WO2021184832A1

WO2021184832A1 - Optical module

Info

Publication number: WO2021184832A1
Application number: PCT/CN2020/133867
Authority: WO
Inventors: 张强; 赵其圣
Original assignee: 青岛海信宽带多媒体技术有限公司
Priority date: 2020-03-18
Filing date: 2020-12-04
Publication date: 2021-09-23

Abstract

Provided is an optical module. A first laser diode and a second laser diode, which are located on the same substrate, are provided inside the optical module, and there is an included angle between resonant cavities of the two laser diodes. A driving circuit is provided to drive the first laser diode to emit light, and to drive the second laser diode to emit light when the first laser diode is controlled to be turned off. Since the second laser diode and the first laser diode are grown on the same substrate, when the first laser diode is turned off, the second laser diode can transfer heat generated when same is turned on to the first laser diode, so as to stabilize the temperature of the first laser diode, thereby reducing a transmission wavelength shift of the first laser diode due to a temperature difference caused by the turning-on and turning-off the first laser diode. Moreover, the included angle is provided between the resonant cavities of the two laser diodes, and therefore, the amount of light, which is emitted from the second laser diode and then enters a coupling lens, can be reduced, thereby preventing the problem of turning-off power of the optical module not being up to standard.

Description

An optical module

This disclosure requires that it be submitted to the Chinese Patent Office on March 18, 2020, the application number is 202010189780.4, the invention name is "a kind of optical module", and it is submitted to the China Patent Office on March 18, 2020, the application number is 202010189689.2, and the invention name is The priority of "a kind of optical module", the entire content of which is incorporated in the present disclosure by reference.

Technical field

The present disclosure relates to the field of optical communication technology, and in particular to an optical module.

Background technique

In the field of optical communications, wavelength division multiplexing technology is a common bandwidth expansion technology in the field of optical communications. The wavelength division multiplexing technology uses multiple lights with different wavelengths in the same optical fiber for data transmission, and distinguishes different light wavelengths by different wavelengths. The signal channel in which orderly data transmission depends on the wavelength stability of the optical signal.

In a PON (Passive Optical Network, passive optical network), an optical network unit (ONU) usually implements optical communication with an optical line terminal (OLT) in a burst light emitting manner. In an embodiment of the present disclosure, the optical module in the optical network unit operates in a burst mode, that is, the laser chip in the optical module switches between emitting light and not emitting light. Since the laser chip generates heat during the working process, the above-mentioned working method will cause the temperature of the laser chip to be different in different states. Generally, there is a temperature drift coefficient between the temperature of the laser chip and the working wavelength. This coefficient is different from different types of laser chips, but it is generally between 0.1 and 0.15 nm/℃, that is, every increase or decrease At one point, its emission wavelength will drift by 0.1 to 0.15 nm.

Summary of the invention

The embodiment of the present disclosure provides an optical module, which mainly includes: a circuit board; a laser chip, which is electrically connected to the circuit board, and includes a first laser diode and a second laser diode on the same substrate, and a resonant cavity of the second laser diode and The resonant cavity of the first laser diode is arranged non-parallel; the driving circuit is arranged on the circuit board, and is electrically connected to the first laser diode and the second laser diode through the circuit board, for driving the first laser diode to emit light; and, When the first laser diode is controlled to be turned off, the second laser diode is driven to emit light; the coupling lens is arranged on the light output side of the first laser diode and is used to collimate the light emitted by the first laser diode.

The embodiments of the present disclosure provide another optical module, including: a circuit board; a laser chip, including a first laser diode and a second laser diode on the same substrate; a driving circuit, which is arranged on the circuit board, and is connected to the first laser diode respectively. The laser diode and the second laser diode are electrically connected to drive the first laser diode to emit light; and, when the first laser diode is turned off, to apply a reverse bias to the second laser diode; the coupling lens is arranged on the first laser diode. The light output side of the laser diode is used to collimate the light emitted by the first laser diode.

Description of the drawings

In order to explain the technical solutions of the present disclosure more clearly, the following will briefly introduce the drawings needed in the embodiments. Obviously, for those of ordinary skill in the art, without creative labor, Other drawings can also be obtained from these drawings.

Figure 1 is a schematic diagram of the connection relationship of an optical communication terminal;

Figure 2 is a schematic diagram of the structure of an optical network unit;

FIG. 3 is a schematic structural diagram of an optical module provided in an embodiment of the disclosure;

4 is a schematic diagram of an exploded structure of an optical module provided in an embodiment of the disclosure;

5 is a schematic diagram of a partial structure of a first optical module provided by an embodiment of the disclosure;

6 is a schematic structural diagram of a laser chip provided by an embodiment of the disclosure;

7 is a schematic diagram of the positional relationship between the laser chip and the coupling lens provided by an embodiment of the disclosure;

FIG. 8 is a timing diagram of a burst signal provided by an embodiment of the disclosure;

9 is a schematic structural diagram of a laser chip driving circuit provided by an embodiment of the disclosure;

10 is a schematic structural diagram of a first optical module laser chip driving circuit provided by an embodiment of the disclosure;

10A is a schematic diagram of a partial structure of another optical module provided by an embodiment of the present disclosure;

10B is a schematic structural diagram of another optical module laser chip driving circuit provided by an embodiment of the disclosure;

11 is a schematic structural diagram of another laser chip driving circuit provided by an embodiment of the disclosure;

FIG. 12 is a schematic structural diagram of another driving circuit of the first optical module laser chip provided by the embodiments of the disclosure; FIG.

FIG. 13 is a schematic structural diagram of another driving circuit of the first optical module laser chip provided by the embodiments of the disclosure; FIG.

14 is a schematic structural diagram of another driving circuit of another optical module laser chip provided by an embodiment of the disclosure;

FIG. 15 is a schematic structural diagram of another driving circuit of another optical module laser chip provided by an embodiment of the disclosure.

Detailed ways

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present disclosure.

One of the core links of optical fiber communication is the conversion of photoelectric signals. Optical fiber communication uses information-carrying optical signals to be transmitted in optical fibers/optical waveguides, and the passive transmission characteristics of light in optical fibers can realize low-cost and low-loss information transmission. However, information processing equipment such as computers uses electrical signals, which requires mutual conversion between electrical signals and optical signals in the signal transmission process.

The optical module implements the above-mentioned photoelectric conversion function in the field of optical fiber communication technology, and the mutual conversion of optical signals and electrical signals is the core function of the optical module. The optical module realizes the electrical connection with the external host computer through the golden finger on the circuit board. The main electrical connections include power supply, I2C signal, data signal transmission and grounding, etc. The electrical connection method realized by the golden finger has become the optical module industry. The standard method, based on this, the circuit board is an essential technical feature in most optical modules.

Figure 1 is a schematic diagram of the connection relationship of an optical communication terminal. As shown in Figure 1, the connection of an optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;

One end of the optical fiber is connected to the remote server, and the other end of the network cable is connected to the local information processing equipment. The connection between the local information processing equipment and the remote server is completed by the connection of the optical fiber and the network cable; and the connection between the optical fiber and the network cable is performed by the optical network with the optical module The unit is complete.

The optical port of the optical module 200 is connected to the optical fiber 101 to establish a two-way optical signal connection with the optical fiber; the electrical port of the optical module 200 is connected to the optical network unit 100 to establish a two-way electrical signal connection with the optical network unit; the optical module implements optical signals Mutual conversion with electrical signals, thereby realizing the establishment of a connection between the optical fiber and the optical network unit; in an embodiment of the present disclosure, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100 , The electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input into the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of photoelectric signals, and does not have the function of processing data. During the foregoing photoelectric conversion process, the information has not changed.

The optical network unit has an optical module interface 102, which is used to connect to the optical module and establish a two-way electrical signal connection with the optical module; the optical network unit has a network cable interface 104, which is used to connect to a network cable and establish a two-way electrical signal connection with the network cable; A connection is established between the module and the network cable through the optical network unit. In an embodiment of the present disclosure, the optical network unit transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module, and the optical network unit acts as an optical module. The upper computer of the module monitors the work of the optical module.

At this point, the remote server establishes a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network units, and network cables.

Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network unit is the upper computer of the optical module, which provides data signals to the optical module and receives data signals from the optical module. The common optical module upper computer also has optical lines Terminal and so on.

Figure 2 is a schematic diagram of the optical network unit structure. As shown in Figure 2, the optical network unit 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided in the cage 106 for accessing optical module electrical ports such as golden fingers; A radiator 107 is provided on the cage 106, and the radiator 107 has a convex structure such as fins to increase the heat dissipation area.

The optical module 200 is inserted into the optical network unit. Specifically, the electrical port of the optical module is inserted into the electrical connector in the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is located on the circuit board and wraps the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, and the optical module is fixed by the cage. The heat generated by the optical module is conducted to the cage through the optical module housing, and finally passes through the cage. The radiator 107 is diffused.

FIG. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure, and FIG. 4 is an exploded structural schematic diagram of an optical module 200 according to an embodiment of the disclosure. As shown in FIG. 3 and FIG. 4, the optical module 200 provided by the embodiment of the present disclosure includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 204, a light emitting component 205 and a light receiving component 206.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square shape. In an embodiment of the present disclosure, the lower shell includes a main board and Two side plates located on both sides of the main board and perpendicular to the main board; the upper casing includes a cover plate, and the cover plate covers the two side plates of the upper casing to form a wrapping cavity; the upper casing may also include On both sides of the cover plate, the two side walls perpendicular to the cover plate are combined by the two side walls and the two side plates, so that the upper shell is covered on the lower shell.

The two openings can be two openings (208, 209) in the same direction, or two openings in different directions; one of the openings is the electrical port 208, and the gold finger of the circuit board protrudes from the electrical port 208 , Inserted into the upper computer such as the optical network unit; the other opening is the optical port 209, which is used for external optical fiber access to connect the optical transmitter component 205 and the optical receiver component 206 inside the optical module; the circuit board 204, the optical transmitter component 205 and the optical receiver component 206 and other optoelectronic devices are located in the package cavity.

The assembly method of the upper shell and the lower shell is used to facilitate the installation of the circuit board 204, the light emitting assembly 205 and the light receiving assembly 206 into the shell. The upper shell and the lower shell form the outermost layer of the optical module. Encapsulation and protection shell; the upper shell and the lower shell are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation; generally, the shell of the optical module is not made into an integrated structure, so that when assembling circuit boards and other components, positioning parts, The heat dissipation and electromagnetic shielding structure cannot be installed, and it is not conducive to production automation.

The unlocking handle 203 is located on the outer wall of the wrapping cavity/lower housing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.

The unlocking handle 203 has an engaging structure that matches the cage of the host computer; pulling the end of the unlocking handle can make the unlocking handle move relative to the surface of the outer wall; the optical module is inserted into the cage of the host computer, and the optical module is locked by the engaging structure of the unlocking handle. Fixed in the cage of the host computer; by pulling the unlocking handle, the locking structure of the unlocking handle moves accordingly, and then the connection relationship between the locking structure and the host computer is changed, so as to release the optical module and the upper computer. The optical module is withdrawn from the cage of the host computer.

Circuit board 204 is provided with circuit traces, electronic components (such as capacitors, resistors, transistors, MOS tubes) and chips (such as microprocessor MCU2045, laser driver chips, limiting amplifiers, clock data recovery CDR, power management chips, and data Processing chip DSP) and so on.

The circuit board 204 connects the electrical components in the optical module according to the circuit design through circuit wiring to achieve electrical functions such as power supply, electrical signal transmission, and grounding.

The circuit board 204 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also carry out the carrying function. For example, the rigid circuit board can carry the chip smoothly; when the light emitting component 205 and the light receiving component 206 are located on the circuit board, The rigid circuit board can also provide a stable load; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. In an embodiment of the present disclosure, a metal pin is formed on one end surface of the rigid circuit board. Golden fingers are used to connect with electrical connectors; these are not easy to implement with flexible circuit boards.

Some optical modules also use flexible circuit boards as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards, for example, flexible circuit boards can be used to connect between rigid circuit boards and optical transceiver devices.

The light emitting component 205 and the light receiving component 206 are respectively used to implement the transmission of optical signals and the reception of optical signals. The light emitting component 206 in the embodiment of the present disclosure adopts a coaxial TO package, which is physically separated from the circuit board, and is electrically connected through a flexible board; the light receiving component 206 also adopts a coaxial TO package, which is physically separated from the circuit board, and is realized through a flexible board Electric connection. In another common implementation manner, it can be arranged on the surface of the circuit board 204; in addition, the light emitting component 205 and the light receiving component 206 can also be combined to form an integrated optical transceiver structure.

In an embodiment of the present disclosure, the golden fingers on the surface of the circuit board 204 have I2C pins, and the I2C protocol can be used between the host computer and the optical module to transmit information through the I2C pins. Among them, for the signal emission of the optical module, the burst signal from the host computer is input by the golden finger on the surface of the circuit board 204 and enters the laser driver chip Driver. The laser driver chip Driver adjusts the amplitude of the burst signal and outputs it to The light emitting component 205 drives the laser chip in the light emitting component 205 to emit light of a preset wavelength. However, in the above-mentioned burst mode, the continuous turning on and off of the laser chip in the light emitting component 205 will cause the light wavelength to change due to the change of the chip temperature, and as the optical communication bandwidth expands, the optical communication network is multiplexed There are more and more wavelengths, the interval between the wavelength and the wavelength is getting smaller and smaller, and the speed of the optical signal is getting higher and higher. Therefore, the actual wavelength of the light emitted by the laser chip and the preset communication channel will be confused with each other, resulting in receiving The end loses the optical signal or receives the wrong optical signal.

In view of the foregoing problems, the embodiments of the present disclosure have designed a new optical module solution. FIG. 5 is a schematic diagram of a partial structure of a first optical module provided by an embodiment of the disclosure. In actual products, there are many packaging methods used in optical modules, such as TO packaging, COB packaging, BOX packaging, and silicon-based optical chip packaging. When used in a certain embodiment of the present disclosure, the specific structure will be adaptable. Change, but its essential principle is shown in Figure 5. In the embodiment of the present disclosure, the driving circuit 10 is provided in the optical module, and the laser chip 20 in the light emitting assembly additionally includes a first laser diode 21 and a second laser diode 22.

FIG. 6 is a schematic structural diagram of a laser chip provided by an embodiment of the disclosure. As shown in FIG. 6, the substrate 23 of the laser chip 20 is provided with two active regions Wa and Wb at the same time, and an isolation trench 24 is provided between the active regions Wa and Wb. The isolation trench 24 divides the laser chip into Two light-emitting units. In the embodiment of the present disclosure, the two independent light-emitting units become the first laser diode 21 and the second laser diode 22 respectively. In addition, the resonant cavity of the first laser diode 21 and the resonant cavity of the second laser diode 22 are arranged non-parallel, that is, the two have a certain angle. Therefore, in the cross-sectional view of the laser chip in FIG. 6, the first The widths of the active regions of the laser diode 21 and the second laser diode 22 are different.

The driving circuit 10 is disposed on the circuit board 204 and is electrically connected to the anodes of the first laser diode 21 and the second laser diode 22 through wires on the circuit board 204. In addition, the cathodes of the first laser diode 21 and the second laser diode 22 are mounted on a TEC (thermoelectric cooler) and grounded. Of course, they can also be grounded directly.

The drive circuit 10 is provided with a double-pole double-throw switch. The double-pole double-throw switch is controlled by a burst signal. One end of the double-pole double-throw switch is electrically connected to the anodes of the first laser diode 21 and the second laser diode 22. One end is respectively movably connected to the contacts A, A', B, B', where the contacts A and B'are grounded, the contacts A'and B are connected to the current source, and the contacts A and B can be connected to the first laser diode 21 When turned on, the contacts A′ and B′ can be turned on with the second laser diode 22.

FIG. 8 is a timing diagram of a burst signal provided by an embodiment of the disclosure. As shown in Figure 8, the burst signal is a rectangular wave signal whose voltage changes with time. At t1, it changes from low to high; at t2, it changes from high to low; at t3, it changes from low to high, and so on. The burst signal is generally generated by the host computer, and the high or low level holding time is set by the actual lighting needs. In the embodiment of the present disclosure, when the burst signal is at the first level, the driving circuit drives 10 the first laser diode 21 to work; when the burst signal is at the second level, it stops driving the first laser diode 21 to work and drives the second laser The diode 22 works. The burst signal is a signal whose first level and the second level change mutually, and is specifically embodied as a signal whose high and low levels change. In an embodiment of the present disclosure, a high-level signal may be provided to the driving circuit 10 when an optical signal needs to be transmitted; and a low-level signal may be provided to the driving circuit 10 when an optical signal does not need to be transmitted. Of course, it is also possible to provide a low-level signal to the driving circuit 10 when the optical signal needs to be transmitted; and to provide a high-level signal to the driving circuit 10 when the optical signal does not need to be transmitted.

Based on the timing change of the above burst signal. When the burst signal is at the first level, the double-pole double-throw switch is enabled and B and B'are turned on. At this time, the anode of the first laser diode 21 is connected to the bias current to emit light, and the anode of the second laser diode 22 It is grounded and cannot emit light. When the burst signal is at the second level, the double-pole double-throw switch is enabled to connect to A and A', the anode of the first laser diode 21 is grounded, and the anode of the second laser diode 22 is connected to the bias current. The second laser diode 22 can obtain current and emit light normally. The first laser diode 21 does not emit light because it does not obtain current. When the coupled laser emits light, we select the first laser diode 21 as the working diode, so that the first laser diode 21 The emitted light is aligned with the coupling lens 30, and then the emitted light is coupled into the optical fiber. The second laser diode 22 is a heating diode, because there is a clamp between the resonant cavity of the second laser diode 22 and the resonant cavity of the first laser diode 21. Therefore, the light emitted by the second laser diode 22 can be effectively reduced to be coupled into the optical fiber through the coupling lens 30.

FIG. 7 is a schematic diagram of the positional relationship between the laser chip and the coupling lens provided by an embodiment of the disclosure. As shown in FIG. 7, in order to prevent the light emitted by the second laser diode 22 from being coupled into the optical fiber through the coupling lens 30 as much as possible, the embodiment of the present disclosure sets the light exit point of the first laser diode 21 to be located near the focal point F of the coupling lens 30, and, The included angle θ between the resonant cavity of the second laser diode 22 and the resonant cavity of the first laser diode 21 is set to be greater than the included angle μ between the central axis of the coupling lens 30 and the maximum angle light beam. It is defined as a ray parallel to the line between the focal point F of the coupling lens 30 and the edge of the coupling lens 30. In addition, a light-absorbing component may be arranged in the light-emitting direction of the second laser diode 22 to absorb the light emitted by the second laser diode 22, wherein the light-absorbing component may be arranged on the light-emitting cavity surface of the second laser diode 22, Or it can be mounted on the inner wall of the TO tube for packaging the first laser diode 21 and the second laser diode 22.

The embodiment of the present disclosure designs two laser diodes at the chip level, combined with the strong consistency of the existing chip manufacturing process, the thermal efficiency of these two laser diodes is very close when they work, and they are grown on the same substrate. The heat exchange efficiency of two laser diodes is very high, and through the configuration of the drive circuit, no matter whether the first laser diode 21 is working or the second laser diode 22 is working, only one of the two laser diodes is working at the same time, so the whole laser chip The heat generated changes very little, and the wavelength change is very small, which can meet the demanding requirements of wavelength division multiplexing technology. At the same time, due to the angle between the resonant cavity of the second laser diode 22 and the resonant cavity of the first laser diode 21, the light emitted by the second laser diode 22 can be prevented from entering the coupling lens, thereby preventing the first laser diode 21 from entering the coupling lens. The problem that the turn-off power of the entire optical module does not meet the standard during the turn-off period.

In a certain embodiment of the present disclosure, the driving circuit 10 in the embodiment of the present disclosure may also adopt other forms of circuit structures, and an embodiment in a certain embodiment of the present disclosure will be given below.

FIG. 9 is a schematic structural diagram of a laser chip driving circuit provided by an embodiment of the disclosure. As shown in Fig. 9, in the optical module provided by the embodiment of the present disclosure, the driving circuit 10 includes a first driving circuit 11 and a second driving circuit 12. The first driving circuit 11 is connected to the first laser diode 21, and the second driving circuit 12 is connected to the second The laser diode 22 is connected, wherein the first driving circuit 11 is used to make the first laser diode 21 emit light of the working wavelength when the received burst signal is the first level value; When the signal is at the second level, the first laser diode 21 will stop emitting light, even if it is turned off; the second drive circuit 12 is used to make the second laser diode 21 when the burst signal is at the second level. The laser diode 22 emits light.

In an embodiment of the present disclosure, the first driving circuit 11 may use an existing laser driving chip. For example, in one embodiment, the anode of the first laser diode 21 is connected to a current source capable of outputting a preset current signal, and the cathode of the first laser diode 21 is connected to the first driving circuit 11. At this time, when the burst signal received by the first driving circuit 11 is at the first level, the port connected to the first laser diode 21 is set to a low level, so that there is a voltage difference across the first laser diode 21. The first laser diode 21 is turned on and emits light of the operating wavelength. In an embodiment of the present disclosure, when the burst signal received by the first driving circuit 11 is at the second level, the port connected to the first laser diode 21 is set to a high level, for example, the first driving circuit 11 is connected to the first laser diode 21. The port to which the laser diode is connected is placed at the same voltage as the output port of the current source. At this time, there is no voltage difference across the first laser diode 21, and the first laser diode 21 is turned off.

In a certain embodiment of the present disclosure, the second driving circuit 12 may adopt an existing laser driving chip, or may adopt other forms of circuit structures. The following will give an embodiment in a certain embodiment of the present disclosure. The circuit structure of the second driving circuit 12 is described in detail, which will not be repeated here.

FIG. 10 is a schematic structural diagram of a first optical module laser chip driving circuit provided by an embodiment of the disclosure. As shown in FIG. 10, based on the second type of optical module, in the optical module provided by the embodiment of the present disclosure, the second driving circuit 12 includes a first electrical switch 121, a first MOS tube 122 and a first operational amplifier 123.

The input end of the first operational amplifier 123 is connected to the MCU of the optical module, the output end of the first operational amplifier 123 is connected to the gate G of the first MOS tube 122, and the drain D of the first MOS tube 122 is connected to the second laser diode. The cathode is connected, and the source S of the first MOS tube 122 is connected to the first end of the first electric switch 121. The second end of the first electric switch 121 may be grounded through a resistor. At the same time, the first electrical switch 121 is closed when the received burst signal is the second level value, so that the second laser diode 22 is turned on.

In addition, the specific structure of the first operational amplifier 123 can be referred to the description in the prior art, which will not be repeated here. In an embodiment of the present disclosure, the first operational amplifier 123 may be an operational amplifier with a fixed amplification factor, or an operational amplifier with an adjustable amplification factor. When the first operational amplifier 123 is an operational amplifier with an adjustable amplification factor At this time, the amplification factor of the first operational amplifier 123 can be adjusted according to actual needs. For example, in order to minimize the temperature drift of the first laser diode 21, the amplification factor of the first operational amplifier 123 can be adjusted to 1.

In an embodiment of the present disclosure, the input terminal of the first operational amplifier 123 is connected to the MCU of the optical module, and the MCU is used to provide the first operational amplifier 123 with an input voltage. In an embodiment of the present disclosure, the MCU may determine the specific input voltage provided to the first operational amplifier 123 according to the feedback data (for example, the feedback data may include the bias current or the wavelength of the light emitted by the first laser diode 21). Value to control the magnitude of the current flowing through the second laser diode 22. For example, in one embodiment, the specific value of the input voltage supplied to the first operational amplifier 123 can be determined according to the current flowing through the first laser diode 21 when the first laser diode 21 emits optical signals, so as to control the current flowing through the second laser diode 21. The current of the laser diode 22 further reduces the temperature difference of the first laser diode 21 to zero during the turn-off process. For example, in one embodiment, when the first laser diode 21 is turned on, the current flowing through the first laser diode 21 is i1. At the same time, when the first laser diode 21 is turned on, the second laser diode 22 is not turned on. At this time, in order to reduce the temperature drift of the first laser diode 21, i12*r1*6.25=i22*r2*118.75 (where i2 is the current flowing through the second laser diode 22 when the second laser diode 22 is turned on) ; R1 is the internal resistance of the first laser diode 21; r2 is the internal resistance of the second laser diode 22; 6.25us is the time that the first laser diode 21 is turned on during a burst signal cycle; 118.75us is one During the burst signal cycle, the first laser diode 21 is turned off). In this way, through i1, i2 can be calculated, and then the specific value of the input voltage provided by the MCU to the first operational amplifier 123 can be determined according to i2 and the current amplification factor of the first operational amplifier 123 (for example, it is determined that the MCU provides the first operational amplifier 123). The specific value of the input voltage of the operational amplifier 123 is aV). In this way, when the MCU provides an input voltage of aV to the first operational amplifier 123, when the second laser diode 22 is turned on, the current flowing through the second laser diode 22 is i2.

In the optical module provided by the embodiments of the present disclosure, by setting the second driving circuit as a circuit including a first operational amplifier, a first MOS tube and a first electrical switch, the MCU can control when the second laser diode is turned on. The current flowing through the second laser diode controls the heat emitted by the second laser diode, thereby reducing the temperature difference from the first laser diode to zero during the turn-off process to reduce the temperature of the first laser diode. Drift causes the temperature drift of the optical signal it emits.

FIG. 11 is a schematic structural diagram of another laser chip driving circuit provided by an embodiment of the disclosure. As shown in Fig. 11, in the optical module provided by the embodiment of the present disclosure, the anode of the first laser diode 21 is connected to the current source, the cathode of the first laser diode 21 is connected to the first driving circuit 11; the anode of the second laser diode 22 is connected to the second The driving circuit 12 is connected, and the cathode of the second laser diode 22 is grounded; the second driving circuit 12 is used to output a current to the second laser diode 22 when the burst signal is received at the second level value, so that The second laser diode 22 is turned on.

The anode of the first laser diode 21 may be connected to a current source through a resistor, and the current source may be a 3.3V current source. In addition, the first driving circuit 11 can use an existing laser driving chip. In this case, it is only necessary to connect a bias current port of the driving chip to the cathode of the first laser diode 21.

It should be noted that in the embodiment of the present disclosure, the magnitude of the current output by the second driving circuit 12 can be controlled by the controller in the optical module. The controller may specifically be an MCU originally integrated in the optical module. In addition, the The controller can also be an FPGA or a CPU. For example, in one embodiment, the current output by the second driving circuit 12 can be adjusted according to the current flowing through the first laser diode 21 when the first laser diode 21 emits light, so as to adjust the output current when the second laser diode 22 is turned on. In turn, the temperature difference of the first laser diode 21 during the turn-off process to the conduction process is reduced to zero. For the specific implementation principle of adjusting the current output by the second driving circuit 12 according to the current flowing through the first laser diode 21 when the first laser diode 21 is turned on, reference may be made to the description of the previous embodiment, which will not be repeated here.

FIG. 12 is a schematic structural diagram of another driving circuit of the first optical module laser chip provided by the embodiments of the disclosure. As shown in FIG. 12, in the optical module provided by the embodiment of the present disclosure, the second driving circuit 12 includes a second operational amplifier 124, a second MOS tube 125 and a second electrical switch 126.

The input terminal of the second operational amplifier 124 is connected to the MCU of the optical module, the output terminal of the second operational amplifier 124 is connected to the gate G of the second MOS tube 125, and the source S of the second MOS tube 125 is connected to the current source. The drain D of the two MOS tube 125 is connected to the first end of the second electrical switch 126, the second end of the second electrical switch 126 is connected to the anode of the second laser diode 22, and the cathode of the second laser diode 22 is grounded.

The second electrical switch 126 is used to connect the second MOS tube 125 to the second laser diode 22 when the burst signal is received at the second level.

In addition, the second operational amplifier 124 can be an operational amplifier with a fixed amplification factor, or an operational amplifier with an adjustable amplification factor. When the second operational amplifier 124 is an operational amplifier with an adjustable amplification factor, the second operational amplifier 124 can be adjusted according to actual needs. The amplification factor of the second operational amplifier 124, for example, to control the heat emitted by the second laser diode 22 when the second laser diode 22 is turned on, the amplification factor of the second operational amplifier 124 is adjusted to 2. In an embodiment of the present disclosure, the input end of the second operational amplifier 124 is connected to the MCU of the optical module, and the MCU is used to provide the second operational amplifier 124 with an input voltage. In an embodiment of the present disclosure, the MCU can control the current flowing through the second laser diode 22 according to the feedback data (for example, the feedback data can be the bias current or the wavelength of the first laser diode 21), so as to make the second laser diode 22 The temperature difference of a laser diode 21 during the turn-off process to the turn-on process is reduced to zero. This reduces the wavelength drift of the optical signal emitted by the first laser diode 21 due to the temperature drift of the first laser diode 21.

In an embodiment of the present disclosure, in a possible implementation manner of the present disclosure, the second electrical switch 126 is a single-pole single-throw electrical switch; the second electrical switch 126 is used for receiving the above-mentioned burst signal as the second At the level value, it is closed, so that the second MOS tube 125 outputs current to the second laser diode 22. In an embodiment of the present disclosure, in another possible implementation manner of the present disclosure, the second electric switch 126 is a switch.

FIG. 13 is a schematic structural diagram of another driving circuit of the first optical module laser chip provided by the embodiments of the disclosure. As shown in FIG. 13, the second driving circuit 12 further includes a first resistor 127, the third terminal of the second electric switch 126 is connected to the first terminal of the first resistor 127, and the second terminal of the first resistor 127 is grounded; The electrical switch 126 is used to connect the second MOS transistor 125 to the first resistor 127 when the burst signal is received at the first level value.

In an embodiment of the present disclosure, in the optical module provided in the embodiment of the present disclosure, the second electrical switch 126 is set as a switch. In this way, when the burst signal is received at the first level value, the first end of the second electrical switch 126 is connected to the third end. At this time, the second laser diode 22 is not conducting and the first resistor 127 is conducting. In an embodiment of the present disclosure, when the received burst signal is the second level value, the first end of the second electrical switch 126 is connected to the second end, and at this time, the second laser diode 22 is turned on. It should be noted that in the embodiment of the present disclosure, although the first resistor 127 is turned on when the first laser diode 21 is turned on, the first resistor 127 and the first laser diode 21 are not thermally coupled. Therefore, although the first resistor 127 generates heat when the first laser diode 21 is turned on, it does not transfer the generated heat to the first laser diode 21.

FIG. 10A is a schematic diagram of a partial structure of another optical module provided by an embodiment of the present disclosure. In actual products, there are many packaging methods that can be used in optical modules, such as TO packaging, COB packaging, BOX packaging, and silicon-based optical chip packaging. When used in a certain embodiment of the present disclosure, the packaging will be adapted to the specific structure. The nature changes, but its essential principle is shown in Figure 10A. In the embodiment of the present disclosure, the drive circuit 10 is provided in the optical module, and the laser chip 20 in the light emitting assembly additionally includes a first laser diode 21 and a second laser diode 22. A coupling lens 30 and a first laser diode are provided outside the laser chip. The light exit directions of the second laser diode 21 and the second laser diode 22 both face the coupling lens 30.

The drive circuit 10 is provided with a double-pole double-throw switch. The double-pole double-throw switch is controlled by a burst signal. One end of the double-pole double-throw switch is electrically connected to the anodes of the first laser diode 21 and the second laser diode 22. One end is respectively movably connected to contacts A, A', B, B', where contacts A and B'are grounded, contact B is connected to a current source, and contact A'is connected to a reverse voltage source (providing reverse bias ) Is connected, the contacts A and B can be connected to the first laser diode 21, and the contacts A'and B'can be connected to the second laser diode 22. Among them, the structure of the reverse voltage source can refer to the existing implementation manners, and the details of the embodiments of the present disclosure are not repeated here.

As shown in Figure 8, the burst signal is a rectangular wave signal whose voltage changes with time. At t1, it changes from low to high; at t2, it changes from high to low; at t3, it changes from low to high, and so on. The burst signal is generally generated by the host computer, and the high or low level holding time is set by the actual lighting needs. According to the embodiment of the present disclosure, when the burst signal is at the first level, the driving circuit 10 drives the first laser diode 21 to work; when the burst signal is at the second level, it stops driving the first laser diode 21 to work, and sends the signal to the second laser. The diode 22 applies a reverse bias voltage. The burst signal is a signal whose first level and the second level change mutually, and is specifically embodied as a signal whose high and low levels change. In an embodiment of the present disclosure, a high-level signal may be provided to the driving circuit 10 when an optical signal needs to be transmitted; and a low-level signal may be provided to the driving circuit 10 when an optical signal does not need to be transmitted. Of course, it is also possible to provide a low-level signal to the drive circuit 10 when the optical signal needs to be transmitted; and to provide a high-level signal to the drive circuit 10 when the optical signal does not need to be transmitted.

Based on the timing change of the above burst signal. When the burst signal is at the first level, when the double-pole double-throw switch is enabled to connect to A and A', the anode of the first laser diode 21 is grounded, and the anode of the second laser diode 22 is connected to the reverse bias voltage. When the second laser diode 22 can generate leakage current and generate heat, the first laser diode 21 does not emit light because it does not receive current; when the burst signal is at the second level, the double-pole double-throw switch is enabled to conduct with B and B' At this time, at this time, the anode of the first laser diode 21 is connected to the bias current to emit light, and the anode of the second laser diode 22 is grounded and cannot emit light. When we couple the laser to emit light, select the first laser diode 21 as the working diode, so that the light emitted by the first laser diode 21 is aligned with the coupling lens 30, and then the light emitted by it is coupled into the optical fiber. The second laser diode 22 is Heating diode.

The embodiment of the present disclosure in FIG. 10A designs two laser diodes at the chip level, and the second laser diode 22 is used to heat the first laser diode 21 when the first laser diode 21 is not working. It is compared with the existing chip manufacturing process. With strong consistency and grown on the same substrate, the heat exchange efficiency of the two laser diodes is very high, the heat generated by the entire laser chip changes very little, and the wavelength change is very small, which can meet the demanding requirements of wavelength division multiplexing technology. At the same time, because the second laser diode only generates heat and does not emit light, it can avoid the problem that the light emitted by the second laser diode enters the coupling lens, thereby avoiding the problem that the turn-off power of the entire optical module does not meet the standard during the turn-off of the first laser diode. .

As shown in FIG. 9, in the optical module provided by the embodiment of the present disclosure, the driving circuit 10 includes a first driving circuit 11 and a second driving circuit 12. The first driving circuit 11 is connected to the first laser diode 21, and the second driving circuit 12 is connected to The second laser diode 22 is connected. The first drive circuit 11 is used to make the first laser diode 21 emit light of the working wavelength when the received burst signal is at the first level value; When the above-mentioned burst signal is at the second level value, the first laser diode 21 is made to stop emitting light, even if it is turned off or off; the second driving circuit 12, in cooperation with the circuit structure of FIG. 10A, is used for receiving the above-mentioned When the burst signal is at the second level value, a reverse bias voltage is applied to the second laser diode 22. In order to ensure the reversibility of the second laser diode 22, the reverse bias voltage is smaller than the reverse bias voltage of the second laser diode 22. Breakdown voltage.

In an embodiment of the present disclosure, the first driving circuit 11 may use an existing laser driving chip. For example, in one embodiment, the anode of the first laser diode 21 is connected to a voltage source capable of outputting a preset voltage signal, and the cathode of the first laser diode 21 is connected to the first driving circuit 11. At this time, when the burst signal received by the first driving circuit 11 is at the first level, the port connected to the first laser diode 21 is set to a low level, so that there is a voltage difference across the first laser diode 21. The first laser diode 21 is turned on and emits light of the operating wavelength. In an embodiment of the present disclosure, when the burst signal received by the first driving circuit 11 is at the second level, the port connected to the first laser diode 21 is set to a high level, for example, the first driving circuit 11 is connected to the first laser diode 21. The port to which the laser diode is connected is set to the same value as the voltage output by the voltage source. At this time, there is no voltage difference across the first laser diode 21, and the first laser diode 21 is turned off.

FIG. 10B is a schematic structural diagram of another optical module laser chip driving circuit provided by an embodiment of the disclosure. As shown in FIG. 10B, in the optical module provided by the embodiment of the present disclosure, the second driving circuit 12 includes a first electric switch 121, a first MOS tube 122 and a first operational amplifier 123.

The input terminal of the first operational amplifier 123 is connected to the MCU of the optical module, the output terminal of the first operational amplifier 123 is connected to the gate G of the first MOS tube 122, and the drain D of the first MOS tube 122 is connected to the second laser diode 22 The cathode of the first MOS tube 122 is connected, and the source S of the first MOS tube 122 is connected to the first end of the first electrical switch 121. The anode of the second laser diode 22 is connected to a reverse voltage source. The second end of the first electric switch 121 may be grounded through a resistor. At the same time, the first electrical switch 121 is closed when the received burst signal is the second level value, so as to apply a reverse bias voltage to the second laser diode 22.

In addition, the specific structure of the first operational amplifier 123 can be referred to the description in the prior art, which will not be repeated here. In an embodiment of the present disclosure, the first operational amplifier 123 may be an operational amplifier with a fixed amplification factor, or an operational amplifier with an adjustable amplification factor. When the first operational amplifier 123 is an operational amplifier with an adjustable amplification factor At this time, the amplification factor of the first operational amplifier 123 can be adjusted according to actual needs. For example, in order to minimize the temperature drift of the first laser diode 21, the amplification factor of the first operational amplifier 123 can be adjusted to 1.5.

In an embodiment of the present disclosure, the input terminal of the first operational amplifier 123 is connected to the MCU of the optical module, and the MCU is used to provide the first operational amplifier 123 with an input voltage. In an embodiment of the present disclosure, the MCU may determine the specific input voltage provided to the first operational amplifier 123 according to the feedback data (for example, the feedback data may include the bias current or the wavelength of the light emitted by the first laser diode 21). Value to control the magnitude of the reverse current flowing through the second laser diode 22. For example, in one embodiment, the specific value of the input voltage supplied to the first operational amplifier 123 can be determined according to the current flowing through the first laser diode 21 when the first laser diode 21 emits optical signals, so as to control the current flowing through the second laser diode 21. The reverse current of the laser diode 22 further reduces the temperature difference from the first laser diode 21 to zero during the turn-off process to the turn-on process.

In the optical module provided by the embodiment of the present disclosure, the second driving circuit is configured as a circuit including the first operational amplifier 123, the first MOS tube 122, and the first electrical switch 121. In this way, the first electrical switch 121 can be controlled by the MCU. When it is turned on, the reverse current flowing through the second laser diode 22 is used to control the heat emitted by the second laser diode 22, thereby reducing the temperature difference from the first laser diode to zero during the turn-off process. In order to reduce the temperature drift of the optical signal emitted by the first laser diode 21 due to the temperature drift of the first laser diode 21.

As shown in FIG. 11, in the optical module provided by the embodiment of the present disclosure, the second driving circuit 12 is arranged at the anode end of the second laser diode 22. The anode of the second laser diode 22 is connected to the second drive circuit 12, and the cathode of the second laser diode 22 is grounded; wherein, the second drive circuit 12 is used to transmit the signal to the second level when the burst signal is received. The output of the second laser diode 22 is applied with a reverse bias voltage, so that the second laser diode 22 generates a leakage current.

It should be noted that in the embodiment of the present disclosure, the magnitude of the reverse bias voltage output by the second driving circuit 12 can be controlled by the controller in the optical module, and the controller may specifically be an MCU originally integrated in the optical module. In addition, the controller can also be an FPGA or a CPU. For example, in one embodiment, the reverse bias voltage output by the second driving circuit 12 can be adjusted according to the current flowing through the first laser diode 21 when the first laser diode 21 emits light, so as to adjust the output of the second laser diode 22. In turn, the temperature difference of the first laser diode 21 during the turn-off process to the conduction process is reduced to zero. For the specific implementation principle of adjusting the current output by the second driving circuit 12 according to the current flowing through the first laser diode 21 when the first laser diode 21 is turned on, reference may be made to the description of the previous embodiment, which will not be repeated here.

14 is a schematic structural diagram of another driving circuit of another optical module laser chip provided by an embodiment of the present disclosure; as shown in FIG. 14, in the optical module provided by an embodiment of the present disclosure, the second driving circuit 12 includes a second operational amplifier 124, The second MOS tube 125 and the second electric switch 126.

The input terminal of the second operational amplifier 124 is connected to the MCU of the optical module, the output terminal of the second operational amplifier 124 is connected to the gate G of the second MOS tube 125, and the source S of the second MOS tube 125 is connected to the reverse voltage source , The drain D of the second MOS tube 125 is connected to the first end of the second electrical switch 126, the second end of the second electrical switch 126 is connected to the anode of the second laser diode 22, and the cathode of the second laser diode 22 is grounded.

In addition, the second operational amplifier 124 can be an operational amplifier with a fixed amplification factor, or an operational amplifier with an adjustable amplification factor. When the second operational amplifier 124 is an operational amplifier with an adjustable amplification factor, the second operational amplifier 124 can be adjusted according to actual needs. The amplification factor of the second operational amplifier 124, for example, to control the heat emitted by the second laser diode 22 when the second laser diode 22 is turned on, the amplification factor of the second operational amplifier 124 is adjusted to 2. In an embodiment of the present disclosure, the input end of the second operational amplifier 124 is connected to the MCU of the optical module, and the MCU is used to provide the second operational amplifier 124 with an input voltage. In an embodiment of the present disclosure, the MCU can control the leakage current flowing through the second laser diode 22 according to the feedback data (for example, the feedback data can be the bias current or the wavelength of the first laser diode 21), so as to make The temperature difference of the first laser diode 21 during the turn-off process to the turn-on process is reduced to zero. This reduces the wavelength drift of the optical signal emitted by the first laser diode 21 due to the temperature drift of the first laser diode 21.

FIG. 15 is a schematic structural diagram of another driving circuit of another optical module laser chip provided by an embodiment of the disclosure. As shown in FIG. 15, the second driving circuit 12 further includes a first resistor 127, the third terminal of the second electrical switch 126 is connected to the first terminal of the first resistor 127, and the second terminal of the first resistor 127 is grounded; The electrical switch 44 is used to connect the second MOS transistor 125 to the first resistor 127 when the burst signal is received at the first level value.

In an embodiment of the present disclosure, in the optical module provided in the embodiment of the present disclosure, the second electrical switch 126 is set as a switch. In this way, when the burst signal is received at the first level value, the first end of the second electrical switch 126 is connected to the third end. At this time, the second laser diode 22 is in the off state and the first resistor 127 is turned on. In an embodiment of the present disclosure, when the received burst signal is the second level value, the first end of the second electrical switch 126 is connected to the second end, and at this time, the second laser diode 22 is applied Reverse bias. It should be noted that, in the embodiment of the present disclosure, although the first resistor 127 is turned on when the first laser diode 21 is turned on, the first resistor 127 and the first laser diode 21 are not thermally coupled. Therefore, although the first resistor 127 generates heat when the first laser diode 21 is turned on, it does not transfer the generated heat to the first laser diode 21.

In the optical module provided by the embodiments of the present disclosure, the second driving circuit is configured as a circuit including a second operational amplifier, a second MOS tube, and a second electrical switch. In this way, the input voltage or amplification of the second operational amplifier can be controlled. The multiplier controls the current flowing through the second laser diode when the second laser diode is turned on to minimize the temperature drift of the first laser diode and reduce the wavelength of the optical signal emitted by the first laser diode due to the temperature drift of the first laser diode. drift. It should be noted that the optical module provided by the embodiments of the present disclosure is not only suitable for the above-mentioned form of separate packaging of the light emitting component and the light receiving component, but also suitable for packaging the light emitting component and the light receiving component together to form an optical transceiver sub-module, and The transceiver chip is mounted on a circuit board and other packaging forms. For any packaging form, the related devices used to transmit optical signals are referred to as light emitting components in the embodiments of the present disclosure. The related devices used to receive optical signals are in In the embodiments of the present disclosure, they are all referred to as light receiving components. In addition, the foregoing optical module may be an optical module in an OLT or ONU, but is not limited to this.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the foregoing embodiments are modified, or some of the technical features are equivalently replaced; these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

An optical module, characterized in that it comprises:

Circuit board

The laser chip is electrically connected to the circuit board and includes a first laser diode and a second laser diode on the same substrate, the resonant cavity of the second laser diode and the resonant cavity of the first laser diode are arranged non-parallel ；

A driving circuit is provided on the circuit board, is electrically connected to the first laser diode and the second laser diode through the circuit board, and is used to drive the first laser diode to emit light; and, to control the When the first laser diode is turned off, driving the second laser diode to emit light;

The coupling lens is arranged on the light exit side of the first laser diode and is used to collimate the light emitted by the first laser diode.
The optical module according to claim 1, wherein a light-absorbing component is provided in the light-emitting direction of the second laser diode.
The optical module according to claim 1 or 2, wherein the light exit point of the first laser diode is located near the focal point of the coupling lens;

The included angle between the resonant cavity of the second laser diode and the resonant cavity of the first laser diode is greater than the included angle between the central axis of the coupling lens and the maximum angle light;

The maximum incident angle rays are rays parallel to the line connecting the focal point and the edge of the coupling lens.
The optical module according to claim 1, wherein the driving circuit comprises a switch, wherein:

The first end of the switch is connected to a current source, the second end of the switch is connected to the anode of the first laser diode, and the third end of the switch is connected to the anode of the second laser diode ；

The switch is configured to connect the current source to the first laser diode when the received burst signal is at the first level value, so that the first laser diode emits light; and, When the received burst signal is the second level value, the current source is connected to the second laser diode, so that the first laser diode is turned off and the second laser diode emits light.
The optical module according to claim 1, wherein the driving circuit comprises a first driving circuit and a second driving circuit, wherein:

The first driving circuit is connected to the first laser diode, and is configured to cause the first laser diode to emit light when the received burst signal is a first level value; and, to cause the first laser diode to emit light when the received burst signal is When the burst signal is at the second level value, stop the first laser diode from emitting light;

The second driving circuit is connected to the second laser diode, and is configured to make the second laser diode emit light when the received burst signal is a second level value.
The optical module according to claim 5, wherein the second driving circuit comprises a first electric switch, wherein: the anode of the first laser diode and the anode of the second laser diode are respectively connected to a current source , The cathode of the first laser diode is connected to the first driving circuit;

The cathode of the second laser diode is connected to the first end of the first electric switch, and the second end of the first electric switch is grounded;

The first electrical switch is configured to be closed when the received burst signal is a second level value, so that the second laser diode emits light.
The optical module according to claim 6, wherein the second driving circuit further comprises a first operational amplifier and a first MOS tube, wherein:

The input terminal of the first operational amplifier is connected to the MCU of the optical module, the output terminal of the first operational amplifier is connected to the gate of the first MOS tube, and the drain of the first MOS tube is connected to the The cathode of the second laser diode is connected, and the source of the first MOS tube is connected to the first end of the first electrical switch.
5. The optical module of claim 5, wherein the anode of the second laser diode is connected to the second driving circuit, and the cathode of the second laser diode is grounded;

The second driving circuit is configured to output a current to the second laser diode when the received burst signal is a second level value, so that the second laser diode emits light.
8. The optical module according to claim 8, wherein the second driving circuit comprises a current source, a second operational amplifier, a second MOS tube and a second electric switch, wherein:

The input terminal of the second operational amplifier is connected to the MCU of the optical module, the output terminal of the second operational amplifier is connected to the gate of the second MOS tube, and the source of the second MOS tube is connected to the The output end of the current source is connected, the drain of the second MOS tube is connected to the first end of the second electrical switch, and the second end of the second electrical switch is connected to the anode of the second laser diode , The cathode of the second laser diode is grounded;

The second electrical switch connects the second MOS tube with the second laser diode when the received burst signal is at the second level value.
The optical module according to claim 9, wherein the second electric switch is a switch, and the second driving circuit further comprises a first resistor, wherein:

The third terminal of the second electric switch is connected to the first terminal of the first resistor, and the second terminal of the first resistor is grounded;

The second electrical switch is used for connecting the second MOS transistor with the first resistor when the received burst signal is at the first level value.
An optical module, characterized in that it comprises:

Circuit board

The laser chip includes a first laser diode and a second laser diode on the same substrate;

The driving circuit is arranged on the circuit board, and is electrically connected to the first laser diode and the second laser diode, respectively, for driving the first laser diode to emit light; and, for controlling the first laser diode to turn off When, applying a reverse bias to the second laser diode;

The coupling lens is arranged on the light exit side of the first laser diode and is used to collimate the light emitted by the first laser diode.
11. The optical module of claim 11, wherein the reverse bias voltage is less than the reverse breakdown voltage of the second laser diode.
The optical module according to claim 11, wherein the driving circuit comprises a switch, wherein:

The first end of the switch is movably connected to a current source and a reverse voltage source, the second end of the switch is connected to the anode of the first laser diode, and the third end of the switch is connected to the The anode of the second laser diode is connected; the cathodes of the first laser diode and the second laser diode are both grounded;

The switch is configured to connect the current power supply to the first laser diode when the received burst signal is at the first level value, so that the first laser diode emits light; and, When the received burst signal is the second level value, the reverse voltage source is connected to the second laser diode, and the connection between the first laser diode and the current source is disconnected to The first laser diode is turned off, and a reverse bias voltage is applied to the second laser diode.
The optical module according to claim 11, wherein the driving circuit comprises a first driving circuit and a second driving circuit, wherein:

The first driving circuit is connected to the first laser diode, and is configured to cause the first laser diode to emit light when the received burst signal is a first level value; and, to cause the first laser diode to emit light when the received burst signal is When the burst signal is at the second level value, stop the first laser diode from emitting light;

The second driving circuit is connected to the second laser diode, and is configured to apply a reverse bias to the second laser diode when the received burst signal is a second level value.
The optical module according to claim 14, wherein the second driving circuit comprises a first electric switch, wherein:

The anode of the first laser diode is connected to a reverse voltage source, the cathode of the second laser diode is connected to the first end of the first electrical switch, and the second end of the first electrical switch is grounded;

The first electrical switch is configured to be closed when the received burst signal is a second level value, so that the reverse voltage source applies a reverse bias voltage to the second laser diode.
The optical module according to claim 15, wherein the second driving circuit further comprises a first operational amplifier and a first MOS tube, wherein:

The input terminal of the first operational amplifier is connected to the MCU of the optical module, the output terminal of the first operational amplifier is connected to the gate of the first MOS tube, and the drain of the first MOS tube is connected to the The cathode of the second laser diode is connected, and the source of the first MOS tube is connected to the first end of the first electrical switch.
The optical module according to claim 14, wherein the anode of the second laser diode is connected to the second driving circuit, and the cathode of the second laser diode is grounded;

The second driving circuit is configured to apply a reverse bias to the second laser diode when the received burst signal is a second level value.
The optical module according to claim 17, wherein the second driving circuit comprises a reverse voltage source, a second operational amplifier, a second MOS tube and a second electric switch, wherein:

The input terminal of the second operational amplifier is connected to the MCU of the optical module, the output terminal of the second operational amplifier is connected to the gate of the second MOS tube, and the source of the second MOS tube is connected to the The reverse voltage source is connected, the drain of the second MOS transistor is connected to the first end of the second electrical switch, and the second end of the second electrical switch is connected to the anode of the second laser diode, The cathode of the second laser diode is grounded;

The second electrical switch connects the second MOS tube with the second laser diode when the received burst signal is at the second level value.
The optical module according to claim 18, wherein the second electric switch is a switch, and the second driving circuit further comprises a first resistor, wherein:

The third terminal of the second electric switch is connected to the first terminal of the first resistor, and the second terminal of the first resistor is grounded;

The second electrical switch is used for connecting the second MOS transistor with the first resistor when the received burst signal is at the first level value.