WO2021176786A1 - Imaging method, imaging device, and panel manufacturing device - Google Patents

Imaging method, imaging device, and panel manufacturing device Download PDF

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Publication number
WO2021176786A1
WO2021176786A1 PCT/JP2020/045076 JP2020045076W WO2021176786A1 WO 2021176786 A1 WO2021176786 A1 WO 2021176786A1 JP 2020045076 W JP2020045076 W JP 2020045076W WO 2021176786 A1 WO2021176786 A1 WO 2021176786A1
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WO
WIPO (PCT)
Prior art keywords
flexible wiring
light
circuit board
wiring board
irradiation
Prior art date
Application number
PCT/JP2020/045076
Other languages
French (fr)
Japanese (ja)
Inventor
浩彦 関
陽朗 竹下
仁人 伊藤
広貴 工藤
Original Assignee
コニカミノルタ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Priority to JP2022504976A priority Critical patent/JPWO2021176786A1/ja
Publication of WO2021176786A1 publication Critical patent/WO2021176786A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • the present invention relates to an imaging method, an imaging device, and a panel manufacturing device.
  • the radiation detection panel, display panel, and the like have, for example, a TFT (Thin Film Transistor) substrate and a circuit board electrically connected to the TFT substrate via a flexible wiring board.
  • TFT Thin Film Transistor
  • circuit board electrically connected to the TFT substrate via a flexible wiring board.
  • an object of the present invention is to provide an imaging method, an imaging device, and a panel manufacturing apparatus capable of improving the stability of alignment between a flexible wiring board and a circuit board.
  • An imaging method for imaging a circuit board and a flexible wiring board wherein the circuit board is mounted on a mounting member, and the flexible wiring board is held by a holding member and mounted on the mounting member described above.
  • the flexible wiring board is arranged at a position facing at least a part of the circuit board, and the light receiving portion is arranged at a position capable of receiving the light reflected by the circuit board facing the flexible wiring board.
  • An imaging method including irradiating the circuit board and the flexible wiring board with irradiation light from the irradiation unit, and directing the light directly reflected by the flexible wiring board out of the irradiation light in a direction deviating from the light receiving unit. ..
  • An imaging method for imaging a circuit board and a flexible wiring board wherein the circuit board is mounted on a mounting member, and the flexible wiring board is held by a holding member and mounted on the mounting member described above.
  • the flexible wiring board is arranged at a position facing at least a part of the circuit board, and the light receiving portion is arranged at a position capable of receiving the light reflected by the circuit board facing the flexible wiring board.
  • An imaging method comprising irradiating the circuit board and the flexible wiring board with irradiation light forming an angle of 15 degrees or more and 75 degrees or less from the irradiation unit with respect to the optical axis of the light receiving unit.
  • the irradiation unit includes a light source and a lens that collects light emitted from the light source.
  • An image pickup device that images a circuit board and a flexible wiring board, and faces at least a part of the mounting member on which the circuit board is mounted and the circuit board mounted on the above-mentioned mounting member.
  • a holding member that holds the flexible wiring board, a light receiving portion that receives light reflected by the circuit board facing the flexible wiring board, and irradiation light are applied to the circuit board and the flexible wiring board.
  • An imaging device including an irradiation unit arranged so that the light positively reflected by the flexible wiring board of the irradiation light is directed in a direction deviating from the light receiving unit.
  • An image pickup device that images a circuit board and a flexible wiring board, and faces at least a part of the mounting member on which the circuit board is mounted and the circuit board mounted on the above-mentioned mounting member.
  • a holding member that holds the flexible wiring board, a light receiving portion that receives light reflected by the circuit board facing the flexible wiring board, and a light receiving portion of 15 degrees or more and 75 degrees with respect to the optical axis of the light receiving portion.
  • An imaging device including an irradiation unit that irradiates the circuit board and the flexible wiring board with irradiation light having the following angles.
  • the irradiation unit includes a light source and a lens that collects light emitted from the light source.
  • a panel manufacturing apparatus including a detection unit that detects the amount of deviation between the first terminal and the second terminal.
  • the light that is specularly reflected by the flexible wiring board is directed in a direction deviating from the light receiving portion, or the irradiation portion is 15 degrees or more and 75 degrees or less with respect to the optical axis of the light receiving portion.
  • the circuit board and the flexible wiring board are irradiated with the irradiation light forming an angle.
  • the degree of bending of the flexible wiring board changes, it is difficult for the light that is specularly reflected by the flexible wiring board to enter the light receiving part among the irradiation light, so that the light receiving part due to the degree of bending of the flexible wiring board Fluctuations in the amount of light incident on the light are reduced. Therefore, the influence of the bending of the flexible wiring board can be suppressed, and the flexible wiring board and the circuit board can be stably imaged. Therefore, it is possible to improve the stability of the alignment between the flexible wiring board and the circuit board.
  • FIG. 3A It is a block diagram which illustrates the structure of the panel manufacturing apparatus which concerns on one Embodiment. It is schematic cross-sectional view which illustrates the structure of the image pickup apparatus shown in FIG. It is a perspective view which shows an example of the structure of the irradiation part shown in FIG. It is a figure which shows the cross-sectional structure along the line BB shown in FIG. 3A. It is a top view which shows an example of the structure of the flexible wiring board and a circuit board shown in FIG. (A) is a plan view showing the configuration before alignment of the terminal of the flexible wiring board and the terminal of the circuit board shown in FIG. 4, and (B) shows the configuration after alignment from (A). It is a plan view.
  • FIG. 5 is a cross-sectional view showing an example of the path of irradiation light when the flexible wiring board shown in FIG. 7A is warped toward the circuit board side. It is sectional drawing which shows an example of the path of the irradiation light when the flexible wiring board shown in FIG. 7A is warped to the side opposite to the circuit board. It is schematic cross-sectional view which illustrates the structure of the panel manufacturing apparatus which concerns on a comparative example.
  • FIG. 9A It is sectional drawing which shows an example of the course of the irradiation light of the irradiation part shown in FIG. It is sectional drawing which shows an example of the course of the irradiation light when the degree of bending is different from the flexible wiring board shown in FIG. 9A. It is schematic cross-sectional view which illustrates the structure of the panel manufacturing apparatus which concerns on the modification.
  • FIG. 1 is a block diagram illustrating the configuration of the panel manufacturing apparatus 1 according to the embodiment.
  • the panel manufacturing device 1 includes, for example, an image pickup device 10, and the image pickup device 10 includes, for example, a mounting member 11, a holding member 12, an irradiation unit 13, and a light receiving unit 14.
  • the panel manufacturing apparatus 1 is provided with a detection unit 15 and a control unit 16 together with the image pickup apparatus 10. These components are communicably connected to each other by the internal bus B.
  • FIG. 2 is a cross-sectional view schematically showing the configuration of the image pickup apparatus 10.
  • the image pickup device 10 is used, for example, to image the terminals of the flexible wiring board 22 (terminal 22T of FIG. 4 described later) and the terminals of the circuit board 23 (terminal 23T of FIG. 4 described later).
  • the irradiation light Li directed from the irradiation unit 13 toward the flexible wiring board 22 and the circuit board 23 is reflected by each of the flexible wiring board 22 and the circuit board 23, and is incident on the light receiving unit 14, so that the flexible wiring board 22
  • the terminals and the terminals of the circuit board 23 are imaged.
  • the light receiving unit 14 has an optical axis 14A substantially perpendicular to the flexible wiring board 22 and the circuit board 23.
  • the flexible wiring board 22 extends in a predetermined direction (Y direction in FIG. 2), and one end of the extending direction is connected to the TFT board 21.
  • the terminals provided at one end of the flexible wiring board 22 are connected to the input / output terminals of the TFT board 21 via the conductive adhesive 24.
  • the conductive adhesive 24 is, for example, ACF (Anisotropic Connective Film).
  • the terminal provided at the other end of the flexible wiring board 22 is connected to the terminal of the circuit board 23.
  • the image pickup apparatus 10 takes a picture from, for example, the flexible wiring board 22 side in a state where the other end of the flexible wiring board 22 is overlapped with the circuit board 23.
  • the panel manufacturing apparatus 1 performs alignment based on the positions of the terminals of the flexible wiring board 22 and the circuit board 23 imaged by the imaging apparatus 10, and then crimps between the terminals.
  • the direction of the optical axis 14A of the light receiving unit 14 will be described as the Z direction
  • the extending direction of the flexible wiring substrate 22 will be described as the Y direction
  • the Z direction and the direction perpendicular to the Y direction will be described as the X direction.
  • the circuit board 23 is mounted on the mounting member 11.
  • the mounting surface of the mounting member 11 is, for example, an XY plane.
  • the mounting member 11 is, for example, a movable stage, and the movement of the mounting member 11 is controlled by the control unit 16.
  • the mounting member 11 moves, for example, in the X direction to change the position of the circuit board 23.
  • the flexible wiring board 22 is held by the holding member 12.
  • the holding member 12 holds the flexible wiring board 22 by suction, for example.
  • the substrate surface of the flexible wiring board 22 is, for example, an XY plane, and the holding member 12 holds the flexible wiring board 22 by suction in the Z direction.
  • the holding member 12 holds, for example, the central portion of the flexible wiring board 22 in the extending direction. It is preferable that the holding member 12 holds the flexible wiring board 22 so that the flexible wiring board 22 is less bent.
  • the holding member 12 holds the flexible wiring board 22 so as to maintain a gap in the Z direction between the flexible wiring board 22 and the circuit board 23. This makes it possible to prevent adhesion between the terminals of the flexible wiring board 22 and the terminals of the circuit board 23 before alignment.
  • the irradiation unit 13 generates irradiation light Li toward the flexible wiring board 22 and the circuit board 23.
  • the irradiation unit 13 is arranged so that the irradiation light Li faces the flexible wiring board 22 and the circuit board 23 from the other end side of the flexible wiring board 22.
  • the angle (angle a) formed by the irradiation light Li and the optical axis 14A of the light receiving unit 14 is adjusted to 15 degrees or more and 75 degrees or less, preferably 30 degrees or more and 60 degrees or less.
  • the irradiation unit 13 is arranged so that the angle a formed by the irradiation light Li and the optical axis 14A of the light receiving unit 14 is 15 degrees or more and 75 degrees or less, preferably 30 degrees or more and 60 degrees or less. Details will be described later, but as a result, even if the degree of bending of the flexible wiring board 22 changes, the light reflected by the flexible wiring board 22 (the specularly reflected light Lsr of FIGS. 7A to 7C described later) can be received by the light receiving portion. It becomes easier to go in the direction deviating from 14.
  • FIG. 3A and 3B show an example of the configuration of the irradiation unit 13.
  • FIG. 3A is an exploded perspective view schematically showing the configuration of the irradiation unit 13, and FIG. 3B shows a cross-sectional configuration along the line BB'shown in FIG. 3A.
  • the irradiation unit 13 includes, for example, a light source 130, a lens 133, and a housing 134. In FIG. 3A, the housing 134 is not shown.
  • the light source 130 is composed of, for example, bar illumination, and has a light source substrate 131 and a plurality of LEDs (Light Emitting Diodes) 132 supported by the light source substrate 131.
  • the light source substrate 131 has, for example, a rectangular planar shape, and a plurality of LEDs 132 are arranged along the long side direction of the rectangle.
  • the LED 132 emits light having a wavelength in the infrared region, for example. That is, the irradiation light Li is light having a wavelength in the infrared region.
  • the wavelength of the irradiation light Li is preferably 840 nm or more and 860 nm or less.
  • the wavelength of the irradiation light Li may be 940 nm or more and 950 nm or less, but by setting the wavelength of the irradiation light Li to 840 nm or more and 860 nm or less, the sensitivity of the light receiving unit 14 tends to be increased, and a clearer image is captured. be able to.
  • the irradiation light Li may be light having a wavelength in the visible region, such as light in the red region.
  • the light source 130 may have a configuration other than bar illumination, and may be, for example, a spot type.
  • the lens 133 is arranged between the light source 130 and the flexible wiring board 22. Irradiation light Li is generated by the light emitted from the light source 130 passing through the lens 133.
  • the lens 133 is a condenser lens and has, for example, a cylindrical shape.
  • the depth of field of the image pickup apparatus 10 is increased.
  • both the flexible wiring board 22 and the circuit board 23 can be easily focused. be able to. That is, it is possible to align these while preventing the terminals of the flexible wiring board 22 and the terminals of the circuit board 23 from adhering to each other.
  • the lens 133 is arranged close to the light source 130 (LED 132).
  • the housing 134 houses the light source 130 and the lens 133.
  • the housing 134 is provided with an opening, and the irradiation light Li is taken out through the opening.
  • the light receiving unit 14 is composed of a camera.
  • the light receiving unit 14 faces the mounting member 11 in the Z direction, with the flexible wiring board 22 (specifically, the other end of the flexible wiring board 22 in detail) and the circuit board 23 in between.
  • the optical axis 14A of the light receiving unit 14 is provided substantially perpendicular to the mounting surface of the mounting member 11. In the image pickup apparatus 10, the flexible wiring board 22 and the circuit board 23 are imaged by the light incident on the light receiving unit 14.
  • FIG. 4 shows an example of the configuration of the flexible wiring board 22 and the circuit board 23.
  • the terminal 22T of the flexible wiring board 22 is provided on one surface of the flexible wiring board 22.
  • the flexible wiring board 22 is, for example, a COF (Chip on Film).
  • the COF includes a wiring board on which an insulating film and a copper foil are laminated, and a chip such as an IC (Integrated Circuit) mounted on the wiring board.
  • the insulating film for example, a polyimide film is used from the viewpoint of heat resistance.
  • the flexible wiring board 22 may be an FPC (Flexible Printed Circuit), a TAB (Tape Automated Bonding), a TCP (Tape Carrier Package), or the like.
  • the flexible wiring board 22 has flexibility.
  • the terminal 23T of the circuit board 23 is provided on one surface of the circuit board 23.
  • the circuit board 23 is provided with a plurality of terminals 23T arranged in the X direction at the same pitch as the terminals 22T.
  • the circuit board 23 is, for example, a PCB (Printed Circuit Board).
  • a conductive adhesive 25 is provided on one surface of the circuit board 23 so as to cover the plurality of terminals 23T.
  • the conductive adhesive 25 is, for example, ACF.
  • the flexible wiring board 22 and the circuit board 23 are arranged so that one surface of the circuit board 23 and one surface of the flexible wiring board 22 face each other with the conductive adhesive 25 in between. NS.
  • the terminal 23T of the circuit board 23 corresponds to a specific example of the first terminal of the present invention
  • the terminal 22T of the flexible wiring board 22 corresponds to a specific example of the second terminal of the present invention.
  • the detection unit 15 detects the amount of misalignment between the terminal 22T of the flexible wiring board 22 and the terminal 23T of the circuit board 23. For example, the detection unit 15 acquires the image information of the terminals 22T and 23T imaged by the image pickup apparatus 10, and detects the amount of displacement in the X direction between the terminal 22T and the terminal 23T based on the image information. ..
  • the control unit 16 aligns the terminal 22T of the flexible wiring board 22 with the terminal 23T of the circuit board 23.
  • the control unit 16 acquires, for example, information on the amount of misalignment detected by the detection unit 15, and drives the mounting member 11 according to this information.
  • FIG. 5 (A) shows an example of the arrangement of the terminals 22T and the terminals 23T before the alignment
  • FIG. 5 (B) shows the terminals after the alignment is performed from the state shown in FIG. 5 (A).
  • An example of the arrangement of the 22T and the terminal 23T is shown.
  • the control unit 16 moves the mounting member 11 by a predetermined distance in the X direction according to the information from the detection unit 15, for example.
  • the positions of the terminals 22T of the flexible wiring board 22 are aligned with the positions of the terminals 23T of the circuit board 23 in the X direction, and the alignment of the terminals 22T and the terminals 23T is completed.
  • the control unit 16 may move the mounting member 11 in the X direction and the Y direction.
  • the control unit 16 may control these crimping steps after the terminals 22T and 23T are aligned.
  • FIG. 6 is a flowchart illustrating an alignment process of terminals 22T and 23T using the panel manufacturing apparatus 1 and a crimping process thereof.
  • the panel manufacturing apparatus 1 performs the positioning step of the terminals 22T and 23T by using the imaging method of the imaging apparatus 10.
  • the process shown in the flowchart of FIG. 6 is stored as a program in the panel manufacturing apparatus 1 and executed by the control unit 16.
  • the mounting member 11, the irradiation unit 13, and the light receiving unit 14 are installed (step S101).
  • the light receiving portion 14 is arranged so that the optical axis 14A of the light receiving portion 14 is perpendicular to the mounting surface of the mounting member 11, and the angle a formed by the optical axis 14A and the irradiation light Li is 15 degrees or more 75.
  • the position of the irradiation unit 13 is adjusted so that the temperature is less than or equal to, preferably 30 degrees or more and 60 degrees or less.
  • the circuit board 23 is mounted on the mounting member 11 (step S102).
  • a conductive adhesive 25 is provided on the terminal 23T of the circuit board 23.
  • the flexible wiring board 22 is held by the holding member 12 (step S103).
  • one surface of the flexible wiring board 22 (the surface provided with the terminal 22T) is made to face the circuit board 23, and a gap in the Z direction is provided between the flexible wiring board 22 and the circuit board 23.
  • the portion of the flexible wiring board 22 provided with the terminal 22T is opposed to the portion of the circuit board 23 provided with the terminal 23T.
  • the positions of the circuit board 23 and the flexible wiring board 22 are adjusted so that the light reflected by the terminals 22T and 23T is incident on the light receiving unit 14.
  • the circuit board 23 may be mounted on the mounting member 11.
  • the irradiation light Li is irradiated from the irradiation unit 13 toward the flexible wiring board 22 and the circuit board 23 (step S104).
  • the reflection of the irradiation light Li on the surface of the flexible wiring board 22 and the surface of the circuit board 23 will be described with reference to FIGS. 7A to 7C.
  • the irradiation light Li transmitted through the flexible wiring board 22 and the conductive adhesive 25 (FIG. 4) is reflected on the surface of the circuit board 23 (or the surface of the terminal 23T) (reflected light Lr).
  • the reflected light Lr further passes through the conductive adhesive 25 and the flexible wiring board 22 and is incident on the light receiving portion 14 (FIGS. 7A to 7C). Images of terminals 22T and 23T are formed by the reflected light Lr incident on the light receiving unit 14.
  • the specularly reflected light Lsr travels in a direction deviating from the light receiving unit 14 and travels in a direction deviating from the light receiving unit 14. No incident on 14.
  • the angle a formed by the optical axis 14A of the light receiving portion 14 and the irradiation light Li is 15 degrees or more and 75 degrees or less, the specular reflected light Lsr is generated even if the degree of bending of the flexible wiring board 22 changes. It is easy to go in the direction deviated from the light receiving unit 14.
  • the flexible wiring board 22 when the flexible wiring board 22 is substantially parallel to the XY plane (FIG. 7A), when the flexible wiring board 22 warps from the XY plane toward the circuit board 23 (FIG. 7B), and when the flexible wiring board 22 is circuited from the XY plane.
  • the specularly reflected light Lsr goes in a direction deviating from the light receiving portion 14. Details will be described later, but this reduces fluctuations in the amount of light incident on the light receiving portion 14 due to the degree of bending of the flexible wiring board 22.
  • the terminals 22T and 23T are imaged (step S105).
  • the image pickup apparatus 10 forms the images of the terminals 22T and 23T by the reflected light Lr incident on the light receiving unit 14. It is preferable to take an image of the terminals 22T and 23T in a state where the portion of the flexible wiring board 22 provided with the terminal 22T faces the portion of the circuit board 23 provided with the terminal 23T. This facilitates the alignment of the terminals 22T and 23T.
  • the terminals 22T and 23T are aligned using the image captured by the image pickup device 10 (step S106).
  • the detection unit 15 detects the deviation amount of the positions of the terminals 22T and 23T from the image captured by the image pickup device 10, and the control unit 16 acquires the information of the deviation amount.
  • the control unit 16 controls the movement of the mounting member 11 based on the information on the amount of deviation from the detection unit 15. As a result, the circuit board 23 is displaced, and the position of the terminal 23T is aligned with the position of the terminal 22T.
  • the terminals 22T and 23T are crimped and fixed (step S107).
  • This fixing is performed, for example, as follows. First, the terminal 22T is pressed against the terminal 23T using a temporary crimping member (not shown). Next, the terminal 22T is heat-bonded to the terminal 23T using a high-temperature heat-bonding head. As a result, the terminals 22T and 23T are fixed, and the circuit board 23 is connected to the TFT board 21 via the flexible wiring board 22.
  • the TFT panel manufactured by using the panel manufacturing apparatus 1 in this way is applied to, for example, a radiation image detector (FPD: Flat Panel Detector) or the like.
  • the panel manufacturing device 1 may be used for manufacturing a display device or the like, for example.
  • the irradiation unit 13 irradiates the circuit board 23 and the flexible wiring board 22 with irradiation light Li forming an angle a of 15 degrees or more and 75 degrees or less with respect to the optical axis 14A of the light receiving unit 14. It is configured to do. As a result, even if the degree of bending of the flexible wiring board 22 changes, the specularly reflected light Lsr on the surface of the flexible wiring board 22 is less likely to enter the light receiving portion 14, and the light receiving portion 14 due to the degree of bending of the flexible wiring board 22 Fluctuations in the amount of light incident on the light are reduced.
  • this action and effect will be described with reference to a comparative example.
  • FIG. 8 is a schematic cross-sectional view showing the configuration of the panel manufacturing apparatus 100 according to the comparative example, and corresponds to FIG. 1 showing the panel manufacturing apparatus 1.
  • the panel manufacturing apparatus 100 has an irradiation unit 113 that irradiates the flexible wiring board 22 and the circuit board 23 with the irradiation light Li.
  • the irradiation unit 113 is arranged so that the angle a formed by the irradiation light Li and the optical axis 14A of the light receiving unit 14 is 0 degrees or more and 10 degrees or less.
  • the panel manufacturing apparatus 100 differs from the panel manufacturing apparatus 1 in this respect.
  • FIG. 9A and 9B show an example of the path of the irradiation light Li irradiated from the irradiation unit 113 to the flexible wiring board 22 and the circuit board 23.
  • the amount of light incident on the light receiving portion 14 tends to fluctuate depending on the degree of bending of the flexible wiring board 22.
  • the flexible wiring board 22 is warped toward the circuit board 23 (FIG. 9A)
  • the specularly reflected light Lsr that is specularly reflected on the surface of the flexible wiring board 22 is incident on the light receiving portion 14.
  • the flexible wiring board 22 is warped on the opposite side to the circuit board 23 (FIG.
  • the specularly reflected light Lsr goes away from the light receiving unit 14 and does not enter the light receiving unit 14. If the locus of the specularly reflected light Lsr varies in this way, the amount of light incident on the light receiving unit 14 fluctuates, so that the captured image tends to become unstable. In an unstable image, for example, the detection unit 15 cannot detect the amount of deviation of the terminals 22T and 23T, which may make it difficult to accurately align the terminals 22T and 23T. In particular, when the panel manufacturing apparatus 100 automatically aligns the terminals 22T and 23T using an algorithm, the algorithm does not operate normally when the captured image becomes unstable, and the alignment of the terminals 22T and 23T is performed. It will be difficult.
  • the flexible wiring board 22 is irradiated with the irradiation light Li having an angle a of 15 degrees or more and 70 degrees or less.
  • the specularly reflected light Lsr tends to deviate from the light receiving portion 14, and it becomes difficult for the specularly reflected light Lsr to enter the light receiving portion 14. That is, since the variation in the trajectory of the specularly reflected light Lsr is suppressed, the variation in the amount of light incident on the light receiving unit 14 can be suppressed, and stable imaging can be performed. Therefore, in the panel manufacturing apparatus 1, the terminals 22T and 23T can be stably aligned. Further, since the algorithms of the detection unit 15 and the control unit 16 operate normally, it is possible to automatically align the terminals 22T and 23T.
  • Table 1 shows the results of aligning the terminals 22T and 23T using the panel manufacturing devices 1, 100.
  • Examples 1 to 3 represent the results of alignment using the panel manufacturing apparatus 1
  • Comparative Examples 1 and 2 represent the results of alignment using the panel manufacturing apparatus 100.
  • irradiation units 13 and 113 having bar illumination and a lens (lens 133 in FIGS. 3A and 3B) were used.
  • the wavelength of the irradiation light Li was 850 nm.
  • the positions of the terminals 22T and 23T were correctly determined at all of the 20 times of alignment of the terminals 22T and 23T. That is, all the alignments could be completed 20 times normally.
  • the angle a is 15 degrees or more and 60 degrees or less
  • the terminals 22T and 23T can be stably aligned.
  • the positions of the terminals 22T and 23T could not be correctly determined in some of the 20 times of the alignment of the terminals 22T and 23T. That is, it was found that when the angle a is 5 degrees or more and 15 degrees or less, it is difficult to stably align the terminals 22T and 23T.
  • the irradiation unit 13 flexibly transmits the irradiation light Li forming an angle a of 15 degrees or more and 75 degrees or less with respect to the optical axis 14A of the light receiving unit 14 with the circuit board 23. Irradiate the wiring board 22.
  • the specularly reflected light Lsr that is specularly reflected by the flexible wiring board 22 among the irradiation light Li is less likely to be incident on the light receiving portion 14. That is, the fluctuation in the amount of light incident on the light receiving portion 14 due to the degree of bending of the flexible wiring board 22 is reduced. Therefore, the influence of the bending of the flexible wiring board 22 can be suppressed, and the terminals 22T and 23T can be stably imaged. Therefore, it is possible to improve the alignment stability of the terminals 22T and 23T.
  • the irradiation unit 13 has the lens 133, the illuminance of the irradiation light Li can be improved and the depth of field can be deepened. As a result, it is possible to maintain a sufficient amount of light at the time of imaging and obtain clear images of terminals 22T and 23T.
  • these alignments can be performed by directly imaging the terminals 22T and 23T without forming alignment marks on the flexible wiring board 22 and the circuit board 23. Therefore, by using the panel manufacturing apparatus 1, the terminals 22T and 23T can be easily aligned without changing the design of the flexible wiring board 22 and the circuit board 23 on which the alignment mark is not formed. Further, since the overlap of the terminals 22T and 23T can be directly imaged, the alignment can be performed with high accuracy.
  • FIG. 10 is a schematic cross-sectional view showing the configuration of the panel manufacturing apparatus 1 according to the modified example.
  • the panel manufacturing apparatus 1 may have a position changing member 17 that is responsible for moving the irradiation unit 13.
  • the position changing member 17 is for changing the position of the irradiation unit 13, and is composed of, for example, a robot or the like.
  • the position changing member 17 changes the position of the irradiation unit 13 between, for example, a position closer to the flexible wiring board 22 and the circuit board 23 and a position further away from the flexible wiring board 22 and the circuit board 23.
  • the position changing member 17 moves the irradiation unit 13 to a position closer to the flexible wiring board 22 and the circuit board 23.
  • the irradiation unit 13 irradiates the flexible wiring board 22 and the circuit board 23 with the irradiation light Li, and photographs the terminals 22T and 23T.
  • the position changing member 17 moves the irradiation unit 13 to a position further away from the flexible wiring board 22 and the circuit board 23.
  • a temporary crimping member (not shown) is provided at a position close to the flexible wiring board 22 and the circuit board 23, and the terminals 22T and 23T are crimped.
  • the irradiation unit 13 can irradiate the flexible wiring board 22 and the circuit board 23 with the irradiation light Li at a closer position. .. As a result, the illuminance of the irradiation light Li can be increased even when the lens 133 is not provided on the irradiation unit 13.
  • the panel manufacturing apparatus 1 may include a position changing member 17 and a lens 133.
  • the panel manufacturing apparatus 1 according to the modified example of the above-described embodiment has the same effect as the effect described in the above-described embodiment.
  • the imaging method, the imaging apparatus, and the panel manufacturing apparatus of the present invention have been described.
  • the present invention can be appropriately added, modified, and omitted by those skilled in the art within the scope of the technical idea.
  • the terminal 22T of the flexible wiring board 22 is crimped to the terminal 23T of the circuit board 23 by using the panel manufacturing apparatus 1
  • the TFT substrate 21 is described by using the panel manufacturing apparatus 1.
  • the terminal of the flexible wiring board 22 may be crimped to the terminal.
  • the TFT substrate 21 corresponds to a specific example of the circuit board of the present invention.
  • the terminals 22T and 23T are imaged. It is also possible to align the terminals 22T and 23T.
  • the panel manufacturing apparatus 1 images the terminal 23T of the circuit board 23 and the terminal 22T of the flexible wiring board 22 and aligns them has been described.
  • the panel manufacturing apparatus 1 is a circuit. Alignment marks may be aligned by imaging the alignment marks formed on the substrate 23 and the flexible wiring board 22 respectively.
  • control unit 16 of the panel manufacturing apparatus 1 controls the mounting member 11
  • the imaging device 10 is provided with a control unit, and this control unit controls the mounting member 11. You may.
  • the irradiation unit 13 may have a light source 130 capable of generating irradiation light Li.
  • the process in the panel manufacturing apparatus 1 may include steps other than the steps in the above-mentioned flowchart, or may not include a part of the above-mentioned steps. Further, the order of the steps is not limited to the above-described embodiment. Further, each step may be executed as one step in combination with other steps, may be executed by being included in other steps, or may be executed by being divided into a plurality of steps.
  • control program of the panel manufacturing apparatus 1 may be provided by a computer-readable recording medium such as a USB memory, a flexible disk, or a CD-ROM, or may be provided online via a network such as the Internet. ..
  • the program recorded on the computer-readable recording medium is usually transferred and stored in a memory, storage, or the like.
  • this program may be provided as a single application software, or may be incorporated into the software of each device as a function of the panel manufacturing device 1.
  • 1 panel manufacturing equipment 10 Imaging device, 11 Mounting member, 12 Holding member, 13 Irradiated part, 130 light source, 131 Light source board, 132 LED, 133 lens, 21 TFT substrate, 22 Flexible wiring board, 23 circuit board, 22T, 23T terminal, Li irradiation light, Lr reflected light, Lrs specularly reflected light.

Abstract

[Problem] To provide an imaging method, an imaging device, and a panel manufacturing device with which it is possible to improve the alignment stability of terminals in a flexible wiring board and terminals in a circuit board. [Solution] An imaging device 10 images a circuit board 23 and a flexible wiring board 22. The imaging device 10 includes: a mounting member 11 to which the circuit board 23 is mounted; a holding member 12 which holds the flexible wiring board 22 in a position facing at least a portion of the circuit board 23 mounted to the mounting member 11; a light receiving part 14 which receives light reflected by the circuit board 23 and the flexible wiring board 22 that face each other; and an irradiating part 13 which irradiates the circuit board 23 and the flexible wiring board 22 with irradiation light Li at a prescribed angle relative to the optical axis 14A of the light receiving part 14, and is disposed such that, of the irradiation light Li, specularly reflected light Lsr that is specularly reflected by the flexible wiring board 22 is reflected in a direction away from the light receiving part 14.

Description

撮像方法、撮像装置およびパネル製造装置Imaging method, imaging device and panel manufacturing device
　本発明は、撮像方法、撮像装置およびパネル製造装置に関する。 The present invention relates to an imaging method, an imaging device, and a panel manufacturing device.
　放射線検出パネルおよび表示パネル等は、例えば、ＴＦＴ（Ｔｈｉｎ　Ｆｉｌｍ　Ｔｒａｎｓｉｓｔｏｒ）基板と、フレキシブル配線基板を介してＴＦＴ基板に電気的に接続された回路基板とを有している。フレキシブル配線基板の端子と回路基板の端子とを圧着することにより、フレキシブル配線基板を介して、ＴＦＴ基板および回路基板が電気的に接続される。 The radiation detection panel, display panel, and the like have, for example, a TFT (Thin Film Transistor) substrate and a circuit board electrically connected to the TFT substrate via a flexible wiring board. By crimping the terminals of the flexible wiring board and the terminals of the circuit board, the TFT board and the circuit board are electrically connected via the flexible wiring board.
　フレキシブル配線基板の端子と回路基板の端子とを圧着するときには、端子間での正確な位置合わせが必要となる。特許文献１では、フレキシブル配線基板の端子および回路基板の端子を撮影することにより、これらの位置合わせを行っている。 When crimping the terminals of the flexible wiring board and the terminals of the circuit board, accurate alignment between the terminals is required. In Patent Document 1, these are aligned by photographing the terminals of the flexible wiring board and the terminals of the circuit board.
特開２０１２－１８５２７０号公報Japanese Unexamined Patent Publication No. 2012-185270
　この圧着工程では、フレキシブル配線基板の撓みの影響を抑え、位置合わせの安定性を向上させることが望まれている。 In this crimping process, it is desired to suppress the influence of bending of the flexible wiring board and improve the stability of alignment.
　本発明は、上記問題に鑑みてなされたものである。したがって、本発明の目的は、フレキシブル配線基板と回路基板との位置合わせの安定性を向上させることが可能な撮像方法、撮像装置およびパネル製造装置を提供することである。 The present invention has been made in view of the above problems. Therefore, an object of the present invention is to provide an imaging method, an imaging device, and a panel manufacturing apparatus capable of improving the stability of alignment between a flexible wiring board and a circuit board.
　本発明の上記目的は、下記によって達成される。 The above object of the present invention is achieved by the following.
　（１）回路基板およびフレキシブル配線基板を撮像する撮像方法であって、前記回路基板を載置部材に載置することと、前記フレキシブル配線基板を保持部材で保持し、前記載置部材に載置した前記回路基板の少なくとも一部に対向する位置に前記フレキシブル配線基板を配置することと、前記フレキシブル配線基板に対向する前記回路基板で反射された光を受光可能な位置に受光部を配置することと、照射部から前記回路基板および前記フレキシブル配線基板に照射光を照射し、前記照射光のうち前記フレキシブル配線基板で正反射された光が前記受光部から逸れる方向に向かうこととを含む撮像方法。 (1) An imaging method for imaging a circuit board and a flexible wiring board, wherein the circuit board is mounted on a mounting member, and the flexible wiring board is held by a holding member and mounted on the mounting member described above. The flexible wiring board is arranged at a position facing at least a part of the circuit board, and the light receiving portion is arranged at a position capable of receiving the light reflected by the circuit board facing the flexible wiring board. An imaging method including irradiating the circuit board and the flexible wiring board with irradiation light from the irradiation unit, and directing the light directly reflected by the flexible wiring board out of the irradiation light in a direction deviating from the light receiving unit. ..
　（２）回路基板およびフレキシブル配線基板を撮像する撮像方法であって、前記回路基板を載置部材に載置することと、前記フレキシブル配線基板を保持部材で保持し、前記載置部材に載置した前記回路基板の少なくとも一部に対向する位置に前記フレキシブル配線基板を配置することと、前記フレキシブル配線基板に対向する前記回路基板で反射された光を受光可能な位置に受光部を配置することと、照射部から前記受光部の光軸に対して１５度以上７５度以下の角度をなす照射光を前記回路基板および前記フレキシブル配線基板に照射することとを含む撮像方法。 (2) An imaging method for imaging a circuit board and a flexible wiring board, wherein the circuit board is mounted on a mounting member, and the flexible wiring board is held by a holding member and mounted on the mounting member described above. The flexible wiring board is arranged at a position facing at least a part of the circuit board, and the light receiving portion is arranged at a position capable of receiving the light reflected by the circuit board facing the flexible wiring board. An imaging method comprising irradiating the circuit board and the flexible wiring board with irradiation light forming an angle of 15 degrees or more and 75 degrees or less from the irradiation unit with respect to the optical axis of the light receiving unit.
　（３）前記照射部は、前記受光部の光軸に対して３０度以上６０度以下の角度をなす前記照射光を照射する、上記（１）または（２）に記載の撮像方法。 (3) The imaging method according to (1) or (2) above, wherein the irradiation unit irradiates the irradiation light at an angle of 30 degrees or more and 60 degrees or less with respect to the optical axis of the light receiving unit.
　（４）前記照射部は、光源と、前記光源から出射された光を集光するレンズとを含む、上記（１）～（３）のいずれかに記載の撮像方法。 (4) The imaging method according to any one of (1) to (3) above, wherein the irradiation unit includes a light source and a lens that collects light emitted from the light source.
　（５）前記照射光は、赤外領域の波長の光を含む、上記（１）～（４）のいずれかに記載の撮像方法。 (5) The imaging method according to any one of (1) to (4) above, wherein the irradiation light includes light having a wavelength in the infrared region.
　（６）前記照射光は、８４０ｎｍ以上８６０ｎｍ以下の波長の光を含む、上記（５）に記載の撮像方法。 (6) The imaging method according to (5) above, wherein the irradiation light includes light having a wavelength of 840 nm or more and 860 nm or less.
　（７）前記回路基板の第１端子が設けられた部分に前記フレキシブル配線基板の第２端子が設けられた部分を対向させた状態で撮像する、上記（１）～（６）のいずれかに記載の撮像方法。 (7) Any of the above (1) to (6), in which the portion of the circuit board provided with the first terminal is opposed to the portion of the flexible wiring board provided with the second terminal. The imaging method described.
　（８）回路基板およびフレキシブル配線基板を撮像する撮像装置であって、前記回路基板が載置される載置部材と、前記載置部材に載置された前記回路基板の少なくとも一部に対向する位置に、前記フレキシブル配線基板を保持する保持部材と、前記フレキシブル配線基板に対向する前記回路基板で反射された光を受光する受光部と、照射光を前記回路基板および前記フレキシブル配線基板に照射するとともに、前記照射光のうち、前記フレキシブル配線基板で正反射された光が前記受光部から逸れる方向に向かうように配置された照射部とを備える撮像装置。 (8) An image pickup device that images a circuit board and a flexible wiring board, and faces at least a part of the mounting member on which the circuit board is mounted and the circuit board mounted on the above-mentioned mounting member. At the position, a holding member that holds the flexible wiring board, a light receiving portion that receives light reflected by the circuit board facing the flexible wiring board, and irradiation light are applied to the circuit board and the flexible wiring board. An imaging device including an irradiation unit arranged so that the light positively reflected by the flexible wiring board of the irradiation light is directed in a direction deviating from the light receiving unit.
　（９）回路基板およびフレキシブル配線基板を撮像する撮像装置であって、前記回路基板が載置される載置部材と、前記載置部材に載置された前記回路基板の少なくとも一部に対向する位置に、前記フレキシブル配線基板を保持する保持部材と、前記フレキシブル配線基板に対向する前記回路基板で反射された光を受光する受光部と、前記受光部の光軸に対して１５度以上７５度以下の角度をなす照射光を前記回路基板および前記フレキシブル配線基板に照射する照射部とを備える撮像装置。 (9) An image pickup device that images a circuit board and a flexible wiring board, and faces at least a part of the mounting member on which the circuit board is mounted and the circuit board mounted on the above-mentioned mounting member. At the position, a holding member that holds the flexible wiring board, a light receiving portion that receives light reflected by the circuit board facing the flexible wiring board, and a light receiving portion of 15 degrees or more and 75 degrees with respect to the optical axis of the light receiving portion. An imaging device including an irradiation unit that irradiates the circuit board and the flexible wiring board with irradiation light having the following angles.
　（１０）前記照射光は、前記受光部の光軸に対して３０度以上６０度以下の角度をなす、上記（８）または（９）に記載の撮像装置。 (10) The imaging device according to (8) or (9) above, wherein the irradiation light forms an angle of 30 degrees or more and 60 degrees or less with respect to the optical axis of the light receiving portion.
　（１１）前記照射部は、光源と、前記光源から出射された光を集光するレンズとを含む、上記（８）～（１０）のいずれかに記載の撮像装置。 (11) The imaging device according to any one of (8) to (10) above, wherein the irradiation unit includes a light source and a lens that collects light emitted from the light source.
　（１２）前記照射部の位置を変更させる位置変更部材を更に有する、上記（８）～（１１）のいずれかに記載の撮像装置。 (12) The imaging device according to any one of (8) to (11) above, further comprising a position changing member for changing the position of the irradiation unit.
　（１３）前記照射光は、赤外領域の波長の光を含む、上記（８）～（１２）のいずれかに記載の撮像装置。 (13) The imaging device according to any one of (8) to (12) above, wherein the irradiation light includes light having a wavelength in the infrared region.
　（１４）前記照射光は、８４０ｎｍ以上８６０ｎｍ以下の波長の光を含む、上記（１３）に記載の撮像装置。 (14) The imaging device according to (13) above, wherein the irradiation light includes light having a wavelength of 840 nm or more and 860 nm or less.
　（１５）前記照射部はＬＥＤを含む、上記（８）～（１４）のいずれかに記載の撮像装置。 (15) The imaging device according to any one of (8) to (14) above, wherein the irradiation unit includes an LED.
　（１６）前記照射部は、バー照明を含む、上記（８）～（１５）のいずれかに記載の撮像装置。 (16) The imaging device according to any one of (8) to (15) above, wherein the irradiation unit includes bar illumination.
　（１７）前記光軸は、前記載置部材の前記回路基板が載置される面に垂直である、上記（８）～（１６）のいずれかに記載の撮像装置。 (17) The imaging apparatus according to any one of (8) to (16) above, wherein the optical axis is perpendicular to the surface on which the circuit board of the above-mentioned mounting member is mounted.
　（１８）上記（８）～（１７）のいずれかに記載の撮像装置と、前記撮像装置により撮像された前記回路基板の第１端子および前記フレキシブル配線基板の第２端子の位置に基づいて、前記第１端子と前記第２端子とのずれ量を検出する検出部とを備えたパネル製造装置。 (18) Based on the positions of the image pickup apparatus according to any one of (8) to (17) above, and the positions of the first terminal of the circuit board and the second terminal of the flexible wiring board imaged by the image pickup apparatus. A panel manufacturing apparatus including a detection unit that detects the amount of deviation between the first terminal and the second terminal.
　（１９）前記ずれ量に応じて前記載置部材の移動を制御する制御部を更に有する、上記（１８）に記載のパネル製造装置。 (19) The panel manufacturing apparatus according to (18) above, further comprising a control unit that controls the movement of the above-mentioned placement member according to the amount of deviation.
　（２０）前記制御部は、前記第１端子および前記第２端子が互いに離間した状態で、前記載置部材を移動させる、上記（１９）に記載のパネル製造装置。 (20) The panel manufacturing apparatus according to (19) above, wherein the control unit moves the above-mentioned placing member in a state where the first terminal and the second terminal are separated from each other.
　本発明によれば、照射光のうち、フレキシブル配線基板で正反射された光は受光部から逸れる方向に向かい、あるいは、照射部は、受光部の光軸に対して１５度以上７５度以下の角度をなす照射光を回路基板およびフレキシブル配線基板に照射する。これにより、フレキシブル配線基板の撓み具合が変化しても、照射光のうち、フレキシブル配線基板で正反射された光が受光部に入射しにくくなるので、フレキシブル配線基板の撓み具合に起因する受光部への入射光量の変動が小さくなる。したがって、フレキシブル配線基板の撓みの影響を抑え、フレキシブル配線基板および回路基板を安定して撮像することができる。よって、フレキシブル配線基板と回路基板との位置合わせの安定性を向上させることが可能となる。 According to the present invention, of the irradiation light, the light that is specularly reflected by the flexible wiring board is directed in a direction deviating from the light receiving portion, or the irradiation portion is 15 degrees or more and 75 degrees or less with respect to the optical axis of the light receiving portion. The circuit board and the flexible wiring board are irradiated with the irradiation light forming an angle. As a result, even if the degree of bending of the flexible wiring board changes, it is difficult for the light that is specularly reflected by the flexible wiring board to enter the light receiving part among the irradiation light, so that the light receiving part due to the degree of bending of the flexible wiring board Fluctuations in the amount of light incident on the light are reduced. Therefore, the influence of the bending of the flexible wiring board can be suppressed, and the flexible wiring board and the circuit board can be stably imaged. Therefore, it is possible to improve the stability of the alignment between the flexible wiring board and the circuit board.
一実施形態に係るパネル製造装置の構成を例示するブロック図である。It is a block diagram which illustrates the structure of the panel manufacturing apparatus which concerns on one Embodiment. 図１に示した撮像装置の構成を例示する概略断面図である。It is schematic cross-sectional view which illustrates the structure of the image pickup apparatus shown in FIG. 図２に示した照射部の構成の一例を表す斜視図である。It is a perspective view which shows an example of the structure of the irradiation part shown in FIG. 図３Ａに示したＢ－Ｂ線に沿った断面構成を表す図である。It is a figure which shows the cross-sectional structure along the line BB shown in FIG. 3A. 図２に示したフレキシブル配線基板および回路基板の構成の一例を表す平面図である。It is a top view which shows an example of the structure of the flexible wiring board and a circuit board shown in FIG. （Ａ）は図４に示したフレキシブル配線基板の端子および回路基板の端子の位置合わせ前の構成を表す平面図であり、（Ｂ）は（Ａ）から位置合わせを行った後の構成を表す平面図である。(A) is a plan view showing the configuration before alignment of the terminal of the flexible wiring board and the terminal of the circuit board shown in FIG. 4, and (B) shows the configuration after alignment from (A). It is a plan view. 図１に示したパネル製造装置を用いたパネルの製造工程の一例を表すフローチャートである。It is a flowchart which shows an example of the manufacturing process of a panel using the panel manufacturing apparatus shown in FIG. 図６に示したステップＳ１０４の照射光の進路の一例を表す断面図である。It is sectional drawing which shows an example of the course of the irradiation light of step S104 shown in FIG. 図７Ａに示したフレキシブル配線基板が回路基板側に反ったときの照射光の進路の一例を表す断面図である。FIG. 5 is a cross-sectional view showing an example of the path of irradiation light when the flexible wiring board shown in FIG. 7A is warped toward the circuit board side. 図７Ａに示したフレキシブル配線基板が回路基板と反対側に反ったときの照射光の進路の一例を表す断面図である。It is sectional drawing which shows an example of the path of the irradiation light when the flexible wiring board shown in FIG. 7A is warped to the side opposite to the circuit board. 比較例に係るパネル製造装置の構成を例示する概略断面図である。It is schematic cross-sectional view which illustrates the structure of the panel manufacturing apparatus which concerns on a comparative example. 図８に示した照射部の照射光の進路の一例を表す断面図である。It is sectional drawing which shows an example of the course of the irradiation light of the irradiation part shown in FIG. 図９Ａに示したフレキシブル配線基板と撓み具合が異なるときの照射光の進路の一例を表す断面図である。It is sectional drawing which shows an example of the course of the irradiation light when the degree of bending is different from the flexible wiring board shown in FIG. 9A. 変形例に係るパネル製造装置の構成を例示する概略断面図である。It is schematic cross-sectional view which illustrates the structure of the panel manufacturing apparatus which concerns on the modification.
　以下、添付した図面を参照して本発明の撮像方法、撮像装置およびパネル製造装置の実施形態を説明する。なお、図中、同一の部材には同一の符号を用いた。また、図面の寸法比率は、説明の都合上誇張されており、実際の比率とは異なる場合がある。 Hereinafter, embodiments of the imaging method, imaging apparatus, and panel manufacturing apparatus of the present invention will be described with reference to the attached drawings. In the figure, the same reference numerals are used for the same members. In addition, the dimensional ratios in the drawings are exaggerated for convenience of explanation and may differ from the actual ratios.
　（実施形態）
　＜パネル製造装置の構成＞
　図１は、一実施形態に係るパネル製造装置１の構成を例示するブロック図である。このパネル製造装置１は、例えば、撮像装置１０を有しており、撮像装置１０は、例えば、載置部材１１、保持部材１２、照射部１３および受光部１４を含んでいる。パネル製造装置１には、この撮像装置１０とともに検出部１５および制御部１６が設けられている。これらの構成要素は、内部バスＢにより相互に通信可能に接続されている。 (Embodiment)
<Configuration of panel manufacturing equipment>
FIG. 1 is a block diagram illustrating the configuration of the panel manufacturing apparatus 1 according to the embodiment. The panel manufacturing device 1 includes, for example, an image pickup device 10, and the image pickup device 10 includes, for example, a mounting member 11, a holding member 12, an irradiation unit 13, and a light receiving unit 14. The panel manufacturing apparatus 1 is provided with a detection unit 15 and a control unit 16 together with the image pickup apparatus 10. These components are communicably connected to each other by the internal bus B.
　図２は、撮像装置１０の構成を模式的に表す断面図である。撮像装置１０は、例えば、フレキシブル配線基板２２の端子（後述の図４の端子２２Ｔ）および回路基板２３の端子（後述の図４の端子２３Ｔ）を撮像するために使用される。撮像装置１０では、照射部１３からフレキシブル配線基板２２および回路基板２３に向かう照射光Ｌｉが、フレキシブル配線基板２２および回路基板２３各々で反射され、受光部１４に入射することによりフレキシブル配線基板２２の端子および回路基板２３の端子が撮像される。受光部１４は、フレキシブル配線基板２２および回路基板２３にほぼ垂直な光軸１４Ａを有している。 FIG. 2 is a cross-sectional view schematically showing the configuration of the image pickup apparatus 10. The image pickup device 10 is used, for example, to image the terminals of the flexible wiring board 22 (terminal 22T of FIG. 4 described later) and the terminals of the circuit board 23 (terminal 23T of FIG. 4 described later). In the image pickup apparatus 10, the irradiation light Li directed from the irradiation unit 13 toward the flexible wiring board 22 and the circuit board 23 is reflected by each of the flexible wiring board 22 and the circuit board 23, and is incident on the light receiving unit 14, so that the flexible wiring board 22 The terminals and the terminals of the circuit board 23 are imaged. The light receiving unit 14 has an optical axis 14A substantially perpendicular to the flexible wiring board 22 and the circuit board 23.
　フレキシブル配線基板２２は所定の方向（図２のＹ方向）に延在しており、この延在方向の一方の端部は、ＴＦＴ基板２１に接続されている。このフレキシブル配線基板２２の一方の端部に設けられた端子は、導電性接着剤２４を介してＴＦＴ基板２１の入出力端子に接続されている。導電性接着剤２４は、例えば、ＡＣＦ（Ａｎｉｓｏｔｒｏｐｉｃ　Ｃｏｎｄｕｃｔｉｖｅ　Ｆｉｌｍ）である。フレキシブル配線基板２２の他方の端部に設けられた端子が、回路基板２３の端子に接続される。撮像装置１０は、回路基板２３にフレキシブル配線基板２２の他方の端部を重ねた状態で、例えば、フレキシブル配線基板２２側から撮影を行う。パネル製造装置１は、例えば、この撮像装置１０により撮像されたフレキシブル配線基板２２および回路基板２３各々の端子の位置に基づいて位置合わせを行った後、端子間の圧着を行う。以下では、受光部１４の光軸１４Ａの方向をＺ方向、フレキシブル配線基板２２の延在方向をＹ方向、これらＺ方向およびＹ方向に垂直な方向をＸ方向として説明する。 The flexible wiring board 22 extends in a predetermined direction (Y direction in FIG. 2), and one end of the extending direction is connected to the TFT board 21. The terminals provided at one end of the flexible wiring board 22 are connected to the input / output terminals of the TFT board 21 via the conductive adhesive 24. The conductive adhesive 24 is, for example, ACF (Anisotropic Connective Film). The terminal provided at the other end of the flexible wiring board 22 is connected to the terminal of the circuit board 23. The image pickup apparatus 10 takes a picture from, for example, the flexible wiring board 22 side in a state where the other end of the flexible wiring board 22 is overlapped with the circuit board 23. The panel manufacturing apparatus 1 performs alignment based on the positions of the terminals of the flexible wiring board 22 and the circuit board 23 imaged by the imaging apparatus 10, and then crimps between the terminals. Hereinafter, the direction of the optical axis 14A of the light receiving unit 14 will be described as the Z direction, the extending direction of the flexible wiring substrate 22 will be described as the Y direction, and the Z direction and the direction perpendicular to the Y direction will be described as the X direction.
　載置部材１１には、例えば、回路基板２３が載置されている。載置部材１１の載置面は、例えば、ＸＹ平面である。載置部材１１は、例えば可動ステージであり、載置部材１１の移動は、制御部１６により制御される。載置部材１１が、例えば、Ｘ方向に移動して回路基板２３の位置が変更される。 For example, the circuit board 23 is mounted on the mounting member 11. The mounting surface of the mounting member 11 is, for example, an XY plane. The mounting member 11 is, for example, a movable stage, and the movement of the mounting member 11 is controlled by the control unit 16. The mounting member 11 moves, for example, in the X direction to change the position of the circuit board 23.
　保持部材１２には、例えば、フレキシブル配線基板２２が保持されている。保持部材１２は、例えば、吸引によりフレキシブル配線基板２２を保持している。フレキシブル配線基板２２の基板面は、例えば、ＸＹ平面であり、保持部材１２は、Ｚ方向の吸引によりフレキシブル配線基板２２を保持している。保持部材１２は、例えば、フレキシブル配線基板２２の延在方向の中央部を保持している。フレキシブル配線基板２２の撓みが小さくなるように、保持部材１２がフレキシブル配線基板２２を保持することが好ましい。保持部材１２は、フレキシブル配線基板２２と回路基板２３との間のＺ方向の間隙を維持するように、フレキシブル配線基板２２を保持する。これにより、フレキシブル配線基板２２の端子と回路基板２３の端子との位置合わせ前の接着を防ぐことができる。 For example, the flexible wiring board 22 is held by the holding member 12. The holding member 12 holds the flexible wiring board 22 by suction, for example. The substrate surface of the flexible wiring board 22 is, for example, an XY plane, and the holding member 12 holds the flexible wiring board 22 by suction in the Z direction. The holding member 12 holds, for example, the central portion of the flexible wiring board 22 in the extending direction. It is preferable that the holding member 12 holds the flexible wiring board 22 so that the flexible wiring board 22 is less bent. The holding member 12 holds the flexible wiring board 22 so as to maintain a gap in the Z direction between the flexible wiring board 22 and the circuit board 23. This makes it possible to prevent adhesion between the terminals of the flexible wiring board 22 and the terminals of the circuit board 23 before alignment.
　照射部１３は、フレキシブル配線基板２２および回路基板２３に向かう照射光Ｌｉを生成する。例えば、フレキシブル配線基板２２の他方の端部側から照射光Ｌｉがフレキシブル配線基板２２および回路基板２３に向かうように、照射部１３が配置されている。本実施形態の撮像装置１０では、照射光Ｌｉと受光部１４の光軸１４Ａとのなす角度（角度ａ）が１５度以上７５度以下、好ましくは３０度以上６０度以下に調整されている。換言すれば、照射部１３は、照射光Ｌｉと受光部１４の光軸１４Ａとのなす角度ａが１５度以上７５度以下、好ましくは３０度以上６０度以下となるように配置されている。詳細は後述するが、これにより、フレキシブル配線基板２２の撓み具合が変化しても、フレキシブル配線基板２２で正反射された光（後述の図７Ａ～図７Ｃの正反射光Ｌｓｒ）が、受光部１４から逸れる方向に向かいやすくなる。 The irradiation unit 13 generates irradiation light Li toward the flexible wiring board 22 and the circuit board 23. For example, the irradiation unit 13 is arranged so that the irradiation light Li faces the flexible wiring board 22 and the circuit board 23 from the other end side of the flexible wiring board 22. In the image pickup apparatus 10 of the present embodiment, the angle (angle a) formed by the irradiation light Li and the optical axis 14A of the light receiving unit 14 is adjusted to 15 degrees or more and 75 degrees or less, preferably 30 degrees or more and 60 degrees or less. In other words, the irradiation unit 13 is arranged so that the angle a formed by the irradiation light Li and the optical axis 14A of the light receiving unit 14 is 15 degrees or more and 75 degrees or less, preferably 30 degrees or more and 60 degrees or less. Details will be described later, but as a result, even if the degree of bending of the flexible wiring board 22 changes, the light reflected by the flexible wiring board 22 (the specularly reflected light Lsr of FIGS. 7A to 7C described later) can be received by the light receiving portion. It becomes easier to go in the direction deviating from 14.
　図３Ａおよび図３Ｂは、照射部１３の構成の一例を表している。図３Ａは、照射部１３の構成を模式的に表す分解斜視図であり、図３Ｂは、図３Ａに示したＢ－Ｂ’線に沿った断面構成を表している。照射部１３は、例えば、光源１３０、レンズ１３３および筐体１３４を含んでいる。図３Ａでは、筐体１３４の図示を省略している。 3A and 3B show an example of the configuration of the irradiation unit 13. FIG. 3A is an exploded perspective view schematically showing the configuration of the irradiation unit 13, and FIG. 3B shows a cross-sectional configuration along the line BB'shown in FIG. 3A. The irradiation unit 13 includes, for example, a light source 130, a lens 133, and a housing 134. In FIG. 3A, the housing 134 is not shown.
　光源１３０は、例えば、バー照明により構成されており、光源基板１３１と、光源基板１３１に支持された複数のＬＥＤ（Light Emitting Diode）１３２とを有している。光源基板１３１は、例えば、矩形の平面形状を有しており、この矩形の長辺方向に沿って複数のＬＥＤ１３２が配置されている。ＬＥＤ１３２は、例えば、赤外領域の波長の光を出射する。即ち、照射光Ｌｉは赤外領域の波長の光である。照射光Ｌｉに赤外領域の波長の光を用いることで、可視領域の波長の光を用いる場合に比べてフレキシブル配線基板２２に含まれるポリイミド等の光透過率が高まり、より鮮明な画像を撮像することができる。特に、照射光Ｌｉの波長は８４０ｎｍ以上８６０ｎｍ以下であることが好ましい。照射光Ｌｉの波長は、９４０ｎｍ以上９５０ｎｍ以下であってもよいが、照射光Ｌｉの波長を８４０ｎｍ以上８６０ｎｍ以下にすることにより、受光部１４の感度が高くなりやすく、より鮮明な画像を撮像することができる。照射光Ｌｉは、例えば、赤色領域の光等、可視領域の波長の光であってもよい。光源１３０は、バー照明以外の構成を有していてもよく、例えば、スポットタイプであってもよい。 The light source 130 is composed of, for example, bar illumination, and has a light source substrate 131 and a plurality of LEDs (Light Emitting Diodes) 132 supported by the light source substrate 131. The light source substrate 131 has, for example, a rectangular planar shape, and a plurality of LEDs 132 are arranged along the long side direction of the rectangle. The LED 132 emits light having a wavelength in the infrared region, for example. That is, the irradiation light Li is light having a wavelength in the infrared region. By using light having a wavelength in the infrared region for the irradiation light Li, the light transmittance of polyimide or the like contained in the flexible wiring substrate 22 is increased as compared with the case where light having a wavelength in the visible region is used, and a clearer image is captured. can do. In particular, the wavelength of the irradiation light Li is preferably 840 nm or more and 860 nm or less. The wavelength of the irradiation light Li may be 940 nm or more and 950 nm or less, but by setting the wavelength of the irradiation light Li to 840 nm or more and 860 nm or less, the sensitivity of the light receiving unit 14 tends to be increased, and a clearer image is captured. be able to. The irradiation light Li may be light having a wavelength in the visible region, such as light in the red region. The light source 130 may have a configuration other than bar illumination, and may be, for example, a spot type.
　レンズ１３３は、光源１３０とフレキシブル配線基板２２との間に配置されている。光源１３０から出射された光がレンズ１３３を透過することにより、照射光Ｌｉが生成される。レンズ１３３は集光レンズであり、例えば円柱形状を有している。レンズ１３３を設けることにより、光源１３０から出射された光の拡散が抑えられ、照射光Ｌｉの照度を向上させることができる。これにより、照射部１３とフレキシブル配線基板２２との間の距離が長いときにも鮮明な画像を形成することができる。また、十分な照度が確保されると、受光部１４に組付けられたレンズの絞りを絞り込むことが可能となる。即ち、Ｆ値を上げることが可能となる。これにより、被写界深度を深くすることができる。撮像装置１０の被写界深度を深くすると、フレキシブル配線基板２２と回路基板２３との間に間隙が設けられているときにも、フレキシブル配線基板２２および回路基板２３の両方に容易にピントを合わせることができる。即ち、フレキシブル配線基板２２の端子と回路基板２３の端子との接着を防ぎつつ、これらの位置合わせを行うことができる。レンズ１３３は、光源１３０（ＬＥＤ１３２）に近接して配置されている。 The lens 133 is arranged between the light source 130 and the flexible wiring board 22. Irradiation light Li is generated by the light emitted from the light source 130 passing through the lens 133. The lens 133 is a condenser lens and has, for example, a cylindrical shape. By providing the lens 133, the diffusion of the light emitted from the light source 130 can be suppressed, and the illuminance of the irradiation light Li can be improved. As a result, a clear image can be formed even when the distance between the irradiation unit 13 and the flexible wiring board 22 is long. Further, when sufficient illuminance is secured, the aperture of the lens assembled to the light receiving unit 14 can be narrowed down. That is, it is possible to increase the F value. As a result, the depth of field can be increased. When the depth of field of the image pickup apparatus 10 is increased, even when a gap is provided between the flexible wiring board 22 and the circuit board 23, both the flexible wiring board 22 and the circuit board 23 can be easily focused. be able to. That is, it is possible to align these while preventing the terminals of the flexible wiring board 22 and the terminals of the circuit board 23 from adhering to each other. The lens 133 is arranged close to the light source 130 (LED 132).
　筐体１３４は、光源１３０およびレンズ１３３を収容している。筐体１３４には開口が設けられており、この開口を介して照射光Ｌｉが取り出される。 The housing 134 houses the light source 130 and the lens 133. The housing 134 is provided with an opening, and the irradiation light Li is taken out through the opening.
　受光部１４は、カメラにより構成されている。受光部１４は、例えば、Ｚ方向においてフレキシブル配線基板２２（詳細には、フレキシブル配線基板２２の他方の端部）および回路基板２３を間にして、載置部材１１に対向している。受光部１４の光軸１４Ａは、載置部材１１の載置面にほぼ垂直に設けられている。撮像装置１０では、受光部１４に入射した光によりフレキシブル配線基板２２および回路基板２３が撮像される。 The light receiving unit 14 is composed of a camera. The light receiving unit 14 faces the mounting member 11 in the Z direction, with the flexible wiring board 22 (specifically, the other end of the flexible wiring board 22 in detail) and the circuit board 23 in between. The optical axis 14A of the light receiving unit 14 is provided substantially perpendicular to the mounting surface of the mounting member 11. In the image pickup apparatus 10, the flexible wiring board 22 and the circuit board 23 are imaged by the light incident on the light receiving unit 14.
　図４は、フレキシブル配線基板２２および回路基板２３の構成の一例を表している。フレキシブル配線基板２２の端子２２Ｔは、フレキシブル配線基板２２の一方の面に設けられている。例えば、フレキシブル配線基板２２の他方の端部には、Ｘ方向に所定のピッチで並ぶ複数の端子２２Ｔが設けられている。フレキシブル配線基板２２は、例えば、ＣＯＦ（Chip on Film）である。ＣＯＦは、絶縁フィルムおよび銅箔が積層された配線基板と、この配線基板に搭載されたＩＣ（Integrated Circuit）等のチップとを含んでいる。絶縁フィルムには、例えば、耐熱性の観点からポリイミドフィルムが用いられている。フレキシブル配線基板２２は、ＦＰＣ（Flexible Printed Circuit）、ＴＡＢ（Tape Automated Bonding）およびＴＣＰ（Tape Carrier Package）等であってもよい。フレキシブル配線基板２２は可撓性を有している。 FIG. 4 shows an example of the configuration of the flexible wiring board 22 and the circuit board 23. The terminal 22T of the flexible wiring board 22 is provided on one surface of the flexible wiring board 22. For example, at the other end of the flexible wiring board 22, a plurality of terminals 22T arranged at a predetermined pitch in the X direction are provided. The flexible wiring board 22 is, for example, a COF (Chip on Film). The COF includes a wiring board on which an insulating film and a copper foil are laminated, and a chip such as an IC (Integrated Circuit) mounted on the wiring board. As the insulating film, for example, a polyimide film is used from the viewpoint of heat resistance. The flexible wiring board 22 may be an FPC (Flexible Printed Circuit), a TAB (Tape Automated Bonding), a TCP (Tape Carrier Package), or the like. The flexible wiring board 22 has flexibility.
　回路基板２３の端子２３Ｔは、回路基板２３の一方の面に設けられている。例えば、回路基板２３には、端子２２Ｔと同じピッチでＸ方向に並ぶ複数の端子２３Ｔが設けられている。回路基板２３は、例えば、ＰＣＢ（Printed Circuit Board）である。回路基板２３の一方の面上には、この複数の端子２３Ｔを覆うように導電性接着剤２５が設けられている。導電性接着剤２５は、例えば、ＡＣＦである。パネル製造装置１では、導電性接着剤２５を間にして、回路基板２３の一方の面とフレキシブル配線基板２２の一方の面とが対向するように、フレキシブル配線基板２２および回路基板２３が配置される。ここでは、回路基板２３の端子２３Ｔが本発明の第１端子の一具体例に対応し、フレキシブル配線基板２２の端子２２Ｔが本発明の第２端子の一具体例に対応する。 The terminal 23T of the circuit board 23 is provided on one surface of the circuit board 23. For example, the circuit board 23 is provided with a plurality of terminals 23T arranged in the X direction at the same pitch as the terminals 22T. The circuit board 23 is, for example, a PCB (Printed Circuit Board). A conductive adhesive 25 is provided on one surface of the circuit board 23 so as to cover the plurality of terminals 23T. The conductive adhesive 25 is, for example, ACF. In the panel manufacturing apparatus 1, the flexible wiring board 22 and the circuit board 23 are arranged so that one surface of the circuit board 23 and one surface of the flexible wiring board 22 face each other with the conductive adhesive 25 in between. NS. Here, the terminal 23T of the circuit board 23 corresponds to a specific example of the first terminal of the present invention, and the terminal 22T of the flexible wiring board 22 corresponds to a specific example of the second terminal of the present invention.
　検出部１５は、フレキシブル配線基板２２の端子２２Ｔと回路基板２３の端子２３Ｔとの位置ずれ量を検出する。検出部１５は、例えば、撮像装置１０で撮像された端子２２Ｔ，２３Ｔの画像情報を取得し、この画像情報に基づいて、端子２２Ｔと端子２３Ｔとの間のＸ方向の位置ずれ量を検出する。 The detection unit 15 detects the amount of misalignment between the terminal 22T of the flexible wiring board 22 and the terminal 23T of the circuit board 23. For example, the detection unit 15 acquires the image information of the terminals 22T and 23T imaged by the image pickup apparatus 10, and detects the amount of displacement in the X direction between the terminal 22T and the terminal 23T based on the image information. ..
　制御部１６は、フレキシブル配線基板２２の端子２２Ｔと回路基板２３の端子２３Ｔとの位置合わせを行う。制御部１６は、例えば、検出部１５で検出された位置ずれ量の情報を取得し、この情報に応じて載置部材１１を駆動する。 The control unit 16 aligns the terminal 22T of the flexible wiring board 22 with the terminal 23T of the circuit board 23. The control unit 16 acquires, for example, information on the amount of misalignment detected by the detection unit 15, and drives the mounting member 11 according to this information.
　図５（Ａ）は、位置合わせ前の端子２２Ｔおよび端子２３Ｔの配置の一例を表しており、図５（Ｂ）は、図５（Ａ）に示した状態から位置合わせを行った後の端子２２Ｔおよび端子２３Ｔの配置の一例を表している。制御部１６は、例えば、検出部１５からの情報に応じて、Ｘ方向に所定の距離だけ載置部材１１を移動させる。これにより、Ｘ方向において、フレキシブル配線基板２２の端子２２Ｔの位置が、回路基板２３の端子２３Ｔの位置に揃い、端子２２Ｔおよび端子２３Ｔの位置合わせが完了する。制御部１６は載置部材１１をＸ方向およびＹ方向に移動させてもよい。制御部１６は、端子２２Ｔ，２３Ｔの位置合わせ後に、これらの圧着工程を制御してもよい。 FIG. 5 (A) shows an example of the arrangement of the terminals 22T and the terminals 23T before the alignment, and FIG. 5 (B) shows the terminals after the alignment is performed from the state shown in FIG. 5 (A). An example of the arrangement of the 22T and the terminal 23T is shown. The control unit 16 moves the mounting member 11 by a predetermined distance in the X direction according to the information from the detection unit 15, for example. As a result, the positions of the terminals 22T of the flexible wiring board 22 are aligned with the positions of the terminals 23T of the circuit board 23 in the X direction, and the alignment of the terminals 22T and the terminals 23T is completed. The control unit 16 may move the mounting member 11 in the X direction and the Y direction. The control unit 16 may control these crimping steps after the terminals 22T and 23T are aligned.
　＜パネルの製造方法＞
　以下、図６を参照して、パネル製造装置１を用いたパネルの製造方法を説明する。図６は、パネル製造装置１を用いた端子２２Ｔ，２３Ｔの位置合わせ工程およびこれらの圧着工程を例示するフローチャートである。パネル製造装置１は、撮像装置１０の撮像方法を用いて、端子２２Ｔ，２３Ｔの位置合わせ工程を行う。例えば、図６のフローチャートに示す処理は、パネル製造装置１にプログラムとして記憶されており、制御部１６により実行される。 <Panel manufacturing method>
Hereinafter, a method of manufacturing a panel using the panel manufacturing apparatus 1 will be described with reference to FIG. FIG. 6 is a flowchart illustrating an alignment process of terminals 22T and 23T using the panel manufacturing apparatus 1 and a crimping process thereof. The panel manufacturing apparatus 1 performs the positioning step of the terminals 22T and 23T by using the imaging method of the imaging apparatus 10. For example, the process shown in the flowchart of FIG. 6 is stored as a program in the panel manufacturing apparatus 1 and executed by the control unit 16.
　まず、載置部材１１、照射部１３および受光部１４を設置しておく（ステップＳ１０１）。このとき、受光部１４の光軸１４Ａが載置部材１１の載置面に垂直となるように、受光部１４を配置し、光軸１４Ａと照射光Ｌｉとのなす角度ａが１５度以上７５度以下、好ましくは３０度以上６０度以下となるように、照射部１３の位置を調整しておく。 First, the mounting member 11, the irradiation unit 13, and the light receiving unit 14 are installed (step S101). At this time, the light receiving portion 14 is arranged so that the optical axis 14A of the light receiving portion 14 is perpendicular to the mounting surface of the mounting member 11, and the angle a formed by the optical axis 14A and the irradiation light Li is 15 degrees or more 75. The position of the irradiation unit 13 is adjusted so that the temperature is less than or equal to, preferably 30 degrees or more and 60 degrees or less.
　次に、回路基板２３を載置部材１１に載置する（ステップＳ１０２）。回路基板２３の端子２３Ｔ上には、導電性接着剤２５を設けておく。続いて、フレキシブル配線基板２２を保持部材１２に保持させる（ステップＳ１０３）。このとき、フレキシブル配線基板２２の一方の面（端子２２Ｔが設けられた面）を回路基板２３に対向させるとともに、回路基板２３との間にＺ方向の間隙を設けておく。フレキシブル配線基板２２と回路基板２３との間にＺ方向の間隙を設けておくことにより、位置合わせ工程の途中でのフレキシブル配線基板２２と回路基板２３との接着を抑えることができる。フレキシブル配線基板２２の少なくとも一部が回路基板２３に対向していればよく、例えば、フレキシブル配線基板２２の端子２２Ｔが設けられた部分を回路基板２３の端子２３Ｔが設けられた部分に対向させる。端子２２Ｔ，２３Ｔで反射された光が受光部１４に入射するように、回路基板２３およびフレキシブル配線基板２２の位置を調整しておく。フレキシブル配線基板２２を保持部材１２で保持した後、回路基板２３を載置部材１１に載置してもよい。 Next, the circuit board 23 is mounted on the mounting member 11 (step S102). A conductive adhesive 25 is provided on the terminal 23T of the circuit board 23. Subsequently, the flexible wiring board 22 is held by the holding member 12 (step S103). At this time, one surface of the flexible wiring board 22 (the surface provided with the terminal 22T) is made to face the circuit board 23, and a gap in the Z direction is provided between the flexible wiring board 22 and the circuit board 23. By providing a gap in the Z direction between the flexible wiring board 22 and the circuit board 23, it is possible to suppress adhesion between the flexible wiring board 22 and the circuit board 23 during the alignment process. At least a part of the flexible wiring board 22 may face the circuit board 23. For example, the portion of the flexible wiring board 22 provided with the terminal 22T is opposed to the portion of the circuit board 23 provided with the terminal 23T. The positions of the circuit board 23 and the flexible wiring board 22 are adjusted so that the light reflected by the terminals 22T and 23T is incident on the light receiving unit 14. After holding the flexible wiring board 22 by the holding member 12, the circuit board 23 may be mounted on the mounting member 11.
　フレキシブル配線基板２２の少なくとも一部を回路基板２３に対向させて配置した後、照射部１３からフレキシブル配線基板２２および回路基板２３に向けて照射光Ｌｉを照射する（ステップＳ１０４）。 After arranging at least a part of the flexible wiring board 22 so as to face the circuit board 23, the irradiation light Li is irradiated from the irradiation unit 13 toward the flexible wiring board 22 and the circuit board 23 (step S104).
　図７Ａ～図７Ｃを用いて、フレキシブル配線基板２２表面および回路基板２３表面での照射光Ｌｉの反射について説明する。フレキシブル配線基板２２および導電性接着剤２５（図４）を透過した照射光Ｌｉは、回路基板２３表面（あるいは端子２３Ｔ表面）で反射される（反射光Ｌｒ）。この反射光Ｌｒは、更に、導電性接着剤２５およびフレキシブル配線基板２２を透過して受光部１４に入射する（図７Ａ～図７Ｃ）。この受光部１４に入射した反射光Ｌｒにより、端子２２Ｔ，２３Ｔの画像が形成される。 The reflection of the irradiation light Li on the surface of the flexible wiring board 22 and the surface of the circuit board 23 will be described with reference to FIGS. 7A to 7C. The irradiation light Li transmitted through the flexible wiring board 22 and the conductive adhesive 25 (FIG. 4) is reflected on the surface of the circuit board 23 (or the surface of the terminal 23T) (reflected light Lr). The reflected light Lr further passes through the conductive adhesive 25 and the flexible wiring board 22 and is incident on the light receiving portion 14 (FIGS. 7A to 7C). Images of terminals 22T and 23T are formed by the reflected light Lr incident on the light receiving unit 14.
　一方、フレキシブル配線基板２２に向かう照射光Ｌｉが、フレキシブル配線基板２２表面で正反射されると（正反射光Ｌｓｒ）、この正反射光Ｌｓｒは、受光部１４から逸れた方向に進み、受光部１４に入射しない。本実施形態では、受光部１４の光軸１４Ａと照射光Ｌｉとのなす角度ａが１５度以上７５度以下であるので、フレキシブル配線基板２２の撓み具合が変化しても、正反射光Ｌｓｒは受光部１４から逸れた方向に向かいやすい。例えば、フレキシブル配線基板２２がＸＹ平面にほぼ平行であるとき（図７Ａ）、フレキシブル配線基板２２がＸＹ平面から回路基板２３側に反ったとき（図７Ｂ）およびフレキシブル配線基板２２がＸＹ平面から回路基板２３と反対側に反ったとき（図７Ｃ）のいずれの場合にも、正反射光Ｌｓｒは受光部１４から逸れた方向に向かう。詳細は後述するが、これにより、フレキシブル配線基板２２の撓み具合に起因する受光部１４への入射光量の変動が小さくなる。 On the other hand, when the irradiation light Li directed to the flexible wiring board 22 is specularly reflected on the surface of the flexible wiring board 22 (specularly reflected light Lsr), the specularly reflected light Lsr travels in a direction deviating from the light receiving unit 14 and travels in a direction deviating from the light receiving unit 14. No incident on 14. In the present embodiment, since the angle a formed by the optical axis 14A of the light receiving portion 14 and the irradiation light Li is 15 degrees or more and 75 degrees or less, the specular reflected light Lsr is generated even if the degree of bending of the flexible wiring board 22 changes. It is easy to go in the direction deviated from the light receiving unit 14. For example, when the flexible wiring board 22 is substantially parallel to the XY plane (FIG. 7A), when the flexible wiring board 22 warps from the XY plane toward the circuit board 23 (FIG. 7B), and when the flexible wiring board 22 is circuited from the XY plane. In any case of warping to the opposite side of the substrate 23 (FIG. 7C), the specularly reflected light Lsr goes in a direction deviating from the light receiving portion 14. Details will be described later, but this reduces fluctuations in the amount of light incident on the light receiving portion 14 due to the degree of bending of the flexible wiring board 22.
　このように照射光Ｌｉをフレキシブル配線基板２２および回路基板２３に照射した後、端子２２Ｔ，２３Ｔの撮像を行う（ステップＳ１０５）。換言すれば、撮像装置１０は、受光部１４に入射した反射光Ｌｒにより端子２２Ｔ，２３Ｔの画像を形成する。フレキシブル配線基板２２の端子２２Ｔが設けられた部分を回路基板２３の端子２３Ｔが設けられた部分に対向させた状態で端子２２Ｔ，２３Ｔを撮像することが好ましい。これにより、端子２２Ｔ，２３Ｔの位置合わせが容易となる。次に、この撮像装置１０により撮像された画像を用いて端子２２Ｔ，２３Ｔの位置合わせを行う（ステップＳ１０６）。このとき、例えば、検出部１５が撮像装置１０で撮像された画像から、端子２２Ｔ，２３Ｔの位置のずれ量を検出し、このずれ量の情報を制御部１６が取得する。制御部１６は、この検出部１５からのずれ量の情報に基づいて載置部材１１の移動を制御する。これにより、回路基板２３が変位し、端子２２Ｔの位置に端子２３Ｔの位置が揃えられる。 After irradiating the flexible wiring board 22 and the circuit board 23 with the irradiation light Li in this way, the terminals 22T and 23T are imaged (step S105). In other words, the image pickup apparatus 10 forms the images of the terminals 22T and 23T by the reflected light Lr incident on the light receiving unit 14. It is preferable to take an image of the terminals 22T and 23T in a state where the portion of the flexible wiring board 22 provided with the terminal 22T faces the portion of the circuit board 23 provided with the terminal 23T. This facilitates the alignment of the terminals 22T and 23T. Next, the terminals 22T and 23T are aligned using the image captured by the image pickup device 10 (step S106). At this time, for example, the detection unit 15 detects the deviation amount of the positions of the terminals 22T and 23T from the image captured by the image pickup device 10, and the control unit 16 acquires the information of the deviation amount. The control unit 16 controls the movement of the mounting member 11 based on the information on the amount of deviation from the detection unit 15. As a result, the circuit board 23 is displaced, and the position of the terminal 23T is aligned with the position of the terminal 22T.
　端子２２Ｔ，２３Ｔの位置合わせを行った後、端子２２Ｔ，２３Ｔを圧着させて固定する（ステップＳ１０７）。この固定は、例えば、以下のように行う。まず、仮圧着部材（不図示）を用いて、端子２２Ｔを端子２３Ｔに押し付ける。次に、高温の熱圧着ヘッドを用いて、端子２２Ｔを端子２３Ｔに熱圧着させる。これにより、端子２２Ｔ，２３Ｔが固定され、フレキシブル配線基板２２を介してＴＦＴ基板２１に回路基板２３が接続される。 After aligning the terminals 22T and 23T, the terminals 22T and 23T are crimped and fixed (step S107). This fixing is performed, for example, as follows. First, the terminal 22T is pressed against the terminal 23T using a temporary crimping member (not shown). Next, the terminal 22T is heat-bonded to the terminal 23T using a high-temperature heat-bonding head. As a result, the terminals 22T and 23T are fixed, and the circuit board 23 is connected to the TFT board 21 via the flexible wiring board 22.
　このようにパネル製造装置１を用いて製造されたＴＦＴパネルは、例えば、放射線画像検出器（ＦＰＤ：Ｆｌａｔ　Ｐａｎｅｌ　Ｄｅｔｅｃｔｏｒ）等に適用される。パネル製造装置１は、例えば、表示装置等の製造に使用されてもよい。 The TFT panel manufactured by using the panel manufacturing apparatus 1 in this way is applied to, for example, a radiation image detector (FPD: Flat Panel Detector) or the like. The panel manufacturing device 1 may be used for manufacturing a display device or the like, for example.
　＜パネル製造装置の作用効果＞
　本実施形態のパネル製造装置１では、照射部１３が、受光部１４の光軸１４Ａに対して１５度以上７５度以下の角度ａをなす照射光Ｌｉを回路基板２３およびフレキシブル配線基板２２に照射するように構成されている。これにより、フレキシブル配線基板２２の撓み具合が変化しても、フレキシブル配線基板２２表面での正反射光Ｌｓｒが受光部１４に入射しにくくなり、フレキシブル配線基板２２の撓み具合に起因する受光部１４への入射光量の変動が小さくなる。以下、比較例を用いて、この作用効果について説明する。 <Effects of panel manufacturing equipment>
In the panel manufacturing apparatus 1 of the present embodiment, the irradiation unit 13 irradiates the circuit board 23 and the flexible wiring board 22 with irradiation light Li forming an angle a of 15 degrees or more and 75 degrees or less with respect to the optical axis 14A of the light receiving unit 14. It is configured to do. As a result, even if the degree of bending of the flexible wiring board 22 changes, the specularly reflected light Lsr on the surface of the flexible wiring board 22 is less likely to enter the light receiving portion 14, and the light receiving portion 14 due to the degree of bending of the flexible wiring board 22 Fluctuations in the amount of light incident on the light are reduced. Hereinafter, this action and effect will be described with reference to a comparative example.
　図８は、比較例に係るパネル製造装置１００の構成を表す概略断面図であり、パネル製造装置１を表す図１に対応している。このパネル製造装置１００は、フレキシブル配線基板２２および回路基板２３に照射光Ｌｉを照射する照射部１１３を有している。パネル製造装置１００では、照射光Ｌｉと受光部１４の光軸１４Ａとのなす角度ａが０度以上１０度以下となるように、照射部１１３が配置されている。パネル製造装置１００は、この点において、パネル製造装置１と異なっている。 FIG. 8 is a schematic cross-sectional view showing the configuration of the panel manufacturing apparatus 100 according to the comparative example, and corresponds to FIG. 1 showing the panel manufacturing apparatus 1. The panel manufacturing apparatus 100 has an irradiation unit 113 that irradiates the flexible wiring board 22 and the circuit board 23 with the irradiation light Li. In the panel manufacturing apparatus 100, the irradiation unit 113 is arranged so that the angle a formed by the irradiation light Li and the optical axis 14A of the light receiving unit 14 is 0 degrees or more and 10 degrees or less. The panel manufacturing apparatus 100 differs from the panel manufacturing apparatus 1 in this respect.
　図９Ａおよび図９Ｂは、照射部１１３からフレキシブル配線基板２２および回路基板２３に照射された照射光Ｌｉの進路の一例を表している。パネル製造装置１００では、フレキシブル配線基板２２の撓み具合によって、受光部１４に入射する光量が変動しやすい。例えばフレキシブル配線基板２２が回路基板２３側に反っているとき（図９Ａ）、照射光Ｌｉのうち、フレキシブル配線基板２２表面で正反射された正反射光Ｌｓｒが受光部１４に入射する。一方、フレキシブル配線基板２２が回路基板２３と反対側に反っているとき（図９Ｂ）、正反射光Ｌｓｒは受光部１４から逸れた方向に向かい、受光部１４に入射しない。このように正反射光Ｌｓｒの軌跡にばらつきが生じると、受光部１４に入射する光量が変動するので、撮像された画像が不安定になりやすい。不安定な画像では、例えば、検出部１５が端子２２Ｔ，２３Ｔのずれ量を検知することができず、端子２２Ｔ，２３Ｔの精確な位置合わせが困難となるおそれがある。特に、パネル製造装置１００が、アルゴリズムを使用して自動的に端子２２Ｔ，２３Ｔの位置合わせを行うとき、撮影画像が不安定になるとアルゴリズムが正常に動作しなくなり、端子２２Ｔ，２３Ｔの位置合わせが困難となる。 9A and 9B show an example of the path of the irradiation light Li irradiated from the irradiation unit 113 to the flexible wiring board 22 and the circuit board 23. In the panel manufacturing apparatus 100, the amount of light incident on the light receiving portion 14 tends to fluctuate depending on the degree of bending of the flexible wiring board 22. For example, when the flexible wiring board 22 is warped toward the circuit board 23 (FIG. 9A), of the irradiation light Li, the specularly reflected light Lsr that is specularly reflected on the surface of the flexible wiring board 22 is incident on the light receiving portion 14. On the other hand, when the flexible wiring board 22 is warped on the opposite side to the circuit board 23 (FIG. 9B), the specularly reflected light Lsr goes away from the light receiving unit 14 and does not enter the light receiving unit 14. If the locus of the specularly reflected light Lsr varies in this way, the amount of light incident on the light receiving unit 14 fluctuates, so that the captured image tends to become unstable. In an unstable image, for example, the detection unit 15 cannot detect the amount of deviation of the terminals 22T and 23T, which may make it difficult to accurately align the terminals 22T and 23T. In particular, when the panel manufacturing apparatus 100 automatically aligns the terminals 22T and 23T using an algorithm, the algorithm does not operate normally when the captured image becomes unstable, and the alignment of the terminals 22T and 23T is performed. It will be difficult.
　これに対し、本実施形態では、角度ａが１５度以上７０度以下の照射光Ｌｉがフレキシブル配線基板２２に照射される。これにより、フレキシブル配線基板２２の撓み具合が変化しても、正反射光Ｌｓｒが受光部１４から逸れた方向に向かい、受光部１４に入射しにくくなる。即ち、正反射光Ｌｓｒの軌跡のばらつきが抑えられるので、受光部１４に入射する光量の変動を抑えて、安定して撮像することができる。よって、パネル製造装置１では安定して端子２２Ｔ，２３Ｔの位置合わせを行うことができる。また、検出部１５および制御部１６のアルゴリズムが正常に動作するので、自動で端子２２Ｔ，２３Ｔの位置合わせを行うことが可能となる。 On the other hand, in the present embodiment, the flexible wiring board 22 is irradiated with the irradiation light Li having an angle a of 15 degrees or more and 70 degrees or less. As a result, even if the degree of bending of the flexible wiring board 22 changes, the specularly reflected light Lsr tends to deviate from the light receiving portion 14, and it becomes difficult for the specularly reflected light Lsr to enter the light receiving portion 14. That is, since the variation in the trajectory of the specularly reflected light Lsr is suppressed, the variation in the amount of light incident on the light receiving unit 14 can be suppressed, and stable imaging can be performed. Therefore, in the panel manufacturing apparatus 1, the terminals 22T and 23T can be stably aligned. Further, since the algorithms of the detection unit 15 and the control unit 16 operate normally, it is possible to automatically align the terminals 22T and 23T.
　表１は、パネル製造装置１，１００を用いて端子２２Ｔ，２３Ｔの位置合わせを行った結果を表している。表１中、実施例１～３は、パネル製造装置１を用いた位置合わせの結果を表し、比較例１，２は、パネル製造装置１００を用いた位置合わせの結果を表す。このとき、バー照明およびレンズ（図３Ａ，３Ｂのレンズ１３３）を有する照射部１３，１１３を使用した。照射光Ｌｉの波長は８５０ｎｍであった。 Table 1 shows the results of aligning the terminals 22T and 23T using the panel manufacturing devices 1, 100. In Table 1, Examples 1 to 3 represent the results of alignment using the panel manufacturing apparatus 1, and Comparative Examples 1 and 2 represent the results of alignment using the panel manufacturing apparatus 100. At this time, irradiation units 13 and 113 having bar illumination and a lens (lens 133 in FIGS. 3A and 3B) were used. The wavelength of the irradiation light Li was 850 nm.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　パネル製造装置１を用いたときには、実施した２０回の端子２２Ｔ，２３Ｔの位置合わせのうち、全ての回で端子２２Ｔ，２３Ｔの位置が正しく決定された。即ち、２０回全ての位置合わせを正常に完了させることができた。このように、角度ａが１５度以上６０度以下であるときには、安定して端子２２Ｔ，２３Ｔの位置合わせを行うことができた。一方、パネル製造装置１００を用いたときには、実施した２０回の端子２２Ｔ，２３Ｔの位置合わせのうち、一部の回では、端子２２Ｔ，２３Ｔの位置を正しく決定することができなかった。即ち、角度ａが５度以上１５度以下であるときには、安定して端子２２Ｔ，２３Ｔの位置合わせを行うことが困難であることがわかった。 When the panel manufacturing apparatus 1 was used, the positions of the terminals 22T and 23T were correctly determined at all of the 20 times of alignment of the terminals 22T and 23T. That is, all the alignments could be completed 20 times normally. As described above, when the angle a is 15 degrees or more and 60 degrees or less, the terminals 22T and 23T can be stably aligned. On the other hand, when the panel manufacturing apparatus 100 was used, the positions of the terminals 22T and 23T could not be correctly determined in some of the 20 times of the alignment of the terminals 22T and 23T. That is, it was found that when the angle a is 5 degrees or more and 15 degrees or less, it is difficult to stably align the terminals 22T and 23T.
　以上のように、本実施形態のパネル製造装置１では、照射部１３が、受光部１４の光軸１４Ａに対して１５度以上７５度以下の角度ａをなす照射光Ｌｉを回路基板２３およびフレキシブル配線基板２２に照射する。これにより、フレキシブル配線基板２２の撓み具合が変化しても、照射光Ｌｉのうち、フレキシブル配線基板２２で正反射された正反射光Ｌｓｒが受光部１４に入射しにくくなる。即ち、フレキシブル配線基板２２の撓み具合に起因する受光部１４への入射光量の変動が小さくなる。したがって、フレキシブル配線基板２２の撓みの影響を抑え、端子２２Ｔ，２３Ｔを安定して撮像することができる。よって、端子２２Ｔ，２３Ｔの位置合わせの安定性を向上させることが可能となる。 As described above, in the panel manufacturing apparatus 1 of the present embodiment, the irradiation unit 13 flexibly transmits the irradiation light Li forming an angle a of 15 degrees or more and 75 degrees or less with respect to the optical axis 14A of the light receiving unit 14 with the circuit board 23. Irradiate the wiring board 22. As a result, even if the degree of bending of the flexible wiring board 22 changes, the specularly reflected light Lsr that is specularly reflected by the flexible wiring board 22 among the irradiation light Li is less likely to be incident on the light receiving portion 14. That is, the fluctuation in the amount of light incident on the light receiving portion 14 due to the degree of bending of the flexible wiring board 22 is reduced. Therefore, the influence of the bending of the flexible wiring board 22 can be suppressed, and the terminals 22T and 23T can be stably imaged. Therefore, it is possible to improve the alignment stability of the terminals 22T and 23T.
　また、照射部１３がレンズ１３３を有することにより、照射光Ｌｉの照度を向上させるとともに、被写界深度を深くすることができる。これにより、撮像時に十分な光量を維持し、鮮明な端子２２Ｔ，２３Ｔの画像を得ることが可能となる。 Further, since the irradiation unit 13 has the lens 133, the illuminance of the irradiation light Li can be improved and the depth of field can be deepened. As a result, it is possible to maintain a sufficient amount of light at the time of imaging and obtain clear images of terminals 22T and 23T.
　また、パネル製造装置１では、フレキシブル配線基板２２および回路基板２３にアライメントマークを形成することなく、端子２２Ｔ，２３Ｔを直接撮像することによりこれらの位置合わせを行うことができる。したがって、パネル製造装置１を用いることにより、アライメントマークの形成されていないフレキシブル配線基板２２および回路基板２３の設計変更を行うことなく、容易に、端子２２Ｔ，２３Ｔの位置合わせを行うことができる。更に、端子２２Ｔ，２３Ｔの重なりを直接撮像することができるので、高い精度で位置合わせを行うことが可能となる。 Further, in the panel manufacturing apparatus 1, these alignments can be performed by directly imaging the terminals 22T and 23T without forming alignment marks on the flexible wiring board 22 and the circuit board 23. Therefore, by using the panel manufacturing apparatus 1, the terminals 22T and 23T can be easily aligned without changing the design of the flexible wiring board 22 and the circuit board 23 on which the alignment mark is not formed. Further, since the overlap of the terminals 22T and 23T can be directly imaged, the alignment can be performed with high accuracy.
　（変形例）
　次に、図１０を参照して、上記実施形態のパネル製造装置１の変形例を説明する。図１０は、変形例に係るパネル製造装置１の構成を表す概略断面図である。パネル製造装置１は、照射部１３の移動を担う位置変更部材１７を有していてもよい。 (Modification example)
Next, a modified example of the panel manufacturing apparatus 1 of the above embodiment will be described with reference to FIG. FIG. 10 is a schematic cross-sectional view showing the configuration of the panel manufacturing apparatus 1 according to the modified example. The panel manufacturing apparatus 1 may have a position changing member 17 that is responsible for moving the irradiation unit 13.
　位置変更部材１７は、照射部１３の位置を変更するためのものであり、例えば、ロボット等により構成されている。位置変更部材１７は、例えば、フレキシブル配線基板２２および回路基板２３により近い位置と、フレキシブル配線基板２２および回路基板２３からより離れた位置との間で照射部１３の位置を変更する。例えば、まず、位置変更部材１７は、フレキシブル配線基板２２および回路基板２３により近い位置に照射部１３を移動させる。次に、照射部１３は、フレキシブル配線基板２２および回路基板２３に照射光Ｌｉを照射し、端子２２Ｔ，２３Ｔの撮影を行う。続いて、位置変更部材１７は、フレキシブル配線基板２２および回路基板２３からより離れた位置に照射部１３を移動させる。この後、フレキシブル配線基板２２および回路基板２３に近い位置に仮圧着部材（不図示）を設けて、端子２２Ｔ，２３Ｔの圧着を行う。 The position changing member 17 is for changing the position of the irradiation unit 13, and is composed of, for example, a robot or the like. The position changing member 17 changes the position of the irradiation unit 13 between, for example, a position closer to the flexible wiring board 22 and the circuit board 23 and a position further away from the flexible wiring board 22 and the circuit board 23. For example, first, the position changing member 17 moves the irradiation unit 13 to a position closer to the flexible wiring board 22 and the circuit board 23. Next, the irradiation unit 13 irradiates the flexible wiring board 22 and the circuit board 23 with the irradiation light Li, and photographs the terminals 22T and 23T. Subsequently, the position changing member 17 moves the irradiation unit 13 to a position further away from the flexible wiring board 22 and the circuit board 23. After that, a temporary crimping member (not shown) is provided at a position close to the flexible wiring board 22 and the circuit board 23, and the terminals 22T and 23T are crimped.
　このように、パネル製造装置１（撮像装置１０）が位置変更部材１７を有することにより、より近い位置で、照射部１３がフレキシブル配線基板２２および回路基板２３に照射光Ｌｉを照射することができる。これにより、照射部１３にレンズ１３３が設けられていないときにも、照射光Ｌｉの照度を高めることができる。パネル製造装置１は、位置変更部材１７およびレンズ１３３を有していてもよい。 As described above, since the panel manufacturing apparatus 1 (imaging apparatus 10) has the position changing member 17, the irradiation unit 13 can irradiate the flexible wiring board 22 and the circuit board 23 with the irradiation light Li at a closer position. .. As a result, the illuminance of the irradiation light Li can be increased even when the lens 133 is not provided on the irradiation unit 13. The panel manufacturing apparatus 1 may include a position changing member 17 and a lens 133.
　以上で説明した上記実施形態の変形例に係るパネル製造装置１は、上記実施形態で説明した効果と同様の効果を奏する。 The panel manufacturing apparatus 1 according to the modified example of the above-described embodiment has the same effect as the effect described in the above-described embodiment.
　以上のように、実施形態において、本発明の撮像方法、撮像装置およびパネル製造装置について説明した。しかしながら、本発明は、その技術思想の範囲内において当業者が適宜に追加、変形、および省略することができることはいうまでもない。 As described above, in the embodiment, the imaging method, the imaging apparatus, and the panel manufacturing apparatus of the present invention have been described. However, it goes without saying that the present invention can be appropriately added, modified, and omitted by those skilled in the art within the scope of the technical idea.
　また、上述の実施形態では、パネル製造装置１を用いて回路基板２３の端子２３Ｔにフレキシブル配線基板２２の端子２２Ｔを圧着する場合について説明したが、パネル製造装置１を用いて、ＴＦＴ基板２１の端子にフレキシブル配線基板２２の端子を圧着するようにしてもよい。このとき、ＴＦＴ基板２１が本発明の回路基板の一具体例に対応する。 Further, in the above-described embodiment, the case where the terminal 22T of the flexible wiring board 22 is crimped to the terminal 23T of the circuit board 23 by using the panel manufacturing apparatus 1 has been described, but the TFT substrate 21 is described by using the panel manufacturing apparatus 1. The terminal of the flexible wiring board 22 may be crimped to the terminal. At this time, the TFT substrate 21 corresponds to a specific example of the circuit board of the present invention.
　また、パネル製造装置１では、フレキシブル配線基板２２の端子２２Ｔが設けられた部分と、回路基板２３の端子２３Ｔが設けられた部分とが対向していない状態で端子２２Ｔ，２３Ｔを撮像した後、端子２２Ｔ，２３Ｔの位置合わせを行うことも可能である。 Further, in the panel manufacturing apparatus 1, after imaging the terminals 22T and 23T in a state where the portion of the flexible wiring board 22 provided with the terminal 22T and the portion of the circuit board 23 provided with the terminal 23T do not face each other, the terminals 22T and 23T are imaged. It is also possible to align the terminals 22T and 23T.
　また、上述の実施形態では、パネル製造装置１が回路基板２３の端子２３Ｔとフレキシブル配線基板２２の端子２２Ｔを撮像し、これらの位置合わせを行う例を説明したが、パネル製造装置１は、回路基板２３およびフレキシブル配線基板２２各々に形成されたアラインメントマークを撮像することにより、これらのアラインメントマークの位置合わせを行ってもよい。 Further, in the above-described embodiment, the example in which the panel manufacturing apparatus 1 images the terminal 23T of the circuit board 23 and the terminal 22T of the flexible wiring board 22 and aligns them has been described. However, the panel manufacturing apparatus 1 is a circuit. Alignment marks may be aligned by imaging the alignment marks formed on the substrate 23 and the flexible wiring board 22 respectively.
　また、上述の実施形態では、パネル製造装置１の制御部１６が載置部材１１を制御する場合について説明したが、撮像装置１０に制御部を設け、この制御部が載置部材１１を制御してもよい。 Further, in the above-described embodiment, the case where the control unit 16 of the panel manufacturing apparatus 1 controls the mounting member 11 has been described. However, the imaging device 10 is provided with a control unit, and this control unit controls the mounting member 11. You may.
　また、上述の実施形態では、光源１３０がＬＥＤ１３２を含む例を説明したが、光源１３０は、ＬＥＤ１３２を含んでいなくてもよい。照射部１３は、照射光Ｌｉを発生することが可能な光源１３０を有していればよい。 Further, in the above-described embodiment, the example in which the light source 130 includes the LED 132 has been described, but the light source 130 does not have to include the LED 132. The irradiation unit 13 may have a light source 130 capable of generating irradiation light Li.
　また、上述した実施形態に係るパネル製造装置１における処理は、上記のフローチャートのステップ以外のステップを含んでもよく、あるいは、上述したステップのうちの一部を含まなくてもよい。また、ステップの順序は、上述した実施形態に限定されない。さらに、各ステップは、他のステップと組み合わされて一つのステップとして実行されてもよく、他のステップに含まれて実行されてもよく、複数のステップに分割されて実行されてもよい。 Further, the process in the panel manufacturing apparatus 1 according to the above-described embodiment may include steps other than the steps in the above-mentioned flowchart, or may not include a part of the above-mentioned steps. Further, the order of the steps is not limited to the above-described embodiment. Further, each step may be executed as one step in combination with other steps, may be executed by being included in other steps, or may be executed by being divided into a plurality of steps.
　また、パネル製造装置１の制御プログラムは、ＵＳＢメモリー、フレキシブルディスク、ＣＤ－ＲＯＭなどのコンピューター読み取り可能な記録媒体によって提供されてもよいし、インターネットなどのネットワークを介してオンラインで提供されてもよい。この場合、コンピューター読み取り可能な記録媒体に記録されたプログラムは、通常、メモリーやストレージなどに転送され記憶される。また、このプログラムは、たとえば、単独のアプリケーションソフトとして提供されてもよいし、パネル製造装置１の一機能としてその各装置のソフトウェアに組み込んでもよい。 Further, the control program of the panel manufacturing apparatus 1 may be provided by a computer-readable recording medium such as a USB memory, a flexible disk, or a CD-ROM, or may be provided online via a network such as the Internet. .. In this case, the program recorded on the computer-readable recording medium is usually transferred and stored in a memory, storage, or the like. Further, this program may be provided as a single application software, or may be incorporated into the software of each device as a function of the panel manufacturing device 1.
　本出願は、２０２０年３月３日に出願された日本国特許出願番号２０２０－０３６１６０号に基づいており、その開示内容は、参照により全体として組み入れられている。 This application is based on Japanese Patent Application No. 2020-036160 filed on March 3, 2020, the disclosure of which is incorporated as a whole by reference.
１　　　パネル製造装置、
１０　　撮像装置、
１１　　載置部材、
１２　　保持部材、
１３　　照射部、
１３０　光源、
１３１　光源基板、
１３２　ＬＥＤ、
１３３　レンズ、
２１　　ＴＦＴ基板、
２２　　フレキシブル配線基板、
２３　　回路基板、
２２Ｔ，２３Ｔ　端子、
Ｌｉ　　照射光、
Ｌｒ　　反射光、
Ｌｒｓ　正反射光。 1 panel manufacturing equipment,
10 Imaging device,
11 Mounting member,
12 Holding member,
13 Irradiated part,
130 light source,
131 Light source board,
132 LED,
133 lens,
21 TFT substrate,
22 Flexible wiring board,
23 circuit board,
22T, 23T terminal,
Li irradiation light,
Lr reflected light,
Lrs specularly reflected light.

Claims (20)

  1. 　回路基板およびフレキシブル配線基板を撮像する撮像方法であって、
    　前記回路基板を載置部材に載置することと、
    　前記フレキシブル配線基板を保持部材で保持し、前記載置部材に載置した前記回路基板の少なくとも一部に対向する位置に前記フレキシブル配線基板を配置することと、
    　前記フレキシブル配線基板に対向する前記回路基板で反射された光を受光可能な位置に受光部を配置することと、
    　照射部から前記回路基板および前記フレキシブル配線基板に照射光を照射し、前記照射光のうち前記フレキシブル配線基板で正反射された光が前記受光部から逸れる方向に向かうことと
    　を含む撮像方法。     This is an imaging method for imaging circuit boards and flexible wiring boards.
    Placing the circuit board on the mounting member and
    The flexible wiring board is held by a holding member, and the flexible wiring board is arranged at a position facing at least a part of the circuit board placed on the above-described mounting member.
    By arranging the light receiving portion at a position where the light reflected by the circuit board facing the flexible wiring board can be received,
    An imaging method including irradiating the circuit board and the flexible wiring board with irradiation light from the irradiation unit, and directing the light directly reflected by the flexible wiring board out of the irradiation light in a direction deviating from the light receiving unit.
  2. 　回路基板およびフレキシブル配線基板を撮像する撮像方法であって、
    　前記回路基板を載置部材に載置することと、
    　前記フレキシブル配線基板を保持部材で保持し、前記載置部材に載置した前記回路基板の少なくとも一部に対向する位置に前記フレキシブル配線基板を配置することと、
    　前記フレキシブル配線基板に対向する前記回路基板で反射された光を受光可能な位置に受光部を配置することと、
    　照射部から前記受光部の光軸に対して１５度以上７５度以下の角度をなす照射光を前記回路基板および前記フレキシブル配線基板に照射することと
    　を含む撮像方法。     This is an imaging method for imaging circuit boards and flexible wiring boards.
    Placing the circuit board on the mounting member and
    The flexible wiring board is held by a holding member, and the flexible wiring board is arranged at a position facing at least a part of the circuit board placed on the above-described mounting member.
    By arranging the light receiving portion at a position where the light reflected by the circuit board facing the flexible wiring board can be received,
    An imaging method including irradiating the circuit board and the flexible wiring board with irradiation light at an angle of 15 degrees or more and 75 degrees or less from the irradiation unit to the optical axis of the light receiving unit.
  3. 　前記照射部は、前記受光部の光軸に対して３０度以上６０度以下の角度をなす前記照射光を照射する、請求項１または２に記載の撮像方法。 The imaging method according to claim 1 or 2, wherein the irradiation unit irradiates the irradiation light at an angle of 30 degrees or more and 60 degrees or less with respect to the optical axis of the light receiving unit.
  4. 　前記照射部は、光源と、前記光源から出射された光を集光するレンズとを含む、請求項１～３のいずれかに記載の撮像方法。 The imaging method according to any one of claims 1 to 3, wherein the irradiation unit includes a light source and a lens that collects light emitted from the light source.
  5. 　前記照射光は、赤外領域の波長の光を含む、請求項１～４のいずれかに記載の撮像方法。 The imaging method according to any one of claims 1 to 4, wherein the irradiation light includes light having a wavelength in the infrared region.
  6. 　前記照射光は、８４０ｎｍ以上８６０ｎｍ以下の波長の光を含む、請求項５に記載の撮像方法。 The imaging method according to claim 5, wherein the irradiation light includes light having a wavelength of 840 nm or more and 860 nm or less.
  7. 　前記回路基板の第１端子が設けられた部分に、前記フレキシブル配線基板の第２端子が設けられた部分を対向させた状態で撮像する、請求項１～６のいずれかに記載の撮像方法。 The imaging method according to any one of claims 1 to 6, wherein the portion of the circuit board provided with the first terminal is opposed to the portion of the flexible wiring board provided with the second terminal.
  8. 　回路基板およびフレキシブル配線基板を撮像する撮像装置であって、
    　前記回路基板が載置される載置部材と、
    　前記載置部材に載置された前記回路基板の少なくとも一部に対向する位置に、前記フレキシブル配線基板を保持する保持部材と、
    　前記フレキシブル配線基板に対向する前記回路基板で反射された光を受光する受光部と、
    　照射光を前記回路基板および前記フレキシブル配線基板に照射するとともに、前記照射光のうち、前記フレキシブル配線基板で正反射された光が前記受光部から逸れる方向に向かうように配置された照射部と
    　を備える撮像装置。     An imaging device that captures images of circuit boards and flexible wiring boards.
    A mounting member on which the circuit board is mounted and
    A holding member that holds the flexible wiring board at a position facing at least a part of the circuit board mounted on the above-mentioned mounting member, and a holding member.
    A light receiving unit that receives light reflected by the circuit board facing the flexible wiring board, and a light receiving unit that receives the light reflected by the circuit board.
    The circuit board and the flexible wiring board are irradiated with the irradiation light, and among the irradiation light, the irradiation portion arranged so that the light reflected by the flexible wiring board deviates from the light receiving portion. An image pickup device equipped.
  9. 　回路基板およびフレキシブル配線基板を撮像する撮像装置であって、
    　前記回路基板が載置される載置部材と、
    　前記載置部材に載置された前記回路基板の少なくとも一部に対向する位置に、前記フレキシブル配線基板を保持する保持部材と、
    　前記フレキシブル配線基板に対向する前記回路基板で反射された光を受光する受光部と、
    　前記受光部の光軸に対して１５度以上７５度以下の角度をなす照射光を前記回路基板および前記フレキシブル配線基板に照射する照射部と
    　を備える撮像装置。     An imaging device that captures images of circuit boards and flexible wiring boards.
    A mounting member on which the circuit board is mounted and
    A holding member that holds the flexible wiring board at a position facing at least a part of the circuit board mounted on the above-mentioned mounting member, and a holding member.
    A light receiving unit that receives light reflected by the circuit board facing the flexible wiring board, and a light receiving unit that receives the light reflected by the circuit board.
    An imaging device including an irradiation unit that irradiates the circuit board and the flexible wiring board with irradiation light at an angle of 15 degrees or more and 75 degrees or less with respect to the optical axis of the light receiving unit.
  10. 　前記照射光は、前記受光部の光軸に対して３０度以上６０度以下の角度をなす、請求項８または９に記載の撮像装置。 The imaging device according to claim 8 or 9, wherein the irradiation light forms an angle of 30 degrees or more and 60 degrees or less with respect to the optical axis of the light receiving portion.
  11. 　前記照射部は、光源と、前記光源から出射された光を集光するレンズとを含む、請求項８～１０のいずれかに記載の撮像装置。 The imaging device according to any one of claims 8 to 10, wherein the irradiation unit includes a light source and a lens that collects light emitted from the light source.
  12. 　前記照射部の位置を変更させる位置変更部材を更に有する、請求項８～１１のいずれかに記載の撮像装置。 The imaging device according to any one of claims 8 to 11, further comprising a position changing member for changing the position of the irradiation unit.
  13. 　前記照射光は、赤外領域の波長の光を含む、請求項８～１２のいずれかに記載の撮像装置。 The imaging device according to any one of claims 8 to 12, wherein the irradiation light includes light having a wavelength in the infrared region.
  14. 　前記照射光は、８４０ｎｍ以上８６０ｎｍ以下の波長の光を含む、請求項１３に記載の撮像装置。 The imaging device according to claim 13, wherein the irradiation light includes light having a wavelength of 840 nm or more and 860 nm or less.
  15. 　前記照射部はＬＥＤを含む、請求項８～１４のいずれかに記載の撮像装置。 The imaging device according to any one of claims 8 to 14, wherein the irradiation unit includes an LED.
  16. 　前記照射部は、バー照明を含む、請求項８～１５のいずれかに記載の撮像装置。 The imaging device according to any one of claims 8 to 15, wherein the irradiation unit includes bar illumination.
  17. 　前記受光部の光軸は、前記載置部材の前記回路基板が載置される面に垂直である、請求項８～１６のいずれかに記載の撮像装置。 The imaging device according to any one of claims 8 to 16, wherein the optical axis of the light receiving unit is perpendicular to the surface on which the circuit board of the above-mentioned mounting member is mounted.
  18. 　請求項８～１７のいずれかに記載の撮像装置と、
    　前記撮像装置により撮像された前記回路基板の第１端子および前記フレキシブル配線基板の第２端子の位置に基づいて、前記第１端子と前記第２端子とのずれ量を検出する検出部と
    　を備えたパネル製造装置。     The imaging device according to any one of claims 8 to 17,
    A detection unit for detecting the amount of deviation between the first terminal and the second terminal based on the positions of the first terminal of the circuit board and the second terminal of the flexible wiring board imaged by the image pickup device is provided. Panel manufacturing equipment.
  19. 　前記ずれ量に応じて前記載置部材の移動を制御する制御部を更に有する、請求項１８に記載のパネル製造装置。 The panel manufacturing apparatus according to claim 18, further comprising a control unit that controls the movement of the above-mentioned placement member according to the amount of deviation.
  20. 　前記制御部は、前記第１端子および前記第２端子が互いに離間した状態で、前記載置部材を移動させる、請求項１９に記載のパネル製造装置。 The panel manufacturing apparatus according to claim 19, wherein the control unit moves the above-mentioned placing member in a state where the first terminal and the second terminal are separated from each other.
PCT/JP2020/045076 2020-03-03 2020-12-03 Imaging method, imaging device, and panel manufacturing device WO2021176786A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08222832A (en) * 1995-02-14 1996-08-30 Fujitsu Ltd Method for observing wiring pattern of printed board
JP2006040978A (en) * 2004-07-22 2006-02-09 Fuji Mach Mfg Co Ltd Electronic component packaging method and equipment
JP2008060244A (en) * 2006-08-30 2008-03-13 Fujikura Ltd Method and device for positioning printed circuit board, and method for connecting printed circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08222832A (en) * 1995-02-14 1996-08-30 Fujitsu Ltd Method for observing wiring pattern of printed board
JP2006040978A (en) * 2004-07-22 2006-02-09 Fuji Mach Mfg Co Ltd Electronic component packaging method and equipment
JP2008060244A (en) * 2006-08-30 2008-03-13 Fujikura Ltd Method and device for positioning printed circuit board, and method for connecting printed circuit board

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