WO2021189861A1 - Capteur à ultrasons - Google Patents

Capteur à ultrasons Download PDF

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Publication number
WO2021189861A1
WO2021189861A1 PCT/CN2020/126108 CN2020126108W WO2021189861A1 WO 2021189861 A1 WO2021189861 A1 WO 2021189861A1 CN 2020126108 W CN2020126108 W CN 2020126108W WO 2021189861 A1 WO2021189861 A1 WO 2021189861A1
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WO
WIPO (PCT)
Prior art keywords
ultrasonic
sensing
ultrasonic transducer
sensor according
transducer
Prior art date
Application number
PCT/CN2020/126108
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English (en)
Chinese (zh)
Inventor
王地宝
范成至
周正三
Original Assignee
神盾股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 神盾股份有限公司 filed Critical 神盾股份有限公司
Publication of WO2021189861A1 publication Critical patent/WO2021189861A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/105—Number of transducers two or more emitters, two or more receivers

Definitions

  • the invention relates to a sensor, in particular to an ultrasonic sensor.
  • the present invention provides an ultrasonic sensor with good ultrasonic fingerprint echo signal quality.
  • the ultrasonic sensor of the present invention includes a sensing array.
  • the sensing array includes a plurality of sensing units arranged in an array, wherein each of the sensing units includes a first ultrasonic transducer and a second ultrasonic transducer.
  • the first ultrasonic transducer is used to transmit and sense ultrasonic waves.
  • the second ultrasonic transducer is used for receiving the reflected ultrasonic wave corresponding to the ultrasonic wave.
  • the first ultrasonic transducer and the second ultrasonic transducer are arranged in parallel on a plane.
  • the first ultrasonic transducer and the second ultrasonic transducer have the same central axis perpendicular to the plane.
  • the ultrasonic sensor of the present invention can transmit and receive ultrasonic waves through a plurality of sensing units arranged in an array among the ultrasonic sensors and arranged on the same plane, so that the ultrasonic sensor can sense signals with good ultrasonic fingerprint echo signal quality. Reflect ultrasonic waves.
  • Fig. 1 is a schematic diagram of an ultrasonic sensor according to an embodiment of the present invention
  • FIG. 2 is a schematic top view of a sensing unit according to an embodiment of the present invention.
  • FIG. 3 is a schematic side sectional view of a sensing unit according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the operation of the ultrasonic sensor of the first embodiment of the present invention.
  • 5A is a transmitter circuit diagram of the ultrasonic sensor of the first embodiment of the present invention.
  • 5B is a receiving circuit diagram of the ultrasonic sensor according to the first embodiment of the present invention.
  • FIG. 6 is a schematic diagram of the operation of the ultrasonic sensor of the second embodiment of the present invention.
  • Fig. 7A is a transmitter circuit diagram of an ultrasonic sensor according to a second embodiment of the present invention.
  • FIG. 7B is a receiving circuit diagram of the ultrasonic sensor of the second embodiment of the present invention.
  • FIG. 8 is a schematic diagram of the operation of the ultrasonic sensor of the third embodiment of the present invention.
  • Fig. 9A is a transmitter circuit diagram of an ultrasonic sensor according to a third embodiment of the present invention.
  • Fig. 9B is a receiving circuit diagram of the ultrasonic sensor according to the third embodiment of the present invention.
  • ultrasonic sensor 100, 400, 600, 800: ultrasonic sensor
  • sensing unit 210, 431 ⁇ 437, 631 ⁇ 635, 831 ⁇ 837: sensing unit;
  • Adhesive layer Adhesive layer
  • Fig. 1 is a schematic diagram of an ultrasonic sensor according to an embodiment of the present invention.
  • the ultrasonic sensor 100 includes a sensing array 110 and an integrated circuit 120.
  • the sensing array 110 includes a plurality of sensing units arranged in an array, and the integrated circuit 120 is coupled to the plurality of sensing units of the sensing array 110.
  • the integrated circuit 120 may be used to drive the plurality of sensing units and receive the sensing results of the plurality of sensing units.
  • the integrated circuit 120 may, for example, include at least one of the driving circuit, the sensing circuit, the delay circuit, and the image synthesis circuit mentioned in the various embodiments of the present invention, but the present invention is not limited thereto.
  • the integrated circuit 120 may include a programmable general-purpose or special-purpose microprocessor (microprocessor), a digital signal processor (digital signal processor, DSP), a programmable controller, and an application-specific integrated circuit ( Application specific integrated circuit (ASIC), graphics processing unit (GPU) or other similar components or a combination of the above components and can be used to implement the relevant functional circuit of the present invention.
  • microprocessor general-purpose or special-purpose microprocessor
  • DSP digital signal processor
  • ASIC application-specific integrated circuit
  • GPU graphics processing unit
  • FIG. 2 is a schematic top view of a sensing unit according to an embodiment of the invention.
  • the top view structure of each sensing unit in the sensing array 110 of FIG. 1 may be the sensing unit 210 shown in FIG. 2.
  • the sensing unit 210 includes ultrasonic transducers 211 and 212.
  • the ultrasonic transducers 211 and 212 may be capacitive ultrasonic micro-transducers (CMUT), but the present invention is not limited thereto.
  • the ultrasonic transducers 211 and 212 are arranged in parallel on a plane formed by extending along the directions D1 and D2, where the directions D1, D2, and D3 are perpendicular to each other.
  • the ultrasonic transducers 211, 212 have the same central axis 210C perpendicular to the plane.
  • the ultrasonic transducer 211 has a ring shape, and the ultrasonic transducer 211 is arranged around the ultrasonic transducer 212 on the plane.
  • the ultrasonic transducer 211 can be used to transmit sensing ultrasonic waves
  • the ultrasonic transducer 212 can be used to receive reflected ultrasonic waves corresponding to the ultrasonic waves.
  • the ultrasonic transducer 212 may also be used to transmit sensing ultrasonic waves
  • the ultrasonic transducer 211 may also be used to receive reflected ultrasonic waves corresponding to the ultrasonic waves.
  • FIG. 3 is a schematic side sectional view of a sensing unit according to an embodiment of the present invention. 2 and 3, FIG. 3 is a side cross-sectional view of the sensing unit 210 of FIG. 2.
  • a support layer 230 is formed on the substrate 220, and the sensing unit 210 is formed in the support layer 230.
  • the ultrasonic transducer 211 includes metal layers 2111, 2112, and the metal layers 2111, 2112 include a dielectric layer 2113 and a cavity 2114 between the metal layers 2111, 2112.
  • the cavity 2114 may include a dielectric material, or have air or It is a vacuum cavity structure.
  • the metal layers 2111, 2112 serve as electrodes, and can be coupled to a driving circuit or a sensing circuit.
  • the ultrasonic transducer 212 includes metal layers 2121, 2122, and the metal layers 2121, 2122 include a dielectric layer 2123 and a cavity 2124 between the metal layers 2121, 2122, wherein the cavity 2124 may include a dielectric material or be a cavity.
  • the metal layers 2121, 2122 serve as electrodes, and can be coupled to a driving circuit or a sensing circuit.
  • at least one of the cavities 2114 and 2124 may be filled with the dielectric material, and the dielectric material may be a soft material.
  • the aforementioned dielectric material may be a polymer material.
  • the metal layers 2111, 2112, 2121, 2122 may be materials such as aluminum (Al), nickel (Ni), titanium (Ti), copper (Cu), or silver (Ag), for example.
  • the dielectric layers 2113 and 2123 can be, for example, a dielectric semiconductor material such as silicon dioxide (Silicon Dioxide), aluminum oxide (Aluminum Oxide), or silicon nitride (Silicon Nitride).
  • the gap between the cavities 2114 and 2124 may be between 0.03 micrometers (um) and 1.5 micrometers, for example.
  • the ultrasonic sensor 400 includes a substrate 420, a support layer 430, an adhesive layer 440, and a panel 450, where the panel 450 can be a light-transmitting panel or a non-light-transmitting panel, such as glass, a display panel, or a general plate. Wait.
  • the ultrasonic sensor 400 includes, for example, sensing units 431 to 437, wherein each of the sensing units 431 to 437 may be the same as the sensing unit 210 in FIGS. 2 and 3 described above.
  • the ultrasonic sensor 400 further includes a driving circuit 460, where the driving circuit 460 is, for example, disposed in the integrated circuit 120 described in the embodiment of FIG. 1, but the present invention is not limited thereto.
  • the driving circuit 460 is coupled in parallel to the ultrasonic transducers 431T to 437T of the sensing units 431 to 437 to output driving signals to the ultrasonic transducers 431T to 437T.
  • the ultrasonic transducers 431T to 437T of the sensing units 431 to 437 simultaneously emit a plurality of sensing ultrasonic waves according to the driving signal, wherein the plurality of sensing ultrasonic waves may be a plurality of spherical waves.
  • the plurality of sensing ultrasonic waves form plane waves.
  • the plane wave is transmitted to the surface of the sensing target 401 through the support layer 430, the adhesive layer 440, and the panel 450, so that the surface of the sensing target 401 generates reflected ultrasonic waves.
  • the reflected ultrasonic waves are transmitted back to the sensing units 431 to 437 via the panel 450, the adhesive layer 440 and the support layer 430.
  • the sensing target 401 may be a finger, and the surface of the sensing target 401 may have fingerprint lines.
  • the ultrasonic transducers 431T to 437T may be, for example, one of the ultrasonic transducer 211 and the ultrasonic transducer 212 of FIG. 2. It is worth noting that the ultrasonic transducers 431T to 437T of the sensing units 431 to 437 of this embodiment can emit sensing ultrasonic waves (medium and low frequency mechanical elastic waves) having a first frequency, where the first frequency can be, for example, 5 to 50 megahertz (MHz).
  • the ultrasonic sensor 400 further includes sensing circuits 481 to 487 and an image synthesis circuit 470.
  • the sensing circuits 481 to 487 and the image synthesis circuit 470 are, for example, disposed in the integrated circuit 120 described in the embodiment of FIG. , But the present invention is not limited to this.
  • the sensing circuits 481 to 487 are coupled to the ultrasonic transducers 431R to 437R of the sensing units 431 to 437 in a one-to-one manner.
  • the ultrasonic transducers 431R to 437R are used to receive the above-mentioned reflected ultrasonic waves, and the sensing circuits 481 to 487 sense the ultrasonic transducers 431R to 437R, and output a plurality of sensing signals to the image synthesis circuit 470.
  • the sensing circuits 481-487 are respectively coupled to the image synthesis circuit 470.
  • the image synthesis circuit 470 generates a sensing image (fingerprint image) according to the plurality of sensing signals.
  • the ultrasonic transducers 431R to 437R may be, for example, the other of the ultrasonic transducer 211 and the ultrasonic transducer 212 of FIG. 2. It is worth noting that the ultrasonic transducers 431R to 437R of the sensing units 431 to 437 of this embodiment can, for example, receive reflected ultrasonic waves having a doubled frequency or a doubled frequency of the first frequency.
  • Fig. 6 is an operation schematic diagram of the ultrasonic sensor of the second embodiment of the present invention.
  • Fig. 7A is a transmission circuit diagram of an ultrasonic sensor according to a second embodiment of the present invention.
  • Fig. 7B is a receiving circuit diagram of the ultrasonic sensor according to the second embodiment of the present invention.
  • the ultrasonic sensor 600 includes a substrate 620, a support layer 630, an adhesive layer 640, and a panel 650.
  • the panel 650 can be a light-transmitting panel or a non-light-transmitting panel, such as glass, a display panel, or a general plate. Wait.
  • the ultrasonic sensor 600 includes, for example, sensing units 631 to 635, wherein each of the sensing units 631 to 635 may be the same as the sensing unit 210 in FIGS. 2 and 3 described above.
  • the ultrasonic sensor 600 further includes delay circuits 661 to 665 and a driving circuit 660.
  • the delay circuits 661 to 665 and the driving circuit 660 are, for example, provided in the integrated circuit 120 described in the embodiment of FIG. The invention is not limited to this.
  • the driving circuit 660 is coupled to the ultrasonic transducers 631T to 635T of the sensing units 631 to 635 in parallel, and the delay circuits 661 to 665 are connected to the ultrasonic transducers 631T to 631T to 631T, respectively, one to one. 635T is coupled in series.
  • the driving circuit 660 outputs driving signals to the delay circuits 661 to 665, so that the delay circuits 661 to 665 provide a plurality of driving signals with different phase delays to the ultrasonic transducers 631T to 635T.
  • the ultrasonic transducers 631T to 635T of the sensing units 631 to 635 transmit a plurality of sensing ultrasonic waves with different phase delays according to the plurality of driving signals with different phase delays, wherein the plurality of sensing ultrasonic waves may be multiple Spherical wave.
  • the plurality of sensing ultrasonic waves with different phase delays may form a focused wave.
  • the focused wave is transmitted to the surface of the sensing target 601 through the support layer 630, the adhesive layer 640, and the panel 650, so that the surface of the sensing target 601 generates reflected ultrasonic waves.
  • the reflected ultrasonic waves are transmitted back to the sensing units 631 to 635 via the panel 650, the adhesive layer 640, and the support layer 630.
  • the sensing target 601 may be a finger, and the surface of the sensing target 601 may have fingerprint lines.
  • the ultrasonic transducers 631T to 635T may be, for example, one of the ultrasonic transducer 211 and the ultrasonic transducer 212 of FIG. 2. It is worth noting that the ultrasonic transducers 631T to 635T of the sensing units 631 to 635 of this embodiment can, for example, emit sensing ultrasonic waves (medium and low frequency mechanical elastic waves) having a first frequency, where the first frequency can be, for example, 5. ⁇ 50 MHz.
  • the ultrasonic sensor 600 further includes sensing circuits 681 to 685 and an image synthesis circuit 670.
  • the sensing circuits 681 to 685 and the image synthesis circuit 670 are, for example, disposed in the integrated circuit 120 described in the embodiment of FIG. 1 , But the present invention is not limited to this.
  • the sensing circuits 681 to 685 are coupled to the ultrasonic transducers 631R to 635R of the sensing units 631 to 635 in a one-to-one manner.
  • the ultrasonic transducers 631R to 635R are used to receive the above-mentioned reflected ultrasonic waves, and the sensing circuits 681 to 685 sense the ultrasonic transducers 631R to 635R, and output a plurality of sensing signals to the image synthesis circuit 670.
  • the sensing circuits 681 to 685 are respectively coupled to the image synthesis circuit 670.
  • the image synthesis circuit 670 generates a sensing image (fingerprint image) according to the plurality of sensing signals.
  • the ultrasonic transducers 631R to 635R may be, for example, the other of the ultrasonic transducer 211 and the ultrasonic transducer 212 of FIG. 2. It is worth noting that the ultrasonic transducers 631R to 635R of the sensing units 631 to 635 of this embodiment can receive reflected ultrasonic waves having a doubled frequency or a doubled frequency of the first frequency.
  • Fig. 8 is an operation schematic diagram of the ultrasonic sensor of the third embodiment of the present invention.
  • Fig. 9A is a transmission circuit diagram of an ultrasonic sensor according to a third embodiment of the present invention.
  • Fig. 9B is a receiving circuit diagram of the ultrasonic sensor according to the third embodiment of the present invention.
  • the ultrasonic sensor 800 includes a substrate 820, a support layer 830, an adhesive layer 840, and a panel 850.
  • the panel 850 can be a light-transmitting panel or a non-light-transmitting panel, such as glass, a display panel, or a general plate. Wait.
  • the ultrasonic sensor 800 includes, for example, sensing units 831 to 837, wherein each of the sensing units 831 to 837 may be the same as the sensing unit 210 in FIGS. 2 and 3 described above.
  • the ultrasonic sensor 800 further includes driving circuits 861 to 867, wherein the driving circuits 861 to 867 are, for example, provided in the integrated circuit 120 described in the embodiment of FIG. 1, but the present invention is not limited thereto.
  • the driving circuits 861 to 867 are one-to-one coupled to the ultrasonic transducers 831T to 837T of the sensing units 831 to 837 to respectively output multiple driving signals to the ultrasonic transducer 831T at different time points. ⁇ 837T.
  • At least a part of the ultrasonic transducers 831T to 837T of the sensing units 831 to 837 transmits a plurality of sensing ultrasonic waves in a time-sharing manner according to the plurality of driving signals received at different time points, wherein the plurality of sensing ultrasonic waves can be For multiple spherical waves.
  • the sensing units 833 and 836 first transmit sensing ultrasonic waves, then the sensing units 832 and 835 transmit sensing ultrasonic waves, and then the sensing units 831, 834, and 837 transmit sensing ultrasonic waves. Therefore, the plurality of sensing ultrasonic waves may form a plurality of highly directional ultrasonic waves.
  • the multiple high-directivity ultrasonic waves are transmitted to the surface of the sensing target 801 through the support layer 830, the adhesive layer 840, and the panel 850, so that the surface of the sensing target 801 generates reflected ultrasonic waves.
  • the sensing target 801 may be a finger, and the surface of the sensing target 801 may have fingerprint lines.
  • the reflected ultrasonic waves are transmitted back to the sensing units 831 to 837 through the panel 850, the adhesive layer 840, and the support layer 830.
  • the ultrasonic transducers 831T to 837T may be, for example, one of the ultrasonic transducer 211 and the ultrasonic transducer 212 of FIG. 2. It is worth noting that the ultrasonic transducers 831T to 837T of the sensing units 831 to 837 of this embodiment can, for example, emit sensing ultrasonic waves (medium and high frequency mechanical elastic waves) having a second frequency, where the second frequency can be greater than 50, for example. Megahertz (MHz).
  • MHz Megahertz
  • Reference 8 and FIG. 9B ultrasonic sensor 800 further includes sensing circuits 881-887, band-pass filters (band-pass filters) 891-897, and image synthesis circuit 870, in which sensing circuits 881-887, band-pass filters 891-
  • the 897 and the image synthesis circuit 870 are, for example, provided in the integrated circuit 120 described in the embodiment of FIG. 1, but the present invention is not limited to this.
  • the sensing circuits 881 to 887 are coupled to the ultrasonic transducers 831R to 837R of the sensing units 831 to 837 on a one-to-one basis, and the band pass filters 891 to 897 are coupled to the sensing units on a one-to-one basis.
  • Test circuits 881 ⁇ 887 are coupled to the sensing units 831 ⁇ 887.
  • the ultrasonic transducers 831R to 837R are used to receive the aforementioned reflected ultrasonic waves, and the sensing circuits 881 to 887 sense the ultrasonic transducers 831R to 837R, and output a plurality of sensing signals to the band pass filters 891 to 897. It is worth noting that the ultrasonic transducers 831R to 837R of the sensing units 831 to 837 of this embodiment can, for example, receive reflected ultrasonic waves having a frequency doubled or doubled with the second frequency.
  • the band-pass filters 891-897 can separate the sensing signal with the first frequency or double frequency of the second frequency, and combine the sensing signal with the first frequency or double frequency of the second frequency Output to the image synthesis circuit 870.
  • the band-pass filters 891-897 are respectively coupled to the image synthesis circuit 870.
  • the image synthesis circuit 870 generates a sensed image (fingerprint image) according to the filtered multiple sensed signals.
  • the ultrasonic transducers 831R to 837R may be, for example, the other of the ultrasonic transducer 211 and the ultrasonic transducer 212 of FIG. 2.
  • the ultrasonic sensor of the present invention can effectively transmit and receive ultrasonic waves by designing an ultrasonic transducer with a special structure.
  • the ultrasonic sensor of the present invention can form a plane wave by emitting multiple sensing ultrasonic waves at the same time, or can form a focused wave by emitting multiple sensing ultrasonic waves with different phase delays, or can transmit multiple waves by time-sharing.
  • a highly directional ultrasonic method is used to make the reflected ultrasonic waves received by the ultrasonic sensor have the advantage of a high signal-to-noise ratio, thereby generating a sensed image with good image quality.

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  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Image Input (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Abstract

L'invention concerne un capteur à ultrasons (100), comprenant un réseau de détection (110), le réseau de détection (110) comprenant de multiples unités de détection (210) disposées en réseau, chacune des multiples unités de détection (210) comprenant un premier transducteur ultrasonore (211) et un second transducteur ultrasonore (212), respectivement ; le premier transducteur ultrasonore (211) est utilisé pour émettre une onde ultrasonore détectée ; le second transducteur ultrasonore (212) est utilisé pour recevoir une onde ultrasonore réfléchie correspondant à l'onde ultrasonore ; le premier transducteur ultrasonore (211) et le second transducteur ultrasonore (212) sont agencés en parallèle sur un plan ; et le premier transducteur ultrasonore (211) et le second transducteur ultrasonore (212) ont le même arbre central (210C), qui est perpendiculaire au plan.
PCT/CN2020/126108 2020-03-24 2020-11-03 Capteur à ultrasons WO2021189861A1 (fr)

Applications Claiming Priority (2)

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US202062993722P 2020-03-24 2020-03-24
US62/993,722 2020-03-24

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WO2021189861A1 true WO2021189861A1 (fr) 2021-09-30

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TW (2) TWI758930B (fr)
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TWI758930B (zh) * 2020-03-24 2022-03-21 神盾股份有限公司 超聲波感測器
CN114812638A (zh) * 2021-01-21 2022-07-29 茂丞科技(深圳)有限公司 阵列式超声波感测器

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TW202136984A (zh) 2021-10-01
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TWM610272U (zh) 2021-04-11
CN112229916A (zh) 2021-01-15

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