WO2021185186A1 - Systems and methods for dew condensation prevention - Google Patents

Systems and methods for dew condensation prevention Download PDF

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Publication number
WO2021185186A1
WO2021185186A1 PCT/CN2021/080629 CN2021080629W WO2021185186A1 WO 2021185186 A1 WO2021185186 A1 WO 2021185186A1 CN 2021080629 W CN2021080629 W CN 2021080629W WO 2021185186 A1 WO2021185186 A1 WO 2021185186A1
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WO
WIPO (PCT)
Prior art keywords
temperature
capture device
heater
dew
image sensor
Prior art date
Application number
PCT/CN2021/080629
Other languages
English (en)
French (fr)
Inventor
Xiaoqiang WAN
Zhenghua Li
Original Assignee
Zhejiang Huaray Technology Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Huaray Technology Co., Ltd. filed Critical Zhejiang Huaray Technology Co., Ltd.
Priority to KR1020227031369A priority Critical patent/KR20220139380A/ko
Priority to JP2022555723A priority patent/JP2023517377A/ja
Publication of WO2021185186A1 publication Critical patent/WO2021185186A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient

Definitions

  • the present disclosure generally relates to a field of image capture, and more particularly relates to systems and methods for dew condensation prevention of a capture device.
  • the image sensor of a capture device (e.g., a camera) is usually cooled to reduce the noise of the image sensor.
  • the temperature of the environment surrounding a lens assembly of the capture device usually drops to tens of degrees below zero.
  • the temperature drops to the dew-point temperature or frost-point temperature, if humidity of the environment is high, water vapor in the environment may be formed dew condensation on a surface of the lens assembly, which may affect the imaging of the capture device. Therefore, it is desirable to provide systems and/or methods for dew condensation prevention of a capture device.
  • a system may include a heater disposed between a lens assembly and an image sensor of a capture device to prevent dew condensation associated with the lens assembly.
  • the system may also include a controller that is electrically coupled with the heater and configured to control the heater to adjust a heating temperature of the heater.
  • the heater may be disposed on a side of the lens assembly that faces the image sensor.
  • the controller may be configured to control the heater based on a temperature of an external environment of the capture device and humidity of the external environment of the capture device.
  • the system may further include a first temperature sensor that is electrically coupled with the controller and configured to detect the temperature of the external environment of the capture device.
  • the system may further include a humidity sensor that is electrically coupled with the controller and configured to detect the humidity of the external environment of the capture device.
  • the controller may be configured to control the heater based further on a temperature of an internal environment of the capture device.
  • the system may further include a second temperature sensor that is disposed inside the capture device, electrically coupled with the controller, and configured to detect the internal temperature of the capture device.
  • the heater may include a positive temperature coefficient (PTC) heating film.
  • PTC positive temperature coefficient
  • the controller may include a detection unit that is electrically coupled with the PTC heating film, and configured to detect a value of resistance of the PTC heating film and determine a temperature of the PTC heating film based on the value of resistance.
  • the temperature of the PTC heating film may be determined as the temperature of the internal environment of the capture device.
  • the system may include a cooling assembly disposed on a side of the image sensor away from the lens assembly.
  • the cooling assembly may include a cooler configured to cool the image sensor.
  • the cooling assembly may also include a heat transferring member configured to transfer heat between the image sensor and the cooler.
  • the cooling assembly may also include a heat insulation member.
  • a sealed space may be formed based on the cooler and the heat insulation member.
  • the heat transferring member may be disposed inside the sealed space and between the image sensor and the cooler.
  • the cooler may include an endothermic surface facing the image sensor and an exothermic surface away from the image sensor.
  • the cooling assembly may include a cooling member that is in thermal contact with the exothermic surface of the cooler and configured to absorb heat released from the exothermic surface of the cooler.
  • the cooling assembly may include a fan configured to improve heat absorption of the cooling member.
  • the system may include a third temperature sensor that is buried inside the heat transferring member and configured to detect a temperature of the image sensor.
  • the lens assembly may include a filter configured to selectively transmit light in a particular range of wavelengths.
  • the filter may include a first surface and a second surface disposed opposite to each other. The second surface face the image sensor.
  • the heater may be operably connected with at least a portion of the second surface of the filter to prevent dew condensation on the first surface of the filter.
  • the heater may be in contact with the second surface of the filter.
  • the heater may be connected with at least an edge of the second surface.
  • a system may include one or more storage devices and one or more processors configured to communicate with the one or more storage devices.
  • the one or more storage devices may include a set of instructions.
  • the one or more processors may be directed to perform one or more of the following operations.
  • the one or more processors may determine whether an image sensor of a capture device is in working condition. In response to determining that the image sensor is in working condition, the one or more processors may control a heater disposed between a lens assembly of the capture device and the image sensor to prevent dew condensation associated with the lens assembly.
  • the one or more processors may obtain a temperature of an external environment of the capture device.
  • the one or more processors may obtain humidity of the external environment of the capture device.
  • the one or more processors may determine a dew-point temperature based on the temperature and humidity of the external environment of the capture device.
  • the one or more processors may control the heater based on the dew-point temperature so that a temperature of an internal environment of the capture device is higher than the dew-point temperature.
  • the one or more processors may obtain the temperature of the internal environment of the capture device.
  • the one or more processors may determine whether the temperature of the internal environment of the capture device is higher than the dew-point temperature. In response to determining that the temperature of an internal environment of the capture device is not higher than the dew-point temperature, the one or more processors may turn the heater on.
  • the one or more processors may turn the heater off.
  • a method may include one or more of the following operations.
  • One or more processors may determine whether an image sensor of a capture device is in working condition.
  • the one or more processors may control a heater disposed between a lens assembly of the capture device and the image sensor to prevent dew condensation associated with the lens assembly.
  • a system may include a determination module configured to determine whether an image sensor of a capture device is in working condition.
  • the system may also include a control module configured to control, in response to determining that the image sensor is in working condition, a heater disposed between a lens assembly of the capture device and the image sensor to prevent dew condensation associated with the lens assembly.
  • a non-transitory computer readable medium may comprise at least one set of instructions.
  • the at least one set of instructions may be executed by one or more processors of a computing device.
  • the one or more processors may cause a scanner to perform one or more scans on an object.
  • the one or more processors may determine whether an image sensor of a capture device is in working condition. In response to determining that the image sensor is in working condition, the one or more processors may control a heater disposed between a lens assembly of the capture device and the image sensor to prevent dew condensation associated with the lens assembly.
  • FIG. 1 is a schematic diagram illustrating an exemplary capture device according to some embodiments of the present disclosure
  • FIG. 2A is a schematic diagram illustrating an exemplary dew condensation prevention device according to some embodiments of the present disclosure
  • FIG. 2B is a schematic diagram illustrating an exemplary dew condensation prevention device according to some embodiments of the present disclosure
  • FIG. 3 is a schematic diagram illustrating an exemplary cooling assembly according to some embodiments of the present disclosure
  • FIG. 4 is a schematic diagram illustrating an exemplary cooling assembly according to some embodiments of the present disclosure.
  • FIG. 5 is a schematic diagram illustrating exemplary hardware and/or software components of a computing device according to some embodiments of the present disclosure
  • FIG. 6 is a block diagram illustrating an exemplary first controller of a dew condensation prevention device according to some embodiments of the present disclosure
  • FIG. 7 is a flowchart illustrating an exemplary process for preventing dew condensation according to some embodiments of the present disclosure
  • FIG. 8 is a flowchart illustrating an exemplary process for preventing dew condensation according to some embodiments of the present disclosure.
  • FIG. 9 is a flowchart illustrating an exemplary process for preventing dew condensation according to some embodiments of the present disclosure.
  • system, ” “unit, ” “module, ” and/or “block” used herein are one method to distinguish different components, elements, parts, section or assembly of different level in ascending order. However, the terms may be displaced by another expression if they achieve the same purpose.
  • module, ” “unit, ” or “block, ” as used herein refers to logic embodied in hardware or firmware, or to a collection of software instructions.
  • a module, a unit, or a block described herein may be implemented as software and/or hardware and may be stored in any type of non-transitory computer-readable medium or other storage device.
  • a software module/unit/block may be compiled and linked into an executable program. It will be appreciated that software modules can be callable from other modules/units/blocks or from themselves, and/or may be invoked in response to detected events or interrupts.
  • Software modules/units/blocks configured for execution on computing devices (e.g., processor 501 as illustrated in FIG.
  • a computer readable medium such as a compact disc, a digital video disc, a flash drive, a magnetic disc, or any other tangible medium, or as a digital download (and can be originally stored in a compressed or installable format that needs installation, decompression, or decryption prior to execution) .
  • Such software code may be stored, partially or fully, on a storage device of the executing computing device, for execution by the computing device.
  • Software instructions may be embedded in firmware, such as an EPROM.
  • hardware modules/units/blocks may be included of connected logic components, such as gates and flip-flops, and/or can be included of programmable units, such as programmable gate arrays or processors.
  • modules/units/blocks or computing device functionality described herein may be implemented as software modules/units/blocks, but may be represented in hardware or firmware.
  • the modules/units/blocks described herein refer to logical modules/units/blocks that may be combined with other modules/units/blocks or divided into sub-modules/sub-units/sub-blocks despite their physical organization or storage.
  • terms “brightness” and “luminance” may be used interchangeably.
  • Terms “photograph, ” “image, ” “picture, ” and “frame” may be used interchangeably to refer to an image captured by a capture device such as a camera.
  • a dew condensation prevention device configured to prevent dew condensation of a capture device.
  • the dew condensation prevention device may include a heater and a controller.
  • the heater may be disposed between a lens assembly and an image sensor of the capture device.
  • the controller may be electrically coupled with the heater and configured to control the temperature of the heater.
  • the controller may control the heater to heat an internal environment of the capture device to a temperature above a dew-point temperature of an external environment of the capture device, so as to prevent dew condensation on a surface of an optical component of the lens assembly.
  • the lens assembly may include a filter configured to selectively transmit light in a particular range of wavelengths.
  • the filter may include a first surface and a second surface disposed opposite to each other.
  • the second surface may face the image sensor.
  • the first surface may be in contact with the internal environment that surrounds the filter and is in fluid communication with the external environment.
  • the heater may be operably connected with the second surface of the filter to prevent dew condensation on the first surface of the filter. For instance, the heater may be in contact with the second surface of the filter.
  • the controller may be configured to obtain a temperature and humidity of the external environment in real-time so as to monitor a dew-point temperature of the external environment in real-time, thereby adjusting, based on the real-time dew-point temperature of the external environment, a heating temperature of the heater.
  • the controller may be configured to obtain a temperature of the internal environment in real-time so as to cause the heater to be on or off by comparing the real-time temperature of the internal environment with the real-time dew-point temperature of the external temperature, which achieve the precise control of the heater, save power consumption of the heater and/or cooling the image sensor, and ensure the cooling effect of the image sensor.
  • a cooling assembly configured to cool an image sensor of a capture device.
  • the cooling assembly may include a sealed space that avoids flow communication between the internal environment of the capture device and the cooling assembly, which makes, when the above dew condensation prevention device is also used in the capture device, the cooling assembly and the heater of the dew condensation prevention device separated from each other, thereby in turn avoiding hot and cold convection. This may not only improve the cooling effect of the image sensor and the heating effect of the internal environment, but also save energy consumption of the heater and the cooling assembly.
  • FIG. 1 is a schematic diagram illustrating an exemplary capture device according to some embodiments of the present disclosure.
  • the capture device 100 may include a lens assembly 110, an exposure-time controller 120, a sensor 130, a processing device 140, and a storage device 150.
  • the capture device 100 may be a device configured to capture one or more images.
  • an image may be a still image, a video, a stream video, or a video frame obtained from a video.
  • the image may be a three-dimensional (3D) image or a two-dimensional (2D) image.
  • the capture device 100 may be a digital camera, a video camera, a security camera, a web camera, a smartphone, a tablet, a laptop, a video gaming console equipped with a web camera, a camera with multiple lenses, a camcorder, etc.
  • the lens assembly 110 may be an optical device that transmits light to the image sensor 130 through an optical means (e.g., refraction, filtering, etc. ) .
  • the lens assembly 110 may include at least one lens configured to focuses or disperses a light beam by means of refraction to form an image.
  • the position of one or more of the at least one lens may be adjustable so that the focal length of the lens assembly 110 may be adjustable to adjust the coverage of the capture device 100.
  • the lens assembly 110 may include aperture mechanisms to adjust the aperture of the lens assembly 110.
  • An aperture of the lens assembly 110 may refer to the size of the hole through which light passes to reach the sensor 130.
  • the aperture may be adjustable to adjust the amount of light that passes through the lens assembly 110.
  • the lens assembly 110 may include a filter configured to selectively transmit light in a particular range of wavelengths (e.g., colors) , while absorbing the remainder.
  • the exposure-time controller 120 may be configured to control an exposure time.
  • the exposure time may refer to the length of time when the sensor 130 inside the capture device 100 generates electrical signals.
  • the exposure-time controller 120 may be a shutter device (e.g., a mechanical shutter) configured to open to allow light to reach the sensor 130 through the lens assembly 110 to make the sensor 130 generate electrical signals when an image is captured.
  • the shutter device may be controlled manually or automatically.
  • the shutter time (e.g., an interval from open to closed) of the shutter device to take pictures of the scenes may be the exposure time.
  • the sensor 130 does not generate electrical signals without electricity even though light reaches the sensor 130.
  • the exposure-time controller 120 may be an electronic shutter to control the length of time when the sensor 130 is charged with electricity (also referred to as the exposure time) .
  • the sensor 130 may be configured to detect and convey the scenes taken by the lens assembly 110 (e.g., the light transmitted from the lens assembly 110) into electronic signals of an image (e.g., a digital image) .
  • the sensor 130 may include charge coupled device (CCD) and complementary metal-oxide semiconductor (CMOS) .
  • the processing device 140 may be configured to process data and/or information relating to the capture device 100 in the present disclosure.
  • the processing device 140 may be electronically connected to and control the operations of one or more components (e.g., the lens assembly 110, the exposure-time controller 120, the sensor 130) in the capture device 100.
  • the processing device 140 may automatically determine target values of exposure parameters of the capture device 100 such as an exposure time, an exposure gain, and an aperture.
  • the processing device 140 may be local or remote.
  • the processing device 140 may communicate with the capture device 100 via wire or wireless connection.
  • the processing device 140 may be a part of the capture device 100 (as shown in FIG. 1) .
  • the storage device 150 may store data, instructions, and/or any other information.
  • the storage device 150 may store data obtained from the processing device 140.
  • the storage device 150 may store captured images.
  • the storage device 150 may store data and/or instructions that the processing device 140 may execute or use to perform exemplary methods described in the present disclosure.
  • the storage device 150 may store data and/or instructions that the processing device 140 may execute or use to perform automatic exposure.
  • the storage device 150 may include a mass storage, removable storage, a volatile read-and-write memory, a read-only memory (ROM) , or the like, or any combination thereof.
  • Exemplary mass storage may include a magnetic disk, an optical disk, a solid-state drive, etc.
  • Exemplary removable storage may include a flash drive, a floppy disk, an optical disk, a memory card, a zip disk, a magnetic tape, etc.
  • Exemplary volatile read-and-write memory may include a random-access memory (RAM) .
  • Exemplary RAM may include a dynamic RAM (DRAM) , a double date rate synchronous dynamic RAM (DDR SDRAM) , a static RAM (SRAM) , a thyristor RAM (T-RAM) , and a zero-capacitor RAM (Z-RAM) , etc.
  • DRAM dynamic RAM
  • DDR SDRAM double date rate synchronous dynamic RAM
  • SRAM static RAM
  • T-RAM thyristor RAM
  • Z-RAM zero-capacitor RAM
  • Exemplary ROM may include a mask ROM (MROM) , a programmable ROM (PROM) , an erasable programmable ROM (EPROM) , an electrically erasable programmable ROM (EEPROM) , a compact disk ROM (CD-ROM) , and a digital versatile disk ROM, etc.
  • MROM mask ROM
  • PROM programmable ROM
  • EPROM erasable programmable ROM
  • EEPROM electrically erasable programmable ROM
  • CD-ROM compact disk ROM
  • digital versatile disk ROM etc.
  • the storage device 150 may be remote or local.
  • the storage device 150 may be implemented on a cloud platform.
  • the cloud platform may include a private cloud, a public cloud, a hybrid cloud, a community cloud, a distributed cloud, an inter-cloud, a multi-cloud, or the like, or any combination thereof.
  • the storage device 150 may be connected to a network to communicate with one or more other components of the capture device 100 (e.g., the processing device 140) .
  • One or more components of the capture device 100 may access the data or instructions stored in the storage device 150 via the network.
  • the storage device 150 may be directly connected to or communicate with one or more other components in the capture device 100 (e.g., the processing device 140) .
  • the storage device 150 may be part of the capture device 100.
  • the capture device 100 may further include an amplifier, an analog to digital (A/D) converter, and a power source (not shown in FIG. 1) .
  • the amplifier may be configured to amplify the electrical signals generated by the sensor 130.
  • the magnification of the electrical signals generated by the sensor 130 may be referred to as an exposure gain. The higher the exposure gain takes, the brighter the image the camera (e.g., the capture device 100) produces (a side effect of a higher gain is that the noise is higher as well) .
  • the A/D converter may be configured to transform the amplified electrical signals from the amplifier into digital signals.
  • the digital signals may be transformed to the processing device 140 to generate an image.
  • the image may be stored in the storage device 150.
  • An aspect of the present disclosure provides a dew condensation prevention device and method used to prevent dew condensation of a component (e.g., a lens assembly, etc. ) of a capture device (e.g., a camera) .
  • a component e.g., a lens assembly, etc.
  • a capture device e.g., a camera
  • dew condensation prevention of the lens assembly may be taken as an example.
  • the dew condensation prevention of the image sensor and the lens assembly described below is merely some examples or implementations.
  • the dew condensation prevention device and method in the present disclosure may be applied to dew condensation prevention of other components of a capture device, such as an image sensor, a processor, a controller, a shutter, etc.
  • FIG. 2A is a schematic diagram illustrating an exemplary dew condensation prevention device 200 according to some embodiments of the present disclosure.
  • the dew condensation prevention device 200 may be used in a capture device (e.g., the capture device 100) to prevent dew condensation of the capture device (e.g., the lens assembly 110) .
  • the dew condensation prevention device 200 may include a heater 201, and a first controller 202.
  • the capture device 100 may include an internal space 203 configured to accommodate the image sensor 130.
  • the capture device 100 may include a housing 205 that surrounds the image sensor 130 and forms the internal space 203.
  • the internal space 203 may be a sealed space separated from an external environment of the capture device 100 and filled into gas without water vapor (e.g., nitrogen, noble gas, dry air, etc. ) to protect the image sensor 130, and alleviate or prevent the entering of water vapor from the external environment into the internal space 203, which may effectively prevent dew condensation on the surface of the image sensor 130.
  • the external environment of the capture device 100 may include an environment the capture device 100 disposed in, e.g., a space surrounding the outer peripheral of the housing 205 and/or the lens assembly 110.
  • the heater 201 may be disposed between the lens assembly 110 and the image sensor 130. In some embodiments, the heater 201 may be disposed inside the internal space 203.
  • the image sensor 130 may be cooled to reduce the noise of the image sensor 130.
  • the temperature of the environment surrounding the lens assembly 110, especially an optical component (e.g., a filter) of the lens assembly 110 closed to (e.g., in contact with the internal space 203 and/or in connection with the housing 205) the image sensor 130 may drop to, e.g., tens of degrees below zero.
  • the temperature drops to the dew-point temperature if humidity of the environment is high, water vapor in the environment may be formed dew condensation on a surface (also referred to as a target surface) of the optical component in contact with the environment, which may affect the imaging of the capture device.
  • Dew-point temperature of air in an environment refers to a temperature at which water vapor in the air becomes saturated and water droplets begin to form.
  • the dew-point temperature may change with the temperature and the humidity of air in the environment. For example, when the temperature of air in an environment with humidity of 90%reaches 30°C, the dew-point temperature of air in the environment may be also 30°C. In this case, if the temperature of an environment surrounding the target surface is above 30°C, dew condensation on the target surface may be effectively prevented.
  • the heater 201 may be configured to heat an internal environment surrounding an optical component (e.g., a filter) of the lens assembly 110 closed to (e.g., in contact with the internal space 203 and/or in connection with the housing 205) the image sensor 130, so as to prevent dew condensation on a target surface of the optical component of the lens assembly 110.
  • the internal environment surrounding the target surface may be in fluid communication with the external environment of the capture device 100.
  • the internal environment of the capture device 100 may include an environment inside the capture device 100, e.g., an environment inside the lens assembly 110.
  • the heater 201 may be disposed on a side of the lens assembly 110 that is closer to the image sensor 130.
  • the heater 201 may be disposed on a surface of the optical component (e.g., a filter) of the lens assembly 110 opposite to the target surface, so as to prevent dew condensation of the target surface.
  • the lens assembly 110 may include an optical component 207 (the shaded rectangle in FIG. 2A) disposed closed to the image sensor 130.
  • the optical component 207 may be in contact with the internal space 203 and/or the housing 205.
  • the optical component 207 may include a first surface 208 and a second surface 209 disposed opposite to each other.
  • the second surface 209 may face the image sensor 130 and may be closer to the image sensor 130 than the first surface 208.
  • the heater 201 may be operably connected with the second surface 209 of the optical component 207 to prevent dew condensation of the first surface 208 (the target surface) of the optical component 207.
  • the heater 201 may be in contact with at least a portion of the second surface 209.
  • the heater 201 may be in contact with at least one edge of the surface 209.
  • the first surface 208 may be in contact with the internal environment that surrounds the optical component 207 and is in fluid communication with the external environment of the capture device 100.
  • the heater 201 may include a heater that may maintain a constant heating temperature after being activated (e.g., being turned on) .
  • the heater 201 may heat the internal environment surrounding the target surface (e.g., the second surface 209) to the constant heating temperature.
  • a heating temperature of the heater 201 refers to a temperature to which the heater 201 is activated. If the constant heating temperature of the heater 201 is higher than the dew-point temperature of the external environment, dew condensation on the target surface of the lens assembly 110 may be effectively prevented.
  • the heater 201 may include a heater that is temperature-adjustable so that the heating temperature of the heater 201 may be adjusted based on the dew-point temperature of the external environment, thereby achieving precise control of the temperature of the internal environment surrounding the target surface.
  • the first controller 202 may be electrically coupled with the heater 201 and configured to control the heater 201.
  • the first controller 202 may be configured to cause the heater 201 to be on or off, and adjust the heating temperature of the heater 201.
  • the first controller 202 may be disposed inside or outside the capture device 100.
  • the structure and/or the type of the first controller 202 may be similar to the processing device 140 described in FIG. 1.
  • the first controller 202 may be integrated into the processing device 140.
  • the first controller 202 may communicate with the processing device 140 or work independently of the processing device 140.
  • the first controller 202 may obtain a dew-point temperature of the external environment and control the heater 201 to adjust the heating temperature of the heater 201 based on the dew-point temperature of the external environment.
  • the first controller 202 may adjust the heating temperature of the heater 201 to a dew condensation prevention temperature that is above the dew-point temperature. For example, if the dew-point temperature is 29°C, the heating temperature of the heater 201 may be adjusted to a dew condensation prevention temperature slightly above 29°C (e.g., 0.5°C, 1°C, 2°C, 3°C, 4°C, 5°C, etc. above 29°C) . Details regarding adjusting the heating temperature of the heater 201 based on the dew-point temperature of the external environment may be found elsewhere in the present disclosure (e.g., the description in connection with FIG. 8) .
  • the first controller 202 may obtain a temperature of an environment the capture device disposed in, e.g., the external environment, and humidity of the environment the capture device disposed in, e.g., the external environment.
  • the first controller 202 may determine a dew-point temperature of the external environment based on the temperature and humidity of the external environment.
  • the dew condensation prevention device 200 may include a first temperature sensor 210 and a humidity sensor 211.
  • the first temperature sensor 210 may be electrically coupled with the first controller 202 and configured to detect the temperature of the external environment.
  • the humidity sensor 211 may be electrically coupled with the first controller 202 and configured to detect the humidity of the external environment.
  • the first temperature sensor 210 and the humidity sensor 211 may be two devices or integrated into a single device so that the single device is capable of detecting both temperature and humidity.
  • the first temperature sensor 210 and the humidity sensor 211 may be disposed in the external environment (as shown in FIG. 2A) .
  • the first temperature sensor 210 and/or the humidity sensor 211 may be integrated into the first controller 202.
  • the temperature and humidity of the external environment may be detected by a third-party device (e.g., a platform of the weather bureau or a satellite platform) communicating with the first controller 202 via a network.
  • the first controller 202 may obtain the temperature and humidity of the external environment from the third-party device via the network.
  • the first controller 202 may directly obtain the dew-point temperature of the external temperature from the third-party device.
  • the dew-point temperature of the external environment may be obtained in real-time so that the first controller 202 may adjust, based on the dew-point temperature of the external environment, the heating temperature of the heater 201 in real-time.
  • the temperature and humidity of the external environment may be detected in real-time so that the first controller 202 may monitor the dew-point temperature of the external environment in real-time, thereby adjusting, based on the real-time dew-point temperature of the external environment, the heating temperature of the heater 201.
  • the first controller 202 may control the heater 201 to work continuously to keep the temperature of the internal environment above the dew-point temperature of the external environment. In some embodiments, since the image sensor 130 usually needs to be cooled, if the heater 201 works continuously, the cooling effect may be affected and/or the cooling power consumption may be increased significantly. Therefore, the first controller 202 may control the heater 201 to work at intervals to save power consumption of the heater 201 and/or a cooling assembly used to cool the image sensor 130. In this case, in addition to the dew-point temperature of the external environment, the first controller 202 may be configured to control the heater 201 based further on a temperature of the internal environment.
  • the first controller 202 may obtain a temperature of the internal environment.
  • the first controller 202 may cause, by comparing the temperature of the internal environment of the capture device 100 with the dew-point temperature of the external environment of the capture device 100, the heater 201 to be off or on to keep the temperature of the internal environment above the dew-point temperature of the external temperature.
  • the first controller 202 may turn the heater 201 off; in response to determining that the temperature of the internal environment is lower than or equal to the dew-point temperature of the external environment, the first controller 202 may turn the heater 201 on to adjust the heating temperature of the heater 201 to a dew condensation prevention temperature that is above the dew-point temperature. Details regarding controlling the heater 201 based on the temperature of the internal environment may be found elsewhere in the present disclosure (e.g., the description in connection with FIG. 9) .
  • the temperature of the internal environment may be obtained in real-time so that the first controller 202 may cause the heater 201 to be on or off based on the real-time temperature of the internal environment, which achieve the precise control of the heater 201, save power consumption of the heater 201 and/or a cooling assembly used to cool the image sensor 130, and ensure the cooling effect of the image sensor 130.
  • a component that controls the heater 201 in the first controller 202 may include a switch tube (e.g., a metal oxide semiconductor (MOS) tube) .
  • a switch tube e.g., a metal oxide semiconductor (MOS) tube
  • MOS metal oxide semiconductor
  • the dew condensation prevention device 200 may include a second temperature sensor (not shown) .
  • the second temperature sensor may be disposed inside the capture device 100 and electrically coupled with the first controller 202.
  • the second temperature sensor may be configured to detect a temperature of the internal environment surrounding the target surface of the lens assembly 110.
  • the second temperature sensor may be disposed near the target surface.
  • the heater 201 may include a heating film with high light transmittance. In some embodiments, the heater 201 may include a positive temperature coefficient (PTC) heating film.
  • the PTC heating film refers to a heating film whose resistance value increases as its temperature increases.
  • the first controller 202 may determine a temperature of the PTC heating film by detecting a value of resistance of the PTC heating film. The temperature of the PTC heating film may be determined as the temperature of the internal environment surrounding the target surface.
  • a temperature of the heater 201 (e.g., the PTC heating film) refers to a temperature the heater 201 has. For example, when the heater 201 is working at a heating temperature, the temperature of the heater 201 may be equal to the heating temperature. When the heater 201 is turned off, the temperature of the heater 201 may be lower than the heating temperature over time.
  • the PTC heating film may provide a larger heat exchange area to improve the efficiency of heat transmission between the PTC heating film and the internal environment, thereby improving the heating effect of the internal environment.
  • the first controller 202 may include a detection unit 213.
  • the detection unit 213 may be electrically coupled with the PTC heating film, and configured to detect the value of resistance of the PTC heating film.
  • the detection unit 213 may be configured to determine the temperature of the PTC heating film based on the value of resistance of the PTC heating film.
  • the detection unit 213 may store a table indicating a corresponding relation between temperatures and values of resistance of the PTC heating film.
  • the detection unit 213 may determine the temperature of the PTC heating film by looking up the table to find a temperature corresponding to the detected value of resistance of the PTC heating film.
  • the detection unit 213 may determine the temperature of the PTC heating film based on an algorithm, a function, or a model indicating a corresponding relation between temperatures and values of resistance of the PTC heating film.
  • dew condensation prevention device 200 is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.
  • dew condensation prevention device 200 may be made under the teaching of the present invention. However, those variations and modifications do not depart from the scope of the present disclosure.
  • FIG. 2B is a schematic diagram illustrating an exemplary dew condensation prevention device 200’ according to some embodiments of the present disclosure.
  • the lens assembly 110 may include at least one lens (not shown) and a filter 207’ configured to selectively transmit light that passes through the at least one lens in a particular range of wavelengths (e.g., colors) , while absorbing the remainder.
  • the capture device 100 may include an internal space 203 configured to accommodate the image sensor 130.
  • the capture device 100 may include a housing 205 that surrounds the image sensor 130.
  • the filter 207’ and the housing 205 may form the sealed internal space 203. Light passing through the filter 207’ may be detected by the image sensor 130.
  • the at least one lens may be connected with the housing 205 in a detachable or non-detachable manner. Accordingly, the at least one lens may be connected with the filter 207’ in a detachable or non-detachable manner.
  • the internal environment between the filter 207’ and the at least one lens may be in fluid communication with the external environment of the capture device 100.
  • the filter 207’ may include a first surface 208’ and a second surface 209’ disposed opposite to each other.
  • the second surface 209’ may be closer to the image sensor 130 than the first surface 208’ .
  • the second surface 209’ may be in contact with the internal space 203.
  • the first surface 208’ may be in contact with the internal environment between the at least one lens and the filter 207’.
  • the image sensor 130 may be cooled to reduce the noise of the image sensor 130. After the image sensor 130 is cooled, because the filter 207’ is closed to the image sensor 130, the air surrounding the filter 207’ may drop to, e.g., tens of degrees below zero. Because the environment surrounding the first surface 208’ of the filter 207’ is in fluid communication with the external environment, if humidity of the external environment is high, water vapor may be formed dew condensation on the first surface 208’, which may affect the imaging of the capture device 100.
  • the dew condensation prevention device 200’ may include a heater 201’ configured to heat the internal environment surrounding the first surface 208’ of the filter 207’, so as to prevent dew condensation on the first surface 208’.
  • the heater 201’ may be disposed between the lens assembly 110 and the image sensor 130.
  • the heater 201’ may be disposed inside the internal space 203.
  • the heater 201’ may be operably connected with the second surface 209’, so as to prevent dew condensation of the first surface 208’.
  • the heater 201’ may be attached to the second surface 209’.
  • the heater 201’ may be attached to at least one edge of the second surface 209’.
  • dew condensation prevention device 200 is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.
  • dew condensation prevention device 200 may be made under the teaching of the present invention. However, those variations and modifications do not depart from the scope of the present disclosure.
  • Another aspect of the present disclosure provides a cooling assembly configured to cool an image sensor (e.g., the image sensor 130) of a capture device (e.g., the capture device 100) .
  • FIG. 3 is a schematic diagram illustrating an exemplary cooling assembly 300 according to some embodiments of the present disclosure.
  • the cooling assembly 300 may include a cooler 304, a heat transferring member 302, and a heat insulation member 301.
  • the cooling assembly 300 may be disposed on a side of the image sensor 130 that is away from the lens assembly 110.
  • the cooling assembly 300 may be disposed outside the internal space 203.
  • the cooling assembly 300 may be disposed outside the housing 205 of the capture device 100 and in the external environment of the capture device 100.
  • the cooler 304 may be configured to cool the image sensor 130.
  • the cooler 304 may include an endothermic surface facing the image sensor 130 and an exothermic surface away from the image sensor 130.
  • the heat transferring member 302 may be configured to transfer heat between the image sensor 130 and the cooler 304.
  • the heat transferring member 302 may transfer heat from the image sensor 130 to the cooler 304.
  • the endothermic surface of the cooler 304 facing the image sensor 130 may absorb the heat transferred by the heat transferring member 302 and the exothermic surface of the cooler 304 away from the image sensor 130 may release the absorbed heat, thereby achieving the cooling of the image sensor 130.
  • a sealed space may be formed based on the cooler 304 and the heat insulation member 301. In some embodiments, the sealed space may be formed based further on the housing 205 or the image sensor 130.
  • the heat transferring member 302 may be disposed inside the sealed space and between the image sensor 130 and the cooler 304. In some embodiments, the sealed space may avoid air flow and heat transmission between the cooling assembly 300 and the external environment of the capture device 100, which improves the cooling efficiency of the cooling assembly 300.
  • the sealed space may avoid flow communication between the internal environment of the capture device 100 and the cooling assembly 300, which makes, when the dew condensation prevention device 200 is also used in the capture device 100, the cooling assembly 300 and the heater 201 separated from each other, thereby in turn avoiding hot and cold convection. This may not only improve the cooling effect of the image sensor 130 and the heating effect of the internal environment, but also save energy consumption of the heater 201 and the cooling assembly 300.
  • the cooling assembly 300 may include a third temperature sensor 303.
  • the third temperature sensor 303 may be buried inside the heat transferring member 302 and configured to detect the temperature of the image sensor 130.
  • the cooler 304 and the third temperature sensor 303 may be electrically coupled with a second controller (not shown) .
  • the second controller may control the cooler 304 to work continuously to cool the image sensor 130 to a cooling temperature (e.g., a temperature at which the image sensor 130 works with less noise) .
  • the second controller may control the cooler 304 to work at intervals to cool the image sensor 130 to the cooling temperature.
  • the second controller may turn on the cooler 304 to cool the image sensor 130 to the cooling temperature; in response to determining that the third temperature sensor 303 detects a temperature equal to or lower than the cooling temperature, the second controller may turn off the cooler 304.
  • the second controller may be integrated into the first controller 202 or the processing device140. In some embodiments, the second controller may be disposed on the driver board of the cooler 304. In some embodiments, the second controller may communicate with the processing device 140 and/or the first controller 202, or work independently of the processing device 140 and the first controller 202.
  • the cooler 304 may be a Peltier effect cooler, which may achieve efficient cooling of the image sensor 130.
  • the heat insulation member 301 may be a plastic product with good thermal insulation performance to avoid heat transmission from the heat transferring member 302 to the external environment and ensure the cooling efficiency of the cooling assembly.
  • the first temperature sensor 210, the second temperature sensor, the third temperature sensor 303, and/or the humidity sensor 211 may be a high-precision digital sensor which may accurately detect a temperature or humidity, and achieve precise control of a temperature of the heater 201 or the cooling assembly 300.
  • dew condensation prevention device 300 is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.
  • multiple variations and modifications may be made under the teaching of the present invention. However, those variations and modifications do not depart from the scope of the present disclosure.
  • FIG. 4 is a schematic diagram illustrating an exemplary cooling assembly 400 according to some embodiments of the present disclosure.
  • the cooling assembly 400 may further include a cooling member 401 and a fan 402.
  • the cooling member 401 may be in thermal contact with the exothermic surface of the cooler 304 and configured to absorb heat released from the exothermic surface of the cooler 304.
  • the fan 402 may be configured to improve heat absorption of the cooling member 401.
  • the cooling member 401 may include a metal radiator, such as, a silver radiator, a copper radiator, an aluminum radiator, etc.
  • the cooling member 401 may include an alloy radiator, such as, an aluminum alloy radiator.
  • the cooling member 401 may include a combination of a metal radiator and an alloy radiator, such as, a copper plate embedded in the base of an aluminum alloy radiator.
  • the fan 402 may be electrically coupled with the second controller.
  • dew condensation prevention device 400 is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.
  • multiple variations and modifications may be made under the teaching of the present invention. However, those variations and modifications do not depart from the scope of the present disclosure.
  • FIG. 5 is a schematic diagram illustrating exemplary hardware and/or software components of a computing device 500 on which the first controller 202 may be implemented according to some embodiments of the present disclosure.
  • the computing device 500 may include a processor 501, a storage 503, an input/output (I/O) 505, and a communication port 507.
  • I/O input/output
  • the processor 501 may execute computer instructions (program code) and perform functions of the processing device in accordance with techniques described herein.
  • the computer instructions may include routines, programs, objects, components, signals, data structures, procedures, modules, and functions, which perform functions described herein.
  • the first controller 202 may be implemented on the processor 501 and the processor 501 may control the heater 201 to adjust the temperature of the heater 201.
  • the processor 501 may include a microcontroller, a microprocessor, a reduced instruction preset computer (RISC) , an application specific integrated circuits (ASICs) , an application-specific instruction-preset processor (ASIP) , a central processing unit (CPU) , a graphics processing unit (GPU) , a physics processing unit (PPU) , a microcontroller unit, a digital signal processor (DSP) , a field programmable gate array (FPGA) , an advanced RISC machine (ARM) , a programmable logic device (PLD) , any circuit or processor capable of executing one or more functions, or the like, or any combinations thereof.
  • RISC reduced instruction preset computer
  • ASICs application specific integrated circuits
  • ASIP application-specific instruction-preset processor
  • CPU central processing unit
  • GPU graphics processing unit
  • PPU physics processing unit
  • DSP digital signal processor
  • FPGA field programmable gate array
  • ARM advanced RISC machine
  • PLD
  • processors of the computing device 500 may also include multiple processors, thus operations and/or method steps that are performed by one processor as described in the present disclosure may also be jointly or separately performed by the multiple processors.
  • the processor of the computing device 500 executes both step A and step B, it should be understood that step A and step B may also be performed by two different processors jointly or separately in the computing device 500 (e.g., a first processor executes step A and a second processor executes step B, or the first and second processors jointly execute steps A and B) .
  • the storage 503 may store data/information obtained from any other component of the computing device 500 (e.g., the processor 501) .
  • the storage 503 may include a mass storage device, a removable storage device, a volatile read-and-write memory, a read-only memory (ROM) , or the like, or any combination thereof.
  • the mass storage device may include a magnetic disk, an optical disk, a solid-state drive, etc.
  • the removable storage device may include a flash drive, a floppy disk, an optical disk, a memory card, a zip disk, a magnetic tape, etc.
  • the volatile read-and-write memory may include a random-access memory (RAM) .
  • the RAM may include a dynamic RAM (DRAM) , a double date rate synchronous dynamic RAM (DDR SDRAM) , a static RAM (SRAM) , a thyristor RAM (T-RAM) , and a zero-capacitor RAM (Z-RAM) , etc.
  • the ROM may include a mask ROM (MROM) , a programmable ROM (PROM) , an erasable programmable ROM (PEROM) , an electrically erasable programmable ROM (EEPROM) , a compact disk ROM (CD-ROM) , and a digital versatile disk ROM, etc.
  • the storage 503 may store one or more programs and/or instructions to perform exemplary methods described in the present disclosure.
  • the storage 503 may store a program for controlling the heater 201 to adjust the temperature of the heater 201.
  • the I/O 505 may input or output signals, data, or information.
  • the I/O 505 may enable a user interaction with the processing device. For example, a captured image may be displayed through the I/O 505.
  • the I/O 505 may include an input device and an output device.
  • Exemplary input devices may include a keyboard, a mouse, a touch screen, a microphone, or the like, or a combination thereof.
  • Exemplary output devices may include a display device, a loudspeaker, a printer, a projector, or the like, or a combination thereof.
  • Exemplary display devices may include a liquid crystal display (LCD) , a light-emitting diode (LED) -based display, a flat panel display, a curved screen, a television device, a cathode ray tube (CRT) , or the like, or a combination thereof.
  • LCD liquid crystal display
  • LED light-emitting diode
  • CRT cathode ray tube
  • the communication port 507 may be connected to a network to facilitate data communications.
  • the communication port 507 may establish connections between the computing device 500 and a device such as the heater 201, the first temperature sensor 210, the humidity sensor 211, or the second temperature sensor, etc.
  • the connection may be a wired connection, a wireless connection, or combination of both that enables data transmission and reception.
  • the wired connection may include an electrical cable, an optical cable, a telephone wire, or the like, or any combination thereof.
  • the wireless connection may include Bluetooth, Wi-Fi, WiMax, WLAN, ZigBee, mobile network (e.g., 3G, 4G, 5G, etc. ) , or the like, or a combination thereof.
  • the communication port 507 may be a standardized communication port, such as RS232, RS485, etc.
  • FIG. 6 is a block diagram illustrating an exemplary first controller 202 according to some embodiments of the present disclosure.
  • the first controller 202 may include an acquisition module 602, a determination module 604, and a control module 606.
  • the determination module 604 may determine whether the image sensor 130 of the capture device 100 is in working condition.
  • the control module 606 may perform a dew condensation prevention operation to control the heater 201 disposed between the lens assembly 110 of the capture device 100 and the image sensor 130 to prevent dew condensation related to the lens assembly 110 in response to determining that the image sensor 130 is in working condition.
  • the acquisition module 602 may obtain a temperature of an external environment of the capture device 100.
  • the temperature of the external environment may be detected by the first temperature sensor 210.
  • the acquisition module 602 may obtain humidity of the external environment.
  • the humidity of the external environment may be detected by the humidity sensor 211.
  • the temperature and humidity of the external environment may be detected by a third-party device communicating with the acquisition module 602 via a network.
  • the determination module 604 may determine a dew-point temperature of the external environment based on the temperature and humidity of the external environment.
  • the control module 606 may control the heater 201 based on the dew-point temperature so that a temperature of the internal environment is higher than the dew-point temperature.
  • the acquisition module 602 may obtain a temperature of the internal environment of the capture device 100.
  • the temperature of the internal environment may be detected by the second temperature sensor, or the temperature of the heater 201 (e.g., a PTC heating film) may be determined as the temperature of the internal environment.
  • the determination module 604 may determine whether the temperature of the internal environment is higher than the dew-point temperature of the external environment. In response to determining that the temperature of the internal environment is higher than the dew-point temperature of the external environment, the control module 606 may turn the heater 201 off. In response to determining that the temperature of the internal environment is not higher than (e.g., equal to or lower than) the dew-point temperature, the control module 606 may turn the heater 201 on to adjust the heating temperature of the heater 201 to a dew condensation prevention temperature that is above the dew-point temperature.
  • the modules in the first controller 202 may be connected to or communicate with each other via a wired connection or a wireless connection.
  • the wired connection may include a metal cable, an optical cable, a hybrid cable, or the like, or any combination thereof.
  • the wireless connection may include a Local Area Network (LAN) , a Wide Area Network (WAN) , a Bluetooth, a ZigBee, a Near Field Communication (NFC) , or the like, or any combination thereof.
  • LAN Local Area Network
  • WAN Wide Area Network
  • Bluetooth a ZigBee
  • NFC Near Field Communication
  • the first controller 202 may further include a storage module (not shown in FIG. 6) .
  • the storage module may be configured to store data generated during any process performed by any component in the first controller 202.
  • each of components of the first controller 202 may include a storage device. Additionally or alternatively, the components of the first controller 202 may share a common storage device.
  • FIG. 7 is a flowchart illustrating an exemplary process for preventing dew condensation according to some embodiments of the present disclosure.
  • the process 700 may be implemented in the first controller 202 illustrated in FIG. 2A.
  • the process 700 may be stored in the storage 503 and/or the storage device 150 as a form of instructions, and invoked and/or executed by the first controller 202 (e.g., the processor 501 illustrated in FIG. 5 and/or one or more modules illustrated in FIG. 6) .
  • the operations of the illustrated process 700 presented below are intended to be illustrative. In some embodiments, the process 700 may be accomplished with one or more additional operations not described, and/or without one or more of the operations discussed. Additionally, the order in which the operations of the process 700 as illustrated in FIG. 7 and described below is not intended to be limiting.
  • the process 700 may indicate a process for preventing dew condensation of a capture device (the capture device 100) using the dew condensation prevention device (e.g., the dew condensation prevention device 200 in FIG. 2A) illustrated in the present disclosure.
  • the dew condensation prevention device e.g., the dew condensation prevention device 200 in FIG. 2A
  • the first controller 202 may determine whether the image sensor 130 of the capture device 100 is in working condition.
  • the first controller 202 in response to determining that the image sensor 130 is in working condition, may perform a dew condensation prevention operation to control the heater 201 disposed between the lens assembly 110 of the capture device 100 and the image sensor 130 to prevent dew condensation related to the lens assembly 110.
  • the first controller 202 in response to determining that the image sensor 130 is not in working condition, may stop performing the dew condensation prevention operation, e.g., turn off the heater 201 until determining that the image sensor 130 is in working condition.
  • the dew condensation prevention operation may include controlling the heater 201 to keep the temperature of the internal environment above the dew-point temperature of the external environment. More descriptions for the dew condensation prevention operation may be found elsewhere in the present disclosure (e.g., FIGs. 8 and 9, and the descriptions thereof) .
  • process 700 is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.
  • process 700 may be accomplished with one or more additional operations not described and/or without one or more of the operations discussed above.
  • FIG. 8 is a flowchart illustrating an exemplary process for preventing dew condensation according to some embodiments of the present disclosure.
  • the process 800 may be implemented in the first controller 202 illustrated in FIG. 2A.
  • the process 800 may be stored in the storage 503 and/or the storage device 150 as a form of instructions, and invoked and/or executed by the first controller 202 (e.g., the processor 501 illustrated in FIG. 5 and/or one or more modules illustrated in FIG. 6) .
  • the operations of the illustrated process 800 presented below are intended to be illustrative.
  • the process 800 may be accomplished with one or more additional operations not described, and/or without one or more of the operations discussed. Additionally, the order in which the operations of the process 800 as illustrated in FIG. 8 and described below is not intended to be limiting.
  • one or more operations of the process 800 may be performed to achieve at least part of operation 704 of the process 700 in FIG. 7.
  • the first controller 202 may obtain a temperature of an external environment of the capture device 100.
  • the temperature of the external environment may be detected by the first temperature sensor 210.
  • the first controller 202 may obtain humidity of the external environment.
  • the humidity of the external environment may be detected by the humidity sensor 211.
  • the temperature and humidity of the external environment may be detected by a third-party device communicating with the first controller 202 via a network.
  • the first controller 202 may determine a dew-point temperature of the external environment based on the temperature and humidity of the external environment.
  • a mapping relation table of "humidity–temperature–dew-point temperature” may be stored in the first controller 202 (e.g., the storage 502 of the first controller 202) .
  • the mapping relation table refers to a table that indicates a corresponding relation of the humidity, the temperature, and the dew-point temperature.
  • the first controller 202 may determine the dew-point temperature of the external environment by looking up the mapping relation table to find a dew-point temperature corresponding to the temperature and humidity of the external environment.
  • the first controller 202 may determine the dew-point temperature of the external environment based on an algorithm, a function, or a model indicating a corresponding relation of the humidity, the temperature, and the dew-point temperature.
  • the first controller 202 may directly obtain the dew-point temperature from a third-party device, e.g., a platform of the weather bureau or a satellite platform. In this case, operation 802 and 804 may be omitted.
  • the first controller 202 may control the heater 201 based on the dew-point temperature so that a temperature of the internal environment is higher than the dew-point temperature.
  • the first controller 202 may control the heater 201 to adjust the heating temperature of the heater 201 to a dew condensation prevention temperature that is above the dew-point temperature.
  • a difference between the dew-point temperature and the dew condensation prevention temperature may be determined based on the dew-point temperature, power consumption of the heater 201 and/or the cooling assembly, sealing performance and/or thermal transmission performance of the capture device 100 (e.g., the internal space 203 and/or the second internal space 204) , or the like, or any combination thereof, so as to achieve the dew condensation prevention of the capture device 100 and reduce power consumption of the heater 201 and/or the cooling assembly.
  • the heating temperature of the heater 201 may be adjusted slightly above 29°C (e.g., 0.5°C, 1°C, 2°C, 3°C, 4°C, 5°C, etc. above 29°C) .
  • the difference between the dew-point temperature and the dew condensation prevention temperature may be set manually by a user (e.g., an engineer) . In some embodiments, the difference between the dew-point temperature and the dew condensation prevention temperature may be set based on default setting of the dew condensation prevention device. In some embodiments, the difference between the dew-point temperature and the dew condensation prevention temperature may be online determined by the first controller 202.
  • the first controller 202 may cause the heater 201 to continuously work to keep the temperature of the internal environment above the dew-point temperature. In some embodiments, the first controller 202 may cause the heater 201 to work at intervals (e.g., cause the heater 201 to be off or on at the dew condensation prevention temperature) by comparing the temperature of the internal environment of the capture device 100 (e.g., the internal environment surrounding the target surface) with the dew-point temperature of the external environment of the capture device 100 to keep the temperature of the internal environment above the dew-point temperature. More descriptions for causing the heater 201 to work at intervals may be found elsewhere in the present disclosure (e.g., FIG. 9 and the description thereof) . In some embodiments, the first controller 202 may adjust the heating temperature of the heater 201 based on the real-time dew-point temperature of the external environment.
  • FIG. 9 is a flowchart illustrating an exemplary process for preventing dew condensation according to some embodiments of the present disclosure.
  • the process 900 may be implemented in the first controller 202 illustrated in FIG. 2A.
  • the process 900 may be stored in the storage 503 and/or the storage device 150 as a form of instructions, and invoked and/or executed by the first controller 202 (e.g., the processor 501 illustrated in FIG. 5 and/or one or more modules illustrated in FIG. 6) .
  • the operations of the illustrated process 900 presented below are intended to be illustrative. In some embodiments, the process 900 may be accomplished with one or more additional operations not described, and/or without one or more of the operations discussed.
  • the first controller 202 may obtain a temperature of the internal environment of the capture device 100.
  • the temperature of the internal environment may be detected by the second temperature sensor, or the temperature of the heater 201 (e.g., a PTC heating film) may be determined as the temperature of the internal environment.
  • the first controller 202 may determine whether the temperature of the internal environment is higher than the dew-point temperature of the external environment. In response to determining that the temperature of the internal environment is higher than the dew-point temperature of the external environment, the process 900 may proceed to operation 906, in which the first controller 202 (e.g., the control module 606) may turn the heater 201 off.
  • the process 900 may proceed to operation 908, in which the first controller 202 (e.g., the control module 606) may turn the heater 201 on to adjust the heating temperature of the heater 201 to a dew condensation prevention temperature that is above the dew-point temperature.
  • the first controller 202 e.g., the control module 606
  • an image capture system may include the capture device 100 and the dew condensation prevention device 200 or 200’ configured to prevent dew condensation of the capture device 100.
  • the image capture system may further include the cooling assembly 300 or the cooling assembly 400 to cool the image sensor 130.
  • computer hardware platforms may be used as the hardware platform (s) for one or more of the elements described herein.
  • a computer with user interface elements may be used to implement a personal computer (PC) or any other type of work station or terminal device.
  • PC personal computer
  • a computer may also act as a server if appropriately programmed.
  • aspects of the present disclosure may be illustrated and described herein in any of a number of patentable classes or context including any new and useful process, machine, manufacture, or composition of matter, or any new and useful improvement thereof. Accordingly, aspects of the present disclosure may be implemented entirely hardware, entirely software (including firmware, resident software, micro-code, etc. ) or combining software and hardware implementation that may all generally be referred to herein as a “unit, ” “module, ” or “system. ” Furthermore, aspects of the present disclosure may take the form of a computer program product embodied in one or more computer readable media having computer readable program code embodied thereon.
  • a computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated signal may take any of a variety of forms, including electro-magnetic, optical, or the like, or any suitable combination thereof.
  • a computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that may communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.
  • Program code embodied on a computer readable signal medium may be transmitted using any appropriate medium, including wireless, wireline, optical fiber cable, RF, or the like, or any suitable combination of the foregoing.
  • Computer program code for carrying out operations for aspects of the present disclosure may be written in any combination of one or more programming languages, including an object-oriented programming language such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB. NET, Python or the like, conventional procedural programming languages, such as the "C" programming language, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, Ruby and Groovy, or other programming languages.
  • the program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server.
  • the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN) , or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider) or in a cloud computing environment or offered as a service such as a Software as a Service (SaaS) .
  • LAN local area network
  • WAN wide area network
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CN114326112A (zh) * 2020-09-30 2022-04-12 华为技术有限公司 防雾的头戴式显示设备及防雾方法
CN114189617A (zh) * 2021-12-17 2022-03-15 信利光电股份有限公司 一种自动防雾镜头装置、摄像模组及电子装置
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