WO2021141203A1 - Solder thin plate structure - Google Patents

Solder thin plate structure Download PDF

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Publication number
WO2021141203A1
WO2021141203A1 PCT/KR2020/011831 KR2020011831W WO2021141203A1 WO 2021141203 A1 WO2021141203 A1 WO 2021141203A1 KR 2020011831 W KR2020011831 W KR 2020011831W WO 2021141203 A1 WO2021141203 A1 WO 2021141203A1
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Prior art keywords
solder
layer
thin plate
plate structure
solder layer
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PCT/KR2020/011831
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French (fr)
Korean (ko)
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신대철
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신대철
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/002—Drill-bits

Definitions

  • the present invention relates to a solder thin plate structure, and more particularly, when the cutting tip is coupled to the shank of a cutting tool such as a cutting saw blade or a core drill bit by soldering, the cutting tip is strongly coupled to the shank of the cutting tool. It relates to a solder thin plate structure.
  • Cutting tools such as diamond saw blades and core drill bits are used for cutting.
  • a diamond saw blade is used to cut a workpiece such as stone, brick, concrete, and asphalt, and a core drill bit is mounted on a core drill and rotates to make a hole in a wall of a building or the like.
  • the cutting tool 1 ′ includes a shank 10 forming a part of the body of the cutting tool 1 ′ and a plurality of cutting tips 20 coupled to the shank 10 .
  • the shank 10 is made of metal, typically steel.
  • the cutting tip 20 is typically formed of a diamond cutting tip. Diamond cutting tips are manufactured by powder metallurgy in which diamond powder and metal powder serving as a binder are mixed, then molded and then sintered. Cemented carbide is sometimes used instead of diamond.
  • the cutting tip 20 is generally manufactured to be thicker than the thickness of the metal shank 10 in order to avoid friction between the metal shank 10 and the workpiece during cutting.
  • the cutting tip 20 is coupled to the shank 10 by laser welding or solder welding, in particular, silver solder welding or the like.
  • laser welding means that a base material is melted and welded by a laser
  • silver lead welding is welding using a silver lead material as a welding rod, and corresponds to a type of soldering.
  • the conventional silver lead thin plate structure 300 ′ has a first silver lead layer 310 , a second silver lead layer 320 , and a metal layer, particularly a copper layer, interposed between the first silver lead layer 310 and the second silver lead layer 320 . (330).
  • the metal layer, particularly the copper layer 330 has a melting temperature higher than the melting temperature of the first silver lead layer 310 and the second silver lead layer 320 .
  • the conventional silver-lead thin plate structure 300 ′ having such a structure is said to prevent cracks from occurring in the silver-lead layers 310 and 320 by mitigating the difference in thermal expansion coefficient. It is understood that the conventional silver lead thin plate structure 300' is based on the following recognition.
  • Patent Publication No. 2002-0037939 (published on May 23, 2002)
  • Patent Registration No. 10-1090404 (Registered on November 30, 2011)
  • Patent Registration No. 10-0791435 (Registered on December 27, 2007)
  • the cutting tip 20 and the shank 10 are coupled by silver solder.
  • a significant portion of the molten silver solder is pressed by the applied pressure and flows out from the bonding surface of the cutting tip 20 and the shank 10, and only a portion of the molten silver solder is pressed by the cutting tip 20 and the shank 10. It remains on the coupling surface of the cutting tip 20 and participates in coupling with the shank (10).
  • the recognition of the prior art in relation to the conventional silver-lead thin plate structure 300' regards the problem of using a single-layer silver-lead thin plate 30 as crack generation due to the difference in thermal expansion coefficient, but according to the understanding of the present inventor, Rather, the cracks in the silver solder layer 30 are caused by the leakage of a significant portion of the silver solder during the pressurization process, so that the silver solder layer 30 is finally left between the cutting tip 20 and the shank 10 . ) is understood to be mainly due to insufficient thickness.
  • the first silver-lead layer 310 and the shank 10 and the copper layer 330 between the cutting tip 20 and the copper layer 330 are not fundamentally solved because a significant portion of the molten silver lead is still leaked from the second silver lead layer 320 therebetween during the pressurization process.
  • the present invention has been devised to solve the problems of the prior art. Accordingly, it is an object of the present invention to provide a solder thin plate structure that enables the cutting tip to be strongly coupled to the shank of the cutting tool when the cutting tip is coupled to the shank of a cutting tool such as a cutting saw blade or a core drill bit by soldering. .
  • a solder thin plate structure according to the present invention for achieving the above object is provided with a first solder layer, a second solder layer and interposed between the first solder layer and the second solder layer, and the first solder layer and the second solder layer and a metal layer having a melting temperature higher than the melting temperature of the layer.
  • the metal layer has a plurality of through holes.
  • solder thin plate structure when pressure and heat are applied while being interposed between objects to be soldered, the first solder layer and the second solder layer are melted, so that the solder flows into the through-holes provided in the metal layer, and the first solder Soldering is carried out while the layer and the second solder layer are intertwined.
  • the soldering objects may be a shank and a cutting tip of a cutting tool.
  • the solder used for the first solder layer and the second solder layer is preferably a lead-free solder containing tin as a main material.
  • the metal of the metal layer may be copper or a copper alloy.
  • the thickness of the first solder layer, the second solder layer, and the metal layer may be in the range of 0.05 to 0.5 mm, respectively, and the diameter of the through hole of the metal layer may be in the range of 0.5 to 2 mm.
  • solder thin plate structure enables the cutting tip to be strongly coupled to the shank of the cutting tool when the cutting tip is coupled to the shank of a cutting tool such as a cutting saw blade or a core drill bit by soldering.
  • FIG. 1 shows a schematic configuration of a general cutting tool.
  • FIGS. 4 and 5 show a schematic configuration of a solder thin plate structure according to an embodiment of the present invention.
  • FIG. 6 shows a schematic configuration of a cutting tool soldered by a solder thin plate structure according to an embodiment of the present invention.
  • the solder thin plate structure 300 has a first solder layer 310, a second solder layer 320, and a first solder layer 310 and a second solder layer. and a metal layer 330 interposed therebetween.
  • the metal layer 330 has a melting temperature higher than the melting temperature of the first solder layer 310 and the second solder layer 320 .
  • a plurality of through holes 332 are formed in the metal layer 330 .
  • the solder used for the first solder layer 310 and the second solder layer 320 is preferably a lead-free solder containing tin as a main material.
  • tin as a main material.
  • the solder may be an alloy consisting of tin-copper (0.7% by weight), tin-silver (3.5% by weight), and tin-silver (3.5% by weight)-copper (0.7% by weight).
  • the content of tin is the residual content.
  • the solder used in the present invention preferably contains at least 90% by weight of tin.
  • the metal of the metal layer 330 may be copper or a copper alloy.
  • a metal having a suitable strength as a metal having a melting temperature higher than that of the first solder layer 310 and the second solder layer 320 may be employed in the present invention.
  • the plurality of through-holes 332 provided in the metal layer 330 preferably have a diameter in the range of 0.5 to 2 mm, and in particular may have a diameter of 1 mm. In addition, it is preferable that the plurality of through-holes 332 are uniformly disposed. If the diameter of the through hole 332 is too small, it may be difficult for the molten solder to flow into it, as described below, and if the diameter of the through hole 332 is too large, the metal layer 330 may It is undesirable because the actual existence and thereby the degree of contribution becomes small. If the number of through-holes 332 is too small, it may be insufficient to achieve the object of the present invention, so it is preferably selected appropriately.
  • the thickness of the first solder layer 310, the second solder layer 320 and the metal layer 330 may be in the range of 0.05 to 0.5 mm, respectively, and in particular may be 0.1 mm. have.
  • solder thin plate structure 300 of the present invention when pressure and heat are applied in a state where the solder thin plate structure 300 of the present invention is interposed between soldering objects such as the shank 10 and the cutting tip 20 of the cutting tool 1 , , the first solder layer 310 and the second solder layer 320 are melted. Then, solder 334 flows into the through-holes 332 provided in the metal layer 330 , so that the first solder layer 310 and the second solder layer 320 are connected to each other and soldering is performed.
  • the cutting tip 20 and the solder thin plate structure 300 of the present invention the cutting tip 20 and the solder thin plate structure 300
  • the first solder layer 310 and the second solder layer 320 are connected to each other because the solder 334 is filled in the through-holes 332 widely distributed throughout the metal layer 330, solder in those portions is coupled to the shank 10 and the cutting tip 20 with a thicker thickness.
  • the metal layer 300 provides mechanical strength to the thinned regions of the first solder layer 310 and the second solder layer 320, such that the first solder layer 310 and the second solder layer 320 . In addition to supporting the regions, it serves to support the thicker solders in the through holes 332 of the metal layer 300 from the side to reinforce the strength of the solders.
  • the thickness of the solder becomes thicker, and the thickness of the solder in the through-holes 332 is applied to the metal layer 330 .
  • the effect of being supported and reinforcing by the side by this prevents cracks from occurring in the first solder layer 310 and the second solder layer 320, so that the cutting tip for the shank 10 of the cutting tool 1 ( 10) improves the bonding strength.
  • solder thin plate structure 300 of the present invention is 4 and 5 may have a form extending in the longitudinal direction and the width direction. In fact, after the solder thin plate structure 300 in a sufficiently expanded form is manufactured, it is cut to an appropriate width and length to be used for soldering.

Abstract

Disclosed is a solder thin plate structure comprising a first solder layer, a second solder layer, and a metal layer interposed between the first solder layer and the second solder layer, the metal layer having a melting temperature higher than the melting temperature of the first solder layer and the second solder layer. In the solder thin plate structure of the present invention, the metal layer has a plurality of through holes. In the solder thin plate structure according to the present invention, when a cutting tip is coupled, by soldering, to a shank of a cutting tool such as a saw blade for cutting or a core drill bit, the cutting tip is strongly coupled to the shank of the cutting tool.

Description

땜납 박판 구조체Solder Laminate Structure
본 발명은 땜납 박판 구조체에 관한 것으로서, 더욱 상세하게는, 절삭용 톱날, 코어 드릴 비트 등과 같은 절삭공구의 샹크에 절삭팁을 납땜에 의하여 결합할 때 절삭팁이 절삭공구의 샹크에 강력하게 결합하게 하는 땜납 박판 구조체에 관한 것이다. The present invention relates to a solder thin plate structure, and more particularly, when the cutting tip is coupled to the shank of a cutting tool such as a cutting saw blade or a core drill bit by soldering, the cutting tip is strongly coupled to the shank of the cutting tool. It relates to a solder thin plate structure.
다이아몬드 톱날, 코어 드릴 비트 등과 같은 절삭공구가 절삭을 위하여 사용된다. 다이아몬드 톱날은 석재, 벽돌, 콘크리트, 아스팔트와 같은 피삭재를 절단하기 위하여 사용되고, 코어 드릴 비트는 코어 드릴에 장착되어 회전함으로써 건물 등의 벽 등에 구멍을 뚫는데 사용된다. Cutting tools such as diamond saw blades and core drill bits are used for cutting. A diamond saw blade is used to cut a workpiece such as stone, brick, concrete, and asphalt, and a core drill bit is mounted on a core drill and rotates to make a hole in a wall of a building or the like.
도 1에는 통상적인 절삭공구(1')의 개략적 구성이 도시되어 있다. 도 1에 도시된 바와 같이, 절삭공구(1')는 절삭공구(1')의 몸체의 일부를 형성하는 샹크(10) 및 샹크(10)에 결합하는 복수개의 절삭팁(20)을 포함한다. 샹크(10)는 금속으로, 통상적으로 강철로 이루어진다. 절삭팁(20)은 통상적으로 다이아몬드 절삭팁으로 형성된다. 다이아몬드 절삭팁은 다이아몬드 분말과 결합재 역할을 하는 금속 분말을 혼합한 후 성형한 다음에 소결하는 분말야금법에 의하여 제조된다. 다이아몬드 대신에 초경 합금이 사용되기도 한다. 1 shows a schematic configuration of a conventional cutting tool 1'. 1 , the cutting tool 1 ′ includes a shank 10 forming a part of the body of the cutting tool 1 ′ and a plurality of cutting tips 20 coupled to the shank 10 . . The shank 10 is made of metal, typically steel. The cutting tip 20 is typically formed of a diamond cutting tip. Diamond cutting tips are manufactured by powder metallurgy in which diamond powder and metal powder serving as a binder are mixed, then molded and then sintered. Cemented carbide is sometimes used instead of diamond.
절삭팁(20)은 도 1에 도시된 바와 같이, 절삭 시에 금속 샹크(10)와 피삭재가 마찰되는 것을 피하기 위하여 금속 샹크(10)의 두께보다 두껍게 제작하는 것이 일반적이다. 절삭팁(20)은 레이저 용접이나 땜납 용접, 특히 은납 용접 등에 의하여 샹크(10)에 결합된다. 이때 레이저 용접은 레이저에 의하여 모재가 용융되어 용접되는 것을 의미하고, 은납 용접은 은납 재료를 용접봉으로 사용하여 용접되는 것으로서 납땜의 일종에 해당한다. As shown in FIG. 1 , the cutting tip 20 is generally manufactured to be thicker than the thickness of the metal shank 10 in order to avoid friction between the metal shank 10 and the workpiece during cutting. The cutting tip 20 is coupled to the shank 10 by laser welding or solder welding, in particular, silver solder welding or the like. In this case, laser welding means that a base material is melted and welded by a laser, and silver lead welding is welding using a silver lead material as a welding rod, and corresponds to a type of soldering.
은납 용접에 의하여 샹크(10)에 절삭팁(20)을 결합하기 위해서는, 은납 박판을 샹크(10)와 절삭팁(20) 사이에 개재한 상태에서 압력과 열을 가하여야 한다. 그러면, 은납 박판의 은납이 용융된 후 냉각됨으로써 절삭팁(20)과 샹크(10) 사이에 은납층(30)이 개재되어 절삭팁(20)은 샹크(10)에 결합하게 된다. In order to couple the cutting tip 20 to the shank 10 by silver solder welding, pressure and heat must be applied in a state where the silver solder thin plate is interposed between the shank 10 and the cutting tip 20 . Then, the silver solder layer 30 is interposed between the cutting tip 20 and the shank 10 by cooling after the silver solder of the thin silver plate is melted, and the cutting tip 20 is coupled to the shank 10 .
도 2 및 도 3에는 단일층의 은납 박판(30) 대신에 종래에 사용되는 은납 박판 구조체를 도시한다. 종래의 은납 박판 구조체(300')는 제1 은납층(310), 제2 은납층(320) 및 제1 은납층(310)과 제2 은납층(320) 사이에 개재되는 금속층, 특히 구리층(330)을 포함한다. 이때, 금속층, 특히 구리층(330)은 제1 은납층(310)과 제2 은납층(320)의 용융온도보다 높은 용융온도를 가진다. 2 and 3 show a silver-lead thin plate structure conventionally used instead of a single-layered silver-lead thin plate 30 . The conventional silver lead thin plate structure 300 ′ has a first silver lead layer 310 , a second silver lead layer 320 , and a metal layer, particularly a copper layer, interposed between the first silver lead layer 310 and the second silver lead layer 320 . (330). At this time, the metal layer, particularly the copper layer 330 , has a melting temperature higher than the melting temperature of the first silver lead layer 310 and the second silver lead layer 320 .
이러한 구조를 가지는 종래의 은납 박판 구조체(300')는 열팽창계수 차이를 완화하여 은납층들(310 및 320)에 크랙이 발생하는 것을 방지한다고 한다. 종래의 은납 박판 구조체(300')는 다음과 같은 인식에 기초하고 있는 것으로 이해된다. The conventional silver-lead thin plate structure 300 ′ having such a structure is said to prevent cracks from occurring in the silver- lead layers 310 and 320 by mitigating the difference in thermal expansion coefficient. It is understood that the conventional silver lead thin plate structure 300' is based on the following recognition.
즉, 종래기술은 단일층의 은납 박판(30)을 사용하여 절삭팁(20)을 샹크(10)에 결합시키는 경우, 그렇게 결합된 절삭공구(1')에서 단일의 은납층(30)은 샹크(10) 및 절삭팁(20)에 대한 큰 열팽창계수 차이를 가지므로 절삭공구(10)를 사용하는 중에 발생하는 열에 의하여 은납층(30)에 크랙이 발생하여 절삭팁(20)이 샹크(10)로부터 탈리될 염려가 높아진다고 인식하는 것으로 이해된다. That is, in the prior art, when the cutting tip 20 is coupled to the shank 10 using a single layer of silver lead plate 30, the single layer of silver lead 30 in the cutting tool 1 ′ coupled as such is the shank. Since there is a large difference in the coefficient of thermal expansion with respect to (10) and the cutting tip (20), cracks are generated in the silver solder layer (30) by the heat generated while the cutting tool (10) is used, and the cutting tip (20) is separated from the shank (10). ) is understood as recognizing that there is an increased risk of separation from
[선행기술문헌][Prior art literature]
[특허문헌][Patent Literature]
특허공개 제2002-0037939호(2002. 05. 23. 공개)Patent Publication No. 2002-0037939 (published on May 23, 2002)
특허등록 제10-1090404호(2011. 11. 30. 등록)Patent Registration No. 10-1090404 (Registered on November 30, 2011)
특허등록 제10-0791435호(2007. 12. 27. 등록)Patent Registration No. 10-0791435 (Registered on December 27, 2007)
절삭팁(20)을 땜납 용접, 특히 은납 용접에 의하여 샹크(10)에 결합시켜 통상의 절삭공구(1')를 제조할 때, 은납에 의하여 절삭팁(20)과 샹크(10)가 결합되도록 하기 위하여 은납의 용융온도 이상으로 가열하면서 가압하여야 한다. 이때, 용융된 은납의 상당 부분은 가압되는 압력에 의하여 눌려져서 절삭팁(20) 및 샹크(10)의 결합면으로부터 유출되고, 용융된 은납의 일부분만이 절삭팁(20) 및 샹크(10)의 결합면에 남아 절삭팁(20) 및 샹크(10)와의 결합에 참여하게 된다. When the cutting tip 20 is joined to the shank 10 by solder welding, in particular, silver solder welding to manufacture a conventional cutting tool 1', the cutting tip 20 and the shank 10 are coupled by silver solder. In order to do this, it is necessary to pressurize it while heating it above the melting temperature of silver lead. At this time, a significant portion of the molten silver solder is pressed by the applied pressure and flows out from the bonding surface of the cutting tip 20 and the shank 10, and only a portion of the molten silver solder is pressed by the cutting tip 20 and the shank 10. It remains on the coupling surface of the cutting tip 20 and participates in coupling with the shank (10).
따라서, 통상의 절삭공구(1')에서 절삭팁(20)과 샹크(10) 간의 결합력이 약하게 되어 사용중 절삭팁(20)이 탈리하거나 내구성이 약하게 되는 문제가 있었다. Therefore, there is a problem in that the coupling force between the cutting tip 20 and the shank 10 is weak in the conventional cutting tool 1 ′, so that the cutting tip 20 detaches or the durability is weak during use.
한편, 종래의 은납 박판 구조체(300')와 관련한 상기 종래기술의 인식은 단일층의 은납 박판(30) 사용에 따른 문제점을 열팽창계수 차이로 인한 크랙 발생으로 보고 있으나, 본 발명자의 이해에 따르면, 오히려 은납층(30)에서의 크랙 발생은 상기에서 언급한 바와 같이, 가압과정에서 용융된 은납의 상당 부분이 유출됨으로써 절삭팁(20)과 샹크(10) 사이에 최종적으로 남게 되는 은납층(30)의 두께가 충분하지 않은 것으로부터 주로 기인하는 것으로 이해된다. On the other hand, the recognition of the prior art in relation to the conventional silver-lead thin plate structure 300' regards the problem of using a single-layer silver-lead thin plate 30 as crack generation due to the difference in thermal expansion coefficient, but according to the understanding of the present inventor, Rather, the cracks in the silver solder layer 30 are caused by the leakage of a significant portion of the silver solder during the pressurization process, so that the silver solder layer 30 is finally left between the cutting tip 20 and the shank 10 . ) is understood to be mainly due to insufficient thickness.
따라서, 본 발명자의 이해에 따르면, 종래의 은납 박판 구조체(300')에서 절삭팁(20)과 구리층(330) 사이의 제1 은납층(310) 그리고 샹크(10)와 구리층(330) 사이의 제2 은납층(320)도 여전히 가압과정에서 용융된 은납의 상당 부분이 유출되기 때문에 은납층들(310 및 320)에서의 크랙 발생을 근본적으로 해결하지 못한 것으로 이해된다. Therefore, according to the understanding of the present inventors, in the conventional silver-lead thin plate structure 300', the first silver-lead layer 310 and the shank 10 and the copper layer 330 between the cutting tip 20 and the copper layer 330. It is understood that cracks in the silver lead layers 310 and 320 are not fundamentally solved because a significant portion of the molten silver lead is still leaked from the second silver lead layer 320 therebetween during the pressurization process.
이에, 본 발명은 상기한 종래기술의 문제점을 해결하기 위하여 안출되었다. 따라서, 본 발명의 목적은 절삭용 톱날, 코어 드릴 비트 등과 같은 절삭공구의 샹크에 절삭팁을 납땜에 의하여 결합할 때 절삭팁이 절삭공구의 샹크에 강력하게 결합하게 하는 땜납 박판 구조체를 제공하는 것이다. Accordingly, the present invention has been devised to solve the problems of the prior art. Accordingly, it is an object of the present invention to provide a solder thin plate structure that enables the cutting tip to be strongly coupled to the shank of the cutting tool when the cutting tip is coupled to the shank of a cutting tool such as a cutting saw blade or a core drill bit by soldering. .
상기한 목적을 달성하기 위한 본 발명에 따른 땜납 박판 구조체는 제1 땜납층, 제2 땜납층 및 상기 제1 땜납층 및 상기 제2 땜납층 사이에 개재되고 상기 제1 땜납층 및 상기 제2 땜납층의 용융온도보다 높은 용융온도를 가지는 금속층을 포함한다. 이때, 상기 금속층은 복수개의 관통공을 가진다. A solder thin plate structure according to the present invention for achieving the above object is provided with a first solder layer, a second solder layer and interposed between the first solder layer and the second solder layer, and the first solder layer and the second solder layer and a metal layer having a melting temperature higher than the melting temperature of the layer. In this case, the metal layer has a plurality of through holes.
상기 땜납 박판 구조체는 납땜 대상체들 사이에 개재된 상태에서 압력과 열을 가하면 상기 제1 땜납층 및 상기 제2 땜납층이 용융되고 그래서 상기 금속층에 마련된 관통공들에 땜납이 흘러들어가서 상기 제1 땜납층과 상기 제2 땜납층이 서려 연결되면서 납땜이 이루어진다. In the solder thin plate structure, when pressure and heat are applied while being interposed between objects to be soldered, the first solder layer and the second solder layer are melted, so that the solder flows into the through-holes provided in the metal layer, and the first solder Soldering is carried out while the layer and the second solder layer are intertwined.
상기 납땜 대상체들은 절삭공구의 샹크와 절삭팁일 수 있다.The soldering objects may be a shank and a cutting tip of a cutting tool.
상기 제1 땜납층 및 상기 제2 땜납층에 사용되는 땜납은 주석을 주재료로 하는 무연 땜납인 것이 바람직하다.The solder used for the first solder layer and the second solder layer is preferably a lead-free solder containing tin as a main material.
상기 금속층의 금속은 구리 또는 구리 합금일 수 있다.The metal of the metal layer may be copper or a copper alloy.
상기 제1 땜납층, 상기 제2 땜납층 및 상기 금속층의 두께는 각각 0.05 내지 0.5 mm의 범위이고, 상기 금속층의 상기 관통공의 직경은 0.5 내지 2 mm의 범위일 수 있다. The thickness of the first solder layer, the second solder layer, and the metal layer may be in the range of 0.05 to 0.5 mm, respectively, and the diameter of the through hole of the metal layer may be in the range of 0.5 to 2 mm.
본 발명에 따른 땜납 박판 구조체는 절삭용 톱날, 코어 드릴 비트 등과 같은 절삭공구의 샹크에 절삭팁을 납땜에 의하여 결합할 때 절삭팁이 절삭공구의 샹크에 강력하게 결합하게 한다. The solder thin plate structure according to the present invention enables the cutting tip to be strongly coupled to the shank of the cutting tool when the cutting tip is coupled to the shank of a cutting tool such as a cutting saw blade or a core drill bit by soldering.
도 1은 일반적인 절삭공구의 개략적 구성을 도시한다.1 shows a schematic configuration of a general cutting tool.
도 2 및 도 3은 종래기술에 따른 땜납 박판 구조체의 개략적 구성을 도시한다.2 and 3 show a schematic configuration of a solder thin plate structure according to the prior art.
도 4 및 도 5는 본 발명의 한 실시예에 따른 땜납 박판 구조체의 개략적 구성을 도시한다.4 and 5 show a schematic configuration of a solder thin plate structure according to an embodiment of the present invention.
도 6은 본 발명의 한 실시예에 따른 땜납 박판 구조체에 의하여 납땜된 절삭공구의 개략적 구성을 도시한다. 6 shows a schematic configuration of a cutting tool soldered by a solder thin plate structure according to an embodiment of the present invention.
이하, 도면을 참조하여 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail with reference to the drawings.
도 4 및 도 5에 도시된 바와 같이, 본 발명에 따른 땜납 박판 구조체(300)는 제1 땜납층(310), 제2 땜납층(320) 그리고 제1 땜납층(310)과 제2 땜납층(320) 사이에 개재되는 금속층(330)을 포함한다. 이때, 금속층(330)은 제1 땜납층(310) 및 제2 땜납층(320)의 용융온도보다 높은 용융온도를 가진다. 또한 금속층(330)에는 복수개의 관통공(332)이 형성되어 있다.4 and 5, the solder thin plate structure 300 according to the present invention has a first solder layer 310, a second solder layer 320, and a first solder layer 310 and a second solder layer. and a metal layer 330 interposed therebetween. At this time, the metal layer 330 has a melting temperature higher than the melting temperature of the first solder layer 310 and the second solder layer 320 . In addition, a plurality of through holes 332 are formed in the metal layer 330 .
본 발명의 땜납 박판 구조체(300)에서, 제1 땜납층(310)과 제2 땜납층(320)에 사용되는 땜납은 주석을 주재료로 하는 무연 땜납인 것이 바람직하다. 특히, 은납인 것이 바람직하다. 예를 들어, 땜납은 주석-구리(0.7중량%), 주석-은(3.5중량%), 주석-은(3.5중량%)-구리(0.7중량%)로 이루어진 합금일 수 있다. 이때, 주석의 함량은 잔여 함량이다. 본 발명에서 사용되는 땜납은 최소한 90중량% 이상의 주석을 포함하는 것이 바람직하다. In the solder thin plate structure 300 of the present invention, the solder used for the first solder layer 310 and the second solder layer 320 is preferably a lead-free solder containing tin as a main material. In particular, it is preferable that it is silver solder. For example, the solder may be an alloy consisting of tin-copper (0.7% by weight), tin-silver (3.5% by weight), and tin-silver (3.5% by weight)-copper (0.7% by weight). At this time, the content of tin is the residual content. The solder used in the present invention preferably contains at least 90% by weight of tin.
금속층(330)의 금속은 구리 또는 구리 합금일 수 있다. 그 외에도 제1 땜납층(310) 및 제2 땜납층(320)의 용융온도보다 높은 용융온도를 가지는 금속으로서 적당한 강도를 가지는 금속도 본 발명에서 채용될 수 있다. The metal of the metal layer 330 may be copper or a copper alloy. In addition, a metal having a suitable strength as a metal having a melting temperature higher than that of the first solder layer 310 and the second solder layer 320 may be employed in the present invention.
금속층(330)에 마련되는 복수개의 관통공(332)은 0.5 내지 2 mm 범위의 직경을 가지는 것이 바람직하고, 특히 1 mm의 직경을 가질 수 있다. 또한 복수개의 관통공(332)은 균일하게 배치되는 것이 바람직하다. 관통공(332)의 직경이 너무 작은 경우에는 아래에서 설명하는 바와 같이, 용융된 땜납이 그것 내에 흘러들어가는 것이 여의치 않을 수 있고, 관통공(332)의 직경이 너무 큰 경우에는 금속층(330)의 실질적인 존재 및 그로 인한 기여 정도가 작게 되기 때문에 바람직하지 않다. 관통공(332)의 갯수는 너무 적은 경우에는 본 발명의 목적을 달성하는데 미흡할 수 있으므로, 적절하게 선택되는 것이 바람직하다. The plurality of through-holes 332 provided in the metal layer 330 preferably have a diameter in the range of 0.5 to 2 mm, and in particular may have a diameter of 1 mm. In addition, it is preferable that the plurality of through-holes 332 are uniformly disposed. If the diameter of the through hole 332 is too small, it may be difficult for the molten solder to flow into it, as described below, and if the diameter of the through hole 332 is too large, the metal layer 330 may It is undesirable because the actual existence and thereby the degree of contribution becomes small. If the number of through-holes 332 is too small, it may be insufficient to achieve the object of the present invention, so it is preferably selected appropriately.
본 발명의 땜납 박판 구조체(300)에서, 제1 땜납층(310), 제2 땜납층(320) 및 금속층(330)의 두께는 각각 0.05 내지 0.5 mm의 범위일 수 있고, 특히 0.1 mm일 수 있다. In the solder thin plate structure 300 of the present invention, the thickness of the first solder layer 310, the second solder layer 320 and the metal layer 330 may be in the range of 0.05 to 0.5 mm, respectively, and in particular may be 0.1 mm. have.
도 6에 도시된 바와 같이, 본 발명의 땜납 박판 구조체(300)가 절삭공구(1)의 샹크(10) 및 절삭팁(20)과 같은 납땜 대상체들 사이에 개재된 상태에서 압력과 열을 가하면, 제1 땜납층(310) 및 제2 땜납층(320)이 용융된다. 그러면 금속층(330)에 마련된 관통공들(332)에는 땜납(334)이 흘러들어가게 되고 그래서 제1 땜납층(310)과 제2 땜납층(320)이 서로 연결되면서 납땜이 이루어지게 된다. As shown in FIG. 6 , when pressure and heat are applied in a state where the solder thin plate structure 300 of the present invention is interposed between soldering objects such as the shank 10 and the cutting tip 20 of the cutting tool 1 , , the first solder layer 310 and the second solder layer 320 are melted. Then, solder 334 flows into the through-holes 332 provided in the metal layer 330 , so that the first solder layer 310 and the second solder layer 320 are connected to each other and soldering is performed.
상기한 과정에 의하면, 본 발명의 땜납 박판 구조체(300)에 의하여 절삭공구(1)의 샹크(10)와 절삭팁(20)이 납땜될 때, 절삭팁(20)과 땜납 박판 구조체(300)의 금속층(330) 사이에서 용융되는 제1 땜납층(310)의 땜납 용융물이 외부로 흘러나가서 그곳에 형성되는 제1 땜납층(310)의 두께는 더 얇아질 수 있고, 또한 샹크(10)와 땜납 박판 구조체(300)의 금속층(330) 사이에서 용융되는 제2 땜납층(320)의 땜납 용융물이 외부로 흘러나가서 그곳에 형성되는 제2 땜납층(320)의 두께는 더 얇아질 수 있다. 그러나, 금속층(330) 전체에 넓게 분포하는 관통공들(332)에 땜납(334)이 채워져서 제1 땜납층(310)과 제2 땜납층(320)이 서로 연결되므로, 그러한 부분들에서 땜납은 더욱 두꺼운 두께로 샹크(10)와 절삭팁(20)을 결합시키게 된다. 더군다나, 금속층(300)은 두께가 얇아진 제1 땜납층(310) 및 제2 땜납층(320) 영역들에 대하여 기계적 강도를 제공하여 그러한 제1 땜납층(310) 및 제2 땜납층(320) 영역들을 지지할 뿐만 아니라 금속층(300)의 관통공들(332)에서 두께가 더욱 두꺼워진 땜납들을 측면에서 지지하여 그러한 땜납들의 강도를 보강하는 역할을 한다. According to the above process, when the shank 10 and the cutting tip 20 of the cutting tool 1 are soldered by the solder thin plate structure 300 of the present invention, the cutting tip 20 and the solder thin plate structure 300 The solder melt of the first solder layer 310 melted between the metal layers 330 of Since the solder melt of the second solder layer 320 melted between the metal layers 330 of the thin plate structure 300 flows to the outside, the thickness of the second solder layer 320 formed therein may be made thinner. However, since the first solder layer 310 and the second solder layer 320 are connected to each other because the solder 334 is filled in the through-holes 332 widely distributed throughout the metal layer 330, solder in those portions is coupled to the shank 10 and the cutting tip 20 with a thicker thickness. Furthermore, the metal layer 300 provides mechanical strength to the thinned regions of the first solder layer 310 and the second solder layer 320, such that the first solder layer 310 and the second solder layer 320 . In addition to supporting the regions, it serves to support the thicker solders in the through holes 332 of the metal layer 300 from the side to reinforce the strength of the solders.
이와 같이, 금속층(330)의 관통공들(332)에 땜납(334)이 채워짐에 따라 땜납의 두께가 두꺼워지는 효과 및 관통공들(332)에서 그렇게 두께가 두꺼워진 땜납이 금속층(330)에 의하여 측면에서 지지되어 보강되는 효과는 제1 땜납층(310) 및 제2 땜납층(320)에서 크랙이 발생하는 것을 방지하게 되고, 그래서 절삭공구(1)의 샹크(10)에 대한 절삭팁(10)의 결합력을 향샹시키게 된다. In this way, as the solder 334 is filled in the through-holes 332 of the metal layer 330 , the thickness of the solder becomes thicker, and the thickness of the solder in the through-holes 332 is applied to the metal layer 330 . The effect of being supported and reinforcing by the side by this prevents cracks from occurring in the first solder layer 310 and the second solder layer 320, so that the cutting tip for the shank 10 of the cutting tool 1 ( 10) improves the bonding strength.
도 4 및 도 5에는 절삭공구(1)의 샹크(10)에 하나의 절삭팁(20)을 납땜하는데 필요한 크기의 땜납 박판 구조체(300)를 도시하였으나, 본 발명의 땜납 박판 구조체(300)는 도 4 및 도 5에 도시된 것에서 길이방향 및 폭방향으로 확장된 형태를 가질 수 있다. 실제로는, 충분히 확장된 형태의 땜납 박판 구조체(300)가 제조된 후 그것을 적당한 폭 및 길이로 절단하여 납땜을 위하여 사용한다. 4 and 5 show a solder thin plate structure 300 of a size necessary for soldering one cutting tip 20 to the shank 10 of the cutting tool 1, but the solder thin plate structure 300 of the present invention is 4 and 5 may have a form extending in the longitudinal direction and the width direction. In fact, after the solder thin plate structure 300 in a sufficiently expanded form is manufactured, it is cut to an appropriate width and length to be used for soldering.

Claims (6)

  1. 제1 땜납층, 제2 땜납층 및 상기 제1 땜납층 및 상기 제2 땜납층 사이에 개재되고 상기 제1 땜납층 및 상기 제2 땜납층의 용융온도보다 높은 용융온도를 가지는 금속층을 포함하는 땜납 박판 구조체이고,Solder comprising a first solder layer, a second solder layer, and a metal layer interposed between the first solder layer and the second solder layer, the metal layer having a melting temperature higher than the melting temperature of the first solder layer and the second solder layer It is a thin plate structure,
    상기 금속층은 복수개의 관통공을 가지는 것을 특징으로 하는 땜납 박판 구조체.The metal layer is a solder thin plate structure, characterized in that it has a plurality of through-holes.
  2. 제1항에 있어서, According to claim 1,
    상기 땜납 박판 구조체는 납땜 대상체들 사이에 개재된 상태에서 압력과 열을 가하면 상기 제1 땜납층 및 상기 제2 땜납층이 용융되고 그래서 상기 금속층에 마련된 관통공들에 땜납이 흘러들어가서 상기 제1 땜납층과 상기 제2 땜납층이 서려 연결되면서 납땜이 이루어지는 것을 특징으로 하는 땜납 박판 구조체. In the solder thin plate structure, when pressure and heat are applied while being interposed between objects to be soldered, the first solder layer and the second solder layer are melted, so that the solder flows into the through-holes provided in the metal layer, and the first solder A solder thin plate structure, characterized in that soldering is performed while the layer and the second solder layer are connected together.
  3. 제2항에 있어서, 3. The method of claim 2,
    상기 납땜 대상체들은 절삭공구의 샹크와 절삭팁인 것을 특징으로 하는 땜납 박판 구조체. The solder thin plate structure, characterized in that the soldering object is a shank and a cutting tip of a cutting tool.
  4. 제1항 내지 제3항 중 어느 한 항에 있어서,4. The method according to any one of claims 1 to 3,
    상기 제1 땜납층 및 상기 제2 땜납층에 사용되는 땜납은 주석을 주재료로 하는 무연 땜납인 것을 특징으로 하는 땜납 박판 구조체. The solder thin plate structure according to claim 1, wherein the solder used for the first solder layer and the second solder layer is a lead-free solder containing tin as a main material.
  5. 제1항 내지 제4항 중 어느 한 항에 있어서,5. The method according to any one of claims 1 to 4,
    상기 금속층의 금속은 구리 또는 구리 합금인 것을 특징으로 하는 땜납 박판 구조체. The metal of the metal layer is a solder thin plate structure, characterized in that copper or copper alloy.
  6. 제1항 내지 제5항 중 어느 한 항에 있어서,6. The method according to any one of claims 1 to 5,
    상기 제1 땜납층, 상기 제2 땜납층 및 상기 금속층의 두께는 각각 0.05 내지 0.5 mm의 범위이고, 상기 금속층의 상기 관통공의 직경은 0.5 내지 2 mm의 범위인 것을 특징으로 하는 땜납 박판 구조체. The thickness of each of the first solder layer, the second solder layer and the metal layer is in the range of 0.05 to 0.5 mm, and the diameter of the through hole of the metal layer is in the range of 0.5 to 2 mm.
PCT/KR2020/011831 2020-01-09 2020-09-03 Solder thin plate structure WO2021141203A1 (en)

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