WO2021223106A1 - 一种散热机柜及通信设备 - Google Patents

一种散热机柜及通信设备 Download PDF

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Publication number
WO2021223106A1
WO2021223106A1 PCT/CN2020/088796 CN2020088796W WO2021223106A1 WO 2021223106 A1 WO2021223106 A1 WO 2021223106A1 CN 2020088796 W CN2020088796 W CN 2020088796W WO 2021223106 A1 WO2021223106 A1 WO 2021223106A1
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WO
WIPO (PCT)
Prior art keywords
cabinet
electronic device
air
heat dissipation
opening
Prior art date
Application number
PCT/CN2020/088796
Other languages
English (en)
French (fr)
Inventor
廉志晟
冯涛
许树龙
Original Assignee
华为数字能源技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为数字能源技术有限公司 filed Critical 华为数字能源技术有限公司
Priority to EP20934736.8A priority Critical patent/EP4138528A4/en
Priority to PCT/CN2020/088796 priority patent/WO2021223106A1/zh
Priority to CN202080044884.4A priority patent/CN114026972A/zh
Publication of WO2021223106A1 publication Critical patent/WO2021223106A1/zh
Priority to US17/981,129 priority patent/US20230057893A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554Forced ventilation of a gaseous coolant
    • H05K7/20572Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • H05K7/20581Cabinets including a drawer for fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554Forced ventilation of a gaseous coolant
    • H05K7/20572Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0213Venting apertures; Constructional details thereof
    • H05K5/0214Venting apertures; Constructional details thereof with means preventing penetration of rain water or dust
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20618Air circulating in different modes under control of air guidance flaps

Definitions

  • This application relates to the technical field of communication equipment, and in particular to a heat dissipation cabinet and communication equipment.
  • Communication equipment is more and more commonly installed in outdoor environments.
  • the heat dissipation cabinet is used to provide outdoor physical working environment and safety guarantee for the related equipment of wireless communication sites or wired network sites.
  • Communication devices such as base station devices, power supply devices, and transmission devices can be installed in the heat dissipation cabinet, and the heat dissipation effect of the electronic devices installed in the heat dissipation cabinet is guaranteed to provide support for the normal operation of the electronic devices.
  • the heat dissipation effect of the existing heat dissipation cabinet is limited, resulting in poor heat dissipation of the electronic devices in the heat dissipation cabinet.
  • the embodiment of the present application provides a heat dissipation cabinet to improve the heat dissipation effect of the heat dissipation cabinet and ensure the heat dissipation effect of electronic devices in the heat dissipation cabinet.
  • the embodiment of the present application also provides a communication device.
  • an embodiment of the present application provides a heat dissipation cabinet.
  • the heat dissipation cabinet includes a cabinet body, a cabinet door, and a baffle.
  • the side wall between the bottom walls, the cabinet door is installed on the cabinet body and located at the position of the side wall, an air outlet channel is provided in the cabinet body near the top wall, and the cabinet door
  • An air inlet assembly and an air outlet assembly are provided, the air outlet assembly is located between the air inlet assembly and the top wall and at one end of the air outlet channel, and an electronic device placement area is arranged in the cabinet, so
  • the baffle is arranged between the electronic device placement area and the cabinet door, and the baffle includes a first opening, so that the air entering through the air inlet assembly directly enters the electronic device through the first opening. Device placement area.
  • a baffle is provided between the electronic device placement area and the cabinet door, so that the air entering through the air inlet assembly directly enters the electronic device through the first opening.
  • the device placement area is used to dissipate heat for the electronic devices arranged in the electronic device placement area.
  • an air outlet channel is provided at a position close to the top wall of the cabinet, so that the air passing through the electronic device is guided from the air outlet channel to the air outlet assembly, and then passes through the air outlet assembly.
  • the air (hot air) of the electronic device is exhausted from the outside of the cabinet.
  • the air outlet channel in the present application can quickly and effectively collect and discharge the heated air passing through the electronic device to the outside of the cabinet, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet and ensuring that it is installed in the cabinet.
  • the present application directly introduces external air (cold air) into the electronic device placement area through the baffle to prevent the external air from spreading in the cabinet in any direction and finally enter the electronic device placement area.
  • the external air The temperature will gradually rise, and when it finally reaches the electronic device placement area, the air does not have a good heat dissipation effect on the electronic devices in the electronic device placement area.
  • the electronic device placement area improves the heat dissipation effect of the air to the electronic device in the electronic device placement area, and ensures the effective operation of the electronic device.
  • the baffle can also prevent the air (hot air) passing through the electronic device placement area from mixing with the air (cold air) entering from the air inlet component, which greatly improves the heat dissipation effect of the heat dissipation cabinet.
  • the air inlet component and the air outlet component in the present application are both arranged on the cabinet door, which is convenient for maintenance, simplifies the side wall structure, and reduces production costs and maintenance costs.
  • the air outlet channel includes a main body and an air duct penetrating the main body, and opposite ends of the main body include a first air duct communicating with the air duct.
  • the upper part of the electronic device installation area is the direction of the electronic device installation area toward the top wall, and the third opening is located between the top wall and the electronic device placement area so as to pass through the
  • the air in the electronic device placement area is quickly collected and discharged out of the cabinet through the air duct to prevent hot air from returning to the electronic device placement area.
  • the air entering the air duct is isolated from the air outside the air duct , Effectively improve the heat dissipation effect of the heat dissipation cabinet.
  • the second opening and the third opening are arranged oppositely in a direction toward the cabinet door, and the air passing through the electronic device placement area
  • the third opening is quickly collected and discharged to the outside of the cabinet through the air duct, preventing hot air from flowing back to the electronic device placement area, and effectively improving the heat dissipation effect of the heat dissipation cabinet.
  • the third opening is disposed toward the electronic device placement area, that is, the third opening is facing the electronic device placement area.
  • the air setting can effectively quickly collect and discharge the air passing through the electronic device placement area to the outside of the cabinet body, prevent hot air from returning to the electronic device placement area, and effectively improve the heat dissipation effect of the heat dissipation cabinet.
  • At least one exhaust fan is provided in the air outlet channel for drawing out the air passing through the electronic device placement area.
  • the baffle in a possible implementation of the heat dissipation cabinet, includes a first baffle and a second baffle, and the first opening is located between the first baffle and the second baffle. Between the baffles, the first baffle is disposed adjacent to the body, and the second baffle is located between the first baffle area and the bottom wall. That is to say, in the present application, the first baffle and the second baffle are spaced apart to form the first opening exposing the electronic device placement area, so that external air is directly passed through the first opening Introducing the electronic device placement area can effectively prevent the air from heating up during the process of not entering the electronic device placement area, and improve the heat dissipation effect of the electronic device in the electronic device placement area.
  • the first baffle and the second baffle can also prevent the backflow of air passing through the electronic device placement area from mixing with the air entering from the air inlet assembly to heat the air entering from the air inlet assembly, which greatly improves The heat dissipation effect of the heat dissipation cabinet.
  • the width of the first opening in the direction from the bottom wall to the top wall is less than or equal to that of the electronic device placement area at the bottom.
  • the width from the wall to the top wall can effectively prevent the air caused by the first opening from being too large to directly enter the electronic device placement area, and the air flowing through the electronic device placement area will flow back from the electronic device placement area.
  • the air entered by the air inlet assembly is mixed to heat the air entered from the air inlet assembly, which effectively improves the heat dissipation effect of the heat dissipation cabinet.
  • a gap is formed between the first baffle and the second baffle and the side wall, so as to allow entry through the air inlet assembly
  • the air enters the electronic device placement area through the gap.
  • the air entering the air inlet assembly passes through the first baffle and the first baffle.
  • the two baffles bypass the gap and enter the side wall position of the cabinet, and then enter the internal air duct of the electronic device, so as to quickly dissipate heat to the electronic device, that is, the air in this application is Follow the internal air duct of the electronic device to enter the electronic device for heat dissipation, which can quickly and effectively dissipate the heat of the electronic device and improve the heat dissipation effect of the electronic device.
  • the first baffle and the first baffle The second baffle can also prevent the air flowing back through the electronic device placement area from mixing with the air entering from the air inlet assembly to heat the air entering from the air inlet assembly, which greatly improves the heat dissipation effect of the heat dissipation cabinet.
  • the air intake assembly includes a first cover and an intake fan
  • the first cover includes an accommodating space and is located opposite to the first cover.
  • the fourth opening and the fifth opening at both ends and communicating with the containing space
  • the air inlet fan is arranged on the side of the fifth opening, and the air inlet fan draws air outside the cabinet body into the cabinet body. That is to say, air is drawn into the cabinet through the air inlet component, that is, the cabinet is a positive pressure system, and the air entering the cabinet heats up after passing through the electronic device placement area, and faces the top wall. Flow in the direction, and then discharge out of the cabinet through the air outlet component located close to the top wall.
  • the fan is installed in the air outlet assembly, that is, the fan is used to draw the air out of the cabinet, thereby forming a negative pressure system in the cabinet.
  • the external air will be sucked into the Inside the cabinet.
  • air can not only enter the cabinet through the air intake components, but also enter the cabinet through other screw holes in the cabinet, so that the dust and water outside the cabinet can pass through the screw holes and escape. Holes such as wire holes are sucked into the cabinet and affect the performance of the devices in the cabinet.
  • the positive pressure system of the present application can effectively prevent air from entering the cabinet from holes other than the air intake components, and can effectively prevent dust and water outside the cabinet from being sucked into the cabinet through holes such as screw holes, wiring holes, etc. In the body, the performance of the device in the cabinet is guaranteed.
  • a part of the first cover is located inside the cabinet door, a part is located outside the cabinet door, and the fourth opening is located in the On the outer side of the cabinet door, the fifth opening is located on the inner side of the cabinet door, so that the air inlet assembly does not occupy too much space in the cabinet body, ensuring the capacity of the cabinet body, and at the same time, the inlet
  • the air component part protrudes from the outside of the cabinet door, which ensures the clean appearance of the heat dissipation cabinet, facilitates the transportation of the heat dissipation cabinet, and prevents the air intake component from being bumped and damaged during transportation and use.
  • the first cover is located inside the cabinet door, and the fourth opening is in communication with the air inlet of the cabinet door, that is, The air inlet component does not protrude from the outside of the cabinet door, so that the appearance of the heat dissipation cabinet is clean and tidy, and the air inlet component is prevented from being knocked and damaged during transportation and use.
  • the first cover is located outside the cabinet door, and the fifth opening is in communication with the air inlet of the cabinet door, that is, the air inlet assembly does not occupy the space in the cabinet, so It can ensure that the space in the cabinet is large enough to meet the large-capacity needs of customers.
  • the air inlet assembly further includes a filter, and the filter is located in the accommodating space and is located in the direction of the fifth air inlet fan. Open side.
  • the filter element is used to filter impurities in the external air, to prevent impurities from entering the cabinet to affect the electrical performance of the electronic device in the cabinet, and to increase the service life of the electronic device.
  • the filter element includes a dustproof element and a first waterproof element, and the dustproof element is disposed close to the intake fan relative to the first waterproof element.
  • the first waterproof member is disposed close to the intake fan relative to the dust-proof member.
  • the air outlet assembly includes a second waterproof member, and the second waterproof member is used to prevent water from entering the cabinet and prevent water from affecting the The electrical performance of the electronic device in the cabinet increases the service life of the electronic device.
  • the number of the air outlet components and the number of the air inlet components are both multiple, so as to achieve different heat dissipation requirements.
  • the heat dissipation cabinet includes a temperature sensor and a controller, the temperature sensor is provided in the electronic device placement area, and the controller and the temperature sensor and The intake fan is electrically connected to control the rotation speed of the intake fan according to the temperature of the electronic device.
  • the cabinet door is connected with a first cover plate and a second cover plate, and the first cover plate is used to open or close the air outlet assembly ,
  • the second cover is used to open or close the air inlet assembly, that is to say, the unused air inlet assembly or the air outlet assembly can be closed to ensure the airtightness of the cabinet and effectively control the
  • the air flow in the cabinet improves the heat dissipation effect of the heat dissipation cabinet while reducing the energy consumption of the heat dissipation cabinet during use, thereby saving the use cost.
  • the cabinet door is provided with a driving part, and the driving part is connected with the controller, the first cover plate and the second cover plate to drive
  • the first cover and the second cover respectively open or close the air outlet assembly and the air intake assembly, so that the first cover and the second cover can be automatically controlled by the controller Control and improve user experience.
  • the heat dissipating cabinet further includes a carrier, the carrier is installed in the cabinet, and the area where the carrier is used to install related electronic devices is In the electronic device placement area, the body is fixed to a portion of the carrier near the top wall.
  • the carrier frame can not only assist in the installation of electronic devices, but also be used to fix the body, thereby avoiding the introduction of a new structure to fix the body, simplifying the structure of the heat dissipation cabinet, and reducing the production cost of the heat dissipation cabinet .
  • the heat dissipation cabinet further includes an auxiliary air outlet component, and the auxiliary air outlet component is provided in the middle of the cabinet door. That is to say, the air passing through the electronic device on the bottom wall can be discharged outside the cabinet through the auxiliary air outlet component, thereby avoiding the step-by-step transfer of hot air between different electronic devices, thereby affecting the heat dissipation effect of other electronic devices , Effectively improve the overall heat dissipation effect of multiple electronic devices.
  • an embodiment of the present application provides a communication device.
  • the communication device includes an electronic device and the heat dissipation cabinet according to any possible implementation manner of the first aspect, and the electronic device is provided in all the heat dissipation cabinets.
  • the communication device has good heat dissipation effect and excellent electrical performance.
  • a baffle is provided between the electronic device placement area and the cabinet door, so that the air entering through the air inlet assembly directly enters the electronic device through the first opening.
  • the device placement area is used to dissipate heat for the electronic devices arranged in the electronic device placement area.
  • an air outlet channel is provided at a position close to the top wall of the cabinet, so that the air passing through the electronic device is guided from the air outlet channel to the air outlet assembly, and then passes through the air outlet assembly.
  • the air (hot air) of the electronic device is exhausted from the outside of the cabinet.
  • the air outlet channel in the present application can quickly and effectively collect and discharge the heated air passing through the electronic device to the outside of the cabinet, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet and ensuring that it is installed in the cabinet.
  • the present application directly introduces external air (cold air) into the electronic device placement area through the baffle to prevent the external air from spreading in the cabinet in any direction and finally enter the electronic device placement area.
  • the external air The temperature will gradually rise, and when it finally reaches the electronic device placement area, the air does not have a good heat dissipation effect on the electronic devices in the electronic device placement area.
  • the air heats up when it does not enter the electronic device placement area, and at the same time, by setting the air outlet channel, the air (hot air) passing through the electronic device placement area can be quickly discharged out of the cabinet, effectively preventing the hot air from returning to the cabinet.
  • the electronic device placement area improves the heat dissipation effect of the air to the electronic device in the electronic device placement area, and ensures the effective operation of the electronic device.
  • Fig. 1 is a schematic structural diagram of a communication device provided by an embodiment of the present application.
  • Fig. 2 is a schematic structural diagram of a first embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • Fig. 3 is a schematic structural view of the heat dissipation cabinet provided in Fig. 2 from another angle.
  • Fig. 4 is a schematic diagram of the structure of the negative pressure system of the heat dissipation cabinet.
  • Figure 5 is a schematic diagram of the air flow in the cabinet.
  • Figure 6 is another schematic diagram of air flow in the cabinet.
  • Fig. 7 is a schematic structural diagram of a second embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • Fig. 8 is a schematic structural diagram of a third embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • Fig. 9 is a schematic structural diagram of a fourth embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • Fig. 10 is a schematic structural diagram of another embodiment of the heat dissipation cabinet provided in Fig. 9.
  • FIG. 11 is a schematic structural diagram of a fifth embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • Fig. 12 is a schematic structural diagram of a fifth embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of a sixth embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of a communication device provided by an embodiment of the present application.
  • the communication equipment 100 includes a heat dissipation cabinet 10 and an electronic device 20, and the electronic device 20 is disposed in the electronic device placement area 114 of the heat dissipation cabinet 10.
  • the communication device 100 is a workstation such as a wireless communication station and a network workstation, and the electronic device 20 may include one or more of a base station device, a power supply device, a storage battery, and a transmission device.
  • the electronic device 20 is arranged in the heat dissipation cabinet 10, which can ensure that the electronic device 20 has a good heat dissipation effect and excellent electrical performance.
  • FIG. 2 is a schematic structural diagram of a first embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • Fig. 3 is a schematic structural view of the heat dissipation cabinet provided in Fig. 2 from another angle.
  • the heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13, and a baffle 14.
  • the cabinet body 11 includes a top wall 111, a bottom wall 112, and side walls connected between the top wall 111 and the bottom wall 112. 113.
  • the cabinet door 12 is installed on the cabinet body 11 at a position of the side wall 113, and can be opened and closed relative to the cabinet body 11.
  • the air outlet channel 13 is arranged in the cabinet 11 and close to the top wall 111.
  • the cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16.
  • the air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and is located at the outlet At one end of the wind channel 13, an electronic device placement area 114 is provided in the cabinet 11, and the electronic device placement area 114 is located on the side of the air outlet channel 13 close to the bottom wall 112.
  • the baffle 14 is provided between the electronic device placement area 114 and the cabinet door 12 Meanwhile, the baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141.
  • a baffle 14 is provided between the electronic device placement area 114 and the cabinet door 12, so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141, so that The electronic device 20 disposed in the electronic device placement area 114 dissipates heat (the arrow in FIG. 2 indicates the approximate flow direction of air in the cabinet 11).
  • an air outlet channel 13 is provided at the position of the cabinet 11 close to the top wall 111, so that the air passing through the electronic device 20 is guided from the air outlet channel 13 to the air outlet assembly 16, and then passes through the electronic device 20 through the air outlet assembly 16.
  • the air (hot air) is discharged out of the cabinet 11.
  • the air outlet channel 13 in the present application can quickly and effectively collect and discharge the heated air passing through the electronic device 20 to the outside of the cabinet 11, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet 10 and ensuring that it is installed in the heat dissipation cabinet 10.
  • the external air cold air
  • the baffle 14 prevent the external air from spreading in any direction in the cabinet 11 and finally enter the electronic device placement area 114. In this process, the temperature of the external air will be reduced.
  • the problem of poor heat dissipation of the electronic device 20 in the electronic device placement area 114 when the air finally reaches the electronic device placement area 20 By directly introducing external air into the electronic device placement area 114, it can effectively prevent the air from entering the electronic device placement area 114.
  • the temperature of the electronic device placement area 114 is raised during the process.
  • the air outlet channel 13 can be set to quickly exhaust the air (hot air) passing through the electronic device placement area 114 out of the cabinet 11, effectively preventing the hot air from flowing back to the electronic device placement area 114, improving
  • the heat dissipation effect of the air on the electronic device 20 in the electronic device placement area 114 is improved, and the effective operation of the electronic device 20 is ensured.
  • the baffle 14 can also prevent the air (hot air) passing through the electronic device placement area 114 from mixing with the air (cold air) entering from the air inlet assembly 15, which greatly improves the heat dissipation effect of the heat dissipation cabinet 10.
  • the air inlet assembly 15 and the air outlet assembly 16 in the present application are both arranged on the cabinet door 12, which is convenient for maintenance, simplifies the structure of the side wall 113, and reduces production costs and maintenance costs.
  • the shape of the cabinet 11 is a square column. Specifically, there are three side walls 113, and the three side walls 113 are connected in sequence and surround the top wall 111 and the bottom wall 112 to form a receiving space.
  • the cabinet door 12 is arranged on the side wall 113 at the opening of the storage space, and opens and closes relative to the cabinet body 11 to open or close the storage space.
  • the cabinet 11 is provided with a supporting frame (not shown in the figure), and the supporting frame is, for example, composed of a plurality of square hole bars.
  • the area where the supporting frame is used to install the electronic device 20 is the electronic device placement area 114, and the supporting frame is used to install the electronic device 20 so that the electronic device 20 is stably installed in the cabinet 11.
  • the carrier is not limited to the above description, as long as it can fix or carry the electronic device 20.
  • the cabinet door 12 has a plate shape and is provided on the side wall 113 through a rotating structure such as a hinge, and can be opened and closed relative to the opening of the receiving space.
  • the cabinet door 12 includes an inner side 121 and an outer side 122, the inner side 121 faces the storage space, and the outer side 122 faces away from the storage space.
  • the cabinet door 12 is provided with an air inlet and an air outlet penetrating through the inner side 121 and the outer side 122.
  • the air inlet is communicated with the air inlet assembly 15, and the air outlet is communicated with the air outlet assembly 16, so that the air outside the cabinet 11 can pass through the air inlet assembly 15 Entering into the cabinet 11, the air in the cabinet 11 is discharged out of the cabinet 11 through the air outlet assembly 16, which ensures the heat dissipation performance of the heat dissipation cabinet 10.
  • the air intake assembly 15 includes a first cover 151, a filter 152 and an intake fan 153.
  • the first cover 151 includes an accommodation space 1511 and fourth openings 1512 and For the fifth opening 1513, the air inlet fan 153 is disposed on the side of the fifth opening 1513, and the filter 152 is located in the receiving space 1511 and on the side of the air inlet fan 153 facing the fifth opening 1513.
  • the intake fan 153 draws air outside the cabinet 11 into the cabinet 11.
  • the first cover 151 is located on the inner side 121 of the cabinet door 12, and the fourth opening 1512 is communicated with the air inlet of the cabinet door 12, that is, the air inlet assembly 15 does not protrude from the outer side 122 of the cabinet door 12, thereby ensuring heat dissipation.
  • the appearance of the cabinet 10 is clean and tidy, which prevents the air inlet assembly 15 from being bumped and damaged during transportation and use.
  • the filter 152 is used to filter impurities in the outside air, to prevent impurities from entering the cabinet 11 to affect the electrical performance of the electronic device 20 in the cabinet 11, and to increase the service life of the electronic device 20.
  • the number of air intake components 15 can be set according to actual needs to achieve different heat dissipation requirements.
  • the air inlet assembly 15 can be switched to an air outlet assembly by removing the fan as required.
  • the air inlet assembly 15 can also be arranged on the outer side 122 of the cabinet door 12, or a part of the air inlet assembly 15 is located on the inner side 121 of the cabinet door 12 and a part is located on the outer side 122 of the cabinet door 12.
  • the air is drawn into the cabinet 11 through the air inlet assembly 15, that is, the cabinet 11 is a positive pressure system.
  • the air entering the cabinet 11 heats up after passing through the electronic device placement area 114 and faces the top wall 111. It flows in the same direction, and then exits the outside of the cabinet 11 through the air outlet assembly 16 located close to the top wall 111.
  • the fan 16a is arranged in the air outlet channel 13 (as shown in Figure 4) or the air outlet assembly 16, that is, the fan 16a is used to extract the air in the cabinet 11, thereby forming a negative pressure system in the cabinet 11, Under the action, the outside air will be sucked into the cabinet 11 through the air inlet assembly 15.
  • air can not only enter the cabinet 11 through the air inlet component 15, but also enter the cabinet 11 through other screw holes in the cabinet 11, thereby passing the dust and water outside the cabinet 11 through the screw holes. , Holes such as wiring holes are sucked into the cabinet 11, which affects the performance of the devices in the cabinet 11.
  • the positive pressure system of the present application can effectively prevent air from entering the cabinet 11 from holes other than the air intake assembly 15, and can effectively prevent dust and water outside the cabinet 11 from being sucked into the cabinet 11 through holes such as screw holes and wiring holes. Inside, the performance of the device in the cabinet 11 is guaranteed.
  • the inlet fan may also be removed, and a fan may be provided on the outlet assembly 16 to switch the heat dissipation cabinet 10 of the positive pressure system to the heat dissipation cabinet of the negative pressure system.
  • the filter element 152 includes a dustproof element 1521 and a first waterproof element 1522.
  • the dustproof member 1521 is, for example, a dustproof structure such as a dust-proof net
  • the first waterproof member 1522 is, for example, a waterproof structure such as a water baffle.
  • the dustproof member 1521 is arranged close to the intake fan 153 relative to the first waterproof member 1522, that is, the first waterproof member 1522 is arranged close to the fourth opening 1512, that is, close to the outside air, so as to effectively prevent water and dust from entering the cabinet 11, Prevent water and dust from affecting the electrical performance of the electronic device 20 in the cabinet 11, and increase the service life of the electronic device 20.
  • the first waterproof member 1522 is disposed close to the intake fan 153 relative to the dust-proof member 1521.
  • the baffle 14 includes a first baffle 142 and a second baffle 143.
  • the first baffle 142 and the second baffle 143 are in the shape of a plate.
  • the first opening 141 is located between the first baffle 142 and the second baffle 143. That is, the first baffle 142 and the second baffle 143 are spaced apart to form a first opening 141 exposing the electronic device placement area 114.
  • the first baffle 142 is disposed adjacent to the air outlet channel 13, and the second baffle 143 is located in the first Between the baffle area 142 and the bottom wall 112.
  • the side of the first baffle 142 close to the air outlet channel 13 is connected to the air outlet channel 13 to cooperate with the air outlet channel 13 to prevent the air entering from the air inlet assembly 15 from directly exiting the air without passing through the electronic device placement area 114
  • the assembly 16 is discharged.
  • the first baffle 142 and the second baffle 143 are both fixed on the supporting frame, and can be detachably connected to the supporting frame.
  • the first baffle 142 and the second baffle 143 can also be composed of a plurality of sub-baffles (not shown).
  • the size of the first opening 141 can be determined according to the volume of the electronic device 20.
  • first baffle 142 and the second baffle 143 By changing the first baffle 142 and the second baffle The number of sub-baffles of the baffle 143 changes the size of the first opening 141, so that the size of the first opening 141 can be set according to actual needs.
  • the first baffle 142 and the second baffle 143 may also be provided on other structures in the cabinet 11.
  • Figure 5 is a schematic diagram of the air flow in the cabinet. Part of the structure of the heat dissipation cabinet 10 is not shown in FIG. 5, please refer to FIG. 2 in combination.
  • the direction of the internal air duct of the electronic device 20 in FIG. 5 is the direction from the cabinet door 12 to the side wall 113 disposed opposite to the cabinet door 12. It can be understood that, taking the cabinet door 12 as the front side, it is opposite to the cabinet door 12
  • the side wall 113 is set at the back, and the direction of the internal air duct of the electronic device 20 is from the front to the back.
  • the internal air duct 20 (the solid arrow part in FIG. 5) is used to dissipate heat from the electronic device 20.
  • part of the air passes through the upper and lower sides of the electronic device 20, that is, passes toward the top wall 111 Backflow on the side of the bottom wall 112 and the side facing the bottom wall 112 (the dotted arrow in Figure 5). Due to the arrangement of the first baffle 142 and the second baffle 143, the recirculated air cannot be mixed with the air entering from the air inlet assembly 15 .
  • the first opening 141 is formed by the first baffle 142 and the second baffle 143, so that external air is directly introduced into the electronic device placement area 114 through the first opening 141, which can effectively prevent air from entering the electronic device placement area.
  • the first baffle 142 and the second baffle 143 can also prevent the backflow of air passing through the electronic device placement area 114 from mixing with the air entering from the air inlet assembly 15 to heat the air entering from the air inlet assembly 15, greatly improving heat dissipation.
  • the width of the first opening 141 from the bottom wall 112 to the top wall 111 is less than or equal to the width of the electronic device placement area 114 from the bottom wall 112 to the top wall 111, thereby effectively preventing the first opening 141 from being too large.
  • the resulting air will not directly enter the electronic device placement area 114, and the air returning through the electronic device placement area 114 will mix with the air entering from the air inlet assembly 15 to heat the air entering from the air inlet assembly 15, effectively improving the heat dissipation of the cabinet. 10's heat dissipation effect.
  • the width of the first opening 141 in the direction from the bottom wall 112 to the top wall 111 may be greater than the width of the electronic device placement area 114 from the bottom wall 112 to the top wall 111 when the heat dissipation requirement is not large.
  • Figure 6 is another schematic diagram of the air flow in the cabinet. Part of the structure of the heat dissipation cabinet 10 is not shown in FIG. 6, please refer to FIG. 2 in combination.
  • a gap a is formed between the first baffle 142 and the second baffle 143 and the side wall 113. Specifically, a gap a is formed between the baffle 15 and two adjacent side walls 13, so that the air entering through the air inlet assembly 15 enters the electronic device placement area 114 through the gap a.
  • the direction of the internal air duct of the electronic device 20 is parallel to the direction between the two side walls 113 connecting the cabinet door 12, it can be understood that taking the cabinet door 12 as the front side, the connection cabinet door
  • the two side walls 113 of 12 are the left side wall and the side wall respectively.
  • the direction of the internal air duct of the electronic device 20 is from the left wall to the right wall, or the direction of the internal air duct of the electronic device 20 is from the right wall.
  • the air entering through the air inlet assembly 15 mainly passes through the first baffle 142 and the second baffle 143 to bypass the gap a and enters the side wall of the cabinet 11 113 position, and then enter the internal air duct of the electronic device 20 to quickly dissipate heat to the electronic device 20 (the solid arrow part in FIG. 6).
  • the air passing through the electronic device 20 exits the electronic device 20 a part of it will go up and down through the electronic device 20 On both sides, that is, through the side toward the top wall 111 and the side toward the bottom wall 112 backflow (the dotted arrow part in FIG.
  • the backflow air cannot interact with The air entering from the air inlet assembly 15 is mixed. That is to say, the air in the present application enters the electronic device 20 along the internal air duct of the electronic device 20 for heat dissipation, which can quickly and effectively dissipate the electronic device 20 and improve the heat dissipation effect of the electronic device 20.
  • the first baffle The 142 and the second baffle 143 can also prevent the air flowing back through the electronic device placement area 114 from mixing with the air entering from the air inlet assembly 15 to heat the air entering from the air inlet assembly 15, which greatly improves the heat dissipation effect of the heat dissipation cabinet 10.
  • the electronic device 20 since the internal air duct direction of the electronic device 20 is not from the front to the back, That is, the electronic device 20 does not have an air inlet passage at the first opening 141, so the air entering from the air inlet assembly 15 will not enter through the first opening 141 between the first baffle 142 and the second baffle 143 When entering the electronic device 20, it enters the electronic device placement area 114 through the gap a, and then enters the internal air duct of the electronic device 20 to dissipate the electronic device 20.
  • the arrangement of the first baffle 142 and the second baffle 143 in the present application has a good heat dissipation effect on the electronic device 20 with different internal air duct directions, and has a wide range of applications.
  • the second baffle 143 and the bottom wall 112 form a gap, so that the air entering through the air inlet assembly 15 enters the bottom wall 112 to dissipate heat from the related heating elements provided on the bottom wall 112.
  • a gap is formed between the baffle 15 and one of the side walls 13.
  • the first opening may not be provided between the first baffle 142 and the second baffle 143.
  • the second baffle 143 may also be connected to the bottom wall 112.
  • the air outlet channel 13 includes a main body 131 and an air duct 132 penetrating the main body 131.
  • the main body 131 is fixed to a portion of the carrier near the top wall 111, and the first baffle 141 is connected to the main body 131.
  • the opposite ends of the body 131 include a second opening 1311 and a third opening 1312 communicating with the air duct 132.
  • the second opening 1311 and the third opening 1312 are oppositely arranged in a direction toward the cabinet door 12, and the second opening 1311 In communication with the air outlet assembly 16, the third opening 1312 is located above the electronic device placement area 114.
  • Above the electronic device installation area 113 is the direction of the electronic device installation area 113 facing the top wall 111.
  • the third opening 1312 is located between the top wall 111 and the electronic device placement area 114 to facilitate the rapid air passing through the electronic device placement area 114.
  • the air is collected and discharged out of the cabinet 11 through the air duct 132 to prevent the hot air from flowing back to the electronic device placement area 114.
  • the air entering the air duct 132 is isolated from the air outside the air duct 132, which effectively improves the heat dissipation effect of the heat dissipation cabinet 10.
  • the main body 131 is arranged on the carrying frame, thereby avoiding the introduction of a new structural fixing main body 131, simplifying the structure of the heat dissipation cabinet 10, and reducing the production cost of the heat dissipation cabinet 10.
  • the third opening 1312 may also face the electronic device placement area 114.
  • An exhaust fan may also be provided in the air duct 132.
  • the air outlet assembly 16 includes a second cover body 161 and a second waterproof member 162.
  • the second cover body 161 includes a sixth opening 1611 and a seventh opening 1612 which are located at two ends of the second cover body 161 and communicate with the inside of the second cover body 161.
  • the second cover 161 is located on the inner side 121 of the cabinet door 12, the seventh opening 1612 is communicated with the second opening 1311 of the air outlet channel 13, and the sixth opening 1611 is communicated with the air outlet of the cabinet door 12.
  • the air outlet assembly 16 does not protrude from the outer side 122 of the cabinet door 12, thereby ensuring a clean appearance of the heat dissipation cabinet 10, and avoiding the air outlet assembly 16 from being bumped and damaged during transportation and use.
  • the second waterproof member 162 is, for example, a waterproof structure such as a water baffle.
  • the second waterproof member 162 is used to prevent water from entering the cabinet 11, prevent water from affecting the electrical performance of the electronic device 20 in the cabinet 11, and improve the use of the electronic device 20 life.
  • the number of air outlet components 16 can be set according to actual needs to achieve different heat dissipation requirements.
  • the air outlet assembly 16 may also be provided with dustproof parts.
  • the air outlet assembly 16 may also be arranged on the outside 122 of the cabinet door 12, or a part of the air outlet assembly 16 is located on the inner side 121 of the cabinet door 12 and a part is located on the outer side 122 of the cabinet door 12.
  • the heat dissipation cabinet 10 also includes a temperature sensor (not shown) and a controller (not shown).
  • the temperature sensor is located in the electronic device placement area 114, the controller is located in the accommodating space, and the controller is electrically connected to the temperature sensor and the intake fan 153.
  • the rotation speed of the inlet fan 153 is controlled according to the temperature of the electronic device 20 to realize the automatic control of the heat dissipation system and improve the user experience.
  • FIG. 7 is a schematic structural diagram of a second embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • the heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13, and a baffle 14.
  • the cabinet body 11 includes a top wall 111, a bottom wall 112, and side walls connected between the top wall 111 and the bottom wall 112. 113.
  • the cabinet door 12 is installed on the cabinet body 11 at a position of the side wall 113, and can be opened and closed relative to the cabinet body 11.
  • the air outlet channel 13 is arranged in the cabinet 11 and close to the top wall 111.
  • the cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16.
  • the air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and is located at the outlet At one end of the wind channel 13, an electronic device placement area 114 is provided in the cabinet 11, and the electronic device placement area 114 is located on the side of the air outlet channel 13 close to the bottom wall 112.
  • the baffle 14 is provided between the electronic device placement area 114 and the cabinet door 12 Meanwhile, the baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141.
  • the heat dissipation cabinet 10 further includes an auxiliary air outlet assembly 17, and the auxiliary air outlet assembly 17 is arranged in the middle of the cabinet door 12 and located between the two air inlet assemblies 15.
  • auxiliary air outlet assembly 17 There is one auxiliary air outlet assembly 17, and the structure of the auxiliary air outlet assembly 17 is the same as that of the air outlet assembly 16.
  • the cabinet door 12 is provided with an air outlet communicating with the auxiliary air outlet assembly 17 to exhaust the air in the cabinet 11 through the auxiliary air outlet assembly 17.
  • the auxiliary air outlet assembly 17 is provided so that the air passing through the electronic device located on the bottom wall 112 can be discharged outside the cabinet 11 through the auxiliary air outlet assembly 17, thereby avoiding the step-by-step transfer of hot air between different electronic devices, thereby affecting other electronic devices.
  • the heat dissipation effect of the device effectively improves the overall heat dissipation effect of multiple electronic devices.
  • the number and positions of the auxiliary air outlet components 17 can also be set according to actual needs, and the auxiliary air outlet components 17 can also be switched to auxiliary air inlet components by setting a fan.
  • FIG. 8 is a schematic structural diagram of a third embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • the heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13, and a baffle 14.
  • the cabinet body 11 includes a top wall 111, a bottom wall 112, and side walls connected between the top wall 111 and the bottom wall 112. 113.
  • the cabinet door 12 is installed on the cabinet body 11 at a position of the side wall 113, and can be opened and closed relative to the cabinet body 11.
  • the air outlet channel 13 is arranged in the cabinet 11 and close to the top wall 111.
  • the cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16.
  • the air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and is located at the outlet At one end of the wind channel 13, an electronic device placement area 114 is provided in the cabinet 11, and the electronic device placement area 114 is located on the side of the air outlet channel 13 close to the bottom wall 112.
  • the baffle 14 is provided between the electronic device placement area 114 and the cabinet door 12 Meanwhile, the baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141.
  • the air outlet channel 13 includes a main body 131 and an air duct 132 passing through the main body 131, and the main body 131 is fixed to a part of the carrier near the top wall 111.
  • the opposite ends of the main body 131 include a second opening 1311 and a third opening 1312 communicating with the air duct 132.
  • the second opening 1311 communicates with the air outlet assembly 16, and the third opening 1312 is located above the electronic device placement area 114.
  • the third opening 1312 is disposed toward the electronic device placement area 114, that is, the third opening 1312 is disposed toward the air passing through the electronic device placement area 114, so that the air passing through the electronic device placement area 114 can be effectively collected and discharged quickly.
  • the outside of the cabinet 11 prevents hot air from flowing back to the electronic device placement area 114, which effectively improves the heat dissipation effect of the heat dissipation cabinet 10.
  • the heat dissipation cabinet 10 includes auxiliary air outlet components. An exhaust fan may also be provided in the air duct 132.
  • FIG. 9 is a schematic structural diagram of a fourth embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • the heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13, and a baffle 14.
  • the cabinet body 11 includes a top wall 111, a bottom wall 112, and side walls connected between the top wall 111 and the bottom wall 112. 113.
  • the cabinet door 12 is installed on the cabinet body 11 and located at the side wall 113, and can be opened and closed relative to the cabinet body 11.
  • the air outlet channel 13 is arranged in the cabinet 11 and close to the top wall 111.
  • the cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16.
  • the air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and is located at the outlet At one end of the wind channel 13, an electronic device placement area 114 is provided in the cabinet 11, and the electronic device placement area 114 is located on the side of the air outlet channel 13 close to the bottom wall 112.
  • the baffle 14 is provided between the electronic device placement area 114 and the cabinet door 12 Meanwhile, the baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141.
  • the air outlet channel 13 includes a main body 131 and an air duct 132 passing through the main body 131, and the main body 131 is fixed to a part of the carrier near the top wall 111.
  • the opposite ends of the body 131 include a second opening 1311 and a third opening 1312 communicating with the air duct 132.
  • the second opening 1311 and the third opening 1312 are oppositely arranged in a direction toward the cabinet door 12, and the second opening 1311 is connected to the air outlet.
  • the components 16 are connected, and the third opening 1312 is located above the electronic device placement area 114.
  • An exhaust fan is arranged in the air outlet channel 13. Specifically, the exhaust fan is arranged in the air duct 132 and is arranged close to the third opening 1312, and is used to draw out the air passing through the electronic device placement area 114.
  • the exhaust fan 18 By arranging the exhaust fan 18 in the air outlet channel 13, the air passing through the electronic device placement area 114 can be quickly collected and discharged to the outside of the cabinet 11, and the heat dissipation effect of the electronic devices in the electronic device placement area 114 can be improved.
  • the exhaust fan 18 is connected to the controller to control the on-off and rotation speed of the exhaust fan 18 through the controller.
  • the number and positions of the exhaust fans 18 can also be set according to actual needs, and the third opening is set toward the electronic device placement area 114 (as shown in FIG. 10).
  • the heat dissipation cabinet 10 includes auxiliary air outlet components.
  • FIG. 11 is a schematic structural diagram of a fifth embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • the heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13, and a baffle 14.
  • the cabinet body 11 includes a top wall 111, a bottom wall 112, and side walls connected between the top wall 111 and the bottom wall 112. 113.
  • the cabinet door 12 is installed on the cabinet body 11 at a position of the side wall 113, and can be opened and closed relative to the cabinet body 11.
  • the air outlet channel 13 is arranged in the cabinet 11 and close to the top wall 111.
  • the cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16.
  • the air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and is located at the outlet At one end of the wind channel 13, an electronic device placement area 114 is provided in the cabinet 11, and the electronic device placement area 114 is located on the side of the air outlet channel 13 close to the bottom wall 112.
  • the baffle 14 is provided between the electronic device placement area 114 and the cabinet door 12 Meanwhile, the baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141.
  • the air intake assembly 15 includes a first cover 151, a filter 152, and an intake fan 153.
  • the first cover 151 includes a receiving space 1511 and two opposite ends of the first cover 151 and communicating with the receiving space 1511.
  • the air inlet fan 153 is disposed on the side of the fifth opening 1513, and the filter 152 is located in the receiving space 1511 and on the side of the air inlet fan 153 facing the fifth opening 1513.
  • the intake fan 153 draws air outside the cabinet 11 into the cabinet 11.
  • the air inlet assembly 15 does not occupy too much space in the cabinet 11, and the capacity of the cabinet 11 is ensured.
  • a part of the air inlet assembly 15 protrudes outside the cabinet door 12 to ensure a clean appearance of the heat dissipation cabinet 10. It also facilitates the transportation of the heat dissipation cabinet 10, and prevents the air intake assembly 15 from being bumped and damaged during transportation and use.
  • the air outlet assembly 16 includes a second cover body 161 and a second waterproof member 162.
  • the second cover body 161 includes a sixth opening 1611 and a seventh opening 1612 which are located at two ends of the second cover body 161 and communicate with the inside of the second cover body 161.
  • the second cover 161 is partly located on the inner side 121 of the cabinet door 12, partly located on the outer side 122 of the cabinet door 12, the sixth opening 1611 is located on the outer side 122 of the cabinet door 12, and the seventh opening 1612 is located on the inner side 121 of the cabinet door 12, so that air can be discharged.
  • the component 16 does not occupy too much space in the cabinet 11, which ensures the capacity of the cabinet 11.
  • part of the air outlet component 16 protrudes from the outside 122 of the cabinet door 12 to ensure the clean appearance of the heat dissipation cabinet 10 and facilitate heat dissipation.
  • the cabinet 10 is transported to prevent the air outlet assembly 16 from being bumped and damaged during transport and use.
  • the air outlet assembly 16 and the air inlet assembly 15 can also be arranged on the inner side 121 of the cabinet door 12 or on the outer side 122 of the cabinet door 12.
  • the heat dissipation cabinet 10 includes auxiliary air outlet components.
  • An exhaust fan may also be provided in the air duct 132.
  • FIG. 12 is a schematic structural diagram of a fifth embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • the heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13, and a baffle 14.
  • the cabinet body 11 includes a top wall 111, a bottom wall 112, and side walls connected between the top wall 111 and the bottom wall 112. 113.
  • the cabinet door 12 is installed on the cabinet body 11 at a position of the side wall 113, and can be opened and closed relative to the cabinet body 11.
  • the air outlet channel 13 is arranged in the cabinet 11 and close to the top wall 111.
  • the cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16.
  • the air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and is located at the outlet At one end of the wind channel 13, an electronic device placement area 114 is provided in the cabinet 11, and the electronic device placement area 114 is located on the side of the air outlet channel 13 close to the bottom wall 112.
  • the baffle 14 is provided between the electronic device placement area 114 and the cabinet door 12 Meanwhile, the baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141.
  • the air intake assembly 15 includes a first cover 151, a filter 152, and an intake fan 153.
  • the first cover 151 includes a receiving space 1511 and two opposite ends of the first cover 151 and communicating with the receiving space 1511.
  • the air inlet fan 153 is disposed on the side of the fifth opening 1513
  • the filter 152 is located in the receiving space 1511 and on the side of the air inlet fan 153 facing the fifth opening 1513.
  • the intake fan 153 draws air outside the cabinet 11 into the cabinet 11.
  • the first cover 151 is located on the outer side 122 of the cabinet door 12, and the fifth opening 1513 is connected to the air inlet of the cabinet door 12. That is, the air inlet assembly 15 does not occupy the space in the cabinet 11, thereby ensuring The space in the cabinet 11 is large enough to meet the large-capacity needs of customers.
  • the air outlet assembly 16 includes a second cover body 161 and a second waterproof member 162.
  • the second cover body 161 includes a sixth opening 1611 and a seventh opening 1612 which are located at two ends of the second cover body 161 and communicate with the inside of the second cover body 161.
  • the second cover 161 is located on the outer side 122 of the cabinet door 12, and the seventh opening 1612 is connected to the air outlet of the cabinet door 12. That is to say, the air outlet assembly 16 does not occupy the space in the cabinet 11, thereby ensuring the cabinet 11
  • the space inside is large enough to meet the large-capacity needs of customers.
  • the air outlet assembly 16 and the air inlet assembly 15 can also be arranged on the inner side 121 of the cabinet door 12, or part of the air outlet assembly 16 and the air inlet assembly 15 are arranged on the outer side 122 of the cabinet door 12, and some are arranged on the outer side 122 of the cabinet door 12.
  • the heat dissipation cabinet 10 includes auxiliary air outlet components.
  • An exhaust fan may also be provided in the air duct 132.
  • FIG. 13 is a schematic structural diagram of a sixth embodiment of a heat dissipation cabinet provided by an embodiment of the present application.
  • the heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13, and a baffle 14.
  • the cabinet body 11 includes a top wall 111, a bottom wall 112, and side walls connected between the top wall 111 and the bottom wall 112. 113.
  • the cabinet door 12 is installed on the cabinet body 11 at a position of the side wall 113, and can be opened and closed relative to the cabinet body 11.
  • the air outlet channel 13 is arranged in the cabinet 11 and close to the top wall 111.
  • the cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16.
  • the air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and is located at the outlet At one end of the wind channel 13, an electronic device placement area 114 is provided in the cabinet 11, and the electronic device placement area 114 is located on the side of the air outlet channel 13 close to the bottom wall 112.
  • the baffle 14 is provided between the electronic device placement area 114 and the cabinet door 12 Meanwhile, the baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141.
  • the cabinet door 12 is connected with a first cover plate 191 and a second cover plate 192, the first cover plate 191 and the second cover plate 192 are slidably connected to the cabinet door 12, and the first cover plate 191 is used to open or The air outlet assembly 16 is closed.
  • the second cover 192 is used to open or close the air inlet assembly 15, that is to say, the unused air inlet assembly 15 or the air outlet assembly 16 can be closed to ensure the airtightness in the cabinet 11 ,
  • the air flow in the cabinet 11 is effectively controlled, the heat dissipation effect of the heat dissipation cabinet 10 is improved, and the energy consumption of the heat dissipation cabinet 10 during use is reduced, and the use cost is saved.
  • the number of the first cover plate 191 and the number of the air outlet assembly 16 are both one, and the number of the second cover plate 192 and the number of the air inlet assembly 15 are both two.
  • the connection between the first cover 191 and the second cover 192 and the cabinet door 12 may also be a rotation connection or other connection methods.
  • the number of air outlet components 16 and air inlet components 15 can also be set according to actual needs.
  • the number of the first cover plate 191 may be less than the number of the air outlet assembly 16, and the number of the second cover plate 192 may be less than the number of the air inlet assembly 15, that is, not all the air outlet assembly 16 and the air inlet assembly 15 are provided with Cover plate.
  • the cabinet door 12 is provided with a driver (not shown), which is connected with the controller, the first cover 191 and the second cover 192 to drive the first cover 191 and the second cover 192 to open respectively Or close the air outlet assembly 16 and the air inlet assembly 15, so that the first cover 191 and the second cover 192 can be automatically controlled by the controller, which improves the user experience.
  • the first cover plate and the second cover plate can also be provided on the air outlet assembly 16 or the air inlet assembly 15 respectively, and can be located at any position of the air outlet assembly 16 or the air inlet assembly 15.
  • the air outlet assembly 16 and the air inlet assembly 15 can also be arranged on the outer side 122 of the cabinet door 12, or part of the air outlet assembly 16 and the air inlet assembly 15 are arranged on the outer side 122 of the cabinet door 12, and some are arranged on the inner side 121 of the cabinet door 12.
  • the heat dissipation cabinet 10 also includes an auxiliary air outlet component and/or an exhaust fan. The exhaust fan is arranged in the air outlet channel, and the auxiliary air outlet component can be opened and closed through a cover plate.
  • Embodiments 1 to 6 The scope of protection in this application is not limited to the above-mentioned Embodiments 1 to 6, and any combination of Embodiments 1 to 6 is also within the scope of protection of this application, that is, the multiple embodiments described above can also be based on actual conditions. Any combination is required.
  • a baffle 14 is provided between the electronic device placement area 114 and the cabinet door 12, so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141, so that The electronic device 20 disposed in the electronic device placement area 114 dissipates heat.
  • an air outlet channel 13 is provided at the position of the cabinet 11 close to the top wall 111, so that the air passing through the electronic device 20 is guided from the air outlet channel 13 to the air outlet assembly 16, and then passes through the electronic device 20 through the air outlet assembly 16.
  • the air (hot air) is discharged out of the cabinet 11.
  • the air outlet channel 13 in the present application can quickly and effectively collect and discharge the heated air passing through the electronic device 20 to the outside of the cabinet 11, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet 10 and ensuring that it is installed in the heat dissipation cabinet 10.
  • the external air cold air
  • the baffle 14 prevent the external air from spreading in any direction in the cabinet 11 and finally enter the electronic device placement area 114. In this process, the temperature of the external air will be reduced.
  • the problem of poor heat dissipation of the electronic device 20 in the electronic device placement area 114 when the air finally reaches the electronic device placement area 20 By directly introducing external air into the electronic device placement area 114, it can effectively prevent the air from entering the electronic device placement area 114.
  • the temperature of the electronic device placement area 114 is raised during the process.
  • the air outlet channel 13 can be set to quickly exhaust the air (hot air) passing through the electronic device placement area 114 out of the cabinet 11, effectively preventing the hot air from flowing back to the electronic device placement area 114, improving
  • the heat dissipation effect of the air on the electronic device 20 in the electronic device placement area 114 is improved, and the effective operation of the electronic device 20 is ensured.
  • the baffle 14 can also prevent the air (hot air) passing through the electronic device placement area 114 from mixing with the air (cold air) entering from the air inlet assembly 15, which greatly improves the heat dissipation effect of the heat dissipation cabinet 10.
  • the temperature control devices such as the air inlet component 15 and the air outlet component 16 of the present application are all arranged on the cabinet door 12, which is convenient for maintenance.
  • the cabinet door 12 of different forms can also be replaced to realize the heat dissipation cabinet 10 in the direct ventilation system and the heating system.
  • the switching system and the air-conditioning system switch smoothly to meet the needs of users in different scenarios, reduce maintenance costs, reduce user costs, and improve user experience.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请实施例提供一种散热机柜和通信设备。所述散热机柜包括柜体、柜门和挡板,所述柜体包括相对设置的顶壁、底壁及连接在所述顶壁和所述底壁之间的侧壁,所述柜门安装于所述柜体且位于所述侧壁的位置处,所述柜体内靠近所述顶壁位置处设有出风通道,所述柜门设有进风组件和出风组件,所述出风组件位于所述进风组件和所述顶壁之间,并位于所述出风通道的一端,所述柜体内设电子装置放置区,所述挡板设于所述电子装置放置区和所述柜门之间,所述挡板包括第一开口,以使通过所述进风组件进入的空气通过所述第一开口直接进入所述电子装置放置区。本申请实施例提供的散热机柜提高了所述散热机柜的散热效果,保障了散热机柜内的电子装置的散热效果。

Description

一种散热机柜及通信设备 技术领域
本申请涉及通信设备技术领域,尤其涉及一种散热机柜及通信设备。
背景技术
通信类设备越来越普遍的安装于户外环境中。在自然环境中,散热机柜用于为无线通信站点或有线网络站点的相关设备提供户外物理工作环境和安全保障。散热机柜内可安装基站装置、电源装置、传输装置等通信用装置,并保证安装在散热机柜中的电子装置的散热效果,为电子装置正常运行提供支持。现有的散热机柜的散热效果有限,导致散热机柜内的电子装置散热不良。
发明内容
本申请实施例提供一种散热机柜,以提高所述散热机柜的散热效果,保障散热机柜内的电子装置的散热效果。
本申请实施例还提供一种通信设备。
第一方面,本申请实施例提供一种散热机柜,所述散热机柜包括柜体、柜门和挡板,所述柜体包括相对设置的顶壁、底壁及连接在所述顶壁和所述底壁之间的侧壁,所述柜门安装于所述柜体且位于所述侧壁的位置处,所述柜体内靠近所述顶壁位置处设有出风通道,所述柜门设有进风组件和出风组件,所述出风组件位于所述进风组件和所述顶壁之间,并位于所述出风通道的一端,所述柜体内设电子装置放置区,所述挡板设于所述电子装置放置区和所述柜门之间,所述挡板包括第一开口,以使通过所述进风组件进入的空气通过所述第一开口直接进入所述电子装置放置区。
本申请实施例所述的散热机柜通过在所述电子装置放置区和所述柜门之间设置挡板,以使通过所述进风组件进入的空气通过所述第一开口直接进入所述电子装置放置区,以为设于所述电子装置放置区的电子装置散热。同时,在所述柜体靠近所述顶壁的位置处设置出风通道,从而将经过电子装置的空气从所述出风通道引至所述出风组件,进而通过所述出风组件将经过电子装置的空气(热气)排出所述柜体外部。也就是说,本申请中的出风通道能快速有效的将经过所述电子装置的受热后的空气收集并排出所述柜体外部,从而有效提高所述散热机柜的散热效果,保证设于所述散热机柜中的电子装置的电性能。换言之,本申请通过挡板将外部空气(冷气)直接引入所述电子装置放置区,避免外部空气在所述柜体内向任意方向扩散最后进入所述电子装置放置区,在这个过程中外部空气的温度会逐渐上升,最后到达所述电子装置放置区时空气对所述电子装置放置区内的电子装置的散热效果不佳的问题,通过直接将外部空气引入所述电子装置放置区,能有效避免空气在没进入所述电子装置放置区的过程中升温,同时通过设置所述出风通道,能快速将经过所述电子装置放置区的空气(热气)排出所述柜体外,有效防止热气回流到所述电子装置放置区,提高了空气对所述电子装置放置区中的电子装置的散热效果,保证了电子装置有效运行。所述挡板还能避免经过所述电子装置放置区的空气(热气)回流与从所述进风组件进入的空气(冷气)混合,大大提高了所述散热机柜的散热效果。本申请中的进风组件和出风组件均设于所述柜门上,便于维护,简化所述侧壁结构,降低生产成本和维护成本。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述出风通道包括本体和贯穿 所述本体的风道,所述本体的相对两端包括与所述风道连通的第二开口和第三开口,所述第二开口与所述出风组件连通,所述第三开口位于所述电子装置放置区的上方。所述电子装置设置区的上方即为所述电子装置设置区朝向所述顶壁的方向,所述第三开口位于所述顶壁和所述电子装置放置区之间,以便于将经过所述电子装置放置区的空气快速收集并通过所述风道排出所述柜体外部,防止热气回流到所述电子装置放置区,同时,进入所述风道内的空气与所述风道外的空气形成隔离,有效提高所述散热机柜的散热效果。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述第二开口和所述第三开口在朝向所述柜门的方向上相对设置,经过所述电子装置放置区的空气通过所述第三开口快速收集并通过所述风道排出所述柜体外部,防止热气回流到所述电子装置放置区,有效提高所述散热机柜的散热效果。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述第三开口朝向所述电子装置放置区设置,也就是说,所述第三开口朝向经过所述电子装置放置区的空气设置,从而能有效将经过所述电子装置放置区的空气快速收集并排出所述柜体外部,防止热气回流到所述电子装置放置区,有效提高所述散热机柜的散热效果。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述出风通道内设有至少一个抽风扇,用于将经过所述电子装置放置区的空气抽出。通过在所述出风通道设置抽风扇,能更加有效的将经过所述电子装置放置区的空气快速收集并排出所述柜体外部,提高所述电子装置放置区中的电子装置的散热效果。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述挡板包括第一挡板和第二挡板,所述第一开口位于所述第一挡板和所述第二挡板之间,所述第一挡板邻近所述本体设置,所述第二挡板位于所述第一挡板区和所述底壁之间。也就是说,本申请通过将所述第一挡板和所述第二挡板间隔设置以形成露出所述电子装置放置区的所述第一开口,从而将外部空气直接通过所述第一开口引入所述电子装置放置区,能有效避免空气在没进入所述电子装置放置区的过程中升温,提高了所述电子装置放置区中的电子装置的散热效果。所述第一挡板和所述第二挡板还能避免经过所述电子装置放置区的空气回流与从所述进风组件进入的空气混合而加热从进风组件进入的空气,大大提高了所述散热机柜的散热效果。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述第一开口在所述底壁至所述顶壁的方向的宽度小于或等于所述电子装置放置区在所述底壁至所述顶壁的宽度,从而能有效避免所述第一开口太大而导致的空气不会直接进入所述电子装置放置区,和经过所述电子装置放置区的空气回流与从所述进风组件进入的空气混合而加热从进风组件进入的空气,有效提高了所述散热机柜的散热效果。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述第一挡板和所述第二挡板与所述侧壁之间形成缝隙,以使通过所述进风组件进入的空气通过所述缝隙进入所述电子装置放置区。对于电子装置的内部风道的方向与连接所述柜门的两个所述侧壁之间的方向平行的电子装置来说,进入进风组件的空气通过所述第一挡板和所述第二挡板绕过所述缝隙进入到所述柜体的所述侧壁位置,然后进入电子装置的内部风道,以便于快速对所述电子装置散热,也就是说,本申请中的空气是顺着所述电子装置的内部风道进入所述电子装置内进行散热,能快速有效对所述电子装置散热,提高所述电子装置的散热效果,同时,所述第一挡板和所述第二挡板还能避免经过所述电子装置放置区的空气回流与从所述进风组件进入的空气混合而加热从进风组件进入的空气,大大提高了所述散热机柜的散热效果。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述进风组件包括第一罩体和进风扇,所述第一罩体包括容纳空间及位于所述第一罩体相对两端并与所述容纳空间连通的第四开口和第五开口,所述进风扇设于所述第五开口侧,所述进风扇将所述柜体外部的空气抽入所述柜体内。也就是说,空气通过进风组件抽入所述柜体内,即所述柜体内为正压系统,进入所述柜体内的空气在经过所述电子装置放置区后升温,朝向所述顶壁的方向流动,然后通过位于靠近所述顶壁的出风组件排出所述柜体外部。若将风扇设于出风组件,即风扇用于将所述柜体内的空气抽出,从而在所述柜体内形成负压系统,在负压的作用下外部空气会通过进风组件被吸入所述柜体内。对于负压系统来说,空气不仅能通过所述进风组件进入所述柜体内,还可能通过柜体的其他螺丝孔进入柜体内部,从而将柜体外部的尘土和水通过螺丝孔、走线孔等孔洞吸入到所述柜体内,影响所述柜体内的装置的性能。本申请的正压系统能有效避免空气从所述进风组件以外的其他孔进入所述柜体内,能有效防止柜体外部的尘土和水通过螺丝孔、走线孔等孔洞吸入到所述柜体内,保证所述柜体内的装置的性能。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述第一罩体一部分位于所述柜门的内侧,一部分位于所述柜门的外侧,所述第四开口位于所述柜门的外侧,所述第五开口位于所述柜门的内侧,从而所述进风组件不会占用太多所述柜体内的空间,保证了所述柜体的容量,同时,所述进风组件部分外凸所述柜门的外侧,保证了所述散热机柜的外观整洁,还便于所述散热机柜的运输,避免所述进风组件在运输及使用过程中磕碰而损坏。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述第一罩体位于所述柜门的内侧,所述第四开口与所述柜门的进风口连通,也就是说,所述进风组件不凸出所述柜门的外侧,从而保证所述散热机柜的外观整洁,避免了所述进风组件在运输及使用过程中磕碰而损坏。或所述第一罩体位于所述柜门的外侧,所述第五开口与所述柜门的进风口连通,也就是说,所述进风组件并不占用所述柜体内的空间,从而能保证所述柜体内的空间足够大,满足客户大容量需求。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述进风组件还包括过滤件,所述过滤件位于所述容纳空间内,并位于所述进风扇朝向所述第五开口一侧。所述过滤件用于过滤外部空气中的杂质,避免杂质进入所述柜体内影响所述柜体内的电子装置的电性能,提高电子装置的使用寿命。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述过滤件包括防尘件和第一防水件,所述防尘件相对所述第一防水件靠近所述进风扇设置,或者所述第一防水件相对所述防尘件靠近所述进风扇设置。从而有效避免灰尘和水进入所述柜体内,避免灰尘和水影响所述柜体内的电子装置的电性能,提高电子装置的使用寿命。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述出风组件包括第二防水件,所述第二防水件用于防止水进入所述柜体内,避免水影响所述柜体内的电子装置的电性能,提高电子装置的使用寿命。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述出风组件和所述进风组件的数量均为多个,以实现不同散热需求。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述散热机柜包括温度传感器和控制器,所述温度传感器设于所述电子装置放置区,所述控制器与温度传感器和进风扇电连接,以根据所述电子装置的温度控制所述进风扇的转速。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述柜门连接有第一盖板和第 二盖板,所述第一盖板用于打开或关闭所述出风组件,所述第二盖板用于打开或关闭所述进风组件,也就是说,可以将不使用的进风组件或出风组件关闭,以保证所述柜体内的密闭性,有效控制所述柜体内的空气流量,提高所述散热机柜的散热效果同时降低所述散热机柜在使用过程中的能耗,节省使用成本。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述柜门设有驱动件,所述驱动件与控制器、所述第一盖板和第二盖板连接,以驱动所述第一盖板和所述第二盖板分别打开或关闭所述出风组件和所述进风组件,从而所述第一盖板和所述第二盖板可通过所述控制器自动控制,提高用户体验。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述散热机柜还包括承载架,所述承载架设于所述柜体内,所述承载架用于设置相关电子装置的区域为所述电子装置放置区,所述本体固定于所述承载架靠近所述顶壁的部分。也就是说,所述承载架既能协助安装电子装置,还用于固定所述本体,从而避免引入新的结构固定所述本体,简化所述散热机柜的结构,降低所述散热机柜的生产成本。
根据第一方面,在所述散热机柜一种可能的实现方式中,所述散热机柜还包括辅助出风组件,所述辅助出风组件设于所述柜门的中部。也就是说,经过位于底壁的电子装置的空气能通过所述辅助出风组件排出所述柜体外部,从而避免热气在不同的电子装置之间逐级传递,从而影响其他电子装置的散热效果,有效提高多个电子装置的整体散热效果。
第二方面,本申请实施例提供一种通信设备,所述通信设备包括电子装置和上述第一方面任一可能的实施方式所述的散热机柜,所述电子装置设于所述散热机柜的所述电子装置放置区。所述通信设备具有很好的散热效果及优良的电性能。
本申请实施例所述的散热机柜通过在所述电子装置放置区和所述柜门之间设置挡板,以使通过所述进风组件进入的空气通过所述第一开口直接进入所述电子装置放置区,以为设于所述电子装置放置区的电子装置散热。同时,在所述柜体靠近所述顶壁的位置处设置出风通道,从而将经过电子装置的空气从所述出风通道引至所述出风组件,进而通过所述出风组件将经过电子装置的空气(热气)排出所述柜体外部。也就是说,本申请中的出风通道能快速有效的将经过所述电子装置的受热后的空气收集并排出所述柜体外部,从而有效提高所述散热机柜的散热效果,保证设于所述散热机柜中的电子装置的电性能。换言之,本申请通过挡板将外部空气(冷气)直接引入所述电子装置放置区,避免外部空气在所述柜体内向任意方向扩散最后进入所述电子装置放置区,在这个过程中外部空气的温度会逐渐上升,最后到达所述电子装置放置区时空气对所述电子装置放置区内的电子装置的散热效果不佳的问题,通过直接将外部空气引入所述电子装置放置区,能有效避免空气在没进入所述电子装置放置区的过程中升温,同时通过设置所述出风通道,能快速将经过所述电子装置放置区的空气(热气)排出所述柜体外,有效防止热气回流到所述电子装置放置区,提高了空气对所述电子装置放置区中的电子装置的散热效果,保证了电子装置有效运行。
附图说明
图1是本申请实施例提供的一种通信设备的结构示意图。
图2是本申请实施例提供的散热机柜的第一实施例的结构示意图。
图3是图2提供的散热机柜的另一角度的结构示意图。
图4是散热机柜的负压系统的结构示意图。
图5是空气在柜体内的流向示意图。
图6是空气在柜体内的另一种流向示意图。
图7是本申请实施例提供的散热机柜的第二实施例的结构示意图。
图8是本申请实施例提供的散热机柜的第三实施例的结构示意图。
图9是本申请实施例提供的散热机柜的第四实施例的结构示意图。
图10是图9提供的散热机柜的另一种实施方式的结构示意图。
图11是本申请实施例提供的散热机柜的第五实施例的结构示意图。
图12是本申请实施例提供的散热机柜的第五实施例的结构示意图。
图13是本申请实施例提供的散热机柜的第六实施例的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图对本申请实施例进行描述。
请参阅图1,图1是本申请实施例提供的一种通信设备的结构示意图。通信设备100包括散热机柜10和电子装置20,电子装置20设于散热机柜10的电子装置放置区114。本实施例中,通信设备100为无线通信站、网络工作站等工作站,电子装置20可包括基站装置、电源装置、蓄电池、传输装置等中的一个或多个。电子装置20设于散热机柜10中,能保证电子装置20具有很好的散热效果及优良的电性能。
请参阅图2和图3,图2是本申请实施例提供的散热机柜的第一实施例的结构示意图。图3是图2提供的散热机柜的另一角度的结构示意图。散热机柜10包括柜体11、柜门12、出风通道13和挡板14,柜体11包括相对设置的顶壁111、底壁112及连接在顶壁111和底壁112之间的侧壁113,柜门12安装于柜体11且位于侧壁113的位置处,且可相对柜体11开合。出风通道13设于柜体11内并靠近顶壁111,柜门12设有进风组件15和出风组件16,出风组件16位于进风组件15和顶壁111之间,并位于出风通道13的一端,柜体11内设电子装置放置区114,电子装置放置区114位于出风通道13靠近底壁112的一侧,挡板14设于电子装置放置区114和柜门12之间,挡板14包括第一开口141,以使通过进风组件15进入的空气通过第一开口141直接进入电子装置放置区114。
本申请实施例的散热机柜10通过在电子装置放置区114和柜门12之间设置挡板14,以使通过进风组件15进入的空气通过第一开口141直接进入电子装置放置区114,以为设于电子装置放置区114的电子装置20散热(图2中箭头表示空气在柜体11内的大致流向)。同时,在柜体11靠近顶壁111的位置处设置出风通道13,从而将经过电子装置20的空气从出风通道13引至出风组件16,进而通过出风组件16将经过电子装置20的空气(热气)排出柜体11外部。也就是说,本申请中的出风通道13能快速有效的将经过电子装置20的受热后的空气收集并排出柜体11外部,从而有效提高散热机柜10的散热效果,保证设于散热机柜10中的电子装置20的电性能。换言之,本申请通过挡板14将外部空气(冷气)直接引入电子装置放置区114,避免外部空气在柜体11内向任意方向扩散最后进入电子装置放置区114,在这个过程中外部空气的温度会逐渐上升,最后到达电子装置放置区20时空气对电子装置放置区114内的电子装置20的散热效果不佳的问题,通过直接将外部空气引入电子装置放置区114,能有效避免空气在没进入电子装置放置区114的过程中升温,同时通过设置出风通道13,能快速将经过电子装置放置区114的空气(热气)排出柜体11外,有效防止热气回流到电子装置放置区114,提高了空气对电子装置放置区114中的电子装置20的散热效果,保证 了电子装置20有效运行。挡板14还能避免经过电子装置放置区114的空气(热气)回流与从进风组件15进入的空气(冷气)混合,大大提高了散热机柜10的散热效果。本申请中的进风组件15和出风组件16均设于柜门12上,便于维护,简化侧壁113结构,降低生产成本和维护成本。
如图2和图3所示,柜体11的形状为方形柱体,具体的,侧壁113为三个,三个侧壁113依次连接并与顶壁111和底壁112围设形成收容空间,以容纳电子装置20,柜门12设于位于收容空间开口处的侧壁113上,并相对柜体11开合以打开或关闭收容空间。柜体11内设有承载架(图未示),承载架例如为多个方孔条组成。承载架用于设置电子装置20的区域为电子装置放置区114,承载架用于安装电子装置20,以使电子装置20稳固的设于柜体11内。当然,在其他实施例中,承载架不限于上述描述,只要能固定或承载电子装置20即可。
柜门12为板状,通过活页等转动结构设于侧壁113上,并可相对收容空间的开口开合。柜门12包括内侧121和外侧122,内侧121朝向收容空间,外侧122背向收容空间。柜门12上设有贯穿内侧121和外侧122的进风口和出风口,进风口与进风组件15连通,出风口与出风组件16连通,以便于柜体11外部的空气通过进风组件15进入柜体11内,柜体11内的空气通过出风组件16排出柜体11外部,保证了散热机柜10的散热性能。
本实施例中,进风组件15为两个,两个进风组件15间隔设于柜门12上。进风组件15包括第一罩体151、过滤件152和进风扇153,第一罩体151包括容纳空间1511及位于第一罩体151相对两端并与容纳空间1511连通的第四开口1512和第五开口1513,进风扇153设于第五开口1513侧,过滤件152位于容纳空间1511内,并位于进风扇153朝向第五开口1513一侧。进风扇153将柜体11外部的空气抽入柜体11内。具体的,第一罩体151位于柜门12的内侧121,第四开口1512与柜门12的进风口连通,也就是说,进风组件15不凸出柜门12的外侧122,从而保证散热机柜10的外观整洁,避免了进风组件15在运输及使用过程中磕碰而损坏。过滤件152用于过滤外部空气中的杂质,避免杂质进入柜体11内影响柜体11内的电子装置20的电性能,提高电子装置20的使用寿命。当然,在其他实施例中,进风组件15的数量可根据实际需要设置,以实现不同散热需求。进风组件15可根据需要去除风扇切换成出风组件。进风组件15还可以设于柜门12的外侧122,或者进风组件15一部分位于柜门12的内侧121,一部分位于柜门12的外侧122。
本实施例中的空气通过进风组件15抽入柜体11内,即柜体11内为正压系统,进入柜体11内的空气在经过电子装置放置区114后升温,朝向顶壁111的方向流动,然后通过位于靠近顶壁111的出风组件16排出柜体11外部。若将风扇16a设于出风通道13(如图4)或出风组件16,即风扇16a用于将柜体11内的空气抽出,从而在柜体11内形成负压系统,在负压的作用下外部空气会通过进风组件15被吸入柜体11内。对于负压系统来说,空气不仅能通过进风组件15进入柜体11内,还可能通过柜体11的其他螺丝孔进入柜体11内部,从而将柜体11外部的尘土和水通过螺丝孔、走线孔等孔洞吸入到柜体11内,影响柜体11内的装置的性能。本申请的正压系统能有效避免空气从进风组件15以外的其他孔进入柜体11内,能有效防止柜体11外部的尘土和水通过螺丝孔、走线孔等孔洞吸入到柜体11内,保证柜体11内的装置的性能。当然,在其他实施例中,还可以去除进风扇,在出风组件16上设置出风扇,从而将正压系统的散热机柜10切换成负压系统的散热机柜。
如图2所示,过滤件152包括防尘件1521和第一防水件1522。本实施例中,防尘件1521例如为防尘网等防尘结构,第一防水件1522例如为挡水板等防水结构。防尘件1521相对第 一防水件1522靠近进风扇153设置,也就是说,第一防水件1522靠近第四开口1512设置,即靠近外部空气设置,从而有效避免水和灰尘进入柜体11内,避免水和灰尘影响柜体11内的电子装置20的电性能,提高电子装置20的使用寿命。当然,在其他实施例中,第一防水件1522相对防尘件1521靠近进风扇153设置。
挡板14包括第一挡板142和第二挡板143,第一挡板142和第二挡板143均为板体形状,第一开口141位于第一挡板142和第二挡板143之间,即第一挡板142和第二挡板143间隔设置以形成露出电子装置放置区114的第一开口141,第一挡板142邻近出风通道13设置,第二挡板143位于第一挡板142区和底壁112之间。具体的,第一挡板142靠近出风通道13的一侧与出风通道13连接,以与出风通道13配合防止从进风组件15进入的空气不通过电子装置放置区114直接从出风组件16排出。第一挡板142和第二挡板143均固定于承载架上,并可拆卸连接于承载架上。第一挡板142和第二挡板143还可以由多个子挡板(图未示)组成,可根据电子装置20的体积决定第一开口141的大小,通过改变第一挡板142和第二挡板143的子挡板数量来改变第一开口141的大小,使得第一开口141的大小可根据实际需要设置。当然,在其他实施例中,第一挡板142和第二挡板143还可以设于柜体11内的其他结构上。
请参阅图2和图5,图5是空气在柜体内的流向示意图。散热机柜10的部分结构未在图5中示出,请结合参阅图2。图5中的电子装置20的内部风道方向为从柜门12到与柜门12相对设置的侧壁113的方向,可以理解的是,以柜门12为正面来说,与柜门12相对设置的侧壁113为后面,电子装置20的内部风道方向即为正面到后面的方向,在对该电子装置20散热时,外部空气通过进风组件15进入后通过第一开口141进入电子装置20的内部风道(图5中实线箭头部分),以对电子装置20散热,经过电子装置20的空气排出电子装置20后,一部分会通过电子装置20上下两侧,即通过朝向顶壁111的一侧和朝向底壁112的一侧回流(图5中虚线箭头部分),由于第一挡板142和第二挡板143的设置,回流的空气无法与从进风组件15进入的空气混合。可以理解的是,通过第一挡板142和第二挡板143形成第一开口141,从而将外部空气直接通过第一开口141引入电子装置放置区114,能有效避免空气在没进入电子装置放置区114的过程中升温,提高了电子装置放置区114中的电子装置20的散热效果。同时,第一挡板142和第二挡板143还能避免经过电子装置放置区114的空气回流与从进风组件15进入的空气混合而加热从进风组件15进入的空气,大大提高了散热机柜10的散热效果。
本实施例中,第一开口141在底壁112至顶壁111的方向的宽度小于或等于电子装置放置区114在底壁112至顶壁111的宽度,从而能有效避免第一开口141太大而导致的空气不会直接进入电子装置放置区114,和经过电子装置放置区114的空气回流与从进风组件15进入的空气混合而加热从进风组件15进入的空气,有效提高了散热机柜10的散热效果。当然,其他实施例中,在散热需求不大的情况下,第一开口141在底壁112至顶壁111的方向的宽度还可以大于电子装置放置区114在底壁112至顶壁111的宽度。
请参阅图2和图6,图6是空气在柜体内的另一种流向示意图。散热机柜10的部分结构未在图6中示出,请结合参阅图2。第一挡板142和第二挡板143与侧壁113之间形成缝隙a。具体的,挡板15与其相邻的两个侧壁13之间均形成有缝隙a,以使通过进风组件15进入的空气通过缝隙a进入电子装置放置区114。对于电子装置20的内部风道的方向与连接柜门12的两个侧壁113之间的方向平行的电子装置20来说,可以理解的是,以柜门12为正面来说, 连接柜门12的两个侧壁113分别为左侧壁和侧壁,电子装置20的内部风道方向为从左侧壁到右侧壁的方向,或者电子装置20的内部风道方向为从右侧壁到左侧壁的方向,当对该电子装置20进行散热时,通过进风组件15进入的空气主要通过第一挡板142和第二挡板143绕过缝隙a进入到柜体11的侧壁113位置,然后进入电子装置20的内部风道,以便于快速对电子装置20散热(图6中实线箭头部分),经过电子装置20的空气排出电子装置20后,一部分会通过电子装置20上下两侧,即通过朝向顶壁111的一侧和朝向底壁112的一侧回流(图6中虚线箭头部分),由于第一挡板142和第二挡板143的设置,回流的空气无法与从进风组件15进入的空气混合。也就是说,本申请中的空气是顺着电子装置20的内部风道进入电子装置20内进行散热,能快速有效对电子装置20散热,提高电子装置20的散热效果,同时,第一挡板142和第二挡板143还能避免经过电子装置放置区114的空气回流与从进风组件15进入的空气混合而加热从进风组件15进入的空气,大大提高了散热机柜10的散热效果。对于内部风道方向为从左侧壁到右侧壁的方向,或从右侧壁到左侧壁的方向的电子装置20来说,由于电子装置20的内部风道方向不是从正面到后面,也就是说,电子装置20在第一开口141处没有进风的通道,因此从进风组件15进入的空气不会通过第一挡板142和第二挡板143之间的第一开口141进入到电子装置20内部,而是会通过缝隙a进入电子装置放置区114,进而进入电子装置20的内部风道对电子装置20进行散热。本申请中的第一挡板142和第二挡板143的设置方式对不同内部风道方向的电子装置20均具有很好的散热效果,应用范围广。第二挡板143与底壁112形成空隙,以便于通过进风组件15进入的空气进入底壁112,为设于底壁112上的相关发热件散热。当然,在其他实施例中,挡板15与其中一个侧壁13之间均形成缝隙。对于内部风道方向与连接柜门12的两个侧壁113之间的方向平行的电子装置20来说,第一挡板142和第二挡板143之间可以不设置第一开口。第二挡板143还可以与底壁112连接。
请参阅图2,出风通道13包括本体131和贯穿本体131的风道132,本体131固定于承载架靠近顶壁111的部分,第一挡板141与本体131连接。本体131的相对两端包括与风道132连通的第二开口1311和第三开口1312,具体的,第二开口1311和第三开口1312在朝向柜门12的方向上相对设置,第二开口1311与出风组件16连通,第三开口1312位于电子装置放置区114的上方。电子装置设置区113的上方即为电子装置设置区113朝向顶壁111的方向,第三开口1312位于顶壁111和电子装置放置区114之间,以便于将经过电子装置放置区114的空气快速收集并通过风道132排出柜体11外部,防止热气回流到电子装置放置区114,同时,进入风道132内的空气与风道132外的空气形成隔离,有效提高散热机柜10的散热效果。本体131设于承载架上,从而避免引入新的结构固定本体131,简化散热机柜10的结构,降低散热机柜10的生产成本。当然,在其他实施例中,第三开口1312还可以朝向电子装置放置区114。风道132中还可以设有抽风扇。
本实施例中,出风组件16为一个。出风组件16包括第二罩体161和第二防水件162,第二罩体161包括位于第二罩体161两端并连通第二罩体161内部的第六开口1611和第七开口1612,第二罩体161位于柜门12的内侧121,第七开口1612与出风通道13的第二开口1311连通,第六开口1611与柜门12的出风口连通。也就是说,出风组件16不凸出柜门12的外侧122,从而保证散热机柜10的外观整洁,避免了出风组件16在运输及使用过程中磕碰而损坏。第二防水件162例如为挡水板等防水结构,第二防水件162用于防止水进入柜体11内,避免水影响柜体11内的电子装置20的电性能,提高电子装置20的使用寿命。当然, 在其他实施例中,出风组件16的数量可根据实际需要设置,以实现不同散热需求。出风组件16中也可设置防尘件,出风组件16还可以设于柜门12的外侧122,或者出风组件16一部分位于柜门12的内侧121,一部分位于柜门12的外侧122。
散热机柜10还包括温度传感器(图未示)和控制器(图未示),温度传感器设于电子装置放置区114,控制器设于收容空间,控制器与温度传感器和进风扇153电连接,以根据电子装置20的温度控制进风扇153的转速,以实现散热系统的自动化调控,提高用户体验。
请参阅图7,图7是本申请实施例提供的散热机柜的第二实施例的结构示意图。散热机柜10包括柜体11、柜门12、出风通道13和挡板14,柜体11包括相对设置的顶壁111、底壁112及连接在顶壁111和底壁112之间的侧壁113,柜门12安装于柜体11且位于侧壁113的位置处,且可相对柜体11开合。出风通道13设于柜体11内并靠近顶壁111,柜门12设有进风组件15和出风组件16,出风组件16位于进风组件15和顶壁111之间,并位于出风通道13的一端,柜体11内设电子装置放置区114,电子装置放置区114位于出风通道13靠近底壁112的一侧,挡板14设于电子装置放置区114和柜门12之间,挡板14包括第一开口141,以使通过进风组件15进入的空气通过第一开口141直接进入电子装置放置区114。本实施例中,散热机柜10还包括辅助出风组件17,辅助出风组件17设于柜门12的中部并位于两个进风组件15之间。辅助出风组件17为一个,辅助出风组件17的结构和出风组件16的结构相同。柜门12上设有与辅助出风组件17连通的出风口,以通过辅助出风组件17将柜体11内的空气排出。通过设置辅助出风组件17以使经过位于底壁112的电子装置的空气能通过辅助出风组件17排出柜体11外部,从而避免热气在不同的电子装置之间逐级传递,从而影响其他电子装置的散热效果,有效提高多个电子装置的整体散热效果。当然,在其他实施例中,辅助出风组件17的数量及位置还可根据实际需要设置,辅助出风组件17还可以通过设置风扇切换为辅助进风组件。
请参阅图8,图8是本申请实施例提供的散热机柜的第三实施例的结构示意图。散热机柜10包括柜体11、柜门12、出风通道13和挡板14,柜体11包括相对设置的顶壁111、底壁112及连接在顶壁111和底壁112之间的侧壁113,柜门12安装于柜体11且位于侧壁113的位置处,且可相对柜体11开合。出风通道13设于柜体11内并靠近顶壁111,柜门12设有进风组件15和出风组件16,出风组件16位于进风组件15和顶壁111之间,并位于出风通道13的一端,柜体11内设电子装置放置区114,电子装置放置区114位于出风通道13靠近底壁112的一侧,挡板14设于电子装置放置区114和柜门12之间,挡板14包括第一开口141,以使通过进风组件15进入的空气通过第一开口141直接进入电子装置放置区114。本实施例中,出风通道13包括本体131和贯穿本体131的风道132,本体131固定于承载架靠近顶壁111的部分。本体131的相对两端包括与风道132连通的第二开口1311和第三开口1312,第二开口1311与出风组件16连通,第三开口1312位于电子装置放置区114的上方。具体的,第三开口1312朝向电子装置放置区114设置,也就是说,第三开口1312朝向经过电子装置放置区114的空气设置,从而能有效将经过电子装置放置区114的空气快速收集并排出柜体11外部,防止热气回流到电子装置放置区114,有效提高散热机柜10的散热效果。当然,在其他实施例中,散热机柜10包括辅助出风组件。风道132中还可以设有抽风扇。
请参阅图9,图9是本申请实施例提供的散热机柜的第四实施例的结构示意图。散热机柜10包括柜体11、柜门12、出风通道13和挡板14,柜体11包括相对设置的顶壁111、底壁112及连接在顶壁111和底壁112之间的侧壁113,柜门12安装于柜体11且位于侧壁113 的位置处,且可相对柜体11开合。出风通道13设于柜体11内并靠近顶壁111,柜门12设有进风组件15和出风组件16,出风组件16位于进风组件15和顶壁111之间,并位于出风通道13的一端,柜体11内设电子装置放置区114,电子装置放置区114位于出风通道13靠近底壁112的一侧,挡板14设于电子装置放置区114和柜门12之间,挡板14包括第一开口141,以使通过进风组件15进入的空气通过第一开口141直接进入电子装置放置区114。本实施例中,出风通道13包括本体131和贯穿本体131的风道132,本体131固定于承载架靠近顶壁111的部分。本体131的相对两端包括与风道132连通的第二开口1311和第三开口1312,第二开口1311和第三开口1312在朝向柜门12的方向上相对设置,第二开口1311与出风组件16连通,第三开口1312位于电子装置放置区114的上方。出风通道13内设有一个抽风扇,具体的,抽风扇设于风道132中并靠近第三开口1312设置,用于将经过电子装置放置区114的空气抽出。通过在出风通道13设置抽风扇18,能更加有效的将经过电子装置放置区114的空气快速收集并排出柜体11外部,提高电子装置放置区114中的电子装置的散热效果。抽风扇18与控制器连接,以通过控制器控制抽风扇18的开关及转速。当然,在其他实施例中,抽风扇18的数量和位置还可根据实际需要设置,第三开口朝向电子装置放置区114设置(如图10)。散热机柜10包括辅助出风组件。
请参阅图11,图11是本申请实施例提供的散热机柜的第五实施例的结构示意图。散热机柜10包括柜体11、柜门12、出风通道13和挡板14,柜体11包括相对设置的顶壁111、底壁112及连接在顶壁111和底壁112之间的侧壁113,柜门12安装于柜体11且位于侧壁113的位置处,且可相对柜体11开合。出风通道13设于柜体11内并靠近顶壁111,柜门12设有进风组件15和出风组件16,出风组件16位于进风组件15和顶壁111之间,并位于出风通道13的一端,柜体11内设电子装置放置区114,电子装置放置区114位于出风通道13靠近底壁112的一侧,挡板14设于电子装置放置区114和柜门12之间,挡板14包括第一开口141,以使通过进风组件15进入的空气通过第一开口141直接进入电子装置放置区114。
本实施例中,进风组件15包括第一罩体151、过滤件152和进风扇153,第一罩体151包括容纳空间1511及位于第一罩体151相对两端并与容纳空间1511连通的第四开口1512和第五开口1513,进风扇153设于第五开口1513侧,过滤件152位于容纳空间1511内,并位于进风扇153朝向第五开口1513一侧。进风扇153将柜体11外部的空气抽入柜体11内。具体的,第一罩体151一部分位于柜门12的内侧121,一部分位于柜门12的外侧122,第四开口1512位于柜门12的外侧122,第五开口1513位于柜门12的内侧121,从而进风组件15不会占用太多柜体11内的空间,保证了柜体11的容量,同时,进风组件15部分外凸柜门12的外侧122,保证了散热机柜10的外观整洁,还便于散热机柜10的运输,避免进风组件15在运输及使用过程中磕碰而损坏。
出风组件16包括第二罩体161和第二防水件162,第二罩体161包括位于第二罩体161两端并连通第二罩体161内部的第六开口1611和第七开口1612,第二罩体161一部分位于柜门12的内侧121,一部分位于柜门12的外侧122,第六开口1611位于柜门12的外侧122,第七开口1612位于柜门12的内侧121,从而出风组件16不会占用太多柜体11内的空间,保证了柜体11的容量,同时,出风组件16部分外凸柜门12的外侧122,保证了散热机柜10的外观整洁,还便于散热机柜10的运输,避免出风组件16在运输及使用过程中磕碰而损坏。当然,在其他实施例中,出风组件16和进风组件15还可以设于柜门12的内侧121或设于柜门12的外侧122。散热机柜10包括辅助出风组件。风道132中还可以设有抽风扇。
请参阅图12,图12是本申请实施例提供的散热机柜的第五实施例的结构示意图。散热机柜10包括柜体11、柜门12、出风通道13和挡板14,柜体11包括相对设置的顶壁111、底壁112及连接在顶壁111和底壁112之间的侧壁113,柜门12安装于柜体11且位于侧壁113的位置处,且可相对柜体11开合。出风通道13设于柜体11内并靠近顶壁111,柜门12设有进风组件15和出风组件16,出风组件16位于进风组件15和顶壁111之间,并位于出风通道13的一端,柜体11内设电子装置放置区114,电子装置放置区114位于出风通道13靠近底壁112的一侧,挡板14设于电子装置放置区114和柜门12之间,挡板14包括第一开口141,以使通过进风组件15进入的空气通过第一开口141直接进入电子装置放置区114。
本实施例中,进风组件15包括第一罩体151、过滤件152和进风扇153,第一罩体151包括容纳空间1511及位于第一罩体151相对两端并与容纳空间1511连通的第四开口1512和第五开口1513,进风扇153设于第五开口1513侧,过滤件152位于容纳空间1511内,并位于进风扇153朝向第五开口1513一侧。进风扇153将柜体11外部的空气抽入柜体11内。具体的,第一罩体151位于柜门12的外侧122,第五开口1513与柜门12的进风口连通,也就是说,进风组件15并不占用柜体11内的空间,从而能保证柜体11内的空间足够大,满足客户大容量需求。
出风组件16包括第二罩体161和第二防水件162,第二罩体161包括位于第二罩体161两端并连通第二罩体161内部的第六开口1611和第七开口1612,第二罩体161位于柜门12的外侧122,第七开口1612与柜门12的出风口连通,也就是说,出风组件16并不占用柜体11内的空间,从而能保证柜体11内的空间足够大,满足客户大容量需求。当然,在其他实施例中,出风组件16和进风组件15还可以设于柜门12的内侧121,或者出风组件16和进风组件15一部分设于柜门12的外侧122,一部分设于柜门12的内侧121。散热机柜10包括辅助出风组件。风道132中还可以设有抽风扇。
请参阅图13,图13是本申请实施例提供的散热机柜的第六实施例的结构示意图。散热机柜10包括柜体11、柜门12、出风通道13和挡板14,柜体11包括相对设置的顶壁111、底壁112及连接在顶壁111和底壁112之间的侧壁113,柜门12安装于柜体11且位于侧壁113的位置处,且可相对柜体11开合。出风通道13设于柜体11内并靠近顶壁111,柜门12设有进风组件15和出风组件16,出风组件16位于进风组件15和顶壁111之间,并位于出风通道13的一端,柜体11内设电子装置放置区114,电子装置放置区114位于出风通道13靠近底壁112的一侧,挡板14设于电子装置放置区114和柜门12之间,挡板14包括第一开口141,以使通过进风组件15进入的空气通过第一开口141直接进入电子装置放置区114。
本实施例中,柜门12连接有第一盖板191和第二盖板192,第一盖板191和第二盖板192滑动连接于柜门12上,第一盖板191用于打开或关闭出风组件16,第二盖板192用于打开或关闭进风组件15,也就是说,可以将不使用的进风组件15或出风组件16关闭,以保证柜体11内的密闭性,有效控制柜体11内的空气流量,提高散热机柜10的散热效果同时降低散热机柜10在使用过程中的能耗,节省使用成本。本实施例中,第一盖板191的数量和出风组件16的数量均为一个,第二盖板192的数量与进风组件15的数量均为两个。当然,在其他实施例中,第一盖板191和第二盖板192与柜门12的连接方式还可以是转动连接等其他连接方式。出风组件16和进风组件15的数量还可以是根据实际需要设置。第一盖板191的数量可以小于出风组件16的数量,第二盖板192的数量可以小于进风组件15的数量,也就是并不是所有的出风组件16和进风组件15均设有盖板。
具体的,柜门12设有驱动件(图未示),驱动件与控制器、第一盖板191和第二盖板192连接,以驱动第一盖板191和第二盖板192分别打开或关闭出风组件16和进风组件15,从而第一盖板191和第二盖板192可通过控制器自动控制,提高用户体验。当然,其他实施例中,第一盖板和第二盖板还可设分别设于出风组件16或进风组件15上,并可以位于出风组件16或进风组件15的任意位置。出风组件16和进风组件15还可以设于柜门12的外侧122,或者出风组件16和进风组件15一部分设于柜门12的外侧122,一部分设于柜门12的内侧121。散热机柜10还包括辅助出风组件和/或抽风扇,抽风扇设于出风通道内,辅助出风组件可通过盖板控制其开合。
本申请中的保护范围不限于上述实施例一至实施例六,实施例一至实施例六中的任意组合也在本申请的保护范围内,也就是说,上述描述的多个实施例还可根据实际需要任意组合。
本申请实施例的散热机柜10通过在电子装置放置区114和柜门12之间设置挡板14,以使通过进风组件15进入的空气通过第一开口141直接进入电子装置放置区114,以为设于电子装置放置区114的电子装置20散热。同时,在柜体11靠近顶壁111的位置处设置出风通道13,从而将经过电子装置20的空气从出风通道13引至出风组件16,进而通过出风组件16将经过电子装置20的空气(热气)排出柜体11外部。也就是说,本申请中的出风通道13能快速有效的将经过电子装置20的受热后的空气收集并排出柜体11外部,从而有效提高散热机柜10的散热效果,保证设于散热机柜10中的电子装置20的电性能。换言之,本申请通过挡板14将外部空气(冷气)直接引入电子装置放置区114,避免外部空气在柜体11内向任意方向扩散最后进入电子装置放置区114,在这个过程中外部空气的温度会逐渐上升,最后到达电子装置放置区20时空气对电子装置放置区114内的电子装置20的散热效果不佳的问题,通过直接将外部空气引入电子装置放置区114,能有效避免空气在没进入电子装置放置区114的过程中升温,同时通过设置出风通道13,能快速将经过电子装置放置区114的空气(热气)排出柜体11外,有效防止热气回流到电子装置放置区114,提高了空气对电子装置放置区114中的电子装置20的散热效果,保证了电子装置20有效运行。挡板14还能避免经过电子装置放置区114的空气(热气)回流与从进风组件15进入的空气(冷气)混合,大大提高了散热机柜10的散热效果。本申请的进风组件15、出风组件16等温控装置全部设于柜门12上,维修方便,还可通过跟换不同形式的柜门12,进而实现散热机柜10在直通风系统、热交换系统和空调间系统平滑切换,以满足用户不同场景需求,降低维护成本,降低用户的使用成本,提高用户体验。
以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以所述权利要求的保护范围为准。

Claims (16)

  1. 一种散热机柜,其特征在于,包括柜体、柜门和挡板,所述柜体包括相对设置的顶壁、底壁及连接在所述顶壁和所述底壁之间的侧壁,所述柜门安装于所述柜体且位于所述侧壁的位置处,所述柜体内靠近所述顶壁位置处设有出风通道,所述柜门设有进风组件和出风组件,所述出风组件位于所述进风组件和所述顶壁之间,并位于所述出风通道的一端,所述柜体内设电子装置放置区,所述挡板设于所述电子装置放置区和所述柜门之间,所述挡板包括第一开口,以使通过所述进风组件进入的空气通过所述第一开口直接进入所述电子装置放置区。
  2. 根据权利要求1所述的散热机柜,其特征在于,所述出风通道包括本体和贯穿所述本体的风道,所述本体的相对两端包括与所述风道连通的第二开口和第三开口,所述第二开口与所述出风组件连通,所述第三开口位于所述电子装置放置区的上方。
  3. 根据权利要求2所述的散热机柜,其特征在于,所述第二开口和所述第三开口在朝向所述柜门的方向上相对设置。
  4. 根据权利要求2所述的散热机柜,其特征在于,所述第三开口朝向所述电子装置放置区设置。
  5. 根据权利要求3或4所述的散热机柜,其特征在于,所述出风通道内设有至少一个抽风扇,用于将经过所述电子装置放置区的空气抽出。
  6. 根据权利要求2-5任一项权利要求所述的散热机柜,其特征在于,所述挡板包括第一挡板和第二挡板,所述第一开口位于所述第一挡板和所述第二挡板之间,所述第一挡板邻近所述本体设置,所述第二挡板位于所述第一挡板区和所述底壁之间。
  7. 根据权利要求6所述的散热机柜,其特征在于,所述第一开口在所述底壁至所述顶壁的方向的宽度小于或等于所述电子装置放置区在所述底壁至所述顶壁的宽度。
  8. 根据权利要求7所述的散热机柜,其特征在于,所述第一挡板和所述第二挡板与所述侧壁之间形成缝隙,以使通过所述进风组件进入的空气通过所述缝隙进入所述电子装置放置区。
  9. 根据权利要求1-8任一项权利要求所述的散热机柜,其特征在于,所述进风组件包括第一罩体和进风扇,所述第一罩体包括容纳空间及位于所述第一罩体相对两端并与所述容纳空间连通的第四开口和第五开口,所述进风扇设于所述第五开口侧,所述进风扇将所述柜体外部的空气抽入所述柜体内。
  10. 根据权利要求9所述的散热机柜,其特征在于,所述第一罩体一部分位于所述柜门的内侧,一部分位于所述柜门的外侧,所述第四开口位于所述柜门的外侧,所述第五开口位于所述柜门的内侧。
  11. 根据权利要求9所述的散热机柜,其特征在于,所述第一罩体位于所述柜门的内侧,所述第四开口与所述柜门的进风口连通;或所述第一罩体位于所述柜门的外侧,所述第五开口与所述柜门的进风口连通。
  12. 根据权利要求10或11所述的散热机柜,其特征在于,所述进风组件还包括过滤件,所述过滤件位于所述容纳空间内,并位于所述进风扇朝向所述第五开口一侧。
  13. 根据权利要求12所述的散热机柜,其特征在于,所述过滤件包括防尘件和第一防水件,所述防尘件相对所述第一防水件靠近所述进风扇设置,或者所述第一防水件相对所述防尘件靠近所述进风扇设置。
  14. 根据权利要求2-5任一项权利要求所述的散热机柜,其特征在于,所述散热机柜还包 括承载架,所述承载架设于所述柜体内,所述承载架用于设置相关电子装置的区域为所述电子装置放置区,所述本体固定于所述承载架靠近所述顶壁的部分。
  15. 根据权利要求1所述的散热机柜,其特征在于,所述散热机柜还包括辅助出风组件,所述辅助出风组件设于所述柜门的中部。
  16. 一种通信设备,其特征在于,所述通信设备包括电子装置和权利要求1-15任一项权利要求所述的散热机柜,所述电子装置设于所述散热机柜的所述电子装置放置区。
PCT/CN2020/088796 2020-05-06 2020-05-06 一种散热机柜及通信设备 WO2021223106A1 (zh)

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