WO2021197113A1 - Optical module and network device - Google Patents

Optical module and network device Download PDF

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Publication number
WO2021197113A1
WO2021197113A1 PCT/CN2021/082212 CN2021082212W WO2021197113A1 WO 2021197113 A1 WO2021197113 A1 WO 2021197113A1 CN 2021082212 W CN2021082212 W CN 2021082212W WO 2021197113 A1 WO2021197113 A1 WO 2021197113A1
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WO
WIPO (PCT)
Prior art keywords
pins
light emitting
optical
receiving
optical module
Prior art date
Application number
PCT/CN2021/082212
Other languages
French (fr)
Chinese (zh)
Inventor
余成
张发魁
李远谋
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021197113A1 publication Critical patent/WO2021197113A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4278Electrical aspects related to pluggable or demountable opto-electronic or electronic elements

Definitions

  • This application relates to the technical field of network equipment, and in particular to an optical module and network equipment.
  • network devices such as optical line terminals and switches realize the access of optical communication devices through optical modules connected to a single board.
  • the more optical modules that can be connected to a single board the more network devices can connect The more the number of optical communication devices that are imported, the greater the capacity of the optical communication network.
  • the width of the edge of the slot connector of the module is limited, so that the number of slot connectors that can be set on the edge is limited, so that the number of optical modules that can be connected on a single board is limited, so that network devices can access The number of optical communication equipment is limited.
  • the embodiments of the present application provide an optical module and a network device, so that the network device can access a larger number of optical communication devices and increase the capacity of the optical communication network.
  • some embodiments of the present application provide an optical module, including a housing, a plurality of light emitting and receiving components, and a gold finger connector; the housing is provided with an electrical interface and a plurality of optical interfaces; and a plurality of light emitting and receiving components
  • the number of the multiple light emitting and receiving components is equal to the number of the multiple optical interfaces.
  • the multiple light emitting and receiving components correspond to the multiple optical interfaces one-to-one, and the optical connection end of each light transmitting and receiving component is connected to the The optical interfaces corresponding to the transmitting and receiving components are opposite;
  • the golden finger connector is located in the electrical interface, and the golden finger connector is electrically connected to a plurality of light transmitting and receiving components.
  • the golden finger connector includes a substrate and a plurality of pins arranged on the substrate. The multiple pins are arranged in multiple rows along the insertion direction of the golden finger connector.
  • the golden finger connector of the optical module is electrically connected to a plurality of light emitting and receiving components, and because the golden finger connector includes a substrate and a plurality of pins arranged on the substrate, a plurality of lead wires
  • the pins are arranged in multiple rows along the mating direction of the gold finger connector, so a larger number of pins can be arranged in the gold finger connector without increasing the width of the gold finger connector to make multiple light emission
  • the receiving components can share a golden finger connector, so that multiple optical transmitting and receiving components can be integrated into one optical module, so that network equipment can access multiple optical communication devices at the same time through one optical module, thereby increasing the number of network equipment.
  • the number of optical communication devices that can be accessed increases the capacity of the optical communication network.
  • the substrate has a first surface and a second surface opposite to each other, a part of the pins of the plurality of pins are disposed on the first surface, and the remaining pins of the plurality of pins are disposed on the second surface. In this way, multiple pins are scattered on the first surface and the second surface. Without increasing the width of the gold finger connector, a larger number of pins can be set on the substrate, so that the gold finger connector can connect more. A large number of optical transmitting and receiving components can further increase the number of optical communication devices that the network device can access, and increase the capacity of the optical communication network.
  • the pins on the first surface are arranged in two rows along the insertion direction of the golden finger connector, and the pins on the second surface are arranged in two rows along the insertion direction of the golden finger connector.
  • the number of rows of pins arranged on the first surface and the second surface is moderate, which can increase the capacity of the optical communication network while reducing the footprint of the socket connector on the single board.
  • the distance between two adjacent pins in each row of pins on the first surface and the second surface is 0.8 mm, and the width of each pin is 0.5 mm.
  • the number of pins in each row of pins on the first surface and the second surface are equal.
  • the number of pins in multiple rows of pins on the first surface is equal
  • the number of pins in multiple rows of pins on the second surface is equal
  • the number of pins in each row of pins on the first surface is equal to
  • the number of pins in each row of pins on the second surface is equal.
  • the pins are evenly distributed on the first surface and the second surface.
  • a larger number of pins can be set on the substrate, so that the gold finger connector can be connected to a larger number
  • the optical transmitting and receiving components can further increase the number of optical communication devices that the network equipment can access, and increase the capacity of the optical communication network.
  • the number of pins in each row of pins on the first surface and the second surface are both 11.
  • a first transition structure is provided between two rows of pins adjacent to each other in the front and rear.
  • the rows of pins are arranged at intervals, and the height of the first transition structure protruding from the surface of the substrate is equal to the height of the protruding surfaces of the two adjacent rows of pins from the substrate.
  • a row of pins near the front end of the golden finger connector is the first row of pins, and the first row of pins is The front end is uneven; among the first row of pins, the pin with the smallest distance between the front end and the front end of the golden finger connector is the first pin, and the remaining pins in the first row of pins except the first pin
  • the side of the foot close to the front end of the golden finger connector is provided with a second transition structure.
  • the height of the second transition structure protruding from the surface of the substrate is equal to the height of the first row of pins protruding from the surface of the substrate, and the second transition structure The front end of the structure is flush with the front end of the first pin. In this way, the second transition structure further plays the role of smoothing, so as to prevent the golden finger connector from being inserted into the socket connector from being stuck smoothly or stuck.
  • the multiple pins include power pins, the power pins are electrically connected to multiple light emitting and receiving components, and the electrical connection lines between the power pins and the multiple light emitting and receiving components are serially connected with a slow-start circuit
  • the multiple pins also include a power control pin, the power control pin is connected with the slow start circuit, the power control pin is used to transmit a switch control signal to the slow start circuit, and the switch control signal can control the switch of the slow start circuit. In this way, there is no need to set a slow start circuit on the single board, so that the structural complexity of the single board can be reduced.
  • the power supply pins include multiple transmitting power pins and multiple receiving power pins; the number of the multiple transmitting power pins is equal to the number of the multiple light transmitting and receiving components, and the multiple transmitting power pins are equal to the number of light transmitting and receiving components.
  • each transmitting power pin is used to supply power to the light transmitting component in the light transmitting and receiving component corresponding to the transmitting power pin; the number of multiple receiving power pins is related to the multiple light emitting The number of receiving components is equal, and multiple receiving power pins correspond to multiple light emitting and receiving components one-to-one, and each receiving power pin is used to supply the light receiving component in the light emitting and receiving component corresponding to the receiving power pin power supply.
  • each row of pins on the first surface has a ground pin, and the ground pin is located at the end of the row of pins.
  • the ground pin can play the role of electrical shielding and anti-wear protection for the signal pins in the row of pins.
  • each row of pins on the second surface has a ground pin, and the ground pin is located at the end of the row of pins.
  • the ground pin can play the role of electrical shielding and anti-wear protection for the signal pins in the row of pins.
  • a plurality of light emitting and receiving components are stacked and arranged in a direction perpendicular to the substrate.
  • the width of the entire optical module can be reduced, which is beneficial to reduce the distance between two adjacent slot connectors on a single board, so that a larger number of slot connectors can be provided on a single board to Connect a larger number of optical film blocks, thereby further increasing the number of optical communication devices that the network device can access, and increasing the capacity of the optical communication network.
  • the number of multiple light emitting and receiving components is two.
  • each light emitting and receiving component includes a light emitting component, a light receiving component, and a wavelength division multiplexer; the light emitting component includes a plurality of light emitting channels, and the light receiving component includes a plurality of light receiving channels.
  • one optical transmitting component integrates multiple optical transmitting channels, and one optical receiving component integrates multiple optical receiving channels, which can further increase the number of optical communication devices that can be accessed by network devices and increase the capacity of the optical communication network.
  • the optical transmitting component includes an optical transmitting channel with a rate of 1 Gbit/s and an optical transmitting channel with a rate of 10 Gbit/s
  • the optical receiving component includes an optical receiving channel with a rate of 1 Gbit/s and an optical receiving channel with a rate of 10 Gbit/s.
  • some embodiments of the present application provide a network device, the network device includes a single board and an optical module; the single board is provided with a slot connector; the optical module is an optical module as described in any of the above technical solutions, and the optical module The golden finger connector of the module fits into the slot connector.
  • optical module used in the network device of the embodiment of the present application is the same as the optical module described in any of the above technical solutions, the two can solve the same technical problem and achieve the same expected effect.
  • the length of the slot connector is 11.8mm ⁇ 0.5mm
  • the width of the slot connector is 11.5mm ⁇ 0.5mm
  • the height of the slot connector is 6.8mm ⁇ 0.5mm.
  • Figure 1 is a schematic structural diagram of a network device provided by some embodiments of the application.
  • FIG. 2 is a schematic structural diagram of an optical module provided by some embodiments of the application.
  • Fig. 3 is an exploded view of the optical module shown in Fig. 2;
  • FIG. 4 is a schematic structural diagram of a golden finger connector of an optical module provided by some embodiments of the application.
  • FIG. 5 is a schematic structural diagram of the golden finger connector of the optical module shown in FIG. 4 as viewed from the direction A;
  • FIG. 6 is a schematic diagram of the back structure of the golden finger connector of the optical module shown in FIG. 4;
  • FIG. 7 is a structural block diagram of an optical module provided by some embodiments of the application.
  • FIG. 8 is a schematic diagram of the structure of the first surface of the substrate of the golden finger connector of the optical module shown in FIG. 7;
  • FIG. 9 is a schematic structural diagram of the second surface of the substrate of the golden finger connector of the optical module shown in FIG. 7.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • the number of slot connectors used to connect the optical modules on the single board can be increased, so that the single board can connect more optical modules, so as to pass the More optical modules to access more optical communication equipment.
  • the number of slot connectors that can be set on the single board is limited, so that the number of optical modules that can be connected to the single board is limited.
  • the number of optical communication devices that the device can access is limited.
  • the number of bi-directional optical sub-assembly (BOSA) integrated in a single optical module can be increased, and all the optical transmitter and receiver components can share a golden finger connector to communicate with the single board. Connect with a socket connector on the.
  • a single optical module can realize the function of multiple optical modules.
  • the optical module is only connected to one slot connector on the single board. Therefore, there is no need to increase the number of slot connectors provided on the single board.
  • the width of the board is limited, which can increase the number of optical communication devices that the network device can access.
  • the number of pins of the gold finger connector is larger, the width of the gold finger connector is larger, and the width of the slot connector on the board Larger, the slot connector occupies a larger width on the single board, so the number of optical communication devices that the network device can access is still limited by the width of the single board.
  • an embodiment of the present application provides a network device, which includes, but is not limited to, an optical line terminal and a switch.
  • FIG. 1 is a schematic diagram of the structure of a network device provided by some embodiments of the application.
  • the network equipment includes a single board 1 and an optical module 2.
  • the single board 1 is also a circuit board, and the single board 1 has a complete set of circuits capable of realizing the functions of a network device.
  • the single board 1 is provided with a slot connector 11, and the number of the slot connector 11 is at least one.
  • FIG. 1 only shows an embodiment in which the number of the slot connector 11 is three, and does not affect the number of the slot connector 11 The quantity is limited.
  • the number of optical modules 2 is at least one, the number of at least one optical module 2 is equal to the number of at least one slot connector 11, at least one optical module 2 corresponds to at least one slot connector 11, and each optical module 2 All of the golden finger connectors are plugged into the corresponding slot connector 11 of the optical module 2.
  • the size of the socket connector 11 is not specifically limited.
  • the length of the socket connector 11 (that is, the maximum width of the socket connector 11 in the insertion direction) may be 11.8 mm ⁇ 0.5mm
  • the width of the slot connector 11 (that is, the maximum width of the slot connector 11 in the direction perpendicular to the insertion direction and parallel to the single board 1) can be 11.5mm ⁇ 0.5mm
  • the slot connector The height of 11 (that is, the maximum width of the slot connector 11 in the direction perpendicular to the single board 1) may be 6.8 mm ⁇ 0.5 mm.
  • FIG. 2 is a schematic structural diagram of an optical module 2 provided by some embodiments of the application.
  • the optical module 2 includes a housing 21.
  • the material of the housing 21 includes, but is not limited to, metal and plastic.
  • the housing 21 includes a base 211 and a cover 212 that are detachably connected.
  • the housing 21 is provided with an electrical interface a and a plurality of optical interfaces b.
  • the electrical interface a is used to connect to the slot connector 11 of the board 1.
  • the optical interface b is used to connect an optical waveguide (such as an optical fiber), and the optical interface b includes, but is not limited to, an SC-type optical fiber interface.
  • the number of optical interfaces b can be two, three or four, which is not specifically limited here.
  • Fig. 2 only shows an embodiment in which the number of optical interfaces b is two, and does not limit the number of optical interfaces b.
  • Fig. 3 is an exploded view of the optical module shown in Fig. 2.
  • the optical module 2 further includes a plurality of light emitting and receiving components 22.
  • a plurality of light emitting and receiving components 22 are arranged in the housing 21, the number of the plurality of light emitting and receiving components 22 is equal to the number of the plurality of optical interfaces b, and the plurality of light emitting and receiving components 22 correspond to the plurality of optical interfaces b in a one-to-one manner.
  • the optical connection ends of each of the light emitting and receiving components 22 are opposite to the optical interface b corresponding to the light emitting and receiving component 22.
  • the optical transmitting and receiving assembly 22 includes a transmitting optical sub-assembly (TOSA), a receiving optical sub-assembly (ROSA), and a wavelength division multiplexer.
  • the wavelength division multiplexer has a first end, a second end and a third end.
  • the wavelength division multiplexer can couple the optical signal input from the first end to the second end output, and couple the optical signal input from the second end to the
  • the third terminal is output, the output terminal of TOSA is connected to the first terminal of the wavelength division multiplexer, and the input terminal of ROSA is connected to the third terminal of the wavelength division multiplexer.
  • the optical connection end of the optical transmitting and receiving component 22 is also the second end of the wavelength division multiplexer.
  • the optical module 2 further includes a golden finger connector 23.
  • the golden finger connector 23 is located in the electrical interface a, and the golden finger connector 23 is electrically connected to a plurality of light emitting and receiving components 22.
  • FIG. 4 is a schematic structural diagram of the golden finger connector 23 of the optical module 2 provided by some embodiments of the application.
  • the golden finger connector 23 includes a substrate 231 and a plurality of pins 232 arranged on the substrate 231, and the plurality of pins 232 are arranged in multiple rows along the insertion direction of the golden finger connector 23.
  • the golden finger connector 23 of the optical module 23 is electrically connected to a plurality of light emitting and receiving components 22, and because the golden finger connector 23 includes a substrate 231 and a plurality of Pins 232, multiple pins 232 are arranged in multiple rows along the plugging direction of the golden finger connector 23, so it is possible to provide more in the golden finger connector 23 without increasing the width of the golden finger connector 23 A large number of pins, so that multiple optical transmitting and receiving components 22 can share a golden finger connector 23, so that multiple optical transmitting and receiving components 22 can be integrated into one optical module 2, so that network devices can pass through one optical module 2. Simultaneous access to multiple optical communication devices can increase the number of optical communication devices that the network device can access, and increase the capacity of the optical communication network.
  • FIG. 5 is a schematic structural diagram of the golden finger connector of the optical module shown in FIG. 4 viewed from the direction A
  • FIG. 6 is a schematic structural diagram of the backside of the golden finger connector of the optical module shown in FIG. 4.
  • the substrate 231 has a first surface 2311 and a second surface 2312 opposite to each other. Some of the plurality of pins 232 are provided on the first surface 2311, and the plurality of pins 232 The rest of the pins are arranged on the second surface 2312.
  • a plurality of pins 232 are dispersedly arranged on the first surface 2311 and the second surface 2312.
  • a larger number of pins can be provided on the substrate 231, so that the golden finger is connected.
  • the device 23 can be connected to a larger number of optical transmitting and receiving components 22, thereby further increasing the number of optical communication devices that the network device can access, and increasing the capacity of the optical communication network.
  • the pins on the first surface 2311 may be arranged in two rows, three rows or four rows along the insertion direction of the golden finger connector 23, which is not specifically limited here. As the number of rows of pins arranged on the first surface 2311 increases, the greater the length of the golden finger connector 23 along the insertion direction, the greater the length of the matching socket connector 11 along the insertion direction. The larger the occupied area on board 1.
  • the pins on the first surface 2311 are along the golden fingers.
  • the connectors 23 are arranged in two rows in the insertion direction, which are two rows arranged along the two dashed lines in FIG. 4. In this way, the number of rows of pins arranged on the first surface 2311 is moderate, which can increase the capacity of the optical communication network while reducing the board area occupied by the socket connector 11 on the single board 1.
  • the pins on the second surface 2312 can be arranged in two rows, three rows or four rows along the insertion direction of the golden finger connector 23, which is not specifically limited here. As the number of rows of pins arranged on the second surface 2312 increases, the greater the length of the golden finger connector 23 along the insertion direction, the greater the length of the matching socket connector 11 along the insertion direction, and The larger the occupied area on board 1.
  • the pins on the second surface 2312 are along the golden fingers.
  • the connectors 23 are arranged in two rows in the insertion direction, which are respectively two rows arranged along the two dotted lines in FIG. 6. In this way, the number of rows of pins arranged on the second surface 2312 is moderate, which can increase the capacity of the optical communication network while reducing the board area occupied by the socket connector 11 on the single board 1.
  • the distance between two adjacent pins in each row of pins on the first surface 2311 and the second surface 2312 is 0.8mm, and the width of each pin (that is, the distance along the pin is 0.8mm).
  • the width in the arrangement direction of a row of pins at) is 0.5mm.
  • the number of pins in the rows of pins on the first surface 2311 and the second surface 2312 may be equal or different, which is not specifically limited here. In some embodiments, as shown in FIGS. 4 and 6, the number of pins in each row of pins on the first surface 2311 and the second surface 2312 are equal. In other words, the number of pins in multiple rows of pins on the first surface 2311 is equal, and the number of pins in multiple rows of pins on the second surface 2312 is equal, and the number of pins in each row of pins on the first surface 2311 is the same. The number is equal to the number of pins in each row of pins on the second surface 2312. In this way, the pins are evenly distributed on the first surface 2311 and the second surface 2312.
  • a larger number of pins can be provided on the substrate 231, so that the gold finger connector 23 A larger number of optical transmitting and receiving components 22 can be connected, so that the number of optical communication devices that the network device can access can be further increased, and the capacity of the optical communication network can be improved.
  • the number of pins in each row of pins on the first surface 2311 and the second surface 2312 may be 9, 10, 11, or 12, which is not specifically limited here. In some embodiments, as shown in FIGS. 4 and 6, the number of pins in each row of pins on the first surface 2311 and the second surface 2312 is 11.
  • the lengths of the pins used to implement different functions are usually different.
  • the length of the ground pin is usually greater than the length of the power pin
  • the length of the power pin is usually greater than the length of the signal pin.
  • multiple pins with different lengths are arranged in a row, as shown in Figs. 4 and 6, they are usually arranged based on the midpoint of the pins along their length. In this way, there will be gaps between the two adjacent rows of pins and the front side of the front row of pins. These gaps will cause the golden finger connector 23 to be inserted into the socket connector 11 incorrectly or incorrectly. Stuck and other situations.
  • the first surface 2311 and the second surface 2312 of the substrate 231 are adjacent to each other in two rows.
  • a first transition structure 233 is provided between the pins.
  • the first transition structure 233 is spaced apart from two rows of pins adjacent to each other in the front and rear, and the height of the first transition structure 233 protruding from the surface of the substrate 231 is adjacent to the front and rear.
  • the heights of the two rows of pins protruding from the surface of the substrate 231 are equal. In this way, the first transition structure 233 can play a smoothing effect, so as to prevent the golden finger connector 23 from being inserted into the socket connector 11 without being smoothly inserted or stuck.
  • one of the first surface 2311 and the second surface 2312 of the substrate 231 is close to the front end of the golden finger connector 23.
  • the row of pins is the first row of pins c.
  • the front ends of the pins c of the first row are not flush.
  • the pin with the smallest distance between the front end and the front end of the golden finger connector 23 is the first pin d, and the rest of the first row of pins c except the first pin d
  • the side of the pins close to the front end of the golden finger connector 23 is provided with a second transition structure 234.
  • the height of the second transition structure 234 protruding from the surface of the substrate 231 and the height of the first row of pins c protruding from the surface of the substrate 231 are equal, and the front end of the second transition structure 234 is flush with the front end of the first pin d.
  • the second transition structure 234 further has a smoothing effect, so as to prevent the golden finger connector 23 from being inserted into the socket connector 11 from being stuck smoothly or stuck.
  • FIG. 8 is a definition diagram of the pins on the first surface 2311 of the substrate 231 of the gold finger connector 23 of the optical module 2 provided by some embodiments of the application
  • FIG. 9 is the gold finger of the optical module 2 provided by some embodiments of the application
  • the plurality of pins 232 include power pins (for example, including VCCR0, VCCT0, VCCR1, VCCT1), and the power pins are electrically connected to the plurality of light emitting and receiving components 22
  • a slow-start circuit (not shown in the figure) is connected in series in the electrical connection line between the power pin and the plurality of light emitting and receiving components 22.
  • the multiple pins 232 also include a power control pin (such as Pow_Ctrl in FIG. 8), which is connected to the slow start circuit, and the power control pin is used to transmit a switch control signal to the slow start circuit, and is controlled by the switch The signal can control the switch of the slow start circuit. In this way, there is no need to provide a slow start circuit on the single board 1, so that the structural complexity of the single board 1 can be reduced.
  • the power supply pins include multiple transmit power pins (such as VCCT0 and VCCT1) and multiple receive power pins (such as VCCR0 and VCCR1).
  • the number of multiple transmitting power pins is equal to the number of multiple light transmitting and receiving components 22, and the multiple transmitting power pins correspond to the multiple light transmitting and receiving components 22 one-to-one, and each transmitting power pin is used to The light emitting component in the light emitting and receiving component 22 corresponding to the emitting power pin transmits power.
  • the number of the multiple receiving power pins is equal to the number of the multiple light emitting and receiving components 22, and the multiple receiving power pins are in one-to-one correspondence with the multiple light emitting and receiving components 22, and each receiving power pin is used for receiving
  • the light receiving component in the light emitting and receiving component 22 corresponding to the power pin supplies power. In this way, power is supplied to the light emitting components and the light receiving components of the multiple light emitting and receiving components through the multiple transmitting power pins and the multiple receiving power pins, and the power supply lines are independent of each other, which is convenient for power supply control and management.
  • each row of pins on the first surface 2311 has a ground pin (GND), and the ground pin is located at the end of the row of pins.
  • the ground pin can play the role of electrical shielding and anti-wear protection for the signal pins in the row of pins.
  • each row of pins on the second surface 2312 has a ground pin (GND), and the ground pin is located at the end of the row of pins.
  • the ground pin can play the role of electrical shielding and anti-wear protection for the signal pins in the row of pins.
  • the plurality of light emitting and receiving components 22 may be arranged side by side in the housing 21, or may be stacked and arranged, which is not specifically limited herein. In some embodiments, as shown in FIG. 3, a plurality of light emitting and receiving components 22 are stacked and arranged in a direction perpendicular to the substrate 231. In this way, the width of the entire optical module 2 can be reduced, which is beneficial to reduce the distance between two adjacent slot connectors on the single board 1, so that a larger number of slot connections can be set on the single board 1. To connect a larger number of optical film blocks 2, thereby further increasing the number of optical communication devices that can be accessed by network devices and increasing the capacity of the optical communication network.
  • the number of the multiple light emitting and receiving components 22 may be two, three, four, etc., which is not specifically limited here. In some embodiments, as shown in FIG. 3, the number of the plurality of light emitting and receiving components 22 is two.
  • the light emitting and receiving component 22 includes a light emitting component, a light receiving component, and a wavelength division multiplexer.
  • the light emitting component may include one light emitting channel or multiple light emitting channels, which is not specifically limited here.
  • the light receiving component may include one light receiving channel or multiple light receiving channels, which is not specifically limited here.
  • the light emitting component includes a plurality of light emitting channels, and the wavelengths of light emitted by the plurality of light emitting channels should be distinguished, for example, a light emitting channel including light with a wavelength of 1577nm and a light emitting channel with a wavelength of 1490nm. aisle.
  • one optical transmitting component integrates multiple optical transmitting channels, which can further increase the number of optical communication devices that can be accessed by network devices, and increase the capacity of the optical communication network.
  • the emission rates of the multiple light emission channels may be the same or different, which is not specifically limited here.
  • the emission rate of the multiple optical emission channels may be 1 Gbit/s, 5 Gbit/s, or 10 Gbit/s, which is not specifically limited here.
  • the light emitting component includes a light emitting channel with a rate of 1 Gbit/s and a light emitting channel with a rate of 10 Gbit/s. In this way, high- and low-speed matching can be realized to meet the needs of different optical communication devices connected.
  • the light receiving component includes multiple light receiving channels.
  • the wavelengths of light received by the multiple light receiving channels should be distinguished.
  • the light receiving channel includes light with a wavelength of 1310nm and light receiving with a wavelength of 1270nm. aisle.
  • an optical receiving component integrates multiple optical receiving channels, which can further increase the number of optical communication devices that the network device can access, and increase the capacity of the optical communication network.
  • the receiving rates of the multiple optical receiving channels may be the same or different, which is not specifically limited here.
  • the receiving rate of the multiple optical receiving channels may be 1 Gbit/s, 5 Gbit/s, or 10 Gbit/s, which is not specifically limited here.
  • the optical receiving component includes an optical receiving channel with a rate of 1 Gbit/s and an optical receiving channel with a rate of 10 Gbit/s. In this way, high and low speeds can be matched to meet the requirements of different connected optical communication devices for different communication speeds.
  • FIG. 7 is a structural block diagram of an optical module 2 provided by some embodiments of the application.
  • the number of light emitting and receiving components 22 integrated in the optical module 2 is two, and the two light emitting and receiving components 22 are a first light emitting and receiving component 221 and a second light emitting and receiving component 222 respectively.
  • the first light emitting and receiving component 221 includes a first light emitting component 2211, a first light receiving component 2212, and a first wavelength division multiplexer 2213
  • the first light emitting component 2211 includes a first light emitting channel 22111 and a second light emitting channel 22112.
  • the first light receiving component 2212 includes a first light receiving channel 22121 and a second light receiving channel 22122.
  • the second light emitting and receiving component 222 includes a second light emitting component 2221, a second light receiving component 2222, and a second wavelength division multiplexer 2223, and the second light emitting component 2221 includes a third light emitting channel 22211 and a fourth light emitting channel 22212.
  • the second light receiving component 2222 includes a third light receiving channel 22221 and a fourth light receiving channel 22222.
  • the first optical emission channel 22111 and the third optical emission channel 22211 are optical emission channels with a rate of 1 Gbit/s.
  • the first optical receiving channel 22121 and the third optical receiving channel 22221 are optical receiving channels with a rate of 1 Gbit/s.
  • the second optical emission channel 22112 and the fourth optical emission channel 22212 are optical emission channels with a rate of 10 Gbit/s.
  • the second optical receiving channel 22122 and the fourth optical receiving channel 22222 are optical receiving channels whose receiving rate can be selected between 5 Gbit/s and 10 Gbit/s.
  • FIG. 8 is a schematic structural view of the first surface 2311 of the substrate 231 of the golden finger connector 23 of the optical module 2 shown in FIG. 7, and FIG. 9 is the second surface 2311 of the substrate 231 of the golden finger connector 23 of the optical module 2 shown in FIG. Schematic diagram of the structure of the surface 2312. It can be seen from FIGS. 8 and 9 that the serial numbers (marked in FIGS. 8 and 9), names and functions of the pins on the golden finger connector 23 are as shown in Table 1. This structure is simple and easy to implement.
  • Table 1 only provides an example of the definition of the pin 232, and does not limit the embodiment of the present application.

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Abstract

An optical module (2) and a network device, relating to the technical field of network devices, so that the network device can access more optical communication devices, thereby improving the capacity of an optical communication network. The optical module (2) comprises a housing (21), multiple optical transmission receiving components (22), and a goldfinger connector (23). One electrical interface (a) and multiple optical interfaces (b) are provided on the housing (21); the multiple optical transmission receiving components (22) are provided in the housing (21), and the multiple optical transmission receiving components (22) have one-to-one correspondence to the multiple optical interfaces (b); an optical connection end of each optical transmission receiving component (22) is separately opposite to the optical interface (b) corresponding to the optical transmission receiving component (22). The goldfinger connector (23) is located in the electrical interface (a), the goldfinger connector (23) is electrically connected to the multiple optical transmission receiving components (22), the goldfinger connector (23) comprises a substrate (231) and multiple pins (232) provided on the substrate (231), and the multiple pins (232) are arranged into multiple rows in an insertion direction of the goldfinger connector (23). The provided optical module (2) is used for achieving conversion between an optical signal and an electrical signal.

Description

一种光模块和网络设备Optical module and network equipment
本申请要求于2020年3月31日提交中国国家知识产权局、申请号为202010249451.4、发明名称为“一种光模块和网络设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of a Chinese patent application filed with the State Intellectual Property Office of China, the application number is 202010249451.4, and the invention title is "a kind of optical module and network equipment" on March 31, 2020, the entire content of which is incorporated herein by reference Applying.
技术领域Technical field
本申请涉及网络设备技术领域,尤其涉及一种光模块和网络设备。This application relates to the technical field of network equipment, and in particular to an optical module and network equipment.
背景技术Background technique
在光通信网络中,诸如光线路终端、交换机等网络设备通过连接于单板上的光模块来实现光通信设备的接入,单板上能够连接的光模块的数量越多,网络设备能够接入的光通信设备的数量就越多,光通信网络的容量就越大。随着人们对信息的需求的快速增长,直接挑战着现有光通信网络的容量,需要网络设备能够接入更多的光通信设备,而由于网络设备的单板上用来设置用于连接光模块的插槽连接器的边沿的宽度有限,使得该边沿能够设置的插槽连接器的数量受限,从而使得单板上能够连接的光模块的数量受限,进而使得网络设备所能够接入的光通信设备的数量受限。In an optical communication network, network devices such as optical line terminals and switches realize the access of optical communication devices through optical modules connected to a single board. The more optical modules that can be connected to a single board, the more network devices can connect The more the number of optical communication devices that are imported, the greater the capacity of the optical communication network. With the rapid growth of people’s demand for information, it directly challenges the capacity of the existing optical communication network, requiring network equipment to be able to access more optical communication equipment. The width of the edge of the slot connector of the module is limited, so that the number of slot connectors that can be set on the edge is limited, so that the number of optical modules that can be connected on a single board is limited, so that network devices can access The number of optical communication equipment is limited.
发明内容Summary of the invention
本申请的实施例提供一种光模块和网络设备,使网络设备能够接入更多数量的光通信设备,提升光通信网络的容量。The embodiments of the present application provide an optical module and a network device, so that the network device can access a larger number of optical communication devices and increase the capacity of the optical communication network.
为达到上述目的,本申请的实施例采用如下技术方案:In order to achieve the foregoing objectives, the following technical solutions are adopted in the embodiments of the present application:
第一方面,本申请一些实施例提供一种光模块,包括壳体、多个光发射接收组件和金手指连接器;壳体设有一个电接口和多个光接口;多个光发射接收组件设置于壳体内,多个光发射接收组件的数量与多个光接口的数量相等,多个光发射接收组件与多个光接口一一对应,每个光发射接收组件的光连接端均与光发射接收组件对应的光接口相对;金手指连接器位于电接口内,金手指连接器与多个光发射接收组件电连接,金手指连接器包括基板和设置于基板上的多个引脚,该多个引脚沿金手指连接器的插接方向排列成多排。In the first aspect, some embodiments of the present application provide an optical module, including a housing, a plurality of light emitting and receiving components, and a gold finger connector; the housing is provided with an electrical interface and a plurality of optical interfaces; and a plurality of light emitting and receiving components The number of the multiple light emitting and receiving components is equal to the number of the multiple optical interfaces. The multiple light emitting and receiving components correspond to the multiple optical interfaces one-to-one, and the optical connection end of each light transmitting and receiving component is connected to the The optical interfaces corresponding to the transmitting and receiving components are opposite; the golden finger connector is located in the electrical interface, and the golden finger connector is electrically connected to a plurality of light transmitting and receiving components. The golden finger connector includes a substrate and a plurality of pins arranged on the substrate. The multiple pins are arranged in multiple rows along the insertion direction of the golden finger connector.
本申请实施例提供的光模块,由于该光模块的金手指连接器与多个光发射接收组件电连接,且由于金手指连接器包括基板和设置于基板上的多个引脚,多个引脚沿金手指连接器的插接方向排列成多排,因此可以在不增加金手指连接器的宽度的情况下,在金手指连接器内设置更多数量的引脚,以使得多个光发射接收组件可以共用一个金手指连接器,从而能够将多个光发射接收组件集成在一个光模块中,使得网络设备能够通过一个光模块同时接入多个光通信设备,从而能够增大网络设备所能够接入的光通信设备的数量,提升光通信网络的容量。In the optical module provided by the embodiments of the present application, since the golden finger connector of the optical module is electrically connected to a plurality of light emitting and receiving components, and because the golden finger connector includes a substrate and a plurality of pins arranged on the substrate, a plurality of lead wires The pins are arranged in multiple rows along the mating direction of the gold finger connector, so a larger number of pins can be arranged in the gold finger connector without increasing the width of the gold finger connector to make multiple light emission The receiving components can share a golden finger connector, so that multiple optical transmitting and receiving components can be integrated into one optical module, so that network equipment can access multiple optical communication devices at the same time through one optical module, thereby increasing the number of network equipment. The number of optical communication devices that can be accessed increases the capacity of the optical communication network.
可选地,基板具有相对的第一表面和第二表面,多个引脚中的一部分引脚设置于第一表面,多个引脚中的其余引脚设置于第二表面上。这样,多个引脚分散布置于第一表面和第二表面,在不增加金手指连接器的宽度的情况下,基板上可以设置更多数量的引脚,使得金手指连接器能够连接更多数量的光发射接收组件,从而能够进一步增大网络设备所能够接入的 光通信设备的数量,提升光通信网络的容量。Optionally, the substrate has a first surface and a second surface opposite to each other, a part of the pins of the plurality of pins are disposed on the first surface, and the remaining pins of the plurality of pins are disposed on the second surface. In this way, multiple pins are scattered on the first surface and the second surface. Without increasing the width of the gold finger connector, a larger number of pins can be set on the substrate, so that the gold finger connector can connect more. A large number of optical transmitting and receiving components can further increase the number of optical communication devices that the network device can access, and increase the capacity of the optical communication network.
可选地,第一表面上的引脚沿金手指连接器的插接方向排列成两排,第二表面上的引脚沿金手指连接器的插接方向排列成两排。这样,引脚在第一表面和第二表面上排列的排数适中,能够在提升光通信网络的容量的同时,减少插槽连接器在单板上的占板面积。Optionally, the pins on the first surface are arranged in two rows along the insertion direction of the golden finger connector, and the pins on the second surface are arranged in two rows along the insertion direction of the golden finger connector. In this way, the number of rows of pins arranged on the first surface and the second surface is moderate, which can increase the capacity of the optical communication network while reducing the footprint of the socket connector on the single board.
可选地,第一表面和第二表面上每排引脚中相邻两个引脚之间的间距为0.8mm,每个引脚的宽度为0.5mm。Optionally, the distance between two adjacent pins in each row of pins on the first surface and the second surface is 0.8 mm, and the width of each pin is 0.5 mm.
可选地,第一表面和第二表面上每排引脚内引脚的数量均相等。也就是说,第一表面上多排引脚内引脚的数量相等,第二表面上多排引脚内引脚的数量相等,第一表面上的每排引脚内引脚的数量均与第二表面上每排引脚内引脚的数量相等。这样,引脚在第一表面和第二表面上分布均匀,在不增加金手指连接器的宽度的情况下,基板上可以设置更多数量的引脚,使得金手指连接器能够连接更多数量的光发射接收组件,从而能够进一步增大网络设备所能够接入的光通信设备的数量,提升光通信网络的容量。Optionally, the number of pins in each row of pins on the first surface and the second surface are equal. In other words, the number of pins in multiple rows of pins on the first surface is equal, the number of pins in multiple rows of pins on the second surface is equal, and the number of pins in each row of pins on the first surface is equal to The number of pins in each row of pins on the second surface is equal. In this way, the pins are evenly distributed on the first surface and the second surface. Without increasing the width of the gold finger connector, a larger number of pins can be set on the substrate, so that the gold finger connector can be connected to a larger number The optical transmitting and receiving components can further increase the number of optical communication devices that the network equipment can access, and increase the capacity of the optical communication network.
可选地,第一表面和第二表面上每排引脚内引脚的数量均为11个。Optionally, the number of pins in each row of pins on the first surface and the second surface are both 11.
可选地,沿金手指连接器的插接方向,基板的第一表面和第二表面上,前后相邻两排引脚之间设有第一过渡结构,第一过渡结构与前后相邻两排引脚之间间隔设置,且第一过渡结构凸出基板的表面的高度与前后相邻两排引脚凸出基板的表面的高度相等。这样,可以通过第一过渡结构起到平滑作用,以避免金手指连接器在插接于插槽连接器的过程中,出现插入不顺畅或者卡死等情况。Optionally, along the inserting direction of the golden finger connector, on the first surface and the second surface of the substrate, a first transition structure is provided between two rows of pins adjacent to each other in the front and rear. The rows of pins are arranged at intervals, and the height of the first transition structure protruding from the surface of the substrate is equal to the height of the protruding surfaces of the two adjacent rows of pins from the substrate. In this way, the smoothing effect can be achieved by the first transition structure, so as to prevent the golden finger connector from being inserted into the socket connector from being improperly inserted or stuck.
可选地,沿金手指连接器的插接方向,基板的第一表面和第二表面上,靠近金手指连接器的前端的一排引脚为第一排引脚,第一排引脚的前端不平齐;第一排引脚中,前端与金手指连接器的前端之间的距离最小的引脚为第一引脚,第一排引脚中除该第一引脚之外的其余引脚靠近金手指连接器的前端的一侧均设有第二过渡结构,该第二过渡结构凸出基板的表面的高度与第一排引脚凸出基板的表面的高度相等,且第二过渡结构的前端与第一引脚的前端平齐。这样,通过第二过渡结构进一步起到平滑作用,以避免金手指连接器在插接于插槽连接器的过程中,出现插入不顺畅或者卡死等情况。Optionally, along the plugging direction of the golden finger connector, on the first surface and the second surface of the substrate, a row of pins near the front end of the golden finger connector is the first row of pins, and the first row of pins is The front end is uneven; among the first row of pins, the pin with the smallest distance between the front end and the front end of the golden finger connector is the first pin, and the remaining pins in the first row of pins except the first pin The side of the foot close to the front end of the golden finger connector is provided with a second transition structure. The height of the second transition structure protruding from the surface of the substrate is equal to the height of the first row of pins protruding from the surface of the substrate, and the second transition structure The front end of the structure is flush with the front end of the first pin. In this way, the second transition structure further plays the role of smoothing, so as to prevent the golden finger connector from being inserted into the socket connector from being stuck smoothly or stuck.
可选地,多个引脚包括电源引脚,电源引脚与多个光发射接收组件电连接,且电源引脚与多个光发射接收组件之间的电连接线路中串接有缓启动电路;多个引脚还包括电源控制引脚,电源控制引脚与缓启动电路连接,电源控制引脚用于向缓启动电路传输开关控制信号,通过该开关控制信号可以控制缓启动电路的开关。这样,无需在单板上设置缓启动电路,从而能够降低单板的结构复杂度。Optionally, the multiple pins include power pins, the power pins are electrically connected to multiple light emitting and receiving components, and the electrical connection lines between the power pins and the multiple light emitting and receiving components are serially connected with a slow-start circuit The multiple pins also include a power control pin, the power control pin is connected with the slow start circuit, the power control pin is used to transmit a switch control signal to the slow start circuit, and the switch control signal can control the switch of the slow start circuit. In this way, there is no need to set a slow start circuit on the single board, so that the structural complexity of the single board can be reduced.
可选地,电源引脚包括多个发射电源引脚和多个接收电源引脚;多个发射电源引脚的数量与多个光发射接收组件的数量相等,且多个发射电源引脚与多个光发射接收组件一一对应,每个发射电源引脚均用于向发射电源引脚对应的光发射接收组件中的光发射组件供给电源;多个接收电源引脚的数量与多个光发射接收组件的数量相等,且多个接收电源引脚与多个光发射接收组件一一对应,每个接收电源引脚均用于向接收电源引脚对应的光发射接收组件中的光接收组件供给电源。这样,通过多个发射电源引脚和多个接收电源引脚分别向多个光发射接收组件的光发射组件和光接收组件供电,供电线路彼此独立,便于供电控制和管理。Optionally, the power supply pins include multiple transmitting power pins and multiple receiving power pins; the number of the multiple transmitting power pins is equal to the number of the multiple light transmitting and receiving components, and the multiple transmitting power pins are equal to the number of light transmitting and receiving components. There is a one-to-one correspondence between the light transmitting and receiving components, and each transmitting power pin is used to supply power to the light transmitting component in the light transmitting and receiving component corresponding to the transmitting power pin; the number of multiple receiving power pins is related to the multiple light emitting The number of receiving components is equal, and multiple receiving power pins correspond to multiple light emitting and receiving components one-to-one, and each receiving power pin is used to supply the light receiving component in the light emitting and receiving component corresponding to the receiving power pin power supply. In this way, power is supplied to the light emitting components and the light receiving components of the multiple light emitting and receiving components through the multiple transmitting power pins and the multiple receiving power pins, and the power supply lines are independent of each other, which is convenient for power supply control and management.
可选地,第一表面上每排引脚中均具有接地引脚,接地引脚位于该排引脚的端部。这样,接地引脚可以对该排引脚内的信号引脚起到电屏蔽和防磨损保护的作用。Optionally, each row of pins on the first surface has a ground pin, and the ground pin is located at the end of the row of pins. In this way, the ground pin can play the role of electrical shielding and anti-wear protection for the signal pins in the row of pins.
可选地,第二表面上每排引脚中均具有接地引脚,接地引脚位于该排引脚的端部。这样, 接地引脚可以对该排引脚内的信号引脚起到电屏蔽和防磨损保护的作用。Optionally, each row of pins on the second surface has a ground pin, and the ground pin is located at the end of the row of pins. In this way, the ground pin can play the role of electrical shielding and anti-wear protection for the signal pins in the row of pins.
可选地,多个光发射接收组件沿垂直于基板的方向层叠排列。这样一来,可以减小整个光模块的宽度,有利于减小单板上相邻两个插槽连接器之间的间距,从而使得单板上可以设置更多数量的插槽连接器,以连接更多数量的光膜块,从而进一步增大网络设备能够接入的光通信设备的数量,提升光通信网络的容量。Optionally, a plurality of light emitting and receiving components are stacked and arranged in a direction perpendicular to the substrate. In this way, the width of the entire optical module can be reduced, which is beneficial to reduce the distance between two adjacent slot connectors on a single board, so that a larger number of slot connectors can be provided on a single board to Connect a larger number of optical film blocks, thereby further increasing the number of optical communication devices that the network device can access, and increasing the capacity of the optical communication network.
可选地,多个光发射接收组件的数量为两个。Optionally, the number of multiple light emitting and receiving components is two.
可选地,每个光发射接收组件均包括光发射组件、光接收组件和波分复用器;光发射组件包括多个光发射通道,光接收组件包括多个光接收通道。这样,一个光发射组件集成了多个光发射通道,一个光接收组件集成了多个光接收通道,能够进一步增大网络设备能够接入的光通信设备的数量,提升光通信网络的容量。Optionally, each light emitting and receiving component includes a light emitting component, a light receiving component, and a wavelength division multiplexer; the light emitting component includes a plurality of light emitting channels, and the light receiving component includes a plurality of light receiving channels. In this way, one optical transmitting component integrates multiple optical transmitting channels, and one optical receiving component integrates multiple optical receiving channels, which can further increase the number of optical communication devices that can be accessed by network devices and increase the capacity of the optical communication network.
可选地,光发射组件包括1Gbit/s速率的光发射通道和10Gbit/s速率的光发射通道,光接收组件包括1Gbit/s速率的光接收通道和10Gbit/s速率的光接收通道。这样,可以实现高低速搭配,以满足所接入的不同光通信设备对不同通信速率的需求。Optionally, the optical transmitting component includes an optical transmitting channel with a rate of 1 Gbit/s and an optical transmitting channel with a rate of 10 Gbit/s, and the optical receiving component includes an optical receiving channel with a rate of 1 Gbit/s and an optical receiving channel with a rate of 10 Gbit/s. In this way, high and low speeds can be matched to meet the requirements of different connected optical communication devices for different communication speeds.
第二方面,本申请一些实施例提供一种网络设备,该网络设备包括单板和光模块;单板上设有插槽连接器;光模块为如上任一技术方案所述的光模块,该光模块的金手指连接器配合插接于插槽连接器中。In the second aspect, some embodiments of the present application provide a network device, the network device includes a single board and an optical module; the single board is provided with a slot connector; the optical module is an optical module as described in any of the above technical solutions, and the optical module The golden finger connector of the module fits into the slot connector.
由于在本申请实施例的网络设备中使用的光模块与如上任一技术方案所述的光模块相同,因此二者能够解决相同的技术问题,并达到相同的预期效果。Since the optical module used in the network device of the embodiment of the present application is the same as the optical module described in any of the above technical solutions, the two can solve the same technical problem and achieve the same expected effect.
可选地,插槽连接器的长度为11.8mm±0.5mm,插槽连接器的宽度为11.5mm±0.5mm,插槽连接器的高度为6.8mm±0.5mm。Optionally, the length of the slot connector is 11.8mm±0.5mm, the width of the slot connector is 11.5mm±0.5mm, and the height of the slot connector is 6.8mm±0.5mm.
附图说明Description of the drawings
图1为本申请一些实施例提供的网络设备的结构示意图;Figure 1 is a schematic structural diagram of a network device provided by some embodiments of the application;
图2为本申请一些实施例提供的光模块的结构示意图;FIG. 2 is a schematic structural diagram of an optical module provided by some embodiments of the application;
图3为图2所示光模块的爆炸图;Fig. 3 is an exploded view of the optical module shown in Fig. 2;
图4为本申请一些实施例提供的光模块的金手指连接器的结构示意图;4 is a schematic structural diagram of a golden finger connector of an optical module provided by some embodiments of the application;
图5为图4所示光模块的金手指连接器由A方向看去的结构示意图;FIG. 5 is a schematic structural diagram of the golden finger connector of the optical module shown in FIG. 4 as viewed from the direction A;
图6为图4所示光模块的金手指连接器的背面结构示意图;6 is a schematic diagram of the back structure of the golden finger connector of the optical module shown in FIG. 4;
图7为本申请一些实施例提供的光模块的结构框图;FIG. 7 is a structural block diagram of an optical module provided by some embodiments of the application;
图8为图7所示光模块的金手指连接器的基板的第一表面的结构示意图;8 is a schematic diagram of the structure of the first surface of the substrate of the golden finger connector of the optical module shown in FIG. 7;
图9为图7所示光模块的金手指连接器的基板的第二表面的结构示意图。FIG. 9 is a schematic structural diagram of the second surface of the substrate of the golden finger connector of the optical module shown in FIG. 7.
附图标记:Reference signs:
1-单板;11-插槽连接器;2-光模块;21-壳体;211-底座;212-盖板;22-光发射接收组件;221-第一光发射接收组件;222-第二光发射接收组件;2211-第一光发射组件;22111-第一光发射通道;22112-第二光发射通道;2212-第一光接收组件;22121-第一光接收通道;22122-第二光接收通道;2213-第一波分复用器;2221-第二光发射组件;22211-第三光发射通道;22212-第四光发射通道;2222-第二光接收组件;22221-第三光接收通道;22222-第四光接收通道;2223-第二波分复用器;23-金手指连接器;231-基板;2311-第一表面;2312-第二表面;232-引脚;233-第一过渡结构;234-第二过渡结构。1-single board; 11-slot connector; 2-optical module; 21-housing; 211-base; 212-cover; 22-optical transmitting and receiving component; 221-first optical transmitting and receiving component; 222-section Two light emitting and receiving components; 2211-first light emitting component; 22111-first light emitting channel; 22112-second light emitting channel; 2212-first light receiving component; 22121-first light receiving channel; 22122-second Optical receiving channel; 2213-first wavelength division multiplexer; 2221-second optical transmitting component; 22211-third optical transmitting channel; 22212-fourth optical transmitting channel; 2222-second optical receiving component; 22221-third Optical receiving channel; 22222-fourth optical receiving channel; 2223-second wavelength division multiplexer; 23-gold finger connector; 231-substrate; 2311-first surface; 2312-second surface; 232-pin; 233-first transition structure; 234-second transition structure.
具体实施方式Detailed ways
在本申请实施例中,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。In the embodiments of the present application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features.
为了增大网络设备所能够接入的光通信设备的数量,可以增大单板上用来连接光模块的插槽连接器的数量,以使单板能够连接更多的光模块,从而通过该更多的光模块来接入更多的光通信设备。但是,由于单板上用来设置插槽连接器的边沿的宽度有限,使得单板上能够设置的插槽连接器的数量有限,从而使得单板能够连接的光模块的数量有限,进而使得网络设备所能够接入的光通信设备的数量有限。In order to increase the number of optical communication devices that the network device can access, the number of slot connectors used to connect the optical modules on the single board can be increased, so that the single board can connect more optical modules, so as to pass the More optical modules to access more optical communication equipment. However, due to the limited width of the edge used to set the slot connector on the single board, the number of slot connectors that can be set on the single board is limited, so that the number of optical modules that can be connected to the single board is limited. The number of optical communication devices that the device can access is limited.
为了解决此问题,可以增大单个光模块所集成的光发射接收组件(bi-directional optical sub-assembly,BOSA)的数量,并使全部光发射接收组件共用一个金手指连接器,以与单板上的一个插槽连接器连接。这样,单个光模块能够实现多个光模块的功能,该光模块仅与单板上的一个插槽连接器连接,因此无需增加单板上设置的插槽连接器的数量,从而不会受到单板的宽度的限制,由此能够增大网络设备所能够接入的光通信设备的数量。但是,由于光模块内全部光发射接收组件共用一个金手指连接器,因此金手指连接器的引脚的数量较多,金手指连接器的宽度较大,单板上的插槽连接器的宽度较大,插槽连接器在单板上的占用宽度较大,因此网络设备能够接入的光通信设备的数量仍然受到单板的宽度的限制。In order to solve this problem, the number of bi-directional optical sub-assembly (BOSA) integrated in a single optical module can be increased, and all the optical transmitter and receiver components can share a golden finger connector to communicate with the single board. Connect with a socket connector on the. In this way, a single optical module can realize the function of multiple optical modules. The optical module is only connected to one slot connector on the single board. Therefore, there is no need to increase the number of slot connectors provided on the single board. The width of the board is limited, which can increase the number of optical communication devices that the network device can access. However, since all the light emitting and receiving components in the optical module share a gold finger connector, the number of pins of the gold finger connector is larger, the width of the gold finger connector is larger, and the width of the slot connector on the board Larger, the slot connector occupies a larger width on the single board, so the number of optical communication devices that the network device can access is still limited by the width of the single board.
为了解决此问题,本申请实施例提供一种网络设备,该网络设备包括但不限于光线路终端和交换机。In order to solve this problem, an embodiment of the present application provides a network device, which includes, but is not limited to, an optical line terminal and a switch.
图1为本申请一些实施例提供的网络设备的结构示意图。如图1所示,网络设备包括单板1和光模块2。单板1也即是电路板,该单板1上具有能够实现网络设备的功能的一整套电路。单板1上设有插槽连接器11,插槽连接器11的数量为至少一个,图1仅给出插槽连接器11的数量为三个的实施例,并不对插槽连接器11的数量构成限定。光模块2的数量为至少一个,至少一个光模块2的数量与至少一个插槽连接器11的数量相等,至少一个光模块2与至少一个插槽连接器11一一对应,每个光模块2的金手指连接器均插接于该光模块2对应的插槽连接器11中。FIG. 1 is a schematic diagram of the structure of a network device provided by some embodiments of the application. As shown in Figure 1, the network equipment includes a single board 1 and an optical module 2. The single board 1 is also a circuit board, and the single board 1 has a complete set of circuits capable of realizing the functions of a network device. The single board 1 is provided with a slot connector 11, and the number of the slot connector 11 is at least one. FIG. 1 only shows an embodiment in which the number of the slot connector 11 is three, and does not affect the number of the slot connector 11 The quantity is limited. The number of optical modules 2 is at least one, the number of at least one optical module 2 is equal to the number of at least one slot connector 11, at least one optical module 2 corresponds to at least one slot connector 11, and each optical module 2 All of the golden finger connectors are plugged into the corresponding slot connector 11 of the optical module 2.
在上述实施例中,对插槽连接器11的尺寸不做具体限定,比如插槽连接器11的长度(也即是插槽连接器11沿插接方向上的最大宽度)可以为11.8mm±0.5mm,插槽连接器11的宽度(也即是插槽连接器11在与插接方向垂直并与单板1平行的方向上的最大宽度)可以为11.5mm±0.5mm,插槽连接器11的高度(也即是插槽连接器11在与单板1垂直的方向上的最大宽度)可以为6.8mm±0.5mm。In the above embodiment, the size of the socket connector 11 is not specifically limited. For example, the length of the socket connector 11 (that is, the maximum width of the socket connector 11 in the insertion direction) may be 11.8 mm ± 0.5mm, the width of the slot connector 11 (that is, the maximum width of the slot connector 11 in the direction perpendicular to the insertion direction and parallel to the single board 1) can be 11.5mm±0.5mm, the slot connector The height of 11 (that is, the maximum width of the slot connector 11 in the direction perpendicular to the single board 1) may be 6.8 mm±0.5 mm.
图2为本申请一些实施例提供的光模块2的结构示意图。如图2所示,光模块2包括壳体21。壳体21的材料包括但不限于金属和塑料。壳体21包括可拆卸连接的底座211和盖板212。壳体21上设有一个电接口a和多个光接口b。电接口a用于连接单板1的插槽连接器11。光接口b用于连接光波导(比如光纤),光接口b包括但不限于SC型光纤接口。光接口b的数量可以为两个、三个或者四个,在此不做具体限定。图2仅给出了光接口b的数量为两个的实施例,并不对光接口b的数量构成限定。FIG. 2 is a schematic structural diagram of an optical module 2 provided by some embodiments of the application. As shown in FIG. 2, the optical module 2 includes a housing 21. The material of the housing 21 includes, but is not limited to, metal and plastic. The housing 21 includes a base 211 and a cover 212 that are detachably connected. The housing 21 is provided with an electrical interface a and a plurality of optical interfaces b. The electrical interface a is used to connect to the slot connector 11 of the board 1. The optical interface b is used to connect an optical waveguide (such as an optical fiber), and the optical interface b includes, but is not limited to, an SC-type optical fiber interface. The number of optical interfaces b can be two, three or four, which is not specifically limited here. Fig. 2 only shows an embodiment in which the number of optical interfaces b is two, and does not limit the number of optical interfaces b.
图3为图2所示光模块的爆炸图。如图3所示,光模块2还包括多个光发射接收组件22。多个光发射接收组件22设置于壳体21内,多个光发射接收组件22的数量与多个光接口b数 量相等,多个光发射接收组件22与多个光接口b一一对应,每个光发射接收组件22的光连接端均与光发射接收组件22对应的光接口b相对。Fig. 3 is an exploded view of the optical module shown in Fig. 2. As shown in FIG. 3, the optical module 2 further includes a plurality of light emitting and receiving components 22. A plurality of light emitting and receiving components 22 are arranged in the housing 21, the number of the plurality of light emitting and receiving components 22 is equal to the number of the plurality of optical interfaces b, and the plurality of light emitting and receiving components 22 correspond to the plurality of optical interfaces b in a one-to-one manner. The optical connection ends of each of the light emitting and receiving components 22 are opposite to the optical interface b corresponding to the light emitting and receiving component 22.
需要说明的是,光发射接收组件22包括光发射组件(transmitting optical sub-assembly,TOSA)、光接收组件(receiving optical sub-assembly,ROSA)和波分复用器。波分复用器具有第一端、第二端和第三端,波分复用器能够将第一端输入的光信号耦合至第二端输出,并将第二端输入的光信号耦合至第三端输出,TOSA的输出端与波分复用器的第一端连接,ROSA的输入端与波分复用器的第三端连接。由此可知,光发射接收组件22的光连接端也即是波分复用器的第二端。It should be noted that the optical transmitting and receiving assembly 22 includes a transmitting optical sub-assembly (TOSA), a receiving optical sub-assembly (ROSA), and a wavelength division multiplexer. The wavelength division multiplexer has a first end, a second end and a third end. The wavelength division multiplexer can couple the optical signal input from the first end to the second end output, and couple the optical signal input from the second end to the The third terminal is output, the output terminal of TOSA is connected to the first terminal of the wavelength division multiplexer, and the input terminal of ROSA is connected to the third terminal of the wavelength division multiplexer. It can be seen that the optical connection end of the optical transmitting and receiving component 22 is also the second end of the wavelength division multiplexer.
如图3所示,光模块2还包括金手指连接器23。金手指连接器23位于电接口a内,金手指连接器23与多个光发射接收组件22电连接。图4为本申请一些实施例提供的光模块2的金手指连接器23的结构示意图。如图4所示,金手指连接器23包括基板231和设置于基板231上的多个引脚232,该多个引脚232沿金手指连接器23的插接方向排列成多排。As shown in FIG. 3, the optical module 2 further includes a golden finger connector 23. The golden finger connector 23 is located in the electrical interface a, and the golden finger connector 23 is electrically connected to a plurality of light emitting and receiving components 22. FIG. 4 is a schematic structural diagram of the golden finger connector 23 of the optical module 2 provided by some embodiments of the application. As shown in FIG. 4, the golden finger connector 23 includes a substrate 231 and a plurality of pins 232 arranged on the substrate 231, and the plurality of pins 232 are arranged in multiple rows along the insertion direction of the golden finger connector 23.
本申请实施例提供的光模块,由于该光模块23的金手指连接器23与多个光发射接收组件22电连接,且由于金手指连接器23包括基板231和设置于基板231上的多个引脚232,多个引脚232沿金手指连接器23的插接方向排列成多排,因此可以在不增加金手指连接器23的宽度的情况下,在金手指连接器23内设置更多数量的引脚,以使得多个光发射接收组件22可以共用一个金手指连接器23,从而能够将多个光发射接收组件22集成在一个光模块2中,使得网络设备能够通过一个光模块2同时接入多个光通信设备,从而能够增大网络设备所能够接入的光通信设备的数量,提升光通信网络的容量。In the optical module provided by the embodiment of the present application, since the golden finger connector 23 of the optical module 23 is electrically connected to a plurality of light emitting and receiving components 22, and because the golden finger connector 23 includes a substrate 231 and a plurality of Pins 232, multiple pins 232 are arranged in multiple rows along the plugging direction of the golden finger connector 23, so it is possible to provide more in the golden finger connector 23 without increasing the width of the golden finger connector 23 A large number of pins, so that multiple optical transmitting and receiving components 22 can share a golden finger connector 23, so that multiple optical transmitting and receiving components 22 can be integrated into one optical module 2, so that network devices can pass through one optical module 2. Simultaneous access to multiple optical communication devices can increase the number of optical communication devices that the network device can access, and increase the capacity of the optical communication network.
多个引脚232可以设置于基板231的一个表面上,也可以设置于基板231的两个表面上,在此不做具体限定。在一些实施例中,图5为图4所示光模块的金手指连接器由A方向看去的结构示意图,图6为图4所示光模块的金手指连接器的背面结构示意图。如图4、图5和图6所示,基板231具有相对的第一表面2311和第二表面2312,多个引脚232中的一部分引脚设置于第一表面2311上,多个引脚232中的其余引脚设置于第二表面2312上。这样,多个引脚232分散布置于第一表面2311和第二表面2312,在不增加金手指连接器23的宽度的情况下,基板231上可以设置更多数量的引脚,使得金手指连接器23能够连接更多数量的光发射接收组件22,从而能够进一步增大网络设备所能够接入的光通信设备的数量,提升光通信网络的容量。The plurality of pins 232 may be provided on one surface of the substrate 231 or may be provided on two surfaces of the substrate 231, which is not specifically limited herein. In some embodiments, FIG. 5 is a schematic structural diagram of the golden finger connector of the optical module shown in FIG. 4 viewed from the direction A, and FIG. 6 is a schematic structural diagram of the backside of the golden finger connector of the optical module shown in FIG. 4. As shown in FIGS. 4, 5, and 6, the substrate 231 has a first surface 2311 and a second surface 2312 opposite to each other. Some of the plurality of pins 232 are provided on the first surface 2311, and the plurality of pins 232 The rest of the pins are arranged on the second surface 2312. In this way, a plurality of pins 232 are dispersedly arranged on the first surface 2311 and the second surface 2312. Without increasing the width of the golden finger connector 23, a larger number of pins can be provided on the substrate 231, so that the golden finger is connected. The device 23 can be connected to a larger number of optical transmitting and receiving components 22, thereby further increasing the number of optical communication devices that the network device can access, and increasing the capacity of the optical communication network.
在上述实施例中,第一表面2311上的引脚沿金手指连接器23的插接方向可以排列成两排、三排或者四排,在此不做具体限定。随着引脚在第一表面2311排列的排数的增加,金手指连接器23沿自身插接方向的长度越大,与之匹配的插槽连接器11沿插接方向的长度越大,在单板1上的占用面积越大。为了在提升光通信网络的容量的同时,减少插槽连接器11在单板1上的占板面积,在一些实施例中,如图4所示,第一表面2311上的引脚沿金手指连接器23的插接方向排列成两排,分别为沿着图4中两条虚线排列的两排。这样,引脚在第一表面2311排列的排数适中,能够在提升光通信网络的容量的同时,减少插槽连接器11在单板1上的占板面积。In the foregoing embodiment, the pins on the first surface 2311 may be arranged in two rows, three rows or four rows along the insertion direction of the golden finger connector 23, which is not specifically limited here. As the number of rows of pins arranged on the first surface 2311 increases, the greater the length of the golden finger connector 23 along the insertion direction, the greater the length of the matching socket connector 11 along the insertion direction. The larger the occupied area on board 1. In order to increase the capacity of the optical communication network while reducing the footprint of the slot connector 11 on the single board 1, in some embodiments, as shown in FIG. 4, the pins on the first surface 2311 are along the golden fingers. The connectors 23 are arranged in two rows in the insertion direction, which are two rows arranged along the two dashed lines in FIG. 4. In this way, the number of rows of pins arranged on the first surface 2311 is moderate, which can increase the capacity of the optical communication network while reducing the board area occupied by the socket connector 11 on the single board 1.
同理地,第二表面2312上的引脚沿金手指连接器23的插接方向可以排列成两排、三排或者四排,在此不做具体限定。随着引脚在第二表面2312排列的排数的增加,金手指连接器23沿自身插接方向的长度越大,与之匹配的插槽连接器11沿插接方向的长度越大,在单板1上的占用面积越大。为了在提升光通信网络的容量的同时,减少插槽连接器11在单板1上的 占板面积,在一些实施例中,如图6所示,第二表面2312上的引脚沿金手指连接器23的插接方向排列成两排,分别为沿着图6中两条虚线排列的两排。这样,引脚在第二表面2312排列的排数适中,能够在提升光通信网络的容量的同时,减少插槽连接器11在单板1上的占板面积。Similarly, the pins on the second surface 2312 can be arranged in two rows, three rows or four rows along the insertion direction of the golden finger connector 23, which is not specifically limited here. As the number of rows of pins arranged on the second surface 2312 increases, the greater the length of the golden finger connector 23 along the insertion direction, the greater the length of the matching socket connector 11 along the insertion direction, and The larger the occupied area on board 1. In order to increase the capacity of the optical communication network while reducing the footprint of the socket connector 11 on the single board 1, in some embodiments, as shown in FIG. 6, the pins on the second surface 2312 are along the golden fingers. The connectors 23 are arranged in two rows in the insertion direction, which are respectively two rows arranged along the two dotted lines in FIG. 6. In this way, the number of rows of pins arranged on the second surface 2312 is moderate, which can increase the capacity of the optical communication network while reducing the board area occupied by the socket connector 11 on the single board 1.
在一些实施例中,第一表面2311和第二表面2312上每排引脚中相邻两个引脚之间的间距为0.8mm,每个引脚的宽度(也即是沿该引脚所处的一排引脚的排列方向上的宽度)为0.5mm。In some embodiments, the distance between two adjacent pins in each row of pins on the first surface 2311 and the second surface 2312 is 0.8mm, and the width of each pin (that is, the distance along the pin is 0.8mm). The width in the arrangement direction of a row of pins at) is 0.5mm.
第一表面2311和第二表面2312上多排引脚内引脚的数量可以相等,也可以不等,在此不做具体限定。在一些实施例中,如图4和图6所示,第一表面2311和第二表面2312上每排引脚内引脚的数量均相等。也就是说,第一表面2311上多排引脚内引脚的数量相等,第二表面2312上多排引脚内引脚的数量相等,第一表面2311上的每排引脚内引脚的数量均与第二表面2312上每排引脚内引脚的数量相等。这样,引脚在第一表面2311和第二表面2312上分布均匀,在不增加金手指连接器23的宽度的情况下,基板231上可以设置更多数量的引脚,使得金手指连接器23能够连接更多数量的光发射接收组件22,从而能够进一步增大网络设备所能够接入的光通信设备的数量,提升光通信网络的容量。The number of pins in the rows of pins on the first surface 2311 and the second surface 2312 may be equal or different, which is not specifically limited here. In some embodiments, as shown in FIGS. 4 and 6, the number of pins in each row of pins on the first surface 2311 and the second surface 2312 are equal. In other words, the number of pins in multiple rows of pins on the first surface 2311 is equal, and the number of pins in multiple rows of pins on the second surface 2312 is equal, and the number of pins in each row of pins on the first surface 2311 is the same. The number is equal to the number of pins in each row of pins on the second surface 2312. In this way, the pins are evenly distributed on the first surface 2311 and the second surface 2312. Without increasing the width of the gold finger connector 23, a larger number of pins can be provided on the substrate 231, so that the gold finger connector 23 A larger number of optical transmitting and receiving components 22 can be connected, so that the number of optical communication devices that the network device can access can be further increased, and the capacity of the optical communication network can be improved.
在上述实施例中,第一表面2311和第二表面2312上每排引脚内引脚的数量可以为9个、10个、11个或者12个,在此不做具体限定。在一些实施例中,如图4和图6所示,第一表面2311和第二表面2312上每排引脚内引脚的数量为11个。In the foregoing embodiment, the number of pins in each row of pins on the first surface 2311 and the second surface 2312 may be 9, 10, 11, or 12, which is not specifically limited here. In some embodiments, as shown in FIGS. 4 and 6, the number of pins in each row of pins on the first surface 2311 and the second surface 2312 is 11.
在多个引脚232内,用于实现不同功能的引脚的长度通常不同,比如接地引脚的长度通常大于电源引脚的长度,电源引脚的长度通常大于用于信号引脚的长度,多个长度不一的引脚在排列成一排时,如图4和图6所示,通常以引脚沿自身长度方向的中点为基准进行排列。这样,前后相邻两排引脚之间以及前排引脚的前侧会出现空隙,这些空隙会造成金手指连接器23在插接于插槽连接器11的过程中,出现插入不顺畅或者卡死等情况。Among the multiple pins 232, the lengths of the pins used to implement different functions are usually different. For example, the length of the ground pin is usually greater than the length of the power pin, and the length of the power pin is usually greater than the length of the signal pin. When multiple pins with different lengths are arranged in a row, as shown in Figs. 4 and 6, they are usually arranged based on the midpoint of the pins along their length. In this way, there will be gaps between the two adjacent rows of pins and the front side of the front row of pins. These gaps will cause the golden finger connector 23 to be inserted into the socket connector 11 incorrectly or incorrectly. Stuck and other situations.
为了避免上述情况,在一些实施例中,如图4和图6所示,沿金手指连接器23的插接方向,基板231的第一表面2311和第二表面2312上,前后相邻两排引脚之间设有第一过渡结构233,该第一过渡结构233与前后相邻两排引脚之间间隔设置,且第一过渡结构233凸出基板231的表面的高度与该前后相邻两排引脚凸出基板231的表面的高度相等。这样,可以通过第一过渡结构233起到平滑作用,以避免金手指连接器23在插接于插槽连接器11的过程中,出现插入不顺畅或者卡死等情况。In order to avoid the above situation, in some embodiments, as shown in FIGS. 4 and 6, along the insertion direction of the golden finger connector 23, the first surface 2311 and the second surface 2312 of the substrate 231 are adjacent to each other in two rows. A first transition structure 233 is provided between the pins. The first transition structure 233 is spaced apart from two rows of pins adjacent to each other in the front and rear, and the height of the first transition structure 233 protruding from the surface of the substrate 231 is adjacent to the front and rear. The heights of the two rows of pins protruding from the surface of the substrate 231 are equal. In this way, the first transition structure 233 can play a smoothing effect, so as to prevent the golden finger connector 23 from being inserted into the socket connector 11 without being smoothly inserted or stuck.
在一些实施例中,如图4和图6所示,沿金手指连接器23的插接方向,基板231的第一表面2311和第二表面2312上,靠近金手指连接器23的前端的一排引脚为第一排引脚c。第一排引脚c的前端不平齐。第一排引脚c中,前端与金手指连接器23的前端之间的距离最小的引脚为第一引脚d,第一排引脚c中除该第一引脚d之外的其余引脚靠近金手指连接器23的前端的一侧均设有第二过渡结构234,第二过渡结构234凸出基板231的表面的高度与第一排引脚c凸出基板231的表面的高度相等,且该第二过渡结构234的前端与第一引脚d的前端平齐。这样,通过第二过渡结构234进一步起到平滑作用,以避免金手指连接器23在插接于插槽连接器11的过程中,出现插入不顺畅或者卡死等情况。In some embodiments, as shown in FIGS. 4 and 6, along the insertion direction of the golden finger connector 23, one of the first surface 2311 and the second surface 2312 of the substrate 231 is close to the front end of the golden finger connector 23. The row of pins is the first row of pins c. The front ends of the pins c of the first row are not flush. In the first row of pins c, the pin with the smallest distance between the front end and the front end of the golden finger connector 23 is the first pin d, and the rest of the first row of pins c except the first pin d The side of the pins close to the front end of the golden finger connector 23 is provided with a second transition structure 234. The height of the second transition structure 234 protruding from the surface of the substrate 231 and the height of the first row of pins c protruding from the surface of the substrate 231 They are equal, and the front end of the second transition structure 234 is flush with the front end of the first pin d. In this way, the second transition structure 234 further has a smoothing effect, so as to prevent the golden finger connector 23 from being inserted into the socket connector 11 from being stuck smoothly or stuck.
图8为本申请一些实施例提供的光模块2中金手指连接器23的基板231的第一表面2311上引脚的定义图,图9为本申请一些实施例提供的光模块2中金手指连接器23的基板231的第二表面2312上引脚的定义图。在一些实施例中,如图8和图9所示,多个引脚232包括电源引脚(比如包括VCCR0、VCCT0、VCCR1、VCCT1),该电源引脚与多个光发射接收组件22电 连接,且该电源引脚与该多个光发射接收组件22之间的电连接线路中串接有缓启动电路(图中未示出)。多个引脚232还包括电源控制引脚(比如图8中的Pow_Ctrl),该电源控制引脚与缓启动电路连接,电源控制引脚用于向缓启动电路传输开关控制信号,通过该开关控制信号可以控制缓启动电路的开关。这样,无需在单板1上设置缓启动电路,从而能够降低单板1的结构复杂度。FIG. 8 is a definition diagram of the pins on the first surface 2311 of the substrate 231 of the gold finger connector 23 of the optical module 2 provided by some embodiments of the application, and FIG. 9 is the gold finger of the optical module 2 provided by some embodiments of the application The definition diagram of the pins on the second surface 2312 of the substrate 231 of the connector 23. In some embodiments, as shown in FIGS. 8 and 9, the plurality of pins 232 include power pins (for example, including VCCR0, VCCT0, VCCR1, VCCT1), and the power pins are electrically connected to the plurality of light emitting and receiving components 22 And a slow-start circuit (not shown in the figure) is connected in series in the electrical connection line between the power pin and the plurality of light emitting and receiving components 22. The multiple pins 232 also include a power control pin (such as Pow_Ctrl in FIG. 8), which is connected to the slow start circuit, and the power control pin is used to transmit a switch control signal to the slow start circuit, and is controlled by the switch The signal can control the switch of the slow start circuit. In this way, there is no need to provide a slow start circuit on the single board 1, so that the structural complexity of the single board 1 can be reduced.
在一些实施例中,如图8和图9所示,电源引脚包括多个发射电源引脚(比如VCCT0和VCCT1)和多个接收电源引脚(比如VCCR0和VCCR1)。多个发射电源引脚的数量与多个光发射接收组件22的数量相等,且多个发射电源引脚与多个光发射接收组件22一一对应,每个发射电源引脚均用于向该发射电源引脚对应的光发射接收组件22中的光发射组件传输电源。多个接收电源引脚的数量与多个光发射接收组件22的数量相等,且多个接收电源引脚与多个光发射接收组件22一一对应,每个接收电源引脚用于向该接收电源引脚对应的光发射接收组件22中的光接收组件供给电源。这样,通过多个发射电源引脚和多个接收电源引脚分别向多个光发射接收组件的光发射组件和光接收组件供电,供电线路彼此独立,便于供电控制和管理。In some embodiments, as shown in FIGS. 8 and 9, the power supply pins include multiple transmit power pins (such as VCCT0 and VCCT1) and multiple receive power pins (such as VCCR0 and VCCR1). The number of multiple transmitting power pins is equal to the number of multiple light transmitting and receiving components 22, and the multiple transmitting power pins correspond to the multiple light transmitting and receiving components 22 one-to-one, and each transmitting power pin is used to The light emitting component in the light emitting and receiving component 22 corresponding to the emitting power pin transmits power. The number of the multiple receiving power pins is equal to the number of the multiple light emitting and receiving components 22, and the multiple receiving power pins are in one-to-one correspondence with the multiple light emitting and receiving components 22, and each receiving power pin is used for receiving The light receiving component in the light emitting and receiving component 22 corresponding to the power pin supplies power. In this way, power is supplied to the light emitting components and the light receiving components of the multiple light emitting and receiving components through the multiple transmitting power pins and the multiple receiving power pins, and the power supply lines are independent of each other, which is convenient for power supply control and management.
在一些实施例中,如图8所示,第一表面2311上每排引脚中均具有接地引脚(GND),接地引脚位于该排引脚的端部。这样,接地引脚可以对该排引脚内的信号引脚起到电屏蔽和防磨损保护的作用。In some embodiments, as shown in FIG. 8, each row of pins on the first surface 2311 has a ground pin (GND), and the ground pin is located at the end of the row of pins. In this way, the ground pin can play the role of electrical shielding and anti-wear protection for the signal pins in the row of pins.
在一些实施例中,如图9所示,第二表面2312上每排引脚中均具有接地引脚(GND),接地引脚位于该排引脚的端部。这样,接地引脚可以对该排引脚内的信号引脚起到电屏蔽和防磨损保护的作用。In some embodiments, as shown in FIG. 9, each row of pins on the second surface 2312 has a ground pin (GND), and the ground pin is located at the end of the row of pins. In this way, the ground pin can play the role of electrical shielding and anti-wear protection for the signal pins in the row of pins.
多个光发射接收组件22在壳体21内可以并排排列,也可以层叠排列,在此不做具体限定。在一些实施例中,如图3所示,多个光发射接收组件22沿垂直于基板231的方向层叠排列。这样一来,可以减小整个光模块2的宽度,有利于减小单板1上相邻两个插槽连接器之间的间距,从而使得单板1上可以设置更多数量的插槽连接器,以连接更多数量的光膜块2,从而进一步增大网络设备能够接入的光通信设备的数量,提升光通信网络的容量。The plurality of light emitting and receiving components 22 may be arranged side by side in the housing 21, or may be stacked and arranged, which is not specifically limited herein. In some embodiments, as shown in FIG. 3, a plurality of light emitting and receiving components 22 are stacked and arranged in a direction perpendicular to the substrate 231. In this way, the width of the entire optical module 2 can be reduced, which is beneficial to reduce the distance between two adjacent slot connectors on the single board 1, so that a larger number of slot connections can be set on the single board 1. To connect a larger number of optical film blocks 2, thereby further increasing the number of optical communication devices that can be accessed by network devices and increasing the capacity of the optical communication network.
多个光发射接收组件22的数量可以为两个、三个或者四个等等,在此不做具体限定。在一些实施例中,如图3所示,多个光发射接收组件22的数量为两个。The number of the multiple light emitting and receiving components 22 may be two, three, four, etc., which is not specifically limited here. In some embodiments, as shown in FIG. 3, the number of the plurality of light emitting and receiving components 22 is two.
由前文描述可知,光发射接收组件22包括光发射组件、光接收组件和波分复用器。光发射组件可以包括一个光发射通道,也可以包括多个光发射通道,在此不做具体限定。光接收组件可以包括一个光接收通道,也可以包括多个光接收通道,在此不做具体限定。It can be seen from the foregoing description that the light emitting and receiving component 22 includes a light emitting component, a light receiving component, and a wavelength division multiplexer. The light emitting component may include one light emitting channel or multiple light emitting channels, which is not specifically limited here. The light receiving component may include one light receiving channel or multiple light receiving channels, which is not specifically limited here.
在一些实施例中,光发射组件包括多个光发射通道,该多个光发射通道发射的光的波长应相区别开,比如包括1577nm波长的光的光发射通道和1490nm波长的光的光发射通道。这样,一个光发射组件集成了多个光发射通道,能够进一步增大网络设备能够接入的光通信设备的数量,提升光通信网络的容量。In some embodiments, the light emitting component includes a plurality of light emitting channels, and the wavelengths of light emitted by the plurality of light emitting channels should be distinguished, for example, a light emitting channel including light with a wavelength of 1577nm and a light emitting channel with a wavelength of 1490nm. aisle. In this way, one optical transmitting component integrates multiple optical transmitting channels, which can further increase the number of optical communication devices that can be accessed by network devices, and increase the capacity of the optical communication network.
在上述实施例中,多个光发射通道的发射速率可以相同,也可以不同,在此不做具体限定。且多个光发射通道的发射速率可以为1Gbit/s、5Gbit/s或者10Gbit/s,在此不做具体限定。在一些实施例中,光发射组件包括1Gbit/s速率的光发射通道和10Gbit/s速率的光发射通道。这样,可以实现高低速搭配,以满足所接入的不同光通信设备所需。In the foregoing embodiment, the emission rates of the multiple light emission channels may be the same or different, which is not specifically limited here. In addition, the emission rate of the multiple optical emission channels may be 1 Gbit/s, 5 Gbit/s, or 10 Gbit/s, which is not specifically limited here. In some embodiments, the light emitting component includes a light emitting channel with a rate of 1 Gbit/s and a light emitting channel with a rate of 10 Gbit/s. In this way, high- and low-speed matching can be realized to meet the needs of different optical communication devices connected.
在一些实施例中,光接收组件包括多个光接收通道,该多个光接收通道接收的光的波长应相区别开,比如包括1310nm波长的光的光接收通道和1270nm波长的光的光接收通道。这 样,一个光接收组件集成了多个光接收通道,能够进一步增大网络设备能够接入的光通信设备的数量,提升光通信网络的容量。In some embodiments, the light receiving component includes multiple light receiving channels. The wavelengths of light received by the multiple light receiving channels should be distinguished. For example, the light receiving channel includes light with a wavelength of 1310nm and light receiving with a wavelength of 1270nm. aisle. In this way, an optical receiving component integrates multiple optical receiving channels, which can further increase the number of optical communication devices that the network device can access, and increase the capacity of the optical communication network.
在上述实施例中,多个光接收通道的接收速率可以相同,也可以不同,在此不做具体限定。且多个光接收通道的接收速率可以为1Gbit/s、5Gbit/s或者10Gbit/s,在此不做具体限定。在一些实施例中,光接收组件包括1Gbit/s速率的光接收通道和10Gbit/s速率的光接收通道。这样,可以实现高低速搭配,以满足所接入的不同光通信设备对不同通信速率的需求。In the foregoing embodiment, the receiving rates of the multiple optical receiving channels may be the same or different, which is not specifically limited here. In addition, the receiving rate of the multiple optical receiving channels may be 1 Gbit/s, 5 Gbit/s, or 10 Gbit/s, which is not specifically limited here. In some embodiments, the optical receiving component includes an optical receiving channel with a rate of 1 Gbit/s and an optical receiving channel with a rate of 10 Gbit/s. In this way, high and low speeds can be matched to meet the requirements of different connected optical communication devices for different communication speeds.
图7为本申请一些实施例提供的光模块2的结构框图。如图7所示,光模块2中集成的光发射接收组件22的数量为两个,两个光发射接收组件22分别为第一光发射接收组件221和第二光发射接收组件222。第一光发射接收组件221包括第一光发射组件2211、第一光接收组件2212和第一波分复用器2213,第一光发射组件2211包括第一光发射通道22111和第二光发射通道22112,第一光接收组件2212包括第一光接收通道22121和第二光接收通道22122。第二光发射接收组件222包括第二光发射组件2221、第二光接收组件2222和第二波分复用器2223,第二光发射组件2221包括第三光发射通道22211和第四光发射通道22212,第二光接收组件2222包括第三光接收通道22221和第四光接收通道22222。第一光发射通道22111和第三光发射通道22211为1Gbit/s速率的光发射通道。第一光接收通道22121和第三光接收通道22221为1Gbit/s速率的光接收通道。第二光发射通道22112和第四光发射通道22212为10Gbit/s速率的光发射通道。第二光接收通道22122和第四光接收通道22222为接收速率可在5Gbit/s和10Gbit/s之间选择的光接收通道。FIG. 7 is a structural block diagram of an optical module 2 provided by some embodiments of the application. As shown in FIG. 7, the number of light emitting and receiving components 22 integrated in the optical module 2 is two, and the two light emitting and receiving components 22 are a first light emitting and receiving component 221 and a second light emitting and receiving component 222 respectively. The first light emitting and receiving component 221 includes a first light emitting component 2211, a first light receiving component 2212, and a first wavelength division multiplexer 2213, and the first light emitting component 2211 includes a first light emitting channel 22111 and a second light emitting channel 22112. The first light receiving component 2212 includes a first light receiving channel 22121 and a second light receiving channel 22122. The second light emitting and receiving component 222 includes a second light emitting component 2221, a second light receiving component 2222, and a second wavelength division multiplexer 2223, and the second light emitting component 2221 includes a third light emitting channel 22211 and a fourth light emitting channel 22212. The second light receiving component 2222 includes a third light receiving channel 22221 and a fourth light receiving channel 22222. The first optical emission channel 22111 and the third optical emission channel 22211 are optical emission channels with a rate of 1 Gbit/s. The first optical receiving channel 22121 and the third optical receiving channel 22221 are optical receiving channels with a rate of 1 Gbit/s. The second optical emission channel 22112 and the fourth optical emission channel 22212 are optical emission channels with a rate of 10 Gbit/s. The second optical receiving channel 22122 and the fourth optical receiving channel 22222 are optical receiving channels whose receiving rate can be selected between 5 Gbit/s and 10 Gbit/s.
图8为图7所示光模块2的金手指连接器23的基板231的第一表面2311的结构示意图,图9为图7所示光模块2的金手指连接器23的基板231的第二表面2312的结构示意图。由图8和图9可知,金手指连接器23上的引脚的序号(标注在图8和图9中)、名称和功能如表1所示。此结构简单,容易实现。8 is a schematic structural view of the first surface 2311 of the substrate 231 of the golden finger connector 23 of the optical module 2 shown in FIG. 7, and FIG. 9 is the second surface 2311 of the substrate 231 of the golden finger connector 23 of the optical module 2 shown in FIG. Schematic diagram of the structure of the surface 2312. It can be seen from FIGS. 8 and 9 that the serial numbers (marked in FIGS. 8 and 9), names and functions of the pins on the golden finger connector 23 are as shown in Table 1. This structure is simple and easy to implement.
表1Table 1
Figure PCTCN2021082212-appb-000001
Figure PCTCN2021082212-appb-000001
Figure PCTCN2021082212-appb-000002
Figure PCTCN2021082212-appb-000002
需要说明的是,表1仅给出了引脚232的定义的示例,并不对本申请实施例构成限定。It should be noted that Table 1 only provides an example of the definition of the pin 232, and does not limit the embodiment of the present application.
在本说明书的描述中,具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner.
最后应说明的是:以上实施例仅用以说明本申请的技术方案,而非对其限制;尽管参照前述实施例对本申请进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the application, not to limit them; although the application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the foregoing embodiments are modified, or some of the technical features are equivalently replaced; these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims (13)

  1. 一种光模块,其特征在于,包括:An optical module, characterized in that it comprises:
    壳体,设有一个电接口和多个光接口;The shell is provided with an electrical interface and multiple optical interfaces;
    多个光发射接收组件,设置于所述壳体内,所述多个光发射接收组件的数量与所述多个光接口的数量相等,所述多个光发射接收组件与所述多个光接口一一对应,每个光发射接收组件的光连接端均与所述光发射接收组件对应的光接口相对;A plurality of light emitting and receiving components are arranged in the housing, the number of the plurality of light emitting and receiving components is equal to the number of the plurality of optical interfaces, and the plurality of light emitting and receiving components are connected to the plurality of optical interfaces One-to-one correspondence, the optical connection end of each light emitting and receiving component is opposite to the corresponding optical interface of the light emitting and receiving component;
    金手指连接器,位于所述电接口内,所述金手指连接器与所述多个光发射接收组件电连接,所述金手指连接器包括基板和设置于所述基板上的多个引脚,所述多个引脚沿所述金手指连接器的插接方向排列成多排。The golden finger connector is located in the electrical interface, the golden finger connector is electrically connected to the plurality of light emitting and receiving components, and the golden finger connector includes a substrate and a plurality of pins arranged on the substrate , The multiple pins are arranged in multiple rows along the insertion direction of the golden finger connector.
  2. 根据权利要求1所述的光模块,其特征在于,所述基板具有相对的第一表面和第二表面,所述多个引脚中的一部分引脚设置于所述第一表面,所述多个引脚中的其余引脚设置于所述第二表面上。The optical module according to claim 1, wherein the substrate has a first surface and a second surface opposite to each other, a part of the pins of the plurality of pins are disposed on the first surface, and the plurality of pins are disposed on the first surface. The remaining pins among the three pins are arranged on the second surface.
  3. 根据权利要求2所述的光模块,其特征在于,所述第一表面上的引脚沿所述金手指连接器的插接方向排列成两排,所述第二表面上的引脚沿所述金手指连接器的插接方向排列成两排。The optical module according to claim 2, wherein the pins on the first surface are arranged in two rows along the insertion direction of the golden finger connector, and the pins on the second surface are arranged along the The insertion directions of the golden finger connectors are arranged in two rows.
  4. 根据权利要求2或3所述的光模块,其特征在于,所述第一表面和所述第二表面上每排引脚内引脚的数量均相等。The optical module according to claim 2 or 3, wherein the number of pins in each row of pins on the first surface and the second surface are equal.
  5. 根据权利要求4所述的光模块,其特征在于,所述第一表面和所述第二表面上每排引脚内引脚的数量均为11个。The optical module according to claim 4, wherein the number of pins in each row of pins on the first surface and the second surface are both 11.
  6. 根据权利要求2-5中任一项所述的光模块,其特征在于,沿所述金手指连接器的插接方向,所述基板的第一表面和第二表面上,前后相邻两排引脚之间设有第一过渡结构,所述第一过渡结构与所述前后相邻两排引脚之间间隔设置,且所述第一过渡结构凸出所述基板的表面的高度与所述前后相邻两排引脚凸出所述基板的表面的高度相等。The optical module according to any one of claims 2-5, wherein along the insertion direction of the golden finger connector, on the first surface and the second surface of the substrate, two rows are adjacent to each other. A first transition structure is provided between the pins, and the first transition structure is spaced apart from the two rows of pins adjacent to the front and rear. The height of the first transition structure protruding from the surface of the substrate is equal The heights of the two adjacent rows of pins protruding from the surface of the substrate are equal.
  7. 根据权利要求2-6中任一项所述的光模块,其特征在于,沿所述金手指连接器的插接方向,所述基板的第一表面和第二表面上,靠近所述金手指连接器的前端的一排引脚为第一排引脚,所述第一排引脚的前端不平齐;The optical module according to any one of claims 2-6, wherein along the insertion direction of the golden finger connector, on the first surface and the second surface of the substrate, close to the golden finger A row of pins at the front end of the connector is the first row of pins, and the front ends of the first row of pins are not flush;
    所述第一排引脚中,前端与所述金手指连接器的前端之间的距离最小的引脚为第一引脚,所述第一排引脚中除所述第一引脚之外的其余引脚靠近所述金手指连接器的前端的一侧均设有第二过渡结构,所述第二过渡结构凸出所述基板的表面的高度与所述第一排引脚凸出所述第一表面的高度相等,且所述第二过渡结构的前端与所述第一引脚的前端平齐。In the first row of pins, the pin with the smallest distance between the front end and the front end of the golden finger connector is the first pin, and the first row of pins except for the first pin The remaining pins on the side close to the front end of the golden finger connector are provided with a second transition structure, and the height of the second transition structure protruding from the surface of the substrate is the same as the protruding position of the first row of pins. The height of the first surface is equal, and the front end of the second transition structure is flush with the front end of the first pin.
  8. 根据权利要求1-7中任一项所述的光模块,其特征在于,所述多个引脚包括电源引脚,所述电源引脚与所述多个光发射接收组件电连接,且所述电源引脚与所述多个光发射接收组件之间的电连接线路中串接有缓启动电路;The optical module according to any one of claims 1-7, wherein the plurality of pins comprise power pins, and the power pins are electrically connected to the plurality of light emitting and receiving components, and A slow-start circuit is connected in series in the electrical connection line between the power supply pin and the plurality of light emitting and receiving components;
    所述多个引脚还包括:The multiple pins further include:
    电源控制引脚,与所述缓启动电路连接,所述电源控制引脚用于向所述缓启动电路传输开关控制信号。The power control pin is connected to the slow start circuit, and the power control pin is used to transmit a switch control signal to the slow start circuit.
  9. 根据权利要求8所述的光模块,其特征在于,所述电源引脚包括多个发射电源引脚和多个接收电源引脚;The optical module according to claim 8, wherein the power supply pin comprises a plurality of transmitting power pins and a plurality of receiving power pins;
    所述多个发射电源引脚的数量与所述多个光发射接收组件的数量相等,且所述多个发射 电源引脚与所述多个光发射接收组件一一对应,每个发射电源引脚均用于向所述发射电源引脚对应的光发射接收组件中的光发射组件供给电源;The number of the multiple transmitting power pins is equal to the number of the multiple light transmitting and receiving components, and the multiple transmitting power pins are in one-to-one correspondence with the multiple light transmitting and receiving components, and each transmitting power source leads The pins are all used to supply power to the light emitting component in the light emitting and receiving component corresponding to the transmitting power pin;
    所述多个接收电源引脚的数量与所述多个光发射接收组件的数量相等,且所述多个接收电源引脚与所述多个光发射接收组件一一对应,每个接收电源引脚均用于向所述接收电源引脚对应的光发射接收组件中的光接收组件供给电源。The number of the plurality of receiving power supply pins is equal to the number of the plurality of light emitting and receiving components, and the plurality of receiving power supply pins corresponds to the plurality of light emitting and receiving components one-to-one, and each receiving power supply leads The pins are all used to supply power to the light receiving component in the light emitting and receiving component corresponding to the receiving power pin.
  10. 根据权利要求1-9中任一项所述的光模块,其特征在于,所述多个光发射接收组件沿垂直于所述基板的方向层叠排列。8. The optical module according to any one of claims 1-9, wherein the plurality of light emitting and receiving components are stacked and arranged in a direction perpendicular to the substrate.
  11. 根据权利要求1-10中任一项所述的光模块,其特征在于,所述多个光发射接收组件的数量为两个。The optical module according to any one of claims 1-10, wherein the number of the plurality of light emitting and receiving components is two.
  12. 根据权利要求1-11中任一项所述的光模块,其特征在于,每个所述光发射接收组件均包括光发射组件、光接收组件和波分复用器;The optical module according to any one of claims 1-11, wherein each of the light emitting and receiving components includes a light emitting component, a light receiving component, and a wavelength division multiplexer;
    所述光发射组件包括多个光发射通道,所述光接收组件包括多个光接收通道。The light emitting component includes a plurality of light emitting channels, and the light receiving component includes a plurality of light receiving channels.
  13. 一种网络设备,其特征在于,包括:A network device, characterized in that it comprises:
    单板,设有插槽连接器;Single board with slot connector;
    权利要求1-12中任一项所述的光模块,所述光模块的金手指连接器配合插接于所述插槽连接器中。The optical module according to any one of claims 1-12, wherein the golden finger connector of the optical module fits and plugs into the socket connector.
PCT/CN2021/082212 2020-03-31 2021-03-22 Optical module and network device WO2021197113A1 (en)

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