WO2021175726A1 - Procédé d'usinage d'une pièce et système d'usinage - Google Patents

Procédé d'usinage d'une pièce et système d'usinage Download PDF

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Publication number
WO2021175726A1
WO2021175726A1 PCT/EP2021/054890 EP2021054890W WO2021175726A1 WO 2021175726 A1 WO2021175726 A1 WO 2021175726A1 EP 2021054890 W EP2021054890 W EP 2021054890W WO 2021175726 A1 WO2021175726 A1 WO 2021175726A1
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WIPO (PCT)
Prior art keywords
workpiece
workpiece surface
removal
removal process
analysis
Prior art date
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PCT/EP2021/054890
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German (de)
English (en)
Inventor
Mostafa BIGLARI
Malte Kumkar
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Trumpf Laser- Und Systemtechnik Gmbh
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Publication date
Application filed by Trumpf Laser- Und Systemtechnik Gmbh filed Critical Trumpf Laser- Und Systemtechnik Gmbh
Publication of WO2021175726A1 publication Critical patent/WO2021175726A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys

Definitions

  • the invention relates to a method for machining at least one workpiece, material being removed from at least one workpiece surface by means of electromagnetic radiation.
  • the invention further relates to a processing system for a workpiece having a processing device for removing material from a workpiece surface of the workpiece by means of electromagnetic radiation.
  • a method for descaling and / or cleaning a metal strand is known from EP 1 558 779 B1, in which the metal strand is guided in a conveying direction through a device in which it is subjected to plasma descaling and / or plasma cleaning. After plasma descaling or plasma cleaning, the surface of the metal strand can be checked. Depending on the result of the inspection of the surface, a conveying speed of the metal strand can be adjusted.
  • a zone of material typically forms under a superficial oxide layer in which the local alloy composition does not correspond to the desired alloy composition of the material.
  • a chromium depletion zone with a reduced chromium content can form, which is susceptible to corrosion.
  • the object of the invention is to improve the controllability of the process of removing material from a workpiece surface. Description of the invention
  • a method for machining at least one workpiece is provided.
  • the workpiece is typically ribbon-shaped; in particular, the workpiece can be an endless belt.
  • a length of the workpiece can be at least twenty times as great as a width of the workpiece.
  • the width can be at least ten times as great as a thickness of the workpiece.
  • the workpiece can in particular consist of chrome steel and / or silicon steel.
  • Chromium steel is understood to mean steel with chromium as an alloying element.
  • the mass fraction of chromium is preferably at least 10%, particularly preferably at least 12%.
  • Silicon steel is understood to mean steel with silicon as an alloying element with a mass content of at least 0.4%.
  • the mass fraction of silicon is preferably at least 1%, particularly preferably at least 2%.
  • the workpiece can consist of a chrome-silicon steel with corresponding chrome and silicon components. With these materials there is a particular need for precise control of a superficial removal process during steel production, for example in a rolling mill.
  • the method according to the invention comprises the steps of a) removing material from at least one workpiece surface by means of, preferably pulsed, electromagnetic radiation, in particular laser radiation and / or magnetron radiation, b) analyzing the composition of the removed material during the removal process, c) influencing the removal process as a function of an analysis result.
  • the removal in step a) can take place in one or more passes.
  • the use of pulsed electromagnetic radiation allows particularly effective ablation. Pulsed radiation can briefly bring greater power to the workpiece than continuous radiation.
  • the ablation can advantageously take place by means of laser ablation.
  • ultrashort pulsed laser radiation is recommended due to the high spatial-temporal gradients to be achieved with largely negligible heat diffusion in the course of the pulse.
  • an oxide layer can be removed by a largely thermomechanically induced process in which the expansion following very rapid heating of the material leads to the oxide layer in its interface becoming detached. This enables a thicker oxide layer to be blown off with a single pulse.
  • Ultrashort pulsed laser radiation also allows ablation with a reduced heat influence compared to longer pulses. In particular, the creation of a disruptive enamel layer can be avoided.
  • Magnetron radiation can generate a plasma on the workpiece surface so that material is removed gently and effectively at the same time.
  • the material to be removed or removed can in particular be material from an oxide layer and / or from a chromium depletion zone of the workpiece.
  • the oxide layer can be a layer of scale.
  • step b) the composition of the material removed is analyzed during the removal process.
  • the composition can thus be determined at the respective point in time of the removal process.
  • the Steel mill has a superficial layer of oxide or scale. With chrome steels, a chrome depletion zone with a reduced proportion of chrome often follows under the guild layer. In the case of silicon steels, a layer of scale often adheres strongly and is difficult to reliably remove using conventional methods such as water jets. The exact thickness of the respective layers is typically not known in advance.
  • the removal process in step c) is influenced as a function of an analysis result.
  • the influencing can take place by changing at least one parameter of the current removal process or a subsequent run of the removal process.
  • a parameter to be adjusted can be the processing time of a surface area.
  • a parameter to be adapted can be the power of the electromagnetic radiation used for the removal.
  • the method according to the invention is preferably carried out with a processing system according to the invention described below. Features described there can also be provided in the method according to the invention.
  • the analysis can be carried out by means of spectroscopy, preferably infrared
  • Spectroscopy and / or plasma spectroscopy take place.
  • the analysis can be carried out by means of laser ultrasound analysis, X-ray diffraction, magnetic measurements, X-ray fluorescence analysis and / or image analysis.
  • Plasma spectroscopy is typically carried out as laser-induced plasma spectroscopy. These analysis methods are particularly suitable for use in steel production.
  • a ratio of several components of the removed material is determined during the analysis, preferably the ratio of iron, nickel and chromium to one another.
  • the ratio can be a mass ratio or a molar ratio (molar ratio).
  • a particularly advantageous variant of the method is characterized in that material is removed from the workpiece surface until the analysis result corresponds to a target value.
  • the target value can specify a ratio of several components of the removed material.
  • Material is preferably removed until a composition of the removed material corresponds, at least with regard to some constituents, to a (desired) alloy composition of the workpiece. If the analysis result corresponds to the target value, the removal process for the corresponding surface area is typically ended. It can, however, be provided that the removal is continued after the (first) target value has been reached until the analysis result corresponds to a second target value. After the first setpoint has been reached, a second set of parameters can be used for removal. Correspondingly, after the second setpoint has been reached, a third set of parameters can be used for removal, and so on.
  • different sets of parameters for the oxide or scale removal and the removal of depletion layers can be predefined. If necessary, for example, the first parameter set is used and adapted until the oxide layer is actually removed.
  • a first set of parameters that has a largely selective effect on the oxide layer (scale) is particularly advantageous.
  • the oxide layer can thus be sufficiently removed before is started with a removal of a depletion layer and / or a texturing.
  • a pulse duration for the oxide removal can be 1 ps or greater, this advantageously being a single pulse application with little or no overlap of the surface areas of the workpiece (removal zones) processed by successive pulses.
  • a pulse duration can be 1 ps or less.
  • This second set of parameters is then used and adapted several times, if necessary, until the desired result has been achieved.
  • Parameters to be changed in the parameter sets can be, for example, pulse duration, repetition frequency, wavelength and / or spot size.
  • the method is not restricted to two sets of parameters, but can be supplemented by, for example, removing the depletion layer in method steps of scrubbing and finishing. Since the workpiece properties are typically not identical over the entire surface, but can be location-dependent, it is also advisable to adjust the parameters in connection with the relative movement of the beam and workpiece in a spatially resolved manner.
  • an optical property of the workpiece surface is additionally analyzed in step b).
  • the result of the optical analysis can be taken into account when influencing the removal process in step c).
  • more material can be removed from the workpiece surface in the area of a surface flaw, preferably until the surface flaw has been eliminated.
  • the optical property can be determined by image recording and image evaluation.
  • an ablation depth can also be determined. This enables additional control of the removal process in particular and of the Machining method in general.
  • the removal depth can in particular also be used for comparison with a previously determined thickness of an oxide layer.
  • the depth of removal can be used to infer the thickness of an oxide layer if this thickness was not known in advance and it is set up in another way, for example as described above, that the oxide layer is completely removed.
  • At least one parameter of the current removal process is preferably changed as a function of the analysis result.
  • the removal process can be automatically adapted to the respective workpiece, for example when workpieces with different alloy compositions are processed.
  • An automatic adaptation to different compositions and / or thicknesses of an oxide layer and / or chromium depletion zone can also take place.
  • material is continuously removed along a longitudinal direction of the workpiece in at least one pass.
  • material is continuously removed from the workpiece surface along the longitudinal direction.
  • the removal of material from adjacent surface areas can take place without interruptions in time or with interruptions in time.
  • the removal can take place in strips running transversely to the longitudinal direction.
  • the workpiece is preferably band-shaped and is moved along the longitudinal direction. This enables continuous processing of the surface of, for example, a steel strip during its manufacture.
  • Excessive thermal accumulation can be counteracted by reducing or avoiding a spatial overlapping of the surface areas detected by successive pulses.
  • thermomechanical ablation processes benefit from an increased area irradiated per pulse with reduced overlap. Overall, therefore, larger beam dimensions on the workpiece surface with a limited pulse repetition rate can be advantageous.
  • a pulse repetition rate can at most
  • a property of the workpiece surface is determined after a first pass and that a second pass takes place in which at least one parameter of the removal process is selected as a function of the characteristic of the property determined after the first pass. The process can thus be controlled particularly flexibly and precisely. In addition, with one ablation in several
  • a preferred variant of the method is characterized in that a property of the workpiece surface, preferably a condition and / or a thickness of an oxide layer and / or a chromium depletion zone, is determined before the removal process is carried out, and that at least one parameter of the removal process is determined as a function of the determined characteristic the
  • a texturing of the workpiece surface is produced during the removal process.
  • a pulse duration of the laser radiation used for ablation can be at most 1 ps, in particular at most 0.7 ps.
  • a fluence of the laser radiation can be at least 0.05 J / cm 2 , preferably at least 0.1 J / cm 2 , particularly preferably at least 0.2 J / cm 2 , and / or at most 4.0 J / cm 2 , preferably at most 3.0 J / cm 2 , particularly preferably at most 2.0 J / cm 2 .
  • an untextured workpiece surface is generated during the removal process.
  • a pulse duration of the laser radiation used for ablation can be at least 1 ps, in particular at least 1.3 ps.
  • a fluence of the laser radiation can be at most 0.05 J / cm 2 , preferably at most 0.01 J / cm 2 .
  • material is removed from two, preferably opposite, workpiece surfaces of the same workpiece at the same time. The machining of the workpiece can be accelerated as a result.
  • the same parameters can be used as for the removal of material from the first workpiece surface.
  • the analysis of the composition of the removed material can then be limited to the first workpiece surface.
  • the composition of the material removed from the two workpiece surfaces is analyzed independently of one another and the removal processes on the two workpiece surfaces are influenced independently of one another as a function of the respective analysis results.
  • the method variants described above can be used for this purpose. In this way, the removal processes on both workpiece surfaces (independently of one another) can be optimally controlled.
  • Step a ′) material is removed from a workpiece surface of a further workpiece, at least one parameter of the further removal process based on the Analysis result from step b) is selected.
  • Step a ') is carried out following steps a) to c).
  • a processing system for a, preferably band-shaped, workpiece also falls within the scope of the present invention.
  • the workpiece can in particular consist of chrome steel and / or silicon steel.
  • the processing system is preferably set up to carry out a processing method according to the invention as described above.
  • the processing system has a processing device for removing material from a workpiece surface of the workpiece by means of, preferably pulsed, electromagnetic radiation, in particular laser radiation and / or magnetron radiation.
  • a processing device for removing material from a workpiece surface of the workpiece by means of, preferably pulsed, electromagnetic radiation, in particular laser radiation and / or magnetron radiation.
  • the processing device can be a laser processing device.
  • the processing device can have a magnetron.
  • the processing system has an analysis device for analyzing the composition of the removed material and a control device for influencing at least one parameter of the
  • Processing device as a function of an analysis result obtained from the analysis device.
  • the processing system is thus able to advantageously design the removal process in the manner described above.
  • the processing system is advantageously set up to Adjust parameters of the current removal process depending on the analysis result.
  • the analysis device can also be designed to analyze an optical property of the workpiece surface.
  • the analysis device can have an image recording unit and an image evaluation unit. This enables a further optimized influencing of the removal process.
  • the processing system can furthermore have a support device for supporting the workpiece below a processing zone of the processing device. In this way, vibrations of the workpiece, which could negatively affect the removal process, can be avoided or at least reduced in the area of the machining zone. This is particularly useful for thin, band-shaped workpieces.
  • the processing system can have a further processing device for removing material from a further workpiece surface of the workpiece. This enables the efficient, in particular simultaneous, machining of the two workpiece surfaces.
  • the processing system preferably has a further analysis device for analyzing the composition of the further
  • the control device can be set up to influence at least one parameter of the further processing device as a function of a further analysis result obtained from the further analysis device.
  • the processing of the further workpiece surface can thereby be controlled particularly precisely.
  • the further analysis device can also be designed to analyze an optical property of the further workpiece surface.
  • the further analysis device can have a further image recording unit and a have further image evaluation unit. This enables a further optimized influencing of the removal process on the further workpiece surface.
  • control device can be set up to process at least one parameter of the further processing device as a function of the
  • FIG. 1 shows a first embodiment of a processing system according to the invention with a processing device for removing material from a workpiece surface of a workpiece, an analysis device for analyzing the removed material and a control device for influencing the processing device, in a schematic side view;
  • FIG. 2 shows a second embodiment of a machining system according to the invention with two machining devices for removing material from opposite workpiece surfaces of a
  • FIG. 3 shows a schematic flow diagram of a first variant of a method according to the invention for machining a workpiece, material being removed from a workpiece surface of the workpiece in several passes;
  • FIG. 4a shows a workpiece before machining with the method according to FIG. 3, in a schematic side view
  • FIG. 4b shows the workpiece from FIG. 4a during a first run of the removal process, in a schematic side view
  • 4c shows the workpiece from FIG. 4a during a second run of the removal process, in a schematic side view
  • 4d shows the workpiece from FIG. 4a during a third run of the removal process, in a schematic side view
  • 5 shows a schematic flow diagram of a second variant of a method according to the invention for machining a workpiece, parameters of a machining device that removes material being changed during an ongoing removal process as a function of a result of an analysis of the material removed;
  • FIG. 6 shows a workpiece during processing with the method according to FIG. 5, in a schematic side view.
  • FIG. 1 shows a processing system 20.
  • the processing system 20 is used for processing a workpiece 10.
  • the workpiece 10 can consist of steel, in particular stainless steel with chromium and / or silicon as alloying elements.
  • the workpiece 10 can be designed in the form of a band. In other words, the workpiece 10 can be a steel strip.
  • the processing system 20 has a processing device 22.
  • the processing device 22 serves to remove material from a workpiece surface 12 of the workpiece 10.
  • the processing device 22 sends out electromagnetic radiation, preferably in the form of radiation pulses.
  • electromagnetic radiation preferably in the form of radiation pulses.
  • the processing device 22 can be a laser processing device.
  • the material can be removed from the workpiece surface 12 by laser ablation.
  • the processing device 22 can have a magnetron.
  • the magnetron emits electromagnetic radiation which can generate a plasma on the workpiece surface 12. The plasma causes material to be removed from the workpiece surface 12.
  • the processing system 20 also has an analysis device 24.
  • the analysis device 24 serves to analyze the composition of the material removed from the workpiece surface 12 by means of the processing device 22.
  • the analysis device 24 can have a spectrometer, in particular an infrared spectrometer or a plasma spectrometer.
  • the analysis device 24 can furthermore be a
  • Image recording module typically with a camera, for determining optical properties of the workpiece surface 12.
  • the processing device 22 and the analysis device 24 can be arranged in a vacuum chamber (not shown in detail).
  • the vacuum chamber can lie against the workpiece surface 12 in a sealing manner.
  • the processing system 20 also has a control device 26.
  • the control device 26 is used to at least one parameter of the
  • the analysis result determined by the analysis device 24 contains information on the composition of the material removed from the workpiece surface 12.
  • the analysis result can contain information on the nature of the workpiece surface 12, for example on the optical properties of the workpiece surface 12.
  • the processing system 20 can have a support device 28.
  • the support device 28 serves to support the workpiece 10 in the area of a processing zone 30 in which the processing device 22 removes material from the workpiece surface 12 is removed to be supported.
  • Support device 28 can support the workpiece 10 in particular below the processing zone 30.
  • the position of the workpiece 10 can be set up in a defined manner, which simplifies the implementation of the removal process or enables higher quality material removal, for example with regard to the quality of the workpiece surface obtained after removal.
  • the support device 28 can have one or more support rollers. In order to enable a continuous feed of a strip-shaped workpiece 10 in a multi-stage removal process, the following can be provided:
  • FIG. 2 shows a further processing system 20.
  • the processing system 20 from FIG. 2 has a processing device 22, an analysis device 24 and a control device 26. In this respect, reference is made to the description above.
  • the processing system 20 of FIG. 2 has a further one
  • the further processing device 32 serves to remove material from a further workpiece surface 34.
  • the workpiece surfaces 12 and 34 can face each other.
  • the further analysis device 36 serves to analyze the composition of the material removed from the further workpiece surface 34 by means of the further processing device 32.
  • the further processing device 32 and the further analysis device 36 can be designed like the (first) processing device 22 and the (first) analysis device 24.
  • An analysis result determined by the further analysis device 36 contains information on the composition of the material removed from the further workpiece surface 34.
  • the analysis result can contain information on the nature of the workpiece surface 34, for example on the optical properties of the workpiece surface 34.
  • the analysis result of the further analysis device 36 is transmitted to the control device 26.
  • the control device 26 is set up to influence at least one parameter of the further processing device 32 as a function of an analysis result of the further analysis device 36. It goes without saying that a further control device (not shown) can also be provided for the further processing device 22 and the further analysis device 36.
  • control device 26 and possibly a further control device of the processing systems 20 of Figure 1 or Figure 2 do not have to be structurally separated (as shown schematically) from the analysis device 24 or 36 and the processing device 22 or 32, but also can be integrated into the analysis device 22, 36 and / or the processing device 22, 32, for example by a corresponding one
  • a support device can also be provided in the processing system 20 of FIG. 2 (not shown in more detail, compare reference numeral 28 in FIG. 1). If necessary, the processing zones 30 of the two
  • FIG. 3 shows a schematic flow diagram of a method for machining a workpiece. The method can be carried out with the processing system 20 of FIG. 1 or FIG. In FIGS. 4a, 4b, 4c and 4d, the workpiece 10 is shown in various stages of processing according to the processing method of FIG.
  • FIG. 4a shows the workpiece 10 in its original state before machining.
  • the workpiece 10 consists here, for example, of chromium steel and has an oxide layer 14, namely a scale layer, at the top on a workpiece surface 12, and below it a chromium depletion zone 16.
  • the chromium content is reduced compared to a desired alloy composition.
  • a composition of the material of the workpiece 10 corresponds to the desired alloy composition.
  • a property of the workpiece surface 12 can be determined.
  • the property can be, for example, a thickness of the oxide layer 14 and / or an optical feature, such as the reflection behavior.
  • the expression of the determined property is used and in a step 104 parameters for a removal process (step 106) to be determined.
  • the removal process can basically be carried out as described above.
  • FIGS. 3 and 4a to 4d material is removed from the workpiece surface 12 in several passes 100.
  • each surface area of the workpiece surface 12 can be repeatedly applied to the processing device 22 (and, if necessary, each surface area of a further workpiece surface 34 is guided past a further processing device 32), with material being continuously removed from the workpiece surface 12.
  • Continuous material removal is understood in particular to mean that at a surface area of the workpiece surface is not machined in a non-material-removing manner for any of the passes (possibly with the exception of a start and / or end area of a strip-shaped workpiece 10).
  • FIG. 4b shows the workpiece 10 during the first implementation of the removal process in a first step 106.
  • step 108 part of the oxide layer 14 is removed from the workpiece surface 12.
  • the material removed from the workpiece surface 12 is analyzed in a step 108.
  • An analysis result can be used to influence parameters for the current removal process (step 106) during the first run of the removal process by performing a further step 104, see the dash-dotted line in FIG. 3.
  • a ratio of several components of the removed material can be determined, for example the ratio of iron, nickel and chromium to one another.
  • a property of the workpiece surface 12 obtained after the removal can be determined (repeated execution of step 102), for example by image evaluation.
  • Step 104 parameters for this further removal process are set when step 104 is carried out again.
  • the property of the workpiece surface 12 determined in the further step 102 can be used.
  • the result of the analysis (step 108) of the material removed in the first pass is used to determine the parameters for the further removal process (compare dashed line in FIG. 3). If, for example, it has been determined that the oxide layer 14 has not yet been completely removed in the first pass, the power of the electromagnetic radiation used for the removal can be increased for the second pass and / or a machining time for each surface area of the workpiece surface 12 can be extended.
  • FIG. 4c shows the workpiece 10 while the removal process is being carried out in step 106 of the second pass.
  • the oxide layer 14 is completely removed here, for example.
  • a portion of the chromium depletion zone 16 can be removed.
  • the analysis of the removed material can be carried out as in the first run. It can be established here by way of example that the proportion of chromium in the removed material does not yet correspond to a target value specified for the workpiece 10.
  • the result of the analysis from step 108 of the second pass and possibly a property of the workpiece surface 12 obtained by the renewed removal are used to define parameters of the removal process for a third pass (step 104).
  • FIG. 4d shows the workpiece 10 while the removal process is being carried out in step 106 of the third pass.
  • the chromium depletion zone 16 is completely removed.
  • a superficial part of the material, the composition of which corresponds to the desired alloy composition of the workpiece can be removed. This is recognized on the basis of the analysis (step 108) of the material removed. The machining process is therefore ended after the third pass.
  • FIG. 5 shows a schematic flow diagram of a second variant of a method for machining a workpiece.
  • the method can be carried out with the processing system 20 of FIG. 1 or FIG.
  • FIG. 6 the workpiece 10 is shown while the method according to FIG. 5 is being carried out.
  • material is removed from a workpiece surface 12 in a single pass.
  • the workpiece 10 from FIG. 6 also consists, for example, of chromium steel and has on the Workpiece surface 12 has an oxide layer 14 on top, namely a layer of scale, and below it a chromium depletion zone 16. In the area of the chromium depletion zone 16, the chromium content is reduced compared to a desired alloy composition. Below the chromium depletion zone 16, a composition of the material of the workpiece 10 corresponds to the desired alloy composition.
  • initially predefined parameters are used for the removal (step 106) of material from the workpiece surface 12.
  • material is removed in a first removal area 40.
  • the material removed in the first removal area 40 is analyzed in a step 108.
  • a removal depth 18 can be measured in a step 110.
  • the analysis of the removed material and, if necessary, the measurement of the removal depth 18 should show that only material of the oxide layer 14 is removed with the specified parameters.
  • the removal process is therefore influenced in a step 104 in that parameters of the processing device 22 are changed. For example, a pulse energy of the electromagnetic radiation used for ablation can be increased.
  • material is removed from the workpiece surface 12 in a second removal area 42.
  • This removed material is also analyzed (step 108).
  • the parameters adapted in this way material is removed from the workpiece surface 12 in a second removal area 42.
  • This removed material is also analyzed (step 108).
  • the parameters adapted in this way material is removed from the workpiece surface 12 in a second removal area 42.
  • Ablation depth 18 are measured (step 110).
  • the analysis result and, if applicable, the measurement of the removal depth 18 may now show that the removal process completely removes the oxide layer 14, but that the chromium depletion zone 16 is only partially removed.
  • the removal process is therefore again influenced (step 104) by changing the parameters of the
  • Processing device 22 can be changed. It can be provided, for example, that a larger number of pulses of the electromagnetic radiation are directed onto the same surface area of the workpiece surface 12. For this purpose, a pulse repetition rate can be increased, for example from 30 kHz to 35 kHz, while a feed rate of the workpiece 10 remains constant. With the parameters adapted in this way, material is removed from the workpiece surface 12 in a third removal area 44. This removed material is also analyzed (step 108). In addition, the removal depth 18 can be measured (step 110). The analysis result and, if necessary, the measurement of the removal depth 18 may now show that the chromium depletion zone 16 is also completely removed.
  • the parameters last used for the removal of the workpiece 10 can also be used in a step 112 for the removal of material from a workpiece surface of a further workpiece (not shown). If the workpiece surface of the further workpiece has a sufficiently similar texture to the workpiece surface 12 of the workpiece 10, the oxide layer 14 and the chromium depletion zone 16 are completely removed with these parameters from the start. This can be checked by an analysis (step 108) of the material removed from the further workpiece and, if necessary, a measurement of the removal depth 18 (step 110). If necessary, the parameters of the removal process can be suitably influenced in a further step 104. For example, the feed rate of the further workpiece could be increased if it emerges that the removal depth 18 on the further workpiece is excessively great. Reference list
  • Workpiece 10 Workpiece surface 12 Oxide layer 14 Chromium depletion zone 16 Removal depth 18 Processing system 20 Processing device 22 Analysis device 24 Control device 26 Support device 28 Processing zone 30 Additional processing device 32 Additional workpiece surface 34 Additional analysis device 36 Longitudinal direction 38 Removal areas 40, 42, 44

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)

Abstract

L'invention concerne un procédé d'usinage d'au moins une pièce (10), en particulier en acier au chrome et/ou en acier au silicium, comprenant les étapes suivantes consistant : a) à enlever de la matière d'au moins une surface (12) de la pièce au moyen d'un rayonnement électromagnétique, de préférence pulsé, en particulier d'un rayonnement laser et/ou d'un rayonnement magnétron, b) à analyser la composition de la matière enlevée pendant l'opération d'enlèvement de matière, c) à influer sur le processus d'enlèvement de matière en fonction d'un résultat d'analyse. L'invention concerne en outre un système d'usinage (20) pour une pièce (10), de préférence en forme de bande, en particulier en acier au chrome et/ou en acier au silicium, comprenant un dispositif d'usinage (22) destiné à enlever de la matière d'une surface (12) de la pièce (10) au moyen d'un rayonnement électromagnétique, de préférence pulsé, en particulier d'un rayonnement laser et/ou d'un rayonnement magnétron, un dispositif d'analyse (24) pour analyser la composition de la matière enlevée, et un dispositif de commande (26) pour influer sur au moins un paramètre du dispositif d'usinage (22) en fonction d'un résultat d'analyse obtenu du dispositif d'analyse.
PCT/EP2021/054890 2020-03-03 2021-02-26 Procédé d'usinage d'une pièce et système d'usinage WO2021175726A1 (fr)

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