WO2021160060A1 - 散热器、单板、电子设备及制造方法 - Google Patents

散热器、单板、电子设备及制造方法 Download PDF

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Publication number
WO2021160060A1
WO2021160060A1 PCT/CN2021/075735 CN2021075735W WO2021160060A1 WO 2021160060 A1 WO2021160060 A1 WO 2021160060A1 CN 2021075735 W CN2021075735 W CN 2021075735W WO 2021160060 A1 WO2021160060 A1 WO 2021160060A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
dissipation plate
heat
chip
heat sink
Prior art date
Application number
PCT/CN2021/075735
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English (en)
French (fr)
Inventor
郭志刚
Original Assignee
华为技术有限公司
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Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21753018.7A priority Critical patent/EP4086951A4/en
Publication of WO2021160060A1 publication Critical patent/WO2021160060A1/zh
Priority to US17/883,710 priority patent/US20220394875A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Definitions

  • This application relates to the field of heat dissipation technology, and in particular to a heat sink, a veneer, an electronic device, and a manufacturing method.
  • the chip of the electronic device generates more heat during operation.
  • a heat sink is usually installed on the chip, and the chip is dissipated to the outside through the heat sink.
  • a thermally conductive layer is filled between the chip and the heat sink, and in order to avoid a gap between the chip and the heat sink, the heat conduction between the chip and the heat sink is filled
  • the thickness of the layer is relatively thick.
  • the increase in the thickness of the heat-conducting layer will increase the thermal resistance of the heat-conducting layer and reduce the heat dissipation effect of the chip.
  • the embodiments of the present application provide a heat sink, a veneer, an electronic device, and a manufacturing method, which can overcome the problems of related technologies.
  • the technical solutions are as follows:
  • a heat sink in one aspect, includes heat dissipation teeth and opposing first and second heat dissipation plates, the heat dissipation teeth are located on the first heat dissipation plate, wherein: the second heat dissipation The board has flexibility, an elastic member is included between the first heat dissipation plate and the second heat dissipation plate, and the second heat dissipation plate is used to adhere to the heat source member.
  • the second heat dissipation plate is flexible and can be deformed by being squeezed, and an elastic member capable of expansion and contraction is installed between the first heat dissipation plate and the second heat dissipation plate.
  • an elastic member capable of expansion and contraction is installed between the first heat dissipation plate and the second heat dissipation plate.
  • the elastic member is one or more of spring, foam, elastic sheet and foam metal.
  • the elastic member may be a spring, and a plurality of springs may be installed between the first heat dissipation plate and the second heat dissipation plate.
  • the second heat dissipation plate is a metal sheet with a thickness within a target range.
  • the metal can be one or a combination of copper, aluminum, aluminum alloy, etc., and the specific material of the metal sheet is not limited in this embodiment, as long as it can realize heat conduction and heat transfer.
  • the second heat dissipation plate is a flexible member that can be deformed.
  • it may be a copper sheet with a relatively thin thickness, for example, it may be a thin copper sheet with a thickness of 0.3 mm or 0.5 mm.
  • the radiator is a vacuum chambers (VC) radiator or a water-cooled radiator.
  • the above-mentioned radiator may be a VC radiator or a water-cooled radiator.
  • a closed space is formed between the first heat dissipation plate and the second heat dissipation plate, and the closed space includes a liquid heat conducting material.
  • a closed space may be enclosed between the first heat dissipation plate and the second heat dissipation plate.
  • the enclosed space may be called the box body of the heat sink, and the box body may be filled with liquid heat conducting material to lift the heat sink. The heat dissipation effect.
  • the present application also provides a single board, the single board includes at least one chip, a circuit board, a base, and the above-mentioned heat sink, wherein: the circuit board is located on the base, so The at least one chip is located on the circuit board, the heat sink is located on the at least one chip, and the heat sink is fixed on the base; each of the chips and the second heat sink of the heat sink At least part of the board is in contact with each other.
  • the base serves as a support for the single board
  • the circuit board is mounted on the base
  • the chip can be soldered on the circuit board
  • the heat sink is placed on the chip
  • the heat sink is fixedly mounted on the base . It can be seen that the radiator can always be in a squeezed state with the chip, ensuring good contact between the radiator and the chip, so that the heat on the chip can be continuously transferred to the radiator and dissipated through the radiator.
  • the distance between the second heat dissipation plate and the circuit board is less than the height of the chip, and the distance between the second heat dissipation plate and the circuit board is smaller than the height of the chip.
  • the contact part of the chip is in a state of squeezing deformation.
  • the chip interference is located between the second heat dissipation plate and the circuit board, that is, the second heat dissipation plate is in an undeformed state.
  • the distance between the second heat dissipation plate and the circuit board is smaller than the height of the chip, so that the local part of the second heat dissipation plate that is in contact with the chip can be in a state of squeezing deformation.
  • a heat-conducting layer is placed between the second heat-dissipating plate of the heat sink and each of the chips, so that the second heat-dissipating plate and the chip are attached to each other through the heat-conducting layer combine.
  • a heat conduction layer is placed between the second heat dissipation plate and each chip, so that the second heat dissipation plate and the chip can communicate with each other through the heat conduction layer. Squeeze fit.
  • the first heat dissipation plate and the second heat dissipation plate are provided with screw holes at corresponding positions, and the circuit board corresponds to the screw holes of the second heat dissipation plate.
  • the position is provided with an escape hole; the bolt used to install the radiator on the base passes through the screw hole of the first heat dissipation plate, the screw hole of the second heat dissipation plate and the circuit
  • the escape hole of the board is installed on the base.
  • the heat sink can be installed on the base by bolts.
  • the bolts can pass through the screw holes of the first heat dissipation plate, the screw holes of the second heat dissipation plate, and the escape holes of the circuit board in sequence, and then be installed on the base. In the mounting holes. In this way, the radiator is supported by the base by the bolts to prevent the radiator from being pressed on the chip and causing damage to the chip.
  • the chip is soldered on the circuit board.
  • the chip can be mounted on the circuit board, for example, it can be soldered on the circuit board, which not only ensures the fixation of the chip and the circuit board, but also ensures the electrical connection between the chip and the circuit board.
  • the area of the heat sink is larger than the area of the chip.
  • the area of the heat sink is much larger than the area of the chip. In this way, although the heat sink is pressed against the chip, only a part of the heat sink is in contact with the chip, and the second heat dissipation plate of the heat sink is flexible. The deformation causes a small part of the weight of the heat sink to press on the chip, and most of the weight of the heat sink is supported by the base. Therefore, although the heat sink and the chip are in a squeezed state, it will not cause damage to the chip. In this way, not only the close fit between the heat sink and the chip is maintained, but the chip is not crushed and damaged.
  • an embodiment of the present application also provides an electronic device, which may include the single board described above.
  • an embodiment of the present application also provides a method for manufacturing a heat sink.
  • the method includes mounting a plurality of elastic elements on a first surface of a second heat dissipation plate, wherein the second heat dissipation plate is flexible, The second surface of the second heat dissipation plate is used to fit the heat source member; the first heat dissipation plate is mounted on the second heat dissipation plate, wherein the elastic member is located between the first heat dissipation plate and the Between the second heat sink.
  • the second heat dissipation plate when the heat sink is placed on the heat source element, the second heat dissipation plate is in contact with the heat source element, and the extrusion between the heat sink and the heat source element can cause the second heat dissipation plate to deform, and the first heat dissipation plate
  • the elastic member between the second heat dissipation plate and the second heat dissipation plate shrinks, which can eliminate the gap between the second heat dissipation plate and the heat source member, so that the second heat dissipation plate and the heat source member are closely attached, so that the heat generated by the heat source member can be quickly transferred Into the radiator, the heat dissipation effect of the radiator can be improved, and the heat dissipation is accelerated for the heat source.
  • the method further includes forming or installing a plurality of heat dissipation teeth on the surface of the first heat dissipation plate facing away from the elastic member.
  • the heat sink can increase the heat dissipation area of the heat sink through the heat dissipation teeth, improve the heat dissipation effect of the heat sink, and accelerate the heat dissipation of the heat source.
  • an embodiment of the present application also provides a method for manufacturing a single board.
  • the method includes mounting a circuit board on a base, and mounting at least one chip on the surface of the circuit board facing away from the base. Place the above-mentioned heat sink on at least one chip, and fix the heat sink on the base, wherein each chip is attached to at least part of the second heat dissipation plate of the heat sink .
  • the circuit board can be a single board.
  • the second heat dissipation plate of the heat sink is flexible, and the heat sink and the chip are in a squeezed state, so that the second heat dissipation plate is deformed.
  • the elastic member between the plates shrinks, which can eliminate the gap between the second heat dissipation plate and the chip, so that the second heat dissipation plate is closely attached to the chip, so that the heat generated by the chip can be quickly transferred to the heat sink. Improve the heat dissipation effect of the radiator and speed up the heat dissipation of the chip.
  • the method before placing the above-mentioned heat sink on the at least one chip, the method further includes placing a thermally conductive layer on the at least one chip.
  • a thermally conductive layer corresponding to the size of the chip may be placed on each chip. After that, the heat sink is placed on the chip with the thermally conductive layer on it. Wherein, the thickness of the heat conducting layer is relatively small, which is used to absorb the heat on the chip and transfer the heat on the chip to the second heat dissipation plate to accelerate the heat dissipation of the chip.
  • the heat sink includes a first heat dissipation plate and a second heat dissipation plate opposite to each other, and an elastic member capable of stretching and shrinking is included between the first heat dissipation plate and the second heat dissipation plate.
  • the second heat sink When the heat sink is placed on a heat source such as a chip, the second heat sink is in contact with the heat source, and the extrusion between the heat sink and the heat source can cause the second heat sink to deform, the first heat sink and the second heat sink
  • the elastic member between the plates shrinks, which can eliminate the gap between the second heat dissipation plate and the heat source member, so that the second heat dissipation plate and the heat source member are closely attached, so that the heat generated by the heat source member can be quickly transferred to the radiator Therefore, the heat dissipation effect of the radiator can be improved, and the heat dissipation can be accelerated for the heat source.
  • FIG. 1 is a schematic structural diagram of a heat sink provided by an embodiment of the present application.
  • Fig. 2 is a schematic structural diagram of a single board including a heat sink provided by an embodiment of the present application.
  • the embodiment of the present application relates to a radiator.
  • the radiator may be a vacuum chambers (VC) radiator, a water-cooled radiator, etc.
  • the specific type of the radiator is not limited in this embodiment.
  • the radiator is in contact with a heat source component that generates heat to dissipate heat from the heat source component.
  • the radiator can be in contact with a chip to dissipate heat for the chip.
  • the heat sink 1 may include heat dissipation teeth 12 and opposite first and second heat dissipation plates 111 and 112.
  • the heat dissipation teeth 12 are located on the first heat dissipation plate 111, and the second heat dissipation plate 112 is flexible.
  • a stretchable elastic member 13 is included between the two heat dissipation plates, and the second heat dissipation plate 112 is used to adhere to the heat source member.
  • a closed space may be enclosed between the first heat dissipation plate 111 and the second heat dissipation plate 112, and the closed space may include a liquid heat conducting material to improve the heat dissipation effect of the heat sink 1.
  • the closed space structure enclosed by the first heat dissipation plate 111 and the second heat dissipation plate 112 can be used as the box body 11 of the radiator 1.
  • the radiator 1 includes a box body 11 and The heat dissipation teeth 12, the first heat dissipation plate 111 and the second heat dissipation plate 112 are two opposite plate surfaces of the box body 11.
  • the heat dissipation teeth 12 are located on the first heat dissipation plate 111.
  • the second heat dissipation plate 112 is flexible and the first heat dissipation An elastic member 13 is included between the plate 111 and the second heat dissipation plate 112, and the second heat dissipation plate 112 is used to adhere to the chip.
  • the heat dissipation teeth 12 may be installed on the first heat dissipation plate 111; in other embodiments, the heat dissipation teeth 12 and the first heat dissipation plate 111 are integrally formed.
  • the material of the box body 11 may be metal, for example, the material of the box body 11 may be copper, aluminum or aluminum alloy, etc.
  • the specific material of the box body 11 is not limited in this embodiment, as long as it can realize heat conduction and heat transfer. .
  • the box body 11 may include a first heat dissipation plate 111, a second heat dissipation plate 112, and sidewalls connecting the first heat dissipation plate 111 and the second heat dissipation plate 112 in opposite positions.
  • the heat dissipating teeth 12 of the radiator 1 can be installed on the outer surface of the first heat dissipating plate 111.
  • the outer surface is also the surface facing away from the inside of the box body 11.
  • the heat dissipation teeth 12 can increase the heat dissipation area of the heat sink 1 and improve the heat dissipation effect of the heat sink 1.
  • the second heat dissipation plate 112 of the heat sink 1 is used to contact the heat source.
  • the second heat dissipation plate 112 has flexibility and is compressed. Can be deformed.
  • the second heat dissipation plate 112 may be a relatively thin copper sheet, such as a metal sheet with a thickness within a target range, for example, it may be a copper sheet with a thickness of 0.3 mm or 0.5 mm.
  • the above-mentioned metal sheet may also be an aluminum sheet or an aluminum alloy sheet, etc.
  • the specific material of the metal sheet is not limited in this embodiment, as long as it can realize heat conduction and heat transfer.
  • an elastic member 13 is installed between the first heat dissipation plate 111 and the second heat dissipation plate 112, so that when the radiator 1 is pressed against the heat source member, the second heat dissipation plate 112 is in contact with the heat source member.
  • the part of the contacting part is compressed and deformed, so that the heat source member is tightly attached to the second heat dissipation plate 112, so that the second heat dissipation plate 112 and the heat source member are maintained in a state of contact, avoiding the second heat dissipation plate 112
  • There is a gap between the heat source and the heat source which can improve the heat dissipation effect of the radiator.
  • the elastic member 13 located between the first heat dissipation plate 111 and the second heat dissipation plate 112 may be one or more of springs, foam, elastic sheets and foamed metal.
  • the elastic member 13 is a spring, and a plurality of springs are installed between the first heat dissipation plate 111 and the second heat dissipation plate 112.
  • the second heat dissipation plate 112 of the heat sink 1 for contacting with the heat source is flexible, and the second heat dissipation plate 112 is also equipped with an elastic member 13 which acts as a buffer.
  • the buffering radiator and the heat source component can always be kept in contact, so that the heat generated by the heat source component can be transferred to the radiator in time, and the heat is dissipated through the radiator, thereby improving the heat dissipation effect of the radiator.
  • the heat sink includes a box body and heat dissipation teeth.
  • the box body includes a first heat dissipation plate and a second heat dissipation plate.
  • the heat dissipation teeth are mounted on the first heat dissipation plate, and the second heat dissipation plate is flexible.
  • a stretchable elastic member is installed between the heat dissipation plate and the second heat dissipation plate. In this way, when the heat sink is placed on the heat source element, the second heat dissipation plate is in contact with the heat source element, and the squeezing between the heat sink and the heat source element can cause the second heat dissipation plate to deform, and the elastic element in the box body shrinks.
  • the gap between the second heat dissipation plate and the heat source element can be eliminated, so that the second heat dissipation plate and the heat source element are closely attached, so that the heat generated by the heat source element can be quickly transferred to the radiator, thereby improving the heat dissipation effect of the radiator , To speed up the heat dissipation of the heat source parts.
  • the heat sink 1 includes a first heat dissipation plate 111 and a second heat dissipation plate 112 opposite to each other.
  • the first heat dissipation plate 111 and the second heat dissipation plate 112 include an elastic member 13 between the first heat dissipation plate 111 and the second heat dissipation plate 112. Cooling teeth 12.
  • the elastic member 13 may be a metal elastic member.
  • the extrusion between the heat sink and the heat source element can cause the second heat dissipation plate to deform, and the elastic element in the box can shrink, which can eliminate
  • the gap between the second heat dissipation plate and the heat source element makes the second heat dissipation plate and the heat source element closely fit, so that the heat generated by the heat source element can be quickly transferred to the radiator, thereby improving the heat dissipation effect of the radiator.
  • the heat source component speeds up heat dissipation.
  • the embodiment of the present application also provides a single board.
  • the single board may be a main control board, a service board, or an interface board of an electronic device.
  • the single board may include a chip 2, a circuit board 3, and a base board.
  • the circuit board 3 is also a printed circuit board (PCB).
  • the base 4 can also be referred to as a pull strip, which is a kind of fixing member and can have a plate-like structure.
  • one heat sink 1 can dissipate heat for one chip 2, and one heat sink 1 can also dissipate heat for multiple chips 2.
  • This embodiment is not limited.
  • one heat sink 1 can be used to dissipate heat for one chip 2.
  • a heat sink 1 dissipates heat for multiple chips 2 is similar, and will not be repeated one by one.
  • the size of the circuit board 3 and the base 4 are equivalent, for example, the area of the circuit board 3 and the base 4 are equal, or the area of the base 4 is slightly larger than the area of the circuit board 3, and the circuit board 3 can be fixedly installed On the base 4.
  • the chip 2 is mounted on the circuit board 3, for example, the chip 2 can be soldered on the circuit board 3 by soldering.
  • the heat sink 1 is located on the chip 2 and is fixedly installed on the base 4, that is, as shown in FIG. 2, the chip 2 is located between the heat sink 1 and the circuit board 3.
  • the area of the chip 2 is much smaller than the area of the heat sink 1, and the chip 2 is only in contact with a part of the second heat dissipation plate 112.
  • the distance between the second heat sink 112 and the circuit board 3 is less than the height of the chip 2.
  • the heat sink 1 is The base 4 is supported, and the part of the second heat dissipation plate 112 that is in contact with the chip 2 is squeezed and deformed.
  • the heat sink 1 and the chip 2 can maintain a good contact state, and thus It is ensured that the chip 2 can transfer heat to the radiator 1 without interruption, which improves the heat dissipation effect of the chip.
  • the above-mentioned chip 2 can be a bare chip or a chip with an upper cover, that is, a bare chip without an upper cover can also be located between the heat sink 1 and the circuit board 3, and a chip with an upper cover can also be located between the heat sink 1 and the circuit board 3. Between the radiator 1 and the circuit board 3. Wherein, if the chip 2 is a chip with an upper cover, a thermally conductive layer may also be placed between the bare chip and the upper cover, and the thermally conductive layer may be made of a resilient material.
  • a heat conduction layer is placed between the second heat dissipation plate 112 and each chip 2, so that the second heat dissipation plate 112 and the chip 2 are connected through the heat conduction layer. fit.
  • the thermally conductive layer located between the second heat dissipation plate 112 and the chip 2 may be a gelatinous substance that can be cured.
  • the function of the heat conduction layer is to absorb heat on the chip 2 and transfer the heat on the chip 2 to the second heat dissipation plate 112, and the thickness of the heat conduction layer is relatively thin.
  • a thermally conductive layer is also placed between the radiator and the chip in the related art, the thickness of the thermally conductive layer is thicker, and its function is to fill the gap between the radiator and the chip, and prevent a cavity between the radiator and the chip from affecting heat dissipation. Effect.
  • the thickness of the thermal conductive layer between the heat sink 1 and the chip 2 in the present application is relatively thin, which only plays a role of heat transfer, and is not used to fill the gap.
  • the heat sink in the present application has a buffering effect
  • the second heat dissipation plate is flexible
  • the box body has an elastic member that can stretch, so that the heat sink and the chip can be maintained in a compressed state, and the gap between the heat sink and the chip can be absorbed
  • the assembly tolerance of the radiator is eliminated, the gap between the radiator and the chip is eliminated, and the radiator and the chip are maintained in a tightly attached state.
  • the radiator 1 is fixedly installed on the base 4, and the radiator 1 can be installed on the base 4 by bolts.
  • screw holes are provided at corresponding positions of the first heat dissipation plate 111 and the second heat dissipation plate 112, and escape holes are provided on the circuit board 3 at positions corresponding to the screw holes of the second heat dissipation plate 112;
  • the bolts used to install the heat sink 1 on the base 4 are installed on the base 4 through the screw holes of the first heat dissipation plate 111, the screw holes of the second heat dissipation plate 112, and the escape holes of the circuit board 3 in sequence.
  • the periphery of the heat sink 1 can be mounted on the base 4 by bolts.
  • the first heat dissipation plate 111 and the second heat dissipation plate 112 of the heat sink 1 can be respectively provided with screws at corresponding positions.
  • the circuit board 3 installed on the base 4 may be provided with a relief hole, and the base 4 may be provided with a mounting hole.
  • the mounting hole may be a screw hole or a projection welding nut. In this way, the bolts pass through the screw holes on the first heat dissipation plate 111, the screw holes on the second heat dissipation plate 112 and the escape holes on the circuit board 3 in sequence, and are installed in the mounting holes on the base 4 to realize the installation of the radiator 1 On the base 4.
  • the heat sink 1 is mounted on the base 4 by bolts, and most of the weight of the heat sink 1 is supported by the base 4.
  • the second heat dissipation plate 112 and the chip 2 are pressed against each other, due to the second heat dissipation of the heat sink 1
  • the board 112 is flexible, so that the heat sink 1 exerts less pressure on the chip 2 and will not cause damage to the chip 2.
  • the single board includes a heat sink, a chip, a circuit board, and a base.
  • the circuit board is mounted on the base, the chip is mounted on the circuit board, and the heat sink is located on the chip and fixedly mounted on the base.
  • the second heat dissipation plate of the heat sink that is in contact with the chip is flexible, and the second heat dissipation plate is also equipped with an elastic member that can expand and contract, so that the heat sink and the chip can be maintained in a squeezed state, so that the heat sink and the chip can be kept in a compressed state.
  • the gap between the chips maintains a tight fit between the heat sink and the chip, so that the heat generated by the chip can be quickly transferred to the heat sink, thereby improving the heat dissipation effect of the heat sink and accelerating the heat dissipation of the chip.
  • the embodiment of the present application also provides an electronic device.
  • the electronic device may be a communication device, a multimedia device, etc., and may include the above-mentioned single board.
  • the single board includes a heat sink, a chip, a circuit board, and The base, wherein the circuit board is mounted on the base, the chip is mounted on the circuit board, the heat sink is located on the chip and is fixedly mounted on the base, the second heat dissipation plate of the heat sink that is in contact with the chip is flexible, and the second heat sink is
  • the heat sink is also equipped with an elastic member that can expand and contract, so that the radiator and the chip can be maintained in a squeezed state, and the gap between the radiator and the chip can be exhausted, so that the heat generated by the chip can be quickly transferred to the radiator , In turn, the heat dissipation effect of the heat sink can be improved, and the heat dissipation of the chip can be accelerated.
  • the embodiment of the present application also provides a method for manufacturing a heat sink.
  • the method may include installing a plurality of elastic members 13 on the first surface of the second heat dissipation plate 112, wherein the second heat dissipation plate 112 is flexible, and the second heat dissipation plate 112 is flexible.
  • the second surface of the plate 112 is used to adhere to the heat source element; the first heat dissipation plate 111 is mounted on the second heat dissipation plate 112, wherein the elastic member 13 is located between the first heat dissipation plate 111 and the second heat dissipation plate 112.
  • the first surface and the second surface of the second heat dissipation plate 112 are opposite to each other.
  • the first heat dissipation plate 111 and the second heat dissipation plate 112 may enclose a box body 11 in a closed space, and the box body 11 may include a liquid heat conducting material.
  • the second heat dissipation plate 112 when the radiator is placed on the heat source component, the second heat dissipation plate 112 is in contact with the heat source component, and the squeezing between the radiator and the heat source component can cause the second heat dissipation plate to deform, and the elasticity of the box body
  • the shrinkage of the parts can eliminate the gap between the second heat dissipation plate and the heat source parts, so that the second heat dissipation plate and the heat source parts are closely attached, so that the heat generated by the heat source parts can be quickly transferred to the radiator, thereby improving heat dissipation
  • the heat dissipation effect of the heat sink speeds up the heat dissipation of the heat source parts.
  • the method may further include installing a plurality of heat dissipation teeth 12 on the surface of the first heat dissipation plate 111 facing away from the elastic member 13.
  • the heat sink can increase the heat dissipation area of the heat sink 1 through the heat dissipation teeth 12 and improve the heat dissipation effect of the heat sink 1.
  • the embodiment of the present application also provides a method for manufacturing a single board.
  • the method may include mounting the circuit board 3 on the base 4, and mounting at least one chip 2 on the surface of the circuit board 3 facing away from the base 4;
  • the heat sink 1 is placed on at least one chip 2 and the heat sink 1 is fixed on the base 4, wherein each chip 2 is attached to at least part of the second heat dissipation plate of the heat sink 1.
  • the distance between the second heat dissipation plate 112 and the circuit board 3 is less than the height of the chip 2, so that the part of the second heat dissipation plate 112 that is in contact with the chip 2 is compressed and deformed. state.
  • the radiator 1 can be fixed on the base 4 by bolts.
  • the chip 2 can be soldered on the circuit board 3 by soldering.
  • the fixing method of the heat sink 1 and the base 4 and the mounting method of the chip 2 and the circuit board 3 are taken as an example.
  • the installation method is not limited.
  • the second heat dissipation plate 112 of the heat sink 1 is flexible, and the heat sink 1 and the chip 2 are in a squeezed state, so that the second heat dissipation plate 112 is deformed.
  • the elastic member 13 between the heat dissipation plates 111 shrinks, which can eliminate the gap between the second heat dissipation plate 112 and the chip 2, so that the second heat dissipation plate 112 and the chip 2 are closely attached, so that the heat generated by the chip 2 can be quickly It is transferred to the heat sink 1 so that the heat dissipation effect of the heat sink 1 can be improved, and the heat dissipation of the chip can be accelerated.
  • the method further includes placing a thermally conductive layer on the at least one chip 2.
  • a thermally conductive layer equivalent to the size of the chip 2 can be placed on each chip 2.
  • the heat sink 1 is placed on the chip 2 with a thermally conductive layer thereon.
  • the thickness of the above-mentioned thermal conductive layer is small, which is used to absorb the heat on the chip 2 and transfer the heat on the chip 2 to the second heat dissipation plate 112 to accelerate the heat dissipation of the chip 2.
  • the above-mentioned heat sink includes a first heat dissipation plate and a second heat dissipation plate opposite to each other, and an elastic member capable of expansion and contraction is included between the first heat dissipation plate and the second heat dissipation plate.
  • the first heat sink and the second heat sink The elastic member between the plates shrinks, which can eliminate the gap between the second heat dissipation plate and the heat source member, so that the second heat dissipation plate and the heat source member are closely attached, so that the heat generated by the heat source member can be quickly transferred to the radiator Therefore, the heat dissipation effect of the radiator can be improved, and the heat dissipation can be accelerated for the heat source.

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Abstract

本申请实施例公开了一种散热器、单板、电子设备及制造方法，属于散热技术领域。散热器包括散热齿以及相对的第一散热板与第二散热板，散热齿位于所述第一散热板上，其中第二散热板具有柔性，第一散热板和第二散热板之间包括弹性件，第二散热板用于与热源件相贴合。采用本申请实施例的方案，当该散热器放置于热源件如芯片上时，第二散热板与热源件相接触，散热器与热源件之间的挤压可以使第二散热板发生形变，第一散热板和第二散热板之间的弹性件发生收缩，可以消除第二散热板与热源件之间的间隙，使第二散热板与热源件紧密贴合，进而可以使热源件产生的热量能够快速传递到散热器中，从而可以提升散热器的散热效果，为热源件加快散热。

Description

散热器、单板、电子设备及制造方法
本申请要求于2020年2月10日提交的申请号为202010085141.3、发明名称为“散热结构及电子设备、安装方法”的中国专利申请的优先权，以及要求于2020年03月13日提交的申请号为202010177372.7、发明名称为“散热器、单板、电子设备及制造方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及散热技术领域，特别涉及一种散热器、单板、电子设备及制造方法。
背景技术
电子设备的芯片在工作中产生较多的热量，为了给电子设备的芯片散热，芯片上通常安装有散热器，芯片通过散热器向外散热。
为了使芯片上的热量快速传递到散热器上，通常情况下，芯片与散热器之间填充有导热层，而为了避免芯片与散热器之间产生缝隙，填充在芯片与散热器之间的导热层的厚度较厚。
而导热层的厚度增大，将提高导热层的热阻，降低芯片的散热效果。
发明内容
本申请实施例提供了一种散热器、单板、电子设备及制造方法，能够克服相关技术的问题，所述技术方案如下：
一方面，提供了一种散热器，所述散热器包括散热齿以及相对的第一散热板和第二散热板，所述散热齿位于所述第一散热板上，其中：所述第二散热板具有柔性，所述第一散热板和所述第二散热板之间包括弹性件，所述第二散热板用于与热源件相贴合。
在一些实施例中，第二散热板具有柔性，受挤压能够发生变形，第一散热板与第二散热板之间还安装有能够发生伸缩的弹性件。这样，该散热器放置于热源件上时，散热器的第二散热板与热源件相挤压，使得热源件顶面上的每一点都接触到第二散热板，避免热源件与第二散热板之间产生缝隙，保证了热源件能够不间断的将热量传递到散热器上。
在一种可能的实现方式中，所述弹性件为弹簧、泡棉、弹片和泡沫金属中的一种或多种。在一些实施例中，弹性件可以是弹簧，第一散热板与第二散热板之间可以安装多个弹簧。
在一种可能的实现方式中，所述第二散热板为厚度在目标范围内的金属片。
其中，金属可以铜、铝和铝合金等中的一种或多种的组合，本实施例对金属片的具体材质不做限定，能够实现导热和传热即可。
在一些实施例中，第二散热板是能够发生变形的柔性件，例如，可以是厚度比较薄的铜片，例如，可以是厚度为0.3毫米或者0.5毫米的薄铜片。
在一种可能的实现方式中，所述散热器为真空腔均热(vapor chambers，VC)散热器或水冷散热器。
在一些实施例中，上述散热器可以是VC散热器或者水冷散热器等。
在一种可能的实现方式中，所述第一散热板和所述第二散热板之间为封闭空间，所述封闭空间中包括液态导热材料。
在一些实施例中，第一散热板与第二散热板之间可以围合成一个封闭空间，该封闭空间可以称为散热器的盒体，盒体中可以填充有液态导热材料，以提升散热器的散热效果。
另一方面，本申请还提供了一种单板，所述单板包括至少一个芯片、线路板、基座和上面所述的散热器，其中：所述线路板位于所述基座上，所述至少一个芯片位于所述线路板上，所述散热器位于所述至少一个芯片上，且所述散热器固定在所述基座上；每个所述芯片与所述散热器的第二散热板的至少部分相贴合。
在一些实施例中，基座作为该单板的支撑件，线路板安装在基座上，芯片可以通过锡焊接在线路板上，散热器放置于芯片上，并且散热器固定安装在基座上。可见，该散热器可以始终与芯片处于挤压状态，保证了散热器与芯片的良好接触，使芯片上的热量可以不间断的传递到散热器上，通过散热器散热。
在一种可能的实现方式中，所述第二散热板处于未变形状态下所述第二散热板与所述线路板之间的距离小于所述芯片的高度，所述第二散热板的与所述芯片相接触的部分处于挤压变形状态。
在一些实施例中，为了使第二散热板与芯片之间能够处于挤压状态，相应的，芯片过盈位于第二散热板与线路板之间，也即是，第二散热板处于未变形状态下第二散热板与线路板之间的距离小于芯片的高度，使得第二散热板的与芯片相接触的局部部分能够处于挤压变形状态。
在一种可能的实现方式中，所述散热器的第二散热板与每个所述芯片之间放置有导热层，以使所述第二散热板与所述芯片通过所述导热层相贴合。
在一些实施例中，为了加快第二散热板吸收芯片的热量，相应的，第二散热板与每个芯片之间均放置有导热层，使得第二散热板与芯片之间可以通过导热层相挤压贴合。
在一种可能的实现方式中，所述第一散热板和所述第二散热板相对应的位置处设置有螺孔，所述线路板上对应所述所述第二散热板的螺孔的位置处设置有避让孔；用于将所述散热器安装在所述基座上的螺栓，依次穿过所述第一散热板的螺孔、所述第二散热板的螺孔和所述线路板的避让孔安装在所述基座上。
在一些实施例中，散热器可以通过螺栓安装在基座上，例如，螺栓可以依次穿过第一散热板的螺孔、第二散热板的螺孔、线路板的避让孔，安装在基座的安装孔中。这样，散热器通过螺栓由基座支撑着，避免散热器压在芯片上对芯片造成损坏。
在一种可能的实现方式中，所述芯片焊接在所述线路板上。
在一些实施例中，芯片可以安装在线路板上，例如可以通过锡焊接在线路板上，既保证了芯片与线路板的固定，又保证了芯片与线路板之间的电性连接。
在一种可能的实现方式中，所述散热器的面积大于所述芯片的面积。
在一些实施例中，散热器的面积远大于芯片的面积，这样，虽然散热器与芯片相挤压，但是由于散热器只有一部分与芯片相接触，且散热器的第二散热板具有柔性能发生变形，使得散热器的很小一部分重量压在芯片上，散热器的大部分重量都是由基座支撑着，故虽然散热器与芯片处于挤压状态，但是也不会对芯片造成损坏。这样，既维持了散热器与芯片的紧密贴合，也不会对芯片造成挤压损坏。
另一方面，本申请实施例还提供了一种电子设备，该电子设备可以包括上面所述的单板。
另一方面，本申请实施例还提供了一种散热器的制造方法，所述方法包括在第二散热板的第一表面上安装多个弹性件，其中，所述第二散热板具有柔性，所述第二散热板的第二表面用于与热源件相贴合；将第一散热板安装在所述第二散热板上，其中，所述弹性件位于所述第一散热板与所述第二散热板之间。
在一些实施例中，当该散热器放置于热源件上时，第二散热板与热源件相接触，散热器与热源件之间的挤压可以使第二散热板发生形变，第一散热板与第二散热板之间的弹性件发生收缩，可以消除第二散热板与热源件之间的间隙，使第二散热板与热源件紧密贴合，进而可以使热源件产生的热量能够快速传递到散热器中，从而可以提升散热器的散热效果，为热源件加快散热。
在一种可能的实现方式中，所述方法还包括在所述第一散热板背对所述弹性件的表面上形成或安装多个散热齿。
在一些实施例中，该散热器可以通过散热齿可以增大散热器的散热面积，提升散热器的散热效果，为热源件加快散热。
另一方面，本申请实施例还提供了一种单板的制造方法，所述方法包括将线路板安装在基座上，在所述线路板背对所述基座的表面上安装至少一个芯片；将上面所述的散热器放置在至少一个芯片上，并将所述散热器固定在所述基座上，其中，每个芯片与所述散热器的第二散热板的至少部分相贴合。该线路板可以是单板。
在一些实施例中，该方法得到的单板，散热器的第二散热板具有柔性，散热器与芯片之间处于挤压状态，使得第二散热板发生形变，第二散热板与第一散热板之间的弹性件发生收缩，可以消除第二散热板与芯片之间的间隙，使第二散热板与芯片紧密贴合，进而可以使芯片产生的热量能够快速传递到散热器中，从而可以提升散热器的散热效果，为芯片加快散热。
在一种可能的实现方式中，所述将上面所述的散热器放置在至少一个芯片上之前，所述方法还包括在至少一个芯片上放置导热层。
在一些实施例中，可以在每个芯片上放置一个与芯片的尺寸相当的导热层。之后，再将散热器放置在其上具有导热层的芯片上。其中，上述导热层的厚度较小，用于吸收芯片上的热量，将芯片上的热量传递到第二散热板上，为芯片加快散热。
在一些实施例中，该散热器包括相对于的第一散热板和第二散热板，第一散热板和第二散热板之间包括能够发生伸缩的弹性件。当该散热器放置于热源件如芯片上时，第二散热板与热源件相接触，散热器与热源件之间的挤压可以使第二散热板发生形变，第一散热板和第二散热板之间的弹性件发生收缩，可以消除第二散热板与热源件之间的间隙，使第二散热板与热源件紧密贴合，进而可以使热源件产生的热量能够快速传递到散热器中，从而可以提升散热器的散热效果，为热源件加快散热。
附图说明
图1是本申请实施例提供的一种散热器的结构示意图；
图2是本申请实施例提供的一种包括散热器的单板的结构示意图。
图例说明
1、散热器 2、芯片 3、线路板 4、基座
11、盒体 12、散热齿 13、弹性件
111、第一散热板 112、第二散热板
具体实施方式
本申请实施例涉及一种散热器，该散热器可以是真空腔均热(vapor chambers，VC)散热器、水冷散热器等，本实施例对散热器的具体类型不做限定。该散热器与产生热量的热源件相接触，为热源件散热，例如，该散热器可以与芯片相接触，为芯片散热。
该散热器1可以包括散热齿12以及相对的第一散热板111和第二散热板112，散热齿12位于第一散热板111上，第二散热板112具有柔性，第一散热板111与第二散热板之间包括能够伸缩的弹性件13，第二散热板112用于与热源件相贴合。
其中，第一散热板111和第二散热板112之间可以围成封闭空间，该封闭空间中可以包括液态导热材料，以提升散热器1的散热效果。
作为一种示例，第一散热板111和第二散热板112围成的封闭空间结构，可以作为散热器1的盒体11，例如，如图1所示，该散热器1包括盒体11和散热齿12，第一散热板111和第二散热板112是盒体11相对的两个板面，散热齿12位于第一散热板111上，其中：第二散热板112具有柔性，第一散热板111和第二散热板112之间包括弹性件13，第二散热板112用于与芯片相贴合。在一些实施例中，散热齿12可以安装在第一散热板111上；在另一些实施例中，散热齿12与第一散热板111一体成型。
其中，盒体11的材质可以是金属，例如，盒体11的材质可以是铜、铝或者铝合金等，本实施例对盒体11的具体材质不做限定，能够实现导热和传热即可。
在一种示例中，盒体11可以包括位置相对的第一散热板111、第二散热板112和连接第一散热板111和第二散热板112的侧壁。散热器1的散热齿12可以安装在第一散热板111的外表面上，外表面也即是背对盒体11内部的表面，其中，散热齿12是片状结构，垂直安装在第一散热板11上，散热齿12可以增大散热器1的散热面积，提升散热器1的散热效果。
在一种示例中，散热器1的第二散热板112用于与热源件相接触，为了使第二散热板112与热源件保持在相接触的状态，第二散热板112具有柔性，受压可以发生变形。例如，第二散热板112可以是比较薄的铜片，如可以是厚度在目标范围内的金属片，示例性地，可以是厚度为0.3毫米或者0.5毫米的铜片。
其中，上述金属片还可以是铝片或者铝合金片等，本实施例对金属片的具体材质不做限定，能够实现导热和传热即可。
如图1所示，盒体1中第一散热板111和第二散热板112之间安装有弹性件13，这样散热器1与热源件相挤压时，第二散热板112上与热源件相接触的局部部分受挤压发生变形，使得热源件紧紧贴合在第二散热板112上，使第二散热板112与热源件维持在相贴合的状态，避免了第二散热板112与热源件之间产生缝隙，进而可以提升散热器的散热效果。
其中，位于第一散热板111与第二散热板112之间的弹性件13可以是弹簧、泡棉、弹片和泡沫金属中的一种或多种。
例如，如图1所示，弹性件13为弹簧，第一散热板111与第二散热板112之间安装有多个弹簧。
由上述可见，该散热器1的用于与热源件相接触的第二散热板112具有柔性，而且第二 散热板112上还安装有弹性件13，弹性件13起到缓冲作用，这种具有缓冲作用的散热器与热源件能够始终保持在相接触的状态，使得热源件产生的热量能够及时传递到散热器上，通过散热器进行散热，进而提升了该散热器的散热效果。
在一些实施例中，该散热器包括盒体和散热齿，盒体包括第一散热板和第二散热板，其中，散热齿安装在第一散热板上，第二散热板具有柔性，第一散热板和第二散热板之间安装有可以伸缩的弹性件。这样，当该散热器放置于热源件上时，第二散热板与热源件相接触，散热器与热源件之间的挤压可以使第二散热板发生形变，盒体内的弹性件发生收缩，可以消除第二散热板与热源件之间的间隙，使第二散热板与热源件紧密贴合，进而可以使热源件产生的热量能够快速传递到散热器中，从而可以提升散热器的散热效果，为热源件加快散热。
在一些实施例中，散热器1包括相对的第一散热板111和第二散热板112，第一散热板111和第二散热板112之间包括弹性件13，第一散热板111上设置有散热齿12。弹性件13可以是金属弹性件。当该散热器放置于热源件上时，第二散热板与热源件相接触，散热器与热源件之间的挤压可以使第二散热板发生形变，盒体内的弹性件发生收缩，可以消除第二散热板与热源件之间的间隙，使第二散热板与热源件紧密贴合，进而可以使热源件产生的热量能够快速传递到散热器中，从而可以提升散热器的散热效果，为热源件加快散热。
本申请实施例还提供了一种单板，该单板可以是电子设备的主控板、业务板或者接口板等，如图2所示，该单板可以包括芯片2、线路板3、基座4和上面所述的散热器1，其中：线路板3安装在基座4上，至少一个芯片2安装在线路板3上，散热器1位于至少一个芯片2上，且散热器1固定安装在基座4上；散热器1的面积大于每个芯片2的面积，每个芯片2与散热器1的第二散热板112的局部部分相贴合。
其中，芯片2也即是上面所述热源件。线路板3也即是印刷电路板(printed circuit board，PCB)。基座4也可以称为手拉条，是一种固定件，可以具有板状结构。
其中，一个散热器1可以为一个芯片2散热，一个散热器1也可以为多个芯片2散热，本实施例对此不作限定，为便于介绍，可以以一个散热器1为一个芯片2散热进行示例，一个散热器1为多个芯片2散热的情况与之类似，便不再一一赘述。
在一种示例中，线路板3和基座4的尺寸相当，例如，线路板3和基座4的面积相等，或者基座4的面积稍大于线路板3的面积，线路板3可以固定安装在基座4上。芯片2安装在线路板3上，例如，芯片2可以通过锡焊接在线路板3上。散热器1位于芯片2上，且固定安装在基座4上，也即是，如图2所示，芯片2位于散热器1与线路板3之间。
如图2所示，芯片2的面积远小于散热器1的面积，芯片2只与第二散热板112的局部部分相接触。第二散热板112处于未变形状态下，第二散热板112与线路板3之间的距离小于芯片2的高度，这样，芯片2位于散热器1与线路板3之间时，散热器1由基座4支撑，第二散热板112的与芯片2相接触的部分受挤压变形。这样，芯片2与第二散热板112虽然紧密相贴合，但是散热器1的只有与芯片2相接触的局部部分以及该局部部分上的弹性件对芯片2造成较小的压力，而散热器1的大部分重量都是由基座4支撑着，故散热器1不会对芯片2造成过大的压力，这样既满足了第二散热板112与芯片2之间的始终接触，又不会对芯片2造成过大的压力。
而且，由于第二散热板112与芯片2之间相互挤压，即使芯片内部的部件发生变形，或者，即使单板发生震动，散热器1与芯片2之间也能保持良好的接触状态，进而保证了芯片 2可以无间断地将热量传递到散热器1，提升为芯片散热的效果。
其中，上述芯片2可以是裸芯片也可以是具有上盖的芯片，也即是，不具有上盖的裸芯片也可以位于散热器1与线路板3之间，具有上盖的芯片也可以位于散热器1与线路板3之间。其中，如果芯片2是具有上盖的芯片，则裸芯片与上盖之间也可以放置有导热层，该导热层可以由具有回弹性的材料制成。
为了加快第二散热板112与芯片2之间的热传递，相应的，第二散热板112与每个芯片2之间放置有导热层，以使第二散热板112与芯片2通过导热层相贴合。
其中，位于第二散热板112与芯片2之间的导热层可以是能够固化的胶状物质。
在一种示例中，导热层的作用是吸收芯片2上的热量，将芯片2上的热量传递到第二散热板112上，导热层的厚度较薄。相关技术中的散热器与芯片之间虽然也放置导热层，但是该导热层的厚度较厚，其作用是填充散热器与芯片之间的缝隙，防止散热器与芯片之间产生空洞而影响散热效果。而本申请中的散热器1与芯片2之间的导热层厚度较薄，只是起到热传递的作用，并不是用来填充缝隙。这是因为本申请中的散热器具有缓冲作用，第二散热板具有柔性，盒体中具有能伸缩的弹性件，使得散热器与芯片能够维持在挤压状态，可以吸收散热器与芯片之间的装配公差，消除散热器与芯片之间的缝隙，使散热器与芯片之间维持在紧密贴合的状态。
如上面所述，散热器1固定安装在基座4上，散热器1可以通过螺栓安装在基座4上。例如，如图2所示，第一散热板111和第二散热板112相对应的位置处设置有螺孔，线路板3上对应第二散热板112的螺孔的位置处设置有避让孔；用于将散热器1安装在基座4上的螺栓，依次穿过第一散热板111的螺孔、第二散热板112的螺孔和线路板3的避让孔安装在基座4上。
在一种示例中，散热器1的四周可以分别通过螺栓安装在基座4上，例如，散热器1的第一散热板111和第二散热板112上相对应的位置上可以分别设置有螺孔，安装在基座4上的线路板3上可以设置有避让孔，基座4上可以设置有安装孔，该安装孔可以是螺孔，也可以是凸焊螺母等。这样，螺栓依次穿过第一散热板111上的螺孔、第二散热板112上的螺孔和线路板3上的避让孔，安装在基座4上的安装孔中，实现散热器1安装在基座4上。
这样，散热器1通过螺栓安装在基座4上，散热器1的大部分重量由基座4支撑着，虽然第二散热板112与芯片2相互挤压，但是由于散热器1的第二散热板112具有柔性，使得散热器1对芯片2形成的压力也较小，不会对芯片2造成损坏。
在一些实施例中，该单板包括散热器、芯片、线路板和基座，其中，线路板安装在基座上，芯片安装在线路板上，散热器位于芯片上且固定安装在基座上，散热器的与芯片相接触的第二散热板具有柔性，第二散热板上还安装有能够发生伸缩的弹性件，使得散热器与芯片之间可以维持在挤压状态，赶尽散热器与芯片之间的缝隙，散热器与芯片之间维持在紧密贴合的状态，使芯片产生的热量能够快速传递到散热器中，进而可以提升散热器的散热效果，为芯片加快散热。
本申请实施例，还提供了一种电子设备，该电子设备可以是通信设备、多媒体设备等可以包括上面所述的单板，如上面所述，该单板包括散热器、芯片、线路板和基座，其中，线路板安装在基座上，芯片安装在线路板上，散热器位于芯片上且固定安装在基座上，散热器的与芯片相接触的第二散热板具有柔性，第二散热板上还安装有能够发生伸缩的弹性件，使 得散热器与芯片之间可以维持在挤压状态，赶尽散热器与芯片之间的缝隙，使芯片产生的热量能够快速传递到散热器中，进而可以提升散热器的散热效果，为芯片加快散热。
本申请实施例还提供了一种散热器的制造方法，该方法可以包括在第二散热板112的第一表面上安装多个弹性件13，其中，第二散热板112具有柔性，第二散热板112的第二表面用于与热源件相贴合；将第一散热板111安装在第二散热板112上，其中，弹性件13位于第一散热板111与第二散热板112之间。
其中，第二散热板112的第一表面和第二表面相对，第一散热板111和第二散热板112可以围成封闭空间的盒体11，盒体11中可以包括液态导热材料。
作为一种示例，当该散热器放置于热源件上时，第二散热板112与热源件相接触，散热器与热源件之间的挤压可以使第二散热板发生形变，盒体内的弹性件发生收缩，可以消除第二散热板与热源件之间的间隙，使第二散热板与热源件紧密贴合，进而可以使热源件产生的热量能够快速传递到散热器中，从而可以提升散热器的散热效果，为热源件加快散热。
作为一种示例，该方法还可以包括在第一散热板111背对弹性件13的表面上安装多个散热齿12。该散热器可以通过散热齿12可以增大散热器1的散热面积，提升散热器1的散热效果。
本申请实施例还提供了一种单板的制造方法，该方法可以包括将线路板3安装在基座4上，在线路板3背对基座4的表面上安装至少一个芯片2；将上面所述的散热器1放置在至少一个芯片2上，并将散热器1固定在基座4上，其中，每个芯片2与散热器1的第二散热板的至少部分相贴合。
其中，第二散热板112处于未变形状态下第二散热板112与线路板3之间的距离小于芯片2的高度，以使第二散热板112的与芯片2相接触的部分处于挤压变形状态。
其中，散热器1可以通过螺栓固定在基座4上。芯片2可以通过锡焊接在线路板3上。其中，散热器1与基座4的固定方式以及芯片2与线路板3的安装方式作为一种示例，本实施例对散热器1与基座4的固定方式，以及芯片2与线路板3的安装方式不做限定。
上述制造方法得到的单板，散热器1的第二散热板112具有柔性，散热器1与芯片2之间处于挤压状态，使得第二散热板112发生形变，第二散热板112与第一散热板111之间的弹性件13发生收缩，可以消除第二散热板112与芯片2之间的间隙，使第二散热板112与芯片2紧密贴合，进而可以使芯片2产生的热量能够快速传递到散热器1中，从而可以提升散热器1的散热效果，为芯片加快散热。
作为一种示例，在将上面所述的散热器1放置在至少一个芯片2上之前，该方法还包括在至少一个芯片2上放置导热层。例如，可以在每个芯片2上放置一个与芯片2的尺寸相当的导热层。之后，再将散热器1放置在其上具有导热层的芯片2上。其中，上述导热层的厚度较小，用于吸收芯片2上的热量，将芯片2上的热量传递到第二散热板112上，为芯片2加快散热。
在一些实施例中，上述散热器包括相对于的第一散热板和第二散热板，第一散热板和第二散热板之间包括能够发生伸缩的弹性件。当该散热器放置于热源件如芯片上时，第二散热板与热源件相接触，散热器与热源件之间的挤压可以使第二散热板发生形变，第一散热板和第二散热板之间的弹性件发生收缩，可以消除第二散热板与热源件之间的间隙，使第二散热板与热源件紧密贴合，进而可以使热源件产生的热量能够快速传递到散热器中，从而可以提 升散热器的散热效果，为热源件加快散热。
以上所述仅为本申请一个实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (17)

  1. 一种散热器(1)，其特征在于，所述散热器(1)包括散热齿(12)以及相对的第一散热板(111)和第二散热板(112)，所述散热齿(12)位于所述第一散热板(111)上，其中：
    所述第二散热板(112)具有柔性，所述第一散热板(111)和所述第二散热板(112)之间包括弹性件(13)，所述第二散热板(112)用于与热源件相贴合。
  2. 根据权利要求1所述的散热器(1)，其特征在于，所述弹性件(13)为弹簧、泡棉、弹片和泡沫金属中的一种或多种。
  3. 根据权利要求1或2所述的散热器(1)，其特征在于，所述第二散热板(112)为厚度在目标范围内的金属片。
  4. 根据权利要求1至3任一所述的散热器(1)，其特征在于，所述散热器(1)为真空腔均热VC散热器或水冷散热器。
  5. 根据权利要求1至4任一所述的散热器(1)，其特征在于，所述第一散热板(111)和所述第二散热板(112)之间为封闭空间，所述封闭空间中包括液态导热材料。
  6. 一种单板，其特征在于，所述单板包括至少一个芯片(2)、线路板(3)、基座(4)和权利要求1至5任一所述的散热器(1)，其中：
    所述线路板(3)位于所述基座(4)上，所述至少一个芯片(2)位于所述线路板(3)上，所述散热器(1)位于所述至少一个芯片(2)上，且所述散热器(1)固定在所述基座(4)上；
    所述芯片(2)与所述散热器(1)的第二散热板(112)的至少部分相贴合。
  7. 根据权利要求6所述的单板，其特征在于，所述第二散热板(112)处于未变形状态下所述第二散热板(112)与所述线路板(3)之间的距离小于所述芯片(2)的高度，所述第二散热板(112)的与所述芯片(2)相接触的部分处于挤压变形状态。
  8. 根据权利要求6或7所述的单板，其特征在于，所述散热器(1)的第二散热板(112)与每个所述芯片(2)之间放置有导热层，以使所述第二散热板(112)与所述芯片(2)通过所述导热层相贴合。
  9. 根据权利要求6至8任一所述的单板，其特征在于，所述第一散热板(111)和所述第二散热板(112)相对应的位置处设置有螺孔，所述线路板(3)上对应所述第二散热板(112)的螺孔的位置处设置有避让孔；
    用于将所述散热器(1)安装在所述基座(4)上的螺栓，依次穿过所述第一散热板(111)的螺孔、所述第二散热板(112)的螺孔和所述线路板(3)的避让孔安装在所述基座(4)上。
  10. 根据权利要求6至9任一所述的单板，其特征在于，所述芯片(2)焊接在所述线路板(3)上。
  11. 根据权利要求6至10任一所述的单板，其特征在于，所述散热器(1)的面积大于所述芯片(2)的面积。
  12. 一种电子设备，其特征在于，所述电子设备包括权利要求6至11任一所述的单板。
  13. 一种散热器的制造方法，所述散热器为权利要求1至5任一所述的散热器(1)，其特征在于，包括：
    在第二散热板(112)的第一表面上安装多个弹性件(13)，其中，所述第二散热板(112)具有柔性，所述第二散热板(112)的第二表面用于与热源件相贴合；
    将第一散热板(111)安装在所述第二散热板(112)上，其中，所述弹性件(13)位于所述第一散热板(111)与所述第二散热板(112)之间。
  14. 根据权利要求13所述的方法，其特征在于，还包括在所述第一散热板(111)背对所述弹性件(13)的表面上形成或安装多个散热齿(12)。
  15. 根据权利要求13或14所述的方法，其特征在于，所述第一散热板(111)和所述第二散热板(112)之间为封闭空间，该方法还包括在所述封闭空间中加入液态导热材料。
  16. 一种单板的制造方法，其特征在于，所述单板包括至少一个芯片(2)、线路板(3)、基座(4)和权利要求1至5任一所述的散热器(1)，所述方法包括：
    将所述线路板(3)安装在基座(4)上，在所述线路板(3)背对所述基座(4)的表面上安装所述至少一个芯片(2)；
    将所述散热器(1)放置在所述至少一个芯片(2)上，并将所述散热器(1)固定在所述基座(4)上，其中，所述至少一个芯片(2)中的每个芯片(2)与所述散热器(1)的第二散热板(112)的至少部分相贴合。
  17. 根据权利要求16所述的方法，其特征在于，所述将所述散热器(1)放置在至少一个芯片(2)上之前，所述方法还包括在所述至少一个芯片(2)上放置导热层。
PCT/CN2021/075735 2020-02-10 2021-02-07 散热器、单板、电子设备及制造方法 WO2021160060A1 (zh)

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