WO2021150041A1 - Dispositif électronique présentant une structure de blindage et une structure de dissipation thermique - Google Patents

Dispositif électronique présentant une structure de blindage et une structure de dissipation thermique Download PDF

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Publication number
WO2021150041A1
WO2021150041A1 PCT/KR2021/000851 KR2021000851W WO2021150041A1 WO 2021150041 A1 WO2021150041 A1 WO 2021150041A1 KR 2021000851 W KR2021000851 W KR 2021000851W WO 2021150041 A1 WO2021150041 A1 WO 2021150041A1
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WIPO (PCT)
Prior art keywords
shielding sheet
shielding
electronic device
disposed
heat transfer
Prior art date
Application number
PCT/KR2021/000851
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English (en)
Korean (ko)
Inventor
이승태
임재덕
정충효
이상기
이원준
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2021150041A1 publication Critical patent/WO2021150041A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Definitions

  • an electronic device including a shielding structure for shielding electromagnetic waves of an electrical device disposed inside the electronic device, and a heat dissipating structure for dissipating heat from the electrical device.
  • An electronic device is a device that performs a specific function according to a loaded program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an image/audio device, a desktop/laptop computer, or a vehicle navigation device from a home appliance. It can mean a device. For example, these electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases and high-speed and large-capacity wireless communication becomes common, various functions may be mounted in one electronic device, such as a mobile communication terminal, in recent years. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, and functions such as schedule management or electronic wallets are being integrated into one electronic device. will be. Such electronic devices are being miniaturized so that users can conveniently carry them.
  • a printed circuit board (PCB) and various electronic devices are disposed inside a bracket for mounting components.
  • Some circuit electrical devices mounted on the printed circuit board (PCB) generate electromagnetic waves and/or heat, and the generated electromagnetic waves and/or heat may cause malfunctions and performance degradation of electronic devices.
  • a heat diffusion member (or a cooling member) (eg, a heat pipe) may be used that is disposed adjacent to an electronic device (eg, an application processor (AP)) that is a heat source and diffuses heat.
  • an electronic device eg, an application processor (AP)
  • AP application processor
  • the heat source and the heat diffusion member for example, as in the case where a shielding structure (for example, a shield can) for shielding electromagnetic waves is disposed, due to the thermal resistance according to the distance between the heat source and the heat diffusion member, efficient heat dissipation is not achieved.
  • thermo interface material TIM
  • heat dissipation member eg, a heat sink
  • a thermal interface material As a general heat transfer member attached to an electrical device and used, a thermal interface material (TIM) has an elastic force, and a separate height compensation structure is needed to compensate for the compressive force according to the elastic force.
  • a shielding sheet partially having an opening may be used to compensate for the internal step shape of the laminated structure.
  • a separate support layer eg, PU foam
  • a lifting phenomenon may occur.
  • a case in which a rigid design of the heat transfer member and the electrical device is not made may occur.
  • an electronic device including a heat dissipation structure for efficiently shielding electromagnetic waves generated from at least one electrical element of an electronic device and efficiently dissipating heat.
  • An electronic device includes a printed circuit board, at least one electrical element disposed on one surface facing a first direction perpendicular to the printed circuit board, and mounted on one surface of the printed circuit board to have the inside of the printed circuit board.
  • a shield can for accommodating an electric element and including at least one opening formed in a region corresponding to the electric element, a shielding sheet disposed over at least a portion of the shield can and closing at least a portion of the opening, and the electric element and the a heat transfer member disposed between the shielding sheets, the shielding sheet having a pre-forming structure, the first portion being disposed laminated over at least a portion of the shielding can, and closing at least a portion of the opening; It may include a second portion protruding in a direction parallel to the first direction to do so.
  • An electronic device includes a printed circuit board, at least one electrical element disposed on one surface facing a first direction perpendicular to the printed circuit board, and mounted on one surface of the printed circuit board to have the inside of the printed circuit board.
  • a shield can for accommodating an electric element and including at least one opening formed in a region corresponding to the electric element, a first portion stacked on at least a portion of the shield can, and covering the entire opening to accommodate the electric element a shielding sheet including a second portion protruding in a direction parallel to the first direction to close the space;
  • a heat transfer member disposed between the electrical element and the shielding sheet, a heat dissipating member disposed on at least a portion of the shielding sheet, and a cooling member having at least one surface disposed in contact with the heat dissipating member.
  • a method of manufacturing an electronic device includes an operation of pre-forming a shielding sheet, an operation of attaching a heat dissipation member to one surface of the preformed shielding sheet, and attaching a carrier film to the shielding sheet and attaching the shielding sheet to the shield can, removing the carrier film, and attaching a cooling member to the shielding sheet from which the carrier film is removed.
  • An electronic device including a shielding and heat dissipation structure according to various embodiments of the present disclosure is preformed (or preformed) to protrude in one direction and a heat transfer member disposed in contact with an electrical element disposed on a printed circuit board
  • a shielding sheet stably covering the heat transfer member compressed at a predetermined compression ratio, it is possible to provide efficient shielding performance and heat dissipation performance.
  • the heat dissipation structure provides an efficient heat transfer path by reducing the thickness between the cover of the electronic device and the electrical device, except for auxiliary materials having high thermal resistance on the path of heat generated by the electrical device. can do.
  • the heat dissipation structure may apply a shielding method capable of comprehensively encapsulating a plurality of parts regardless of a height between parts disposed on a printed circuit board by applying a three-dimensional shielding sheet.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • FIG. 2A is a front perspective view of an electronic device, according to various embodiments of the present disclosure.
  • 2B is a rear perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 4 is a perspective view illustrating a structure for shielding and dissipating heat around an electric element, according to an embodiment of the present disclosure.
  • 5A is a cross-sectional view illustrating a structure for shielding and dissipating heat around an electric element, according to an embodiment of the present disclosure.
  • 5B is a graph showing the correlation between compressibility and load of a structure for shielding and heat dissipation, according to an embodiment of the present disclosure.
  • 5C is a graph showing the correlation between thermal resistance and load of a structure for shielding and heat dissipation, according to an embodiment of the present disclosure
  • FIG. 6 is a cross-sectional view illustrating a structure for shielding and dissipating heat around an electric element according to another embodiment of the present disclosure.
  • FIG. 7 is a cross-sectional view schematically illustrating a shielding principle of a shielding sheet and a shielding can, according to various embodiments of the present disclosure.
  • FIG. 8 is a cross-sectional view illustrating a method of attaching a shielding and heat dissipation structure using a carrier film, according to various embodiments of the present disclosure.
  • FIG. 9 is a cross-sectional view illustrating a method of removing a carrier film after attaching a shielding and heat dissipation structure using the carrier film, according to various embodiments of the present disclosure
  • FIG. 10 is a conceptual diagram illustrating a state in which an adhesive layer of a carrier film is peeled off after a thermal curing operation, according to various embodiments of the present disclosure
  • FIG. 11 is a cross-sectional view illustrating an attachment method using a carrier film of a structure for shielding and heat dissipation around an electric element, according to another embodiment of the present disclosure
  • FIG. 12 is a cross-sectional view illustrating a shielding and heat dissipation structure around an electric element according to another embodiment of the present disclosure.
  • FIG. 13 is an operation flowchart for manufacturing a shielding and heat dissipation structure, according to various embodiments of the present disclosure.
  • 14A is a conceptual diagram illustrating a shielding and heat dissipation structure according to a certain comparative embodiment.
  • 14B is a conceptual diagram illustrating an electromagnetic wave movement path in a shielding and heat dissipation structure, according to a comparative embodiment.
  • 15 is a diagram illustrating a shielding sheet, according to some comparative examples.
  • 16A is a graph for showing shielding performance in an example using nanofoam as a shielding sheet according to a comparative example.
  • 16B is a graph illustrating shielding performance of a shielding and heat dissipating structure using a preformed shielding sheet according to various embodiments of the present disclosure
  • FIG. 1 it is a block diagram of the electronic device 101 in the network environment 100 .
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the processor 120 executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or in conjunction with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphics processing unit, an image signal processor
  • the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function.
  • the auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • the auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).
  • the sound output device 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device.
  • the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. there is.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the electronic device 102 may output a sound.
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a computer network eg, a telecommunication network such as a LAN or WAN.
  • These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other.
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified and authenticated.
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, RFIC
  • other than the radiator may be additionally formed as a part of the antenna module 197 .
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 and 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations executed in the electronic device 101 may be executed in one or more of the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • the one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology may be used.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • a or B at least one of A and B, “at least one of A or B”, “A, B or C”, “at least one of A, B and C” and “A;
  • Each of the phrases “at least one of B, or C” may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases.
  • Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101).
  • a machine eg, electronic device 101
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is different from the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided as included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones).
  • a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.
  • 2A is a front perspective view of an electronic device 101 according to various embodiments of the present disclosure.
  • 2B is a rear perspective view of the electronic device 101 according to various embodiments of the present disclosure.
  • the electronic device 101 includes a first surface (or front) 310A, a second surface (or rear) 310B, and a first surface 310A and
  • the housing 310 may include a side surface 310C surrounding the space between the second surfaces 310B.
  • the housing may refer to a structure that forms part of the first surface 310A, the second surface 310B, and the side surface 310C of FIG. 2A .
  • the first surface 310A may be formed by a front plate 302 (eg, a glass plate or a polymer plate) that is at least partially transparent.
  • the second surface 310B may be formed by a substantially opaque back plate 311 .
  • the back plate 311 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 310C is coupled to the front plate 302 and the rear plate 311 and may be formed by a side bezel structure (or “side member”) 318 including a metal and/or a polymer.
  • the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 302 includes two first regions 310D that extend seamlessly from the first surface 310A toward the rear plate 311 by bending the front plate. It may include both ends of the long edge of (302).
  • the rear plate 311 has two second regions 310E that extend seamlessly by bending from the second surface 310B toward the front plate 302 with long edges. It can be included at both ends.
  • the front plate 302 (or the back plate 311 ) may include only one of the first regions 310D (or the second regions 310E). In another embodiment, some of the first regions 310D or the second regions 310E may not be included.
  • the side bezel structure 318 when viewed from the side of the electronic device 101 , has a side surface that does not include the first regions 310D or the second regions 310E as described above. It may have a first thickness (or width), and may have a second thickness thinner than the first thickness at a side surface including the first regions 310D or the second regions 310E.
  • the electronic device 101 includes a display 301 , an audio module 303 , 307 , 314 , a sensor module 304 , 316 , 319 , a camera module 305 , 312 , 313 , and a key input. at least one of a device 317 , a light emitting element 306 , and connector holes 308 , 309 . In some embodiments, the electronic device 101 may omit at least one of the components (eg, the key input device 317 or the light emitting device 306 ) or additionally include other components.
  • the display 301 may be visually exposed through, for example, a substantial portion of the front plate 302 .
  • at least a portion of the display 301 may be exposed through the front plate 302 forming the first areas 310D of the first surface 310A and the side surface 310C.
  • the edge of the display 301 may be formed to be substantially the same as an adjacent outer shape of the front plate 302 .
  • the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.
  • a recess or opening is formed in a part of the screen display area of the display 301, and the audio module 303, 307 is aligned with the recess or the opening. 314 ), sensor modules 304 , 316 , and 319 , camera modules 305 , 312 , 313 , and at least one of a light emitting device 306 .
  • audio modules 303 , 307 , 314 , sensor modules 304 , 316 , 319 , and camera modules 305 , 312 , 313 are located on the rear surface of the screen display area of the display 301 . , and may include at least one of the light emitting device 306 .
  • the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • a touch sensing circuit capable of measuring the intensity (pressure) of a touch
  • a digitizer capable of measuring the intensity (pressure) of a touch
  • a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor module 304 , 316 , 319 , and/or at least a portion of a key input device 317 include the first area 310D, and/or the second area ( 310E).
  • the audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314 .
  • the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).
  • the audio modules 303 , 307 , and 314 are not limited to the above structure, and may be variously designed and changed according to the structure of the electronic device 101 , such as mounting only some audio modules or adding a new audio module.
  • the sensor modules 304 , 316 , and 319 may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state.
  • the sensor modules 304 , 316 , 319 may include, for example, a first sensor module 304 (eg, a proximity sensor) and/or a second sensor module (eg, a second sensor module) disposed on the first side 310A of the housing 310 . (not shown) (eg, a fingerprint sensor), and/or a third sensor module 319 (eg, HRM sensor) and/or a fourth sensor module 316 disposed on the second side 310B of the housing 310 . ) (eg fingerprint sensor).
  • a first sensor module 304 eg, a proximity sensor
  • a second sensor module eg, a second sensor module
  • a third sensor module 319 eg, HRM sensor
  • fourth sensor module 316 disposed on the second side 310B of the housing 310 .
  • the fingerprint sensor may be disposed on the first surface 310A (eg, the display 301) as well as the second surface 310B of the housing 310.
  • the electronic device 101 may include a sensor module, not shown, for example.
  • it may further include at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the sensor modules 304 , 316 , and 319 are not limited to the above structure, and may be designed and changed in various ways, such as mounting only some sensor modules or adding a new sensor module, depending on the structure of the electronic device 101 .
  • the camera modules 305 , 312 , and 313 are, for example, a first camera device 305 disposed on a first side 310A of the electronic device 101 , and a second side 310B. ) disposed in the second camera device 312 , and/or a flash 313 .
  • the camera module 305, 312 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 .
  • the camera modules 305 , 312 , and 313 are not limited to the above structure, and may be designed and changed in various ways, such as mounting only some camera modules or adding a new camera module, depending on the structure of the electronic device 101 .
  • the key input device 317 may be disposed, for example, on the side surface 310C of the housing 310 .
  • the electronic device 101 may not include some or all of the above-mentioned key input devices 317 and the not included key input devices 317 may be displayed on the display 301 as soft keys, etc. It can be implemented in the form
  • the key input device may include a sensor module 316 disposed on the second surface 310B of the housing 310 .
  • the light emitting device 306 may be disposed on the first surface 310A of the housing 310 , for example.
  • the light emitting device 306 may provide, for example, state information of the electronic device 101 in the form of light.
  • the light emitting device 306 may provide, for example, a light source that is linked to the operation of the camera module 305 .
  • Light emitting element 306 may include, for example, LEDs, IR LEDs, and xenon lamps.
  • the connector holes 308 and 309 are, for example, a first connector hole that may receive a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device.
  • a connector eg, a USB connector
  • 308 and/or a second connector hole (eg, earphone jack) 309 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.
  • the connector holes 308 and 309 are not limited to the above structure, and may be designed and changed in various ways, for example, only some connector holes are mounted or new connector holes are added, depending on the structure of the electronic device 101 .
  • FIG 3 is an exploded perspective view of an electronic device 101 according to various embodiments of the present disclosure.
  • an electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 3 ) according to various embodiments includes a side bezel structure 331 and a first support member 332 (eg: bracket), a front plate 320 , a display 330 , at least one printed circuit board 340 , a battery 350 , a second support member 360 (eg, a rear case), an antenna 370 , and a rear surface thereof.
  • a plate 380 may be included.
  • the electronic device 101 may omit at least one of the components (eg, the first support member 332 or the second support member 360 ) or additionally include other components. .
  • At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIGS. 1, 2A, or 2B, and the overlapping description will be described below. omit
  • the first support member 332 may be disposed inside the electronic device 101 and may be connected to the side bezel structure 331 or may be integrally formed with the side bezel structure 331 .
  • the first support member 332 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 332 may have a display 330 coupled to one side and a printed circuit board 340 coupled to the other side thereof.
  • the printed circuit board 340 may be equipped with a processor, memory, and/or an interface.
  • the printed circuit board 340 may include a printed circuit board (PCB) or a flexible PCB (FPCB).
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 101 , for example, a non-rechargeable primary battery, or a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 101 or may be detachably disposed with the electronic device 101 .
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the antenna structure may be formed by a part of the side bezel structure 331 and/or the first support member 332 or a combination thereof.
  • FIG. 4 is a perspective view illustrating a structure for shielding and dissipating heat around an electric element, according to an embodiment of the present disclosure.
  • 5A is a cross-sectional view illustrating a structure for shielding and dissipating heat around an electric element, according to an embodiment of the present disclosure.
  • 5B is a graph showing the correlation between compressibility and load of a structure for shielding and heat dissipation, according to an embodiment of the present disclosure.
  • 5C is a graph showing the correlation between thermal resistance and load of a structure for shielding and heat dissipation, according to an embodiment of the present disclosure;
  • 6 is a cross-sectional view illustrating a structure for shielding and dissipating heat around an electric element according to another embodiment of the present disclosure.
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 3 ) has a structure for shielding and heat dissipation, and includes a printed circuit board 340 , at least one electrical element 510 , and at least one It may include a heat transfer member 520 , a shielding sheet 530 , and a shield can 570 .
  • the electronic device 101 may further include at least one heat dissipation member 540 and a cooling member (eg, the cooling member 560 of FIG. 5A or 6 ) as a structure for shielding and dissipating heat.
  • the configuration of the printed circuit board 340 of FIGS. 4 to 6 may be partially or entirely the same as that of the printed circuit board 340 of FIG. 3 .
  • the carrier film 610 is a configuration that can be used before attaching the cooling member 560 to the shielding and heat dissipation structure according to various embodiments of the present disclosure, which will be described in detail below.
  • 'Z' in the three-axis coordinate system may indicate an upward direction when the shielding and heat dissipation structure 500 is viewed from the side.
  • 'X' is a direction perpendicular to 'Z' and may indicate a horizontal longitudinal direction of the shielding and heat dissipation structure 500 .
  • 'Y' is a direction perpendicular to 'X' and 'Z', and may indicate a vertical longitudinal direction of the shielding and heat dissipation structure 500 .
  • P1 may schematically indicate a point where the center of the upper surface of the heat transfer member 520 abuts on the lower surface of the shielding sheet 530 .
  • the point P1 at which the center of the upper surface of the heat transfer member (eg, the first heat transfer member 521) abuts is set at the center or a position close to the center of the protruding portion S2 of the shielding sheet 530.
  • the point P2 at which the center of the upper surface of another heat transfer member (eg, the second heat transfer member 522) abuts is also at the center or close to the center of the protruding portion S2 of the shielding sheet 530. can be set.
  • heat transfer efficiency when the heat transfer member 521 and the shielding sheet 530 come into contact with each other, heat transfer efficiency may be high only when the area of the contacting surface is wide.
  • the heat transfer member 521 when the heat transfer member 521 is positioned on the inclined surface S3 of the shielding sheet 530 , the adhesion between the heat transfer member and the shielding sheet may be reduced, and thus heat transfer performance may be reduced.
  • the point P1 and/or P2 where the center of the upper surface of the heat transfer member abuts is set at a position close to the center of the protruding portion S2 of the shielding sheet 530 , the heat transfer member and the shielding sheet 530 are mutually
  • the area of the contacting surface may be formed to be wide.
  • the heat dissipation member 540 may be disposed on the upper surface of the shielding sheet 530 , and may be disposed at a position corresponding to a point where the center of the upper surface of the heat transfer member 520 abuts against the shielding sheet 530 .
  • 5A and 6 may be views illustrating a cross-section of the shielding and heat dissipation structure 500 of FIG. 4 taken in the A-A' direction.
  • the cross-section cut in the A-A' direction may be a cross-section cut in a direction parallel to the X-axis.
  • 5A and 6 '+Z or -Z' may indicate upper and lower directions when the shielding and heat dissipation structure 500 is viewed from the side.
  • '+Z' means the front direction in which the electric element 510 disposed inside the electronic device faces the front cover (eg, the front plate 320 in FIG. 4), and ' -Z' may mean a rear direction in which the electric element 510 disposed inside the electronic device faces the rear cover (eg, the rear plate 380 of FIG. 4 ).
  • a plurality of electrical elements may be disposed on at least one side surface of the printed circuit board 340 (eg, the printed circuit board 340 of FIG. 3 ).
  • Some electric elements 510 among the plurality of electric elements are heat sources that generate heat, and may be, for example, at least one chip disposed on at least one side of the printed circuit board 340, and the PMIC ( It may include at least one of a power management integrated circuit), a power amplifier (PAM), an application processor (AP), a communication processor (CP), a charger integrated circuit (IC), and a DC converter.
  • the electric element 510 may include a first electric element 511 and a second electric element 512 .
  • the first electrical device 511 may be an application processor (AP)
  • the second electrical device 512 may be a power management integrated circuit (PMIC).
  • the shield can 570 may be formed around at least a portion of the electrical device 510 .
  • the shield can 570 surrounds at least a portion of the electrical device 510 , thereby shielding electromagnetic waves generated from the electrical device 510 .
  • the shield can 570 may be mounted on one surface of the printed circuit board 340 in a state of accommodating the electrical element 510 in an internal space.
  • the shielding and heat dissipation structure of the electronic device eg, the heat dissipation structure 500 of FIG. 5A
  • the shield can 570 when the shielding and heat dissipation structure of the electronic device (eg, the heat dissipation structure 500 of FIG. 5A ) is viewed from above (eg, viewed in the second direction (-Z)), the shield can 570 ), at least one opening (eg, the first opening 573 ) may be formed in a region corresponding to the electric element 510 so that a portion thereof does not overlap the electric element 510 .
  • the first opening 573 may be formed in a region in which at least a portion of the electric element 510 is located.
  • the first opening 573 provides a space in which a material of a different material can be disposed at a position facing the electric element 510 , so that heat generated from the electric element 510 can be easily transferred to the outside. can be made available for release.
  • a heat transfer member eg, the first heat transfer member 521
  • the first heat transfer member 521 may be disposed in the first opening 573 to form a path through which heat generated from the electric element 510 is transferred.
  • the shield can 570 may be coupled to one surface (eg, one surface facing the first direction (+Z)) of the printed circuit board 340 .
  • one surface of the printed circuit board 340 and the shield can 570 may be coupled by a soldering method.
  • the shield can 570 forms an opening (eg, a first opening 573 ) and includes an upper portion 571 in which a portion of the shielding sheet 530 is located, the upper portion 571 and a printed circuit. It may include a side portion 572 defining a space between the substrates 340 .
  • the shield can 570 has a shape (eg, of an electronic device) that surrounds at least a portion of the electric element 510 using at least a part of the upper part 571 and the side part 572 .
  • a shape eg, of an electronic device
  • the shielding and heat dissipation structure 500 may be manufactured as a closed square loop).
  • a plurality of electrical elements may be disposed on at least one surface of the printed circuit board 340 (eg, the printed circuit board 340 of FIG. 3 ).
  • the electric element 510 may include a first electric element 511 and a second electric element 512 , and may be accommodated in one shield can 570 .
  • the first electrical device 511 may be an application processor (AP)
  • the second electrical device 512 may be a power management integrated circuit (PMIC).
  • AP application processor
  • PMIC power management integrated circuit
  • other electric elements eg, a communication processor (CP) or a DC converter
  • CP communication processor
  • DC converter DC converter
  • a first opening 573 may be formed at a position corresponding to the first electric element 511
  • a second opening 574 may be formed at a position corresponding to the second electric element 512 .
  • a shielding sheet 530 may be stacked on at least a portion of the shield can 570 .
  • the shielding sheet 530 may be laminated on at least a portion of an upper portion (eg, 571 of FIG. 4 ) of the shield can 570 .
  • the shielding sheet 530 may provide a function of shielding electromagnetic waves that may be generated by the electric element 510 .
  • the shielding sheet 530 may be disposed to cover at least a portion of the first opening 573 and/or the second opening 574 of the shield can 570 to shield electromagnetic waves of the electric element 510 .
  • the shielding sheet 530 is laminated to cover the portion where the first opening 573 and/or the second opening 574 are formed and on the periphery thereof (eg, the upper portion 571 of the shield can 570 ). can be
  • the shielding sheet 530 may include a first portion S1 disposed over at least a portion of the shield can 570 , a second portion S2 disposed to face the heat transfer member 520 , and a first A third portion S3 extending from the portion S1 to the second portion S2 and forming a designated inclined surface or a curved surface may be included.
  • the third part S3 has an inclined surface in order to compensate for a height difference between the respective areas of the shielding can 570 and the shielding sheet 530 disposed on the upper surface (+Z direction) of the heat transfer member 520 . formed or at least a partially curved surface may be formed.
  • the protruding structure of the shielding sheet 530 includes a plurality of components (eg, a first electric element 511 and a second electric element (eg, a first electric element 511 ) and a second electric element (eg, a first electric element 511 ) having different heights arranged on the printed circuit board 340 . 512)) as a whole.
  • the shielding sheet 530 is pre-formed to cover parts of different heights and/or the shield can 570, and includes an inclined surface or a curved surface through the pre-forming. structure can be provided.
  • the shielding sheet 530 has a three-dimensional shape (eg, conformal type) structure to encapsulate parts of various sizes and shapes disposed on the printed circuit board 340 into a single sheet paper. and can provide a shielding function through this.
  • a three-dimensional shape eg, conformal type
  • the shielding sheet 530 formed through the preforming. is disposed so that the first portion S1 covers at least a portion of the shield can 570, and the second portion S2 closes at least a portion of the opening (eg, the first opening 573) in the first direction It may be formed to protrude in a parallel direction.
  • the thickness (or height) at which the second portion S2 of the shielding sheet 530 protrudes is illustrated by t1 .
  • the distance between the lower surface of the first portion S1 of the shielding sheet 530 and the lower surface of the second portion S2 of the shielding sheet 530 is the second portion S2 of the shielding sheet 530 .
  • ) can be set as the projected thickness (or height) t1.
  • the shielding sheet 530 may include a shielding film.
  • the shielding film may be formed of a fiber film having a nano structure to shield electromagnetic waves.
  • the fiber film may be formed thin and long by processing the fibers based on the electrospinning method, and the fibers thus formed are plated with copper (Cu), then plated with nickel (Ni; nickel), and finally again It may be formed by plating with copper (Cu).
  • the fiber film may be implemented as a nanostructure formed by overlapping each of the fibers formed by the plating operation several times.
  • the shielding film may be formed to a thickness of approximately 1 to 100 ⁇ m.
  • the shielding film may have a thickness of 55 ⁇ m or 65 ⁇ m.
  • the shielding sheet 530 may provide a heat transfer function for transferring heat that may be generated by the electric element 510 to the outside of the electric element 510 .
  • the shielding sheet 530 may include a conductive adhesive film.
  • the shielding sheet 530 may be manufactured by laminating a plurality of layers.
  • the shielding sheet 530 may be formed by combining a shielding film and a conductive adhesive film.
  • the conductive adhesive films may be disposed to face each other with the shielding film interposed therebetween.
  • the conductive adhesive films may be disposed to adhere the shielding sheet 530 to the heat transfer member 520 adjacent thereto, and may include nickel (Ni).
  • the conductive adhesive film may be formed to a thickness of approximately 1 to 10 ⁇ m.
  • the thickness of the conductive adhesive film may have a thickness of 7 ⁇ m.
  • the shielding film and the heat transfer member 520 are spaced apart or other foreign substances are disposed, or when an air-gap is formed between the shielding film and the heat transfer member 520, heat transfer may not be efficient, but When the shielding film and the heat transfer member 520 are directly adhered by the conductive adhesive film without other foreign substances or air-gap, the heat generated from the electrical element 510 passes through the shielding sheet 530 directly to the outside. can be delivered efficiently.
  • an aluminum layer and an insulating coating layer may be additionally stacked on the shielding sheet 530 .
  • heat generated from the electrical component 510 may pass through at least a portion of the shielding sheet 530 located on the first opening 573 and/or the second opening 574 of the shield can 570 . It can be transferred to another layer.
  • the shielding sheet 530 may include an elastic material to be compressible when pressure is applied by an external impact.
  • the shielding sheet 530 moves in the second direction (-Z) toward the electric element 510 and the opposite first direction (+Z) together with the heat transfer member 520 having an elastic material. can provide Therefore, when an external pressure is applied due to an external shock, it is possible to prevent the shock directly applied to the electrical element 510 .
  • the heat transfer member 520 may be disposed between the electric element 510 and the shielding sheet 530 to transfer heat generated in the electric element 510 to the shielding sheet 530 . At least a portion of the heat transfer member 520 is disposed to pass through the first opening 573 of the shield can 570 , and the first surface 520a facing the first direction (+Z) is conductive of the shielding sheet 530 .
  • the adhesive film adheres to a portion of the shielding film (eg, a partial surface in the downward direction), and the second surface 520b facing the second direction (-Z) is in direct contact with at least a portion of the electrical element 510 . can be placed.
  • the heat transfer member 520 may be formed of a carbon fiber thermal interface material (TIM) capable of transferring heat generated from the electrical device 510 .
  • TIM carbon fiber thermal interface material
  • the heat transfer member 520 is not limited to the carbon fiber TIM as an example, and may include various heat transfer materials or members for transferring heat generated from the electric element 510 to the outside or the cover of the electronic device.
  • it may be configured to include a thermal interface material (TIM), a heat pipe, a heat dissipation sheet, or a heat dissipation paint.
  • the material of the heat dissipation sheet or the heat dissipation paint may include, for example, graphite, carbon nanotubes, a natural regenerated material, silicon, silicon, or a high thermal conductivity material such as graphite.
  • the carbon fiber TIM (carbon fiber thermal interface material) is at least one of a liquid phase thermal interface material (TIM), an acrylic thermal interface material (TIM) and/or a solid phase thermal interface material (TIM). may include
  • the heat transfer member 520 may be configured in plurality, for example, the first heat transfer member 521 and the second electric element 512 disposed in contact with the first electric element 511 and A second heat transfer member 522 disposed in contact with each other may be included.
  • the first electric element 511 is an application processor (AP)
  • the first heat transfer member 521 may be a carbon fiber TIM
  • the second electric element 512 is a power management integrated circuit (PMIC).
  • the second heat transfer member 522 may be an acrylic TIM.
  • the first heat transfer member 521 and the second heat transfer member 522 may have different thicknesses (or heights) (eg, t2 and t3 ). For example, as shown in FIG.
  • the first heat transfer member 521 may have a thickness t2
  • the second heat transfer member 522 may have a thickness t3 .
  • the first heat transfer member 521 and the second heat transfer member 522 may have different thicknesses depending on the thickness of each electric element disposed thereunder.
  • the step difference between the stacked structure in which the first electric element 511 and the first heat transfer member 521 are stacked and the second electric element 512 and the second heat transfer member 522 are stacked The thicknesses of the first heat transfer member 521 and the second heat transfer member 522 may be adjusted to minimize them.
  • the first heat transfer member 521 disposed on the first electric element 511 may be the second electric element. It may be formed to have a thickness smaller than that of the second heat transfer member 522 disposed in the 512 . Accordingly, the combined total height of the electrical element 510 and the heat transfer member 520 may be the same or similar to each other. According to another embodiment, the first heat transfer member 521 and the second heat transfer member 522 are not only different in thickness, but have a length in a direction parallel to the X axis with reference to the direction component shown in FIG. 5A . and/or a length in a direction parallel to the Y-axis may be set differently.
  • the thickness (or height) t1 at which the second part S2 of the shielding sheet 530 protrudes is the heat transfer member.
  • the thickness (or height) t1 at which the second part S2 of the shielding sheet 530 protrudes is the heat transfer member.
  • the thickness (or height) of the heat transfer member may be set to a thickness (or height) having a compressibility in which thermal resistance is rapidly reduced so that the shielding and heat dissipation structure 500 may exhibit more efficient heat dissipation performance.
  • FIG. 5B a graph of a correlation between compressibility and load is shown in relation to a shielding and heat dissipation structure (eg, the shielding and heat dissipation structure 500 of FIG. 5A ) according to an embodiment of the present disclosure.
  • the compressibility may mean a compressibility of the heat transfer member (eg, the heat transfer member 520 of FIG. 5A ), which may increase in proportion to the load.
  • FIG. 5C a graph for the correlation between thermal resistance and load in relation to the shielding and heat dissipation structure according to an embodiment of the present disclosure is illustrated. Here, it can be seen that the thermal resistance is inversely proportional to the load. Referring to FIG.
  • the compressibility of the heat transfer member increases. However, there is a possibility that the heat transfer member may be damaged during excessive compression, so that an appropriate load may be applied.
  • an appropriate compressibility for the heat transfer member may be set in order to prevent the heat transfer member from being damaged when an excessive load is applied.
  • the compressibility of the heat transfer member in consideration of the heat resistance and the load may be set to, for example, 25%.
  • the slope of the third portion S3 of the shielding sheet 530 may vary according to the compressibility of the first heat transfer member 521 . According to a change in the inclination of the third portion S3 of the shielding sheet 530 , the shielding sheet 530 may maintain a flat surface as a whole, or may have a partially curved shape.
  • the heat transfer member 520 together with the shielding sheet 530 may move in a second direction (-Z) toward the electric element 510 and a first direction (-Z) opposite to the second direction (-Z). +Z) to be able to flow.
  • the first part S1 fixedly disposed on the shield can 570 generally supports the shielding sheet 530
  • the second part S2 is perpendicular to the printed circuit board 340 together with the heat transfer member 520 . can move up and down.
  • the third part (S3) is a part disposed between the first part (S1) and the second part (S2), and guides the vertical movement of the second part (S2), and the position of the second part (S2) It is possible to form an inclined surface that increases or decreases in correspondence with the .
  • the shielding sheet 530 and the heat transfer member 520 may be provided with an elastic material, so that, when an external force is applied due to an external impact, an impact directly applied to the electrical element 510 may be prevented.
  • the shielding and heat dissipation structure 500 is disposed to be in contact with the shielding sheet 530 on a surface of the shielding sheet 530 , which faces a direction parallel to the first direction.
  • a member 540 may be included.
  • the heat dissipation member 540 may be disposed to overlap at least a portion of the second portion S2 of the shielding sheet 530 .
  • the heat dissipation member 540 is disposed between a cover (eg, a front cover (eg, the front plate 320 of FIG. 4 ) or a rear cover (eg, the rear plate 380 of FIG. 4 )) of the electronic device and the electric element 510 .
  • the heat dissipation member 540 may include at least one of a material including boron nitride (BN), a graphite sheet, or a material including poly urethane (PU).
  • the heat dissipation member 540 may include BN based Al with adhesive (BN).
  • the heat dissipation member 540 may be formed to have an area corresponding to the heat transfer member 520 .
  • the shielding sheet 530 may be disposed facing the heat transfer member 520 with the second portion S2 interposed therebetween.
  • the heat dissipation member 540 may include a conductive adhesive layer, which is adhered to one surface of the second portion S2 of the shielding sheet 530 to dissipate heat generated from the electrical element 510 with another material. (eg, the cooling member 560) can be delivered quickly and stably.
  • the heat dissipation member 540 is disposed as a separate member for each of the plurality of electrical elements, collects heat generated by each electrical device 510 , and collects the collected heat from the other surface of the heat dissipation member 540 . It can be delivered to the cooling member 560 disposed in the.
  • the heat dissipation member 540 may be configured in plurality, for example, a first heat dissipation member 541 disposed to face the first heat dissipation member 521 and a second heat dissipation member disposed to face the second heat dissipation member 522 . member 542 .
  • the first heat dissipation member 541 and the second heat dissipation member 542 may compensate for a tolerance between the shielding sheet 530 and other devices.
  • the cooling member 560 may be disposed to contact the shielding sheet 530 or the heat dissipation member 540 .
  • the cooling member 560 is disposed between a cover (eg, a front cover (eg, the front plate 320 of FIG. 4 ) or a rear cover (eg, the rear plate 380 of FIG. 4 )) of the electronic device and the shielding sheet 530 ). It may be provided with a material having high thermal conductivity so as to effectively transfer heat from the electric element 510 .
  • the cooling member 560 may include a water-cooled heat diffusion member such as a heat pipe or a vapor chamber.
  • the cooling member 560 may include a bracket provided in the electronic device (eg, the electronic device 101 of FIG. 3 ).
  • one surface of the cooling member 560 may be disposed in contact with a partial region in which the plurality of heat dissipation members 540 are disposed. Heat transferred from the electrical elements 510 through the plurality of heat dissipating members 540 may be transmitted to the cooling member 560 having a relatively larger area than the heat dissipating member 540 . The heat transferred to the cooling member 560 may be diffused to other parts (eg, the electronic device housing) of the electronic device (eg, the electronic device 101 of FIG. 3 ) through the cooling member 560 without being accumulated. .
  • heat generated from the electrical device 510 may be efficiently transferred to the cover or the outside of the electronic device.
  • heat from the electric element 510 may be transferred to the heat transfer member 520 disposed in contact with the electric element 510 .
  • the heat transfer member 520 may pass through the first opening 573 and/or the second opening 574 of the shield can 570 to transfer the transferred heat to the shielding sheet 530 .
  • the heat transferred to the shielding sheet 530 may be transferred to the cooling member 560 through the heat dissipation member 540 .
  • the heat dissipation member 540 may be configured in plurality, and after collecting heat transferred from the plurality of electrical elements 510 , it may be rapidly diffused through the cooling member 560 having a large area.
  • the shielding and heat dissipation structure 500 includes a heat transfer member 520 having a good heat transfer effect, except for a support layer (eg, a copper plate) applied in a general heat dissipation structure.
  • a support layer eg, a copper plate
  • heat generated in the electrical device 510 is quickly dispersed to the outside of the electronic device, thereby providing an effect of cooling the temperature around the electrical device 510 .
  • a portion of the heat transfer member 520 is disposed to directly contact at least a portion of the shielding sheet 530 , and is formed on the upper surface of the shield can 570 and one surface of the shield can 570 using the shielding sheet 530 .
  • the overall thickness of the shielding and heat dissipation structure 500 may be reduced by disposing the first opening 573 and the second opening 574 to cover the entirety.
  • FIG. 7 is a cross-sectional view schematically illustrating a shielding principle of a shielding sheet and a shielding can, according to various embodiments of the present disclosure.
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 3 ) includes a printed circuit board 340 , at least one electrical element 510 , at least one heat transfer member 520 , and a shielding sheet. 530 and a shield can 570 may be included. Although omitted from the drawings, the electronic device 101 may further include at least one of at least one heat dissipation member 540 and a cooling member 560 .
  • a plurality of electrical elements may be disposed on at least one side surface of the printed circuit board 340 (eg, the printed circuit board 340 of FIG. 3 ).
  • the electric element 510 may include a first electric element 511 and a second electric element 512 , and may be accommodated in one shield can 570 .
  • the first electric element 511 has a first heat transfer member 521 disposed thereon
  • the second electric element 521 has a second heat transfer member 522 disposed thereon, each of the shielding sheet 530 having the second heat transfer member 521 disposed thereon. Heat generated when the electric device is driven may be discharged through the portion S2 corresponding to the first opening 573 and the second opening 574 .
  • the shield can 570 consisting of the upper part 571 and the side part 572, and the first opening 573 and the second opening 574 of the shield can 570 are closed.
  • the shielding sheet 530 may effectively block electromagnetic waves generated from the first electric element 511 and the second electric element 521 .
  • the upper part 571 and the side part 572 and the shielding sheet 530 may form an integral electromagnetic noise shielding path (ENSP), thereby exhibiting high electromagnetic wave shielding performance. For example, as shown in FIG.
  • ENSP integral electromagnetic noise shielding path
  • FIG. 8 is a cross-sectional view illustrating a method of attaching a shielding and heat dissipation structure 500 using a carrier film, according to various embodiments of the present disclosure.
  • 9 is a cross-sectional view illustrating a method of removing a carrier film after attaching the shielding and heat dissipation structure 500 using the carrier film, according to various embodiments of the present disclosure.
  • the carrier film 610 is a process film, used in a process to implement a heat dissipation structure, and may not be disposed in an electronic device later.
  • the shielding sheet 530 may serve to press the heat dissipation member 540 to be attached thereto.
  • the heat dissipating member 540 is BN based Al with adhesive (BN)
  • the heat dissipating member 540 itself has an adhesive component, so that the shielding sheet 530 and the heat dissipating member 540 are in contact with each other after It is possible to form a shielding and heat dissipation structure in an attached state.
  • the shielding sheet 530 and the heat dissipation member 540 may be attached to each other due to an adhesive component included in the shielding sheet 530 , according to an embodiment.
  • the shielding sheet 530 and the heat dissipation member 540 may be attached through a separate adhesive interposed therebetween.
  • the shielding sheet 530 may serve as a support layer in the process of being pressed. In addition, it may serve to maintain the shape of the shielding sheet 530 during the SMD process and/or thermal curing.
  • the shielding sheet 530 may be disposed on at least a portion of the shielding can 570 using a carrier film 610 pre-attached to one surface of the shielding sheet 530 .
  • the edge portion of the carrier film 610 may press the first portion S1 of the shielding sheet 530 on the upper surface of the shield can 570 .
  • the carrier film 610 may serve to support the shielding sheet 530 to be attached to the shield can 570 .
  • the shielding sheet 530 and the shielding can 570 may be attached to each other due to an adhesive component included in the shielding sheet 530 .
  • the shielding sheet 530 and the shielding can 570 may be attached through a separate adhesive interposed therebetween.
  • the carrier film 610 may be removed. Referring to FIG. 9 , after the heat dissipation member 540 is attached to the shielding sheet 530 and/or after the shielding sheet 530 is attached over at least a portion of the shield can 570 , the carrier film ( 610) may be removed. Since only the carrier film 610 is removed, the shielding sheet 530 and the heat dissipation member 540 may be maintained in a stacked state on the upper surface of the shield can 570 . After the carrier film 610 is removed, the cooling member 560 may be positioned on the heat dissipation member 540 .
  • the heat dissipation member 540 may be in direct contact with the cooling member 560 , thereby thermal resistance between the heat generating source (eg, the electrical element 510 ) and the cooling member 560 . can be minimized and heat dissipation can be facilitated.
  • the heat dissipation member 540 is BN based Al with adhesive (BN)
  • the heat dissipation member 540 and the cooling member 560 are also attached to each other. It is possible to form a shielding and heat dissipation structure in the state
  • the heat dissipation member 540 and the cooling member 560 may be attached through a separate adhesive interposed therebetween.
  • FIG. 10 is a conceptual diagram illustrating a state in which the adhesive layer of the carrier film 610 is peeled off after a thermal curing operation, according to various embodiments of the present disclosure.
  • the carrier film 610 pre-attached to one surface of the shielding sheet 530 should have adhesive strength so that the shielding sheet 530 can be attached on at least a portion of the shield can 570 , while the shielding sheet 530 is the shield. It should be able to be easily removed after being attached to the can 570 .
  • a heat release adhesive layer 620 is formed on the surface in contact with the shielding sheet 530 .
  • the thermal peel adhesive layer 620 may have the same level of adhesive strength as a general adhesive layer at room temperature, but may have a configuration in which the adhesive strength decreases when heated to a certain temperature or higher.
  • the thermal peel adhesive layer 620 may include a spherical thermally expandable acrylic microcapsule 621 as shown in FIG. 10 .
  • hydrocarbons may be contained in the microcapsule 621 as a thermal expander. During thermal expansion, the microcapsule 621 is heated to soften the capsule membrane, and at the same time, the contained hydrocarbon is vaporized (gasified) to increase the internal pressure, and the microcapsule 621 can be expanded. Since the expanded microcapsules 621 reduce the adhesion area of the adherend, the adhesive strength of the adhesive layer may be reduced.
  • 11 is a cross-sectional view illustrating an attachment method using a carrier film 610 of a structure 500 for shielding and dissipating heat around an electric element according to another embodiment of the present disclosure.
  • 12 is a cross-sectional view illustrating a shielding and heat dissipation structure 500 around an electrical device according to another embodiment of the present disclosure.
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 3 ) includes a printed circuit board 340 , at least one electrical element 510 , at least one heat transfer member 520 , and a shielding sheet. 530 and a shield can 570 may be included.
  • the electronic device 101 may further include an insulating film 580 .
  • the insulating film 580 may be used to limit electrical connection between the configuration of the shield can 570 and/or the shielding sheet 530 and a structure (eg, a cooling member) stacked thereon.
  • the configuration of the printed circuit board 340 of FIGS. 11 and 12 may be partially or entirely the same as that of the printed circuit board 340 of FIG. 3 .
  • the configuration of at least one electrical element 510, at least one heat transfer member 520, a shielding sheet 530, a cooling member 560 and a shielding can 570 of FIGS. 11 and 12 is shown in FIG.
  • the configuration of at least one electrical element 510, at least one heat transfer member 520, a shielding sheet 530, a cooling member 560, and a shield can 570 of 5a may be the same in part or in whole. can
  • the carrier film 610 is disposed on the shielding and heat dissipating structure 500
  • FIG. 12 shows that the cooling member 560 is disposed on the shielding and heat dissipating structure 500 .
  • the carrier film 610 may be configured to support an upper portion of the shielding sheet 530 in order to attach and press the shielding sheet 530 to the shield can 570 .
  • the cooling member 560 may be formed to be flat, spaced apart from one surface of the first portion S1 of the shielding sheet 530 and in contact with the second portion S2 of the shielding sheet 530 . can be placed.
  • FIG. 11 and 12 show a shielding and heat dissipating structure 500 in which the heat dissipating member 540 is not shown.
  • the insulating film 580 may be applied without the heat dissipation member 540 .
  • the present invention is not limited thereto, and a heat dissipation member 540 may be additionally included separately from the insulating film 580 , unlike illustrated in the drawings.
  • the insulating film 580 when used, for example, when the shielding sheet 530 has fluidity, one surface of the fluid shielding sheet 530 may be supported.
  • the insulating film 580 may form a substantially integral configuration with the shielding sheet 530 .
  • FIG. 13 is an operation flowchart for manufacturing a shielding and heat dissipation structure (eg, the shielding and heat dissipation structure 500 of FIG. 4 ) according to various embodiments of the present disclosure.
  • a shielding and heat dissipation structure eg, the shielding and heat dissipation structure 500 of FIG. 4
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 3 ) includes a printed circuit board 340 , at least one electrical element 510 , at least one heat transfer member 520 , and a shielding sheet. (shielding sheet) 530 , and a shielding can 570 may be included.
  • the electronic device 101 may further include at least one of at least one heat dissipation member 540 and a cooling member 560 to implement a shielding and heat dissipation structure in which a plurality of components are stacked.
  • the carrier film 610 may be used according to various embodiments of the present disclosure.
  • the shielding sheet 530 used in the shielding and heat dissipation structure 500 may have a specific shape, and the shape may be implemented through pre-forming using a jig.
  • the shielding sheet 530 may be preformed.
  • the preforming means using a silicone compression jig to cover the parts and/or the shield can 570 of different heights, and the shielding sheet 530 has a predetermined thickness (or in consideration of the preset compression ratio of the heat transfer member 520 ). It may be molded to have a height).
  • the shielding sheet 530 may have a structure including an inclined surface and/or a curved surface.
  • the shielding sheet 530 protrudes in one direction (eg, the first direction) so as to close at least a portion of the opening, the first portion S1 to be disposed on at least a portion of the shield can 570 .
  • the formed second part S2 may be included.
  • the shielding sheet 530 may include a third portion S3 extending from the first portion S1 to the second portion S2 and forming a designated inclined surface or a curved surface.
  • the shielding sheet 530 provides a three-dimensional shape (eg, conformal type) structure so that parts of various sizes and shapes disposed on the printed circuit board 340 can be encapsulated into one sheet, and through this It can provide a shielding function.
  • an operation of attaching the heat dissipation member 540 to one surface of the preformed shielding sheet 530 may be performed.
  • the heat dissipation member 540 may be attached to one surface of the preformed shielding sheet 530 facing the first direction (+Z).
  • the heat dissipation member 540 may provide a function of collecting heat directed in the first direction (+Z) in the heat dissipation structure.
  • the heat dissipation member 540 may be positioned at the second portion S2 of the shielding sheet 530 .
  • the heat dissipation member 540 may be formed of a plurality of spaced apart from each other, and the position of the heat dissipation member 540 may be set to correspond to the position of each of the plurality of electrical elements 510 disposed on the printed circuit board 340 .
  • the plurality of second portions S2 of the shielding sheet 530 corresponding to the plurality of electrical elements 510 may be formed in plurality, and the plurality of heat dissipation members 540 may be located in the plurality of second portions S2. there is.
  • an operation of attaching the heat transfer member 520 to one surface of the preformed shielding sheet 530 may be performed.
  • the heat transfer member 520 may be adhered to one surface of the preformed shielding sheet 530 facing the second direction (-Z).
  • the shielding sheet 530 may include a shielding film and a conductive adhesive film, and may directly adhere the heat transfer member 520 using the conductive adhesive film to improve heat transfer efficiency.
  • the heat transfer member 520 may be positioned at the second portion S2 of the shielding sheet 530 .
  • the heat dissipation member 540 is positioned in the first direction (+Z) with respect to the shielding sheet 530 and the heat transfer member 520 is positioned in the second direction (-Z) to face each other. there is.
  • an operation of attaching the carrier film 610 to the shielding sheet 530 may be performed.
  • the heat dissipation member 540 may be pre-attached to the shielding sheet 530 .
  • a portion is preformed to protrude, and the shielding sheet 530 to which the heat dissipation member 540 is attached and the carrier film 610 may be aligned. Then, the carrier film 610 provided with an adhesive layer (eg, a heat release adhesive layer 620 ) may be attached to the shielding sheet 530 .
  • an adhesive layer eg, a heat release adhesive layer 620
  • an operation of attaching the shielding sheet 530 to the shield can 570 using the carrier film 610 may be performed.
  • the shielding sheet 530 to which the carrier film 610 is attached may be aligned with the shield can 570 in which the electric element 510 is accommodated and includes an opening.
  • the lower surface of the shielding sheet 530 may be attached to the upper surface of the shield can 570 by pressing the carrier film 610 using a nozzle (not shown).
  • the heat transfer member 520 is attached to one surface of the shielding sheet 530
  • the lower surface of the heat transfer member 520 may be attached to the upper surface of the electric element 510 .
  • the assembly thereof may be thermally cured.
  • the shielding sheet 530 and the shield can 570 assembly may be placed in a predetermined chamber and heated at about 120 degrees Celsius for about 20 minutes.
  • the adhesive force of the thermal peel adhesive layer 620 attached to one surface (eg, the surface to be attached to the shielding sheet 530 ) of the carrier film 610 may be reduced.
  • an operation of removing the carrier film 610 from the shielding sheet 530 may be performed.
  • the carrier film 610 is a component used only in the manufacturing process, and may not be located inside the electronic device that has been manufactured.
  • the cooling member 560 may be attached to the area of the shielding sheet from which the carrier film 610 is removed.
  • the cooling member 560 may be disposed on the shielding sheet 530 and the heat dissipation member 540 to be attached by pressing in the second direction (-Z).
  • the shielding and heat dissipation structure including the elastic material is compressed by the pressing, and can be maintained in close contact.
  • the cooling member 560 may be provided with a material having high thermal conductivity to effectively transfer the heat collected from the plurality of heat dissipation members 540 .
  • the cooling member 560 may include a water-cooled heat diffusion member such as a heat pipe or a vapor chamber, and as another example, a bracket, a copper plate (cu plate) It may include a metal plate such as
  • 14A is a conceptual diagram illustrating a shielding and heat dissipation structure according to a certain comparative embodiment.
  • 14B is a conceptual diagram illustrating an electromagnetic wave movement path in a shielding and heat dissipation structure, according to a comparative embodiment.
  • 15 is a diagram illustrating a shielding sheet, according to some comparative examples.
  • a heat transfer member 521 is formed through the opening 573 formed in the upper surface of the shield can 570 , and the shielding sheet 530 ′ is connected to the heat transfer member 521 .
  • the shielding and heat dissipation structure formed to be stepped while spanning only a part of the is shown.
  • a plate 591 and a support layer 592 may be used.
  • the support layer 592 may be formed of, for example, nanoform (offset).
  • the heat transfer member 521 is directly connected to the plate 591 , the heat dissipation performance may be guaranteed to some extent, but the electromagnetic noise shielding path is cut off at the upper side of the heat transfer member 521 , which may be disadvantageous in terms of shielding performance.
  • a shielding sheet 530 ′ according to an exemplary embodiment is disclosed.
  • a first hole 573 ′ corresponding to the first opening of the shield can and a second hole corresponding to the second opening of the shield can are disclosed.
  • (574') is shown.
  • the portion S2' corresponding to the second portion S2 of the shielding sheet 530 of the embodiment described with reference to FIGS. 4 to 13 constitutes the first hole 573', so that the third portion of the shielding sheet 530 is formed.
  • the portion S3 ′ and the corresponding portion S3 ′ may be in an unsupported state.
  • the shielding sheet 530' can be coupled to the heat transfer member 521 within the effective ranges 521' and 522' for the heat transfer member 521 to be adhered using an adhesive, but the heat transfer member 521 is eccentric ( C1), there may be a problem in that the third portion S3 of the shielding sheet 530 and the corresponding portion S3 ′ are lifted.
  • the shielding and heat dissipation structure may entirely cover the upper surface (eg, the first direction (+Z)) of the shield can 570 .
  • the flexible shielding sheet 530 is provided, contact points for shielding are reduced, making it easier to manufacture and improving shielding power.
  • 16A is a graph for showing shielding performance in an example using nanofoam as a shielding sheet according to a comparative example.
  • 16B is a graph illustrating shielding performance of a shielding and heat dissipating structure using a preformed shielding sheet according to various embodiments of the present disclosure;
  • Fig. 16b is a graph showing the shielding performance of the shielding and heat dissipation structure according to the embodiment shown in Figs. 4 to 13, and Fig. 16a is a nanoform according to another embodiment for comparison with the embodiment shown in Fig. 16b A graph showing the shielding performance of the shielding and heat-dissipating structure to which is applied may be shown.
  • the embodiment shown in FIG. 16A may be to apply an offset formed nanoform.
  • the nanoform with an offset is formed with some openings (eg, the first hole 573 ′ or the second hole 574 ′ in FIG. 15 ), without shielding the entire upper surface of the heat transfer member, the opening ( Example: to be configured to contact a plate (eg, plate 591 in FIG. 15 ) with at least a portion of the heat transfer member exposed through the first hole 573 ′ or the second hole 574 ′ in FIG. 15 ) can
  • FIG. 16A as an embodiment using nanofoam as a shielding sheet, maximum values of shieldable noise components for various frequency ranges are shown.
  • the maximum value of the shieldable noise component of the nanoform may be different for each electrical device.
  • G1 and G2 may be shown as maximum values of shieldable noise components for each electric element.
  • the noise G1 and the noise G2 represent noise components of electromagnetic waves generated by the first electrical device 511 (eg, charger IC) and the second electrical device 521 (eg, AP or memory).
  • the nanoform noise G1 is measured as 35.5dB
  • the nanoform noise G2 is 48.3dB
  • the nanoform noise G1 is 37.1dB and the nanoform noise G2 is 50.0dB
  • nanoform noise G1 was measured to be 38.3 dB
  • nanoform noise G2 was measured to be 53.4 dB
  • nanoform noise G1 was measured to be 41.5 dB
  • nanoform noise G2 was measured to be 57.1 dB in the vicinity of 1.5 GHz
  • nanoform noise was measured at around 2.5 GHz.
  • G1 can measure 45.3 dB
  • nanofoam noise G2 can measure 59.4 dB.
  • FIG. 16B graphs showing shielding performance with respect to the shielding and heat dissipation structures according to the embodiments shown in FIGS. 4 to 13 may be shown.
  • the maximum values of the shieldable components for various frequency ranges are shown.
  • the maximum shieldable noise value of the preforming shielding film may be different for each electric element, and may be shown as G3 and G4 in FIG. 16B .
  • the pre-forming shielding film shields the entire upper surface of the heat transfer member (eg, the first heat transfer member 521).
  • the noise G3 and the noise G4 are the first electrical element 511 (eg, the charger IC) and the second 2 It may represent the maximum value of the noise component of the electromagnetic wave generated by the electrical element 521 (eg, AP or Memory).
  • the noise G3 of the preforming shielding film is 45.6 dB, and the noise G4 of the pre-forming shielding film is 48.2 dB.
  • the noise G3 of the pre-forming shielding film is 47.2 dB
  • the preforming shielding film noise G4 is measured to be 50.4dB
  • the noise G3 of the preforming shielding film is 49.0dB
  • the noise G4 of the preformed shielding film is 52.0dB
  • the noise G3 of the preforming shielding film is The noise G4 of the preforming shielding film is 54.1dB
  • the noise G4 of the preformed shielding film is measured to be 55.7dB.
  • the G3 noise of the preforming shielding film can be measured as 61.1
  • the noise G4 of the preforming shielding film can be measured as 59.6.
  • the electronic device (eg, the electronic device 101 of FIG. 1 ) according to various embodiments of the present disclosure includes a printed circuit board (eg, the printed circuit board 340 of FIG. 4 ), a first perpendicular to the printed circuit board At least one electric element (eg, at least one electric element 510 of FIG. 4 ) disposed on one surface facing the direction is mounted on one surface of the printed circuit board to accommodate the electric element therein, and the electric element and a shield can (eg, shield can 570 in FIG. 4 ) comprising at least one opening (eg, at least one opening 573 or 574 in FIG.
  • the shielding sheet has a pre-forming structure, and closes at least a part of the opening and a first part (eg, the first part S1 in FIG. 4 ) laminated on at least a part of the shield can;
  • a second portion eg, the second portion S2 of FIG. 4 ) protruding in a direction parallel to the first direction may be included.
  • the first portion of the shielding sheet may surround the periphery of the second portion and be disposed in contact with the shield can.
  • At least one of the shielding sheet and the heat transfer member may be formed of a material including an elastic material.
  • the shielding sheet may include a shielding film including a nano fiber structure and a conductive adhesive film disposed on at least one surface of the shielding film.
  • the shielding sheet further includes a heat dissipation member (eg, the heat dissipation member 540 of FIG. 4 ) disposed to overlap at least a portion of the second portion on a surface of the shielding sheet facing in a direction parallel to the first direction. can do.
  • a heat dissipation member eg, the heat dissipation member 540 of FIG. 4
  • the heat dissipation member may include BN (BN based Al with adhesive) based on aluminum (Al).
  • At least a portion of the cooling member may further include a cooling member disposed in contact with the heat dissipation member.
  • the cooling member may be at least one of a bracket, a heat pipe, and a vapor chamber.
  • an insulating film disposed on a surface of the shielding sheet facing a direction parallel to the first direction may be included.
  • At least a portion of the heat transfer member may be disposed to pass through the opening of the shield can, and may transfer heat generated from the electric element to the shielding sheet.
  • the heat transfer member may be at least one of a carbon fiber thermal interface material (TIM) or an acrylic fiber thermal interface material (TIM).
  • TIM carbon fiber thermal interface material
  • TIM acrylic fiber thermal interface material
  • the electric element may include a first electric element (eg, the first electric element 511 of FIG. 4 ) and a second electric element (eg, the second electric element of FIG. 4 ) disposed to be spaced apart on the printed circuit board. 2 electrical elements 512), wherein the heat transfer member is disposed on the first heat transfer member (eg, the first heat transfer member 521 in FIG. 4) adhered on the first electric element and on the second electric element It may include an adhesive second heat transfer member (eg, the second heat transfer member 522 of FIG. 4 ).
  • the shielding sheet may provide a three-dimensional structure to encapsulate the at least one electrical element disposed on the circuit board into a single sheet paper.
  • the heat dissipation member may include a first heat dissipation member (eg, the first heat dissipation member 541 of FIG. 4 ) facing the first heat transfer member with the shielding sheet interposed therebetween, and the shielding sheet interposed therebetween. and a second heat dissipating member (eg, the second heat dissipating member 542 of FIG. 4 ) facing the second heat transmitting member.
  • a first heat dissipation member eg, the first heat dissipation member 541 of FIG. 4
  • a second heat dissipating member eg, the second heat dissipating member 542 of FIG. 4
  • the shielding sheet is disposed on at least a portion of the shield can by using a carrier film attached to one surface of the shielding sheet, and after the shielding sheet is adhered to the shield can, the carrier film ( Example: The carrier film 610 of FIG. 4 may be removed.
  • a printed circuit board eg, the printed circuit board 340 of FIG. 4
  • At least one electric element eg, the electric element 510 of FIG. 4
  • a shield including at least one opening formed in the region of the shield can, a first part stacked on at least a portion of the shield can (for example, the first part S1 of FIG.
  • an electronic device including a member (eg, the heat dissipation member 540 of FIG. 4 ) and a cooling member (eg, the cooling member 560 of FIG. 5A ) having at least one surface disposed in contact with the heat dissipation member may be provided.
  • the shielding sheet is disposed on at least a portion of the shielding can using a carrier film (eg, the carrier film 610 of FIG. 4 ) attached to one surface of the shielding sheet, and the shielding sheet After being adhered to the shield can, the carrier film may be removed.
  • a carrier film eg, the carrier film 610 of FIG. 4
  • the cooling member may be attached to the heat dissipation member after the carrier film is removed.
  • an operation of pre-forming a shielding sheet eg, the shielding sheet 530 of FIG. 4
  • an operation of attaching a heat dissipation member eg, the heat dissipation member 540 of FIG. 4
  • an operation of attaching a carrier film eg, the carrier film 610 of FIG. 4
  • an operation of attaching a cooling member eg, the cooling member 560 of FIG. 5A
  • a method of manufacturing an electronic device including the operation of:
  • thermosetting operation may be further included after the operation of attaching the shielding sheet to the shield can.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Textile Engineering (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un dispositif électronique selon divers modes de réalisation de la présente divulgation comprend : une carte de circuit imprimé ; au moins un élément électrique, disposé sur une surface orientée suivant une première direction perpendiculaire à la carte de circuit imprimé ; un blindage montable sur la surface de la carte de circuit imprimé pour y loger l'élément électrique et comportant au moins une ouverture formée dans une région correspondant à l'élément électrique ; une feuille de blindage, disposée sur au moins une partie du blindage et fermant au moins une partie de l'ouverture ; et un organe de transfert thermique, disposé entre l'élément électrique et la feuille de blindage. La feuille de blindage présente une structure de préformage et peut comporter une première partie empilée sur au moins une partie du blindage et une seconde partie, formée pour faire saillie selon une direction parallèle à la première direction pour fermer au moins une partie de l'ouverture.
PCT/KR2021/000851 2020-01-21 2021-01-21 Dispositif électronique présentant une structure de blindage et une structure de dissipation thermique WO2021150041A1 (fr)

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WO2023015953A1 (fr) * 2021-08-12 2023-02-16 荣耀终端有限公司 Couvercle de blindage, ensemble carte de circuit imprimé et dispositif électronique

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WO2023085825A1 (fr) * 2021-11-12 2023-05-19 삼성전자 주식회사 Dispositif électronique comprenant une structure de blindage

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JPH10145064A (ja) * 1996-11-05 1998-05-29 Advantest Corp 高放熱性伝熱部品
US20060126309A1 (en) * 2004-12-15 2006-06-15 Bolle Cristian A Thermal management for shielded circuit packs
JP2016006808A (ja) * 2014-05-26 2016-01-14 住友ベークライト株式会社 電磁波シールド用フィルム、および電子部品搭載基板
US20180103539A1 (en) * 2015-01-30 2018-04-12 e.solutions GmbH Arrangement and method for electromagnetic shielding
KR20180109615A (ko) * 2017-03-28 2018-10-08 삼성전자주식회사 전자 장치

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JPH10145064A (ja) * 1996-11-05 1998-05-29 Advantest Corp 高放熱性伝熱部品
US20060126309A1 (en) * 2004-12-15 2006-06-15 Bolle Cristian A Thermal management for shielded circuit packs
JP2016006808A (ja) * 2014-05-26 2016-01-14 住友ベークライト株式会社 電磁波シールド用フィルム、および電子部品搭載基板
US20180103539A1 (en) * 2015-01-30 2018-04-12 e.solutions GmbH Arrangement and method for electromagnetic shielding
KR20180109615A (ko) * 2017-03-28 2018-10-08 삼성전자주식회사 전자 장치

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Publication number Priority date Publication date Assignee Title
WO2023015953A1 (fr) * 2021-08-12 2023-02-16 荣耀终端有限公司 Couvercle de blindage, ensemble carte de circuit imprimé et dispositif électronique
EP4156881A4 (fr) * 2021-08-12 2023-08-02 Honor Device Co., Ltd. Couvercle de blindage, ensemble carte de circuit imprimé et dispositif électronique

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