WO2021217407A1

WO2021217407A1 - Temperature measurement system and method

Info

Publication number: WO2021217407A1
Application number: PCT/CN2020/087448
Authority: WO
Inventors: 李琳; 刘浩东; 梅伟; 刘宗文; 黄为
Original assignee: 华为技术有限公司
Priority date: 2020-04-28
Filing date: 2020-04-28
Publication date: 2021-11-04
Also published as: CN114127526A

Abstract

A temperature measurement system (100), comprising at least one ultrasonic transmitter (UT), at least one ultrasonic receiver (UR), a temperature measurement device (102), and a processor (101). Any UT in the at least one UT is used for transmitting a first ultrasonic signal; a preset UR in the at least one UR is used for receiving a second ultrasonic signal, the second ultrasonic signal being formed by transmission of the first ultrasonic signal in a region to be measured, and the preset UR being provided in the region to be measured; the temperature measurement device (102) is used for measuring a reference temperature and providing the reference temperature to the processor (101); the processor (101) is used for determining, on the basis of the first ultrasonic signal, the second ultrasonic signal, and the reference temperature, the temperature of the region to be measured. Thus, the measured temperature is more accurate. Also disclosed is a temperature measurement method.

Description

Temperature measurement system and method

Technical field

The embodiments of the present application relate to the technical field of temperature measurement, and in particular, to a temperature measurement system and method.

Background technique

With the advancement of science and technology and the improvement of living standards, people have higher and higher requirements for environmental temperature measurement. In areas where temperature adjustment is required, such as automobiles, indoors, etc., methods such as temperature sensors are usually used to monitor the temperature in the space area to achieve the purpose of temperature adjustment in the space area.

Related temperature measurement methods can usually only accurately measure a certain space, such as a closed space, the air temperature in a local range (for example, the air temperature in a local area where a temperature sensor is set), which makes the temperature of other areas in the space and The detected temperature is quite different, which makes it impossible to accurately adjust the temperature in these areas. In summary, how to accurately measure the temperature of various spatial regions in a certain space has become a problem that needs to be solved.

Summary of the invention

The temperature measurement system and method provided in this application are beneficial to more accurately measure the temperature of the area in the space. In order to achieve the above objectives, this application adopts the following technical solutions:

In the first aspect, an embodiment of the present application provides a temperature measurement system. The temperature measurement system includes at least one ultrasonic transmitter, at least one ultrasonic receiver, a temperature measurement device, and a processor; wherein the at least one ultrasonic transmitter is Any ultrasonic transmitter is used to transmit a first ultrasonic signal; the preset ultrasonic receiver in the at least one ultrasonic receiver is used to receive a second ultrasonic signal, and the second ultrasonic signal is that the first ultrasonic signal is in the area to be measured Formed by transmission, the preset ultrasonic receiver is set in the area to be measured; the temperature measuring device is used to measure a reference temperature and provide the reference temperature to the processor; the processor is used to The first ultrasonic signal, the second ultrasonic signal and the reference temperature determine the temperature of the area to be measured.

The ultrasonic signal may be generated by an ultrasonic generator, or it may be pre-stored in the memory. The memory used to store the ultrasonic signal can be packaged with the ultrasonic transmitter, or can be independently arranged outside the ultrasonic transmitter. In addition, the memory used to store ultrasonic signals can also be packaged with the processor.

The ultrasonic transmitter and the processor can obtain ultrasonic signals from the ultrasonic generator or the memory respectively. Wherein, the time when the ultrasonic transmitter transmits the ultrasonic signal can be set by default, or it can be transmitted under the control of the processor.

It should be noted here that the above-mentioned ultrasonic transmitter may include one or more; the ultrasonic receiver may include one or more. When there are multiple ultrasonic transmitters or ultrasonic receivers described above, they can be arranged in different areas.

By acquiring the ultrasonic signal emitted by the ultrasonic transmitter, the ultrasonic signal received by the ultrasonic receiver, and the reference temperature, the relationship between the speed of sound and the temperature is used to determine the temperature of the space area, which is beneficial to more accurately measure the temperature of the space area.

Based on the first aspect, in a possible implementation manner, the first ultrasonic signal is a quadrature modulation signal.

By setting the first ultrasonic signal as a quadrature modulation signal, the anti-interference ability of the transmitted ultrasonic signal can be improved, thereby improving the stability of the transmitted ultrasonic signal.

Based on the first aspect, in a possible implementation manner, the at least one ultrasonic transmitter includes a first ultrasonic transmitter and a second ultrasonic transmitter, wherein the first ultrasonic signal emitted by the first ultrasonic transmitter and Another first ultrasonic signal transmitted by the second ultrasonic transmitter has a different carrier frequency.

By modulating different first ultrasonic signals to carrier waves of different frequencies, signal interference between multiple first ultrasonic signals can be avoided, so that the processor can accurately identify the propagation path of the first ultrasonic signal, thereby accurately calculating the first ultrasonic signal. The temperature of the area corresponding to the propagation path of the signal.

Based on the first aspect, in a possible implementation manner, the at least one ultrasonic receiver includes a first preset ultrasonic receiver and a second preset ultrasonic receiver; the first preset ultrasonic receiver is disposed at the first A region to be measured, the second preset ultrasonic receiver is arranged in the second region to be measured; the processor is specifically configured to determine the first temperature of the first region to be measured and the temperature of the second region to be measured The second temperature.

The first area to be measured and the second area to be measured are transmission path areas of the first ultrasonic signal. In other words, the first area to be measured and the second area to be measured can also be said to be areas where the signal strength of the received second ultrasonic signal is greater than the preset threshold. By setting the first ultrasonic receiver and the second ultrasonic receiver, the temperature of more local areas in the space area can be measured, thereby determining the temperature distribution of the area to be measured based on the temperature of multiple local areas, and further improving the accuracy of temperature measurement .

Based on the first aspect, in a possible implementation manner, the processor is specifically configured to: determine a reference speed of sound based on the reference temperature; The phase difference between the second ultrasonic signals, the first ultrasonic signal is transmitted in the area to be measured to form the transmission distance of the second ultrasonic signal, and the first sound velocity is determined; based on the first sound velocity , The reference temperature and the reference speed of sound determine the temperature of the area to be measured.

Based on the first aspect, in a possible implementation manner, the processor is further configured to: the processor is further configured to generate a temperature distribution in a space based on the first temperature and the second temperature, the The space includes the first area to be measured and the second area to be measured.

In the second aspect, an embodiment of the present application provides a temperature measurement method to obtain a first ultrasonic signal emitted by an ultrasonic transmitter in a temperature measurement system; obtain a reference temperature from a temperature measurement device in the temperature measurement system; The preset ultrasonic receiver in the measurement system acquires a second ultrasonic signal, the second ultrasonic signal is formed by the transmission of the first ultrasonic signal in the area to be measured, and the preset ultrasonic receiver is arranged in the to-be-measured area. Area; based on the reference temperature, the first ultrasonic signal and the second ultrasonic signal, determine the temperature of the area to be measured.

Based on the second aspect, in a possible implementation manner, the determining the temperature of the area to be measured based on the reference temperature, the first ultrasonic signal, and the second ultrasonic signal includes: based on the The frequency of the first ultrasonic signal, the phase difference between the first ultrasonic signal and the second ultrasonic signal, and the transmission of the first ultrasonic signal in the area to be measured to form the transmission of the second ultrasonic signal Determine the first speed of sound based on the distance, and determine the temperature of the area to be measured based on the first speed of sound, the reference temperature, and the reference speed of sound.

Based on the second aspect, in a possible implementation manner, the preset ultrasound receiver includes a first preset ultrasound receiver and a second preset ultrasound receiver; the first preset ultrasound receiver is disposed at the first preset ultrasound receiver. An area to be measured, the second preset ultrasonic receiver is arranged in the second area to be measured; the determining the area to be measured based on the reference temperature, the first ultrasonic signal and the second ultrasonic signal The temperature includes: determining the first ultrasonic signal based on the reference temperature, the first ultrasonic signal, and two second ultrasonic signals from the first preset ultrasonic receiver and the second preset ultrasonic receiver A first temperature of a region to be measured and a second temperature of the second region to be measured.

Based on the second aspect, in a possible implementation manner, the method further includes: generating a temperature distribution in a space based on the first temperature and the second temperature, the space including the first area to be measured And the second area to be measured.

In a third aspect, an embodiment of the present application provides a device that includes one or more processors and a memory, the memory is coupled to the processor, the memory is configured to store one or more programs, and the one The or more processors are used to run the one or more programs to implement the method as described in the second aspect.

Based on the third aspect, in a possible implementation manner, the device is a chip.

In a fourth aspect, an embodiment of the present application provides a device. The device includes: a first acquisition module for acquiring a first ultrasonic signal emitted by an ultrasonic transmitter in a temperature measurement system; a second acquisition module for receiving The temperature measurement device in the temperature measurement system acquires a reference temperature; a third acquisition module is used to acquire a second ultrasonic signal from a preset ultrasonic receiver in the temperature measurement system, and the second ultrasonic signal is the first The ultrasonic signal is transmitted in the area to be measured, and the preset ultrasonic receiver is arranged in the area to be measured; the determination module is configured to be based on the reference temperature, the first ultrasonic signal, and the second ultrasonic signal , To determine the temperature of the area to be measured.

Based on the fourth aspect, in a possible implementation manner, the determining module is further configured to: based on the frequency of the first ultrasonic signal, the phase difference between the first ultrasonic signal and the second ultrasonic signal , The first ultrasonic signal is transmitted in the area to be measured to form the transmission distance of the second ultrasonic signal, and the first sound speed is determined; based on the first sound speed, the reference temperature and the reference sound speed , To determine the temperature of the area to be measured.

Based on the fourth aspect, in a possible implementation manner, the preset ultrasound receiver includes a first preset ultrasound receiver and a second preset ultrasound receiver; the first preset ultrasound receiver is disposed at the first preset ultrasound receiver. An area to be measured, the second preset ultrasonic receiver is arranged in the second area to be measured; the determining module is further configured to: based on the reference temperature, the first ultrasonic signal, and the signal from the first preset The two second ultrasonic signals of the ultrasonic receiver and the second preset ultrasonic receiver are used to determine the first temperature of the first area to be measured and the second temperature of the second area to be measured.

Based on the fourth aspect, in a possible implementation manner, the device further includes: a generating module configured to generate a temperature distribution in a space based on the first temperature and the second temperature, the space including the The first area to be measured and the second area to be measured.

In a fifth aspect, an embodiment of the present application provides a readable storage medium, and the readable storage medium stores instructions. When the instructions are run on a computer, they are used to execute any of the temperature measurement methods in the second aspect described above.

In a sixth aspect, embodiments of the present application provide a computer program or computer program product, which when the computer program or computer program product is executed on a computer, enables the computer to implement the temperature measurement method in any of the above-mentioned second aspects.

It should be understood that the second to sixth aspects of the present application are consistent with the technical solutions of the first aspect of the present application, and the beneficial effects achieved by each aspect and corresponding feasible implementation manners are similar, and will not be repeated.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present application more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments of the present application. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor.

FIG. 1 is a schematic structural diagram of a temperature measurement system provided by an embodiment of the present application;

FIG. 2 is another schematic diagram of the structure of the temperature measurement system provided by an embodiment of the present application;

FIG. 3 is a flowchart for determining the temperature distribution of an ultrasonic signal propagation path area provided by an embodiment of the present application;

FIG. 4 is another structural schematic diagram of the temperature measurement system provided by an embodiment of the present application;

FIG. 5 is a schematic diagram of a virtual line constructed in the process of determining the temperature distribution provided by an embodiment of the present application; FIG.

FIG. 6 is another structural schematic diagram of the temperature measurement system provided by an embodiment of the present application;

FIG. 7 is a flowchart of a temperature measurement method provided by an embodiment of the present application;

FIG. 8 is a schematic diagram of the structure of the device provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

The terms "first", "second", etc. in this application are only used for the purpose of distinguishing description, and cannot be understood as indicating or implying relative importance, nor as indicating or implying order. In addition, the terms "including" and "having" and any variations of them are intended to cover non-exclusive inclusions, for example, including a series of steps or units. The method, system, product, or device need not be limited to those clearly listed steps or units, but may include other steps or units that are not clearly listed or are inherent to these processes, methods, products, or devices. In the description of the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations, or illustrations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferable or advantageous than other embodiments or design solutions. To be precise, words such as "exemplary" or "for example" are used to present related concepts in a specific manner.

The embodiment of the present application provides a temperature measurement system, which can accurately measure the temperature of any preset space area in the space. For its specific structure, please refer to the explanation of the following embodiments.

Please refer to FIG. 1, which shows a schematic structural diagram of a temperature measurement system 100 provided by an embodiment of the present application. As shown in FIG. 1, the temperature measurement system 100 includes an ultrasonic transmitter UT, an ultrasonic receiver UR and a processor 101.

The ultrasonic transmitter UT can usually send an ultrasonic signal with a preset sound wave frequency. When the vibration frequency of the sound wave is between 20Khz and 500MHz, it belongs to the ultrasonic range. The sound wave frequency of the ultrasonic signal emitted by the ultrasonic transmitter UT may be, for example, 50 KHz.

For the acquisition of ultrasonic signals, the following methods can be used.

In the first possible implementation manner, the temperature measurement system 100 may be provided with an ultrasonic generator 103, which is coupled with the ultrasonic transmitter UT and the processor 101, as shown in FIG. 1. The ultrasonic generator 103 may generate a first ultrasonic signal of a preset frequency, and then provide the generated first ultrasonic signal to the ultrasonic transmitter UT and the processor 101.

In the second possible implementation manner, the temperature measurement system 100 may be provided with a memory 104, and the memory 104 may be coupled with the ultrasonic transmitter UT and the processor 101, as shown in FIG. 2. The memory 104 may pre-store a plurality of ultrasonic signals with preset frequencies. The processor 101 may control the memory 104 to provide one of the ultrasonic signals of the preset frequency to the ultrasonic transmitter UT.

In order to ensure that the ultrasonic signal emitted by the ultrasonic transmitter UT has better anti-interference ability, and to prevent other objects or sounds from interfering with the ultrasonic signal, causing excessive noise or signal attenuation of the ultrasonic signal, the ultrasonic signal emitted by the ultrasonic transmitter UT is Modulated ultrasonic signal.

In a possible implementation manner, the ultrasonic signal emitted by the ultrasonic transmitter UT is an ultrasonic signal after quadrature modulation.

In specific implementation, quadrature modulation methods such as quadrature amplitude modulation, quadrature frequency division multiplexing modulation, coded orthogonal frequency division modulation, interleaved quadrature quadrature phase shift keying or π/4 quadrature phase shift keying can be used. One of them modulates the original ultrasonic signal to obtain a quadrature-modulated ultrasonic signal. Based on this, in the first possible implementation manner, the ultrasonic signal stored in the memory 104 is an ultrasonic signal after quadrature modulation.

In a second possible implementation manner, the temperature measurement system 100 may be provided with a quadrature modulator, and the ultrasonic generator 103 or the memory 104 may be coupled with the quadrature modulator to provide the ultrasonic generator 103 or the memory 104 with the quadrature modulator. The original ultrasonic signal is supplied to the quadrature modulator to generate a quadrature modulated ultrasonic signal.

In a third possible implementation manner, the processor 101 may include a digital signal processor (DSP, Digital Signal Processor), and the DSP may obtain the original ultrasonic signal from the ultrasonic generator 103 or the memory 104, and adopt a quadrature modulation method for the original ultrasonic signal. The ultrasonic signal is orthogonally modulated to generate the orthogonally modulated ultrasonic signal.

The ultrasonic receiver UR shown in Fig. 1 and Fig. 2 is used for receiving ultrasonic signals. The ultrasonic receiver UR provides the received ultrasonic signal to the processor 101.

When the signal sent by the ultrasonic transmitter UT is an ultrasonic signal after quadrature modulation, the following implementation scheme can be adopted.

In the first possible implementation manner, the above-mentioned temperature measurement system 100 further includes a quadrature demodulator. The quadrature demodulator 100 may be coupled with the ultrasonic receiver UR and the processor 101. The ultrasonic receiver UR can provide the received ultrasonic signal to the quadrature demodulator. The quadrature demodulator performs quadrature demodulation on the ultrasonic signal and provides it to the processor 101. It should be noted that the quadrature demodulator matches the quadrature modulation method of the ultrasonic signal. As an example, when the ultrasonic signal is modulated by the quadrature amplitude modulation method, the quadrature demodulator also uses the quadrature amplitude demodulation method to demodulate the ultrasonic signal.

In a second possible implementation manner, the processor 101 includes a DSP. The ultrasonic receiver UR provides the received ultrasonic signal to the processor 101, and the processor 101 uses the DSP to quadrature demodulate the signal sent by the ultrasonic receiver UR to restore the signal.

The temperature measurement system 100 shown in FIGS. 1 and 2 further includes a temperature measurement device 102, which may include, but is not limited to, a temperature sensor, a thermometer, or a thermocouple. The temperature measuring device 102 may be coupled with the processor 101. The temperature measuring device 102 is used to measure the temperature of any space area or reference space area in the space, and then send the measured temperature to the processor 101. The temperature measured by the temperature measuring device 102 can be used as a reference temperature.

Optionally, in a space where the air conditioner is installed, the temperature measuring device 102 may be installed at the air outlet of the air conditioner, that is, the preset space area is the air outlet of the air conditioner, so as to accurately detect the reference temperature.

Optionally, the above-mentioned temperature measuring device 102 may include a plurality of them, which are respectively arranged in different location areas in space. At this time, the processor 101 may also perform an average calculation on the multiple temperatures provided by the multiple temperature measurement devices 102, and use the temperature after the average calculation as the reference temperature.

The processor 101 is used to receive the ultrasonic signal from the ultrasonic receiver UR, and then determine the ultrasonic signal propagation path based on the ultrasonic signal transmitted by the ultrasonic transmitter UT, the ultrasonic signal received by the ultrasonic receiver UR, and the reference temperature provided by the temperature measuring device 102 The temperature of the space area to be measured. Here, it can be noted that the ultrasonic signal emitted by the ultrasonic transmitter UT is the first ultrasonic signal, and the ultrasonic signal received by the ultrasonic receiver UR is the second ultrasonic signal.

The processor 101 may determine the phase difference between the first ultrasonic signal and the second ultrasonic signal, and then determine the real-time sound velocity based on the phase difference between the two and the reference temperature. Finally, based on the real-time speed of sound, the reference temperature and the reference speed of sound, the temperature of the space area to be measured where the ultrasonic signal propagation path is located is determined. The space area to be measured here is represented by the space area where the propagation path L1 is located, which can be understood as an area where the signal strength of the first ultrasonic signal that can be detected is greater than a preset threshold.

Specifically, referring to FIG. 3, it shows a process 300 for the processor 101 to determine the temperature of the spatial region where the ultrasonic signal propagation path is located.

In step 301, the temperature is obtained from the temperature measuring device 102, and a reference sound velocity is determined based on the obtained temperature.

Specifically, the relationship between sound velocity and temperature is as shown in formula (1):

Among them, V _base is the reference speed of sound; T _base is the reference temperature.

Step 302: Determine the phase difference between the first ultrasonic signal and the second ultrasonic signal.

Step 303: Determine the real-time sound velocity based on the phase difference between the first ultrasonic signal and the second ultrasonic signal.

Specifically, there is a relationship between the phase difference and the speed of sound as shown in formula (2):

ψ=2πd/λ=2πdf/V (2)

Among them, f is the frequency of the first ultrasonic signal, ψ is the phase difference, d is the distance between the ultrasonic transmitter UT and the ultrasonic receiver UR, and the real-time sound velocity V can be calculated by formula (2). It can be understood that in this scenario, the ultrasonic transmitter UT and the ultrasonic receiver UR may not be arranged together.

In another embodiment, the ultrasonic transmitter UT and the ultrasonic receiver UR can be set together, that is, there is no distance between the two. At this time, the second ultrasonic signal received by the ultrasonic receiver UR is after the first ultrasonic signal is reflected by the object. signal of. For example, the ultrasonic transmitter UT and the ultrasonic receiver UR are integrated together, and the ultrasonic transmitter UT is facing a wall, the distance between the ultrasonic transmitter UT and the wall is X, and the first ultrasonic signal emitted by the ultrasonic transmitter UT is reflected after reaching the wall The return is the second ultrasonic signal and is received by the ultrasonic receiver UR, the distance d at this time is 2X. Therefore, the distance d in the above formula indicates the transmission distance of the first ultrasonic signal, and after the transmission distance d, it becomes a second ultrasonic signal that can be received.

Step 304: Determine the temperature of the area where the ultrasonic signal propagation path is located based on the real-time speed of sound, the reference temperature, and the reference speed of sound.

According to the relationship between the speed of sound and temperature, the speed of sound increases by 0.607m/s for every increase of 1°C. Therefore, the temperature of the ultrasonic signal propagation path area can be determined by formula (3).

T=T _base +(VV _base )/0.607 (3)

Figure 1 schematically shows an ultrasonic receiver UR. In a specific application scenario, in order to more accurately measure the temperature distribution of various regions in a certain space, the temperature measurement system 100 may include multiple ultrasonic receivers, and the multiple ultrasonic receivers may be arranged at different positions in the spatial area. As shown in Figure 4. Fig. 4 schematically shows four ultrasonic receivers UR1, UR2, UR3 and UR4. The ultrasonic receivers UR1, UR2, UR3, and UR4 may be coupled with the processor 101, respectively.

The ultrasonic receivers UR1, UR2, UR3 and UR4 can all receive the ultrasonic signals sent by the ultrasonic transmitter UT.

In a specific implementation, in order to distinguish the signals received by each ultrasonic receiver, the original ultrasonic signal can be modulated onto carrier waves of different frequencies. The ultrasonic transmitter UT can use a time-sharing cycle to transmit ultrasonic signals with different carrier frequencies to the ultrasonic receivers UR1, UR2, UR3, and UR4.

As an example, the ultrasonic transmitter UT transmits an ultrasonic signal with a carrier frequency of f1 to the ultrasonic receiver UR1 at time T1; transmits an ultrasonic signal with a carrier frequency of f2 to the ultrasonic receiver UR2 at time T2; and transmits an ultrasonic signal with a carrier frequency of f2 to the ultrasonic receiver UR3 at time T3 An ultrasonic signal with a carrier frequency of f3; at time T4, an ultrasonic signal with a carrier frequency of f4 is transmitted to the ultrasonic receiver UR4..., reciprocating in turn.

After the ultrasonic receivers UR1, UR2, UR3, and UR4 receive the signals sent by the ultrasonic transmitter UT, they can provide the received ultrasonic signals to the processor 101.

After the processor 101 receives the ultrasonic signals provided by the ultrasonic receivers UR1, UR2, UR3, and UR4, it can first perform quadrature demodulation on each ultrasonic signal to obtain the ultrasonic signal transmitted through path L1 and the ultrasonic signal transmitted through path L2, respectively. Signal, the ultrasonic signal transmitted through the path L3, and the ultrasonic signal transmitted through the path L4.

Then, the temperature determination method of the process 300 shown in FIG. 3 is used to determine the temperature of the spatial region where each ultrasonic signal propagation path is located, and then based on the obtained multiple temperatures and the influence coefficient of each path on the temperature distribution of the spatial region, construct Figure 4 shows the temperature distribution of the spatial region.

The method for constructing the temperature distribution will be described in detail below in conjunction with FIG. 5.

In FIG. 5, L1 is the ultrasonic propagation path between the ultrasonic transmitter UT and the ultrasonic receiver UR1, and L2 is the ultrasonic propagation path between the ultrasonic transmitter UT and the ultrasonic receiver UR2. With the temperature measurement method shown in FIG. 3, the temperature T1 of the spatial region along the path L1 and the temperature T2 of the spatial region along the path L2 can be measured. In Fig. 5, the spatial area along the path L1 is abstracted as a straight line connecting the ultrasonic transmitter UT and the ultrasonic receiver UR1, and the spatial area along the path L2 is abstracted as a straight line connecting the ultrasonic transmitter UT and the ultrasonic receiver UR2. Among them, the temperature of the space area along the path L1 are all equal; the temperature of the space area along the path L2 are all the same. At this time, the path L1 and the path L2 can be regarded as two isotherms with a temperature of T1 and a temperature of T2, respectively. The space area formed by the path L1, the path L2, and the connection line of the ultrasonic receiver UR1 and the ultrasonic receiver UR2 can be regarded as a space area formed by a stack of countless two-dimensional planes M. Among them, the temperature distribution of each two-dimensional plane M is the same. The path L1, the path L2, and the line connecting the ultrasonic receiver UR1 and the ultrasonic receiver UR2 can be regarded as the boundary of the two-dimensional plane M.

The X-axis direction and the Y-axis direction in the two-dimensional plane M are defined as shown in Fig. 5. With the path L1 and the path L2 as the boundary, m virtual lines x1, x2,..., xi... and n virtual lines y1, y2,..., yj... are set at equal intervals. Among them, the virtual lines x1, x2,..., xi... extend along the X axis direction and are arranged along the Y axis direction; the virtual lines y1, y2,..., yj... extend along the Y axis direction and are arranged along the X axis direction. m is a positive integer greater than i, and n is a positive integer greater than j. It can be seen from FIG. 5 that the Y-axis direction is consistent with the direction of the path L1, and the X-axis direction is consistent with the connection direction of the ultrasonic signal receiver UR1 and the ultrasonic signal receiver UR2. In other scenarios, the X-axis direction can also be consistent with the direction of the path L2. This embodiment does not limit the X-axis direction and the Y-axis direction, as long as the virtual lines x1, x2,..., xi... and the virtual lines y1, y2, …, yj…respectively converge at the path L1 and the path L2 to form a virtual point. At this time, any one of the virtual point coordinates can be defined as the origin, and the coordinate values of the other virtual points can be mapped based on the distance between the other virtual points and the origin. The i-th virtual line along the X-axis direction can be expressed as xi, and the j-th virtual line along the Y-axis direction can be expressed as j, and i and j are respectively positive integers greater than 0. The distance between every two virtual lines extending in the X-axis direction is d1, and the distance between every two virtual lines extending in the Y-axis direction is d2. A plurality of virtual lines x1, x2, ...xi and a plurality of virtual lines y1, y2, ...yj are interlaced to form a plurality of virtual points. Suppose that along the X axis, there are c virtual points on each virtual line; along the Y axis, there are r virtual points on each virtual line, where c and r are changing, and each virtual line along the X axis The number of virtual points may be different, and the number of virtual points on each virtual line along the Y-axis direction may be different. T _ij is the temperature at the intersection of the i-th virtual line xi and the j-th virtual line yj.

Suppose the coefficient matrix of the temperature distribution of the two-dimensional plane M is A, then the following equation is given:

λA(x _L1 ,y _L1 )=T1 (4)

λA(x _L2 ,y _L2 )=T2 (5)

λ is the thermal conductivity of air, (x _L1 , y _L1 ) are the coordinates of virtual points formed by the intersection of virtual lines x1, x2,..., xi... with virtual lines y1, y2,..., yj... at path L1; Among them, (x _L1 , y _L1 ) represents the coordinate set of each virtual point distributed along the path L1; (x _L2 , y _L2 ) are the virtual lines x1, x2,..., xi... and virtual lines y1, y2,..., yj...The coordinates of each virtual point formed by the intersection at the path L2; where (x _L2 , y _L2 ) represents the coordinate set of each virtual point distributed along the path L2. Based on formula (4) and formula (5), the coefficient value corresponding to each virtual point distributed along the path L1 in the coefficient matrix A can be determined, and the coefficient value corresponding to each virtual point distributed along the path L2 in the coefficient matrix A can be determined.

Define the position coefficient function of each virtual point as:

index(i,j)=(j-1)c+i-1 (6)

At this time, there is: T _(j-1)c+i-1 =T _ij (7)

A(index(i,j),index(i-1,j))=-d1 (8)

A(index(i,j),index(i+1,j))=-d1 (9)

A(index(i,j),index(i,j+1))=-d2 (10)

A(index(i,j),index(i,j-1))=-d2 (11)

A(index(i,j), index(i,j))=1+2d1+2d2 (12)

Among them, index(i-1,j), index(i+1,j), index(i,j-1), index(i,j+1) are adjacent to the virtual point index(i,j) respectively Virtual point. Based on the determined coefficient values in the coefficient matrix A corresponding to each virtual point on the path L1 and each virtual point on the path L2 and formula (6)-formula (12), it is possible to deduce each in the two-dimensional plane M The value of the coefficient at the virtual point, and the coefficient matrix A is obtained.

Then, using formula (13), the temperature of the two-dimensional plane M at each virtual point can be determined, so as to obtain the temperature distribution of the space area between the path L1 and the path L2.

T _ij =λA(xi,yj) (13)

In addition, referring to FIG. 4, a method of determining the temperature distribution of the space area between the path L1 and the path L2 can be used to determine the temperature distribution of the space area between the path L2 and the path L3, and the space between the path L3 and the path L4, respectively. The temperature distribution of the area, thereby constructing the temperature distribution of the space area between the ultrasonic transmitter and the ultrasonic receiver. As a result, the temperature of each area in the space can be accurately obtained, which is beneficial to accurately monitor the temperature, and then accurately adjust the temperature of each area in the space.

In some application scenarios, the temperature measurement system 100 may include multiple ultrasonic transmitters and multiple ultrasonic receivers. The multiple ultrasonic transmitters and multiple ultrasonic receivers may be arranged at different positions in the space area, and each ultrasonic transmitter may correspond to multiple ultrasonic receivers, as shown in FIG. 6. Figure 6 shows three ultrasonic transmitters UL1, UL2, and UL3, and six ultrasonic receivers UR1, UR2, UR3, UR4, UR5, and UR6. Among them, the ultrasonic receivers UR1 and UR2 are used to receive the ultrasonic signals emitted by the ultrasonic transmitter UL1, and the ultrasonic receivers UR3, UR4, UR5 and UR6 are used to receive the ultrasonic signals emitted by the ultrasonic transmitters UL2 and UL3.

Specifically, as shown in Figure 6, the ultrasonic transmitter UT1 transmits ultrasonic signals to the ultrasonic receiver UR1 through the path L11; the ultrasonic transmitter UT1 transmits ultrasonic signals to the ultrasonic receiver UR2 through the path L12; the ultrasonic transmitter UT2 transmits ultrasonic signals to the ultrasonic through the path L21 The receiver UR3 transmits ultrasonic signals; the ultrasonic transmitter UT2 transmits ultrasonic signals to the ultrasonic receiver UR4 through path L22; the ultrasonic transmitter UT2 transmits ultrasonic signals to the ultrasonic receiver UR5 through path L23; the ultrasonic transmitter UT2 transmits ultrasonic signals to the ultrasonic receiver through path L24 UR6 transmits ultrasonic signals; ultrasonic transmitter UT3 transmits ultrasonic signals to ultrasonic receiver UR3 through path L31; ultrasonic transmitter UT3 transmits ultrasonic signals to ultrasonic receiver UR4 through path L32; ultrasonic transmitter UT3 transmits ultrasonic signals to ultrasonic receiver UR5 through path L33 Ultrasonic signal; the ultrasonic transmitter UT3 transmits an ultrasonic signal to the ultrasonic receiver UR6 through the path L34.

The processor 101 is configured to receive ultrasonic signals provided by ultrasonic receivers UR1, UR2, UR3, UR4, UR5, and UR6, and then demodulate the received ultrasonic signals to obtain multiple demodulated ultrasonic signals.

In specific implementation, the orthogonal modulation modes of the ultrasonic signals emitted by the ultrasonic transmitter UT1, the ultrasonic transmitter UT2 and the ultrasonic transmitter UT3 are all different. Therefore, mutual interference between the ultrasonic signals emitted by multiple ultrasonic transmitters is avoided. In addition, the ultrasonic signal transmitted by the ultrasonic transmitter UT1 to the ultrasonic receivers UR1 and UR2 can be modulated to carrier waves of different frequencies; the ultrasonic signal transmitted by the ultrasonic transmitter UT2 to the ultrasonic receivers UR3, UR4, UR5 and UR6 can be modulated to Carriers of different frequencies; the ultrasonic signals emitted by the ultrasonic transmitter UT3 to the ultrasonic receivers UR3, UR4, UR5 and UR6 can be modulated to the carriers of different frequencies. Thus, the ultrasonic signals propagating in various directions can be distinguished.

At this time, the processor 101 may use a quadrature modulation method corresponding to the ultrasonic signal transmitted by the ultrasonic transmitter UL1 to demodulate the ultrasonic signals received from the ultrasonic receivers UR1 and UR2; the processor 101 may use a method corresponding to the ultrasonic transmitter UL1. The quadrature modulation method of the ultrasonic signal transmitted by the ultrasonic transmitter UL2 and the ultrasonic transmitter UL3 respectively demodulate the ultrasonic signals received from the ultrasonic receivers UR3, UR4, UR5 and UR6.

Then, the processor 101 can determine the path L11, the path L12, the path L21, the path L22, the path L23, the path L24, the path L31, the path L32, the path L33, and the path L34 based on the temperature determination method shown in FIG. Then use the temperature distribution construction method shown in Figure 5 to determine the temperature distribution of the space between the path L11 and the path L21, the temperature distribution of the space between the path L21 and the path L22, and the path The temperature distribution of the space area between L22 and the path L23, the temperature distribution of the space area between the path L23 and the path L24, the temperature distribution of the space area between the path L31 and the path L32, the space between the path L32 and the path L33 The temperature distribution of the area and the temperature distribution of the space area between the path L33 and the path L34, thereby obtaining the temperature distribution of the space area between the ultrasonic transmitter and the ultrasonic receiver.

Based on the temperature measurement system 100 shown in FIG. 1, FIG. 4, and FIG. 6, the temperature measurement system 100 can be specifically applied to an environment where an air conditioning system is installed in a car, room, theater, etc., so that the The temperature measurement system 100 accurately measures the air temperature in each area of the environment, and then adjusts the air temperature in each area in real time to ensure that the air temperature in each area of the space is consistent with the set temperature of the air conditioner, thereby improving user experience.

Taking a car as an example, when the temperature measurement system 100 is applied to a car, the above-mentioned ultrasonic transmitter may be a car audio, and the above-mentioned ultrasonic receiver may be a microphone installed in the car. The aforementioned processor may be a vehicle-mounted control device.

When the temperature measurement system 100 is used in a room, the ultrasonic transmitter may be a home audio system, and the ultrasonic receiver and the processor may be set in a smart terminal such as a mobile phone. The smart terminal may be used to receive ultrasonic signals and The received ultrasonic signals are processed to generate temperature distributions in various areas of the room.

In addition, the temperature measurement system 100 may also include more devices such as communication modules, input/output devices, etc., which will not be repeated here.

Please continue to refer to FIG. 7, which shows a flow 700 of a temperature measurement method provided by an embodiment of the present application, and the temperature measurement method is applied to the processor 101 shown in FIG. 1. The temperature measurement method includes the following steps: Step 701: Obtain the first ultrasonic signal emitted by the ultrasonic transmitter in the temperature measurement system. Step 702: Obtain a reference temperature from the temperature measurement device in the temperature measurement system. Step 703: Obtain a second ultrasonic signal from a preset ultrasonic receiver in the temperature measurement system. The second ultrasonic signal is formed by the transmission of the first ultrasonic signal in the area to be measured, and the preset ultrasonic receiver is arranged in the area to be measured. Step 704: Determine the temperature of the area to be measured based on the reference temperature, the first ultrasonic signal and the second ultrasonic signal.

In a possible implementation manner, step 704 further includes: based on the frequency of the first ultrasonic signal, the phase difference between the first ultrasonic signal and the second ultrasonic signal, and whether the first ultrasonic signal is The transmission distance in the area to be measured to form the second ultrasonic signal is determined, and the first sound velocity is determined; based on the first sound velocity, the reference temperature and the reference sound velocity, the area to be measured is determined temperature.

In a possible implementation, the preset ultrasonic receiver includes a first preset ultrasonic receiver and a second preset ultrasonic receiver; the first preset ultrasonic receiver is set in the first area to be measured, and the second preset ultrasonic receiver The ultrasonic receiver is arranged in the second area to be measured; based on the reference temperature, the first ultrasonic signal, and the second ultrasonic signal, determining the temperature of the area to be measured includes: based on the reference temperature, the first ultrasonic signal, and from the first preset The two second ultrasonic signals of the ultrasonic receiver and the second preset ultrasonic receiver determine the first temperature of the first area to be measured and the second temperature of the second area to be measured.

In a possible implementation, the temperature measurement method further includes: generating a temperature distribution in a space based on the first temperature and the second temperature, the space including a first area to be measured and a second area to be measured.

For the specific implementation of the temperature measurement method shown in FIG. 7, reference may be made to the specific implementation of the method steps executed by the processor 101 shown in FIG. 1, FIG. 2, FIG. 4, and FIG. 6, which will not be repeated here. By acquiring the first ultrasonic signal emitted by the ultrasonic transmitter, the second ultrasonic signal received by the ultrasonic receiver and the reference temperature, the relationship between the speed of sound and the temperature is used to determine the temperature of the space area, which is conducive to more accurately measuring the temperature of the space area .

It can be understood that, in order to implement the above-mentioned functions, the processor includes hardware and/or software modules corresponding to each function. In combination with the algorithm steps of the examples described in the embodiments disclosed herein, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a certain function is executed by hardware or computer software-driven hardware depends on the specific application and design constraint conditions of the technical solution. Those skilled in the art can use different methods for each specific application in combination with the embodiments to implement the described functions, but such implementation should not be considered as going beyond the scope of the present application.

In this embodiment, the processor may be divided into functional modules according to the foregoing method examples. For example, each functional module may be divided corresponding to each function, or two or more functions may be integrated into one processing module. The above-mentioned integrated modules can be implemented in the form of hardware. It should be noted that the division of modules in this embodiment is illustrative, and is only a logical function division, and there may be other division methods in actual implementation.

In the case of dividing each functional module corresponding to each function, FIG. 8 shows a possible composition diagram of the apparatus 800 involved in the foregoing embodiment. As shown in FIG. 8, the apparatus 800 may include: a first acquisition module 801, a second acquiring module 802, a third acquiring module 803, and a determining module 804.

Among them, the first acquisition module 801 is used to acquire the first ultrasonic signal emitted by the ultrasonic transmitter in the temperature measurement system; the second acquisition module 802 is used to acquire the reference temperature from the temperature measurement device in the temperature measurement system; and the third acquisition is The module 803 is used to obtain a second ultrasonic signal from a preset ultrasonic receiver in the temperature measurement system. The second ultrasonic signal is formed by the transmission of the first ultrasonic signal in the area to be measured. The preset ultrasonic receiver is set in the to-be-measured area. Measurement area; determination module 804, for determining the temperature of the area to be measured based on the reference temperature, the first ultrasonic signal and the second ultrasonic signal.

In a possible implementation, the determining module 804 is further configured to: based on the frequency of the first ultrasonic signal, the phase difference between the first ultrasonic signal and the second ultrasonic signal, the first ultrasonic signal is transmitted in the area to be measured to The transmission distance of the second ultrasonic signal is formed, and the first sound speed is determined; based on the first sound speed, the reference temperature and the reference sound speed, the temperature of the area to be measured is determined.

In a possible implementation, the preset ultrasonic receiver includes a first preset ultrasonic receiver and a second preset ultrasonic receiver; the first preset ultrasonic receiver is set in the first area to be measured, and the second preset ultrasonic receiver The ultrasonic receiver is arranged in the second area to be measured; the determining module 804 is further used for: based on the reference temperature, the first ultrasonic signal, and two second ultrasonic waves from the first preset ultrasonic receiver and the second preset ultrasonic receiver Signal to determine the first temperature of the first area to be measured and the second temperature of the second area to be measured.

In a possible implementation manner, the device 800 further includes: a generating module (not shown in the figure) for generating a temperature distribution in a space based on the first temperature and the second temperature, the space including the first area to be measured and The second area to be measured.

The device 800 provided in this embodiment is used to execute the temperature measurement method executed by the processor 101 shown in the temperature measurement system 100, and can achieve the same effect as the foregoing implementation method.

In the case of an integrated unit, the device 800 may include a processor, a memory, and a communication module. The processor may control and manage the actions of the device 800, for example, it may be used to support the device 800 to execute the steps executed by each of the foregoing modules. The memory can be used to support the device 800 to execute and store program codes and data. The communication module can be used for communication between the device 800 and other devices (for example, the temperature measuring device 102 and the ultrasonic receiver UR shown in FIG. 1).

Among them, the processor may implement or execute various exemplary logic modules described in conjunction with the disclosure of this application. The processor can also be a combination of computing functions, for example, a combination of one or more microprocessors, such as a central processing unit (CPU), and other general-purpose processors and digital signal processors (Digital Signal Processors). Processor, DSP), Application Specific Integrated Circuit (ASIC), off-the-shelf Programmable Gate Array (Field Programmable Gate Array, FPGA) or other programmable logic devices, discrete gates or transistor logic devices, or discrete hardware components, etc. The general-purpose processor may be a microprocessor, a microcontroller, or any conventional processor.

It should also be understood that the memory mentioned in the embodiments of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memory. Among them, the non-volatile memory can be read-only memory (Read-Only Memory, ROM), programmable read-only memory (Programmable ROM, PROM), erasable programmable read-only memory (Erasable PROM, EPROM), and electrically available Erase programmable read-only memory (Electrically EPROM, EEPROM) or flash memory. The volatile memory may be a random access memory (Random Access Memory, RAM), which is used as an external cache. By way of exemplary but not restrictive description, many forms of RAM are available, such as static random access memory (Static RAM, SRAM), dynamic random access memory (Dynamic RAM, DRAM), synchronous dynamic random access memory (Synchronous DRAM, SDRAM), Double Data Rate Synchronous Dynamic Random Access Memory (Double Data Rate SDRAM, DDR SDRAM), Enhanced Synchronous Dynamic Random Access Memory (Enhanced SDRAM, ESDRAM), Synchronous Link Dynamic Random Access Memory (Synchlink DRAM, SLDRAM) ) And Direct Rambus RAM (DR RAM).

The communication module may specifically be a radio frequency circuit, a Bluetooth chip, a Wi-Fi chip, and other devices that interact with other electronic devices.

This embodiment also provides a computer-readable storage medium, the computer-readable storage medium stores computer instructions, when the computer instructions run on the computer, the computer is caused to execute the above-mentioned related method steps to realize the temperature measurement in the above-mentioned embodiment method.

This embodiment also provides a computer program product, which when the computer program product runs on a computer, causes the computer to execute the above-mentioned related steps, so as to realize the temperature measurement method in the above-mentioned embodiment.

In addition, the embodiments of the present application also provide a device. The device may specifically be a chip, component or module. The device may include a coupled processor and a memory; wherein the memory is used to store computer execution instructions, and when the device is running, The processor can execute the computer-executable instructions stored in the memory, so that the chip executes the above-mentioned temperature measurement method.

Among them, the processor, computer readable storage medium, computer program product, or chip provided in this embodiment are all used to execute the corresponding method provided above. Therefore, the beneficial effects that can be achieved can refer to the above provided The beneficial effects of the corresponding method will not be repeated here.

Through the description of the above embodiments, those skilled in the art can understand that for the convenience and conciseness of the description, only the division of the above-mentioned functional modules is used as an example for illustration. In practical applications, the above-mentioned functions can be assigned to different functions as required. The function module is completed, that is, the internal structure of the device is divided into different function modules to complete all or part of the functions described above.

In the several embodiments provided in this application, it should be understood that the disclosed device and method may be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of modules is only a logical function division, and there may be other divisions in actual implementation, for example, multiple modules or components can be combined or integrated. To another device, or some features can be ignored, or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be through some interfaces. The indirect coupling or communication connection of the devices may be in electrical, mechanical or other forms.

The units described as separate parts may or may not be physically separate, and the parts displayed as units may be one physical unit or multiple physical units, that is, they may be located in one place, or they may be distributed to multiple different places. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.

In addition, the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or software functional unit.

If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solutions of the embodiments of the present application are essentially or the part that contributes to the prior art, or all or part of the technical solutions can be embodied in the form of a software product, and the software product is stored in a storage medium. It includes several instructions to make a device (which may be a single-chip microcomputer, a chip, etc.) or a processor (processor) execute all or part of the steps of the methods of the various embodiments of the present application. The aforementioned readable storage media include: U disk, mobile hard disk, read only memory (read only memory, ROM), random access memory (random access memory, RAM), magnetic disk or optical disk, etc., which can store program code medium.

The above are only specific implementations of this application, but the protection scope of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application. Should be covered within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A temperature measurement system, characterized in that, the temperature measurement system includes at least one ultrasonic transmitter, at least one ultrasonic receiver, a temperature measurement device, and a processor; wherein,

Any one of the at least one ultrasonic transmitter is used to transmit a first ultrasonic signal;

The preset ultrasonic receiver in the at least one ultrasonic receiver is used to receive a second ultrasonic signal, the second ultrasonic signal is formed by the transmission of the first ultrasonic signal in the area to be measured, and the preset ultrasonic receiver is set In the area to be measured;

The temperature measuring device is used to measure a reference temperature and provide the reference temperature to the processor;

The processor is configured to determine the temperature of the area to be measured based on the first ultrasonic signal, the second ultrasonic signal, and the reference temperature.
The temperature measurement system according to claim 1, wherein the first ultrasonic signal is a quadrature modulation signal.
The temperature measurement system according to claim 1 or 2, wherein the at least one ultrasonic transmitter includes a first ultrasonic transmitter and a second ultrasonic transmitter, wherein the first ultrasonic transmitter emitted by the first ultrasonic transmitter The ultrasonic signal and another first ultrasonic signal emitted by the second ultrasonic transmitter have different carrier frequencies.
The temperature measurement system according to any one of claims 1 to 3, wherein the at least one ultrasonic receiver includes a first preset ultrasonic receiver and a second preset ultrasonic receiver;

The first preset ultrasonic receiver is arranged in a first area to be measured, and the second preset ultrasonic receiver is arranged in a second area to be measured;

The processor is specifically configured to determine the first temperature of the first area to be measured and the second temperature of the second area to be measured.
The temperature measurement system according to any one of claims 1 to 4, wherein the processor is specifically configured to:

Determine a reference speed of sound based on the reference temperature;

Based on the frequency of the first ultrasonic signal, the phase difference between the first ultrasonic signal and the second ultrasonic signal, the first ultrasonic signal is transmitted in the area to be measured to form the second ultrasonic wave The transmission distance of the signal, determine the first sound speed;

Based on the first sound velocity, the reference temperature, and the reference sound velocity, the temperature of the area to be measured is determined.
The temperature measurement system according to claim 4, wherein the processor is further configured to generate a temperature distribution in a space based on the first temperature and the second temperature, and the space includes the first waiting temperature. A measurement area and the second to-be-measured area.
A temperature measurement method, characterized in that the method includes:

Acquiring the first ultrasonic signal emitted by the ultrasonic transmitter in the temperature measurement system;

Obtaining a reference temperature from a temperature measuring device in the temperature measuring system;

Obtain a second ultrasonic signal from a preset ultrasonic receiver in the temperature measurement system, the second ultrasonic signal is formed by the transmission of the first ultrasonic signal in the area to be measured, and the preset ultrasonic receiver is set at The area to be measured;

Based on the reference temperature, the first ultrasonic signal and the second ultrasonic signal, the temperature of the area to be measured is determined.
8. The temperature measurement method according to claim 7, wherein the determining the temperature of the area to be measured based on the reference temperature, the first ultrasonic signal, and the second ultrasonic signal comprises:

Based on the frequency of the first ultrasonic signal, the phase difference between the first ultrasonic signal and the second ultrasonic signal, the first ultrasonic signal is transmitted in the area to be measured to form the second ultrasonic wave The transmission distance of the signal, determine the first sound speed;

Based on the first sound velocity, the reference temperature, and the reference sound velocity, the temperature of the area to be measured is determined.
The temperature measurement method according to claim 7 or 8, wherein the preset ultrasonic receiver includes a first preset ultrasonic receiver and a second preset ultrasonic receiver; the first preset ultrasonic receiver Arranged in the first area to be measured, and the second preset ultrasonic receiver is arranged in the second area to be measured;

The determining the temperature of the area to be measured based on the reference temperature, the first ultrasonic signal, and the second ultrasonic signal includes:

Determine the first area to be measured based on the reference temperature, the first ultrasonic signal, and two second ultrasonic signals from the first preset ultrasonic receiver and the second preset ultrasonic receiver The first temperature and the second temperature of the second area to be measured.
The method according to claim 9, wherein the method further comprises:

Based on the temperature distribution in the first temperature and the second temperature generating space, the space includes the first area to be measured and the second area to be measured.
A device, characterized in that the device comprises:

One or more processors and memories;

The memory is coupled to the processor, and the memory is used to store one or more programs;

The one or more processors are used to run the one or more programs to implement the method according to any one of claims 7-10.
The device according to claim 11, wherein the device is a chip.
A device, characterized in that the device comprises:

The first acquisition module is used to acquire the first ultrasonic signal emitted by the ultrasonic transmitter in the temperature measurement system;

The second acquiring module is used to acquire the reference temperature from the temperature measuring device in the temperature measuring system;

The third acquisition module is configured to acquire a second ultrasonic signal from a preset ultrasonic receiver in the temperature measurement system, the second ultrasonic signal is formed by the transmission of the first ultrasonic signal in the area to be measured, the A preset ultrasonic receiver is arranged in the area to be measured;

The determining module is configured to determine the temperature of the area to be measured based on the reference temperature, the first ultrasonic signal and the second ultrasonic signal.
The device according to claim 13, wherein the determining module is further configured to:

Based on the frequency of the first ultrasonic signal, the phase difference between the first ultrasonic signal and the second ultrasonic signal, the first ultrasonic signal is transmitted in the area to be measured to form the second ultrasonic wave The transmission distance of the signal, determine the first sound speed;

Based on the first sound velocity, the reference temperature, and the reference sound velocity, the temperature of the area to be measured is determined.
The device according to claim 13 or 14, wherein the preset ultrasonic receiver comprises a first preset ultrasonic receiver and a second preset ultrasonic receiver; the first preset ultrasonic receiver is arranged at The first area to be measured, the second preset ultrasonic receiver is arranged in the second area to be measured;

The determining module is further used for:

Determine the first area to be measured based on the reference temperature, the first ultrasonic signal, and two second ultrasonic signals from the first preset ultrasonic receiver and the second preset ultrasonic receiver The first temperature and the second temperature of the second area to be measured.
The device according to claim 15, wherein the device further comprises:

A generating module is configured to generate a temperature distribution in a space based on the first temperature and the second temperature, the space including the first area to be measured and the second area to be measured.
A readable storage medium, characterized by comprising computer instructions, which when run on a computer, cause the computer to execute the method according to any one of claims 7-10.
A computer program product, characterized in that, when the computer program product runs on a computer, the computer is caused to execute the method according to any one of claims 7-10.