WO2021164757A1 - Carte à puce et son procédé de fabrication - Google Patents

Carte à puce et son procédé de fabrication Download PDF

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Publication number
WO2021164757A1
WO2021164757A1 PCT/CN2021/077016 CN2021077016W WO2021164757A1 WO 2021164757 A1 WO2021164757 A1 WO 2021164757A1 CN 2021077016 W CN2021077016 W CN 2021077016W WO 2021164757 A1 WO2021164757 A1 WO 2021164757A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
backplane
smart card
metal layer
metal
Prior art date
Application number
PCT/CN2021/077016
Other languages
English (en)
Inventor
Teng ZENG
Chen Fang
Dunpu WANG
Original Assignee
Giesecke+Devrient Mobile Security Gmbh
Giesecke+Devrient (China) Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke+Devrient Mobile Security Gmbh, Giesecke+Devrient (China) Technologies Co., Ltd. filed Critical Giesecke+Devrient Mobile Security Gmbh
Publication of WO2021164757A1 publication Critical patent/WO2021164757A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/06187—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with magnetically detectable marking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets

Definitions

  • the invention relates to the technical field of smart cards, in particular to a smart card and a manufacturing method thereof.
  • the present invention provides a smart card, which can improve individuality and aesthetics by embedding decorative pieces with stereoscopy on a metal layer.
  • the present invention provides a smart card, which includes the following.
  • a metal layer which is laminated on the backplane layer, wherein the metal layer has an embedding holes, and the embedding hole is recessed from a surface of the metal layer away from the backplane layer toward the backplane layer;
  • a decorative pieces which are embedded in the embedding holes.
  • a number of the embedding holes is more than two, and a minimum distance between two adjacent embedding holes is greater than or equal to 0.3 mm.
  • a minimum distance from an embedding hole to an edge of the metal layer is greater than or equal to 1 mm.
  • a minimum distance from a bottom of an embedding hole to a surface of the metal layer near the backplane layer is greater than or equal to 0.2 mm.
  • the metal layer is a titanium alloy layer or a stainless steel layer.
  • the metal layer has an annular recess, and the annular recess is recessed from a surface of the metal layer toward the backplane layer in a direction away from the backplane layer, and the metal layer further comprises an annular ferrite layer and an annular antenna layer which are laminated in the annular recess and the annular ferrite layer disposed between the annular antenna layer and the metal layer.
  • the metal layer has a central recess which is located in the annular recess
  • the smart card further comprises a central ferrite layer which is arranged in the central recess.
  • the smart card further comprises a bonding glue layer, the annular ferrite layer is bonded to a bottom wall of the annular recess through the bonding glue layer, and the central ferrite layer is bonded to the bottom wall of the central recess through the bonding glue layer.
  • the smart card further comprises a bonding layer, and the bonding layer bonds the backplane layer and the metal layer.
  • the decorative pieces are one or more of diamonds, gems, and jade.
  • the smart card provided by the invention comprises a backplane layer, a metal layer, and decorative pieces embedded on a metal layer.
  • the metal layer is provided with an embedding holes.
  • Decorative pieces decorative pieces are fixed and installed in the embedding holes of the metal layer. The decorative pieces can improve the aesthetic appearance of the manufactured smart card, show more individuality, and improve the noble texture and stereoscopy of the smart card.
  • a manufacturing method of a smart card which includes the following steps.
  • a backplane layer is manufactured.
  • a metal layer is manufactured, and the metal layer is laminated on the backplane layer.
  • Embedding holes are processed, wherein the embedding holes are processed on a surface of the metal layer away from the backplane layer;
  • Decorative pieces decorative pieces are embedded, wherein the decorative pieces are embedded in the embedding holes.
  • manufacturing the backplane layer includes the following steps:
  • a card body structure to be processed is manufactured, wherein a backplane base layer, a peelable layer, and a thickness compensation layer are sequentially laminated and subjected to hot pressing treatment to form the card body structure;
  • a surface element layer is manufactured, wherein the surface element layer is processed and formed on a surface of the backplane base layer away from the peelable layer.
  • the peelable layer and the thickness compensation layer are peeled off, wherein the backplane base layer and the surface element layer are constructed into the backplane layer.
  • the peelable layer is an offset printing ink layer or a screen printing ink layer; and/or the surface element layer comprises at least one of a magnetic strip, an anti-counterfeit label and a signature strip; and/or the backplane base layer comprises a glue film layer, a printed graphic layer and a backside substrate layer which are laminated, wherein the backside substrate layer is connected with the peelable layer, and the surface element layer is formed on a surface of the glue film layer away from the peelable layer.
  • FIG. 1 is a schematic structural diagram of a top view of a smart card disclosed in an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a sectional view along the A-A direction in FIG. 1.
  • FIG. 3 is a schematic structural diagram of a partial sectional view of a backplane layer disclosed in an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a partial sectional view of a smart card disclosed in an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a sectional view of a smart card disclosed in another embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a partial sectional view of a smart card disclosed in another embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a top view of a smart card disclosed in another embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a sectional view along the B-B direction in FIG. 7.
  • FIG. 9 is a schematic structural diagram of a card body disclosed in an embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of a card body structure provided with a surface element layer according to an embodiment of the present invention.
  • FIG. 11 is a schematic structural diagram of a backplane layer disclosed in an embodiment of the present invention.
  • Backplane layer 10.
  • Backplane base layer 111, Glue film layer; 112, Printed graphic layer; 113, Backside substrate layer; 12.
  • a plurality of/multiple means two or more;
  • the terms “upper” , “lower” , “left” , “right” , “inner/in” , “outer” , etc. indicate the orientation or positional relationship only for the convenience of describing the invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the invention.
  • the terms “first” , “second” , “third” , etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
  • the embodiment of the present invention provides a smart card 1.
  • the smart card 1 can be used to implement electronic transaction functions.
  • the smart card 1 is a type of card with a predetermined length, width, and thickness, and also has portability and ease of use.
  • the smart card 1 may be a financial card, a credit card, a stored-value card, a bus card, an access card, or a membership card, but it is not limited to the card types listed above.
  • the thickness of the card needs to meet a standard thickness of 0.76 mm (millimeters) to 0.84 mm to ensure the normal use of the card.
  • the smart card 1 includes a backplane layer 10, a metal layer 20, and decorative pieces 30.
  • the metal layer 20 and the backplane layer 10 are laminated and connected and fixed to each other.
  • the metal layer 20 has an upper surface and a lower surface.
  • the upper surface of the metal layer 20 serves as a front surface of the smart card 1
  • a lower surface of the backplane layer 10 serves as a back surface of the smart card 1.
  • An edge of the metal layer 20 and the backplane layer 10 are aligned with each other along the thickness direction X.
  • the backplane layer 10 includes a backplane base layer 11 and a surface element layer 12 laminated on the backplane base layer 11.
  • the backplane base layer 11 includes a glue film layer 111, a printed graphic layer 112, and a backside substrate layer 113 that are laminated.
  • the backside substrate layer 113 faces the metal layer 20 and is connected and fixed to the metal layer 20.
  • the surface element layer 12 is disposed on a surface of the glue film layer 111 away from the metal layer 20.
  • the surface element layer 12 includes at least one of a magnetic strip 121, a signature strip 122, and an anti-counterfeiting label 123.
  • the metal layer 20 in the embodiment of the present invention, relative to a plastic material layer of the same thickness, the metal layer 20 itself has a predetermined thickness and high rigidity, so that it is not prone to deformation and bending due to force, and it is also beneficial to improve the overall rigidity and deformation resistance of the smart card 1 itself.
  • the metal layer 20 of the embodiment of the present invention has embedding holes 21.
  • the embedding holes 21 are recessed from a surface of the metal layer 20 away from the backplane layer 10 toward the backplane layer 10.
  • an engraving machine or a hole milling machine can be used to process and manufacture the embedding holes 21 on the metal layer 20.
  • a number of the embedding holes 21 may be two or more.
  • a minimum distance L1 between two adjacent embedding holes 21 is greater than or equal to 0.3 mm so that when two adjacent embedding holes 21 are processed, a possibility that the two embedding holes 21 overlap each other due to the position interference between the two embedding holes 21 can be reduced, and a possibility, that an area between the two embedding holes 21 is too small because a distance between the two embedding holes 21 is too close to each other, which in turn leads to that the area is just too small and is prone to deformation or cracking, can also be reduced.
  • decorative pieces 30 are installed and fixed in the embedding holes 21 of the metal layer 20.
  • the decorative pieces 30 can improve the aesthetic appearance of the finished smart card 1, can show more individuality, and improve the noble texture and stereoscopy of the smart card 1.
  • a part of a decorative piece 30 embedded in an embedding hole 21 matches a shape of the embedding hole 21.
  • the decorative piece 30 is a diamond.
  • the types of diamonds include but are not limited to Flat-bottomed diamonds and culet-bottomed diamonds.
  • the diamond may be but is not limited to crystal diamonds. Understandably, the decorative piece 30 is not limited to the above-mentioned diamond, and may also be a gem or a jade.
  • the decorative elements 30 may be freely mixed and matched combinations of diamonds, gems, and jades to present different textures and impressions.
  • a bonding glue is pre-filled in the embedding holes 21 manufactured and processed, and then the decorative pieces 30 are put into the embedding holes 21. After the bonding glue is cured, the decorative pieces 30 are connected and fixed to the metal layer 20.
  • an appearance layer of the smart card 1 is provided with decorative pieces 30 with strong stereoscopy, the individuality and nobleness of cardholders can be highlighted, and the experience satisfaction of cardholders can be improved.
  • the smart card 1 uses the metal layer 20 as a foundation, and then sets embedding holes 21 on the metal layer 20, and finally embeds the decorative pieces 30 in the embedding holes 21.
  • plastic substrates including PVC, PC, PET, etc.
  • the metal layer 20 itself has high rigidity and good bending resistance, thereby reducing the possibility that the smart card 1 will bend and cause the decorative pieces 30 to fall off, and improving the connection stability of the decorative pieces 30.
  • a plurality of embedding holes 21 are arranged in rows and columns on the metal layer 20.
  • a minimum distance L2 between the outermost circle of embedding holes 21 and the edge of the metal layer 20 is equal to 1 mm so that the entire layout of the metal layer 20 is basically covered with the embedding holes 21.
  • one decorative piece 30 is embedded in each embedding hole 21, so that all the decorative pieces 30 basically cover the entire layout of the metal layer 20.
  • a graphic design of the full-page decorative pieces 30 can be carried out according to an arrangement design of the embedding holes 21 on the metal layer 20, or different graphic layout information can be obtained by embedding a combination of decorative pieces 30 with different colors at different positions of the embedding holes 21. Referring to FIG.
  • a number of the embedding holes 21 disposed on the metal layer 20 may also be one or two, or a certain number of embedding holes 21 can be disposed on a small area of the metal layer 20.
  • a minimum distance L2 between an embedding hole 21 and the edge of the metal layer 20 is not limited to the above-mentioned 1 mm, but may be larger than 1 mm, so that a possibility of the decorative piece 30 falling due to the impact force applied to the edge during the falling process of the smart card 1 can be effectively reduced.
  • the embedding holes 21 can be formed on almost the whole layout of the metal layer 20, and a number density of the embedding holes 21 can also be increased.
  • a minimum distance L1 between two adjacent embedding holes 21 may be equal to 0.3 mm.
  • a minimum distance L3 from a bottom of an embedding hole 21 to a surface of the metal layer 20 close to the backplane layer 10 is greater than or equal to 0.2 mm, compared with an embodiment in which the embedding hole 21 penetrates through the metal layer 20, it is beneficial to ensure the rigidity of the metal layer 20 after processing and forming the embedding holes 21, and it is also beneficial to reduce a possibility of inaccurate positioning caused by the decorative pieces 30 being easily stuck at lower openings of the embedding holes 21 in the embedding holes 21, and improve the convenience of subsequent operation of embedding the decorative pieces 30.
  • the embedding hole 21 may be a blind hole.
  • the metal layer 20 is a titanium alloy layer or a stainless steel layer.
  • the metal layer 20 is a titanium alloy layer with high strength and good corrosion resistance.
  • the backplane layer 10 covers the lower surface of the metal layer 20.
  • the material of the backplane layer 10 cannot be a material that has a shielding effect on electromagnetic fields, such as metal, so as to avoid affecting the normal use of the smart card 1.
  • the material of the backplane layer 10 can be selected from PVC, PETG, ABS, and other materials.
  • the metal layer 20 has an annular recess 22.
  • the annular recess 22 is recessed from a surface of the metal layer 20 toward the backplane layer 10 in a direction away from the backplane layer 10.
  • the smart card 1 further includes an annular ferrite layer 40 and an annular antenna layer 50.
  • ferrite is a composite oxide containing iron oxide and other iron or rare earth oxides as main components.
  • the annular ferrite layer 40 and the annular antenna layer 50 are laminated in the annular recess 22.
  • the annular ferrite layer 40 is disposed between the annular antenna layer 50 and the metal layer 20.
  • the annular antenna layer 50 can be used to transfer information, so that the smart card 1 forms a contact IC card.
  • the annular ferrite layer 40 can improve the shielding effect of the metal layer 20 on electromagnetic waves.
  • the annular ferrite layer 40 is inserted into the annular recess 22 and then bonded to the metal layer 20, and the annular antenna layer 50 is inserted into the annular recess 22 and then bonded to the annular ferrite layer 40.
  • the metal layer 20 has a central recess 23.
  • the central recess 23 is located in the annular recess 22.
  • the smart card 1 also includes a central ferrite layer 60.
  • the central ferrite layer 60 is arranged in the central recess 23 and located inside the annular ferrite layer 40.
  • the central ferrite layer 60 is inserted into the central recess 23 and directly bonded and fixed to a bottom wall of the central recess 23.
  • the central ferrite layer 60 arranged in a middle area of the smart card 1 can improve an electromagnetic wave capability of the annular antenna layer 50, effectively increase a response distance of the smart card 1, and meet a normal transaction function of the smart card 1.
  • a thickness of the central ferrite layer 60 is equal to a thickness of the annular ferrite layer 40.
  • the smart card 1 further includes a bonding glue layer 70.
  • the annular ferrite layer 40 is installed in the annular recess 22, the annular ferrite layer 40 is bonded to a bottom wall of the annular recess 22 through the bonding glue layer 70.
  • the annular antenna layer 50 is installed in the annular recess 22, the annular antenna layer 50 is bonded to the annular ferrite layer 40 by the bonding glue layer 70.
  • the central ferrite layer 60 is installed in the central recess 23, the central ferrite layer 60 is bonded to a bottom wall of the central recess 23 through a bonding glue layer 70.
  • the bonding glue layer 70 may be liquid quick-drying glue or double-sided glue.
  • the smart card 1 further includes a bonding layer 80.
  • the bonding layer 80 bonds the backplane layer 10 and the metal layer 20.
  • a connection difficulty between the backplane layer 10 and the metal layer 20 can be reduced by bonding the backplane layer 10 and the metal layer 20 through the bonding layer 80, thereby reducing the possibility of depression or fracture of the metal layer 20 caused by excessive stress in a process of press molding.
  • the bonding layer 80 may be a glue layer or a double-sided glue layer.
  • the smart card 1 further includes a contact IC chip 90.
  • the IC chip 90 is embedded in the metal layer 20.
  • the position arrangement of the embedding holes 21 and the position arrangement of the decorative pieces 30 need to avoid the position of the IC chip 90 to ensure a normal reading of the smart card 1.
  • the smart card 1 only uses the contact IC chip 90 to complete a transaction work, so that there is no need to arrange the annular recess 22 and the central recess 23 on the lower surface of the metal layer 20.
  • the backplane layer 10 can be directly bonded and fixed to the metal layer 20 through the bonding layer 80.
  • the embodiment of the present invention also provides a manufacturing method of a smart card 1, which includes the following steps:
  • a backplane layer 10 is manufactured.
  • a metal layer 20 is manufactured, and the metal layer 20 is laminated on the backplane layer 10.
  • Embedding holes 21 are processed, wherein the embedding holes 21 are processed on a surface of the metal layer 20 away from the backplane layer 10.
  • Decorative pieces 30 are embedded, wherein the decorative pieces 30 are embedded in the embedding holes 21.
  • the metal layer 20 is used as a base material for the embedded decorative pieces 30 on a front side of the smart card 1, and a thickness of the backplane base layer 11 is very thin, it is very difficult to manufacture the surface element layer 12 on the backplane base layer 11 with small thickness after connecting and fixing the metal layer 20 and the backplane base layer 11, and high processing equipment is required, resulting in high processing cost.
  • the processing cost can be reduced on the premise of ensuring a processing quality of the backplane base layer 11.
  • the metal layer 20 and the backplane layer 10 are separately manufactured and then assembled to form the smart card 1, which is conducive to reducing the processing difficulty and cost of the backplane layer 10 and also reducing the possibility of structural damage of the backplane layer 10 during processing.
  • the above steps of manufacturing the backplane layer 10 include the following steps:
  • the card body structure 100 to be processed is manufactured, a backplane base layer 11, a peelable layer 200, and a thickness compensation layer 300 are sequentially laminated and subjected to hot pressing treatment to form the card body structure 100.
  • a surface element layer 12 is manufactured, the surface element layer 12 is processed and formed on a surface of the backplane base layer 11 away from the peelable layer 200.
  • the peelable layer 200 and the thickness compensation layer 300 are peeled off, the backplane base layer 11, and the surface element layer 12 are constructed into the backplane layer 10.
  • the card body structure 100 is an analog card
  • the peelable layer 200 and the thickness compensation layer 300 are used for thickness compensation in the thickness direction X, so that the thickness dimensions of the card body structure 100 can meet the processing requirements, thereby ensuring normal card running on processing equipment, and enabling the corresponding equipment to process and form the surface element layer 12 on the backplane base layer 11.
  • the thickness compensation layer 300 includes a front compensation layer 301 and an intermediate compensation layer 302.
  • the peelable layer 200 is disposed between the intermediate compensation layer 302 and the backplane base layer 11.
  • the front compensation layer 301 and the middle compensation layer 302 are PVC white substrates with a thickness of 0.33 mm.
  • connection forces between the peelable layer 200 and the backplane base layer 11 and the thickness compensation layer 300 are weak. After the surface element layer 12 is formed on the backplane base layer 11, it is easy to separate the peelable layer 200 and the thickness compensation layer 300 from the backplane layer 10 together.
  • the various layer structures are combined into a whole after hot pressing treatment, and cannot be separated from each other.
  • the present invention adopts the following technical scheme:
  • the peelable layer 200 is an offset printing ink or a screen printing ink.
  • offset printing ink or screen printing ink spreads over the backplane base layer 11. Since the peelable layer 200 separates the thickness compensation layer 300 and the backplane base layer 11, the thickness compensation layer 300 and the backplane base layer 11 will not be combined into a whole after hot pressing treatment, thus ensuring that the thickness compensation layer 300 can be easily separated from the backplane base layer 11 after hot pressing.
  • the surface element layer 12 includes at least one of a magnetic strip 121, an anti-counterfeiting label 123, and a signature strip 122.
  • the surface element layer 12 is not limited to the types listed above, and a specific layer structure can be provided according to product requirements.
  • the backplane base layer 11 includes a glue film layer 111, a printed graphic layer 112, and a backside substrate layer 113 that are laminated.
  • the backside substrate layer 113 is connected to the peelable layer 200.
  • a surface element layer 12 is formed on a surface of the glue film layer 111 away from the peelable layer 200.
  • the backside substrate layer 113 may be a PVC white substrate or a PVC black substrate.
  • a thickness of the backside substrate layer 113 is 0.12 mm.
  • the printed graphic layer 112 contains text information and picture information.
  • the printed graphic layer 112 is formed by screen printing or offset printing in four colors.
  • the glue film layer 111 may be a PVC glue film.
  • a thickness of the glue film layer 111 is 0.06 mm.
  • the surface element layer 12 is a magnetic strip 121, and it is processed and formed on the glue film layer 111 by a magnetic mounting method.
  • the surface element layer 12 is the anti-counterfeiting label 123 or the signature strip 122, and both are processed and formed on the glue film layer 111 by means of hot stamping.
  • the smart card 1 or the smart card 1 manufactured by the manufacturing method of the smart card 1 according to the embodiment of the present invention includes a backplane layer 10, a metal layer 20, and decorative pieces 30 embedded on a metal layer 20.
  • the decorative pieces 30 help enhancing the aesthetic and noble effect of the smart card 1, showing the individuality of the smart card 1. Since the metal layer 20 has high rigidity and good bending resistance, the metal layer 20 is not prone to the possibility that the decorative piece 30 embedded in the metal layer 20 is easy to fall due to deformation, and the metal layer 20 can be provided with embedding holes 21 with higher number density without reducing the overall rigidity of the smart card 1.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une carte à puce (1) et son procédé de fabrication. La carte à puce (1) comprend une couche de fond de panier (10) ; une couche métallique (20) stratifiée sur la couche de fond de panier (10), la couche métallique (20) présentant des trous d'incorporation (21), et les trous d'incorporation (21) étant évidés à partir d'une surface de la couche métallique à l'opposé de la couche de fond de panier (10) vers la couche de fond de panier (10) ; et des pièces décoratives (30) incorporées dans les trous d'incorporation (21). La carte à puce (20) peut améliorer l'individualisation et l'esthétique par incorporation de pièces décoratives (30) avec stéréoscopie sur la couche métallique (20).
PCT/CN2021/077016 2020-02-21 2021-02-20 Carte à puce et son procédé de fabrication WO2021164757A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010107831.4 2020-02-21
CN202010107831.4A CN111340170A (zh) 2020-02-21 2020-02-21 智能卡及其制造方法

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WO2021164757A1 true WO2021164757A1 (fr) 2021-08-26

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PCT/CN2021/077016 WO2021164757A1 (fr) 2020-02-21 2021-02-20 Carte à puce et son procédé de fabrication

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4121899A4 (fr) * 2020-02-21 2024-03-20 Giesecke+Devrient ePayments GmbH Carte à puce

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111340170A (zh) * 2020-02-21 2020-06-26 捷德(中国)科技有限公司 智能卡及其制造方法
CN213365548U (zh) * 2020-07-22 2021-06-04 捷德(中国)科技有限公司 识别卡

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201020959Y (zh) * 2007-01-16 2008-02-13 黄石捷德万达金卡有限公司 一种镶嵌钻石或其它饰品的交易卡
CN203164994U (zh) * 2013-03-11 2013-08-28 兰荣 镶钻智能卡
CN110168567A (zh) * 2017-01-11 2019-08-23 安全创造有限责任公司 金属双界面卡
CN111340170A (zh) * 2020-02-21 2020-06-26 捷德(中国)科技有限公司 智能卡及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201020959Y (zh) * 2007-01-16 2008-02-13 黄石捷德万达金卡有限公司 一种镶嵌钻石或其它饰品的交易卡
CN203164994U (zh) * 2013-03-11 2013-08-28 兰荣 镶钻智能卡
CN110168567A (zh) * 2017-01-11 2019-08-23 安全创造有限责任公司 金属双界面卡
CN111340170A (zh) * 2020-02-21 2020-06-26 捷德(中国)科技有限公司 智能卡及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4121899A4 (fr) * 2020-02-21 2024-03-20 Giesecke+Devrient ePayments GmbH Carte à puce

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