment is challenging since many mechanical and electrical components of the transport system are not vacuum capable. For example, the provision of electromagnets in a vacuum environment may lead to large outgassing rates and contamination of the processing system.
  • a transport system for moving a device in a vacuum processing system.
  • the transport system includes a drive unit including a housing encasing an interior space having one or more electromagnets. Further, the transport system includes a vacuum system connected with the interior space of the housing.
  • a substrate processing system includes a vacuum processing chamber, a processing device provided in the vacuum processing chamber, a substrate carrier for carrying a substrate; and a transport system for transporting the substrate carrier.
  • the transport system includes a drive unit comprising a housing encasing an interior space having one or more electromagnets. Additionally, the transport system includes a vacuum system connected with the interior space of the housing as well as with an interior space of the vacuum processing chamber.
  • a method of operating a transport system for moving a device in a vacuum processing system includes applying a first vacuum with a first vacuum pressure pi in a vacuum chamber of the vacuum processing system. Additionally, the method includes applying a second vacuum with a second vacuum pressure p2 in a housing of a drive unit. The housing of the drive unit encases an interior space having one or more electromagnets. Further, the method includes moving the device by employing the drive unit.
  • Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus. For instance, according to a further aspect of the present disclosure, a method of coating a substrate, particularly for manufacturing an electronic device, is provided.
  • the electronic device may be an opto-electronical device, e.g. a display.
  • the method of coating a substrate includes using at least one of a transport system according to any embodiments described herein, a substrate processing system according to any embodiments described herein, and a method of operating a transport system for moving a device in a vacuum processing system according to any embodiments described herein.
  • FIG. 1 shows a schematic view of a transport system according to embodiments described herein;
  • FIG. 2 shows a schematic view of a transport system with a device to be transported according to further embodiments described herein;
  • FIG. 3 shows a schematic view of a transport system with further optional features according to embodiments described herein;
  • FIG. 4 shows a schematic view of a transport system according to embodiments described herein including a vacuum chamber;
  • FIG. 5 shows a schematic view of a substrate processing system according to embodiments described herein.
  • FIG. 6 shows a flowchart for illustrating a method of operating a transport system for moving a device in a vacuum processing system according to embodiments described herein.
  • the device 10 can be a carrier, particularly a substrate carrier or a mask carrier.
  • the transport system 100 as described herein may also be used for other devices employed in a vacuum processing system, e.g. processing devices such as deposition sources.
  • the device 10 can be moved by the transport system 100 in a transport direction T, as exemplarily indicated in FIG. 1.
  • the transport direction T is perpendicular to the paper plane.
  • the transport direction T is typically an essentially horizontal direction (horizontal +/-10 0 ).
  • the term “transport direction” can be understood as the direction in which the device is transported along a transport path by the transport system.
  • the transport path can be linear or curved. Further, the transport direction may vary along the transport path. Further, in FIG. 1 the vertical direction V and the lateral direction F are indicated.
  • the transport system 100 includes a drive unit 110, as exemplarily shown in FIG. 1.
  • the drive unit 110 includes a housing 120.
  • the housing 120 encases an interior space 121.
  • one or more electromagnets 130 are provided in the interior space 121.
  • the transport system 100 includes a vacuum system 140.
  • the vacuum system 140 is connected with the interior space 121 of the housing 120. Accordingly, it is to be understood that a vacuum can be generated in the interior of the housing 120 by using the vacuum system 140.
  • embodiments of the transport system as described herein are improved with respect to vacuum compatibility.
  • a transport system with a drive unit in which a vacuum can be provided, a pressure difference between the inside of the drive unit housing and the outside of the drive unit housing can be reduced.
  • stress and elastic deformation of the drive unit housing, particularly of the part of the drive unit housing covering the electromagnets can be reduced such that compared to the state of the art the drive unit housing wall, particularly the part covering the electromagnets, can be designed with smaller thickness.
  • the drive efficiency of the drive unit particularly in vacuum environments, can be improved.
  • a “transport system for moving a device” can be understood as a system or apparatus configured for moving, particularly transporting, a device along a transport path in a transport direction T.
  • the transport system may be configured for transporting an essentially vertically oriented device. “Essentially vertically” as used herein may encompass a deviation of 10° or less from an exactly vertical orientation.
  • the device which may be moved by the transport system can be a carrier.
  • the transport system for moving a device can be a carrier transport system for moving, particularly transporting, a carrier along a transport path in a transport direction T.
  • a “carrier” can be understood as a carrying device configured for carrying an object, e.g.
  • the carrier can be a substrate carrier or a mask carrier used in a processing system, e.g. for vertically processing a substrate.
  • the carrier may include a carrier body and a holding device, e.g. a mechanical, electrostatic, or magnetic chucking device, configured for holding the object, e.g. the substrate or the mask, at an object support surface of the carrier body.
  • the carrier may be configured to carry a large-area substrate, i.e. a substrate having a size of 1 m 2 or more, particularly 5 m 2 or more, or even 8 m 2 or more. Transporting and holding large and heavy carriers is challenging, particularly using magnetic levitation.
  • the term “substrate” may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate.
  • the present disclosure is not limited thereto, and the term “substrate” may also embrace flexible substrates such as a web or a foil.
  • the term “substantially inflexible” is understood to distinguish over “flexible”.
  • a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.
  • the substrate may be made of any material suitable for material deposition.
  • the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • the device 10 can be a substrate carrier or a mask carrier.
  • the carrier can be a substrate carrier for large area substrates or a mask carrier for masks employed for masking large area substrates.
  • the term “large area substrate” refers to a substrate having a main surface with an area of 0.5 m 2 or larger, particularly of 1 m 2 or larger.
  • a large area substrate can be GEN 4.5, which corresponds to about 0.67 m 2 of substrate (0.73mx0.92m), GEN 5, which corresponds to about 1.4 m 2 of substrate (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m 2 of substrate (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m 2 of substrate (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 of substrate (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.
  • FIG. 2 shows a transport system 100 in combination with a device 10 to be transported.
  • the drive unit 110 can be arranged below the device 10 to be transported.
  • the transport system 100 further includes a magnetic levitation unit 190 for contactlessly levitating the device 10, e.g. a carrier, particularly a substrate carrier or a mask carrier.
  • a magnetic levitation unit 190 for contactlessly levitating the device 10, e.g. a carrier, particularly a substrate carrier or a mask carrier.
  • the device 10 is a substrate carrier 230
  • the magnetic levitation unit 190 is configured for holding the device 10 in a device transportation space.
  • the device transportation space may be understood as a zone where the device is arranged during the transport of the device in the transportation direction T along a transport path.
  • the magnetic levitation unit 190 is arranged above the device transportation space.
  • the magnetic levitation unit 190 is arranged to interact with one or more first magnetic counterparts 181 of the device 10.
  • the one or more first magnetic counterparts 181 may be arranged at a top part of the device 10.
  • the magnetic levitation unit 190 includes one or more first actuators 191 for contactlessly holding the device 10.
  • the one or more first magnetic counterparts 181 of the device may magnetically interact with the one or more first actuators 191 of the magnetic levitation unit 190.
  • the one or more first magnetic counterparts 181 can be passive magnetic elements.
  • the one or more first magnetic counterparts 181 may be made of a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties.
  • a “passive magnetic element” or “passive magnet” as used herein may be understood as a magnet which is not actively controlled, e.g. via a feedback control. For example, no output parameter such as a magnetic field strength of the passive magnet is controlled depending on an input parameter such as a distance.
  • a “passive magnetic element” may include one or more permanent magnets.
  • a “passive magnetic element” or “passive magnet” may include one or more electromagnets which may not be actively controlled.
  • the one or more first actuators 191 may be attached to an outside surface of an upper chamber wall 177, e.g. of a vacuum chamber.
  • the one or more first actuators 191 may be attached to an inside surface of the upper chamber wall 177, as exemplarily shown in FIG. 5.
  • a “magnetic levitation unit” can be understood as a unit configured for holding an object, e.g. a device such as a carrier, in a contactless manner by using magnetic force.
  • the term “levitating” or “levitation” refers to a state of an object, e.g. a carrier carrying a substrate or a mask, wherein the object floats without mechanical contact or support.
  • “contactlessly levitating” can be understood in the sense that a weight, e.g. the weight of a carrier, particularly the weight of a carrier carrying a substrate or a mask, is not held by a mechanical contact or mechanical forces, but is held by a magnetic force.
  • the term “contactless” as used throughout the description can be understood in that a carrier is held in a levitating or floating state using magnetic forces instead of mechanical forces, i.e. contact forces.
  • a “first actuator” of the magnetic levitation unit can be understood as an active and controllable element.
  • the one or more first actuators may include a controllable magnet such as an electromagnet.
  • the magnetic field of the one or more first actuators may be actively controllable for maintaining and / or adjusting the distance between the magnetic levitation unit and the carrier.
  • a “first actuator” of the magnetic levitation unit can be understood as an element with a controllable and adjustable magnetic field to provide a magnetic levitation force acting on the carrier.
  • the one or more electromagnets 130 of the drive unit 110 represent a stator part of an electromagnetic linear motor. Further, with exemplary reference to FIG. 2, it is to be understood that the one or more electromagnets 130 are arranged to interact with one or more second magnetic counterparts 182 of the device 10. In particular, the one or more second magnetic counterparts 182 can be provided at a bottom of the device 10. During device transportation, the one or more second magnetic counterparts 182 move in the transport direction T passing the one or more electromagnets 130.
  • the one or more electromagnets 130 can be understood as the stator of an electro -magnetic linear motor and the one or more second magnetic counterparts 182 can be understood as the mover part of the electro-magnetic linear motor.
  • the electro-magnetic linear motor may be a synchronous linear motor or an asynchronous linear motor.
  • the one or more second magnetic counterparts 182 of the device may magnetically interact with the one or more electromagnets 130 of the drive unit 110.
  • the one or more second magnetic counterparts 182 can be passive magnetic elements.
  • the one or more second magnetic counterparts 182 may be made of a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties.
  • the one or more electromagnets 130 are configured for moving the device in the transport direction, particularly in a contactless manner.
  • the one or more electromagnets 130 may be actively controllable for exerting a moving force on the device 10 in the transport direction T.
  • a “drive unit” can be understood as a unit configured for moving a device as described herein in the transport direction.
  • the drive unit as described herein may be configured to generate a magnetic force acting on the device, e.g. a carrier, in the transport direction T.
  • the drive unit can be a linear motor.
  • a drive unit for moving or transporting the device can be understood as a unit configured for providing a driving force, e.g. a force in a direction different from the levitation force, wherein the device is moved from one position to another, different position, for example a different position along the transport direction.
  • the device can be a carrier carrying a substrate or a mask and can be levitated by the magnetic levitation unit, i.e. by a force counteracting gravity.
  • the device can be moved by the drive unit in the transport direction T (different from a direction parallel to gravity) while being levitated.
  • the vacuum system 140 includes one or more pipes 141 connecting the interior space 121 of the housing 120 with one or more vacuum pumps 142.
  • the one or more vacuum pumps 142 may include at least one of a pre-vacuum pump, a high vacuum pump and an ultra-high vacuum pump.
  • the one or more electromagnets 130 may include one or more coils 131 wound around one or more cores 132, respectively.
  • the one or more electromagnets 130, particularly the one or more coils 131, are typically connected via one or more power supply lines 151.
  • the one or more power supply lines 151 extend through a wall of the housing 120.
  • the one or more cores 132 can include a magnetic material, i.e. a ferromagnetic material such as iron or the like.
  • the one or more coils 131 can be provided as conductive wires being wound around the one or more cores.
  • the housing 120 includes a main body 122 having a reception 123 for the one or more electromagnets 130, as exemplarily indicated in FIG. 3. More specifically, the reception 123 is configured such that the one or more electromagnets 130 can be arranged therein. Further, the housing 120 includes a cover 124 covering the reception 123. Accordingly, it is to be understood from FIG. 3 that the inner space 121 of the housing is delimited by the main body 122 with the reception 123 and the cover 124. Typically, the cover 124 includes a membrane 125, as schematically indicated in FIG. 3.
  • the term “membrane” can be understood as a structure having a large surface area in relation to the thickness of the membrane.
  • the membrane 125 has a thickness t of 0.1 mm ⁇ t ⁇ 2.5 mm, particularly 0.1 mm ⁇ t ⁇ 2.0 mm, more particularly 0.1 mm ⁇ t ⁇ 1.0 mm.
  • the membrane 125 has a thickness t of 0.3 mm ⁇ t ⁇ 2.5 mm, particularly 0.3 mm ⁇ t ⁇ 2.0 mm, more particularly 0.3 mm ⁇ t ⁇ 1.0 mm.
  • the membrane 125 can be made of stainless steel.
  • cover 124 By providing cover 124 with a membrane as described herein, eddy current losses can beneficially be reduced. Accordingly, a drive force generated by the drive unit 110 as described herein is increased with respect to the state of the art. Thus beneficially, the overall driving efficiency can be improved.
  • an air-tight sealing 161 is provided at an interface between the main body 122 and the cover 124, as exemplarily indicated in FIG. 3.
  • the air-tight sealing 161 may be provided by O-rings.
  • the transport system 100 may further include a cooling system 170 for cooling the drive unit 110.
  • the cooling system 170 typically includes one or more cooling elements 171 embedded in the housing 120.
  • the one or more cooling elements 171 can be a fluid based cooling element, e.g. a cooling pipe with a cooling fluid.
  • the one or more cooling elements 171 can be Peltier elements.
  • the transport system 100 includes a vacuum chamber 175, as exemplarily shown in FIG. 4.
  • the drive unit 110 is at least partially arranged within the vacuum chamber 175.
  • vacuum can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar.
  • the pressure in a vacuum chamber as described herein may be between 10 3 mbar and about 10 11 mbar, more typically between 10 8 mbar and 10 11 mbar, or even less than 10 11 mbar.
  • the vacuum system 140 is connected with an interior space 176 of the vacuum chamber 175. Accordingly, typically the vacuum system 140 is configured to provide a first vacuum with a first vacuum pressure pi in the vacuum chamber 175.
  • the first vacuum pressure pi can be a high vacuum (HV) pressure or an ultra high vacuum (UHV) pressure.
  • HV high vacuum pressure
  • UHV ultra high vacuum
  • a high vacuum pressure (HV) is a pressure within of less than 10 3 mbar, particularly within the range from 10 3 mbar to 10 8 mbar.
  • An ultra high vacuum (UHV) pressure is a pressure within the range from 10 8 mbar to 10 11 mbar.
  • the vacuum system 140 is configured to provide a second vacuum with a second vacuum pressure p2 in the housing 120 of a drive unit 110.
  • the second vacuum pressure p2 can be a pre-vacuum pressure.
  • a pre-vacuum pressure is a pressure within the range from 100 mbar to 10 3 mbar.
  • the vacuum system 140 can be configured for providing a pressure difference Ap between the interior space 121 of the housing 120 and the interior space 176 of the vacuum chamber 175 of
  • pi-p2£ 400 mbar, particularly
  • the cover 124, particularly the membrane 125 can be of lower thickness compared to the state of the art, since stress on the membrane and thus elastic deformation can beneficially be reduced.
  • the vacuum system 140 includes a pre-vacuum pump 143 and an high vacuum pump 144, particularly a ultra-high vacuum pump.
  • the pre- vacuum pump 143 is connected with the high vacuum pump 144, particularly the ultra-high vacuum pump, and the interior space 121 of the housing 120 of the drive unit 110, e.g. via one or more pipes 141.
  • the high vacuum pump 144, particularly the ultra-high vacuum pump is connected to the interior space 176 of the vacuum chamber 175. Accordingly, beneficially a vacuum inside the vacuum chamber 175 as well as a vacuum inside the housing 120 of the drive unit 110 can be provided simultaneously.
  • the transport system 100 includes a further air-tight sealing 162 provided at an interface between the main body 122 and the vacuum chamber 175.
  • the substrate processing system 200 includes at least one vacuum processing chamber 210, a processing device 220 provided in the vacuum processing chamber 210, and a transport system 100 for transporting the substrate carrier 230.
  • the processing device 220 may be selected from the group consisting of a deposition source, an evaporation source, and a sputter source, or other processing devices used for the processing of large area substrates employed for display manufacturing.
  • the processing device 220 is a deposition source, wherein a material to be deposited is indicated by dotted arrows 222.
  • the transport system 100 for transporting the substrate carrier 230 includes a drive unit 110 including a housing 120 encasing an interior space 121 having one or more electromagnets 130. Additionally, the transport system 100 for transporting the substrate carrier 230 includes a vacuum system 140 connected with the interior space 121 of the housing 120 and with an interior space 211 of the vacuum processing chamber 210. In particular, the transport system 100 for transporting the substrate carrier 230 is configured according to the transport system 100 for moving a device 100 according to any embodiments described herein, as exemplarily described with reference to FIGS. 1 to 4.
  • the method 300 includes applying (represented by block 310 in FIG. 6) a first vacuum with first a vacuum pressure pi in a vacuum chamber 175 of the vacuum processing system. [0049] Additionally, the method 300 includes applying (represented by block 320 in FIG. 6) a second vacuum with a second vacuum pressure p2 in a housing 120 of a drive unit 110. The housing 120 encases an interior space 121 having one or more electromagnets 130. Further, the method 300 includes moving (represented by block 330 in FIG. 6) the device 10 by employing the drive unit 110.
  • the method 300 further includes providing (represented by block 340 in FIG. 6) a pressure difference Ap between the first vacuum pressure pi and the second vacuum pressure p2, wherein the pressure difference Ap is
  • embodiments of the present disclosure beneficially provide a transport system, a substrate processing system, and a method of operating a transport system which are improved with respect to vacuum-compatibility and drive efficiency.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un système de transport (100) destiné à transporter un dispositif (10) dans un système de traitement sous vide. Le système de transport (100) inclut une unité d'entraînement (110) incluant un boîtier (120) renfermant un espace intérieur (121) ayant un ou plusieurs électroaimants (130). En outre, le système de transport (100) inclut un système de vide (140) relié à l'espace intérieur (121) du boîtier (120). L'invention concerne en outre un système de traitement de substrat incluant le système de transport ainsi qu'un procédé de fonctionnement d'un système de transport.
PCT/EP2020/062335 2020-05-04 2020-05-04 Système de transport pour déplacer un dispositif dans un système de traitement sous vide, système de traitement de substrat le comprenant et procédé de fonctionnement d'un système de transport WO2021223840A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/EP2020/062335 WO2021223840A1 (fr) 2020-05-04 2020-05-04 Système de transport pour déplacer un dispositif dans un système de traitement sous vide, système de traitement de substrat le comprenant et procédé de fonctionnement d'un système de transport
CN202080094100.9A CN115003852A (zh) 2020-05-04 2020-05-04 用于在真空处理系统中移动装置的运输系统、包括其的基板处理系统以及操作运输系统的方法

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Application Number Priority Date Filing Date Title
PCT/EP2020/062335 WO2021223840A1 (fr) 2020-05-04 2020-05-04 Système de transport pour déplacer un dispositif dans un système de traitement sous vide, système de traitement de substrat le comprenant et procédé de fonctionnement d'un système de transport

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WO2021223840A1 true WO2021223840A1 (fr) 2021-11-11

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