WO2021189991A1 - 印刷板、印刷器具及基板的印刷方法 - Google Patents

印刷板、印刷器具及基板的印刷方法 Download PDF

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Publication number
WO2021189991A1
WO2021189991A1 PCT/CN2020/137191 CN2020137191W WO2021189991A1 WO 2021189991 A1 WO2021189991 A1 WO 2021189991A1 CN 2020137191 W CN2020137191 W CN 2020137191W WO 2021189991 A1 WO2021189991 A1 WO 2021189991A1
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WO
WIPO (PCT)
Prior art keywords
printing
plate
substrate
printed board
flat plate
Prior art date
Application number
PCT/CN2020/137191
Other languages
English (en)
French (fr)
Inventor
赵斌
肖军城
李嘉
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US17/419,189 priority Critical patent/US20220402260A1/en
Publication of WO2021189991A1 publication Critical patent/WO2021189991A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/50—Screen printing machines for particular purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2217/00—Printing machines of special types or for particular purposes
    • B41P2217/50—Printing presses for particular purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • This application relates to the field of printing technology, in particular to printing plates, printing appliances and printing methods of substrates.
  • screen printing is called universal printing. It can be printed on various substrates, such as various plastics, textiles, metals, glass, printed circuit boards and other materials, and is widely used in advertising, art, construction, publishing, Industrial fields such as printing and dyeing, and electronics. Especially in the electronics industry, the share of screen printing technology is as high as 90%, and the importance of screen printing can be seen from this.
  • a traditional screen printer includes a frame, an alignment component, a printing component, and a conveying component.
  • the alignment component is set on one side of the frame, and the printing component is set on the other side of the frame.
  • the substrate is placed on the alignment component in advance. Alignment, the conveying assembly transports the substrate from the alignment assembly to the printing assembly for printing.
  • the thin film transistor (TFT) process on the glass substrate to drive the sub-millimeter light-emitting diode (LED) shows a new field. Since the glass substrate is more flexible and fragile than the PCB board, it is attached to the surface. During the printing process of the assembly technology, it is easy to cause deformation or breakage of the printing point, which reduces the yield of the printing process.
  • the embodiments of the present application provide a printing method for a printing plate, a printing apparatus, and a substrate.
  • a raised portion is provided on one surface of a flat plate, and a printing hole is arranged on the raised portion, so that the printed hole area on the flat plate is raised Therefore, in the printing process using the printed board, only the protrusions corresponding to the printing holes of the printed board are in contact with the printed board, which can effectively prevent the large-area contact between the printed board and the printed board, and reduce the printed board.
  • the probability of the solder paste scraped on the substrate prevents short circuit of the substrate and improves the yield of the printing process.
  • an embodiment of the present application provides a printed board, including a flat plate, one side surface of the flat plate is provided with a convex portion, the convex portion is provided with a printing hole, and the printing hole penetrates the convex portion And the tablet.
  • a plurality of the protrusions are provided on one side surface of the flat plate, and the plurality of protrusions are arranged at intervals.
  • the multiple protrusions are arranged in an array.
  • the convex portion is provided with a plurality of the printing holes arranged in an array.
  • the depth of the printing hole is 0.05 mm to 2 mm.
  • the height of the protrusion is 0.01 mm to 1 mm.
  • the printing hole is rectangular or circular.
  • the printed board is made of a metal material.
  • an embodiment of the present application provides a printing appliance, the printing appliance includes a printing table and a printing plate adapted to the printing table, the printing plate includes a flat plate, and one side surface of the flat plate is provided with a convex The raised part is provided with a printed hole on the raised part, and the printed hole penetrates the raised part and the flat plate.
  • a plurality of the protrusions are provided on one side surface of the flat plate, and the plurality of protrusions are arranged at intervals.
  • the multiple protrusions are arranged in an array.
  • the convex portion is provided with a plurality of the printing holes arranged in an array.
  • the depth of the printing hole is 0.05 mm to 2 mm.
  • the height of the protrusion is 0.01 mm to 1 mm.
  • the printing hole is rectangular or circular.
  • the printed board is made of a metal material.
  • an embodiment of the present application provides a printing method of a substrate, and the method includes:
  • the printing device is used to print the printed substrate.
  • the printed board provided by the embodiment of the present application includes a flat plate, one side surface of the flat plate is provided with a protrusion, and the protrusion is provided with a printing hole, and the printing hole penetrates the protrusion and the flat plate.
  • a convex portion is provided on one side surface of the plate, and a printing hole is arranged on the convex portion, so that the area of the printing hole on the plate is convex.
  • FIG. 1 is a schematic diagram of a front view structure of a printed board provided by an embodiment of the application
  • FIG. 2 is a schematic diagram of the bottom structure of a printed board provided by an embodiment of the application.
  • FIG. 3 is a schematic flowchart of a printing method of a substrate provided by an embodiment of the application.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the present application, “multiple” means two or more than two, unless otherwise specifically defined.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected or integrally connected it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relation.
  • an intermediate medium it can be the internal communication of two components or the interaction of two components relation.
  • the "above” or “below” of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them.
  • the "above”, “above” and “above” of the first feature on the second feature include the first feature directly above and obliquely above the second feature, or it simply means that the first feature is higher in level than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • the embodiments of the present application provide a printing plate, a printing apparatus, and a printing method of a substrate. Detailed descriptions are given below.
  • FIG. 1 is a schematic diagram of a front view of a printed board provided by an embodiment of the application
  • FIG. 2 is a schematic diagram of a bottom view of the printed board provided by an embodiment of the application.
  • a protrusion 101 is provided on one side surface of the flat plate, and a printing hole 102 is provided on the protrusion, and the printing hole penetrates the protrusion and the flat plate.
  • the printed board is applied to surface mount technology (Surface Mounted Technology) (Surface Mounted Technology, SMT), where SMT is a surface mount component (SMC/SMD for short) that combines leadless or short leads.
  • SMT Surface Mounted Technology
  • SMC/SMD surface mount component
  • Chinese called chip components mounted on a printed circuit board (Printed Circuit Board, PCB) surface or other substrate surface, through reflow soldering or dip soldering and other methods to solder and assemble the circuit assembly technology.
  • the embodiment of the present application provides a raised portion 101 on one side surface of the plate 10, and a printed hole 102 is provided on the raised portion 101, so that the area of the printed hole 102 on the plate 10 is raised.
  • a printed hole 102 is provided on the raised portion 101, so that the area of the printed hole 102 on the plate 10 is raised.
  • one side surface of the flat plate 10 is provided with a plurality of the protrusions 101, and the plurality of protrusions 101 are arranged at intervals.
  • the protrusions 101 correspond to the printing holes 102, and the printing holes 102
  • the distance between the protrusions 101 is not limited here, and it depends on the actual situation.
  • the printed holes on the printed board correspond to all the silk-screened marks that need to be printed on the printed circuit board, respectively.
  • the protrusions 101 are arranged in an array, and the protrusions 101 are provided with a plurality of the printing holes 102 that may be arranged in an array, wherein the depth of the printing holes 102 is 0.05 mm to 2 mm, for example, the depth of the printing hole 102 may be 1 mm, and further, the printing hole 102 may be rectangular or circular, depending on the actual situation.
  • the height of the raised portion 101 is 0.01mm to 1mm. In this embodiment, by setting the height of the raised portion 101 to 0.01mm to 1mm, it can be achieved within the range of 0.01mm to 1mm.
  • the protrusion 101 corresponding to the printing hole 102 is in contact with the printed board, which can effectively prevent the large-area contact between the printed board and the printed board and reduce the scratch of the printed board.
  • the probability of applying tin paste on the substrate prevents short circuit of the substrate, improves the yield of the printing process, and at the same time enables the printed board to maintain a certain degree of stability during the printing process.
  • the printed board is made of a metal material.
  • the printed board may be made of steel or other metal materials, depending on the actual situation.
  • an embodiment of the present application further provides a printing appliance, which includes a printing table and the printing plate adapted to the printing table.
  • the printed board there may be multiple corresponding printing holes and protrusions on the printed board.
  • the number and relative positions of the printing holes and protrusions can be designed according to actual conditions, and the printed board can be adapted to Used in all kinds of printing equipment.
  • a convex portion 101 is provided on one side surface of the plate 10, and a printing hole 102 is provided on the convex portion 101, so that the area of the printing hole 102 on the plate 10 is convex.
  • the protrusions 101 corresponding to the printing holes 102 are in contact with the printed board, which can effectively prevent the large-area contact between the printed board and the printed board, and reduce the scratch of the printed board.
  • the probability of applying solder paste on the substrate prevents short circuit of the substrate and improves the yield of the printing process.
  • an embodiment of the present application also provides a printing method of a substrate, as shown in FIG. include:
  • this embodiment generally adopts screen printing, which is generally composed of a printing plate, a squeegee, ink, a printing table, and a substrate.
  • Screen printing is based on the basic principle that the graphic part of the printing plate is ink-permeable, and the non-graphic part is not ink-permeable.
  • the imprint Due to the viscosity of the ink, the imprint is fixed within a certain range.
  • the squeegee is always in line contact with the printing plate and the substrate, and the contact line moves with the movement of the squeegee, because the printing plate and the substrate are kept constant.
  • the gap makes the printing plate produce a reaction force against the squeegee through its own tension during printing. This reaction force is called resilience. Due to the effect of resilience, the printing plate and the substrate are only in mobile line contact, while other parts of the printing plate and the substrate are in a separated state. The ink and the screen are broken to ensure the printing dimensional accuracy and avoid smearing the substrate.
  • the squeegee is lifted after scraping the entire layout, the printing plate is also lifted at the same time, and the ink is gently scraped back to the initial position. So far is a printing trip.
  • using the printing apparatus to print the punching substrate includes laying the steel mesh on the punching substrate; and using a squeegee to print the punching substrate on which the steel mesh is laid.
  • using a squeegee to print the stencil substrate on which the steel mesh is laid includes: setting the stencil on the stencil substrate; adjusting the relative position of the squeegee and the steel mesh to make the Align with the steel mesh; print the printed substrate.
  • a convex portion 101 is provided on one side surface of the plate 10, and a printing hole 102 is provided on the convex portion 101, so that the area of the printing hole 102 on the plate 10 is convex.
  • the protrusions 101 corresponding to the printing holes 102 are in contact with the printed board, which can effectively prevent the large-area contact between the printed board and the printed board, and reduce the scratch of the printed board.
  • the probability of applying solder paste on the substrate prevents short circuit of the substrate and improves the yield of the printing process.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种印刷板包括平板（10），平板（10）的一侧表面设置有凸起部（101），凸起部（101）上设有印刷孔（102），印刷孔（102）贯穿凸起部（101）和平板（10）。还提供一种印刷器具和一种基板的印刷方法。通过在平板上的一侧表面设置凸起部，并在凸起部上设置印刷孔，使得平板上的印刷孔区域凸起，因此在利用该印刷板进行印刷过程中，该印刷板仅印刷孔对应的凸起部与打件基板相接触，可以有效地防止印刷板与打件基板大面积的接触，降低了印刷板刮到基板上的涂锡膏的概率，防止基板短路，提高了印刷工艺的良品率。

Description

印刷板、印刷器具及基板的印刷方法 技术领域
本申请涉及印刷技术领域，尤其涉及印刷板、印刷器具及基板的印刷方法。
 背景技术
目前，网板印刷被称为万能印刷，它能在各种承印材料进行印刷，如各种塑胶、纺织品、金属、玻璃、印刷电路板等材料，进而广泛应用于广告、美术、建筑、出版、印染、及电子等工业领域。尤其是电子工业，网板印刷技术占有率高达90%，网板印刷的重要性由此可见。
传统的网印机包括机架、对位组件、印刷组件和输送组件，对位组件设置在机架一侧，印刷组件设置在机架的另一侧，将承印物放置在对位组件上预先对位，输送组件将承印物从对位组件中输送到印刷组件中进行印刷工作。
 技术问题
在玻璃基板上进行薄膜晶体管（thin film transistor，TFT）工艺驱动次毫米发光二极管（light-emitting diode-LED）显示为一个新的领域，由于玻璃基板相较于PCB板更加柔软脆弱，在表面贴装技术打件过程中易造成形变造成打件点位偏移或破裂，降低了印刷工艺的良率。
 技术解决方案
本申请实施例提供一种印刷板、印刷器具及基板的印刷方法，通过在平板上的一侧表面设置凸起部，并在凸起部上设置印刷孔，使得平板上的印刷孔区域凸起，因此在利用该印刷板进行印刷过程中，该印刷板仅印刷孔对应的凸起部与打件基板相接触，从而可以有效的防止印刷板与打件基板大面积的接触，降低了印刷板刮到基板上的涂锡膏的概率，防止基板短路，提高了印刷工艺的良率。
一方面，本申请实施例提供一种印刷板，包括平板，所述平板的一侧表面设置有凸起部，所述凸起部上设有印刷孔，所述印刷孔贯穿所述凸起部和所述平板。
在本申请一种可能的实现方式中，所述平板的一侧表面设置有多个所述凸起部，所述多个凸起部间隔设置。
在本申请一种可能的实现方式中，所述多个凸起部呈阵列排布。
在本申请一种可能的实现方式中，所述凸起部设置有呈阵列排布的多个所述印刷孔。
在本申请一种可能的实现方式中，所述印刷孔深度为0.05mm至2mm。
在本申请一种可能的实现方式中，所述凸起部高度为0.01mm至1mm。
在本申请一种可能的实现方式中，所述印刷孔为矩形或圆形。
在本申请一种可能的实现方式中，所述印刷板为金属材料。
另一方面，本申请实施例提供一种印刷器具，所述印刷器具包括印刷台和适配于所述印刷台的印刷板，所述印刷板包括平板，所述平板的一侧表面设置有凸起部，所述凸起部上设有印刷孔，所述印刷孔贯穿所述凸起部和所述平板。
在本申请一种可能的实现方式中，所述平板的一侧表面设置有多个所述凸起部，所述多个凸起部间隔设置。
在本申请一种可能的实现方式中，所述多个凸起部呈阵列排布。
在本申请一种可能的实现方式中，所述凸起部设置有呈阵列排布的多个所述印刷孔。
在本申请一种可能的实现方式中，所述印刷孔深度为0.05mm至2mm。
在本申请一种可能的实现方式中，所述凸起部高度为0.01mm至1mm。
在本申请一种可能的实现方式中，所述印刷孔为矩形或圆形。
在本申请一种可能的实现方式中，所述印刷板为金属材料。
另一方面，本申请实施例提供一种基板的印刷方法，所述方法包括：
准备印刷器具，其中，所述印刷器具为所述的印刷器具；
准备打件基板；
利用所述印刷器具对所述打件基板进行印刷。
 有益效果
本申请实施例提供的印刷板，包括平板，平板的一侧表面设置有凸起部，凸起部上设有印刷孔，印刷孔贯穿凸起部和平板。本申请实施例通过在平板上的一侧表面设置凸起部，并在凸起部上设置印刷孔，使得平板上的印刷孔区域凸起，因此在利用该印刷板进行印刷过程中，该印刷板仅印刷孔对应的凸起部与打件基板相接触，从而可以有效的防止印刷板与打件基板大面积的接触，降低了印刷板刮到基板上的涂锡膏的概率，防止基板短路，提高了印刷工艺的良率。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供的印刷板的正视结构示意图；
图2为本申请实施例提供的印刷板的仰视结构示意图；
图3为本申请实施例提供的基板的印刷方法的流程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
本申请实施例提供一种印刷板、印刷器具及基板的印刷方法。以下分别进行详细说明。
请参阅图1和图2，图1为本申请实施例提供的印刷板的正视结构示意图，图2为本申请实施例提供的印刷板的仰视结构示意图，其中，该印刷板包括平板10，该平板的一侧表面设置有凸起部101，该凸起部上设有印刷孔102，该印刷孔贯穿该凸起部和该平板。
本实施例中，该印刷板应用于表面组装技术（表面贴装技术）（Surface Mounted Technology，SMT），其中，SMT是一种将无引脚或短引线表面组装元器件（简称SMC/SMD，中文称片状元器件）安装在印制电路板（Printed Circuit Board，PCB)的表面或其它基板的表面上，通过再流焊或浸焊等方法加以焊接组装的电路装连技术。
综上可知，本申请实施例通过在平板10上的一侧表面设置凸起部101，并在凸起部101上设置印刷孔102，使得平板10上的印刷孔102区域凸起，因此在利用该印刷板进行印刷过程中，该印刷板仅印刷孔102对应的凸起部101与打件基板相接触，从而可以有效的防止印刷板与打件基板大面积的接触，降低了印刷板刮到基板上的涂锡膏的概率，防止基板短路，提高了印刷工艺的良率。
在一些实施例中，该平板10的一侧表面设置有多个该凸起部101，该多个凸起部101间隔设置，具体的，该凸起部101对应印刷孔102，该印刷孔102与实际印刷结构相对应，其中多个凸起部101的间隔距离在此不作限定，根据实际情况而定。
其中，印刷板上的印刷孔与需印刷在所述印刷电路板上的所有丝印标记分别一一对应。
在一些实施例中，该多个凸起部101呈阵列排布，该凸起部101设置有可以是呈阵列排布的多个该印刷孔102，其中，该印刷孔102深度为0.05mm至2mm，例如该印刷孔102深度可以是1mm，进一步的，该印刷孔102可以是矩形或圆形，具体根据实际情况而定。
在一些实施例中，该凸起部101高度为0.01mm至1mm，本实施例中，通过将该凸起部101的高度设置为0.01mm至1mm，在该0.01mm至1mm区间既可以实现在利用该印刷板进行印刷过程中，该印刷板仅印刷孔102对应的凸起部101与打件基板相接触，从而可以有效的防止印刷板与打件基板大面积的接触，降低了印刷板刮到基板上的涂锡膏的概率，防止基板短路，提高了印刷工艺的良率，同时可以使得印刷板在印刷过程中保持一定的稳定性。
在一些实施例中，该印刷板为金属材料，例如，该印刷板可以是钢材质，也可以是其他金属材质，根据实际情况而定。
为便于更好的实施本申请该印刷板，本申请实施例还提供印刷器具，该印刷器具包括印刷台和适配于该印刷台的该印刷板。
本实施例中，印刷板上对应的印刷孔、凸起部可以是多个，具体的，该印刷孔、凸起部的个数和相对位置可根据实际情况进行设计，该印刷板可适配于各类印刷器具。
综上可知，本申请实施例通过在平板10上的一侧表面设置凸起部101，并在凸起部101上设置印刷孔102，使得平板10上的印刷孔102区域凸起，因此在利用该印刷板进行印刷过程中，该印刷板仅印刷孔102对应的凸起部101与打件基板相接触，从而可以有效的防止印刷板与打件基板大面积的接触，降低了印刷板刮到基板上的涂锡膏的概率，防止基板短路，提高了印刷工艺的良率。
为了便于更好的实施本申请该印刷板，本申请实施例还提供基板的印刷方法，如图3所示，图3为本申请实施例提供的基板的印刷方法的流程示意图，其中，该方法包括：
301、准备印刷器具，其中，该印刷器具为上述实施例该的印刷器具。
302、准备打件基板。
303、利用印刷器具对该打件基板进行印刷。
具体的，本实施例一般采用的是丝网印刷，丝网印刷一般由印刷板、刮印刮板、油墨、印刷台以及承印物构成。丝网印刷是利用印刷板图文部分网孔透油墨，非图文部分网孔不透墨的基本原理进行印刷。
印刷时在印刷板一端上倒入油墨，用刮印刮板在印刷板上的油墨部位施加一定压力，同时朝印刷板另一端移动。油墨在移动中被刮板从图文部分的网孔中挤压到承印物上。
由于油墨的粘性作用而使印迹固着在一定范围之内，印刷过程中刮板始终与印刷板和承印物呈线接触，接触线随刮板移动而移动，由于印刷板与承印物之间保持一定的间隙，使得印刷时的印刷板通过自身的张力而产生对刮板的反作用力，这个反作用力称为回弹力。由于回弹力的作用，使印刷板与承印物只呈移动式线接触，而印刷板其它部分与承印物为脱离状态。使油墨与丝网发生断裂运动，保证了印刷尺寸精度和避免蹭脏承印物。当刮板刮过整个版面后抬起，同时印刷板也抬起，并将油墨轻刮回初始位置。至此为一个印刷行程。
在一些实施例中，该利用该印刷器具对该打件基板进行印刷，包括在该打件基板上铺设该钢网；利用刮刀对铺设有该钢网的该打件基板进行印刷。
在一些实施例中，该利用刮刀对铺设有该钢网的该打件基板进行印刷，包括：在该打件基板上设置该钢网；调整刮刀和该钢网的相对位置，以使该刮刀与该钢网对位；对该打件基板进行印刷。
综上可知，本申请实施例通过在平板10上的一侧表面设置凸起部101，并在凸起部101上设置印刷孔102，使得平板10上的印刷孔102区域凸起，因此在利用该印刷板进行印刷过程中，该印刷板仅印刷孔102对应的凸起部101与打件基板相接触，从而可以有效的防止印刷板与打件基板大面积的接触，降低了印刷板刮到基板上的涂锡膏的概率，防止基板短路，提高了印刷工艺的良率。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种印刷板、印刷器具及基板的印刷方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种印刷板，其中，包括平板，所述平板的一侧表面设置有凸起部，所述凸起部上设有印刷孔，所述印刷孔贯穿所述凸起部和所述平板。
  2. 根据权利要求1所述的印刷版，其中，所述平板的一侧表面设置有多个所述凸起部，所述多个凸起部间隔设置。
  3. 根据权利要求2所述的印刷版，其中，所述多个凸起部呈阵列排布。
  4. 根据权利要求1所述的印刷板，其中，所述凸起部设置有呈阵列排布的多个所述印刷孔。
  5. 根据权利要求1所述的印刷板，其中，所述印刷孔深度为0.05mm至2mm。
  6. 根据权利要求4所述的印刷板，其中，所述印刷孔深度为0.05mm至2mm。
  7. 根据权利要求1所述的印刷板，其中，所述凸起部高度为0.01mm至1mm。
  8. 根据权利要求2所述的印刷板，其中，所述凸起部高度为0.01mm至1mm。
  9. 根据权利要求3所述的印刷板，其中，所述凸起部高度为0.01mm至1mm。
  10. 根据权利要求1所述的印刷板，其中，所述印刷孔为矩形或圆形。
  11. 根据权利要求1所述的印刷板，其中，所述印刷板为金属材料。
  12. 一种印刷器具，其中，所述印刷器具包括印刷台和适配于所述印刷台的印刷板，所述印刷板包括平板，所述平板的一侧表面设置有凸起部，所述凸起部上设有印刷孔，所述印刷孔贯穿所述凸起部和所述平板。
  13. 根据权利要求12所述的印刷器具，其中，所述平板的一侧表面设置有多个所述凸起部，所述多个凸起部间隔设置。
  14. 根据权利要求13所述的印刷器具，其中，所述多个凸起部呈阵列排布。
  15. 根据权利要求12所述的印刷器具，其中，所述凸起部设置有呈阵列排布的多个所述印刷孔。
  16. 根据权利要求12所述的印刷器具，其中，所述印刷孔深度为0.05mm至2mm。
  17. 根据权利要求12所述的印刷器具，其中，所述凸起部高度为0.01mm至1mm。
  18. 根据权利要求12所述的印刷器具，其中，所述印刷孔为矩形或圆形。
  19. 根据权利要求12所述的印刷器具，其中，所述印刷板为金属材料。
  20. 一种基板的印刷方法，其中，所述方法包括：
    准备印刷器具，其中，所述印刷器具为如权利要求12所述的印刷器具；
    准备打件基板；
    利用所述印刷器具对所述打件基板进行印刷。
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