WO2021196040A1 - Laser modulé par électro-absorption et module optique - Google Patents

Laser modulé par électro-absorption et module optique Download PDF

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Publication number
WO2021196040A1
WO2021196040A1 PCT/CN2020/082611 CN2020082611W WO2021196040A1 WO 2021196040 A1 WO2021196040 A1 WO 2021196040A1 CN 2020082611 W CN2020082611 W CN 2020082611W WO 2021196040 A1 WO2021196040 A1 WO 2021196040A1
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Prior art keywords
ground
electro
ground terminal
absorption
matching circuit
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PCT/CN2020/082611
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English (en)
Chinese (zh)
Inventor
贺林峰
张胜利
薛迎冬
满江伟
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华为技术有限公司
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Priority to PCT/CN2020/082611 priority Critical patent/WO2021196040A1/fr
Priority to CN202080093001.9A priority patent/CN114946091A/zh
Publication of WO2021196040A1 publication Critical patent/WO2021196040A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management

Definitions

  • This application relates to the technical field of optical modules, and in particular to an electro-absorption modulated laser and an optical module.
  • the electro-absorption modulation laser includes an electro-absorption modulation laser circuit.
  • the electro-absorption modulation laser circuit includes a laser circuit and an electro-absorption modulation circuit.
  • the laser circuit and the electro-absorption modulation circuit are connected to a common ground through a reference ground, and the laser circuit is loaded with a DC signal, and the laser circuit is electrically absorbed.
  • a high frequency AC signal is loaded in the modulation circuit.
  • the size of electro-absorption modulation lasers is getting smaller and smaller, and the distance between the laser circuit and the electro-absorption modulation circuit is getting closer and closer.
  • the high-frequency AC signal in the electro-absorption modulation circuit is likely to affect the laser The laser in the circuit produces interference.
  • the high-frequency signal in the electro-absorption modulation circuit has a particularly prominent effect on the laser in the laser circuit.
  • the embodiments of the present application provide an electro-absorption modulated laser and an optical module, which can reduce the interference of the high-frequency AC signal in the electro-absorption modulation circuit on the laser in the laser circuit, and improve the performance of the electro-absorption modulated laser.
  • some embodiments of the present application provide an electro-absorption modulated laser.
  • the electro-absorption modulated laser includes a laser, a decoupling capacitor, an electro-absorption modulator, a matching circuit, and a ground isolation structure;
  • the decoupling capacitor is connected in parallel with the laser, and the decoupling The capacitor has a ground terminal, and the ground terminal of the decoupling capacitor is used for electrical connection with the reference ground;
  • the matching circuit is connected in parallel with the electro-absorption modulator, the matching circuit has a ground terminal, and the ground terminal of the matching circuit is used for electrical connection with the reference ground; ground isolation structure It is used to prevent electrical signals from flowing from the ground terminal of the matching circuit to the ground terminal of the decoupling capacitor along the reference ground.
  • the ground isolation structure is used to prevent electrical signals from flowing from the ground terminal of the matching circuit to the ground terminal of the decoupling capacitor along the reference ground.
  • the ground isolation structure can reduce The amount of high-frequency electrical signals flowing into the ground terminal of the decoupling capacitor from the ground terminal of the matching circuit along the reference ground can reduce the interference of the high-frequency signal in the electro-absorption modulation circuit on the laser and improve the performance of the electro-absorption modulation laser.
  • the electro-absorption modulated laser further includes a substrate and a reference ground, the substrate having a first surface; the reference ground includes a first reference ground layer, the first reference ground layer is provided on the first surface of the substrate; the decoupling capacitor and the matching circuit are both provided
  • the first surface of the substrate, the ground terminal of the decoupling capacitor and the ground terminal of the matching circuit are electrically connected to the first reference ground layer, and the ground isolation structure is arranged on the first reference ground layer. Since the path of electrical conduction between the ground terminal of the matching circuit and the ground terminal of the decoupling capacitor along the first reference ground layer is relatively short, the ground isolation structure is arranged on the first reference ground layer, which can effectively inhibit the electrical signal from being grounded by the matching circuit. The terminal flows into the ground terminal of the decoupling capacitor along the reference ground.
  • the ground isolation structure is a long slot provided on the first reference ground layer, the position connected to the ground terminal of the decoupling capacitor on the first reference ground layer is the first position, and the ground terminal on the first reference ground layer is connected to the ground terminal of the matching circuit.
  • the connection position is the second position, the long groove is located between the first position and the second position, and the long groove penetrates the first reference formation in a direction perpendicular to the first surface of the substrate.
  • the high-frequency electrical signal at the ground terminal of the matching circuit will not flow from the first reference ground layer to the ground terminal of the decoupling capacitor along a straight path, but needs to bypass the long slot and then flow to the ground terminal of the decoupling capacitor, thereby pulling
  • the ground terminal of the decoupling capacitor and the ground terminal of the matching circuit are electrically conductive paths through the first reference ground layer to prevent electrical signals from flowing from the ground terminal of the matching circuit to the ground terminal of the decoupling capacitor along the first reference ground layer.
  • the long groove penetrates the first reference formation along its length direction.
  • the long slot can break the path of electrical conduction between the ground terminal of the decoupling capacitor and the ground terminal of the matching circuit through the first reference ground layer, and high-frequency electrical signals will not flow from the ground terminal of the matching circuit along the first reference ground layer.
  • the interference intensity of the high-frequency modulation signal in the electro-absorption modulation circuit to the laser is small.
  • the ground isolation structure is a first insulating backing plate, and the first insulating backing plate is provided between the ground terminal of the decoupling capacitor and the first reference ground layer; or, the ground isolation structure is a second insulating backing plate.
  • the second insulating backing plate is provided between the ground terminal of the matching circuit and the first reference ground layer; or, the ground isolation structure includes a first insulating backing plate and a second insulating backing plate, and the first insulating backing plate is provided for the decoupling Between the ground terminal of the capacitor and the first reference ground layer, the second insulating backing plate is provided between the ground terminal of the matching circuit and the first reference ground layer.
  • the electrical connection path between the first reference ground planes achieves the purpose of preventing electrical signals from flowing from the ground terminal of the matching circuit to the ground terminal of the decoupling capacitor along the first reference ground plane.
  • lasers include, but are not limited to, distributed feedback lasers, edge emitting lasers, Fabry-Perot lasers, and vertical cavity surface emitting lasers.
  • the matching circuit includes a matching resistor and a matching capacitor connected in series.
  • the matching capacitor can prevent the DC signal from passing through the matching circuit, and can achieve the purpose of reducing power consumption.
  • the laser and the electro-absorption modulator are integrated into one body.
  • high coupling efficiency and high output power of modulated light can be obtained between the electro-absorption modulator and the laser, and the electro-absorption modulated laser has the advantages of small size and high integration.
  • the ground terminal of the laser, the ground terminal of the decoupling capacitor, the ground terminal of the electro-absorption modulator, and the ground terminal of the matching circuit are all directly set on the reference ground.
  • the ground terminal of the laser, the ground terminal of the decoupling capacitor, the ground terminal of the electro-absorption modulator, and the ground terminal of the matching circuit can be directly welded to the reference ground without an intermediate connection structure, so the structure is simple, the operation is convenient, and the Conducive to the volume miniaturization design of the electro-absorption modulated laser.
  • the substrate further includes a second surface opposite to the first surface;
  • the reference ground further includes a second reference ground layer disposed on the second surface of the substrate, and the first reference ground layer is electrically connected to the second reference ground layer.
  • the area of the reference ground is larger and the grounding performance is better.
  • the reference ground further includes a plurality of metallized vias, an array of the plurality of metallized vias is arranged in the substrate, and the first reference ground layer is electrically connected to the second reference ground layer through the plurality of metallized vias.
  • the appearance of the electro-absorption modulated laser is good, and the structure is simple and easy to realize.
  • the first surface of the substrate includes a first area and a second area, the first area and the second area do not overlap, the first reference ground layer is provided in the first area of the first surface, and the matching circuit except for the ground terminal The rest of the outer part is arranged in the second area of the first surface.
  • the remaining parts of the matching circuit except the ground terminal are combined with each other. Electrical isolation between the first reference ground layers.
  • the electrical connection line in the matching circuit is a metal layer disposed on the second area of the first surface.
  • the dimensional accuracy of the electrical connection lines in the matching circuit can be guaranteed, and the impedance matching performance of the matching circuit can be guaranteed.
  • some embodiments of the present application provide an optical module including the electro-absorption modulated laser as described in any of the above technical solutions.
  • the optical module provided by the embodiment of the present application includes the electro-absorption modulated laser described in any of the above technical solutions
  • the optical module provided in the embodiment of the present application and the electro-absorption modulated laser described in any of the above technical solutions can solve the same technology Problem, and achieve the same expected effect.
  • FIG. 1 is a schematic diagram of the structure of an electro-absorption modulated laser provided by some embodiments of the application;
  • Fig. 2 is a schematic structural diagram of the electro-absorption modulated laser shown in Fig. 1 as viewed from the A direction;
  • Fig. 3 is a circuit diagram of an electro-absorption modulated laser provided by some embodiments of the application.
  • FIG. 4 is a schematic structural diagram of an electro-absorption modulated laser provided by still other embodiments of the application.
  • Fig. 5 is a schematic structural diagram of the electro-absorption modulated laser shown in Fig. 4 as viewed from the direction B;
  • FIG. 6 is a schematic structural diagram of an electro-absorption modulated laser provided by still other embodiments of the application.
  • Fig. 7 is the relationship curve between the interference intensity of the modulation signal in the electro-absorption modulation circuit of the electro-absorption modulation laser shown in Fig. 1 and the electro-absorption modulation circuit of the electro-absorption modulation laser shown in Fig. 4 on the laser and the frequency of the modulation signal loaded to the electro-absorption modulation circuit ;
  • FIG. 8 is a schematic structural diagram of an electro-absorption modulated laser provided by still other embodiments of the application.
  • Fig. 9 is a schematic structural diagram of the electro-absorption modulated laser shown in Fig. 8 as viewed from the C direction;
  • Fig. 10 is the relationship curve between the interference intensity of the modulation signal in the electro-absorption modulation circuit of the electro-absorption modulation laser shown in Fig. 1 and the electro-absorption modulation laser shown in Fig. 8 to the laser and the frequency of the modulation signal loaded to the electro-absorption modulation circuit .
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • the embodiment of the present application provides an optical module, the optical module is applied to an optical communication network, and the optical module includes a transmitter optical subassembly (TOSA), and the transmitter optical subassembly includes an electronic absorption modulation laser (electronic absorption). modulator laser, EML).
  • TOSA transmitter optical subassembly
  • EML electronic absorption modulation laser
  • the embodiments of the present application also provide an electro-absorption modulated laser.
  • the electro-absorption modulated laser is applied to the above-mentioned optical module, and the electro-absorption modulated laser can realize the conversion of electrical signals to optical signals.
  • Fig. 3 is a circuit diagram of an electro-absorption modulated laser provided by some embodiments of the present application.
  • the electro-absorption modulated laser includes an electro-absorption modulated laser circuit 2.
  • the electro-absorption modulated laser circuit 2 includes a laser circuit 21 and an electro-absorption modulation circuit 22.
  • the laser circuit 21 and the electro-absorption modulation circuit 22 are shared by reference ground 4. ⁇ Ground connection.
  • the laser circuit 21 includes a parallel laser 211 and a decoupling capacitor 212.
  • the laser 211 is used to emit laser light.
  • the decoupling capacitor 212 has a ground terminal 2122, and the ground terminal 2122 of the decoupling capacitor 212 is electrically connected to the reference ground 4. .
  • the AC noise in the DC current input to the laser 211 can directly flow into the reference ground through the decoupling capacitor 212, so that the AC noise in the DC current can be removed, and the AC noise can be prevented from affecting the laser 211.
  • FIG. 1 is a schematic diagram of the structure of the electro-absorption modulated laser provided by some embodiments of the application
  • FIG. 2 is a schematic diagram of the structure of the electro-absorption modulated laser shown in FIG. 1 as viewed from the A direction, as shown in FIGS. 1 and 2
  • the laser 211 has a current input terminal 2111 and a ground terminal 2112.
  • the decoupling capacitor 212 has a power supply terminal 2121 and a ground terminal 2122.
  • the power supply terminal 2121 of the decoupling capacitor 212 is electrically connected to the current input terminal 2111 of the laser 211.
  • the ground terminal 2112 and the ground terminal 2122 of the decoupling capacitor 212 are both electrically connected to the reference ground 4.
  • the laser circuit 21 has a simple structure and is easy to implement.
  • the power supply terminal 2121 of the decoupling capacitor 212 and the current input terminal 2111 of the laser 211 may be electrically connected through an electrical connection structure such as a microstrip line, a metal wire, etc., which is not specifically limited herein.
  • an electrical connection structure such as a microstrip line, a metal wire, etc., which is not specifically limited herein.
  • the power supply terminal 2121 of the decoupling capacitor 212 and the current input terminal 2111 of the laser 211 are electrically connected through a metal wire 213.
  • This structure is simple, and the wire 213 can be connected through a wire bonding process. The wire bonding process is mature and therefore easy to implement.
  • ground terminal 2112 of the laser 211 In order to facilitate the electrical connection between the ground terminal 2112 of the laser 211 and the reference ground 4, in some embodiments, as shown in FIG.
  • the ground terminal 2112 is in direct contact with the reference ground 4, and there is no intermediate structure between the ground terminal 2112 of the laser 211 and the reference ground 4. In this way, the ground terminal 2112 of the laser 211 can be directly welded to the reference ground 4, so the structure is simple, the operation is convenient, and the electro-absorption modulated laser has a small size design.
  • the ground terminal 2122 of the decoupling capacitor 212 is directly set on the reference ground 4.
  • the ground terminal 2122 of the decoupling capacitor 212 is in direct contact with the reference ground 4, and there is no intermediate structure between the ground terminal 2122 of the decoupling capacitor 212 and the reference ground 4.
  • the ground terminal 2122 of the decoupling capacitor 212 can be directly welded to the reference ground 4, so the structure is simple, the operation is convenient, and the size and miniaturization design of the electro-absorption modulated laser is facilitated.
  • the laser 211 includes, but is not limited to, a distributed feedback (DFB) laser, an edge emitting laser, a Fabry-perot (FP) laser, and a vertical cavity surface emitting laser.
  • DFB distributed feedback
  • FP Fabry-perot
  • the electro-absorption modulation circuit 22 includes an electro-absorption modulator 221 and a matching circuit 222 connected in parallel.
  • the electro-absorption modulator 221 is used to absorb the laser light emitted by the laser 211 to modulate the laser light emitted by the laser 211.
  • the electro-absorption modulator 221 has high impedance characteristics to electrical signals.
  • the matching circuit 222 has a ground terminal 2222, and the ground terminal 2222 of the matching circuit 222 is electrically connected to the reference ground 4.
  • the electro-absorption modulator 221 Since the electro-absorption modulator 221 has high impedance characteristics for electrical signals, the high-frequency AC signal loaded to the electro-absorption modulator 221 can smoothly enter the reference ground 4 along the matching circuit 222, which is beneficial to the high-frequency modulation signal in the electro-absorption The loading on the modulation circuit 22 reduces signal reflection.
  • the electroabsorption modulator 221 has a modulation signal input terminal 2211 and a ground terminal 2212
  • the matching circuit 222 has a modulation signal input terminal 2221 and a ground terminal 2222.
  • the modulation of the matching circuit 222 The signal input terminal 2221 is electrically connected to the modulation signal input terminal 2211 of the electro-absorption modulator 221, and the ground terminal 2212 of the electro-absorption modulator 221 and the ground terminal 2222 of the matching circuit 222 are both electrically connected to the reference ground 4.
  • the electro-absorption modulation circuit 22 has a simple structure and is easy to implement.
  • the modulation signal input terminal 2221 of the matching circuit 222 and the modulation signal input terminal 2211 of the electro-absorption modulator 221 may be electrically connected through electrical connection structures such as microstrip lines, metal wires, etc., which are not specifically limited here. .
  • electrical connection structures such as microstrip lines, metal wires, etc., which are not specifically limited here. .
  • the modulation signal input terminal 2211 (as shown in FIG. 2) of the electroabsorption modulator 221 and the modulation signal input terminal 2221 of the matching circuit 222 pass through metal
  • the wire 223 is electrically connected. This structure is simple, and the wire 223 can be connected through a wire bonding process. The wire bonding process is mature and therefore easy to implement.
  • the ground terminal 2212 of the electro-absorption modulator 221 is directly arranged on the reference ground 4. That is, the ground terminal 2212 of the electroabsorption modulator 221 is in direct contact with the reference ground 4, and there is no intermediate structure between the ground terminal 2212 of the electroabsorption modulator 221 and the reference ground 4. In this way, the ground terminal 2212 of the electro-absorption modulator 221 can be directly welded to the reference ground 4 without the need for an intermediate electrical connection structure, so the structure is simple, the operation is convenient, and the electro-absorption modulated laser is designed to be miniaturized.
  • the electro-absorption modulator 221 may be separate from the laser 211, or may be integrated with the laser 211, which is not specifically limited here.
  • the electro-absorption modulator 221 and the laser 211 are integrated into one body.
  • the electro-absorption modulator 221 and the laser 211 can be integrated on the same substrate by the metal-organic chemical vapor deposition (MOCVD) growth technology to realize the electro-absorption modulator 221 and the laser 211 Integration.
  • MOCVD metal-organic chemical vapor deposition
  • the matching circuit 222 has various structural forms.
  • the matching circuit 222 only includes a matching resistor 2223, and for example, the matching circuit 222 includes a matching resistor 2223 and a matching capacitor 2224 connected in series, which are not specifically limited herein.
  • the matching capacitor 2224 can prevent the DC signal from passing through the matching circuit 222, which can achieve the purpose of reducing power consumption.
  • FIG. 1 only shows an embodiment in which the matching circuit 222 includes a matching resistor 2223 and a matching capacitor 2224 connected in series, and does not limit the application.
  • the ground terminal 2222 of the matching circuit 222 is directly disposed on the reference ground 4, that is, matching
  • the ground terminal 2222 of the circuit 222 is in direct contact with the reference ground 4, and there is no intermediate structure between the ground terminal 2222 of the matching circuit 222 and the reference ground 4.
  • the ground terminal 2222 of the matching circuit 222 can be directly welded to the reference ground 4, so the structure is simple, the operation is convenient, and it is beneficial to the volume miniaturization design of the electro-absorption modulated laser.
  • the electro-absorption modulator 221 Since the electro-absorption modulator 221 has a high impedance characteristic to electrical signals, the high-frequency signal (that is, the modulation signal) loaded to the electro-absorption modulation circuit 22 mostly flows into the reference ground 4 along the matching circuit 222. Since the ground terminal of the decoupling capacitor 212 and the ground terminal of the matching circuit 222 are both connected to the reference ground 4, as the optical module develops toward a smaller volume, the volume of the electro-absorption modulated laser becomes smaller and smaller, and the ground of the decoupling capacitor 212 The distance between the matching circuit 222 and the grounding terminal of the matching circuit 222 is getting closer.
  • the high-frequency signal of the matching circuit 222 flowing into the reference ground 4 easily flows into the decoupling capacitor 212 along the reference ground 4, and further flows into the laser 211 (high-frequency signal
  • the flow path is shown in the path 1) in Fig. 3, thereby causing interference to the laser 211, especially when the laser 211 works in the low current mode, this effect is particularly prominent.
  • FIG. 4 is a schematic structural diagram of an electro-absorption modulated laser provided by still other embodiments of the application
  • FIG. 5 is a schematic structural diagram of the electro-absorption modulated laser shown in FIG. 4 when viewed from the B direction.
  • the electro-absorption modulated laser not only includes the electro-absorption modulated laser circuit 2 in the embodiment shown in Figures 1 and 2, but also includes a ground isolation structure 3, which is used to suppress The electrical signal flows from the ground terminal 2222 of the matching circuit 222 to the ground terminal 2122 of the decoupling capacitor 212 along the reference ground 4.
  • the ground isolation structure 3 can reduce the amount of high-frequency electrical signals that flow from the ground terminal 2222 of the matching circuit 222 to the ground terminal 2122 of the decoupling capacitor 212 along the reference ground 4, thereby reducing the high frequency in the electro-absorption modulation circuit 22.
  • the interference of the signal to the laser 211 improves the performance of the electro-absorption modulated laser.
  • the ground isolation structure 3 has a variety of structural forms, as long as the electrical signal can be prevented from flowing from the ground terminal 2222 of the matching circuit 222 to the ground terminal 2122 of the decoupling capacitor 212 along the reference ground 4, which is not specifically limited here.
  • the electro-absorption modulated laser further includes a substrate 1 and a reference ground 4.
  • the substrate 1 is made of a dielectric material, and the substrate 1 has a first surface 11.
  • the reference ground 4 includes a first reference ground layer 41, and the first reference ground layer 41 is disposed on the first surface 11 of the substrate 1.
  • the decoupling capacitor 212 and the matching circuit 222 are both disposed on the first surface 11 of the substrate 1, and the ground terminal 2122 of the decoupling capacitor 212 and the ground terminal 2222 of the matching circuit 222 are electrically connected to the first reference ground layer 41, and the ground isolation structure 3 Set on the first reference ground 41.
  • the ground isolation structure 3 is arranged on the first reference ground layer 41, which can effectively suppress The electrical signal flows from the ground terminal 2222 of the matching circuit 222 to the ground terminal 2122 of the decoupling capacitor 212 along the reference ground 4.
  • the ground isolation structure 3 is a long slot provided on the first reference ground layer 41, and the position on the first reference ground layer 41 connected to the ground terminal 2122 of the decoupling capacitor 212 is the first Position, the position on the first reference ground layer 41 connected to the ground terminal 2222 of the matching circuit 222 is the second position, the long groove is located between the first position and the second position, and the long groove is perpendicular to the first surface 11 of the substrate 1 The direction runs through the first reference formation 41.
  • the high-frequency electrical signal of the ground terminal 2222 of the matching circuit 222 will not flow from the first reference ground layer 41 to the ground terminal 2122 of the decoupling capacitor 212 along a straight path, but needs to bypass the long slot and then flow to the decoupling capacitor 212.
  • the ground terminal 2122 of the decoupling capacitor 212 and the ground terminal 2222 of the matching circuit 222 are electrically connected through the first reference ground layer 41, thereby preventing the electrical signal from being grounded by the matching circuit 222.
  • the terminal 2222 flows into the ground terminal 2122 of the decoupling capacitor 212 along the first reference ground layer 41.
  • the long groove may be a straight long groove, an arc-shaped long groove, an L-shaped long groove, etc., which are not specifically limited herein.
  • FIG. 4 only shows an embodiment in which the long groove is an L-shaped long groove, and does not limit the application.
  • the long groove is a straight long groove
  • the length of the long groove can be perpendicular to the line between the first position and the second position, or it can be less than 90° to the line between the first position and the second position The included angle is not specifically limited here.
  • the length of the long slot is not specifically limited, as long as the path of electrical conduction between the ground terminal 2122 of the decoupling capacitor 212 and the ground terminal 2222 of the matching circuit 222 through the first reference ground 41 can be extended.
  • the long slot is located
  • the portion between the first position and the second position is a linear long groove, and the length direction of the linear long groove is perpendicular to the line between the first position and the second position.
  • the high-frequency electrical signal of the ground terminal 2222 of the matching circuit 222 has a longer path to bypass the long slot, which can greatly extend the distance between the ground terminal 2122 of the decoupling capacitor 212 and the ground terminal 2222 of the matching circuit 222.
  • the interference intensity of the modulation signal in the electro-absorption modulation circuit 22 in the electro-absorption modulation laser shown in FIG. 1 on the laser 211 and the modulation signal loaded to the electro-absorption modulation circuit 22 are obtained by simulation.
  • the relationship between the frequency of the electro-absorption modulation circuit 22 in the electro-absorption modulation laser shown in Fig. 4 and the interference intensity of the modulation signal in the electro-absorption modulation circuit 22 to the laser 211 and the frequency of the modulation signal loaded to the electro-absorption modulation circuit 22 are obtained by simulation.
  • the relationship curve 2 between the two, and the relationship curve 1 and the relationship curve 2 are shown in FIG. 7.
  • FIG. 6 is an electrical signal provided by other embodiments of the application.
  • the structural diagram of the absorption modulation laser is shown in FIG. 6, the long slot penetrates the first reference formation 41 along its own length direction. In this way, the long slot can break the path electrically conductive between the ground terminal 2122 of the decoupling capacitor 212 and the ground terminal 2222 of the matching circuit 222 through the first reference ground 41, and high-frequency electrical signals will not be transmitted from the ground terminal of the matching circuit 222.
  • 2222 flows into the ground terminal 2122 of the decoupling capacitor 212 along the first reference ground layer 41, and the interference intensity of the high-frequency modulation signal in the electro-absorption modulation circuit 22 to the laser 211 is relatively small.
  • the long slot only breaks the path electrically conductive between the ground terminal 2122 of the decoupling capacitor 212 and the ground terminal 2222 of the matching circuit 222 through the first reference ground 41, but does not break the decoupling.
  • FIG. 8 is a schematic structural diagram of an electro-absorption modulated laser provided by still other embodiments of this application
  • FIG. 9 is a schematic structural diagram of the electro-absorption modulated laser shown in FIG. 8 as viewed from the C direction.
  • the ground isolation structure 3 is a first insulating backing plate, and the first insulating backing plate is provided between the decoupling capacitor 212 and the first reference ground layer 41.
  • the ground isolation structure 3 is a second insulating backing plate, and the second insulating backing plate is provided between the ground terminal 2222 of the matching circuit 222 and the first reference ground layer 41.
  • the third ground isolation structure 3 includes a first insulating backing plate and a second insulating backing plate, the first insulating backing plate is provided between the decoupling capacitor 212 and the first reference ground layer 41, and the second insulating backing plate is provided Between the ground terminal 2222 of the matching circuit 222 and the first reference ground 41.
  • the grounding terminal 2122 of the decoupling capacitor 212 and the first reference ground 41, the grounding terminal 2222 of the matching circuit 222 and the first reference ground 41, or the grounding of the decoupling capacitor 212 is elongated by the insulating backing plate.
  • the electrical connection path between the terminal 2122 and the ground terminal 2222 of the matching circuit 222 and the first reference ground 41 to suppress electrical signals from flowing from the ground terminal 2222 of the matching circuit 222 to the ground terminal of the decoupling capacitor 212 along the first reference ground 41 The purpose of 2122. This structure is simple and easy to implement.
  • the modulation signal loaded in the electro-absorption modulation circuit 22 is a high-frequency signal, small changes in the structure of the electro-absorption modulation circuit 22 can easily lead to a significant decrease in the performance of the electro-absorption modulation circuit 22. Therefore, in order to To avoid affecting the structure of the electro-absorption modulation circuit 22, a first insulating backing plate should be selected between the ground terminal 2122 of the decoupling capacitor 212 and the first reference ground 41. Since the laser circuit 21 is loaded with a direct current, the change in the structure of the laser circuit 21 has a small impact on the performance, and therefore will not have a major impact on the performance of the electro-absorption modulated laser. Of course, this is not absolute.
  • a second insulating backing plate can also be provided between the ground terminal 2222 of the matching circuit 222 and the first reference ground 41 to achieve The purpose of suppressing the flow of electrical signals from the ground terminal 2222 of the matching circuit 222 to the ground terminal 2122 of the decoupling capacitor 212 along the first reference ground 41.
  • the local isolation structure 3 is the first insulating backing plate
  • the first insulating backing plate is provided There is a metal layer 5, the ground terminal 2122 of the decoupling capacitor 212 is welded to the metal layer 5, and the metal layer 5 is connected to the first reference ground layer 41 by a metal wire 6. This structure is simple and easy to implement.
  • the interference intensity of the modulation signal in the electro-absorption modulation circuit 22 in the electro-absorption modulation laser shown in FIG. 1 to the laser 211 and the modulation signal loaded to the electro-absorption modulation circuit 22 are obtained by simulation.
  • the relationship curve 3 between the frequencies of the electro-absorption modulation laser shown in Figure 8 at the same time, the simulation to obtain the intensity of the interference of the modulation signal in the electro-absorption modulation circuit 22 to the laser 211 and the frequency of the modulation signal loaded to the electro-absorption modulation circuit 22 The relationship curve 4 between, and the relationship curve 3 and the relationship curve 4 are shown in FIG. 10.
  • the interference intensity of the modulation signal to the laser 211 in the electro-absorption modulation circuit 22 of the electro-absorption modulated laser shown in Fig. 8 can be reduced by more than 7 dB.
  • the isolation effect of the ground isolation structure 3 is better.
  • the substrate 1 further has a second surface 12 opposite to the first surface 11.
  • the reference ground 4 further includes a second reference ground layer 42 which is disposed on the substrate.
  • the first reference ground layer 41 is electrically connected to the second reference ground layer 42. In this way, the area of the reference ground 4 is larger, and the grounding performance is better.
  • the first reference ground layer 41 and the second reference ground layer 42 may be electrically connected through a wire, or may be electrically connected through a metalized via, which is not specifically limited herein.
  • the reference ground 4 further includes a plurality of metalized vias 43, the plurality of metalized vias 43 are arranged in an array in the substrate 1, and the first reference ground layer 41 passes through a plurality of metalized vias.
  • the via 43 is electrically connected to the second reference ground layer 42. In this way, the appearance of the electro-absorption modulated laser is good, and the structure is simple and easy to realize.
  • the first surface 11 of the substrate 1 includes a first The area 111 and the second area 112, the first area 111 and the second area 112 do not overlap, the first reference ground layer 41 is provided in the first area 111 of the first surface 11, and the rest of the matching circuit 222 except the ground terminal 2222 Partly disposed in the second area 112 of the first surface 11.
  • the remaining parts of the first reference ground 41 and the matching circuit 222 except the ground terminal 2222 are respectively arranged in two non-overlapping areas on the first surface 11 to realize the matching circuit 222 except the ground terminal 2222.
  • the remaining part is electrically isolated from the first reference ground layer 41.
  • the dimensional accuracy of the electrical connection lines in the matching circuit 222 can be guaranteed, and the impedance matching performance of the matching circuit 222 can be guaranteed.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Optics & Photonics (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)

Abstract

L'invention concerne un laser modulé par électro-absorption et un module optique, qui se rapportent au domaine technique des modules optiques et sont aptes à réduire les interférences de signaux de courant alternatif haute fréquence (AC) dans un circuit de modulation d'électro-absorption sur le laser dans un circuit laser. Le laser modulé par électro-absorption comprend un laser (211), un condensateur de découplage (212), un modulateur d'électro-absorption (221), un circuit d'adaptation (222) et une structure d'isolation à la terre (3) ; le condensateur de découplage (212) est connecté en parallèle au laser (211), le condensateur de découplage (212) comprend une borne de mise à la terre (2122) et la borne de mise à la terre (2122) du condensateur de découplage (212) est utilisée pour le raccordement électrique à la terre de référence (4) ; le circuit d'adaptation (222) est connecté en parallèle au modulateur d'électro-absorption (221), le circuit d'adaptation (222) comprend une borne de mise à la terre (2222) et la borne de mise à la terre (2222) du circuit d'adaptation (222) est utilisée pour un raccordement électrique avec la terre de référence (4) ; et la structure d'isolation à la terre (3) est utilisé pour empêcher un signal électrique provenant de la borne de mise à la terre (2222) du circuit d'adaptation (222) de s'écouler dans la borne de mise à la terre (2122) du condensateur de découplage (212) le long de la terre de référence. Le laser modulé par électro-absorption est utilisé pour convertir un signal électrique en un signal optique.
PCT/CN2020/082611 2020-03-31 2020-03-31 Laser modulé par électro-absorption et module optique WO2021196040A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2020/082611 WO2021196040A1 (fr) 2020-03-31 2020-03-31 Laser modulé par électro-absorption et module optique
CN202080093001.9A CN114946091A (zh) 2020-03-31 2020-03-31 一种电吸收调制激光器和光模块

Applications Claiming Priority (1)

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PCT/CN2020/082611 WO2021196040A1 (fr) 2020-03-31 2020-03-31 Laser modulé par électro-absorption et module optique

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275957A (ja) * 1997-03-31 1998-10-13 Hitachi Ltd 光半導体チップキャリア
CN2917038Y (zh) * 2006-03-24 2007-06-27 深圳飞通光电子技术有限公司 电吸收调制激光器驱动电路
CN101202418A (zh) * 2006-12-13 2008-06-18 中国科学院半导体研究所 用于电吸收调制激光器封装用的热沉
CN110235322A (zh) * 2016-12-09 2019-09-13 弗劳恩霍夫应用研究促进协会 激光装置和用于制造激光装置的方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275957A (ja) * 1997-03-31 1998-10-13 Hitachi Ltd 光半導体チップキャリア
CN2917038Y (zh) * 2006-03-24 2007-06-27 深圳飞通光电子技术有限公司 电吸收调制激光器驱动电路
CN101202418A (zh) * 2006-12-13 2008-06-18 中国科学院半导体研究所 用于电吸收调制激光器封装用的热沉
CN110235322A (zh) * 2016-12-09 2019-09-13 弗劳恩霍夫应用研究促进协会 激光装置和用于制造激光装置的方法

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BAO, NINGNING ET AL.: "Passage; Electronic Practical Course", ELECTRONIC PRACTICAL COURSE, 31 December 2016 (2016-12-31), CN, pages 78 - 79, XP009531268, ISBN: 978-7-118-11038-8 *

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