WO2021136515A1

WO2021136515A1 - Display panel, display device and substrate to be cut

Info

Publication number: WO2021136515A1
Application number: PCT/CN2020/142208
Authority: WO
Inventors: 李云龙; 王青; 卢鹏程; 张大成
Original assignee: 京东方科技集团股份有限公司
Priority date: 2020-01-02
Filing date: 2020-12-31
Publication date: 2021-07-08
Also published as: CN111146211A; CN111146211B

Abstract

A display panel, a display device and a substrate to be cut, which relate to the technical field of display, and can solve the problems that water and oxygen invade a display area and impact the performance and the service life of a light-emitting device due to cracks generated in a packaging layer in the process of cutting a substrate to be cut. The display panel is provided with a display area and a peripheral area surrounding the display area, and comprises a display substrate and a packaging layer, wherein the display substrate comprises a backing substrate, and at least one light-emitting device and a retaining wall are arranged on the backing substrate; the backing substrate comprises a silicon-based backing and a driving circuit manufactured on the silicon-based backing, wherein the driving circuit is coupled with the at least one light-emitting device, the at least one light-emitting device is positioned in the display area, and the retaining wall is positioned in the peripheral area; and the packaging layer is configured to package the display substrate.

Description

Display panel, display device and substrate to be cut

This application claims the priority of the Chinese patent application with application number 202010001902.2 filed on January 2, 2020, the entire content of which is incorporated into this application by reference.

Technical field

The present disclosure relates to the field of display technology, and in particular to a substrate to be cut, a display panel and a micro display chip.

Background technique

The electroluminescent diode display has the advantages of self-luminescence, low power consumption, wide viewing angle, fast response speed and high contrast, and has become the mainstream development trend of the current display.

The electroluminescent diode display includes a display substrate and an encapsulation layer for encapsulating the display substrate. The display substrate includes a plurality of light emitting devices provided on the bottom plate.

Summary of the invention

In one aspect, a display panel is provided. The display panel has a display area and a peripheral area surrounding the display area, and the display panel includes a display substrate and an encapsulation layer. The display substrate includes: a base substrate, a plurality of light emitting devices arranged on the base substrate, and a barrier wall, the plurality of light emitting devices are located in the display area, and the barrier wall is located in the peripheral area. The encapsulation layer is configured to encapsulate the display substrate.

In some embodiments, the packaging layer includes a three-layer packaging film, and the edges of the three-layer packaging film are all flush with the edges of the base substrate.

In some embodiments, the base substrate includes a silicon-based substrate and a driving circuit fabricated on the silicon-based substrate, and the driving circuit is coupled to the plurality of light-emitting devices.

In some embodiments, the retaining wall includes at least one first sub-retaining wall, and the encapsulation layer completely covers each first sub-retaining wall.

In some embodiments, the retaining wall includes a ring-shaped first sub-retaining wall arranged around the display area.

In some embodiments, the retaining wall includes a plurality of first sub-retaining walls distributed along the circumference of the display area, and every two adjacent first sub-retaining walls of the plurality of first sub-retaining walls are arranged at intervals.

In some embodiments, the heights of the plurality of first sub-retaining walls distributed along the circumference of the display area are the same.

In some embodiments, in the direction toward the peripheral area, the heights of at least two of the first sub-retaining walls are the same or not completely the same.

In some embodiments, the retaining wall includes at least one second sub-retaining wall, and each second sub-retaining wall includes: a top surface and a side surface, the top surface being a surface away from the base substrate, and the side surface The top surface connection. The encapsulation layer covers the top surface of each second sub-blocking wall, and the encapsulation layer has an opening, and the opening exposes at least a part of the side surface.

In some embodiments, the retaining wall includes a ring-shaped second sub-retaining wall arranged around the display area.

In some embodiments, the retaining wall includes a plurality of second sub-retaining walls distributed along the circumference of the display area, and every two adjacent second sub-retaining walls of the plurality of second sub-retaining walls are arranged at intervals.

In some embodiments, when the retaining wall includes a first sub-retaining wall and a second sub-retaining wall, the height of the second sub-retaining wall is greater than the height of the first sub-retaining wall.

In some embodiments, the display panel further includes: a pixel defining layer disposed on the base substrate and located in the display area, the pixel defining layer includes a plurality of opening areas, and one light emitting device is located in one opening area . The retaining wall and the pixel defining layer are arranged in the same layer.

In another aspect, a display device is provided. The display device includes the display panel as described in any of the above embodiments.

In another aspect, a substrate to be cut is provided. The substrate to be cut has a plurality of display areas and a peripheral area surrounding each display area, and the peripheral area includes a cutting area. The substrate to be cut includes: a display substrate mother board and an encapsulation layer configured to encapsulate the display substrate mother board. The substrate mother board for display includes: a base substrate mother board, at least one light emitting device provided in the display area on the base substrate mother board, and located between the display area and the cutting area The retaining wall;

In some embodiments, the base substrate mother board includes a silicon-based base substrate mother board and a plurality of driving circuits fabricated on the silicon-based base substrate mother board. Each of the plurality of driving circuits is coupled with a plurality of light emitting devices in the display area.

In some embodiments, the retaining wall includes at least one first sub-retaining wall. The encapsulation layer completely covers each first sub-retaining wall.

In some embodiments, the retaining wall includes a plurality of first sub-retaining walls distributed along the circumference of the display area and located between the cutting areas. Every two adjacent first sub-retaining walls of the plurality of first sub-retaining walls are arranged at intervals. The heights of a plurality of first sub-retaining walls distributed along the circumference of the display area are the same.

In some embodiments, the retaining wall includes at least one second sub-retaining wall, and each second sub-retaining wall includes a top surface and a side surface, and the top surface is a surface away from the base substrate. The side surface is connected to the top surface. The encapsulation layer covers the top surface of each second sub-retaining wall, the encapsulation layer has an opening portion, and the opening portion exposes at least a part of the side surface.

In some embodiments, when the retaining wall includes the first sub-retaining wall and the second sub-retaining wall, the height of the second sub-retaining wall is greater than the height of the first sub-retaining wall .

In some embodiments, the display substrate mother board further includes: a pixel defining layer and a plurality of light-emitting devices disposed on the base substrate mother board and located in the display area. The pixel defining layer includes a plurality of opening regions, and one light-emitting device is located in one opening region. The retaining wall and the pixel defining layer are arranged in the same layer.

Description of the drawings

In order to explain the technical solutions of the present disclosure more clearly, the following will briefly introduce the drawings that need to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are merely appendices to some embodiments of the present disclosure. Figures, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limitations on the actual size of the product, the actual process of the method, and the actual timing of the signal involved in the embodiments of the present disclosure.

FIG. 1 is a structural diagram of a display panel provided according to some embodiments of the present disclosure;

FIG. 2 is a cross-sectional structural view along the AA direction in FIG. 1 according to some embodiments of the present disclosure;

FIG. 3 is a structural diagram of another display panel provided according to some embodiments of the present disclosure;

FIG. 4 is a cross-sectional structural view along the BB direction in FIG. 3 according to some embodiments of the present disclosure;

FIG. 5 is another cross-sectional structure view along the BB direction in FIG. 3 according to some embodiments of the present disclosure;

FIG. 6 is a structural diagram of still another display panel provided according to some embodiments of the present disclosure;

FIG. 7 is a cross-sectional structural view along the CC direction in FIG. 6 according to some embodiments of the present disclosure;

FIG. 8 is a structural diagram of still another display panel provided according to some embodiments of the present disclosure;

FIG. 9 is a cross-sectional structure view along the DD direction in FIG. 8 according to some embodiments of the present disclosure;

FIG. 10 is a structural diagram of yet another display panel provided according to some embodiments of the present disclosure;

FIG. 11 is a structural diagram of a substrate to be cut according to some embodiments of the present disclosure;

FIG. 12 is a cross-sectional structural view along the AA direction in FIG. 11 according to some embodiments of the present disclosure;

FIG. 13 is another cross-sectional structure view along the AA direction in FIG. 11 according to some embodiments of the present disclosure;

Fig. 14 is a schematic structural diagram of an electroluminescent diode display substrate according to some embodiments of the present disclosure;

FIG. 15 is another cross-sectional structure view along the AA direction in FIG. 11 according to some embodiments of the present disclosure;

Figure 16 is a structural diagram of a substrate to be cut provided by the related art;

FIG. 17 is another cross-sectional structure view along the AA direction in FIG. 11 according to some embodiments of the present disclosure;

FIG. 18 is a structural diagram of yet another substrate to be cut provided according to an embodiment of the present disclosure;

FIG. 19a is a structural diagram of yet another substrate to be cut provided according to some embodiments of the present disclosure;

FIG. 19b is another cross-sectional structure view along the BB direction in FIG. 19a according to some embodiments of the present disclosure;

FIG. 20 is a structural diagram of yet another substrate to be cut provided according to some embodiments of the present disclosure;

FIG. 21 is a structural diagram of yet another substrate to be cut provided according to some embodiments of the present disclosure;

FIG. 22 is a structural diagram of yet another substrate to be cut provided according to some embodiments of the present disclosure;

FIG. 23 is a cross-sectional structure view along the CC direction in FIG. 21 or FIG. 22 according to some embodiments of the present disclosure.

Detailed ways

The technical solutions in some embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by those of ordinary skill in the art fall within the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms such as the third-person singular form "comprises" and the present participle form "comprising" are used throughout the specification and claims. Interpreted as open and inclusive means "including, but not limited to." In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" "example)" or "some examples" are intended to indicate that a specific feature, structure, material, or characteristic related to the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics described may be included in any one or more embodiments or examples in any suitable manner.

Hereinafter, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

In describing some embodiments, the expressions "coupled" and "connected" and their extensions may be used. For example, the term "connected" may be used when describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other. For another example, the term "coupled" may be used when describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

"At least one of A, B, and C" has the same meaning as "at least one of A, B, or C", and both include the following combinations of A, B, and C: only A, only B, only C, A and B The combination of A and C, the combination of B and C, and the combination of A, B and C.

The use of "applicable to" or "configured to" in this document means open and inclusive language, which does not exclude devices that are adapted or configured to perform additional tasks or steps.

As used herein, "about", "approximately" or "approximately" includes the stated value as well as the average value within the acceptable deviation range of the specified value, wherein the acceptable deviation range is as defined by those of ordinary skill in the art It is determined in consideration of the measurement in question and the error associated with the measurement of a specific quantity (ie, the limitations of the measurement system).

The exemplary embodiments are described herein with reference to cross-sectional views and/or plan views as idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in the shape with respect to the drawings due to, for example, manufacturing technology and/or tolerances can be envisaged. Therefore, the exemplary embodiments should not be construed as being limited to the shape of the area shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched area shown as a rectangle will generally have curved features. Therefore, the areas shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the area of the device, and are not intended to limit the scope of the exemplary embodiments.

Some embodiments of the present disclosure provide a display device. The display device may be a product or a component, and the component may be a display panel, a display substrate, or the like. For example, the display device may be a self-luminous display device, such as a silicon-based OLED (Organic Light Emitting Diode, organic electroluminescence) display device, etc.; in this case, the display device may also include an FPC (Flexible Printed) bonded to the display panel. Circuit) and other components. The above-mentioned display device may be a product or component with any display function, such as a display, a TV, a digital camera, a mobile phone, and a tablet computer.

As shown in FIG. 1, taking the display device as a silicon-based OLED display panel 1 as an example, the silicon-based OLED display panel 1 has a display area (Active Area, AA area) 01 and a peripheral area 02 surrounding the display area.

As shown in FIG. 2, the display panel 1 includes a display substrate 10a and an encapsulation layer 20 configured to encapsulate the display substrate 10a.

Among them, the display substrate 10a includes a base substrate 100a, at least one light-emitting device 40a and a retaining wall 30a provided on the base substrate 100a. The base substrate 100a includes a silicon-based substrate 101a and a driving circuit 102a fabricated on the silicon-based substrate. The driving circuit 102a is coupled to at least one light-emitting device 40a, which is located in the display area 01, and the barrier 30a Located in the surrounding area 02.

In some embodiments, the driving circuit 102a includes at least one thin film transistor, and each thin film transistor includes a source electrode, a drain electrode, an active layer, a gate electrode, and a gate insulating layer. In the case where the base substrate 100a is a silicon-based substrate 101a, the driving circuit 102a can be formed on the silicon-based substrate 101a by using a CMOS process, which is beneficial to simplify the manufacturing process of the base substrate 100a, and is small in size and high in resolution. Improved integration.

As shown in FIG. 2, the display panel further includes: a pixel definition layer (PDL) 50 disposed on the base substrate 100a and located in the display area 01. The pixel definition layer 50 includes at least one opening area and one light emitting area. The device 40a is located in an opening area, and the retaining wall 30a and the pixel defining layer 50 are arranged in the same layer.

In some embodiments, the retaining wall 30a and the existing film layer on the display substrate 10a are fabricated at the same time. In another embodiment, the retaining wall 30a is fabricated separately, and is not fabricated at the same time as the existing film layer on the display substrate 10a.

In the case where the barrier wall 30a and the existing film layer on the display substrate 10a are made at the same time, optionally, the barrier wall 30a and the pixel defining layer 50 are of the same layer and the same material.

Here, "same layer" refers to a layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then using the same mask to form a patterning process. Depending on the specific pattern, the same patterning process may include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights. Or have different thicknesses.

In this embodiment, since the retaining wall 30a and the pixel defining layer 50 are made of the same layer and the same material, the retaining wall 30a can be fabricated at the same time as the pixel defining layer 50 is made. The wall 30a does not increase the manufacturing process of the display substrate 10a, and simplifies the manufacturing process of the display substrate 10a.

In some embodiments, as shown in FIG. 2, the light-emitting device 40 a includes a first electrode 401, a light-emitting functional layer 402 and a second electrode 403 which are sequentially stacked on the base substrate 100 a. In some embodiments, the light-emitting functional layer 402 includes a light-emitting layer. In other embodiments, in addition to the light-emitting layer, the light-emitting functional layer 402 also includes an electron transport layer (election transporting layer, ETL), an electron injection layer (election injection layer, EIL), and a hole transporting layer (hole transporting layer, HTL) and one or more layers in the hole injection layer (HIL). In the case where the base substrate 100a includes the driving circuit 102a, the first electrode 401 is electrically connected to the drain of the thin film transistor used as the driving transistor in the driving circuit 102a.

In some embodiments, the first electrode 401 is an anode, and the second electrode 403 is a cathode. In other embodiments, the first electrode 401 is a cathode, and the second electrode 403 is an anode.

The light-emitting device 40a provided by the embodiment of the present disclosure may be a top-emitting type. In this case, the first electrode 401 close to the base substrate 100a is in an opaque state, and the second electrode 403 far from the base substrate 100a is in a light-transmitting state. . The light emitting device 40a may also be of a bottom emission type. In this case, the first electrode 401 close to the base substrate 100a is in a light-transmitting state, and the second electrode 403 far away from the base substrate 100a is in a opaque state. Of course, the light emitting device 40a may also be a double-sided light emitting type. In this case, the first electrode 401 close to the base substrate 100a and the second electrode 403 far away from the base substrate 100a are both in a light-transmitting state.

As shown in FIG. 2, the base substrate 100 a further includes a flat layer 60 provided between the driving circuit 102 a and the first electrode 401.

On this basis, the structure of the encapsulation layer 20 is not limited. The encapsulation layer 20 may include one layer of encapsulation film; it may also include two or more encapsulation films. As shown in FIG. 2, the packaging layer 20 may include a three-layer packaging film, and the edges of the three-layer packaging film are flush with the edges of the base substrate 100a. Among them, the material of the encapsulation film 201 in the middle layer is an organic material, and the material of the encapsulation film 201 on both sides is an inorganic material. For example, along the direction away from the base substrate 100a, the materials of the three-layer packaging film are silicon nitride (SiNx), parylene and aluminum oxide (Al2O3).

In some embodiments, the retaining wall includes at least one first sub-retaining wall, and the encapsulation layer completely covers each first sub-retaining wall. For example, as shown in FIG. 2, the retaining wall 30a includes a first sub-retaining wall 301a, and the encapsulation layer 20 covers the surface (that is, the top surface) of the first sub-retaining wall 301a away from the base substrate 100a, and the first sub-retaining wall 301a. Two sides of the retaining wall 301a. Since the encapsulation layer completely covers the first sub-retaining wall, when the encapsulation layer is formed, the surface of the encapsulation layer will be uneven, which can increase the diffusion path of water and oxygen, so as to slow down the invasion of water and oxygen into the display area 01 and ensure the light emitting device 40a. The performance and lifetime improve the reliability of the light-emitting device 40a in a high-temperature and high-humidity environment.

It should be noted that this embodiment does not limit the height of the first sub-retaining wall 301a, and can be set as required.

Here, the number of first sub-retaining walls 301a included in the retaining wall 30a is not limited, and the retaining wall 30a may include one first sub-retaining wall 301a; or multiple first sub-retaining walls 301a.

In some embodiments, the retaining wall 30a includes a ring-shaped first sub-retaining wall 301a arranged around the display area 01. For example, as shown in Fig. 1, the first sub-retaining wall 301a is arranged in a circle around the display area 01 end to end, and the first sub-retaining wall 301a is ring-shaped. In this way, the first sub-wall 301a can block the diffusion of microcracks in the encapsulation layer 20 from any position on the periphery of the display area 01, extend the water and oxygen diffusion path, and protect the display area 01 from various positions.

Here, one first sub-retaining wall 301a may be arranged end to end in a circle around the display area 01, or a plurality of first sub-retaining walls 301a may be arranged end to end in a circle around the display area 01.

In some embodiments, the retaining wall includes a plurality of first sub-retaining walls distributed along the circumference of the display area, and every two adjacent first sub-retaining walls of the plurality of first sub-retaining walls are arranged at intervals. For example, as shown in FIG. 3, the retaining wall 30a includes eight first sub-retaining walls 301a distributed along the circumference of the display area 01, that is, the eight first sub-retaining walls 301a are in the circumferential direction of the display area 01. In the direction, it is distributed in two circles. Among them, the four first sub-retaining walls 301a are distributed along the display area 01 in one circle, and the other four first sub-retaining walls 301a are distributed along the other circle of the display area 01. Among the four first sub-retaining walls 301a distributed along the circumference of the display area 01, every two adjacent first sub-retaining walls 301a are arranged at intervals.

In some embodiments, the heights of the plurality of first sub-retaining walls 301a distributed along the circumference of the display area 01 are the same. For example, as shown in FIG. 3, there are two circles of first sub-retaining walls 301a distributed along the circumferential direction of the display area 01, wherein the height of the first sub-retaining walls 301a included in each circle is the same.

It should be noted that, among the plurality of first sub-retaining walls 301a included in a circle, every two adjacent first sub-retaining walls are arranged at intervals, and the height of the first sub-retaining walls 301a of two adjacent circles is not adjusted in this embodiment. Make restrictions. For example, as shown in 4, the heights of the first sub-retaining walls 301a of two adjacent circles may be the same. As another example, as shown in FIG. 5, the heights of two adjacent first sub-retaining walls 301a may be different.

It should be noted that, due to the influence of different factors in the actual production of multiple first sub-retaining walls, the height of each first sub-retaining wall produced is not completely the same. In this embodiment, the heights of the multiple first sub-retaining walls are all the same, which means that the heights of the multiple first sub-retaining walls are approximately the same within the allowable error range. The allowable error range is determined by a person of ordinary skill in the art in consideration of the measurement in question and the error associated with the measurement of a specific quantity (ie, the limitation of the measurement system).

In some embodiments, the retaining wall includes a ring-shaped first sub-retaining wall arranged around the display area, and a plurality of first sub-retaining walls distributed along the circumference of the display area. For example, as shown in FIG. 6, the retaining wall 30 a includes a ring-shaped first sub-retaining wall 301 a arranged around the display area 01 and eight first sub-retaining walls 301 a distributed along the circumference of the display area 01.

In some embodiments, along the direction toward the peripheral area 02, the heights of at least two first sub-retaining walls 301a are the same. Specifically, in the direction parallel to the base substrate 100a and in the direction toward the peripheral area 02, the heights of at least two first sub-retaining walls 301a are the same. For example, as shown in FIG. 7, in the direction toward the peripheral area 02, the annular first sub-retaining wall 301a and the plurality of first sub-retaining walls 301a spaced around the display area have the same height.

In other embodiments, along the direction toward the peripheral area 02, the heights of the at least two first sub-retaining walls 301a are not completely the same, where the difference may be that the heights of the at least two first sub-retaining walls 301a are different. The same; it can also be that in at least two first sub-retaining walls 301a, some of the first sub-retaining walls 301a have the same height, and some of the first sub-retaining walls 301a have different heights. In this way, the diffusion path of water and oxygen can be increased more effectively, the invasion of water and oxygen into the display area 01 can be slowed, the performance and life of the light emitting device 40a can be ensured, and the reliability of the light emitting device 40a in a high temperature and high humidity environment can be improved.

In the case where the heights of at least two first sub-retaining walls 301a are not completely the same, multiple first sub-retaining walls 301a can be formed at the same time through one patterning process. In this case, the mask used for mask exposure in the patterning process The board is a halftone mask; it is also possible to form a plurality of first sub-retaining walls 301a through multiple patterning processes, wherein the first sub-retaining walls 301a with the same height can be formed using the same patterning process. For example, the retaining wall 30a includes first sub-retaining walls 301a of two heights. The first sub-retaining wall 301a of the first height may be formed by the first patterning process, and then the second sub-retaining wall 301a may be formed by the second patterning process. The height of the first sub-retaining wall 301a. The patterning process includes mask exposure and development processes.

In some embodiments, the retaining wall 30a includes at least one second sub-retaining wall 302a, each of the second sub-retaining walls 302a includes a surface (that is, a top surface) and a side surface away from the base substrate 100a, wherein the side surface and the top surface are connected The encapsulation layer 20 covers the top surface of each second sub-retaining wall 302a, and the encapsulation layer 20 has an opening that exposes at least a part of the side surface of the second sub-retaining wall 302a. For example, as shown in FIG. 9, the encapsulation layer covers the top surface of the second sub-retaining wall 302a, the encapsulation layer 20 has an opening portion, and the opening portion is at least a part of the side surface of the second sub-retaining wall 302a by the roadside. That is, the encapsulation layer 20 is disconnected at the boundary of the second sub-retaining wall 302a, so the height of the second sub-retaining wall 302a should be greater than the height of the first sub-retaining wall 301a.

In this embodiment, the retaining wall 30a includes a second sub-retaining wall 302a, and the encapsulating layer 20 is disconnected at the boundary of the second sub-retaining wall 302a. Since the encapsulating layer 20 is cut off at the boundary of the second sub-retaining wall 302a, It can slow down the invasion of water and oxygen into the display area 01, ensure the performance and life of the light-emitting device 40a, enhance the encapsulation of the light-emitting device 40a, and improve the reliability of the light-emitting device 40a in a high-temperature and high-humidity environment.

In some embodiments, the retaining wall includes a ring-shaped second sub-retaining wall arranged around the display area. For example, as shown in FIG. 8, the second sub-retaining wall 302a is arranged in a circle around the display area 01 end to end, and the second sub-retaining wall 302a is ring-shaped. In this way, the second sub-retaining wall 302a can block the diffusion of microcracks in the encapsulation layer 20 from any position on the periphery of the display area 01, extend the water and oxygen diffusion path, and protect the display area 01 from various positions.

Here, one second sub-retaining wall 302a may be arranged in a circle around the display area 01 end to end, or a plurality of second sub-retaining walls 302a may be arranged in a circle around the display area 01 end to end.

In some embodiments, the retaining wall 30a includes a plurality of second sub-retaining walls 302a distributed along the circumference of the display area 01, and every two adjacent second sub-retaining walls 302a of the plurality of second sub-retaining walls 302a are arranged at intervals , And the heights of the plurality of second sub-retaining walls distributed along the circumference of the display area are the same. For example, as shown in FIG. 10, the retaining wall 30a includes four second sub-retaining walls 302a distributed along the circumference of the display area 01, the four second sub-retaining walls 302a are distributed in a circle, and the four first sub-retaining walls 302a are distributed in a circle. Every two adjacent second sub-retaining walls 302a in the retaining wall 302a are spaced apart, and the heights of the four first sub-retaining walls 302a are the same.

In some embodiments, when the retaining wall 30a includes a first sub-retaining wall 301a and a second sub-retaining wall 302a, the height of the second sub-retaining wall 302a is greater than the height of the first sub-retaining wall 301a. In this way, the second sub-retaining wall 302a can block the encapsulation layer 20 to block the spread of micro-cracks and prevent the micro-cracks from spreading to the encapsulation layer 20 located in the display area 01. The first sub-retaining wall 301a can prolong the diffusion of water and oxygen. The path, which combines blocking crack propagation and extending the water and oxygen diffusion path, can more effectively prevent water and oxygen from entering the display area 01, ensure the performance and life of the light-emitting device 40a, enhance the encapsulation of the light-emitting device 40a, and improve the light-emitting device 40a Reliability in high temperature and high humidity environment.

It should be noted that this embodiment does not limit the relative positions of the first sub-retaining wall and the second sub-retaining wall. For example, as shown in FIG. 10, the first sub-retaining wall 301a is close to the display area 01 relative to the second sub-retaining wall 302a. For another example, the second sub-retaining wall 302a is close to the display area 01 relative to the first sub-retaining wall 301a.

The embodiment of the present disclosure provides a substrate to be cut. As shown in FIG. 11, it has a plurality of display areas (Active Area, AA area) 01 and a peripheral area 02 surrounding each display area 01. The peripheral area 02 includes a cutting area (Cutting area). )021 and non-cutting area 022.

It should be understood that during the cutting process of the substrate to be cut, the substrate to be cut is cut along the scribe lane of the cutting area 021.

It should be noted that the substrate to be cut provided by the embodiments of the present disclosure may be a display panel mother board; it may also be a wafer chip. In the case that the substrate to be cut is a display panel motherboard, the display panel motherboard includes multiple display panels. Cutting the display panel motherboard along the cutting area 021 can obtain multiple display panels, and each display panel includes a display area 01 And the peripheral area 02 located on the periphery of the display area 01. When the substrate to be cut is a wafer chip, the wafer chip includes a plurality of microdisplay chips (Chip), and the wafer chip is cut along the cutting area 021 to obtain a plurality of microdisplay chips, and each microdisplay chip includes Display area 01 and peripheral area 02 surrounding display area 01.

Based on the above, the display panel can be applied to a large-size display. The large-size display can be, for example, a mobile phone, a TV, a computer, and other displays. The micro display chip can be applied to a micro display. The micro display can be, for example, a head-mounted virtual reality display (Virtual Reality, VR for short) or a head-mounted augmented reality display (Augmented Reality, AR for short).

The substrate to be cut provided by the embodiment of the present disclosure is an electroluminescent diode display substrate. The type of the electroluminescent diode display substrate is not limited, and it may be a silicon-based electroluminescent diode display substrate (Organic Light-Emitting Diode Display, OLED).

As shown in FIGS. 12 and 13, the substrate to be cut includes a display substrate 10 and an encapsulation layer (Thin Film Encapsulation, TFE) 20 for packaging the display substrate 10; the display substrate mother board 10 includes a base substrate mother board 100 At least one light emitting device 40 in the display area 01 provided on the base substrate mother board 100, and a barrier (Dam) 30 located between the display area 01 and the cutting area 021.

In some embodiments, as shown in FIG. 13, the base substrate mother board 100 includes a silicon-based substrate 101 and a driving circuit 102 provided on the silicon-based substrate 101. As shown in FIG. 14, the display substrate 10 further includes: a pixel definition layer (PDL) 50 disposed on the base substrate 100 and located in the display area 01 and at least one light emitting device (Electroluminescent, EL device for short) 40; The pixel defining layer 50 includes at least one opening area, and a light emitting device 40 is located in one opening area.

FIG. 12 and FIG. 13 only illustrate the light-emitting device 40 in the display area 01, and the pixel defining layer 50 is not illustrated.

In this embodiment, a retaining wall 30 can be provided between one display area 01 and the cutting area 021; or a retaining wall 30 can be provided between two or more display areas 01 and the cutting area 021. In some embodiments of the present disclosure, a retaining wall 30 is provided between each display area 01 and the cutting area 021.

In the related art, the structure of the substrate to be cut is as shown in FIG. 16, including a display substrate 10 and an encapsulation layer 20 for packaging the display substrate 10. The substrate to be cut includes a plurality of display areas 01 and a peripheral area 02 located at the periphery of the display area 01, and the peripheral area 02 includes a cutting area 021 and a non-cutting area 022. When cutting the substrate to be cut along the cutting area 021 of the substrate to be cut, the presence of cutting stress will cause micro-cracks in the encapsulation layer 20, and the generation of micro-cracks will shorten the diffusion path of water and oxygen, thereby making it easier for water and oxygen to enter. The display area 01 further affects the performance and life of the light-emitting device 40 in the display area 01, especially the performance and life of the light-emitting device 40 close to the cutting area 021. The light-emitting device 40 close to the cutting area 021 is prone to black borders, thereby reducing This improves the reliability of the light-emitting device 40 in a high-temperature and high-humidity environment.

The embodiment of the present disclosure provides a substrate to be cut, including a plurality of display areas 01 and a peripheral area 02 surrounding each display area 01. The peripheral area 02 includes a cutting area 021 and a non-cutting area 022. The substrate to be cut includes a display substrate 10 And an encapsulation layer 20 for encapsulating the display substrate 10; the display substrate 10 includes a base substrate 100 and a wall 30 disposed on the base substrate 100 and located between the display area 01 and the cutting area 021. Due to the embodiment of the present disclosure, a retaining wall 30 is provided between the display area 01 and the cutting area 021, and when the substrate to be cut is cut along the cutting area 021, the retaining wall 30 will block the spread of microcracks, thereby slowing the intrusion of water and oxygen. In the display area 01, the performance and life of the light-emitting device 40 are ensured, the encapsulation of the light-emitting device 40 is enhanced, and the reliability of the light-emitting device 40 in a high-temperature and high-humidity environment is improved.

In some embodiments, as shown in FIG. 11, FIG. 12, FIG. 13, and FIG. 15, the retaining wall 30 includes at least one first sub-retaining wall 301; the packaging layer 20 completely covers each first sub-retaining wall 301.

In this embodiment, since the barrier wall 30 includes the first sub barrier wall 301, and the encapsulation layer 20 completely covers the first sub barrier wall 301, when the encapsulation layer 20 is formed, the surface of the encapsulation layer 20 will be uneven. In the process of cutting the substrate to be cut, even if the encapsulation layer 20 produces microcracks, the first sub-wall 301 makes the surface of the encapsulation layer 20 uneven, which can block the spread of microcracks, increase the diffusion path of water and oxygen, and slow down Water and oxygen invade the display area 01 to ensure the performance and life of the light-emitting device 40, and improve the reliability of the light-emitting device 40 in a high-temperature and high-humidity environment.

In some embodiments, as shown in FIG. 11, the retaining wall 30 includes a plurality of first sub-retaining walls 01 distributed along the circumference of the display area 01 and located between the cutting areas 021, and the plurality of first sub-retaining walls In 301, every two adjacent first sub-block walls 301 are arranged at intervals, and the heights of the plurality of first sub-block walls 301 distributed along the circumference of the display area 01 are the same.

As shown in Figure 11, for any display area 01, there can be multiple first sub-retaining walls 301 between one side of the display area 01 and the cutting area 021; it can also be two sides or two of the display area 01. A plurality of first sub-retaining walls 301 are arranged between more than one side and the cutting area 021.

On this basis, in the case where the retaining wall 30 includes a plurality of first sub-retaining walls 301 distributed along the circumference of the display area 01 and located between the cutting areas 021, it may be as shown in FIG. 12, FIG. 13 and FIG. 15. As shown, the heights of the plurality of first sub-retaining walls 301 located between at least one side of the display area 01 and the cutting area 021 are all the same; or as shown in FIG. 17, at least one side of the display area 01 is connected to the cutting area. The heights of the plurality of first sub-retaining walls 301 between the areas 021 are not completely the same.

In some embodiments, as shown in FIG. 18, the retaining wall 30 includes a ring-shaped first sub-retaining wall 301 arranged around the display area 01.

In some embodiments, in the direction toward the peripheral area 02, the heights of at least two first sub-retaining walls are the same or not completely the same.

It should be noted that, for the explanation that the heights of at least two first sub-retaining walls are the same or not the same in the direction toward the peripheral area 02, please refer to the explanation in the above-mentioned embodiment, which will not be repeated here.

Considering that for the display area 01 with the cutting area 021 around, when the substrate to be cut is cut along the cutting area 021, the packaging layer 20 around the display area 01 may have cracks, which may cause water and oxygen to escape from the display area 01. Enter display area 01 from any location around. Based on this, optionally, a circle of first sub-retaining walls 301 is arranged end to end around the periphery of the display area 01 with the cutting area 021 all around. Further optionally, as shown in FIG. 18, around each display area 01, a circle of first sub-retaining walls 301 is arranged end to end around the display area 01.

Optionally, as shown in FIG. 19a and FIG. 19b, the retaining wall 30 includes at least one second sub-retaining wall 302, and each second sub-retaining wall 302 includes a top surface and a side surface, and the top surface is remote from the base substrate 100. The surface, the side surface is connected to the top surface; the encapsulation layer 20 covers the surface (ie, the top surface) of each second sub-retaining wall 302 away from the base substrate 100, and the encapsulation layer 20 has an opening that exposes at least a part of the side surface In other words, the encapsulation layer 20 is broken at the boundary of the second sub-retaining wall 302.

Here, the retaining wall 30 may include one second sub-retaining wall 302; it may also include a plurality of second sub-retaining walls 302, which is not limited and can be set as required. In some embodiments, at least one second sub-retaining wall 302 is provided between at least one side of the display area 01 and the cutting area 021.

In addition, the material of the first sub-retaining wall 301 and the material of the second sub-retaining wall 302 may be the same or different. When the material of the first sub-retaining wall 301 and the material of the second sub-retaining wall 302 are the same, in some embodiments, the first sub-retaining wall 301 and the second sub-retaining wall 302 are both in the same layer as the pixel defining layer 50 The same material.

In this embodiment, the retaining wall 30 includes a second sub-retaining wall 302, and the encapsulating layer 20 is disconnected at the boundary of the second sub-retaining wall 302. Since the encapsulating layer 20 is cut off at the boundary of the second sub-retaining wall 302, When the substrate to be displayed is cut along the cutting area 021, the cracks can be prevented from spreading along the encapsulation layer 20, thereby preventing the cracks from spreading to the display area 01, thereby slowing the intrusion of water and oxygen into the display area 01, ensuring the performance and life of the light emitting device 40, and enhancing light emission The encapsulation of the device 40 improves the reliability of the light-emitting device 40 in a high-temperature and high-humidity environment.

The shape of the second sub-retaining wall 302 is not limited. In some embodiments, as shown in FIG. 19a, the shape of the second sub-retaining wall 302 is a strip. In this case, the second sub-block wall 302 extends along the extending direction of the side of the display area 01 that it is close to. In other embodiments, as shown in FIG. 20, at least one second sub-retaining wall 302 is arranged in a circle around the display area 01 end to end, that is, the shape of the second sub-retaining wall 302 is a ring.

Here, one second sub-retaining wall 302 may be arranged end to end in a circle around the display area 01; or a plurality of second sub-retaining walls 302 may be arranged end to end in a circle around the display area 01.

Considering that for the display area 01 with the cutting area 021 around, when the substrate to be cut is cut along the cutting area 021, the packaging layer 20 around the display area 01 may have cracks, which may cause water and oxygen to escape from the display area 01. Enter display area 01 from any location around. Based on this, optionally, a circle of second sub-retaining walls 302 is arranged end to end around the periphery of the display area 01 with the cutting area 021 provided around it. Further optionally, as shown in FIG. 20, a circle of second sub-retaining walls 302 are arranged end to end around the display area 01 at the periphery of each display area 01.

In this embodiment, since the second sub-retaining wall 302 is arranged end to end around the display area 01, the second sub-retaining wall 302 can prevent cracks from spreading to the package located in the display area 01 from any position on the periphery of the display area 01 In the layer 20, the display area 01 is protected from various positions to prevent water and oxygen from entering the display area 01.

In this embodiment, as shown in Figs. 11 and 18, the retaining wall 30 only includes the first sub-retaining wall 301; or as shown in Figs. 19a and 20, the retaining wall 30 only includes the second sub-retaining wall 302; Of course, as shown in FIG. 21, FIG. 22, and FIG. 23, the retaining wall 30 includes a first sub-retaining wall 301 and a second sub-retaining wall 302.

Optionally, when the retaining wall 30 includes the first sub-retaining wall 301 and the second sub-retaining wall 302, the height of the second sub-retaining wall 302 is greater than the height of the first sub-retaining wall 301, and the first sub-retaining wall 301 Relative to the second sub-blocking wall 302, it is close to the display area 01.

Based on this, embodiments of the present disclosure also provide a display panel, which is obtained by cutting the above-mentioned substrate to be cut, wherein the substrate to be cut is a display panel mother board.

The embodiments of the present disclosure also provide a micro display chip, which is obtained by cutting the above-mentioned substrate to be cut; wherein the substrate to be cut is a wafer chip.

The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited to this. Any person skilled in the art who thinks of changes or substitutions within the technical scope disclosed in the present disclosure shall cover Within the protection scope of this disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

A display panel having a display area and a peripheral area surrounding the display area, the display panel comprising:

A display substrate, the display substrate includes: a base substrate, at least one light-emitting device and a retaining wall arranged on the base substrate; the base substrate includes a silicon-based substrate and a silicon-based substrate A driving circuit on the bottom, the driving circuit is coupled to the at least one light-emitting device; the at least one light-emitting device is located in the display area; the retaining wall is located in the peripheral area;

An encapsulation layer configured to encapsulate the display substrate.
The display panel according to claim 1, wherein the packaging layer comprises a three-layer packaging film, and the edges of the three-layer packaging film are all flush with the edges of the base substrate.
The display panel according to any one of claims 1 to 2, wherein:

The retaining wall includes at least one first sub-retaining wall, and the encapsulation layer completely covers each first sub-retaining wall.
The display panel according to claim 3, wherein:

The retaining wall includes a ring-shaped first sub-retaining wall arranged around the display area.
The display panel according to claim 3 or 4, wherein:

The retaining wall includes a plurality of first sub retaining walls distributed along the circumference of the display area, and every two adjacent first sub retaining walls of the plurality of first sub retaining walls are arranged at intervals.
The display panel according to claim 5, wherein:

The heights of a plurality of first sub-retaining walls distributed along the circumference of the display area are the same.
The display panel according to any one of claims 3 to 6, wherein:

Along the direction toward the peripheral area, the heights of at least two of the first sub-retaining walls are the same or not completely the same.
The display panel according to any one of claims 1 to 7, wherein:

The retaining wall includes at least one second sub-retaining wall, each second sub-retaining wall includes: a top surface and a side surface, the top surface is a surface away from the base substrate, and the side surface is connected to the top surface ；

The encapsulation layer covers the top surface of each second sub-retaining wall, and the encapsulation layer has an opening, and the opening exposes at least a part of the side surface.
The display panel according to claim 8, wherein:

The retaining wall includes a ring-shaped second sub-retaining wall arranged around the display area.
The display panel according to claim 8 or 9, wherein:

The retaining wall includes a plurality of second sub retaining walls distributed along the circumference of the display area, and every two adjacent second sub retaining walls of the plurality of second sub retaining walls are arranged at intervals.
The display panel according to claim 10, wherein:

In the case where the retaining wall includes a first sub-retaining wall and a second sub-retaining wall, the height of the second sub-retaining wall is greater than the height of the first sub-retaining wall.
The display panel of claim 1, wherein the display panel further comprises:

A pixel defining layer disposed on the base substrate and located in the display area, the pixel defining layer includes a plurality of opening areas, and a light emitting device is located in one opening area;

The retaining wall and the pixel defining layer are arranged in the same layer.
A display device comprising: the display panel according to any one of claims 1-12.
A substrate to be cut, having a plurality of display areas and a peripheral area surrounding each display area, the peripheral area including a cutting area;

The substrate to be cut includes: a display substrate mother board and an encapsulation layer configured to encapsulate the display substrate mother board;

The substrate mother board for display includes: a base substrate mother board, at least one light emitting device disposed in the display area on the base substrate mother board, and located between the display area and the cutting area The retaining wall; the base substrate mother board includes a silicon-based substrate and a drive circuit fabricated on the silicon-based substrate, the drive circuit is coupled to the at least one light-emitting device; the at least one light-emitting device Located in the display area.
The substrate to be cut according to claim 14, wherein the retaining wall comprises at least one first sub-retaining wall; the encapsulation layer completely covers each first sub-retaining wall.
The substrate to be cut according to claim 15, wherein the retaining wall comprises a plurality of first sub-retaining walls distributed along the circumference of the display area and located between the cutting areas, the plurality of Every two adjacent first sub-retaining walls in the first sub-retaining wall are arranged at intervals, and the heights of the plurality of first sub-retaining walls distributed along the circumference of the display area are the same.
The substrate to be cut according to claim 16, wherein the retaining wall comprises a ring-shaped first sub-blocking wall arranged around the display area.
The substrate to be cut according to any one of claims 15 to 17, wherein, in the direction toward the peripheral area, the heights of at least two of the first sub-retaining walls are the same or not completely the same.
The substrate to be cut according to any one of claims 15 to 18, wherein the retaining wall includes at least one second sub-retaining wall, and each second sub-retaining wall includes a top surface and a side surface, and the top surface is Away from the surface of the base substrate, the side surface is connected to the top surface; the encapsulation layer covers the top surface of each second sub-wall, the encapsulation layer has an opening, and the opening exposes all At least part of the side.
14. The to-be-cut substrate according to claim 14, wherein the display substrate mother board further comprises: a pixel defining layer and at least one light-emitting device provided on the base substrate mother board and located in the display area; The pixel defining layer includes a plurality of opening regions, and one light-emitting device is located in one opening region;

The retaining wall and the pixel defining layer are arranged in the same layer.