WO2019235877A1

WO2019235877A1 - Connector connecting conductive frame and circuit board and electronic device comprising same

Info

Publication number: WO2019235877A1
Application number: PCT/KR2019/006871
Authority: WO
Inventors: 정완의; 장세영; 한재룡; 김도훈; 김영준
Original assignee: 삼성전자 주식회사
Priority date: 2018-06-08
Filing date: 2019-06-07
Publication date: 2019-12-12
Also published as: KR102510921B1; KR20190139653A

Abstract

In various embodiments of the present disclosure, disclosed are an interposer connector for effectively shielding an electronic component mounted on a substrate from noise provided from the inside and the outside of an electronic device, and the electronic device comprising same. According to various embodiments of the present disclosure, the electronic device comprises: a circuit board on which at least one electronic component is mounted; a conductive frame disposed over the circuit board to surround the at least one electronic component; and at least one connector mounted on the circuit board, wherein the at least one connector includes: a second surface mounted on the circuit board; a first surface facing the second surface; and a plurality of side surfaces surrounding the second surface and the first surface, and a recess is formed in the first surface along one side surface of the plurality of side surfaces, wherein the recess comprises: a housing physically coupled to the conductive frame; and a plurality of conductive terminals formed on the one side surface, wherein at least one conductive terminal of the plurality of conductive terminals is electrically connected to the conductive frame through a connection terminal formed in the recess, and electrically connected to a ground part of the circuit board.

Description

Connector connecting the conductive frame and the circuit board and an electronic device comprising the same

In various embodiments of the present disclosure, a connector for effectively shielding an electronic component mounted on a substrate from noise provided inside or outside the electronic device and an electronic device including the same are disclosed.

Recently, mobile phones, MP3 players, portable multimedia players (PMPs), tablet PCs, Galaxy Tabs, smartphones, iPads, and e-book terminals and various electronic devices have been provided to users. You can interact with the content. Such electronic devices are supported by various types of wireless mobile communication services using various frequency bands along with design trends such as convenience for consumers, high-class design, and thinness. The inside of the portable electronic device may include a board on which various electronic components are mounted, and a connector provided for compatibility of data, such as a communication port.

On the other hand, a mobile terminal must accommodate electronic components for implementing various functions in a limited space, and a stacked substrate structure in which two or more substrates are stacked to effectively utilize insufficient mounting space (hereinafter referred to as a 'layered PCB structure'). Is widely used. In addition, the connector is widely used as a medium connecting the board to the board.

Conventional connectors are divided into surface mounted device (SMD) type and through hole device (THD) type. The surface mount type forms a solder joint while a plurality of pins provided in the connector undergo a reflow process on a printed circuit board (hereinafter referred to as a 'circuit board'). A plurality of pins provided in the penetrate the printed circuit board. The surface-mount type is advantageous in mass production compared to the insert-mount type, which has advantages in terms of manufacturing cost and time. Accordingly, various components (for example, connectors) mounted on the printed circuit board mainly consist of a surface mount type.

Meanwhile, as another connector, an interposer connector may be utilized. An interposer connector is a type of connector packaged with an insulating material (for example, silicon (Si), glass, or ceramic) for the electrical connection between the board and the board. Example: plating layer) may be to improve the shielding performance. The interposer may provide electrical connection and / or mechanical flexibility between the semiconductor chip and the circuit board.

However, the conventional connector is exposed to the outside as it is surface-mounted on the circuit board and thus does not implement shielding at all, and thus data communication components generated when there is data communication act as noise in antenna performance. There was a disadvantage in reducing the radiation performance of the antenna. For example, the conventional connector is formed by cutting or bending after cutting the SUS plate in order to assemble the printed circuit board when forming the press plate by the press method, such a joint A joint caused a hole or a slit in the connector device. Through this hole or slot, data communication components are emitted and noise is generated, which degrades the antenna's radiation performance.

On the other hand, in the antenna structure used for next generation communication (e.g., millimeter wave communication) system, for example, the next generation (5th generation) communication system or pre (pre) next generation communication system, the type of electronic components around the wiring, And / or may be affected by electronic component placement. In particular, in the conventional connector structure, an empty space is inevitably generated between the substrate and the substrate (hereinafter, referred to as a "layered PCB structure") in the manufacturing method, and noise can be emitted through this space. Next-generation communication systems use relatively high frequencies, which is likely to degrade antenna performance, such as degradation of peripheral components.

Although the interposer connector is known to have higher shielding performance than the general connector, even if the interposer connector is used under the next-generation communication system, the interposer connector is insufficient to prevent performance degradation due to noise.

Various embodiments of the present invention to provide a connector to effectively shield the noise due to the conventional connector structure.

Various embodiments of the present invention to provide a connector and an electronic device using the same that can effectively shield the noise in the next generation communication (eg, millimeter wave communication) system.

According to various embodiments of the present disclosure, an electronic device may include: a circuit board on which at least one electronic component is mounted; A conductive frame disposed over the circuit board to surround the at least one electronic component; And at least one connector mounted on the circuit board, wherein the at least one connector includes a second surface mounted on the circuit board, a first surface facing the second surface, the second surface, and the first surface; A housing including a plurality of sides surrounding a first surface, the recess including a recess formed along one side of the plurality of sides on the first surface, the recess physically coupled to the conductive frame; And a plurality of conductive terminals formed on the one side surface, wherein at least one conductive terminal of the plurality of conductive terminals is electrically connected to the conductive frame through a connection terminal formed in the recess, and the circuit board It is possible to provide an electronic device that is electrically connected to the ground of the electronic device.

According to various embodiments of the present disclosure, a circuit board includes a top surface facing a first direction and a bottom surface facing a second direction opposite to the first direction; At least one electronic component mounted on an upper surface of the circuit board; At least one connector mounted on an upper surface of the circuit board and electrically connected to at least one of the circuit board and the electronic component; And a shielding surface connected to the ground portion of the circuit board and facing the first direction or a third direction different from the second direction to surround at least a portion of the electronic component, thereby shielding the electronic component. It may provide an electronic device including a frame.

According to various embodiments of the present disclosure, a circuit board includes a top surface facing a first direction and a bottom surface facing a second direction opposite to the first direction; At least one electronic component mounted on an upper surface of the circuit board; At least one connector mounted on an upper surface of the circuit board and electrically connected to at least one of the circuit board and the electronic component; And a shielding surface mounted on an upper surface of the circuit board and facing a third direction different from the first direction or the second direction, and disposed to surround at least a portion of the electronic component and at least a portion of the connector. A conductive frame may be provided to shield the electronic component.

According to various embodiments disclosed in the present disclosure, the space between the substrate and the substrate (hereinafter referred to as the 'laminated PCB') and effectively shielding the substrate and the grounded conductive frame is improved compared to the stacked PCB structure according to the prior art. It may have a noise shielding effect.

According to various embodiments disclosed in the present disclosure, it is possible to provide a structure that is advantageous for securing durability of the packaging of the stacked PCB structure.

According to various embodiments, a long conductive frame is disposed between the substrate and the substrate to achieve a stable fixation structure so that stress is concentrated on a particular structure (any connector of a plurality of connectors or part of the conductive frame). You can also prevent it.

According to various embodiments of the present disclosure, in a multilayer PCB structure, since the conductive frame may serve to structurally connect the substrate to the substrate, only the required number of connectors may be used, thereby reducing the manufacturing cost of the product. It may have the effect of saving.

1 is a perspective view of a front side of a mobile electronic device according to one embodiment.

FIG. 2 is a perspective view of a rear surface of the electronic device of FIG. 1.

3 is an exploded perspective view of the electronic device of FIG. 1.

4 is a perspective view of an electronic device including a connector according to various embodiments of the present disclosure.

5 is a perspective view of an electronic device including a connector according to another embodiment of FIG. 4.

FIG. 6 is a diagram of an interposer connector with a recess in accordance with various embodiments disclosed herein.

7 is a diagram illustrating a cross section of a connection terminal line grounded to a substrate among a plurality of conductive terminals.

FIG. 8 is a diagram of an interposer connector with a recess according to another embodiment of FIG. 6.

9 is a diagram of a connector including an assembly, in accordance with various embodiments disclosed herein.

10 is a diagram of a connector including an assembly, in accordance with various embodiments disclosed herein.

FIG. 11 is a view of a connector including an assembly, according to another embodiment from FIG. 10.

12 illustrates a connector and a conductive frame, in accordance with various embodiments disclosed herein.

FIG. 13 illustrates a connector and a circuit board mounted conductive frame, according to various embodiments disclosed herein.

14 is a diagram illustrating shielding efficiency of an electronic device according to various embodiments of the present disclosure.

15 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

Hereinafter, various embodiments of the present disclosure may be described with reference to the accompanying drawings.

1 and 2, an electronic device 100 according to an embodiment may include a first surface (or front surface) 110A, a second surface (or rear surface) 110B, a first surface 110A, and It may include a housing 110 including a side (110C) surrounding the space between the second surface (110B). In another embodiment (not shown), the housing may refer to a structure that forms some of the first surface 110A, second surface 110B, and side surfaces 110C of FIG. 1. According to one embodiment, the first face 110A may be formed by a front plate 102 (eg, a glass plate comprising various coating layers, or a polymer plate) that is at least partially substantially transparent. The second surface 110B may be formed by the substantially opaque back plate 111. The back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be. The side 110C may be formed by a side bezel structure (or “side member”) 118 that engages the front plate 102 and the back plate 111 and includes metal and / or polymer. In some embodiments, back plate 111 and side bezel structure 118 may be integrally formed and include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 102 includes two first regions 110D extending seamlessly from the first surface 110A toward the rear plate 111 and extending seamlessly. It may be included at both ends of the long edge (102). In the illustrated embodiment (see FIG. 2), the back plate 111 has a long edge between two second regions 110E extending seamlessly from the second face 110B toward the front plate 102. It can be included at both ends. In some embodiments, the front plate 102 (or the back plate 111) may include only one of the first regions 110D (or the second regions 110E). In another embodiment, some of the first regions 110D or the second regions 110E may not be included. In the above embodiments, when viewed from the side of the electronic device 100, the side bezel structure 118 may have a side surface where the first regions 110D or the second regions 110E are not included. It may have a first thickness (or width) and a second thickness that is thinner than the first thickness on the side surface including the first regions 110D or the second regions 110E.

According to an embodiment, the electronic device 100 may include a display 101, an

audio module

103, 107, 114, a

sensor module

104, 116, 119, a

camera module

105, 112, 113, and a key input. And at least one of the device 117, the light emitting element 106, and the connector holes 108, 109. In some embodiments, the electronic device 100 may omit at least one of the components (for example, the key input device 117 or the light emitting element 106) or may further include other components.

The display 101 may be exposed through, for example, a substantial portion of the front plate 102. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first surface 110A and the first regions 110D of the side surface 110C. In some embodiments, the corners of the display 101 may be formed approximately the same as the adjacent outer shape of the front plate 102. In another embodiment (not shown), the distance between the outer side of the display 101 and the outer side of the front plate 102 may be substantially the same in order to expand the area where the display 101 is exposed.

In another embodiment (not shown), an audio module 114 and a sensor are formed in a portion of the screen display area of the display 101 and are aligned with the recess or opening. At least one of the module 104, the camera module 105, and the light emitting device 106 may be included. In another embodiment (not shown), the audio module 114, the sensor module 104, the camera module 105, the fingerprint sensor 116, and the light emitting element 106 are located behind the screen display area of the display 101. It may include at least one of). In another embodiment (not shown), the display 101 is coupled or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer for detecting a magnetic field stylus pen. Can be deployed. In some embodiments, at least a portion of the

sensor module

104, 119, and / or at least a portion of the key input device 117 may be configured such that the first regions 110D, and / or the second regions 110E. Can be placed in the field.

The

audio module

103, 107, 114 may include a microphone hole 103 and a

speaker hole

107, 114. The microphone hole 103 may include a microphone for acquiring an external sound, and in some embodiments, a plurality of microphones may be disposed to detect a direction of the sound. The speaker holes 107 and 114 may include an external speaker hole 107 and a receiver receiver hole 114 for a call. In some embodiments, the speaker holes 107 and 114 and the microphone hole 103 may be implemented as one hole, or a speaker may be included without the speaker holes 107 and 114 (eg, piezo speaker).

The

sensor modules

104, 116, and 119 may generate an electrical signal or data value corresponding to an operating state inside the electronic device 100 or an external environment state. The

sensor modules

104, 116, 119 may comprise, for example, a first sensor module 104 (eg, proximity sensor) and / or a second sensor module (eg, disposed on the first surface 110A of the housing 110). Not shown) (eg, fingerprint sensor), and / or third sensor module 119 (eg, HRM sensor) and / or fourth sensor module 116 disposed on the second side 110B of the housing 110. ) (Eg, fingerprint sensor). The fingerprint sensor may be disposed on the first surface 110A (eg, the display 101 as well as the second surface 110B) of the housing 110. The electronic device 100 may be a sensor module (not shown), for example. For example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104 may be used. It may include.

The

camera modules

105, 112, and 113 are the first camera device 105 disposed on the first surface 110A of the electronic device 100, and the second camera device 112 disposed on the second surface 110B. ) And / or flash 113. The

camera devices

105, 112 may include one or a plurality of lenses, an image sensor, and / or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100.

The key input device 117 may be disposed on the side surface 110C of the housing 110. In another embodiment, the electronic device 100 may not include some or all of the above-mentioned key input device 117 and the non-included key input device 117 may include other soft keys or the like on the display 101. It may be implemented in the form. In some embodiments, the key input device may include a sensor module 116 disposed on the second surface 110B of the housing 110.

The light emitting element 106 may be disposed, for example, on the first surface 110A of the housing 110. The light emitting element 106 may provide, for example, state information of the electronic device 100 in the form of light. In another embodiment, the light emitting element 106 may provide a light source that is interlocked with, for example, the operation of the camera module 105. The light emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 108 and 109 may include a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or an external electronic device. And a second connector hole (eg, an earphone jack) 109 that can accommodate a connector for transmitting and receiving audio signals.

Referring to FIG. 3, the electronic device 300 may include a side bezel structure 310, a first support member 311 (eg, a bracket), a front plate 320, a display 330, and a printed circuit board 340. The battery 350 may include a second support member 360 (eg, a rear case), an antenna 370, and a rear plate 380. In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360) or further include other components. . At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2, and overlapping descriptions thereof will be omitted.

The first support member 311 may be disposed in the electronic device 300 to be connected to the side bezel structure 310 or may be integrally formed with the side bezel structure 310. The first support member 311 may be formed of, for example, a metal material and / or a non-metal (eg polymer) material. In the first support member 311, the display 330 may be coupled to one surface thereof, and the printed circuit board 340 may be coupled to the other surface thereof. The printed circuit board 340 may be equipped with a processor, a memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially coplanar with, for example, the printed circuit board 340. The battery 350 may be integrally disposed in the electronic device 300, or may be detachably attached to the electronic device 300.

The antenna 370 may be disposed between the rear plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by some or a combination of the side bezel structure 310 and / or the first support member 311.

4 is a perspective view of an electronic device 400 (eg, 100 of FIG. 1) including a connector 600, according to various embodiments disclosed herein. FIG. 5 is a perspective view of an electronic device 400 (eg, 100 of FIG. 1) including a connector 600, according to other embodiments of FIG. 4.

According to various embodiments of the present disclosure, an electronic device 400 may include a printed circuit board 410 (hereinafter referred to as a “circuit board”), at least one electronic component 500, and at least one It may include a connector 600.

Referring to FIG. 4, the circuit board 410 may include an upper surface 401 facing the first direction and a lower surface 402 facing the second direction opposite to the first direction. Here, the first direction may be a direction parallel to the direction component '①' shown in FIG. 4, and the second direction may be a direction parallel to the direction component '②' shown in FIG. 4. The direction component '①' may indicate a direction substantially the same as the z-axis of the coordinate axis described below with reference to FIG. 2, and the direction component '②' may indicate a direction opposite to the z-axis of the coordinate axis. According to an embodiment, the first direction may face the first surface 110A of the electronic device 100 described above with reference to FIG. 1 or the second surface 110B of the electronic device 100.

According to various embodiments, the shape of the circuit board 410 is not limited to any particular embodiment. 1 and 2, the rectangular circuit board 410 is shown, but various shapes including circuit boards having shapes different from those shown in the drawings, for example, 'a' and 'b' shapes (including atypical shapes). ) May correspond to a circuit board.

According to various embodiments of the present disclosure, at least one electronic component 500 and at least one connector 600 may be mounted on the top surface 401 of the circuit board 410. Herein, the electronic component 500 or the connector 600 mounted on the circuit board 410 may mean that the electronic component 500 or the connector 300 is fixed at a specific position on the circuit board 410. For example, a fastening part is formed below the electronic component 500 or the lower part of the connector 600, and a through hole device (THD) method coupled to the fastening structure provided on the circuit board 100 may be applied. In addition, a surface mounted device (SMD) method of forming a solder joint by a reflow process may be applied. As described above, the shape of the circuit board 410 may be variously modified. Accordingly, the position or arrangement of the at least one electronic component 500 or the at least one connector 600 on the circuit board 410 may be variously modified to correspond to the shape of the circuit board 410.

According to various embodiments, two or more circuit boards may be provided as the circuit board 410. When two or more circuit boards are provided, each circuit board 410 may be stacked on each other. As shown in the example of FIG. 5, the circuit board 410 or the first substrate and the sub circuit board 420 or the second substrate will be described. ) May be stacked on each other, and according to an embodiment, the top surface 401 of the circuit board 410 and the top surface (not shown) of the sub circuit board 420 may face each other.

According to one embodiment, when two

circuit boards

410 and 420 are provided, at least one electronic component 500 is mounted on the circuit board 410, and at least one electronic component also on the sub circuit board 420. (Not shown) may be mounted. The two

circuit boards

410 and 420 may face each other while the electronic component 500 is mounted. In this case, the top surface 101 of the first substrate 410 and the top surface (not shown) of the second substrate 420 may face each other, and the electronic components mounted on the two

circuit boards

410 and 420, respectively, 500 may be staggered so as not to physically interfere with each other. According to an embodiment, the electronic components 500 mounted on the two

circuit boards

410 and 420 may be arranged to minimize interference in consideration of electromagnetic influences. According to the above embodiment, in the electronic device 400 (eg, 100 of FIG. 1) having various electronic components 500, space utilization may be increased.

According to various embodiments, at least one electronic component 500 mounted on the circuit board 410 may be provided. For example, in the case illustrated in FIGS. 4 and 5, when three different

electronic components

501, 502, 503 are provided, each

electronic component

501, 502, 503 is individually connected to the connector 600. Or may be connected to the connector 600 in conjunction with other electronic components.

The kind and form of the electronic component 500 are not limited to any particular one. The electronic component 500 may include, for example, a communication device, a processor, a memory, a radio frequency transceiver (RF transceiver), a power management module, a wireless communication circuit, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to an embodiment of the present disclosure, the processor may include at least a communication processor or an integrated configuration of an application processor and a communication processor, and may control or drive the wireless transceiver, the power management module, the wireless communication circuit, and the like. have.

According to an embodiment, the electronic component 500 constitutes a next-generation communication system. For example, the electronic component 500 may be a millimeter wave communication device that performs wireless communication in a frequency band of about 20 GHz or more and about 100 GHz or less.

According to various embodiments, the connector 600 may serve to connect two different substrates. For example, the connector 600 may be disposed between the two

circuit boards

410 and 420 to electrically connect the two

circuit boards

410 and 420. 4 and 5, the number and positions of the connectors 600 may be variously set. For example, in the embodiments illustrated in FIGS. 4 and 5, the connector 600 is illustrated in which a plurality of connectors 600 are arranged in series along the circumference of the circuit board 410, but is not limited thereto. The plurality of connectors 600 may be arranged in parallel, or may be configured in a combination of serial / parallel arrangements.

According to various embodiments disclosed herein, the connector 600 may be an interposer connector. According to an embodiment, the connector 600 may be made of an insulating material including silicon (Si), glass, or ceramic to have a low coefficient of thermal expansion, and conductive terminals may be formed together with the insulating materials. It may be packaged and mounted on the circuit board 410. According to an embodiment, when the connector 600 is configured as an interposer connector, the connector 600 may be surface mounted (SMD) on a circuit board 410 made of an organic material. The use of interposer connectors can provide electrical connectivity and / or mechanical flexibility between the semiconductor chip and the circuit board.

According to various embodiments disclosed herein, the electronic device 400 (eg, 100 of FIG. 1) may include a circuit board 410, at least one electronic component 500, and at least one connector 600. The electronic component 500 may include a conductive frame 700 to shield the electronic component 500 from internal / external noise of the electronic device 400. If the connector 600 is to electrically and structurally interconnect different substrates of the stacked PCB structure, the conductive frame 700 may serve to shield the internal space of the stacked PCB structure formed by the connector 600.

According to various embodiments, the conductive frame 700 may be disposed over the circuit board 410 to surround the at least one electronic component 500. According to an embodiment, the conductive frame 700 may be electrically connected to a ground portion (not shown) of the circuit board 410.

According to another exemplary embodiment, the conductive frame 700 may have a shielding surface facing a third direction different from the first direction (eg, direction component '①') or the second direction (eg, direction component '②'). Can have The conductive frame 700 is a strip-shaped component in which the shielding surface extends in one direction, and may surround a space inside the stacked PCB substrate. According to various embodiments, the inner space in which the conductive frame 700 is enclosed may be substantially sealed. However, if only a shielding effect is ensured, a fine groove or slit may be present to prevent the structure from being closed.

According to an embodiment, the conductive frame 700 may form a closed-loop structure as shown in FIGS. 4 and 5. The conductive frame 700 may extend in a shape corresponding to the shape of the circuit board 410. For example, when the circuit board 410 is formed in a rectangular shape as shown in FIGS. 4 and 5, the conductive frame 700 may also have a rectangular frame structure, and unlike the drawing, the circuit board 410 may be formed. When the 'a' or 'b' structure has a shape, the conductive frame 700 forms a closed loop structure, but may have a 'a' or 'b' shape as a whole.

According to various embodiments, the conductive frame 700 may be provided to extend integrally to shield the electronic component 500, but is not limited thereto. According to an embodiment, a plurality of conductive metal pieces (not shown) are provided, and the plurality of conductive metal pieces (not shown) are disposed in a band shape for shielding the electronic component 500 to have a structure substantially the same as that of the conductive frame. Can have. When a plurality of conductive metal pieces (not shown) form a conductive frame, an embodiment of forming a conductive frame in a discrete form in which slits exist between the conductive metal pieces and an extension without a slit Embodiments for forming a conductive frame of uninterrupted form may be applied. Additional embodiments of the conductive frame 700 will be described below with reference to FIG. 12.

Hereinafter, various embodiments of the connector 600 will be described in detail with reference to FIGS. 6 to 8.

6 is a diagram of a connector 600 with a recess in accordance with various embodiments disclosed herein. FIG. 7 is a diagram illustrating a cross section of the connection terminal 622 which is grounded with the circuit board 410 among the plurality of conductive terminals. FIG. 8 is a diagram of a connector 600 with a recess according to another embodiment of FIG. 6.

According to various embodiments, the connector 600 includes a terminal portion 620 that includes a housing 610 or a body and a plurality of

conductive terminals

621 and 622 accommodated in the housing 610. can do. The housing 610 may be configured to form an overall appearance of the connector 600. The plurality of

conductive terminals

621 and 622 included in the terminal unit 620 may include a circuit board (eg, 410 of FIG. 5) and a sub circuit board (eg, 420 of FIG. 5), or a circuit board (eg, of FIG. 4). 410 and an electronic component (eg, 500 of FIG. 4) may be electrically connected. For example, the housing 610 may have a material including an insulating material, and the terminal unit 320 may have a material including a conductive material.

As shown in FIG. 6, the housing 610 may have a hexahedron shape as a whole. According to one embodiment, when mounted on a circuit board (eg, 410 of FIG. 4), a second surface 602 facing the top surface of the substrate (eg, 401 of FIG. 4), and a second surface 602 are provided. It may include a first surface 601 facing in a direction opposite to the facing direction, and a side surface 603 facing in a direction different from the direction in which the first surface 601 or the second surface 602 faces. The side 603 may include a first side 603a and a second side 603b, and may include a third side 603c and a fourth side 603d. According to one embodiment, the housing 610 may have a rectangular parallelepiped shape. In this case, the side surface 603 includes a first side surface 603a and a second side surface 603b perpendicular to the longitudinal direction of the housing 610, and a third side surface 603c parallel to the longitudinal direction of the housing 610. And a fourth side 603d.

The first surface 601, the second surface 602, and the side surface 603 of the connector 600 described in the embodiments of FIGS. 4 to 14 are the first surface 110A of the electronic device 100 of FIG. 1. ), The second surface 110B and the side surface 110C, and the housing 610 of the connector 600 described in the embodiments of FIGS. 4 to 14 may be referred to as the electronic device 100 of FIG. 1. Note that it may refer to a configuration different from that of the housing.

According to various embodiments, the terminal portion 620 includes a plurality of

conductive terminals

621 and 622 penetrating from the first surface 601 to the second surface 602, each of the plurality of conductive terminals 621. The ends of 622 may be exposed at the first side 601 and the second side 602. End portions of the plurality of

conductive terminals

621 and 622 exposed through the first surface 601 and the second surface 602 may be electrically connected to the outside (eg, the

substrates

410 and 420 of FIG. 5). .

According to various embodiments, the connector 600 may include a recess 630 in the housing 610. According to one embodiment, the recess 630 may be formed along the side of one of the plurality of side surfaces on the first surface 601. According to another embodiment, the recess 610 may be formed on the second surface 602 or the plurality of side surfaces 603, but the recess 630 formed on the first surface 601 for convenience of description below. Explain mainly on).

According to one embodiment, the recess 630 may be penetrated from the first side 603a of the connector 600 to the second side 603b. In addition, according to an embodiment, the recess 630 is different from the one illustrated in FIG. 6, and at least a portion of the recess 630 is not extended from the first side 603a to the second side 603b without breaking. It may have a form that is interrupted internally.

According to various embodiments, a conductive frame (eg, 700 of FIG. 4) may be inserted into the recess 630. According to one embodiment, the width of the conductive frame (eg, 700 of FIG. 4) may have a width that can be fitted into the recess 630. When the conductive frame (eg, 700 of FIG. 4) is inserted into the recess 630, a plurality of connectors 600 may be interconnected through the conductive frame (eg, 700 of FIG. 4). Accordingly, durability of the multilayer PCB structure can be secured.

According to various embodiments, the recess 630 may include a plurality of conductive terminals 621 of the terminal portion 620 to ground a conductive frame (eg, 700 of FIG. 4) to a circuit board (eg, 410 of FIG. 4). A portion of 622 may provide a space in which the recess 630 protrudes toward the recess 630.

Referring to FIG. 6, at least one of the plurality of

conductive terminals

621 and 622 of the terminal unit 620 may be configured as a connection terminal 622. For example, some terminals 621 of the plurality of

conductive terminals

621 and 622 may be configured with conventional signal terminals as many as necessary according to the design specification of the electronic device (eg, 400 of FIG. 4). have. Some of the plurality of

conductive terminals

621 and 622 may be configured as connection terminals 622 for grounding the conductive frame (eg, 700 of FIG. 4). According to an embodiment, at least one end of the connection terminal 622 is connected to a ground portion (not shown) of the substrate, and the other end of the connection terminal 622 has at least a portion protrudingly formed inside the recess 630 to form a conductive frame ( For example, when 700 of FIG. 4 is inserted, a conductive frame (eg, 700 of FIG. 4) may be contacted. Accordingly, the conductive frame (eg, 700 of FIG. 4) can be made in an electrically grounded state.

Referring to FIG. 7, according to an embodiment, the connection terminal 622 may include a first portion 622a and a conductive frame (eg, connected to a ground portion (not shown) of a circuit board (eg, 410 of FIG. 4). 700 of FIG. 4 may include a second portion 622b branched toward the recess 630 to be connected to a ground portion (not shown) of a circuit board (eg, 410 of FIG. 4). With the first portion 622a of the connecting terminal 622 grounded to the circuit board (eg, 410 of FIG. 4), the second portion 622b of the connecting terminal 622 branches toward the recess 630. Therefore, when the conductive frame (eg, 700 of FIG. 4) contacts the second portion 622b, the conductive frame (eg, 700 of FIG. 4) may be grounded to the circuit board (eg, 410 of FIG. 4). According to various embodiments of the present disclosure, since the conductive frame (eg, 700 of FIG. 4) is grounded to a circuit board (eg, 410), the internal space formed by the stacked PCB structure may be shielded. (Eg, 400 of FIG. 4) may improve noise shielding performance.

6 and 7, four conventional signal terminals 621 and one connection terminal 622 are provided, which should be noted that this is only one example. For example, the plurality of

conductive terminals

621 and 622 may be implemented by a combination of various numbers of conductive lines different from the embodiment illustrated in FIGS. 6 and 7.

6 and 8, the terminal unit 620 according to various embodiments of the present disclosure may have a structure exposed through at least two surfaces of the housing 610. According to one embodiment, the terminal portion 620 may be exposed (see FIG. 6) through three sides of the housing 610, and in another embodiment exposed through two sides in a state accommodated in the housing 610. (See FIG. 8).

For example, when exposed to the outside through two surfaces of the housing 610 (see FIG. 8), the plurality of conductive terminals included in the terminal portion 620 may include the first surface 601 and the first surface 601 of the connector 600. May be exposed through two sides 602. In contrast, when exposed to the outside through the three surfaces of the housing 610 (see FIG. 6), the plurality of conductive terminals included in the terminal portion 620 may include the first surface 601 and the second surface of the connector 600. In addition to the face 602, it can also be exposed through the side of the connector (eg, 603d). In a stacked PCB structure, the conductive terminals exposed through the first side 601 and the second side 602 of the connector 600 are in contact with the circuit board (eg, 410 of FIG. 4), but the side (eg, 603d) The conductive terminals exposed through the substrate may be exposed to the outside (eg, the electronic component (eg, 500 of FIG. 4)) instead of the substrate. According to an embodiment, the wiring line of the electronic device (eg, 400 of FIG. 4) is directly connected by directly connecting the conductive terminals exposed through the side (eg, 603d) and the electronic component (eg, 500 of FIG. 4). Can be reduced. According to another embodiment, the electronic component (eg, 500 of FIG. 4) may be disposed adjacent to the connector 600, thereby increasing the space utilization of the stacked PCB.

According to various embodiments of the present disclosure, an electronic device (eg, 400 of FIG. 4) may include a specification required for the electronic device (eg, 400 of FIG. 4) or an electronic component provided on a stacked PCB (eg, FIG. 4). Depending on the type and arrangement (or connection) of the 500, the terminal unit 620 of various embodiments described above may be selected or used in combination.

According to various embodiments, the connector 600 may be formed with an assembly formed integrally with the housing 610. The assembly is shown in a recess structure in the embodiment shown in FIGS. 6 to 8. According to various embodiments of the present disclosure, the assembly may have not only a recess structure but also various other forms to be fixedly installed with the conductive frame (eg, 700 of FIG. 4). For example, although not shown in the drawings, the assembly may have a configuration protruding from the housing 610, and the conductive frame (eg, 700 of FIG. 4) may be configured to receive a configuration protruding from the housing 610. It may be.

Hereinafter, a connector including an assembly 800 according to various other embodiments will be described with reference to FIGS. 9 to 11.

6 and 8 can be seen that the assembly 630 is formed integrally with the housing 610 and has a fitting groove shape. In FIGS. 9 to 11, a configuration separate from the housing 610 may be described. The assembly 800 may be coupled to at least one side of the housing 610 and physically coupled to the conductive frame (eg, 700 of FIG. 4). Can be.

9 is a diagram of a connector 600 including an assembly 800, in accordance with various embodiments disclosed herein. 10 is a diagram of a connector 600 that includes an assembly 800, in accordance with various embodiments disclosed herein. FIG. 11 is a diagram of a connector 600 including an assembly 800, according to another embodiment of FIG. 10.

9, unlike the embodiment described above with reference to FIGS. 6 to 8, the connector 600 includes attaching, adhering, and fastening in a state in which the assembling unit 800 is physically separated from the connector 600. Can be combined through various coupling schemes.

According to one embodiment, the housing 610, or body portion of the connector 600 may have a substantially hexahedral shape, and thus, the first surface 601 and the direction in which the first surface 601 faces. It may include a second face 602 facing in the opposite direction, and a side facing in a direction different from the direction in which the first face 601 or the second face 602 faces, and the side faces in the longitudinal direction of the housing 610. A third side surface (eg, x-axis direction) perpendicular to a third side surface (eg, x-axis direction) including a first side surface 603a and a second side surface 603b, and parallel to a longitudinal direction (eg, x-axis direction) of the housing 610. 603c) and a fourth side 603d of FIG. 6.

According to an embodiment, in the connector 600 including the assembling unit 800, the entire surface of the housing 610 may have a flat shape. In addition, the assembly 800 may be coupled to any one surface (eg, a third side surface (eg, 603d of FIG. 6)) of six surfaces of the housing 610.

According to one embodiment, without providing a recess (eg, 630 of FIG. 6) in the housing 610, a recess 830 for inserting a conductive frame (eg, 700 of FIG. 4) into the assembly portion 800. ) Can be prepared. According to one embodiment, an area including at least a portion of the assembly 800 coupled to one side of the housing 610 may include a conductive frame (eg, 700 in FIG. 4) and a circuit board (eg, in FIG. 4). 410 may serve to ground. In order for the assembly 800 to serve to ground the conductive frame (eg, 700 of FIG. 4) to the circuit board (eg, 410 of FIG. 4), a ground terminal may be provided in an area including at least a portion of the assembly 800. Can be formed. The ground terminal may be formed to include at least a portion of the assembly portion 800 in a direction parallel to the longitudinal direction (eg, the x-axis direction) of the housing 610 of the edge region of the housing 610.

According to one embodiment, the entire assembly portion 800 may be formed as a ground terminal. Here, a conductive material may be included as a material of the assembling unit 800 and may be insulated from the housing 610. According to an embodiment, when the entire assembly 800 coupled to the housing 610 is formed as a ground terminal, the conductive frame (eg, 700 of FIG. 4) only contacts the assembly 500. Since the ground is formed, the terminal unit 620 may not include a separate connection terminal (eg, 622 of FIG. 6) for grounding the circuit board 410.

According to the embodiment shown in FIG. 10, the connector 600 including the assembling unit 800 includes the assembling unit 800 separately provided in a state in which the recess 630 is provided in the housing 610. It may be to bind to. Even in this embodiment, the method of coupling the assembly 800 to the housing 610 may use various coupling methods including attachment, adhesion, and fastening.

The housing 610 in the embodiment of FIG. 10 may also have a substantially hexahedral shape, such that the first face 601 and a second face facing in a direction opposite to the direction in which the first face 601 faces. 602 and a side facing in a direction different from the direction in which the first face 601 or the second face 602 faces, the side being the first side 603a perpendicular to the longitudinal direction of the housing 610. ) And a second side surface 603b, and a third side surface (eg, 603c of FIG. 6) and a fourth side surface 603d parallel to the longitudinal direction of the housing 610.

Unlike the embodiment of FIG. 9, in the embodiment of FIG. 10, the first side (eg, 603a of FIG. 6) and / or the second side (eg, FIG. 6), rather than the third side (eg, 603c) of the housing 610. At least one

assembly portion

801, 802 may be coupled to 603b of 6. Here, the recess 630 is formed to fit the conductive frame (for example, 700 of FIG. 4) in the housing 610, and the recess 630 is also attached to the assembly 800 coupled to the housing 610. A concave structure of a corresponding shape can be formed. According to the embodiment of FIG. 10, the assembling unit 800 is in a direction perpendicular to the longitudinal direction of the housing 610 (eg, the x-axis direction of FIG. 10) among the edge regions of the housing 610. Including a recess structure corresponding to the recess 630 may have a structure substantially the same as the cross-sectional structure cut in a direction perpendicular to the longitudinal direction of the housing.

According to one embodiment, at least a portion of an

assembly

801 or 802 coupled to the first side (eg 603a of FIG. 6) or the second side (eg 603b of FIG. 6) of the housing 610 is included. The region may serve to ground the conductive frame (eg, 700 of FIG. 4) to the circuit board (eg, 410 of FIG. 4). According to other embodiments, at least a portion of two

assemblies

801, 802 coupled to the first side (eg 603a of FIG. 6) and the second side (eg 603b of FIG. 6) of the housing 610. The region including may serve to ground the conductive frame (eg, 700 of FIG. 4) to the circuit board (eg, 410 of FIG. 4). In order for the assembly 800 to serve to ground the conductive frame (eg, 700 of FIG. 4) to the circuit board (eg, 410 of FIG. 4), a ground terminal may be provided in an area including at least a portion of the assembly 800. Can be formed. The ground terminal may be formed to include at least a portion of the assembly portion 800 in a direction parallel to the longitudinal direction (eg, the x-axis direction) of the housing 610 of the edge region of the housing 610.

According to one embodiment, the assembly 801 coupled to the first side (eg 603a of FIG. 6) of the housing 610 or the assembly 802 coupled to the second side (eg 603b of FIG. 6). The whole may be formed of a ground terminal. According to another embodiment, the entirety of the two

assemblies

801, 802 coupled to the first side (eg 603a of FIG. 6) and the second side (eg 603b of FIG. 6) of the housing 610 may be ground terminals. It may be formed as. Here, the entire assembly part 800 may be formed of a ground terminal, which may include a conductive material as a material of the assembly part 800.

According to the embodiment shown in FIG. 11, the connector 600 including the assembling unit 800 also includes an assembling unit 800 separately provided in a state in which the recess 630 is provided in the housing 610 as in FIG. 10. It may be coupled to the housing 610. Even in this embodiment, the method of coupling the assembly 800 to the housing 610 may use various coupling methods including attachment, adhesion, and fastening.

In the embodiment of FIG. 11, at least one of the first side (eg, 603a of FIG. 6) and / or the second side (eg, 603b of FIG. 6), rather than the third side (eg, 603c) of the housing 610.

Assembly parts

801 and 802 may be combined. And unlike the embodiment of Figure 10, in the direction perpendicular to the longitudinal direction of the housing 610 (for example, the x-axis direction of Figure 11) the one side and the other side is in close contact with the housing 610 It may further include.

According to an embodiment, the housing 610 may be provided with three

assembly parts

801, 802, and 803. The ground terminal may be formed on at least one of the three assembling

parts

801, 802, and 803. For example, a ground terminal may be formed only in one

assembly

801 or 802 or 803, and a combination of two or more of the three

assembly parts

801, 802, and 803 801 and 802, or 801 and 803, or 802. And 803, or 801, 802, and 803. Of course, in the embodiment here, at least any one of the three assembling

units

801, 802, and 803 may be formed as a ground terminal. Accordingly, when the conductive frame (eg, 700 of FIG. 4) is inserted into the assembly portion 800, the conductive frame (eg, 700 of FIG. 4) may be formed at various points on the circuit board (eg, 410 of FIG. 4). Can be grounded. As a result, it is possible to provide a stable grounding structure between the conductive frame (eg, 700 of FIG. 4) and the circuit board (eg, 410 of FIG. 4), and also to provide high design freedom in a stacked PCB structure.

According to various embodiments, in designing a stacked PCB, any one of the various embodiments of the connector 600 shown in FIGS. 6 to 11 may be selected and used, or two or more embodiments may be combined.

12 is a diagram illustrating a connector 600 and a conductive frame 700, in accordance with various embodiments disclosed herein.

According to various embodiments of the present disclosure, the conductive frame 700 is physically coupled to an assembly portion (eg, 630 of FIGS. 6 to 8 and 800 of FIGS. 9 to 11) of the connector 600, and has various shapes. Can be formed. The conductive frame 700 may have various shapes without being limited to any particular shape and dimension, provided that only the shielding performance of the electronic device (eg, 400 of FIG. 4) disclosed herein is secured. For example, a band-shaped conductive frame 700 is illustrated in FIGS. 4 and 5, but is not necessarily limited thereto. According to an exemplary embodiment, a zigzag structure (not shown) may be bent at a predetermined angle along a length direction. May have

According to an embodiment, the length L of the conductive frame 700 may be greater than the length a of the connector 600. For example, as in the embodiment illustrated in FIG. 12 (d), the conductive frame 700 may extend long without a slit in one frame, and thus may have a closed loop structure.

According to another embodiment, if the conductive frame 700 has the form of a plurality of conductive metal pieces 700b, 700b, 700c, the length of each conductive metal piece may be formed larger or smaller than the length a of the connector 600. It may be. For example, as in the embodiment shown in FIG. 12E, the length L1 of any one of the

conductive metal pieces

700a, 700b, 700c is greater than the length a of the connector 600. The length L2 of the other metal piece 700c may be smaller than the length a of the connector 600. According to one embodiment, as shown in FIG. 12 (e), even though some slits are formed along the longitudinal direction of the conductive frame 700, the slits are covered by engagement with the

connectors

600 and 700 to substantially seal the slits. The structure can be formed.

According to one embodiment, the height of the conductive frame 700 may have a constant height.

According to another embodiment, the height of the conductive frame 700 may have a step along the length direction. For example, as illustrated in FIG. 12F, a protruding structure 702 having a predetermined height c may be formed on the lower surface 701 of the conductive frame 700. Accordingly, the conductive frame 700 may have a shape corresponding to a portion where the recess 630 is formed in the connector 600. By utilizing the connector 600 and the conductive frame 700 of the structure in the laminated PCB structure, it is possible to effectively package the internal space of the laminated PCB structure.

Using the connector 600 and the conductive frame 700 according to the above embodiments, it is possible to obtain a high shielding efficiency, it may be advantageous to ensure the durability of the packaging of the laminated PCB structure. According to various embodiments, a long conductive frame 700 is disposed between the substrate and the substrate to achieve a stable fixing structure, such that a certain structure (a certain connector or part of the conductive frame of the plurality of connectors 600) is provided. Concentration of stress can be prevented. According to an embodiment, since the conductive frame 700 may serve to structurally connect the substrate to the substrate, it may also have an advantage of ensuring the number of connectors 600 as many as the required signal lines.

FIG. 13 is a diagram illustrating a connector 900 and a circuit board mounted conductive frame 1000 according to various embodiments disclosed herein.

Referring to FIG. 13, a circuit board 410 including an upper surface facing the first direction (eg, 401 of FIG. 4) and a lower surface facing the second direction (eg, 402 of FIG. 4) facing the first direction. ; At least one electronic component (eg, 500 of FIG. 4) mounted on an upper surface of the circuit board 410; At least one connector 900 mounted on an upper surface of the circuit board 410 and electrically connected to at least one of the circuit board 410 and the electronic component; And a conductive frame 1000 mounted on an upper surface of the circuit board 410 and having a shielding surface facing a first direction or a third direction different from the second direction and shielding the electronic component. According to an embodiment, the conductive frame 1000 referred to in FIG. 13 may be arranged to surround at least a portion of the electronic component and at least a portion of the connector 900. In addition, according to the embodiment, the conductive frame 1000 may be disposed spaced apart from the at least one connector 900 at the outside of the connector 900.

4 to 11, the recess (eg, 630 of FIG. 6) is formed in the housing (eg, 610 of FIG. 6), or the assembly portion (eg, 800 of FIG. 9) is formed. A connector 900 that does not include is disclosed, and a conductive frame 1000 that is not physically connected to the connector 900 may be provided separately. Accordingly, the conductive frame 1000 can exhibit excellent shielding performance without using a form in which the conductive frame 1000 is separately coupled to the connector 900.

14 is a graph illustrating shielding efficiency of an electronic device (eg, 400 of FIG. 4) according to various embodiments of the present disclosure. Referring to FIG. 14, various embodiments of shielding effectiveness of an electronic device having a stacked PCB structure according to a frequency change are illustrated.

FIG. 14 shows graphs (L1, L2, L3) measuring shielding efficiency according to frequency change under three different conditions, wherein the L1 graph uses the connector disclosed in this document (eg, 600 of FIG. 4). It shows shielding efficiency of the general laminated PCB structure, which is not shown, and the L2 graph is different from the embodiment shown in FIGS. 1 to 13 of this document, and a connector shielded by plating on an outer surface (hereinafter referred to as 'a connector using a shielding film'). ) Shows the shielding efficiency of the laminated PCB structure. And the L3 graph shows the shielding efficiency of the stacked PCB structure using a connector (eg, 600 of FIG. 4) according to various embodiments disclosed in the present document. In the graph, when the value corresponds to the same frequency band, a lower value of the vertical axis may indicate higher shielding efficiency.

Referring to the drawings, for example, a stacked PCB structure using a connector (eg, 600 of FIG. 4) in accordance with various embodiments disclosed herein in the entire frequency range is a connector according to various embodiments disclosed herein. It can be seen that the shielding efficiency is much higher than that of the general multilayer PCB structure without using the PSA. In addition, the shielding efficiency graph L3 of the electronic device (eg, 400 of FIG. 4) using the connector (eg, 600 of FIG. 4) according to various embodiments of the present disclosure may include an electronic device including a connector using a shielding film. It can be seen that it has a higher efficiency than the shielding efficiency graph L2 of the device.

For example, in the high frequency region, the shielding efficiency (graph L3) of the electronic device using the connector disclosed in this document (eg, 600 of FIG. 4) and the shielding efficiency of the electronic device including the connector using the shielding film (graph L2) are compared. 10, the shielding efficiency may be improved by about 27 dB in the frequency about 5 GHz region, and the shielding efficiency may be improved by about 19 dB in the frequency about 10 GHz region.

According to another embodiment, it can be seen that the shielding efficiency may be improved by about 9 dB in the high band frequency band of about 20 GHz.

According to an electronic device (eg, 400 of FIG. 4) according to various embodiments of the present disclosure, shielding efficiency in various millimeter wave frequency bands other than the frequency band described above may be improved.

15 is a block diagram of an electronic device 1501 in a network environment 1500 according to various embodiments. Referring to FIG. 15, in a network environment 1500, the electronic device 1501 communicates with the electronic device 1502 through a first network 1598 (eg, a short-range wireless communication network) or the second network 1599. The electronic device 1504 or the server 1508 may be communicated through a remote wireless communication network. According to an embodiment of the present disclosure, the electronic device 1501 may communicate with the electronic device 1504 through the server 1508. According to an embodiment, the electronic device 1501 may include a processor 1520, a memory 1530, an input device 1550, an audio output device 1555, a display device 1560, an audio module 1570, and a sensor module. 1576, interface 1577, haptic module 1579, camera module 1580, power management module 1588, battery 1589, communication module 1590, subscriber identification module 1596, or antenna module 1597 ) May be included. In some embodiments, at least one of the components (for example, the display device 1560 or the camera module 1580) may be omitted or one or more other components may be added to the electronic device 1501. In some embodiments, some of these components may be implemented in one integrated circuit. For example, the sensor module 1576 (eg, fingerprint sensor, iris sensor, or illuminance sensor) may be implemented embedded in the display device 1560 (eg, display).

The processor 1520 may, for example, execute software (eg, a program 1540) to provide at least one other component (eg, hardware or software component) of the electronic device 1501 connected to the processor 1520. It can control and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operation, the processor 1520 may transmit instructions or data received from another component (eg, the sensor module 1576 or the communication module 1590) to the volatile memory 1532. Can be loaded into, processed in a command or data stored in the volatile memory 1532, and stored in the non-volatile memory 1534. According to an embodiment, the processor 1520 may include a main processor 1521 (eg, a central processing unit or an application processor), and a coprocessor 1523 (eg, a graphics processing unit, an image signal processor) that may operate independently or together. , Sensor hub processor, or communication processor). Additionally or alternatively, the coprocessor 1523 may be configured to use lower power than the main processor 1521 or to be specialized for its designated function. The coprocessor 1523 may be implemented separately from or as part of the main processor 1521.

The coprocessor 1523 may, for example, replace the main processor 1521 while the main processor 1521 is in an inactive (eg, sleep) state, or the main processor 1521 may be active (eg, execute an application). Together with the main processor 1521, at least one of the components of the electronic device 1501 (eg, the display device 1560, the sensor module 1576, or the communication module 1590). Control at least some of the functions or states associated with the. According to one embodiment, the coprocessor 1523 (eg, an image signal processor or communication processor) may be implemented as part of another functionally related component (eg, camera module 1580 or communication module 1590). have.

The memory 1530 may store various data used by at least one component (for example, the processor 1520 or the sensor module 1576) of the electronic device 1501. The data may include, for example, software (eg, program 1540) and input data or output data for instructions associated with it. The memory 1530 may include a volatile memory 1532 or a nonvolatile memory 1534.

The program 1540 may be stored as software in the memory 1530 and may include, for example, an operating system 1542, middleware 1544, or an application 1546.

The input device 1550 may receive a command or data to be used for a component (eg, the processor 1520) of the electronic device 1501 from the outside (eg, a user) of the electronic device 1501. The input device 1550 may include, for example, a microphone, a mouse, or a keyboard.

The sound output device 1555 may output a sound signal to the outside of the electronic device 1501. The sound output device 1555 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as multimedia playback or recording playback, and the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of a speaker.

The display device 1560 may visually provide information to the outside (eg, a user) of the electronic device 1501. The display device 1560 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment of the present disclosure, the display device 1560 may include a touch circuitry configured to sense a touch, or a sensor circuit (eg, a pressure sensor) configured to measure the strength of a force generated by the touch. have.

The audio module 1570 may convert sound into an electrical signal or vice versa. According to an embodiment of the present disclosure, the audio module 1570 acquires sound through the input device 1550, or an external electronic device (eg, connected to the sound output device 1555 or the electronic device 1501 directly or wirelessly). Sound may be output through the electronic device 1502 (eg, a speaker or a headphone).

The sensor module 1576 detects an operating state (eg, power or temperature) or an external environmental state (eg, a user state) of the electronic device 1501 and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 1576 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 1577 may support one or more designated protocols that may be used for the electronic device 1501 to be directly or wirelessly connected to an external electronic device (eg, the electronic device 1502). According to an embodiment of the present disclosure, the interface 1577 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 1578 may include a connector through which the electronic device 1501 may be physically connected to an external electronic device (eg, the electronic device 1502). According to an embodiment of the present disclosure, the connection terminal 1578 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 1579 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinetic senses. According to one embodiment, the haptic module 1579 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 1580 may capture still images and videos. According to an embodiment, the camera module 1580 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 1588 may manage power supplied to the electronic device 1501. According to an embodiment of the present disclosure, the power management module 1588 may be implemented as at least part of a power management integrated circuit (PMIC).

The battery 1589 may supply power to at least one component of the electronic device 1501. According to an embodiment, the battery 1589 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 1590 may be a direct (eg wired) communication channel or wireless communication channel between the electronic device 1501 and an external electronic device (eg, the electronic device 1502, the electronic device 1504, or the server 1508). Establish and perform communication over established communication channels. The communication module 1590 may operate independently of the processor 1520 (eg, an application processor) and include one or more communication processors that support direct (eg, wired) or wireless communication. According to an embodiment, the communication module 1590 may be a wireless communication module 1592 (eg, a cellular communication module, a near field communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1594 (eg, It may include a local area network (LAN) communication module, or a power line communication module. The corresponding communication module of these communication modules may be a first network 1598 (e.g. a short range communication network such as Bluetooth, WiFi direct or an infrared data association (IrDA)) or a second network 1599 (e.g. a cellular network, the Internet, or Communicate with external electronic devices via a telecommunications network, such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented by a plurality of components (eg, a plurality of chips) separate from each other. The wireless communication module 1592 uses subscriber information (e.g., international mobile subscriber identifier (IMSI)) stored in the subscriber identification module 1596 within a communication network such as the first network 1598 or the second network 1599. The electronic device 1501 may be checked and authenticated.

The antenna module 1597 may transmit or receive a signal or power to an external (eg, an external electronic device) or from an external source. According to one embodiment, the antenna module 1597 may include one or more antennas, from which at least one antenna suitable for a communication scheme used in a communication network, such as a first network 1598 or a second network 1599, For example, it may be selected by the communication module 1590. The signal or power may be transmitted or received between the communication module 1590 and the external electronic device through the selected at least one antenna.

At least some of the components are connected to each other and connected to each other through a communication method between peripheral devices (eg, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)). For example, commands or data).

According to an embodiment of the present disclosure, the command or data may be transmitted or received between the electronic device 1501 and the external electronic device 1504 through the server 1508 connected to the second network 1599. Each of the

electronic devices

1502 and 1504 may be a device that is the same as or different from the electronic device 1501. According to an embodiment of the present disclosure, all or part of operations executed in the electronic device 1501 may be executed in one or more external devices among the external

electronic devices

1502, 1504, or 1508. For example, when the electronic device 1501 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 1501 may not execute the function or service itself. In addition to or in addition, one or more external electronic devices may be requested to perform at least a part of the function or the service. The one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1501. The electronic device 1501 may process the result as it is or additionally and provide the result as at least part of a response to the request. To this end, for example, cloud computing, distributed computing, or client-server computing technology may be used.

Electronic devices according to various embodiments of the present disclosure may be various types of devices. The electronic device may include, for example, a portable communication device (eg, a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. An electronic device according to an embodiment of the present disclosure is not limited to the above-described devices.

Various embodiments of the present disclosure and terms used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, and it should be understood to include various changes, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the items, unless the context clearly indicates otherwise. In this document, "A or B", "At least one of A and B", "At least one of A or B," "A, B or C," "At least one of A, B and C," and "A And phrases such as "at least one of B, or C" may include all possible combinations of items listed together in the corresponding one of the phrases. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish a component from other corresponding components, and to separate the components from other aspects (e.g. Order). Some (eg, first) component may be referred to as "coupled" or "connected" to another (eg, second) component, with or without the term "functionally" or "communicatively". When mentioned, it means that any component can be connected directly to the other component (eg, by wire), wirelessly, or via a third component.

As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. The module may be an integral part or a minimum unit or part of the component, which performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present disclosure may include one or more instructions stored in a storage medium (eg, internal memory 1536 or external memory 1538) that can be read by a machine (eg, electronic device 1501). It may be implemented as software (eg, program 1540) including the. For example, a processor (eg, the processor 1520) of the device (eg, the electronic device 1501) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the device to be operated to perform at least one function in accordance with the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' means only that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), which is the case when data is stored semi-permanently on the storage medium. It does not distinguish cases where it is temporarily stored.

According to an embodiment of the present disclosure, a method according to various embodiments of the present disclosure may be included in a computer program product. The computer program product may be traded between the seller and the buyer as a product. The computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play StoreTM) or two user devices ( Example: smartphones) can be distributed (eg downloaded or uploaded) directly or online. In the case of on-line distribution, at least a portion of the computer program product may be stored at least temporarily on a device-readable storage medium such as a server of a manufacturer, a server of an application store, or a relay server, or may be temporarily created.

According to various embodiments of the present disclosure, each component (eg, a module or a program) of the above-described components may include a singular or plural object. According to various embodiments of the present disclosure, one or more components or operations of the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of the component of each of the plurality of components the same as or similar to that performed by the corresponding component of the plurality of components before the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, or may be omitted. Or one or more other operations may be added.

According to various embodiments of the present disclosure, in an electronic device (eg, 400 of FIG. 4), a circuit board (eg, 410 of FIG. 4) in which at least one electronic component (eg, 500 of FIG. 4) is mounted. ; A conductive frame (eg, 700 in FIG. 4) disposed over the circuit board to surround the at least one electronic component; And at least one connector (eg, 600 in FIG. 4) mounted to the circuit board, wherein the at least one connector includes the second surface (eg, 602 in FIG. 6) mounted on the circuit board. A first side facing the second side (eg, 601 of FIG. 6), the second side and a plurality of side surfaces surrounding the first side (eg, 603a, 603b, 603c, 603d of FIG. 6); And a recess (eg, 630 in FIG. 6) formed on the first side along one side of the plurality of sides, the recess being physically coupled to the conductive frame (eg, FIG. 6). 610); And a plurality of conductive terminals (eg, 621 and 622 of FIG. 6) formed on one side thereof, and at least one conductive terminal of the plurality of conductive terminals is a connection terminal (eg, formed inside the recess). An electronic device electrically connected to the conductive frame and electrically connected to a ground portion (not shown) of the circuit board may be provided through 622 of FIG. 6.

According to various embodiments, the sub-circuit board (eg, FIG. 5) of the at least one connector facing the first side of the at least one connector facing the circuit board (eg, 410 of FIG. 5). The electronic device may further include a 420, and the sub circuit board may provide an electronic device electrically connected to at least some of the plurality of conductive terminals.

According to various embodiments, the connector may be surface mounted on the substrate.

According to various embodiments, the housing (eg, 601 of FIG. 6) is formed to have a substantially hexahedral shape, and the side surface is a first side surface perpendicular to the longitudinal direction of the housing (eg, 603a of FIG. 6). And a second side (eg, 603b of FIG. 6), and include a third side (eg, 603c of FIG. 6) and a fourth side (eg, 603d of FIG. 6) parallel to the longitudinal direction of the housing. Can be.

According to various embodiments, the recess may extend along the longitudinal direction of the housing.

According to various embodiments, the recess may be penetrated from the first side of the housing to the second side.

According to various embodiments, at least one of the plurality of conductive terminals may include a first portion (eg, 622a of FIG. 7) connected to a ground portion of the circuit board, and the conductive frame may be connected to a ground portion of the circuit board. It may include a second portion (eg, 621a of FIG. 7) branched toward the recess to be connected to form the connection terminal.

According to various embodiments, the conductive frame may have a stepped shape corresponding to the shape of the recess.

According to various embodiments of the present disclosure, an upper surface facing a first direction (eg, 401 of FIG. 4) and a lower surface facing a second direction opposite to the first direction (eg, 402 of FIG. 4) may be included. A circuit board (eg, 410 of FIG. 4); At least one electronic component (eg, 500 of FIG. 4) mounted on an upper surface of the circuit board; At least one connector (eg, 600 in FIG. 6) mounted on an upper surface of the circuit board and electrically connected to at least one of the circuit board or the electronic component; And a shielding surface connected to the ground portion of the circuit board and facing a first direction or a third direction different from the second direction to surround at least a portion of the electronic component, thereby shielding the electronic component. An electronic device including a frame (eg, 700 of FIG. 4) may be provided.

According to various embodiments of the present disclosure, the assembly unit may be integrally formed with the connector (eg, 600 of FIG. 4), and the conductive frame (eg, 700 of FIG. 4) may be mounted on the connector through the assembly unit. Can be fixedly installed.

According to various embodiments, the connector may include a housing (eg, 610 of FIG. 4) and a plurality of conductive terminals (eg, 621 and 622 of FIG. 6) accommodated in the housing.

According to various embodiments of the present disclosure, the housing (eg, 610 of FIG. 6) has a substantially hexahedral shape, and when mounted on the circuit board, a second surface facing the top surface of the circuit board. (Eg, 602 of FIG. 6), a first surface (eg, 601 of FIG. 6) facing in a direction opposite to the direction in which the second surface faces, and a direction perpendicular to the direction in which the first and second surfaces face. 6, a side facing the first side (eg, 603a of FIG. 6) and a second side (eg, 603b of FIG. 6) perpendicular to the longitudinal direction of the housing. And a third side surface (eg, 603c of FIG. 6) and a fourth side surface (eg, 603d of FIG. 6) parallel to the longitudinal direction of the housing.

According to various embodiments of the present disclosure, a separate component from the housing may further include an assembly (eg, 800 of FIG. 9) fastened to at least one side of the housing and physically coupled to the conductive frame.

According to various embodiments, the assembly portion (eg, 800 of FIG. 9) may include a recess (eg, 830 of FIG. 9) formed along a direction parallel to the longitudinal direction of the housing to which the conductive frame is coupled. The ground terminal may be formed on at least a portion of the assembly unit to be electrically connected to the conductive frame.

According to various embodiments, the housing (eg, 610 of FIG. 10) includes a recess (eg, 630 of FIG. 10) formed along a direction parallel to the longitudinal direction of the housing to which the conductive frame is coupled. The cross section of the assembly unit (eg, 800 of FIG. 10) may include a recess structure corresponding to the recess (eg, 630 of FIG. 10) and may be cut in a direction perpendicular to the longitudinal direction of the housing. It may have the same structure.

According to various embodiments, the entire assembly may be conductive.

According to various embodiments, the ground terminal may be formed in an edge region of the housing or an inner region of the housing.

According to various embodiments of the present disclosure, an upper surface facing a first direction (eg, 401 of FIG. 4) and a lower surface facing a second direction opposite to the first direction (eg, 402 of FIG. 4) may be included. A circuit board (eg, 410 of FIG. 13); At least one electronic component (eg, 500 of FIG. 4) mounted on an upper surface of the circuit board; At least one connector (eg, 900 in FIG. 13) mounted on an upper surface of the circuit board and electrically connected to at least one of the circuit board or the electronic component; And a shielding surface mounted on an upper surface of the circuit board and facing a third direction different from the first direction or the second direction, and disposed to surround at least a portion of the electronic component and at least a portion of the connector. A conductive frame (eg, 1000 of FIG. 13) for shielding the electronic component may be provided.

According to various embodiments, the conductive frame may be spaced apart from the connector at an outer side of the connector.

According to various embodiments, the conductive frame may have a closed loop structure.

In the foregoing detailed description of the present invention, specific embodiments have been described. However, it will be apparent to those skilled in the art that various modifications can be made without departing from the scope of the present invention.

Claims

In an electronic device,

A circuit board on which at least one electronic component is mounted;

A conductive frame disposed over the circuit board to surround the at least one electronic component; And

At least one connector mounted on the circuit board, wherein the at least one connector,

A second surface mounted on the circuit board, a first surface facing the second surface, a plurality of side surfaces surrounding the second surface, and the first surface, wherein the first surface includes: A recess formed along one side, the recess comprising: a housing physically coupled with the conductive frame; And

A plurality of conductive terminals formed on the one side surface, wherein at least one conductive terminal of the plurality of conductive terminals is electrically connected to the conductive frame through a connection terminal formed inside the recess, and Electronic device electrically connected to ground.
The electronic device of claim 1, further comprising a sub circuit board disposed to face the circuit board and to be in contact with the first surface of the at least one connector.
The electronic device of claim 2, wherein the sub circuit board is electrically connected to at least some of the plurality of conductive terminals.
The method of claim 1,

The connector is surface mounted using solder on the circuit board.
The method of claim 1,

The housing is formed to have a substantially hexahedral shape,

And the side surface includes a first side surface and a second side surface perpendicular to the longitudinal direction of the housing, and a third side surface and a fourth side surface parallel to the longitudinal direction of the housing.
The method of claim 5,

The recess is formed along the longitudinal direction of the housing.
The method of claim 5,

And the recess penetrates from the first side of the housing to the second side.
The method of claim 5,

At least one of the plurality of conductive terminals may include a first portion connected to the ground portion of the circuit board, and the conductive frame is branched toward the recess to connect the ground portion of the circuit board to form the connection terminal. An electronic device comprising a second portion.
The method of claim 1,

The conductive frame has a stepped shape corresponding to the shape of the recess.
The method of claim 1,

An assembly part integrally formed with the connector;

The conductive frame is fixed to the connector through the assembly unit.
The method of claim 1,

The connector,

An electronic device comprising a housing and a plurality of conductive terminals received in the housing.
The method of claim 1,

And an assembly unit separate from the housing, the assembly unit coupled to at least one side of the housing and physically coupled to the conductive frame.
The method of claim 12,

The assembly unit includes a recess formed along a direction parallel to the longitudinal direction of the housing to which the conductive frame is coupled, wherein at least a portion of the assembly unit has a ground terminal.
The method of claim 12,

The assembly portion of the electronic device includes a recess structure corresponding to the recess, the cross section having the same structure as the cross-sectional structure cut in a direction perpendicular to the longitudinal direction of the housing.
The method of claim 13,

The electronic device as a whole is conductive.