WO2021174587A1 - Mems麦克风 - Google Patents

Mems麦克风 Download PDF

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Publication number
WO2021174587A1
WO2021174587A1 PCT/CN2020/079623 CN2020079623W WO2021174587A1 WO 2021174587 A1 WO2021174587 A1 WO 2021174587A1 CN 2020079623 W CN2020079623 W CN 2020079623W WO 2021174587 A1 WO2021174587 A1 WO 2021174587A1
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WO
WIPO (PCT)
Prior art keywords
metal shell
shell
substrate
metal
gap
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PCT/CN2020/079623
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English (en)
French (fr)
Inventor
胡恒宾
王天娇
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瑞声声学科技(深圳)有限公司
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Publication of WO2021174587A1 publication Critical patent/WO2021174587A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the utility model relates to the technical field of electro-acoustic conversion, in particular to a MEMS microphone.
  • MEMS microphone is an electrical energy transducer manufactured based on MEMS (Micro Electro Mechanical System) technology, which has the characteristics of small size, good frequency response characteristics, and low noise. With the development of smaller and thinner electronic devices, MEMS microphones are more and more widely used in electronic devices.
  • MEMS Micro Electro Mechanical System
  • the installation of MEMS microphones generally adopts high-temperature reflow soldering on the circuit board. During the soldering process, the shell is likely to fall off due to the effect of high temperature.
  • the purpose of the utility model is to provide a MEMS microphone, which aims to solve the problem that the shell is easy to fall off during the installation process of the MEMS microphone.
  • the utility model relates to a MEMS microphone, which comprises a housing with a housing space and a MEMS chip and an ASIC chip housed in the housing space.
  • the housing includes a substrate for mounting the MEMS chip and the ASIC chip, A first metal shell that surrounds the substrate to form the accommodating space, and a second metal shell that is sleeved outside the first metal shell at intervals, and the second metal shell is fixed to the substrate and is connected to the substrate And the first metal shell surrounds a second metal shell forming a first shell gap, the substrate is provided with a pickup hole corresponding to the MEMS chip, and the first metal shell is provided with a connection with the receiving A vent hole between the space and the first shell gap.
  • the substrate is provided with a first positioning portion extending from a surface close to the first metal shell toward the direction of the first metal shell, and the surface of the first metal shell facing the substrate direction is fixed on the substrate. Mentioned on the first positioning part.
  • the substrate is provided with a second positioning portion extending from a surface close to the second metal shell toward the direction of the second metal shell, and the surface of the second metal shell facing the substrate direction is fixed on the substrate. Mentioned on the second positioning part.
  • the substrate is a circuit board
  • the ASIC chip is electrically connected to the circuit board
  • the MEMS chip is electrically connected to the MEMS chip through metal wires.
  • the housing further includes a third metal shell fixed on the substrate, and the third metal shell is arranged in the gap between the first shell and sleeved between the first metal shell and the Between the second metal shell, and the third metal shell, the first metal shell and the substrate are surrounded to form a second shell gap, and the third metal shell, the second metal shell and the substrate are surrounded to form a third shell
  • the third metal shell is provided with a through hole connecting the second shell gap and the third shell gap.
  • the third metal shell includes a plurality of third metal shells, and the plurality of third metal shells are sleeved at intervals, and the through holes are provided on the plurality of metal shells.
  • the expanded air in the gap of the first shell can be transferred to the receiving space through the vent hole during the reflow soldering installation process, and the sound can be picked up.
  • the hole is led out, thereby avoiding the situation that the second metal shell is expanded and caused to fall off.
  • Figure 1 is a schematic diagram of the structure of the MEMS microphone of the present invention.
  • Figure 2 is a schematic diagram of the exploded structure of the MEMS microphone of the present invention.
  • Fig. 3 is a schematic cross-sectional structure diagram of the MEMS microphone of the present invention along the direction A-A in Fig. 1;
  • Figure 4 is a schematic cross-sectional view of another embodiment of the utility model.
  • a MEMS microphone of the present invention includes a housing 10 having a housing space 110, and a MEMS chip 15 and an ASIC chip 14 housed in the housing space 110.
  • the housing 10 includes a MEMS chip 15 for mounting.
  • the substrate 13 of the ASIC chip 14, the first metal shell 11 surrounding the substrate 13 to form an accommodation space 110, and the second metal shell 12 spaced apart from the first metal shell 11, and the second metal shell 12 is fixed to the substrate 13
  • a first shell gap 120 is formed on and surrounded by the substrate 13 and the first metal shell 11.
  • the substrate 13 is provided with a pickup hole 131
  • the MEMS chip 15 is provided with a communication hole 151 that communicates the pickup hole 131 and the accommodating space 110.
  • the first metal shell 11 is provided with a vent 111 connecting the receiving space 110 and the first shell gap 120.
  • the MEMS microphone of the present invention is provided with the second metal shell 12 outside the first metal shell 11, so that the expanded air in the first shell gap 120 can be passed through the vent hole during the reflow soldering installation process.
  • 111 is transmitted to the receiving space 110 and is led out through the vent hole 151 and the sound pickup hole 131, thereby preventing the second metal shell 12 from falling off due to expansion.
  • the arrangement of the first metal shell 11 and the second metal shell 12 in the present invention is mainly caused by the first shell gap 120 between the first metal shell 11 and the second metal shell 12 during the heating process. To a certain degree of buffering effect, so as to prevent the second metal shell 12 from falling off when the external temperature rises.
  • the shape, size, specific position and number of the vent holes 111 in the present invention can be differently limited according to actual conditions.
  • the substrate 13 is provided with a first positioning portion 132 extending from the surface close to the first metal shell 11 toward the first metal shell 11, and the surface of the first metal shell 11 facing the substrate 13 is fixed to the first metal shell 11. Locating part 132 on.
  • the first metal shell 11 and the first positioning portion 132 are physically connected by glue, and the connection between the first metal shell 11 and the first positioning portion 132 is a fully sealed connection, thereby ensuring the accommodating space 110 Isolation from the external environment.
  • the substrate 13 is provided with a second positioning portion 133 extending from the surface of the second metal shell 12 toward the second metal shell 12, and the surface of the second metal shell 12 facing the substrate 13 is fixed to the second metal shell 12. Locating part 133 on.
  • the second metal shell 12 and the second positioning portion 133 are physically connected by glue, and the connection between the second metal shell 12 and the second positioning portion 133 is a fully sealed connection, thereby ensuring the first shell The air tightness of the gap 120.
  • the substrate 13 is a circuit board
  • the ASIC chip 14 is electrically connected to the circuit board
  • the MEMS chip 15 is electrically connected to the MEMS chip 15 through metal wires.
  • the housing 10 further includes a third metal shell 16 fixed on the substrate 13, and the third metal shell 16 is disposed on the first A shell gap 120 is sleeved between the first metal shell 11 and the second metal shell 12 at intervals, and the third metal shell 16, the first metal shell 11 and the substrate 13 are surrounded to form a second shell gap 121, A third shell gap 122 is enclosed between the third metal shell 16, the second metal shell 12 and the substrate 13, and the third metal shell 16 is provided with a through hole 161 penetrating the second shell gap 121 and the third shell gap 122.
  • the third metal shell 16 includes a plurality of third metal shells 16 and the plurality of third metal shells 16 are sleeved at intervals, and the plurality of metal shells 16 are provided with through holes 161. That is to say, the present invention is not limited to the use of two layers or metal shells for buffering the shell gap, and the setting of metal shells can also be increased according to specific needs to meet the needs of more situations.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)

Abstract

本实用新型提供了一种MEMS麦克风。本实用新型的MEMS麦克风，包括具有收容空间的壳体以及收容于收容空间内的MEMS芯片和ASIC芯片，壳体包括用于安装MEMS芯片和ASIC芯片的基板、与基板围设形成收容空间的第一金属壳以及间隔套设于第一金属壳外的第二金属壳，第二金属壳固定于基板上并与基板以及第一金属壳形成第一壳间隙，基板上设有与MEMS芯片相适配的拾音孔，第一金属壳上设有连通收容空间与第一壳间隙的通气孔。通过在第一金属壳外设置第二金属壳，可以在回流焊安装的过程中将壳间隙中的膨胀空气通过通气孔传递至收容空间中，并通过拾音孔导出，从而避免了第二金属壳受膨胀而导致脱落的情况。

Description

MEMS麦克风 技术领域
本实用新型涉及电声转换技术领域，尤其涉及一种MEMS麦克风。
 背景技术
MEMS麦克风是基于MEMS（微型机电系统）技术制造的电能换声器，其具有体积小、频响特性好、噪声低等特点。随着电子设备的小巧化、薄型化发展，MEMS麦克风被越来越广泛地运用到电子设备中。
现有技术中，MEMS麦克风的安装一般均采用高温回流焊方式焊接于线路板上，在焊接过程中由于高温作用容易导致外壳脱落现象。
 技术问题
本实用新型的目的在于提供一种MEMS麦克风，旨在解决MEMS麦克风安装过程中外壳容易脱落的问题。
 技术解决方案
本实用新型的技术方案如下：
本实用新型一种MEMS麦克风，包括具有收容空间的壳体以及收容于所述收容空间内的MEMS芯片和ASIC芯片，所述壳体包括用于安装所述MEMS芯片和所述ASIC芯片的基板、与所述基板围设形成所述收容空间的第一金属壳以及间隔套设于所述第一金属壳外的第二金属壳，所述第二金属壳固定于所述基板并与所述基板以及所述第一金属壳围设形成第一壳间隙的第二金属壳，所述基板上设有与所述MEMS芯片对应的拾音孔，所述第一金属壳上设有连通所述收容空间与所述第一壳间隙的通气孔。
优选地，所述基板上设有自靠近所述第一金属壳的表面朝向所述第一金属壳方向延伸的第一定位部，所述第一金属壳朝向所述基板方向的表面固定于所述第一定位部上。
优选地，所述基板上设有自靠近所述第二金属壳的表面朝向所述第二金属壳方向延伸的第二定位部，所述第二金属壳朝向所述基板方向的表面固定于所述第二定位部上。
优选地，所述基板为电路板，所述ASIC芯片与所述电路板电连接，所述MEMS芯片通过金属引线与所述MEMS芯片电连接。
优选地，所述壳体还包括固定于所述基板上的第三金属壳，所述第三金属壳设于所述第一壳间隙内且间隔套设于所述第一金属壳与所述第二金属壳之间，且所述第三金属壳、第一金属壳与基板之间围设形成第二壳间隙，第三金属壳、第二金属壳与基板之间围设形成第三壳间隙，所述第三金属壳上设有连通所述第二壳间隙与第三壳间隙的贯通孔。
优选地，所述第三金属壳包括若干个，若干所述第三金属壳之间相互间隔套设，若干所述金属壳上均设有所述贯通孔。
 有益效果
本实用新型的有益效果在于：
本实用新型中的MEMS麦克风通过在第一金属壳外设置第二金属壳，可以在回流焊安装的过程中将第一壳间隙中的膨胀空气通过通气孔传递至收容空间中，并通过拾音孔导出，从而避免了第二金属壳受膨胀而导致脱落的情况。
 附图说明
图1为本实用新型MEMS麦克风的结构示意图；
图2为本实用新型MEMS麦克风的分解结构示意图；
图3为本实用新型MEMS麦克风沿图1中A-A方向的的剖视结构示意图；
图4位本实用新型另一实施例的剖视结构示意图。
 本发明的实施方式
下面结合附图和实施方式对本实用新型作进一步说明。
请参阅图1-3，本实用新型一种MEMS麦克风，包括具有收容空间110的壳体10以及收容于收容空间110内的MEMS芯片15和ASIC芯片14，壳体10包括用于安装MEMS芯片15和ASIC芯片14的基板13、与基板13围设形成收容空间110的第一金属壳11以及间隔套设于第一金属壳11外的第二金属壳12，第二金属壳12固定于基板13上并与基板13以及第一金属壳11围设形成第一壳间隙120，基板13上设有拾音孔131，MEMS芯片15上设有连通拾音孔131与收容空间110的连通孔151，第一金属壳11上设有连通收容空间110与第一壳间隙120的通气孔111。
相较于现有技术，本实用新型中的MEMS麦克风通过在第一金属壳11外设置第二金属壳12，可以在回流焊安装的过程中将第一壳间隙120中的膨胀空气通过通气孔111传递至收容空间110中，并通过通气孔151以及拾音孔131导出，从而避免了第二金属壳12受膨胀而导致脱落的情况。
需要说明的是，本实用新型中的第一金属壳11以及第二金属壳12的设置主要是通过第一金属壳11与第二金属壳12之间的第一壳间隙120在加热过程中起到一定缓冲作用，从而避免第二金属壳12在外界温度升高的情况下不易脱落。
本实用新型中的通气孔111形状、大小、具体位置以及数量可以根据实际情况进行不同的限定。
在本实施例中，基板13上设有自靠近第一金属壳11的表面朝向第一金属壳11方向延伸的第一定位部132，第一金属壳11朝向基板13方向的表面固定于第一定位部132上。本实用新型中的第一金属壳11与第一定位部132之间通过胶水进行物理连接，且第一金属壳11与第一定位部132的连接处为全密封连接，从而保证了收容空间110与外界环境的隔离。
在本实施例中，基板13上设有自靠近第二金属壳12的表面朝向第二金属壳12方向延伸的第二定位部133，第二金属壳12朝向基板13方向的表面固定于第二定位部133上。本实用新型中的第二金属壳12与第二定位部133之间通过胶水进行物理连接，且第二金属壳12与第二定位部133的连接处为全密封连接，从而保证了第一壳间隙120的气密性。
在本实施例中，基板13为电路板，ASIC芯片14与电路板电连接，MEMS芯片15通过金属引线与MEMS芯片15电连接。请进一步参阅图4，在本实用新型的另一实施例中，与上述实施例不同的是，壳体10还包括固定于基板13上的第三金属壳16，第三金属壳16设于第一壳间隙120内且间隔套设于第一金属壳11与第二金属壳12之间，且第三金属壳16、第一金属壳11与基板13之间围设形成第二壳间隙121，第三金属壳16、第二金属壳12与基板13之间围设形成第三壳间隙122，第三金属壳16上设有贯通第二壳间隙121与第三壳间隙122的贯通孔161。
在本实施例中，第三金属壳16包括若干个，若干第三金属壳16之间相互间隔套设，若干金属壳16上均设有贯通孔161。即本实用新型并不局限于使用两层或金属壳进行壳间隙的缓冲，也可以根据具体需求增加金属壳的设置，以适应更多情况的需求。
以上的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (6)

  1. 一种MEMS麦克风，包括具有收容空间的壳体以及收容于所述收容空间内的MEMS芯片和ASIC芯片，其特征在于，所述壳体包括用于安装所述MEMS芯片和所述ASIC芯片的基板、与所述基板围设形成所述收容空间的第一金属壳以及间隔套设于所述第一金属壳外的第二金属壳，所述第二金属壳固定于所述基板并与所述基板以及所述第一金属壳围设形成第一壳间隙，所述基板上设有与所述MEMS芯片对应的拾音孔，所述第一金属壳上设有连通所述收容空间与所述第一壳间隙的通气孔。
  2. 根据权利要求1所述的MEMS麦克风，其特征在于，所述基板上设有自靠近所述第一金属壳的表面朝向所述第一金属壳方向延伸的第一定位部，所述第一金属壳朝向所述基板方向的表面固定于所述第一定位部上。
  3. 根据权利要求1所述的MEMS麦克风，其特征在于，所述基板上设有自靠近所述第二金属壳的表面朝向所述第二金属壳方向延伸的第二定位部，所述第二金属壳朝向所述基板方向的表面固定于所述第二定位部上。
  4. 根据权利要求1所述的MEMS麦克风，其特征在于，所述基板为电路板，所述ASIC芯片与所述电路板电连接，所述MEMS芯片通过金属引线与所述MEMS芯片电连接。
  5. 根据权利要求1所述的MEMS麦克风，其特征在于，所述壳体还包括固定于所述基板上的第三金属壳，所述第三金属壳设于所述第一壳间隙内且间隔套设于所述第一金属壳与所述第二金属壳之间，所述第三金属壳、第一金属壳与基板之间围设形成第二壳间隙，第三金属壳、第二金属壳与基板之间围设形成第三壳间隙，所述第三金属壳上设有连通所述第二壳间隙与第三壳间隙的贯通孔。
  6. 根据权利要求5所述的MEMS麦克风，其特征在于，所述第三金属壳包括若干个，若干所述第三金属壳之间相互间隔套设，若干所述金属壳上均设有所述贯通孔。
PCT/CN2020/079623 2020-03-05 2020-03-17 Mems麦克风 WO2021174587A1 (zh)

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CN202020264558.1 2020-03-05

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113194369B (zh) * 2021-03-25 2022-10-14 闻泰通讯股份有限公司 一种麦克风

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201571176U (zh) * 2009-11-20 2010-09-01 歌尔声学股份有限公司 一种mems麦克风
US20190014421A1 (en) * 2017-05-25 2019-01-10 Knowles Electronics, Llc Microphone package
CN109641739A (zh) * 2016-07-27 2019-04-16 美商楼氏电子有限公司 微机电系统（mems）装置封装
CN209402725U (zh) * 2018-12-18 2019-09-17 歌尔科技有限公司 产品外壳及mems麦克风
CN110868682A (zh) * 2019-12-18 2020-03-06 青岛歌尔智能传感器有限公司 一种mems麦克风

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201571176U (zh) * 2009-11-20 2010-09-01 歌尔声学股份有限公司 一种mems麦克风
CN109641739A (zh) * 2016-07-27 2019-04-16 美商楼氏电子有限公司 微机电系统（mems）装置封装
US20190014421A1 (en) * 2017-05-25 2019-01-10 Knowles Electronics, Llc Microphone package
CN209402725U (zh) * 2018-12-18 2019-09-17 歌尔科技有限公司 产品外壳及mems麦克风
CN110868682A (zh) * 2019-12-18 2020-03-06 青岛歌尔智能传感器有限公司 一种mems麦克风

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