WO2021204070A1 - 端子连接结构、显示单元及显示器 - Google Patents

端子连接结构、显示单元及显示器 Download PDF

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Publication number
WO2021204070A1
WO2021204070A1 PCT/CN2021/085193 CN2021085193W WO2021204070A1 WO 2021204070 A1 WO2021204070 A1 WO 2021204070A1 CN 2021085193 W CN2021085193 W CN 2021085193W WO 2021204070 A1 WO2021204070 A1 WO 2021204070A1
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Prior art keywords
terminal
light
emitting device
terminals
electrical connection
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PCT/CN2021/085193
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English (en)
French (fr)
Inventor
刁鸿浩
黄玲溪
Original Assignee
北京芯海视界三维科技有限公司
视觉技术创投私人有限公司
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Application filed by 北京芯海视界三维科技有限公司, 视觉技术创投私人有限公司 filed Critical 北京芯海视界三维科技有限公司
Priority to US17/917,928 priority Critical patent/US20230155094A1/en
Priority to EP21785663.2A priority patent/EP4135026A1/en
Publication of WO2021204070A1 publication Critical patent/WO2021204070A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49534—Multi-layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/20—Structure, shape, material or disposition of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Definitions

  • This application relates to the field of optical technology, such as a terminal connection structure, a display unit and a display.
  • the embodiments of the present disclosure provide a terminal connection structure, a display unit, and a display to solve the technical problem that there is no technical solution for providing a terminal for leading from a light emitting device.
  • the terminal connection structure provided by the embodiments of the present disclosure includes: a plurality of terminals, a plurality of terminal-side conductive holes, an electrical connection layer, and a plurality of light-emitting device-side conductive holes; wherein,
  • the electrical connection layer can be electrically connected to the multiple light emitting devices in the light emitting device layer through the multiple light emitting device side conductive holes, and can be electrically connected to the multiple terminals through the multiple terminal side conductive holes;
  • the multiple terminals are arranged in an array and do not exceed the coverage of the light emitting device layer.
  • the plurality of terminals may not exceed the longitudinal projection range of the light emitting device layer.
  • the plurality of terminals may not exceed the longitudinal projection range of the plane defined by part or all of the light emitting devices in the light emitting device layer.
  • At least one terminal of the plurality of terminals may be located at the edge of the coverage of the light emitting device layer.
  • none of the multiple terminals may be located at the edge of the coverage of the light emitting device layer.
  • the center of the at least one terminal located at the edge of the coverage of the light emitting device layer may not be aligned with the center of the at least one terminal-side conductive hole connecting the at least one terminal.
  • At least one terminal located at the edge of the coverage of the light emitting device layer may have a shape different from other partial or all terminals.
  • At least one terminal located at the edge of the coverage of the light-emitting device layer may have an area different from other parts or all of the terminals.
  • the distance between the at least one terminal located at the edge of the coverage area of the light emitting device layer and the adjacent at least one terminal may be different from the average distance between the terminals.
  • the electrical connection layer may include at least two electrical connection layers; each of the at least two electrical connection layers can be electrically connected to a plurality of light-emitting devices through a plurality of light-emitting device-side conductive holes, and both are electrically conductive through a plurality of terminal sides.
  • the hole is electrically connected to a plurality of terminals.
  • the at least two electrical connection layers may include a light-emitting device-side electrical connection layer and a terminal-side electrical connection layer;
  • the plurality of light-emitting device-side conductive holes may include a plurality of first light-emitting device conductive holes and second light-emitting device conductive holes. hole.
  • the light-emitting device side electrical connection layer can be electrically connected to a plurality of light-emitting devices through a plurality of first light-emitting device conductive holes.
  • the terminal-side electrical connection layer can be electrically connected to a plurality of light-emitting devices through a plurality of conductive holes of the second light-emitting device.
  • At least one of the plurality of light emitting devices includes a first electrode and a second electrode.
  • the light-emitting device side electrical connection layer can be electrically connected to the first electrode through at least one of the plurality of first light-emitting device conductive holes.
  • the terminal-side electrical connection layer can be electrically connected to the second electrode through at least one of the plurality of second light-emitting device conductive holes.
  • each of the plurality of light emitting devices may include a first electrode and a second electrode.
  • the light-emitting device side electrical connection layer can be electrically connected to the first electrodes of different light-emitting devices of the plurality of light-emitting devices through the plurality of first light-emitting device conductive holes, respectively.
  • the terminal-side electrical connection layer can be electrically connected to the second electrodes of different light-emitting devices of the plurality of light-emitting devices through a plurality of conductive holes of the second light-emitting devices.
  • a terminal-side electrical connection layer and a light-emitting device-side electrical connection layer may be sequentially provided.
  • the terminal connection structure may further include at least one of the following insulating layers:
  • An insulating layer that isolates a plurality of terminals from the electrical connection layer on the terminal side;
  • An insulating layer that isolates the terminal side electrical connection layer from the light emitting device side electrical connection layer
  • An insulating layer that isolates the light-emitting device side electrical connection layer from the multiple light-emitting devices.
  • the plurality of terminal-side conductive holes may include a plurality of first terminal conductive holes and a plurality of second terminal conductive holes.
  • the light-emitting device-side electrical connection layer may be electrically connected to a plurality of terminals through a plurality of first terminal conductive holes.
  • the terminal-side electrical connection layer may be electrically connected to a plurality of terminals through a plurality of second terminal conductive holes.
  • the plurality of terminals may include at least one first terminal and at least one second terminal.
  • the light emitting device side electrical connection layer may be electrically connected to at least one first terminal through at least one of the plurality of first terminal conductive holes.
  • the terminal-side electrical connection layer may be electrically connected to at least one second terminal through at least one of the plurality of second terminal conductive holes.
  • the at least one first terminal may include a plurality of first terminals
  • the at least one second terminal may include a plurality of second terminals.
  • the light-emitting device-side electrical connection layer may be electrically connected to the plurality of first terminals through the plurality of first terminal conductive holes, respectively.
  • the terminal-side electrical connection layer may be electrically connected to a plurality of second terminals through a plurality of second terminal conductive holes, respectively.
  • At least one of the light-emitting device side electrical connection layer and the terminal side electrical connection layer may be arranged in the following manner:
  • the light-emitting device side electrical connection layer includes at least one layer of light-emitting device side conductive traces
  • the terminal-side electrical connection layer includes at least one layer of terminal-side conductive traces.
  • At least one of the conductive traces on the light emitting device side and the conductive traces on the terminal side may be arranged in an array.
  • At least one of the conductive traces on the light emitting device side and the conductive traces on the terminal side may be arranged in an array in the form of rows or columns.
  • the conductive traces on the light emitting device side may be arranged in an array in the form of rows, and the conductive traces on the terminal side may be arranged in an array in the form of columns.
  • the conductive traces on the light emitting device side may be arranged in an array in the form of columns, and the conductive traces on the terminal side may be arranged in an array in the form of rows.
  • each of the terminal-side conductive traces may be electrically connected to at least one of the plurality of terminals.
  • each of the conductive traces on the side of the light-emitting device may be electrically connected to at least one of the multiple terminals.
  • At least one of the plurality of terminals may cover at least one of the plurality of terminal-side conductive holes.
  • some or all of the multiple terminals may be arranged at equal intervals.
  • parts of the plurality of terminals may be arranged in an array.
  • all of the multiple terminals may be arranged in an array.
  • the display unit provided by the embodiment of the present disclosure includes a plurality of light-emitting devices and the above-mentioned terminal connection structure.
  • the plurality of light emitting devices may include at least one light emitting diode (LED) light emitting device.
  • LED light emitting diode
  • the at least one LED light emitting device may include at least one Micro LED light emitting device.
  • a plurality of light emitting devices may be arranged in an array.
  • parts of the plurality of light emitting devices may be arranged in an array.
  • all of the multiple light-emitting devices may be arranged in an array.
  • the display provided by the embodiment of the present disclosure includes the above-mentioned display unit.
  • the terminal connection structure, display unit, and display provided by the embodiments of the present disclosure can achieve the following technical effects:
  • FIG. 1A and 1B are structural schematic diagrams of a terminal connection structure provided by an embodiment of the present disclosure
  • FIG. 2 is another structural schematic diagram of the terminal connection structure provided by the embodiment of the present disclosure.
  • FIG. 3 is another structural schematic diagram of a terminal connection structure provided by an embodiment of the present disclosure.
  • FIG. 5 is another structural schematic diagram of a terminal connection structure provided by an embodiment of the present disclosure.
  • FIG. 6 is another structural schematic diagram of the terminal connection structure provided by the embodiment of the present disclosure.
  • FIG. 7 is another structural schematic diagram of a terminal connection structure provided by an embodiment of the present disclosure.
  • FIG. 8 is another structural schematic diagram of a terminal connection structure provided by an embodiment of the present disclosure.
  • FIG. 9 is another structural schematic diagram of a terminal connection structure provided by an embodiment of the present disclosure.
  • FIG. 10 is another structural schematic diagram of a terminal connection structure provided by an embodiment of the present disclosure.
  • FIG. 11 is another structural schematic diagram of a terminal connection structure provided by an embodiment of the present disclosure.
  • FIG. 12 is another structural schematic diagram of a terminal connection structure provided by an embodiment of the present disclosure.
  • FIG. 13 is another structural schematic diagram of a terminal connection structure provided by an embodiment of the present disclosure.
  • 14A and 14B are structural schematic diagrams of the electrical connection layer on the light-emitting device side and the electrical connection layer on the terminal side provided by the embodiments of the present disclosure
  • 15A, 15B, 15C, and 15D are schematic diagrams of the arrangement of conductive traces on the light-emitting device side and conductive traces on the terminal side according to embodiments of the present disclosure
  • FIG. 16 is a schematic structural diagram of a display unit provided by an embodiment of the present disclosure.
  • FIG. 17 is another schematic structural diagram of a display unit provided by an embodiment of the present disclosure.
  • FIG. 18 is another schematic structural diagram of a display unit provided by an embodiment of the present disclosure.
  • FIG. 19 is another schematic structural diagram of a display unit provided by an embodiment of the present disclosure.
  • 20A and 20B are schematic diagrams of the structure of a display provided by an embodiment of the present disclosure.
  • an embodiment of the present disclosure provides a terminal connection structure, including: a plurality of terminals 110, a plurality of terminal-side conductive holes 120, an electrical connection layer 130, and a plurality of light-emitting device-side conductive holes 140; wherein ,
  • the electrical connection layer 130 can be electrically connected to the multiple light emitting devices 150 in the light emitting device layer 1510 through the multiple light emitting device side conductive holes 140, and can be electrically connected to the multiple terminals 110 through the multiple terminal side conductive holes 120;
  • the multiple terminals 110 are arranged in an array and do not exceed the coverage area of the light emitting device layer 1510.
  • the terminal 110 for leading from the light emitting device 150 can be effectively provided.
  • it is also conducive to the miniaturization of the terminal connection structure.
  • the electrical connection layer 130 may include at least two electrical connection layers; each of the at least two electrical connection layers can be electrically connected to the multiple light-emitting devices 150 through the multiple light-emitting device-side conductive holes 140, and both can be electrically connected through the multiple light-emitting device-side conductive holes 140.
  • Each terminal-side conductive hole 120 is electrically connected to the plurality of terminals 110.
  • the plurality of terminals 110 may not exceed the longitudinal projection range of the light emitting device layer 1510.
  • the coverage area of the light-emitting device layer 1510 may be expressed as a longitudinal projection area of the light-emitting device layer 1510.
  • the light emitting device layer 1510 represented by a dashed frame may represent the longitudinal projection range of the light emitting device layer 1510.
  • the longitudinal projection range of the light emitting device layer 1510 may be smaller than the coverage range of the electrical connection layer 130.
  • the longitudinal projection range of the light emitting device layer 1510 and the coverage range of the electrical connection layer 130 may be the same.
  • the longitudinal projection range of the light emitting device layer 1510 may be larger than the coverage range of the electrical connection layer 130.
  • the relationship between the coverage area of the light emitting device layer 1510 and the coverage area of the electrical connection layer 130 may be considered according to actual conditions such as process requirements.
  • the plurality of terminals 110 may not exceed the longitudinal projection range of the surface 1520 defined by part or all of the light emitting devices 150 in the light emitting device layer 1510.
  • the longitudinal projection range of the surface 1520 defined by part of the light emitting devices 150 in the light emitting device layer 1510 is within the coverage range of the light emitting device layer 1510.
  • the longitudinal projection range of the surface 1520 defined by all the light emitting devices 150 in the light emitting device layer 1510 may be within the coverage of the light emitting device layer 1510, or may be the same as the coverage of the light emitting device layer 1510.
  • At least one terminal 110 of the plurality of terminals 110 may be located at the edge of the coverage of the light emitting device layer 1510.
  • the two leftmost terminals 110 are located at the left edge of the coverage area of the light emitting device layer 1510, for example: The edges are aligned; the two terminals 110 on the far right are located at the right edges of the coverage of the light emitting device layer 1510, for example, the right edges of the two terminals 110 on the far right are aligned with the right edges of the coverage of the light emitting device layer 1510.
  • the number and positions of the terminals 110 may be considered according to actual conditions such as process requirements.
  • none of the plurality of terminals 110 may be located at the edge of the coverage of the light emitting device layer 1510.
  • the center A of the at least one terminal 110 located at the edge of the coverage of the light emitting device layer 1510 may not be aligned with the center B of the at least one terminal-side conductive hole 120 connected to the at least one terminal 110.
  • the rightmost terminal 110 is located at the edge of the coverage of the light emitting device layer 1510, and the center A of the terminal 110 (represented in the form of a centerline, which may also be referred to as an axis) is connected to the terminal 110.
  • the center B (represented in the form of a center line, which may also be referred to as an axis) of the terminal-side conductive hole 120 is not on the same vertical straight line.
  • the center A of the at least one terminal 110 located at the edge of the coverage of the light emitting device layer 1510 may be aligned with the center B of the at least one terminal-side conductive hole 120 connected to the at least one terminal 110.
  • the center A of the at least one terminal 110 located within the coverage of the light emitting device layer 1510 may be aligned with the center B of the at least one terminal-side conductive hole 120 connected to the at least one terminal 110, or not aligned.
  • the alignment relationship between the center A of the terminal 110 and the center B of the terminal-side conductive hole 120 may be considered according to actual conditions such as process requirements.
  • At least one terminal 110 located at the edge of the coverage of the light emitting device layer 1510 may have a shape different from other parts or all of the terminals 110.
  • the shapes of some or all of the terminals 110 among the plurality of terminals 110 may be the same or different.
  • the shape of the terminal 110 may refer to the shape of the longitudinal projection of the terminal 110.
  • the shape of at least one terminal 110 of the plurality of terminals 110 may be rectangular, circular, spherical, etc., and other shapes such as polygonal, irregular shape, etc. may also be set according to actual conditions such as process requirements.
  • At least one terminal 110 located at the edge of the coverage of the light emitting device layer 1510 may have an area different from other parts or all of the terminals 110.
  • the circular terminal 110 is located at the edge of the coverage of the light emitting device layer 1510, and the area of the circular terminal 110 may be smaller than the area of other parts or all of the terminals 110.
  • At least one terminal 110 of the plurality of terminals 110 may have an area different from other parts or all of the terminals 110, for example: At least one terminal 110 at the edge of the coverage area of the light emitting device layer 1510 may have an area different from some or all of the other terminals 110; or, at least one terminal 110 located within the coverage area of the light emitting device layer 1510 may have a different area The area of part or all of the terminal 110.
  • At least one terminal 110 located at the edge of the coverage area of the light emitting device layer 1510 may have an area larger or smaller than part or all of the other terminals 110; or, at least one terminal 110 located within the coverage area of the light emitting device layer 1510 , May have an area larger or smaller than other part or all of the terminals 110.
  • the area of some or all of the terminals 110 in the plurality of terminals 110 may be the same.
  • the distance d between the at least one terminal 110 located at the edge of the coverage of the light emitting device layer 1510 and the adjacent at least one terminal 110 may be different from the average distance D between the terminals 110.
  • the distance between the two lowermost terminals 110 is the average distance D between the terminals 110
  • the two rightmost terminals 110 are located at the edge of the coverage of the light emitting device layer 1510
  • the rightmost The distance d between the two terminals 110 may be greater than the average distance D between the terminals 110.
  • the distance d between the two rightmost terminals 110 may be smaller than the average distance D between the terminals 110.
  • the distance d between the two leftmost terminals 110 may be larger or smaller than the average distance D between the terminals 110.
  • the spacing d between the terminals 110 at different positions can be flexibly set according to actual conditions such as process requirements.
  • the above-mentioned at least two electrical connection layers may include a light-emitting device side electrical connection layer 131 and a terminal side electrical connection layer 132.
  • the plurality of light-emitting device-side conductive holes 140 may include a plurality of first light-emitting device conductive holes 141 and second light-emitting device conductive holes 142.
  • the light-emitting device-side electrical connection layer 131 can be electrically connected to the plurality of light-emitting devices 150 through the plurality of first light-emitting device conductive holes 141; the terminal-side electrical connection layer 132 can be electrically connected to the plurality of second light-emitting device conductive holes 142 It is electrically connected to a plurality of light emitting devices 150.
  • At least one of the plurality of light emitting devices 150 may include a first electrode 151 and a second electrode 152.
  • the light-emitting device-side electrical connection layer 131 can be electrically connected to the first electrode 151 through at least one of the plurality of first light-emitting device conductive holes 141; the terminal-side electrical connection layer 132 can be electrically connected to the first electrode 151 through the plurality of second light-emitting devices At least one of the conductive holes 142 is electrically connected to the second electrode 152.
  • each light emitting device 150 of the plurality of light emitting devices 150 may include a first electrode 151 and a second electrode 152.
  • the light-emitting device-side electrical connection layer 131 can be electrically connected to the first electrodes 151 of different light-emitting devices 150 among the plurality of light-emitting devices 150 through the plurality of first light-emitting device conductive holes 141; the terminal-side electrical connection layer 132 It can be electrically connected to the second electrodes 152 of different light emitting devices 150 of the plurality of light emitting devices 150 through the plurality of second light emitting device conductive holes 142, respectively.
  • a terminal side electrical connection layer 132 and a light emitting device side electrical connection layer 131 may be sequentially provided.
  • the terminal connection structure may further include at least one of the following insulating layers:
  • An insulating layer 160 that isolates the plurality of terminals 110 from the terminal-side electrical connection layer 132;
  • An insulating layer 180 that isolates the light-emitting device side electrical connection layer 131 from the plurality of light-emitting devices 150.
  • At least one of the insulating layer 160, the insulating layer 170, and the insulating layer 180 may include at least one layer of insulating structure.
  • the plurality of terminal-side conductive holes 120 may include a plurality of first terminal conductive holes 121 and a plurality of second terminal conductive holes 122.
  • the light emitting device side electrical connection layer 131 may be electrically connected to the plurality of terminals 110 through a plurality of first terminal conductive holes 121; the terminal side electrical connection layer 132 may be electrically connected to a plurality of terminals 110 through a plurality of second terminal conductive holes 122 The terminal 110 is electrically connected.
  • the plurality of terminals 110 may include at least one first terminal 111 and at least one second terminal 112.
  • the light-emitting device side electrical connection layer 131 may be electrically connected to at least one first terminal 111 through at least one of the plurality of first terminal conductive holes 121; the terminal side electrical connection layer 132 may be electrically connected to the at least one first terminal 111 through a plurality of second terminals At least one of the conductive holes 122 is electrically connected to at least one second terminal 112.
  • the at least one first terminal 111 described above may include a plurality of first terminals 111, and the at least one second terminal 112 described above may include a plurality of second terminals 112.
  • the light-emitting device-side electrical connection layer 131 may be electrically connected to the plurality of first terminals 111 through a plurality of first terminal conductive holes 121; the terminal-side electrical connection layer 132 may be electrically connected to a plurality of second terminal conductive holes 122. They are electrically connected to a plurality of second terminals 112 respectively.
  • At least one of the light-emitting device-side electrical connection layer 131 and the terminal-side electrical connection layer 132 may be arranged in the following manner:
  • the light-emitting device-side electrical connection layer 131 includes at least one layer of light-emitting device-side conductive traces 1311;
  • the terminal-side electrical connection layer 132 includes at least one layer of terminal-side conductive traces 1321.
  • each line segment in the light-emitting device-side electrical connection layer 131 represents a layer of light-emitting device-side conductive traces 1311.
  • each line segment in the terminal-side electrical connection layer 132 represents a layer of terminal-side conductive traces 1321.
  • At least one of the light-emitting device-side conductive trace 1311 and the terminal-side conductive trace 1321 may be arranged in an array.
  • At least one of the light-emitting device-side conductive traces 1311 and the terminal-side conductive traces 1321 may be arranged in an array in the form of rows or columns.
  • the light-emitting device-side conductive traces 1311 may be arranged in an array in the form of rows, and the terminal-side conductive traces 1321 may be arranged in an array in the form of columns.
  • the light-emitting device-side conductive traces 1311 may be arranged in an array in the form of columns, and the terminal-side conductive traces 1321 may be arranged in an array in the form of rows.
  • the array arrangement of the light-emitting device-side conductive traces 1311 and the terminal-side conductive traces 1321 may be determinant. In some embodiments, the array arrangement of the light-emitting device-side conductive traces 1311 and the terminal-side conductive traces 1321 may be different from that shown in FIG. Array arrangement such as ellipse and triangle. Optionally, regardless of the array arrangement of the light-emitting device-side conductive traces 1311 and the terminal-side conductive traces 1321, as long as the multiple terminals 110 for leading from the light-emitting device 150 can be effectively provided.
  • each of the terminal-side conductive traces 1321 may be electrically connected to at least one terminal 110 of the plurality of terminals 110.
  • each of the light-emitting device-side conductive traces 1311 may be electrically connected to at least one terminal 110 of the plurality of terminals 110.
  • each of the terminal-side conductive traces 1321 may be electrically connected to one of the second terminals 112 of the plurality of second terminals 112, so that different traces in the terminal-side conductive traces 1321 can be connected to each other. It is electrically connected to a different second terminal 112 among the plurality of second terminals 112.
  • each of the terminal-side conductive traces 1321 may be electrically connected to at least two second terminals 112 of the plurality of second terminals 112 to provide a connection between the second terminal 112 and the terminal-side conductive trace 1321 Backup of electrical connections.
  • each of the conductive traces 1311 on the light-emitting device side may be electrically connected to one of the first terminals 111 of the plurality of first terminals 111, so that different traces in the conductive trace 1311 on the light-emitting device side can be electrically connected.
  • the wires are respectively electrically connected to different first terminals 111 among the plurality of first terminals 111.
  • each of the light-emitting device-side conductive traces 1311 may be electrically connected to at least two first terminals 111 of the plurality of first terminals 111 to provide the first terminal 111 and the light-emitting device-side conductive trace Backup of electrical connections between 1311.
  • At least one terminal 110 of the plurality of terminals 110 may cover at least one terminal-side conductive hole 120 of the plurality of terminal-side conductive holes 120, for example: at least one terminal of the plurality of terminals 110 The 110 may cover at least one of the terminal-side conductive holes 120 to which the terminal 110 is electrically connected.
  • At least one terminal 110 of the plurality of terminals 110 may cover part or all of at least one terminal-side conductive hole 120 in the plurality of terminal-side conductive holes 120, for example: at least one terminal of the plurality of terminals 110 110 may cover part or all of at least one terminal-side conductive hole 120 among the plurality of terminal-side conductive holes 120 to which the terminal 110 is electrically connected. Optionally, at least one terminal 110 of the plurality of terminals 110 may not cover at least one of the terminal-side conductive holes 120 to which the terminal 110 is electrically connected.
  • terminal 110 covers the terminal-side conductive hole 120, and whether the terminal 110 covers part or all of the terminal-side conductive hole 120, as long as the electrical connection between the terminal 110 and the terminal-side conductive hole 120 can be effectively achieved, It is only necessary to provide a plurality of terminals 110 for leading from the light emitting device 150.
  • some or all of the terminals 110 of the plurality of terminals 110 may be arranged at equal intervals.
  • Some of the terminals 110 of the terminals 110 may be arranged at equal intervals, other terminals 110 may be arranged at non-equal intervals, or all the terminals 110 of the plurality of terminals 110 may be arranged at non-equal intervals.
  • parts of the plurality of terminals 110 may be arranged in an array.
  • all of the multiple terminals 110 may be arranged in an array.
  • the array arrangement of the multiple terminals 110 may be a matrix, for example, a determinant.
  • the array arrangement of the plurality of terminals 110 may be different from that shown in FIG. 1B, but an arrangement of other array shapes, such as circular, elliptical, and triangular array arrangements.
  • an arrangement of other array shapes such as circular, elliptical, and triangular array arrangements.
  • the shapes of some or all of the terminals 110 among the plurality of terminals 110 may be the same or different.
  • the shape of the terminal 110 may refer to the shape of the surface of the terminal 110.
  • the shape of at least one terminal 110 of the plurality of terminals 110 may be rectangular, circular, spherical, etc., and other shapes such as polygonal, irregular shape, etc. may also be set according to actual conditions such as process requirements.
  • an embodiment of the present disclosure provides a display unit 200 including a plurality of light emitting devices 150 and the above-mentioned terminal connection structure.
  • the plurality of light emitting devices 150 may include at least one light emitting diode (LED) light emitting device 153, for example, some or all of the plurality of light emitting devices 150 may be LED light emitting devices 153.
  • LED light emitting diode
  • the at least one LED light emitting device 153 may include at least one Micro LED light emitting device 154.
  • some or all of the plurality of light emitting devices 150 may be Micro LED light emitting devices 154.
  • the at least one LED light emitting device 153 may include at least one Mini LED light emitting device.
  • some or all of the multiple light emitting devices 150 may be Mini LED light emitting devices.
  • a plurality of light emitting devices 150 may be arranged in an array.
  • parts of the plurality of light emitting devices 150 may be arranged in an array.
  • all of the plurality of light emitting devices 150 may be arranged in an array.
  • the array arrangement of the plurality of light emitting devices 150 may be a matrix type, for example, a determinant type.
  • the array arrangement of the plurality of light-emitting devices 150 may be different from that shown in FIG. 19, but in other array shapes, such as circular, elliptical, triangular, etc. array arrangements. .
  • the array arrangement of the plurality of light-emitting devices 150 regardless of the array arrangement of the plurality of light-emitting devices 150, as long as the plurality of terminals 110 leading from the light-emitting devices 150 can be effectively provided.
  • the shapes of some or all of the light emitting devices 150 in the plurality of light emitting devices 150 may be the same or different.
  • the shape of the light emitting device 150 may refer to the shape of the longitudinal projection of the light emitting device 150.
  • the shape of at least one light-emitting device 150 among the plurality of light-emitting devices 150 may be rectangular, circular, spherical, etc., and other shapes such as polygonal, irregular shape, etc. may also be set according to actual conditions such as process requirements.
  • the display unit 200 may perform 3D display.
  • different display units 200 may be spliced together.
  • the manner in which different display units 200 are spliced together and the number of display units 200 to be spliced can be considered according to actual conditions such as process requirements.
  • an embodiment of the present disclosure provides a display 300 including the above-mentioned display unit 200.
  • the display 300 can perform 3D display.
  • the display 300 may include at least one display unit 200; for example, the display 300 may include one, two, three, or more display units 200. In the display 300 formed by the display unit 200, there is no wire frame between two display units 200 that are spliced together.
  • part or all of the plurality of display units 200 provided in the display 300 may be arranged in an array.
  • the array arrangement of the plurality of display units 200 may be a matrix, such as a determinant.
  • the array arrangement of the plurality of display units 200 may be different from that shown in FIG. 20B, but in other array shapes, such as circular, elliptical, triangular, etc. array arrangements. .
  • different display units 200 provided in the display 300 may be spliced together.
  • the manner in which different display units 200 are spliced together and the number of spliced display units 200 may be considered according to actual conditions such as process requirements.
  • terminal connection structure, display unit and display provided by the embodiments of the present disclosure, even when the size of the light emitting device is very small, a terminal for leading from the light emitting device can be effectively provided.
  • the first element can be called the second element, and likewise, the second element can be called the first element, as long as all occurrences of the "first element” are renamed consistently and all occurrences "Second component” can be renamed consistently.
  • the first element and the second element are both elements, but they may not be the same element.
  • the terms used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and claims, unless the context clearly indicates, the singular forms "a” (a), “an” (an) and “the” (the) are intended to also include plural forms .
  • the term “and/or” as used in this application refers to any and all possible combinations that include one or more of the associated lists.
  • the term “comprise” (comprise) and its variants “comprises” and/or including (comprising) and the like refer to the stated features, wholes, steps, operations, elements, and/or The existence of components does not exclude the existence or addition of one or more other features, wholes, steps, operations, elements, components, and/or groups of these. If there are no more restrictions, the element defined by the sentence “including a" does not exclude the existence of other identical elements in the process, method, or device that includes the element.
  • each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.
  • the methods, products, etc. disclosed in the embodiments if they correspond to the method parts disclosed in the embodiments, then the related parts can be referred to the description of the method parts.
  • the disclosed methods and products can be implemented in other ways.
  • the device embodiments described above are merely illustrative.
  • the division of units may only be a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or may be Integrate into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to implement this embodiment.
  • the functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.

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Abstract

本申请涉及光学技术领域，公开了一种端子连接结构，包括：多个端子、多个端子侧导电孔、电连接层、以及多个发光器件侧导电孔；其中，电连接层能够通过多个发光器件侧导电孔与发光器件层中的多个发光器件电连接，以及通过多个端子侧导电孔与多个端子电连接；多个端子呈阵列排布且不超出发光器件层的覆盖范围。上述的端子连接结构，使得即使发光器件的尺寸非常小，也可以有效设置用于从发光器件引线的端子。本申请还公开了一种显示单元和显示器。

Description

端子连接结构、显示单元及显示器
本申请要求在2020年04月08日提交中国知识产权局、申请号为202010269351.8、发明名称为“端子连接结构、显示单元及显示器”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光学技术领域，例如涉及一种端子连接结构、显示单元及显示器。
背景技术
为了实现对发光器件的控制，需要设置用于从发光器件引线的端子。
在实现本公开实施例的过程中，发现相关技术中至少存在如下问题：
当发光器件的尺寸非常小时，尚不存在设置用于从发光器件引线的端子的技术方案。
发明内容
为了对披露的实施例的一些方面有基本的理解，下面给出了简单的概括。该概括不是泛泛评述，也不是要确定关键/重要组成元素或描绘这些实施例的保护范围，而是作为后面的详细说明的序言。
本公开实施例提供了一种端子连接结构、显示单元及显示器，以解决不存在设置用于从发光器件引线的端子的技术方案的技术问题。
本公开实施例提供的端子连接结构，包括：多个端子、多个端子侧导电孔、电连接层、以及多个发光器件侧导电孔；其中，
电连接层能够通过多个发光器件侧导电孔与发光器件层中的多个发光器件电连接，以及通过多个端子侧导电孔与多个端子电连接；
多个端子呈阵列排布且不超出发光器件层的覆盖范围。
在一些实施例中，多个端子可以不超出发光器件层的纵向投影范围。
在一些实施例中，多个端子可以不超出发光器件层中的部分或全部发光器件所限定的面的纵向投影范围。
在一些实施例中，多个端子中的至少一个端子可以位于发光器件层的覆盖范围的边缘。可选地，多个端子中可以没有端子位于发光器件层的覆盖范围的边缘。
在一些实施例中，位于发光器件层的覆盖范围的边缘的至少一个端子的中心，可以与 连接至少一个端子的至少一个端子侧导电孔的中心不对位。
在一些实施例中，位于发光器件层的覆盖范围的边缘的至少一个端子，可以具有不同于其他部分或全部端子的形状。
在一些实施例中，位于发光器件层的覆盖范围的边缘的至少一个端子，可以具有不同于其他部分或全部端子的面积。
在一些实施例中，位于发光器件层的覆盖范围的边缘的至少一个端子，与相邻的至少一个端子之间的间距，可以不同于端子间平均间距。
在一些实施例中，电连接层可以包括至少两层电连接层；至少两层电连接层均能够通过多个发光器件侧导电孔与多个发光器件电连接，以及均通过多个端子侧导电孔与多个端子电连接。
在一些实施例中，至少两层电连接层可以包括发光器件侧电连接层、端子侧电连接层；多个发光器件侧导电孔可以包括多个第一发光器件导电孔、第二发光器件导电孔。
在一些实施例中，发光器件侧电连接层能够通过多个第一发光器件导电孔与多个发光器件电连接。可选地，端子侧电连接层能够通过多个第二发光器件导电孔与多个发光器件电连接。
在一些实施例中，多个发光器件中的至少一个包括第一电极、第二电极。
在一些实施例中，发光器件侧电连接层能够通过多个第一发光器件导电孔中的至少一个与第一电极电连接。可选地，端子侧电连接层能够通过多个第二发光器件导电孔中的至少一个与第二电极电连接。
在一些实施例中，多个发光器件中的每个发光器件可以包括第一电极、第二电极。
在一些实施例中，发光器件侧电连接层能够通过多个第一发光器件导电孔分别与多个发光器件中不同发光器件的第一电极电连接。可选地，端子侧电连接层能够通过多个第二发光器件导电孔分别与多个发光器件中不同发光器件的第二电极电连接。
在一些实施例中，从多个端子向多个发光器件，可以依次设置有：端子侧电连接层、发光器件侧电连接层。
在一些实施例中，端子连接结构还可以包括以下至少之一的绝缘层：
将多个端子与端子侧电连接层相隔离的绝缘层；
将端子侧电连接层与发光器件侧电连接层相隔离的绝缘层；
将发光器件侧电连接层与多个发光器件相隔离的绝缘层。
在一些实施例中，多个端子侧导电孔可以包括多个第一端子导电孔、多个第二端子导电孔。
在一些实施例中，发光器件侧电连接层可以通过多个第一端子导电孔与多个端子电连接。可选地，端子侧电连接层可以通过多个第二端子导电孔与多个端子电连接。
在一些实施例中，多个端子可以包括至少一个第一端子、至少一个第二端子。
在一些实施例中，发光器件侧电连接层可以通过多个第一端子导电孔中的至少一个与至少一个第一端子电连接。可选地，端子侧电连接层可以通过多个第二端子导电孔中的至少一个与至少一个第二端子电连接。
在一些实施例中，至少一个第一端子可以包括多个第一端子，至少一个第二端子包括多个第二端子。
在一些实施例中，发光器件侧电连接层可以通过多个第一端子导电孔分别与多个第一端子电连接。可选地，端子侧电连接层可以通过多个第二端子导电孔分别与多个第二端子电连接。
在一些实施例中，发光器件侧电连接层和端子侧电连接层中至少之一，可以以如下方式设置：
发光器件侧电连接层包括至少一层的发光器件侧导电走线；
端子侧电连接层包括至少一层的端子侧导电走线。
在一些实施例中，发光器件侧导电走线和端子侧导电走线中至少之一可以呈阵列排布。
在一些实施例中，发光器件侧导电走线和端子侧导电走线中至少之一可以以行或列的形式呈阵列排布。
在一些实施例中，发光器件侧导电走线可以以行的形式呈阵列排布，端子侧导电走线可以以列的形式呈阵列排布。可选地，发光器件侧导电走线可以以列的形式呈阵列排布，端子侧导电走线可以以行的形式呈阵列排布。
在一些实施例中，端子侧导电走线中的每条走线可以与多个端子中的至少一个端子电连接。可选地，发光器件侧导电走线中的每条走线可以与多个端子中的至少一个端子电连接。
在一些实施例中，多个端子中的至少一个端子可以覆盖多个端子侧导电孔中的至少一个端子侧导电孔。
在一些实施例中，多个端子中的部分或全部端子之间可以等间距设置。
在一些实施例中，多个端子中的部分可以呈阵列排布。可选地，多个端子全部可以呈阵列排布。
本公开实施例提供的显示单元，包括多个发光器件，以及上述的端子连接结构。
在一些实施例中，多个发光器件可以包括至少一个发光二极管(LED)发光器件。
在一些实施例中，至少一个LED发光器件可以包括至少一个微(Micro)LED发光器件。
在一些实施例中，多个发光器件可以呈阵列排布。
在一些实施例中，多个发光器件中的部分可以呈阵列排布。可选地，多个发光器件全部可以呈阵列排布。
本公开实施例提供的显示器，包括上述的显示单元。
本公开实施例提供的端子连接结构、显示单元及显示器，可以实现以下技术效果：
即使发光器件的尺寸非常小，也可以有效设置用于从发光器件引线的端子。
以上的总体描述和下文中的描述仅是示例性和解释性的，不用于限制本申请。
附图说明
一个或多个实施例通过与之对应的附图进行示例性说明，这些示例性说明和附图并不构成对实施例的限定，附图中具有相同参考数字标号的元件示为类似的元件，附图不构成比例限制，并且其中：
图1A、图1B是本公开实施例提供的端子连接结构的结构示意图；
图2是本公开实施例提供的端子连接结构的另一结构示意图；
图3是本公开实施例提供的端子连接结构的另一结构示意图；
图4是本公开实施例提供的端子连接结构的另一结构示意图；
图5是本公开实施例提供的端子连接结构的另一结构示意图；
图6是本公开实施例提供的端子连接结构的另一结构示意图；
图7是本公开实施例提供的端子连接结构的另一结构示意图；
图8是本公开实施例提供的端子连接结构的另一结构示意图；
图9是本公开实施例提供的端子连接结构的另一结构示意图；
图10是本公开实施例提供的端子连接结构的另一结构示意图；
图11是本公开实施例提供的端子连接结构的另一结构示意图；
图12是本公开实施例提供的端子连接结构的另一结构示意图；
图13是本公开实施例提供的端子连接结构的另一结构示意图；
图14A、图14B是本公开实施例提供的发光器件侧电连接层、端子侧电连接层的结构示意图；
图15A、图15B、图15C、图15D是本公开实施例提供的发光器件侧导电走线、端子侧导电走线的设置示意图；
图16是本公开实施例提供的显示单元的结构示意图；
图17是本公开实施例提供的显示单元的另一结构示意图；
图18是本公开实施例提供的显示单元的另一结构示意图；
图19是本公开实施例提供的显示单元的另一结构示意图；
图20A、图20B是本公开实施例提供的显示器的结构示意图。
附图标记：
110：端子；A：中心；111：第一端子；112：第二端子；120：端子侧导电孔；B：中心；d：间距；D：平均间距；121：第一端子导电孔；122：第二端子导电孔；130：电连接层；131：发光器件侧电连接层；1311：发光器件侧导电走线；132：端子侧电连接层；1321：端子侧导电走线；140：发光器件侧导电孔；141：第一发光器件导电孔；142：第二发光器件导电孔；150：发光器件；1510：发光器件层；1520：面；151：第一电极；152：第二电极；153：LED发光器件；154：Micro LED发光器件；160：绝缘层；170：绝缘层；180：绝缘层；200：显示单元；300：显示器。
具体实施方式
为了能够更加详尽地了解本公开实施例的特点与技术内容，下面结合附图对本公开实施例的实现进行详细阐述，所附附图仅供参考说明之用，并非用来限定本公开实施例。在以下的技术描述中，为方便解释起见，通过多个细节以提供对所披露实施例的充分理解。然而，在没有这些细节的情况下，一个或多个实施例仍然可以实施。在其它情况下，为简化附图，熟知的结构和装置可以简化展示。
参见图1A、图1B，本公开实施例提供了一种端子连接结构，包括：多个端子110、多个端子侧导电孔120、电连接层130、以及多个发光器件侧导电孔140；其中，
电连接层130能够通过多个发光器件侧导电孔140与发光器件层1510中的多个发光器件150电连接，以及通过多个端子侧导电孔120与多个端子110电连接；
多个端子110呈阵列排布且不超出发光器件层1510的覆盖范围。
这样，即使发光器件150的尺寸非常小，也可以有效设置用于从发光器件150引线的端子110。另外，还有利于端子连接结构的小型化。
在一些实施例中，电连接层130可以包括至少两层电连接层；该至少两层电连接层均能够通过多个发光器件侧导电孔140与多个发光器件150电连接，以及均通过多个端子侧导电孔120与多个端子110电连接。
参见图1B，在一些实施例中，多个端子110可以不超出发光器件层1510的纵向投影范围。在一些实施例中，发光器件层1510的覆盖范围可以表示为发光器件层1510的纵向投影范围。可选地，以虚线框表示的发光器件层1510可以代表发光器件层1510的纵向投影范围。
如图1B所示，发光器件层1510的纵向投影范围可以小于电连接层130的覆盖范围。在一些实施例中，发光器件层1510的纵向投影范围与电连接层130的覆盖范围可以相同。可选地，发光器件层1510的纵向投影范围可以大于电连接层130的覆盖范围。可选地，可以根据工艺需求等实际情况，考虑发光器件层1510的覆盖范围与电连接层130的覆盖范围之间的关系。
参见图2，在一些实施例中，多个端子110可以不超出发光器件层1510中的部分或全部发光器件150所限定的面1520的纵向投影范围。在一些实施例中，发光器件层1510中的部分发光器件150所限定的面1520的纵向投影范围在发光器件层1510的覆盖范围内。可选地，发光器件层1510中的全部发光器件150所限定的面1520的纵向投影范围可以在发光器件层1510的覆盖范围内，或可以与发光器件层1510的覆盖范围相同。
参见图3，在一些实施例中，多个端子110中的至少一个端子110可以位于发光器件层1510的覆盖范围的边缘。如图3中所示，最左侧的两个端子110位于发光器件层1510的覆盖范围的左边缘，例如：最左侧的两个端子110的左边缘与发光器件层1510的覆盖范围的左边缘对齐；最右侧的两个端子110位于发光器件层1510的覆盖范围的右边缘，例如：最右侧的两个端子110的右边缘与发光器件层1510的覆盖范围的右边缘对齐。可选地，针对位于发光器件层1510的覆盖范围的边缘的端子110，可以根据工艺需求等实际情况对该端子110的数量和位置予以考虑。
在一些实施例中，可以如图1B中所示，多个端子110中可以没有端子110位于发光器件层1510的覆盖范围的边缘。
参见图4，在一些实施例中，位于发光器件层1510的覆盖范围的边缘的至少一个端子110的中心A，可以与连接至少一个端子110的至少一个端子侧导电孔120的中心B不对位。如图4中所示，最右侧的端子110位于发光器件层1510的覆盖范围的边缘，该端子110的中心A(以中心线的形式表示，也可以称为轴线)与连接该端子110的端子侧导电孔120的中心B(以中心线的形式表示，也可以称为轴线)不在同一条竖直的直线上。
在一些实施例中，位于发光器件层1510的覆盖范围的边缘的至少一个端子110的中心A，可以与连接至少一个端子110的至少一个端子侧导电孔120的中心B对位。可选地，位于发光器件层1510的覆盖范围内的至少一个端子110的中心A，可以与连接至少一个 端子110的至少一个端子侧导电孔120的中心B对位，或不对位。可选地，可以根据工艺需求等实际情况考虑端子110的中心A与端子侧导电孔120的中心B之间的对位关系。
参见图5，在一些实施例中，位于发光器件层1510的覆盖范围的边缘的至少一个端子110，可以具有不同于其他部分或全部端子110的形状。在一些实施例中，多个端子110中部分或全部端子110的形状可以相同或不同。可选地，由于端子110的厚度通常非常小，因此端子110的形状可以是指端子110的纵向投影的形状。可选地，多个端子110中至少一个端子110的形状可以为矩形、圆形、球形等，也可以根据工艺需求等实际情况设置多边形、异形等其他形状。
在一些实施例中，位于发光器件层1510的覆盖范围的边缘的至少一个端子110，可以具有不同于其他部分或全部端子110的面积。例如：如图5中所示，形状为圆形的端子110位于发光器件层1510的覆盖范围的边缘，该圆形的端子110的面积可以小于其他部分或全部端子110的面积。
在一些实施例中，无论多个端子110中的部分或全部端子110的形状是否相同，多个端子110中的至少一个端子110，可以具有不同于其他部分或全部端子110的面积，例如：位于发光器件层1510的覆盖范围的边缘的至少一个端子110，可以具有不同于其他部分或全部端子110的面积；或，位于发光器件层1510的覆盖范围内的至少一个端子110，可以具有不同于其他部分或全部端子110的面积。可选地，位于发光器件层1510的覆盖范围的边缘的至少一个端子110，可以具有大于或小于其他部分或全部端子110的面积；或，位于发光器件层1510的覆盖范围内的至少一个端子110，可以具有大于或小于其他部分或全部端子110的面积。在一些实施例中，多个端子110中的部分或全部端子110的面积可以相同。
参见图6，在一些实施例中，位于发光器件层1510的覆盖范围的边缘的至少一个端子110，与相邻的至少一个端子110之间的间距d，可以不同于端子110间平均间距D。如图6中所示，假设最下侧的两个端子110之间的间距为端子110间平均间距D，最右侧的两个端子110位于发光器件层1510的覆盖范围的边缘，最右侧的两个端子110之间的间距d可以大于端子110间平均间距D。可选地，最右侧的两个端子110之间的间距d可以小于端子110间平均间距D。在一些实施例中，最左侧的两个端子110之间的间距d可以大于或小于端子110间平均间距D。可选地，可以根据工艺需求等实际情况灵活设置位于不同位置的端子110之间的间距d。
参见图7，在一些实施例中，上述的至少两层电连接层可以包括发光器件侧电连接层131、端子侧电连接层132。可选地，多个发光器件侧导电孔140可以包括多个第一发光器 件导电孔141、第二发光器件导电孔142。
在一些实施例中，发光器件侧电连接层131能够通过多个第一发光器件导电孔141与多个发光器件150电连接；端子侧电连接层132能够通过多个第二发光器件导电孔142与多个发光器件150电连接。
参见图8，在一些实施例中，多个发光器件150中的至少一个可以包括第一电极151、第二电极152。
在一些实施例中，发光器件侧电连接层131能够通过多个第一发光器件导电孔141中的至少一个与第一电极151电连接；端子侧电连接层132能够通过多个第二发光器件导电孔142中的至少一个与第二电极152电连接。
参见图9，在一些实施例中，多个发光器件150中的每个发光器件150可以包括第一电极151、第二电极152。
在一些实施例中，发光器件侧电连接层131能够通过多个第一发光器件导电孔141分别与多个发光器件150中不同发光器件150的第一电极151电连接；端子侧电连接层132能够通过多个第二发光器件导电孔142分别与多个发光器件150中不同发光器件150的第二电极152电连接。
在一些实施例中，从多个端子110向多个发光器件150，可以依次设置有：端子侧电连接层132、发光器件侧电连接层131。
参见图10，在一些实施例中，端子连接结构还可以包括以下至少之一的绝缘层：
将多个端子110与端子侧电连接层132相隔离的绝缘层160；
将端子侧电连接层132与发光器件侧电连接层131相隔离的绝缘层170；
将发光器件侧电连接层131与多个发光器件150相隔离的绝缘层180。
在一些实施例中，绝缘层160、绝缘层170、绝缘层180中至少之一可以包括至少一层的绝缘结构。
参见图11，在一些实施例中，多个端子侧导电孔120可以包括多个第一端子导电孔121、多个第二端子导电孔122。
在一些实施例中，发光器件侧电连接层131可以通过多个第一端子导电孔121与多个端子110电连接；端子侧电连接层132可以通过多个第二端子导电孔122与多个端子110电连接。
参见图12，在一些实施例中，多个端子110可以包括至少一个第一端子111、至少一个第二端子112。
在一些实施例中，发光器件侧电连接层131可以通过多个第一端子导电孔121中的至 少一个与至少一个第一端子111电连接；端子侧电连接层132可以通过多个第二端子导电孔122中的至少一个与至少一个第二端子112电连接。
参见图13，在一些实施例中，上述的至少一个第一端子111可以包括多个第一端子111，上述的至少一个第二端子112可以包括多个第二端子112。
在一些实施例中，发光器件侧电连接层131可以通过多个第一端子导电孔121分别与多个第一端子111电连接；端子侧电连接层132可以通过多个第二端子导电孔122分别与多个第二端子112电连接。
参见图14A、图14B，在一些实施例中，发光器件侧电连接层131和端子侧电连接层132中至少之一，可以以如下方式设置：
发光器件侧电连接层131包括至少一层的发光器件侧导电走线1311；
端子侧电连接层132包括至少一层的端子侧导电走线1321。
图14A中，在发光器件侧电连接层131中从上向下例举了不同层的发光器件侧导电走线1311。可选地，发光器件侧电连接层131中的每条线段代表一层发光器件侧导电走线1311。
图14B中，在端子侧电连接层132中从上向下例举了不同层的端子侧导电走线1321。可选地，端子侧电连接层132中的每条线段代表一层端子侧导电走线1321。
参见图15A、图15B、图15C、图15D，在一些实施例中，发光器件侧导电走线1311和端子侧导电走线1321中至少之一可以呈阵列排布。
在一些实施例中，发光器件侧导电走线1311和端子侧导电走线1321中至少之一可以以行或列的形式呈阵列排布。
如图15A、图15B中所示，在一些实施例中，发光器件侧导电走线1311可以以行的形式呈阵列排布，端子侧导电走线1321可以以列的形式呈阵列排布。如图15C、图15D中所示，在一些实施例中，发光器件侧导电走线1311可以以列的形式呈阵列排布，端子侧导电走线1321可以以行的形式呈阵列排布。
如图15A、图15B、图15C、图15D中所示，发光器件侧导电走线1311和端子侧导电走线1321的阵列排布方式可以是行列式的。在一些实施例中，发光器件侧导电走线1311和端子侧导电走线1321的阵列排布方式可以不同于图1B中所示，而是呈其他阵列形状的排布方式，例如：圆形、椭圆形、三角形等阵列排布方式。可选地，无论发光器件侧导电走线1311和端子侧导电走线1321的阵列排布方式如何，只要能够有效设置用于从发光器件150引线的多个端子110即可。
在一些实施例中，端子侧导电走线1321中的每条走线可以与多个端子110中的至少 一个端子110电连接。可选地，发光器件侧导电走线1311中的每条走线可以与多个端子110中的至少一个端子110电连接。
在一些实施例中，端子侧导电走线1321中的每条走线可以与多个第二端子112中的一个第二端子112电连接，以使端子侧导电走线1321中的不同走线分别与多个第二端子112中的不同第二端子112电连接。可选地，端子侧导电走线1321中的每条走线可以与多个第二端子112中的至少两个第二端子112电连接，以提供第二端子112与端子侧导电走线1321之间电连接的备份。
在一些实施例中，发光器件侧导电走线1311中的每条走线可以与多个第一端子111中的一个第一端子111电连接，以使发光器件侧导电走线1311中的不同走线分别与多个第一端子111中的不同第一端子111电连接。可选地，发光器件侧导电走线1311中的每条走线可以与多个第一端子111中的至少两个第一端子111电连接，以提供第一端子111与发光器件侧导电走线1311之间电连接的备份。
参见图7，在一些实施例中，多个端子110中的至少一个端子110可以覆盖多个端子侧导电孔120中的至少一个端子侧导电孔120，例如：多个端子110中的至少一个端子110可以覆盖该端子110所电连接的多个端子侧导电孔120中的至少一个端子侧导电孔120。
在一些实施例中，多个端子110中的至少一个端子110可以覆盖多个端子侧导电孔120中的至少一个端子侧导电孔120的部分或全部，例如：多个端子110中的至少一个端子110可以覆盖该端子110所电连接的多个端子侧导电孔120中的至少一个端子侧导电孔120的部分或全部。可选地，多个端子110中的至少一个端子110可以不覆盖该端子110所电连接的多个端子侧导电孔120中的至少一个端子侧导电孔120。可选地，无论端子110是否覆盖端子侧导电孔120，也无论端子110覆盖端子侧导电孔120的部分还是全部，只要能够有效实现端子110与端子侧导电孔120之间的电连接，以有效设置用于从发光器件150引线的多个端子110即可。
参见图1B，在一些实施例中，多个端子110中的部分或全部端子110之间可以等间距设置。可选地，多个端子110中的部分或全部端子110之间可以存在距离变动范围，以使多个端子110中的部分或全部端子110的位置能够根据该距离变动范围灵活设置，例如：多个端子110中的部分端子110之间可以等间距设置，其他端子110之间可以非等间距设置，或多个端子110中的全部端子110之间可以非等间距设置。
参见图1B，在一些实施例中，多个端子110中的部分可以呈阵列排布。可选地，多个端子110全部可以呈阵列排布。
如图1B中所示，无论多个端子110中的部分还是全部呈阵列排布，多个端子110的 阵列排布方式可以是矩阵式的，例如：行列式。在一些实施例中，多个端子110的阵列排布方式可以不同于图1B中所示，而是呈其他阵列形状的排布方式，例如：圆形、椭圆形、三角形等阵列排布方式。可选地，无论多个端子110的阵列排布方式如何，只要能够有效设置用于从发光器件150引线的多个端子110即可。
在一些实施例中，多个端子110中部分或全部端子110的形状可以相同或不同。可选地，由于端子110的厚度通常非常小，因此端子110的形状可以是指端子110的表面的形状。可选地，多个端子110中至少一个端子110的形状可以为矩形、圆形、球形等，也可以根据工艺需求等实际情况设置多边形、异形等其他形状。
参见图16，本公开实施例提供了一种显示单元200，包括多个发光器件150，以及上述的端子连接结构。
参见图17，在一些实施例中，多个发光器件150可以包括至少一个发光二极管(LED)发光器件153，例如：多个发光器件150中的部分或全部可以是LED发光器件153。
参见图18，在一些实施例中，至少一个LED发光器件153可以包括至少一个微(Micro)LED发光器件154，例如：多个发光器件150中的部分或全部可以是Micro LED发光器件154。可选地，至少一个LED发光器件153可以包括至少一个迷你(Mini)LED发光器件，例如：多个发光器件150中的部分或全部可以是Mini LED发光器件。
参见图19，在一些实施例中，多个发光器件150可以呈阵列排布。
在一些实施例中，多个发光器件150中的部分可以呈阵列排布。可选地，多个发光器件150全部可以呈阵列排布。
如图19中所示，无论多个发光器件150中的部分还是全部呈阵列排布，多个发光器件150的阵列排布方式可以是矩阵式的，例如：行列式。在一些实施例中，多个发光器件150的阵列排布方式可以不同于图19中所示，而是呈其他阵列形状的排布方式，例如：圆形、椭圆形、三角形等阵列排布方式。可选地，无论多个发光器件150的阵列排布方式如何，只要能够有效设置从发光器件150引线的多个端子110即可。
在一些实施例中，多个发光器件150中部分或全部发光器件150的形状可以相同或不同。可选地，由于发光器件150的厚度通常非常小，因此发光器件150的形状可以是指发光器件150的纵向投影的形状。可选地，多个发光器件150中至少一个发光器件150的形状可以为矩形、圆形、球形等，也可以根据工艺需求等实际情况设置多边形、异形等其他形状。
在一些实施例中，显示单元200可以进行3D显示。
在一些实施例中，不同的显示单元200可以拼接到一起。可选地，可以根据工艺需求 等实际情况，考虑不同的显示单元200拼接到一起的方式及所拼接的显示单元200的数量。可选地，两个拼接到一起的显示单元200之间不存在走线边框。
参见图20A、图20B，本公开实施例提供了一种显示器300，包括上述的显示单元200。
在一些实施例中，显示器300可以进行3D显示。
在一些实施例中，显示器300可以包括至少一个显示单元200；例如：显示器300可以包括一个、两个、三个或更多显示单元200。由显示单元200所构成的显示器300中，在两个拼接到一起的显示单元200之间不存在走线边框。
如图20B中所示，显示器300中设置的多个显示单元200中的部分或全部可以呈阵列排布。在一些实施例中，多个显示单元200的阵列排布方式可以是矩阵式的，例如：行列式。在一些实施例中，多个显示单元200的阵列排布方式可以不同于图20B中所示，而是呈其他阵列形状的排布方式，例如：圆形、椭圆形、三角形等阵列排布方式。
在一些实施例中，显示器300中设置的不同的显示单元200可以拼接到一起。可选地，可以根据工艺需求等实际情况，考虑不同的显示单元200拼接到一起的方式及所拼接的显示单元200的数量。可选地，两个拼接到一起的显示单元200之间可以不存在走线边框。
本公开实施例提供的端子连接结构、显示单元及显示器，即使在发光器件的尺寸非常小的情况下，也可以有效设置用于从发光器件引线的端子。
以上描述和附图充分地示出了本公开的实施例，以使本领域技术人员能够实践它们。其他实施例可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求，否则单独的部件和功能是可选的，并且操作的顺序可以变化。一些实施例的部分和特征可以被包括在或替换其他实施例的部分和特征。本公开实施例的范围包括权利要求书的整个范围，以及权利要求书的所有可获得的等同物。当用于本申请中时，虽然术语“第一”、“第二”等可能会在本申请中使用以描述各元件，但这些元件不应受到这些术语的限制。这些术语仅用于将一个元件与另一个元件区别开。比如，在不改变描述的含义的情况下，第一元件可以叫做第二元件，并且同样第，第二元件可以叫做第一元件，只要所有出现的“第一元件”一致重命名并且所有出现的“第二元件”一致重命名即可。第一元件和第二元件都是元件，但可以不是相同的元件。而且，本申请中使用的用词仅用于描述实施例并且不用于限制权利要求。如在实施例以及权利要求的描述中使用的，除非上下文清楚地表明，否则单数形式的“一个”(a)、“一个”(an)和“所述”(the)旨在同样包括复数形式。类似地，如在本申请中所使用的术语“和/或”是指包含一个或一个以上相关联的列出的任何以及所有可能的组合。另外，当用于本申请中时，术语“包括”(comprise)及其变型“包括”(comprises)和/或包括(comprising)等指陈述的特征、整体、步骤、操作、 元素，和/或组件的存在，但不排除一个或一个以上其它特征、整体、步骤、操作、元素、组件和/或这些的分组的存在或添加。在没有更多限制的情况下，由语句“包括一个…”限定的要素，并不排除在包括该要素的过程、方法或者设备中还存在另外的相同要素。本文中，每个实施例重点说明的可以是与其他实施例的不同之处，各个实施例之间相同相似部分可以互相参见。对于实施例公开的方法、产品等而言，如果其与实施例公开的方法部分相对应，那么相关之处可以参见方法部分的描述。
本领域技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，可以取决于技术方案的特定应用和设计约束条件。本领域技术人员可以对每个特定的应用来使用不同方法以实现所描述的功能，但是这种实现不应认为超出本公开实施例的范围。本领域技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
本文所披露的实施例中，所揭露的方法、产品(包括但不限于装置、设备等)，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，单元的划分，可以仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例。另外，在本公开实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。

Claims (31)

  1. 一种端子连接结构，包括：多个端子、多个端子侧导电孔、电连接层、以及多个发光器件侧导电孔；其中，
    所述电连接层能够通过所述多个发光器件侧导电孔与发光器件层中的多个发光器件电连接，以及通过所述多个端子侧导电孔与所述多个端子电连接；
    所述多个端子呈阵列排布且不超出所述发光器件层的覆盖范围。
  2. 根据权利要求1所述的端子连接结构，其中，所述多个端子不超出所述发光器件层的纵向投影范围。
  3. 根据权利要求1所述的端子连接结构，其中，所述多个端子不超出所述发光器件层中的部分或全部发光器件所限定的面的纵向投影范围。
  4. 根据权利要求1至3任一项所述的端子连接结构，其中，
    所述多个端子中的至少一个端子位于所述发光器件层的覆盖范围的边缘；或
    所述多个端子中没有端子位于所述发光器件层的覆盖范围的边缘。
  5. 根据权利要求4所述的端子连接结构，其中，位于所述发光器件层的覆盖范围的边缘的所述至少一个端子的中心，与连接所述至少一个端子的至少一个端子侧导电孔的中心不对位。
  6. 根据权利要求4所述的端子连接结构，其中，位于所述发光器件层的覆盖范围的边缘的所述至少一个端子，具有不同于其他部分或全部端子的形状。
  7. 根据权利要求6所述的端子连接结构，其中，位于所述发光器件层的覆盖范围的边缘的所述至少一个端子，具有不同于其他部分或全部端子的面积。
  8. 根据权利要求6所述的端子连接结构，其中，位于所述发光器件层的覆盖范围的边缘的所述至少一个端子，与相邻的至少一个端子之间的间距，不同于端子间平均间距。
  9. 根据权利要求1至8任一项所述的端子连接结构，其中，所述电连接层包括至少两层电连接层；所述至少两层电连接层均能够通过所述多个发光器件侧导电孔与多个发光器件电连接，以及均通过所述多个端子侧导电孔与所述多个端子电连接。
  10. 根据权利要求9所述的端子连接结构，其中，所述至少两层电连接层包括发光器件侧电连接层、端子侧电连接层；所述多个发光器件侧导电孔包括多个第一发光器件导电孔、第二发光器件导电孔；
    其中，所述发光器件侧电连接层能够通过所述多个第一发光器件导电孔与所述多个发光器件电连接；
    所述端子侧电连接层能够通过所述多个第二发光器件导电孔与所述多个发光器件电 连接。
  11. 根据权利要求10所述的端子连接结构，其中，所述多个发光器件中的至少一个包括第一电极、第二电极；
    其中，所述发光器件侧电连接层能够通过所述多个第一发光器件导电孔中的至少一个与所述第一电极电连接；
    所述端子侧电连接层能够通过所述多个第二发光器件导电孔中的至少一个与所述第二电极电连接。
  12. 根据权利要求11所述的端子连接结构，其中，所述多个发光器件中的每个发光器件包括第一电极、第二电极；
    其中，所述发光器件侧电连接层能够通过所述多个第一发光器件导电孔分别与所述多个发光器件中不同发光器件的第一电极电连接；
    所述端子侧电连接层能够通过所述多个第二发光器件导电孔分别与所述多个发光器件中不同发光器件的第二电极电连接。
  13. 根据权利要求10所述的端子连接结构，其中，从所述多个端子向所述多个发光器件，依次设置有：所述端子侧电连接层、所述发光器件侧电连接层。
  14. 根据权利要求13所述的端子连接结构，还包括以下至少之一的绝缘层：
    将所述多个端子与所述端子侧电连接层相隔离的绝缘层；
    将所述端子侧电连接层与所述发光器件侧电连接层相隔离的绝缘层；
    将所述发光器件侧电连接层与所述多个发光器件相隔离的绝缘层。
  15. 根据权利要求10至14任一项所述的端子连接结构，其中，所述多个端子侧导电孔包括多个第一端子导电孔、多个第二端子导电孔；
    其中，所述发光器件侧电连接层通过所述多个第一端子导电孔与所述多个端子电连接；
    所述端子侧电连接层通过所述多个第二端子导电孔与所述多个端子电连接。
  16. 根据权利要求15所述的端子连接结构，其中，所述多个端子包括至少一个第一端子、至少一个第二端子；
    其中，所述发光器件侧电连接层通过所述多个第一端子导电孔中的至少一个与所述至少一个第一端子电连接；
    所述端子侧电连接层通过所述多个第二端子导电孔中的至少一个与所述至少一个第二端子电连接。
  17. 根据权利要求16所述的端子连接结构，其中，所述至少一个第一端子包括多个第一端子，所述至少一个第二端子包括多个第二端子；
    其中，所述发光器件侧电连接层通过所述多个第一端子导电孔分别与所述多个第一端子电连接；
    所述端子侧电连接层通过所述多个第二端子导电孔分别与所述多个第二端子电连接。
  18. 根据权利要求10至17任一项所述的端子连接结构，其中，所述发光器件侧电连接层和所述端子侧电连接层中至少之一，以如下方式设置：
    所述发光器件侧电连接层包括至少一层的发光器件侧导电走线；
    所述端子侧电连接层包括至少一层的端子侧导电走线。
  19. 根据权利要求18所述的端子连接结构，其中，所述发光器件侧导电走线和所述端子侧导电走线中至少之一呈阵列排布。
  20. 根据权利要求19所述的端子连接结构，其中，所述发光器件侧导电走线和所述端子侧导电走线中至少之一以行或列的形式呈阵列排布。
  21. 根据权利要求20所述的端子连接结构，其中，
    所述发光器件侧导电走线以行的形式呈阵列排布，所述端子侧导电走线以列的形式呈阵列排布；或，
    所述发光器件侧导电走线以列的形式呈阵列排布，所述端子侧导电走线以行的形式呈阵列排布。
  22. 根据权利要求18所述的端子连接结构，其中，
    所述端子侧导电走线中的每条走线与所述多个端子中的至少一个端子电连接，或
    所述发光器件侧导电走线中的每条走线与所述多个端子中的至少一个端子电连接。
  23. 根据权利要求1所述的端子连接结构，其中，所述多个端子中的至少一个端子覆盖所述多个端子侧导电孔中的至少一个端子侧导电孔。
  24. 根据权利要求1所述的端子连接结构，其中，所述多个端子中的部分或全部端子之间等间距设置。
  25. 根据权利要求1所述的端子连接结构，其中，
    所述多个端子中的部分呈阵列排布；或，
    所述多个端子全部呈阵列排布。
  26. 一种显示单元，包括多个发光器件，以及如权利要求1至25任一项所述的端子连接结构。
  27. 根据权利要求26所述的显示单元，其中，所述多个发光器件包括至少一个发光二极管LED发光器件。
  28. 根据权利要求27所述的显示单元，其中，所述至少一个LED发光器件包括至少 一个微Micro LED发光器件。
  29. 根据权利要求26至28任一项所述的显示单元，其中，所述多个发光器件呈阵列排布。
  30. 根据权利要求29所述的显示单元，其中，
    所述多个发光器件中的部分呈阵列排布；或，
    所述多个发光器件全部呈阵列排布。
  31. 一种显示器，包括如权利要求26至30任一项所述的显示单元。
PCT/CN2021/085193 2020-04-08 2021-04-02 端子连接结构、显示单元及显示器 WO2021204070A1 (zh)

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