WO2021143952A1 - 导流罩和具有其的服务器 - Google Patents

导流罩和具有其的服务器 Download PDF

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Publication number
WO2021143952A1
WO2021143952A1 PCT/CN2021/080853 CN2021080853W WO2021143952A1 WO 2021143952 A1 WO2021143952 A1 WO 2021143952A1 CN 2021080853 W CN2021080853 W CN 2021080853W WO 2021143952 A1 WO2021143952 A1 WO 2021143952A1
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WO
WIPO (PCT)
Prior art keywords
air
fan
air deflector
deflector
wind
Prior art date
Application number
PCT/CN2021/080853
Other languages
English (en)
French (fr)
Inventor
葛永博
郝明亮
张磊
范亚芳
修洪雨
王国辉
Original Assignee
北京比特大陆科技有限公司
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Filing date
Publication date
Application filed by 北京比特大陆科技有限公司 filed Critical 北京比特大陆科技有限公司
Priority to US17/793,421 priority Critical patent/US20230039583A1/en
Publication of WO2021143952A1 publication Critical patent/WO2021143952A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/002—Axial flow fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/26—Rotors specially for elastic fluids
    • F04D29/28—Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps
    • F04D29/30—Vanes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/52—Casings; Connections of working fluid for axial pumps
    • F04D29/54—Fluid-guiding means, e.g. diffusers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/52—Casings; Connections of working fluid for axial pumps
    • F04D29/54—Fluid-guiding means, e.g. diffusers
    • F04D29/541—Specially adapted for elastic fluid pumps
    • F04D29/542—Bladed diffusers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/70—Suction grids; Strainers; Dust separation; Cleaning
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/70—Suction grids; Strainers; Dust separation; Cleaning
    • F04D29/701—Suction grids; Strainers; Dust separation; Cleaning especially adapted for elastic fluid pumps
    • F04D29/703—Suction grids; Strainers; Dust separation; Cleaning especially adapted for elastic fluid pumps specially for fans, e.g. fan guards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications

Definitions

  • This application relates to the field of heat dissipation technology, and in particular, to an air deflector and a server having the same.
  • the static hub area that is, the fan hub area
  • This area is a no-wind area.
  • the wind pressure in the hub area is relatively low, which is not conducive to dissipating the heat of the chip directly opposite to it.
  • the temperature difference between the chip corresponding to the hub area and the chip in the adjacent area can reach 7 °C -16 °C, so the uniformity of the fan flow field is poor, which is not conducive to the uniformity of the temperature of the chip and other electronic devices.
  • one purpose of the present application is to propose a diversion cover that increases the air volume in the no-wind zone, improves the parallelism of the wind flow in the no-wind zone, and the uniformity of the wind flow field in the no-wind zone, thereby improving the no-wind zone.
  • the heat dissipation effect of the chip and electrical components is to propose a diversion cover that increases the air volume in the no-wind zone, improves the parallelism of the wind flow in the no-wind zone, and the uniformity of the wind flow field in the no-wind zone, thereby improving the no-wind zone.
  • Another purpose of this application is to provide a server with the above-mentioned diversion cover.
  • the flow deflector according to the embodiment of the first aspect of the present application includes an annular stent; the drainage element is arranged on the inner side of the annular stent, and includes a first surface and a second surface that are arranged oppositely, and the area of the first surface is larger than that of the first surface.
  • a wind gathering ring which is arranged around the outer periphery of the drainage member, is located between the drainage member and the annular support and is arranged separately from the drainage member and the annular support; multiple The first air guide fins are arranged at intervals around the circumference of the air guide, and are connected between the air guide and the air collecting ring; a plurality of second air guides surround the circumference of the air collecting ring They are arranged at intervals and connected between the wind gathering ring and the annular support.
  • the structure of the air deflector is simple by providing the above-mentioned annular bracket, the air guide, the air collecting ring, a plurality of first air guiding fins and a plurality of second air guiding fins.
  • the air deflector is used in conjunction with the fan, the air volume in the hub area is increased, the heat dissipation effect at the position directly opposite the hub area is improved, and the flow field distribution is improved at the same time, so that the fan discharges more uniformly, so that the heat dissipation can be more uniform .
  • the cross-sectional area of the drainage member gradually decreases from the first surface to the second surface.
  • the drainage member has a truncated cone shape or a hemispherical shape.
  • the wind collecting ring has a cylindrical ring structure.
  • the end of the first air guide fin close to the air collecting ring deviates from the end of the first air guide fin close to the air guide in the radial direction of the air guide .
  • the end of the second air guide fin close to the annular bracket deviates from the end of the second air guide fin close to the air collecting ring in the radial direction of the flow guide .
  • the number of the first air guide fins is the same as the number of the second air guide fins.
  • the first wind guide fins correspond to the second wind guide fins one-to-one, and the first wind guide fins smoothly transition to the second wind guide fins.
  • the extension direction of the second air guide fin is the same as the extension direction of the first air guide fin.
  • the server according to the embodiment of the second aspect of the present application includes a chassis; a fan assembly is provided on the chassis and includes an inlet fan and an outlet fan;
  • the electronic component is arranged between the air inlet fan and the air outlet fan; the air deflector is arranged at the air outlet of the air inlet fan, and the air deflector is an embodiment according to the above-mentioned first aspect of the present application
  • the shroud is an embodiment according to the above-mentioned first aspect of the present application.
  • the first surface faces the intake fan
  • the second surface faces the electronic component
  • the intake fan includes a fan body and a fan outer frame, and the air deflector is installed on the fan outer frame.
  • the air deflector and the fan frame are integrally molded by injection molding.
  • the air deflector is fixed on the chassis.
  • Fig. 1 is a schematic diagram of an air deflector according to an embodiment of the present application
  • Figure 2 is a front view of the deflector according to an embodiment of the present application.
  • Figure 3 is a cross-sectional view along the line A-A in Figure 2;
  • Figure 4 is a right side view of the air deflector according to the embodiment of the present application.
  • Fig. 5 is a top view of the air deflector according to an embodiment of the present application.
  • the air deflector 100 includes an annular bracket 1, a deflector 2, a wind collecting ring 3, a plurality of first air guide fins 41 and a plurality of second air guides. Air guide piece 42.
  • the drainage member 2 is provided on the inner side of the annular bracket 1.
  • the direction “inside” can be understood as the direction toward the center of the ring stent 1, and the opposite direction is defined as “outside”, that is, the direction away from the center of the ring stent 1.
  • the cross-sectional area of one end of the flow guide 2 (for example, the left end in FIG. 3) is smaller than the cross-sectional area of the other end of the flow guide 2 (for example, the right end in FIG.
  • the flow guiding member 2 includes a first surface 21 and a second surface 22 opposite to each other along the direction of air flow, and the area of the first surface 21 is larger than the area of the second surface 22.
  • the wind collecting ring 3 surrounds the outer circumference of the drainage piece 2, and the wind collecting ring 3 is located between the drainage piece 2 and the annular support 1 and is spaced apart from the drainage piece 2 and the annular support 1 respectively.
  • a plurality of first air guide fins 41 are arranged at intervals around the circumference of the air guide 2 and connected between the air guide 2 and the air collecting ring 3; a plurality of second air guide fins 42 are arranged at intervals around the circumference of the air collecting ring 3 , And connected between the wind gathering ring 3 and the annular support 1.
  • the ring-shaped stent 1 is generally a frame-shaped structure
  • the drainage member 2 may be located at the inner center of the ring-shaped stent 1, and the area of the first surface 21 of the drainage member 2 is larger than the area of the second surface 22 .
  • the air deflector 100 is arranged on the air outlet side of the fan (not shown), the first surface 21 of the air deflector 2 faces the fan, and the area of the first surface 21 is larger than the area of the second surface 22, which is convenient for the air deflector. 2 Drain the wind blown by the fan to the hub area, so that the air volume in the hub area can be increased, and the heat dissipation of the electronic components such as chips directly opposite to the hub area can be better realized.
  • a wind collecting ring 3 is arranged between the drainage piece 2 and the annular support 1, and the wind collecting ring 3 is arranged around the drainage piece 2.
  • the air will diverge to the surroundings, which is not conducive to the heat dissipation of the electronic devices directly opposite to the hub area, and passes through the air guide 2, the wind collecting ring 3, and the first air guide 41
  • the arrangement of the second air guide fin 42 can reduce the divergence of the wind flow, make the wind flow more parallel, and the flow field is more uniform, thereby improving the heat dissipation effect of the hub area.
  • the eight first air guiding fins 41 are arranged around the circumference of the air guiding member 2 at intervals, and are connected to the air guiding member 2 and Between the wind collecting rings 3, eight second air guide fins 42 are arranged at intervals around the circumference of the wind collecting ring 3, and are connected between the wind collecting ring 3 and the annular support 1. In this way, the wind flow can be divided.
  • the parallelism of the air flow from the fan is further improved, the flow field can be more uniform, and the size of the air deflector 100 in the thickness direction can be effectively reduced.
  • the number of the first air guide fins 41 and the second air guide fins 42 is not limited by this embodiment and the drawings.
  • the air deflector 100 of the embodiment of the present application is provided with the above-mentioned annular bracket 1, the air guide 2, the air collecting ring 3, a plurality of first air guide fins 41 and a plurality of second air guide fins 42.
  • the structure of 100 is simple.
  • the air deflector 100 is used in conjunction with a fan, the air volume in the hub area is increased, the heat dissipation effect at the position directly opposite the hub area is improved, and the flow field distribution is improved at the same time, so that the fan discharges more uniformly, thereby making heat dissipation more Evenly.
  • the cross-sectional area of the drainage member 2 gradually decreases along the first surface 21 to the second surface 22.
  • the cross-sectional area of the guide member 2 gradually changes along its axial direction, and the cross-sectional area of the end of the guide member 2 facing the fan is larger than the cross-sectional area of the end of the guide member 2 away from the fan
  • the area, that is, the area of the first surface 21 is larger than the area of the second surface 22.
  • the drainage member 2 is in the shape of a truncated cone (as shown in Figures 1 to 3) or a hemispherical shape (not shown in the figure), but it is not limited thereto. With this arrangement, the processing is simple and the cost is reduced.
  • the wind gathering ring 3 has a cylindrical ring structure, but it is not limited thereto.
  • the wind collecting ring 3 is arranged around the outer circumference of the drainage member 2, and the wind collecting ring 3 is located between the drainage member 2 and the annular support 1 and is spaced apart from the drainage member 2 and the annular support 1 respectively.
  • the wind blown by the fan will diverge to the surroundings due to the centrifugal force, resulting in a small air volume in the hub area, which makes the electronic devices such as chips in this area less effective in heat dissipation.
  • the divergence of the wind flow can be reduced.
  • Improve the air volume and parallelism of the air flow in the hub area ensure the uniformity of the air flow field, and improve the heat dissipation effect of the electronic components such as chips in the hub area.
  • each first air guiding fin 41 close to the air collecting ring 3 is offset from the end of the first air guiding fin 41 close to the air guiding member 2 in the radial direction of the air guiding member 2, and each The end of the second air guide plate 42 close to the annular bracket 1 is offset from the end of the second air guide plate 42 close to the wind collecting ring 3 in the radial direction of the flow guide 2.
  • each of the first air guiding fins 41 and each of the second air guiding fins 42 may be substantially arc-shaped, and the extension of each first air guiding fin 41 and each second air guiding fin 42 The direction deviates from the radial direction of the flow guide 2.
  • the first air guiding fin 41 and the second air guiding fin 42 have a guiding effect on the wind flowing therethrough, so that the heat dissipation of the electronic devices such as chips in the hub area can be better realized.
  • the number of the first air guiding fins 41 and the second air guiding fins 42 are the same. It can be understood that in other embodiments, the number of the first air guiding fins 41 and the second air guiding fins 42 may be different.
  • the first air guiding fins 41 and the second air guiding fins 42 are in one-to-one correspondence, and the first air guiding fins 41 smoothly transition to the second air guiding fins 42.
  • the first wind guide piece 41 smoothly transitions to the second wind guide piece 42, that is, the connection between the first wind guide piece 41 and the second wind guide piece 42 extends along the extending trend of the first wind guide piece 41 and transitions to The second wind guide piece 42.
  • the first air guiding piece 41 and the second air guiding piece 42 can be integrally formed, which reduces the manufacturing process and reduces the cost.
  • first air guiding fins 41 and the second air guiding fins 42 are not arranged correspondingly, that is, the first air guiding fins 41 and the second air guiding fins 42 are staggered. Not a smooth transition. It can be understood that the specific number and specific arrangement of the first air guiding fins 41 and the second air guiding fins 42 can be specifically set according to actual requirements to better meet the actual application.
  • the extending direction of the second air guiding fin 42 is the same as the extending direction of the first air guiding fin 41.
  • the curvature of the second air guiding fin 42 and the corresponding first air guiding fin 41 are the same.
  • the parallelism of the air flow in the hub area can be further ensured, and the processing of the first air guiding fin 41 and the second air guiding fin 42 is facilitated.
  • the present application is not limited to this, and it is also possible that the extending direction of the second air guiding fin 42 is different from the extending direction of the first air guiding fin 41.
  • the server (not shown in the figure) according to the embodiment of the second aspect of the present application includes a chassis (not shown in the figure), a fan assembly (not shown in the figure), electronic components (not shown in the figure) and a shroud 100.
  • the air deflector 100 is the air deflector 100 according to the above-mentioned embodiment of the first aspect of the present application.
  • the fan assembly is arranged on the chassis, the fan assembly includes an inlet fan and an outlet fan, the air deflector 100 is arranged at the outlet of the inlet fan, and the electronic components are arranged between the inlet fan and the outlet fan.
  • the electronic components may be chips and other components.
  • the air deflector 100 can effectively guide the wind at the air outlet to the inside of the chassis, and realize the air outlet of the air inlet fan. Rectification improves the windless condition in the hub area of the air inlet fan, and improves the uniformity of the air outlet. Moreover, by setting the air deflector 100, compared with the traditional server without air deflector 100, the average temperature of all chips at the air outlet fan can be lowered by about 1°C, which can effectively control the electronic devices such as chips in the hub area. Heat dissipation.
  • the first surface 21 faces the intake fan
  • the second surface 22 faces the electronic component.
  • the area of the first surface 21 is larger than the area of the second surface 22, which is convenient for the guide member 2 to divert the wind blown by the inlet fan to the hub area, thereby increasing the air volume in the hub area, and thus can better realize the direct opposite to the hub area. Heat dissipation of electronic components.
  • the intake fan includes a fan body and a fan outer frame, and the air deflector 100 is installed on the fan outer frame.
  • the air deflector 100 can also be fixed on the chassis. At this time, the air deflector 100 can be separated from the fan, and the air deflector 100 can be directly (for example, plugged in, etc.) installed in the chassis after being processed and formed. Therefore, the production process is simple, and quick installation can be realized.
  • a slot position may be reserved on the air deflector 100, so that the air deflector 100 is suitable for various fans.
  • the air deflector 100 and the outer frame of the fan are integrally molded by injection molding. At this time, the air deflector 100 and the outer frame of the fan are made into an integral structure. This setting prevents the fan from being too thick, which is conducive to the miniaturization of the server.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected, or integrally connected it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected, or integrally connected it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • the specific meanings of the above terms in this application can be understood under specific circumstances.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

本申请涉及散热技术领域，公开了一种导流罩和具有其的服务器。其中，导流罩包括环形支架、引流件、聚风环、多个第一导风片和多个第二导风片。引流件设在环形支架的内侧，包括相对设置的第一表面和第二表面，第一表面的面积大于第二表面的面积。聚风环环设于引流件的外周，位于引流件和环形支架之间且分别与引流件和环形支架间隔设置。多个第一导风片环绕引流件的周向间隔设置，且连接于引流件和聚风环之间；多个第二导风片环绕聚风环的周向间隔设置，且连接于聚风环和环形支架之间。将本申请的导流罩与风扇配合使用时，增加了hub区的风量，改善了与hub区正对位置处的散热效果，同时改善了流场分布，使风扇出风更加均匀，从而可以使散热更加均匀。

Description

导流罩和具有其的服务器 技术领域
本申请涉及散热技术领域，尤其是涉及一种导流罩和具有其的服务器。
背景技术
相关技术中，风扇马达区域存在一部分静止的hub区(即风扇轮毂区域)，该区域为无风区，hub区的风压相对较低，不利于对其正对位置的芯片进行散热，同时位于hub区对应的芯片与其旁边区域芯片的温差能达到7℃-16℃，从而风扇流场的均匀性差，不利于芯片等电子器件温度的均匀性。
申请内容
本申请旨在至少解决现有技术中存在的技术问题之一。为此，本申请的一个目的在于提出一种导流罩，增加了无风区的风量，提高无风区的风流的平行度，以及无风区的风流场的均匀性，从而提高无风区的芯片及电气元件的散热效果。
本申请的另一个目的在于提出一种具有上述导流罩的服务器。
根据本申请第一方面实施例的导流罩，包括环形支架；引流件，设在所述环形支架的内侧，包括相对设置的第一表面和第二表面，所述第一表面的面积大于所述第二表面的面积；聚风环，环设于所述引流件的外周，位于所述引流件和所述环形支架之间且分别与所述引流件和所述环形支架间隔设置；多个第一导风片，环绕所述引流件的周向间隔设置，且连接于所述引流件和所述聚风环之间；多个第二导风片，环绕所述聚风环的周向间隔设置，且连接于所述聚风环和所述环形支架之间。
根据本申请实施例的导流罩，通过设置包括上述的环形支架、引流件、聚风环、多个第一导风片和多个第二导风片，导流罩的结构简单。当导流罩与风扇配合使用时，增加了hub区的风量，改善了与hub区正对位置处的散热效果，同时改善了流场分布，使风扇出风更加均匀，从而可以使散热更加均匀。
根据本申请的一些实施例，所述引流件的横截面面积沿所述第一表面至所述第二表面逐渐减小。
根据本申请的一些实施例，所述引流件为圆台形或半球形。
根据本申请的一些实施例，所述聚风环为圆柱环形结构。
根据本申请的一些实施例，所述第一导风片之靠近所述聚风环的一端在所述引流件的径向方向上偏离所述第一导风片之靠近所述引流件的一端。
根据本申请的一些实施例，所述第二导风片之靠近所述环形支架的一端在所述引流件的径向方向上偏离所述第二导风片之靠近所述聚风环的一端。
根据本申请的一些实施例，所述第一导风片与所述第二导风片的数量相同。
根据本申请的一些实施例，所述第一导风片与所述第二导风片一一对应，并且所述第一导风片平滑过渡至所述第二导风片。
根据本申请的一些实施例，所述第二导风片的延伸方向与所述第一导风片的延伸方向相同。
根据本申请第二方面实施例的服务器，包括机箱；风扇组件，设在所述机箱上，包括进风风扇和出风风扇；
电子元件，设在所述进风风扇和所述出风风扇之间；导流罩，设在所述进风风扇的出风口处，所述导流罩为根据本申请上述第一方面实施例的导流罩。
根据本申请的一些实施例，所述第一表面朝向所述进风风扇，所述第二表面朝向所述电子元件。
根据本申请的一些实施例，所述进风风扇包括风扇本体和风扇外框，所述导流罩安装于所述风扇外框。
根据本申请的一些实施例，所述导流罩与所述风扇外框一体注塑成型。
根据本申请的一些实施例，所述导流罩固定在所述机箱上。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是根据本申请实施例的导流罩的示意图；
图2是根据本申请实施例的导流罩的主视图；
图3是沿图2中A-A线的剖面图；
图4是根据本申请实施例的导流罩的右视图；
图5是根据本申请实施例的导流罩的俯视图。
附图标记：100：导流罩；1：环形支架；2：引流件；21：第一表面；22：第二表面；3：聚风环；41：第一导风片；42：第二导风片。
具体实施方式
下面详细描述本申请的实施例，参考附图描述的实施例是示例性的，下面详细描述本申请的实施例。
下面参考图1-图5描述根据本申请实施例的导流罩100。
如图1-图5所示，根据本申请第一方面实施例的导流罩100，包括环形支架1、引流件2、聚风环3、多个第一导风片41和多个第二导风片42。
具体而言，引流件2设在环形支架1的内侧。这里，需要说明的是，方向“内”可以理解为朝向环形支架1中心的方向，其相反方向被定义为“外”，即远离环形支架1中心的方向。在导流罩100的厚度方向上、引流件2的一端(例如，图3中的左端)的横截面面积小于引流件2的另一端(例如，图3中的右端)的横截面面积，具体地，引流件2沿气流流动的方向包括相对设置的第一表面21和第二表面22，第一表面21的面积大于第二表面22的面积。聚风环3环绕在引流件2的外周，聚风环3位于引流件2和环形支架1之间且分别与引流件2和环形支架1间隔设置。多个第一导风片41环绕引流件2的周向间隔设置，且连接于引流件2和聚风环3之间；多个第二导风片42环绕聚风环3的周向间隔设置，且连接于聚风环3和环形支架1之间。
例如，在图1-图5的示例中，环形支架1大体为框形结构，引流件2可以位于环形支架1的内侧中央，引流件2的第一表面21的面积大于第二表面22的面积。实际应用中，导流罩100设在风扇(图未示出)的出风侧，引流件2的第一表面21朝向风扇，第一表面21的面积大于第二表面22的面积，便于引流件2将风扇吹出的风引流至hub区，从而可以提高hub区的风量，进而可以更好地实现与hub区正对的电子元件例如芯片等的散热。
引流件2与环形支架1之间设有聚风环3，且聚风环3环绕引流件2设置。当风扇的扇叶转动时，在离心力的作用下，空气会向四周发散，从而不利于与hub区正对的电子器件散热，而通过引流件2、聚风环3、第一导风片41和第二导风片42的设置，可以减少风流发散，使风流平行度更好，流场更加均匀，从而提高了hub区的散热效果。如图1所示，第一导风片41和第二导风片42分别设有八个，八个第一导风片41环绕引流件2的周向间隔设置，并且连接于引流件2和聚风环3之间，八个第二导风片42环绕聚风环3的周向间隔设置，并且连接于聚风环3和环形支架1之间，如此，可以对 出风风流进行分割，进一步提高风扇出风风流的平行度，使流场可以更加均匀，并且可以有效减小导流罩100的厚度方向上的尺寸。需要说明的是，第一导风片41和第二导风片42的数量并不受本实施例和附图的限制。
根据本申请实施例的导流罩100，通过设置包括上述的环形支架1、引流件2、聚风环3、多个第一导风片41和多个第二导风片42，导流罩100的结构简单。当导流罩100与风扇配合使用时，增加了hub区的风量，改善了与hub区正对位置处的散热效果，同时改善了流场分布，使风扇出风更加均匀，从而可以使散热更加均匀。
根据本申请的一些实施例，引流件2的横截面面积沿第一表面21至第二表面22逐渐减小。例如，参照图1和图2并结合图3，引流件2的横截面面积沿其轴向逐渐变化，引流件2的朝向风扇的一端的横截面面积大于引流件2远离风扇的一端的横截面面积，也就是第一表面21的面积大于第二表面22的面积。由此，有效地利用空气与引流件2之间的粘滞力，有助于将风扇吹出的风向中间的hub区进行引流，提高了中间hub区的风量。
在一些可选的实施例中，引流件2为圆台形(如图1-图3所示)或半球形(图未示出)，但不限于此。如此设置，加工简单，降低成本。
在一些可选的实施例中，聚风环3为圆柱环形结构，但不限于此。例如，如图1和图2所示，聚风环3环绕设置在引流件2的外周，聚风环3位于引流件2和环形支架1之间且分别与引流件2和环形支架1间隔设置。风扇吹出的风由于离心力的作用会向四周发散，导致hub区内风量较小，使得该区域内的电子器件例如芯片等的散热效果较差，而通过设置聚风环3，可以减少风流的发散，提高hub区的风量以及风流的平行度，保证风流场的均匀性，提升了hub区的电子元件例如芯片等的散热效果。
根据本申请的一些实施例，每个第一导风片41之靠近聚风环3的一端在引流件2的径向方向上偏离第一导风片41之靠近引流件2的一端，每个第二导风片42之靠近环形支架1的一端在引流件2的径向方向上偏离第二导风片42之靠近聚风环3的一端。结合图1和图2，每个第一导风片41和每个第二导风片42可以大体呈弧形，且每个第一导风片41和每个第二导风片42的延伸方向偏离引流件2的径向方向。如此设置，第一导风片41和第二导风片42对流经其的风具有引导作用，从而可以更好地实现对hub区的电子器件例如芯片等的散热。
作为一种实施方式，第一导风片41与第二导风片42的数量相同。可以理解，在其他实施例中，第一导风片41与第二导风片42的数量不相同也是可以的。
作为一种实施方式，第一导风片41与第二导风片42一一对应，并且第一导风片41 平滑过渡至第二导风片42。第一导风片41平滑过渡至第二导风片42，也就是第一导风片41和第二导风片42的连接处沿着第一导风片41的延伸趋势进行延伸并过渡至第二导风片42。如此设置，第一导风片41和第二导风片42可以一体成型，减少制作工序，降低成本。作为一种可替代的实施方式，第一导风片41与第二导风片42不对应设置也是可以的，也即，第一导风片41与第二导风片42之间错开设置，不是平滑过渡。可以理解的是，第一导风片41与第二导风片42的具体数量和具体布置方式等可以根据实际要求具体设置，以更好地满足实际应用。
作为一种实施方式，第二导风片42的延伸方向与第一导风片41的延伸方向相同。当第二导风片42的延伸方向与第一导风片41的延伸方向相同时，第二导风片42与对应的第一导风片41的曲率相同。由此，能够进一步保证hub区的风流的平行度，同时便于第一导风片41和第二导风片42加工。当然，本申请不限于此，第二导风片42的延伸方向与第一导风片41的延伸方向不相同也是可以的。
根据本申请第二方面实施例的服务器(图未示出)，包括机箱(图未示出)、风扇组件(图未示出)、电子元件(图未示出)和导流罩100。导流罩100为根据本申请上述第一方面实施例的导流罩100。
具体而言，风扇组件设在机箱上，风扇组件包括进风风扇和出风风扇，导流罩100设在进风风扇的出风口处，电子元件设在进风风扇和出风风扇之间。其中，电子元件可以为芯片等元件。
根据本申请实施例的服务器，通过将导流罩100设在进风风扇的出风口处，导流罩100能够有效地将出风口处的风导向机箱内部，并实现对进风风扇出风的整流，改善进风风扇hub区无风的状况，提升了出风的均匀性。而且，通过设置导流罩100，与传统的没有导流罩100的服务器相比，出风风扇处所有芯片的平均温度可以低1℃左右，可以有效对hub区处的电子器件例如芯片等进行散热。
作为一种实施方式，第一表面21朝向进风风扇，第二表面22朝向电子元件。第一表面21的面积大于第二表面22的面积，便于引流件2将进风风扇吹出的风引流至hub区，从而可以提高hub区的风量，进而可以更好地实现与hub区正对的电子元件的散热。
作为一种实施方式，进风风扇包括风扇本体和风扇外框，导流罩100安装于风扇外框。当然，作为另一种实施方式，导流罩100还可以固定在机箱上。此时导流罩100可以与风扇分离，导流罩100加工成型后再直接(例如，采用插接的方式等)安装至机箱内。由此，生产工艺简单，可以实现快速安装。例如，可以在导流罩100上预留卡槽位置，实现导流罩100适用于多种风扇。
根据本申请的一些实施例，导流罩100与风扇外框一体注塑成型。此时导流罩100与风扇外框做成整体结构。如此设置，避免风扇过厚，有利于服务器的小型化设计。
根据本申请实施例的服务器的其他构成以及操作对于本领域普通技术人员而言都是已知的，这里不再详细描述。
在本申请的描述中，需要理解的是，术语“中心”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“顶”、“底”、“内”、“外”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (14)

  1. 一种导流罩，其特征在于，包括：
    环形支架；
    引流件，设在所述环形支架的内侧，包括相对设置的第一表面和第二表面，所述第一表面的面积大于所述第二表面的面积；
    聚风环，环设于所述引流件的外周，位于所述引流件和所述环形支架之间且分别与所述引流件和所述环形支架间隔设置；
    多个第一导风片，环绕所述引流件的周向间隔设置，且连接于所述引流件和所述聚风环之间；
    多个第二导风片，环绕所述聚风环的周向间隔设置，且连接于所述聚风环和所述环形支架之间。
  2. 根据权利要求1所述的导流罩，其特征在于，所述引流件的横截面面积沿所述第一表面至所述第二表面逐渐减小。
  3. 根据权利要求1或2所述的导流罩，其特征在于，所述引流件为圆台形或半球形。
  4. 根据权利要求1或2所述的导流罩，其特征在于，所述聚风环为圆柱环形结构。
  5. 根据权利要求1所述的导流罩，其特征在于，所述第一导风片之靠近所述聚风环的一端在所述引流件的径向方向上偏离所述第一导风片之靠近所述引流件的一端。
  6. 根据权利要求1所述的导流罩，其特征在于，所述第二导风片之靠近所述环形支架的一端在所述引流件的径向方向上偏离所述第二导风片之靠近所述聚风环的一端。
  7. 根据权利要求1或5或6所述的导流罩，其特征在于，所述第一导风片与所述第二导风片的数量相同。
  8. 根据权利要求7所述的导流罩，其特征在于，所述第一导风片与所述第二导风片一一对应，并且所述第一导风片平滑过渡至所述第二导风片。
  9. 根据权利要求8所述的导流罩，其特征在于，所述第二导风片的延伸方向与所述第一导风片的延伸方向相同。
  10. 一种服务器，其特征在于，包括：
    机箱；
    风扇组件，设在所述机箱上，包括进风风扇和出风风扇；
    电子元件，设在所述进风风扇和所述出风风扇之间；
    导流罩，设在所述进风风扇的出风口处，所述导流罩为根据权利要求1-9任一项所述的导流罩。
  11. 根据权利要求10所述的服务器，其特征在于，所述第一表面朝向所述进风风扇，所述第二表面朝向所述电子元件。
  12. 根据权利要求10或11所述的服务器，其特征在于，所述进风风扇包括风扇本体和风扇外框，所述导流罩安装于所述风扇外框。
  13. 根据权利要求12所述的服务器，其特征在于，所述导流罩与所述风扇外框一体注塑成型。
  14. 根据权利要求10或11所述的服务器，其特征在于，所述导流罩固定在所述机箱上。
PCT/CN2021/080853 2020-01-16 2021-03-15 导流罩和具有其的服务器 WO2021143952A1 (zh)

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