WO2021189798A1 - Method for preparing cuw90 material by using spherical tungsten powder - Google Patents

Method for preparing cuw90 material by using spherical tungsten powder Download PDF

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Publication number
WO2021189798A1
WO2021189798A1 PCT/CN2020/118482 CN2020118482W WO2021189798A1 WO 2021189798 A1 WO2021189798 A1 WO 2021189798A1 CN 2020118482 W CN2020118482 W CN 2020118482W WO 2021189798 A1 WO2021189798 A1 WO 2021189798A1
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Prior art keywords
adhesive
workpiece
tungsten powder
sintering furnace
copper
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PCT/CN2020/118482
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French (fr)
Chinese (zh)
Inventor
周宁
周兴
康迪
刘萍
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陕西斯瑞新材料股份有限公司
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Publication of WO2021189798A1 publication Critical patent/WO2021189798A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10Formation of a green body
    • B22F10/14Formation of a green body by jetting of binder onto a bed of metal powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/60Treatment of workpieces or articles after build-up
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/1003Use of special medium during sintering, e.g. sintering aid
    • B22F3/1007Atmosphere
    • B22F3/101Changing atmosphere
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/14Both compacting and sintering simultaneously
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24After-treatment of workpieces or articles
    • B22F3/26Impregnating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/045Alloys based on refractory metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/0475Impregnated alloys
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C27/00Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04Alloys based on tungsten or molybdenum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10Processes characterised by the sequence of their steps
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Definitions

  • the invention belongs to the technical field of material preparation, and specifically relates to a method for preparing CuW90 material by using spherical tungsten powder.
  • the tungsten-copper alloy electrode is a composite metal material made of high-purity tungsten powder and high-purity, high-plasticity, high-conductivity copper powder, and refined through static pressing, high-temperature sintering, and melting. Good electrical conductivity, low thermal expansion, no softening at high temperature, high strength, high density, and high hardness.
  • the CuW90 material is widely used. It is often used in the electrical contact contact industry of power switches, rocket nozzles in aerospace and heat dissipation materials of semiconductor integrated circuit chips. Especially as a heat dissipation material for chips, it has high thermal conductivity and low expansion characteristics and is widely used.
  • 3D printing technology was originally called rapid prototyping technology or rapid prototyping technology. It was developed based on modern CAD/CAM technology, mechanical engineering, layered manufacturing technology, laser technology, computer numerical control technology, precision servo drive technology and new material technology. Advanced manufacturing technology. It is based on a computer three-dimensional digital model, which is decomposed into multi-layer plane slices through software. Then the CNC molding system uses laser beams, hot melt nozzles, etc. to layer and bond the bondable materials layer by layer, and finally stack and make the product.
  • the commonly used manufacturing methods of CuW90 materials on the market are mold forming-high temperature pre-fired skeleton-high temperature copper infiltration, and then processed into required parts by subsequent machining, which can only be produced into simple shapes. For some occasions with small quantity and many types, the mold production cycle is long and the cost is high. For some parts with complex shapes that cannot be machined, they cannot be produced. Therefore, the present invention designs a method for preparing CuW90 material by using spherical tungsten powder.
  • the present invention provides a method for preparing CuW90 material by using spherical tungsten powder.
  • the technical scheme of the present invention is: a method for preparing CuW90 material by using spherical tungsten powder, which mainly includes the following steps:
  • the rough workpiece is sent to a high-pressure, vacuum dual-purpose high-temperature sintering furnace, the temperature in the high-temperature sintering furnace is increased to 100-200 degrees for preheating for 5-8 minutes, the high-temperature sintering furnace is first filled with hydrogen, and then the furnace is vacuumed To a negative pressure of 2.0 ⁇ 0.3 ⁇ 10 -1 Pa, raise the temperature of the high-temperature sintering furnace to 1000-1100°C at a heating rate of 5°C/min, and blow a directional hydrogen gas flow upward from the bottom of the high-temperature sintering furnace, and the top of the high-temperature sintering furnace continues Vacuum, keep the pressure in the high-temperature sintering furnace balanced, evaporate and blow off the adhesive in the rough blank of the workpiece, and the blowing time is 5-8h;
  • the copper powder is made into a copper powder embryo that can be sleeved outside the sintered tungsten billet, and the copper powder embryo is sleeved outside the sintered tungsten billet and placed in a high-temperature sintering furnace, sintered and infiltrated at 1350-1400°C for 40-60 minutes, after cooling Obtain CuW90 material.
  • the workpiece model can be split into the part model, and the rough parts of the lead parts can be obtained according to the process of S2, and the parts are separated between the S3 process.
  • the rough blank is assembled and bonded firmly, and the subsequent processing is carried out as a whole, which can meet the preparation of more precise and complex workpieces.
  • the tungsten powder is industrial tungsten powder with a purity of 15-65 ⁇ m and a purity of 99.99%
  • the copper powder is copper powder with a purity of 5-7 ⁇ m and a purity of 99.99%.
  • the mass ratio of tungsten powder to copper powder is 9:1. .
  • the adhesive is any one of urea-formaldehyde-modified furan resin, phenol-formaldehyde-modified furan resin, ketone-formaldehyde-modified furan resin, and urea-formaldehyde-phenol-formaldehyde-modified furan resin.
  • the artifact has an impact.
  • a collection device for collecting vaporized adhesive gas is installed at the mouth of the high-temperature sintering furnace to prevent the removed adhesive from being directly discharged into the air, causing air pollution.
  • the density of the prepared sintered tungsten billet is 15-15.5 g/cm 3 to ensure the performance of the sintered tungsten billet.
  • the flow rate of the directional hydrogen gas flow blown upward from the bottom of the high-temperature sintering furnace is 3-5m/s, and the directional hydrogen gas flow is blown by the rough workpiece, not directly to the rough workpiece. It will cause damage to the rough blank of the workpiece, and it can avoid the disordered movement of the adhesive in the high-temperature sintering furnace by not directly blowing the rough blank of the workpiece.
  • the processes of S1-S4 are all performed in a dust-free environment to avoid environmental impurities from affecting the process.
  • the preparation process of the copper kit is: directly print the adhesive model with the same shape as the rough blank of the workpiece made of tungsten powder through the 3D spray printer with the adhesive, and then print the adhesive model on the adhesive model. Pave the copper powder evenly to obtain a copper workpiece with an adhesive model inside. After standing for 8-10 hours, cut the copper workpiece, remove the adhesive model, and then use the S3 process to sinter the cut copper workpiece after degumming The copper powder blank is obtained, and the sintered copper blank can completely cover the sintered tungsten blank for copper infiltration, the copper infiltration is uniform, and the obtained workpiece has excellent mechanical properties.
  • the method for preparing CuW90 material using spherical tungsten powder provided by the present invention has the following advantages compared with the prior art:
  • the copper powder is made into a sintered copper billet that can be sleeved outside the sintered tungsten billet.
  • the sintered copper billet can completely cover the sintered tungsten billet for copper infiltration, and the copper infiltration is uniform.
  • Embodiment 1 A method for preparing CuW90 material by using spherical tungsten powder, which mainly includes the following steps:
  • the tungsten powder is 15 ⁇ m industrial tungsten powder with a purity of 99.99%, and the adhesive is phenolic modified furan resin;
  • the rough workpiece is sent to a high-pressure, vacuum dual-purpose high-temperature sintering furnace, the temperature in the high-temperature sintering furnace is increased to 180 degrees for preheating for 8 minutes, the high-temperature sintering furnace is first filled with hydrogen, and then the furnace is vacuumed to a negative pressure of 2.0 ⁇ 10 -1 Pa, raise the temperature of the high-temperature sintering furnace to 1100°C at a heating rate of 5°C/min, and blow a directional hydrogen gas flow from the bottom of the high-temperature sintering furnace upwards, with a flow rate of 3m/s, and the directional hydrogen gas flow through the workpiece. Blow by the side of the blank, not directly to the rough workpiece.
  • the top of the high-temperature sintering furnace is continuously vacuumed to keep the pressure in the high-temperature sintering furnace balanced, and the adhesive in the rough workpiece is evaporated and blown away.
  • the blowing time is 6h, and the high-temperature sintering
  • the furnace mouth is provided with a collection device for collecting vaporized adhesive gas;
  • the preparation process of the copper kit is as follows: : Directly print the adhesive model with the same shape as the rough workpiece made of tungsten powder with the adhesive through the 3D spray printer, and then evenly spread the copper powder on the adhesive model to obtain the copper with the adhesive model inside. For the workpiece, cut the copper workpiece after standing for 10 hours, remove the adhesive model from it, and then use the S3 process to sinter and degum the cut copper workpiece to obtain a copper powder embryo;
  • the copper powder embryo is sleeved outside the sintered tungsten blank and placed in a high-temperature sintering furnace, sintered and infiltrated at 1400°C for 50 minutes, and cooled to obtain CuW90 material;
  • Example 2 Basically the same as Example 1, but the difference is that a more complex or larger-sized workpiece is prepared.
  • the workpiece model can be split into the part model, and the collars are respectively prepared according to the process of S2.
  • the rough parts are assembled and bonded firmly between the S3 process, and the subsequent processing is carried out as a whole.
  • Embodiment 3 It is basically the same as Embodiment 1, except that: in S3, the directed hydrogen gas flow is directly blown to the rough workpiece to blow away the evaporated adhesive on the rough workpiece.
  • Example 4 Basically the same as Example 1, the difference is: in S4, the copper powder is made into a copper block, the sintered tungsten billet is placed in a high-temperature sintering furnace, and the copper block is placed on top of the sintered tungsten billet. Sintering and infiltrating at °C for 50 minutes, turning the sintered tungsten blank after cooling, repeating the above copper infiltration step, and finally obtaining CuW90 material.
  • Example 1 The methods of Example 1 and Example 4 were used to prepare CuW90 materials, and the properties of the prepared CuW90 materials were tested. The results are shown in Table 1.
  • the CuW90 material prepared by the method provided in the examples has high density, excellent conductivity, high hardness and high softening temperature, and the overall performance is better than that of the CuW90 material in Example 1 and the prior art.
  • Example 1 and Example 3 The sintering and degumming processes provided in Example 1 and Example 3 were used to perform sintering and degumming of rough workpieces with the same parameters, and the content of the binder in the prepared sintered tungsten blanks were detected respectively.
  • the binder content in the sintered tungsten billet prepared by the process provided in Example 1 is less than 0.33%, the surface of the sintered tungsten billet and the interior of the high-temperature sintering furnace have no adhesive residue, and the surface of the sintered tungsten billet is intact;
  • the binder content in the sintered tungsten blank prepared by the process provided in Example 3 is greater than 5%, the surface of the sintered tungsten blank and the inside of the high-temperature sintering furnace both have the binder remaining, and there are pits on the surface of the sintered tungsten blank.
  • the directional hydrogen gas flow is blown by the side of the rough workpiece, instead of directly blowing to the rough workpiece, the appearance of pits on the sintered tungsten blank can be avoided, and the adhesive removal efficiency is high, and the surface of the high-temperature sintering furnace There is no adhesive residue and will not pollute the high-temperature sintering furnace.

Abstract

A method for preparing a CuW90 material by using a spherical tungsten powder, comprising the following steps: preparation before printing: inputting data of a workpiece to be prepared to a 3D adhesive-spraying printer, dividing the workpiece into a plurality of slabs arranged in parallel, and filling the 3D adhesive-spraying printer with a tungsten powder and an adhesive; adhesive-spraying 3D printing: applying a layer of adhesive on every tungsten powder layer laid, and applying a further layer of adhesive after the adhesive has penetrated into the tungsten powder, and performing repeated applications until a rough workpiece blank is obtained; sintering and adhesive removal: sending the rough workpiece blank to a high-pressure and vacuum dual-purpose high-temperature sintering furnace, and evaporating and blowing off the adhesive in the rough workpiece blank at a high temperature under negative pressure, and obtaining a sintered tungsten blank by means of high temperature and high pressure sintering; and copper infiltration: preparing a copper powder into a copper powder blank that can be sleeved outside the sintered tungsten blank, and sleeving the copper powder blank outside the sintered tungsten blank, and placing the sleeved blank in a high-temperature sintering furnace and performing infiltration to obtain the CuW90 material.

Description

一种采用球形钨粉制备CuW90材料的方法A method for preparing CuW90 material by using spherical tungsten powder
本申请要求申请日为2020/3/23的中国专利申请202010206834.3的优先权。本申请引用上述中国专利申请的全文。This application claims the priority of the Chinese patent application 202010206834.3 whose filing date is 2020/3/23. This application quotes the full text of the aforementioned Chinese patent application.
技术领域Technical field
本发明属于材料制备技术领域,具体是涉及一种采用球形钨粉制备CuW90材料的方法。The invention belongs to the technical field of material preparation, and specifically relates to a method for preparing CuW90 material by using spherical tungsten powder.
背景技术Background technique
钨铜合金电极是一种由高纯度钨粉和纯度高塑性好的高导电性铜粉结合,通过静压成型,高温烧结,熔融工艺精制而成而成的复合金属材料。良好的导电性、热膨胀小、高温不软化,高强度,高密度,高硬度。CuW90材料应用非常广泛,它常使用在电力开关的电接触触头行业,航空航天的火箭喷口及半导体集成电路芯片的散热材料。尤其是作为芯片的散热材料,它具有高高导热及低膨胀的特性被广泛采用。The tungsten-copper alloy electrode is a composite metal material made of high-purity tungsten powder and high-purity, high-plasticity, high-conductivity copper powder, and refined through static pressing, high-temperature sintering, and melting. Good electrical conductivity, low thermal expansion, no softening at high temperature, high strength, high density, and high hardness. The CuW90 material is widely used. It is often used in the electrical contact contact industry of power switches, rocket nozzles in aerospace and heat dissipation materials of semiconductor integrated circuit chips. Especially as a heat dissipation material for chips, it has high thermal conductivity and low expansion characteristics and is widely used.
3D打印技术最初被称为快速成型技术或快速原型制造技术,它基于现代CAD/CAM技术、机械工程、分层制造技术、激光技术、计算机数控技术、精密伺服驱动技术和新材料技术,开发出先进的制造技术。它基于计算机三维数字模型,通过软件分解为多层平面切片。然后由CNC成型系统使用激光束、热熔喷嘴等逐层层叠和粘合可粘合材料,最后叠加并制作产品。3D printing technology was originally called rapid prototyping technology or rapid prototyping technology. It was developed based on modern CAD/CAM technology, mechanical engineering, layered manufacturing technology, laser technology, computer numerical control technology, precision servo drive technology and new material technology. Advanced manufacturing technology. It is based on a computer three-dimensional digital model, which is decomposed into multi-layer plane slices through software. Then the CNC molding system uses laser beams, hot melt nozzles, etc. to layer and bond the bondable materials layer by layer, and finally stack and make the product.
目前市场上的CuW90材料常用的制造方法是模具成型-高温预烧骨架-高温渗铜,再通过后面的机械加工成需要的零件,只能生产成简单的形状。对于一些数量少,种类多的场合,模具生产周期长,成本高。而对一些复杂形状的,无法采用机械加工的零件,无法生产,所以,本发明设计了一种采用球形钨粉制备CuW90材料的方法。The commonly used manufacturing methods of CuW90 materials on the market are mold forming-high temperature pre-fired skeleton-high temperature copper infiltration, and then processed into required parts by subsequent machining, which can only be produced into simple shapes. For some occasions with small quantity and many types, the mold production cycle is long and the cost is high. For some parts with complex shapes that cannot be machined, they cannot be produced. Therefore, the present invention designs a method for preparing CuW90 material by using spherical tungsten powder.
发明内容Summary of the invention
针对上述存在的问题,本发明提供了一种采用球形钨粉制备CuW90材料的方法。In view of the above-mentioned problems, the present invention provides a method for preparing CuW90 material by using spherical tungsten powder.
本发明的技术方案是:一种采用球形钨粉制备CuW90材料的方法,主要包括以下步骤:The technical scheme of the present invention is: a method for preparing CuW90 material by using spherical tungsten powder, which mainly includes the following steps:
S1:打印前准备S1: Preparation before printing
将需要制备的工件模型资料输入至3D喷胶打印机中,将工件模型平行分割成多个 平板模型,向3D喷胶打印机中装填钨粉作为工件打印材料和用于粘接钨粉的粘接剂;Input the workpiece model data to be prepared into the 3D glue-spraying printer, divide the workpiece model into multiple flat models in parallel, and fill the 3D glue-spraying printer with tungsten powder as the workpiece printing material and the adhesive for bonding the tungsten powder ;
S2:喷胶3D打印S2: Spray glue 3D printing
先在打印版上铺设一层粘接剂,然后按照S1中分隔的平板模型,从下至上铺设钨粉,每铺设一层钨粉在钨粉层上叠加铺设一层粘接剂,粘结剂渗透进钨粉后再铺设一层粘接剂,反复叠加,直至最上层的钨粉铺设完毕,打印好的工件模型在3D喷胶打印机中静置8-10h得到工件粗坯;First lay a layer of adhesive on the printing plate, and then lay tungsten powder from the bottom to the top according to the flat model separated in S1. Each layer of tungsten powder is laid on the tungsten powder layer with a layer of adhesive, adhesive After infiltrating the tungsten powder, lay a layer of adhesive and overlap it repeatedly until the top layer of tungsten powder is laid. The printed workpiece model is left in the 3D spray printer for 8-10 hours to obtain a rough workpiece;
S3:烧结脱胶S3: Sintering degumming
将工件粗坯送至高压、真空两用高温烧结炉中,将高温烧结炉中温度升高至100-200度预热5-8min,先向高温烧结炉中充入氢气,然后抽炉中真空至负压2.0±0.3×10 -1Pa,以5℃/min的升温速率升高高温烧结炉温度至1000-1100℃,从高温烧结炉的底部向上吹入定向氢气气流,高温烧结炉顶部持续抽真空,保持高温烧结炉内压力均衡,将工件粗坯内的粘接剂蒸发吹除,吹除时间为5-8h; The rough workpiece is sent to a high-pressure, vacuum dual-purpose high-temperature sintering furnace, the temperature in the high-temperature sintering furnace is increased to 100-200 degrees for preheating for 5-8 minutes, the high-temperature sintering furnace is first filled with hydrogen, and then the furnace is vacuumed To a negative pressure of 2.0±0.3×10 -1 Pa, raise the temperature of the high-temperature sintering furnace to 1000-1100°C at a heating rate of 5°C/min, and blow a directional hydrogen gas flow upward from the bottom of the high-temperature sintering furnace, and the top of the high-temperature sintering furnace continues Vacuum, keep the pressure in the high-temperature sintering furnace balanced, evaporate and blow off the adhesive in the rough blank of the workpiece, and the blowing time is 5-8h;
关闭高温烧结炉出气口,持续通入氢气使高温烧结炉内压力2.0±0.5×10 -2MPa,升高高温烧结炉内温度至1600-2200℃,烧结温度16-18h,烧结完毕后通入冷却气体急速制冷,得到烧结钨坯; Close the gas outlet of the high-temperature sintering furnace, continue to inject hydrogen to make the pressure in the high-temperature sintering furnace 2.0±0.5×10 -2 MPa, increase the temperature in the high-temperature sintering furnace to 1600-2200℃, and the sintering temperature for 16-18h. After the sintering is completed, pass in The cooling gas is rapidly refrigerated to obtain a sintered tungsten billet;
S4:渗铜S4: Copper infiltration
将铜粉制成可以套接在烧结钨坯外的铜粉胚,将铜粉胚套接在烧结钨坯外放入高温烧结炉中,以1350-1400℃烧结熔渗40-60min,冷却后得到CuW90材料。The copper powder is made into a copper powder embryo that can be sleeved outside the sintered tungsten billet, and the copper powder embryo is sleeved outside the sintered tungsten billet and placed in a high-temperature sintering furnace, sintered and infiltrated at 1350-1400°C for 40-60 minutes, after cooling Obtain CuW90 material.
进一步地,如果制备较为复杂或体积较大的的工件,在S1中,可以将工件模型拆分至零件模型,分别按照S2的工序分别制得领零件粗坯,在S3工序之间将各零件粗坯组装粘接牢固,整体进行后续工艺处理,可以满足更为精密复杂的工件制备。Further, if a more complex or bulky workpiece is prepared, in S1, the workpiece model can be split into the part model, and the rough parts of the lead parts can be obtained according to the process of S2, and the parts are separated between the S3 process. The rough blank is assembled and bonded firmly, and the subsequent processing is carried out as a whole, which can meet the preparation of more precise and complex workpieces.
优选地,所述钨粉选取15-65μm、纯度为99.99%的工业钨粉,铜粉选取5-7μm、纯度为99.99%的铜粉,钨粉与铜粉的取用质量比为9:1。Preferably, the tungsten powder is industrial tungsten powder with a purity of 15-65 μm and a purity of 99.99%, and the copper powder is copper powder with a purity of 5-7 μm and a purity of 99.99%. The mass ratio of tungsten powder to copper powder is 9:1. .
优选地,所述粘接剂为脲醛改性呋喃树脂、酚醛改性呋喃树脂、酮醛改性呋喃树脂、脲醛酚醛改性呋喃树脂的任意一种,粘接效果好且易除去,不会对工件产生影响。Preferably, the adhesive is any one of urea-formaldehyde-modified furan resin, phenol-formaldehyde-modified furan resin, ketone-formaldehyde-modified furan resin, and urea-formaldehyde-phenol-formaldehyde-modified furan resin. The artifact has an impact.
进一步地,所述S3中,在高温烧结炉口设置收集蒸发粘接剂气体的收集装置,避免除去的粘接剂直接排向空气中,造成空气污染。Further, in the S3, a collection device for collecting vaporized adhesive gas is installed at the mouth of the high-temperature sintering furnace to prevent the removed adhesive from being directly discharged into the air, causing air pollution.
优选地,所述S3中,制得的烧结钨坯密度为15-15.5g/cm 3,保证烧结钨坯的性能。 Preferably, in the S3, the density of the prepared sintered tungsten billet is 15-15.5 g/cm 3 to ensure the performance of the sintered tungsten billet.
进一步地,所述S3中,从高温烧结炉的底部向上吹入的定向氢气气流流速为3-5m/s,且定向氢气气流经工件粗坯旁边吹过,不直接吹向工件粗坯,不会对工件粗坯造成损伤,并且不直接吹向工件粗坯可以避免粘接剂在高温烧结炉内无序运动。Further, in the S3, the flow rate of the directional hydrogen gas flow blown upward from the bottom of the high-temperature sintering furnace is 3-5m/s, and the directional hydrogen gas flow is blown by the rough workpiece, not directly to the rough workpiece. It will cause damage to the rough blank of the workpiece, and it can avoid the disordered movement of the adhesive in the high-temperature sintering furnace by not directly blowing the rough blank of the workpiece.
优选地,所述S1-S4的工艺均在无尘环境下进行,避免环境杂质对工艺造成影响。Preferably, the processes of S1-S4 are all performed in a dust-free environment to avoid environmental impurities from affecting the process.
进一步地,所述S4中,铜套件的制备工艺为:通过3D喷胶打印机用粘接剂直接打印与钨粉制成的工件粗坯形状相同的粘接剂模型,然后在粘接剂模型上均匀铺设铜粉得到内部包含有粘接剂模型的铜工件,静置8-10h后将铜工件切割,将其中的粘接剂模型摘除,然后利用S3的工序将切割后的铜工件烧结脱胶后得到铜粉胚,烧结铜坯可以完全覆盖烧结钨坯外进行渗铜,渗铜均匀,制得的工件力学性能优异。Further, in the S4, the preparation process of the copper kit is: directly print the adhesive model with the same shape as the rough blank of the workpiece made of tungsten powder through the 3D spray printer with the adhesive, and then print the adhesive model on the adhesive model. Pave the copper powder evenly to obtain a copper workpiece with an adhesive model inside. After standing for 8-10 hours, cut the copper workpiece, remove the adhesive model, and then use the S3 process to sinter the cut copper workpiece after degumming The copper powder blank is obtained, and the sintered copper blank can completely cover the sintered tungsten blank for copper infiltration, the copper infiltration is uniform, and the obtained workpiece has excellent mechanical properties.
本发明的有益效果是:本发明提供的一种采用球形钨粉制备CuW90材料的方法,相较于现有技术,具有以下优点:The beneficial effects of the present invention are: the method for preparing CuW90 material using spherical tungsten powder provided by the present invention has the following advantages compared with the prior art:
(1)采用球形钨粉喷胶逐层叠加,快速制造一些复杂小型零件的钨坯,再通过高温收缩达到所需要密度的钨坯,适用批量生产复杂的CuW90材料的产品零件;(1) Using spherical tungsten powder spray glue layer by layer to quickly manufacture some tungsten blanks of complex small parts, and then shrink the tungsten blanks to the required density through high temperature shrinkage, which is suitable for mass production of complex CuW90 material product parts;
(2)利用负压脱胶技术将3D喷胶打印掺杂在工件内的粘接剂除去,利用定向气流吹除的方式,既不对工件造成损坏,又可以最大程度除去粘接剂,并且设置粘接剂回收装置,避免除去的粘接剂直接排向空气中,造成空气污染;(2) Use negative pressure degumming technology to remove the adhesive mixed in the workpiece by 3D spray printing, and use the method of directional air blowing to not damage the workpiece, but also to remove the adhesive to the greatest extent, and set the adhesive Adhesive recovery device to prevent the removed adhesive from being directly discharged into the air, causing air pollution;
(3)利用3D喷胶打印技术将铜粉制成可以套接在烧结钨坯外的烧结铜坯,烧结铜坯可以完全覆盖烧结钨坯外进行渗铜,渗铜均匀,制得的工件力学性能优异。(3) Using 3D glue spray printing technology, the copper powder is made into a sintered copper billet that can be sleeved outside the sintered tungsten billet. The sintered copper billet can completely cover the sintered tungsten billet for copper infiltration, and the copper infiltration is uniform. The resulting workpiece mechanics Excellent performance.
具体实施方式Detailed ways
为便于对本发明技术方案的理解,下面结合具体实施例对本发明做进一步的解释说明,实施例并不构成对发明保护范围的限定。In order to facilitate the understanding of the technical solutions of the present invention, the present invention will be further explained in conjunction with specific embodiments below, and the embodiments do not constitute a limitation on the protection scope of the invention.
实施例1:一种采用球形钨粉制备CuW90材料的方法,主要包括以下步骤:Embodiment 1: A method for preparing CuW90 material by using spherical tungsten powder, which mainly includes the following steps:
S1:打印前准备S1: Preparation before printing
将需要制备的工件模型资料输入至3D喷胶打印机中,将工件模型平行分割成多个平板模型,向3D喷胶打印机中装填钨粉作为工件打印材料和用于粘接钨粉的粘接剂,钨粉选取15μm、纯度为99.99%的工业钨粉,粘接剂为酚醛改性呋喃树脂;Input the workpiece model data to be prepared into the 3D glue-spraying printer, divide the workpiece model into multiple flat models in parallel, and fill the 3D glue-spraying printer with tungsten powder as the workpiece printing material and the adhesive for bonding the tungsten powder , The tungsten powder is 15μm industrial tungsten powder with a purity of 99.99%, and the adhesive is phenolic modified furan resin;
S2:喷胶3D打印S2: Spray glue 3D printing
先在打印版上铺设一层粘接剂,然后按照S1中分隔的平板模型,从下至上铺设钨粉,每铺设一层钨粉在钨粉层上叠加铺设一层粘接剂,粘结剂渗透进钨粉后再铺设一层粘接剂,反复叠加,直至最上层的钨粉铺设完毕,打印好的工件模型在3D喷胶打印机中静置10h得到工件粗坯;First lay a layer of adhesive on the printing plate, and then lay tungsten powder from the bottom to the top according to the flat model separated in S1. Each layer of tungsten powder is laid on the tungsten powder layer with a layer of adhesive, adhesive After infiltrating the tungsten powder, lay a layer of adhesive and overlap it repeatedly until the top layer of tungsten powder is laid, and the printed workpiece model is placed in a 3D glue-spraying printer for 10 hours to obtain a rough workpiece;
S3:烧结脱胶S3: Sintering degumming
将工件粗坯送至高压、真空两用高温烧结炉中,将高温烧结炉中温度升高至180度 预热8min,先向高温烧结炉中充入氢气,然后抽炉中真空至负压2.0×10 -1Pa,以5℃/min的升温速率升高高温烧结炉温度至1100℃,从高温烧结炉的底部向上吹入定向氢气气流,流速为3m/s,且定向氢气气流经工件粗坯旁边吹过,不直接吹向工件粗坯,高温烧结炉顶部持续抽真空,保持高温烧结炉内压力均衡,将工件粗坯内的粘接剂蒸发吹除,吹除时间为6h,高温烧结炉口设置收集蒸发粘接剂气体的收集装置; The rough workpiece is sent to a high-pressure, vacuum dual-purpose high-temperature sintering furnace, the temperature in the high-temperature sintering furnace is increased to 180 degrees for preheating for 8 minutes, the high-temperature sintering furnace is first filled with hydrogen, and then the furnace is vacuumed to a negative pressure of 2.0 ×10 -1 Pa, raise the temperature of the high-temperature sintering furnace to 1100°C at a heating rate of 5°C/min, and blow a directional hydrogen gas flow from the bottom of the high-temperature sintering furnace upwards, with a flow rate of 3m/s, and the directional hydrogen gas flow through the workpiece. Blow by the side of the blank, not directly to the rough workpiece. The top of the high-temperature sintering furnace is continuously vacuumed to keep the pressure in the high-temperature sintering furnace balanced, and the adhesive in the rough workpiece is evaporated and blown away. The blowing time is 6h, and the high-temperature sintering The furnace mouth is provided with a collection device for collecting vaporized adhesive gas;
关闭高温烧结炉出气口,持续通入氢气使高温烧结炉内压力2.0×10 -2MPa,升高高温烧结炉内温度至1800℃,烧结温度18h,烧结完毕后通入冷却气体急速制冷,得到密度为15.5g/cm 3的烧结钨坯; Close the gas outlet of the high-temperature sintering furnace, continue to feed hydrogen to make the pressure in the high-temperature sintering furnace 2.0×10 -2 MPa, raise the temperature in the high-temperature sintering furnace to 1800℃, and the sintering temperature for 18 hours. After the sintering is completed, the cooling gas is rapidly cooled to obtain Sintered tungsten blank with a density of 15.5g/cm 3;
S4:渗铜S4: Copper infiltration
选取7μm、纯度为99.99%的铜粉,钨粉与铜粉的取用质量比为9:1,将铜粉制成可以套接在烧结钨坯外的铜粉胚,铜套件的制备工艺为:通过3D喷胶打印机用粘接剂直接打印与钨粉制成的工件粗坯形状相同的粘接剂模型,然后在粘接剂模型上均匀铺设铜粉得到内部包含有粘接剂模型的铜工件,静置10h后将铜工件切割,将其中的粘接剂模型摘除,然后利用S3的工序将切割后的铜工件烧结脱胶后得到铜粉胚;Select 7μm copper powder with a purity of 99.99%, the mass ratio of tungsten powder to copper powder is 9:1, and the copper powder is made into a copper powder embryo that can be sleeved outside the sintered tungsten billet. The preparation process of the copper kit is as follows: : Directly print the adhesive model with the same shape as the rough workpiece made of tungsten powder with the adhesive through the 3D spray printer, and then evenly spread the copper powder on the adhesive model to obtain the copper with the adhesive model inside. For the workpiece, cut the copper workpiece after standing for 10 hours, remove the adhesive model from it, and then use the S3 process to sinter and degum the cut copper workpiece to obtain a copper powder embryo;
将铜粉胚套接在烧结钨坯外放入高温烧结炉中,以1400℃烧结熔渗50min,冷却后得到CuW90材料;The copper powder embryo is sleeved outside the sintered tungsten blank and placed in a high-temperature sintering furnace, sintered and infiltrated at 1400°C for 50 minutes, and cooled to obtain CuW90 material;
S1-S4的工艺均在无尘环境下进行。The processes of S1-S4 are all carried out in a dust-free environment.
实施例2:与实施例1基本相同,不同之处在于:制备较为复杂或体积较大的的工件,在S1中,可以将工件模型拆分至零件模型,分别按照S2的工序分别制得领零件粗坯,在S3工序之间将各零件粗坯组装粘接牢固,整体进行后续工艺处理。Example 2: Basically the same as Example 1, but the difference is that a more complex or larger-sized workpiece is prepared. In S1, the workpiece model can be split into the part model, and the collars are respectively prepared according to the process of S2. For the rough parts, the rough parts are assembled and bonded firmly between the S3 process, and the subsequent processing is carried out as a whole.
实施例3:与实施例1基本相同,不同之处在于:S3中,定向氢气气流直接吹向工件粗坯,将工件粗坯上蒸发的粘接剂吹离。Embodiment 3: It is basically the same as Embodiment 1, except that: in S3, the directed hydrogen gas flow is directly blown to the rough workpiece to blow away the evaporated adhesive on the rough workpiece.
实施例4:与实施例1基本相同,不同之处在于:S4中,将铜粉制成铜块,将烧结钨坯放入高温烧结炉中,将铜块放置在烧结钨坯顶部,以1150℃烧结熔渗50min,冷却后翻转烧结钨坯,重复上述渗铜步骤,最终得到CuW90材料。Example 4: Basically the same as Example 1, the difference is: in S4, the copper powder is made into a copper block, the sintered tungsten billet is placed in a high-temperature sintering furnace, and the copper block is placed on top of the sintered tungsten billet. Sintering and infiltrating at ℃ for 50 minutes, turning the sintered tungsten blank after cooling, repeating the above copper infiltration step, and finally obtaining CuW90 material.
实验例1:研究渗铜方式对CuW90材料制备的影响Experimental example 1: Study the effect of copper infiltration method on the preparation of CuW90 material
利用实施例1、实施例4的方法分别制备CuW90材料,分别检测制备得到的CuW90材料性能,结果如表1所示。The methods of Example 1 and Example 4 were used to prepare CuW90 materials, and the properties of the prepared CuW90 materials were tested. The results are shown in Table 1.
表1不同渗铜方式的得到的CuW90材料性能对比表Table 1 Comparison of properties of CuW90 materials obtained by different copper infiltration methods
组别Group 密度/(g/cm 3) Density/(g/cm 3 ) 导电率/IACSConductivity/IACS 硬度/(HB)Hardness/(HB) 软化温度/℃Softening temperature/℃
实施例1Example 1 17.7517.75 29.3429.34 273.44273.44 950950
实施例4Example 4 18.6418.64 61.3461.34 293.54293.54 980980
结论:利用实施例提供的方法制备得到的CuW90材料密度高、导电率优、硬度高且软化温度高,整体性能优于实施例1与现有技术中CuW90材料的性能。Conclusion: The CuW90 material prepared by the method provided in the examples has high density, excellent conductivity, high hardness and high softening temperature, and the overall performance is better than that of the CuW90 material in Example 1 and the prior art.
实验例2:研究烧结脱胶工艺中定向氢气气流的吹向对工艺的影响Experimental example 2: Study the influence of the blowing direction of the directional hydrogen gas flow on the process in the sintering degumming process
利用实施例1、实施例3分别提供的烧结脱胶工艺对相同参数的工件粗坯进行烧结脱胶,分别检测制备得到的烧结钨坯中粘接剂的含量。The sintering and degumming processes provided in Example 1 and Example 3 were used to perform sintering and degumming of rough workpieces with the same parameters, and the content of the binder in the prepared sintered tungsten blanks were detected respectively.
结果:实施例1提供工艺制备得到的烧结钨坯中粘接剂含量小于0.33%,烧结钨坯表面与高温烧结炉内部无粘接剂残留,且烧结钨坯表面完好;Result: The binder content in the sintered tungsten billet prepared by the process provided in Example 1 is less than 0.33%, the surface of the sintered tungsten billet and the interior of the high-temperature sintering furnace have no adhesive residue, and the surface of the sintered tungsten billet is intact;
而实施例3提供工艺制备得到的烧结钨坯中粘接剂含量大于5%,烧结钨坯表面与高温烧结炉内部均残留有粘接剂,且烧结钨坯表面上有凹坑。However, the binder content in the sintered tungsten blank prepared by the process provided in Example 3 is greater than 5%, the surface of the sintered tungsten blank and the inside of the high-temperature sintering furnace both have the binder remaining, and there are pits on the surface of the sintered tungsten blank.
结论:烧结脱胶工艺中,定向氢气气流经工件粗坯旁边吹过,不直接吹向工件粗坯,可以避免烧结钨坯上凹坑的出现,并且粘接剂脱除效率高,高温烧结炉表面无粘接剂残留,不会对高温烧结炉造成污染。Conclusion: In the sintering degumming process, the directional hydrogen gas flow is blown by the side of the rough workpiece, instead of directly blowing to the rough workpiece, the appearance of pits on the sintered tungsten blank can be avoided, and the adhesive removal efficiency is high, and the surface of the high-temperature sintering furnace There is no adhesive residue and will not pollute the high-temperature sintering furnace.
虽然以上描述了本发明的具体实施方式,但是本领域的技术人员应当理解,这些仅是举例说明,在不背离本发明的原理和实质的前提下,可以对这些实施方式做出多种变更或修改。因此,本发明的保护范围由所附权利要求书限定。Although the specific embodiments of the present invention are described above, those skilled in the art should understand that these are only examples, and various changes or modifications can be made to these embodiments without departing from the principle and essence of the present invention. Revise. Therefore, the protection scope of the present invention is defined by the appended claims.

Claims (9)

  1. 一种采用球形钨粉制备CuW90材料的方法,其特征在于,主要包括以下步骤:A method for preparing CuW90 material by using spherical tungsten powder is characterized in that it mainly includes the following steps:
    S1:打印前准备S1: Preparation before printing
    将需要制备的工件模型资料输入至3D喷胶打印机中,将工件模型平行分割成多个平板模型,向3D喷胶打印机中装填钨粉作为工件打印材料和用于粘接钨粉的粘接剂;Input the workpiece model data to be prepared into the 3D glue-spraying printer, divide the workpiece model into multiple flat models in parallel, and fill the 3D glue-spraying printer with tungsten powder as the workpiece printing material and the adhesive for bonding the tungsten powder ;
    S2:喷胶3D打印S2: Spray glue 3D printing
    先在打印版上铺设一层粘接剂,然后按照S1中分隔的平板模型,从下至上铺设钨粉,每铺设一层钨粉在钨粉层上叠加铺设一层粘接剂,粘结剂渗透进钨粉后再铺设一层粘接剂,反复叠加,直至最上层的钨粉铺设完毕,打印好的工件模型在3D喷胶打印机中静置8-10h,去除多余的粉末,得到工件粗坯;First lay a layer of adhesive on the printing plate, and then lay tungsten powder from the bottom to the top according to the flat model separated in S1. Each layer of tungsten powder is laid on the tungsten powder layer with a layer of adhesive, adhesive After infiltrating the tungsten powder, lay a layer of adhesive and overlap it repeatedly until the top layer of tungsten powder has been laid. The printed workpiece model is placed in a 3D spray printer for 8-10 hours to remove excess powder to obtain a rough workpiece. Billet
    S3:烧结脱胶S3: Sintering degumming
    将工件粗坯送至高压、真空两用高温烧结炉中,将高温烧结炉中温度升高至100-200度预热5-8min,先向高温烧结炉中充入氢气,然后抽炉中真空至负压2.0±0.3×10 -1Pa,以5℃/min的升温速率升高高温烧结炉温度至1000-1100℃,从高温烧结炉的底部向上吹入定向氢气气流,高温烧结炉顶部持续抽真空,保持高温烧结炉内压力均衡,将工件粗坯内的粘接剂蒸发吹除,吹除时间为5-8h; The rough workpiece is sent to a high-pressure, vacuum dual-purpose high-temperature sintering furnace, the temperature in the high-temperature sintering furnace is increased to 100-200 degrees for preheating for 5-8 minutes, the high-temperature sintering furnace is first filled with hydrogen, and then the furnace is vacuumed To a negative pressure of 2.0±0.3×10 -1 Pa, raise the temperature of the high-temperature sintering furnace to 1000-1100°C at a heating rate of 5°C/min, and blow a directional hydrogen gas flow upward from the bottom of the high-temperature sintering furnace, and the top of the high-temperature sintering furnace continues Vacuum, keep the pressure in the high-temperature sintering furnace balanced, evaporate and blow off the adhesive in the rough blank of the workpiece, and the blowing time is 5-8h;
    关闭高温烧结炉出气口,持续通入氢气使高温烧结炉内压力2.0±0.5×10 -2MPa,升高高温烧结炉内温度至1600-2200℃,烧结温度16-18h,烧结完毕后通入冷却气体急速制冷,得到烧结钨坯; Close the gas outlet of the high-temperature sintering furnace, continue to inject hydrogen to make the pressure in the high-temperature sintering furnace 2.0±0.5×10 -2 MPa, increase the temperature in the high-temperature sintering furnace to 1600-2200℃, and the sintering temperature for 16-18h. After the sintering is completed, pass in The cooling gas is rapidly refrigerated to obtain a sintered tungsten billet;
    S4:渗铜S4: Copper infiltration
    将铜粉制成可以套接在烧结钨坯外的铜粉胚,将铜粉胚套接在烧结钨坯外放入高温烧结炉中,以1350-1400℃烧结熔渗40-60min,冷却后得到CuW90材料。The copper powder is made into a copper powder embryo that can be sleeved outside the sintered tungsten billet, and the copper powder embryo is sleeved outside the sintered tungsten billet and placed in a high-temperature sintering furnace, sintered and infiltrated at 1350-1400°C for 40-60 minutes, after cooling Obtain CuW90 material.
  2. 根据权利要求1所述的一种采用球形钨粉制备CuW90材料的方法,其特征在于,所述钨粉选取15-65μm、纯度为99.99%的工业钨粉,铜粉选取5-7μm、纯度为99.99%的铜粉,钨粉与铜粉的取用质量比为9:1。The method for preparing CuW90 material using spherical tungsten powder according to claim 1, wherein the tungsten powder is selected from 15-65 μm industrial tungsten powder with a purity of 99.99%, and the copper powder is selected from 5-7 μm with a purity of 99.99%. 99.99% copper powder, the mass ratio of tungsten powder to copper powder is 9:1.
  3. 根据权利要求1或2所述的一种采用球形钨粉制备CuW90材料的方法,其特征在于,所述粘接剂为脲醛改性呋喃树脂、酚醛改性呋喃树脂、酮醛改性呋喃树脂、脲醛酚醛改性呋喃树脂的任意一种。The method for preparing CuW90 material using spherical tungsten powder according to claim 1 or 2, wherein the adhesive is urea-formaldehyde-modified furan resin, phenol-formaldehyde-modified furan resin, ketone-formaldehyde-modified furan resin, Any of urea-formaldehyde-modified furan resins.
  4. 根据权利要求1-3中至少一项所述的一种采用球形钨粉制备CuW90材料的方法,其特征在于,所述S3中,在高温烧结炉口设置收集蒸发粘接剂气体的收集装置。The method for preparing CuW90 material by using spherical tungsten powder according to at least one of claims 1 to 3, characterized in that, in said S3, a collection device for collecting vaporized adhesive gas is provided at the mouth of the high-temperature sintering furnace.
  5. 根据权利要求1-4中至少一项所述的一种采用球形钨粉制备CuW90材料的方法,其特征在于,所述S3中,制得的烧结钨坯密度为15-15.5g/cm 3The method for preparing CuW90 material by using spherical tungsten powder according to at least one of claims 1 to 4, characterized in that, in the S3, the density of the prepared sintered tungsten green is 15-15.5 g/cm 3 .
  6. 根据权利要求1-5中至少一项所述的一种采用球形钨粉制备CuW90材料的方法,其特征在于,所述S3中,从高温烧结炉的底部向上吹入的定向氢气气流流速为3-5m/s,且定向氢气气流经工件粗坯旁边吹过,不直接吹向工件粗坯。The method for preparing CuW90 material by using spherical tungsten powder according to at least one of claims 1 to 5, characterized in that, in the S3, the flow rate of the directional hydrogen gas flow blown upward from the bottom of the high-temperature sintering furnace is 3 -5m/s, and the directional hydrogen gas flow is blown by the rough blank of the workpiece, not directly to the rough blank of the workpiece.
  7. 根据权利要求1-6中至少一项所述的一种采用球形钨粉制备CuW90材料的方法,其特征在于,所述S3中,从高温烧结炉的底部向上吹入的定向氢气气流流速为3-5m/s。The method for preparing CuW90 material by using spherical tungsten powder according to at least one of claims 1 to 6, characterized in that, in the S3, the flow rate of the directed hydrogen gas flow blown upward from the bottom of the high-temperature sintering furnace is 3 -5m/s.
  8. 根据权利要求1-7中至少一项所述的一种采用球形钨粉制备CuW90材料的方法,其特征在于,所述S1-S4的工艺均在无尘环境下进行。The method for preparing CuW90 material by using spherical tungsten powder according to at least one of claims 1-7, wherein the processes of S1-S4 are all performed in a dust-free environment.
  9. 根据权利要求1-8中至少一项所述的一种采用球形钨粉制备CuW90材料的方法,其特征在于,所述S4中,铜套件的制备工艺为:通过3D喷胶打印机用粘接剂直接打印与钨粉制成的工件粗坯形状相同的粘接剂模型,然后在粘接剂模型上均匀铺设铜粉得到内部包含有粘接剂模型的铜工件,静置8-10h后将铜工件切割,将其中的粘接剂模型摘除,然后利用S3的工序将切割后的铜工件烧结脱胶后得到铜粉胚。The method for preparing CuW90 material using spherical tungsten powder according to at least one of claims 1-8, characterized in that, in the S4, the preparation process of the copper kit is: using an adhesive for a 3D spray printer Directly print the adhesive model with the same shape as the rough blank of the workpiece made of tungsten powder, and then evenly spread the copper powder on the adhesive model to obtain a copper workpiece with the adhesive model inside. After standing for 8-10 hours, the copper The workpiece is cut, the adhesive model is removed, and then the cut copper workpiece is sintered and degummed using the S3 process to obtain a copper powder embryo.
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