WO2021145033A1 - Élément d'imagerie à semi-conducteurs, dispositif d'imagerie, et procédé de commande d'élément d'imagerie à semi-conducteurs - Google Patents

Élément d'imagerie à semi-conducteurs, dispositif d'imagerie, et procédé de commande d'élément d'imagerie à semi-conducteurs Download PDF

Info

Publication number
WO2021145033A1
WO2021145033A1 PCT/JP2020/038430 JP2020038430W WO2021145033A1 WO 2021145033 A1 WO2021145033 A1 WO 2021145033A1 JP 2020038430 W JP2020038430 W JP 2020038430W WO 2021145033 A1 WO2021145033 A1 WO 2021145033A1
Authority
WO
WIPO (PCT)
Prior art keywords
gain
analog
signal
correction coefficient
memories
Prior art date
Application number
PCT/JP2020/038430
Other languages
English (en)
Japanese (ja)
Inventor
英範 業天
Original Assignee
ソニーセミコンダクタソリューションズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニーセミコンダクタソリューションズ株式会社 filed Critical ソニーセミコンダクタソリューションズ株式会社
Publication of WO2021145033A1 publication Critical patent/WO2021145033A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/67—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/10—Calibration or testing
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/12—Analogue/digital converters

Definitions

  • This technology relates to a solid-state image sensor. More specifically, the present invention relates to a solid-state image sensor that converts an analog signal into a digital signal for each column, an image pickup device, and a control method for the solid-state image sensor.
  • This technology was created in view of this situation, and aims to reduce the memory capacity of a solid-state image sensor that holds a correction coefficient for each column.
  • the present technology has been made to solve the above-mentioned problems, and the first aspect thereof is to increase or decrease the analog signal by the analog gain selected from the plurality of analog gains to increase or decrease the analog signal.
  • An analog-to-digital converter that converts to a digital signal, multiple memories of different sizes, and a gain correction coefficient that calculates the correction coefficient for correcting the error of the selected analog gain as a gain correction coefficient based on the digital signal. It is provided with a calculation unit and a reduction processing unit that reduces the number of digits of the gain correction coefficient to a value corresponding to the analog gain and holds it in a memory having a size corresponding to the number of digits after reduction among the plurality of memories.
  • a solid-state imaging device and a control method thereof This has the effect of reducing the amount of memory required.
  • the plurality of memories are arranged in a predetermined direction, the sizes of the plurality of memories in the predetermined direction are different from each other, and the sizes of the plurality of memories are perpendicular to each of the predetermined directions.
  • the size of the directions may be substantially the same. This has the effect of reducing the size of the memory in the direction perpendicular to the predetermined direction.
  • the plurality of memories are grouped into two groups, and a predetermined number of memories belonging to each of the two groups are different in size in a predetermined direction from each other and are arranged in the predetermined direction.
  • the size of one of the two groups in the direction perpendicular to the predetermined direction may be different from that of the other. This has the effect of reducing the size of the memory in the predetermined direction.
  • the sizes of the plurality of memories in the predetermined directions are substantially the same, and the sizes of the plurality of memories in the directions perpendicular to the predetermined directions are different from each other, and each of them is a pair. Even if a plurality of sets of memories are arranged in the predetermined direction, the pair of memories are arranged in the vertical direction, and the total size of each of the plurality of sets in the vertical direction is substantially the same. good. This has the effect of reducing the size of the memory in the predetermined direction.
  • the reduction processing unit may reduce the number of digits as the analog gain becomes smaller. This has the effect of reducing the memory capacity according to the analog gain.
  • the digital signal is provided by an input switching unit that inputs one of a predetermined level test signal and a pixel signal as the analog signal to the analog digital converter and the retained gain correction coefficient.
  • the gain correction coefficient calculation unit may further include a correction unit for correcting the above, and the gain correction coefficient calculation unit may calculate the gain correction coefficient from the test signal and the digital signal. This has the effect of holding the gain correction coefficient calculated from the test signal and the digital signal in the memory.
  • the correction unit may extend the number of digits of the retained gain correction coefficient to a predetermined value to perform correction. This has the effect that the correction is performed by the gain correction coefficient with the expanded number of digits.
  • the analog-to-digital converter has a comparator that compares the analog signal with a predetermined lamp signal and outputs a comparison result, and a digital that generates the digital signal based on the comparison result.
  • the comparator includes a signal generation unit, and the comparator amplifies the difference between the predetermined reference voltage and the voltage of the predetermined node and outputs the difference as the comparison result, and between the predetermined node and the input switching unit.
  • a switch for changing the capacitance ratio according to a predetermined control signal is provided, and the plurality of analog gains are grouped into a plurality of gain domains having different capacitance ratios, and each of the plurality of memories has different analog gains.
  • the above gain correction coefficient corresponding to may be retained. This has the effect of maintaining the gain correction coefficient for each gain domain.
  • the second aspect of the present technology is an analog digital converter that increases or decreases the analog signal according to the analog gain selected from the plurality of analog gains and converts the increased or decreased analog signal into a digital signal, and a plurality of analog signals having different sizes.
  • Memory a gain correction coefficient calculation unit that calculates a correction coefficient for correcting the error of the selected analog gain as a gain correction coefficient based on the digital signal, and an analog gain that calculates the number of digits of the gain correction coefficient.
  • An image in which a reduction processing unit that reduces the value according to the above and holds it in a memory of a size corresponding to the number of digits after reduction among the plurality of memories and a digital signal corrected by the held gain correction coefficient are arranged. It is an image pickup apparatus including an image signal processing unit that processes a signal. This brings about the effect that the digital signal is corrected by the gain correction coefficient held in the memory with the reduced capacity.
  • VSL Very Signal Line
  • FIG. 1 is a block diagram showing a configuration example of the image pickup apparatus 100 according to the first embodiment of the present technology.
  • the image pickup device 100 is a device for taking an image of image data (frame), and includes an optical unit 110, a solid-state image sensor 200, and a DSP (Digital Signal Processing) circuit 120. Further, the image pickup apparatus 100 includes a display unit 130, an operation unit 140, a bus 150, a frame memory 160, a storage unit 170, and a power supply unit 180.
  • a digital camera such as a digital still camera, a smartphone having an image pickup function, a personal computer, an in-vehicle camera, or the like is assumed.
  • the optical unit 110 collects the light from the subject and guides it to the solid-state image sensor 200.
  • the solid-state image sensor 200 generates a frame by photoelectric conversion in synchronization with a vertical synchronization signal.
  • the vertical synchronization signal is a periodic signal having a predetermined frequency indicating the timing of imaging.
  • the solid-state image sensor 200 supplies the generated image data to the DSP circuit 120 via the signal line 209.
  • the DSP circuit 120 executes predetermined signal processing on the frame from the solid-state image sensor 200.
  • the DSP circuit 120 outputs the processed frame to the frame memory 160 or the like via the bus 150.
  • the display unit 130 displays a frame.
  • a liquid crystal panel or an organic EL (Electro Luminescence) panel is assumed.
  • the operation unit 140 generates an operation signal according to the operation of the user.
  • the bus 150 is a common route for the optical unit 110, the solid-state image sensor 200, the DSP circuit 120, the display unit 130, the operation unit 140, the frame memory 160, the storage unit 170, and the power supply unit 180 to exchange data with each other.
  • the frame memory 160 holds image data.
  • the storage unit 170 stores various data such as frames.
  • the power supply unit 180 supplies power to the solid-state image sensor 200, the DSP circuit 120, the display unit 130, and the like.
  • FIG. 2 is a diagram showing an example of a laminated structure of the solid-state image sensor 200 according to the first embodiment of the present technology.
  • the solid-state image sensor 200 includes a circuit chip 202 and a pixel chip 201 laminated on the circuit chip 202. These chips are electrically connected via a connection such as a via. In addition to vias, it can also be connected by Cu-Cu bonding or bumps.
  • FIG. 3 is a block diagram showing a configuration example of the solid-state image sensor 200 according to the first embodiment of the present technology.
  • the solid-state image sensor 200 includes a vertical scanning circuit 210, a test signal source 220, a DAC 230, a timing control circuit 240, a pixel array unit 250, an input switching unit 270, a column signal processing unit 280, and an image processing unit 300.
  • a plurality of pixels 260 are arranged in a two-dimensional grid pattern.
  • a set of pixels 260 arranged in a predetermined horizontal direction is referred to as a "row”
  • a set of pixels 260 arranged in a direction perpendicular to the horizontal direction is referred to as a "column” or a “column”.
  • the timing control circuit 240 controls the operation timing of the vertical scanning circuit 210, the DAC 230, and the column signal processing unit 280 in synchronization with the vertical synchronization signal Vsync. Further, an imaging start signal instructing the start of imaging of a moving image including a plurality of consecutive frames is input to the timing control circuit 240.
  • the imaging start signal is generated by, for example, an external host computer (not shown).
  • the vertical scanning circuit 210 selects and drives rows in order, and outputs an analog pixel signal to the input switching unit 270.
  • Pixel 260 generates a pixel signal by photoelectric conversion under the control of the vertical scanning circuit 210. Each of the pixels 260 outputs a pixel signal to the input switching unit 270 via the vertical signal line 269.
  • the test signal source 220 generates a signal of a predetermined level as a test signal according to the control signal Tin from the image processing unit 300, and supplies the signal to the input switching unit 270 via the signal line 229.
  • a DAC for correction provided separately from the DAC 230 is used.
  • the input switching unit 270 selects either the pixel signal or the test signal of the column for each column according to the control of the image processing unit 300.
  • the input switching unit 270 supplies the selected signal as an input signal to the column signal processing unit 280 via the signal line 279.
  • the DAC 230 generates a reference signal by DA (Digital to Analog) conversion and supplies it to the column signal processing unit 280 via a signal line 239.
  • DA Digital to Analog
  • the reference signal for example, a saw blade-shaped lamp signal is used.
  • the column signal processing unit 280 converts an analog input signal into a digital signal for each column using a reference signal.
  • the column signal processing unit 280 supplies a digital signal to the image processing unit 300 via the signal line 289.
  • the image processing unit 300 performs predetermined image processing on a frame in which digital signals are arranged. This image processing includes correction processing for reducing fixed pattern noise.
  • the image processing unit 300 supplies the processed frame to the DSP circuit 120.
  • setting information from the outside is input to the timing control circuit 240 and the image processing unit 300.
  • This setting information is information indicating a setting value such as an analog gain during imaging, and is generated by a host computer or the like.
  • the above-mentioned circuit in the solid-state image sensor 200 is distributed and arranged in the pixel chip 201 and the circuit chip 202.
  • the pixel array unit 250 is provided on the pixel chip 201, and circuits other than the pixel array unit 250 (such as the column signal processing unit 280) are arranged on the circuit chip 202.
  • the circuits arranged in the pixel chip 201 and the circuit chip 202 are not limited to this combination.
  • the pixel array unit 250, the input switching unit 270, and the comparator in the column signal processing unit 280 may be arranged on the pixel chip 201, and other circuits may be arranged on the circuit chip 202.
  • FIG. 4 is a circuit diagram showing a configuration example of the pixel 260 according to the first embodiment of the present technology.
  • the pixel 260 includes a photoelectric conversion element 261, a transfer transistor 262, a reset transistor 263, a floating diffusion layer 264, an amplification transistor 265, and a selection transistor 266.
  • the photoelectric conversion element 261 photoelectrically converts the incident light to generate an electric charge.
  • the transfer transistor 262 transfers an electric charge from the photoelectric conversion element 261 to the floating diffusion layer 264 according to the transfer signal TX from the vertical scanning circuit 210.
  • the reset transistor 263 initializes the charge amount of the floating diffusion layer 264 according to the reset signal RST from the vertical scanning circuit 210.
  • the floating diffusion layer 264 accumulates electric charges and generates a voltage according to the amount of electric charges.
  • the amplification transistor 265 amplifies the voltage of the floating diffusion layer 264.
  • the selection transistor 266 outputs a signal of the amplified voltage as a pixel signal SIG according to the selection signal SEL from the vertical scanning circuit 210. Assuming that the number of columns is N (N is an integer), the pixel signal of the nth (n is an integer of 1 to N) column is transmitted to the input switching unit 270 via the vertical signal line 269-n.
  • the circuit of the pixel 260 is not limited to the one illustrated in the figure as long as it can generate a pixel signal by photoelectric conversion.
  • FIG. 5 is a circuit diagram showing a configuration example of the input switching unit 270 according to the first embodiment of the present technology.
  • the input switching unit 270 includes a plurality of selectors 271.
  • the selector 271 is provided for each column. When the number of columns is N, N selectors 271 are arranged.
  • the selector 271 selects either the pixel signal SIG of the corresponding column or the test signal Tout from the test signal source 220 according to the input switching signal SWin from the image processing unit 300.
  • One of the two input terminals of the selector 271 in the nth column is connected to the pixel array unit 250 via the vertical signal line 269-n, and the other is connected to the test signal source 220 via the signal line 229.
  • the output terminal of the selector 271 in the nth column is connected to the column signal processing unit 280 via the signal line 279-n.
  • the selector 271 outputs the selected signal as an input signal Ain.
  • FIG. 6 is a block diagram showing a configuration example of the column signal processing unit 280 according to the first embodiment of the present technology.
  • the column signal processing unit 280 includes a plurality of ADC 281s. ADC 281 is provided for each row. When the number of columns is N, N ADC281s are arranged.
  • the ADC 281 converts the analog input signal Ain of the corresponding column into the digital signal Dout.
  • the ADC 281 includes a comparator 400 and a counter 282.
  • the comparator 400 compares the reference signal RMP with the input signal Ain in the corresponding column.
  • the comparator 400 supplies the comparison result CMP to the counter 282.
  • the auto zero signal AZ from the timing control circuit 240 and the capacitance ratio control signal Gctrl from the image processing unit 300 are input to the comparator 400.
  • the capacitance ratio control signal Gctrl is a signal for controlling the analog gain of the ADC 281 by switching the capacitance ratio.
  • the counter 282 counts the count value over a period until the comparison result CMP is inverted according to the control of the timing control circuit 240.
  • the counter 282 supplies a signal indicating the count value to the image processing unit 300 as a digital signal Dout.
  • the counter 282 is an example of the digital signal generation unit described in the claims.
  • the ADC 281 that performs AD conversion by the comparator 400 and the counter 282 is called a single slope type ADC.
  • an ADC other than the single slope type such as a sequential comparison type can be arranged as the ADC 281.
  • a sequential comparison type ADC is arranged, a SAR (Successive Approximation Register) logic circuit and a register are arranged instead of the counter 282.
  • This SAR logic circuit obtains a value of a reference signal that approximates the input signal based on the comparison result CMP, and generates a DAC control signal for updating the reference signal to that value.
  • the register holds a digital signal in which the comparison results are arranged and a DAC control signal, and outputs the digital signal to the image processing unit 300 while outputting the DAC control signal to the DAC 230.
  • FIG. 7 is a circuit diagram showing a configuration example of the comparator 400 according to the first embodiment of the present technology.
  • a capacitance ratio switching circuit 410 and a differential amplifier circuit 430 are arranged in the comparator 400.
  • the capacity ratio switching circuit 410 includes a predetermined number of switches such as switches 411 to 415 and a plurality of capacities such as capacities 416 to 421.
  • One end of the capacities 416 to 421 is commonly connected to the node 422.
  • the other end of the capacitance 416 is connected to the input switching unit 270 via the signal line 279-n, and the other end of the capacitance 421 is connected to the DAC 230 via the signal line 239.
  • the switch 411 opens and closes the path between the other end of the capacitance 416 and the other end of the capacitance 417 according to the capacitance ratio control signal Gctrl.
  • the switch 412 opens and closes the path between the other end of the capacitance 417 and the other end of the capacitance 418 according to the capacitance ratio control signal Gctrl.
  • the switch 413 opens and closes the path between the other end of the capacitance 418 and the other end of the capacitance 419 according to the capacitance ratio control signal Gctrl.
  • the switch 414 opens and closes a path between the other end of the capacitance 419 and the other end of the capacitance 420 according to the capacitance ratio control signal Gctrl.
  • the switch 415 opens and closes a path between the other end of the capacitance 420 and the other end of the capacitance 421 according to the capacitance ratio control signal Gctrl.
  • the image processing unit 300 controls only one of the switches 411 to 415 to be in the open state and the rest to the closed state by the capacitance ratio control signal Gctrl. By this control, the combined capacitance of the capacitance inserted between the signal line 279-n on the vertical signal line side and the node 422 and the combined capacitance inserted between the signal line 239 on the lamp signal side and the node 422 are combined. The capacity ratio with the capacity is changed.
  • the combined capacitance on the vertical signal line side is referred to as "VSL side capacitance”
  • the combined capacitance on the lamp signal side is referred to as "lamp side capacitance”.
  • the image processing unit 300 can switch the capacitance ratio in five stages by controlling five switches.
  • the image processing unit 300 can switch the capacity ratio to a plurality of stages other than the 5 stages. Assuming that the number of stages is M (M is an integer), M switches and M + 1 capacitances are arranged in the capacitance ratio switching circuit 410.
  • the capacity value of the capacity 416 is the largest, and the capacity values of the capacities 417 to 421 are set to be the same.
  • the respective capacity values of the capacities 416 to 421 can be set to arbitrary values.
  • the capacity 440 holds a predetermined reference voltage VSH.
  • the differential amplifier circuit 430 amplifies the difference between the voltage of the node 422 and the reference voltage VSH.
  • the differential amplifier circuit 430 includes pMOS transistors 431 and 432, auto-zero switches 436 and 437, and nMOS transistors 433 to 435.
  • the pMOS transistors 431 and 432 are connected in parallel to the power supply.
  • the gate of the pMOS transistor 431 is connected to its own drain and the gate of the pMOS transistor 432.
  • the drain of the nMOS transistor 433 is connected to the pMOS transistor 431, and the source is connected to the common node. Further, the gate of the nMOS transistor 433 is connected to the node 422. The drain of the nMOS transistor 434 is connected to the pMOS transistor 432 and the source is connected to the common node. Further, the gate of the nMOS transistor 434 is connected to the capacitance 440.
  • the nMOS transistor 435 is inserted between the common node and the ground terminal, and a predetermined bias voltage Vbias is input to the gate.
  • the auto zero switch 436 short-circuits between the drain and the gate of the nMOS transistor 433 according to the auto zero signal AZ from the timing control circuit 240.
  • the auto zero switch 437 short-circuits between the drain and the gate of the nMOS transistor 434 according to the auto zero signal AZ.
  • comparison result CMP is output to the counter 282 from the connection point of the pMOS transistor 432 and the nMOS transistor 434.
  • a lamp signal whose level increases with the passage of time is input as a reference signal RMP to the comparator 400 having the configuration illustrated in the figure.
  • FIG. 8 is a diagram showing an example of VSL side capacity and lamp side capacity for each gain domain in the first embodiment of the present technology.
  • the analog gain of the ADC 281 can be controlled by the slope inclination of the reference signal RMP (lamp signal) and the capacitance ratio of the VSL side capacitance and the lamp side capacitance. The gentler the slope, the higher the analog gain. In addition, the analog gain increases or decreases according to the capacitance ratio.
  • K K is an integer
  • M step an analog gain in K ⁇ M step can be realized.
  • the analog gain can be grouped into 5 gain domains d0 to d4. Within each gain domain, the capacitance ratio is set to be the same, and the analog gain is controlled in multiple stages by the slope inclination.
  • the host computer measures the amount of ambient light, and the higher the amount of metering, the lower the analog gain.
  • the vertical axis of the figure shows the VSL side capacity or the lamp side capacity
  • the horizontal axis shows the analog gain.
  • the VSL side capacitance is the same as the lamp side capacitance.
  • the VSL side capacitance is larger than the lamp side capacitance. The larger the VSL side capacitance, the larger the analog gain.
  • FIG. 9 is a block diagram showing a configuration example of the image processing unit 300 according to the first embodiment of the present technology.
  • the image processing unit 300 includes a gain error measuring unit 310, a correction value calculation unit 320, a storage unit 330, a selector 340, a correction unit 350, and a controller 360.
  • the selector 340 outputs the digital signal Dout from the column signal processing unit 280 to either the gain error measuring unit 310 or the correction unit 350 according to the output switching signal SWout from the controller 360.
  • the gain error measuring unit 310 measures a parameter representing an analog gain error from a digital signal from the selector 340.
  • an error may occur in each analog gain of the ADC 281, and the error is often different for each column. Fixed pattern noise can occur due to the relative gain error between the columns.
  • the analog gain error is caused by, for example, product variation of the analog circuit in the comparator 400 and deterioration over time. Therefore, the gain error measuring unit 310 measures the brightness level error a plurality of times for each column and each gain domain in order to make the analog gain uniform, and obtains the relative gain error between the columns based on them. ..
  • the number of AD conversions for obtaining the analog gain is set as the number of samples according to the setting information from the host computer. Then, the gain error measuring unit 310 supplies the obtained error as measurement data to the correction value calculation unit 320.
  • the gain error measurement unit 310 generates an update pulse based on the number of samples from the controller 360, and supplies the update pulse together with the measurement data to the correction value calculation unit 320.
  • This update pulse is a signal that indicates the update timing of the correction value.
  • the correction value calculation unit 320 obtains a correction value for correcting an analog gain error for each column and each gain domain based on the measurement data.
  • the correction value includes a value of the gain correction coefficient a for correcting the analog gain error and a value of the offset correction coefficient b for correcting the offset error.
  • the correction value calculation unit 320 stores the obtained correction value (gain correction coefficient and offset correction coefficient) in the storage unit 330. Further, the correction value calculation unit 320 is input with the measurement target domain information indicating the gain domain to be measured by the gain error measurement unit 310. The correction value calculation unit 320 updates the correction value of the gain domain indicated by the measurement target domain information in synchronization with the update pulse.
  • the storage unit 330 stores the correction value for each column and each gain domain.
  • the correction unit 350 corrects the digital signal from the selector 340 according to the correction value.
  • the correction target domain information indicating the gain domain to be corrected is input to the correction unit 350 by the controller 360.
  • the correction unit 350 starts from the storage unit 330 in the mth column in the nth column.
  • the gain correction coefficient a and the offset correction coefficient b of the gain domain of the above are read out.
  • the digital signal Dout is corrected by the following equation.
  • Dout' Dout ⁇ a + b ⁇ ⁇ ⁇ Equation 1 In the above equation, Dout'indicates the corrected digital signal.
  • the correction unit 350 supplies the image data (frame) in which the digital signal Dout'obtained by the equation 1 is arranged to the DSP circuit 120.
  • the controller 360 controls the calibration. First, the controller 360 performs start-up processing for calculating the correction value before the start of the video period, which is the period for generating the frame. In this start-up process, the controller 360 controls the input switching unit 270 by the input switching signal SWin to input the test signal. Further, the controller 360 controls the selector 340 by the output switching signal SWout to output a digital signal to the gain error measuring unit 310. Further, the controller 360 controls the comparator 400 by the capacitance ratio control signal Gctrl to sequentially switch to each of the M gain domains. Further, the controller 360 causes the correction value calculation unit 320 to calculate the correction values of the M gain domains in order based on the measurement target domain information.
  • the controller 360 inputs a pixel signal by the input switching signal SWin, controls the selector 340 by the output switching signal SWout, and outputs a digital signal to the correction unit 350. Further, the controller 360 is switched to the gain domain corresponding to the analog gain indicated by the setting information by the capacitance ratio control signal Gctrl. Further, the controller 360 corrects the digital signal by the correction value of the gain domain corresponding to the analog gain indicated by the setting information by the correction target domain information.
  • the controller 360 executes the division processing performed by dividing the processing performed in the startup processing.
  • the controller 360 causes the input switching signal SWin to input a test signal, and the output switching signal SWout to output a digital signal to the gain error measuring unit 310.
  • the controller 360 controls the comparator 400 by the capacitance ratio control signal Gctrl to switch to any of the M gain domains.
  • the controller 360 causes the correction value calculation unit 320 to calculate the correction value of any of the M gain domains based on the measurement target domain information. The controller 360 does not have to execute this division process when there is little deterioration over time.
  • the controller 360 supplies the number of samples indicated by the setting information to the gain error measuring unit 310, controls the test signal source 220 by the control signal Tin, and generates test signals for the number of samples. Let me.
  • the setting information includes the analog gain set in the video period, the number of samples in the start-up processing and the division processing, and the drive mode.
  • This drive mode indicates, for example, one of a plurality of modes in which the resolution of the frame to be read and the reading range are different.
  • FIG. 10 is a block diagram showing a configuration example of the gain error measuring unit 310 according to the first embodiment of the present technology.
  • the gain error measurement unit 310 includes a sample number counter 311, an update pulse generation unit 312, a gain calculation unit 313, and an offset calculation unit 314.
  • the sample number counter 311 counts the number of digital signals input from the selector 340 as the number of samples.
  • the sample number counter 311 supplies the number of samples to the update pulse generation unit 312.
  • the update pulse generation unit 312 generates an update pulse based on the number of samples counted by the sample number counter 311.
  • the total number of samples and the number of divided samples from the controller 360 are input to the update pulse generation unit 312.
  • the update pulse generation unit 312 generates an update pulse when the total number of samples reaches the total number of samples in the start-up process, and supplies the update pulse to the correction value calculation unit 320. Further, in the division process, the update pulse generation unit 312 generates an update pulse every time the number of samples reaches the number of divided samples and supplies the update pulse to the correction value calculation unit 320.
  • the number of divided samples means the total number of samples for each gain domain acquired over a predetermined frame in the divided process.
  • the gain calculation unit 313 calculates the brightness level error for each column and each gain domain.
  • Ain H is a high level input signal
  • Ain L is a low level input signal.
  • Dout H is a digital signal corresponding to Ain H
  • Dout L is a digital signal corresponding to Ain H.
  • the gain calculation unit 313 calculates a statistic (average, total, etc.) of the slope g for each gain domain and each column as STg.
  • STg cn_dm be the statistic of the mth gain domain in the nth column.
  • the statistic STg cn_dm is calculated for all gain domains.
  • the statistic STg cn_dm is calculated for each frame for the gain domain to be measured.
  • the offset calculation unit 314 calculates the offset for each column and each gain domain.
  • the offset calculation unit 314 calculates the offset for each column in the gain domain.
  • the offset calculation unit 314 calculates the offset statistic (average, total, etc.) as ST Azure for each gain domain and each column. Let ST réelle cn_dm be the statistic ST réelle of the mth gain domain in the nth column.
  • the gain calculation unit 313 and the offset calculation unit 314 supply the data including the calculation result to the correction value calculation unit 320 as measurement data.
  • the gain error measuring unit 310 performs an offset calculation in addition to the gain calculation, but if the error is small, the gain calculation may be performed without performing this calculation.
  • FIG. 11 is a block diagram showing a configuration example of the correction value calculation unit 320 according to the first embodiment of the present technology.
  • the correction value calculation unit 320 includes a gain correction coefficient calculation unit 321 and a reduction processing unit 322.
  • the reduction processing unit 322 includes a subtractor 323 and a demultiplexer 324, a plurality of clip processing units 325, and a plurality of decimal digit reduction units 326.
  • the clip processing unit 325 is provided for each gain domain.
  • the decimal digit reduction unit 326 is provided for each gain domain for the gain domains d0 to dM-2.
  • the gain correction coefficient calculation unit 321 calculates the gain correction coefficient a for each column and each gain domain.
  • the gain correction coefficient calculation unit 321 calculates the average value of the statistics STg cn_dm of all the columns as the target value AVGg d0 in the gain domain d0. do. Then, the gain correction coefficient calculation unit 321 calculates AVGg d0 / STg cn_dm as the gain correction coefficient a for each column.
  • the gain correction coefficient calculation unit 321 performs a calculation for each gain domain of the measurement target.
  • the gain correction coefficient calculation unit 321 sets the average value of the statistic STg cn_dm of all the columns of the gain domain dm as the target value AVGg d0 of the gain domain d0 so that the linearity of the analog gain can be obtained in the gain domain d1 and later. Correct based on the standard. Then, the gain correction coefficient calculation unit 321 calculates the corrected average value as the target value AVGg dm of the gain domain dm, and AVGg dm / STg cn_dm as the gain correction coefficient a for each column. Let a cn_dm be the gain correction coefficient of the m-th gain domain in the nth column.
  • the gain correction coefficient calculation unit 321 outputs the calculated gain correction coefficient a cn_dm to the subtractor 323 in synchronization with the update pulse.
  • the subtractor 323 reduces the integer part of the gain correction coefficient by subtracting a predetermined value from the gain correction coefficient a cn_dm. For example, when the gain correction coefficient is a value around "1", "1" is subtracted. The subtractor 323 supplies a decimal part of the gain correction coefficient obtained by the subtraction to the demultiplexer 324.
  • the demultiplexer 324 supplies a decimal part from the subtractor 323 to the clip processing unit 325 corresponding to the gain domain indicated by the measurement target domain information.
  • the clip processing unit 325 performs clip processing that limits the value of the decimal part within a predetermined range.
  • the clip processing unit 325 related to the gain domains d0 to dM-2 supplies the decimal part after the clip processing to the corresponding decimal digit reduction unit 326.
  • the clip processing unit 325 related to the gain domain dM-1 outputs the decimal part after the clip processing to the storage unit 330 as it is.
  • the decimal digit reduction unit 326 reduces the number of decimal places after the clip process to a value corresponding to the analog gain.
  • the decimal digit reduction unit 326 causes the storage unit 330 to hold the decimal part after the decimal digit reduction as fcn_dm.
  • the reduction processing unit 322 reduces the integer part of the gain correction coefficient and reduces the decimal digits except for the gain domain dM-1, but the reduction method is not limited to this.
  • the reduction processing unit 322 can also reduce a part of the integer digits of the gain correction coefficient in all gain domains.
  • the reduction processing unit 322 can reduce the integer part and a part of the decimal digits of the gain correction coefficient in all the gain domains.
  • correction value calculation unit 320 further calculates the offset correction coefficient as necessary, and causes the storage unit 330 to hold the offset correction coefficient.
  • the circuit for calculating the offset correction coefficient is omitted.
  • FIG. 12 is a graph showing an example of the relationship between the input value and the output value of the clip processing unit 325 according to the first embodiment of the present technology.
  • the horizontal axis represents the input value of the clip processing unit 325
  • the vertical axis represents the output value of the clip processing unit 325.
  • the clip processing unit 325 when the input value exceeds a predetermined upper limit value MAX, the clip processing unit 325 outputs the upper limit value MAX as an output value instead of the input value. Further, when the input value is less than the predetermined lower limit value MIN, the clip processing unit 325 outputs the lower limit value MIN as an output value instead of the input value. When the input value is equal to or greater than the lower limit value MIN and equal to or less than the upper limit value MAX, the input value is output as it is as an output value. By this clipping process, the value of the decimal part is limited to the range from the lower limit value MIN to the upper limit value MAX.
  • FIG. 13 is a block diagram showing a configuration example of the storage unit 330 according to the first embodiment of the present technology.
  • a plurality of memories 331 are arranged in the storage unit 330 in a predetermined X direction.
  • the memory 331 is provided for each gain domain.
  • the memory 331 corresponding to the mth gain domain is hereinafter referred to as “memory # m”.
  • the memory #m holds a decimal part f cn_dm of the gain correction coefficient of the mth gain domain. As described above, since the gain correction coefficient is calculated for each column in each gain domain, N fractional parts f cn_dm are held in each of the memory # m, where N is the number of columns. These decimal parts f cn_dm are arranged in the Y direction perpendicular to the X direction.
  • each of the M memories 331 in the X direction is set to a value corresponding to the number of digits of the decimal part f cn_dm to be held.
  • the size of the mth memory 331 in the X direction is hereinafter referred to as X m . Assuming that the number of digits in the binary notation of the fractional part f cn_dm is W m , the size X m is a value proportional to W m.
  • the physical size Y of each of the M memories 331 in the Y direction is substantially the same, and is a value proportional to N, which is the number of columns.
  • substantially the same means a case where the sizes are exactly the same, or a case where the difference between the sizes is within a predetermined value.
  • the reduction processing unit 322 reduces a part of the integer digits of the gain correction coefficient, the remaining integer digits and the decimal part are held in the memory 331 at the maximum.
  • the reduction processing unit 322 reduces the integer part and a part of the decimal digits of the gain correction coefficient, the remaining decimal digits are held in the memory 331 at the maximum.
  • the memory # 0 to the memory # M-1 are arranged in ascending order in the X direction, starting from the memory # 0 having the smallest size. Conversely, if memory # M-1 is considered as the starting point, they are arranged in descending order.
  • the storage unit 330 further holds an offset correction coefficient as needed.
  • the memory that holds the offset correction coefficient is omitted in the figure.
  • the memory arrangement method is not limited to ascending order.
  • a plurality of pairs of memories # m having substantially the same total size in each X direction can be arranged in a predetermined order.
  • FIG. 15 is a diagram showing an example of processing of the correction value calculation unit 320 in the first embodiment of the present technology.
  • a is a diagram showing an example of processing for the gain correction coefficient of the gain domain d0.
  • Reference numeral b in the figure is an example of the gain correction coefficient after the reduction of the gain domains d0 to d6.
  • the value of "1.0000000101101” in binary notation is calculated as the gain correction coefficient a cn_d0 in the gain domain d0.
  • the correction value calculation unit 320 subtracts “1” from the gain correction coefficient a cn_d0 to obtain “0.0000000101101”. Further, a sign bit S indicating a sign after subtraction is generated.
  • the correction value calculation unit 320 performs a clip process to reduce the first to sixth decimal places to "101101".
  • the correction value calculation unit 320 can reduce the large number of digits and reduce the dynamic range of the decimal part as the analog gain becomes smaller.
  • the number of digits of the gain correction coefficient in other words, reducing the dynamic range
  • the required size of the memory 331 can be reduced.
  • the number of gain domains is 7, the decimal digit before reduction is 12 digits, and the digit to be reduced in the mth gain domain is up to (6-m) digits.
  • the 0th memory # 0 which has the smallest size, holds 7 bits of data for each column, including the code bit S.
  • Memory # 1 holds 8 bits of data for each column, including the code bit S.
  • the data size is increased by one bit, and the memory # 6, which has the largest size, holds 13 bits of data for each column, including the code bit S.
  • the memory capacity can be reduced as compared with the comparative example. Since the physical size of the memory is proportional to the capacity, the size can be reduced by reducing the capacity.
  • FIG. 16 is a block diagram showing a configuration example of the correction unit 350 according to the first embodiment of the present technology.
  • the correction unit 350 includes a plurality of digit number expansion units 351, a multiplexer 352, an adder 353, and a multiplier 354.
  • the digit number expansion unit 351 is provided for all gain domains other than the gain domain dM-1 in which decimal digits are not reduced.
  • the digit number expansion unit 351 expands the number of digits of the fractional part fcn_dm of the gain correction coefficient of the corresponding gain domain to a predetermined value by zero padding or the like.
  • the digit number expansion unit 351 supplies the expanded decimal part to the multiplexer 352.
  • the digit number expansion unit 351 expands the part of the integer digits and the decimal digits.
  • the digit number expansion unit 351 expands the part of the decimal digits. ..
  • the decimal part of the gain domain dM-1 and the fractional part from each of the digit expansion units 351 are input to the multiplexer 352.
  • a fractional part corresponding to the gain domain indicated by the correction target domain information from the controller 360 is selected and supplied to the adder 353.
  • the adder 353 adds a reduced integer part (such as "1") to the decimal part from the multiplexer 352.
  • the adder 353 supplies the addition result to the multiplier 354.
  • the multiplier 354 multiplies the addition result of the adder 353 with the digital signal in the frame from the selector 340. By this multiplication, the result of correcting the digital signal by the gain correction coefficient before the reduction of the integer part is obtained.
  • the multiplier 354 outputs the calculation result to the DSP circuit 120 as a corrected digital signal.
  • the correction unit 350 makes corrections using an offset coefficient as necessary.
  • the circuit that corrects by the offset coefficient is omitted. Further, the correction unit 350 can further perform dither processing.
  • FIG. 17 is a diagram for explaining a method of correcting an analog gain error in the first embodiment of the present technology.
  • Pixel 260 produces a pixel signal SIG
  • test signal source 220 produces a predetermined level (high level or low level) test signal Tout.
  • the selector 271 in the input switching unit 270 selects either the test signal Tout or the pixel signal SIG of the corresponding column according to the input switching signal SWin, and supplies the input signal Ain to the ADC 281 of the corresponding column.
  • the ADC 281 increases or decreases the analog input signal Ain according to the analog gain selected by the capacitance ratio control signal Gctrl among the plurality of analog gains, and converts the increased or decreased input signal Ain into a digital signal Dout.
  • the selector 340 selects either the gain error measuring unit 310 or the correction unit 350 as the output destination according to the output switching signal SWout, and outputs the digital signal Dout.
  • the gain error measuring unit 310 measures the analog gain and offset for each column and each gain domain in order to correct the error of the analog gain and the offset, and supplies the measurement data to the correction value calculation unit 320.
  • the gain correction coefficient calculation unit 321 in the correction value calculation unit 320 is for correcting the analog gain error for each column and each gain domain based on the test signal Tout (input) and the digital signal Dout (output). Calculate the gain correction coefficient.
  • the reduction processing unit 322 reduces the number of digits of the gain correction coefficient to a value corresponding to the corresponding analog gain, and holds the memory in a memory having a size corresponding to the number of digits after the reduction among the plurality of memories 331.
  • the correction unit 350 corrects the digital signal Dout with the output correction value (gain correction coefficient, etc.). By this correction, it is possible to remove the vertical streak-shaped fixed pattern noise caused by the variation of the analog gain for each column.
  • FIG. 18 is a flowchart showing an example of the operation of the solid-state image sensor 200 according to the first embodiment of the present technology.
  • the operation of the solid-state image sensor 200 is started, for example, when a predetermined application for capturing image data is executed.
  • the column signal processing unit 280 in the solid-state image sensor 200 AD-converts the test signal for all of the gain domains (step S901).
  • the gain error measuring unit 310 measures the gain error for each column and each gain domain (step S902).
  • the correction value calculation unit 320 calculates the correction value for each column and each gain domain, and causes the storage unit 330 to hold the correction value (step S903).
  • the column signal processing unit 280 AD-converts the pixel signals of all the pixels to generate a frame (step S904).
  • the correction unit 350 corrects the digital signal in the frame according to the correction value (step S905).
  • the column signal processing unit 280 AD-converts the test signal for the gain domain to be measured (step S906).
  • the gain error measuring unit 310 measures the gain error for each column for the gain domain (step S907).
  • the correction value calculation unit 320 determines whether or not an update pulse has been generated (step S908). When the update pulse is not generated (step S908: No), the solid-state image sensor 200 repeats steps S904 and subsequent steps.
  • step S908 when an update pulse is generated (step S908: Yes), the correction value calculation unit 320 calculates a correction value for each column for the gain domain to be corrected, and updates based on the calculation result (step S909). After step S909, the solid-state image sensor 200 repeatedly executes step S904 and subsequent steps.
  • the solid-state image sensor 200 does not have to perform the division process when there is little deterioration over time.
  • steps S906 to S909 are not executed, and after step S905, steps S904 and subsequent steps are repeatedly executed.
  • the reduction processing unit 322 reduces the number of digits of the gain correction coefficient according to the analog gain, so that the number of digits is not changed as compared with the case where the number of digits is not changed.
  • the required memory capacity can be reduced.
  • Second Embodiment> In the first embodiment described above, a plurality of memories 331 are arranged in the X direction in the storage unit 330, but in this arrangement, the storage unit 330 is arranged in the X direction as the number of the memories 331 increases. May increase size.
  • the storage unit 330 of the second embodiment is different from the first embodiment in that the arrangement of the memory 331 is changed to reduce the size in the X direction.
  • FIG. 20 is a block diagram showing a configuration example of the storage unit 330 according to the second embodiment of the present technology.
  • the M memories 331 are grouped into two groups. Let the number of one of the two groups be K (K is an integer less than M-1). In one of the groups, memories # 0 to # K-1 are arranged in the X direction. In the other group, the remaining memories # K to # M-1 are arranged in the X direction.
  • Each Y-direction size of the memory # 0 to # K-1 is substantially identical to the size and Y 1. Further, the sizes of the memories # 0 to # K-1 in the X direction are different, and the values correspond to the analog gain.
  • the sizes of the memories # K to # M-1 in the Y direction are substantially the same, and the size is defined as Y 2 .
  • This Y 2 is set to a value larger than Y 1.
  • the size X K in the X direction is smaller than the X K-1 of the memory # K-1 by the amount that the size in the Y direction is increased. For example, if the number of digits of the binary representation of the decimal part of the memory #K and W K, the size X K in the X direction is set to a value proportional to W K ⁇ (Y 1 / Y 2). Further, the sizes of the memories # K to # M-1 in the X direction are different, and the values correspond to the analog gain.
  • the M memories 331 are divided into two groups having different sizes in the Y direction and the memories 331 are arranged in the X direction in each group, the size of the storage unit 330 in the X direction can be reduced. Can be done.
  • the M memories 331 are divided into two groups having different sizes in the Y direction, and the memories 331 are arranged in the X direction in each group.
  • the size in the X direction can be reduced.
  • the M memories 331 are divided into two groups having different sizes in the Y direction, and the memories 331 are arranged in the X direction in each group. However, in this array, the size of the memory 331 in the X direction is different.
  • the storage unit 330 of the modified example of this second embodiment is different from the first embodiment in which the arrangement of the memory 331 is changed and the sizes in the X direction are aligned.
  • FIG. 21 is a block diagram showing a configuration example of the storage unit 330 according to the second embodiment of the present technology.
  • the sizes of the memories 331 in the X direction are substantially the same, and the size in the Y direction is a value corresponding to the analog gain.
  • a plurality of pairs of memories 331 are arranged in the X direction in a predetermined order. In each set, the pair of memories are arranged in the Y direction, and the total size of each set in the Y direction is substantially the same.
  • the sizes of the respective memories 331 in the X direction can be made substantially the same.
  • the technology according to the present disclosure can be applied to various products.
  • the technology according to the present disclosure is realized as a device mounted on a moving body of any kind such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility, an airplane, a drone, a ship, and a robot. You may.
  • FIG. 22 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile control system to which the technique according to the present disclosure can be applied.
  • the vehicle control system 12000 includes a plurality of electronic control units connected via the communication network 12001.
  • the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside information detection unit 12030, an in-vehicle information detection unit 12040, and an integrated control unit 12050.
  • a microcomputer 12051, an audio image output unit 12052, and an in-vehicle network I / F (interface) 12053 are shown as a functional configuration of the integrated control unit 12050.
  • the drive system control unit 12010 controls the operation of the device related to the drive system of the vehicle according to various programs.
  • the drive system control unit 12010 provides a driving force generator for generating the driving force of the vehicle such as an internal combustion engine or a driving motor, a driving force transmission mechanism for transmitting the driving force to the wheels, and a steering angle of the vehicle. It functions as a control device such as a steering mechanism for adjusting and a braking device for generating a braking force of a vehicle.
  • the body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs.
  • the body system control unit 12020 functions as a keyless entry system, a smart key system, a power window device, or a control device for various lamps such as headlamps, back lamps, brake lamps, blinkers or fog lamps.
  • the body system control unit 12020 may be input with radio waves transmitted from a portable device that substitutes for the key or signals of various switches.
  • the body system control unit 12020 receives inputs of these radio waves or signals and controls a vehicle door lock device, a power window device, a lamp, and the like.
  • the vehicle outside information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000.
  • the image pickup unit 12031 is connected to the vehicle exterior information detection unit 12030.
  • the vehicle outside information detection unit 12030 causes the image pickup unit 12031 to capture an image of the outside of the vehicle and receives the captured image.
  • the vehicle exterior information detection unit 12030 may perform object detection processing or distance detection processing such as a person, a vehicle, an obstacle, a sign, or a character on the road surface based on the received image.
  • the imaging unit 12031 is an optical sensor that receives light and outputs an electric signal according to the amount of the light received.
  • the image pickup unit 12031 can output an electric signal as an image or can output it as distance measurement information. Further, the light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.
  • the in-vehicle information detection unit 12040 detects the in-vehicle information.
  • a driver state detection unit 12041 that detects the driver's state is connected to the in-vehicle information detection unit 12040.
  • the driver state detection unit 12041 includes, for example, a camera that images the driver, and the in-vehicle information detection unit 12040 determines the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041. It may be calculated, or it may be determined whether or not the driver has fallen asleep.
  • the microcomputer 12051 calculates the control target value of the driving force generator, the steering mechanism, or the braking device based on the information inside and outside the vehicle acquired by the vehicle exterior information detection unit 12030 or the vehicle interior information detection unit 12040, and the drive system control unit.
  • a control command can be output to 12010.
  • the microcomputer 12051 realizes ADAS (Advanced Driver Assistance System) functions including vehicle collision avoidance or impact mitigation, follow-up driving based on inter-vehicle distance, vehicle speed maintenance driving, vehicle collision warning, vehicle lane deviation warning, and the like. It is possible to perform cooperative control for the purpose of.
  • ADAS Advanced Driver Assistance System
  • the microcomputer 12051 controls the driving force generator, the steering mechanism, the braking device, and the like based on the information around the vehicle acquired by the vehicle exterior information detection unit 12030 or the vehicle interior information detection unit 12040. It is possible to perform coordinated control for the purpose of automatic driving, etc., which runs autonomously without depending on the operation.
  • the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the vehicle exterior information detection unit 12030.
  • the microcomputer 12051 controls the headlamps according to the position of the preceding vehicle or the oncoming vehicle detected by the external information detection unit 12030, and performs coordinated control for the purpose of anti-glare such as switching the high beam to the low beam. It can be carried out.
  • the audio image output unit 12052 transmits an output signal of at least one of audio and an image to an output device capable of visually or audibly notifying information to the passenger or the outside of the vehicle.
  • an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are exemplified as output devices.
  • the display unit 12062 may include, for example, at least one of an onboard display and a heads-up display.
  • FIG. 23 is a diagram showing an example of the installation position of the imaging unit 12031.
  • the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.
  • the imaging units 12101, 12102, 12103, 12104, 12105 are provided at positions such as the front nose, side mirrors, rear bumpers, back doors, and the upper part of the windshield in the vehicle interior of the vehicle 12100, for example.
  • the imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the upper part of the windshield in the vehicle interior mainly acquire an image in front of the vehicle 12100.
  • the imaging units 12102 and 12103 provided in the side mirrors mainly acquire images of the side of the vehicle 12100.
  • the imaging unit 12104 provided on the rear bumper or the back door mainly acquires an image of the rear of the vehicle 12100.
  • the imaging unit 12105 provided on the upper part of the windshield in the vehicle interior is mainly used for detecting a preceding vehicle, a pedestrian, an obstacle, a traffic light, a traffic sign, a lane, or the like.
  • FIG. 23 shows an example of the photographing range of the imaging units 12101 to 12104.
  • the imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose
  • the imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively
  • the imaging range 12114 indicates the imaging range of the imaging units 12102 and 12103.
  • the imaging range of the imaging unit 12104 provided on the rear bumper or the back door is shown. For example, by superimposing the image data captured by the imaging units 12101 to 12104, a bird's-eye view image of the vehicle 12100 as viewed from above can be obtained.
  • At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information.
  • at least one of the image pickup units 12101 to 12104 may be a stereo camera composed of a plurality of image pickup elements, or may be an image pickup element having pixels for phase difference detection.
  • the microcomputer 12051 uses the distance information obtained from the imaging units 12101 to 12104 to obtain the distance to each three-dimensional object within the imaging range 12111 to 12114 and the temporal change of this distance (relative velocity with respect to the vehicle 12100). By obtaining, it is possible to extract as the preceding vehicle a three-dimensional object that is the closest three-dimensional object on the traveling path of the vehicle 12100 and that travels in substantially the same direction as the vehicle 12100 at a predetermined speed (for example, 0 km / h or more). can.
  • a predetermined speed for example, 0 km / h or more.
  • the microcomputer 12051 can set an inter-vehicle distance to be secured in front of the preceding vehicle in advance, and can perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), and the like. In this way, it is possible to perform coordinated control for the purpose of automatic driving or the like in which the vehicle travels autonomously without depending on the operation of the driver.
  • the microcomputer 12051 converts three-dimensional object data related to a three-dimensional object into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on the distance information obtained from the imaging units 12101 to 12104. It can be classified and extracted and used for automatic avoidance of obstacles. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that can be seen by the driver of the vehicle 12100 and obstacles that are difficult to see. Then, the microcomputer 12051 determines the collision risk indicating the risk of collision with each obstacle, and when the collision risk is equal to or higher than the set value and there is a possibility of collision, the microcomputer 12051 is used via the audio speaker 12061 or the display unit 12062. By outputting an alarm to the driver and performing forced deceleration and avoidance steering via the drive system control unit 12010, driving support for collision avoidance can be provided.
  • At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays.
  • the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian is present in the captured image of the imaging units 12101 to 12104.
  • pedestrian recognition includes, for example, a procedure for extracting feature points in an image captured by an imaging unit 12101 to 12104 as an infrared camera, and pattern matching processing for a series of feature points indicating the outline of an object to determine whether or not the pedestrian is a pedestrian. It is done by the procedure to determine.
  • the audio image output unit 12052 When the microcomputer 12051 determines that a pedestrian is present in the captured images of the imaging units 12101 to 12104 and recognizes the pedestrian, the audio image output unit 12052 outputs a square contour line for emphasizing the recognized pedestrian.
  • the display unit 12062 is controlled so as to superimpose and display. Further, the audio image output unit 12052 may control the display unit 12062 so as to display an icon or the like indicating a pedestrian at a desired position.
  • the above is an example of a vehicle control system to which the technology according to the present disclosure can be applied.
  • the technique according to the present disclosure can be applied to, for example, the imaging unit 12031 among the configurations described above.
  • the image pickup apparatus 100 of FIG. 1 can be applied to the image pickup unit 12031.
  • the present technology can have the following configurations.
  • An analog-to-digital converter that increases or decreases the analog signal according to the selected analog gain from a plurality of analog gains and converts the increased or decreased analog signal into a digital signal.
  • a gain correction coefficient calculation unit that calculates a correction coefficient for correcting the error of the selected analog gain as a gain correction coefficient based on the digital signal, and a gain correction coefficient calculation unit.
  • a solid-state image sensor including a reduction processing unit that reduces the number of digits of the gain correction coefficient to a value corresponding to the analog gain and holds the memory in a size corresponding to the number of digits after reduction among the plurality of memories.
  • the plurality of memories are arranged in a predetermined direction.
  • the sizes of the plurality of memories in the predetermined direction are different from each other.
  • the solid-state image sensor according to (1) above wherein the sizes of the plurality of memories in the direction perpendicular to the predetermined direction are substantially the same.
  • the plurality of memories are grouped into two groups. A predetermined number of memories belonging to each of the two groups have different sizes in a predetermined direction from each other and are arranged in the predetermined direction.
  • the solid-state image sensor according to (1) wherein the size of one of the two groups in the direction perpendicular to the predetermined direction is different from that of the other.
  • the sizes of the plurality of memories in the predetermined directions are substantially the same. The sizes of the plurality of memories in the direction perpendicular to the predetermined direction are different from each other.
  • a plurality of sets, each consisting of a pair of memories, are arranged in the predetermined direction.
  • the pair of memories are arranged in the vertical direction and are arranged in the vertical direction.
  • An input switching unit that inputs either a predetermined level test signal or a pixel signal as the analog signal to the analog-to-digital converter.
  • a correction unit that corrects the digital signal by the retained gain correction coefficient is further provided.
  • the solid-state image sensor according to any one of (1) to (5), wherein the gain correction coefficient calculation unit calculates the gain correction coefficient from the test signal and the digital signal. (7) The solid-state image sensor according to (6), wherein the correction unit expands the number of digits of the held gain correction coefficient to a predetermined value and performs correction.
  • the analog-to-digital converter is A comparator that compares the analog signal with a predetermined lamp signal and outputs a comparison result, A digital signal generation unit that generates the digital signal based on the comparison result is provided.
  • the comparator A differential amplifier circuit that amplifies the difference between the predetermined reference voltage and the voltage of the predetermined node and outputs it as the comparison result.
  • the plurality of analog gains are grouped into a plurality of gain domains having different capacitance ratios.
  • An analog-to-digital converter that increases or decreases the analog signal according to the analog gain selected from the plurality of analog gains and converts the increased or decreased analog signal into a digital signal.
  • a gain correction coefficient calculation unit that calculates a correction coefficient for correcting the error of the selected analog gain as a gain correction coefficient based on the digital signal, and a gain correction coefficient calculation unit.
  • a reduction processing unit that reduces the number of digits of the gain correction coefficient to a value corresponding to the analog gain and holds the memory in a size corresponding to the number of digits after reduction among the plurality of memories.
  • An image pickup apparatus including an image signal processing unit that processes an image signal in which digital signals corrected by the held gain correction coefficient are arranged.
  • Image sensor 110 Optical unit 120
  • DSP circuit 130 Display unit 140 Operation unit 150
  • Bus 160 Frame memory 170
  • Power supply unit 200 Solid-state image sensor 201 Pixel chip 202 Circuit chip 210 Vertical scanning circuit 220 Test signal source 230 DAC 240 Timing control circuit 250 pixel array unit 260 pixels 261 photoelectric conversion element 262 Transfer transistor 263 Reset transistor 264 Floating diffusion layer 265 Amplification transistor 266 Selection transistor 270 Input switching unit 271, 340 Selector 280 Column signal processing unit 281 ADC 282 Counter 300 Image processing unit 310 Gain error measurement unit 311 Sample number counter 312 Update pulse generation unit 313 Gain calculation unit 314 Offset calculation unit 320 Correction value calculation unit 321 Gain correction coefficient calculation unit 322 Reduction processing unit 323 Subtractor 324 Demultiplexer 325 Clip processing unit 326 Fractional digit reduction unit 330 Storage unit 331 Memory 350 Correction unit 351 Digit number expansion unit 352 Multiplexer 353 Adder 354 Multiplier 360 controller 400 Comparator 410 Capacity ratio switching circuit 411

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Analogue/Digital Conversion (AREA)

Abstract

La présente invention réduit la capacité de mémoires dans un élément d'imagerie à semi-conducteurs qui maintient des coefficients de correction pour chaque colonne.　Un convertisseur analogique/numérique augmente et diminue un signal analogique par l'intermédiaire d'un gain analogique sélectionné parmi une pluralité de gains analogiques, et convertit le signal analogique augmenté et diminué en un signal numérique. Une pluralité de mémoires ont respectivement des tailles différentes. Une unité de calcul de coefficient de correction de gain calcule, en tant que coefficient de correction de gain, le coefficient de correction afin de corriger une erreur du gain analogique sélectionné sur la base du signal numérique. Une unité de traitement de réduction réduit le nombre de chiffres du coefficient de correction de gain à une valeur correspondant au gain analogique, et stocke le coefficient de correction de gain dans une mémoire ayant une taille conforme au nombre de chiffres après la réduction parmi la pluralité de mémoires.
PCT/JP2020/038430 2020-01-16 2020-10-12 Élément d'imagerie à semi-conducteurs, dispositif d'imagerie, et procédé de commande d'élément d'imagerie à semi-conducteurs WO2021145033A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-005157 2020-01-16
JP2020005157A JP2021114649A (ja) 2020-01-16 2020-01-16 固体撮像素子、撮像装置、および、固体撮像素子の制御方法

Publications (1)

Publication Number Publication Date
WO2021145033A1 true WO2021145033A1 (fr) 2021-07-22

Family

ID=76864110

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/038430 WO2021145033A1 (fr) 2020-01-16 2020-10-12 Élément d'imagerie à semi-conducteurs, dispositif d'imagerie, et procédé de commande d'élément d'imagerie à semi-conducteurs

Country Status (2)

Country Link
JP (1) JP2021114649A (fr)
WO (1) WO2021145033A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62279787A (ja) * 1986-05-28 1987-12-04 Nec Corp 平面撮像素子固定パタ−ン雑音除去装置
JP2007028521A (ja) * 2005-07-21 2007-02-01 Micron Technol Inc 並列入力演算平均モジュールを用いてイメージャ雑音低減化を行う方法及び装置
JP2008244947A (ja) * 2007-03-28 2008-10-09 Sony Corp 固定パターンノイズ除去回路、固定パターンノイズ除去方法、プログラムおよび撮像装置
JP2016143958A (ja) * 2015-01-30 2016-08-08 株式会社東芝 固体撮像装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62279787A (ja) * 1986-05-28 1987-12-04 Nec Corp 平面撮像素子固定パタ−ン雑音除去装置
JP2007028521A (ja) * 2005-07-21 2007-02-01 Micron Technol Inc 並列入力演算平均モジュールを用いてイメージャ雑音低減化を行う方法及び装置
JP2008244947A (ja) * 2007-03-28 2008-10-09 Sony Corp 固定パターンノイズ除去回路、固定パターンノイズ除去方法、プログラムおよび撮像装置
JP2016143958A (ja) * 2015-01-30 2016-08-08 株式会社東芝 固体撮像装置

Also Published As

Publication number Publication date
JP2021114649A (ja) 2021-08-05

Similar Documents

Publication Publication Date Title
WO2018096813A1 (fr) Élément de capture d'image à semi-conducteur, dispositif de capture d'image à semi-conducteur, et procédé de commande d'élément de capture d'image à semi-conducteur
WO2020235146A1 (fr) Élément d'imagerie à semi-conducteurs, dispositif d'imagerie, et procédé de contrôle d'élément d'imagerie à semi-conducteurs
CN112740659A (zh) 固态摄像元件和摄像装置
WO2021090538A1 (fr) Dispositif de détection, appareil électronique et procédé de commande de dispositif de détection
US11310450B2 (en) Solid-state imaging element, imaging device, and method for controlling solid-state imaging element
WO2018116633A1 (fr) Élément d'imagerie à semi-conducteurs, dispositif électronique, et procédé de fabrication destiné à un élément d'imagerie à semi-conducteurs
WO2022074940A1 (fr) Élément d'imagerie à semi-conducteurs et dispositif d'imagerie
WO2021112058A1 (fr) Élément d'imagerie à semi-conducteurs, dispositif d'imagerie, et procédé de commande d'élément d'imagerie à semi-conducteurs
WO2022172586A1 (fr) Élément d'imagerie à semi-conducteurs, dispositif d'imagerie et procédé de commande d'un élément d'imagerie à semi-conducteurs
WO2021256073A1 (fr) Élément d'imagerie à semi-conducteurs, dispositif d'imagerie, et procédé de commande d'élément d'imagerie à semi-conducteurs
US11223791B2 (en) Signal processing circuit, solid-state imaging element, and method for controlling signal processing circuit
WO2021112059A1 (fr) Élément d'imagerie à semi-conducteurs, dispositif d'imagerie et procédé de commande d'élément d'imagerie à semi-conducteurs
US11451725B2 (en) Solid-state imaging element, imaging apparatus, and method for controlling solid-state imaging element
WO2021145033A1 (fr) Élément d'imagerie à semi-conducteurs, dispositif d'imagerie, et procédé de commande d'élément d'imagerie à semi-conducteurs
WO2020255496A1 (fr) Capteur d'image à semi-conducteurs, dispositif d'imagerie et procédé de commande de capteur d'image à semi-conducteurs
WO2021084826A1 (fr) Élément de capture d'image à semi-conducteurs
WO2020250494A1 (fr) Élément d'imagerie à semi-conducteurs, dispositif d'imagerie et procédé de commande d'élément d'imagerie à semi-conducteurs
WO2022137790A1 (fr) Élément de capture d'image à semi-conducteurs, dispositif de détection et procédé permettant de commander un élément de capture d'image à semi-conducteurs
WO2022244293A1 (fr) Circuit de conversion analogique/numérique, dispositif de détection d'image à semi-conducteurs et procédé permettant de commander un circuit de conversion analogique/numérique
WO2019171686A1 (fr) Circuit d'amplification, dispositif d'imagerie et procédé permettant de de commander un circuit d'amplification
WO2023112480A1 (fr) Élément d'imagerie à semi-conducteurs, dispositif d'imagerie, et procédé de contrôle d'élément d'imagerie à semi-conducteurs
WO2022038903A1 (fr) Élément d'imagerie à semi-conducteur
WO2021124628A1 (fr) Élément d'imagerie à semi-conducteurs et dispositif d'imagerie
WO2022004125A1 (fr) Élément d'imagerie à semi-conducteurs, dispositif d'imagerie et procédé de contrôle d'élément d'imagerie à semi-conducteurs
WO2020149095A1 (fr) Dispositif de capture d'images et système de capture d'images

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20913410

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20913410

Country of ref document: EP

Kind code of ref document: A1