WO2019235877A1 - Connecteur connectant un cadre conducteur et une carte de circuit imprimé et dispositif électronique le comprenant - Google Patents

Connecteur connectant un cadre conducteur et une carte de circuit imprimé et dispositif électronique le comprenant Download PDF

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Publication number
WO2019235877A1
WO2019235877A1 PCT/KR2019/006871 KR2019006871W WO2019235877A1 WO 2019235877 A1 WO2019235877 A1 WO 2019235877A1 KR 2019006871 W KR2019006871 W KR 2019006871W WO 2019235877 A1 WO2019235877 A1 WO 2019235877A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
connector
electronic device
housing
conductive frame
Prior art date
Application number
PCT/KR2019/006871
Other languages
English (en)
Korean (ko)
Inventor
정완의
장세영
한재룡
김도훈
김영준
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2019235877A1 publication Critical patent/WO2019235877A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • a connector for effectively shielding an electronic component mounted on a substrate from noise provided inside or outside the electronic device and an electronic device including the same are disclosed.
  • the inside of the portable electronic device may include a board on which various electronic components are mounted, and a connector provided for compatibility of data, such as a communication port.
  • a mobile terminal must accommodate electronic components for implementing various functions in a limited space, and a stacked substrate structure in which two or more substrates are stacked to effectively utilize insufficient mounting space (hereinafter referred to as a 'layered PCB structure'). Is widely used.
  • the connector is widely used as a medium connecting the board to the board.
  • SMD surface mounted device
  • TDD through hole device
  • the surface mount type forms a solder joint while a plurality of pins provided in the connector undergo a reflow process on a printed circuit board (hereinafter referred to as a 'circuit board').
  • the surface-mount type is advantageous in mass production compared to the insert-mount type, which has advantages in terms of manufacturing cost and time. Accordingly, various components (for example, connectors) mounted on the printed circuit board mainly consist of a surface mount type.
  • an interposer connector may be utilized as another connector.
  • An interposer connector is a type of connector packaged with an insulating material (for example, silicon (Si), glass, or ceramic) for the electrical connection between the board and the board.
  • an insulating material for example, silicon (Si), glass, or ceramic
  • plating layer may be to improve the shielding performance.
  • the interposer may provide electrical connection and / or mechanical flexibility between the semiconductor chip and the circuit board.
  • the conventional connector is exposed to the outside as it is surface-mounted on the circuit board and thus does not implement shielding at all, and thus data communication components generated when there is data communication act as noise in antenna performance.
  • the conventional connector is formed by cutting or bending after cutting the SUS plate in order to assemble the printed circuit board when forming the press plate by the press method, such a joint A joint caused a hole or a slit in the connector device. Through this hole or slot, data communication components are emitted and noise is generated, which degrades the antenna's radiation performance.
  • next generation communication e.g., millimeter wave communication
  • next generation communication system for example, the next generation (5th generation) communication system or pre (pre) next generation communication system
  • the type of electronic components around the wiring, And / or may be affected by electronic component placement
  • an empty space is inevitably generated between the substrate and the substrate (hereinafter, referred to as a "layered PCB structure") in the manufacturing method, and noise can be emitted through this space.
  • Next-generation communication systems use relatively high frequencies, which is likely to degrade antenna performance, such as degradation of peripheral components.
  • the interposer connector is known to have higher shielding performance than the general connector, even if the interposer connector is used under the next-generation communication system, the interposer connector is insufficient to prevent performance degradation due to noise.
  • Various embodiments of the present invention to provide a connector to effectively shield the noise due to the conventional connector structure.
  • Various embodiments of the present invention to provide a connector and an electronic device using the same that can effectively shield the noise in the next generation communication (eg, millimeter wave communication) system.
  • next generation communication eg, millimeter wave communication
  • an electronic device may include: a circuit board on which at least one electronic component is mounted; A conductive frame disposed over the circuit board to surround the at least one electronic component; And at least one connector mounted on the circuit board, wherein the at least one connector includes a second surface mounted on the circuit board, a first surface facing the second surface, the second surface, and the first surface; A housing including a plurality of sides surrounding a first surface, the recess including a recess formed along one side of the plurality of sides on the first surface, the recess physically coupled to the conductive frame; And a plurality of conductive terminals formed on the one side surface, wherein at least one conductive terminal of the plurality of conductive terminals is electrically connected to the conductive frame through a connection terminal formed in the recess, and the circuit board It is possible to provide an electronic device that is electrically connected to the ground of the electronic device.
  • a circuit board includes a top surface facing a first direction and a bottom surface facing a second direction opposite to the first direction; At least one electronic component mounted on an upper surface of the circuit board; At least one connector mounted on an upper surface of the circuit board and electrically connected to at least one of the circuit board and the electronic component; And a shielding surface connected to the ground portion of the circuit board and facing the first direction or a third direction different from the second direction to surround at least a portion of the electronic component, thereby shielding the electronic component. It may provide an electronic device including a frame.
  • a circuit board includes a top surface facing a first direction and a bottom surface facing a second direction opposite to the first direction; At least one electronic component mounted on an upper surface of the circuit board; At least one connector mounted on an upper surface of the circuit board and electrically connected to at least one of the circuit board and the electronic component; And a shielding surface mounted on an upper surface of the circuit board and facing a third direction different from the first direction or the second direction, and disposed to surround at least a portion of the electronic component and at least a portion of the connector.
  • a conductive frame may be provided to shield the electronic component.
  • the space between the substrate and the substrate (hereinafter referred to as the 'laminated PCB') and effectively shielding the substrate and the grounded conductive frame is improved compared to the stacked PCB structure according to the prior art. It may have a noise shielding effect.
  • a long conductive frame is disposed between the substrate and the substrate to achieve a stable fixation structure so that stress is concentrated on a particular structure (any connector of a plurality of connectors or part of the conductive frame). You can also prevent it.
  • the conductive frame may serve to structurally connect the substrate to the substrate, only the required number of connectors may be used, thereby reducing the manufacturing cost of the product. It may have the effect of saving.
  • FIG. 1 is a perspective view of a front side of a mobile electronic device according to one embodiment.
  • FIG. 2 is a perspective view of a rear surface of the electronic device of FIG. 1.
  • FIG. 3 is an exploded perspective view of the electronic device of FIG. 1.
  • FIG. 4 is a perspective view of an electronic device including a connector according to various embodiments of the present disclosure.
  • FIG. 5 is a perspective view of an electronic device including a connector according to another embodiment of FIG. 4.
  • FIG. 6 is a diagram of an interposer connector with a recess in accordance with various embodiments disclosed herein.
  • connection terminal line is grounded to a substrate among a plurality of conductive terminals.
  • FIG. 8 is a diagram of an interposer connector with a recess according to another embodiment of FIG. 6.
  • FIG. 9 is a diagram of a connector including an assembly, in accordance with various embodiments disclosed herein.
  • FIG. 10 is a diagram of a connector including an assembly, in accordance with various embodiments disclosed herein.
  • FIG. 11 is a view of a connector including an assembly, according to another embodiment from FIG. 10.
  • FIG. 12 illustrates a connector and a conductive frame, in accordance with various embodiments disclosed herein.
  • FIG. 13 illustrates a connector and a circuit board mounted conductive frame, according to various embodiments disclosed herein.
  • FIG. 14 is a diagram illustrating shielding efficiency of an electronic device according to various embodiments of the present disclosure.
  • 15 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
  • an electronic device 100 may include a first surface (or front surface) 110A, a second surface (or rear surface) 110B, a first surface 110A, and It may include a housing 110 including a side (110C) surrounding the space between the second surface (110B).
  • the housing may refer to a structure that forms some of the first surface 110A, second surface 110B, and side surfaces 110C of FIG. 1.
  • the first face 110A may be formed by a front plate 102 (eg, a glass plate comprising various coating layers, or a polymer plate) that is at least partially substantially transparent.
  • the second surface 110B may be formed by the substantially opaque back plate 111.
  • the back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be.
  • the side 110C may be formed by a side bezel structure (or “side member”) 118 that engages the front plate 102 and the back plate 111 and includes metal and / or polymer.
  • back plate 111 and side bezel structure 118 may be integrally formed and include the same material (eg, a metal material such as aluminum).
  • the front plate 102 includes two first regions 110D extending seamlessly from the first surface 110A toward the rear plate 111 and extending seamlessly. It may be included at both ends of the long edge (102).
  • the back plate 111 has a long edge between two second regions 110E extending seamlessly from the second face 110B toward the front plate 102. It can be included at both ends.
  • the front plate 102 (or the back plate 111) may include only one of the first regions 110D (or the second regions 110E). In another embodiment, some of the first regions 110D or the second regions 110E may not be included.
  • the side bezel structure 118 when viewed from the side of the electronic device 100, may have a side surface where the first regions 110D or the second regions 110E are not included. It may have a first thickness (or width) and a second thickness that is thinner than the first thickness on the side surface including the first regions 110D or the second regions 110E.
  • the electronic device 100 may include a display 101, an audio module 103, 107, 114, a sensor module 104, 116, 119, a camera module 105, 112, 113, and a key input. And at least one of the device 117, the light emitting element 106, and the connector holes 108, 109. In some embodiments, the electronic device 100 may omit at least one of the components (for example, the key input device 117 or the light emitting element 106) or may further include other components.
  • the display 101 may be exposed through, for example, a substantial portion of the front plate 102. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first surface 110A and the first regions 110D of the side surface 110C. In some embodiments, the corners of the display 101 may be formed approximately the same as the adjacent outer shape of the front plate 102. In another embodiment (not shown), the distance between the outer side of the display 101 and the outer side of the front plate 102 may be substantially the same in order to expand the area where the display 101 is exposed.
  • an audio module 114 and a sensor are formed in a portion of the screen display area of the display 101 and are aligned with the recess or opening. At least one of the module 104, the camera module 105, and the light emitting device 106 may be included. In another embodiment (not shown), the audio module 114, the sensor module 104, the camera module 105, the fingerprint sensor 116, and the light emitting element 106 are located behind the screen display area of the display 101. It may include at least one of). In another embodiment (not shown), the display 101 is coupled or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer for detecting a magnetic field stylus pen. Can be deployed.
  • At least a portion of the sensor module 104, 119, and / or at least a portion of the key input device 117 may be configured such that the first regions 110D, and / or the second regions 110E. Can be placed in the field.
  • the audio module 103, 107, 114 may include a microphone hole 103 and a speaker hole 107, 114.
  • the microphone hole 103 may include a microphone for acquiring an external sound, and in some embodiments, a plurality of microphones may be disposed to detect a direction of the sound.
  • the speaker holes 107 and 114 may include an external speaker hole 107 and a receiver receiver hole 114 for a call.
  • the speaker holes 107 and 114 and the microphone hole 103 may be implemented as one hole, or a speaker may be included without the speaker holes 107 and 114 (eg, piezo speaker).
  • the sensor modules 104, 116, and 119 may generate an electrical signal or data value corresponding to an operating state inside the electronic device 100 or an external environment state.
  • the sensor modules 104, 116, 119 may comprise, for example, a first sensor module 104 (eg, proximity sensor) and / or a second sensor module (eg, disposed on the first surface 110A of the housing 110). Not shown) (eg, fingerprint sensor), and / or third sensor module 119 (eg, HRM sensor) and / or fourth sensor module 116 disposed on the second side 110B of the housing 110. ) (Eg, fingerprint sensor).
  • the fingerprint sensor may be disposed on the first surface 110A (eg, the display 101 as well as the second surface 110B) of the housing 110.
  • the electronic device 100 may be a sensor module (not shown), for example.
  • a sensor module for example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104 may be used. It may include.
  • the camera modules 105, 112, and 113 are the first camera device 105 disposed on the first surface 110A of the electronic device 100, and the second camera device 112 disposed on the second surface 110B. ) And / or flash 113.
  • the camera devices 105, 112 may include one or a plurality of lenses, an image sensor, and / or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100.
  • the key input device 117 may be disposed on the side surface 110C of the housing 110.
  • the electronic device 100 may not include some or all of the above-mentioned key input device 117 and the non-included key input device 117 may include other soft keys or the like on the display 101. It may be implemented in the form.
  • the key input device may include a sensor module 116 disposed on the second surface 110B of the housing 110.
  • the light emitting element 106 may be disposed, for example, on the first surface 110A of the housing 110.
  • the light emitting element 106 may provide, for example, state information of the electronic device 100 in the form of light.
  • the light emitting element 106 may provide a light source that is interlocked with, for example, the operation of the camera module 105.
  • the light emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 108 and 109 may include a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or an external electronic device. And a second connector hole (eg, an earphone jack) 109 that can accommodate a connector for transmitting and receiving audio signals.
  • a connector eg, a USB connector
  • a second connector hole eg, an earphone jack
  • the electronic device 300 may include a side bezel structure 310, a first support member 311 (eg, a bracket), a front plate 320, a display 330, and a printed circuit board 340.
  • the battery 350 may include a second support member 360 (eg, a rear case), an antenna 370, and a rear plate 380.
  • the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360) or further include other components. .
  • At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2, and overlapping descriptions thereof will be omitted.
  • the first support member 311 may be disposed in the electronic device 300 to be connected to the side bezel structure 310 or may be integrally formed with the side bezel structure 310.
  • the first support member 311 may be formed of, for example, a metal material and / or a non-metal (eg polymer) material.
  • the display 330 may be coupled to one surface thereof, and the printed circuit board 340 may be coupled to the other surface thereof.
  • the printed circuit board 340 may be equipped with a processor, a memory, and / or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, volatile memory or nonvolatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially coplanar with, for example, the printed circuit board 340. The battery 350 may be integrally disposed in the electronic device 300, or may be detachably attached to the electronic device 300.
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350.
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.
  • the antenna structure may be formed by some or a combination of the side bezel structure 310 and / or the first support member 311.
  • FIG. 4 is a perspective view of an electronic device 400 (eg, 100 of FIG. 1) including a connector 600, according to various embodiments disclosed herein.
  • FIG. 5 is a perspective view of an electronic device 400 (eg, 100 of FIG. 1) including a connector 600, according to other embodiments of FIG. 4.
  • an electronic device 400 may include a printed circuit board 410 (hereinafter referred to as a “circuit board”), at least one electronic component 500, and at least one It may include a connector 600.
  • a printed circuit board 410 hereinafter referred to as a “circuit board”
  • at least one electronic component 500 may include a connector 600.
  • the circuit board 410 may include an upper surface 401 facing the first direction and a lower surface 402 facing the second direction opposite to the first direction.
  • the first direction may be a direction parallel to the direction component '1' shown in FIG. 4
  • the second direction may be a direction parallel to the direction component '2' shown in FIG. 4.
  • the direction component '1' may indicate a direction substantially the same as the z-axis of the coordinate axis described below with reference to FIG. 2, and the direction component '2' may indicate a direction opposite to the z-axis of the coordinate axis.
  • the first direction may face the first surface 110A of the electronic device 100 described above with reference to FIG. 1 or the second surface 110B of the electronic device 100.
  • the shape of the circuit board 410 is not limited to any particular embodiment. 1 and 2, the rectangular circuit board 410 is shown, but various shapes including circuit boards having shapes different from those shown in the drawings, for example, 'a' and 'b' shapes (including atypical shapes). ) May correspond to a circuit board.
  • At least one electronic component 500 and at least one connector 600 may be mounted on the top surface 401 of the circuit board 410.
  • the electronic component 500 or the connector 600 mounted on the circuit board 410 may mean that the electronic component 500 or the connector 300 is fixed at a specific position on the circuit board 410.
  • a fastening part is formed below the electronic component 500 or the lower part of the connector 600, and a through hole device (THD) method coupled to the fastening structure provided on the circuit board 100 may be applied.
  • TDD through hole device
  • SMD surface mounted device
  • the shape of the circuit board 410 may be variously modified. Accordingly, the position or arrangement of the at least one electronic component 500 or the at least one connector 600 on the circuit board 410 may be variously modified to correspond to the shape of the circuit board 410.
  • two or more circuit boards may be provided as the circuit board 410.
  • each circuit board 410 may be stacked on each other.
  • the circuit board 410 or the first substrate and the sub circuit board 420 or the second substrate will be described.
  • At least one electronic component 500 is mounted on the circuit board 410, and at least one electronic component also on the sub circuit board 420. (Not shown) may be mounted.
  • the two circuit boards 410 and 420 may face each other while the electronic component 500 is mounted.
  • the top surface 101 of the first substrate 410 and the top surface (not shown) of the second substrate 420 may face each other, and the electronic components mounted on the two circuit boards 410 and 420, respectively, 500 may be staggered so as not to physically interfere with each other.
  • the electronic components 500 mounted on the two circuit boards 410 and 420 may be arranged to minimize interference in consideration of electromagnetic influences.
  • the electronic device 400 eg, 100 of FIG. 1 having various electronic components 500, space utilization may be increased.
  • At least one electronic component 500 mounted on the circuit board 410 may be provided.
  • each electronic component 501, 502, 503 is individually connected to the connector 600. Or may be connected to the connector 600 in conjunction with other electronic components.
  • the kind and form of the electronic component 500 are not limited to any particular one.
  • the electronic component 500 may include, for example, a communication device, a processor, a memory, a radio frequency transceiver (RF transceiver), a power management module, a wireless communication circuit, and / or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the processor may include at least a communication processor or an integrated configuration of an application processor and a communication processor, and may control or drive the wireless transceiver, the power management module, the wireless communication circuit, and the like. have.
  • the electronic component 500 constitutes a next-generation communication system.
  • the electronic component 500 may be a millimeter wave communication device that performs wireless communication in a frequency band of about 20 GHz or more and about 100 GHz or less.
  • the connector 600 may serve to connect two different substrates.
  • the connector 600 may be disposed between the two circuit boards 410 and 420 to electrically connect the two circuit boards 410 and 420.
  • the number and positions of the connectors 600 may be variously set.
  • the connector 600 is illustrated in which a plurality of connectors 600 are arranged in series along the circumference of the circuit board 410, but is not limited thereto.
  • the plurality of connectors 600 may be arranged in parallel, or may be configured in a combination of serial / parallel arrangements.
  • the connector 600 may be an interposer connector.
  • the connector 600 may be made of an insulating material including silicon (Si), glass, or ceramic to have a low coefficient of thermal expansion, and conductive terminals may be formed together with the insulating materials. It may be packaged and mounted on the circuit board 410.
  • the connector 600 when the connector 600 is configured as an interposer connector, the connector 600 may be surface mounted (SMD) on a circuit board 410 made of an organic material.
  • SMD surface mounted
  • the electronic device 400 may include a circuit board 410, at least one electronic component 500, and at least one connector 600.
  • the electronic component 500 may include a conductive frame 700 to shield the electronic component 500 from internal / external noise of the electronic device 400. If the connector 600 is to electrically and structurally interconnect different substrates of the stacked PCB structure, the conductive frame 700 may serve to shield the internal space of the stacked PCB structure formed by the connector 600.
  • the conductive frame 700 may be disposed over the circuit board 410 to surround the at least one electronic component 500. According to an embodiment, the conductive frame 700 may be electrically connected to a ground portion (not shown) of the circuit board 410.
  • the conductive frame 700 may have a shielding surface facing a third direction different from the first direction (eg, direction component '1') or the second direction (eg, direction component '2').
  • the conductive frame 700 is a strip-shaped component in which the shielding surface extends in one direction, and may surround a space inside the stacked PCB substrate.
  • the inner space in which the conductive frame 700 is enclosed may be substantially sealed. However, if only a shielding effect is ensured, a fine groove or slit may be present to prevent the structure from being closed.
  • the conductive frame 700 may form a closed-loop structure as shown in FIGS. 4 and 5.
  • the conductive frame 700 may extend in a shape corresponding to the shape of the circuit board 410.
  • the conductive frame 700 may also have a rectangular frame structure, and unlike the drawing, the circuit board 410 may be formed.
  • the conductive frame 700 forms a closed loop structure, but may have a 'a' or 'b' shape as a whole.
  • the conductive frame 700 may be provided to extend integrally to shield the electronic component 500, but is not limited thereto.
  • a plurality of conductive metal pieces are provided, and the plurality of conductive metal pieces (not shown) are disposed in a band shape for shielding the electronic component 500 to have a structure substantially the same as that of the conductive frame.
  • a plurality of conductive metal pieces form a conductive frame
  • Embodiments for forming a conductive frame of uninterrupted form may be applied. Additional embodiments of the conductive frame 700 will be described below with reference to FIG. 12.
  • FIG. 6 is a diagram of a connector 600 with a recess in accordance with various embodiments disclosed herein.
  • FIG. 7 is a diagram illustrating a cross section of the connection terminal 622 which is grounded with the circuit board 410 among the plurality of conductive terminals.
  • FIG. 8 is a diagram of a connector 600 with a recess according to another embodiment of FIG. 6.
  • the connector 600 includes a terminal portion 620 that includes a housing 610 or a body and a plurality of conductive terminals 621 and 622 accommodated in the housing 610. can do.
  • the housing 610 may be configured to form an overall appearance of the connector 600.
  • the plurality of conductive terminals 621 and 622 included in the terminal unit 620 may include a circuit board (eg, 410 of FIG. 5) and a sub circuit board (eg, 420 of FIG. 5), or a circuit board (eg, of FIG. 4).
  • 410 and an electronic component (eg, 500 of FIG. 4) may be electrically connected.
  • the housing 610 may have a material including an insulating material
  • the terminal unit 320 may have a material including a conductive material.
  • the housing 610 may have a hexahedron shape as a whole.
  • a second surface 602 facing the top surface of the substrate (eg, 401 of FIG. 4), and a second surface 602 are provided. It may include a first surface 601 facing in a direction opposite to the facing direction, and a side surface 603 facing in a direction different from the direction in which the first surface 601 or the second surface 602 faces.
  • the side 603 may include a first side 603a and a second side 603b, and may include a third side 603c and a fourth side 603d.
  • the housing 610 may have a rectangular parallelepiped shape.
  • the side surface 603 includes a first side surface 603a and a second side surface 603b perpendicular to the longitudinal direction of the housing 610, and a third side surface 603c parallel to the longitudinal direction of the housing 610. And a fourth side 603d.
  • the first surface 601, the second surface 602, and the side surface 603 of the connector 600 described in the embodiments of FIGS. 4 to 14 are the first surface 110A of the electronic device 100 of FIG. 1. ),
  • the second surface 110B and the side surface 110C, and the housing 610 of the connector 600 described in the embodiments of FIGS. 4 to 14 may be referred to as the electronic device 100 of FIG. 1. Note that it may refer to a configuration different from that of the housing.
  • the terminal portion 620 includes a plurality of conductive terminals 621 and 622 penetrating from the first surface 601 to the second surface 602, each of the plurality of conductive terminals 621.
  • the ends of 622 may be exposed at the first side 601 and the second side 602. End portions of the plurality of conductive terminals 621 and 622 exposed through the first surface 601 and the second surface 602 may be electrically connected to the outside (eg, the substrates 410 and 420 of FIG. 5). .
  • the connector 600 may include a recess 630 in the housing 610.
  • the recess 630 may be formed along the side of one of the plurality of side surfaces on the first surface 601.
  • the recess 610 may be formed on the second surface 602 or the plurality of side surfaces 603, but the recess 630 formed on the first surface 601 for convenience of description below. Explain mainly on).
  • the recess 630 may be penetrated from the first side 603a of the connector 600 to the second side 603b.
  • the recess 630 is different from the one illustrated in FIG. 6, and at least a portion of the recess 630 is not extended from the first side 603a to the second side 603b without breaking. It may have a form that is interrupted internally.
  • a conductive frame (eg, 700 of FIG. 4) may be inserted into the recess 630.
  • the width of the conductive frame (eg, 700 of FIG. 4) may have a width that can be fitted into the recess 630.
  • a plurality of connectors 600 may be interconnected through the conductive frame (eg, 700 of FIG. 4). Accordingly, durability of the multilayer PCB structure can be secured.
  • the recess 630 may include a plurality of conductive terminals 621 of the terminal portion 620 to ground a conductive frame (eg, 700 of FIG. 4) to a circuit board (eg, 410 of FIG. 4).
  • a portion of 622 may provide a space in which the recess 630 protrudes toward the recess 630.
  • At least one of the plurality of conductive terminals 621 and 622 of the terminal unit 620 may be configured as a connection terminal 622.
  • some terminals 621 of the plurality of conductive terminals 621 and 622 may be configured with conventional signal terminals as many as necessary according to the design specification of the electronic device (eg, 400 of FIG. 4). have.
  • Some of the plurality of conductive terminals 621 and 622 may be configured as connection terminals 622 for grounding the conductive frame (eg, 700 of FIG. 4).
  • connection terminal 622 is connected to a ground portion (not shown) of the substrate, and the other end of the connection terminal 622 has at least a portion protrudingly formed inside the recess 630 to form a conductive frame (
  • a conductive frame eg, 700 of FIG. 4
  • the conductive frame can be made in an electrically grounded state.
  • connection terminal 622 may include a first portion 622a and a conductive frame (eg, connected to a ground portion (not shown) of a circuit board (eg, 410 of FIG. 4).
  • 700 of FIG. 4 may include a second portion 622b branched toward the recess 630 to be connected to a ground portion (not shown) of a circuit board (eg, 410 of FIG. 4).
  • the first portion 622a of the connecting terminal 622 grounded to the circuit board (eg, 410 of FIG. 4)
  • the second portion 622b of the connecting terminal 622 branches toward the recess 630. Therefore, when the conductive frame (eg, 700 of FIG.
  • the conductive frame (eg, 700 of FIG. 4) contacts the second portion 622b, the conductive frame (eg, 700 of FIG. 4) may be grounded to the circuit board (eg, 410 of FIG. 4). According to various embodiments of the present disclosure, since the conductive frame (eg, 700 of FIG. 4) is grounded to a circuit board (eg, 410), the internal space formed by the stacked PCB structure may be shielded. (Eg, 400 of FIG. 4) may improve noise shielding performance.
  • the plurality of conductive terminals 621 and 622 may be implemented by a combination of various numbers of conductive lines different from the embodiment illustrated in FIGS. 6 and 7.
  • the terminal unit 620 may have a structure exposed through at least two surfaces of the housing 610.
  • the terminal portion 620 may be exposed (see FIG. 6) through three sides of the housing 610, and in another embodiment exposed through two sides in a state accommodated in the housing 610. (See FIG. 8).
  • the plurality of conductive terminals included in the terminal portion 620 may include the first surface 601 and the first surface 601 of the connector 600. May be exposed through two sides 602.
  • the plurality of conductive terminals included in the terminal portion 620 may include the first surface 601 and the second surface of the connector 600. In addition to the face 602, it can also be exposed through the side of the connector (eg, 603d).
  • the conductive terminals exposed through the first side 601 and the second side 602 of the connector 600 are in contact with the circuit board (eg, 410 of FIG.
  • the side (eg, 603d) The conductive terminals exposed through the substrate may be exposed to the outside (eg, the electronic component (eg, 500 of FIG. 4)) instead of the substrate.
  • the wiring line of the electronic device eg, 400 of FIG. 4 is directly connected by directly connecting the conductive terminals exposed through the side (eg, 603d) and the electronic component (eg, 500 of FIG. 4). Can be reduced.
  • the electronic component eg, 500 of FIG. 4 may be disposed adjacent to the connector 600, thereby increasing the space utilization of the stacked PCB.
  • an electronic device may include a specification required for the electronic device (eg, 400 of FIG. 4) or an electronic component provided on a stacked PCB (eg, FIG. 4).
  • the terminal unit 620 of various embodiments described above may be selected or used in combination.
  • the connector 600 may be formed with an assembly formed integrally with the housing 610.
  • the assembly is shown in a recess structure in the embodiment shown in FIGS. 6 to 8.
  • the assembly may have not only a recess structure but also various other forms to be fixedly installed with the conductive frame (eg, 700 of FIG. 4).
  • the assembly may have a configuration protruding from the housing 610, and the conductive frame (eg, 700 of FIG. 4) may be configured to receive a configuration protruding from the housing 610. It may be.
  • the assembly 630 is formed integrally with the housing 610 and has a fitting groove shape.
  • FIGS. 9 to 11 a configuration separate from the housing 610 may be described.
  • the assembly 800 may be coupled to at least one side of the housing 610 and physically coupled to the conductive frame (eg, 700 of FIG. 4). Can be.
  • FIG. 9 is a diagram of a connector 600 including an assembly 800, in accordance with various embodiments disclosed herein.
  • 10 is a diagram of a connector 600 that includes an assembly 800, in accordance with various embodiments disclosed herein.
  • FIG. 11 is a diagram of a connector 600 including an assembly 800, according to another embodiment of FIG. 10.
  • the connector 600 includes attaching, adhering, and fastening in a state in which the assembling unit 800 is physically separated from the connector 600. Can be combined through various coupling schemes.
  • the housing 610, or body portion of the connector 600 may have a substantially hexahedral shape, and thus, the first surface 601 and the direction in which the first surface 601 faces. It may include a second face 602 facing in the opposite direction, and a side facing in a direction different from the direction in which the first face 601 or the second face 602 faces, and the side faces in the longitudinal direction of the housing 610.
  • the entire surface of the housing 610 may have a flat shape.
  • the assembly 800 may be coupled to any one surface (eg, a third side surface (eg, 603d of FIG. 6)) of six surfaces of the housing 610.
  • a recess 830 for inserting a conductive frame (eg, 700 of FIG. 4) into the assembly portion 800. ) can be prepared.
  • an area including at least a portion of the assembly 800 coupled to one side of the housing 610 may include a conductive frame (eg, 700 in FIG. 4) and a circuit board (eg, in FIG. 4). 410 may serve to ground.
  • a ground terminal may be provided in an area including at least a portion of the assembly 800.
  • the ground terminal may be formed to include at least a portion of the assembly portion 800 in a direction parallel to the longitudinal direction (eg, the x-axis direction) of the housing 610 of the edge region of the housing 610.
  • the entire assembly portion 800 may be formed as a ground terminal.
  • a conductive material may be included as a material of the assembling unit 800 and may be insulated from the housing 610.
  • the conductive frame eg, 700 of FIG. 4
  • the terminal unit 620 may not include a separate connection terminal (eg, 622 of FIG. 6) for grounding the circuit board 410.
  • the connector 600 including the assembling unit 800 includes the assembling unit 800 separately provided in a state in which the recess 630 is provided in the housing 610. It may be to bind to. Even in this embodiment, the method of coupling the assembly 800 to the housing 610 may use various coupling methods including attachment, adhesion, and fastening.
  • the housing 610 in the embodiment of FIG. 10 may also have a substantially hexahedral shape, such that the first face 601 and a second face facing in a direction opposite to the direction in which the first face 601 faces. 602 and a side facing in a direction different from the direction in which the first face 601 or the second face 602 faces, the side being the first side 603a perpendicular to the longitudinal direction of the housing 610. ) And a second side surface 603b, and a third side surface (eg, 603c of FIG. 6) and a fourth side surface 603d parallel to the longitudinal direction of the housing 610.
  • At least one assembly portion 801, 802 may be coupled to 603b of 6.
  • the recess 630 is formed to fit the conductive frame (for example, 700 of FIG. 4) in the housing 610, and the recess 630 is also attached to the assembly 800 coupled to the housing 610.
  • a concave structure of a corresponding shape can be formed. According to the embodiment of FIG.
  • the assembling unit 800 is in a direction perpendicular to the longitudinal direction of the housing 610 (eg, the x-axis direction of FIG. 10) among the edge regions of the housing 610.
  • Including a recess structure corresponding to the recess 630 may have a structure substantially the same as the cross-sectional structure cut in a direction perpendicular to the longitudinal direction of the housing.
  • At least a portion of an assembly 801 or 802 coupled to the first side (eg 603a of FIG. 6) or the second side (eg 603b of FIG. 6) of the housing 610 is included.
  • the region may serve to ground the conductive frame (eg, 700 of FIG. 4) to the circuit board (eg, 410 of FIG. 4).
  • the region including may serve to ground the conductive frame (eg, 700 of FIG. 4) to the circuit board (eg, 410 of FIG. 4).
  • a ground terminal may be provided in an area including at least a portion of the assembly 800. Can be formed.
  • the ground terminal may be formed to include at least a portion of the assembly portion 800 in a direction parallel to the longitudinal direction (eg, the x-axis direction) of the housing 610 of the edge region of the housing 610.
  • the whole may be formed of a ground terminal.
  • the entirety of the two assemblies 801, 802 coupled to the first side (eg 603a of FIG. 6) and the second side (eg 603b of FIG. 6) of the housing 610 may be ground terminals. It may be formed as.
  • the entire assembly part 800 may be formed of a ground terminal, which may include a conductive material as a material of the assembly part 800.
  • the connector 600 including the assembling unit 800 also includes an assembling unit 800 separately provided in a state in which the recess 630 is provided in the housing 610 as in FIG. 10. It may be coupled to the housing 610.
  • the method of coupling the assembly 800 to the housing 610 may use various coupling methods including attachment, adhesion, and fastening.
  • Assembly parts 801 and 802 may be combined.
  • the one side and the other side is in close contact with the housing 610 It may further include.
  • the housing 610 may be provided with three assembly parts 801, 802, and 803.
  • the ground terminal may be formed on at least one of the three assembling parts 801, 802, and 803.
  • a ground terminal may be formed only in one assembly 801 or 802 or 803, and a combination of two or more of the three assembly parts 801, 802, and 803 801 and 802, or 801 and 803, or 802. And 803, or 801, 802, and 803.
  • at least any one of the three assembling units 801, 802, and 803 may be formed as a ground terminal. Accordingly, when the conductive frame (eg, 700 of FIG. 4) is inserted into the assembly portion 800, the conductive frame (eg, 700 of FIG.
  • any one of the various embodiments of the connector 600 shown in FIGS. 6 to 11 may be selected and used, or two or more embodiments may be combined.
  • FIG. 12 is a diagram illustrating a connector 600 and a conductive frame 700, in accordance with various embodiments disclosed herein.
  • the conductive frame 700 is physically coupled to an assembly portion (eg, 630 of FIGS. 6 to 8 and 800 of FIGS. 9 to 11) of the connector 600, and has various shapes. Can be formed.
  • the conductive frame 700 may have various shapes without being limited to any particular shape and dimension, provided that only the shielding performance of the electronic device (eg, 400 of FIG. 4) disclosed herein is secured.
  • a band-shaped conductive frame 700 is illustrated in FIGS. 4 and 5, but is not necessarily limited thereto.
  • a zigzag structure (not shown) may be bent at a predetermined angle along a length direction. May have
  • the length L of the conductive frame 700 may be greater than the length a of the connector 600.
  • the conductive frame 700 may extend long without a slit in one frame, and thus may have a closed loop structure.
  • the length of each conductive metal piece may be formed larger or smaller than the length a of the connector 600. It may be.
  • the length L1 of any one of the conductive metal pieces 700a, 700b, 700c is greater than the length a of the connector 600.
  • the length L2 of the other metal piece 700c may be smaller than the length a of the connector 600.
  • the slits are covered by engagement with the connectors 600 and 700 to substantially seal the slits.
  • the structure can be formed.
  • the height of the conductive frame 700 may have a constant height.
  • the height of the conductive frame 700 may have a step along the length direction.
  • a protruding structure 702 having a predetermined height c may be formed on the lower surface 701 of the conductive frame 700.
  • the conductive frame 700 may have a shape corresponding to a portion where the recess 630 is formed in the connector 600.
  • a long conductive frame 700 is disposed between the substrate and the substrate to achieve a stable fixing structure, such that a certain structure (a certain connector or part of the conductive frame of the plurality of connectors 600) is provided. Concentration of stress can be prevented.
  • the conductive frame 700 since the conductive frame 700 may serve to structurally connect the substrate to the substrate, it may also have an advantage of ensuring the number of connectors 600 as many as the required signal lines.
  • FIG. 13 is a diagram illustrating a connector 900 and a circuit board mounted conductive frame 1000 according to various embodiments disclosed herein.
  • a circuit board 410 including an upper surface facing the first direction (eg, 401 of FIG. 4) and a lower surface facing the second direction (eg, 402 of FIG. 4) facing the first direction. ; At least one electronic component (eg, 500 of FIG. 4) mounted on an upper surface of the circuit board 410; At least one connector 900 mounted on an upper surface of the circuit board 410 and electrically connected to at least one of the circuit board 410 and the electronic component; And a conductive frame 1000 mounted on an upper surface of the circuit board 410 and having a shielding surface facing a first direction or a third direction different from the second direction and shielding the electronic component. According to an embodiment, the conductive frame 1000 referred to in FIG.
  • the conductive frame 1000 may be disposed spaced apart from the at least one connector 900 at the outside of the connector 900.
  • the recess (eg, 630 of FIG. 6) is formed in the housing (eg, 610 of FIG. 6), or the assembly portion (eg, 800 of FIG. 9) is formed.
  • a connector 900 that does not include is disclosed, and a conductive frame 1000 that is not physically connected to the connector 900 may be provided separately. Accordingly, the conductive frame 1000 can exhibit excellent shielding performance without using a form in which the conductive frame 1000 is separately coupled to the connector 900.
  • FIG. 14 is a graph illustrating shielding efficiency of an electronic device (eg, 400 of FIG. 4) according to various embodiments of the present disclosure. Referring to FIG. 14, various embodiments of shielding effectiveness of an electronic device having a stacked PCB structure according to a frequency change are illustrated.
  • FIG. 14 shows graphs (L1, L2, L3) measuring shielding efficiency according to frequency change under three different conditions, wherein the L1 graph uses the connector disclosed in this document (eg, 600 of FIG. 4). It shows shielding efficiency of the general laminated PCB structure, which is not shown, and the L2 graph is different from the embodiment shown in FIGS. 1 to 13 of this document, and a connector shielded by plating on an outer surface (hereinafter referred to as 'a connector using a shielding film'). ) Shows the shielding efficiency of the laminated PCB structure. And the L3 graph shows the shielding efficiency of the stacked PCB structure using a connector (eg, 600 of FIG. 4) according to various embodiments disclosed in the present document. In the graph, when the value corresponds to the same frequency band, a lower value of the vertical axis may indicate higher shielding efficiency.
  • a connector eg, 600 of FIG. 4
  • a stacked PCB structure using a connector (eg, 600 of FIG. 4) in accordance with various embodiments disclosed herein in the entire frequency range is a connector according to various embodiments disclosed herein.
  • the shielding efficiency is much higher than that of the general multilayer PCB structure without using the PSA.
  • the shielding efficiency graph L3 of the electronic device (eg, 400 of FIG. 4) using the connector (eg, 600 of FIG. 4) may include an electronic device including a connector using a shielding film. It can be seen that it has a higher efficiency than the shielding efficiency graph L2 of the device.
  • the shielding efficiency (graph L3) of the electronic device using the connector disclosed in this document (eg, 600 of FIG. 4) and the shielding efficiency of the electronic device including the connector using the shielding film (graph L2) are compared.
  • the shielding efficiency may be improved by about 27 dB in the frequency about 5 GHz region, and the shielding efficiency may be improved by about 19 dB in the frequency about 10 GHz region.
  • the shielding efficiency may be improved by about 9 dB in the high band frequency band of about 20 GHz.
  • shielding efficiency in various millimeter wave frequency bands other than the frequency band described above may be improved.
  • the electronic device 1501 communicates with the electronic device 1502 through a first network 1598 (eg, a short-range wireless communication network) or the second network 1599.
  • the electronic device 1504 or the server 1508 may be communicated through a remote wireless communication network.
  • the electronic device 1501 may communicate with the electronic device 1504 through the server 1508.
  • the electronic device 1501 may include a processor 1520, a memory 1530, an input device 1550, an audio output device 1555, a display device 1560, an audio module 1570, and a sensor module.
  • the components may be included.
  • at least one of the components may be omitted or one or more other components may be added to the electronic device 1501.
  • some of these components may be implemented in one integrated circuit.
  • the sensor module 1576 eg, fingerprint sensor, iris sensor, or illuminance sensor
  • the display device 1560 eg, display
  • the processor 1520 may, for example, execute software (eg, a program 1540) to provide at least one other component (eg, hardware or software component) of the electronic device 1501 connected to the processor 1520. It can control and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operation, the processor 1520 may transmit instructions or data received from another component (eg, the sensor module 1576 or the communication module 1590) to the volatile memory 1532. Can be loaded into, processed in a command or data stored in the volatile memory 1532, and stored in the non-volatile memory 1534.
  • software eg, a program 1540
  • the processor 1520 may transmit instructions or data received from another component (eg, the sensor module 1576 or the communication module 1590) to the volatile memory 1532. Can be loaded into, processed in a command or data stored in the volatile memory 1532, and stored in the non-volatile memory 1534.
  • the processor 1520 may include a main processor 1521 (eg, a central processing unit or an application processor), and a coprocessor 1523 (eg, a graphics processing unit, an image signal processor) that may operate independently or together. , Sensor hub processor, or communication processor). Additionally or alternatively, the coprocessor 1523 may be configured to use lower power than the main processor 1521 or to be specialized for its designated function. The coprocessor 1523 may be implemented separately from or as part of the main processor 1521.
  • a main processor 1521 eg, a central processing unit or an application processor
  • a coprocessor 1523 eg, a graphics processing unit, an image signal processor
  • the coprocessor 1523 may be configured to use lower power than the main processor 1521 or to be specialized for its designated function.
  • the coprocessor 1523 may be implemented separately from or as part of the main processor 1521.
  • the coprocessor 1523 may, for example, replace the main processor 1521 while the main processor 1521 is in an inactive (eg, sleep) state, or the main processor 1521 may be active (eg, execute an application). Together with the main processor 1521, at least one of the components of the electronic device 1501 (eg, the display device 1560, the sensor module 1576, or the communication module 1590). Control at least some of the functions or states associated with the. According to one embodiment, the coprocessor 1523 (eg, an image signal processor or communication processor) may be implemented as part of another functionally related component (eg, camera module 1580 or communication module 1590). have.
  • the memory 1530 may store various data used by at least one component (for example, the processor 1520 or the sensor module 1576) of the electronic device 1501.
  • the data may include, for example, software (eg, program 1540) and input data or output data for instructions associated with it.
  • the memory 1530 may include a volatile memory 1532 or a nonvolatile memory 1534.
  • the program 1540 may be stored as software in the memory 1530 and may include, for example, an operating system 1542, middleware 1544, or an application 1546.
  • the input device 1550 may receive a command or data to be used for a component (eg, the processor 1520) of the electronic device 1501 from the outside (eg, a user) of the electronic device 1501.
  • the input device 1550 may include, for example, a microphone, a mouse, or a keyboard.
  • the sound output device 1555 may output a sound signal to the outside of the electronic device 1501.
  • the sound output device 1555 may include, for example, a speaker or a receiver.
  • the speaker may be used for general purposes such as multimedia playback or recording playback, and the receiver may be used to receive an incoming call.
  • the receiver may be implemented separately from or as part of a speaker.
  • the display device 1560 may visually provide information to the outside (eg, a user) of the electronic device 1501.
  • the display device 1560 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display device 1560 may include a touch circuitry configured to sense a touch, or a sensor circuit (eg, a pressure sensor) configured to measure the strength of a force generated by the touch. have.
  • the audio module 1570 may convert sound into an electrical signal or vice versa. According to an embodiment of the present disclosure, the audio module 1570 acquires sound through the input device 1550, or an external electronic device (eg, connected to the sound output device 1555 or the electronic device 1501 directly or wirelessly). Sound may be output through the electronic device 1502 (eg, a speaker or a headphone).
  • an external electronic device eg, connected to the sound output device 1555 or the electronic device 1501 directly or wirelessly. Sound may be output through the electronic device 1502 (eg, a speaker or a headphone).
  • the sensor module 1576 detects an operating state (eg, power or temperature) or an external environmental state (eg, a user state) of the electronic device 1501 and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 1576 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 1577 may support one or more designated protocols that may be used for the electronic device 1501 to be directly or wirelessly connected to an external electronic device (eg, the electronic device 1502).
  • the interface 1577 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal 1578 may include a connector through which the electronic device 1501 may be physically connected to an external electronic device (eg, the electronic device 1502).
  • the connection terminal 1578 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 1579 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinetic senses.
  • the haptic module 1579 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 1580 may capture still images and videos. According to an embodiment, the camera module 1580 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 1588 may manage power supplied to the electronic device 1501. According to an embodiment of the present disclosure, the power management module 1588 may be implemented as at least part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 1589 may supply power to at least one component of the electronic device 1501.
  • the battery 1589 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 1590 may be a direct (eg wired) communication channel or wireless communication channel between the electronic device 1501 and an external electronic device (eg, the electronic device 1502, the electronic device 1504, or the server 1508). Establish and perform communication over established communication channels.
  • the communication module 1590 may operate independently of the processor 1520 (eg, an application processor) and include one or more communication processors that support direct (eg, wired) or wireless communication.
  • the communication module 1590 may be a wireless communication module 1592 (eg, a cellular communication module, a near field communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1594 (eg, It may include a local area network (LAN) communication module, or a power line communication module.
  • LAN local area network
  • the corresponding communication module of these communication modules may be a first network 1598 (e.g. a short range communication network such as Bluetooth, WiFi direct or an infrared data association (IrDA)) or a second network 1599 (e.g. a cellular network, the Internet, or Communicate with external electronic devices via a telecommunications network, such as a computer network (eg, LAN or WAN).
  • a first network 1598 e.g. a short range communication network such as Bluetooth, WiFi direct or an infrared data association (IrDA)
  • a second network 1599 e.g. a cellular network, the Internet, or Communicate with external electronic devices via a telecommunications network, such as a computer network (eg, LAN or WAN).
  • a telecommunications network such as a computer network (eg, LAN or WAN).
  • These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented by a plurality of components (
  • the wireless communication module 1592 uses subscriber information (e.g., international mobile subscriber identifier (IMSI)) stored in the subscriber identification module 1596 within a communication network such as the first network 1598 or the second network 1599.
  • subscriber information e.g., international mobile subscriber identifier (IMSI)
  • IMSI international mobile subscriber identifier
  • the antenna module 1597 may transmit or receive a signal or power to an external (eg, an external electronic device) or from an external source.
  • the antenna module 1597 may include one or more antennas, from which at least one antenna suitable for a communication scheme used in a communication network, such as a first network 1598 or a second network 1599, For example, it may be selected by the communication module 1590.
  • the signal or power may be transmitted or received between the communication module 1590 and the external electronic device through the selected at least one antenna.
  • peripheral devices eg, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 1501 and the external electronic device 1504 through the server 1508 connected to the second network 1599.
  • Each of the electronic devices 1502 and 1504 may be a device that is the same as or different from the electronic device 1501.
  • all or part of operations executed in the electronic device 1501 may be executed in one or more external devices among the external electronic devices 1502, 1504, or 1508.
  • the electronic device 1501 may not execute the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • the one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1501.
  • the electronic device 1501 may process the result as it is or additionally and provide the result as at least part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology may be used.
  • Electronic devices may be various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smartphone
  • a computer device e.g., a tablet, or a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch, or a smart watch
  • first, second, or first or second may be used merely to distinguish a component from other corresponding components, and to separate the components from other aspects (e.g. Order).
  • Some (eg, first) component may be referred to as “coupled” or “connected” to another (eg, second) component, with or without the term “functionally” or “communicatively”.
  • any component can be connected directly to the other component (eg, by wire), wirelessly, or via a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit.
  • the module may be an integral part or a minimum unit or part of the component, which performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present disclosure may include one or more instructions stored in a storage medium (eg, internal memory 1536 or external memory 1538) that can be read by a machine (eg, electronic device 1501). It may be implemented as software (eg, program 1540) including the.
  • a processor eg, the processor 1520 of the device (eg, the electronic device 1501) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the device to be operated to perform at least one function in accordance with the at least one command invoked.
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' means only that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), which is the case when data is stored semi-permanently on the storage medium. It does not distinguish cases where it is temporarily stored.
  • a signal e.g., electromagnetic waves
  • a method according to various embodiments of the present disclosure may be included in a computer program product.
  • the computer program product may be traded between the seller and the buyer as a product.
  • the computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play StoreTM) or two user devices ( Example: smartphones) can be distributed (eg downloaded or uploaded) directly or online.
  • a device-readable storage medium such as a server of a manufacturer, a server of an application store, or a relay server, or may be temporarily created.
  • each component eg, a module or a program of the above-described components may include a singular or plural object.
  • one or more components or operations of the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of the component of each of the plurality of components the same as or similar to that performed by the corresponding component of the plurality of components before the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, or may be omitted. Or one or more other operations may be added.
  • a circuit board (eg, 410 of FIG. 4) in which at least one electronic component (eg, 500 of FIG. 4) is mounted. ;
  • a conductive frame (eg, 700 in FIG. 4) disposed over the circuit board to surround the at least one electronic component;
  • at least one connector (eg, 600 in FIG. 4) mounted to the circuit board, wherein the at least one connector includes the second surface (eg, 602 in FIG. 6) mounted on the circuit board.
  • a first side facing the second side (eg, 601 of FIG.
  • the sub-circuit board (eg, FIG. 5) of the at least one connector facing the first side of the at least one connector facing the circuit board (eg, 410 of FIG. 5).
  • the electronic device may further include a 420, and the sub circuit board may provide an electronic device electrically connected to at least some of the plurality of conductive terminals.
  • the connector may be surface mounted on the substrate.
  • the housing (eg, 601 of FIG. 6) is formed to have a substantially hexahedral shape, and the side surface is a first side surface perpendicular to the longitudinal direction of the housing (eg, 603a of FIG. 6). And a second side (eg, 603b of FIG. 6), and include a third side (eg, 603c of FIG. 6) and a fourth side (eg, 603d of FIG. 6) parallel to the longitudinal direction of the housing. Can be.
  • the recess may extend along the longitudinal direction of the housing.
  • the recess may be penetrated from the first side of the housing to the second side.
  • At least one of the plurality of conductive terminals may include a first portion (eg, 622a of FIG. 7) connected to a ground portion of the circuit board, and the conductive frame may be connected to a ground portion of the circuit board. It may include a second portion (eg, 621a of FIG. 7) branched toward the recess to be connected to form the connection terminal.
  • the conductive frame may have a stepped shape corresponding to the shape of the recess.
  • an upper surface facing a first direction (eg, 401 of FIG. 4) and a lower surface facing a second direction opposite to the first direction (eg, 402 of FIG. 4) may be included.
  • a circuit board eg, 410 of FIG. 4; At least one electronic component (eg, 500 of FIG. 4) mounted on an upper surface of the circuit board; At least one connector (eg, 600 in FIG. 6) mounted on an upper surface of the circuit board and electrically connected to at least one of the circuit board or the electronic component; And a shielding surface connected to the ground portion of the circuit board and facing a first direction or a third direction different from the second direction to surround at least a portion of the electronic component, thereby shielding the electronic component.
  • An electronic device including a frame (eg, 700 of FIG. 4) may be provided.
  • the assembly unit may be integrally formed with the connector (eg, 600 of FIG. 4), and the conductive frame (eg, 700 of FIG. 4) may be mounted on the connector through the assembly unit. Can be fixedly installed.
  • the connector may include a housing (eg, 610 of FIG. 4) and a plurality of conductive terminals (eg, 621 and 622 of FIG. 6) accommodated in the housing.
  • the housing (eg, 610 of FIG. 6) has a substantially hexahedral shape, and when mounted on the circuit board, a second surface facing the top surface of the circuit board. (Eg, 602 of FIG. 6), a first surface (eg, 601 of FIG. 6) facing in a direction opposite to the direction in which the second surface faces, and a direction perpendicular to the direction in which the first and second surfaces face. 6, a side facing the first side (eg, 603a of FIG. 6) and a second side (eg, 603b of FIG. 6) perpendicular to the longitudinal direction of the housing. And a third side surface (eg, 603c of FIG. 6) and a fourth side surface (eg, 603d of FIG. 6) parallel to the longitudinal direction of the housing.
  • a separate component from the housing may further include an assembly (eg, 800 of FIG. 9) fastened to at least one side of the housing and physically coupled to the conductive frame.
  • the assembly portion (eg, 800 of FIG. 9) may include a recess (eg, 830 of FIG. 9) formed along a direction parallel to the longitudinal direction of the housing to which the conductive frame is coupled.
  • the ground terminal may be formed on at least a portion of the assembly unit to be electrically connected to the conductive frame.
  • the housing (eg, 610 of FIG. 10) includes a recess (eg, 630 of FIG. 10) formed along a direction parallel to the longitudinal direction of the housing to which the conductive frame is coupled.
  • the cross section of the assembly unit (eg, 800 of FIG. 10) may include a recess structure corresponding to the recess (eg, 630 of FIG. 10) and may be cut in a direction perpendicular to the longitudinal direction of the housing. It may have the same structure.
  • the entire assembly may be conductive.
  • the ground terminal may be formed in an edge region of the housing or an inner region of the housing.
  • an upper surface facing a first direction eg, 401 of FIG. 4 and a lower surface facing a second direction opposite to the first direction (eg, 402 of FIG. 4) may be included.
  • a circuit board eg, 410 of FIG. 13
  • At least one electronic component eg, 500 of FIG. 4
  • At least one connector eg, 900 in FIG.
  • a conductive frame (eg, 1000 of FIG. 13) for shielding the electronic component may be provided.
  • the conductive frame may be spaced apart from the connector at an outer side of the connector.
  • the conductive frame may have a closed loop structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Dans divers modes de réalisation, la présente invention concerne un connecteur d'interposeur permettant de protéger efficacement un composant électronique monté sur un substrat contre le bruit provenant de l'intérieur et de l'extérieur d'un dispositif électronique, et le dispositif électronique le comprenant. Selon divers modes de réalisation de la présente invention, le dispositif électronique comprend : une carte de circuit imprimé sur laquelle au moins un composant électronique est monté ; un cadre conducteur disposé sur la carte de circuit imprimé pour entourer le ou les composants électroniques ; et au moins un connecteur monté sur la carte de circuit imprimé, le ou les connecteurs comprenant : une seconde surface montée sur la carte de circuit imprimé ; une première surface faisant face à la seconde surface ; et une pluralité de surfaces latérales entourant la seconde surface et la première surface, et un évidement étant formé dans la première surface le long d'une surface latérale parmi la pluralité de surfaces latérales, l'évidement comprenant : un boîtier couplé physiquement au cadre conducteur ; et une pluralité de bornes conductrices formées sur la surface latérale, au moins une borne conductrice parmi la pluralité de bornes conductrices étant connectée électriquement au cadre conducteur par l'intermédiaire d'une borne de connexion formée dans l'évidement, et étant connectée électriquement à une partie masse de la carte de circuit imprimé.
PCT/KR2019/006871 2018-06-08 2019-06-07 Connecteur connectant un cadre conducteur et une carte de circuit imprimé et dispositif électronique le comprenant WO2019235877A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180066386A KR102510921B1 (ko) 2018-06-08 2018-06-08 도전성 프레임과 회로 기판을 연결하는 커넥터 및 그를 포함하는 전자 장치
KR10-2018-0066386 2018-06-08

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WO2023040569A1 (fr) * 2021-09-18 2023-03-23 荣耀终端有限公司 Ensemble carte de circuit imprimé et dispositif électronique

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KR20210031303A (ko) 2019-09-11 2021-03-19 삼성전자주식회사 회로 기판에 실장되는 커넥터를 포함하는 전자 장치
WO2021172739A1 (fr) * 2020-02-26 2021-09-02 삼성전자 주식회사 Dispositif électronique comprenant une interposeur
KR20220046204A (ko) * 2020-10-07 2022-04-14 삼성전자주식회사 차폐 커넥터 구조를 포함하는 전자 장치
EP4195630A4 (fr) 2020-12-16 2024-04-10 Samsung Electronics Co., Ltd. Dispositif électronique
KR20220093509A (ko) 2020-12-28 2022-07-05 삼성전기주식회사 연결기판 및 이를 포함하는 인터포저기판

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US20100033940A1 (en) * 2005-03-01 2010-02-11 Matsushita Electric Industrial Co., Ltd. Inter-board coupling connector and circuit board device using inter-board coupling connector
KR20110045153A (ko) * 2009-10-26 2011-05-04 삼성전자주식회사 쉴드 캔용 고정 장치
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