WO2021169012A1 - 一种ito膜功能片以及电容屏卡组件 - Google Patents

一种ito膜功能片以及电容屏卡组件 Download PDF

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Publication number
WO2021169012A1
WO2021169012A1 PCT/CN2020/086394 CN2020086394W WO2021169012A1 WO 2021169012 A1 WO2021169012 A1 WO 2021169012A1 CN 2020086394 W CN2020086394 W CN 2020086394W WO 2021169012 A1 WO2021169012 A1 WO 2021169012A1
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WIPO (PCT)
Prior art keywords
silver paste
driving
sensing
wiring area
board
Prior art date
Application number
PCT/CN2020/086394
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English (en)
French (fr)
Inventor
凌洁
蒲彩林
雷俊
Original Assignee
成都吉锐时代触摸技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN202020212206.1U external-priority patent/CN211506445U/zh
Priority claimed from CN202010119612.8A external-priority patent/CN111240537A/zh
Application filed by 成都吉锐时代触摸技术有限公司 filed Critical 成都吉锐时代触摸技术有限公司
Publication of WO2021169012A1 publication Critical patent/WO2021169012A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

Definitions

  • the present invention relates to the technical field of touch screens, in particular to an ITO film (Film) functional sheet and a capacitive screen card assembly.
  • ITO film Fink
  • Capacitive screen technology uses the current induction of the human body to work.
  • the capacitive screen is a four-layer composite glass screen, divided into two types of structure, one is the capacitive screen of G+G structure, and its structure is a glass cover plate attached to the ITO glass functional sheet, the front and back of the ITO glass functional sheet
  • the sensing layer and the driving layer are respectively etched on both sides.
  • the side of the glass functional sheet attached to the glass cover is the sensing layer, and the other side is the driving layer, which is the receiving and sending functions.
  • the other is a capacitive screen with G+F+F structure.
  • Its structure is a glass cover plate laminated with an ITO film functional film.
  • the ITO film functional film is formed by bonding two PET films, namely the sensing layer PET film and
  • the driving layer is PET film, the sensing layer is on the top, and the driving layer is on the bottom.
  • the capacitive screens of these two structures have the same principle of action, and the substrate structures are different.
  • connection structure of the capacitive screen is generally as follows: pads, silver paste lines and concentrated binding areas are set on the edge of the ITO glass functional sheet or the ITO film functional sheet.
  • the geometric patterns arranged vertically and horizontally on the chip are connected, on the other hand, they are connected to the binding area by silver paste lines, and then the flexible FPC board and the binding area can be connected by thermocompression.
  • the purpose of the present invention is to overcome the above-mentioned problems in the prior art and provide an ITO film functional sheet.
  • the technical problem to be solved by the present invention is to further reduce the frame width of the capacitive screen.
  • An ITO film functional sheet comprising a sensing layer and a driving layer that are bonded together, and is characterized in that a plurality of driving electrodes parallel to each other are uniformly arranged on the driving layer, and a plurality of mutually parallel driving electrodes are uniformly arranged on the sensing layer.
  • Parallel sensing electrodes; a driving silver paste wiring area is integrally formed on the longitudinal side of the driving layer, and a plurality of driving silver paste pads and a plurality of driving silver paste lines are arranged in the driving silver paste wiring area.
  • the silver paste pads are respectively connected to a plurality of driving electrodes through a plurality of driving silver paste lines; one of the lateral sides of the sensing layer is integrally formed with a sensing silver paste wiring area, and a plurality of sensing silver paste wiring areas are provided
  • the sensing silver paste pads and a plurality of sensing silver paste lines are respectively connected to the plurality of sensing electrodes through the plurality of sensing silver paste lines.
  • the driving silver paste wiring area and the sensing silver paste wiring area are both rectangular structures.
  • Both the driving silver paste wiring area and the sensing silver paste wiring area are provided with hollow areas, the driving silver paste pad is arranged on the side of the hollow area in the driving silver paste wiring area, and the silver paste lines are driven around The hollow area is arranged; the induction silver paste pad is arranged on the side of the hollow area in the induction silver paste wiring area, and the induction silver paste line is arranged around the hollow area.
  • the number of the driving silver paste wiring areas is at least two, and the driving silver paste wiring areas in the driving silver paste wiring areas are all connected to a plurality of driving electrodes.
  • the number of the sensing silver paste wiring areas is at least two, and the sensing silver paste lines in the sensing silver paste wiring areas are all connected to a plurality of sensing electrodes.
  • the two longitudinal sides of the driving layer are integrally formed with driving silver paste wiring areas, and the driving silver paste lines in the driving silver paste wiring areas on the two longitudinal sides are all connected to the driving electrodes.
  • the main improvement of the present invention is to extend its edge on the basis of the existing ITO film functional sheet, and transfer the existing silver paste traces and bonding pads to the extended induction silver paste
  • the wiring area and the driving silver paste wiring area can effectively reduce the frame width of the capacitive screen.
  • the ITO film functional sheet is made of flexible foldable material
  • the driving silver paste wiring area integrally formed on the drive layer and the sensing silver paste wiring area integrally formed on the sensing layer are also flexible foldable materials.
  • the silver paste lines and pads can be folded and hidden by folding the sensing silver paste wiring area and driving the silver paste wiring area, so as to achieve the purpose of reducing the frame of the capacitive screen.
  • the driving silver paste wiring area and the sensing silver paste wiring area are both rectangular structures. This structure facilitates the centralized arrangement of the silver paste lines and the bonding pads, and is beneficial for centralized bonding with the flexible FPC board.
  • the present invention is provided with hollow areas in both the driving silver paste wiring area and the sensing silver paste wiring area.
  • the advantage of this structure is that it can reduce the amount of functional sheet material and is beneficial to reducing product production costs.
  • the number of driving silver paste wiring areas is at least two, and the driving silver paste wiring areas in the driving silver paste wiring areas are all connected to a plurality of driving electrodes. This structure is beneficial to drive the folding and hiding of the silver paste wiring area.
  • the number of sensing silver paste wiring areas is at least two, and the sensing silver paste wiring areas in the sensing silver paste wiring areas are all connected to multiple sensing electrodes. This structure is conducive to the folding and hiding of the induction silver paste wiring area.
  • the two longitudinal sides of the driving layer in the present invention are integrally formed with driving silver paste wiring areas, and the driving silver paste lines in the driving silver paste wiring areas on the two longitudinal sides are connected to the driving electrodes.
  • This structure makes the functional chip a dual-drive functional chip, which is suitable for large-size capacitive screens of 27 inches and above, and can still have a narrow frame and ensure high touch accuracy when used in large-size capacitive screens.
  • the present invention is applicable to various types of capacitive screens, such as flat capacitive screens, curved capacitive screens, spherical capacitive screens, and various irregular structure capacitive screens.
  • the purpose of the present invention is to overcome the above-mentioned problems in the prior art and provide a capacitive screen card assembly.
  • the technical problem to be solved by the present invention is to further reduce the frame width of the capacitive screen.
  • a capacitive screen card assembly which is characterized in that it includes a glass cover plate, a PCB control board, an A adapter board, a B adapter board, an FPC (Flexible Printed Circuit) drive board, an FPC sensor board and an ITO film functional film.
  • the glass cover plate is adhesively connected to the ITO film functional sheet.
  • the ITO film functional sheet includes a sensing layer and a driving layer that are bonded together. A plurality of driving electrodes parallel to each other are uniformly arranged on the driving layer.
  • the sensing layer A plurality of sensing electrodes parallel to each other are uniformly arranged on the upper surface; a driving silver paste wiring area is integrally formed on the longitudinal side of the driving layer, and a plurality of driving silver paste pads and a plurality of driving electrodes are arranged in the driving silver paste wiring area.
  • Silver paste line, a plurality of driving silver paste pads are respectively connected to a plurality of driving electrodes through a plurality of driving silver paste lines, the two ends of the FPC driving board are respectively connected to the A transfer board and the driving silver paste pad; the sensing layer
  • An induction silver paste wiring area is integrally formed on one of the lateral sides.
  • the induction silver paste lines are respectively connected to a plurality of induction electrodes, the two ends of the FPC induction board are respectively connected to the B adapter board and the induction silver paste pad, and the A adapter board and the B adapter board are both connected to the PCB control board.
  • the FPC driving board and the FPC sensing board are both provided with a plurality of metal pads and a plurality of silver wires respectively connected to the metal pads, and the FPC driving board is connected to the driving silver paste pads by thermocompression through the metal pads, The FPC induction board is connected to the induction silver paste pad by thermocompression through a metal pad.
  • the driving silver paste wiring area and the sensing silver paste wiring area are both rectangular structures.
  • Both the driving silver paste wiring area and the sensing silver paste wiring area are provided with hollow areas, the driving silver paste pad is arranged on the side of the hollow area in the driving silver paste wiring area, and the silver paste lines are driven around The hollow area is arranged; the induction silver paste pad is arranged on the side of the hollow area in the induction silver paste wiring area, and the induction silver paste line is arranged around the hollow area.
  • the number of the driving silver paste wiring areas is at least two.
  • the driving silver paste lines in the driving silver paste wiring areas are all connected to a plurality of driving electrodes, and each driving silver paste wiring area is correspondingly connected to an FPC driving board and An A adapter board.
  • the number of the sensing silver paste wiring areas is at least two, the sensing silver paste lines in the sensing silver paste wiring areas are all connected to multiple sensing electrodes, and each sensing silver paste wiring area is correspondingly connected to an FPC sensing board and A B adapter board.
  • the two longitudinal sides of the driving layer are integrally formed with driving silver paste wiring areas, and the driving silver paste lines in the driving silver paste wiring areas on the two longitudinal sides are all connected to the driving electrodes.
  • the main innovation of the present invention is to improve the connection structure of the existing functional film and the FPC board, which is embodied in the extension of the edge of the ITO film functional film, and the wiring and binding of the existing silver paste Use silver paste pads to transfer to the extended induction silver paste trace area and drive silver paste trace area, and transfer the existing FPC board and ITO film functional sheet edge connection structure to the induction silver paste trace area and Drive the silver paste wiring area connection, so as to achieve the purpose of effectively reducing the width of the capacitive screen frame.
  • the ITO film functional sheet is made of flexible foldable material
  • the driving silver paste wiring area integrally formed on the drive layer and the sensing silver paste wiring area integrally formed on the sensing layer are also flexible foldable materials.
  • the silver paste lines and pads can be folded and hidden by folding the sensing silver paste wiring area and driving the silver paste wiring area, so as to achieve the purpose of reducing the frame of the capacitive screen.
  • the pads remain on the functional chip, and in the present invention, even the pads are It is folded and hidden, that is, there is no pad on the ITO film in the area corresponding to the glass cover. It can be said that the present invention can achieve a narrower frame, and its technical effect is better than the prior art.
  • the FPC driving board of the present invention is connected to the driving silver paste pad by thermal compression bonding through metal pads, and the FPC sensing board is connected to the induction silver paste pad by thermocompression bonding via metal pads.
  • the advantage is to ensure the stability of the connection. sex.
  • the driving silver paste wiring area and the sensing silver paste wiring area are both rectangular structures. This structure facilitates the centralized arrangement of the silver paste lines and the pads, and is beneficial for centralized binding with the flexible FPC board.
  • the present invention is provided with hollow areas in both the driving silver paste wiring area and the sensing silver paste wiring area.
  • the advantage of this structure is that it can reduce the amount of material of the functional sheet, which is beneficial to reduce the production cost of the product.
  • the number of driving silver paste wiring areas in the present invention is at least two, and the driving silver paste wiring areas in the driving silver paste wiring areas are all connected to multiple driving electrodes, and each driving silver paste wiring area is correspondingly connected to one FPC Driver board and an A adapter board. This structure is beneficial to drive the folding and hiding of the silver paste wiring area.
  • sensing silver paste wiring areas there are at least two sensing silver paste wiring areas.
  • the sensing silver paste lines in the sensing silver paste wiring area are all connected to multiple sensing electrodes, and each sensing silver paste wiring area is connected to one FPC.
  • Induction board and a B adapter board This structure is conducive to the folding and hiding of the induction silver paste wiring area.
  • the two longitudinal sides of the driving layer in the present invention are integrally formed with driving silver paste wiring areas, and the driving silver paste lines in the driving silver paste wiring areas on the two longitudinal sides are connected to the driving electrodes.
  • This structure makes the functional chip a dual-drive functional chip, which is suitable for large-size capacitive screens of 27 inches and above, and can still have a narrow frame and ensure high touch accuracy when used in large-size capacitive screens.
  • the present invention is applicable to various types of capacitive screens, such as flat capacitive screens, curved capacitive screens, spherical capacitive screens, and various irregular structure capacitive screens.
  • Figure 1 is a schematic diagram of the structure of Embodiment 1;
  • Figure 2 is a transverse cross-sectional view of Figure 1;
  • Figure 3 is a longitudinal sectional view of Figure 1;
  • Embodiment 5 is a schematic diagram of the structure of the driving layer in Embodiment 1;
  • Embodiment 6 is a schematic diagram of the structure of Embodiment 2.
  • FIG. 7 is a schematic diagram of the structure of Embodiment 3.
  • FIG. 8 is a schematic diagram of the structure of Embodiment 4.
  • Figure 9 is a transverse cross-sectional view of Figure 8.
  • Embodiment 10 is a schematic diagram of the structure of Embodiment 5.
  • Embodiment 11 is a schematic diagram of the structure of Embodiment 6;
  • Embodiment 12 is a schematic diagram of the structure of Embodiment 7;
  • Example 13 is a schematic diagram of the structure of the ITO film functional sheet in Example 7.
  • Figure 14 is a transverse cross-sectional view of Figure 12;
  • Figure 15 is a longitudinal sectional view of Figure 12;
  • FIG. 17 is a schematic diagram of the structure of the driving layer in Embodiment 7;
  • Embodiment 8 is a schematic diagram of the structure of Embodiment 8.
  • Example 19 is a schematic diagram of the structure of the ITO film functional sheet in Example 8.
  • Example 21 is a schematic diagram of the structure of the ITO film functional sheet in Example 9;
  • Figure 23 is a transverse cross-sectional view of Figure 22;
  • the markings in the figure are: 1, sensing layer, 2, driving layer, 3, driving electrode, 4, sensing electrode, 5, driving the silver paste wiring area, 6, driving the silver paste pad, 7, driving the silver paste line, 8 , Induction silver paste wiring area, 9, induction silver paste pad, 10, induction silver paste line, 11, hollow area, 12, OCA optical glue, 13, glass cover, 14, A transfer board, 15, B adapter board, 16, FPC drive board, 17, FPC sensor board, 18, ITO film functional film, 19, PCB control board.
  • the present invention discloses an ITO film functional sheet, which comprises a sensing layer 1 and a driving layer 2 which are fixed into a whole by OCA optical glue 12.
  • a plurality of driving electrodes 3 parallel to each other are uniformly arranged on the driving layer 2.
  • a plurality of sensing electrodes 4 parallel to each other are uniformly arranged on the sensing layer 1.
  • the driving electrodes 3 are arranged horizontally, and the sensing electrodes 4 are arranged vertically, and preferably the sensing electrodes 4 and the driving electrodes 3 are arranged vertically and horizontally; the driving layer A driving silver paste wiring area 5 is integrally formed on the longitudinal side of 2; a plurality of driving silver paste pads 6 and a plurality of driving silver paste lines 7 are provided in the driving silver paste wiring area 5, and a plurality of driving silver paste pads are provided.
  • sensing silver paste wiring area 8 There are a plurality of sensing silver paste pads 9 and a plurality of sensing silver paste lines 10, and the plurality of sensing silver paste pads 9 are respectively connected to the plurality of sensing electrodes 4 through the plurality of sensing silver paste lines 10.
  • the sensing layer 1 and the driving layer 2 are both flexible and foldable PET films, and the driving electrodes 3 and the sensing electrodes 4 are all conventional conventional technologies, and are generally geometric patterns engraved on the PET film by laser lithography.
  • the driving silver paste wiring area 5 is bonded and connected to the flexible FPC board through the driving silver paste pad 6, and the sensing silver paste wiring area 8 is bonded and connected to the flexible FPC board through the sensing silver paste pad 9.
  • the driving silver paste pad 6 and the sensing silver paste pad 9 preferably have a rectangular structure with a length and width of 2mm*0.4mm, which are used for thermal bonding and bonding with a flexible FPC board.
  • This embodiment discloses an ITO film functional sheet, as shown in Figs. 1-3, comprising a sensing layer 1 and a driving layer 2 which are fixed by OCA optical glue 12 into a whole.
  • the driving layer 2 is evenly provided with a plurality of Drive electrodes 3 parallel to each other, the sensing layer 1 is uniformly provided with a plurality of parallel sensing electrodes 4, preferably the drive electrodes 3 are arranged horizontally, the sensing electrodes 4 are arranged vertically, and preferably the sensing electrodes 4 and the drive electrodes 3 Arrange vertically and horizontally; as shown in Figure 4-5;
  • a driving silver paste wiring area 5 is integrally formed on the longitudinal edge of the driving layer 2, and a plurality of driving silver paste pads are arranged in the driving silver paste wiring area 5 6 and a plurality of driving silver paste lines 7, a plurality of driving silver paste pads 6 are respectively connected to a plurality of driving electrodes 3 through a plurality of driving silver paste lines 7;
  • one of the lateral sides of the sensing layer 1
  • the driving silver paste wiring area 5 is integrally formed on one of the longitudinal edges of the driving layer 2, that is, the functional chip is a single-drive functional chip, which is suitable for capacitive screens with a size of 27 inches or less.
  • the driving silver paste wiring area 5 and the sensing silver paste wiring area 8 are preferably rectangular structures.
  • the length of the driving silver paste wiring area 5 is substantially the same as the length of the longitudinal side of the driving layer 2, and the length of the sensing silver paste wiring area 8 is substantially the same as the length of the longitudinal side of the sensing layer 1.
  • the driving silver paste pad 6 is arranged in the middle of the other side corresponding to the longitudinal side of the driving layer 2, and the sensing silver paste pad 9 is arranged in the middle of the other side corresponding to the lateral side of the sensing layer 1.
  • This embodiment discloses an ITO film functional sheet, which includes a sensing layer 1 and a driving layer 2 which are fixed into a whole by OCA optical glue 12.
  • a plurality of driving electrodes 3 parallel to each other are uniformly arranged on the driving layer 2.
  • the sensing layer 1 is uniformly provided with a plurality of sensing electrodes 4 parallel to each other.
  • the driving electrodes 3 are arranged horizontally, and the sensing electrodes 4 are arranged vertically, and preferably the sensing electrodes 4 and the driving electrodes 3 are arranged crosswise and crosswise;
  • a driving silver paste wiring area 5 is integrally formed on the longitudinal side of the layer 2, and a plurality of driving silver paste pads 6 and a plurality of driving silver paste lines 7 are arranged in the driving silver paste wiring area 5, and a plurality of driving silver paste welding
  • the disk 6 is respectively connected to a plurality of driving electrodes 3 through a plurality of driving silver paste lines 7; one of the lateral sides of the sensing layer 1 is integrally formed with a sensing silver paste wiring area 8, and the sensing silver paste wiring area 8 is provided There are a plurality of sensing silver paste pads 9 and a plurality of sensing silver paste lines 10, and the plurality of sensing silver paste pads 9 are respectively connected to the plurality of sensing electrodes 4 through the plurality of sensing silver paste lines 10.
  • the driving silver paste wiring area 5 is integrally formed on one of the longitudinal edges of the driving layer 2, that is, the functional chip is a single-drive functional chip, which is suitable for sizes under 27 inches Capacitive screen.
  • the driving silver paste wiring area 5 and the sensing silver paste wiring area 8 are preferably rectangular structures. Among them, the length of the driving silver paste wiring area 5 is less than the length of the longitudinal side of the driving layer 2, and the length of the sensing silver paste wiring area 8 is less than the length of the longitudinal side of the sensing layer 1; There is a protruding area on the longitudinal side of 2 and a protruding area on the lateral side of the sensing layer 1.
  • the driving silver paste pad 6 is arranged in the middle of the other side corresponding to the longitudinal side of the driving layer 2, and the sensing silver paste pad 9 is arranged in the middle of the other side corresponding to the lateral side of the sensing layer 1.
  • a hollow area 11 is also provided in the driving silver paste wiring area 5 and in the sensing silver paste wiring area 8, and the driving silver paste pad 6 is provided in the driving silver paste wiring area 5.
  • the driving silver paste line 7 is arranged around the hollow area 11; the induction silver paste pad 9 is arranged on the side of the hollow area 11 in the induction silver paste wiring area 8, and the induction silver paste line 10 Set around the hollow area 11.
  • This embodiment discloses an ITO film functional sheet, which includes a sensing layer 1 and a driving layer 2 which are fixed into a whole by OCA optical glue 12.
  • a plurality of driving electrodes 3 parallel to each other are uniformly arranged on the driving layer 2.
  • the sensing layer 1 is uniformly provided with a plurality of sensing electrodes 4 parallel to each other.
  • the driving electrodes 3 are arranged horizontally, and the sensing electrodes 4 are arranged vertically, and preferably the sensing electrodes 4 and the driving electrodes 3 are arranged crosswise and crosswise;
  • a driving silver paste wiring area 5 is integrally formed on the longitudinal side of the layer 2, and a plurality of driving silver paste pads 6 and a plurality of driving silver paste lines 7 are arranged in the driving silver paste wiring area 5, and a plurality of driving silver paste welding
  • the disk 6 is respectively connected to a plurality of driving electrodes 3 through a plurality of driving silver paste lines 7; one of the lateral sides of the sensing layer 1 is integrally formed with a sensing silver paste wiring area 8, and the sensing silver paste wiring area 8 is provided There are a plurality of sensing silver paste pads 9 and a plurality of sensing silver paste lines 10, and the plurality of sensing silver paste pads 9 are respectively connected to the plurality of sensing electrodes 4 through the plurality of sensing silver paste lines 10.
  • the driving silver paste wiring area 5 is integrally formed on one of the longitudinal edges of the driving layer 2, that is, the functional chip is a single-drive functional chip, which is suitable for sizes under 27 inches Capacitive screen.
  • the number of the driving silver paste wiring area 5 is at least two, the sum of the number of all driving silver paste lines 7 in the driving silver paste wiring area 5 is equal to the number of driving electrodes 3, and all the driving silver paste wiring areas 5
  • the driving silver paste lines 7 are connected to a plurality of driving electrodes 3 in a one-to-one correspondence.
  • the number of the sensing silver paste wiring areas 8 is at least two, the sum of the number of all sensing silver paste lines 10 in the sensing silver paste wiring area 8 is equal to the number of sensing electrodes 4, and the number of sensing silver paste wiring areas 8
  • the sensing silver paste line 10 is connected to a plurality of sensing electrodes 4 in a one-to-one correspondence.
  • both the driving silver paste wiring area 5 and the sensing silver paste wiring area 8 are preferably rectangular structures, and the size is preferably such that the corresponding silver paste lines and pads can be provided. From the perspective of FIG. 7, it is equivalent to having multiple protruding areas on the longitudinal side of the driving layer 2 and multiple protruding areas on the lateral side of the sensing layer 1. This structure makes the volume of the driving silver paste wiring area 5 and the sensing silver paste wiring area 8 smaller, which is beneficial to drive the silver paste wiring area 5 and the sensing silver paste wiring area 8, and it is also beneficial to further reduce the amount of material. .
  • the two longitudinal sides of the drive layer 2 are integrally formed with drive silver paste wiring areas 5, that is, the functional film is a dual-drive functional film, which is suitable for large sizes of 27 inches and above. Size capacitive screen.
  • All the driving silver paste lines 7 in the driving silver paste wiring area 5 on the two longitudinal sides are connected to the driving electrodes 3. Specifically, the two ends of each driving silver paste line 7 are connected to the two longitudinal sides respectively.
  • the driving silver paste lines 7 in the driving silver paste wiring area 5 are connected.
  • the two longitudinal sides of the drive layer 2 are integrally formed with drive silver paste wiring areas 5, that is, the functional chip is a dual-drive functional chip, which is suitable for large-size capacitors of 27 inches and above. Screen. All the driving silver paste lines 7 in the driving silver paste wiring area 5 on the two longitudinal sides are connected to the driving electrodes 3. Specifically, the two ends of each driving silver paste line 7 are connected to the two longitudinal sides respectively. The driving silver paste lines 7 in the driving silver paste wiring area 5 are connected.
  • the two longitudinal sides of the drive layer 2 are integrally formed with drive silver paste wiring areas 5, that is, the functional chip is a dual-drive functional chip, which is suitable for large-size capacitors of 27 inches and above. Screen. All the driving silver paste lines 7 in the driving silver paste wiring area 5 on the two longitudinal sides are connected to the driving electrodes 3. Specifically, the two ends of each driving silver paste line 7 are connected to the two longitudinal sides respectively. The driving silver paste lines 7 in the driving silver paste wiring area 5 are connected.
  • the invention also discloses a capacitive screen card assembly, which includes a glass cover 13, a PCB control board 19, an A adapter board 14, a B adapter board 15, an FPC drive board 16, an FPC sensor board 17, and an ITO film function sheet 18. ,
  • the glass cover 13 and the ITO film functional sheet 18 are firmly connected by OCA optical glue 12.
  • the ITO film functional sheet 18 includes a sensing layer 1 and a driving layer 2 which are bonded together by OCA optical glue 12, and a glass cover After the board 13 and the ITO film functional sheet 18 are adhered, the sensing layer 1 is located between the glass cover 13 and the driving layer 2; the driving layer 2 is evenly provided with a plurality of driving electrodes 3 parallel to each other, and the sensing layer 1 A plurality of sensing electrodes 4 parallel to each other are uniformly arranged on the surface.
  • the driving electrodes 3 are arranged horizontally, and the sensing electrodes 4 are arranged vertically, and preferably the sensing electrodes 4 and the driving electrodes 3 are arranged crosswise and arranged vertically; the longitudinal direction of the driving layer 2
  • a driving silver paste wiring area 5 is integrally formed on the side.
  • a plurality of driving silver paste pads 6 and a plurality of driving silver paste lines 7 are provided in the driving silver paste wiring area 5.
  • the driving silver paste lines 7 are respectively connected to a plurality of driving electrodes 3; one of the lateral sides of the sensing layer 1 is integrally formed with a sensing silver paste wiring area 8, and the sensing silver paste wiring area 8 is provided with a plurality of sensing Silver paste pads 9 and multiple sensing silver paste lines 10, the multiple sensing silver paste pads 9 are respectively connected to the multiple sensing electrodes 4 through the multiple sensing silver paste lines 10; the two ends of the FPC drive board 16 are respectively connected to A
  • the connecting board 14 is connected to the driving silver paste pad 6, the two ends of the FPC induction board 17 are connected to the B adapter board 15 and the induction silver paste pad 9 respectively, and the A adapter board 14 and the B adapter board 15 are both controlled by the PCB The board 19 is connected.
  • the FPC driving board 16 and the FPC sensing board 17 are both provided with a plurality of metal pads and a plurality of silver wires respectively connected to the metal pads, and the FPC driving board 16 is connected to the driving silver paste through the metal pads on the pads.
  • the bonding pad 6 is connected by thermocompression, and the FPC induction board 17 is connected by thermocompression to the induction silver paste pad 9 through the metal bonding pad on it.
  • the sensing layer 1 and the driving layer 2 are both flexible and foldable PET films, and the driving electrodes 3 and the sensing electrodes 4 are conventional conventional technologies, and generally are geometric patterns engraved on the PET film by laser lithography.
  • the driving silver paste wiring area 5 is bonded and connected to the flexible FPC board through the driving silver paste pad 6, and the sensing silver paste wiring area 8 is bonded and connected to the flexible FPC board through the sensing silver paste pad 9.
  • the driving silver paste pad 6 and the sensing silver paste pad 9 preferably have a rectangular structure with a length and width of 2mm*0.4mm, which are used for thermal bonding and bonding with a flexible FPC board.
  • the A transfer board 14 and the B transfer board 15 are all collected by a flexible FPC board, and then the flexible FPC board is connected to the PCB control board 19.
  • This embodiment discloses a capacitive screen card assembly, as shown in Figures 12-15, including a glass cover 13, a PCB control board 19, A adapter board 14, B adapter board 15, FPC driver board 16, FPC sensor
  • the board 17 and the ITO film functional sheet 18, the glass cover plate 13 and the ITO film functional sheet 18 are firmly connected by OCA optical glue 12, and the ITO film functional sheet 18 includes a sensing layer which is glued and integrated by OCA optical glue 12 1 and driving layer 2.
  • the sensing layer 1 is located between the glass cover 13 and the driving layer 2; the driving layer 2 is evenly provided with multiple parallel drives Electrode 3, the sensing layer 1 is uniformly provided with a plurality of sensing electrodes 4 parallel to each other.
  • the driving electrodes 3 are arranged horizontally, and the sensing electrodes 4 are arranged vertically, and preferably the sensing electrodes 4 and the driving electrodes 3 are arranged vertically and horizontally.
  • the driving layer 2 is integrally formed with a driving silver paste wiring area 5 on the longitudinal side, and a plurality of driving silver paste pads 6 and a plurality of driving silver paste pads 6 are provided in the driving silver paste wiring area 5 A silver paste line 7 is driven, and a plurality of driving silver paste pads 6 are respectively connected to a plurality of driving electrodes 3 through a plurality of driving silver paste lines 7; an induction silver paste trace is integrally formed on one of the lateral sides of the sensing layer 1 Zone 8, the induction silver paste wiring zone 8 is provided with a plurality of induction silver paste pads 9 and a plurality of induction silver paste lines 10, and the plurality of induction silver paste pads 9 are connected to the plurality of induction silver paste lines 10 through the plurality of induction silver paste lines 10 respectively.
  • the sensing electrode 4 is connected; the two ends of the FPC driving board 16 are connected to the A transfer board 14 and the driving silver paste pad 6 respectively, and the two ends of the FPC sensing board 17 are respectively connected to the B transfer board 15 and the sensing silver paste pad 9 ,
  • the A adapter board 14 and the B adapter board 15 are both connected to the PCB control board 19.
  • the FPC driving board 16 and the FPC sensing board 17 are both provided with a plurality of metal pads and a plurality of silver wires respectively connected to the metal pads, and the FPC driving board 16 is connected to the driving silver paste through the metal pads on the pads.
  • the bonding pad 6 is connected by thermocompression
  • the FPC induction board 17 is connected by thermocompression to the induction silver paste pad 9 through the metal bonding pad on it.
  • the driving silver paste wiring area 5 is integrally formed on one of the longitudinal edges of the driving layer 2, that is, the ITO film functional sheet 18 is a single-drive functional sheet, and the single-drive functional sheet makes a capacitive screen card
  • the components are suitable for capacitive screens with a size of 27 inches or less.
  • the driving silver paste wiring area 5 and the sensing silver paste wiring area 8 are preferably rectangular structures.
  • the length of the driving silver paste wiring area 5 is substantially the same as the length of the longitudinal side of the driving layer 2, and the length of the sensing silver paste wiring area 8 is substantially the same as the length of the longitudinal side of the sensing layer 1.
  • the driving silver paste pad 6 is arranged in the middle of the other side corresponding to the longitudinal side of the driving layer 2, and the sensing silver paste pad 9 is arranged in the middle of the other side corresponding to the lateral side of the sensing layer 1.
  • This embodiment discloses a capacitive screen card assembly, including a glass cover 13, a PCB control board 19, an A adapter board 14, a B adapter board 15, an FPC drive board 16, an FPC sensor board 17, and an ITO film function sheet 18. ,
  • the glass cover 13 and the ITO film functional sheet 18 are firmly connected by OCA optical glue 12.
  • the ITO film functional sheet 18 includes a sensing layer 1 and a driving layer 2 which are bonded together by OCA optical glue 12, and a glass cover After the board 13 and the ITO film functional sheet 18 are adhered, the sensing layer 1 is located between the glass cover 13 and the driving layer 2; the driving layer 2 is evenly provided with a plurality of driving electrodes 3 parallel to each other, and the sensing layer 1 A plurality of sensing electrodes 4 parallel to each other are uniformly arranged on the surface.
  • the driving electrodes 3 are arranged horizontally, and the sensing electrodes 4 are arranged vertically, and preferably the sensing electrodes 4 and the driving electrodes 3 are arranged crosswise and arranged vertically; the longitudinal direction of the driving layer 2
  • a driving silver paste wiring area 5 is integrally formed on the side.
  • a plurality of driving silver paste pads 6 and a plurality of driving silver paste lines 7 are provided.
  • the driving silver paste lines 7 are respectively connected to a plurality of driving electrodes 3; one of the lateral sides of the sensing layer 1 is integrally formed with a sensing silver paste wiring area 8, and the sensing silver paste wiring area 8 is provided with a plurality of sensing Silver paste pads 9 and multiple sensing silver paste lines 10, the multiple sensing silver paste pads 9 are respectively connected to the multiple sensing electrodes 4 through the multiple sensing silver paste lines 10; the two ends of the FPC drive board 16 are respectively connected to A
  • the connection board 14 is connected to the driving silver paste pad 6, the two ends of the FPC induction board 17 are respectively connected to the B adapter board 15 and the induction silver paste pad 9, and the A adapter board 14 and the B adapter board 15 are both controlled by the PCB The board 19 is connected.
  • the FPC driving board 16 and the FPC sensing board 17 are both provided with a plurality of metal pads and a plurality of silver wires respectively connected to the metal pads, and the FPC driving board 16 is connected to the driving silver paste through the metal pads on the pads.
  • the bonding pad 6 is connected by thermocompression, and the FPC induction board 17 is connected by thermocompression to the induction silver paste pad 9 through the metal bonding pad on it.
  • the driving silver paste wiring area 5 is integrally formed on one of the longitudinal edges of the driving layer 2, that is, the ITO film functional sheet 18 is a single-drive functional sheet.
  • the single-drive function chip makes the capacitive screen card assembly suitable for capacitive screens of 27 inches or less.
  • the driving silver paste wiring area 5 and the sensing silver paste wiring area 8 are preferably rectangular structures. Among them, the length of the driving silver paste wiring area 5 is less than the length of the longitudinal side of the driving layer 2, and the length of the sensing silver paste wiring area 8 is less than the length of the longitudinal side of the sensing layer 1.
  • a hollow area 11 is also provided in the driving silver paste wiring area 5 and in the sensing silver paste wiring area 8, and the driving silver paste pad 6 is provided in the driving silver paste wiring area 5.
  • the driving silver paste line 7 is arranged around the hollow area 11; the induction silver paste pad 9 is arranged on the side of the hollow area 11 in the induction silver paste wiring area 8, and the induction silver paste line 10 Set around the hollow area 11.
  • This embodiment discloses a capacitive screen card assembly, including a glass cover 13, a PCB control board 19, an A adapter board 14, a B adapter board 15, an FPC drive board 16, an FPC sensor board 17, and an ITO film function sheet 18. ,
  • the glass cover 13 and the ITO film functional sheet 18 are firmly connected by OCA optical glue 12.
  • the ITO film functional sheet 18 includes a sensing layer 1 and a driving layer 2 which are bonded together by OCA optical glue 12, and a glass cover After the board 13 and the ITO film functional sheet 18 are adhered, the sensing layer 1 is located between the glass cover 13 and the driving layer 2; the driving layer 2 is evenly provided with a plurality of driving electrodes 3 parallel to each other, and the sensing layer 1 A plurality of sensing electrodes 4 parallel to each other are uniformly arranged on the surface.
  • the driving electrodes 3 are arranged horizontally, and the sensing electrodes 4 are arranged vertically, and preferably the sensing electrodes 4 and the driving electrodes 3 are arranged crosswise and arranged vertically; the longitudinal direction of the driving layer 2
  • a driving silver paste wiring area 5 is integrally formed on the side.
  • a plurality of driving silver paste pads 6 and a plurality of driving silver paste lines 7 are provided.
  • the driving silver paste lines 7 are respectively connected to a plurality of driving electrodes 3; one of the lateral sides of the sensing layer 1 is integrally formed with a sensing silver paste wiring area 8, and the sensing silver paste wiring area 8 is provided with a plurality of sensing Silver paste pads 9 and multiple sensing silver paste lines 10, the multiple sensing silver paste pads 9 are respectively connected to the multiple sensing electrodes 4 through the multiple sensing silver paste lines 10; the two ends of the FPC drive board 16 are respectively connected to A
  • the connecting board 14 is connected to the driving silver paste pad 6, the two ends of the FPC induction board 17 are connected to the B adapter board 15 and the induction silver paste pad 9 respectively, and the A adapter board 14 and the B adapter board 15 are both controlled by the PCB The board 19 is connected.
  • the FPC driving board 16 and the FPC sensing board 17 are both provided with a plurality of metal pads and a plurality of silver wires respectively connected to the metal pads, and the FPC driving board 16 is connected to the driving silver paste through the metal pads on the pads.
  • the bonding pad 6 is connected by thermocompression, and the FPC induction board 17 is connected by thermocompression to the induction silver paste pad 9 through the metal bonding pad on it.
  • the driving silver paste wiring area 5 is integrally formed on one of the longitudinal edges of the driving layer 2, that is, the ITO film functional sheet 18 is a single-drive functional sheet.
  • the single-drive function chip makes the capacitive screen card assembly suitable for capacitive screens of 27 inches or less.
  • the number of the driving silver paste wiring area 5 is at least two, the sum of the number of all driving silver paste lines 7 in the driving silver paste wiring area 5 is equal to the number of driving electrodes 3, and all the driving silver paste wiring areas 5
  • the driving silver paste lines 7 are connected to a plurality of driving electrodes 3 in a one-to-one correspondence, and each driving silver paste wiring area 5 is correspondingly connected with an FPC driving board 16 and an A adapter board 14.
  • the number of the sensing silver paste wiring areas 8 is at least two, the sum of the number of all sensing silver paste lines 10 in the sensing silver paste wiring area 8 is equal to the number of sensing electrodes 4, and all the sensing silver paste wiring areas 8
  • the sensing silver paste lines 10 are connected to a plurality of sensing electrodes 4 in a one-to-one correspondence, and each sensing silver paste wiring area 8 is correspondingly connected to an FPC sensing board 17 and a B adapter board 15.
  • both the driving silver paste wiring area 5 and the sensing silver paste wiring area 8 are preferably rectangular structures, and the size is preferably such that the corresponding silver paste lines and pads can be provided. From the perspective of Figs. 20-21, it is equivalent to a plurality of protruding areas on the longitudinal side of the drive layer 2 and a plurality of protruding areas on the lateral side of the sensing layer 1. This structure makes the volume of the driving silver paste wiring area 5 and the sensing silver paste wiring area 8 smaller, which is beneficial to drive the silver paste wiring area 5 and the sensing silver paste wiring area 8, and it is also beneficial to further reduce the amount of material. .
  • Embodiment 7 This embodiment is basically the same as Embodiment 7, and the main difference is that:
  • the two longitudinal sides of the drive layer 2 are integrally formed with drive silver paste wiring areas 5, that is, the ITO film functional sheet 18 is a dual-drive functional sheet, and the dual-drive functional sheet
  • All the driving silver paste lines 7 in the driving silver paste wiring area 5 on the two longitudinal sides are connected to the driving electrodes 3.
  • the two ends of each driving silver paste line 7 are connected to the two longitudinal sides respectively.
  • the driving silver paste lines 7 in the driving silver paste wiring area 5 are connected.
  • the driving silver paste wiring areas 5 on the two longitudinal sides are respectively connected to an FPC driving board 16 and an A transfer board 14 respectively.
  • Embodiment 8 This embodiment is basically the same as Embodiment 8, and the main difference is that:
  • the two longitudinal sides of the driving layer 2 are integrally formed with driving silver paste wiring areas 5, that is, the ITO film functional sheet 18 is a dual-drive functional sheet, and the dual-drive functional sheet makes the capacitor
  • the screen card assembly is suitable for large-size capacitive screens of 27 inches and above.
  • All the driving silver paste lines 7 in the driving silver paste wiring area 5 on the two longitudinal sides are connected to the driving electrodes 3. Specifically, the two ends of each driving silver paste line 7 are connected to the two longitudinal sides respectively.
  • the driving silver paste lines 7 in the driving silver paste wiring area 5 are connected. Further, the driving silver paste wiring areas 5 on the two longitudinal sides are respectively connected to an FPC driving board 16 and an A transfer board 14 respectively.
  • Embodiment 9 is basically the same as Embodiment 9. The main difference is that:
  • the two longitudinal sides of the driving layer 2 are integrally formed with driving silver paste wiring areas 5, that is, the ITO film functional sheet 18 is a dual-drive functional sheet, and the dual-drive functional sheet makes the capacitor
  • the screen card assembly is suitable for large-size capacitive screens of 27 inches and above.
  • All the driving silver paste lines 7 in the driving silver paste wiring area 5 on the two longitudinal sides are connected to the driving electrodes 3. Specifically, the two ends of each driving silver paste line 7 are connected to the two longitudinal sides respectively.
  • the driving silver paste lines 7 in the driving silver paste wiring area 5 are connected. Further, each driving silver paste wiring area 5 is respectively connected to an FPC driving board 16 and an A transfer board 14 respectively.
  • the driving silver paste wiring area 5 and the sensing silver paste wiring area 8 are folded and hidden, and the area on the ITO film functional sheet 18 corresponding to the glass cover 13 is solderless Disk, so that the frame of the capacitive screen can be further narrowed.
  • the area on the ITO film functional sheet 18 corresponding to the glass cover 13 is solderless Disk, so that the frame of the capacitive screen can be further narrowed.

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Abstract

本发明公开了一种ITO膜功能片以及电容屏卡组件。该电容屏卡组件包括玻璃盖板、PCB控制板、A转接板、B转接板、FPC驱动板、FPC感应板和ITO膜功能片，ITO膜功能片包括感应层和驱动层，驱动层上设置有驱动电极，感应层上均匀设置有感应电极；驱动层的纵向边上一体成型有驱动银浆走线区，驱动银浆走线区内设有驱动银浆焊盘和驱动银浆线，FPC驱动板的两端分别与A转接板和驱动银浆焊盘连接；感应层的其中一条横向边上一体成型有感应银浆走线区，感应银浆走线区内设置有感应银浆焊盘和感应银浆线，FPC感应板的两端分别与B转接板和感应银浆焊盘连接，A转接板和B转接板均与PCB控制板连接。本发明所要解决的技术问题是能够进一步降低电容屏的边框宽度。

Description

一种ITO膜功能片以及电容屏卡组件
相关申请的交叉引用
本申请要求于2020年2月26日提交的申请号为2020101196128，名称为“一种ITO Film功能片”以及于2020年2月26日提交的申请号为202020212206.1，名称为“一种电容屏卡组件”的中国专利申请的优先权，其通过引用方式全部并入本文。
技术领域
本发明涉及触摸屏技术领域，尤其涉及一种ITO膜(Film)功能片以及电容屏卡组件。
背景技术
电容屏技术是利用人体的电流感应进行工作的。电容屏是一块四层复合玻璃屏，分为两种结构类型，一种是G+G结构的电容屏，其结构是一张玻璃盖板贴合ITO玻璃功能片，ITO玻璃功能片的正反两面分别蚀刻出感应层和驱动层，玻璃功能片贴合玻璃盖板那面为感应层，另外一面为驱动层，分别为接收和发送功能。另一种是G+F+F结构的电容屏，其结构是一张玻璃盖板贴合ITO膜功能片，ITO膜功能片由两张PET薄膜贴合而成，分别为感应层PET薄膜和驱动层PET薄膜，感应层在上，驱动层在下。这两种结构的电容屏作用原理一致，基材结构不同。当手指触摸在玻璃盖板表面时，由于人体电场，手指和触摸屏表面形成以一个耦合电容，对于高频电流来说，电容是直接导体，于是手指从接触点吸走一个很小的电流。这个电流分别从触摸屏的四角上的电极中流出，并且流经这四个电极的电流与手指到四角的距离成正比，控制器通过对这四个电流比例的精确计算，得出触摸点的位置。
目前，电容屏的连接结构一般为：在ITO玻璃功能片或ITO膜功能片的边缘上设置焊盘、银浆线和集中的绑定区域，焊盘一方面与ITO玻璃功能片或ITO膜功能片上纵横交叉排布的几何图案相连，另一方面通过银浆线连接到绑定区域，然后再将柔性FPC板与绑定区域热压合连接即可。随 着电容屏触摸技术的高速发展，使得电容屏应用范围越来越广，尤其是中大尺寸上面的应用，但现有传感器工艺的设计导致很多电容屏设计在中大尺寸上都没有办法做到很窄的边框。
中国专利公开号为CN207976867U的现有技术在2018年10月16日公开了一种电容触摸屏走线结构，其包括多个X轴电极和Y轴电极，每个X轴电极和Y轴电极均引出电极引线，该专利通过导电胶直接与透明电极通道绑定，柔性线路板上的铜走线汇集之后，通过连接器卡口与驱动线路板相连，保证超大尺寸通道电阻的同时，可获得更窄的走线宽度。但由于其绑定区域在功能片上，其仍然会占用一定的究竟，这导致其边框宽度仍然不够窄。
发明内容
本发明的目的在于克服现有技术中存在的上述问题，提供了一种ITO膜功能片，本发明所要解决的技术问题是能够进一步降低电容屏的边框宽度。
为实现上述目的，本发明采用的技术方案如下：
一种ITO膜功能片，包括粘固成一体的感应层和驱动层，其特征在于：所述驱动层上均匀设置有多根相互平行的驱动电极，所述感应层上均匀设置有多根相互平行的感应电极；所述驱动层的纵向边上一体成型有驱动银浆走线区，驱动银浆走线区内设置有多个驱动银浆焊盘和多根驱动银浆线，多个驱动银浆焊盘通过多根驱动银浆线分别与多根驱动电极相连；所述感应层的其中一条横向边上一体成型有感应银浆走线区，感应银浆走线区内设置有多个感应银浆焊盘和多根感应银浆线，多个感应银浆焊盘通过多根感应银浆线分别与多根感应电极相连。
所述驱动银浆走线区和感应银浆走线区均为矩形结构。
所述驱动银浆走线区内和感应银浆走线区内均设置有缕空区域，驱动银浆焊盘设置在驱动银浆走线区中的缕空区域一侧，驱动银浆线围绕缕空区域设置；感应银浆焊盘设置在感应银浆走线区中的缕空区域一侧，感应银浆线围绕缕空区域设置。
所述驱动银浆走线区的数量至少为两个，驱动银浆走线区中的驱动银浆线均与多根驱动电极连接。
所述感应银浆走线区的数量至少为两个，感应银浆走线区中的感应银浆线均与多根感应电极连接。
所述驱动层的两条纵向边上均一体成型有驱动银浆走线区，两条纵向边上的驱动银浆走线区中的驱动银浆线均与驱动电极连接。
采用ITO膜功能片的优点在于：
1、本发明的主要改进点在于在现有ITO膜功能片的基础上对其边缘进行了延升，并将现有的银浆走线以及绑定用焊盘转移到延伸出来的感应银浆走线区和驱动银浆走线区，以此达到有效降低电容屏边框宽度的目的。具体来说，由于ITO膜功能片为柔性可折叠材质，因此一体成型在驱动层上的驱动银浆走线区和一体成型在感应层上的感应银浆走线区也是柔性可折叠材质，在生产时可通过折叠感应银浆走线区和驱动银浆走线区使银浆线及焊盘折叠隐藏，以此达到降低电容屏边框的目的。另外，如背景技术中所引证的关于窄边框电容屏的现有技术中，虽然其也能较好的降低电容屏边框，但其功能片上至少保留有焊盘，而本发明中连焊盘都被折叠隐藏起来了，即与玻璃盖板所对应区域的ITO膜功能片上无焊盘，可以说本发明能够更到更窄的边框，其技术效果也更优于现有技术。
2、本发明将驱动银浆走线区和感应银浆走线区均为矩形结构，该结构有利于将银浆线和焊盘的集中设置，并有利于与柔性FPC板集中绑定。
3、本发明在驱动银浆走线区内和感应银浆走线区内均设置有缕空区域，该结构的优点在于能够减少功能片材料的用量，有利于降低产品生产成本。
4、本发明中驱动银浆走线区的数量至少为两个，驱动银浆走线区中的驱动银浆线均与多根驱动电极连接。该结构有利于驱动银浆走线区的折叠隐藏。
5、本发明中感应银浆走线区的数量至少为两个，感应银浆走线区中的感应银浆线均与多根感应电极连接。该结构有利于感应银浆走线区的折叠隐藏。
6、本发明中的驱动层的两条纵向边上均一体成型有驱动银浆走线区，两条纵向边上的驱动银浆走线区中的驱动银浆线均与驱动电极连接。该结构使得功能片为双驱功能片，适用于27寸及以上的大尺寸电容屏，能够在用于大尺寸电容屏时仍然具有窄边框和保证具有较高的触摸精度。
7、本发明适用于各种类型的电容屏，例如平面电容屏、曲面电容屏、 球面电容屏以及各种不规则结构电容屏等。
本发明的目的在于克服现有技术中存在的上述问题，提供了一种电容屏卡组件，本发明所要解决的技术问题是能够进一步降低电容屏的边框宽度。
为实现上述目的，本发明采用的技术方案如下：
一种电容屏卡组件，其特征在于：包括玻璃盖板、PCB控制板、A转接板、B转接板、FPC(Flexible Printed Circuit)驱动板、FPC感应板和ITO膜功能片，所述玻璃盖板与ITO膜功能片粘固连接，所述ITO膜功能片包括粘固成一体的感应层和驱动层，所述驱动层上均匀设置有多根相互平行的驱动电极，所述感应层上均匀设置有多根相互平行的感应电极；所述驱动层的纵向边上一体成型有驱动银浆走线区，驱动银浆走线区内设置有多个驱动银浆焊盘和多根驱动银浆线，多个驱动银浆焊盘通过多根驱动银浆线分别与多根驱动电极相连，FPC驱动板的两端分别与A转接板和驱动银浆焊盘连接；所述感应层的其中一条横向边上一体成型有感应银浆走线区，感应银浆走线区内设置有多个感应银浆焊盘和多根感应银浆线，多个感应银浆焊盘通过多根感应银浆线分别与多根感应电极相连，FPC感应板的两端分别与B转接板和感应银浆焊盘连接，A转接板和B转接板均与PCB控制板连接。
所述FPC驱动板和FPC感应板上均设置有多个金属焊盘和多根分别与金属焊盘相连的银连线，FPC驱动板通过金属焊盘与驱动银浆焊盘热压合连接，FPC感应板通过金属焊盘与感应银浆焊盘热压合连接。
所述驱动银浆走线区和感应银浆走线区均为矩形结构。
所述驱动银浆走线区内和感应银浆走线区内均设置有缕空区域，驱动银浆焊盘设置在驱动银浆走线区中的缕空区域一侧，驱动银浆线围绕缕空区域设置；感应银浆焊盘设置在感应银浆走线区中的缕空区域一侧，感应银浆线围绕缕空区域设置。
所述驱动银浆走线区的数量至少为两个，驱动银浆走线区中的驱动银浆线均与多根驱动电极连接，每个驱动银浆走线区对应连接一块FPC驱动板和一块A转接板。
所述感应银浆走线区的数量至少为两个，感应银浆走线区中的感应银浆线均与多根感应电极连接，每个感应银浆走线区对应连接一块FPC感应 板和一块B转接板。
所述驱动层的两条纵向边上均一体成型有驱动银浆走线区，两条纵向边上的驱动银浆走线区中的驱动银浆线均与驱动电极连接。
采用本发明的优点在于：
1、本发明的主要创新点在于对现有功能片与FPC板的连接结构进行了改进，具体体现在对ITO膜功能片的边缘进行了延升，将现有的银浆走线以及绑定用银浆焊盘转移到延伸出来的感应银浆走线区和驱动银浆走线区，并将现有的FPC板与ITO膜功能片边缘连接结构转移到分别与感应银浆走线区和驱动银浆走线区连接，以此达到有效降低电容屏边框宽度的目的。具体来说，由于ITO膜功能片为柔性可折叠材质，因此一体成型在驱动层上的驱动银浆走线区和一体成型在感应层上的感应银浆走线区也是柔性可折叠材质，在生产时可通过折叠感应银浆走线区和驱动银浆走线区使银浆线及焊盘折叠隐藏，以此达到降低电容屏边框的目的。另外，如背景技术中所引证的关于窄边框电容屏的现有技术中，虽然其也能较好的降低电容屏边框，但其功能片上至少保留有焊盘，而本发明中连焊盘都被折叠隐藏起来了，即与玻璃盖板所对应区域的ITO膜功能片上无焊盘，可以说本发明能够更到更窄的边框，其技术效果也更优于现有技术。
2、本发明中的FPC驱动板通过金属焊盘与驱动银浆焊盘热压合连接，FPC感应板通过金属焊盘与感应银浆焊盘热压合连接，其优点在于保证了连接的稳定性。
3、本发明将驱动银浆走线区和感应银浆走线区均为矩形结构，该结构有利于将银浆线和焊盘的集中设置，并有利于与柔性FPC板集中绑定。
4、本发明在驱动银浆走线区内和感应银浆走线区内均设置有缕空区域，该结构的优点在于能够减少功能片材料的用量，有利于降低产品生产成本。
5、本发明中驱动银浆走线区的数量至少为两个，驱动银浆走线区中的驱动银浆线均与多根驱动电极连接，每个驱动银浆走线区对应连接一块FPC驱动板和一块A转接板。该结构有利于驱动银浆走线区的折叠隐藏。
6、本发明中感应银浆走线区的数量至少为两个，感应银浆走线区中的感应银浆线均与多根感应电极连接，每个感应银浆走线区对应连接一块FPC感应板和一块B转接板。该结构有利于感应银浆走线区的折叠隐藏。
7、本发明中的驱动层的两条纵向边上均一体成型有驱动银浆走线区， 两条纵向边上的驱动银浆走线区中的驱动银浆线均与驱动电极连接。该结构使得功能片为双驱功能片，适用于27寸及以上的大尺寸电容屏，能够在用于大尺寸电容屏时仍然具有窄边框和保证具有较高的触摸精度。
8、本发明适用于各种类型的电容屏，例如平面电容屏、曲面电容屏、球面电容屏以及各种不规则结构电容屏等。
附图说明
图1为实施例1的结构示意图；
图2为图1的横向剖面图；
图3为图1的纵向剖面图；
图4为实施例1中感应层的结构示意图；
图5为实施例1中驱动层的结构示意图；
图6为实施例2的结构示意图；
图7为实施例3的结构示意图；
图8为实施例4的结构示意图；
图9为图8的横向剖面图；
图10为实施例5的结构示意图；
图11为实施例6的结构示意图；
图12为实施例7的结构示意图；
图13为实施例7中ITO膜功能片的结构示意图；
图14为图12的横向剖面图；
图15为图12的纵向剖面图；
图16为实施例7中感应层的结构示意图；
图17为实施例7中驱动层的结构示意图；
图18为实施例8的结构示意图；
图19为实施例8中ITO膜功能片的结构示意图；
图20为实施例9的结构示意图；
图21为实施例9中ITO膜功能片的结构示意图；
图22为实施例10的结构示意图；
图23为图22的横向剖面图；
图24为实施例11的结构示意图；
图25为实施例12的结构示意图；
图中标记为：1、感应层，2、驱动层，3、驱动电极，4、感应电极，5、驱动银浆走线区，6、驱动银浆焊盘，7、驱动银浆线，8、感应银浆走线区，9、感应银浆焊盘，10、感应银浆线，11、缕空区域，12、OCA光学胶，13、玻璃盖板，14、A转接板，15、B转接板，16、FPC驱动板，17、FPC感应板，18、ITO膜功能片，19、PCB控制板。
具体实施方式
本发明公开了一种ITO膜功能片，包括通过OCA光学胶12粘固成一体的感应层1和驱动层2，所述驱动层2上均匀设置有多根相互平行的驱动电极3，所述感应层1上均匀设置有多根相互平行的感应电极4，优选驱动电极3横向排布，感应电极4竖向排布，且优选感应电极4与驱动电极3纵横相交排布；所述驱动层2的纵向边上一体成型有驱动银浆走线区5，驱动银浆走线区5内设置有多个驱动银浆焊盘6和多根驱动银浆线7，多个驱动银浆焊盘6通过多根驱动银浆线7分别与多根驱动电极3相连；所述感应层1的其中一条横向边上一体成型有感应银浆走线区8，感应银浆走线区8内设置有多个感应银浆焊盘9和多根感应银浆线10，多个感应银浆焊盘9通过多根感应银浆线10分别与多根感应电极4相连。
其中，所述感应层1和驱动层2均为柔性可折叠的PET膜，驱动电极3和感应电极4均为现有常规技术，一般为激光光刻在PET膜上的几何图案。驱动银浆走线区5通过驱动银浆焊盘6与柔性FPC板绑定连接，感应银浆走线区8通过感应银浆焊盘9与柔性FPC板绑定连接。驱动银浆焊盘6和感应银浆焊盘9优选为矩形结构，其长宽为2mm*0.4mm，用于与柔性FPC板热合绑定。
下面结合附图对本发明作进一步具体说明。
实施例1
本实施例公开了一种ITO膜功能片，如图1-3所示，包括通过OCA光学胶12粘固成一体的感应层1和驱动层2，所述驱动层2上均匀设置有多根相互平行的驱动电极3，所述感应层1上均匀设置有多根相互平行的感应电极4，优选驱动电极3横向排布，感应电极4竖向排布，且优选感应电极4与驱动电极3纵横交叉排布；如图4-5所示；所述驱动层2的纵 向边上一体成型有驱动银浆走线区5，驱动银浆走线区5内设置有多个驱动银浆焊盘6和多根驱动银浆线7，多个驱动银浆焊盘6通过多根驱动银浆线7分别与多根驱动电极3相连；所述感应层1的其中一条横向边上一体成型有感应银浆走线区8，感应银浆走线区8内设置有多个感应银浆焊盘9和多根感应银浆线10，多个感应银浆焊盘9通过多根感应银浆线10分别与多根感应电极4相连。
本实施例中，所述驱动银浆走线区5一体成型在驱动层2的其中一条纵向边上，即所述功能片为单驱功能片，适用于27寸以下尺寸的电容屏。所述驱动银浆走线区5和感应银浆走线区8均优选为矩形结构。其中，驱动银浆走线区5的长度与驱动层2的纵向边长度基本相同，感应银浆走线区8的长度与感应层1的纵向边长度基本相同。驱动银浆焊盘6设置在与驱动层2的纵向边相应对的另一边的中部，感应银浆焊盘9设置在与感应层1的横向边相应对的另一边的中部。
实施例2
本实施例公开了一种ITO膜功能片，包括通过OCA光学胶12粘固成一体的感应层1和驱动层2，所述驱动层2上均匀设置有多根相互平行的驱动电极3，所述感应层1上均匀设置有多根相互平行的感应电极4，优选驱动电极3横向排布，感应电极4竖向排布，且优选感应电极4与驱动电极3纵横交叉排布；所述驱动层2的纵向边上一体成型有驱动银浆走线区5，驱动银浆走线区5内设置有多个驱动银浆焊盘6和多根驱动银浆线7，多个驱动银浆焊盘6通过多根驱动银浆线7分别与多根驱动电极3相连；所述感应层1的其中一条横向边上一体成型有感应银浆走线区8，感应银浆走线区8内设置有多个感应银浆焊盘9和多根感应银浆线10，多个感应银浆焊盘9通过多根感应银浆线10分别与多根感应电极4相连。
本实施例中，如图6所示，所述驱动银浆走线区5一体成型在驱动层2的其中一条纵向边上，即所述功能片为单驱功能片，适用于27寸以下尺寸的电容屏。所述驱动银浆走线区5和感应银浆走线区8均优选为矩形结构。其中，驱动银浆走线区5的长度小于驱动层2纵向边的长度，感应银浆走线区8的长度小于感应层1纵向边的长度；从图6上看，就相当于是在驱动层2的纵向边上有一块凸出区域和在感应层1的横向边上有一块凸出区域。驱动银浆焊盘6设置在与驱动层2的纵向边相应对的另一边的中 部，感应银浆焊盘9设置在与感应层1的横向边相应对的另一边的中部。
进一步的，为了减少材料用量，在驱动银浆走线区5内和感应银浆走线区8内还均设置有缕空区域11，驱动银浆焊盘6设置在驱动银浆走线区5中的缕空区域11一侧，驱动银浆线7围绕缕空区域11设置；感应银浆焊盘9设置在感应银浆走线区8中的缕空区域11一侧，感应银浆线10围绕缕空区域11设置。
实施例3
本实施例公开了一种ITO膜功能片，包括通过OCA光学胶12粘固成一体的感应层1和驱动层2，所述驱动层2上均匀设置有多根相互平行的驱动电极3，所述感应层1上均匀设置有多根相互平行的感应电极4，优选驱动电极3横向排布，感应电极4竖向排布，且优选感应电极4与驱动电极3纵横交叉排布；所述驱动层2的纵向边上一体成型有驱动银浆走线区5，驱动银浆走线区5内设置有多个驱动银浆焊盘6和多根驱动银浆线7，多个驱动银浆焊盘6通过多根驱动银浆线7分别与多根驱动电极3相连；所述感应层1的其中一条横向边上一体成型有感应银浆走线区8，感应银浆走线区8内设置有多个感应银浆焊盘9和多根感应银浆线10，多个感应银浆焊盘9通过多根感应银浆线10分别与多根感应电极4相连。
本实施例中，如图7所示，所述驱动银浆走线区5一体成型在驱动层2的其中一条纵向边上，即所述功能片为单驱功能片，适用于27寸以下尺寸的电容屏。所述驱动银浆走线区5的数量至少为两个，驱动银浆走线区5中所有驱动银浆线7的数量之和等于驱动电极3的数量，驱动银浆走线区5中所有的驱动银浆线7与多根驱动电极3一一对应连接。所述感应银浆走线区8的数量至少为两个，感应银浆走线区8中所有感应银浆线10的数量之和等于感应电极4的数量，感应银浆走线区8中的感应银浆线10与多根感应电极4一一对应连接。
进一步的，驱动银浆走线区5和感应银浆走线区8均优选为矩形结构，其大小以刚好能够设置对应的银浆线和焊盘为佳。从图7上看，就相当于是在驱动层2的纵向边上有多块凸出区域和在感应层1的横向边上有多块凸出区域。该种结构使得驱动银浆走线区5和感应银浆走线区8的体积较小，既有利于驱动银浆走线区5和感应银浆走线区8，又有利于进一步减少材料用量。
实施例4
本实施例与实施例1基本相同，主要区别在于，
如图8-9所示，所述驱动层2的两条纵向边上均一体成型有驱动银浆走线区5，即所述功能片为双驱功能片，适用于27寸及以上的大尺寸电容屏。两条纵向边上的驱动银浆走线区5中所有的驱动银浆线7均与驱动电极3连接，具体来说，就是每根驱动银浆线7的两端分别与两条纵向边上的驱动银浆走线区5中的驱动银浆线7相连。
实施例5
本实施例与实施例2基本相同，主要区别在于，
如图10所示，所述驱动层2的两条纵向边上均一体成型有驱动银浆走线区5，即所述功能片为双驱功能片，适用于27寸及以上的大尺寸电容屏。两条纵向边上的驱动银浆走线区5中所有的驱动银浆线7均与驱动电极3连接，具体来说，就是每根驱动银浆线7的两端分别与两条纵向边上的驱动银浆走线区5中的驱动银浆线7相连。
实施例6
本实施例与实施例3基本相同，主要区别在于，
如图11所示，所述驱动层2的两条纵向边上均一体成型有驱动银浆走线区5，即所述功能片为双驱功能片，适用于27寸及以上的大尺寸电容屏。两条纵向边上的驱动银浆走线区5中所有的驱动银浆线7均与驱动电极3连接，具体来说，就是每根驱动银浆线7的两端分别与两条纵向边上的驱动银浆走线区5中的驱动银浆线7相连。
本发明还公开了一种电容屏卡组件，包括玻璃盖板13、PCB控制板19、A转接板14、B转接板15、FPC驱动板16、FPC感应板17和ITO膜功能片18，所述玻璃盖板13与ITO膜功能片18通过OCA光学胶12粘固连接，所述ITO膜功能片18包括通过OCA光学胶12粘固成一体的感应层1和驱动层2，玻璃盖板13与ITO膜功能片18粘固后，感应层1位于玻璃盖板13与驱动层2之间；所述驱动层2上均匀设置有多根相互平行的驱动电极3，所述感应层1上均匀设置有多根相互平行的感应电极4，优选驱动电极3横向排布，感应电极4竖向排布，且优选感应电极4与驱动电极3纵横相交排布；所述驱动层2的纵向边上一体成型有驱动银浆走线区5，驱动银浆走线区5内设置有多个驱动银浆焊盘6和多根驱动银浆线7， 多个驱动银浆焊盘6通过多根驱动银浆线7分别与多根驱动电极3相连；所述感应层1的其中一条横向边上一体成型有感应银浆走线区8，感应银浆走线区8内设置有多个感应银浆焊盘9和多根感应银浆线10，多个感应银浆焊盘9通过多根感应银浆线10分别与多根感应电极4相连；FPC驱动板16的两端分别与A转接板14和驱动银浆焊盘6连接，FPC感应板17的两端分别与B转接板15和感应银浆焊盘9连接，A转接板14和B转接板15均与PCB控制板19连接。具体的，FPC驱动板16和FPC感应板17上均设置有多个金属焊盘和多根分别与金属焊盘相连的银连线，FPC驱动板16通过其上的金属焊盘与驱动银浆焊盘6热压合连接，FPC感应板17通过其上的金属焊盘与感应银浆焊盘9热压合连接。
本实施例中，所述感应层1和驱动层2均为柔性可折叠的PET膜，驱动电极3和感应电极4均为现有常规技术，一般为激光光刻在PET膜上的几何图案。驱动银浆走线区5通过驱动银浆焊盘6与柔性FPC板绑定连接，感应银浆走线区8通过感应银浆焊盘9与柔性FPC板绑定连接。驱动银浆焊盘6和感应银浆焊盘9优选为矩形结构，其长宽为2mm*0.4mm,用于与柔性FPC板热合绑定。
本实施例中，所述A转接板14和B转接板15均通过一个柔性的FPC板进行汇总，然后再由该柔性FPC板与PCB控制板19连接。
下面结合附图对本发明作进一步具体说明。
实施例7
本实施例公开了一种电容屏卡组件，如图12-15所示，包括玻璃盖板13、PCB控制板19、A转接板14、B转接板15、FPC驱动板16、FPC感应板17和ITO膜功能片18，所述玻璃盖板13与ITO膜功能片18通过OCA光学胶12粘固连接，所述ITO膜功能片18包括通过OCA光学胶12粘固成一体的感应层1和驱动层2，玻璃盖板13与ITO膜功能片18粘固后，感应层1位于玻璃盖板13与驱动层2之间；所述驱动层2上均匀设置有多根相互平行的驱动电极3，所述感应层1上均匀设置有多根相互平行的感应电极4，优选驱动电极3横向排布，感应电极4竖向排布，且优选感应电极4与驱动电极3纵横相交排布；如图16-17所示，所述驱动层2的纵向边上一体成型有驱动银浆走线区5，驱动银浆走线区5内设置有多个驱动银浆焊盘6和多根驱动银浆线7，多个驱动银浆焊盘6通过多根驱动银 浆线7分别与多根驱动电极3相连；所述感应层1的其中一条横向边上一体成型有感应银浆走线区8，感应银浆走线区8内设置有多个感应银浆焊盘9和多根感应银浆线10，多个感应银浆焊盘9通过多根感应银浆线10分别与多根感应电极4相连；FPC驱动板16的两端分别与A转接板14和驱动银浆焊盘6连接，FPC感应板17的两端分别与B转接板15和感应银浆焊盘9连接，A转接板14和B转接板15均与PCB控制板19连接。具体的，FPC驱动板16和FPC感应板17上均设置有多个金属焊盘和多根分别与金属焊盘相连的银连线，FPC驱动板16通过其上的金属焊盘与驱动银浆焊盘6热压合连接，FPC感应板17通过其上的金属焊盘与感应银浆焊盘9热压合连接。
本实施例中，所述驱动银浆走线区5一体成型在驱动层2的其中一条纵向边上，即所述ITO膜功能片18为单驱功能片，该单驱功能片使得电容屏卡组件适用于27寸以下尺寸的电容屏。所述驱动银浆走线区5和感应银浆走线区8均优选为矩形结构。其中，驱动银浆走线区5的长度与驱动层2的纵向边长度基本相同，感应银浆走线区8的长度与感应层1的纵向边长度基本相同。驱动银浆焊盘6设置在与驱动层2的纵向边相应对的另一边的中部，感应银浆焊盘9设置在与感应层1的横向边相应对的另一边的中部。
实施例8
本实施例公开了一种电容屏卡组件，包括玻璃盖板13、PCB控制板19、A转接板14、B转接板15、FPC驱动板16、FPC感应板17和ITO膜功能片18，所述玻璃盖板13与ITO膜功能片18通过OCA光学胶12粘固连接，所述ITO膜功能片18包括通过OCA光学胶12粘固成一体的感应层1和驱动层2，玻璃盖板13与ITO膜功能片18粘固后，感应层1位于玻璃盖板13与驱动层2之间；所述驱动层2上均匀设置有多根相互平行的驱动电极3，所述感应层1上均匀设置有多根相互平行的感应电极4，优选驱动电极3横向排布，感应电极4竖向排布，且优选感应电极4与驱动电极3纵横相交排布；所述驱动层2的纵向边上一体成型有驱动银浆走线区5，驱动银浆走线区5内设置有多个驱动银浆焊盘6和多根驱动银浆线7，多个驱动银浆焊盘6通过多根驱动银浆线7分别与多根驱动电极3相连；所述感应层1的其中一条横向边上一体成型有感应银浆走线区8，感应银 浆走线区8内设置有多个感应银浆焊盘9和多根感应银浆线10，多个感应银浆焊盘9通过多根感应银浆线10分别与多根感应电极4相连；FPC驱动板16的两端分别与A转接板14和驱动银浆焊盘6连接，FPC感应板17的两端分别与B转接板15和感应银浆焊盘9连接，A转接板14和B转接板15均与PCB控制板19连接。具体的，FPC驱动板16和FPC感应板17上均设置有多个金属焊盘和多根分别与金属焊盘相连的银连线，FPC驱动板16通过其上的金属焊盘与驱动银浆焊盘6热压合连接，FPC感应板17通过其上的金属焊盘与感应银浆焊盘9热压合连接。
本实施例中，如图18-19所示，所述驱动银浆走线区5一体成型在驱动层2的其中一条纵向边上，即所述ITO膜功能片18为单驱功能片，该单驱功能片使得电容屏卡组件适用于27寸以下尺寸的电容屏。所述驱动银浆走线区5和感应银浆走线区8均优选为矩形结构。其中，驱动银浆走线区5的长度小于驱动层2纵向边的长度，感应银浆走线区8的长度小于感应层1纵向边的长度；从图18-19上看，就相当于是在驱动层2的纵向边上有一块凸出区域和在感应层1的横向边上有一块凸出区域。驱动银浆焊盘6设置在与驱动层2的纵向边相应对的另一边的中部，感应银浆焊盘9设置在与感应层1的横向边相应对的另一边的中部。
进一步的，为了减少材料用量，在驱动银浆走线区5内和感应银浆走线区8内还均设置有缕空区域11，驱动银浆焊盘6设置在驱动银浆走线区5中的缕空区域11一侧，驱动银浆线7围绕缕空区域11设置；感应银浆焊盘9设置在感应银浆走线区8中的缕空区域11一侧，感应银浆线10围绕缕空区域11设置。
实施例9
本实施例公开了一种电容屏卡组件，包括玻璃盖板13、PCB控制板19、A转接板14、B转接板15、FPC驱动板16、FPC感应板17和ITO膜功能片18，所述玻璃盖板13与ITO膜功能片18通过OCA光学胶12粘固连接，所述ITO膜功能片18包括通过OCA光学胶12粘固成一体的感应层1和驱动层2，玻璃盖板13与ITO膜功能片18粘固后，感应层1位于玻璃盖板13与驱动层2之间；所述驱动层2上均匀设置有多根相互平行的驱动电极3，所述感应层1上均匀设置有多根相互平行的感应电极4，优选驱动电极3横向排布，感应电极4竖向排布，且优选感应电极4与驱动电 极3纵横相交排布；所述驱动层2的纵向边上一体成型有驱动银浆走线区5，驱动银浆走线区5内设置有多个驱动银浆焊盘6和多根驱动银浆线7，多个驱动银浆焊盘6通过多根驱动银浆线7分别与多根驱动电极3相连；所述感应层1的其中一条横向边上一体成型有感应银浆走线区8，感应银浆走线区8内设置有多个感应银浆焊盘9和多根感应银浆线10，多个感应银浆焊盘9通过多根感应银浆线10分别与多根感应电极4相连；FPC驱动板16的两端分别与A转接板14和驱动银浆焊盘6连接，FPC感应板17的两端分别与B转接板15和感应银浆焊盘9连接，A转接板14和B转接板15均与PCB控制板19连接。具体的，FPC驱动板16和FPC感应板17上均设置有多个金属焊盘和多根分别与金属焊盘相连的银连线，FPC驱动板16通过其上的金属焊盘与驱动银浆焊盘6热压合连接，FPC感应板17通过其上的金属焊盘与感应银浆焊盘9热压合连接。
本实施例中，如图20-21所示，所述驱动银浆走线区5一体成型在驱动层2的其中一条纵向边上，即所述ITO膜功能片18为单驱功能片，该单驱功能片使得电容屏卡组件适用于27寸以下尺寸的电容屏。所述驱动银浆走线区5的数量至少为两个，驱动银浆走线区5中所有驱动银浆线7的数量之和等于驱动电极3的数量，驱动银浆走线区5中所有的驱动银浆线7与多根驱动电极3一一对应连接，每个驱动银浆走线区5对应连接一块FPC驱动板16和一块A转接板14。所述感应银浆走线区8的数量至少为两个，感应银浆走线区8中所有感应银浆线10的数量之和等于感应电极4的数量，感应银浆走线区8中所有的感应银浆线10与多根感应电极4一一对应连接，每个感应银浆走线区8对应连接一块FPC感应板17和一块B转接板15。
进一步的，驱动银浆走线区5和感应银浆走线区8均优选为矩形结构，其大小以刚好能够设置对应的银浆线和焊盘为佳。从图20-21上看，就相当于是在驱动层2的纵向边上有多块凸出区域和在感应层1的横向边上有多块凸出区域。该种结构使得驱动银浆走线区5和感应银浆走线区8的体积较小，既有利于驱动银浆走线区5和感应银浆走线区8，又有利于进一步减少材料用量。
实施例10
本实施例与实施例7基本相同，主要区别在于，
如图22-23所示，所述驱动层2的两条纵向边上均一体成型有驱动银浆走线区5，即所述ITO膜功能片18为双驱功能片，该双驱功能片使得电容屏卡组件适用于27寸及以上的大尺寸电容屏。两条纵向边上的驱动银浆走线区5中所有的驱动银浆线7均与驱动电极3连接，具体来说，就是每根驱动银浆线7的两端分别与两条纵向边上的驱动银浆走线区5中的驱动银浆线7相连。进一步的，两条纵向边上的驱动银浆走线区5各自对应连接一块FPC驱动板16和一块A转接板14。
实施例11
本实施例与实施例8基本相同，主要区别在于，
如图24所示，所述驱动层2的两条纵向边上均一体成型有驱动银浆走线区5，即所述ITO膜功能片18为双驱功能片，该双驱功能片使得电容屏卡组件适用于27寸及以上的大尺寸电容屏。两条纵向边上的驱动银浆走线区5中所有的驱动银浆线7均与驱动电极3连接，具体来说，就是每根驱动银浆线7的两端分别与两条纵向边上的驱动银浆走线区5中的驱动银浆线7相连。进一步的，两条纵向边上的驱动银浆走线区5各自对应连接一块FPC驱动板16和一块A转接板14。
实施例12
本实施例与实施例9基本相同，主要区别在于，
如图25所示，所述驱动层2的两条纵向边上均一体成型有驱动银浆走线区5，即所述ITO膜功能片18为双驱功能片，该双驱功能片使得电容屏卡组件适用于27寸及以上的大尺寸电容屏。两条纵向边上的驱动银浆走线区5中所有的驱动银浆线7均与驱动电极3连接，具体来说，就是每根驱动银浆线7的两端分别与两条纵向边上的驱动银浆走线区5中的驱动银浆线7相连。进一步的，每个驱动银浆走线区5各自对应连接一块FPC驱动板16和一块A转接板14。
综上所述，本发明整个结构组装完成后，驱动银浆走线区5和感应银浆走线区8均折叠隐藏，且ITO膜功能片18上与玻璃盖板13相对应的区域无焊盘，使得电容屏的边框能够进一步做到更窄。仅为本发明的具体实施方式，本说明书中所公开的任一特征，除非特别叙述，均可被其他等效或具有类似目的替代特征加以替换；所公开的所有特征、或所有方法或过程中的步骤，除了互相排斥的特征和/或步骤以外，均可以任何方式组合。

Claims (13)

  1. 一种ITO膜功能片，包括粘固成一体的感应层(1)和驱动层(2)，其特征在于：所述驱动层(2)上均匀设置有多根相互平行的驱动电极(3)，所述感应层(1)上均匀设置有多根相互平行的感应电极(4)；所述驱动层(2)的纵向边上一体成型有驱动银浆走线区(5)，驱动银浆走线区(5)内设置有多个驱动银浆焊盘(6)和多根驱动银浆线(7)，多个驱动银浆焊盘(6)通过多根驱动银浆线(7)分别与多根驱动电极(3)相连；所述感应层(1)的其中一条横向边上一体成型有感应银浆走线区(8)，感应银浆走线区(8)内设置有多个感应银浆焊盘(9)和多根感应银浆线(10)，多个感应银浆焊盘(9)通过多根感应银浆线(10)分别与多根感应电极(4)相连。
  2. 根据权利要求1所述的一种ITO膜功能片，其特征在于：所述驱动银浆走线区(5)和感应银浆走线区(8)均为矩形结构。
  3. 根据权利要求2所述的一种ITO膜功能片，其特征在于：所述驱动银浆走线区(5)内和感应银浆走线区(8)内均设置有缕空区域(11)，驱动银浆焊盘(6)设置在驱动银浆走线区(5)中的缕空区域(11)一侧，驱动银浆线(7)围绕缕空区域(11)设置；感应银浆焊盘(9)设置在感应银浆走线区(8)中的缕空区域(11)一侧，感应银浆线(10)围绕缕空区域(11)设置。
  4. 根据权利要求1所述的一种ITO膜功能片，其特征在于：所述驱动银浆走线区(5)的数量至少为两个，驱动银浆走线区(5)中的驱动银浆线(7)均与多根驱动电极(3)连接。
  5. 根据权利要求1所述的一种ITO膜功能片，其特征在于：所述感应银浆走线区(8)的数量至少为两个，感应银浆走线区(8)中的感应银浆线(10)均与多根感应电极(4)连接。
  6. 根据权利要求1-5中任一项所述的一种ITO膜功能片，其特征在于：所述驱动层(2)的两条纵向边上均一体成型有驱动银浆走线区(5)，两条纵向边上的驱动银浆走线区(5)中的驱动银浆线(7)均与驱动电极(3)连接。
  7. 一种电容屏卡组件，其特征在于：包括玻璃盖板(13)、PCB控 制板(19)、A转接板(14)、B转接板(15)、FPC驱动板(16)、FPC感应板(17)和ITO膜功能片(18)，所述玻璃盖板(13)与ITO膜功能片(18)粘固连接，所述ITO膜功能片(18)包括粘固成一体的感应层(1)和驱动层(2)，所述驱动层(2)上均匀设置有多根相互平行的驱动电极(3)，所述感应层(1)上均匀设置有多根相互平行的感应电极(4)；所述驱动层(2)的纵向边上一体成型有驱动银浆走线区(5)，驱动银浆走线区(5)内设置有多个驱动银浆焊盘(6)和多根驱动银浆线(7)，多个驱动银浆焊盘(6)通过多根驱动银浆线(7)分别与多根驱动电极(3)相连，FPC驱动板(16)的两端分别与A转接板(14)和驱动银浆焊盘(6)连接；所述感应层(1)的其中一条横向边上一体成型有感应银浆走线区(8)，感应银浆走线区(8)内设置有多个感应银浆焊盘(9)和多根感应银浆线(10)，多个感应银浆焊盘(9)通过多根感应银浆线(10)分别与多根感应电极(4)相连，FPC感应板(17)的两端分别与B转接板(15)和感应银浆焊盘(9)连接，A转接板(14)和B转接板(15)均与PCB控制板(19)连接。
  8. 根据权利要求7所述的一种电容屏卡组件，其特征在于：所述FPC驱动板(16)和FPC感应板(17)上均设置有多个金属焊盘和多根分别与金属焊盘相连的银连线，FPC驱动板(16)通过金属焊盘与驱动银浆焊盘(6)热压合连接，FPC感应板(17)通过金属焊盘与感应银浆焊盘(9)热压合连接。
  9. 根据权利要求所述的一种电容屏卡组件，其特征在于：所述驱动银浆走线区(5)和感应银浆走线区(8)均为矩形结构。
  10. 根据权利要求9所述的一种电容屏卡组件，其特征在于：所述驱动银浆走线区(5)内和感应银浆走线区(8)内均设置有缕空区域(11)，驱动银浆焊盘(6)设置在驱动银浆走线区(5)中的缕空区域(11)一侧，驱动银浆线(7)围绕缕空区域(11)设置；感应银浆焊盘(9)设置在感应银浆走线区(8)中的缕空区域(11)一侧，感应银浆线(10)围绕缕空区域(11)设置。
  11. 根据权利要求7所述的一种电容屏卡组件，其特征在于：所述驱动银浆走线区(5)的数量至少为两个，驱动银浆走线区(5)中的驱动银浆线(7)均与多根驱动电极(3)连接，每个驱动银浆走线区(5)对应连 接一块FPC驱动板(16)和一块A转接板(14)。
  12. 根据权利要求7所述的一种电容屏卡组件，其特征在于：所述感应银浆走线区(8)的数量至少为两个，感应银浆走线区(8)中的感应银浆线(10)均与多根感应电极(4)连接，每个感应银浆走线区(8)对应连接一块FPC感应板(17)和一块B转接板(15)。
  13. 根据权利要求7-12中任一项所述的一种电容屏卡组件，其特征在于：所述驱动层(2)的两条纵向边上均一体成型有驱动银浆走线区(5)，两条纵向边上的驱动银浆走线区(5)中的驱动银浆线(7)均与驱动电极(3)连接。
PCT/CN2020/086394 2020-02-26 2020-04-23 一种ito膜功能片以及电容屏卡组件 WO2021169012A1 (zh)

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CN203535621U (zh) * 2013-11-20 2014-04-09 北京集创北方科技有限公司 一种二维电容式触摸屏
CN207976867U (zh) * 2018-04-18 2018-10-16 深圳市成鸿科技有限公司 一种电容触摸屏走线结构
US10275106B2 (en) * 2017-06-21 2019-04-30 Samsung Display Co., Ltd. Display device and method of fabricating the same
CN110174967A (zh) * 2019-05-23 2019-08-27 成都吉锐时代触摸技术有限公司 一种窄边框电容屏的制备工艺

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CN203535621U (zh) * 2013-11-20 2014-04-09 北京集创北方科技有限公司 一种二维电容式触摸屏
US10275106B2 (en) * 2017-06-21 2019-04-30 Samsung Display Co., Ltd. Display device and method of fabricating the same
CN207976867U (zh) * 2018-04-18 2018-10-16 深圳市成鸿科技有限公司 一种电容触摸屏走线结构
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